BH2430T-C-HITE, 规格书,Datasheet 资料
富士通显示设备 B24-9 TE 数据表说明书
Data SheetFujitsu Display B24-9 TEWidescreen 60.5 cm (23.8-inch) Advanced Ergonomic DisplayIdeal for office applications and 24/7 usageThe FUJITSU Display B24-9 TE is a widescreen display with 1920 x 1080 Full HD resolution with a ultra-thin bezel housing. The monitor has a wide viewing angle that delivers consistent picture quality and DisplayView™ manageability software for further enhancing monitor features with a range of connectivity options ideal for medium- and large-sized businesses.The 23.8-inch display with 16:9 aspect ratio at Full HD resolution for consistent clarity and superior viewing experience is ideal for office applications.The 6-in-1 stand base allows users to tilt, swivel, adjust height, and rotate monitor display as per their comfort and working style.The ultra-thin bezel housing on three sides for multi-monitoring scenarios and integrated speakers and cable guide allow for a clean desk experience.The always available USB, DisplayPort, HDMI interfaces ensure to have a complete package that meets all your business requirements.The ergonomic stand with height adjust with 345° swivel, 35° rear tilt and 45 mm picture over desk enables for an enhanced flexibility.The environmental-friendly LED technology with highly efficient energy saving functions like ECO Operation mode and ECO standy help to save on costs.The DisplayView software enables you to configure your monitor for adjusting screen brightness, pivot function and much more.Focusing on environmental friendliness, the packaging is styrofoam free andsolely consisting of cardboard, which is more than 90% recycled.Technical detailsSpecial featuresIn-Plane Switching (IPS) technologyLow blue light mode6-in-1 StandEco button for Eco mode and 3-coloured Eco status LEDAlways available USB (in operating and standby mode)DisplayView™ Software24/7 usageIntegrated speakersErgonomic standStand6-in-1 StandHeight adjust range150 mmPicture height over desk (min)45 mmRotation to portrait90°Tilt angle-5° / +35°Swivel angle345°Picture performancePanel and backlit In-Plane Switching (IPS) technology/LEDScreen Surface Treatment Anti-glare, 3H hard coatingContrast - typical1,000:1Contrast - advanced20,000,000:1Response time gray to gray typical 5 ms (in video mode)Viewing angle (h/v) - typical178°/178° CR10:1Color performance16.7 million colorsBrightness - typical250 cd/m2Size and resolutionAspect ratio16:9Diagonal Size60.5 cm (23.8-inch)Resolution (native)1,920 x 1,080 pixelResolution (interpolated)1,680 x 1,050 pixel, 1,440 x 900 pixel, 1,280 x 1,024 pixel, 1,280 x 720 pixel, 1,024 x 768 pixel, 800 x 600 pixel, 640 x480 pixelPicture size527 x 296 mmPixel Pitch0.2745 mmFrequenciesHorizontal30 - 82 kHzVertical48 - 76 HzConnectivityDisplayPort 1 x DisplayPort 1.2HDMI 1 x HDMI 1.4VGA/D-SUB 1 x D-SUBAudio signal output 3.5 mm stereo phone jack for head phoneAudio sound output 2 x 2 WAudio signal input 3.5 mm stereo phone jackUSB downstream2x USB 3.2 Gen1USB upstream 1 x USB 3.2 Gen1Ease-of-use menuDirect Access Keys Brightness, ECO, Input, Mode, Audio, MenuLanguages Arabic, Czech, Danish, Dutch, English, Finnish, French, German, Italian, Norwegian, Polish, Portuguese, Russian,Spanish, Swedish, Turkish, Japanese, Chinese simply, Chinese traditionalBrightness / Contrast Brightness, Contrast, Black level, Auto level, ACRMode sRGB, Office, Photo, Video, Low Blue LightColor sRGB, 5000K, 6500K, 7500K, Native, Custom Color (R,G,B)OSD Language, OSD-Timeout, OSD rotationImage adjust Clock, Phase, H-Position, V-Position, Expansion, SharpnessAudio Mute, Volume, Input for HDMI and DP interfaceInformation Model name, Serial number, Signal input, Resolution/mode, Display mode , Color Temperature, ACR Status Advanced settings Overdrive, DDC/CI, Factory RecallPower consumption (typical, w/o sound)Soft switch off0.1 WPower save mode0.17 WOperating with EPA settings14.25 WTotal Energy Consumption (ETEC)44.66 kWh/yearOperating maximum brightness22 WPower supply integratedPower notes Speakers off, USB not connectedETEC and EPA refer to ENERGY STAR® 8.0Electrical valuesRated voltage range100 V - 240 VRated frequency range50 Hz - 60 HzProtection class1ComplianceModel DY24-9TGlobal ENERGY STAR® 8.0, TÜV Low Blue Light Certified, TÜV Flicker Free Certified, Zero bright and dark pixel faults, Subpixelfaults according to ISO9241-307 (Pixel fault class I), EPEAT® Silver (dedicated regions), TCO CertifiedEurope EN 62368-1, CE certification according to EC Directive 2004/108/EEC, RoHS, WEEE, IT-Eco-DeclarationAustralia/New Zealand RCMChina CCCGermany TÜV GSRussia EACSingapore S-MarkSouth Korea KCTaiwan BSMIUSA/Canada FCC Class B, cTUVusCompliance link https:///sites/certificatesDimensions / Weight / EnvironmentalDimension without stand (W x D x H)540.3 x 64 x 325.6 mm21.27 x 2.52 x 12.82 inchDimension with stand (W x D x H)540.3 x 229.4 x 346.2 mm21.27 inch x 9.03 x 13.63 inchWeight (unpacked) 5.25 kg11.57 lbsWeight (Monitor only) 3.21 kg7.08 lbsOperating ambient temperature 5 - 35 °C (41 - 95 °F)Operating relative humidity10 - 85 % (non condensing)MiscellaneousMiscellaneous VESA DDC/ CI, Flat Display Mounting Interface VESA MIS-D 100 C, Kensington lock preparedColor Marble greyAdditional SoftwareAdditional software (optional)WINDOWS WHQL driverDisplayView SuiteAdditional software (notes)Use of accompanying and/or additional Software is subject to proactive acceptance of the respective LicenseAgreements /EULAs/ Subscription and support terms of the Software manufacturer as applicable for the relevantSoftware whether preinstalled or optional. The software may only be available bundled with a software supportsubscription which – depending on the Software - may be subject to separate remuneration.Package contentDisplay delivered accessories DisplayPort data cable 1.8 mUSB-cable 1.8 m (USB-A to USB-B)Power cable for wall socket (Euro-Schuko-Type CEE7) 1.8 mQuickstart flyerSafety notesDisplay delivered accessories notes Power cable with IEC-60320-C13, 3-pin connector on display sideData cables and USB cable detachable on displayUser manual and DisplayView Software is available via downloadPackaging dimension (mm)655 x 411 x 220 mmPackaging dimension (inch)25.79 x 16.18 x 8.66 inchWeight (packed)7.1 kgWeight (packed) (lbs)15.65 lbsOrder informationOrder Code S26361-K1713-V140EAN Code4065221888260Country specific order code BDL:K1713V140-UK - with UK power cable, mandatory for Arabian countriesBDL:K1713V140-CHN - with China power cable and CEL, mandatory for ChinaBDL:K1713V140-INT - W/o power cable, mandatory for countries where import with EU cable is not allowed Accessories information Further helpful options:Stands and Mounting kits:/fts/products/computing/peripheral/accessories/desktop/ums/index.htmlAvailable Adapters: /dmsp/Publications/public/pos-connectivity.pdfWarrantyWarranty period 3 years (depending on country)Warranty Terms & Conditions /warrantyDigital bug fixes Subject to availability and following their generic release for the product, bug fixes and function-preserving patchesfor product-related software (firmware) can be downloaded from the technical support at: https://support.ts.fujitsu.com/ free of charge by entering the respective product serial number. For application software supplied togetherwith the product, please directly refer to the support websites of the respective software manufacturer.Spare Parts availability at least 7 years after shipment, for details see https:///Service Weblink /emeia/products/product-support-services/CONTACTFujitsu Technology Solutions GmbH Website: 2023-11-27 EM-ENworldwide project for reducing burdens on the environment.Using our global know-how, we aim to contribute to the creation of a sustainable environment for future generations through IT.Please find further information at http://www./global/about/environmenttechnical specification with the maximum selection of components for the named system and not the detailed scope ofdelivery. The scope of delivery is defined by the selection of components at the time of ordering.Technical data is subject to modification and delivery subject to availability. Any liability that the data and illustrations are complete, actual or correct is excluded. Designations may be trademarks and/or copyrights of the respective owner, the use of which by third parties for their own purposes may infringe the rights of such owner.The overall product has been designed and manufactured for general office use, regular personal use and ordinary industrial use.More informationAll rights reserved, including intellectual property rights. Designations may be trademarks and/or copyrights of therespective owner, the use of which by third parties for their own purposes may infringe the rights of such owner. For further information see https:///global/about/resources/terms/ Copyright 2023 Fujitsu Technology Solutions GmbH。
DS2430A+;DS2430AP+;DS2430A+T&R;DS2430AP+T&R;DS2430A;中文规格书,Datasheet资料
M
ORDERING INFORMATION
PIN DESCRIPTION
Pin 1 Pin 2 Pin 3 Pin 4 Pin 5 Pin 6 TO-92 Ground Data NC –––– –––– ––––
N
3
N O
T
R
PART TEMP RANGE PIN-PACKAGE DS2430A+ -40°C to +85°C 3 TO-92 DS2430A+T&R -40°C to +85°C 3 TO-92 (2k pcs) DS2430AP+ -40°C to +85°C 6 TSOC DS2430AP+T&R -40°C to +85°C 6 TSOC (4k pcs) +Denotes a lead(Pb)-free/RoHS-compliant package. T&R = Tape and reel.
19-5236; Rev 2/12
FEATURES
M E
256-bit Electrically Erasable Programmable Read Only Memory (EEPROM) plus 64-bit one-time programmable application register Unique, factory-lasered and tested 64-bit registration number (8-bit family code + 48-bit serial number + 8-bit CRC tester) assures absolute identity because no two parts are alike Built-in multidrop controller ensures compatibility with other MicroLAN products EEPROM organized as one page of 32 bytes for random access Reduces control, address, data, and power to a single data pin Directly connects to a single port pin of a microprocessor and communicates at up to 15.3kbits per second 8-bit family code specifies DS2430A communication requirements to reader Presence detector acknowledges when reader first applies voltage Low cost TO-92 or 6-pin TSOC and UCSP surface mount package Reads and writes over a wide voltage range of 2.8V to 5.25V from -40°C to +85°C
SFH2430中文资料
Silizium-Fotodiode mit V λ Charakteristik Silicon Photodiode with V λ CharacteristicsLead (Pb) Free Product - RoHS Compliant 2007-04-031SFH 2430Wesentliche Merkmale•Spektrale Empfindlichkeit angepasst an die Augenempfindlichkeit (V λ)•Niedriger Temperaturkoeffizient der Fotoempfindlichkeit •Gute Linearität•DIL-Plastikbauform mit hoher Packungsdichte •Geeignet für Vapor-Phase Löten und IR-Reflow Löten (JEDEC level 4) Anwendungen•Umgebungslichtsensor (Handy, Regensensor, Klimaanlagensteuerung)Typ Type Bestellnummer Ordering Code SFH 2430Q65110A2673Features•Spectral sensitivity adapted to Human Eye Sensitivity (V λ)•Low temperature coefficient of spectral sensitivity •high linearity•DIL plastic package with high packing density •Suitable for vapor-phase and IR-reflow soldering (JEDEC level 4) Applications•Ambient light sensor (Mobile phone, rain sensor, regulation of air conditioning)2007-04-032GrenzwerteMaximum Ratings Bezeichnung ParameterSymbol SymbolWert Value Einheit Unit Betriebs- und LagertemperaturOperating and storage temperature range T op ; T stg – 40 … + 100°C Sperrspannung Reverse voltageV R 6V Verlustleistung, T A = 25 °C Total power dissipationP tot150mWKennwerte (T A = 25 °C, Normlicht A, T = 2856 K)Characteristics (T A = 25 °C, standard light A, T = 2856 K) Bezeichnung ParameterSymbol SymbolWert Value Einheit Unit Fotoempfindlichkeit, V R = 5 V Spectral sensitivityS5.8 (>4)nA/Ix Wellenlänge der max. Fotoempfindlichkeit Wavelength of max. sensitivityλS max 570nm Spektraler Bereich der Fotoempfindlichkeit S = 10% von S maxSpectral range of sensitivity S = 10% of S maxλ400 (900)nmBestrahlungsempfindliche Fläche Radiant sensitive areaA 7.00mm 2Abmessung der bestrahlungsempfindlichen FlächeDimensions of radiant sensitive area L × BL × W2.65 × 2.65mm × mmHalbwinkel Half angleϕ± 60Grad deg.Dunkelstrom, V R = 5V Dark currentI R 0.1 (<5)nA Spektrale Fotoempfindlichkeit, λ = 550 nm Spectral sensitivityS λ0.17A/W Anstiegs- und Abfallzeit des Fotostromes Rise and fall time of the photocurrent R L = 50 k Ω; V R = 5 V; λ = 550 nm t r , t f200μsDurchlaßspannung, I F = 100 mA, E = 0 Forward voltageV F1.2VKapazität, V R= 0 V, f = 1 MHz, E = 0 Capacitance C1000pFTemperaturkoeffizient von I SC Temperature coefficient of I SC TCI0.16%/KKennwerte (T A = 25 °C, Normlicht A, T = 2856 K) Characteristics (T A = 25 °C, standard light A, T = 2856 K) (cont’d)Bezeichnung Parameter SymbolSymbolWertValueEinheitUnit2007-04-0332007-04-034Relative Spectral Sensitivity S= f (λ)Dark Current I= f (V ), E = 0Directional Characteristics SPhotocurrent I P /I P(25 °C) = f (T A ) E = 1000 lx, V = 5 VCapacitanceC = f (V ), f = 1 MHz, E = 0Total Power Dissipation2007-04-035Maßzeichnung Package OutlinesMaße in mm (inch) / Dimensions in mm (inch).Maße in mm / Dimensions in mm solder padLötbedingungen Vorbehandlung nach JEDEC Level 4 Soldering Conditions Preconditioning acc. to JEDEC Level 4 Reflow Lötprofil für bleifreies Löten(nach J-STD-020C)Published byOSRAM Opto Semiconductors GmbHWernerwerkstrasse 2, D-93049 Regensburg© All Rights Reserved.The information describes the type of component and shall not be considered as assured characteristics.Terms of delivery and rights to change design reserved. Due to technical requirements components may contain dangerous substances. For information on the types in question please contact our Sales Organization.PackingPlease use the recycling operators known to you. We can also help you – get in touch with your nearest sales office. By agreement we will take packing material back, if it is sorted. You must bear the costs of transport. For packing material that is returned to us unsorted or which we are not obliged to accept, we shall have to invoice you for any costs incurred.Components used in life-support devices or systems must be expressly authorized for such purpose! Critical components 1 , may only be used in life-support devices or systems 2 with the express written approval of OSRAM OS.1 A critical component is a component usedin a life-support device or system whose failure can reasonably be expected to cause the failure of that life-support device or system, or to affect its safety or effectiveness of that device or system.2 Life support devices or systems are intended (a) to be implanted in the human body, or (b) to support and/or maintain and sustain human life. If they fail, it is reasonable to assume that the health of the user may be endangered.2007-04-036。
HCPL-2430资料
