PCB缺陷英语汇总

印制电路板各工序缺陷中英文一览

Inner layer dry/film 内层干菲林Blocking boards 卡板Lack copper 少铜Inner scrap 内层报废Uncomplete tearing film 撕膜不净Soft inner 内层变软Conductor lift 崩线Inner misregistration 内层错位Bulge on conductor 线路凸位Inner short 内层短路Poor conductor 线路不良Inner open 内层开路Pattern misregistration 线路图形歪Inner slight short 内层微短Elliptical hole 椭圆孔Pressing 压板DRY PLY DRY PLY Inner shift 内层偏位Tg value out of spec. Tg超出要求Inner hole position incorrect 内层歪孔Tg value not meet the requirement Tg达不到要求Lay up in reverse 排反板Dent凹折The incision length not meetthe requirement切割长度达不到要求Measling 白斑Board poor cutting 切坏板Poor edge 板边不良Burnt 烧焦Burrs on board edge 板边毛刺The resin content lower thanthe requirement树脂含量低于要求Resin shortage in board edge 板边缺树脂Void in resin 树脂空洞Fibre in board edge 板边纤维丝Dissipation factor beyondcriteria损耗因子达不到要求Thin board thickness 板薄Make wrong guide hole 挑错管位Excess board thickness 板厚Thinner copper thickness 铜箔偏薄Board out of spec. 板厚不合要求Dlamination between surfacecopper and prepreg铜箔气泡Lamination wrinkles 板料布纹Bow and twist out of spec 弯曲性超标Lamination blisters 板料气泡Dusty and damage 污损Rough board surface 板面不光滑Absorption beyond criteria 吸水性超标Board surface extrusion 板面突起Construction of fiber not meetrequirement纤维结构不符要求Dent by pressing board 板面压伤Pressing dent 压板凹痕Board warp/bow 板弯/曲Poor lamination 压板不良Board small 板小Failed pressure vessel test 压力锅测试未达标Protective film too thick or thin 保护膜偏厚&偏薄Fracture 压伤Delamination 爆板Oxide 氧化Peel strength under requirement 剥离强度未达标Misuse prepreg 用错P片Black oxide scratch 擦花黑化Laminate misused 用错板料Layer structure not meet MIrequirement层压结构不符MI要求Misuse inner P/R 用错内层P/R Poor dimensional stability 尺寸稳定性未达标Misuse Cu coil 用错铜箔Delamination/Blister 分层/起泡Weave texture 织纹显露Poor cutting 割板不良Wrinkles 皱折痕Guide hole over size 管位大孔Marked legend shift 字唛打偏Guide pin shift 管位钉打偏Marked legend in unit 字唛入单元Guide hole shift 管位歪孔Stain on board 板面污渍Poor black oxide 黑化不良Bow 板弯Board slip in pressing 滑板Copper clad thickness underspec.表面铜薄Foreign material in laminate 基材内异物Copper clad thickness overspec.表面铜厚Joint glue too thick or thin 接着剂偏厚&偏薄Drilling wrong guide hole 打错管位Unqualified dielectric layer 介电层不合格Inner layer cu thickness underspec.内层铜薄Thin dielectric layer thickness 介电层偏薄Inner layer cu thickness overspec.内层铜厚Excess dielectric layer 介电层偏厚Foreign material in innerlayer内层杂物Electronic inductivity beyond standard 介电常数未达标Length and width not meetspec.外围尺寸不符合要求Cutting wrong laminate 开错料Marking wrong 打错字唛Missing guide hole 漏打管位Missing marking 漏打字唛Missing black oxide 漏黑化Poor staff 板料不良Exposed/Disrupted fibres 露纤维/纤维断裂Poor marking 打字唛不良Routing guide hole shift 锣偏管位孔Board break 板裂Pits 麻点The joint of copper foil 铜箔接口Inner white spot 内层白点Skipping inner-layer 少排内层Improper inner layer 内层不配套Skipping prepreg 少排P片Inner scratch 内层擦花Pattern perforation 线路穿孔Inner pink ring 内层粉红圈Poor mechanical pressing 机械压伤不良Inner glue residue 内层胶渍Drilling 钻房Broken guide hole 打爆管位Hole diameter over size 钻大孔Drill bit broken 断针Drilling extra hole 钻多孔Scrape 刮花Drilling in reverse 钻反孔Deformed hole 孔变形Poor drilling 钻孔不良Burrs in hole 孔内披锋Drilling un-through 钻不穿Drilling skip 漏钻孔Drilling hole misalignment 钻歪孔Drilling wrong boards 钻错板Hole diameter under size 钻小孔Drilling wrong hole 钻错孔Hole damaged 钻炸孔Tenting hole/Plugging 塞孔PTH/PP 沉铜/板面电镀Board surface dent 板面凹痕Copper thread in hole 孔内铜丝Board surface copper nubbles 板面铜粒No copper in hole 孔内无铜Board folding and breaking 板折坏Copper in hole（NPTH）孔内有铜(非镀铜孔)Poor plating 电镀不良Board damaged by scrubbing 磨坏板The plating thickness not uniform 电镀层不均匀Plating copper peel off 铜层剥离Rough plating 电镀粗糙Wicking 渗铜Hole plugged by plating 电镀塞孔Drilling hole failure 钻飞孔Burnt board by plating 电镀烧板Board scratched by machine 机械刮伤Boards-drop into the tunnel 缸底板Mechanical drilling holemisalignment机械钻歪孔Burrs on hole-edge 孔边毛刺Poor mechanical drilling 机械钻孔不良Rough hole wall 孔粗Big hole of mechanicaldrilling机械钻大孔Hole black 孔黑Extra hole of mechanicaldrilling机械钻多孔Missing hole of mechanicaldrilling机械钻漏孔Dry/Film 干菲林Hole breakout 崩孔Glue residue 胶渍Film scratch 擦花菲林Missing PAD 漏PAD Scratching prevent tin 擦花锡面Missing date code 漏印周期Under developing 冲板不净Poor in D/F lamination 辘菲林不良Over developing 冲板过度Poor exposure 曝光不良Broken dry film 穿菲林Exposure foreign material 曝光垃圾Overlap boards 叠板Bleeding copper plating(wicking)渗镀Same location trace open 定位断线Peel off D/F 甩菲林Short 短路Misuse film 用错菲林Trace open 断线Foreign inclusions 杂物Put wrong D/F 放错菲林Pin hole 针孔Put D/F in reverse 放反菲林Unclear date code 周期不清Film wring 菲林起皱Mistake date code 用错周期Film in hole 菲林入孔Foreign material under film 菲林下杂物D/F residue 菲林碎Pattern plating & Etching & M/I图电/蚀刻/中检Dishdown 碟形凹痕Trace undersize 线幼Dirty 板污Chemical solution polluting 药水Copper residue 残铜Lower impedance 阻抗偏低Dropped D/F 掉菲林Higher impedance 阻抗偏高Poor tin plating 镀锡不良Resistance out of requirement 电阻不合要求Trace broken by clamper 夹崩线路Hole knocked down 撞崩孔D/F clamping 夹菲林Trace shift (by damage) 撞歪（断）线Under etching 蚀板不净Scrap by machine blocking 塞机报废Over etching 蚀板过度Mechanical broken trace 机械撞断路Unclear etching legend 蚀字不清Poor circuit reworking 补线不良Thin copper plating 铜薄Poor rework 修理不良Excess copper thickness 铜厚Burned trace open 烧断线Film under stripping 褪菲林不净SMT PAD undersize 锡手指幼Tin under stripping 褪锡不净Edge roughness(dull line) 线路狗牙Thin tin coating 锡薄Trace spacing undersize 线隙不足Nicks 缺口Boards damaged 板损坏W/F 湿绿油Board discolor 板黄S/M on SMT PAD 绿油上锡手指S/M skipping 不过油Foreign material under S/M 绿油下杂物Scratch 擦花Poor S/M color 绿油颜色不良Damaged by pin pressing 钉床压伤Poor scrubbing 磨板不良Weave exposure 基材白点Solder mask bleeding 渗油Board poor baking 焗坏板Hand print 手印Expose cu in hole 孔内露铜Solder mask peel off 甩油Exposed conductors 露线Over micro-etching 微蚀过度S/M skip 漏印绿油S/M on PAD 绿油上焊盘S/M uneven 绿油不匀Missing boards 遗失板S/M under developing 绿油冲不净Misuse W/F net 用错W/F网Solder mask misregistration 绿油偏位S/M thickness under spec. 