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UPC4574G2-E1中文资料

UPC4574G2-E1中⽂资料The information in this document is subject to change without notice. Before using this document, please confirm that this is the latest version.Not all products and/or types are available in every country. Please check with an NEC Electronics sales representative for availability and additional information.DATA SHEETDocument No. G15977EJ4V0DS00 (4th edition)Date Published March 2004 N CP(K) Printed in JapanThe mark shows major revised points.1987DESCRIPTIONThe µPC4574 is an ultra low noise, high slew rate quad operational amplifier specifically designed for audio, instrumentation, and communication circuits. The low noise and high frequency capabilities make it ideal for preamps and active filters for instrumentation and professional audio.FEATURESUltra low noise High slew rate Wide bandwidthInternal frequency compensationORDERING INFORMATIONPart NumberPackageµPC4574C µPC4574C(5) 14-pin plastic DIP (7.62 mm (300)) 14-pin plastic DIP (7.62 mm (300)) µPC4574G2 µPC4574G2(5) 14-pin plastic SOP (5.72 mm (225)) 14-pin plastic SOP (5.72 mm (225))EQUIVALENT CIRCUIT (1/4 Circuit)I I I NVVPIN CONFIGURATION (Top View)OUT 4I I4I N4V ?I N3I I3OUT 3OUT 1I I1I N1V +I N2I I2OUT 2PC4574C, 4574C(5), 4574G2, 4574G2(5)µData Sheet G15977EJ4V0DS2ABSOLUTE MAXIMUM RATINGS (T A = 25°C)Parameter SymbolRatings Unit Voltage between V +and V ? Note1V +V0.3 to +36VDifferential Input Voltage V ID ±30 V Input VoltageNote2V IV ??0.3 to V ++0.3 V Output VoltageNote3V OV ??0.3 to V + +0.3VC Package Note4570 mW Power Dissipation G2 PackageNote5P T 550 mW Output Short Circuit DurationNote610 sec Operating Ambient Temperature T A ?20 to +80 °C Storage TemperatureT stg55 to +125°CNotes 1. Reverse connection of supply voltage can cause destruction.2. The input voltage should be allowed to input without damage or destruction. Even during the transition periodof supply voltage, power on/off etc., this specification should be kept. The normal operation will establish when the both inputs are within the Common Mode Input Voltage Range of electrical characteristics.3. This specification is the voltage which should be allowed to supply to the output terminal from externalwithout damage or destructive. Even during the transition period of supply voltage, power on/off etc., this specification should be kept. The output voltage of normal operation will be the Output Voltage Swing of electrical characteristics.4. Thermal derating factor is –7.6 mW/°C when ambient temperature is higher than 50°C.5. Thermal derating factor is –5.5 mW/°C when ambient temperature is higher than 25°C.6. Pay careful attention to the total power dissipation not to exceed the absolute maximum ratings, Note 4 andNote 5.RECOMMENDED OPERATING CONDITIONSParameter Symbol MIN. TYP. MAX. UnitSupply Voltage V ± ±4 ±16 V Output Current I O±10 mASource Resistance R S 50k ?Capacitive Load (A V = +1)C L 100 pFµPC4574C, µPC4574G2±Notes 7. Input bias currents flow out from IC. Because each currents are base current of PNP-transistor on input stage.8.This current flows irrespective of the existence of use.Data Sheet G15977EJ4V0DS 3µPC4574C(5), µPC4574G2(5)±Notes 7. Input bias currents flow out from IC. Because each currents are base current of PNP-transistor on input stage.8.This current flows irrespective of the existence of use.4Data Sheet G15977EJ4V0DSMEASUREMENT CIRCUITFig.1 Total Harmonic Distortion Measurement CircuitnFig.3 Flat Noise Measurement Circuit (FLAT+JIS A)V O = 40 dB x V n100 V n =V O40 dBData Sheet G15977EJ4V0DS 5Data Sheet G15977EJ4V0DS6TYPICAL PERFORMANCE CHARACTERISTICS (T A = 25°C, TYP.) T A - Operating Ambient Temperature - ?CPOWER DISSIPATIONP T - T o t a l P o w e r D i s s i p a t i o n - m W800600400200020*********20406080100120110010 k 1 M 1 k 10100 k 10 Mf - Frequency - HzOPEN LOOP FREQUENCY RESPONSEA V - O p e n L o o p V o l t a g e G a i n - d BV ± = ±15 V202040608021.510.50?0.5?1?1.5?2T A - Operating Ambient Temperature - ?CINPUT OFFSET VOLTAGEV I O - I n p u t O f f s e t V o l t a g e - m V= ±15 VV ±each 5 samples data806040200?20550530510490470450T A - Operating Ambient Temperature - ?CINPUT BIAS CURRENTI B - I n p u t B i a s C u r r e n t - n A= ±15 VV ±f - Frequency - HzLARGE SIGNAL FREQUENCY RESPONSE V o m - O u t p u t V o l t a g e S w i n g - V p -p 01020301001 k 10 k 100 k 1 M 10 MV = ±15 V±R L = 10 k ?I O - Output Current - mAOUTPUT CURRENT LIMITV O - O u t p u t V o l t a g e - V±±5±10±15T A - Operating Ambient Temperature - ?CSUPPLY CURRENTI C C - S u p p l y C u r r e n t - m A12963204020060800V = ±15 V±SUPPLY CURRENTI C C - S u p p l y C u r r e n t - m A12963±10±20V - Supply Voltage - V±Data Sheet G15977EJ4V0DS7COMMON MODE INPUT VOLTAGE RANGE V I C M - C o m m o n M o d e I n p u t V o l t a g e R a n g e - V 20100±10±20V - Supply Voltage - V±VOLTAGE FOLLOWER PULSE RESPONSE V O - O u t p u t V o l t a g e - V10551002468t - Time - sµV = ±15 V ±A V = 1R L = 2 k ?INPUT NOISE VOLTAGE (FLAT + JIS A)V n - I n p u t N o i s e V o l t a g e - V r .m .s .1001010.1101001 k10 k100 kR S - Source Resistance - ?V = ±15 V±µf - Frequency - HzINPUT EQUIVALENT NOISE VOLTAGE DENSITY e n - I n p u t E q u i v a l e n t N o i s e V o l t a g e D e n s i t y - n V / H z20468100 1 k10 k 100 k10±R S = 100 VTOTAL HARMONIC DISTORTIONT H D - T o t a l H a r m o n i c D i s t o r t i o n - %10.0010.010.10.000110100 1 k10 k 100 kf - Frequency - HzV = ±15 V ±V O = 3 V r.m.s.A V = 1R L = 2 k ?Data Sheet G15977EJ4V0DS8PACKAGE DRAWINGS (Unit: mm)14-PIN PLASTIC DIP (7.62 mm (300))ITEM MILLIMETERS A 19.22±0.22.14 MAX.F I J D 1.32±0.12G 3.6±0.3C B 2.54 (T.P.)0.50±0.10R 0~15°H 0.51 MIN.K 7.62 (T.P.)L 6.4±0.23.554.3±0.2N 0.25NOTES1. Each lead centerline is located within 0.25 mm ofits true position (T.P.) at maximum material condition.2. ltem "K" to center of leads when formed parallel.P14C-100-300B1-3M 0.25+0.10?0.05Data Sheet G15977EJ4V0DS9ITEM B C I 14-PIN PLASTIC SOP (5.72 mm (225))D E G H J PMILLIMETERS 1.27 (T.P.)1.42 MAX.A 10.2±0.264.4±0.10.1±0.10.426.5±0.21.49+0.08?0.071.1±0.163°+7°?3°NOTEEach lead centerline is located within 0.1 mm ofits true position (T.P.) at maximum material condition.F 1.59+0.21?0.2K L M N 0.6±0.20.170.10.10+0.08?0.07S14GM-50-225B, C-6RECOMMENDED SOLDERING CONDITIONSThe µPC4574 should be soldered and mounted under the following recommended conditions.For soldering methods and conditions other than those recommended below, contact an NEC Electronics sales representative.For technical information, see the following website.Semiconductor Device Mount Manual (/doc/015a7dda76a20029bd642de6.html/pkg/en/mount/index.html)Type of Surface Mount DeviceµPC4574G2, 4574G2(5): 14-pin plastic SOP (5.72 mm (225))Process ConditionsSymbol Infrared Ray Reflow Peak temperature: 230°C or below (Package surface temperature),Reflow time: 30 seconds or less (at 210°C or higher),Maximum number of reflow processes: 1 time.IR30-00-1Vapor Phase Soldering Peak temperature: 215°C or below (Package surface temperature),Reflow time: 40 seconds or less (at 200°C or higher),Maximum number of reflow processes: 1 time.VP15-00-1Wave Soldering Solder temperature: 260°C or below, Flow time: 10 seconds or less,Maximum number of flow processes: 1 time,Pre-heating temperature: 120°C or below (Package surface temperature).WS60-00-1Partial Heating Method Pin temperature: 300°C or below,Heat time: 3 seconds or less (Per each side of the device).–Caution Apply only one kind of soldering condition to a device, except for "partial heating method", or thedevice will be damaged by heat stress.Type of Through-hole DeviceµPC4574C, 4574C(5): 14-pin plastic DIP (7.62 mm (300))Process ConditionsWave Soldering (only to leads) Solder temperature: 260°C or below, Flow time: 10 seconds or less.Partial Heating Method Pin temperature: 300°C or below,Heat time: 3 seconds or less (per each lead).Caution For through-hole device, the wave soldering process must be applied only to leads, and make sure that the package body does not get jet soldered.Data Sheet G15977EJ4V0DS10The information in this document is current as of March, 2004. The information is subject to change without notice. For actual design-in, refer to the latest publications of NEC Electronics data sheets or data books, etc., for the most up-to-date specifications of N EC Electronics products. N ot all products and/or types are available in every country. Please check with an N EC Electronics sales representative for availability and additional information.No part of this document may be copied or reproduced in any form or by any means without the prior written consent of NEC Electronics. NEC Electronics assumes no responsibility for any errors that may appear in this document.NEC Electronics does not assume any liability for infringement of patents, copyrights or other intellectual property rights of third parties by or arising from the use of NEC Electronics products listed in this document or any other liability arising from the use of such products. No license, express, implied or otherwise, is granted under any patents, copyrights or other intellectual property rights of NEC Electronics or others.Descriptions of circuits, software and other related information in this document are provided for illustrative purposes in semiconductor product operation and application examples. The incorporation of these circuits, software and information in the design of a customer's equipment shall be done under the full responsibility of the customer. NEC Electronics assumes no responsibility for any losses incurred by customers or third parties arising from the use of these circuits, software and information.While NEC Electronics endeavors to enhance the quality, reliability and safety of NEC Electronics products, customers agree and acknowledge that the possibility of defects thereof cannot be eliminated entirely. To minimize risks of damage to property or injury (including death) to persons arising from defects in NEC Electronics products, customers must incorporate sufficient safety measures in their design, such as redundancy, fire-containment and anti-failure features.NEC Electronics products are classified into the following three quality grades: "Standard", "Special" and "Specific".The "Specific" quality grade applies only to NEC Electronics products developed based on a customer-designated "quality assurance program" for a specific application. The recommended applications of an NEC Electronics product depend on its quality grade, as indicated below. Customers must check the quality grade of each NEC Electronics product before using it in a particular application."Standard":Computers, office equipment, communications equipment, test and measurement equipment, audioand visual equipment, home electronic appliances, machine tools, personal electronic equipment and industrial robots. "Special":Transportation equipment (automobiles, trains, ships, etc.), traffic control systems, anti-disastersystems, anti-crime systems, safety equipment and medical equipment (not specifically designed for life support). "Specific":Aircraft, aerospace equipment, submersible repeaters, nuclear reactor control systems, lifesupport systems and medical equipment for life support, etc.The quality grade of NEC Electronics products is "Standard" unless otherwise expressly specified in NEC Electronics data sheets or data books, etc. If customers wish to use NEC Electronics products in applications not intended by NEC Electronics, they must contact an NEC Electronics sales representative in advance to determine NEC Electronics' willingness to support a given application.(Note)(1)"NEC Electronics" as used in this statement means NEC Electronics Corporation and also includes itsmajority-owned subsidiaries.(2)"NEC Electronics products" means any product developed or manufactured by or for NEC Electronics (asdefined above).M8E 02. 11-1。