71234568ANODE 1CATHODE 1CATHODE 2ANODE 2GNDV CC V O1V O2HCPL-2430TRUTH TABLE (POSITIVE LOGIC)LED ON OFF V CCGNDNC71234568HCPL-2400NCLED ON OFF ON OFFENABLEL L H HOUTPUTL H Z ZTRUTH TABLE (POSITIVE LOGIC)OUTPUT L HV E V O ANODE CATHODE Features• High Speed: 40 MBd Typical Data Rate• High Common Mode Rejection:HCPL-2400: 10 kV/µs at V CM = 300 V (Typical)• AC Performance Guaranteed over Temperature• High Speed AlGaAs Emitter • Compatible with TTL, STTL,LSTTL, and HCMOS Logic Families• Totem Pole and Tri State Output (No Pull Up Resistor Required)• Safety ApprovalUL Recognized – 2500 V rms for 1 minute per UL1577VDE 0884 Approved with V IORM = 630 V peak (Option 060) for HCPL-2400CSA Approved• High Power Supply Noise Immunity• MIL-STD-1772 VersionAvailable (HCPL-5400/1 and HCPL-5430/1)20 MBd High CMR Logic Gate Optocouplers Technical DataHCPL-2400HCPL-2430Applications• Isolation of High Speed Logic Systems• Computer-Peripheral Interfaces• Switching Power Supplies • Isolated Bus Driver(Networking Applications)• Ground Loop Elimination • High Speed Disk Drive I/O • Digital Isolation for A/D,D/A Conversion • Pulse Transformer ReplacementFunctional DiagramCAUTION: It is advised that normal static precautions be taken in handling and assembly of this component toprevent damage and/or degradation which may be induced by ESD.A 0.1 µF bypass capacitor must be connected between pins 5 and 8.DescriptionThe HCPL-2400 and HCPL-2430high speed optocouplers combine an 820 nm AlGaAs light emitting diode with a high speedphotodetector. This combination results in very high data rate capability and low input current.The totem pole output (HCPL-2430) or three state output(HCPL-2400) eliminates the need for a pull up resistor and allows for direct drive of data buses.*Technical data for the Hermetic HCPL-5400/01, HCPL-5430/31, and HCPL-6430/31 are on separate Agilent publications.The detector has optical receiver input stage with built-in Schmitt trigger to provide logic compatible waveforms, eliminating the need for additional waveshaping. The hysteresis provides differential mode noise immunity and mini-mizes the potential for output signal chatter.The electrical and switchingcharacteristics of the HCPL-2400and HCPL-2430 are guaranteed over the temperature range of 0°C to 70°C.These optocouplers arecompatible with TTL, STTL,LSTTL, and HCMOS logicfamilies. When Schottky type TTL devices (STTL) are used, a data rate performance of 20 MBd over temperature is guaranteed when using the application circuit of Figure 13. Typical data rates are 40MBd.Ordering InformationSpecify Part Number followed by Option Number (if desired).Example:HCPL-2400#XXX060 = VDE 0884 V IORM = 630 V peak Option*300 = Gull Wing Surface Mount Option 500 = Tape and Reel Packaging Option*For HCPL-2400 only.SchematicV CC V OGNDV V CCV O1V V O2GNDANODECATHODEV E TRUTH TABLE (POSITIVE LOGIC)LED ON OFF LED ON OFF ON OFFENABLEL L H HOUTPUTL H Z ZTRUTH TABLE(POSITIVE LOGIC)OUTPUT L HPackage Outline Drawings8-Pin DIP Package (HCPL-2400, HCPL-2430)8-Pin DIP Package with Gull Wing Surface Mount Option 300(HCPL-2400, HCPL-2430)1.080 ± 0.320MAX.(0.100)BSCDIMENSIONS IN MILLIMETERS (INCHES).LEAD COPLANARITY = 0.10 mm (0.004 INCHES).+ 0.076 - 0.051+ 0.003) - 0.002)DIMENSIONS IN MILLIMETERS AND (INCHES).+ 0.076 - 0.051(0.010+ 0.003) - 0.002)*MARKING CODE LETTER FOR OPTION NUMBERS "V" = OPTION 060OPTION NUMBERS 300 AND 500 NOT MARKED.Note: Use of nonchlorine activated fluxes is highly recommended.240TIME – MINUTEST E M P E R A T U R E – °C220200180160140120100806040200260Solder Reflow Temperature Profile(Gull Wing Surface Mount Option 300 Parts)Insulation and Safety Related SpecificationsParameter Symbol Value Units ConditionsMinimum External L(101)7.1mmMeasured from input terminals to output Air Gap (External terminals, shortest distance through air.Clearance)Minimum External L(102)7.4mmMeasured from input terminals to output Tracking (External terminals, shortest distance path along body.Creepage)Minimum Internal 0.08mmThrough insulation distance, conductor toPlastic Gapconductor, usually the direct distance between the (Internal Clearance)photoemitter and photodetector inside the optocoupler cavity .Tracking Resistance CTI 200VoltsDIN IEC 112/VDE 0303 Part 1(Comparative Tracking Index)Isolation GroupIIIa Material Group (DIN VDE 0110, 1/89, Table 1)Option 300 - surface mount classification is Class A in accordance with CECC 00802.Regulatory InformationThe HCPL-24XX has been approved by the following organizations:VDEApproved according to VDE 0884/06.92 (Option 060 only).ULRecognized under UL 1577,Component Recognition Program, File E55361.CSAApproved under CSA Component Acceptance Notice #5, File CA 88324.VDE 0884 Insulation Related Characteristics(HCPL-2400 OPTION 060 ONLY)*Refer to the front of the optocoupler section of the current catalog, under Product Safety Regulations section (VDE 0884) for a detailed description.Note: Isolation characteristics are guaranteed only within the safety maximum ratings which must ben ensured by protective circuits in application.Absolute Maximum Ratings(No derating required up to 70°C)Parameter Symbol Minimum Maximum Units Note Storage Temperature T S-55125°C Operating Temperature T A-4085°CAverage Forward Input Current I F(AVG)10mAPeak Forward Input Current I FPK20mA12 Reverse Input Voltage V R2VThree State Enable Voltage V E-0.510V(HCPL-2400 Only)Supply Voltage V CC07VAverage Output Collector Current I O-2525mAOutput Collector Voltage V O-0.510VOutput Voltage V O-0.518VOutput Collector Power Dissipation P O40mW(Each Channel)Total Package Power Dissipation P T350mW(Each Channel)Lead Solder Temperature260°C for 10 sec., 1.6 mm below seating plane(for Through Hole Devices)Reflow Temperature Profile See Package Outline Drawings section(Option #300)Recommended Operating ConditionsParameter Symbol Minimum Maximum Units Power Supply Voltage V CC 4.75 5.25V Forward Input Current (ON)I F(ON)48mA Forward Input Voltage (OFF)V F(OFF)0.8V Fan Out N5TTL Loads Enable Voltage (Low)V EL00.8V HCPL-2400 Only)Enable Voltage (High)V EH2V CC V HCPL-2400 Only)Operating Temperature T A070°CElectrical Specifications0°C ≤T A≤70°C, 4.75 V ≤V CC≤5.25 V, 4 mA ≤I F(ON)≤8 mA, 0 V ≤V F(OFF)≤0.8 V. All typicals at T A=25°C, V CC = 5 V, I F(ON) = 6.0 mA, V F(OFF) = 0 V, except where noted. See Note 11.*All typical values at T A = 25°C and V CC = 5 V, unless otherwise noted.Switching Specifications0°C ≤T A≤70°C, 4.75 V ≤V CC≤5.25 V, 4 mA ≤I F(ON)≤8 mA, 0 V ≤V F(OFF)≤0.8 V. All typicals at T A = 25°C, V CC = 5 V, I F(ON) = 6.0 mA, V F(OFF) = 0 V, except where noted. See Note 11.DeviceParameter Symbol HCPL-Min.Typ.*Max.Units Test Conditions Figure NotePropagation Delay t PHL55ns I F(ON) = 7 mA5, 6, 71, 4, Time to Logic Low5, 6 Output Level153360Propagation Delay t PLH55ns I F(ON) = 7 mA5, 6, 71, 4, Time to Logic High5, 6 Output Level153060Pulse Width|t PHL-t PLH|215ns I F(ON) = 7 mA5, 86 Distortion525Propagation Delay t PSK35ns Per Notes & Text15, 167 SkewOutput Rise Time t r20ns5Output Fall Time t f10ns5Output Enable Time t PZH240015ns9, 10to Logic HighOutput Enable Time t PZL240030ns9, 10to Logic LowOutput Disable Time t PHZ240020ns9, 10from Logic HighOutput Disable Time t PLZ240015ns9, 10from Logic LowLogic High Common|CM H|100010,000V/µs V CM = 300 V, T A = 25°C,119 Mode Transient I F = 0 mAImmunityLogic Low Common|CM L|100010,000V/µs V CM = 300 V, T A = 25°C,119 Mode Transient I F = 4 mAImmunityPower Supply Noise PSNI0.5V p-p V CC = 5.0 V,10 Immunity48 Hz ≤ = F AC≤50 MHz*All typical values at T A = 25°C and V CC = 5 V, unless otherwise noted.Package Characteristics*All typical values are at T A = 25°C.**The Input-Output Momentary Withstand Voltage is a dielectric voltage rating that should not be interpreted as an input-output continuous voltage rating. For the continuous voltage rating refer to the VDE 0884 Insulation Related Characteristics Table (if applicable), your equipment level safety specification or Agilent Application Note 1074 entitled “Optocoupler Input-Output Endurance Voltage,” publication number 5963-2203E.Notes:1. Each channel.2. Duration of output short circuit timenot to exceed 10 ms.3. Device considered a two terminaldevice: pins 1, 2, 3, and 4 shortedtogether, and pins 5, 6, 7, and 8shorted together.4. t PHL propagation delay is measuredfrom the 50% level on the rising edgeof the input current pulse to the 1.5V level on the falling edge of the outputpulse. The t PLH propagation delay ismeasured from the 50% level on thefalling edge of the input current pulseto the 1.5 V level on the rising edge of the output pulse.5. The typical data shown is indicative ofwhat can be expected using theapplication circuit in Figure 13.6. This specification simulates the worstcase operating conditions of theHCPL-2400 over the recommendedoperating temperature and V CC rangewith the suggested application circuitof Figure 13.7. Propagation delay skew is discussedlater in this data sheet.8. Measured between pins 1 and 2shorted together, and pins 3 and 4shorted together.9. Common mode transient immunity in aLogic High level is the maximumtolerable (positive) dV CM/dt of thecommon mode pulse, V CM, to assurethat the output will remain in a LogicHigh state (i.e., V O > 2.0 V. Commonmode transient immunity in a LogicLow level is the maximum tolerable(negative) dV CM/dt of the commonmode pulse, V CM, to assure that theoutput will remain in a Logic Low state(i.e., V O < 0.8 V).10. Power Supply Noise Immunity is thepeak to peak amplitude of the ac ripplevoltage on the V CC line that the devicewill withstand and still remain in thedesired logic state. For desired logichigh state, V OH(MIN) > 2.0 V, and fordesired logic low state,V OL(MAX) < 0.8 V.11. Use of a 0.1 µF bypass capacitorconnected between pins 8 and 5adjacent to the device is required.12. Peak Forward Input Current pulsewidth < 50 µs at 1 KHz maximumrepetition rate.13. In accordance with UL 1577, eachoptocoupler is proof tested by applyingan insulation test voltage ≥3000V rmsfor one second (leakage detectioncurrent limit, I I-O≤ 5 µA). This test isperformed before the 100% Produc-tion test shown in the VDE 0884Insulation Related CharacteristicsTable, if applicable.Figure 4. Typical Diode Input Forward Current Characteristic.Figure 6. Typical Propagation Delay vs. Ambient Temperature.Figure 7. Typical Propagation Delay vs. Input Forward Current.Figure 8. Typical Pulse Width Distortion vs. Ambient Temperature.Figure 5. Test Circuit for t PLH , t PHL , t r , and t f .Figure 1. Typical Logic Low Output Voltage vs. Logic Low Output Current.Figure 2. Typical Logic High Output Voltage vs. Logic High Output Current.Figure 3. Typical Output Voltage vs.Input Forward Current.Figure 9. Test Circuit for t PHZ , t PZH , t PLZ and t PZL .Figure 10. Typical Enable Propagation Delay vs. Ambient Temperature.Figure 11. Test Diagram for Common Mode Transient Immunity and Typical Waveforms.Figure 12. Thermal Derating Curve,Dependence of Safety Limiting Value with Case Temperature per VDE 0884.O U T P U T P O W E R – P S , I N P U T C U R R E N T – I S0T S – CASE TEMPERATURE – °C400600800200100300500700VPULSE GENERATOROUTPUT V MONITORING NODE OFigure 15. Illustration of Propagation Delay Skew – t PSK .I FV OI FV OFigure 13. Recommended 20 MBd HCPL-2400/30 Interface Circuit.ApplicationsFigure 14. Alternative HCPL-2400/30Interface Circuit.Figure 16. Parallel Data Transmission Example.Figure 17. Modulation Code Selections.Figure 18. Typical HCPL-2400/30 Output Schematic.DATAINPUTSCLOCKDATAOUTPUTSCLOCKHCPL-2400HCPL-2400VPropagation Delay, Pulse-Width Distortion and Propagation Delay Skew Propagation delay is a figure of merit which describes how quickly a logic signal propagates through a system. The propaga-tion delay from low to high (t PLH) is the amount of time required for an input signal to propagate to the output, causing the output to change from low to high. Similarly, the propagation delay from high to low (t PHL) is the amount of time required for the input signal to propagate to the output, causing the output to change from high to low (see Figure 5).Pulse-width distortion (PWD) results when t PLH and t PHL differ in value. PWD is defined as the difference between t PLH and t PHL and often determines the maximum data rate capability of a transmission system. PWD can be expressed in percent by dividing the PWD (in ns) by the minimum pulse width (in ns) being transmitted. Typically, PWD on the order of 20-30% of the minimum pulse width is tolerable; the exact figure depends on the particular application (RS232,RS422, T-1, etc.).Propagation delay skew, t PSK, is an important parameter to consider in parallel data applica-tions where synchronization of signals on parallel data lines is a concern. If the parallel data is being sent through a group of optocouplers, differences in propagation delays will cause the data to arrive at the outputs of the optocouplers at different times. If this difference in propagation delays is large enough, it will determine the maximum rate atwhich parallel data can be sentthrough the optocouplers.Propagation delay skew is definedas the difference between theminimum and maximum propaga-tion delays, either t PLH or t PHL, forany given group of optocouplerswhich are operating under thesame conditions (i.e., the samedrive current, supply voltage,output load, and operating tem-perature). As illustrated inFigure15, if the inputs of a groupof optocouplers are switchedeither ON or OFF at the sametime, t PSK is the differencebetween the shortest propagationdelay, either t PLH or t PHL, and thelongest propagation delay, eithert PLH or t PHL.As mentioned earlier, t PSK candetermine the maximum paralleldata transmission rate. Figure 16is the timing diagram of a typicalparallel data application with boththe clock and the data lines beingsent through optocouplers. Thefigure shows data and clocksignals at the inputs and outputs ofthe optocouplers. To obtain themaximum data transmission rate,both edges of the clock signalsare being used to clock the data;if only one edge were used, theclock signal would need to betwice as fast.Propagation delay skew repre-sents the uncertainty of where anedge might be after being sentthrough an optocoupler.Figure16 shows that there will beuncertainty in both the data andthe clock lines. It is importantthat these two areas of uncertaintynot overlap, otherwise the clocksignal might arrive before all ofthe data outputs have settled, orsome of the data outputs maystart to change before the clocksignal has arrived. From theseconsiderations, the absoluteminimum pulse width that can besent through optocouplers in aparallel application is twice t PHZ.A cautious design should use aslightly longer pulse width toensure that any additionaluncertainty in the rest of thecircuit does not cause a problem.The HCPL-2400/30 optocouplersoffer the advantages of guaran-teed specifications for propaga-tion delays, pulse-width distortion,and propagation delay skew overthe recommended temperature,input current, and power supplyranges.Application CircuitA recommended LED drive circuitis shown in Figure 13. This circuitutilizes several techniques tominimize the total pulse-widthdistortion at the output of theoptocoupler. By using twoinverting TTL gates connected inseries, the inherent pulse-widthdistortion of each gate cancels thedistortion of the other gate. Forbest results, the two series-connected gates should be fromthe same package.The circuit in Figure 13 also usestechniques known as prebias andpeaking to enhance theperformance of the optocouplerLED. Prebias is a small forwardvoltage applied to the LED whenthe LED is off. This small prebiasvoltage partially charges thejunction capacitance of the LED,allowing the LED to turn on morequickly. The speed of the LED isfurther increased by applyingmomentary current peaks to the LED during the turn-on and turn-off transitions of the drive current. These peak currents help to charge and discharge the capacitances of the LED more quickly, shortening the time required for the LED to turn on and off.Switching performance of theHCPL-2400/30 optocouplers isnot sensitive to the TTL logicfamily used in the recommendeddrive circuit. The typical andworst-case switching parametersgiven in the data sheet can be metusing common 74LS TTL invert-ing gates or buffers. Use of fasterTTL families will slightly reducethe overall propagation delaysfrom the input of the drive circuitto the output of the optocoupler,but will not necessarily result inlower pulse-width distortion orpropagation delay skew. Thisreduction in overall propagationdelay is due to shorter delays inthe drive circuit, not to changes inthe propagation delays of theoptocoupler; optocoupler prop-agation delays are not affected bythe speed of the logic used in thedrive circuit. Data subject to change.Copyright © 1999 Agilent Technologies Obsoletes 5091-2922E, 5954-2140E 5965-3586E (11/99)。
