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UHF常用芯片汇总

UHF常用芯片汇总

UHF常用芯片汇总以下是一些常用的UHF(Ultra High Frequency)芯片的汇总,这些芯片主要用于无线通信和RFID(Radio Frequency Identification)应用。

1. Impinj Monza系列Impinj Monza系列芯片是全球最著名的UHF RFID芯片之一、这个系列提供了高性能、高度集成、低功耗的解决方案。

Monza系列的芯片通常用于物联网、零售、物流和库存管理等领域。

2.NXPUCODE系列NXPUCODE系列芯片是业界最常见的UHFRFID芯片之一、这个系列的芯片具有卓越的性能和可靠性,支持多协议,能够满足不同应用的需求。

UCODE芯片广泛应用于零售、物流、运输和电子票务等领域。

3. Alien Higgs系列Alien Higgs系列芯片是另一个广受欢迎的UHF RFID芯片。

这个系列的芯片采用先进的射频和数字电路技术,具有高度集成、低功耗和高性能的特点。

Higgs芯片常用于零售、制造业、医疗和物流等领域。

4. STMicroelectronics ST25系列ST25系列芯片由STMicroelectronics推出,是一款多功能的UHF RFID芯片。

该系列的芯片具有高度集成、低功耗和优秀性能等特点。

ST25系列芯片广泛应用于物联网、安全识别、物流和库存管理等领域。

5. TI Tag-it系列TI Tag-it系列芯片是德州仪器(Texas Instruments)推出的UHF RFID芯片。

这个系列的芯片具有高度集成、低功耗和高性能的特点,能够满足不同应用领域的需求。

Tag-it芯片常用于物流、库存管理和电子车牌等领域。

6. Smartrac Frog系列7. SensThys SensArray系列SensThys SensArray系列芯片是一种集成射频前端和数字电路的UHF RFID芯片。

这个系列的芯片具有高度灵活性和可扩展性,适用于不同射频环境下的部署和应用。

十六款发烧电解电容试听心得

十六款发烧电解电容试听心得

据说今年是北半球有气象记录以来最热的一年。

高温如此,忙碌如此,发烧亦如此。

这两天有了点小空,翻出手上的发烧电解电容,开始做个小测试。

试验设备是仿的RA1耳放,JRC4556AD运放。

用hifidiy坛子的mini usb dac 配套电源直流+-10..7V供电,更换不同的电解电容,直接跨接在+-供电端测试滤波(退偶)时的声音表现。

以试听顺序排列,先挨个谈谈听感。

1、BC 021 40V 1000uf凝聚细腻的声音,比较有形体感。

人声醇厚,中高频略有雾气。

高频延展比较好,细致顺滑略明亮,声场宽松,定位不错,层次感还可以。

解析比较高。

2、RIFA PEG124 100V 100uf细腻醇厚,高频柔和细致,声场广阔而正确。

听交响非常有厅堂感,弧形的座次感最为清晰,声音富有包围感。

但解析其实只算比较高,中高频略有朦胧感,比BC 021 KO 40V 1000uf还略朦胧点,低频下潜和力度也较之略差。

3、BC 119 40V 220uf近似021 KO 40V 1000uf的声音,但没有那么细致凝聚,声场略小,宽松感差了一筹,耐听度下降,声音有点浮躁。

声音没有那么醇厚,但是高频比较华丽4、UCC(原思碧)678D 40V 160uf这个是美国化工的次顶级红头电容,看上去保持了思碧原有的工艺,价格昂贵,仅次于EPCOS SIKOREL125系列电容。