ICS501 LOCO PLL时钟乘法器数据表说明书

DescriptionThe ICS501 LOCO TM is the most cost effective way to generate a high-quality, high-frequency clock output from a lower frequency crystal or clock input. The name LOCO stands for Low Cost Oscillator, as it is designed to replace crystal oscillators in most electronic systems. Using Phase-Locked Loop (PLL) techniques, the device uses a standard fundamental mode, inexpensive crystal to produce output clocks up to 160 MHz.Stored in the chip’s ROM is the ability to generate nine different multiplication factors, allowing one chip to output many common frequencies (see table on page 2).The device also has an output enable pin which tri-states the clock output when the OE pin is taken low.This product is intended for clock generation. It has low output jitter (variation in the output period), but input to output skew and jitter are not defined or guaranteed. For applications which require defined input to output skew, use the ICS570B.Features•Packaged as 8-pin SOIC, MSOP, or die •RoHS 5 (green) or RoHS 6 (green and lead free) compliant packaging•IDT’s lowest cost PLL clock•Zero ppm multiplication error•Input crystal frequency of 5 - 27 MHz•Input clock frequency of 2 - 50 MHz•Output clock frequencies up to 160 MHz •Extremely low jitter of 25 ps (one sigma)•Compatible with all popular CPUs•Duty cycle of 45/55 up to 160 MHz•Nine selectable frequencies•Operating voltage of 3.3 V or 5.0 V•Tri-state output for board level testing•25 mA drive capability at TTL levels•Ideal for oscillator replacement•Industrial temperature version available •Advanced, low-power CMOS processBlock DiagramPin Assignment Clock Output Table0 = connect directly to ground 1 = connect directly to VDD M = leave unconnected (floating)Common Output Frequency Examples (MHz)Pin DescriptionsS1S0CLK Minimum Input 004X input per page 50M 5.3125X input 20 MHz 015X input per page 5M 0 6.25X input 4 MHz M M 2X input per page 5M 1 3.125X input 8 MHz 106X input per page 51M 3X input per page 5118X inputper page 5Output 2024303233.3337.54048506062.5Input1012101616.6612101216.661020Selection (S1, S0)M, M M, M 1, M M, M M, M M, 10, 00, 01, M 1, 0M, 1Output 6466.6672758083.3390100106.25120125Input1616.6612121016.661520201520Selection (S1, S0)0, 00, 01, 0M, 01, 10, 11, 00, 10, M1, 1M, 0PinNumberPin NamePin TypePin Description1XI/ICLK Input Crystal connection or clock input.2VDD Power Connect to +3.3 V or +5 V.3GND Power Connect to ground.4S1Tri-level IinputSelect 1 for output clock. Connect to GND or VDD or float.5CLK Output Clock output per table above.6S0Tri-level InputSelect 0 for output clock. Connect to GND or VDD or float.7OE Input Output enable. Tri-states CLK output when low. Internal pull-up.8X2OutputCrystal connection. Leave unconnected for clock input.External ComponentsDecoupling CapacitorAs with any high-performance mixed-signal IC, the ICS501 must be isolated from system power supply noise to perform optimally.A decoupling capacitor of 0.01µF must be connectedbetween VDD and the GND. It must be connected close to the ICS501 to minimize lead inductance. No external power supply filtering is required for the ICS501.Series Termination ResistorA 33Ω terminating resistor can be used next to the CLK pin for trace lengths over one inch.Crystal Load CapacitorsThe total on-chip capacitance is approximately 12 pF. A parallel resonant, fundamental mode crystal should be used. The device crystal connections should include pads for small capacitors from X1 to ground and from X2 to ground. These capacitors are used to adjust the stray capacitance of the board to match the nominally required crystal load capacitance. Because load capacitance can only be increased in this trimming process, it is important to keep stray capacitance to a minimum by using very short PCB traces (and no vias) between the crystal and device. Crystal capacitors, if needed, must be connected from each of the pins X1 and X2 to ground.The value (in pF) of these crystal caps should equal (C L -12 pF)*2. In this equation, C L = crystal load capacitance in pF. Example: For a crystal with a 16 pF load capacitance, each crystal capacitor would be 8 pF [(16-12) x 2 = 8].Absolute Maximum RatingsStresses above the ratings listed below can cause permanent damage to the ICS501. These ratings, which are standard values for IDT commercially rated parts, are stress ratings only. Functional operation of the device at these or any other conditions above those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods can affect product reliability. Electrical parameters are guaranteed only over the recommended operating temperature range.Recommended Operation ConditionsItemRatingSupply Voltage, VDD 7 VAll Inputs and Outputs-0.5 V to VDD+0.5 V Ambient Operating Temperature -40 to +85︒C Storage Temperature -65 to +150︒C Soldering Temperature260︒CParameterMin.Typ.Max.UnitsAmbient Operating Temperature (commercial)0+70︒C Ambient Operating Temperature (industrial)-4085︒C Power Supply Voltage (measured in respect to GND)+3.0+5.25VDC Electrical CharacteristicsVDD=5.0 V ±5%, Ambient temperature -40 to +85︒C, unless stated otherwiseParameter Symbol Conditions Min.Typ.Max.Units Operating Voltage VDD 3.0 5.25VInput High Voltage, ICLK only V IH ICLK (pin 1)(VDD/2)+1VInput Low Voltage, ICLK only V IL ICLK (pin 1)(VDD/2)-1VInput High Voltage V IH OE (pin 7) 2.0VInput Low Voltage V IL OE (pin 7)0.8VInput High Voltage V IH S0, S1VDD-0.5VInput Low Voltage V IL S0, S10.5VOutput High Voltage V OH I OH = -25 mA 2.4VOutput Low Voltage V OL I OL = 25 mA0.4VIDD Operating Supply Current, 20 No load, 100M20mA Short Circuit Current CLK output+70mA On-Chip Pull-up Resistor Pin 7270kΩInput Capacitance, S1, S0, and OE Pins 4, 6, 74pF Nominal Output Impedance20ΩAC Electrical CharacteristicsVDD = 5.0 V ±5%, Ambient Temperature -40 to +85︒ C, unless stated otherwiseNote 1: Measured with 15 pF load.Thermal Characteristics for 8SOICThermal Characteristics for 8MSOPParameterSymbolConditions Min.Typ.Max.UnitsInput Frequency, crystal input F IN 527MHz Input Frequency, clock inputF IN 250MHz Output Frequency, VDD = 4.75 to 5.25 V F OUT 0︒C to +70︒C 13160MHz -40︒C to +85︒C 13140 MHzOutput Frequency, VDD = 3.0 to 3.6 V F OUT 0︒C to +70︒C 13100MHz -40︒C to +85︒C 1390MHz Output Clock Rise Time t OR 0.8 to 2.0 V, Note 11ns Output Clock Fall Time t OF 2.0 to 8.0 V, Note 11nsOutput Clock Duty Cycle t OD1.5 V, up to 160 MHz4549-5155%PLL Bandwidth10kHzOutput Enable Time, OE high to outputon50ns Output Disable Time, OE low to tri-state 50ns Absolute Clock Period Jitter t ja Deviation from mean+70ps One Sigma Clock Period Jitter t js25psParameterSymbolConditionsMin.Typ.Max.UnitsThermal Resistance Junction to AmbientθJA Still air 150︒C/W θJA 1 m/s air flow 140︒C/W θJA 3 m/s air flow 120︒C/W Thermal Resistance Junction to Case θJC 40︒C/W Thermal Resistance Junction to Top of CaseψJTStill air20︒C/WParameterSymbolConditionsMin.Typ.Max.UnitsThermal Resistance Junction to AmbientθJA Still air95︒C/W Thermal Resistance Junction to CaseθJC48︒C/WPackage Outline and Package Dimensions (8-pin MSOP, 3.00 mm Body) Package dimensions are kept current with JEDEC Publication No. 95Package Outline and Package Dimensions (8-pin SOIC, 150 Mil. Narrow Body) Package dimensions are kept current with JEDEC Publication No. 95Ordering InformationPart / Order Number Marking Shipping Packaging Package Temperature 501MLF501MLF Tubes8-pin SOIC0 to +70︒ C501MLFT501MLF Tape and Reel8-pin SOIC0 to +70︒ C501MILF501MILF Tubes8-pin SOIC-40 to +85︒ C501MILFT501MILF Tape and Reel8-pin SOIC-40 to +85︒ C501GLF01GL Tubes8-pin MSOP0 to +70︒ C501GLFT01GL Tape and Reel8-pin MSOP0 to +70︒ C501GILF1GIL Tubes8-pin MSOP-40 to +85︒ C501GILFT1GIL Tape and Reel8-pin MSOP-40 to +85︒ C501-DWF-Die on uncut, probed wafers0 to +70︒ C501-DPK-Tested die in waffle pack0 to +70︒ C501E-DPK-Tested die in waffle pack0 to +70︒ C"LF" suffix to the part number are the Pb-Free configuration and are RoHS compliant.While the information presented herein has been checked for both accuracy and reliability, Integrated Device Technology (IDT) assumes no responsibility for either its use or for the infringement of any patents or other rights of third parties, which would result from its use. No other circuits, patents, or licenses are implied. This product is intended for use in normal commercial applications. Any other applications such as those requiring extended temperature range, high reliability, or other extraordinary environmental requirements are not recommended without additional processing by IDT. IDT reserves the right to change any circuitry or specifications without notice. IDT does not authorize or warrant any IDT product for use in life support devices or critical medical instruments.DISCLAIMER Integrated Device Technology, Inc. (IDT) and its affiliated companies (herein referred to as “IDT”) reserve the right to modify the products and/or specifications described herein at any time, without notice, at IDT’s sole discretion. Performance specifications and operating parameters of the described products are determined in an independent state and are not guaranteed to perform the same way when installed in customer products. The information contained herein is provided without representation or warranty of any kind, whether express or implied, including, but not limited to, the suitability of IDT's products for any particular purpose, an implied warranty of merchantability, or non-infringement of the intellectual property rights of others. This document is presented only as a guide and does not convey any license under intellectual property rights of IDT or any third parties.IDT's products are not intended for use in applications involving extreme environmental conditions or in life support systems or similar devices where the failure or malfunction of an IDT product can be reasonably expected to significantly affect the health or safety of users. Anyone using an IDT product in such a manner does so at their own risk, absent an express, written agreement by IDT.Corporate HeadquartersIntegrated Device Technology, For Sales800-345-7015408-284-8200Fax: 408-284-2775For Tech Support/go/supportInnovate with IDT and accelerate your future networks. Contact:。