油薄Solder mask blistering 绿油超泡Solder mask over developing 绿油冲过度Solder mask wrinkles 绿油起皱Misuse solder mask 用错油墨Solder mask in hole 绿油入孔S/M thickness over spec. 油厚S/M on gold finger 绿油上金手指C/M 白字C/M in hole 字符入孔Plugging hole shift 塞偏孔C/M on PAD 字符油上焊盘Unclear trademark 商标不清Mark Illegible 字符不清Double C/M 双重白字Legend dissolved 字符溶解Poor carbon ink 碳油不良Carbon ink on board 板面有碳油Carbon ink short 碳油短路Broken ink 爆油Carbon ink saw-tooth shaped 碳油狗牙Yellow C/M in hole 黄油入孔Missing print C/M 印错字符Peelable mask in hole 蓝胶入孔Misuse black oil net 印错黑油网Missing plug hole 漏塞孔Wrong trademark 印错商标Missing C/M 漏印字符Askew C/M 印歪字符S/M blocking hole 绿油塞孔Misuse C/M net 印错字符网Poor plug hole 塞孔不良Exposed conductor 露导体Illegible legend 字符残缺Carbon ink peel off 甩碳油Carbon ink bleeding 渗碳油C/M peel off 甩字符Return cycle print 返印周期Misuse carbon ink net 用错碳油网Solder powder 锡粉HAL 喷锡Scratching solder legend 擦伤锡字Solder thickness over spec. 锡厚Dent in gold finger 金手指凹痕Solder thickness under spec. 锡厚度不足Scratching gold finger 金手指擦花Gray solder 锡面灰Expose cu on gold finger 金手指露铜Tin blocking hole 锡塞孔Solder on gold finger 金手指上锡Line peel off 线路剥离Dirty hole 孔灰Solder on trace 线路上锡Poor melting 熔锡不良Solder on S/M 板面上锡PAD peel off 甩焊盘Non-wetting 不上锡Copper peel off 甩铜Solder whiten 锡白Solder peel off 甩锡Solder surface roughness 锡面粗糙Excessive solder 锡高Solder thread in hole 孔内锡丝Dewetting 缩锡Undersized hole 孔细SMT PAD damaged 损坏锡手指Rust solder 锈色G/F plating & Immersion gold 金手指电镀&沉金Gold burnt in plating 电镀烧金Gold bleeding 渗金Poor gold plating 镀金不良Water residue 水渍印Poor Ni plating 镀镍不良Poor gold stripping 褪金不良Gold plating skip 漏镀金White hole edge 孔边发白Ni plating skip 漏镀镍No gold in hole 孔内无金Ni thickness under spec. 镍薄Gold on guide hole 管位孔上金Gold on trace 线路上金Gold or Ni peel off 甩金镍Ni or gold skipping SKIP Watercolor printing 水纹印Gold on the edge 板边有金Chemical solution on goldsurface药水上金面Poor gold immersion 沉金不良Rough G/F 金手指粗糙Gold whiten 金白G/F damaged 金手指损坏Gold thickness under spec. 金薄Ni spot on board surface 板面镀上镍Poor gold color 金颜色不良Nodule on G/F 金手指有突出块Pin hole on G/F 金手指针孔Profiling 外形加工Poor V-cut V坑不良Board damaged by punching 啤坏板Too shallow V-cut V坑过浅Damage G/F by punching 啤坏金手指Excess depth of V-cut V坑过深Damage board by model 啤模压伤V-cut shift V坑偏位Double V-cut 双重V坑Dimension not meet requirement 尺寸不合要求Out of upper tolerance 外围偏大Missing V-cut 漏V坑Out of lower tolerance 外围偏小Miss routing board 漏锣板Poor bevel 斜边不良Miss punching boards 漏啤板Board cracked by punching 啤爆板Poor routing edge 锣边不良Bevel edge over size 斜边偏大Board damaged by routing 锣坏板Bevel edge under size 斜边偏小Poor punch 啤板不良Missing slot hole 漏SLOT孔Hole cracked by punching 啤爆孔Missing routing G/F bevel edge 漏锣G/F斜边Damaged board 烂板Miss routing hole 漏锣孔Measling after punching 啤后有白点Miss punching hole 漏啤孔Rouging board scrapped by machine 机械锣坏板Outdated boards 周期过期Others 其它Unclear E-T E-T印不清Outdated boards 过期板Damaged edge 板边损坏Old boards(stocked boards 旧板(存仓板)Damaged corner 板角损坏Old boards (customers cleanboard)旧板(客清板)Dent by E-Test 电测压伤Customer returned boards 客户退货Broken board 断板Collected mantissa boards 清尾数板Missing E-T stamp 漏盖E-T印Wrong REV 做错REVOut of inner scraps 超出内层报废ME trial ME试验Old REV 旧REVPE scrap PE报废Receive extra order 接多单QA trial QA试验PPC changed revision PPC转版本ME take board ME取板PE take board PE取板Overdue prepreg 过期P片QA take board QA取板Prepreg broken P片折裂PMC take board PMC取板Black yarn 黑纱Return to material vendor RTV物料供应商Black spot 黑点Return to machine vendor RTV机器供应商Prepreg wrinkle P片折痕Return to subcontractor RTV外发供应商Resin not proportion 树脂分布不均Yellow spot 黄斑(点) Smeary 油污Glue particle 胶粒(印) GT not meet requirement GF不符合要求Fish-eye 鱼眼Dimension deviation 尺寸偏差Extract yarn 抽纱Design defect 设计错误Digging hole 挖洞Distribute wrong laminate 发错物料Dry-ply 树脂脱落Returned materials 退料Discolor 变色White spot in prepreg P片白点Roll edge not neat 卷边不齐Dry ply in prepreg P片缺树脂Cloth weight out of spec. 布重超标Texture expose in prpreg P片织纹显露R/C not meet requirement 树脂含量不符要求Material in prepreg P片杂物F/L not meet requirement 比例流量不符要求Water dipped prepreg P片浸水The joint of cloth decrease 接布头减少Incoming quantity is notenough来料数量不足Voids 空洞Nodules/Burrs 结瘤/披锋Scratches and dents 擦花和凹痕Voids-Copper plating 铜镀层空洞Weave exposed 露织物Plating voids –Finishedcoating成品涂覆层的镀层空间Crazing 微裂纹Panel scratches and dents 板面擦花与凹痕Exposing copper in hole(voids) 孔内露铜(破洞) Skip coverage 跳印Nonmetallic burrs 非金属披锋Weaves/wrinkles/Ripples 波纹/皱褶/皱纹Metallic burrs 金属披锋Tenting (Via holes) 封孔(导通孔) Haloing 晕圈Soda strewing 毛细管空隙Etch back 回蚀Roughness 孔粗Negative etch back 负回蚀Flare 锥口Resin recession 树脂凹痕。