美国化工(或者包括以前的思碧)电容都是个性浓烈的电容,我个人喜欢他的风格,但是焊机也比较难以驾驭。

此电容质感非常强烈,声音热烈明朗浓郁饱满,下潜、力度很好,气势仅次于EPCOS SIKOREL125。

定位比较好,层次感强,声场宽大,但是由于结象丰满,声像分离度不够高,过于浓烈的表现掩盖了良好的解析和透明度,也因此有一点点冲。

5、nichicon KZ 50V 100uf这个电容为了追求极致,买的是经过测定的日本原厂电容。

价格更UCC 678D相当。

此次试听当中,HIFI性第二强的电容,定位良好,有力度,但声音总是少了感染力,过于平淡,声音也略冲,高频不够细致,不够顺滑。

常用开关电源芯片大全

常用开关电源芯片大全

常用开关电源芯片大全第1章DC-DC电源转换器/基准电压源DC-DC电源转换器1.低噪声电荷泵DC-DC电源转换器AAT3113/AAT31142.低功耗开关型DC-DC电源转换器ADP30003.高效3A开关稳压器AP15014.高效率无电感DC-DC电源转换器FAN56605.小功率极性反转电源转换器ICL76606.高效率DC-DC电源转换控制器IRU30377.高性能降压式DC-DC电源转换器ISL64208.单片降压式开关稳压器L49609.大功率开关稳压器L4970A高效率单片开关稳压器L4978高效率升压/降压式DC-DC电源转换器L597014.高效率1A降压单片开关稳压器LM1575/LM2575/LM2575HV降压单片开关稳压器LM2576/LM2576HV16.可调升压开关稳压器LM2577降压开关稳压器LM259618.高效率5A开关稳压器LM267819.升压式DC-DC电源转换器LM2703/LM270420.电流模式升压式电源转换器LM273321.低噪声升压式电源转换器LM275022.小型75V降压式稳压器LM500723.低功耗升/降压式DC-DC电源转换器LT107324.升压式DC-DC电源转换器LT161525.隔离式开关稳压器LT172526.低功耗升压电荷泵LT175127.大电流高频降压式DC-DC电源转换器LT176528.大电流升压转换器LT193529.高效升压式电荷泵LT193730.高压输入降压式电源转换器LT195632.高压升/降压式电源转换器LT343333.单片3A升压式DC-DC电源转换器LT343634.通用升压式DC-DC电源转换器LT346035.高效率低功耗升压式电源转换器LT346437.大电流高效率升压式DC-DC电源转换器LT378238.微型低功耗电源转换器LTC175440.低噪声高效率降压式电荷泵LTC191141.低噪声电荷泵LTC3200/LTC3200-542.无电感的降压式DC-DC电源转换器LTC325143.双输出/低噪声/降压式电荷泵LTC325244.同步整流/升压式DC-DC电源转换器LTC340145.低功耗同步整流升压式DC-DC电源转换器LTC340246.同步整流降压式DC-DC电源转换器LTC340547.双路同步降压式DC-DC电源转换器LTC340748.高效率同步降压式DC-DC电源转换器LTC341649.微型2A升压式DC-DC电源转换器LTC3426两相电流升压式DC-DC电源转换器LTC342851.单电感升/降压式DC-DC电源转换器LTC344052.大电流升/降压式DC-DC电源转换器LTC344254.直流同步降压式DC-DC电源转换器LTC370355.双输出降压式同步DC-DC电源转换控制器LTC373656.降压式同步DC-DC电源转换控制器LTC377057.双2相DC-DC电源同步控制器LTC380258.高性能升压式DC-DC电源转换器MAX1513/MAX151459.精简型升压式DC-DC电源转换器MAX1522/MAX1523/MAX152460.高效率40V升压式DC-DC电源转换器MAX1553/MAX155461.高效率升压式LED电压调节器MAX1561/MAX159962.高效率5路输出DC-DC电源转换器MAX156563.双输出升压式DC-DC电源转换器MAX1582/MAX1582Y64.驱动白光LED的升压式DC-DC电源转换器MAX158365.高效率升压式DC-DC电源转换器MAX1642/MAX1643降压式开关稳压器MAX164467.高效率升压式DC-DC电源转换器MAX1674/MAX1675/MAX167668.高效率双输出DC-DC电源转换器MAX167769.低噪声1A降压式DC-DC电源转换器MAX1684/MAX168570.高效率升压式DC-DC电源转换器MAX169871.高效率双输出降压式DC-DC电源转换器MAX171572.小体积升压式DC-DC电源转换器MAX1722/MAX1723/MAX172473.输出电流为50mA的降压式电荷泵MAX173074.升/降压式电荷泵MAX175975.高效率多路输出DC-DC电源转换器MAX1800同步整流降压式稳压型MAX1830/MAX183177.双输出开关式LCD电源控制器MAX187878.电流模式升压式DC-DC电源转换器MAX189679.具有复位功能的升压式DC-DC电源转换器MAX194780.高效率PWM降压式稳压器MAX1992/MAX199381.大电流输出升压式DC-DC电源转换器MAX61882.低功耗升压或降压式DC-DC电源转换器MAX629升压式DC-DC电源转换器MAX668/MAX66984.大电流PWM降压式开关稳压器MAX724/MAX72685.高效率升压式DC-DC电源转换器MAX756/MAX75786.高效率大电流DC-DC电源转换器MAX761/MAX76287.隔离式DC-DC电源转换器MAX8515/MAX8515A88.高性能24V升压式DC-DC电源转换器MAX872789.升/降压式DC-DC电源转换器MC33063A/MC34063A升压/降压/反向DC-DC电源转换器MC33167/MC3416791.低噪声无电感电荷泵MCP1252/MCP125392.高频脉宽调制降压稳压器MIC220393.大功率DC-DC升压电源转换器MIC229594.单片微型高压开关稳压器NCP1030/NCP103195.低功耗升压式DC-DC电源转换器NCP1400A96.高压DC-DC电源转换器NCP140397.单片微功率高频升压式DC-DC电源转换器NCP141098.同步整流PFM步进式DC-DC电源转换器NCP142199.高效率大电流开关电压调整器NCP1442/NCP1443/NCP1444/NCP1445 100.新型双模式开关稳压器NCP1501101.高效率大电流输出DC-DC电源转换器NCP1550102.同步降压式DC-DC电源转换器NCP1570103.高效率升压式DC-DC电源转换器NCP5008/NCP5009104.大电流高速稳压器RT9173/RT9173A105.高效率升压式DC-DC电源转换器RT9262/RT9262A106.升压式DC-DC电源转换器SP6644/SP6645107.低功耗升压式DC-DC电源转换器SP6691108.新型高效率DC-DC电源转换器TPS54350109.无电感降压式电荷泵TPS6050x110.高效率升压式电源转换器TPS6101x恒流白色LED驱动器TPS61042112.具有LDO输出的升压式DC-DC电源转换器TPS6112x113.低噪声同步降压式DC-DC电源转换器TPS6200x114.三路高效率大功率DC-DC电源转换器TPS75003115.高效率DC-DC电源转换器UCC39421/UCC39422控制升压式DC-DC电源转换器XC6371117.白光LED驱动专用DC-DC电源转换器XC9116同步整流降压式DC-DC电源转换器XC9215/XC9216/XC9217119.稳压输出电荷泵XC9801/XC9802120.高效率升压式电源转换器ZXLB1600线性/低压差稳压器121.具有可关断功能的多端稳压器BAXXX122.高压线性稳压器HIP5600123.多路输出稳压器KA7630/KA7631124.三端低压差稳压器LM2937125.可调输出低压差稳压器LM2991126.三端可调稳压器LM117/LM317127.低压降CMOS500mA线性稳压器LP38691/LP38693128.输入电压从12V到450V的可调线性稳压器LR8 非常低压降稳压器(VLDO)LTC3025130.大电流低压差线性稳压器LX8610负输出低压差线性稳压器MAX1735低压差线性稳压器MAX8875133.带开关控制的低压差稳压器MC33375134.带有线性调节器的稳压器MC33998136.低静态电流低压差稳压器NCP562/NCP563137.具有使能控制功能的多端稳压器PQxx138.五端可调稳压器SI-3025B/SI-3157B低压差线性稳压器SPX2975140.五端线性稳压器STR20xx141.五端线性稳压器STR90xx142.具有复位信号输出的双路输出稳压器TDA8133143.具有复位信号输出的双路输出稳压器TDA8138/TDA8138A 144.带线性稳压器的升压式电源转换器TPS6110x145.低功耗50mA低压降线性稳压器TPS760xx146.高输入电压低压差线性稳压器XC6202147.高速低压差线性稳压器XC6204148.高速低压差线性稳压器XC6209F149.双路高速低压差线性稳压器XC6401基准电压源150.新型XFET基准电压源ADR290/ADR291/ADR292/ADR293 151.低功耗低压差大输出电流基准电压源MAX610x152.低功耗基准电压源MAX6120155.低功耗精密低压降基准电压源REF30xx/REF31xx156.精密基准电压源TL431/KA431/TLV431A第2章AC-DC转换器及控制器1.厚膜开关电源控制器DP104C2.厚膜开关电源控制器DP308P系列高电压功率转换控制器DPA423/DPA424/DPA425/DPA4264.电流型开关电源控制器FA13842/FA13843/FA13844/FA138455.开关电源控制器FA5310/FA5311开关电源控制器FAN75567.绿色环保的PWM开关电源控制器FAN7601型开关电源控制器FS6M07652R9.开关电源功率转换器FS6Sxx10.降压型单片AC-DC转换器HV-2405E11.新型反激准谐振变换控制器ICE1QS01电源功率转换器KA1M088013.开关电源功率转换器KA2S0680/KA2S088014.电流型开关电源控制器KA38xx型开关电源功率转换器KA5H0165R型开关电源功率转换器KA5Qxx型开关电源功率转换器KA5Sxx18.电流型高速PWM控制器L499019.具有待机功能的PWM初级控制器L599120.低功耗离线式开关电源控制器L6590SWITCH TN系列电源功率转换器LNK304/LNK305/LNK306SWITCH系列电源功率转换器LNK500/LNK501/LNK52023.离线式开关电源控制器M51995A电源控制器M62281P/M62281FP25.高频率电流模式PWM控制器MAX5021/MAX502226.新型PWM开关电源控制器MC4460427.电流模式开关电源控制器MC4460528.低功耗开关电源控制器MC4460829.具有PFC功能的PWM电源控制器ML482430.液晶显示器背光灯电源控制器ML487631.离线式电流模式控制器NCP120032.电流模式脉宽调制控制器NCP120533.准谐振式PWM控制器NCP120734.低成本离线式开关电源控制电路NCP121535.低待机能耗开关电源PWM控制器NCP1230系列自动电压切换控制开关STR8xxxx37.大功率厚膜开关电源功率转换器STR-F665438.大功率厚膜开关电源功率转换器STR-G865639.开关电源功率转换器STR-M6511/STR-M652940.离线式开关电源功率转换器STR-S5703/STR-S5707/STR-S570841.离线式开关电源功率转换器STR-S6401/STR-S6401F/STR-S6411/STR-S6411F 442.开关电源功率转换器STR-S651343.离线式开关电源功率转换器TC33369~TC3337444.高性能PFC与PWM组合控制集成电路TDA16846/TDA1684745.新型开关电源控制器TDA1685046.“绿色”电源控制器TEA150447.第二代“绿色”电源控制器TEA150748.新型低功耗“绿色”电源控制器TEA153349.开关电源控制器TL494/KA7500/MB3759SwitchⅠ系列功率转换器TNY253、TNY254、TNY255SwitchⅡ系列功率转换器TNY264P~TNY268GSwitch(Ⅱ)系列离线式功率转换器TOP209~TOP227Switch-FX系列功率转换器TOP232/TOP233/TOP234Switch-GX系列功率转换器TOP242~TOP25055.开关电源控制器UCX84X56.离线式开关电源功率转换器VIPer12AS/VIPer12ADIP57.新一代高度集成离线式开关电源功率转换器VIPer53第3章功率因数校正控制/节能灯电源控制器1.电子镇流器专用驱动电路BL83012.零电压开关功率因数控制器FAN48223.功率因数校正控制器FAN75274.高电压型EL背光驱动器HV826场致发光背光驱动器IMP525/IMP5606.高电压型EL背光驱动器/反相器IMP8037.电子镇流器自振荡半桥驱动器IR21568.单片荧光灯镇流器IR21579.调光电子镇流器自振荡半桥驱动器IR215910.卤素灯电子变压器智能控制电路IR216111.具有功率因数校正电路的镇流器电路IR216612.单片荧光灯镇流器IR216713.自适应电子镇流器控制器IR252014.电子镇流器专用控制器KA754115.功率因数校正控制器L656116.过渡模式功率因数校正控制器L656217.集成背景光控制器MAX8709/MAX8709A18.功率因数校正控制器MC33262/MC3426219.固定频率电流模式功率因数校正控制器NCP1653场致发光灯高压驱动器SP440321.功率因数校正控制器TDA4862/TDA486322.有源功率因数校正控制器UC385423.高频自振荡节能灯驱动器电路VK05CFL24.大功率高频自振荡节能灯驱动器电路VK06TL第4章充电控制器1.多功能锂电池线性充电控制器AAT36802.可编程快速电池充电控制器BQ20003.可进行充电速率补偿的锂电池充电管理器BQ20574.锂电池充电管理电路BQ2400x5.单片锂电池线性充电控制器BQ2401x接口单节锂电池充电控制器BQ2402x同步开关模式锂电池充电控制器BQ241008.集成PWM开关控制器的快速充电管理器BQ29549.具有电池电量计量功能的充电控制器DS277010.锂电池充电控制器FAN7563/FAN7564线性锂/锂聚合物电池充电控制器ISL629212.锂电池充电控制器LA5621M/LA5621V恒流/恒压电池充电控制器LT176915.线性锂电池充电控制器LTC173216.带热调节功能的1A线性锂电池充电控制器LTC173317.线性锂电池充电控制器LTC173418.新型开关电源充电控制器LTC198019.开关模式锂电池充电控制器LTC4002锂电池充电器LTC400621.多用途恒压/恒流充电控制器LTC400823.可由USB端口供电的锂电池充电控制器LTC405324.小型150mA锂电池充电控制器LTC405425.线性锂电池充电控制器LTC405826.单节锂电池线性充电控制器LTC405927.独立线性锂电池充电控制器LTC406128.镍镉/镍氢电池充电控制器M62256FP29.大电流锂/镍镉/镍氢电池充电控制器MAX150130.锂电池线性充电控制器MAX150731.双输入单节锂电池充电控制器MAX1551/MAX155532.单节锂电池充电控制器MAX167933.小体积锂电池充电控制器MAX1736接口单节锂电池充电控制器MAX181135.多节锂电池充电控制器MAX187336.双路输入锂电池充电控制器MAX187437.单节锂电池线性充电控制器MAX189838.低成本/多种电池充电控制器MAX190839.开关模式单节锂电池充电控制器MAX1925/MAX192640.快速镍镉/镍氢充电控制器MAX2003A/MAX200341.可编程快速充电控制器MAX712/MAX71342.开关式锂电池充电控制器MAX74543.多功能低成本充电控制器MAX846A44.具有温度调节功能的单节锂电池充电控制器MAX8600/MAX860145.锂电池充电控制器MCP73826/MCP73827/MCP7382846.高精度恒压/恒流充电器控制器MCP73841/MCP73842/MCP73843/MCP73844 647.锂电池充电控制器MCP73861/MCP7386248.单节锂电池充电控制器MIC7905049.单节锂电池充电控制器NCP180050.高精度线性锂电池充电控制器VM7205。