阪上 SKY

HOME > 製品情報 > 油圧用パッキン > SKYパッキン製品一覧を見る特徴SKYパッキン最もポピュラーな油圧シリンダ用のパッキンです。

ピストンおよびロッド用のいずれにも使用でき、一体みぞに装着が可能のため部品点数の削減、コンパクト設計などコスト低減に効果を発揮します。

●パッキンは上図のように方向性があります。

装着方向にご注意ください。

●装着みぞの位置によっては一体みぞに装着できない場合があります。

その場合は分割みぞ構造にしてください。

●SKY-18未満は分割みぞにしてください。

●φD H9／f8は軸受方式により変わります。

ウェアリングまたはエスリーブ併用の場合は、各寸法表をご参照ください。

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SKYパッキン寸法表パッキンおよびみぞ寸法 (単位：mm）指示コードSKYパッキン併用バック（PT111）dDH G A G B D 1d 1 (参考)L標準（RN 906）耐熱用（RF 905）（RF 907）耐寒用（RN 903）HNBR (RP902)(RP903)10185 5.7 6.71710.431.5SKY- 0010001N906TBC- 0010007T111パッキンおよびみぞ寸法 (単位：mm）指示コードSKYパッキン併用バック（PT111）dDH G A G B D 1d 1 (参考)L標準（RN 906）耐熱用（RF 905）（RF 907）耐寒用（RN 903）HNBR (RP902)(RP903)12205 5.7 6.71912.43 1.5SKY- 0012001N906 TBC- 0012003T11112.5205 5.7 6.71912.93 1.5SKY-12.5TCS- 20×12.514225 5.7 6.72114.43 1.5SKY-14SKY-14F●●TCS- 22×1416245 5.7 6.72316.43 1.5SKY-16SKY-16F● TCS- 24×1617255 5.7 6.72417.43 1.5SKY- 0017001N906TCS- 25×1718265 5.7 6.72518.43 1.5SKY-18SKY-18F● TCS- 26×1820285 5.7 6.72720.43 1.5SKY-20SKY-20FSKY-20NTCS- 28×202030678.52920.43 1.5SKY- 0020001N906TBC- 0020006T11122305 5.7 6.72922.43 1.5SKY-22SKY-22F ●●TCS- 30×2222.4305 5.7 6.72922.83 1.5SKY-22.4SKY-22.4F ●●TCS- 30×22.423.531.55 5.7 6.730.523.93 1.5SKY-23.5SKY-23.5FTCS- 31.5×23.524325 5.7 6.73124.43 1.5SKY- 0024002N906TCS- 32×2425335 5.7 6.73225.43 1.5SKY-25SKY-25FSKY-25NTCS- 33×2526345 5.7 6.73326.43 1.5SKY- 0026001N906 TBC- 0026005T11127355 5.7 6.73427.43 1.5SKY- 0027001N906TCS- 35×272835.55 5.7 6.734.528.43 1.5SKY-28SKY-28FSKY-28N●●TCS- 35.5×2828365 5.7 6.73528.431.5SKY-28ATCS- 36×2830385 5.7 6.73730.5 3.53SKY- 0030001N906TBC- 0030005T1113040678.53930.5 3.53SKY-30SKY-30F SKY-30NTCS- 40×3031.541.5678.540.5323.53SKY-31.5SKY-31.5FTCS- 41.5×31.53242678.54132.5 3.53SKY-32TCS- 42×323545678.54435.5 3.53SKY-35SKY-35FSKY-35NTCS- 45×35併用バック（PT111）dDH G A G B D 1d 1 (参考)L標準（RN 906）耐熱用（RF 905）（RF 907）耐寒用（RN 903）HNBR (RP902)(RP903)35.545678.54436 3.53SKY-35.5SKY-35.5FSKY-35.5N●●TCS- 45×35.535.545.5678.544.5363.53SKY-35.5A TCS- 45.5×35.53646678.54536.5 3.53SKY-36SKY-36F●TCS- 46×363848678.54738.5 3.53SKY- 0038001N906TBC- 0038003T1114050678.54940.5 3.53SKY-40SKY-40F SKY-40N TCS- 50×404555678.55445.5 3.53SKY-45SKY-45F SKY-45N TCS- 55×454556789.55545.5 3.53SKY-45A SKY-45AF SKY-45AN ●●TCS- 56×455060678.55950.5 3.53SKY-50SKY-50F SKY-50NTCS- 60×505363678.56253.6 3.53SKY-53SKY-53FTCS- 63×535565678.56455.6 3.53SKY-55SKY-55F SKY-55NTCS- 65×555666678.56556.6 3.53SKY-56SKY-56F●●TCS- 66×565868678.56758.6 3.53SKY- 0058001N906TBC- 0058004T1116070678.56960.6 3.53SKY-60SKY-60F SKY-60NTCS- 70×606071789.57060.6 3.53SKY-60ASKY-60AFTCS- 71×606171678.57061.6 3.53SKY- 0061001N906TC-パッキン指示コード6373678.57263.6 3.53SKY-63SKY-63F SKY-63N ●TCS- 73×636575678.57465.6 3.53SKY-65SKY-65F SKY-65NTCS- 75×656777678.57667.6 3.53SKY-67SKY-67F●●TCS- 77×677080678.57970.6 3.53SKY-70SKY-70F SKY-70N●●TCS- 80×707180678.57971.6 3.53SKY-71SKY-71F●TCS- 80×717585678.58475.6 3.53SKY-75SKY-75F SKY-75N TCS- 85×758090678.58980.6 3.53SKY-80SKY-80FSKY-80N●●TCS- 90×80併用バック（PT111）dDH G A G B D 1d 1 (参考)L標準（RN 906）耐熱用（RF 905）（RF 907）耐寒用（RN 903）HNBR (RP902)(RP903)8595678.59485.6 3.53SKY- 0085002N906TBC- 0085001T11185100910129885.644SKY-85SKY-85FSKY-85N●●TCS- 100×85861008.59.511.59886.644SKY-86SKY-86FTCS- 100×86891049101210289.644SKY- 0089001N906 TBC- 0089001T11190100678.59990.644SKY- 0090001N906TBC- 0090013T111901059101210390.644SKY-90SKY-90F SKY-90N●TCS- 105×90951109101210895.644SKY-95SKY-95FTCS- 110×95961119101210996.644SKY- 0096001N906TBC- 0096001T111981128.59.511.511098.644SKY-98SKY-98FTCS- 112×9810011591012113100.644SKY-100SKY-100FSKY-100N●●TCS- 115×10010512091012118105.644SKY- 0105002N906TBC- 0105001T1111061208.59.511.5118106.644SKY-106SKY-106FSKY-106NTCS- 120×10611012591012123110.644SKY- 0110003N906●●TBC- 0110001T1111121258.59.511.5123112.644SKY-112SKY-112F TCS- 125×11211212591012123112.644SKY-112ASKY-112AF●●TCS- 125×1121151308.59.511.5128115.644SKY- 0115002N906SKY- 0115001N903 TBC- 0115002T1111181328.59.511.5130118.644SKY-118SKY-118FSKY-118NTCS- 132×1181191338.59.511.5131119.644SKY- 0119001N906 TBC- 0119001T11112013591012133120.644SKY- 0120002N906TBC- 0120001T11112514091012138125.644SKY-125SKY-125FSKY-125N●●TCS- 140×12513014591012143130.644SKY- 0130001N906TBC- 0130001T1111321458.59.511.5143132.644SKY-132SKY-132FTCS- 145×132併用バック（PT111）dDH G A G B D 1d 1 (参考)L標準（RN 906）耐熱用（RF 905）（RF 907）耐寒用（RN 903）HNBR (RP902)(RP903)1361508.59.511.5148136.644SKY-136SKY-136F TCS- 150×13614015591012153140.644SKY-140SKY-140F●●TCS- 155×14014516091012158145.644SKY-145SKY-145F SKY-145NTCS- 160×14515016591012163150.644SKY-150SKY-150F TCS- 165×15015517091012168155.644SKY-155SKY-155F TCS- 170×15516017591012173160.644SKY-160SKY-160F ●●TCS- 175×16016518091012178165.644SKY-165SKY-165FTCS- 180×16517018591012183170.644SKY- 0170001N906TBC- 0170001T11117519091012188175.644SKY-175SKY-175F TCS- 190×175180200121315.5198180.855SKY-180SKY-180F●●TCS- 200×180185205121315.5203185.855SKY- 0185001N906TBC- 0185001T111190*********.5208190.855SKY- 0190003N906SKY- 0190001F905 TBC- 0190004T111195215121315.5213195.855SKY- 0195001N906TBC- 0195006T111200*********.5218200.855SKY-200SKY-200F TCS- 220×200204224121315.5222204.855SKY-204SKY-204FTCS- 224×204210230121315.5228210.855SKY- 0210002N906SKY- 0210001F905 TBC- 0210004T111215235121315.5233215.855SKY- 0215001N906 TBC- 0215003T111220*********.5238220.855SKY- 0220001N906TBC- 0220003T111224244121315.5242224.855SKY-224SKY-224F TCS- 244×224230*********.5248230.855SKY-230SKY-230FTCS- 250×230235255121315.5253235.855SKY- 0235001N906 TBC- 0235001T111237257121315.5255237.855SKY- 0237001N906TC-パッキン指示コード併用バック（PT111）dDH G A G B D 1d 1 (参考)L標準（RN 906）耐熱用（RF 905）（RF 907）耐寒用（RN 903）HNBR (RP902)(RP903)240260121315.5258240.855SKY- 0240003N906SKY- 0240001F905 TBC- 0240001T111245265121315.5263245.855SKY- 0245001N906TBC- 0245004T111250*********.5268250.855SKY-250SKY-250FTCS- 270×250260280141518278260.855SKY-260SKY-260F TCS- 280×260280300141518298280.855SKY-280SKY-280FTCS- 300×280290310141518308290.855SKY- 0290001N906TBC- 0290001T111295315141518313295.855SKY-295SKY-295FTCS- 315×295300320121316318300.855SKY- 0300003N906 TBC- 0300003T11131033014151832831155SKY- 0310001N906 TBC- 0310002T11131533514151833331655SKY-315 TCS- 335×31533535514151835333655SKY-335 TCS- 355×33535537514151837335655SKY-355TCS- 375×35538040014151839838155SKY-380SKY-380FTCS- 400×38040042014151841840155SKY-400 TCS- 420×40043045014151844843155SKY-430 TCS- 450×43045047014151846845155SKY-450 TCS- 470×45048050014151849848155SKY-480 TCS- 500×48050052517182152250155SKY- 0500001N906 TBC- 0500002T11154056014151855854155SKY- 0540001N906 TBC- 0540001T11155057013141756855155SKY- 0550001N906 TBC- 0550001T11161063014151862861155SKY- 0610001N906 TBC- 0610001T11163065517182165263155SKY- 0630001N906TBC- 0630001T111併用バック（PT111）dDH G A G B D 1d 1 (参考)L標準（RN 906）耐熱用（RF 905）（RF 907）耐寒用（RN 903）HNBR (RP902)(RP903)66069018192268766155SKY- 0660001N906 TC-パッキン指示コード77080018192279777155SKY- 0770001N906TC-パッキン指示コード≪2012年5月更新≫★ご注文・お問い合わせは、指示コードにてご指示ください。