ATEX HBDC系列圆柱式防爆灯具说明书
Applications• For illumination of:— Stairways — Small areas — Emergency exitFeatures• For lamps:— 70 W high pressure sodium (ovoid type E27 lampholder)— 18/20 W compact fluorescent lamp (E27 lampholder)— 2 x 40 W incandescent lamp (E27 lampholder)— 8 W fluorescent bulb (G5 lampholder) (lamp supplied)• HPS version: compensated power supply (+/-10%) with power factor 0.9:— ATEX/IEC: 230/240 V , 50 Hz• Connection to plug-in terminal block via 2 x 3 terminals 2.5 mm² (0.004 in²).• Operates in any position.• Threaded access cover with O-ring seal.• T wo integrated mounting lugs.• 1 external earth via 4 mm² (0.006 in²) bracket.• 2 threaded cable entries.• Supplied with 1 plug M20 (cable gland not supplied).Standard Materials• End cap and cover: Zamak, anticorrosion treated and painted gray• Sealed tube: toughened glass• External reflector: galvanized steel painted white • Protective guard: zinc plated steel• Lamps are not supplied except for 8 W fluorescent bulbOptions• Fixing accessories available in 316 stainless steel or zinc plated steel.• Fall prevention fixing kit in stainless steel.ATEX/IECEx Certifications and Compliances• Certification T ype: FLd — Gas: Zone 1 - 2– Conforming to ATEX 94/9/CE: II 2 G – T ype of Protection: Ex d IIB/IIC– T emperature Class: See T Rating (Gas) and Surface Temperature (Dust) Table — Dust: Zone 21 - 22– Conforming to ATEX 94/9/CE: II 2 D – T ype of Protection: Ex tD A21– Surface T emperature: See T Rating (Gas) and Surface Temperature (Dust) Table• Ambient T emperature: -20 °C ≤ T a ≤ +50 °C (-4 °F ≤ T a ≤ +122 °F); for 70 W HPS: -40 °C ≤ T a ≤ +50 °C (-40 °F ≤ T a ≤ +122 °F) • CE Declaration of Conformity: 50203• ATEX Certificate: LCIE 97/ ATEX 6012• IECEx Certificate: IECEx LCI 04.0018• Index of Protection according EN/IEC 60529: IP66/68 (10 m)• Impact Resistance (shock): IK08• Internal Volume: > 2 dm 3 (122 in³) - 2 litersEURASEC Certification• EURASEC N° TC RU C-FR.ГБ05.B.00912Other Certification• INMETRO Certificate: BVC11.0492 ①Related Products• For labels see Labels for Emergency Lighting Units, ATX Self-Adhesive Signaling Labels for Emergency Lighting Units.70 W High Pressure Sodium VersionCompact Fluorescent VersionATEX/IECEx:Zone 1 and 2 – 21 and 22 II 2 GDIP66/68 (10M) - IK08① Inmetro certification available on special request only. Contact your local sales representative for more information.I N C A N D E S C E N T /A R E A : A T E X /I E C E x F L A M E P R O O FATEX/IECEx:Zone 1 and 2 – 21 and 22 II 2 GDIP66/68 (10M) - IK08Incandescent lamp (2 x 40 W) ②T5T5T5T5+95 (+203)+95 (+203)Compact Fluorescent lamp(20 W max)T6T5T5T4+95 (+203)+130 (+266)Fluorescent (8 W - G5 lampholder)T6T5T5T4+95 (+203)+130 (+266)High Pressure Sodium Lamp(70 W ovoid) ②T4 for Ta = +50 °C (+122 °F)––+122 (+252)–① 50 Hz only for the 70 W HPS Version.② Lamp not supplied.Order using catalog numbering guide below to decifer the catalog number logic on the following page.Catalog Numbering Guide — HBDC Series Cylindrical Bulkhead LuminairesHBDCF14002ASeries:HBDC - HBDC SeriesZone 1 and 2 – 21 and 22 ATEX/IECEx CertifiedQuantity of Lamps:1 - One Lamp 2 - Two LampVoltage:02A - 24 Vac, 50/60 Hz 02D - 24 Vdc04A - 48 Vac, 50/60 Hz 04D - 48 Vdc11A - 110 Vac, 50/60 Hz 11D - 110 Vdc24A - 230/240 Vac, 50/60 Hz ①24B - 230/240 Vac/Vdc, 50/60 HzLamp Type:I - Incandescent F - FluorescentL - High Pressure SodiumLamp Wattage (for lamp type):40 - 40 W (Incandescent)18 - 18/20 W (Compact Fluorescent)70 - 70 W (High Pressure Sodium)08 - 8 W (Fluorescent)INCANDESCENT/AREA: ATEX/IECEx FLAMEPROOFATEX/IECEx:Zone 1 and 2 – 21 and 22 II 2 GDIP66/68 (10M) - IK08External reflector in galvanized steel (painted white)(not compatible with 70 W HPS version)FDER1G Protective guard in zinc plated steel FDPG1ZProtective guard in zinc plated steel for 70 W HPS versionFDPG5Z Quick one-hand fixing (Set of 2 brackets) in zinc plated steel FDFBZQuick one-hand fixing (Set of 2 brackets) in 316 stainless steelFDFBS Fixing unit on flat surface (Set of 2 brackets) in zinc plated steel FDSBZFixing unit on flat surface (Set of 2 brackets) in 316 stainless steelFDSBSFixing unit in zinc plated steel for 1-1/2" tube [49 mm (1.93 in) diameter] or for 1-1/4" tube tube[42 mm (1.65 in) diameter]FDHC49ZFixing unit in 316 stainless steel for 1-1/2" tube [49 mm (1.93 in) diameter] or for 1-1/4" tube tube[42 mm (1.65 in) diameter]FDHC49S Fixing unit in zinc plated steel for 2" tube [60 mm (2.36 in) diameter]FDHC60ZFixing unit in stainless steel for 2" tube [60 mm (2.36 in) diameter]FDHC60SFall prevention fixing kit in stainless steel [1.2 m (0.05 in) chain]FDSCS① Lamp not supplied.INCANDESCENT/AREA:ATEX/IECExFLAMEPROOFATEX/IECEx:Zone 1 and 2 – 21 and 22 II 2 GDIP66/68 (10M) - IK08Dimensions in Millimeters (Inches)HBDCL17024A (70 W HP High Pressure Sodium)HBDC and HBDCFPhotometric DataPolar curves for a 1000 lm flux, according to NF C 71-120.Luminaire symbol according to NF C 71-121.70 W HP High Pressure Sodium Efficiency 59.4%NF C 71-121: 0.56G + 0.04T5101520253035404550556065101397090272x40 W Incandescent Efficiency: 75.6%NFC 71-121: 0.74G + 0.02T 510152025303540455060709943INCANDESCENT/AREA: ATEX/IECEx FLAMEPROOF。
2430-005中文资料
MIN -002 -005 thru -200 -002 & -005 -010 thru -200
TYP 2 2 100 50 2 +300 0.5 0.7 >65 1
MAX 3 4 3 300 200 3 1.0 1.5
UNITS % % of span (ppቤተ መጻሕፍቲ ባይዱ of span)/EC % ppm/EC % of span dB Ohm V mA grams grams/meter
PERFORMANCE - By Model: VS=±12 to ±16VDC, TC=25EC.
MODEL NUMBER Input Range 2430-002 2430-005 2430-010 2430-025 2430-050 2430-100 2430-200 ±5 0 - 400 1000 38 ±10 ±25 ±50 ±100 ±200 0 - 600 0 - 1000 0 - 1500 0 - 2000 0 - 2500 500 76 200 190 2000 100 380 50 760 25 1520 UNITS g Hz mV/g µg/(root Hz) g ±2 Frequency Response (Nominal, 3 dB) 0 - 300 Sensitivity 2500 Output Noise (RMS, typical) 15 Max. Mechanical Shock (0.1 ms)
OPERATION
The Model 2430 produces three analog voltage outputs which vary with acceleration. The Z axis is perpendicular to the bottom of the package, with positive acceleration defined as a force pushing on the bottom of the package. The X and Y axis directions are marked on the cover with positive acceleration defined as acceleration in the direction of the axis arrow. The outputs are single ended and vary with respect to the voltage at the OUTPUT REF input which should be approximately centered between the +VS and -VS supply voltages. The output scale factor is independent of the supply voltages from ±12 to ±16 volts. At zero acceleration, the output voltage is nominally zero volts; at ±full scale acceleration the output voltage is ±5 volts respectively.
ZST6000光伏逆变器综合测试仪入门手册V1.02
致远电子
安全须知
本仪器的使用涉及到高压，为防止电击或其它危险造成的人员伤亡，在安装、使用或 维修本产品之前，请务必仔细阅读、并完全理解“安全须知”章节的相关内容。 为保证您能正确安全地使用本仪器， 请务必遵守以下注意事项。 如果未遵守本手册指定 的方法操作本仪器， 可能会损坏本仪器的保护功能。 因违反以下注意事项操作仪器所引起的 损伤，广州致远电子股份有限公司概不承担责任。
产品入门手册 << I
致远电子
注意搬运安全
ZST6000 入门手册
为避免仪器在搬运过程中滑落，造成仪器面板上的按键、旋钮或接口等部件损坏，请注 意搬运安全。
警示标志
注意符号表示存在危险。提示用户对某一过程、操作方法或类似情况 进行操作时，如果不能正确执行或遵守规则，则可能对产品造成损坏或者 丢失重要数据。在完全阅读和充分理解注意所要求的事项之前，请不要继 续操作。 警告符号表示存在严重危险。提示用户对某一过程、操作方法或类似 情况进行操作时，如果不能正确执行或遵守规则，则可能造成人身伤害甚 至死亡。在完全阅读和充分理解警告所要求的事项之前，请务必停止操作。
安全信息
光伏逆变器综合测试仪安全符号如下所示。
小心，危险
CE 认证
地端子
小心，电击危险
请勿将使用过的 电池丢入垃圾桶
可回收利用
CAT Ⅱ(1000V)IEC 测量Ⅱ类，输入可连接到归属到Ⅱ类过电压条件下的电源 ( 最大 1000VAC)。 一般注意事项 针对人身安全与设备保护，列出注意事项如下所述： 保护功能有缺陷。在使用仪器之前，请对保护功能进行确认。如发现 保护接地或保险丝有缺陷，请勿继续使用本仪器； 请勿拆卸仪器的机箱。仪器内部有高压，非常危险。若要对仪器内部 进行检查和调试，请咨询广州致远电子股份有限公司； 出现异味或冒烟时。出现机体冒烟或散发异味等异常情况时，请直接 关闭电源，从插座拔掉电源插头，并切断连接在输入端子的测量回路 的电源。发生异常情况时，请咨询致远公司； 勿在易燃环境下操作仪器。请勿在含有易燃易爆液体或气体的环境里 使用本仪器； 请勿损坏电源线。请勿将物品摆放在电源线上，并使电源线远离热源。 将电源插头从插座拔出时，请勿拉扯电线，而应手持插头拔出。电源 线有破损时，请在确认好零件编号后再向经销商订购；
伊顿电气有限公司Eaton Electrical Ltd. DMVCD系列隔离开关使用说明书
DMVCD系列隔离开关使用说明书伊顿电气有限公司Eaton Electrical Ltd.装箱单随机文件和附件产品型号说明书合格证手柄操作轴柜外操作机构标准件限制件DMV63CD/3.41111DMV100CD/3.411111DMV63CD/3.4G 111111DMV100CD/3.4G 1111111DMV160-630CD/3.41111DMV160-630CD/3.4G 11111DMV1000CD/3.41112DMV1000CD/3.4G 111112DMV1250-1600CD/3.41114DMV1250-1600CD/3.4G111114尊敬的用户：欢迎您使用本公司生产的DMVCD系列隔离开关产品!为了您能安全正确地使用本系列产品,敬请您在安装调试和使用前熟读本说明书。
本产品符合GB/T14048.3、IEC60947-3标准，并通过了国家CCC认证。
目录一.用途 (4)二.产品的工作条件 (4)三.结构与特点 (4)四.主要规格及技术参数 (4)五.外型与安装尺寸 (5)六.安装方法 (9)七.使用与维修 (14)八.订货须知 (14)一、用途DMVCD系列隔离开关（以下简称开关）适用于交流50Hz，额定电压415V以下，额定电流为63～1600A。
在配电系统中做不频繁接通与分断电路及隔离电路用。
二、产品的工作条件开关在如下条件下可靠运行：安装地点的海拔高度不超过2000米；周围空气温度不超过+40℃，而且其24h内的平均温度值不超过+35℃；周围空气温度的下限为-5℃；最高温度为+40℃时，空气的相对湿度不超过50%，在较低的温度下可以允许有较高的相对湿度，例如20℃时达90%。
对由于温度变化偶尔产生的凝露应采取特殊的措施；污染等级为3级。
注：若预期使用条件与以上标准不同，应在下单前提出。
三、结构与特点开关由不饱和聚酯玻璃纤维增强模塑料(DMC)制造的外壳；弹簧储能加速机构能快速实现接通与分断；触头结构为并联双断点两个分离触头面，并由片状弹簧保证触头压力；开关能够自动确定通断的极限位置，而且具有明显的通断标记来指示通断位置。
KYDBL2430-2E 智能控制器使用说明书
MMT-DPWKYDBL2430-2EKYDBL2430-2E智能控制器使用说明书济南科亚电子有限公司在使用本产品前请您详细阅读本使用说明书。
由于不遵守该使用及安装说明书中规定的注意事项，所引起的任何故障和损失均不在厂家的保修范围内，厂家将不承担任何相关责任。
请妥善保管好文件，如有相关疑问，请与厂家联系。
安全注意事项·请专业技术人员进行安装、连接、调试该设备。
·在带电情况下不能安装、移除或更换设备线路。
·请务必在本产品的电源输入端与电源（电瓶）之间加装必要的保护装置,以免造成危险事故或致命伤害；需要加装：过流保护器、保险、紧急开关。
·请做好本产品与大地、设备之间的隔离及绝缘保护。
·如确实需要带电调试本产品，请选用绝缘良好的非金属专用螺丝刀或专用调试工具。
·本产品需要安装在通风条件良好的环境中。
·本产品不能直接应用在高湿、粉尘、腐蚀性气体、强烈震动的非正常环境下。
△!该标志表示一种重要提示或是警告。
目录一、概述 (1)二、规格及型号 (1)三、产品特性 (1)四、性能指标 (2)五、外形尺寸 (3)六、接线要求 (4)七、控制器端子接线说明及端子功能示意图 (5)八、控制器事态响应状态 (11)九、直流有刷电机的连接及说明 (12)十、控制器工作模式说明 (13)十一、LED指示灯状态说明 (15)十二、公司地址及联系方式 (15)一、概述KYDBL4830-2E是一款智能型直流有刷马达控制器。
该电机驱动器可同时控制三台直流有刷电机，内部使用32位高性能MCU，采用高级的运动处理算法实现内部电子差速功能。
工作模式分为两种；独立模式和混合模式。
独立模式：可实现三路电机完全独立控制，三路直流有刷电机可分别控制电机的速度与方向。
混合模式：可实现三台有刷电机同步控制（前进、后退，左右旋转）。
控制信号多达8种方式（无线遥控、摇杆、电位器、模拟量、频率、脉宽、RS232、CAN总线）。
GigaVUE HC系列产品数据手册说明书
GigaVUE HC SeriesScalable Traffic Intelligence for Small to Large Enterprises and Service ProvidersKey BenefitsThe GigaVUE HC series consists of three models: GigaVUE-HC1, GigaVUE-HC2, and GigaVUE-HC3.Management, Integration, and InstallationSmall footprint with low space, power and cooling needs Modular for flexibility and scalability as needs change Rapid programmatic response to detectable events Advanced integration with tools, controllers and other infrastructure systemsTraffic Forwarding for Network and Security Operations Optimize the delivery of your network traffic to your monitoring and security tools, enabling:• Eliminating contention for network data access• Targeting specific flows to specific tools with network and application awareness• Sharing traffic load across multiple tools’ instances, even for encapsulated trafficSelectively aggregate and replicate traffic at line rate Optimize the content of the delivered traffic, enabling:• Removing duplicate packets• Feeding non-packet based tools with flow and/or rich meta data• Removing unwanted/undesirable protocol headers and/or payload content• Obfuscating private or sensitive dataReuse existing tools for current and new network links Scale network coverage and tool deployment, with USB MGMT PTP CON RDY PTPPPS FAN PWRM/SSTACK STACK P/S PPS(IN)RDY POWERH/SSMT-HC3-C05C5C4C3C2C1RDYPOWERH/SPRT-HC3-X24X1/X2X3/X4X5/X6X7/X8X9/X10X11/X12X13/X14X15/X16X17/X18X19/X20X21/X22X23/X24RDY POWERH/SPRT-HC3-X24X1/X2X3/X4X5/X6X7/X8X9/X10X11/X12X13/X14X15/X16X17/X18X19/X20X21/X22X23/X24RDYC1C2C3C4C5C6C7C8POWERH/SPRT-HC3-C08Q08X1/X2RDY PWR FAN PTP PPS M/SStack/PTP Mgnt / Con G1 / G2G3 / G4USB X3/X4X5/X6X7/X8X9/X10X11/X12TAP1TAP2TAP3TAP4RDY POWER ON/OF TAP1TAP2TAP3TAP4RDYPOWER ON/OF Fan PPS RearRdy PwrM/SLockPTPIEEE 1588StackMgmt PortMgmtCon-soleGigaVUE-HC211234T A P H C 0G 100C 0RdyPwrTAP 1TAP 2TAP 3TAP 4TAP 5TAP 6TAP 7TAP 8TAP 9TAP 10TAP 11TAP 12X1X2RdyPwr S M T H C 0X 16X3X4X5X6X7X8X9X10X11X12X13X14X15X16H/SX1X2RdyPwr B P S H C 0D 25A 4GX3X4X5X6X7X8X9X10X11X12X13X14X15X16SX / SR50 umP R T H C 0Q 06Rdy Pwr Q1LNK ENA Q1LNK ENA Q1LNK ENA Q1LNK ENA Q1LNK ENA Q1LNK ENAAs a key product family within the Gigamon Visibility and Analytics Fabric™, the GigaVUE HC series enables comprehensive traffic and security intelligence at scale. These next-generation network packet brokers are an ideal choice to enhance your security and monitoring solutions.inline and out-of-band security and monitoring tools.GigaVUE HC Series is used to provide visibility for active and passive security as well as network and application monitoring.The GigaVUE HC Series Modelsacross medium-sized branch offices.GigaVUE-HC3A 3RU form factor offers trafficintelligence at scale to meet thedemands of large enterprises andservice providers.GigaVUE-HC3GigaVUE-HC3Key Features and BenefitsNetwork and Traffic Access Three modular chassis models with portspeed and media options:• 100Mb, 1000Mb and 10Gb copper• 1Gb, 10Gb, 25Gb, 40Gb and 100Gbmultimode and single-mode fiberCompatible with SFP, SFP+, QSFP+ andQSFP28 MSA-compliant transceivers,as offered by Gigamon • Scale from low to high density systems:–Cost-effective for only whatis needed–Increased