NuMicro N9H30系列开发板用户手册说明书

NuMicro N9H30系列开发板用户手册说明书

NuMicro®FamilyArm® ARM926EJ-S BasedNuMaker-HMI-N9H30User ManualEvaluation Board for NuMicro® N9H30 SeriesNUMAKER-HMI-N9H30 USER MANUALThe information described in this document is the exclusive intellectual property ofNuvoton Technology Corporation and shall not be reproduced without permission from Nuvoton.Nuvoton is providing this document only for reference purposes of NuMicro microcontroller andmicroprocessor based system design. Nuvoton assumes no responsibility for errors or omissions.All data and specifications are subject to change without notice.For additional information or questions, please contact: Nuvoton Technology Corporation.Table of Contents1OVERVIEW (5)1.1Features (7)1.1.1NuMaker-N9H30 Main Board Features (7)1.1.2NuDesign-TFT-LCD7 Extension Board Features (7)1.2Supporting Resources (8)2NUMAKER-HMI-N9H30 HARDWARE CONFIGURATION (9)2.1NuMaker-N9H30 Board - Front View (9)2.2NuMaker-N9H30 Board - Rear View (14)2.3NuDesign-TFT-LCD7 - Front View (20)2.4NuDesign-TFT-LCD7 - Rear View (21)2.5NuMaker-N9H30 and NuDesign-TFT-LCD7 PCB Placement (22)3NUMAKER-N9H30 AND NUDESIGN-TFT-LCD7 SCHEMATICS (24)3.1NuMaker-N9H30 - GPIO List Circuit (24)3.2NuMaker-N9H30 - System Block Circuit (25)3.3NuMaker-N9H30 - Power Circuit (26)3.4NuMaker-N9H30 - N9H30F61IEC Circuit (27)3.5NuMaker-N9H30 - Setting, ICE, RS-232_0, Key Circuit (28)NUMAKER-HMI-N9H30 USER MANUAL3.6NuMaker-N9H30 - Memory Circuit (29)3.7NuMaker-N9H30 - I2S, I2C_0, RS-485_6 Circuit (30)3.8NuMaker-N9H30 - RS-232_2 Circuit (31)3.9NuMaker-N9H30 - LCD Circuit (32)3.10NuMaker-N9H30 - CMOS Sensor, I2C_1, CAN_0 Circuit (33)3.11NuMaker-N9H30 - RMII_0_PF Circuit (34)3.12NuMaker-N9H30 - RMII_1_PE Circuit (35)3.13NuMaker-N9H30 - USB Circuit (36)3.14NuDesign-TFT-LCD7 - TFT-LCD7 Circuit (37)4REVISION HISTORY (38)List of FiguresFigure 1-1 Front View of NuMaker-HMI-N9H30 Evaluation Board (5)Figure 1-2 Rear View of NuMaker-HMI-N9H30 Evaluation Board (6)Figure 2-1 Front View of NuMaker-N9H30 Board (9)Figure 2-2 Rear View of NuMaker-N9H30 Board (14)Figure 2-3 Front View of NuDesign-TFT-LCD7 Board (20)Figure 2-4 Rear View of NuDesign-TFT-LCD7 Board (21)Figure 2-5 Front View of NuMaker-N9H30 PCB Placement (22)Figure 2-6 Rear View of NuMaker-N9H30 PCB Placement (22)Figure 2-7 Front View of NuDesign-TFT-LCD7 PCB Placement (23)Figure 2-8 Rear View of NuDesign-TFT-LCD7 PCB Placement (23)Figure 3-1 GPIO List Circuit (24)Figure 3-2 System Block Circuit (25)Figure 3-3 Power Circuit (26)Figure 3-4 N9H30F61IEC Circuit (27)Figure 3-5 Setting, ICE, RS-232_0, Key Circuit (28)Figure 3-6 Memory Circuit (29)Figure 3-7 I2S, I2C_0, RS-486_6 Circuit (30)Figure 3-8 RS-232_2 Circuit (31)Figure 3-9 LCD Circuit (32)NUMAKER-HMI-N9H30 USER MANUAL Figure 3-10 CMOS Sensor, I2C_1, CAN_0 Circuit (33)Figure 3-11 RMII_0_PF Circuit (34)Figure 3-12 RMII_1_PE Circuit (35)Figure 3-13 USB Circuit (36)Figure 3-14 TFT-LCD7 Circuit (37)List of TablesTable 2-1 LCD Panel Combination Connector (CON8) Pin Function (11)Table 2-2 Three Sets of Indication LED Functions (12)Table 2-3 Six Sets of User SW, Key Matrix Functions (12)Table 2-4 CMOS Sensor Connector (CON10) Function (13)Table 2-5 JTAG ICE Interface (J2) Function (14)Table 2-6 Expand Port (CON7) Function (16)Table 2-7 UART0 (J3) Function (16)Table 2-8 UART2 (J6) Function (16)Table 2-9 RS-485_6 (SW6~8) Function (17)Table 2-10 Power on Setting (SW4) Function (17)Table 2-11 Power on Setting (S2) Function (17)Table 2-12 Power on Setting (S3) Function (17)Table 2-13 Power on Setting (S4) Function (17)Table 2-14 Power on Setting (S5) Function (17)Table 2-15 Power on Setting (S7/S6) Function (18)Table 2-16 Power on Setting (S9/S8) Function (18)Table 2-17 CMOS Sensor Connector (CON9) Function (19)Table 2-18 CAN_0 (SW9~10) Function (19)NUMAKER-HMI-N9H30 USER MANUAL1 OVERVIEWThe NuMaker-HMI-N9H30 is an evaluation board for GUI application development. The NuMaker-HMI-N9H30 consists of two parts: a NuMaker-N9H30 main board and a NuDesign-TFT-LCD7 extensionboard. The NuMaker-HMI-N9H30 is designed for project evaluation, prototype development andvalidation with HMI (Human Machine Interface) function.The NuMaker-HMI-N9H30 integrates touchscreen display, voice input/output, rich serial port serviceand I/O interface, providing multiple external storage methods.The NuDesign-TFT-LCD7 can be plugged into the main board via the DIN_32x2 extension connector.The NuDesign-TFT-LCD7 includes one 7” LCD which the resolution is 800x480 with RGB-24bits andembedded the 4-wires resistive type touch panel.Figure 1-1 Front View of NuMaker-HMI-N9H30 Evaluation BoardNUMAKER-HMI-N9H30 USER MANUAL Figure 1-2 Rear View of NuMaker-HMI-N9H30 Evaluation Board1.1 Features1.1.1 NuMaker-N9H30 Main Board Features●N9H30F61IEC chip: LQFP216 pin MCP package with DDR (64 MB)●SPI Flash using W25Q256JVEQ (32 MB) booting with quad mode or storage memory●NAND Flash using W29N01HVSINA (128 MB) booting or storage memory●One Micro-SD/TF card slot served either as a SD memory card for data storage or SDIO(Wi-Fi) device●Two sets of COM ports:–One DB9 RS-232 port with UART_0 used 75C3232E transceiver chip can be servedfor function debug and system development.–One DB9 RS-232 port with UART_2 used 75C3232E transceiver chip for userapplication●22 GPIO expansion ports, including seven sets of UART functions●JTAG interface provided for software development●Microphone input and Earphone/Speaker output with 24-bit stereo audio codec(NAU88C22) for I2S interfaces●Six sets of user-configurable push button keys●Three sets of LEDs for status indication●Provides SN65HVD230 transceiver chip for CAN bus communication●Provides MAX3485 transceiver chip for RS-485 device connection●One buzzer device for program applicationNUMAKER-HMI-N9H30 USER MANUAL●Two sets of RJ45 ports with Ethernet 10/100 Mbps MAC used IP101GR PHY chip●USB_0 that can be used as Device/HOST and USB_1 that can be used as HOSTsupports pen drives, keyboards, mouse and printers●Provides over-voltage and over current protection used APL3211A chip●Retain RTC battery socket for CR2032 type and ADC0 detect battery voltage●System power could be supplied by DC-5V adaptor or USB VBUS1.1.2 NuDesign-TFT-LCD7 Extension Board Features●7” resolution 800x480 4-wire resistive touch panel for 24-bits RGB888 interface●DIN_32x2 extension connector1.2 Supporting ResourcesFor sample codes and introduction about NuMaker-N9H30, please refer to N9H30 BSP:https:///products/gui-solution/gui-platform/numaker-hmi-n9h30/?group=Software&tab=2Visit NuForum for further discussion about the NuMaker-HMI-N9H30:/viewforum.php?f=31 NUMAKER-HMI-N9H30 USER MANUALNUMAKER-HMI-N9H30 USER MANUAL2 NUMAKER-HMI-N9H30 HARDWARE CONFIGURATION2.1 NuMaker-N9H30 Board - Front View Combination Connector (CON8)6 set User SWs (K1~6)3set Indication LEDs (LED1~3)Power Supply Switch (SW_POWER1)Audio Codec(U10)Microphone(M1)NAND Flash(U9)RS-232 Transceiver(U6, U12)RS-485 Transceiver(U11)CAN Transceiver (U13)Figure 2-1 Front View of NuMaker-N9H30 BoardFigure 2-1 shows the main components and connectors from the front side of NuMaker-N9H30 board. The following lists components and connectors from the front view:NuMaker-N9H30 board and NuDesign-TFT-LCD7 board combination connector (CON8). This panel connector supports 4-/5-wire resistive touch or capacitance touch panel for 24-bits RGB888 interface.Connector GPIO pin of N9H30 FunctionCON8.1 - Power 3.3VCON8.2 - Power 3.3VCON8.3 GPD7 LCD_CSCON8.4 GPH3 LCD_BLENCON8.5 GPG9 LCD_DENCON8.7 GPG7 LCD_HSYNCCON8.8 GPG6 LCD_CLKCON8.9 GPD15 LCD_D23(R7)CON8.10 GPD14 LCD_D22(R6)CON8.11 GPD13 LCD_D21(R5)CON8.12 GPD12 LCD_D20(R4)CON8.13 GPD11 LCD_D19(R3)CON8.14 GPD10 LCD_D18(R2)CON8.15 GPD9 LCD_D17(R1)CON8.16 GPD8 LCD_D16(R0)CON8.17 GPA15 LCD_D15(G7)CON8.18 GPA14 LCD_D14(G6)CON8.19 GPA13 LCD_D13(G5)CON8.20 GPA12 LCD_D12(G4)CON8.21 GPA11 LCD_D11(G3)CON8.22 GPA10 LCD_D10(G2)CON8.23 GPA9 LCD_D9(G1) NUMAKER-HMI-N9H30 USER MANUALCON8.24 GPA8 LCD_D8(G0)CON8.25 GPA7 LCD_D7(B7)CON8.26 GPA6 LCD_D6(B6)CON8.27 GPA5 LCD_D5(B5)CON8.28 GPA4 LCD_D4(B4)CON8.29 GPA3 LCD_D3(B3)CON8.30 GPA2 LCD_D2(B2)CON8.31 GPA1 LCD_D1(B1)CON8.32 GPA0 LCD_D0(B0)CON8.33 - -CON8.34 - -CON8.35 - -CON8.36 - -CON8.37 GPB2 LCD_PWMCON8.39 - VSSCON8.40 - VSSCON8.41 ADC7 XPCON8.42 ADC3 VsenCON8.43 ADC6 XMCON8.44 ADC4 YMCON8.45 - -CON8.46 ADC5 YPCON8.47 - VSSCON8.48 - VSSCON8.49 GPG0 I2C0_CCON8.50 GPG1 I2C0_DCON8.51 GPG5 TOUCH_INTCON8.52 - -CON8.53 - -CON8.54 - -CON8.55 - -NUMAKER-HMI-N9H30 USER MANUAL CON8.56 - -CON8.57 - -CON8.58 - -CON8.59 - VSSCON8.60 - VSSCON8.61 - -CON8.62 - -CON8.63 - Power 5VCON8.64 - Power 5VTable 2-1 LCD Panel Combination Connector (CON8) Pin Function●Power supply switch (SW_POWER1): System will be powered on if the SW_POWER1button is pressed●Three sets of indication LEDs:LED Color DescriptionsLED1 Red The system power will beterminated and LED1 lightingwhen the input voltage exceeds5.7V or the current exceeds 2A.LED2 Green Power normal state.LED3 Green Controlled by GPH2 pin Table 2-2 Three Sets of Indication LED Functions●Six sets of user SW, Key Matrix for user definitionKey GPIO pin of N9H30 FunctionK1 GPF10 Row0 GPB4 Col0K2 GPF10 Row0 GPB5 Col1K3 GPE15 Row1 GPB4 Col0K4 GPE15 Row1 GPB5 Col1K5 GPE14 Row2 GPB4 Col0K6GPE14 Row2GPB5 Col1 Table 2-3 Six Sets of User SW, Key Matrix Functions●NAND Flash (128 MB) with Winbond W29N01HVS1NA (U9)●Microphone (M1): Through Nuvoton NAU88C22 chip sound input●Audio CODEC chip (U10): Nuvoton NAU88C22 chip connected to N9H30 using I2Sinterface–SW6/SW7/SW8: 1-2 short for RS-485_6 function and connected to 2P terminal (CON5and J5)–SW6/SW7/SW8: 2-3 short for I2S function and connected to NAU88C22 (U10).