Poly Edge E500系列IP办公电话数据手册说明书

DATA SHEET POLY EDGE E500 SERIES IP DESK PHONESIt’s time for a desk phone that makes hybrid work easy. The Poly Edge E500 Series with twelve-line keys offers more ways to connect, plus unbelievable audio, in a seriously sharp package. Built for hot-desking or the home office, these phones provide simple mobile phone pairing, plus bring together Poly’s famous noise reduction technology and a cutting-edge design for the perfect user experience. Our most versatile phones to date, the Poly Edge E500 Series is packed with features you didn’t even know you needed, like text-to-speech and antimicrobial protection. No matter what size your business, this is the phone that upgrades your office with style, bringing your organization into the future.• 12-line keys supporting up to 48 lines, features, and contacts.• Integrated Bluetooth® 5.0 for mobile phone or headset pairing (E550).• Poly NoiseBlockAI and Poly Acoustic Fence technologies.• Signature Poly HD voice and bass-frequency-enhancing speaker design.• Large 5” color IPS LCD display.CUTTING-EDGE EXPERIENCEBENEFITS• Stay informed with style with the surround light status indicator with RGB mixing.• Improved accessibility with text-to-speech feature, screen color adjustments for color blindness and bigger font settings.• Add your choice of devices, with USB ports for expansion modules, headsets, or charging devices.• Turn your Poly Edge E500 series phone into an attendant console by adding up to two Poly Edge E Expansion Modules.• Easy to install in home offices or hard to cable locations with includedWi-Fi (E550).POLY EDGE E500SERIESPOLY EDGE E500POLY EDGE E550IDEAL FOR Executives and enterprise professionalsworking from the office Executives and enterprise professionals working from the office or home officeLINE KEYS1212LINES, CONTACTS12 displayed / 48 supported12 displayed / 48 supported PAIRING BLUETOOTH® HEADSET AND MOBILE PHONE No YesWI-FI No Yes SPECIFICATIONSLINES / FEATURE KEYS• 12-line keys supporting up to 48-line key assignments for lines, contacts, and features supported with pagination • 4 context-sensitive “soft” keys• 4-way navigation key cluster with center “Select” key• Home and back feature keys• Pagination key for additional lines/ contacts• Volume + / - control keys• Hold and Transfer keys• Headset select key• Speakerphone select key• Mute key (illuminated when muted)• Voicemail key• Up to two Poly Edge E Expansion modules are supported for addition line keys – order separatelyUSER INTERFACE FEATURES• Color 5” IPS LCD primary display (800x480 pixel resolution)• Voicemail support1• WebKit-based browser• Two position desk stand (an optional wall mount kit can be ordered separately)• Unicode UTF-8 character support• Two USB Type-C ports (2.0 compliant) for media, storage applications, headset, expansion module and future video camera connectivity • Surround Lighting for the statusindicator (RGB with color mixing)• Integrated Bluetooth 5.0 (Edge E550model only)• NFC Support• Multilingual user interface including2Arabic (UAE), Chinese (Traditional/Simplified), Czech, Danish, Dutch,English (Canada/ US/UK), French(France/Canadian), German, Hungarian,Italian, Japanese, Korean, Norwegian,Polish, Portuguese, Romanian, Russian,Slovenian, Spanish, and SwedishAUDIO FEATURES• Poly HD Voice technology deliverslifelike voice quality for each audio path:handset, hands-free speakerphone, andoptional headset• Poly Acoustic Clarity technologyprovides full duplex conversations,acoustic echo cancellation, andbackground noise suppression• Poly Acoustic Fence technologyeliminates background noise when usinga handset or wired headset• Poly NoiseBlockAI technology removesmost background noise when using thespeakerphone• Poly Computer Audio Connector appinstalled on your PC (Windows only)enables selecting your phone for PCaudio in/out to use the phones handset,optional headset and handsfreespeakerphone with PC applications• Bass frequency enhancing design• Frequency response—150 Hz-14 kHz forhandset, optional headset and handsfreespeakerphone modes• Codecs: G.711 (A-law and μ-law),G.729AB, G.722 (H400 Voice), G.722.1,iLBC, OPUS• TIA-920 wideband audio, type 1compliant (IEEE 1329 full duplex)• Individual volume settings with visualfeedback for each audio path• Voice activity detection• Comfort noise generation• DTMF tone generation (RFC 2833 andin-band)• Low delay audio packet transmission• Adaptive jitter buffersPACKET LOSS CONCEALMENT HEADSETAND HANDSET COMPATIBILITY• Dedicated RJ-9 headset port• Hearing aid compatibility to ITU-T P.370and TIA 504A standards• Compliant with ADA Section 508Subpart B 1194.23 (all)• Hearing aid compatible (HAC) handsetfor magnetic coupling to hearing aids• Compatible with commercially availableTTY adapter equipment• USB headset support (USB Type-C)BLUETOOTH HEADSET SUPPORT (E550) CALL HANDLING FEATURES¹• Enhanced Feature Keys make powerful feature shortcuts online key appearances or soft keys• Shared call/bridged line appearance • Busy Lamp Field (BLF)• Flexible line appearance (1 or more-line keys can be assigned for each line extension)• Distinctive incoming call treatment/call waiting• Call timer and call waiting• Call transfer, hold, divert (forward), park, pickup• Called, calling, connected party information• Local 3-way audio conferencing• 1-touch speed dial, redial• Remote missed call notification• Do not disturb function• Reverse Number Lookup via LDAP• Calling Party Identification (RFC8225 classifications—Trusted, Unknown, SPAM)• Electronic hook switch capable• Local configurable digit map/dial plan OPEN APPLICATION PLATFORM• WebKit-enabled full browser that supports HTML5, CSS, SSL security, and JavaScript• Supports Polycom Apps SDK and API for third-party business and personal applications• NFC-enabled Edge E series phones allow third-party applications to read serial number and other device information that can be useful in application development such as guest login for phone hoteling or Bluetooth pairing1• Corporate directory access using LDAP • Visual Conference Management NETWORK AND PROVISIONING• SIP Protocol Support• SDP• IETF SIP (RFC 3261 and companion RFCs)• Two-port gigabit Ethernet switch10/100/1000Base-TX across LAN andPC ports-Conforms to IEEE802.3-2005 (Clause40) for Physical media attachment-Conforms to IEEE802.3-2002 (Clause28) for link partner auto-negotiation• Manual or dynamic host configurationprotocol (DHCP) network setup• Time and date synchronization usingSNTP• FTP/FTPS/TFTP/HTTP/HTTPS serverbased central provisioning for massdeployments• Provisioning and call server redundancysupported1• QoS Support–IEEE 802.1p/Q tagging(VLAN), Layer 3 TOS, and DHCP• VLAN—CDP, DHCP VLAN discovery,LLDP-MED for VLAN discovery• Network Address Translation (NAT) —support for static configuration and• “Keep-Alive” SIP signaling• RTCP and RTP support• Event logging• Syslog• Hardware diagnostics• Status and statistics reporting• IPv4, IPv6, dual stack (IPv4/IPv6) mode• TCP• UDP• DNS-SRV• Wi-Fi network connectivity (EDGEE550)4- 2.4-2.4835 GHz (802.11b, 802.11g,802.11n HT-20)- 5.15-5.825 GHz (802.11a, 802.11nHT-20,802.11n HT-40, 802.11ac)SECURITY• 802.1X authentication• SRTP media encryption using AES-256• Transport Layer Security (TLS)• Encrypted configuration files• Digest authentication• Password login• Support for URL syntax with passwordfor boot server address• HTTPS secure provisioning• Support for signed software executables• Wi-Fi encryption: WEP, WPA-Personal,WPA2-Personal, WPA2-Enterprise with802.1X (EAP-TLS, PEAP-MSCHAPv2)POWER• Built-in auto sensing IEEE 802.3afPower over Ethernet (Class 4) 13 W(Max)• External Universal AC/DC Adapter**********(25W)-powersupplyunit (PSU) sold separately4• ENERGY STAR® ratedSAFETY• UL 62368-1• CAN/CSA C22.2 No. 62368-1-14• EN 60950-1/62368-1• IEC 60950-1 and IEC 62368-1• AS/NZS 60950.1/62368.1REGULATORY APPROVALS (POLY EDGEE500)³• FCC Part 15 (CFR 47) Class B• ICES-003 Class B• EN55032 Class B• CISPR32 Class B• VCCI Class B• EN55024• EN61000-3-2; EN61000-3-3• UK - UKCA• NZ Telepermit• UAE TRA• Eurasian Customs Union EAC• Brazil ANATEL• Australia RCM• South Africa ICASA• Saudi Arabia CITC• Indonesia SDPPI• S.Korea KC• Mexico NOM ANCE• RoHS Compliant• CE Mark• TAADATA SHEETLEARN MOREFor more information on Poly Edge E500 Series visit /edge-e500DATA SHEETREGULATORY APPROVALS (POLY EDGE E550)³• Argentina ENACOM • Australia RCM • Brazil ANATEL • Canada ICES • China SRRC • China RoHS 2.0• EEA CE Mark• Eurasian Customs Union EAC • India WPC • Indonesia SDPPI • Israel MOC• Japan MIC and VCCI • Malaysia SIRIM• Mexico IFETEL and NYCE • NZ Telepermit • Saudi Arabia CITC • Singapore IMDA • South Africa ICASA • South Korea KC • Taiwan NCC • UAE TRA • UK - UKCA • USA FCCRADIO (POLY EDGE E550)• USA–FCC Part 15.247 & FCC Part 15.407 • Canada–RSS 247 Issue 2• EU–ETSI EN 300 328 & ETSI EN 301 893 • Japan–Article 2.1 Item 19-2 and 19-3 • Australia - AS/NZS 4268EMC (POLY EDGE E550)• FCC Part 15 Class B • ICES-003 Class B • EN 55032 Class B • EN 55024• EN 301 489-1 and EN 301 489-3 and EN 301 489-17• CISPR32 Class B • VCCI Class BOPERATING CONDITIONS• Temperature: 0 to 40°C (+32 to 104° F)• Relative humidity: 5% to 95%, noncondensing STORAGE TEMPERATURE • -40 to +70° C (-40 to +160° F)POLY EDGE E500 AND EDGE E550 PHONES COME WITH• Console with Microban ® Antimicrobial protection • Handset with Microban ®Antimicrobial protection• Handset cord• Network (LAN) cable—CAT-5E • Desk Stand • Setup SheetPOLY EDGE E500 AND EDGE E550 UNIT BOX DIMENSIONS (L X W X D) / WEIGHT • Box dimension : 25.6 x 33.8 x 8.8 (cm) ; 10 x 13.3 x 3.5 (inches)• Box weight: 1.08kg/2.4lbs (withproduct, accessories, and documents)MASTER CARTON QUANTITY • 10PART NUMBERS - PHONES • 2200-87855-025POLY EDGE E500 IP PHONE • 2200-87050-025POLY EDGE E550 IP PHONE COUNTRY OF ORIGIN • ChinaPART NUMBERS - ACCESSORIES • 2200-87020-025POLY EDGE E EXPANSION MODULE • 2200-49760-001CCX 500/600/700,EDGE E500,PSU,48V/0.52A,NA • 2200-49760-002CCX 500/600/700,EDGE E500,PSU,48V/0.52A,JP • 2200-49760-012CCX 500/600/700,EDGE E500,PSU,48V/0.52A,AU • 2200-49760-016CCX 500/600/700,EDGE E500,PSU,48V/0.52A,KR • 2200-49760-022CCX 500/600/700,EDGE E500,PSU,48V/0.52A,CN • 2200-49760-036CCX 500/600/700,EDGE E500,PSU,48V/0.52A,IN • 2200-49760-102CCX 500/600/700,EDGE E500,PSU,48V/0.52A,UK • 2200-49760-122CCX 500/600/700,EDGE E500,PSU,48V/0.52A,EU • 2200-49760-212CCX 500/600/700,EDGE E500,PSU,48V/0.52A,BZ WARRANTY• 1-year limited warranty1 M ost software-enabled features andcapabilities must be supported by the server. Please contact your IP PBX/Softswitch vendor or service provider for a list of supported features.2 Planned localizations 3 Planned compliances4 O rdering an optional power supply unit will be necessary if not powered over Ethernet with PoE (i.e. Using Wi-Fi for network)©2023 Poly. All trademarks are the property of their respective owners. The Bluetooth trademark is owned by Bluetooth SIG, Inc. and any use of the mark by Poly is under license. 4.23 1836606。

UPG501中文资料

FEATURES• WIDE OPERATING FREQUENCY RANGE:f IN = 1.5 GHz to 5 GHz (T A = 25°C)•SINGLE SUPPLY VOLTAGE: V DD = +10 V•DIVISION RATIO OF 4•HIGH RELIABILITY HERMETICALLY SEALED PACKAGE•GUARANTEED PERFORMANCE OVER AN AMBIENT TEMPERATURE RANGE: -25°C to +75°CPART NUMBER UPG501B PACKAGE OUTLINEBF08SYMBOLSPARAMETERS AND CONDITIONSUNITS MIN TYP MAX I DD Supply CurrentmA 507090f IN(U)Upper Limit of Input Frequency GHz 5.05.3f IN(L)Lower Limit of Input Frequency GHz 0.71.5P INInput Power,f IN = 4.5 to 5 GHz dBm 10.013.0f IN = 1.5 to 4.5 GHz dBm 6.013.0P OUT Output Power at f IN = 5 GHzdBm -1.02.0R TH(CH-C)Thermal Resistance (Channel to Case)°C/W16ELECTRICAL CHARACTERISTICS (T A = -25°C to +75°C, V DD = 10 V, V GG = Open)DESCRIPTIONThe UPG501B is a GaAs divide-by-4 prescaler that is capableof operating up to 5 GHz. It is intended to be used in frequency synthesizers of microwave communications systems and measurement equipment. The UPG501B is a static divider with two (2) master-slave D-type flip-flops using Source-Coupled-FET-Logic (SCFL). It operates from a single supply voltage. The UPG501B is housed in a hermetically sealed 8-lead ceramic flat package that is easy to use and provides high reliability.INPUT POWER vs. INPUT FREQUENCY0 1 2 3 4 5 6 7+20+15+10+50-5-10-15-20Input Frequency, f (GHz)I n p u t P o w e r , P I N (d B m )California Eastern Laboratories元器件交易网SYMBOLSPARAMETERS UNITS RATINGS V DD Supply Voltage V +12I DD Supply CurrentmA 150P T Total Power Dissipation 2W 1.5P IN Input PowerdBm +20T OP Operating Temperature °C -65 to +125T STGStorage Temperature°C-65 to +175Notes:1. Operation in excess of any one of these conditions may result in permanent damage.2. T C ≤ 125°CABSOLUTE MAXIMUM RATINGS 1 (T A = 25°C)UPG501BTEST CIRCUITTYPICAL PERFORMANCE CURVES (T A = 25°C)Note: Because of the high internal gain and gain compression of theUPG501B, the device is subject to self-oscillation in the absence of an RF input signal. This self-oscillation can be suppressed by either of the following means:• Add a shunt resistor to the RF input line. Typically a resistor value between 50 and 1000 ohms will suppress the self-oscillation (see the test circuit).• Apply a negative voltage through a 1000 ohm resistor to the normally open VGG connection. Typically voltages between 0 and -9 volts will suppress the self-oscillation.Both of these approaches will reduce the input sensitivity of the device (by as much as 3 dB for a 50 ohm shunt resistor), but otherwise have no effect on the reliability or other electrical characteristics of the device.101001K10K100KOffset from Carrier (Hz)S S B P h a s e N o i s e (d B c /H z )-70-80-90-100-110-120-130-140-150-1601MSSB PHASE NOISE vs.OFFSET FROM CARRIER f IN = 3.41 GHz, T A = 25°C+20+15+10+50-5-10-15-201234567Input Frequency, f IN (GHz)O u t p u t P o w e r , P O U T (d B m )OUTPUT POWER vs. INPUT FREQUENCYCase Temperature, T C (°C)T o t a l P o w e r D i s s i p a t i o n , P T (W )0 50 100 110 150 200 2502.52.01.51.00.5OUTLINE DIMENSIONS (Units in mm)UPG501BPACKAGE OUTLINE BF08LEADCONNECTIONS:5.INPUT 6.V GG 7.NC*8.GNDFLANGE, GND 1.OUTPUT 2.NC*3.NC*4.V DDPOWER DERATING CURVE* No connectionOUTV EXCLUSIVE NORTH AMERICAN AGENT FOR RF, MICROWAVE & OPTOELECTRONIC SEMICONDUCTORS• Headquarters • 4590 Patrick Henry Drive • Santa Clara, CA 95054-1817 • (408) 988-3500 • Telex 34-6393 • FAX (408) 988-0279PRINTED IN USA ON RECYCLED PAPER -4/97DATA SUBJECT TO CHANGE WITHOUT NOTICE元器件交易网。