flexibilityPort configurability:• Full flexibility in selecting ports as ingress, intermediate, interconnect or egress functions• Unidirectional and bi-direction ports • Tunneling (e.g. L2GRE, ERSPAN, TCP, VXLAN)• Enable agile response to changes in monitoring infrastructure and monitoring needs• Facilitate passive out-of-band and active inline monitoring via the same HC node• Allow virtualized traffic to be accessed, or backhauled between locations, over an IP network – and with reliable delivery (using TCP)Core Intelligence Flow Mapping®:• Aggregation and replication–Selective any-to-any port mapping• Filtering–Layer 2 to 7 rules–Ingress aggregate and egress• Load-balancing–Layers 2 to 4 hashing criteria–Session stickiness • Access traffic from any link to any tool, even for different link rates• Remove issues with asymmetric routing and link aggregation (LAG)• Optimize tools by forwarding only traffic of interest or dropping traffic not of interest• Spread load across multiple tool instances of same typeInline Bypass:• Optional physical bypass for100M/1G/10G/25G/40G/100G link rates and copper/fiber (multimode, single mode) media types• Aggregate multiple network segments • Filter and load-balance towards inline applications/tools• Easily configure simple and complex tool chains• Customizable heartbeat packets for positive (through-path) and negative (block) tests • Remove multiple points of network failure• Provide full visibility for each inline security tool type (e.g. IPS, WAF)• Easily deploy security in layers solutions, for both active and passive scenarios• Seamlessly migrate tools from passive out-of-band to active inline mode • Reduce likelihood of network impact due to malfunctioning active inline toolsVLAN port tagging• Pinpoint source of traffic Clustering and Fabric Mapping• Enable resilient traffic forwarding• Manage up to 32 nodes in a cluster asa single virtual node• Enact end-to-end Flow Mapping,across clusters, scaling to hundredsof nodesTraffic Intelligence Adaptive packet filtering, Advancedload-balancing, Deduplication, Headerstripping, Masking, NetFlow generation,Slicing, SSL/TLS decryption, Advancedtunneling, Advanced flow slicing Refer to the GigaSMART® datasheet found hereApplication Intelligence Application Filtering, ApplicationMetadata, Video Data Records Refer to the GigaSMART datasheet found hereSubscriber Intelligence Flow Sampling, GTP Correlation,SIP/RTP Correlation, 5G & CUPScorrelation, Subscriber-aware Metadata*Refer to the GigaSMART datasheet found hereNetwork Detection ThreatINSIGHT Sensor Refer to the GigaSMART datasheetfound hereManagement Local and remote management using:• Command line interface (CLI)(T elnet/SSH)• Web GUI (HTTP/HTTPS)• XML API (HTTP/HTTPS)• Fabric Manager (HTTP/HTTPS)• SNMP (v1, v2, v3)• Syslog • Easy to manage via a web GUI or via CLI for users already familiarwith Cisco• Easy integration with applications using CLI or RESTful API• Support SDN paradigm• Manage and orchestrate from single pane of glass• Alerts can be received by any Syslog server or SNMP managerUser access:• Role-based Access Control (RBAC) –Multi-tenant user access–Flexible user/role definedprivileges, screen viewsand access• AAA security with local and remote authentication (LDAP, RADIUS, TACACS+)• Adhere to corporate IT security policies• Meet corporate IT authentication policySystem Field replaceable hardware:• Port modules• AC and DC power supplies• Fan trays• Control card • Achieve five nines highly available uptime• Without needing to replace or remove the chassis, you can:–Scale as needs change–Upgrade features and capabilitiesMetrics and statistics:• Management CPU resources • Switching ASIC resources • Port utilization• Flow map throughput • Facilitate troubleshooting• Guide capacity planning and traffic forward rules* Available with 5.11 releaseChassis Maximum CapabilitiesATTRIBUTE GIGAVUE-HC1GIGAVUE-HC2GIGAVUE-HC3 Size Small (1RU)Medium (2RU)Large (3RU) Throughput604Gbps960Gbps 6.4Tbps No. of port modules244No. of GigaSMART modules 3 (2 front, 1 built-in) 5 (4 front, 1 rear) 4 (front) No. of GigaSMART engines358 (2 per module) No. of ports and speeds10/100Mb20 (4 built-in UTP)72***-1Gb40 (12 built-in SFP+ and 4built-in UTP)96-10Gb36 (12 built-in SFP+)9612825Gb--12840Gb82464100Gb-8‡64Physical bypass options10/100/1000Mb copper,1/10Gb SX/SR Fiber 10/100/1000Mb copper,1/10Gb SX/SR Fiber,1/10Gb LX/LR Fiber,40Gb SR4 Fiber40/100Gb SR4 Fiber,10/25Gb SR Fiber(using breakout),40/100Gb LR4 Fiber*** Using module with SKU TAP-HCO-G100C0Field Swappable Port and GigaSMART ModulesPRODUCT DESCRIPTIONGigaVUE-HC1 Modules PRT-HC1-X1212 x 1Gb/10Gb (SFP/SFP+) portsPRT-HC1-Q04X08* 4 x 40Gb (QSFP+) & 8 x 1Gb/10Gb (SFP/SFP+) ports• QSFP+ Port Modes: 1 x 40Gb or 4 x 10GbBPS-HC1-D25A241Gb/10Gb Bypass combo module• 2 pairs of SX/SR 50/125μm Bypass + 4 x 10Gb/1Gb(SFP+/SFP) ports• 100Mb/1000Mb embeddedTAP-HC1-G10040TAP and Bypass module• 4 pairs of copper (RJ-45) TAP or Bypass• Each pair can be individually configured as TAPor Bypass• 100Mb/1000Mb embeddedSMT-HC1-S Third generation GigaSMART front module with:• One GigaSMART engine• No front portsRefer to the GigaSMART datasheet found here formore informationGigaVUE-HC2 Modules PRT-HC0-X2424 x 10Gb/1Gb (SFP+/SFP) ports modulePRT-HC0-Q06 6 x 40Gb (QSFP+) ports modulePRT-HC0-C02 2 x 100Gb (QSFP28) ports module• Supports 100GBASE-SR4• PRT-HC0-C02 requires Control Card Version 2• 40Gb Bypass and 1Gb/10GbBPS-HC0-Q25A28Combo module• 2 pairs of 40G SR4 Bypass + 8 x 10Gb/1Gb (SFP+/SFP)ports• 1Gb/10Gb BypassBPS-HC0-D25A4G Combo module• 4 pairs of SX/SR 50/125μm Bypass + 16 x 10Gb/1Gb(SFP+/SFP) ports• 1Gb/10Gb BypassBPS-HC0-D35C4G Combo module• 4 pairs of LX/LR single-mode Bypass + 16 x 10Gb/1Gb(SFP+/SFP) ports• 1Gb/10Gb Bypass* Available with 5.11 releaseGigaVUE-HC2 Modules TAP-HC0-D25AC0TAP module• 12 x SX/SR 50/125μm TAP pair• 50/50 split ratio• 1Gb/10Gb embeddedTAP-HC0-D25BC0TAP module• 12 x SX/SR 62.5/125μm TAP pair• 50/50 split ratio• 1Gb/10Gb embeddedTAP-HC0-D35CC0TAP module• 12 x LX/LR TAP pair• 50/50 split ratio• 1Gb/10Gb embeddedTAP-HC0-G100C0TAP and Bypass module• 12 x copper (RJ-45) TAP or Bypass pair• Each pair can be individually configured as TAP or Bypass• 100Mb/1000Mb embeddedSMT-HC0-Q02X081Second generation GigaSMART front module with:• One GigaSMART engine• 2 x 40Gb (QSFP+), 8 x 10Gb/1Gb (SFP+/SFP) portsRefer to the GigaSMART datasheet found here formore informationSMT-HC0-X16First generation GigaSMART front module with:• One GigaSMART engine• 16 x 10Gb/1Gb (SFP+/SFP) portsRefer to the GigaSMART datasheet found here formore informationSMT-HC0-R First generation GigaSMART rear module with:• One GigaSMART engine• No portsRefer to the GigaSMART datasheet found here formore information1 SMT-HC0-Q02X08 requires Control Card Version2 (CTL-HC0-002)GigaVUE-HC3 Modules PRT-HC3-C16216 x 100Gb/40Gb (QSFP28/QSFP+) ports module• Port Modes: 1 x 100Gb/40Gb, 4 x 25Gb1 or 4 x 10Gb1PRT-HC3-C08Q088 x 100Gb QSFP28 ports module• Port Modes: 1 x 100Gb, 2 x 40Gb, 4 x 25Gb1, 2 or4 x 10Gb1PRT-HC3-X2424 x 25Gb2/10Gb (SFP28/SFP+) ports module• Port Modes: 1 x 25Gb/10GbBPS-HC3-C25F2G100Gb/40Gb/25Gb/10Gb Bypass combo module• 2 x 100Gb/40Gb SR4 Bypass pairs• Up to 8 x 10Gb SR Bypass pairs• 16 x 25Gb2/10Gb (SFP28/SFP+) portsBPS-HC3-Q35C2G40Gb/25Gb/10Gb Bypass combo module• 2 x 40Gb LR4 Bypass pairs• 16 x 25Gb2/10Gb (SFP28/SFP+) portsBPS-HC3-C35C2G100Gb/40Gb/25Gb/10Gb Bypass combo module• 2 x 100Gb LR4 Bypass pairs• 16 x 25Gb2/10Gb (SFP28/SFP+) portsSMT-HC3-C05GigaSMART front module with:• Two GigaSMART engines• 5 x 100Gb QSFP ports• Port Modes: 1 x 100Gb, 1 x 40Gb, 4 x 25Gb1, 2 or4 x 10Gb1Refer to the GigaSMART® datasheet found here formore information.1 Requires MPO-to-4xLC breakout cable or the PNL-M341 or PNL-M343 modules for G-TAP M Series2 Requires Control Card Version 2 (CTL-HC3-002)Physical Dimensions and WeightsPRODUCT NAME HEIGHT WIDTH DEPTH WEIGHTGigaVUE-HC1GigaVUE-HC1base chassis(includes built-insecond generationGigaSMART engine)1.75in (4.5cm)17.26in (43.85cm)without ears19.5in (495mm)With PSU handleand card ejector:20.92in (53.18 cm)20.88lbs (9.47kg)With ears: 21.12lbs(9.58kg)PRT-HC1-X12 1.6in (4.10cm) 4.65in (11.8cm)10.13in (24.98cm) 1.50lbs (0.68kg) PRT-HC1-Q04X08 1.6in (4.10cm) 4.65in (11.8cm)10.13in (24.98cm) 1.50lbs (0.68kg) BPS-HC1-D25A24module1.6in (4.10cm) 4.65in (11.80cm)10.13in (24.98cm)2.2lb (0.99kg)TAP-HC1-G10040module1.6in (4.10cm) 4.65in (11.8cm)10.13in (24.98cm) 1.50lbs (.68kg) SMT-HC1-S* 1.6in (4.10cm) 4.65in (11.80cm)10.13in (24.98cm)2.54lb (1.15kg)GigaVUE-HC2GigaVUE-HC2base chassis 2RU3.5in (8.9cm)17.26in (43.85cm)without ears24.2in (61.6cm)without cablemanagement27.0in (68.6cm)with cablemanagement36.8lbs (16.7kg)PRT-HC0-X24module1.6in (4.1cm)8.0in (20.3cm)9.4in (23.8cm)2.12lbs (0.96kg)PRT-HC0-Q06module1.6in (4.1cm)8.0in (20.3cm)9.4in (23.8cm)2.40lbs (1.09kg)PRT-HC0-C02module1.6in (4.1cm)8.0in (20.3cm)9.4in (23.8cm)2.30lbs (1.09kg)BPS-HC0-Q25A28 module1.6in (4.1cm)8.0in (20.3cm)10.5in (26.7cm) 3.14lbs (1.42kg)BPS-HC0-D25A4G module1.6in (4.1cm)8.0in (20.3cm)10.5in (26.7cm) 3.60lbs (1.63kg)BPS-HC0-D25B4G module1.6in (4.1cm)8.0in (20.3cm)10.5in (26.7cm) 3.60lbs (1.63kg)BPS-HC0-D35C4G module1.6in (4.1cm)8.0in (20.3cm)10.5in (26.7cm) 3.60lbs (1.63kg)TAP-HC0-D25AC0 module1.6in (4.1cm)8.0in (20.3cm)9.4in (23.8cm) 3.50lbs (1.59kg)TAP-HC0-D25BC0 module1.6in (4.1cm)8.0in (20.3cm)9.4in (23.8cm) 3.50lbs (1.59kg)TAP-HC0-D35CC0 module1.6in (4.1cm)8.0in (20.3cm)9.4in (23.8cm) 3.50lbs (1.59kg)TAP-HC0-G100C0module1.6in (4.1cm)8.0in (20.3cm)9.4in (23.8cm) 3.20lbs (1.45kg) * Available with 5.10 releasePRODUCT NAME HEIGHT WIDTH DEPTH WEIGHT GigaVUE-HC2SMT-HC0-Q02X08module1.6in (4.1cm)8.0in (20.3cm)10.2in (26.0cm) 4.1lbs (1.86kg)SMT-HC0-X16module1.6in (4.1cm)8.0in (20.3cm)10.2in (26.0cm) 4.40lbs (2.00kg)SMT-HC0-Rmodule1.6in (4.1cm)9.3in (23.5cm)13.2in (33.6cm) 4.40lbs (2.00kg)0GigaVUE-HC3GigaVUE-HC3base chassis 3RU5.25in (13.34cm)17.26in (43.85cm)without ears29.1in (74.0cm)without cablemanagement33.5in (85.0cm)with cablemanagement88.0lbs (40.00kg)PRT-HC3-C16module1.9in (4.7cm)8.5in (21.7cm)16.1in (41.0cm) 6.00lbs (2.72kg)PRT-HC3-C08Q08 module1.9in (4.7cm)8.5in (21.7cm)16.1in (41.0cm)2.40lbs (1.09kg)PRT-HC3-X24module1.9in (4.7cm)8.5in (21.7cm)16.1in (41.0cm)2.12lbs (0.96kg)BPS-HC3-C25F2Gmodule1.9in (4.7cm)8.5in (21.7cm)16.1in (41.0cm) 6.40lbs (2.90kg)BPS-HC3-Q35C2G module1.9in (4.7cm)8.5in (21.7cm)16.1in (41.0cm) 6.05lbs (2.74kg)BPS-HC3-C35C2G module1.9in (4.7cm)8.5in (21.7cm)16.1in (41.0cm) 6.05lbs (2.74kg)SMT-HC3-C05module1.9in (4.7cm)8.5in (21.7cm)16.1in (41.0cm) 4.40lbs (2.00kg) Power SpecificationsPRODUCT LINE COMPONENT SPECIFICATIONSGivaVUE-HC1Power Configurations• 1 + 1 Power: 2 Power Supply ModulesMax power consumption/heat output • 212 Watts; 722.9 BTU/hr• Fully populated system with all ports at 100 percent traffic loadAC power supply modules • Min/max voltage: 100V–127V AC, 200V–240V AC, 50/60Hz • Max PSM input current: 5.8A @ 100V, 2.9A @ 200VDC power supply modules • Min/max voltage: -40.5V to -60V DC • MaxPSMinputcurrent:**********PRODUCT LINE COMPONENT SPECIFICATIONS GivaVUE-HC2Power configurations• 1 + 1 power: 2 power supply modulesMax power consumption/heat output • 960 Watts; 3276 BTU/hr (Control Card Version s 1 and 2)• Fully populated system with all ports at 100 percent traffic loadAC power supply modules• Min/max voltage: 100V–240V AC, 50/60Hz, 8.4A @ 200 V• Max PSM input current: 14.0A @ 100VDC power supply modules• Min/max voltage: -36V to -72V DC• Max PSM input current: 35A @ -36VGivaVUE-HC3Power configurations• 1 + 1 power: 2 power supply modules• 2 + 2 power: 4 power supply modulesMax power consumption/heat output • 1850 Watts; 6312.4 BTU/hr (Control Card Version 1)• 2000 Watts; 6824.3 BTU/hr (Control Card Version 2)• Fully populated system with all ports at 100 percent traffic loadAC power supply modules • Min/max voltage: 100V–115V AC, 200V–240V AC, 50/60Hz • Max PSM input current: 14A @ 100V, 10A @ 200VDC power supply modules• Min/max voltage: -40V to -72V DC• Max PSM input current: 48A @ -40VEnvironmental SpecificationsASPECT SPECIFICATIONSOperating temperature32.F to 104.F (0.C to 40.C)Operating relative humidity20–80 percent, non-condensing Recommended storage temperature-4.F to 158.F (-20.C to 70.C) Recommended storage relative humidity15–85 percent, non-condensing Altitude Systems: Up to 13,000 ft (3.96km)Power Supply Modules: Up to 10,000 ft (3.05km)Standards and ProtocolsTYPE STANDARDSProtocols IEEE 802.3-2012, IEEE 802.1Q VLAN, IEEE 802.3 10BASE-T, IEEE 802.3u 100BASE-TX, IEEE 802.3ab 1000BASE-T, IEEE 802.3z 1000BASE-X, IEEE 802.3ae 10000BASE-X, IEEE 802.3ba, RFC 783 TFTP, RFC 791IP, RFC 793 TCP, RFC 826 ARP, RFC 854 T elnet, RFC 768 UDP, RFC 792 ICMP, SNMP v1/v2c & v3, RFC 2131DHCP client, RFC 1492 TACACS+, and support for IPv4 and IPv6ComplianceASPECT GIGAVUE STANDARDSafety HC1UL 60950-1; CSA C22.2 EN 60950-1; IEC-60950-1:2005(2nd Edition) + Am 1:2009 +Am 2:2013HC2UL 60950-1; CSA C22.2 EN 60950-1; IEC-60950-1HC3UL 60950-1, 2nd Edition; CAN/CSA C22.2 No. 60950-1-07, 2nd Edition;EN 60950-1:2006/ A11:2009/ A1:2010/A12:2011/A2:2013; IEC 60950-1:2005(2nd Edition) + Am 1:2009 + Am 2:2013Emissions HC1FCC Part 15, Class A; VCCI Class A; EN55022/CISPR-22 Class A; Australia/New ZealandAS/NZS CISPR-22 Class A: RCM; EU: CE Mark EN 55022 Class A, China CCC, TaiwanBSMI, Korea KCC, Russia EACHC2FCC Part 15, Class A; VCCI Class A; EN55022/CISPR-22 Class A; Australia/New ZealandAS/NZS CISPR-22 Class A; CE Mark EN 55022 Class A, China CCC, Taiwan BSMI,Korea KCC, Russia EACHC3FCC Part 15, Class A; VCCI Class A; EN55022/CISPR-22 Class A; Australia/New ZealandAS/NZS CISPR-22 Class A; EU:CE Mark EN 55022 Class A; Taiwan BSMI, Korea KCC,Russia EACImmunity HC1ETSI EN300 386 V1.3.2, EN61000-4-2, EN 61000-4-3, 61000-4-4, EN 61000-4-5, EN61000-4-6, EN 61000-3-2HC2HC3ETSI EN300 386 V1.6.1:2012; EN61000-3-2; EN61000-3-3; EN61000-4-2; EN61000-4-3; EN61000-4-4; EN61000-4-5; EN61000-4-6; EN61000-4-8; EN61000-4-11 Environment HC1RoHS 6: EU directive 2002/95/ECHC2HC3EU RoHS 6, EU Directive 2011/65/EU; 2006/1907/EC (REACH); ISTA 2ANEBS HC1Level 3 (GVS-HC102/2)HC2Level 3 (GVS-HC2A1/2)HC3Level 3 (GVS-HC301/2)Security HC1FIPS 140-2HC2FIPS 140-2, UC APL, Common CriteriaHC3FIPS 140-2PRODUCT CATEGORY PART NUMBER DESCRIPTIONBase Hardware GVS-HC101GigaVUE-HC1 node, 12 1G/10G cages, 4 10/100/1000M copper, fan tray,2 power supplies, AC powerGVS-HC102 GigaVUE-HC1 node, 12 1G/10G cages, 4 10/100/1000M copper, fan tray,2 power supplies, DC powerBPS-HC1-D25A24Bypass Combo Module, GigaVUE-HC1, 2 SX/SR 50/125 BPS pairs,4 10G cagesTAP-HC1-G10040TAP and Bypass module, GigaVUE-HC1, 10/100/1000M copper,4 TAPs or BPC pairsPRT-HC1-X12Port Module, GigaVUE-HC1, 12x10G/1G SFP+/SFPPRT-HC1-Q04X08*Port