●CMOS Sensor connector (CON10, SW9~10)–SW9~10: 1-2 short for CAN_0 function and connected to 2P terminal (CON11)–SW9~10: 2-3 short for CMOS sensor function and connected to CMOS sensorconnector (CON10)Connector GPIO pin of N9H30 FunctionCON10.1 - VSSCON10.2 - VSSNUMAKER-HMI-N9H30 USER MANUALCON10.3 - Power 3.3VCON10.4 - Power 3.3VCON10.5 - -CON10.6 - -CON10.7 GPI4 S_PCLKCON10.8 GPI3 S_CLKCON10.9 GPI8 S_D0CON10.10 GPI9 S_D1CON10.11 GPI10 S_D2CON10.12 GPI11 S_D3CON10.13 GPI12 S_D4CON10.14 GPI13 S_D5CON10.15 GPI14 S_D6CON10.16 GPI15 S_D7CON10.17 GPI6 S_VSYNCCON10.18 GPI5 S_HSYNCCON10.19 GPI0 S_PWDNNUMAKER-HMI-N9H30 USER MANUAL CON10.20 GPI7 S_nRSTCON10.21 GPG2 I2C1_CCON10.22 GPG3 I2C1_DCON10.23 - VSSCON10.24 - VSSTable 2-4 CMOS Sensor Connector (CON10) FunctionNUMAKER-HMI-N9H30 USER MANUAL2.2NuMaker-N9H30 Board - Rear View5V In (CON1)RS-232 DB9 (CON2,CON6)Expand Port (CON7)Speaker Output (J4)Earphone Output (CON4)Buzzer (BZ1)System ResetSW (SW5)SPI Flash (U7,U8)JTAG ICE (J2)Power ProtectionIC (U1)N9H30F61IEC (U5)Micro SD Slot (CON3)RJ45 (CON12, CON13)USB1 HOST (CON15)USB0 Device/Host (CON14)CAN_0 Terminal (CON11)CMOS Sensor Connector (CON9)Power On Setting(SW4, S2~S9)RS-485_6 Terminal (CON5)RTC Battery(BT1)RMII PHY (U14,U16)Figure 2-2 Rear View of NuMaker-N9H30 BoardFigure 2-2 shows the main components and connectors from the rear side of NuMaker-N9H30 board. The following lists components and connectors from the rear view:● +5V In (CON1): Power adaptor 5V input ●JTAG ICE interface (J2) ConnectorGPIO pin of N9H30Function J2.1 - Power 3.3V J2.2 GPJ4 nTRST J2.3 GPJ2 TDI J2.4 GPJ1 TMS J2.5 GPJ0 TCK J2.6 - VSS J2.7 GPJ3 TD0 J2.8-RESETTable 2-5 JTAG ICE Interface (J2) Function●SPI Flash (32 MB) with Winbond W25Q256JVEQ (U7); only one (U7 or U8) SPI Flashcan be used●System Reset (SW5): System will be reset if the SW5 button is pressed●Buzzer (BZ1): Control by GPB3 pin of N9H30●Speaker output (J4): Through the NAU88C22 chip sound output●Earphone output (CON4): Through the NAU88C22 chip sound output●Expand port for user use (CON7):Connector GPIO pin of N9H30 FunctionCON7.1 - Power 3.3VCON7.2 - Power 3.3VCON7.3 GPE12 UART3_TXDCON7.4 GPH4 UART1_TXDCON7.5 GPE13 UART3_RXDCON7.6 GPH5 UART1_RXDCON7.7 GPB0 UART5_TXDCON7.8 GPH6 UART1_RTSCON7.9 GPB1 UART5_RXDCON7.10 GPH7 UART1_CTSCON7.11 GPI1 UART7_TXDNUMAKER-HMI-N9H30 USER MANUAL CON7.12 GPH8 UART4_TXDCON7.13 GPI2 UART7_RXDCON7.14 GPH9 UART4_RXDCON7.15 - -CON7.16 GPH10 UART4_RTSCON7.17 - -CON7.18 GPH11 UART4_CTSCON7.19 - VSSCON7.20 - VSSCON7.21 GPB12 UART10_TXDCON7.22 GPH12 UART8_TXDCON7.23 GPB13 UART10_RXDCON7.24 GPH13 UART8_RXDCON7.25 GPB14 UART10_RTSCON7.26 GPH14 UART8_RTSCON7.27 GPB15 UART10_CTSCON7.28 GPH15 UART8_CTSCON7.29 - Power 5VCON7.30 - Power 5VTable 2-6 Expand Port (CON7) Function●UART0 selection (CON2, J3):–RS-232_0 function and connected to DB9 female (CON2) for debug message output.–GPE0/GPE1 connected to 2P terminal (J3).Connector GPIO pin of N9H30 Function J3.1 GPE1 UART0_RXDJ3.2 GPE0 UART0_TXDTable 2-7 UART0 (J3) Function●UART2 selection (CON6, J6):–RS-232_2 function and connected to DB9 female (CON6) for debug message output –GPF11~14 connected to 4P terminal (J6)Connector GPIO pin of N9H30 Function J6.1 GPF11 UART2_TXDJ6.2 GPF12 UART2_RXDJ6.3 GPF13 UART2_RTSJ6.4 GPF14 UART2_CTSTable 2-8 UART2 (J6) Function●RS-485_6 selection (CON5, J5, SW6~8):–SW6~8: 1-2 short for RS-485_6 function and connected to 2P terminal (CON5 and J5) –SW6~8: 2-3 short for I2S function and connected to NAU88C22 (U10)Connector GPIO pin of N9H30 FunctionSW6:1-2 shortGPG11 RS-485_6_DISW6:2-3 short I2S_DOSW7:1-2 shortGPG12 RS-485_6_ROSW7:2-3 short I2S_DISW8:1-2 shortGPG13 RS-485_6_ENBSW8:2-3 short I2S_BCLKNUMAKER-HMI-N9H30 USER MANUALTable 2-9 RS-485_6 (SW6~8) FunctionPower on setting (SW4, S2~9).SW State FunctionSW4.2/SW4.1 ON/ON Boot from USB SW4.2/SW4.1 ON/OFF Boot from eMMC SW4.2/SW4.1 OFF/ON Boot from NAND Flash SW4.2/SW4.1 OFF/OFF Boot from SPI Flash Table 2-10 Power on Setting (SW4) FunctionSW State FunctionS2 Short System clock from 12MHzcrystalS2 Open System clock from UPLL output Table 2-11 Power on Setting (S2) FunctionSW State FunctionS3 Short Watchdog Timer OFFS3 Open Watchdog Timer ON Table 2-12 Power on Setting (S3) FunctionSW State FunctionS4 Short GPJ[4:0] used as GPIO pinS4Open GPJ[4:0] used as JTAG ICEinterfaceTable 2-13 Power on Setting (S4) FunctionSW State FunctionS5 Short UART0 debug message ONS5 Open UART0 debug message OFFTable 2-14 Power on Setting (S5) FunctionSW State FunctionS7/S6 Short/Short NAND Flash page size 2KBS7/S6 Short/Open NAND Flash page size 4KBS7/S6 Open/Short NAND Flash page size 8KBNUMAKER-HMI-N9H30 USER MANUALS7/S6 Open/Open IgnoreTable 2-15 Power on Setting (S7/S6) FunctionSW State FunctionS9/S8 Short/Short NAND Flash ECC type BCH T12S9/S8 Short/Open NAND Flash ECC type BCH T15S9/S8 Open/Short NAND Flash ECC type BCH T24S9/S8 Open/Open IgnoreTable 2-16 Power on Setting (S9/S8) FunctionCMOS Sensor connector (CON9, SW9~10)–SW9~10: 1-2 short for CAN_0 function and connected to 2P terminal (CON11).–SW9~10: 2-3 short for CMOS sensor function and connected to CMOS sensorconnector (CON9).Connector GPIO pin of N9H30 FunctionCON9.1 - VSSCON9.2 - VSSCON9.3 - Power 3.3VCON9.4 - Power 3.3V NUMAKER-HMI-N9H30 USER MANUALCON9.5 - -CON9.6 - -CON9.7 GPI4 S_PCLKCON9.8 GPI3 S_CLKCON9.9 GPI8 S_D0CON9.10 GPI9 S_D1CON9.11 GPI10 S_D2CON9.12 GPI11 S_D3CON9.13 GPI12 S_D4CON9.14 GPI13 S_D5CON9.15 GPI14 S_D6CON9.16 GPI15 S_D7CON9.17 GPI6 S_VSYNCCON9.18 GPI5 S_HSYNCCON9.19 GPI0 S_PWDNCON9.20 GPI7 S_nRSTCON9.21 GPG2 I2C1_CCON9.22 GPG3 I2C1_DCON9.23 - VSSCON9.24 - VSSTable 2-17 CMOS Sensor Connector (CON9) Function●CAN_0 Selection (CON11, SW9~10):–SW9~10: 1-2 short for CAN_0 function and connected to 2P terminal (CON11) –SW9~10: 2-3 short for CMOS sensor function and connected to CMOS sensor connector (CON9, CON10)SW GPIO pin of N9H30 FunctionSW9:1-2 shortGPI3 CAN_0_RXDSW9:2-3 short S_CLKSW10:1-2 shortGPI4 CAN_0_TXDSW10:2-3 short S_PCLKTable 2-18 CAN_0 (SW9~10) Function●USB0 Device/HOST Micro-AB connector (CON14), where CON14 pin4 ID=1 is Device,ID=0 is HOST●USB1 for USB HOST with Type-A connector (CON15)●RJ45_0 connector with LED indicator (CON12), RMII PHY with IP101GR (U14)●RJ45_1 connector with LED indicator (CON13), RMII PHY with IP101GR (U16)●Micro-SD/TF card slot (CON3)●SOC CPU: Nuvoton N9H30F61IEC (U5)●Battery power for RTC 3.3V powered (BT1, J1), can detect voltage by ADC0●RTC power has 3 sources:–Share with 3.3V I/O power–Battery socket for CR2032 (BT1)–External connector (J1)●Board version 2.1NUMAKER-HMI-N9H30 USER MANUAL2.3 NuDesign-TFT-LCD7 -Front ViewFigure 2-3 Front View of NuDesign-TFT-LCD7 BoardFigure 2-3 shows the main components and connectors from the Front side of NuDesign-TFT-LCD7board.7” resolution 800x480 4-W resistive touch panel for 24-bits RGB888 interface2.4 NuDesign-TFT-LCD7 -Rear ViewFigure 2-4 Rear View of NuDesign-TFT-LCD7 BoardFigure 2-4 shows the main components and connectors from the rear side of NuDesign-TFT-LCD7board.NuMaker-N9H30 and NuDesign-TFT-LCD7 combination connector (CON1).NUMAKER-HMI-N9H30 USER MANUAL 2.5 NuMaker-N9H30 and NuDesign-TFT-LCD7 PCB PlacementFigure 2-5 Front View of NuMaker-N9H30 PCB PlacementFigure 2-6 Rear View of NuMaker-N9H30 PCB PlacementNUMAKER-HMI-N9H30 USER MANUALFigure 2-7 Front View of NuDesign-TFT-LCD7 PCB PlacementFigure 2-8 Rear View of NuDesign-TFT-LCD7 PCB Placement3 NUMAKER-N9H30 AND NUDESIGN-TFT-LCD7 SCHEMATICS3.1 NuMaker-N9H30 - GPIO List CircuitFigure 3-1 shows the N9H30F61IEC GPIO list circuit.Figure 3-1 GPIO List Circuit NUMAKER-HMI-N9H30 USER MANUAL3.2 NuMaker-N9H30 - System Block CircuitFigure 3-2 shows the System Block Circuit.NUMAKER-HMI-N9H30 USER MANUALFigure 3-2 System Block Circuit3.3 NuMaker-N9H30 - Power CircuitFigure 3-3 shows the Power Circuit.NUMAKER-HMI-N9H30 USER MANUALFigure 3-3 Power Circuit3.4 NuMaker-N9H30 - N9H30F61IEC CircuitFigure 3-4 shows the N9H30F61IEC Circuit.Figure 3-4 N9H30F61IEC CircuitNUMAKER-HMI-N9H30 USER MANUAL3.5 NuMaker-N9H30 - Setting, ICE, RS-232_0, Key CircuitFigure 3-5 shows the Setting, ICE, RS-232_0, Key Circuit.NUMAKER-HMI-N9H30 USER MANUALFigure 3-5 Setting, ICE, RS-232_0, Key Circuit3.6 NuMaker-N9H30 - Memory CircuitFigure 3-6 shows the Memory Circuit.NUMAKER-HMI-N9H30 USER MANUALFigure 3-6 Memory Circuit3.7 NuMaker-N9H30 - I2S, I2C_0, RS-485_6 CircuitFigure 3-7 shows the I2S, I2C_0, RS-486_6 Circuit.NUMAKER-HMI-N9H30 USER MANUALFigure 3-7 I2S, I2C_0, RS-486_6 Circuit3.8 NuMaker-N9H30 - RS-232_2 CircuitFigure 3-8 shows the RS-232_2 Circuit.NUMAKER-HMI-N9H30 USER MANUALFigure 3-8 RS-232_2 Circuit3.9 NuMaker-N9H30 - LCD CircuitFigure 3-9 shows the LCD Circuit.NUMAKER-HMI-N9H30 USER MANUALFigure 3-9 LCD Circuit3.10 NuMaker-N9H30 - CMOS Sensor, I2C_1, CAN_0 CircuitFigure 3-10 shows the CMOS Sensor,I2C_1, CAN_0 Circuit.NUMAKER-HMI-N9H30 USER MANUALFigure 3-10 CMOS Sensor, I2C_1, CAN_0 Circuit3.11 NuMaker-N9H30 - RMII_0_PF CircuitFigure 3-11 shows the RMII_0_RF Circuit.NUMAKER-HMI-N9H30 USER MANUALFigure 3-11 RMII_0_PF Circuit3.12 NuMaker-N9H30 - RMII_1_PE CircuitFigure 3-12 shows the RMII_1_PE Circuit.NUMAKER-HMI-N9H30 USER MANUALFigure 3-12 RMII_1_PE Circuit3.13 NuMaker-N9H30 - USB CircuitFigure 3-13 shows the USB Circuit.NUMAKER-HMI-N9H30 USER MANUALFigure 3-13 USB Circuit3.14 NuDesign-TFT-LCD7 - TFT-LCD7 CircuitFigure 3-14 shows the TFT-LCD7 Circuit.Figure 3-14 TFT-LCD7 CircuitNUMAKER-HMI-N9H30 USER MANUAL4 REVISION HISTORYDate Revision Description2022.03.24 1.00 Initial version NUMAKER-HMI-N9H30 USER MANUALNUMAKER-HMI-N9H30 USER MANUALImportant NoticeNuvoton Products are neither intended nor warranted for usage in systems or equipment, anymalfunction or failure of which may cause loss of human life, bodily injury or severe propertydamage. Such applications are deemed, “Insecure Usage”.Insecure usage includes, but is not limited to: equipment for surgical implementation, atomicenergy control instruments, airplane or spaceship instruments, the control or operation ofdynamic, brake or safety systems designed for vehicular use, traffic signal instruments, all typesof safety devices, and other applications intended to support or sustain life.All Insecure Usage shall be made at customer’s risk, and in the event that third parties lay claimsto Nuvoton as a result of customer’s Insecure Usage, custome r shall indemnify the damagesand liabilities thus incurred by Nuvoton.。