PCB英文缺陷词汇

Wrinkled flex Corner damageUnsupported hole haloingFinger prints/smudge on copper foil 铜面手指印/污渍线路弯曲板角缺损非支撑孔白斑 Measle(Cross-section)Resin starvationDelamination Laminate voidsLaminate voids(Possible measle)Crazing非支撑孔白斑/轻微的机械损坏非支撑孔白斑/严重的机械损坏板边白斑板边白斑与非金属批锋 Measle over inner layer conductor Measled board(Board edge view)Unsupported hole haloing/slight mechanical damage Unsupported hole haloing/severe mechanical damage Haloing along edgeHaloing and nonmetallic burrs along edge 内层导体上面的白点白点板(板边视图)白点(切片)树脂不足分层,爆板碾压空洞碾压空洞(可能是白点)白边在散热区里的碾压空洞在散热区里的碾压空洞/白点碾压空洞与退胶Lamimate voids/measle in thermal zone Lamimate void in thermal zone Laminate void and resin recession 铜箔划伤和凹痕有电镀节点的导体线宽减小/粗糙边缘定义被蚀刻掉的导体织纹显露表面起泡/分层毗邻焊接块的起泡空洞导线悬起导线削减后断线蚀刻不完全被蚀刻掉的导体 (焊接块)/空里电镀空洞)导体针孔导体里的针孔粗糙边缘定义导线电镀铅悬起划伤的露铜导线短路,外来铜丝剥离的导线划伤的导线与基材面划伤的内层导线与基材面 Copper foil-scratch and dent Conductor with plating nodulesConductor width reduction/Rough edge definition Etched conductor Weave texture /exposure Surface blistering/delamination Blistering adjacent to land VoidsConductor overhangConductor undercutting collapse Incomplete etchingEtched conductor(land)/plating void in the hole Conductor-pin hole Pin hole in conductorConductor-rough edge definition Tin/lead plating overhang Scratched conductors exposing copperShorts,extraneous copper Peeled conductorsScratched conductors and substrate Scratched inner conductors and substrateFinger prints/smudge on copper foil 铜面手指印/污渍金手指/差劲的电镀粘合力悬起的焊接块悬起的焊接块和板角裂痕严重悬起的焊接块,板角裂痕 ,内层分离电金粘合力差镀通孔-焊接填充孔的不可润湿性差劲的焊接填充-空洞和去湿性金手指/凹痕,针孔和表面节结在金手指上的电镀凿痕在金手指上的电镀划伤金手指电镀异物有露铜的导线表面不能润湿大面积的去湿有去湿,不能润湿和焊接桥接的导线孔完全填充-上表面不可润湿熔化后的电镀锡/铅喷锡(热风平整)焊接去湿在盲孔里的表面拍偏拍偏 -崩孔内部铜箔裂缝/镀层裂缝(桶状的)拍偏 -没有锡圈内层拍偏焊接去湿与不能润湿表面焊接块锡铅污染拍偏良好的对准度电镀分离表面污染/在铜箔里的非电镀分离Lifted landLifted land and corner crackGold contacts/Poor plating adhesionGold contacts/Pit,pin holes and surface nodules Plating on printed contacts gouged Plating on printed contacts scratched Severe lifted land, corner crack, innerlayer separation Separation between platingsSurface contamination/electroless separation from foil Poor solder fill- voids and dewetting Complete hole fill-nonwetting top surface Tin/lead plating after fusing Hor Air Solder Leveled(HASL)Gold contacts Plating anomalies Gold plating adhesion failure Plated-through hole-solder filled Nonwetting of holeGood registrationMisregistration -no annular ring Solder dewetting and nonwetting surface lands Tin lead contamination Misregistration Solder dewettingConductor surface nonwetting with eposed copper Dewetting of large planeConductor with dewetting,nonwetting and solder bridging Copper plating- separation in plated-through hole Innerlayer separation and rein recession 内层分离和退胶Poor plating adhesion to hole wall孔壁电镀粘合力差Internal foil crack/Plating cracks(barrel)外部铜箔裂缝和板角裂缝胶渍(水平视图)内层分离电镀铜-在镀通孔里的分离有焊接去湿与不能润湿/附加蚀刻铜线的导线Internal foil crack内部铜箔裂缝Conductor with solder dewetting and nonwetting/plus etched conductorsExternal foil crack and corner crack Resin smear(Horizontal view)Surface misregistration in blind via Misregistration- hole breakout Innerlayer separationInnerlayer misregistrationFinger prints/smudge on copper foil铜面手指印/污渍Voids in hole 孔里的空洞Nail heading钉头Plating void 电镀空洞 Protruding glass fibers, wicking and plating fold 玻璃纤维,毛细和镀层重叠突起Thin area in copper plating 在铜镀层里的薄区Plating fold, metal core board镀层重叠,金属芯板Plating void/Barrel crack 电镀空洞/桶状裂缝Gross plating voids 总电镀空洞Plating nodule电镀节结Separation along vertical edge of external foil 沿着外部铜箔竖直边缘的分离Negative etchback负蚀 Negative etchback with plating fold and occlusion 有电镀重叠和闭塞的负蚀Electroless copper 非电镀铜 Etchback(positive)正蚀 Blow hole resulting from plating void 因电镀空洞而吹孔Barrel crack 桶状裂缝Plating fold/Plating nodule 电镀重叠/电镀结节Taper plating锥形电镀 Flxe plating voids, severe damage of flex substrate/Gross dielectric damage 挠性封装底板的挠性电镀空洞,严重损坏/总的非传导性损坏Flex barrel crack 挠性桶状裂缝 Flex plating voids挠性电镀空洞Corner crack 角落裂缝Severe corner crack 严重的角落裂缝Plating crack 电镀裂缝Plating separation (extending beyond vertical edge of external foil)电镀分离(沿着外部铜箔竖直边缘延伸)Plating fold,inclusion,and nodule 电镀重叠,夹杂物和结节Interplane separation内层分离Separation along edge of external foil(top arrow)/Interplane separation (lower arrow)沿着外部铜箔边缘的分离(上面箭头)/内层分离(下面箭头)Horizontal microsection/Pink ring 水平切片/分红圈Horizontal microsection/Plating anomaly 水平切片/ 电镀异物Plating anomaly电镀异物Rough edges粗糙边缘Machining inconsistencies 机械矛盾 Slot (protruding fibers)狭槽(纤维突起)悬起的焊接块/内层分离/孔壁电镀粘合力差/沿着外部焊接块竖直边缘的分离Lifted land/Innerlayer separation/Poor plating adhesion to hole wall/Seperation along vertical edge of external landFinger prints/smudge on copper foil 铜面手指印/污渍Missing hole 少孔Nicked edge on printed contact 印刷手指上的边缘刻痕 Twist 曲 Burr(drilling)批锋(钻孔)Edge condition-burrs (routing )边缘情形-批锋(锣板)Solder resist misregistration绿油拍偏 Solder resist misregistration, surface mount 绿油拍偏,表面安装Bow and twist 板弯曲 Typical solder resist 典型的阻焊(绿油)Incomplete via tenting 不完全via 孔封孔Solder resist blisters绿油起泡Solder resist blisters/delamination 绿油起泡/分层Soda strawing 碱处理粗糙 Good ink marking 良好的水印白字Flaking /peeling压成片/剥离Skip coverage-solder resist bubbles 跳跃覆层-绿油起泡Waves/ripples/wrinkles 起波浪/起波纹/起皱Impression stamped (illegible)压印白字(字迹模糊的)Etched marking 蚀字Smeared marking 油印白字 Impression stamp marking 压印白字效果 Etched marking (missing )蚀字(缺损)Wrong layup,multilayer board 错误压板结构,多层板Innerlayer image reversed 内层图象颠倒Missing or discolored oxide 缺少或变色氧化Pink ring 粉红圈Delamination(thermal zone)分层(散热区)Internal laminate delamination in prepreg area 在PP 区的内部碾压分层Poor trimming 差劲的修整性 Typical rigid-flex 典型刚-挠结合板Typical flex典型挠性板Typical flex (with stiffener)典型挠性板(有硬物)Strain relief张力减小Trimming burrs修整性批锋Rigid-flex anomalies(unsupported hole haloing, solder on gold,trimming burrs,etc)刚-挠异物(非支撑孔白斑,金上焊料,修整性批锋,等等.Corrosion腐蚀Foreign material in covercoat 在覆盖下的异物 Tape residue 磁性残留物Finger prints/smudge on copper foil 铜面手指印/污渍Metal core board with through-hole and blind vias有镀通孔和盲孔的金属芯板Metal core through-hole通孔金属芯板Void in backfill dielectric material of metal core board在金属芯板衬垫绝缘物质里的空洞 Blind vias盲孔Burr on metal core在金属芯板上的批锋Typical flush circuit典型的嵌入式电路Typical flush microsection典型的嵌入式电切片Uneven resin fill flush circuit嵌入式电路不均匀填胶 Foreign material -hair异物-发丝Foreign material-stained异物-污物Surface contamination表面污染Gross multiple problems总的多重问题。