IH5014MPE中文资料

Features •Switches Analog Signals Up to 20 Volts Peak-to-Peak •Each Channel Complete - Interfaces with MostIntegrated Logic •Switching Speeds Less Than 0.5µs •I D(OFF) Less Than 500pA Typical at 70o C •Effective r DS(ON) - 5Ω to 50Ω•Commercial and Military Temperature Range OperationDescription The IH5009series of analog switches were designed to ﬁll the need for an easy-to-use,inexpensive switch for both industrial and military applications.Although low cost is a primary design objective,performance and versatility have not been sacriﬁced.Each package contains up to four channels of analog gating and is designed to eliminate the need for an external driver.The odd numbered devices are designed to be driven directly from TTL open collector logic (15volts)while the even numbered devices are driven directly from low level TTL logic (5volts).Each channel simulates a SPDT switch.SPST switch action is obtained by leaving the diode cathode unconnected;for SPDT action,the cathode should be grounded (0V).The parts are intended for high performance multiplexing and commutating usage.A logic “0”turns the channel ON and a logic “1” turns the channel OFF .Part Number InformationPART NUMBER CHANNELSLOGIC LEVEL PACKAGE PKG NO.IH50094+15DD, PD IH50104+5DD, PD IH50114+15DE, PE IH50124+5DE, PE IH50143+5DD, PD IH50163+5DE, PE IH50172+15PA IH50182+5DD, PA IH50192+15DE, PA IH50202+5DE, PA IH50221+5DD, PA IH50241+5PANOTE:Mil-Temperature range (-55o C to 125o C)available in ceramicpackages only.IH50XXMDEPACKAGEPA -8 LEAD PDIP PD -14 LEAD PDIP PE -16 LEAD PDIP DD -14 LEAD CERDIP DE -16 LEAD CERDIP TEMPERATURE RANGEM =MILITARY (-55o C to 125o C)C =COMMERCIAL (0o C to 70o C)BASIC PART NUMBERMay 1999CAUTION: These devices are sensitive to electrostatic discharge. Users should follow proper IC Handling Procedures.IH5009-5012, 5014,5016-5020, 5022, 5024Virtual Ground Analog Switch File Number3129.1O B S O L E T E P R O D U C T N O R E C O M M E N D E D RE P L A C E M E N T C a l l C e n t r a l A p p l i c a t i o n s1-800-442-7747o r e m a i l: c e n t a p p @h a r r i s .c o m元器件交易网Functional Diagrams (Numbers in brackets refer to CERDIP Packages)IH5009, IH5010(14 LEAD CERDIP, 14 LEAD PDIP)IH5011, IH5012(16 LEAD CERDIP, 16 LEAD PDIP)IH5014(14 LEAD CERDIP, 14 LEAD PDIP)IH5016(16 LEAD CERDIP, 16 LEAD PDIP)IH5017 (8 LEAD PDIP)IH5018 (8 LEAD PDIP, 14 LEAD CERDIP)IH5019, IH5020(8 LEAD PDIP, 16 LEAD CERDIP)IH5022(8 LEAD PDIP, 14 LEAD CERDIP)IH5024(8 LEAD PDIP)Absolute Maximum Ratings Thermal InformationPositive Analog Signal Voltage. . . . . . . . . . . . . . . . . . . . . . . . . .30V Negative Analog Signal Voltage. . . . . . . . . . . . . . . . . . . . . . . . .-15V Diode Current. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .10mA Power Dissipation (Note) . . . . . . . . . . . . . . . . . . . . . . . . . . .500mW Operating ConditionsTemperature Range5009C Series . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .0o C to 70o C 5009M Series . . . . . . . . . . . . . . . . . . . . . . . . . . . .-55o C to 125o C Maximum Storage Temperature Range . . . . . . . . . .-65o C to 150o C Maximum Lead T emperature (Soldering 10s). . . . . . . . . . . . .300o CCAUTION:Stresses above those listed in“Absolute Maximum Ratings”may cause permanent damage to the device.This is a stress only rating and operation of the device at these or any other conditions above those indicated in the operational sections of this speciﬁcation is not implied.NOTE:Dissipation rating assumes device is mounted with all leads welded or soldered to printed circuit board in ambient temperature below 75o C. For higher temperature, derate at rate of 5m/W o C.Electrical Speciﬁcations(Per Channel)PARAMETER (NOTE 1)SYMBOL(NOTE 4)TESTCONDITIONS(NOTE 2)TYPE-55o C (M)0o C (C)MIN/MAX25o C125o C(M)70o C (C)MIN/MAX UNITSTYP MIN/MAXInput Current-ON I IN(ON)ALL V IN = 0V, I D = 2mA-0.01±0.5100µA Input Current-OFF I IN(OFF)5V Logic Ckts V IN = +4.5V,V A =±10V-0.04±0.520nAInput Current-OFF I IN(OFF)15V Logic Ckts V IN = +11V,V A =±10V-0.04±0.520nAChannel ControlVoltage-ONV IN(ON)5V Logic Ckts Note 30.5-0.50.5VChannel ControlVoltage-ONV IN(ON)15V Logic Ckts Note 3 1.5- 1.5 1.5VChannel ControlVoltage-OFFV IN(OFF)5V Logic Ckts Note 3-- 4.5 4.5VChannel ControlVoltage-OFFV IN(OFF)15V Logic Ckts Note 3--11.011.0VLeakage Current-OFF I D(OFF)5V Logic Ckts V IN = +4.5V,V A =±10V-0.02±0.520nALeakage Current-OFF I D(OFF)15V Logic Ckts V IN = +11V,V A =±10V-0.02±0.520nALeakage Current-ON I D(ON)5V Logic Ckts V IN = 0V, I S = 1mA-0.30±1.01000 (M)200 (C)nALeakage Current-ON I D(ON)15V Logic Ckts V IN = 0V, I S = 1mA-0.10±0.5500 (M)100 (C)nA Leakage Current-ON I D(ON)5V Logic Ckts V IN = 0V, I S = 2mA-- 1.010µA Leakage Current-ON I D(ON)15V Logic Ckts V IN = 0V, I S = 2mA-- 2.0100µADrain-Source ON-Resistance r DS(ON)5V Logic Ckts I D = 2mA, V IN = 0.5V150******** (M)240 (C)ΩDrain-Source ON-Resistance r DS(ON)15V Logic Ckts I D = 2mA, V IN = 1.5V10080100250 (M)160 (C)ΩTurn-ON Time t(ON)All-150500-ns Turn-OFF Time t(OFF)All-300500-ns Cross Talk CT All f = 100Hz-120--dB NOTES:1.(OFF) and (ON) subscript notation refers to the conduction state of the FET switch for the given test.2.Refer to Figure 1 for definition of terms.3.V IN(ON) and V IN(OFF) are test conditions guaranteed by the tests of r DS(ON)and I D(OFF) respectively.4.“5V Logic CKTS” applies to even-numbered devices. “15V Logic CKTS” applies to odd-numbered devices.。

MDP01中文资料

Thick Film Resistor Networks, Dual-In-Line,Molded DIP, 01, 03, 05 Schematics For technical questions contact: ff2aresistors@Document Number: 31511MDP 01, 03, 05Vishay DaleFEATURES•0.160" [4.06 mm] maximum seated height and rugged, molded case construction •Thick film resistive elements•Low temperature coefficient (- 55 °C to + 125 °C)± 100 ppm/°C•Reduces total assembly costs•Compatible with automatic insertingþequipment •Wide resistance range (10 Ω to 2.2 M Ω)•Uniform performance characteristics •Available in tube pack•Lead (Pb)-free version is RoHS compliant* For resistor power ratings at + 25 °C see derating curves ** Tighter tracking available*** ± 1 % and ± 5 % tolerences available on requestSTANDARD ELECTRICAL SPECIFICATIONSGLOBAL MODEL/NO. OF PINS SCHEMATICRESISTOR POWER RATING Max. AT 70 °CWRESISTANCE RANGEΩSTANDARD TOLERANCE± %TEMPERATURE COEFFICIENT (- 55 °C to + 125 °C)ppm/°C TCR TRACKING**(- 55 °C to + 125 °C)ppm/°CWEIGHTg MDP 140103050.125 0.2500.12510 - 2.2M 10 - 2.2M Consult factory± 2 (± 1, ± 5)***± 100± 50± 50± 100 1.3MDP 160103050.125 0.2500.12510 - 2.2M 10 - 2.2M Consult factory± 2 (± 1, ± 5)***± 100± 50± 50± 1001.5Document Number: 31511For technical questions contact: ff2aresistors@MDP 01, 03, 05Thick Film Resistor Networks, Dual-In-Line,Molded DIP , 01, 03, 05 SchematicsVishay DaleDIMENSIONS in inches [millimeters]GLOBAL MODEL A B C MDP 140.750 [19.05]0.600 [15.24]6MDP 160.850 [21.59]0.700 [17.78]7TECHNICAL SPECIFICATIONSPARAMETERUNIT MDP14MDP16Package Power Rating (Maximum at + 70 °C)W 1.731.92Voltage Coefficient of Resistance V eff < 50 ppm typicalDielectric Strength VAC 200Insulation Resistance Ω> 10 000M minimumOperating T emperature Range °C - 55 to + 125Storage T emperature Range°C- 55 to + 150MECHANICAL SPECIFICATIONSMarking Resistance to Solvents:Permanency testing per MIL-STD-202, Method 215Solderability:Per MIL-STD-202, Method 208EBody:Molded epoxy T erminals:Solder plated leadsWeight:14 pin = 1.3 grams; 16 pin = 1.5 grams For technical questions contact: ff2aresistors@Document Number: 31511MDP 01, 03, 05Vishay DaleThick Film Resistor Networks, Dual-In-Line,Molded DIP , 01, 03, 05 SchematicsStandard E-24 resistance values stocked. Consult factoryIMPEDANCE CODESCODE R1(Ω) R2(Ω)CODE R1(Ω) R2(Ω)500B 82130141A 270270750B 120200181A 330390800C 130210191A 330470990A 160260221B 330680101C 180240281B 560560111C 180270381B 560 1.2K 121B 180390501C 620 2.7K 121C 220270102A 1.5K 3.3K 131A220330202B3K6.2KMDP 01, 03, 05Thick Film Resistor Networks, Dual-In-Line,Molded DIP , 01, 03, 05 SchematicsVishay DaleDocument Number: 31511For technical questions contact: ff2aresistors@PERFORMANCETESTCONDITIONSMAX. ΔR(Typical Test Lots)Power Conditioning 1.5 rated power, applied 1.5 hours “ON” and 0.5 hour “OFF” for 100 hours ± 4 hours at + 25 °C ambient temperature ± 0.50 % ΔR Thermal Shock 5 cycles between - 65 °C and + 125 °C ± 0.50 % ΔR Short Time Overload 2.5 x rated working voltage 5 seconds± 0.25 % ΔR Low Temperature Operation 45 minutes at full rated working voltage at - 65 °C ± 0.25 % ΔR Moisture Resistance 240 hours with humidity ranging from 80 % RH to 98 % RH± 0.50 % ΔR Resistance to Soldering Heat Leads immersed in + 350 °C solder to within 1/16" of device body for 3 seconds± 0.25 % ΔR Shock T otal of 18 shocks at 100 G's± 0.25 % ΔR Vibration 12 hours at maximum of 20 G's between 10 and 2000 Hz± 0.25 % ΔR Load Life 1000 hours at + 70 °C, rated power applied 1.5 hours “ON, 0.5 hour “OFF” for full 1000 hour period. Derated according to the curve.± 1.00 % ΔR T erminal Strength 4.5 pound pull for 30 seconds ± 0.25 % ΔRInsulation Resistance10 000 Megohm (minimum)-Dielectric Withstanding VoltageNo evidence of arcing or damage (200 VRMS for 1 minute)-Disclaimer Legal Disclaimer NoticeVishayAll product specifications and data are subject to change without notice.Vishay Intertechnology, Inc., its affiliates, agents, and employees, and all persons acting on its or their behalf (collectively, “Vishay”), disclaim any and all liability for any errors, inaccuracies or incompleteness contained herein or in any other disclosure relating to any product.Vishay disclaims any and all liability arising out of the use or application of any product described herein or of any information provided herein to the maximum extent permitted by law. The product specifications do not expand or otherwise modify Vishay’s terms and conditions of purchase, including but not limited to the warranty expressed therein, which apply to these products.No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this document or by any conduct of Vishay.The products shown herein are not designed for use in medical, life-saving, or life-sustaining applications unless otherwise expressly indicated. Customers using or selling Vishay products not expressly indicated for use in such applications do so entirely at their own risk and agree to fully indemnify Vishay for any damages arising or resulting from such use or sale. Please contact authorized Vishay personnel to obtain written terms and conditions regarding products designed for such applications.Product names and markings noted herein may be trademarks of their respective owners.元器件交易网Document Number: 。

