产品锡须生长试验报告
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一﹑試驗目的﹕Aim
檢驗產品在試驗後是否有錫鬚產生﹐以確認產品的可靠性。
To verify if whisker occurs after experiment, which is to confirm the reliability of products?
二、試驗樣品數量﹕Sample Q’ty
5PCS
三、試驗材料﹕Material of experiment
錫銅（Sn98Cu2），錫銀(SnAg)、PTH9648半成品、成品
Solder Sn98Cu2/ SnAg、PTH9648 semi-products、finished products
四﹑試驗項目及條件﹕Experiment items and condition
1﹑高溫試驗﹕溫度﹕125±2℃﹐時間﹕1000小時
High temperature experiment: 125±2℃﹐1000H
2﹑恆定濕熱試驗﹕溫度﹕85℃±2℃﹐濕度﹕85%±2%RH﹐時間﹕500小時
Constant humidity and heat experiment﹕85℃±2℃﹐85%±2%RH﹐500H
3﹑熱沖擊試驗﹕最低溫度﹕-45℃最高溫度﹕85℃﹐保持時間﹕30分鐘﹐循環次數﹕1000次Thermal shock experiment﹕Minimum temperature﹕-45℃; max temperature﹕85℃﹐hold time﹕30minutes﹐cycle times﹕1000times
五﹑試驗設備﹕Equipment used for experiment
1﹑高溫試驗﹕高溫箱(PHH-101)
High temperature experiment: High temperature chamber (PHH-101)
2﹑恆定濕熱試驗﹕高低溫試驗箱(MHK-120NK)
Constant humidity and heat experiment: Constant temperature/Humidity test chamber (MHK-120NK)
3﹑熱沖擊試驗﹕溫試沖擊試驗箱(TST-80-65-3W)
Thermal shock test: Thermal shock test chamber (TST-80-65-3W)
4﹑金相顯微鏡(BX-53M)
Metallomicroscope(BX-53M)
六﹑檢驗項目﹕Inspection item
1﹑試驗前用金相顯微鏡觀察焊點
Check soldering spot with Metallomicroscope before experiment
2﹑試驗後用金相顯微鏡觀察焊點
Check soldering spot with Metallomicroscope after experiment
七﹑檢驗環境要求及標准﹕Inspection circumstance requirement and standard
1﹑環境要求﹕溫度﹕15~~30度﹔濕度45~~45%RH
Circumstance requirement: 15~30℃，45~~45%RH
2﹑錫鬚標准﹕用金相顯微鏡觀察焊點錫鬚小於600u"(約為最小PIN距1.27mm的1/2)
Solder whisker standard: check with Metallomicroscope to confirm if solder whisker on soldering spot is less than 600u (around 1/2 of minimum pins distance 1.27mm)
八﹑試驗前後圖片如下﹕
用金相顯微鏡觀察焊點無錫鬚產生，實驗前後對比圖片如下：
We checked soldering spots with Metallomicroscope and found no solder whisker, pictures before and after experiment is as below:
半成品驗證前後內PIN圖片:Inner pins pictures of semi-products before and after experiment
高溫試驗前﹑高溫試驗後無錫鬚產生
No whisker before and after high temperature experiment
恆定濕熱試驗前﹑恆定濕熱試驗後無錫鬚產生
No whisker before and after Constant humidity and heat experiment
熱沖擊試驗前﹑熱沖擊試驗後無錫鬚產生
No whisker before and after thermal shock experiment
成品驗證前後外PIN圖片:
高溫試驗前﹑高溫試驗後無錫鬚產生
No whisker before and after high temperature experiment
恆定濕熱試驗前﹑恆定濕熱試驗後無錫鬚產生
No whisker before and after Constant humidity and heat experiment
SMD 產品熱沖擊試驗前﹑熱沖擊試驗後無錫鬚產生
No whisker before and after thermal shock experiment
九、結論：Conclusion
試驗後用金相顯微鏡觀察結果顯示，未有發現有任何錫鬚現象產生，故此錫使用符合要求。
We checked with Metallomicroscope after experiment and found no solder whisker, so the solder we used can meet requirement.