SMT常见不良中英文对照

SMT常见不良中英文对照1.缺件(MISSING PARTS)2.错件(WRONG PARTS)3.多件(EXCESSIVE PARTS)4.短路(SHORT)5.断路(OPEN)6.线短(WIRE SHORT)7.线长(WIRE LONG)8.拐线(WIREPOORDDRESS)9.冷焊(COLD SOLDER)10.包焊(EXCESSSOLDER)11.空焊(MISSING SOLDER)12.锡尖(SOLDER ICICLE)13.锡渣(SOLDER SPLASH)14.锡裂(SODER CRACK)15.锡洞(PINHOLE)16.锡球(SOLDER BALL)17.锡桥(SOLDER BRIDGE)18.滑牙(SCREWLOOSE)19.氧化(RUST)20.异物(FOREIGNER MATERIAL)21.溢胶(EXCESSIVEGLUE)22.锡短路(SOLDER BRIDGE)24.极性反(WRONG POLARITY)25.脚未入(PINUNSEATED)27.脚未剪(PINNOCUT)28脚未弯(PINNOTBENT)29.缺盖章(MISSINGSTAMP)31.缺序号(MISSINGS/N)32.序号错(WRONGS/N)34.标示错(WRONGMARK)35.脚太短(PINSHORT)36.J1不洁(J1DIRTY)37.锡凹陷(SOLDERSCOOPED)38.线序错(W/LOFWIRE)39.未测试(NOTEST)40.VR变形(VRDEFORMED)41.PCB翘皮(PCB PEELING)42.PCB弯曲(PCB TWIST)43.零件沾胶(GLUEONPARTS)44.零件脚长(PARTSPINLONG)45.浮件(PART SLIFT)46.零件歪斜(PARTSTILT)47.零件相触(PARTSTOUCH)48.零件变形(PARTSDEFORMED)49.零件损坏(PARTSDAMAGED)50.零件脚脏(PINDIRTY)51.零件多装(PARTSEXCESS)52.零件沾锡(SOLDERONPARTS)53.零件偏移(PARTSSHIFT)54.包装错误(WRONGPACKING)55.印章错误(WRONGSTAMPS)56.尺寸错误(DIMENSIONWRONG)57.二极管坏(DIODENG)58.晶体管坏(TRANSISTORNG)59.振荡器坏(X’TLNG)60.管装错误(TUBESWRONG)61.阻值错误(IMPEDANCEWRONG)62.版本错误(REVWRONG)63.电测不良(TESTFAILURE)64.版本未标(NONREVLEBEL)65.包装损坏(PACKINGDAMAGED)66.印章模糊(STAMPSDEFECTIVE)67.卷标歪斜(LABELTILT)68.外箱损坏(CARTONDAMAGED)69.点胶不良(POORGLUE)70.IC座氧化(SOCKETRUST)71.缺UL卷标(MISSINGULLABEL)72.线材不良(WIREFAILURE)73.零件脚损坏(PINDAMAGED)74.金手指沾锡(SOLDERONGOLDENFINGERS)76.包装数量错(PACKINGQ’TYWRONG)77.零件未定位(PARTSUNSEATED)79.垫片安装不良(WASHERUNSEATED)80.线材安装不良(WIREUNSEATED)。

PCB及PCBA缺陷中英文对照表

1板面凹痕dent 41漏印字符skip2内层白斑I/L white spot 42金粗Au too big3线路缺口circuit nick 43金簿Au too thin4蚀刻不净undering etching 44金手指缺口G/F voids/nick on G/F5绿油剥离S/M peel off 45金手指发黑G/F too black6显影不净under developing 46字符印反inverse C/M7基材白点 laminate measling 47金手指针孔G/F pinholes8铜面氧化copper oxide 48标志不清symbol unclear9绿油上焊盘s/m on pad 49标志错symbol wrong10白字上焊盘c/m on pad 50绿油鬼影ghost in S/M11阻焊不良poor S/M 51手指印finger print12线路擦花 track scratch 52补线不良poor line repairing13锡上线sn on circuit 53锡高exessive solder14聚锡sn mass 54孔小hole undersize15锡灰sn gray 55字符错wrong C/M16焊盘露铜cu exposed on pad 56字符印偏C/M misalignment17锡上金手指sn on G/F 57字符入孔C/M in hole18金手指凹痕G/F dent 58字符重影C/M doubloe image19金手指擦花G/F scratch 59漏镀金手指missing plating G/F20金手指粗糙G/F roughness 60金手指发白G/F gray21v-cut不良poor V-cut 61焊盘脱落pad break off/pad peel off 22倒边不良poor milling 62焊盘露铜pad expose cu23针床压伤ET dent 63断绿油桥missing S/M bridge24拖锡不良poor touch up 64塞孔block hole25补金不良poor repairing Au 65水迹water print26补油不良poor repairing s/m 66锡珠solder ball27针孔pinhole 67砂孔pitting28胶渍paster stain 68油薄29k孔内毛刺burrs in hole 69聚油excess solder mask30锡珠入孔solder in hole 70锡粗Sn too thick31露铜expose Cu 71线路上锡Sn overlap scratch32露镍expose Ni 72绿油下杂物 contamination under S/M 33绿油起泡solder mask blister 73焊盘损坏land damage34绿油起皱solder mask winbles 74焊盘翘起lifted land35金手指氧化G/F oxiding 75偏位misregistration36金颜色不良Au discoloration 76漏钻孔missing hole37金面凸起Au surface blister 77焊盘缺口nick on pad38绿油入孔solder mask in hole 78线路缺口nick on track39爆板board angle damafe40翘板warp1开路open circuit 46焊盘翘起lifted land2短路short circuit 47漏钻孔missing hole线路狗牙circuit wist 48露布纹weave exposure3线路缺口circuit nick 49钻偏孔hole misregistratiion4线路凹痕circuit dent 50孔损害hole damage5渗镀plating Bloody 51基材分层delamination6焊盘缺口pad nick 52蚀刻过度over etching7内层白斑I/L white spot 53多孔hole too much8黑化不良poor B.O 54残铜remain Cu55孔内露基材 laminate exposure in hole 10粉红圈pinking ring 56焊盘脱落pad break off11层压起泡press blister 57焊盘凹痕pad dent12错位misregistation 58焊盘凸起pad bulge13偏位shift 59焊盘损坏pad damaged14孔内无铜no Cu on Pth 60焊盘缺口pad nick15孔内毛刺hole burrs 61焊盘露铜pad expose Cu16NPTH有铜Cu on NPTH 30修理不良poor repairing17铜面露基材exposed laminate 31铜薄copper too thin18铜面凹痕dent on Cu surface 32内层擦花I/L scratch19胶渍gum residue 33内层偏位I/L misregistation20夹膜D/F nip 34内层杂物I/L inclusions21蚀刻不尽under etching 35掉膜film off22线幼line too thin 36干膜碎D/F meaking23孔大hole oversize 37退锡不尽poor Sn stripping24孔小hole undersize 38间隙小space too marrow25偏孔hole misregistration 39板薄board too thin26铜面瘤粒Cu nodule 40板厚board too thickness27显影不尽under developing 41针孔pinhole28铜面刮伤scratch on Cu surface 42崩孔breakout29塞孔hole plugged 43侧蚀undrcut45亚色dull colour 44镀层粗糙plating layer roughness。