SN960_2004-05_e

1 Field of application- Longitudinal internal cracks...........................................................................................................................................33 - 373 Defect classificationThe material defects are classified in defect classes 1 to 5 with increasing defect sizes.Defect classes 4 and 5 are not relevant for products of SMS Demag.4 Printing of chartsThe use of a colour printer is recommended in order to obtain a good quality of the chart printouts.5 Preparation of samples for macro etchingThe samples are taken from the slabs at right angles to the direction of casting. The sample surface to be inspected is finely ground to a surface roughness of approx. 60 µm (coarseness of emery paper 240).6 Inspection methods6.1 Unalloyed and low-alloy carbon steels6.1.1 Pickling with hydrochloric acidThis method is used for the inspection of smaller samples.Composition:100 cm3 of distilled water H2O100 cm3 of hydrochloric acid HClTemperature: 75 °C – 80 °CEtching time: approx. 15 minutesThe etching agent is heated to a temperature between 75 and 80 °C and is kept at this temperature during inspection. For every sample a freshly prepared solution is used. The quantity used shall be such that there is no build-up of etching remainders on the surface to be inspected.Continued on pages 2 to 37Bearbeitet: Normung The reproduction, distribution and utilization of this document as well as the disclosure of its content to otherswithout prior explicit written consent of SMS Demag AG is prohibited. Holder has to protect this documentagainst unauthorized withdrawal of third parties. Offenders will be held liable for the payment of damages.All rights reserved in case of patent/utility model/trademark protection.04.04Page 2SN 960 : 2004-056.1.2 Copper-ammonium-chloride methodThis method is used for large samples.Composition:100 cm3 of distilled water H2O100 cm3 of alcohol3 cm3 of hydrochloric acid HCl0.2 g of cupric chloride3 g of ferric chloride0.1 g of stannous chlorideTemperature: room temperature approx. 20 °CEtching time: approx. 1 to 3 minutesThe inspection of the sample takes place at room temperature. The quantity used shall be such that there is no build-up of etching remainders on the surface to be inspected.During etching a Cu film deposits on the surface; this film shall be removed using a soft brush or a cloth. After 3 to 10 repetitions a sufficient degree of surface attack will have been attained to enable evaluation of the samples.6.2 Stainless and acid-resistant steels and high-alloy heat-resistant steels6.2.1 Pickling with hydrochloric acidEtching agent and method of preparation are the same as under item 6.1.1.6.2.2 Deep etching for stainless and acid-resistant steelsDeep etching is used for detecting the primary structure and the volume of segregation in stainless and acid-resistant steel. Composition:100 cm3 of distilled water H2O100 cm3 of hydrochloric acid HCl25 cm3 of nitric acid HNO3Temperature: 70 °CEtching time: approx. 5 minutesBetter contrast can be achieved by occasional rubbing with a cotton-wool pad over the polished section during etching.7 Post-treatment of samplesUpon etching, the samples are immediately rinsed in running water to remove adherent etching remainders. When samples are to be stored for a longer time, neutralising of the samples in alkaline solutions, subsequent rinsing with alcohol and drying are recommendable.Reference:Mannesmann standard chart and sample guideMannesmann AG HüttenwerkeAbteilung Qualitätsstellen (depts. of quality control)Today:Hüttenwerke Krupp Mannesmann GmbHReferenced standardsNoneDEFECT TYPE :SPOT-SHAPED INCLUSIONS ArrayDEFECT CLASSIFICATION: CLASS 1Page 3SN 960 : 2004-05DEFECT TYPE :SPOT-SHAPED INCLUSIONS DEFECT CLASSIFICATION: CLASS 2Page 4 SN 960 : 2004-05DEFECT TYPE :SPOT-SHAPED INCLUSIONS ArrayDEFECT CLASSIFICATION: CLASS 3Page 5SN 960 : 2004-05DEFECT TYPE :SPOT-SHAPED INCLUSIONS DEFECT CLASSIFICATION: CLASS 4Page 6 SN 960 : 2004-05DEFECT TYPE :SPOT-SHAPED INCLUSIONS ArrayDEFECT CLASSIFICATION: CLASS Page 7SN 960 : 2004-05DEFECT TYPE :CLOUD-SHAPED INCLUSIONS DEFECT CLASSIFICATION: CLASS 1Page 8 SN 960 : 2004-05DEFECT TYPE :CLOUD-SHAPED INCLUSIONSDEFECT CLASSIFICATION: CLASS 2Page 9SN 960 : 2004-05DEFECT TYPE :CLOUD-SHAPED INCLUSIONS DEFECT CLASSIFICATION: CLASS 3Page 10 SN 960 : 2004-05CLOUD-SHAPED INCLUSIONS ArrayDEFECT CLASSIFICATION: CLASS 4Page 11SN 960 : 2004-05DEFECT CLASSIFICATION: CLASS 5CENTRE SEGREGATION AND CORE UNSOUNDNESS ArrayDEFECT CLASSIFICATION: CLASS 1Page 13SN 960 : 2004-05DEFECT CLASSIFICATION: CLASS 2CENTRE SEGREGATION AND CORE UNSOUNDNESS ArrayDEFECT CLASSIFICATION: CLASS 3Page 15SN 960 : 2004-05DEFECT CLASSIFICATION: CLASS 4CENTRE SEGREGATION AND CORE UNSOUNDNESS ArrayDEFECT CLASSIFICATION: CLASS 5Page 17SN 960 : 2004-05DEFECT CLASSIFICATION: CLASS 1NARROW SIDE CRACKS ArrayDEFECT CLASSIFICATION: CLASS 2Page 19SN 960 : 2004-05DEFECT CLASSIFICATION: CLASS 3NARROW SIDE CRACKS ArrayDEFECT CLASSIFICATION: CLASS 4Page 21SN 960 : 2004-05DEFECT CLASSIFICATION: CLASS 5CORNER CRACKS ArrayDEFECT CLASSIFICATION: CLASS 1Page 23SN 960 : 2004-05DEFECT CLASSIFICATION: CLASS 2CORNER CRACKS ArrayDEFECT CLASSIFICATION: CLASS 3Page 25SN 960 : 2004-05DEFECT CLASSIFICATION: CLASS 4CORNER CRACKS ArrayDEFECT CLASSIFICATION: CLASS 5Page 27SN 960 : 2004-05DEFECT CLASSIFICATION: CLASS 1TRANSVERSE INTERNAL CRACKS ArrayDEFECT CLASSIFICATION: CLASS 2Page 29SN 960 : 2004-05DEFECT CLASSIFICATION: CLASS 3TRANSVERSE INTERNAL CRACKS ArrayDEFECT CLASSIFICATION: CLASS 4Page 31SN 960 : 2004-05DEFECT CLASSIFICATION: CLASS 5LONGITUDINAL INTERNAL CRACKS ArrayDEFECT CLASSIFICATION: CLASS 1Page 33SN 960 : 2004-05DEFECT CLASSIFICATION: CLASS 2LONGITUDINAL INTERNAL CRACKS ArrayDEFECT CLASSIFICATION: CLASS 3Page 35SN 960 : 2004-05DEFECT CLASSIFICATION: CLASS 4LONGITUDINAL INTERNAL CRACKS ArrayDEFECT CLASSIFICATION: CLASS 5Page 37SN 960 : 2004-05。

斯特亚尔（ST）电子STN161XXXUXXX电路保护电阻数据手册说明书

STN161XXXUXXXTVS Diode ESD suppressorProduct features• Protects one I/O or power line • Low clamping voltage • Low leakage current• Meets moisture sensitivity level (MSL) 3•Molding compound flammability rating: UL 94V-0•Termination finish: TinApplications• Cellular phones • Wearables• Portable electronics • Laptop/notebook computers •Digital camerasEnvironmental compliance and general specifications•IEC61000-4-2 (ESD)• Up to ±30 kV (air)•Up to ±30 kV (contact))•IEC61000-4-5 (Lightning) Up to 110 A (8/20 µs)Pb HALOGENHFFREEFamilyPackage (N16=DFN1610)Number of channels (1)Operating voltage (050 = 5 V) Ordering part numberBi/Uni directional (U=Uni) Capacitance (852 = 850 pF)Pin out/functional diagramST N161050U 8522Technical Data 11134Effective March 2021STN161XXXUXXX TVS Diode ESD suppressor/electronicsParameterSymbolValueUnitSTN161XXXUXXXPeak pulse power dissipation on 8/20 μs waveform P pp 2000W ESD per IEC 61000-4-2 (Air)ESD per IEC 61000-4-2 (Contact)V ESD +/-30 +/-30kVLead soldering temperature T L +260 (10 seconds)°C Operating junction temperature range T J -55 to +125°C Storage temperature rangeT STG-55 to +150°CElectrical characteristics(+25 °C)STN161050U852ParameterTest condition Minimum Typical Maximum Symbol (Units)Reverse working voltage --- 5.0V RWM (V)Reverse breakdown voltage I T = 1 mA 678V BR (V)Reverse leakage current V RWM = 5 V --1I R (μA)Peak pulse current t p = 8/20 μs --110I pp (A)Clamping voltageI pp = 50 A, t p = 8/20 μs I pp = 80 A, t p = 8/20 μs I pp = 110 A, t p = 8/20 μs ---111314141517V C (V)V C (V)V C (V)Junction capacitanceV RWM = 0V, f = 1 MHz-8501050C J (pF)Absolute maximum ratings(+25 °C, RH=45%-75%, unless otherwise noted)STN161070U722ParameterTest condition Minimum Typical Maximum Symbol (Units)Reverse working voltage ---7.0V RWM (V)Reverse breakdown voltage I T = 1 mA 7.589V BR (V)Reverse leakage current V RWM = 7 V --1I R (μA)Forward voltage I F = 10 mA 0.6-1V F Peak pulse current t p = 8/20 μs --100I pp (A)Clamping voltageI pp = 50 A, t p = 8/20 μs I pp = 100 A, t p = 8/20 μs -12151518V C (V)V C (V)Junction capacitance V RWM = 0V, f = 1 MHz-720900C J (pF)3Technical Data 11134Effective March 2021STN161XXXUXXXTVS Diode ESD suppressor /electronics STN161090U602ParameterTest condition Minimum Typical Maximum Symbol (Units)Reverse working voltage ---9.0V RWM (V)Reverse breakdown voltage I T = 1 mA 9.510.512.5V BR (V)Reverse leakage current V RWM = 9 V --1I R (μA)Forward voltage I T = 10 mA 0.6- 1.0V F Peak pulse current t p = 8/20 μs --90I pp (A)Clamping voltageI pp = 40 A, t p = 8/20 μs I pp = 50 A, t p = 8/20 μs I pp = 90 A, t p = 8/20 μs ---141518171922V C (V)V C (V)V C (V)Junction capacitanceV RWM = 0V, f = 1 MHz-600750C J (pF)STN161120U372ParameterTest condition Minimum Typical Maximum Symbol (Units)Reverse working voltage ---12V RWM (V)Reverse breakdown voltage I T = 1 mA 13.314.417V BR (V)Reverse leakage current V RWM = 12 V --1I R (μA)Peak pulse current t p = 8/20 μs --70I pp (A)Clamping voltageI pp = 20 A, t p = 8/20 μs I pp = 40 A, t p = 8/20 μs I pp = 70 A, t p = 8/20 μs -162022192428V C (V)Junction capacitance V RWM = 0V, f = 1 MHz-370450C J (pF)STN161150U332ParameterTest condition Minimum Typical Maximum Symbol (Units)Reverse working voltage ---15V RWM (V)Reverse breakdown voltage I T = 1 mA 1617.220V BR (V)Reverse leakage current V RWM = 12 V --1I R (μA)Peak pulse current t p = 8/20 μs --55I pp (A)Clamping voltageI pp = 25 A, t p = 8/20 μs I pp = 50 A, t p = 8/20 μs I pp = 55 A, t p = 8/20 μs -222627252830V C (V)V C (V)V C (V)Junction capacitance V RWM = 0V, f = 1 MHz-330450C J (pF)4Technical Data 11134Effective March 2021STN161XXXUXXX TVS Diode ESD suppressor/electronicsMechanical parameters, pad layout- mmPart markingDimension Minimum Typical MaximumA 0.450.500.55A100.020.05b 0.850.900.95c 0.080.120.18D 1.55 1.60 1.65e 1.1 BSCE 0.95 1.00 1.05L 0.350.400.45L10.06 BSC(STN161050U852)(STN161150U332)(STN161120U372)(STN161090U602)(STN161070U722)5Technical Data 11134Effective March 2021STN161XXXUXXXTVS Diode ESD suppressor /electronics Packaging information mm/inchesDrawing not to scale.Supplied in tape and reel packaging, 3,000 parts per 7” diameter reel (EIA-481 compliant)6Technical Data 11134Effective March 2021STN161XXXUXXX TVS Diode ESD suppressor/electronicsRatings and V-I characteristic curves(+25 °C unless otherwise noted)V- I curve characteristics (uni-directional)Pulse waveform (8/20 µs)Pulse derating curve ESD waveformEatonElectronics Division 1000 Eaton Boulevard Cleveland, OH 44122United States/electronics © 2021 EatonAll Rights Reserved Printed in USAPublication No. 11134March 2021Technical Data 11134Effective March 2021STN161XXXUXXXTVS Diode ESD suppressor Life Support Policy: Eaton does not authorize the use of any of its products for use in life support devices or systems without the express writtenapproval of an officer of the Company. Life support systems are devices which support or sustain life, and whose failure to perform, when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in significant injury to the user.Eaton reserves the right, without notice, to change design or construction of any products and to discontinue or limit distribution of any products. Eaton also reserves the right to change or update, without notice, any technical information contained in this bulletin.Solder reflow profileT e m p e r a t u r eT LTPEaton is a registered trademark.All other trademarks are property of their respective owners.Follow us on social media to get the latest product and support information.Reference J-STD-020Profile featureStandard SnPb solderLead (Pb) free solderPreheat and soak • Temperature min. (T smin )100 °C 150 °C • Temperature max. (T smax )150 °C 200 °C • Time (T smin to T smax ) (t s )60-120 seconds 60-120 seconds Ramp up rate T L to T p3 °C/ second max. 3 °C/ second max.Liquidous temperature (T l ) Time (t L ) maintained above T L183 °C60-150 seconds 217 °C60-150 seconds Peak package body temperature (T P )*Table 1Table 2Time (t p )* within 5 °C of the specified classification temperature (T c )20 seconds*30 seconds*Ramp-down rate (T p to T L ) 6 °C/ second max. 6 °C/ second max.Time 25 °C to peak temperature6 minutes max.8 minutes max.* Tolerance for peak profile temperature (T p ) is defined as a supplier minimum and a user maximum.Table 1 - Standard SnPb solder (T c )Package thicknessVolume mm3 <350Volume mm3 ≥350<2.5 mm 235 °C 220 °C ≥2.5 mm220 °C220 °CTable 2 - Lead (Pb) free solder (T c )Package thicknessVolume mm 3 <350Volume mm 3350 - 2000Volume mm 3 >2000<1.6 mm 260 °C 260 °C 260 °C 1.6 – 2.5 mm 260 °C 250 °C 245 °C >2.5 mm250 °C245 °C245 °C。

2004-NORSOK-M501

coatings (coating system no. 3B).
Other changes and modifications are also made. All main changes are highlighted with revision marks.
NORSOK standard
Page 2 of 20
4.4 Ambient conditions
4.5 Coating materials
4.6 Steel materials
4.7 Shop primer
4.8 Unpainted surfaces
4.9 Handling and shipping of coated items
4.10 Pre-qualification of products, personnel and procedures
been introduced also for coating systems that shall be pre-qualified; • DNV classification testing has been accepted as an alternative qualification method for ballast water tank
Copyrights reserved
NORSOK standard M-501
Foreword
Introduction
1
Scope
2 2.1 2.2
Normative and informative references Normative references Informative references
The NORSOK standards are prepared and published with support by The Norwegian Oil Industry Association (OLF) and Federation of Norwegian Manufacturing Industries (TBL).