超米特电子有限公司产品说明书

超米特电子有限公司产品说明书

1US Headquarters TEL +(1) 781-935-4850FAX +(1) 781-933-4318 • Europe TEL +(44) 1628 404000FAX +(44) 1628 404090Asia Pacific TEL +(852) 2 428 8008FAX +(852) 2 423 8253South America TEL +(55) 11 3917 1099FAX +(55) 11 3917 0817Superior elongation and tensilestrength help to prevent tearing in use due to mishandling. Typical properties for CHO-SEAL 1310 and 1273 materi-al are shown on pages 33 and 32respectively.High Shielding PerformanceCHO-SEAL 1310 material provides more than 80 dB of shielding effectiv-ness from 100 MHz to 10 GHz, while CHO-SEAL 1273 material provides more than 100 dB.Low Volume ResistivityBoth materials have exceptionally low volume resistivity, which makes them well suited for grounding appli-cations in which a flexible electrical contact is needed.Low Compression GasketSpacer gaskets are typicallydesigned to function under low deflec-tion forces. Chomerics uses design tools such as Finite Element Analysis (FEA) to accurately predict compres-sion-deflection behavior of various cross section options. Refer to page16.LCP Plastic SpacerLiquid crystal polymer (LCP)spacers, including those made with Vectra A130 material, provide aCHO-SEAL ®1310 or 1273Conductive ElastomersWith EMI spacer gaskets, shielding and grounding are provided by Chomerics’CHO-SEAL 1310 and 1273 conductive elastomers, specifi-cally formulated for custom shape molded parts. They provide excellent shielding and isolation against electro-magnetic interference (EMI), or act as a low impedance ground path between PCB traces and shielding media. Physically tough, these elas-tomers minimize the risk of gasket damage, in contrast to thin-walled extrusions or unsupported molded gaskets.Silicone-based CHO-SEAL 1310and 1273 materials offer excellent resistance to compression set over a wide temperature range, resulting in years of continuous service. CHO-SEAL 1310 material is filled with silver-plated-glass particles, while 1273 utilizes silver-plated-copper filler to provide higher levels of EMI shielding effectiveness.EMI Spacer GasketsThe unique design of Chomerics’EMI spacer gaskets features a thin plastic retainer frame onto which a conductive elastomer is molded. The elastomer can be located inside or outside the retainer frame, as well as on its top and bottom surface. EMI spacer gaskets provide a newapproach to designing EMI gaskets into handheld electronics such as dig-ital cellular phones. Board-to-board spacing is custom designed to fit broad application needs. Customized cross sections and spacer shapes allow for very low closure forcerequirements and a perfect fit in any design or device.Robotic InstallationSpacer gaskets can be installed quickly by robotic application. Integral locater pins in the plastic spacer help ensure accuratepositioning in both manual and pick-and-place assembly. Benefits include faster assembly and lower labor costs.The integrated conductive elastomer/plastic spacer gasket is a low cost,easily installed system for providing EMI shielding and grounding in small electronic enclosures.Figure 1Single Piece EMI Gasket/Locator PinsCHO-SEAL 1310 or 1273 Conductive Elastomer (Inside)Plastic Spacer Around Outsideor InsideApplications for EMI Spacer GasketsThe spacer gasket concept is especially suited to digital and dual board telephone handsets or other handheld electronic devices. It provides a low impedance path between peripheral ground traces on printed circuit boards and components such as:•the conductive coating on a plastic housing•another printed circuit board •the keypad assemblyTypical applications for EMI spacer gaskets include:•Digital cellular, handyphone and personal communications services (PCS) handsets •PCMCIA cards•Global Positioning Systems (GPS)•Radio receivers•Other handheld electronics, e.g.,personal digital assistants (PDAs)•Replacements for metal EMI shield-ing “fences” on printedcircuit boards in wireless tele-communications devicesstable platform for direct, highprecision molding of conductive elas-tomers. The Vectra A130 material described in Table 1 has excellent heat deflection temperature character-istics (489°F, 254°C). For weight con-siderations, the LCP has aspecific gravity of only 1.61. This plas-tic is also 100% recyclable.Typical EMI Spacer Gasket Design ParametersThe EMI spacer gasket concept can be considered using the design parameters shown in Table 2. Some typical spacer gasket profiles are shown below.Figure 2Typical Spacer Gasket Profiles3US Headquarters TEL +(1) 781-935-4850FAX +(1) 781-933-4318 • Europe TEL +(44) 1628 404000FAX +(44) 1628 404090Asia Pacific TEL +(852) 2 428 8008FAX +(852) 2 423 8253South America TEL +(55) 11 3917 1099FAX +(55) 11 3917 0817Finite Element AnalysisChomerics, a division of the Parker Hannifin Corporation’s Seal Group, is the headquarters of Parker Seal’s Elastomer Simulation Group. This unit specializes in elastomer finite element analysis (FEA) using MARC K6 series software as a foundation for FEA capability.Benefits of FEA include:•Quickly optimizing elastomer gasket designs•Allowing accurate predictions of alternate elastomer design concepts •Eliminating extensive trial and error prototype evaluationTypical use of FEA in EMI spacer gasket designs is to evaluate the force vs. deflection requirements of alternate designs.For example, onespacer design features a continuous bead of con-ductive elastomer molded onto a plastic spacer. An alternative designemploys an “interrupted bead,” where the interrup-tions (gaps left on the plastic frame) are sized to maintain the requiredlevel of EMI shielding. Figure 4illustrates these alternative designs.Gasket DeflectionFigure 5 compares the effect of continuous and interrupted elastomer gasket designs in terms of the force required to deflect the conductive elastomer. This actual cellular handset application required a spacer gasket with interrupted bead to meet desired deflection forces.Chomerics Designand Application ServicesChomerics will custom design a spacer for your application. Advice,analysis and design assistance will be provided by Chomerics Applications and Design engineers at no additional fee. Contact Chomerics directlyat the locations listed at the bottom of the page.Figure 3FEA Example of an EMISpacer Gasket Cross SectionFigure 4Continuous (top) and InterruptedElastomer GasketsFigure 5Typical Spacer Gasket Deflection。

IT4010中文资料

IT4010中文资料

INZOTEK超低EMI、无需滤波器、3W 单声道 D 类音频功放 功能说明IT4010IT4010 是一款超低 EMI、无需滤波器 3W 单声道 D 类音频功率放大器。

IT4010 采用先进的技术, 在全带宽范围内极大地降低了 EMI 干扰,最大限度地减少对其他部件的影响。

IT4010 内置过流保护、过热保护及欠压保护功能,有效地保护芯片在异常工作状况下不被损坏。

并 且利用扩频技术充分优化全新电路设计,高达 90%的效率更加适合于手机及其他便携式音频产品。

IT4010 无需滤波器的 PWM 调制结构及增益内置方式减少了外部元件、PCB 面积和系统成本。

IT4010 提供 MSOP8封装,额定的工作温度范围为-40℃至 85℃。

1          主要特性优异的全带宽 EMI 抑制能力 优异的“上电,掉电”噪声抑制 3W 输出功率(10% THD、5V 电源、4Ω 负载) 0.05%THD+N(1W 输出功率、5V 电源) 无需滤波器 Class-D 结构 高达 90%的效率 高 PSRR:-80dB(217Hz) 低静态电流(3.5mA) 工作电压范围:2.2V~5.25V 过流保护、过热保护、欠压保护 MSOP8封装2   应用领域移动电话(手机等) MP3/PMP Mini 音箱 数码相框3典型应用电路图1IT4010-04 May 2011IT4010 典型应用图 1IT40104INZOTEK参数 表1 芯片最大物理极限值 最小值 最大值 -0.3 -0.3 -65 6.0 VDD+0.3 150 150 260 190 -40 85 +/-8000 150 -150 单位 V V ℃ ℃ ℃ ℃/W ℃ V mA mA极限参数电源电压 VDD INP,INN,CTRL 引脚电压 最大结温 存储温度范围 引脚温度 (焊接 10 秒) 封装热阻JA(MSOP8) 工作温度范围 ESD 防护电压 Latch-up +IT -IT注 1:在极限值之外或任何其他条件下,芯片的工作性能不予保证。