PCB英文缺陷词汇

Wrinkled flex Corner damageUnsupported hole haloingFinger prints/smudge on copper foil 铜面手指印/污渍线路弯曲板角缺损非支撑孔白斑 Measle(Cross-section)Resin starvationDelamination Laminate voidsLaminate voids(Possible measle)Crazing非支撑孔白斑/轻微的机械损坏非支撑孔白斑/严重的机械损坏板边白斑板边白斑与非金属批锋 Measle over inner layer conductor Measled board(Board edge view)Unsupported hole haloing/slight mechanical damage Unsupported hole haloing/severe mechanical damage Haloing along edgeHaloing and nonmetallic burrs along edge 内层导体上面的白点白点板(板边视图)白点(切片)树脂不足分层,爆板碾压空洞碾压空洞(可能是白点)白边在散热区里的碾压空洞在散热区里的碾压空洞/白点碾压空洞与退胶Lamimate voids/measle in thermal zone Lamimate void in thermal zone Laminate void and resin recession 铜箔划伤和凹痕有电镀节点的导体线宽减小/粗糙边缘定义被蚀刻掉的导体织纹显露表面起泡/分层毗邻焊接块的起泡空洞导线悬起导线削减后断线蚀刻不完全被蚀刻掉的导体 (焊接块)/空里电镀空洞)导体针孔导体里的针孔粗糙边缘定义导线电镀铅悬起划伤的露铜导线短路,外来铜丝剥离的导线划伤的导线与基材面划伤的内层导线与基材面 Copper foil-scratch and dent Conductor with plating nodulesConductor width reduction/Rough edge definition Etched conductor Weave texture /exposure Surface blistering/delamination Blistering adjacent to land VoidsConductor overhangConductor undercutting collapse Incomplete etchingEtched conductor(land)/plating void in the hole Conductor-pin hole Pin hole in conductorConductor-rough edge definition Tin/lead plating overhang Scratched conductors exposing copperShorts,extraneous copper Peeled conductorsScratched conductors and substrate Scratched inner conductors and substrateFinger prints/smudge on copper foil 铜面手指印/污渍金手指/差劲的电镀粘合力悬起的焊接块悬起的焊接块和板角裂痕严重悬起的焊接块,板角裂痕 ,内层分离电金粘合力差镀通孔-焊接填充孔的不可润湿性差劲的焊接填充-空洞和去湿性金手指/凹痕,针孔和表面节结在金手指上的电镀凿痕在金手指上的电镀划伤金手指电镀异物有露铜的导线表面不能润湿大面积的去湿有去湿,不能润湿和焊接桥接的导线孔完全填充-上表面不可润湿熔化后的电镀锡/铅喷锡(热风平整)焊接去湿在盲孔里的表面拍偏拍偏 -崩孔内部铜箔裂缝/镀层裂缝(桶状的)拍偏 -没有锡圈内层拍偏焊接去湿与不能润湿表面焊接块锡铅污染拍偏良好的对准度电镀分离表面污染/在铜箔里的非电镀分离Lifted landLifted land and corner crackGold contacts/Poor plating adhesionGold contacts/Pit,pin holes and surface nodules Plating on printed contacts gouged Plating on printed contacts scratched Severe lifted land, corner crack, innerlayer separation Separation between platingsSurface contamination/electroless separation from foil Poor solder fill- voids and dewetting Complete hole fill-nonwetting top surface Tin/lead plating after fusing Hor Air Solder Leveled(HASL)Gold contacts Plating anomalies Gold plating adhesion failure Plated-through hole-solder filled Nonwetting of holeGood registrationMisregistration -no annular ring Solder dewetting and nonwetting surface lands Tin lead contamination Misregistration Solder dewettingConductor surface nonwetting with eposed copper Dewetting of large planeConductor with dewetting,nonwetting and solder bridging Copper plating- separation in plated-through hole Innerlayer separation and rein recession 内层分离和退胶Poor plating adhesion to hole wall孔壁电镀粘合力差Internal foil crack/Plating cracks(barrel)外部铜箔裂缝和板角裂缝胶渍(水平视图)内层分离电镀铜-在镀通孔里的分离有焊接去湿与不能润湿/附加蚀刻铜线的导线Internal foil crack内部铜箔裂缝Conductor with solder dewetting and nonwetting/plus etched conductorsExternal foil crack and corner crack Resin smear(Horizontal view)Surface misregistration in blind via Misregistration- hole breakout Innerlayer separationInnerlayer misregistrationFinger prints/smudge on copper foil铜面手指印/污渍Voids in hole 孔里的空洞Nail heading钉头Plating void 电镀空洞 Protruding glass fibers, wicking and plating fold 玻璃纤维,毛细和镀层重叠突起Thin area in copper plating 在铜镀层里的薄区Plating fold, metal core board镀层重叠,金属芯板Plating void/Barrel crack 电镀空洞/桶状裂缝Gross plating voids 总电镀空洞Plating nodule电镀节结Separation along vertical edge of external foil 沿着外部铜箔竖直边缘的分离Negative etchback负蚀 Negative etchback with plating fold and occlusion 有电镀重叠和闭塞的负蚀Electroless copper 非电镀铜 Etchback(positive)正蚀 Blow hole resulting from plating void 因电镀空洞而吹孔Barrel crack 桶状裂缝Plating fold/Plating nodule 电镀重叠/电镀结节Taper plating锥形电镀 Flxe plating voids, severe damage of flex substrate/Gross dielectric damage 挠性封装底板的挠性电镀空洞,严重损坏/总的非传导性损坏Flex barrel crack 挠性桶状裂缝 Flex plating voids挠性电镀空洞Corner crack 角落裂缝Severe corner crack 严重的角落裂缝Plating crack 电镀裂缝Plating separation (extending beyond vertical edge of external foil)电镀分离(沿着外部铜箔竖直边缘延伸)Plating fold,inclusion,and nodule 电镀重叠,夹杂物和结节Interplane separation内层分离Separation along edge of external foil(top arrow)/Interplane separation (lower arrow)沿着外部铜箔边缘的分离(上面箭头)/内层分离(下面箭头)Horizontal microsection/Pink ring 水平切片/分红圈Horizontal microsection/Plating anomaly 水平切片/ 电镀异物Plating anomaly电镀异物Rough edges粗糙边缘Machining inconsistencies 机械矛盾 Slot (protruding fibers)狭槽(纤维突起)悬起的焊接块/内层分离/孔壁电镀粘合力差/沿着外部焊接块竖直边缘的分离Lifted land/Innerlayer separation/Poor plating adhesion to hole wall/Seperation along vertical edge of external landFinger prints/smudge on copper foil 铜面手指印/污渍Missing hole 少孔Nicked edge on printed contact 印刷手指上的边缘刻痕 Twist 曲 Burr(drilling)批锋(钻孔)Edge condition-burrs (routing )边缘情形-批锋(锣板)Solder resist misregistration绿油拍偏 Solder resist misregistration, surface mount 绿油拍偏,表面安装Bow and twist 板弯曲 Typical solder resist 典型的阻焊(绿油)Incomplete via tenting 不完全via 孔封孔Solder resist blisters绿油起泡Solder resist blisters/delamination 绿油起泡/分层Soda strawing 碱处理粗糙 Good ink marking 良好的水印白字Flaking /peeling压成片/剥离Skip coverage-solder resist bubbles 跳跃覆层-绿油起泡Waves/ripples/wrinkles 起波浪/起波纹/起皱Impression stamped (illegible)压印白字(字迹模糊的)Etched marking 蚀字Smeared marking 油印白字 Impression stamp marking 压印白字效果 Etched marking (missing )蚀字(缺损)Wrong layup,multilayer board 错误压板结构,多层板Innerlayer image reversed 内层图象颠倒Missing or discolored oxide 缺少或变色氧化Pink ring 粉红圈Delamination(thermal zone)分层(散热区)Internal laminate delamination in prepreg area 在PP 区的内部碾压分层Poor trimming 差劲的修整性 Typical rigid-flex 典型刚-挠结合板Typical flex典型挠性板Typical flex (with stiffener)典型挠性板(有硬物)Strain relief张力减小Trimming burrs修整性批锋Rigid-flex anomalies(unsupported hole haloing, solder on gold,trimming burrs,etc)刚-挠异物(非支撑孔白斑,金上焊料,修整性批锋,等等.Corrosion腐蚀Foreign material in covercoat 在覆盖下的异物 Tape residue 磁性残留物Finger prints/smudge on copper foil 铜面手指印/污渍Metal core board with through-hole and blind vias有镀通孔和盲孔的金属芯板Metal core through-hole通孔金属芯板Void in backfill dielectric material of metal core board在金属芯板衬垫绝缘物质里的空洞 Blind vias盲孔Burr on metal core在金属芯板上的批锋Typical flush circuit典型的嵌入式电路Typical flush microsection典型的嵌入式电切片Uneven resin fill flush circuit嵌入式电路不均匀填胶 Foreign material -hair异物-发丝Foreign material-stained异物-污物Surface contamination表面污染Gross multiple problems总的多重问题。