Module, GigaVUE-HC1, 4x40G QSFP+ and 8x10G SFP+ cagesSMT-HC1-S GigaSMART, HC Series, Front Module w/o ports (includesSlicing, Masking, Source Port and GigaVUE Tunneling De-Encapsulation SW) Licenses-Refer to the GigaSMART® datasheet found here for more information.Fan and Power Supplies FAN-TAXQ0GigaVUE-TA10, TA40, HC1 fan assembly, each (2 required on TA10,3 on TA40 and HC1)PWR-TAXQ1Power Supply Module, GigaVUE-TA10, TA40, or HC1, AC, each PWR-TAXQ2Power Supply Module, GigaVUE-TA10, TA40, or HC1 DC, each* Available with 5.11 releasePRODUCT CATEGORY PART NUMBER DESCRIPTIONBase Hardware GVS-HC2A1GigaVUE-HC2 base unit with chassis, Control Card Version 2, 1 fan Tray, CLI,2 power supplies, AC powerGVS-HC2A2GigaVUE-HC2 base unit with chassis, Control Card Version 2, 1 fan tray, CLI,2 power supplies, DC powerCTL-HC0-002Control Card Version 2, GigaVUE-HC2PRT-HC0-X24Port Module, HC Series, 24x10GPRT-HC0-Q06Port Module, HC Series, 6x40GPRT-HC0-C02Port Module, HC Series, 2x100G QSFP28 cages. Requires Control CardVersion 2BPS-HC0-D25A4G Bypass Combo Module, HC Series, 4 SX/SR 50/125 BPS pairs, 16 10G cagesBPS-HC0-D25B4G Bypass Combo Module, HC Series, 4 SX/SR 62.5/125 BPS pairs,16 10G cagesBPS-HC0-D35C4G Bypass Combo Module, HC Series, 4 LX/LR BPS pairs, 16 10Gb cagesBPS-HC0-Q25A28Bypass Combo Module, GigaVUE-HC2, 2 40G SR4 BPS pairs, 8 10G cagesTAP-HC0-D25AC0TAP module, HC Series, SX/SR Internal TAP module 50/125, 12 TAPsTAP-HC0-D25BC0TAP module, HC Series, SX/SR Internal TAP module 62.5/125, 12 TAPsTAP-HC0-D35CC0TAP module, HC Series, LX/LR Internal TAP module, 12 TAPsTAP-HC0-G100C0TAP and Bypass Module, HC Series, copper, 12 TAP or BPS pairsSMT-HC0-Q02X08GigaSMART, HC Series, Front Module, 2 40Gb, 8 10Gb cages (includesSlicing, Masking, Source Port and GigaVUE Tunneling De-Encapsulation SW) SMT-HC0-R GigaSMART, HC Series, Rear Module (includes Slicing, Masking, Source Portand GigaVUE Tunneling De-Encapsulation SW)SMT-HC0-X16GigaSMART, HC Series, Front Module, 16 10Gb cages (includes Slicing,Masking, Source Port and GigaVUE Tunneling De-Encapsulation SW) Licenses-Refer to the GigaSMART® datasheet found here for more information.Fan and Power Supplies FAN-HC200GigaVUE-HC2 fan assembly, each (1 required) PWR-HC201Power supply module, GigaVUE-HC2, AC PWR-HC202Power supply module, GigaVUE-HC2, DC© 2019-2021 Gigamon. All rights reserved. Gigamon and the Gigamon logo are trademarks of Gigamon in the United States and/or other countries. Gigamon trademarks can be found at /legal-trademarks . All other trademarks are the trademarks of their respective owners. Gigamon reserves the right to change, modify, transfer, or otherwise revise this publication without notice.Worldwide Headquarters 3300 Olcott Street, Santa Clara, CA 95054 USA +1 (408) 831-4000 | PRODUCT CATEGORY PART NUMBERDESCRIPTION Base HardwareGVS-HC301GigaVUE-HC3 base unit with chassis, Control Card, 5 fan modules, CLI, 2 power supplies, AC power GVS-HC302GigaVUE-HC3 base unit with chassis, Control Card, 5 fan modules, CLI, 2 power supplies, DC power GVS-HC3A1GigaVUE-HC3 base unit with chassis, Control Card v2, 5 fan modules, CLI, 2 power supplies, AC power GVS-HC3A2GigaVUE-HC3 base unit with chassis, Control Card v2, 5 fan modules, CLI, 2 power supplies, DC power CTL-HC3-002Control Card Version 2, GigaVUE-HC3, each PRT-HC3-C16Port Module, GigaVUE-HC3, 16x100G QSFP28 cages PRT-HC3-C08Q08Port Module, GigaVUE-HC3, 8x100G QSFP28 cages and 8x40G QSFP+ cages PRT-HC3-X24Port Module, GigaVUE-HC3, 24x10G BPS-HC3-C25F2GBypass Combo Module, GigaVUE-HC3, 2 40/100Gb SR4 BPS pairs, 16 10G cages BPS-HC3-Q35C2GBypass Combo Module, GigaVUE-HC3, 2 40Gb LR BPS pairs, 16 10G cages BPS-HC3-C35C2GBypass Combo Module, GigaVUE-HC3, 2 100Gb LR BPS pairs, 16 10G cages SMT-HC3-C05GigaSMART, GigaVUE-HC3, 5x100G QSFP28 cages(includes Slicing, Masking, Source Port and GigaVUE Tunneling De-Encapsulation SW)Licenses -Refer to the GigaSMART® datasheet found here for more information.Fan and Power Supplies FAN-HC300GigaVUE-HC3 fan assembly, each (5 required)PWR-HC301Power supply module, GigaVUE-HC3, AC (each)PWR-HC302Power supply module, GigaVUE-HC3, DC (each)Support and ServicesGigamon offers a range of support and maintenance services. For details regarding the Gigamon Limited Warranty and our product support and software maintenance programs, visit /support-and-services/overview-and-benefits . For More InformationFor more information about the Gigamon Platform or to contact your local representative, please visit: .Learn more or get a demo: /contact-us。
FTDI Chipi-X Cable 数据手册说明书
Chipi-X Cable DatasheetVersion 1.0Document Reference No.: FT_000634 Clearance No.: FTDI# 288Future TechnologyDevices InternationalLtdDatasheet Chipi-X CableChipi-X is a USB to full-handshake RS232 cable with a male DB9 connector. This cable isavailable with or without an enclosure.1IntroductionThe Chipi-X cable is a USB to RS232 level full-handshake UART cable. Chipi-X utilises FTDI’s FT231XS USB to full-handshake UART IC and FT3243S RS232 transceiver IC. A male DB9 (aka DE9) connector provides the connectivity for RS232 communications and a USB-A plug tethered by a 10cm cable to the PCB provides connectivity for USB communications. All components used are Pb-free (RoHS compliant).1.1 FeaturesEntire USB protocol handled on the FT232XS chipFTDI’s royalty -free VCP and D2XX drivers eliminate the requirement for USB driver development in most casesUART interface support for 7 or 8 data bits, 1 or 2 stop bits and odd / even / mark / space / no parity.Fully assisted hardware or X-On / X-Off software handshaking.Data transfer rates from 300 baud to 250 kilo-baud at RS232 voltage levels.512 byte receive buffer and 512 byte transmit buffer utilising buffer smoothing technology to allow for high data throughputAdjustable receive buffer timeout.ESD protection on RS232 I/Os exceeding ±15kV IEC1000-4-2 Air Gap Discharge, ±15kV for Human Body Mode (HBM) and ±8kV IEC1000-4-2 Contact Discharge.ESD protection on USB lines exceeding ±2kV for Human Body Mode (HBM), ±200V for Machine Mode (MM) and ±500V for Charged Device Mode (CDM).Integrated MTP-ROM for storing USB VID, PID, serial number and product description strings.Low operating and USB suspend current. Low USB bandwidth consumption. USB 2.0 Full Speed compatible. -40°C to 85°C extended operating temperature range.Latch-up FreeTable of Contents1Introduction (1)1.1Features (1)2Driver Support (3)3Ordering Information (3)4Functional Description (4)4.1Block Diagram (4)4.2Electrical Details (4)5Chipi-X Signals and Pin Out (5)5.1RS232 Signals (5)5.2USB Signals (5)6Module Dimensions (6)7Chipi-X Circuit Schematic (7)8Internal MTP ROM Configuration (8)9Contact Information (9)Appendix A – List of Tables and Figures (10)Appendix B – Revision History (11)2Driver SupportRoyalty-Free VIRTUAL COM PORT (VCP) DRIVERS for:Windows 7 32,64-bitWindows VistaWindows XP 32,64-bitWindows XP EmbeddedWindows 4.2 , 5.0 and 6.0MAC OS OS-XLinux 2.6.32 or later Android Royalty-Free D2XX Direct Drivers (USB Drivers + DLL S/W Interface):Windows 7 32,64-bitWindows VistaWindows XP 32,64-bitWindows XP EmbeddedWindows 4.2, 5.0 and 6.0MAC OS OS-XLinux 2.6.32 or later AndroidThe drivers listed above are all available to download for free from . Various 3rd Party Drivers are also available for various other operating systems - visit for details.For driver installation instructions please see:/Support/Documents/InstallGuides.htm.3Ordering Information4 Functional Description 4.1Block DiagramFigure 4.1 – Chipi-X Block Diagram4.2Electrical Details5Chipi-X Signals and Pin Out 5.1RS232 SignalsFigure 5.1 – Chipi-X DB9 Pin Out5.2 USB Signals6Module DimensionsFigure 6.1 – Chipi-X DimensionsFigure 6.2 – Enclosure DimensionsAll dimensions are given in millimetres.Chipi-X cables only use lead free components, and are fully compliant with European Union directive 2002/95/EC.7Chipi-X Circuit SchematicFigure 7.1 – Chipi-X Circuit Schematic8Internal MTP ROM ConfigurationFollowing a power-on reset or a USB reset the FT231X will scan its internal MTP ROM and read the USB configuration descriptors stored there. The default values programmed into the internal MTP ROM in theThe internal MTP ROM in the FT231X can be programmed over USB using the utility program FT_PROG. FT_PROG can be downloaded from . Users who do not have their own USB vendor ID but who would like to use a unique Product ID in their design can apply to FTDI for a free block of unique PIDs. Contact FTDI Support(*********************)forthisservice,alsosee TN_100 and TN_101.9Contact InformationHead Office – Glasgow, UKFuture Technology Devices International LimitedUnit 1, 2 Seaward Place, Centurion Business Park Glasgow G41 1HHUnited KingdomTel: +44 (0) 141 429 2777Fax: +44 (0) 141 429 2758E-mail (Sales) *******************E-mail (Support) *********************E-mail (General Enquiries) ******************* Branch Office – Taipei, TaiwanFuture Technology Devices International Limited (Taiwan) 2F, No. 516, Sec. 1, NeiHu RoadTaipei 114Taiwan , R.O.C.Tel: +886 (0) 2 8791 3570Fax: +886 (0) 2 8791 3576E-mail (Sales) **********************E-mail (Support) ************************E-mail (General Enquiries) **********************Branch Office – Hillsboro, Oregon, USA Future Technology Devices International Limited (USA) 7235 NW Evergreen Parkway, Suite 600Hillsboro, OR 97123-5803USATel: +1 (503) 547 0988Fax: +1 (503) 547 0987E-Mail (Sales) *********************E-Mail (Support) ***********************E-Mail (General Enquiries) ********************* Branch Office – Shanghai, ChinaFuture Technology Devices International Limited (China) Room 408, 317 Xianxia Road,Shanghai, 200051ChinaTel: +86 21 62351596Fax: +86 21 62351595E-mail (Sales) *********************E-mail (Support) ***********************E-mail (General Enquiries) *********************Web SiteDistributor and Sales RepresentativesPlease visit the Sales Network page of the FTDI Web site for the contact details of our distributor(s) and sales representative(s) in your country.System and equipment manufacturers and designers are responsible to ensure that their systems, and any Future Technology Devices International Ltd (FTDI) devices incorporated in their systems, meet all applicable safety, regulatory and system-level performance requirements. All application-related information in this document (including application descriptions, suggested FTDI devices and other materials) is provided for reference only. While FTDI has taken care to assure it is accurate, this information is subject to customer confirmation, and FTDI disclaims all liability for system designs and for any applications assistance provided by FTDI. Use of FTDI devices in life support and/or safety applications is entirely at the u ser’s risk, and the user agrees to defend, indemnify and hold harmless FTDI from any and all damages, claims, suits or expense resulting from such use. This document is subject to change without notice. No freedom to use patents or other intellectual property rights is implied by the publication of this document. Neither the whole nor any part of the information contained in, or the product described in this document, may be adapted or reproduced in any material or electronic form without the prior written consent of the copyright holder. Future Technology Devices International Ltd, Unit 1, 2 Seaward Place, Centurion Business Park, Glasgow G41 1HH, United Kingdom. Scotland Registered Company Number: SC136640Chipi-X Cable DatasheetVersion 1.0Document Reference No.: FT_000634 Clearance No.: FTDI# 288 Appendix A – List of Tables and FiguresList of FiguresFigure 4.1 – Chipi-X Block Diagram (4)Figure 5.1 – Chipi-X DB9 Pin Out (5)Figure 6.1 – Chipi-X Dimensions (6)Figure 6.2 – Enclosure Dimensions (6)Figure 7.1 – Chipi-X Circuit Schematic (7)List of TablesTable 3.1 – Chipi-X Ordering Information (3)Table 4.1 – Chipi-X I/O Characteristics (4)Table 4.2 – Chipi-X ESD Tolerance (4)Table 5.1 – Chipi-X RS232 Signals (5)Table 5.2 – Chipi-X USB Lines (5)Table 8.1 – Default Internal MTP ROM Configuration (8)Chipi-X Cable DatasheetVersion 1.0Document Reference No.: FT_000634 Clearance No.: FTDI# 288 Appendix B – Revision HistoryDocument Title: DS_CHIPI-XDocument Reference No.: FT_000634Clearance No.: FTDI# 288Product Page: /FT-X.htmDocument Feedback: Send FeedbackVersion 1.0 Initial Datasheet Released 14/03/12Copyright © 2012 Future Technology Devices International Limited 11。
阿吉伯特 T-13 4 超级超明亮 LED 灯泡数据表说明书
DescriptionThese non-diffused lamps are designed to produce a bright light source and smooth radiationpattern. A slight tint is added to the lens for easy color identification.This lamp has been designed with aHLMP-C115, HLMP-C117, HLMP-C123, HLMP-C215, HLMP-C223,HLMP-C315, HLMP-C323, HLMP-C415, HLMP-C423, HLMP-C515,HLMP-C523, HLMP-C615, HLMP-C623Features•Very high intensity •Exceptional uniformity •Microtint lens for color identification•Consistent viewability All colors: AlGaAs RedHigh Efficiency Red Yellow Orange GreenEmerald Green •15° and 25° family•Tape and reel options available •Binned for color and intensity Applications•Ideal for backlighting front panels*•Used for lighting switches •Adapted for indoor and outdoor signsAgilentT-13/4 Super Ultra-Bright LED LampsData Sheet20mil lead frame, enhanced flange, and tight meniscus controls, making it compatible with radial lead automated insertion equipment.Selection GuidePart Number Luminous Intensity Iv (mcd) Color2θ1/2[1]Standoff Leads HLMP-Min.Max.DH AS AlGaAs15No C115290.0–C115-O00xx290.0–C115-OP0xx290.01000.0Yes C117-OP0xx290.01000.025No C12390.2–C123-L00xx90.2–Red15No C215138.0–C215-M00xx138.0–C215-MN0xx138.0400.025No C22390.2–C223-L00xx90.2–C223-MN0xx138.0400.0 Yellow15No C315147.0–C315-L00xx147.0–C315-LM0xx147.0424.025No C32396.2–C323-K00xx96.2–C323-KL0xx96.2294.0 Orange15No C415138.0–C415-M00xx138.0–C415-M0D0xx138.0–C415-MN0xx138.0400.025No C42390.2–C423-L00xx90.2–C423-LM0xx90.2276.0 Green15No C515170.0–C515-L00xx170.0C515-LM0xx170.0490.025No C52369.8–C523-J00xx69.8–C523-KL0xx111.7340.0 Emerald Green15No C61517.0–C615-G00xx17.0–25No C623 6.7–C623-E00xx 6.7–Part Numbering SystemHLMP - C x xx - x x x xxMechanical Options00: Bulk01: Tape & Reel, Crimped Leads02: Tape & Reel, Straight LeadsB2: Right Angle Housing, Even LeadsUQ: Ammo Pack, Horizontal LeadsColor Bin Options0: Full Color Bin DistributionD: Color Bins 4 & 5 onlyMaximum Iv Bin Options0: Open (No Maximum Limit)Others: Please refer to the Iv Bin TableMinimum Iv Bin OptionsPlease refer to the Iv Bin TableViewing Angle & Standoffs Options15: 15 Degree, without Standoffs17: 15 Degree, with Standoffs23: 25 Degree, without StandoffsColor Options1. AS AlGaAs Red2. High Efficiency Red3. Yellow4. Orange5. Green6. Emerald GreenPackage OptionsC: T-1 3/4 (5 mm)Absolute Maximum Ratings at T A = 25°CHighHighDH AS Efficiency Performance AlGaAs Red and Green and ParameterRed Orange Yellow Emerald Green Units DC Forward Current [1]30302030mA Transient Forward Current [2]500500500500mA (10 µsec Pulse)Reverse Voltage (Ir = 100 µA)5555V LED Junction Temperature 110110110110°C Operating Temperature Range –20 to +100–55 to +100–20 to +100°C Storage Temperature Range–55 to +100°CNotes:1. See Figure 5 for maximum current derating vs. ambient temperature.2. The transient current is the maximum nonrecurring peak current the device can withstand without damaging the LED die and wire bond.Package DimensionsHLMP-Cx15 and HLMP-Cx23HLMP-Cx17(0.039)NOTES:1. ALL DIMENSIONS ARE IN MILLIMETERS (INCHES).2. LEADS ARE MILD STEEL, SOLDER DIPPED.3. AN EPOXY MENISCUS MAY EXTEND ABOUT 0.5 mm (0.020 in.) DOWN THE LEADS.