LTC4213 1 4213f 电子电路保护器说明书

LTC4213 1 4213f 电子电路保护器说明书

2µs/DIV4213 TA01b124213fBias Supply Voltage (V CC )...........................–0.3V to 9V Input VoltagesON, SENSEP, SENSEN.............................–0.3V to 9V I SEL ..........................................–0.3V to (V CC + 0.3V)Output VoltagesGATE .....................................................–0.3V to 15V READY.....................................................–0.3V to 9V Operating Temperature RangeLTC4213C ...............................................0°C to 70°C LTC4213I.............................................–40°C to 85°C Storage Temperature Range.................–65°C to 150°C Lead Temperature (Soldering, 10sec)...................300°CORDER PART NUMBER DDB PART*MARKING T JMAX = 125°C, θJA = 250°C/WEXPOSED PAD (PIN 9)PCB CONNECTION OPTIONALConsult LTC Marketing for parts specified with wider operating temperature ranges.*The temperature grade is identified by a label on the shipping container.LBHVLTC4213CDDB LTC4213IDDB ABSOLUTE AXI U RATI GSW W WU PACKAGE/ORDER I FOR ATIOUUW (Note 1)ELECTRICAL CHARACTERISTICSThe ● denotes the specifications which apply over the full operatingtemperature range, otherwise specifications are at T A = 25°C. V CC = 5V, I SEL = 0 unless otherwise noted. (Note 2)SYMBOL PARAMETER CONDITIONSMIN TYP MAX UNITSV CC Bias Supply Voltage ● 2.36V V SENSEP SENSEP Voltage ●06V I CC V CC Supply Current●1.63mA V CC(UVLR)V CC Undervoltage Lockout Release V CC Rising● 1.8 2.07 2.23V ∆V CC(UVHYST)V CC Undervoltage Lockout Hysteresis ●30100160mV I SENSEP SENSEP Input Current V SENSEP = V SENSEN = 5V, Normal Mode 154080µA V SENSEP = V SENSEN = 0, Normal Mode –1±15µA I SENSENSENSEN Input CurrentV SENSEP = V SENSEN = 5V, Normal Mode 154080µA V SENSEP = V SENSEN = 0, Normal Mode –1±15µA V SENSEP = V SENSEN = 5V,50280µAReset Mode or Fault ModeV CBCircuit Breaker Trip Voltage I SEL = 0, V SENSEP = V CC●22.52527.5mV V CB = V SENSEP – V SENSEN I SEL = Floated, V SENSEP = V CC ●455055mV I SEL = V CC, V SENSEP = V CC ●90100110mV V CB(FAST)Fast Circuit Breaker Trip Voltage I SEL = 0, V SENSEP = V CC●63100115mV V CB(FAST)= V SENSEP – V SENSEN I SEL = Floated, V SENSEP = V CC ●126175200mV I SEL = V CC, V SENSEP = V CC ●252325371mV I GATE(UP)GATE Pin Pull Up Current V GATE = 0V●–50–100–150µA I GATE(DN)GATE Pin Pull Down Current ∆V SENSEP – V SENSEN = 200mV, V GATE = 8V ●1040mA ∆V GSMAX External N-Channel Gate Drive V SENSEN = 0, V CC ≥ 2.97V, I GATE = –1µA ● 4.8 6.58V V SENSEN = 0, V CC = 2.3V, I GATE = –1µA ● 2.65 4.38V ∆V GSARMV GS Voltage to Arm Circuit BreakerV SENSEN = 0, V CC ≥ 2.97V ● 4.4 5.47.6V V SENSEN = 0, V CC = 2.3V●2.53.57VTOP VIEWDDB PACKAGE8-LEAD (3mm × 2mm) PLASTIC DFN567894321READY ON I SEL GND V CC SENSEP SENSEN GATE34213f∆V GSMAX – ∆V GSARM Difference Between ∆V GSMAX and V SENSEN = 0, V CC ≥ 2.97V ●0.3 1.1V ∆V GSARMV SENSEN = 0, V CC = 2.3V●0.150.8VV READY(OL)READY Pin Output Low Voltage I READY = 1.6mA, Pull Down Device On ●0.20.4V I READY(LEAK)READY Pin Leakage Current V READY = 5V, Pull Down Device Off ●0±1µA V ON(TH)ON Pin High Threshold ON Rising, GATE Pulls Up ●0.760.80.84V ∆V ON(HYST)ON Pin Hysteresis ON Falling, GATE Pulls Down104090mV V ON(RST)ON Pin Reset Threshold ON Falling, Fault Reset, GATE Pull Down ●0.360.40.44V I ON(IN)ON Pin Input Current V ON = 1.2V●0±1µA ∆V OV Overvoltage Threshold ●0.410.7 1.1V ∆V OV = V SENSEP – V CCt OVOvervoltage Protection Trip Time V SENSEP = V SENSEN = Step 5V to 6.2V 2565160µs t FAULT(SLOW)V CB Trips to GATE Discharging ∆V SENSE Step 0mV to 50mV,●71627µs V SENSEN Falling, V CC = V SENSEP = 5V t FAULT(FAST)V CB(FAST) Trips to GATE Discharging ∆V SENSE Step 0V to 0.3V, V SENSEN Falling,●12.5µs V SENSEP = 5Vt DEBOUNCE Startup De-Bounce Time V ON = 0V to 2V Step to Gate Rising,2760130µs (Exiting Reset Mode)t READY READY Delay Time V GATE = 0V to 8V Step to READY Rising,2250115µs V SENSEP = V SENSEN = 0t OFF Turn-Off Time V ON = 2V to 0.6V Step to GATE Discharging 1.5510µs t ON Turn-On Time V ON = 0.6V to 2V Step to GATE Rising,4816µs (Normal Mode)t RESETReset TimeV ON Step 2V to 0V2080150µsNote 1: Absolute Maximum Ratings are those values beyond which the life of a device may be impaired.ELECTRICAL CHARACTERISTICSThe ● denotes the specifications which apply over the full operatingtemperature range, otherwise specifications are at T A = 25°C. V CC = 5V, I SEL = 0 unless otherwise noted. (Note 2)SYMBOLPARAMETERCONDITIONSMIN TYP MAX UNITSNote 2: All currents into device pins are positive; all currents out of device pins are negative. All voltages are referenced to ground unless otherwise specified.4564213ft RESET vs Temperaturet FAULT(SLOW) vs V CCt FAULT(SLOW) vs Temperaturet FAULT(FAST) vs V CCt FAULT(FAST) vs TemperatureTYPICAL PERFOR A CE CHARACTERISTICSU WSpecifications are at T A = 25°C. V CC = 5Vunless otherwise noted.t F A U L T (F A S T ) (µs )4213 G230.90.80.71.01.11.21.3TEMPERATURE (°C)–50050100125–252575BIAS SUPPLY VOLTAGE (V)2.010t F A U L T (S L O W ) (µs )14121618 3.0 4.0 5.0 6.04213 G202022 2.53.54.55.5TEMPERATURE (°C)–500501001254213 G21–25257510t F A U L T (S L O W ) (µs )141216182022TEMPERATURE (°C)–500501001254213 G19–252575t R E S E T (µs )60708090100BIAS SUPPLY VOLTAGE (V)2.0t F A U L T (F A S T ) (µs )3.04.05.06.04213 G222.53.54.55.50.90.80.71.01.11.21.374213fPI FU CTIO SU U UREADY (Pin 1): READY Status Output. Open drain output that goes high impedance when the external MOSFET is on and the circuit breaker is armed. Otherwise this pin pulls low.ON (Pin 2): ON Control Input. The LTC4213 is in reset mode when the ON pin is below 0.4V. When the ON pin increases above 0.8V, the device starts up and the GATE pulls up with a 100µA current source. When the ON pin drops below 0.76V, the GATE pulls down. To reset a circuit breaker fault, the ON pin must go below 0.4V.I SEL (Pin 3): Threshold Select Input. With the I SEL pin grounded, float or tied to V CC the V CB is set to 25mV, 50mV or 100mV, respectively. The corresponding V CB(FAST)values are 100mV, 175mV and 325mV.GND (Pin 4): Device Ground.GATE (P in 5): GATE D rive Output. An internal charge pump supplies 100µA pull-up current to the gate of the external N-channel MOSFET. Internal circuitry limits thevoltage between the GATE and SENSEN pins to a safe gate drive voltage of less than 8V. When the circuit breaker trips, the GATE pin abruptly pulls to GND.SENSEN (Pin 6): Circuit Breaker Negative Sense Input.Connect this pin to the source of the external MOSFET.During reset or fault mode, the SENSEN pin discharges the output to ground with 280µA.SENSEP (P in 7): Circuit Breaker Positive Sense Input.Connect this pin to the drain of external N-channel MOSFET.The circuit breaker trips when the voltage across SENSEP and SENSEN exceeds V CB . The input common mode range of the circuit breaker is from ground to V CC + 0.2V when V CC < 2.5V. For V CC ≥ 2.5V, the input common mode range is from ground to V CC + 0.4V.V CC (Pin 8): Bias Supply Voltage Input. Normal operation is between 2.3V and 6V. An internal under-voltage lockout circuit disables the device when V CC < 2.07V.Exposed Pad (Pin 9): Exposed pad may be left open or connected to device ground.8910114213fsupply transient dips below 1.97V of less than 80µs are ignored.ON FunctionWhen V ON is below comparator COMP1’s threshold of 0.4V for 80µs, the device resets. The system leaves reset mode if the ON pin rises above comparator COMP2’s threshold of 0.8V and the UVLO condition is met. Leaving reset mode, the GATE pin starts up after a t DEBOUNCE delay of 60µs. When ON goes below 0.76V, the GATE shuts off after a 5µs glitch filter delay. The output is discharged by the external load when V ON is in between 0.4V to 0.8V. At this state, the ON pin can re-enable the GATE if V ON exceeds 0.8V for more than 8µs. Alternatively, the device resets if the ON pin is brought below 0.4V for 80µs. Once reset, the GATE pin restarts only after the t DEBOUNCE 60µs delay at V ON rising above 0.8V. To protect the ON pin from overvoltage stress due to supply transients, a series resistor of greater than 10k is recommended when the ON pin is connected directly to the supply. An external resis-tive divider at the ON pin can be used with COMP2 to set a supply undervoltage lockout value higher than the inter-nal UVLO circuit. An RC filter can be implemented at the ON pin to increase the powerup delay time beyond the internal 60µs delay.Gate FunctionThe GATE pin is held low in reset mode. 60µs after leaving reset mode, the GATE pin is charged up by an internal 100µA current source. The circuit breaker arms when V GATE > V SENSEN + ∆V GSARM . In normal mode operation,the GATE peak voltage is internally clamped to ∆V GSMAX above the SENSEN pin. When the circuit breaker trips, an internal MOSFET shorts the GATE pin to GND, turning off the external MOSFET.READY StatusThe READY pin is held low during reset and at startup. It is pulled high by an external pullup resistor 50µs after the circuit breaker arms. The READY pin pulls low if the circuit breaker trips or the ON pin is pulled below 0.76V, or V CC drops below undervoltage lockout.∆V GSARM and V GSMAXEach MOSFET has a recommended V GS drive voltage where the channel is deemed fully enhanced and R DSON is minimized. Driving beyond this recommended V GS volt-age yields a marginal decrease in R DSON . At startup, the gate voltage starts at ground potential. The GATE ramps past the MOSFET threshold and the load current begins to flow. When V GS exceeds ∆V GSARM , the circuit breaker is armed and enabled. The chosen MOSFET should have a recommended minimum V GS drive level that is lower than ∆V GSARM . Finally, V GS reaches a maximum at ∆V GSMAX.Trip and Reset Circuit BreakerFigure 2 shows the timing diagram of V GATE and V READY after a fault condition. A tripped circuit breaker can be reset either by cycling the V CC bias supply below UVLO thresh-old or pulling ON below 0.4V for >t RESET . Figure 3 shows the timing diagram for a tripped circuit breaker being reset by the ON pin.Calculating Current LimitThe fault current limit is determined by the R DSON of the MOSFET and the circuit breaker voltage V CB .I V R LIMIT CB DSON=()2The R DSON value depends on the manufacturer’s distribu-tion, V GS and junction temperature. Short Kelvin-sense connections between the MOSFET drain and source to the LTC4213 SENSEP and SENSEN pins are strongly recommended.For a selected MOSFET, the nominal load limit current is given by:I V R LIMIT NOM CB NOM DSON NOM ()()()()=3The minimum load limit current is given by:I V R LIMIT MIN CB MIN DSON MAX ()()()()=4APPLICATIO S I FOR ATIOW UUU1213144213fOperating temperature of 0° to 70°C.R DSON @ 25°C = 100%R DSON @ 0°C = 90%R DSON @ 70°C = 120%MOSFET resistance variation:R DSON(NOM) = 15m • 0.82 = 12.3m ΩR DSON(MAX) = 15m • 1.333 • 0.93 • 1.2 = 15m • 1.488= 22.3m ΩR DSON(MIN) = 15m • 0.667 • 0.80 • 0.90 = 15m • 0.480= 7.2m ΩV CB variation:NOM V CB = 25mV = 100%MIN V CB = 22.5mV = 90%MAX V CB = 27.5mV = 110%The current limits are:I LIMIT(NOM) = 25mV/12.3m Ω = 2.03A I LIMIT(MIN) = 22.5mV/22.3m Ω = 1.01A I LIMIT(MAX) = 27.5mV/7.2m Ω = 3.82AFor proper operation, the minimum current limit must exceed the circuit maximum operating load current with margin. So this system is suitable for operating load current up to 1A. From this calculation, we can start with the general rule for MOSFET R DSON by assuming maxi-mum operating load current is roughly half of the I LIMIT(NOM). Equation 7 shows the rule of thumb.I V R OPMAX CB NOM DSON NOM =()()•()27Note that the R DSON(NOM) is at the LTC4213 nominal operating ∆V GSMAX rather than at typical vendor spec.Table 1 gives the nominal operating ∆V GSMAX at the various operating V CC . From this table users can refer to the MOSFET’s data sheet to obtain the R DSON(NOM) value.Table 1. Nominal Operating ∆V GSMAX for Typical Bias Supply VoltageV CC (V)∆V GSMAX (V)2.3 4.32.5 5.02.7 5.63.0 6.53.37.05.07.06.07.0Load Supply Power-Up after Circuit Breaker Armed Figure 4 shows a normal power-up sequence for the circuit in Figure 1 where the V IN load supply power-up after circuit breaker is armed. V CC is first powered up by an auxiliary bias supply. V CC rises above 2.07V at time point 1. V ON exceeds 0.8V at time point 2. After a 60µs debounce delay, the GATE pin starts ramping up at time point 3. The external MOSFET starts conducting at time point 4. At time point 5, V GATE exceed ∆V GSARM and the circuit breaker is armed. After 50µs (t READY delay), READY pulls high by an external resistor at time point 6. READY signals the V IN load supply module to start its ramp. The load supply begins soft-start ramp at time point 7. The load supply ramp rate must be slow to prevent circuit breaker tripping as in equation (8).∆∆V t I I C IN OPMAX LOADLOAD<−()8Where I OPMAX is the maximum operating current defined by equation 7.For illustration, V CB = 25mV and R DSON = 3.5m Ω at the nominal operating ∆V GSMAX . The maximum operating current is 3.5A (refer to equation 7). Assuming the load can draw a current of 2A at power-up, there is a margin of 1.5A available for C LOAD of 100µF and V IN ramp rate should be <15V/ms. At time point 8, the current through the MOSFET reduces after C LOAD is fully charged.APPLICATIO S I FOR ATIOW UUU1516174213fThe selected MOSFET V GS absolute maximum rating should meet the LTC4213 maximum ∆V GSMAX of 8V.Other MOSFET criteria such as V BDSS , I DMAX , and R DSON should be reviewed. Spikes and ringing above maximum operating voltage should be considered when choosing V BDSS . I DMAX should be greater than the current limit. The maximum operating load current is determined by the R DSON value. See the section on “Calculating Current Limit” for details.Supply RequirementsThe LTC4213 can be powered from a single supply or dual supply system. The load supply is connected to the SENSEP pin and the drain of the external MOSFET. In the single supply case, the V CC pin is connected to the load supply, preferably with an RC filter. With dual supplies,V CC is connected to an auxiliary bias supply V AUX where V AUX voltage should be greater or equal to the load supply voltage. The load supply voltage must be capable of sourcing more current than the circuit breaker limit. If the load supply current limit is below the circuit breaker trip current, the LTC4213 may not react when the output overloads. Furthermore, output overloads may trigger UVLO if the load supply has foldback current limit in a single supply system.V IN Transient and Overvoltage ProtectionInput transient spikes are commonly observed whenever the LTC4213 responds to overload. These spikes can be large in amplitude, especially given that large decoupling capacitors are absent in hot swap environments. These short spikes can be clipped with a transient suppressor of adequate voltage and power rating. In addition, the LTC4213can detect a prolonged overvoltage condition. WhenAPPLICATIO S I FOR ATIOW UUU point 6 should be within the circuit breaker limits. Other-wise, the system fails to start and the circuit breaker trips immediately after arming. In most applications additional external gate capacitance is not required unless C LOAD is large and startup becomes problematic. If an external gate capacitor is employed, its capacitance value should not be excessive unless it is used with a series resistor. This is because a big gate capacitor without resistor slows down the GATE turn off during a fault. An alternative method would be a stepped I SEL pin to allow a higher current limit during startup.In the event of output short circuit or a severe overload, the load supply can collapse during GATE ramp up due to load supply current limit. The chosen MOSFET must withstand this possible brief short circuit condition before time point 6 where the circuit breaker is allowed to trip. Bench short circuit evaluation is a practical verification of a reliable design. To have current limit while powering a MOSFET into short circuit conditions, it is preferred that the load supply sequences to turn on after the circuit breaker is armed as described in an earlier section.Power-Off CycleThe system can be powered off by toggling the ON pin low.When ON is brought below 0.76V for 5µs, the GATE and READY pins are pulled low. The system resets when ON is brought below 0.4V for 80µs.MOSFET SelectionThe LTC4213 is designed to be used with logic (5V) and sub-logic (3V) MOSFETs for V CC potentials above 2.97V with ∆V GSMAX exceeding 4.5V. For a V CC supply range between 2.3V and 2.97V, sub-logic MOSFETs should be used as the minimum ∆V GSMAX is less than 4.5V.1819Information furnished by Linear Technology Corporation is believed to be accurate and reliable.However, no responsibility is assumed for its use. Linear Technology Corporation makes no represen-tation that the interconnection of its circuits as described herein will not infringe on existing patent rights.201630 McCarthy Blvd., Milpitas, CA 95035-7417(408) 432-1900 ● FAX: (408) 434-0507 ● © LINEAR TECHNOLOGY CORPORA TION 2005LT/TP 0405 500 • PRINTED IN USA。