UP series

Grundfos UPS 100 系列简介
照片
UPS 100 系列技术参数
主要产品特性
> 方便的电气连接
> 高效率 > 无需马达保护 > 较宽的产品范围 > 较宽的应用范围
> 简单易用的速度调节钮 > 非常低的噪音 > 高质量的材料 UPS Series 100
测定曲线
系统带给客户的主要益处
安装
UPS200 系列 UPS200 系列
UPSD双头泵－－除信号输出外，还可控制两台泵的运行方式。
运行模式：
1、交替运行（工厂设置）两台泵交替运行，每24小时转换一次。 2、备用运行持续地按工作泵和备用泵运行。 3、单泵运行每台泵都独立运行，彼此互不联系.
UPSD
UPS E泵
1991: 第一代 UPE －－技术突破第一台带有集成变频器的湿转子泵: 节能和通讯的新标准.
测定曲线
系统带给客户的主要益处
安装
> 易于安装 > 只有一个供应商 > 易于启动
最终用户 > 免维护 > 寿命长 > 运行成本低 > 高度舒适性
Grundfos UPS 100 系列简介
照片
UPE 2000 系列技术参数
技术参数
温度压力功率范围速度连接方式接口两端距离泵体
+ 2 - + 95 oC PN 10 (10 bar) 60W - 2200W 变速活接头; 法兰 130 - 450 mm 铸铁; 青铜
•泵壳用铸铁、青铜或不锈钢制造。
UPS100系列
UPS系列小型湿转子循环泵
》UP泵是封闭转子式，即泵和电动机形成一个整体，没有轴封，仅有二个密封垫圈。轴承由泵送的液体来润滑。

RCU 501 远程控制单元产品说明书

RCU501 is a high performance, general purpose, real-time process control computer for use in a wide variety of system applications in both on- and offshore installations. The processor core is an embedded Power PC™ architecture and the module is approved for Ex Zone 2 applications.Application types• Dynamic Positioning Systems• Thruster Control / Steering Systems • Navigation Sensor Integrator• Integrated Process Control Systems • Alarm and monitoring Systems • Safety SystemsFunction• Dual ethernet LAN process networks • Dual RedundancyNet interface for redundant RCU con ﬁ guration• Dual Remote IO process BUS (RBUS) • 4 general purpose Digital Input channels • 4 general purpose Digital Output channels• 32 serial lines for 3rd party interface • 2 PROFIBUS channels for 3rd party interface• 2 CANBUS channels for 3rd party interfaceFeature• Single unit topology: SIL 1 compliant • Dual unit topology: SIL 2 and SIL 3compliant• Triple unit topology • Ex Zone 2 approved• Compliant to the following protocols:1. Modbus (Serial and TCP)2. NMEA 01833. PROFIBUS/PROFIsafe4. CAN/DeviceNet • 3rd party vendor speci ﬁ c protocols are available upon request • Power:1. Redundant power input with power alarm monitoring2. Inrush current and over-voltage protection• Enhanced watchdog with fail-safe function and system status outputBene ﬁ tsThe following built-in functions minimize system downtime:• Extended Built-in Self- Test (BIST) for computer diagnostics and fault identi ﬁ cation during start-up and runtime • Prepared for online remote diagnostics • Prepared for online ﬁ rmware upgrade • Bootable from ﬁ le server or local ﬂ ash memory• Easy installation and replacement 1. DIN Rail mounting2. All connections are pluggable3. 3 digit address switches• Hot swap in redundant applications,dual and triple Hot-Standby redundancy, 1oo2 redundancy• Status LED indication (Normal/Error)• RoHS compliantComputer performance• RCU501 performance is application dependant and governed by process complexity, updating frequency and number of interfaced I/O. Maximum updating frequency is 50 Hz.• Con ﬁ guration guidelines:1. ESD/PSD: max. 800 I/O,F&G: max. 700 I/O both at scan rate: 1 Hz 2. Process/ Automation:max. 2000 I/O,design advice: 1280 I/O both at scan rate: 1 Hz3. Anti-surge: 3 loops, Scan rate: 50 Hz4. Dynamic Positioning: Tripleredundant DP system combined with Position Mooring. (Scan rate is adapted to signal processing and varies from 1 to 10 Hz).312729 Rev. B / September 2010KM article numberRCU501: 603439StandardsRCU501 complies with the following:• IACS E10• IEC 60533• IEC 60945• IEC 61508• IEC 62061Type approvalRCU501 is type approved by:• Det Norske Veritas (DNV)• The American Bureau of Shipping(ABS) • TÜV Rheinland• Wurldtech™; Achilles level 1certi ﬁ edCE markingCE mark compliant, con ﬁ rm to:• 2004/108/EC (EMC directive)• 94/9/EC (Atex directive)Ex certi ﬁ cationEx nA II T4 (Zone 2)Environmental speci ﬁ cationsAmbient temperatures and humidity:• Temp. Operation: -15˚C to 70˚C • Temp. Storage: -25˚C to 70˚C• Humidity Operation: Up to 98% RH • Humidity Storage: Up to 98% RH Protection Standards: IP 20DimensionsHeight: 355 mm Width: 158 mm Depth: 87 mm Weight: 1.35 kgCross point screw lock on DIN Rail T35 7.5/15 according to EN 50022ElectricalInput supply voltage: 24 VDC (+30%, -25%)Nominal current consumption: ≈ 0.8 A Start-up current: Max. 2.7 A Power consumption: Max. 20 W Heat dissipation: Max. 20 W Power connectors:• Screw terminals (slotted) • Cable cross section: 2.5 mm²Processor and memory Processor:• Type: Power PC TM host processorMPC8245• Clock frequency: 400 MHzMemory:• RAM size and speed: 64 MB @ 133MHz• PROM: 16 MB application ﬂ ash-ﬁ leSerial lineChannels: 32 insulated serial lines, distributed on 8 RJ45 connectors Physical layer: RS232, RS422 and RS485 Multidrop via RSER200Bit rate: Max. 115 kb/sGeneral purpose I/O channelsDigital Output (DO):• 4 x opto-isolated outputs• 1 x opto-isolated watchdog (forexternal interface)Digital Input (DI): 4 x opto-isolated inputsI/O connectors: • Cage clamps• Cable cross section: 1 mm²LAN interfaceProcess network & RedundancyNet: 2 x RJ45 Ethernet IEEE 802.3 type 10BASE-T/100BASE-TXRBUS interfaceConnector: 2 x RJ45Bit-rate: 2 Mb/sSignal code: Manchester encoded (Self-clocked)Copper wire topology:• Insulation: 500 V (Optocoupler)• Physical layer: RS485 Multidrop • Cable attenuation: < 6.5 db/100m @10 MHz (CAT 5)• Cable length: Max. 200 m betweenrepeaters. Max. 3 repeatersFibre optical topology (w/ additional ﬁ bre media converter):• Fibre cable: 62.5/125 μm. Multimodus • Connector: ST • Cable length: Max. 1000 m (point to point). 500 m if used in patch-panel topology Field interfaceCAN interface:• 2 x CANopen/DeviceNet @ 5 polecage clamp terminals. 2.5 mm² cable • Bit rate: Max. 1 Mb/s. (DeviceNet notde ﬁ ned above 500 kb/s)PROFIBUS interface:• 2 x opto-isolated 9 Pin femaleD-Sub connectors • Bit rate: Max. 12 Mb/sLife cycle predictionPredicted failure rate @ GB 25˚C (60% con ﬁ dent, based on chip suppliers data): 24.2 YearsPredicted failure rate @ NS 35˚C(Environmental de-rating based on RomeLaboratory toolkit): 6.5 Years* KM reserves the right to make changes to the material or product described, at any time without notice.。

SFC05-4_04中文资料

PRELIMINARY
2004 Semtech Corp.
4

元器件交易网
PROTECTION PRODUCTS Applications Information
Device Connection Options
The SFC05-4 has solder bumps located in a 3 x 2 matrix layout on the active side of the device. The bumps are designated by the numbers 1 - 3 along the horizontal axis and letters A - B along the vertical axis. The lines to be protected are connected at bumps A1, B1, A3, and B3. Bumps A2 and B2 are connected to ground. All path lengths should be kept as short as possible to minimize the effects of parasitic inductance in the board traces.
Flip Chip TVS
Flip chip TVS devices are wafer level chip scale packages. They eliminate external plastic packages and leads and thus result in a significant board space savings. Manufacturing costs are minimized since they do not require an intermediate level interconnect or interposer layer for reliable operation. Their compatibility with current pick and place equipment further reduces manufacturing costs. Certain precautions and design considerations have to be observed, however, for maximum solder joint reliability. These include solder pad definition, board finish, and assembly parameters.

RCLAMP0504P中文资料

Electrical Characteristics (T=25oC)
Parameter Reverse Stand-Off Voltage Reverse Breakdown Voltage Reverse Leakage Current Clamping Voltage Clamping Voltage Clamping Voltage Junction Capacitance
rclamp0504p rclamp0504p railclamp lowcapacitance tvs array protection products descriptionfeatures circuit diagram pin configuration revision 06/01/2007 railclamps lowcapacitance tvs arrays designed protecthigh speed data interfaces. serieshas been specifically designed protectsensitive compo- nents which transmissionlines from overvoltage caused esd(electrostatic discharge), cde (cable discharge events), eft(electrical fast transients). uniquedesign incorporates surge rated, low capacitance steering diodes tvsdiode singlepackage. during transient conditions, steeringdiodes direct transientcurrent internaltvs diode clamps transientvoltage safelevel. lowcapacitance array configuration allows protectup fourhigh-speed data lines. 6-pin,rohs compliant, slp1616p6 package. measures1.6 lead-freenipdau. esdimmunity requirements iec61000-4-2, level (15kvair, 8kv contact discharge). smallsize, low capacitance, highesd surge capability makes them ideal por-table applications cellularphones, next genera- t

Parker PF501 Coalescing Filter - Miniature说明书

PF501 Series1/4 Inch PortsCatalog 0700P-EMiniature PF501 SeriesOrdering InformationPortSizeNPT BSPPManual Twist Drain Manual Twist Drain1/4"PF501-02DHSS PF501G02DHSSPF501 CoalescingFilter DimensionsA1.56(40)C0.31(8)D3.69(94)E4.00(102)F1.58(40)inches(mm)BOLD ITEMS ARE MOST POPULAR.Standard part numbers shown bold. For other models refer toordering information below.SCFM = Standard cubic feet per minute at 90 PSIG inlet and 5 PSIGpressure drop.Features• Stainless steel construction handlesmost corrosive environments.• Meets NACE specificationsMR-01-75/ISO 15156.• 1/8" female threaded drain.• High Flow: 1/4" - 16 SCFM§Port Type- NPTG BSPPPort Size02 1/4 InchBowlD Metal BowlwithoutSight GaugeElementH .3 MicronMaterialSS Stainless SteelPF501 - 02 D H SSOptionsBlank ManualTwist DrainR AutomaticPulse DrainPF501 SeriesCoalescing Filters (Oil Removal)Catalog 0700P-E Technical Specifications – PF501Flow - dm /sP r e s s u r e D r o p - b a r3n Primary Pressure - PSIG 2.4 bar 6.2 bar 10.3 barPrimary Pressure - bar PF501 Filter Kits & AccessoriesDrain Kits –Automatic Pulse Drain ................................................RK504SY -SS Manual Twist Drain –Small (Old) ..........................................................SA600Y7-1SS Large (New) ...............................................................SAP05481Filter Element Kits – 0.3 Micron .........................................................................EKF501H Pipe Nipple –1/4" 316 Stainless Steel ................................................616Y28-SSSpecificationsBowl Capacity ..................................................................1.0 Ounces Filter Rating .......................................................................0.3 Micron Port Threads ..........................................................................1/4 InchPressure & Temperature Ratings –Manual T wist Drain ............................0 to 300 PSIG (0 to 20.7 bar) 0°F to 180°F (-18°C to 82°C) Auto Pulse Drain ..................................10 to 175 PSIG (0 to 12 bar) 32°F to 150°F (0°C to 66°C)Note: Air must be dry enough to avoid ice formation attemperatures below 32°F (0°C)Sump Capacity ..................................................................0.4 Ounce Weight ........................................................................0.6 lb. (0.27 kg)Materials of ConstructionBody .....................................................................316 Stainless Steel Bowls ...................................................................316 Stainless Steel Drain ....................................................................316 Stainless Steel Element Holder .......................................................................Acetal Filter Element .........................................................Borosilicate Fiber Seals .............................................................................FluorocarbonOperationTechnical InformationThe contaminated air enters the element interior and is forced through a thick membrane (A) of “borosilicate” glass fibers coated with epoxy. Flow then passes through the element, and at this stage 99.97% of the sub micronic particles have been removed from the air stream. The tiny droplets coalesce together and are collected from the filter element by the outer drain layer.The clean, filtered air now passes through and out into the pneumatic system. The air line coalescing filter removes liquid aerosols and sub-micron particulate matter. Collected liquids and particles in the “quiet zone” (B)should be drained before their level reaches a height where they would be reentrained in the flowing air. This can beaccomplished by unscrewing the drain valve (C) slightly until the liquid begins to drain.(Revised 11-21-12)。