± 0.20± 0.008)Electrical Characteristics at T A = 25°CForward Reverse Capacitance Speed of ResponseVoltage Breakdown C (pF)Thermalτs (ns)Vf (Volts)Vr (Volts)Vf = 0Resistance Time Constant@ If = 20 mA@ Ir = 100 µA f = 1 MHz RθJ-PIN e-t/τsPart Number Typ.Max.Min.Typ.(°C/W)Typ.HLMP-C115 1.8 2.253021030HLMP-C117HLMP-C123HLMP-C215 1.9 2.651121090HLMP-C223HLMP-C315 2.1 2.651521090HLMP-C323HLMP-C415 1.9 2.654210280HLMP-C423HLMP-C515 2.2 3.0518210260HLMP-C523HLMP-C615 2.2 3.0518210260HLMP-C623Optical Characteristics at T A = 25°CLuminous Color,ViewingIntensity Peak Dominant Angle LuminousIv (mcd)Wavelength Wavelength2θ1/2Efficacy@ 20 mA[1]λpeak (nm)λd[2] (nm)(Degrees)[3]ηvPart Number Min.Typ.Typ.Typ.Typ.(lm/w) HLMP-C1152906006456371180HLMP-C117HLMP-C1239020026HLMP-C215138300635626171459017023HLMP-C315146300583585175009617025HLMP-C415138300600602173809017023HLMP-C515170300568570205956917028HLMP-C61517455585602065662728Notes:1. The luminous intensity, Iv, is measured at the mechanical axis of the lamp package. The actual peak of the spatial radiation pattern may not bealigned with this axis.2. The dominant wavelength, λd, is derived from the CIE Chromaticity Diagram and represents the color of the device.3. 2θ1/2 is the off-axis angle where the luminous intensity is 1/2 the on-axis intensity.Figure 1. Relative intensity vs. wavelength.Figure 2. Forward current vs. forward voltage (non-resistor lamp).Figure 3. Relative luminous intensity vs. forward current.WAVELENGTH – nmR E L A T I V E I N T E N S I T Y1.00.50I F – F O R W A R DC U R R E N T – m AV F – FORWARD VOLTAGE – VI F – F O R W A R D C U R R E N T – m AV F – FORWARD VOLTAGE – VHIGH EFFICIENCY RED, ORANGE,YELLOW, AND HIGH PERFORMANCEGREEN, EMERALD GREENR E L A T I V E L U M I N O U S I N TE N S I T Y (N O R M A L I Z E D A T 20 m A )I F – DC FORWARD CURRENT – mA R E L A T I V E L U M I N O U S I N T E N S I T Y (N O R M A L I Z E D A T 20 m A )0I DC – DC CURRENT PER LED – mA10201.60.80.4515301.2250.20.61.01.4HER, ORANGE, YELLOW, AND HIGH PERFORMANCE GREEN, EMERALD GREENFigure 5. Maximum forward dc current vs. ambient temperature. Derating based on T j MAX = 110°C.Figure 4. Relative efficiency (luminous intensity per unit current) vs. peak current.Figure 6. Relative luminous intensity vs. angular displacement. 15 degree family.R E L A T I V E E F F I C I E N C Y (N O R M A L I Z E D A T 20 m A )0I PEAK – PEAK FORWARD CURRENT – mA0.60.8300201001.21.00.20.45020010DH As AlGaAs REDηP E A K – R E L A T I V E E F F I C I E N C Y (N O R M A L I Z E D A T 20 m A )I PEAK – PEAK FORWARD CURRENT – mAHER, ORANGE, YELLOW, HIGHPERFORMANCE GREEN, EMERALD GREENI F – F O R W A R D C U R R E NT – m AT A – AMBIENT TEMPERATURE – °C DH As AlGaAs REDI F – F O R W A R D C U R R E N T – m AT A – AMBIENT TEMPERATURE – °CHER, ORANGE, YELLOW, AND HIGH PERFORMANCE GREEN, EMERALD GREEN N O R M A L I Z E D L U M I N O U S I N T E N S I T Y10ANGULAR DISPLACEMENT – DEGREES0.80.60.50.70.2450.10.30.4403530252010515-5-10-15-20-25-30-35-40-450.9Figure 7. Relative luminous intensity vs. angular displacement. 25 degree family.Intensity Bin Limits Intensity Range (mcd)ColorBin Min.Max.L 101.5162.4M 162.4234.6N 234.6340.0O 340.0540.0P 540.0850.0Q 850.01200.0R 1200.01700.0Red/OrangeS 1700.02400.0T 2400.03400.0U 3400.04900.0V 4900.07100.0W 7100.010200.0X 10200.014800.0Y 14800.021400.0Z 21400.030900.0L 173.2250.0M 250.0360.0N 360.0510.0O 510.0800.0P 800.01250.0YellowQ 1250.01800.0R 1800.02900.0S 2900.04700.0T 4700.07200.0U 7200.011700.0V 11700.018000.0W18000.027000.0N O R M A L I Z E D L U M I N O U S I N T E N S I T Y10ANGULAR DISPLACEMENT – DEGREES0.80.60.50.70.2450.10.30.4403530252010515-5-10-15-20-25-30-35-40-450.9Intensity Bin Limits, continuedIntensity Range (mcd) Color Bin Min.Max.E7.612.0F12.019.1G19.130.7H30.749.1I49.178.5J78.5125.7K125.7201.1L201.1289.0 Green/M289.0417.0 Emerald Green N417.0680.0O680.01100.0P1100.01800.0Q1800.02700.0R2700.04300.0S4300.06800.0T6800.010800.0U10800.016000.0V16000.025000.0W25000.040000.0 Maximum tolerance for each bin limit is ± 18%.Color CategoriesLambda (nm)Color Category #Min.Max.6561.5564.55564.5567.5 Green4567.5570.53570.5573.52573.5576.51582.0584.53584.5587.0 Yellow2587.0589.54589.5592.05592.0593.01597.0599.52599.5602.03602.0604.5 Orange4604.5607.55607.5610.56610.5613.57613.5616.58616.5619.5 Tolerance for each bin limit is ± 0.5 nm.Mechanical Option MatrixMechanical Option Code Definition00Bulk Packaging, minimum increment 500 pcs/bag01Tape & Reel, crimped leads, minimum increment 1300 pcs/bag02Tape & Reel, straight leads, minimum increment 1300 pcs/bagB2Right Angle Housing, even leads, minimum increment 500 pcs/bagUQ Ammo Pack, horizontal leads, in 1K minimum incrementNote:All categories are established for classification of products. Products may not be available in all categories. Please contact your local Agilent representative for further clarification/information.11Precautions Lead Forming•The leads of an LED lamp may be preformed or cut to length prior to insertion and soldering into PC board.•If lead forming is required before soldering, care must be taken to avoid any excessive mechanical stress induced to LED package. Otherwise, cut the leads of LED to length after soldering process at roomtemperature. The solder joint formed will absorb the mechanical stress of the lead cutting from traveling to the LED chip die attach and wirebond.•It is recommended that tooling made to preciselyform and cut the leads to length rather than rely upon hand operation.Soldering Conditions•Care must be taken during PCB assembly and soldering process to prevent damage to LED component.•The closest LED is allowed to solder on board is 1.59mm below the body (encapsulant epoxy) for those parts without standoff.•Recommended soldering conditions:•Wave soldering parameter must be set andmaintained according to recommended temperature and dwell time in the solder wave. Customer isadvised to periodically check on the soldering profile to ensure the soldering profile used is always conforming to recommended soldering condition.•If necessary, use fixture to hold the LED component in proper orientation with respect to the PCB during soldering process.•Proper handling is imperative to avoid excessive thermal stresses to LED components when heated.Therefore, the soldered PCB must be allowed to cool to room temperature, 25°C, before handling.•Special attention must be given to board fabrication,solder masking, surface plating and lead holes size and component orientation to assure solderability.•Recommended PC board plated through hole sizes for LED component leads:Manual Solder Wave Soldering Dipping Pre-heat Temperature 105 °C Max.–Pre-heat Time 30 sec Max.–Peak Temperature 250 °C Max.260 °C Max.Dwell Time3 sec Max.5 sec Max.LED Component Plated Through Lead SizeDiagonal Hole Diameter 0.457 x 0.457 mm 0.646 mm 0.976 to 1.078 mm (0.018 x 0.018 inch)(0.025 inch)(0.038 to 0.042 inch)0.508 x 0.508 mm 0.718 mm 1.049 to 1.150 mm (0.020 x 0.020 inch)(0.028 inch)(0.041 to 0.045 inch)Note: Refer to application note AN1027 for more information on soldering LED components.Figure 8. Recommended wave soldering profile.BOTTOM SIDE OF PC BOARD TIME – SECONDST E M P E R A T U R E – °CTOP SIDE OF PC BOARDCONVEYOR SPEED = 1.83 M/MIN (6 FT/MIN)PREHEAT SETTING = 150°C (100°C PCB)SOLDER WAVE TEMPERATURE = 245°C AIR KNIFE AIR TEMPERATURE = 390°C AIR KNIFE DISTANCE = 1.91 mm (0.25 IN.)AIR KNIFE ANGLE = 40°SOLDER: SN63; FLUX: RMANOTE: ALLOW FOR BOARDS TO BESUFFICIENTLY COOLED BEFORE EXERTING MECHANICAL FORCE./semiconductors For product information and a complete list of distributors, please go to our web site.For technical assistance call:Americas/Canada: +1 (800) 235-0312 or (916) 788-6763Europe: +49 (0) 6441 92460China: 10800 650 0017Hong Kong: (+65) 6756 2394India, Australia, New Zealand: (+65) 6755 1939 Japan: (+81 3) 3335-8152 (Domestic/Interna-tional), or 0120-61-1280 (Domestic Only) Korea: (+65) 6755 1989Singapore, Malaysia, Vietnam, Thailand, Philippines, Indonesia: (+65) 6755 2044 Taiwan: (+65) 6755 1843Data subject to change.Copyright © 2004-2005 Agilent Technologies, Inc. Obsoletes 5988-2149ENNovember 12, 20055989-4251EN。
PLM12K44 产品列表说明书
R622
x
Resistor 2R7 .33W 5% Surface Mounted 1206
R623
x
Resistor 10K .125W 1% Surface Mounted 0805
R500, R524, R526, R391,
x
R722, R330, R333, R533,
R570, R335, R429, R567,
PLM12K44
Part list
Ic Shunt Regulator TL431A SOT-23 Ic Voltage Regulator Lm317 Full Pack Ic Regulator Lm337 TO-220 Ic Comparator Lm339D Ic Digital Isolator SI8441-C
Transistor high-voltage NPN PMBTA42 SOT-23 Transistor high-voltage PNP PMBTA92 SOT-23 Transistor Bipolar Signal BC847B SOT-23 Transistor Signal MMBF4392 Transistor resistor-equipped NPN PDTC144ET SOT-23 Transistor Darlington BCV47 SOT-23 Ic Bus buffer/line driver 3 state 74AHC1G125 SOT353-1 Ic Photocoupler Tcet1102g
74AHC1G14
BAS21 1N4006 6V2.225W2%SOT23 BAV99B BAV70 FFPF60SA60DS 18V.225W2%SOT23 US1J
744710215;中文规格书,Datasheet资料
5.1 5.0 4.02012-06-272012-05-022009-06-30SStSStRStSStCZWürth Elektronik eiSos GmbH & Co. KGEMC & Inductive SolutionsMax-Eyth-Str. 174638 WaldenburgGermanyTel. +49 (0) 79 42 945 - 0A Dimensions: [mm]F Typical Impedance Characteristics:H4: Classification Wave Soldering Profile:H5: Classification Wave ProfileProfile FeaturePreheat- Temperature Min (T smin )- Temperature Typical (T stypical ) - Temperature Max (T smax ) - Time (t s ) from (T smin to T smax )Δ preheat to max Temperature Peak temperature (T p )Time of actual peak temperature (t p )Ramp-down rate - Min - Typical - MaxTime 25°C to 25°C Pb-Free Assembly 100°C 120°C 130°C 70 seconds 150°C max.250°C - 260°C max. 10 secondsmax. 5 second each wave ~ 2 K/s ~ 3.5 K/s ~ 5 K/s 4 minutesSn-Pb Assembly 100°C 120°C 130°C 70 seconds 150°C max.235°C - 260°C max. 10 secondsmax. 5 second each wave ~ 2 K/s ~ 3.5 K/s ~ 5 K/s 4 minutesrefer to EN 61760-1:2006H Soldering Specifications:I Cautions and Warnings:The following conditions apply to all goods within the product series of WE-SDof Würth Elektronik eiSos GmbH & Co. KG:General:All recommendations according to the general technical specifications of the data-sheet have to be complied with.The disposal and operation of the product within ambient conditions which probably alloy or harm the wire isolation has to be avoided.If the product is potted in customer applications, the potting material might shrink during and after hardening. Accordingly to this the product is exposed to the pressure of the potting material with the effect that the core, wire and termination is possibly damaged by this pressure and so the electrical as well as the mechanical characteristics are endanger to be affected. After the potting material is cured, the core, wire and termination of the product have to be checked if any reduced electrical or mechanical functions or destructions have occurred.The responsibility for the applicability of customer specific products and use in a particular customer design is always within the authority of the customer. All technical specifications for standard products do also apply for customer specific products.Washing varnish agent that is used during the production to clean the application might damage or change the characteristics of the wire in-sulation, the marking or the plating. The washing varnish agent could have a negative effect on the long turn function of the product.Direct mechanical impact to the product shall be prevented as the ferrite material of the core could flake or in the worst case it could break. Product specific:Follow all instructions mentioned in the datasheet, especially:•The solder profile has to be complied with according to the technical wave soldering specification, otherwise no warranty will be sustai-ned.•All products are supposed to be used before the end of the period of 12 months based on the product date-code, if not a 100% solderabi-lity can´t be warranted.