4110场效应管参数

4110场效应管参数

4110场效应管参数
(实用版)
目录
1.4 吨装载机的概述
2.4 吨装载机的主要参数
3.4 吨装载机的应用场景
正文
一、4 吨装载机的概述
4 吨装载机是一种广泛应用于建筑工地、矿山、码头等场所的工程机械。

它能够进行物料的装载、运输和卸载等工作,大大提高了工程效率。

根据不同的需求,4 吨装载机有多种型号和配置,用户可以根据实际需要进行选择。

二、4 吨装载机的主要参数
1.载重:4 吨装载机的载重能力为 4 吨,满足大部分装载需求。

2.铲斗容量:铲斗容量是指装载机一次能装载的物料量,4 吨装载机的铲斗容量通常为 1.5-2 立方米。

3.发动机功率:4 吨装载机的发动机功率一般在 80-120 马力之间,动力强劲,能够应对各种工况。

4.速度:4 吨装载机的行驶速度和铲斗升降速度可以根据不同型号和配置有所差异,一般在 30-40 公里/小时和 10-20 米/分钟之间。

5.工作时间:4 吨装载机的连续工作时间一般为 6-8 小时,长时间工作需要进行适当的休息和保养。

三、4 吨装载机的应用场景
1.建筑工地:4 吨装载机在建筑工地中主要用于物料的装载、运输和卸载,如沙石、水泥、砖块等。

2.矿山:在矿山作业中,4 吨装载机可用于矿石的运输和装载,提高矿山开采效率。

3.码头:在码头作业中,4 吨装载机可用于货物的装卸,加快港口作业速度。

4.环卫清洁:4 吨装载机还可应用于城市环卫清洁,如清理垃圾、绿
化带维护等。

总之,4 吨装载机作为一款重要的工程机械设备,具有广泛的应用场景和较高的实用价值。

41F高温双极锁存型霍尔位置传感器芯片

41F高温双极锁存型霍尔位置传感器芯片

管脚名称 VCC GND OUT
SIP3L
(顶视图)
功能描述 电源电压
地 集电极开路输出
3. OUT 2. GND 1. Vcc
12 3
Preliminary datasheet
Page 1-5
Rev. 1.2 Dec. 30,2009
u 产品技术参数 l 极限参数
参数 电源电压 磁感应强度 输出反向击穿电压 输出低电平电流 最大允许的功耗 工作环境温度 贮存温度
-
典型
3.8
0.1 3.5 0.2 0.5
最大
30 250 600 10 9.0
-
Gauss Gauss Gauss
单位
V mV mV μA mA μS μS
Preliminary datasheet
Page 2-5
Rev. 1.2 Dec. 30, Nhomakorabea009u 电路内部框图
Vcc
REG.
AMP.
41F
41F
双极锁存型霍尔效应位置传感器
41F 高温双极锁存型霍尔效应位置传感 器是由内部电压稳压单元、霍尔电压发生器、差 分放大器、温度补偿单元、施密特触发器和集电 极开路输出级组成的磁敏传感电路,其输入为磁 感应强度,输出是一个数字电压信号。它是一种 双磁极工作的磁敏电路,适合于矩形或者柱形磁 体下工作。工作温度范围可以在-40℃到150℃, 电源电压工作范围从3.8V 到30V,负载电流能力 最高可达40mA。封装形式为SIP3L(TO92S)。
OUT GND
u 测试电路图
Vcc=12V
RL
RL=820 Ohm CL CL=20 pF
OUT
Preliminary datasheet

LTC1144资料

LTC1144资料

2
U
W
U
U
W W
W
元器件交易网
LTC1144 TYPICAL PERFORMANCE CHARACTERISTICS
Output Resistance vs Supply Voltage
元器件交易网
LTC1144 Switched-Capacitor Wide Input Range Voltage Converter with Shutdown
FEATURES
s s s s s s
DESCRIPTIO
s s
Wide Operating Supply Voltage Range: 2V to 18V Boost Pin (Pin 1) for Higher Switching Frequency Simple Conversion of 15V to –15V Supply Low Output Resistance: 120Ω Maximum Power Shutdown to 8µA with SHDN Pin Open Circuit Voltage Conversion Efficiency: 99.9% Typical Power Conversion Efficiency: 93% Typical Easy to Use
ORDER PART NUMBER LTC1144CN8 LTC1144IN8
N8 PACKAGE 8-LEAD PLASTIC DIP T JMAX = 110°C, θJA = 100°C/W
TOP VIEW BOOST 1 CAP+ 2 GND 3 CAP– 4 8 7 6 5 V+ OSC SHDN VOUT
LTC1144CS8 LTC1144IS8 S8 PART MARKING 1144 1144I

IRFP4110PBF资料

IRFP4110PBF资料

IRRM
Reverse Recovery Current
ton
Forward Turn-On Time
Min. Typ. Max. Units
Conditions
––– ––– 170c A MOSFET symbol
D
showing the
––– ––– 670
integral reverse
G
p-n junction diode.
ID, Drain-to-Source Current (A)
10 0.1
≤60µs PULSE WIDTH Tj = 25°C
1
10
100
VDS, Drain-to-Source Voltage (V)
Fig 1. Typical Output Characteristics
1000
ID, Drain-to-Source Current (A)
100
10
TJ = 25°C
TJ = 175°C 1
VDS = 25V ≤60µs PULSE WIDTH
0.1
1
2
3
4
5
6
7
VGS, Gate-to-Source Voltage (V)
Fig 3. Typical Transfer Characteristics
Dynamic @ TJ = 25°C (unless otherwise specified)
Symbol
Parameter
Min. Typ. Max. Units
Conditions
gfs
Forward Transconductance
Qg

ltc1144

ltc1144

inputs from sources operating from external supplies be applied prior to power-up of the LTC1144. Note 3: fOSC is tested with COSC = 100pF to minimize the effects of test fixture capacitance loading. The 0pF frequency is correlated to this 100pF test point, and is intended to simulate the capacitance at pin 7 when the device is plugged into a test socket and no external capacitor is used.
OUTPUT VOLTAGE (V)
15V INPUT
10µF
+
–15V OUTPUT 10µF
1144 TA01
–13
–12
–11
–10 0 10 30 40 20 LOAD CURRENT (mA) 50
1144 TA02
U
+
UO
UO
1
LTC1144 ABSOLUTE
(Note 1)
AXI U
The LTC1144 is a monolithic CMOS switched-capacitor voltage converter. It performs supply voltage conversion from positive to negative from an input range of 2V to 18V, resulting in complementary output voltages of –2V to –18V. Only two noncritical external capacitors are needed for the charge pump and charge reservoir functions. The converter has an internal oscillator that can be overdriven by an external clock or slowed down when connected to a capacitor. The oscillator runs at a 10kHz frequency when unloaded. A higher frequency outside the audio band can also be obtained if the Boost Pin is tied to V +. The SHDN pin reduces supply current to 8µA and can be used to save power when the converter is not in use. The LTC1144 contains an internal oscillator, divide-bytwo, voltage level shifter, and four power MOSFETs. A special logic circuit will prevent the power N-channel switch substrate from turning on.