PCB常见不良中英文对照电子厂专业术语

WINDOWS不能軟體關機 QAPLUS 當機音效不良 VGA不良或螢冪雜訊 USB不良凹痕
英文 CACHE MEMORY defect cann't read floppy IDE1 cann't read or error KEYBOARD LOCK error GspReEeEdNeerrroror ror cann't switch LED no light or error speaker error or disorder COM 1/2 defect LPT1 defect CMOS setting error time stopped ID 00 defect CARD defect WINDOWS hang up WINDOWS cann't boot from software QAPLUS hang up audio error VGA error or disorder USB defect sink mark
電源短路 CPU速度不對 MEMORY不良 KEYBOARD不良 HIMEM ERROR或當機凹孔條狀痕表面裂痕橘皮狀表皮皺摺粗糙波動冒汗扭曲翹曲波痕熔塌焊痕白化皺紋
pock mark resin streak resin wear riding sagging saponification scar scrap scrap jam scratch scuffing seam shock line short shot
英文 PCB defect soldering open short missing wrong component invert position shift component shift reverse tombstone component side up solder ball extra soldering poor soldering bar code defect

线路板PCB专业英语词汇(制造、测试、缺陷名等)

Thermoset
热固性
Clad
覆箔
Layup
叠层
laminating
层压
Postcure
后固化
Curing time
固化时间
Resinflow
树脂流动度
Resin content
树脂含量
PCB英语词汇（二）
3 设计
3.1 通用术语
Computer-aided design (CAD)
计算机辅助设计
导线宽度/ቤተ መጻሕፍቲ ባይዱ距
Conductor layer
导线层
Component hole
元件孔
Mountinghole
安装孔
Supported hole
支撑孔
Unsupported hole
非支撑孔
Via
导通孔
Plated through hole
镀通孔
Blind via (hole)
盲孔
Buried via (hole)
消泡剂
resolution
分辨率
definition
逼真度
ghost image
重影
halation
晕环
air inclusion
夹杂气泡
tackiness
粘着性
post cure
后固化
shelf life
保存期
pot life/ working life
适用期
dip coating
浸涂法
roller coating
网版印刷
Silk screen
丝印网版
Stencil
网版
Screenability

常见缺陷中英文对照23

常见缺陷中英文对照23Injection molding / Die casting vocabulary (注塑 / 壓鑄一般述語) Die casting壓鑄Injection molding注塑Gate 水口Gate remnant批水口未清 / 披鋒Flash / excessive flash披鋒 / 嚴重披鋒Short shut / undershot缺料 / 走料不齊Over shot多料 (崩模)Ejector pin mark (Die cast)頂針印 / 痕(壓鑄) Flow mark / flow line / silver streak / weld line夾水紋 / 花紋 / 銀紋Cold flow / cold streak冷紋Oil streak / oily surface油紋 / 油面Splash mark走水紋Air hole / void砂眼 / 氣眼Deformation / warpage / twist變形/ 彎曲 / 扭曲Mold stitching / spur stitching扣模 / 粘模Wrong plastic material用錯膠料Sink mark / dent mark凹陷 / 凹痕Shrinkage / shrink mark縮水Stress mark / ejector mark (injection)頂白 / 發白Burnt mark燒焦點Black spots / black streak黑點 / 黑紋Scratch mark刮花 / 刮痕Cracking裂紋Peel off / chip (die cast)走皮(壓鑄)Part line mismatch / misalignment合模線不對位/ 錯位Dull colour啞色Water mark水紋 / 水印Glossy surface / finishing光面Molded colour mismatch / deviation顏色偏差Pigment色粉Zinc alloy鋅合金Plastic raw material塑膠料Regrind material 水口料 / 翻用料File mark / trim mark銼紋 / 銼損Dirty mark / contamination污糟/ 污漬Material contamination混料Stain mark模漬Blistering起泡Poor surface texture表面粗糙Tread extrusion拉絲Exposed insert露骨Dimension out-specification尺寸不合Mating failure裝配試驗不合格Poor molding-undefined molding defect啤塑差(一般性) Mixing colour混色Incorrect post (die cast)鍋釘尺寸不符Brittleness料脆Casting壓鑄件Gate mark水口位不良Page 1。

PCB专业术语翻译(英语)

PCB专业术语（英语）PCB printed circuit board 印刷电路板，指空的线路板PCBA printed circuit board assembly 印刷电路板组件，指完成元件焊接的线路板组件PW A Printed Wire Assembly，Aperture list Editor：光圈表编辑器。

