铜粉导电胶的研究进展

万方数据

万方数据

万方数据

铜粉导电胶的研究进展

作者：王刘功， 银锐明， 杨华荣， 刘飘， 杨开霞， Wang Liugong， Yin Ruiming， Yang Huarong， Liu Piao， Yang Kaixia

作者单位：王刘功,银锐明,Wang Liugong,Yin Ruiming(湖南工业大学,包装与材料工程学院,湖南,株洲,412008)， 杨华荣,刘飘,杨开霞,Yang Huarong,Liu Piao,Yang Kaixia(湖南利德电子浆料

有限公司,湖南,株洲,412007)

刊名：

广东化工

英文刊名：GUANGDONG CHEMICAL INDUSTRY

年，卷(期)：2011,38(1)

1.杨颖;王守绪;何为金属粉末-聚合物复合导电胶研究进展[期刊论文]-印制电路信息 2009(03)

2.马文有热固化铜粉导电胶的研究 2003

3.张聚国;付求涯镀银铜粉导电胶的研究[期刊论文]-表面技术 2007(04)

4.Myung Jin Yim Oxidation prevention and electrical property enhancement of copper-filled isotropically conductive adhesives 2007(10)

5.赵勇我国铜粉导电胶现状及同际地位[期刊论文]-粘合剂 1989(04)

6.Zhang R;Moon K S;Lin W Preparation of highly conductive polymer nanocomposites by low temperature smtering of silver nanoparticles 2010

7.Mir I;Kumar D Recent advances in isotropic conductive adhesives for electronics packaging applications[外文期刊] 2008

8.Lu D;Wong C P Recent advances in developing high performance isotropic conductive adhesives[外文期刊] 2008(15)

9.Gallagher C;Mattijasevic G;Maguire J F Transient liquid phase sintering conductive adhesives as solder replacements 1997

10.Li Y;Wong C P Reccnt advances of conductive adhesives as a lead free alternative in electronic packaging:materials,processing,reliability and applications[外文期刊] 2006(1/3)

11.Li Y;Moon K S;Wong C P Electrical property improvement of electrically conductive adhesives through in-situ replacement by short-chain difunctional acids[外文期刊] 2006(01)

12.Lu D;Wong C Isotropic conductive adhesives filled with low-melting-point alloy fillers

13.左新浪;夏志东;雷永平促进剂在导电胶中的作用研究[期刊论文]-中国胶粘剂 2009(12)

14.闫军;崔海萍;杜仕国偶联剂对环氯-铜粉复合导电涂料导电性能的影响[期刊论文]-弹性体 2003(04)

15.苏辉煌;钟新辉;詹国柱导电胶的研究进展[期刊论文]-粘接 2008(06)

16.Irfan M;Kumar D Recent advances in isotropic conductive adhesives for electronics packaging applications 2008

17.Zhang H J;Chart Y C Research on the contact resistance,reliability,and degradation mechanisms of anisotropically conductive film interconnection for flip-chip-on-flex applications[外文期刊]

2003(04)

18.Jong M K;Kiyokazu Y;Kozo F Novel interconnection method using lectrically conductive paste with fusible filler[外文期刊] 2005(05)

19.游敏;郑小玲;毛玉平导电胶的可靠性与胶层内应力研究[期刊论文]-三峡大学学报(自然科学版) 2003(02)

20.Daoqiang Lu;Wong C P A study of contact resistance of conductive adhesives based on anhydride-cured epoxy systems[外文期刊] 2000(03)

21.Takezawa H;Mitani T;Kitae T Effects of zinc on the rcliability of conductive adhesives 2002

22.Daoqiang Lu;Wong C P High perfonrmance conductive adhesives[外文期刊] 1999(04)

23.梁彤祥;马文有;曹茂盛SiO2纳米粒子对铜导电胶连接强度的影响[期刊论文]-高分子材料科学与工程 2005(01)

24.常英;徐长富;刘刚紫外光固化导电胶的老化性能研究[期刊论文]-中国胶黏剂 2005(11)

25.陈治中;许佩新;谢文明铜导电胶老化性能的研究 1998(02)

26.鲜飞导电胶粘剂的研究[期刊论文]-印制电路信息 2010(03)

27.王继虎;陈月辉;王锦成铜粉导电丙烯酸醇压敏胶的研制 2005(01)

28.毛玉乎;游敏;邓冰葱固化工艺对HT1012铜粉导电胶剪切强度的影响[期刊论文]-研究报告及专论 2004(04)

29.游敏;郑勇;郑小玲XH-11型胶粘剂最佳固化工艺的研究[期刊论文]-粘接 1995(02)

30.Liu J;Gustafsson K;Lai Z Surface characteristics,reliability,and failure mechanisms of

tin/lead,copper,and gold metallizations 1997(01)

31.Wolfson H;Elliott G Electrically conducting cements containing epoxy resins and silver 1956

32.虞苏玮高性能非银导电胶粘剂的研究与应用 1997(01)

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