西门子 S7-1200 功能安全手册 - 设备手册说明书

西门子 S7-1200 功能安全手册 - 设备手册说明书

SIMATICS7S7-1200 功能安全手册设备手册Siemens AGDigital IndustriesⓅ 10/2022 本公司保留更改的权利 Copyright © Siemens AG 2022. 保留所有权利法律资讯警告提示系统为了您的人身安全以及避免财产损失,必须注意本手册中的提示。

人身安全的提示用一个警告三角表示,仅与财产损失有关的提示不带警告三角。

警告提示根据危险等级由高到低如下表示。

危险表示如果不采取相应的小心措施,将会导致死亡或者严重的人身伤害。

警告表示如果不采取相应的小心措施,可能导致死亡或者严重的人身伤害。

小心表示如果不采取相应的小心措施,可能导致轻微的人身伤害。

注意表示如果不采取相应的小心措施,可能导致财产损失。

当出现多个危险等级的情况下,每次总是使用最高等级的警告提示。

如果在某个警告提示中带有警告可能导致人身伤害的警告三角,则可能在该警告提示中另外还附带有可能导致财产损失的警告。

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由于具备相关培训及经验,合格人员可以察觉本产品/系统的风险,并避免可能的危险。

按规定使用 Siemens 产品请注意下列说明:警告Siemens 产品只允许用于目录和相关技术文件中规定的使用情况。

如果要使用其他公司的产品和组件,必须得到 Siemens 推荐和允许。

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必须注意相关文件中的提示。

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然而不排除存在偏差的可能性,因此我们不保证印刷品中所述内容与硬件和软件完全一致。

电磁炉三极管型号代换

电磁炉三极管型号代换

APT50GP60B
600 72
APT15GP90B
900 21
APT25GP90B
900 36
APT40GP90B
900 50
APT13GP120B
1200 20
0-50KHZ 0-50KHZ 0-50KHZ 0-50KHZ 0-50KHZ 0-50KHZ 0-200KHZ 0-200KHZ 0-200KHZ 0-200KHZ 0-200KHZ 0-200KHZ 0-200KHZ
易并联 有 D
NPT 结构 易并联 有 D
NPT 结构 易并联 有 D
NPT 结构 易并联 有 D
NPT 结构 易并联 有 D
NPT 结 构 易并 联 有D
NPT 结 构 易并 联 有D
PT 结 构 不易 并联 无 D
PT 结 构 不易 并联 无 D
PT 结 构 不易 并联 无 D
PT 结 构 不易 并联 无 D
0-200KHZ 0-200KHZ 0-200KHZ 0-200KHZ 0-200KHZ 0-200KHZ 0-200KHZ 0-200KHZ 0-200KHZ 0-200KHZ 0-200KHZ 0-200KHZ 0-200KHZ 0-200KHZ
PT 结 构 不易 并联 无 D
PT 结 构 不易 并联 无 D
3.0
0.14μ s 单管
单管
无 阻 尼

单管


2.1
0.15μ s 单管
2.1
0.25μ s 单管
GT50J122 GT60J323 GT50J322
(富士)厂型号
1MBH50-060 1MBH50D-100 1MBH25-120 1MBH60-100 1MBH25D-120 1MBH60D-100 1MBH60-170

PT4110中文资料

PT4110中文资料

60
10 -6 5 10 -7 5 10 -8 5 10 -9 5 10 -10 5 10 -11 5 - 25
0
25
50
75
100
Ambient temperature Ta (˚C)
Ambient temperature Ta (˚C )
PT4110/PT4110F
Fig. 3 Relative Collector Current vs. Ambient Temperature
(Ta = 25˚C)
20˚
Fig. 9 PT4110 Relative Output vs. Distance (Detector : GL4110)
100 30˚ 10 40˚
Ta = 25˚C
Relative output (%)
1
- 50˚ - 60˚ - 70˚ - 80˚ - 90˚
50˚ 60˚ 70˚ 80˚ 90˚
(Ta= 25˚C) Unit V V mA mW ˚C ˚C ˚C
Soldering area
*1 For MAX. 5 seconds at the position of 1.4 mm from the resin edge
“ In the absence of confirmation by device specification sheets, SHARP takes no responsibility for any defects that occur in equipment using any of SHARP's devices, shown in catalogs, data books, etc. Contact SHARP in order to obtain the latest version of the device specification sheets before using any SHARP's device.”

4110场效应管参数

4110场效应管参数

4110场效应管参数
场效应管(field effect transistor,FET)是一种三端器件,
常用于放大和开关电路中。

其主要参数包括:
1. 静态参数:
- 阈值电压(Vth):指的是控制极(栅极)与源极之间的电压,当控
制电压超过阈值电压时,场效应管开始导通。

- 饱和漏极电流(Idss):指的是当栅极和源极短路时,漏极电流的
最大值。

这个参数一般在静态工作点上是指定的。

2. 动态参数:
- 转导(gm):指的是漏极电流对栅极-源极电压变化的灵敏度。

转导
越大,场效应管放大能力越强。

- 输入电阻(Rin):指的是从栅极到源极的输入电阻。

输入电阻越大,场效应管对输入信号的损耗越小。

- 输出电阻(Rout):指的是从漏极到源极的输出电阻。

输出电阻越大,场效应管对输出信号的损耗越小。

- 最大漏极电流(Idmax):指的是场效应管最多能承受的漏极电流。

以上是一些常见的场效应管参数,不同型号的场效应管会有不同
的参数范围和限制。

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TYPICAL APPLICATION
Battery Backup System Manager
SYSTEM LOAD
DCIN 0V
BACKUP LOAD (DCOUT) CURRENT FLOW
OFF
ON
ON
BATTERY
UVLO SET POINT
INID DCDIV
BATID LTC4110 CHGFET
(GPIO1, GPIO2, GPIO3, SELC, SELA, TYPE, VCHG, THA, THB, ISENSE, ACPDLY, SDA, SCL) .... –0.3V to 7V Input Voltage (VCAL, VDIS)....................... –0.3V to 1.35V Output Voltage (ACPb, GPIO1, GPIO2, GPIO3) ................ – 0.3V to 7V CLP-CLN, CSP-CSN ..................................................±1V Operating Temperature Range (Note 2)....–40°C to 85°C Junction Temperature (Note 3) ............................. 105°C Storage Temperature Range QFN Package......................................–65°C to 125°C
APPLICATIONS
n Backup Battery Systems n Server Memory Backup n Medical Equipment n High Reliability Systems
DESCRIPTION
The LTC®4110 is a complete single chip, high efficiency, flyback battery charge and discharge manager with automatic switchover between the input supply and the backup battery or super capacitor. The IC provides four modes of operation: battery backup, battery charge, battery calibration and shutdown. Battery backup and battery charge are automatic standalone modes, while the optional calibration mode requires a CPU host to communicate over an SMBus. During calibration the flyback charger is used in reverse to discharge the battery with a programmable constant current into the system load eliminating heat generation. Three status outputs can be individually reconfigured over the SMBus to become GPIOs. User programmable overdischarge protection is provided. The SHDN pin isolates the battery to support shipping the product with a charged battery installed.
DCHFET
4110 F01
/
Server Backup System (In Backup MANAGER
HOST CPU
SYSTEM LOAD (DC/DC, ETC.)
BACKUP LOAD (MEMORY, ETC.)
n Standalone for Li-Ion/Polymer, SLA, and Supercaps n Optional SMBus/I2C Support Allows Battery
Capacity Calibration Operation with Host n Over- and Under-Battery Voltage Protection n Adjustable Battery Float Voltage n Precision Charge Voltage ±0.5% n Programmable Charge/Calibration Current Up to
LTC4110
Battery Backup System Manager
FEATURES
n Complete Backup Battery Manager for Li-Ion/ Polymer, Lead Acid, NiMH/NiCd Batteries and Super Capacitors
CURRENT FLOW
BATTERY
I2C BUS
4110 TA01b
4110fb
1
LTC4110
ABSOLUTE MAXIMUM RATINGS
(Note 1)
DCIN, BAT, DCOUT, DCDIV, SHDN to GND ....................................................... –0.3V to 20V Input Voltage (CLP, CLN)...............–0.3V to DCIN + 0.3V Input Voltage (CSP, CSN) ................–0.3V to BAT + 0.3V Input Voltage
PACKAGE DESCRIPTION
LTC4110EUHF
LTC4110EUHF#TR
4110
38-Lead (5mm × 7mm) Plastic QFN
Consult LTC Marketing for parts specified with wider operating temperature ranges.
UHF PACKAGE 38-LEAD (5mm s 7mm) PLASTIC QFN
TJMAX = 100°C, θJA = 34°C/W EXPOSED PAD (PIN 39) IS GND, MUST BE SOLDERED TO PCB
ORDER INFORMATION
LEAD FREE FINISH
For more information on lead free part marking, go to: /leadfree/ For more information on tape and reel specifications, go to: /tapeandreel/
temperature range, otherwise specifications are at TA = 25°C. Unless otherwise specified, VDCIN = VDCOUT = VDCDIV = 12V, VBAT = 8.4V, GND = SGND = CLP = CLN = SHDN = 0V and RVREF = 49.9k. All currents into device pins are positive and all currents out of device pins are negative. All voltages are referenced to GND, unless otherwise specified.
TAPE AND REEL
PART MARKING
PACKAGE DESCRIPTION
LTC4110EUHF#PBF
LTC4110EUHF#TRPBF 4110
38-Lead (5mm × 7mm) Plastic QFN
LEAD BASED FINISH
TAPE AND REEL
PART MARKING
38 37 36 35 34 33 32 39
13 14 15 16 17 18 19
31 BAT 30 SELC 29 ISENSE 28 SGND 27 CSN 26 CSP 25 ITH 24 ICHG 23 ICAL 22 IPCC 21 THB 20 THA
ACPb VDIS VCAL VCHG VREF TIMER TYPE
Multiple LTC4110s can be combined to form a redundant battery backup system or increase the number of battery packs to achieve longer backup run times.
L, LT, LTC and LTM are registered trademarks of Linear Technology Corporation. PowerPath is a trademark of Linear Technology Corporation. All other trademarks are the property of their respective owners.
TEMPERATURE RANGE –40°C to 85°C TEMPERATURE RANGE –40°C to 85°C
2
/
4110fb
LTC4110
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