Aperture list windows：光圈表窗口。

Annular ring：焊环。

Array：拼版或陈列。

Acid trip：蚀刻死角。

Assemby：安装。

Bare Bxnel：光板，未进行插件工序的PCB板。

Bad Badsize：工作台，工作台有效尺寸。

Blind Buried via：盲孔，埋孔。

Chamfer：倒角。

Circuit：线路。

Circuit layer：线路层。

Clamshell tester：双面测试机。

Coordinates Area：坐标区域。

Copy-protect key：软件狗。

Coutour：轮廓。

Draw：一种圆形的光圈，但只是用于创建线路，不用于创建焊盘。

Drill Rack：铅头表。

Drill Rack Editor：铅头表编辑器。

Drill Rack window：铅头表窗口。

D Code：Gerber格式中用不着于表达光圈的代码。

Double-sided Biard：双面板。

End of Block character（EOB）：块结束符。

Extract Netlist：提取网络。

Firdacial：对位标记。

Flash：焊盘，来源于早期矢量光绘机，在矢量光绘机中，焊盘是光通过光圈“闪出”（Flash）而形成的。

Gerber Data：从PCB CAD系统到PCB生产过程中最常用的数据格式。

Grid ：栅格。

Graphical Editor：图形编辑器。

Incremental Data：增量数据。

Land：接地层。

Layer list window：层列表窗口。

PCB缺陷英文对照

PCB缺陷中文名称
漏印字符金粗金簿金手指缺口金手指发黑字符印反金手指针孔标志不清标志错绿油鬼影手指印补线不良锡高孔小字符错字符印偏字符入孔字符重影漏镀金手指金手指发白焊盘脱落焊盘露铜断绿油桥塞孔水迹锡珠砂孔油薄聚油锡粗线路上锡绿油下杂物焊盘损坏焊盘翘起偏位漏钻孔焊盘缺口线路缺口返工不良绿油下氧化焊盘翘起漏钻孔露布纹钻偏孔孔损害基材分层蚀刻过度多孔残铜孔内露基材焊盘脱落焊盘凹痕焊盘凸起焊盘损坏焊盘缺口焊盘露铜修理不良铜薄内层擦花
英文对照
skip Au too big Au too thin G/F voids/nick on G/F G/F too black inverse C/M G/F pinholes symbol unclear symbol wrong ghost in S/M finger print poor line repairing exessive solder hole undersize wrong C/M C/M misalignment C/M in hole C/M doubloe image missing plating G/F G/F gray pad break off/pad peel off pad expose cu missing S/M bridge block hole water print solder ball pitting
poor repairing s/m
pinhole paster stain burrs in hole solder in hole expose Cu expose Ni solder mask blister solder mask winbles G/F oxiding Au discoloration Au surface blister solder mask in hole board angle damafe warp open circuit short circuit circuit wist circuit nick circuit dent plating Bloody pad nick I/L white spot poor B.O measling pinking ring press blister misregistation shift no Cu on Pth hole burrs Cu on NPTH exposed laminate dent on Cu surface

各类SMT缺陷中英文解释

SP MP DS/SS ST 组移连锡件位焊尖放歪
TP SU CS/US WP PE PB P0 PCS 组侧虚错 PAD PCB PCB 线件立焊件脱断烘路立落裂焦短起路
BP 管脚弯曲
CD 组件功能失效
DP NTF 组误件测损坏
Barcode 手机识别码

故障类型号 station locatiom SG CS EP ES FL FM FP GP IS OP PM IP RP SB SH 站元沾冷多多浮外反金少空漏撞极锡锡别件胶焊件锡高来白手锡焊件件性珠孔异指贴物沾反锡
TBA 待分析
TBA 待分析
Barcode 手机识别码
故障类型号 station locatiom SG CS EP ES FL FM FP GP IS OP PM IP RP SB SH 站元沾冷多多浮外反金少空漏撞极锡锡别件胶焊件锡高来白手锡焊件件性珠孔异指贴物沾反锡
SP MP DS/SS ST 组移连锡件位焊尖放歪
TP SU CS/US WP PE PB P0 PCS 组侧虚错 PAD PCB PCB 线件立焊件脱断烘路立落裂焦短起路
BP 管脚弯曲
CD 组件功能失效
DP NTF 组误件测损坏

PCB及PCBA缺陷中英文对照表

PCB及PCBA缺陷中英文对照表 (2010-12-10 205900)001内层开路Inner open002内层断路Inner short003外层开路Outer open004外层断路Outer short005内层蚀刻过度Inner over ecthing006外层蚀刻过度Outer over ecthing007内层树脂气泡Resin void008内层杂物Foreign material009内层图形移位Inner pattern mis-registration 010层与层移位Layer to layer mis-registration 011打孔不良Improper targeting012内层蚀刻不净Inner under etching013露布纹Weave textureexposure014檫花(氧化膜面)Scratch(Oxide surface)015板损坏Damaged board016分层(物料)Delamination (Raw material) 017内层不配套Excessive inner core018板过厚Over thickness019白点(压板)Measling (Pressing)020白点(喷锡)Measling (HSAL)021板曲Warpage022板焦黄Burnt023起皱Wrinkle024起泡(压板)Blistering (Pressing)025镀层起泡Blistering (Cu plating)026喷锡起泡Blistering (HSAL)027板面凹痕DENT (Pressing profilling GF) 028白斑Crazing029胶渣Gum residue030孔未穿Incomplete drilling031披锋Burr032多孔Extra hole033偏孔Hole shift034孔径大Hole oversize035孔径小Hole undersize036少孔Missing Hole037塞孔Block hole038崩孔Hole breakout039孔粗糙(镀铜)Hole roughness(Cu plating)040孔粗糙(机械钻孔)Hole roughness(mechanical drill) 041崩线、线路缺口Nick void on trace042缺口Nick void on pad043曝光过度Over-exposure044曝光不良Under exposure045显影不足Under develop046干膜脱落DF Peel off047干膜碎DF Rdsidue048干膜移位DF Mis-registration049标志不清(曝光)Illegible marking (exposure)050错菲林Wrong AW051非镀铜孔有铜Copper in NPTH052镀铜孔内无铜No copper in PTH053渗镀Nickel smear054电镀粗糙Rough plating055孔壁缺口Hole void (Cu)056金手指颜色不良Gold Finger discoloration057金面颜色不良Gold discoloration058金面阴阳色Two tone colour on gold surface 059铜、镍脱落Copper Nickel peel off060铜镀层厚度超要求Copper thickness out of requirement 061漏镀（金手指等）Skip plating(GF ENIG Cu)062金面污点Stain on gold surface063电镀针孔Plating pits (Cu)064镀锡缺点Tin plating defect065铜碎Copper residue066黑孔Black Hole067镀层白渍Plating haze068金手指凸出Protrusion (GF)069板污Board contamination070手指套Glove mark071褪锡不良Improper Tin stripping072微短路Micro short073粉红圈Pink ring074焊盘崩缺Broken annular ring075蚀刻不净Under etching076焊盘脱落Pad peel off077绿油上焊盘SM on pad078绿油图形移位Pattern mis-registration079绿油露线Expose trace080油薄Uneven SM thickness081入孔SM in hole082绿油冲板不良SM under develop083漏塞孔SM unplugged084IC栏不良Poor IC barrier085绿油脱落SM peel off086塞孔不满Incomplete SM plugging 087多开绿油窗Extra opening088溶剂测试失败Fail in solvent test089漏印Skip printing090水印Water mark091断绿油桥SM Bridge broken092绿油下氧化Oxidation under soldermask 093返工不良Poor rework094错油Wrong Ink095漏印字符Missing legend ink096字符入孔Legend in Hole097字符脱落Legend peel off098字符上焊盘Legend on pad099字符不清Illegible legend100日期不清Illegible date code101锣坑次品Milling Defects102啤板方向错Wrong punch direction103漏锣Missing routing104漏斜切Missing chamfering105斜边过度Over chamfefing106错外形尺寸Wrong outline dimension 107倒边不良Bevelling defect108金手指脱落Gold finger peel off109露镍、铜NiCu exposure110缺口Nick (GF)111涂层不良Poor ENTEK112锡上金手指Solder on GF113上锡不良(缩锡)Dewetting114不上锡(不沾锡)Non wetting115锡珠、锡堆Solder balllump116锡上线Solder on trace117针痕Pin mark118阻抗超出要求Impedance out of requirement 119工程试验Evaluation120微切片(出货)Microsection (outgoing)121微切片(工程试验用)Microsection (engineering)。