•Violation of the technical product specifications such as exceeding the nominal rated current will result in the loss of warranty.1. General Customer ResponsibilitySome goods within the product range of Würth Elektronik eiSos GmbH & Co. KG contain statements regarding general suitability for certain application areas. These statements about suitability are based on our knowledge and experience of typical requirements concerning the are-as, serve as general guidance and cannot be estimated as binding statements about the suitability for a customer application. The responsibi-lity for the applicability and use in a particular customer design is always solely within the authority of the customer. Due to this fact it is up to the customer to evaluate, where appropriate to investigate and decide whether the device with the specific product characteristics described in the product specification is valid and suitable for the respective customer application or not.2. Customer Responsibility related to Specific, in particular Safety-Relevant ApplicationsIt has to be clearly pointed out that the possibility of a malfunction of electronic components or failure before the end of the usual lifetime can-not be completely eliminated in the current state of the art, even if the products are operated within the range of the specifications.In certain customer applications requiring a very high level of safety and especially in customer applications in which the malfunction or failure of an electronic component could endanger human life or health it must be ensured by most advanced technological aid of suitable design of the customer application that no injury or damage is caused to third parties in the event of malfunction or failure of an electronic component.3. Best Care and AttentionAny product-specific notes, warnings and cautions must be strictly observed.4. Customer Support for Product SpecificationsSome products within the product range may contain substances which are subject to restrictions in certain jurisdictions in order to serve spe-cific technical requirements. Necessary information is available on request. In this case the field sales engineer or the internal sales person in charge should be contacted who will be happy to support in this matter.5. Product R&DDue to constant product improvement product specifications may change from time to time. As a standard reporting procedure of the Product Change Notification (PCN) according to the JEDEC-Standard inform about minor and major changes. In case of further queries regarding the PCN, the field sales engineer or the internal sales person in charge should be contacted. The basic responsibility of the customer as per Secti-on 1 and 2 remains unaffected.6. Product Life CycleDue to technical progress and economical evaluation we also reserve the right to discontinue production and delivery of products. As a stan-dard reporting procedure of the Product Termination Notification (PTN) according to the JEDEC-Standard we will inform at an early stage about inevitable product discontinuance. According to this we cannot guarantee that all products within our product range will always be available. Therefore it needs to be verified with the field sales engineer or the internal sales person in charge about the current product availability ex-pectancy before or when the product for application design-in disposal is considered.The approach named above does not apply in the case of individual agreements deviating from the foregoing for customer-specific products.7. Property RightsAll the rights for contractual products produced by Würth Elektronik eiSos GmbH & Co. KG on the basis of ideas, development contracts as well as models or templates that are subject to copyright, patent or commercial protection supplied to the customer will remain with Würth Elektronik eiSos GmbH & Co. KG.8. General Terms and ConditionsUnless otherwise agreed in individual contracts, all orders are subject to the current version of the “General Terms and Conditions of Würth Elektronik eiSos Group”, last version available at .J Important Notes:The following conditions apply to all goods within the product range of Würth Elektronik eiSos GmbH & Co. KG:分销商库存信息: WURTH-ELECTRONICS 744710215。
EIZO FlexScan EV2430说明书
24.1" (61.1 cm) LCD MonitorTireless EyesTo prevent eye fatigue, a brightness sensor called Auto EcoViewdetects the changes in the ambient brightness that occur throughout the day and automatically adjusts the screen to the ideal brightness level. Auto EcoView cuts power by almost 40% compared tooperating the monitor at maximum brightness.The FlexScan EV2430 has 178°which makes it suitable for most business use.ensure you always get the right setting for any application. You can switch modes with just the touch of a button.Paper Mode Reduces Eye FatiguePaper Mode is a preset color mode that simulates the look of printed paper and helps prevent eyestrain when readingdocuments by reducing the amount of blue light emitted from theflicker unperceivable without anydrawbacks like compromising color stability.The Perfect Office All-RounderAuto EcoViewSescorSpecificationsAudio Speakers Input Terminals Output Terminals Sound Adjustment Power Power Requirements Power Consumption Power Save Mode Features & Preset Modes With current LCD technology, a panel may contain a limited number of missing or flickering pixels. If the monitor is left on continuously over a long period of time, dark smudges or burn-in may appear. To maximize the life of the monitor, we recommend the monitor be turned off periodically.Ergonomic StandAdjust the screen to your ideal viewing position with EIZO’s versatile stand.Getting ConnectedThree input terminals are included for connecting to PCs. Inaddition, a USB hub and headphone/ audio jacks are conveniently located on the side of the monitor.DisplayPort DVI-D D-SubLED Backlights – Less Power, Longer LifeCompared to conventional CCFL backlights, LED backlights last longer and consume less power. They are also mercury-free tohave minimal impact on the environment when they are eventually disposed of.Presence Sensor for Energy SavingsA presence sensor called EcoView Sense prompts the monitor to switch to power save mode when you are absent and then power on again when you return. It even works in a multi-monitor setup so all monitors remain on when you are at your desk.Compliance with International Labels5-Year WarrantyA manufacturer’s 5-year warranty covers all components including the LCD panel to ensure a long service life. This warranty is 2-years or 67% longer than the standard 3-year warrantyof most monitor brands for significantly lower running costs.Dimensions (Unit : mm)358552.5233233368～49956.95°35°344°90°Height Adjustment Tilt SwivelPortrait 131 mm。
AT24C_datasheet
Features•Low-voltage and Standard-voltage Operation–V CC=1.7V to5.5V•Internally Organized256x8(2K)•Two-wire Serial Interface•Schmitt Trigger,Filtered Inputs for Noise Suppression•Bidirectional Data Transfer Protocol•1MHz(5V),400kHz(1.7V,2.5V,2.7V)Compatibility•Write Protect Pin for Hardware Data Protection•8-byte Page(2K)Write Modes•Partial Page Writes Allowed•Self-timed Write Cycle(5ms max)•High-reliability–Endurance:1Million Write Cycles–Data Retention:100Years•Green(Pb/Halide-free/RoHS Compliant)Package Options•Die Sales:Wafer Form and Tape and ReelDescriptionThe Atmel®AT24C02C provides2048-bits of serial electrically erasable and program-mable read-only memory(EEPROM)organized as256-words of8-bits each.Thedevice is optimized for use in many industrial and commercial applications where low-power and low-voltage operation are essential.The AT24C02C is available in space-saving8-lead PDIP,8-lead TSSOP,8-lead JEDEC SOIC,8-lead UDFN,5-leadSOT23and8-ball VFBGA packages and is accessed via a two-wire serial interface.Table0-1.Pin ConfigurationNote:For use of5-leadSOT23,the softwareA2,A1,and A0bits inthe device addressword must be set tozero to properlycommunicate12348765A0A1A2GNDVCCWPSCLSDA8-lead SOIC12348765A0A1A2GNDVCCWPSCLSDA8-lead PDIP12354SCLGNDSDAWPVCC5-lead SOT2312348765VCCWPSCLSDAA0A1A2GND8-lead UDFNBottom ViewVCCWPSCLSDAA0A1A2GND123487658-ball VFBGABottom View12348765A0A1A2GNDVCCWPSCLSDA8-lead TSSOP捷多邦，您值得信赖的PCB打样专家！28700D–SEEPR–8/10Atmel AT24C02CFigure 0-1.Block Diagram*NOTICE:Stresses beyond those listed under “Abso-lute Maximum Ratings”may cause perma-nent damage to the device.This is a stress rating only and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of this specification is not implied.Exposure to absolute maximum rating condi-tions for extended periodsmay affect device reliability.VCC GND WP SCL SDAA 2A 1A 038700D–SEEPR–8/10AtmelAT24C02C1.Pin DescriptionSERIAL CLOCK (SCL):The SCL input is used to positive edge clock data into each EEPROM device and negative edge clock data out of each device.SERIAL DATA (SDA):The SDA pin is bidirectional for serial data transfer.This pin is open-drain driven and may be wire-ORed with any number of other open-drain or open-collector devices.DEVICE/PAGE ADDRESSES (A2,A1,A0):The A2,A1and A0pins are device address inputs that are hard wired for the Atmel ®AT24C02C.As many as eight 2K devices may be addressed on a single bus system (device addressing is discussed in detail under the Device Addressing section).WRITE PROTECT (WP):AT24C02C has a write protect pin that provides hardware data protection.The write protect pin allows normal read/write operations when connected to ground (GND).When the write protect pin is connected to V CC ,the write protection feature is enabled and operates as shown in Table 1-1.Table 1-1.Write Protect48700D–SEEPR–8/10Atmel AT24C02C2.Memory OrganizationAtmel AT24C02C,2K SERIAL EEPROM:Internally organized with 32pages of 8-bytes each,the 2K requires an 8-bit data word address for random word addressing.IL IH Table 2-1.Pin Capacitance (1)Applicable over recommended operating range from T A =25⋅C,f =1.0MHz,V CC =+1.7V to +5.5VTable 2-2.DC CharacteristicsApplicable over recommended operating range from:T AI =–40°C to +85°C,V CC =+1.7V to +5.5V (unless otherwise noted)58700D–SEEPR–8/10AtmelAT24C02CTable 2-3.AC CharacteristicsApplicable over recommended operating range from T AI =–40°C to +85°C,V CC =+1.7V to +5.5V,CL =1TTL Gate and 100pF (unless otherwise noted)68700D–SEEPR–8/10Atmel AT24C02C3.Device OperationCLOCK and DATA TRANSITIONS:The SDA pin is normally pulled high with an external device.Data on the SDA pin may change only during SCL low time periods (see Figure 5-2on page 8).Data changes during SCL high periods will indicate a start or stop condition as defined below.START CONDITION:A high-to-low transition of SDA with SCL high is a start condition which must precede any other command (see Figure 5-3on page 8).STOP CONDITION:A low-to-high transition of SDA with SCL high is a stop condition.After a read sequence,the stop command will place the EEPROM in a standby power mode (see Figure 5-3on page 8).ACKNOWLEDGE:All addresses and data words are serially transmitted to and from the EEPROM in 8-bit words.The EEPROM sends a zero to acknowledge that it has received each word.This happens during the ninth clock cycle.STANDBY MODE:The Atmel ®AT24C02C features a low-power standby mode which is enabled:(a)upon power-up and (b)after the receipt of the STOP bit and the completion of any internal operations.2-Wire Software Reset:After an interruption in protocol,power loss or system reset,any 2-wire part can be reset by following these steps:(a)Create a start bit condition,(b)clock 9cycles,(c)create another start bit followed by stop bit condition as shown below.The device is ready for next communication after above steps have been completed.Figure 3-1.SoftwareresetSCLSDA78700D–SEEPR–8/10AtmelAT24C02C4.Bus TimingFigure 4-1.SCL:Serial Clock,SDA:Serial Data I/O5.Write Cycle TimingFigure 5-1.SCL:Serial Clock,SDA:Serial Data I/ONotes:1.The write cycle time t WR is the time from a valid stop condition of a write sequence to the end of the internalclear/writecycleSCLSDA INSDA OUTSTOP CONDITIONST ART CONDITIONSCLSDA88700D–SEEPR–8/10Atmel AT24C02CFigure 5-2.Data ValidityFigure 5-3.Start and Stop DefinitionFigure 5-4.Output AcknowledgeSDASCLDAT A ST ABLEDATA STABLEDA TA CHANGESDASCLST ART STOPSCLDAT A INDAT A OUTST ART ACKNOWLEDGE98198700D–SEEPR–8/10AtmelAT24C02C6.Device AddressingThe 2K EEPROM device requires an 8-bit device address word following a start condition to enable the chip for a read or write operation (refer to Figure 8-1).The device address word consists of a mandatory one,zero sequence for the first four most significant bits as shown.This is common to all the EEPROM devices.The next three bits are the A2,A1and A0device address bits for the 2K EEPROM.These three bits must compare to their corresponding hard-wired input pins.The eighth bit of the device address is the read/write operation select bit.A read operation is initiated if this bit is high and a write operation is initiated if this bit is low.Upon a compare of the device address,the EEPROM will output a zero.If a compare is not made,the chip will return to a standby state.7.Write OperationsBYTE WRITE:A write operation requires an 8-bit data word address following the device address word and acknowledgment.Upon receipt of this address,the EEPROM will again respond with a zero and then clock in the first 8-bit data word.Following receipt of the 8-bit data word,the EEPROM will output a zero and the addressing device,such as a microcontroller,must terminate the write sequence with a stop condition.At this time the EEPROM enters an internally timed write cycle,t WR ,to the nonvolatile memory.All inputs are disabled during this write cycle and the EEPROM will not respond until the write is complete (see Figure 8-2on page 10).PAGE WRITE:The 2K EEPROM is capable of an 8-byte page write.A page write is initiated the same as a byte write,but the microcontroller does not send a stop condition after the first data word is clocked in.Instead,after the EEPROM acknowledges receipt of the first data word,the microcontroller can transmit up to seven data words.The EEPROM will respond with a zero after each data word received.The microcontroller must terminate the page write sequence with a stop condition (see Figure 8-3on page 10).The data word address lower three bits are internally incremented following the receipt of each data word.The higher data word address bits are not incremented,retaining the memory page row location.When the word address,internally generated,reaches the page boundary,the following byte is placed at the beginning of the same page.If more than eight data words are transmitted to the EEPROM,the data word address will “roll over”and previous data will be overwritten.ACKNOWLEDGE POLLING:Once the internally timed write cycle has started and the EEPROM inputs are disabled,acknowledge polling can be initiated.This involves sending a start condition followed by the device address word.The read/write bit is representative of the operation desired.Only if the internal write cycle has completed will the EEPROM respond with a zero allowing the read or write sequence to continue.8.Read OperationsRead operations are initiated the same way as write operations with the exception that the read/write select bit in the device address word is set to one.There are three read operations:current address read,random address read and sequential read.CURRENT ADDRESS READ:The internal data word address counter maintains the last address accessed during the last read or write operation,incremented by one.This address stays valid between operations as long as the chip power is maintained.The address “roll over”during read is from the last byte of the last memory page to the108700D–SEEPR–8/10Atmel AT24C02Cfirst byte of the first page.The address “roll over”during write is from the last byte of the current page to the first byte of the same page.Once the device address with the read/write select bit set to one is clocked in and acknowledged by the EEPROM,the current address data word is serially clocked out.The microcontroller does not respond with an input zero but does generate a following stop condition (see Figure 8-4on page 11).RANDOM READ:A random read requires a “dummy”byte write sequence to load in the data word address.Once the device address word and data word address are clocked in and acknowledged by the EEPROM,the microcontroller must generate another start condition.The microcontroller now initiates a current address read by sending a device address with the read/write select bit high.The EEPROM acknowledges the device address and serially clocks out the data word.The microcontroller does not respond with a zero but does generate a following stop condition (see Figure 8-5on page 11).SEQUENTIAL READ:Sequential reads are initiated by either a current address read or a random address read.After the microcontroller receives a data word,it responds with an acknowledge.As long as the EEPROM receives an acknowledge,it will continue to increment the data word address and serially clock out sequential data words.When the memory address limit is reached,the data word address will “roll over”and the sequential read will continue.The sequential read operation is terminated when the microcontroller does not respond with a zero but does generate a following stop condition (see Figure 8-6on page 11).Figure 8-1.Device AddressFigure 8-2.Byte WriteFigure 8-3.PageWrite118700D–SEEPR–8/10AtmelAT24C02CFigure 8-4.Current Address ReadFigure 8-5.Random ReadFigure 8-6.SequentialRead128700D–SEEPR–8/10Atmel AT24C02C9.Ordering Code DetailAtmel DesignatorProduct FamilyDevice DensityDevice RevisionShipping Carrier OptionOperating Voltage02 = 2k B or blank = Bulk (tubes)T = Tape and ReelM = 1.7V to 5.5VPackage Device Grade or Wafer/Die ThicknessH = Green, NiPdAu lead finish, Industrial Temperature Range (-40˚C to +85˚C)U = Green, matte Sn lead finish, Industrial Temperature range (-40˚C to +85˚C)11 =11mil wafer thicknessPackage OptionP = PDIP SS = JE DE C SOIC X = TSSOP MA = UDFN ST = SOT23C = VFBGAWWU = Wafer unsawnWDT = Die in Tape and ReelA T 24C 02C -S S H M-B138700D–SEEPR–8/10AtmelAT24C02C10.Part MarkingsAtmel AT24C02C-PUMAtmel AT24C02C-SSHMAtmel AT24C02C-XHM| Seal Week | | ||---|---|---|---|---|---|---|---| A T M L U Y W W |---|---|---|---|---|---|---|---| 0 2 C M @|---|---|---|---|---|---|---|---| * LOT NUMBER|---|---|---|---|---|---|---|---| |PIN 1 INDICATOR (DOT)Top Mark Seal YearU = Material Set Y = Seal Year WW = Seal Week 02C= Device@ = Country of Assembly M = Voltage Indicator*Lot Number to Use ALL Characters in MarkingBOTTOM MARKNo Bottom Mark| Seal Week | | ||---|---|---|---|---|---|---|---| A T M L H Y W W |---|---|---|---|---|---|---|---| 0 2 C M @|---|---|---|---|---|---|---|---| * LOT NUMBER|---|---|---|---|---|---|---|---| |PIN 1 INDICATOR (DOT)Top Mark Seal YearH = Material Set Y = Seal Year WW = Seal Week 02C= DeviceM = Voltage Indicator @ = Country of Assembly*Lot Number to Use ALL Characters in MarkingBOTTOM MARKNo Bottom MarkPIN 1 INDICATOR (DOT) ||---|---|---|---|---|---| * A T H Y W W |---|---|---|---|---|---| 0 2 C M @ |---|---|---|---|---|---|A TMEL LOT NUMBER |---|---|---|---|---|---|---|Top MarkH = Material Set Y = Seal Year WW = Seal Week 02C= DeviceM = Voltage Indicator @ = Country of AssemblyBOTTOM MARKNo Bottom Mark148700D–SEEPR–8/10Atmel AT24C02CAtmel AT24C02C-MAHMAtmel AT24C02C-STUMAtmel AT24C02C-CUM|---|---|---| 0 2 C |---|---|---| H M @ |---|---|---| Y T C |---|---|---| * | PIN 1 INDICATOR (DOT)Top Mark02C= DeviceH = Material SetM = Voltage Indicator @ = Country of Assembly Y = Year of Assembly TC = Trace CodeTop Mark|---|---|---|---|---|Line 1 --------> 2 C M B U |---|---|---|---|---| * | PIN 1 INDICATOR (DOT)Bottom Mark|---|---|---|---| Y M T C |---|---|---|---|2C = DeviceM = Voltage Indicator B = Write Protection U = Material SetY = One Digit Year Code M = Seal Month TC = Trace CodeTop MarkLine 1 -------> 02CU Line 2 -------> YMTC | <--PIN 1 THIS CORNER02C= DeviceU = Material SetY = One Digit Year Code M = Seal Month TC = Trace Code158700D–SEEPR–8/10AtmelAT24C02C11.Ordering CodesAtmel AT24C02C Ordering InformationNotes:1.“-B”denotes bulk2.“-T”denotes tape and reel.SOIC =4K per reel.TSSOP,UDFN,SOT23,and VFBGA =5K per reel3.For Wafer sales,please contact Atmel Sales168700D–SEEPR–8/10Atmel AT24C02C12.Packaging Information8P3–PDIP178700D–SEEPR–8/10AtmelAT24C02C8S1–JEDEC SOIC188700D–SEEPR–8/10Atmel AT24C02C8A2–TSSOP198700D–SEEPR–8/10AtmelAT24C02C208700D–SEEPR–8/10Atmel AT24C02C5TS1–SOT23AtmelAT24C02C8U3-1–VFBGA2122Atmel AT24C02C13.Revision HistoryHeadquarters InternationalAtmel Corporation 2325Orchard Parkway San Jose,CA95131 USATel:(+1)(408)441-0311 Fax:(+1)(408)487-2600 Atmel Asia LimitedUnit01-5&16,19FBEA Tower,Millennium City5418Kwun Tong RoadKwun Tong,KowloonHONG KONGTel:(+852)2245-6100Fax:(+852)2722-1369Atmel Munich GmbHBusiness CampusParkring4D-85748Garching b.MunichGERMANYTel:(+49)89-31970-0Fax:(+49)89-3194621Atmel Japan9F,Tonetsu Shinkawa Bldg.1-24-8ShinkawaChuo-ku,Tokyo104-0033JAPANTel:(+81)(3)3523-3551Fax:(+81)(3)3523-7581Product ContactTechnical Supports_eeprom@Sales Contact/contactsLiterature Requests/literatureDisclaimer:The information in this document is provided in connection with Atmel products.No license,express or implied,by estoppel or otherwise,to any intellectual property right is granted by this document or in connection with the sale of Atmel products.EXCEPT AS SET FORTH IN ATMEL’S TERMS AND CONDI-TIONS OF SALE LOCATED ON ATMEL’S WEB SITE,ATMEL ASSUMES NO LIABILITY WHATSOEVER AND DISCLAIMS ANY EXPRESS,IMPLIED OR STATUTORY WARRANTY RELATING TO ITS PRODUCTS INCLUDING,BUT NOT LIMITED TO,THE IMPLIED WARRANTY OF MERCHANTABILITY,FITNESS FOR A PARTICULAR PURPOSE,OR NON-INFRINGEMENT.IN NO EVENT SHALL ATMEL BE LIABLE FOR ANY DIRECT,INDIRECT,CONSEQUENTIAL,PUNITIVE,SPECIAL OR INCIDEN-TAL DAMAGES(INCLUDING,WITHOUT LIMITATION,DAMAGES FOR LOSS OF PROFITS,BUSINESS INTERRUPTION,OR LOSS OF INFORMATION)ARISING OUT OF THE USE OR INABILITY TO USE THIS DOCUMENT,EVEN IF ATMEL HAS BEEN ADVISED OF THE POSSIBILITY OF SUCH DAMAGES.Atmel makes no representations or warranties with respect to the accuracy or completeness of the contents of this document and reserves the right to make changes to specifications and product descriptions at any time without notice.Atmel does not make any commitment to update the information contained herein.Unless specifically provided otherwise,Atmel products are not suitable for,and shall not be used in,automotive applications.Atmel’s products are not intended,authorized,or warranted for use as components in applications intended to support or sustain life.©2010Atmel Corporation.All rights reserved.Atmel®,logo and combinations thereof,and others,are registered trademarks or trademarks of Atmel Corporation or its subsidiaries.Other terms and product names may be trademarks of others.。
和谐XPS安全自动化产品数据表说明书
Product data sheetSpecificationsEstop or guard ,Harmony XPS,connected to supply terminals 24 V AC/DC , no inputs, screwXPSBAC14APMainRange of ProductHarmony Safety Automation Product or Component Type Safety module Safety module name XPSBACSafety module application For emergency stop and protective guard applications Function of module Emergency stop button with 2 NC contacts Guard monitoring with 1 or 2 limit switchesSafety levelCan reach PL e/category 4 for normally open relay contact ISO 13849-1Can reach SILCL 3 for normally open relay contact IEC 62061Can reach SIL 3 for normally open relay contact IEC 61508Can reach PL c/category 1 for normally closed relay contact ISO 13849-1Can reach SILCL 1 for normally closed relay contact IEC 62061Can reach SIL 1 for normally closed relay contact IEC 61508Safety reliability dataMTTFd > 30 years for normally open relay contact ISO 13849-1Dcavg >= 99 % for normally open relay contact ISO 13849-1PFHd = 0.95E-09 for normally open relay contact ISO 13849-1HFT = 1 for normally open relay contact IEC 62061PFHd = 0.95E-09 for normally open relay contact IEC 62061SFF > 99% for normally open relay contact IEC 62061HFT = 1 for normally open relay contact IEC 61508-1PFHd = 0.95E-09 for normally open relay contact IEC 61508-1SFF > 99% for normally open relay contact IEC 61508-1Type = B for normally open relay contact IEC 61508-1MTTFd > 30 years for normally closed relay contact ISO 13849-1DC > 60 % for normally closed relay contact ISO 13849-1PFHd = 0.95E-09 for normally closed relay contact ISO 13849-1HFT=0 for normally closed relay contact IEC 62061PFHd = 0.95E-09 for normally closed relay contact IEC 62061SFF > 60% for normally closed relay contact IEC 62061HFT=0 for normally closed relay contact IEC 61508-1PFHd = 0.95E-09 for normally closed relay contact IEC 61508-1SFF > 60% for normally closed relay contact IEC 61508-1Type = B for normally closed relay contact IEC 61508-1Electrical circuit type NC pairConnections - terminalsRemovable screw terminal block, 0.2...2.5 mm² solid or flexibleRemovable screw terminal block, 0.25...2.5 mm² flexible with ferrule single conductor Removable screw terminal block, 0.2...1.5 mm² solid or flexible twin conductorRemovable screw terminal block, 2 x 0.25...1 mm² flexible with ferrule without cable end, with bezel Removable screw terminal block, 2 x 0.5...1.5 mm² flexible with ferrule with cable end, with bezel [Us] Rated Supply Voltage24 V AC - 15...10 %24 V DC - 20...20 %ComplementarySynchronisation time between inputs UnlimitedType of startAutomatic/manual/monitoredD i s c l a i m e r : T h i s d o c u m e n t a t i o n i s n o t i n t e n d e d a s a s u b s t i t u t e f o r a n d i s n o t t o b e u s e d f o r d e t e r m i n i n g s u i t a b i l i t y o r r e l i a b i l i t y o f t h e s e p r o d u c t s f o r s p e c i f i c u s e r a p p l i c a t i o n sPower consumption in W 1.5 W 24 V DCPower consumption in VA 3.5 VA 24 V AC 50/60 HzInput protection type Internal, electronicSafety outputs 4 NO + 1 NCSafety inputs0Input compatibility Normally closed circuit ISO 14119XC limit switch ISO 14119Mechanical contact ISO 14119Normally closed circuit ISO 13850Input terminal Power supply[Ie] rated operational current5 A AC-13 A AC-155 A DC-13 A DC-133 A AC-11 A AC-153 A DC-11 A DC-13Control outputs0[Ith] conventional free air6 Athermal currentAssociated fuse rating10 A gG NO relay output circuit IEC 60947-1 Minimum output current10 mA relay outputMinimum output voltage5 V relay outputResponse time150 ms at 24 V AC80 ms at 24 V DC[Ui] rated insulation voltage300 V 2)EN/IEC 60947-1[Uimp] rated impulse withstand4 kV II EN/IEC 60947-1voltageLocal signalling LED green power power ONLED red error errorLED yellow state statusLED yellow start1 start inputLED yellow start2 start inputMounting Support35 mm symmetrical DIN railDepth 4.72 in (120 mm)Height 3.94 in (100 mm)Width0.89 in (22.5 mm)Net Weight0.44 lb(US) (0.200 kg) EnvironmentAmbient Air Temperature for-13…131 °F (-25…55 °C)OperationStandards IEC 60947-5-1IEC 61508-1 functional safety standardIEC 61508-2 functional safety standardIEC 61508-3 functional safety standardIEC 61508-4 functional safety standardIEC 61508-5 functional safety standardIEC 61508-6 functional safety standardIEC 61508-7 functional safety standardISO 13849-1 functional safety standardIEC 62061 functional safety standardProduct certifications TÜVcULusIP degree of protection IP20 terminals)EN/IEC 60529IP40 housing)EN/IEC 60529IP54 mounting area)EN/IEC 60529 Relative Humidity5…95 % non-condensingOrdering and shipping detailsCategory22477-SAFETY MODULES (PREVENTA)Discount Schedule SAF2GTIN3606482034013Nbr. of units in pkg.1Package weight(Lbs)10.76 oz (305 g)Returnability YesPacking UnitsUnit Type of Package 1PCEPackage 1 Height 2.52 in (6.4 cm)Package 1 width 5.24 in (13.3 cm)Package 1 Length 6.02 in (15.3 cm)Unit Type of Package 2S03Number of Units in Package 216Package 2 Weight12.01 lb(US) (5.448 kg)Package 2 Height11.81 in (30 cm)Package 2 width11.81 in (30 cm)Package 2 Length15.75 in (40 cm)Package 3 Height11.81 in (30 cm)Offer SustainabilitySustainable offer status Green Premium productCalifornia proposition 65WARNING: This product can expose you to chemicals including: Lead and lead compounds, which isknown to the State of California to cause cancer and birth defects or other reproductive harm. For moreinformation go to REACh Regulation REACh DeclarationEU RoHS Directive Pro-active compliance (Product out of EU RoHS legal scope)EU RoHS DeclarationMercury free YesRoHS exemption information YesChina RoHS Regulation China RoHS declarationEnvironmental Disclosure Product Environmental ProfileCircularity Profile End of Life InformationWEEE The product must be disposed on European Union markets following specific waste collection andnever end up in rubbish bins.Dimensions Drawings DimensionsFront and Side Views(A) : Product drawing(B) : Screw clamp terminal(C) : Side view(1) : Removable terminal blocks, top(2) : Removable terminal blocks, bottom(3) : LED indicators(4) : Sealable transparent coverMounting to DIN railScrew-mountingConnections and SchemaWiring Diagram(1) : A1-A2 (Power supply)(2) : Y1 (Control output of Start/Restart input), Y2 (Input channel for automatic/manual start/restart), Y3 (Input channel for monitored start/restart with falling edge)13-14-23-24-33-34-43-44-51/61-52-62 : Terminals of the safety-related outputs。
PT-2430PC电子标签打印机用户指南说明书
When using Windows Vista When connecting the device for the fiStarting P-touch Editor 5.0Click Open folder to view fi les .Exit P-touch Editor Lite by clicking on the at the top To disconnect the labeler, click the icon in the computer’s task bar (, , or ).P-touch Editor Lite by double-clicking Do not turn off the power or remove the labeler while using P-touch Editor Lite.Move the mode selector switch on the back of the P-touch labeler to the “E” position before connecting the USB cable.Double-click PTLITE10.Click P-touch Editor Lite.When margins are set to Large, (default setting) labels print with approx. 1" margins on each side of the printed text. Reduce this margin by changing the setting to Small.Select Margins from the menu displayedwhen you right click the mouse. Changethe setting to Small.Enter the desired text and click the Print button.If Auto Cut is set to ON (default setting) in thePrint Options, the tape will advance and cutyour label to accommodate the small margins.Select the tape size and enter the de-sired text.Insert a few spaces, then click the button.Enter the desired text and press theENTER key. Enter the desired text onthe second row.Click Symbol under . Select thesymbol that you want to enter from thedisplayed dialog box.Click the Print button.Select the number or letter within your text and clickter on each label. Click to the right of theand enter the number of labels being printing in theClick to change the font.Click to specify the font size.You can adjust the font size up or down one level by clicking or .Speci es the font style:Bold Italic UnderlineSpeci es the alignment of text in a text box.Sets the width of the tape. Click to automatically detect the width of theSets the length of the label. Click to automatically adjust the length of thelabel to accommodate the entered text.Click to set the zoom factor for the Label View.You can also change the zoom factor by clicking or .Click to print normally or to print with options.Auto Cut: Each label is automatically cut after printing.Chain Printing: Uses the least amount of tape when printing more than one label con-。