【WO2019202528A1】MEMS集成传感器的制造方法及其传感器【专利】

(

(51)International Patent Classification:(81)Designated States(unless otherwise indicated,for every

G01N15/00(2006.01)G01N33/00(2006.01)kind o f national protection av ailable).AE,AG,AL,AM,

AO,AT,AU,AZ,BA,BB,BG,BH,BN,BR,BW,BY,BZ, (21)International Application Number:

CA,CH,CL,CN,CO,CR,CU,CZ,DE,DJ,DK,DM,DO,

PCT/IB2019/053185

DZ,EC,EE,EG,ES,FI,GB,GD,GE,GH,GM,GT,HN, (22)International Filing Date:HR,HU,ID,IL,IN,IR,IS,JO,JP,KE,KG,KH,KN,KP,

17April2019(17.04.2019)KR,KW,KZ,LA,LC,LK,LR,LS,LU,LY,MA,MD,ME,

MG,MK,MN,MW,MX,MY,MZ,NA,NG,NI,NO,NZ, (25)Filing Language:English OM,PA,PE,PG,PH,PL,PT,QA,RO,RS,RU,RW,

SA, (26)Publication Language:English SC,SD,SE,SG,SK,SL,SM,ST,SV,SY,TH,TJ,TM,TN,

TR,TT,TZ,UA,UG,US,UZ,VC,VN,ZA,ZM,ZW. (30)Priority Data:

20181101459317April2018(17.04.2018)IN(84)Designated States(unless otherwise indicated,for every

kind o f regional protection available).ARIPO(BW,GH, (71)Applicant:INDIAN INSTITUTE OF TECHNOLOGY,GM,KE,LR,LS,MW,MZ,NA,RW,SD,SL,ST,SZ,TZ,

DELHI[IN/IN];Hauz Khas,New Delhi110016(IN).UG,ZM,ZW),Eurasian(AM,AZ,BY,KG,KZ,RU,TJ, (72)Inventors:DHANEKAR,Saakshi;Centre for AppliedRe-TM),European(AL,AT,BE,BG,CH,CY,CZ,DE,DK,

search in Electronics,Indian Institute of Technology,Delhi,EE,ES,FI,FR,GB,GR,HR,HU,IE,IS,IT,LT,LU,LV, Hauz Khas,New Delhi110016(IN).DWIVEDI,Priyan-MC,MK,MT,NL,NO,PL,PT,RO,RS,SE,SI,SK,SM, ka;Centre for Applied Research in Electronics,Indian In¬TR),OAPI(BF,BJ,CF,CG,Cl,CM,GA,GN,GQ,GW, stitute of Technology,Delhi,Hauz Khas,New Delhi110016KM,ML,MR,NE,SN,TD,TG).

(IN).

(74)Agent:MAJUMDAR,Subhatosh et al.;S.Majumdar&

Co.,5,Harish Mukherjee Road,West Bengal,Kolkata700

025(IN).

(54)Title:METHOD FOR FABRICATION OF MEMS INTEGRATED SENSOR AND SENSOR THEREOF

(57)Abstract:The present invention provides a method of fab¬

rication and characterization of a wafer scalable planar MEMS

at¬

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FIGURE1

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patent(Rule4.17(H))

as to the applicant's entitlement to claim the priority o f the

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