JIS G0404-2005 中文版钢材的一般交货条件

JIS G 0404:2005钢材的一般交货技术条件序言本标准是参照1992年发布的ISO404《钢及钢产品的一般交货技术条件》第二版并修改其技术内容而制订的。

１适用范围本标准规定了除锻件、铸件及粉未冶金制品以外的全部钢及钢产品的一般交货技术条件。

订货时双方协商的交货条件或者产品标准中所规定的交货条件与本标准不同时适用。

２引用文件附表１中所列的标准由于被本标准引用，构成本标准规定的一部分。

这些引用标准适用于最新版标准。

3定义本标准所用的主要术语定义如下： a) 检验检验是指诸如测定、检查、试验和测量产品或服务的特性值，并且将其与规定值进行比较以确定是否合格的活动。

b) 试验试验是指测定材料或产品的性能和特性值的所有作业或活动。

c) 规定检验和试验规定检验和试验是指在交货前，根据合同的技术要求，在交货的产品上或其中的部分产品上进行检验和试验，以便验证它们是否符合合同的要求。

d) 检验代表检验代表可为一个人或几个人： 1) 政府法规中指定的检查员; 2) 需方委托的代表;3) 供方（供方，下同）委任的代表。

不能是生产线上的人员，而是能代表需方行为的人员。

e) 试验单元根据产品标准或订货合同要求，以在抽样产品上所进行的试验为依据，一次合格或不合格的产品集合。

f) 抽样产品检验、试验时，在试验单元中抽取的部分（例如：一块板）（见图１）。

g) 试料为制备试样，从抽样产品中切取足够量的材料。

注：在某些情况下，试料就是抽样产品。

w w w .b zf xw .c omJIS G 0404:2005h) 样坯为了制备试样，经过机械处理或所需热处理后的试料。

i) 试样具有合格尺寸且满足试验要求的样坯。

注：在某些状态下，试样可以是试料，也可以是样坯。

j) 熔炼分析按标准或已文件化的一定程序，供方自行选定的测定样品熔炼化学成分的分析。

k) 成品分析成品分析是指在供货产品上进行的化学分析。

l) 序贯试验由试验得到的平均值和单个值来判定产品是否符合合同和/或产品标准要求的一组试验。

摄像头驱动VID+PID大全AND生产厂家

摄像头驱动VID+PID大全AND生产厂家VID_05A9OmniVisionUSB\VID_05A9&PID_A518 :// drvsky /driver/OV518+.htmUSB\VID_05A9&PID_A511 :// drvsky /driver/OV511+.htmUSB\VID_05A9&PID_4519 :// drvsky /driver/OV530.htmUSB\VID_05a9&PID_0519 :// drvsky /driver/OV530.htmUSB\VID_05a9&PID_0531 :// drvsky /driver/OV534.htmUSB\VID_05a9&PID_0550 :// drvsky /driver/OV550.htmUSB\VID_05a9&PID_2800 :// drvsky /driver/PID_2800.htmPS：那个是帖子里的一个朋友反馈的硬件ID，我收集了一下，提供给大伙儿，由于这几天都在看球，因此回复慢，请那位朋友谅解。

大伙儿假如有摄像头不一样的硬件ID，欢迎在帖子里讨论。

VID_1B17CNLTFCNLTF A380摄像头方案下载地址：:// drvsky /driver/CNLTF_A380.htm硬件ID：USB\VID_1B17&PID_6100USB\VID_1B17&PID_6101USB\VID_1B17&PID_6110USB\VID_1B17&PID_6111VID_1871市面的无驱摄像头较多的，更新一个嘉映的无驱摄像头驱动，支持硬件ID如下。

:// drvsky /driver/AVEO_UVC.htm 硬件ID：USB\VID_1871&PID_0101USB\VID_1871&PID_0141USB\VID_1871&PID_0306USB\VID_1871&PID_01f0USB\VID_1871&PID_3640USB\VID_1871&PID_2640USB\VID_1871&PID_2655USB\VID_1871&PID_2000USB\VID_1871&PID_2001USB\VID_1871&PID_2003USB\VID_1871&PID_2004USB\VID_1871&PID_2005USB\VID_1871&PID_2006USB\VID_1871&PID_2007USB\VID_1871&PID_2020USB\VID_1871&PID_2020USB\VID_1871&PID_2020USB\VID_1871&PID_2020USB\VID_1871&PID_2021USB\VID_1871&PID_2021USB\VID_1871&PID_2021USB\VID_1871&PID_2021USB\VID_1871&PID_2021USB\VID_1871&PID_2021USB\VID_1871&PID_2020USB\VID_1871&PID_2021USB\VID_1871&PID_2020USB\VID_1871&PID_2021 USB\VID_1871&PID_2022 USB\VID_1871&PID_2023 USB\VID_1871&PID_2024 USB\VID_1871&PID_2025 USB\VID_1871&PID_2026 USB\VID_1871&PID_2027 USB\VID_1871&PID_2028 USB\VID_1871&PID_2029 USB\VID_1871&PID_2030 USB\VID_1871&PID_2031 USB\VID_1871&PID_2032 USB\VID_1871&PID_2033 USB\VID_1871&PID_2034 USB\VID_1871&PID_2035 USB\VID_1871&PID_2036 USB\VID_1871&PID_2037 USB\VID_1871&PID_2038 USB\VID_1871&PID_2039 USB\VID_1871&PID_2040 USB\VID_1871&PID_2041 USB\VID_1871&PID_2042 USB\VID_1871&PID_2043 USB\VID_1871&PID_2044 USB\VID_1871&PID_2045 USB\VID_1871&PID_2046 USB\VID_1871&PID_2047 USB\VID_1871&PID_2048 USB\VID_1871&PID_2049USB\VID_1871&PID_2050 USB\VID_1871&PID_2051 USB\VID_1871&PID_2052 USB\VID_1871&PID_2053 USB\VID_1871&PID_2054 USB\VID_1871&PID_2055 USB\VID_1871&PID_2056 USB\VID_1871&PID_2057 USB\VID_1871&PID_2058 USB\VID_1871&PID_2059 USB\VID_1871&PID_2060 USB\VID_1871&PID_2061 USB\VID_1871&PID_2062 USB\VID_1871&PID_2063 USB\VID_1871&PID_2064 USB\VID_1871&PID_2065 USB\VID_1871&PID_2066 USB\VID_1871&PID_2067 USB\VID_1871&PID_2068 USB\VID_1871&PID_2069 USB\VID_1871&PID_2070 USB\VID_1871&PID_2071 USB\VID_1871&PID_2072 USB\VID_1871&PID_2073 USB\VID_1871&PID_2074 USB\VID_1871&PID_2075 USB\VID_1871&PID_2076 USB\VID_1871&PID_2077 USB\VID_1871&PID_2078USB\VID_1871&PID_2079 USB\VID_1871&PID_2080 USB\VID_1871&PID_2081 USB\VID_1871&PID_2082 USB\VID_1871&PID_2083 USB\VID_1871&PID_2084 USB\VID_1871&PID_2085 USB\VID_1871&PID_2086 USB\VID_1871&PID_2087 USB\VID_1871&PID_2088 USB\VID_1871&PID_2089 USB\VID_1871&PID_2090 USB\VID_1871&PID_2091 USB\VID_1871&PID_2092 USB\VID_1871&PID_2093 USB\VID_1871&PID_2094 USB\VID_1871&PID_2095 USB\VID_1871&PID_2096 USB\VID_1871&PID_2097 USB\VID_1871&PID_2098 USB\VID_1871&PID_2099 USB\VID_1871&PID_2100 USB\VID_1871&PID_1000 USB\VID_1871&PID_1001 USB\VID_1871&PID_1002 USB\VID_1871&PID_1003 USB\VID_1871&PID_1004 USB\VID_1871&PID_1005 USB\VID_1871&PID_1006USB\VID_1871&PID_1007USB\VID_1871&PID_1008USB\VID_1871&PID_1009USB\VID_1871&PID_1010USB\VID_1871&PID_0336USB\VID_1871&PID_0668USB\VID_1871&PID_0326USB\VID_1871&PID_0346USB\VID_1871&PID_0366USB\VID_1871&PID_0386USB\VID_1871&PID_0501USB\VID_1871&PID_0541USB\VID_1871&PID_0701USB\VID_1871&PID_0721USB\VID_1871&PID_0741USB\VID_1871&PID_0761USB\VID_1871&PID_0781USB\VID_1871&PID_0F81USB\VID_1871&PID_0F01USB\VID_1871&PID_0F21USB\VID_1871&PID_0F41USB\VID_1871&PID_0F61USB\VID_1871&PID_0D01Aveo 嘉映微电子388摄像头方案下载地址：:// drvsky /driver/AVEO_388.htm 硬件ID：USB\VID_1871&PID_0306USB\VID_1871&PID_01f0USB\VID_1871&PID_56CC嘉映无驱308H方案:// drvsky /driver/308H.htm硬件ID：USB\VID_1871&PID_0306USB\VID_1871&PID_01f0VID_093A 台湾原相科技。

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(1) An export permit needs to be obtained from the competent authorities of the Japanese Government if any of the products or technical information described in this material and controlled under the "Foreign Exchange and Foreign Trade Law" is to be exported or taken out of Japan. (2) The technical information described in this material is limited to showing representative characteristics and applied circuits examples of the products. It neither warrants non-infringement of intellectual property right or any other rights owned by our company or a third party, nor grants any license. (3) We are not liable for the infringement of rights owned by a third party arising out of the use of the technical information as described in this material. (4) The products described in this material are intended to be used for standard applications or general electronic equipment (such as office equipment, communications equipment, measuring instruments and household appliances). Consult our sales staff in advance for information on the following applications: • Special applications (such as for airplanes, aerospace, automobiles, traffic control equipment, combustion equipment, life support systems and safety devices) in which exceptional quality and reliability are required, or if the failure or malfunction of the products may directly jeopardize life or harm the human body. • Any applications other than the standard applications intended. (5) The products and product specifications described in this material are subject to change without notice for modification and/or improvement. At the final stage of your design, purchasing, or use of the products, therefore, ask for the most up-to-date Product Standards in advance to make sure that the latest specifications satisfy your requirements. (6) When designing your equipment, comply with the guaranteed values, in particular those of maximum rating, the range of operating power supply voltage, and heat radiation characteristics. Otherwise, we will not be liable for any defect which may arise later in your equipment. Even when the products are used within the guaranteed values, take into the consideration of incidence of break down and failure mode, possible to occur to semiconductor products. Measures on the systems such as redundant design, arresting the spread of fire or preventing glitch are recommended in order to prevent physical injury, fire, social damages, for example, by using the products. (7) When using products for which damp-proof packing is required, observe the conditions (including shelf life and amount of time let standing of unsealed items) agreed upon when specification sheets are individually exchanged. (8) This material may be not reprinted or reproduced whether wholly or partially, without the prior written permission of Matsushita Electric Industrial Co., Ltd.
Forward current transfer ratio hFE
320
80
0 10−1
1
10
102
103
Collector current IC (mA)
2
SJJ00232BED
Request for your special attention and precautions in using the technical information and semiconductors described in this material
10 IC / IB = 10
VCE = 10 V Ta = 25°C
100
VCE = 10 V
Collector current IC (mA)
8
Base current IB (mA)
1
80
6
Ta = 75°C
−25°C
60
10−1
Ta = 75°C 25°C −25°C
4
40
10−2
2
20
0
0
Tr1 Tr2
1: Emitter (Tr1) 2: Base (Tr1) 3: Collector (Tr2)
0 to 0.02
4: Emitter (Tr2) 5: Base (Tr2) 6: Collector (Tr1) SSMini6-F1 Package
Marking Symbol: 5H Internal Connection
(0.20)
Publication date: December 2003
SJJ00232BED
1
UP04501
PT Ta
150
50 Ta = 25°C
IC VCE
IB = 160 µA 140 µA 40
IC I B
160 VCE = 10 V Ta = 25°C
Total power dissipation PT (mW)
0
0.2
0.4
0.6
0.8Biblioteka 00.20.4
0.6
0.8
1.0
10−3 10−1
1
10
102
Base-emitter voltage VBE (V)
Base-emitter voltage VBE (V)
Collector current IC (mA)
hFE IC
400 VCE = 10 V Ta = 75°C 25°C 240 −25°C 160
1 2 3 (0.50)(0.50) 1.00±0.05 1.60±0.05 (0.30) 6 5 4
1.20±0.05 1.60±0.05
0.20+0.05 –0.02
Unit: mm
0.10±0.02
5˚
(0.20)
Display at No.1 lead
■ Absolute Maximum Ratings Ta = 25°C
Note) Measuring methods are based on JAPANESE INDUSTRIAL STANDARD JIS C 7030 measuring methods for transistors.
0.10 max.