Flomerics MicroStripes 最新版三维电磁仿真软件

Flomerics MicroStripes 7.5 最新版三维电磁仿真软件


Flomerics推出MicroStripes三维电磁仿真软件7.5最新版本，该版本不仅包含了射频/微波和天线设计模块，而且和电路级仿真软件AWR Microwave Office?有集成接口。

“MicroStripes7.5版本操作简便可以和Microwave Office?无缝连接，该软件可提供高频率段的射频和微波的设计仿真功能，采用经证实了的全波三维处理器能解决复杂的高频频段设计问题，并能够迎合市场的时效性要求，” Flomerics电磁产品线经理做了如是评价。

MicroStripes 7.5版本在建模过程中可方便导入所需的激励信号波形，运行仿真得出结果，而不需要任何的后期处理过程。使用该技术，可通过预先设置系统中模拟的或测试的激励波形的属性，仿真得到雷击、电磁脉冲或静电放电等带来的影响。

在7.5版本中，模型中如果使用地平面，可不需对系统和地平面之间的区域划分网格。在仿真区域外部主要考虑地平面的影响，能极大地缩短计算时间。

MicroStripes 7.5 版本在处理铁氧体吸收材料边界问题时，采用SmartPart紧凑模型法，将铁氧体吸收边界的影响计入仿真，不对边界进行网格划分，从而有效地减少了计算资源。在不牺牲计算精度的前提下，以Siepel创立的暗室吸收标准来评定，采用铁氧体吸收材料SmartPart技术，可以缩短计算时间至原来的1/15。
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MicroStripes 7.5版本新的突出特点：
与AWR Mic

rowave Office?集成为电路设计者提供采用先进的三维全波时域仿真技术的设计流程。
可使用任意波形的信号激励模型。
引入地平面仅增加非常少的计算时间，不需要对散射源和地平面之间的区域进行网格划分。
独一无二的SmartPart紧凑模型技术，可大大地减少很多测试中因处理铁氧体材料吸收边界问题所需的计算时间。
可计算并显示任何发射源的近场信号如RFID标签等。
如需更多信息，请访问公司网页：/

关于MicroStripes
MicroStripes（/）三维电磁分析仿真软件采用传输线矩阵（TLM）法计算Maxwell方程组，该方法的计算效率、稳定性及计算精确度都已经得到证明。MicroStripes软件已经广泛应用在车辆、轮船、航空及评定人体对电磁场的吸收等方面，可解决天线设计、评估安装性能、射频/微波器件、雷达横截面（RCS）、电磁兼容（EMC）、电磁干扰（EMI）/电磁脉冲（EMP）以及雷击等问题。
::::::English Description::::::

Flomerics has introduced version 7.5 of its MicroStripes 3D EM simulation solution for RF/microwave and antenna design which integrates with Applied Wave Research?s (AWR?) Microwave Office? circuit design software.

?MicroStripes v7.5 operates seamlessly as a plug-in to Microwave Office, providing high-frequency RF and microwave circuit designers with proven, full-wave 3D solver capabilities required by complex high frequency design issues and time-to market cycles,? said the EM Product Line Manager at Flomerics.

The new version of MicroStripes enables users to import any desired excitation waveform during the modeling process, run the simulation, and evaluate the results without any additional post-processing. This makes it possible, for example, to simulate the effect of a lightning strike, electromagnetic pulse (EMP) or electrostatic discharge (ESD) on a system using a pre-computed, analytic or measured waveform.

In version 7.5, ground planes can also be used for models without meshing all of the space between the system and ground plane. A specific algorithm accounts for the effects of the ground plane outside of the simulation domain, substantially reducing solution time.

MicroStripes 7.5 reduces the computational resources required to model ferrite tiles by providing its unique SmartPart compact model methodology of ferrite tile absorber which incorporates the effects of the tiles into the simulation without having to include them in the mesh. In a recent benchmark of an anechoic chamber performed by Siepel, the ferrite tile SmartPart reduced solution time by a factor of 15 without sacrificing accuracy.

Highlights of MicroStripes version 7.5 include:



Integration with AWR?s Microwave Office providing circuit designers with advanced design-flow and access to powerful 3D, full-wave time do

main simulation.
The use of any waveform to excite the model.
The new ability to add a ground plane with very little additional computational time by eliminating the need to mesh the space between the emissions source and ground plane.
Unique SmartPart compact model of a ferrite tile greatly reducing the solution time for many test chambers.
The ability to compute and visualize the nearfield signals from any emissions source such as radio frequency identification (RFID) tag.