PCB及PCBA缺陷中英文对照表

PCB及PCBA缺陷中英文对照表PCB及PCBA缺陷中英文对照表1板面凹痕dent 41漏印字符skip2内层白斑I/L white spot 42金粗Au too big3线路缺口circuit nick 43金簿Au too thin4蚀刻不净undering etching 44金手指缺口G/F voids/nick on G/F 5绿油剥离S/M peel off 45金手指发黑G/F too black6显影不净under developing 46字符印反inverse C/M7基材白点laminate measling 47金手指针孔G/F pinholes8铜面氧化copper oxide 48标志不清symbol unclear9绿油上焊盘s/m on pad 49标志错symbol wrong10白字上焊盘c/m on pad 50绿油鬼影ghost in S/M11阻焊不良poor S/M 51手指印finger print12线路擦花track scratch 52补线不良poor line repairing13锡上线sn on circuit 53锡高exessive solder14聚锡sn mass 54孔小hole undersize15锡灰sn gray 55字符错wrong C/M16焊盘露铜cu exposed on pad 56字符印偏C/M misalignment17锡上金手指sn on G/F 57字符入孔C/M in hole18金手指凹痕G/F dent 58字符重影C/M doubloe image19金手指擦花G/F scratch 59漏镀金手指missing plating G/F20金手指粗糙G/F roughness 60金手指发白G/F gray21v-cut不良poor V-cut 61焊盘脱落pad break off/pad peel off 22倒边不良poor milling 62焊盘露铜pad expose cu23针床压伤ET dent 63断绿油桥missing S/M bridge24拖锡不良poor touch up 64塞孔block hole25补金不良poor repairing Au 65水迹water print26补油不良poor repairing s/m 66锡珠solder ball27针孔pinhole 67砂孔pitting28胶渍paster stain 68油薄S/M too thin29k孔内毛刺burrs in hole 69聚油excess solder mask 30锡珠入孔solder in hole 70锡粗Sn too thick31露铜expose Cu 71线路上锡Sn overlap scratch 32露镍expose Ni 72绿油下杂物contamination under S/M 33绿油起泡solder mask blister 73焊盘损坏land damage34绿油起皱solder mask winbles 74焊盘翘起lifted land35金手指氧化G/F oxiding 75偏位misregistration36金颜色不良Au discoloration 76漏钻孔missing hole37金面凸起Au surface blister 77焊盘缺口nick on pad 38绿油入孔solder mask in hole 78线路缺口nick on track 39爆板board angle damafe40翘板warp1开路open circuit 46焊盘翘起lifted land2短路short circuit 47漏钻孔missing hole线路狗牙circuit wist 48露布纹weave exposure3线路缺口circuit nick 49钻偏孔hole misregistratiion 4线路凹痕circuit dent 50孔损害hole damage5渗镀plating Bloody 51基材分层delamination6焊盘缺口pad nick 52蚀刻过度over etching7内层白斑I/L white spot 53多孔hole too much8黑化不良poor B.O 54残铜remain Cu9爆板measling 55孔内露基材laminate exposure in hole10粉红圈pinking ring 56焊盘脱落pad break off 11层压起泡press blister 57焊盘凹痕pad dent12错位misregistation 58焊盘凸起pad bulge13偏位shift 59焊盘损坏pad damaged14孔内无铜no Cu on Pth 60焊盘缺口pad nick15孔内毛刺hole burrs 61焊盘露铜pad expose Cu 16NPTH有铜Cu on NPTH 30修理不良poor repairing17铜面露基材exposed laminate 31铜薄copper too thin18铜面凹痕dent on Cu surface 32内层擦花I/L scratch19胶渍gum residue 33内层偏位I/L misregistation20夹膜D/F nip 34内层杂物I/L inclusions21蚀刻不尽under etching 35掉膜film off22线幼line too thin 36干膜碎D/F meaking23孔大hole oversize 37退锡不尽poor Sn stripping 24孔小hole undersize 38间隙小space too marrow 25偏孔hole misregistration 39板薄board too thin26铜面瘤粒Cu nodule 40板厚board too thickness27显影不尽under developing 41针孔pinhole28铜面刮伤scratch on Cu surface 42崩孔breakout29塞孔hole plugged 43侧蚀undrcut45亚色dull colour 44镀层粗糙plating layer roughness PCB及PCBA常用度量衡单位换算所属目录：FASTPCBA靖邦公司资料发布时间：2009-01-01 1英尺=12英寸1英寸inch=1000密尔mil1mil=25.4um1mil=1000uin mil密耳有时也成英丝1um=40uin（有些公司称微英寸为麦，其实是微英寸）1OZ=28.35克/平方英尺=35微米H=18微米4mil/4mil=0.1mm/0.1mm线宽线距1ASD=1安培/平方分米=10.76安培/平方英尺1AM=1安培分钟=60库仑主要用于贵金属电镀如镀金1平方分米=10.76平方英尺1盎司=28.35克,此为英制单位1加仑(英制)=4.5升1加仑美制=3.785升1KHA=1000安小时1安培小时=3600库仑比重波美度=145-145/比重SG.SG.比重（克/立方厘米）=145/（145-波美PCB及PCBA行业专用名词PCB及PCBA行业专用名词BOM(Bill of material) 物料需求單Laminate 基板Copper foil 銅箔Solder mask(s/m) 防焊Bare Board 空板Microetching 微蝕Exposure 曝光Dry Film 干膜Matte side 毛面Rcc(Resin coated copper) 背膠銅箔Final shaping 成型Electrical test(ET) 電測Visual Inspection 外觀檢查Gold Finger(G/F) 金手指Legend 文字Post Cure 后烤Desmear 除膠渣Developing 顯影Pattern Plating 線路電鍍Panel Plating 全板電鍍Puddle Effect 水坑效應Oxide Coating 黑氧化Routing Bit 銑刀Tolerance 公差Post Treatment 后處理Adhesion 附著力Stripping 去膜Baking 烘烤AQL(acceptable quality level) 品質允收水準Optical Target 光學靶點Lay up 疊合Chromation 鉻化處理Undercut 側蝕Microvia 微孔Annular Ring 孔環Burr 毛頭Entek 有機保焊處理Conformal Mask 銅窗Drum Side 光面Diazo Film 偶氮棕片Cut Lamination 下料Sheets Cutting 裁板Inner Layer Drilling 內層鑽孔Outter Layer Drilling 一次孔2nd Drilling 二次孔PCB及PCBA专用名词Laser Drilling 雷射鉆孔Blind&Burried Hole Drilling 盲(埋)孔鉆孔screen printing 網版印刷silk screen 絲網印刷scum 透明殘膜skip printing 跳印漏印squeege 刮刀type 种類abietic acid 松脂酸air knife 風刀bridging 搭橋橋接flux 助焊劑product process 制程pre-process 制前solder bridge 錫橋soler bump 錫突solder plug 錫塞immersion gold 浸金(化金)thin core 薄基板twist 板翘, 板扭warp ,warpage 板彎weave eposure 織紋顯露wicking 燈蕊效應yield 良品abrasion resistance 耐磨性absorption 吸收accelerated test 加速實驗acceleration 速化反應accelerator 加速剂batch 批cold solder joint 冷焊點component side 零件面double side 雙面double side board 雙面板fiducial mark 基準記號finished board 成品板lot size 批量rack 掛架register mark 對準用標記solder side 錫鉛面thickness 厚度warehouse 仓库wet process 濕制程Beveling 斜邊chamfer 道角dimension 尺寸Fixture 治具interconnection 互相連通line space 線距line width 線寬misregistration 對不准mouse bite 蝕刻缺口nick 缺口master drawing 主圖print and etch board 印刷後及蝕刻後板crease 皺褶dent 凹陷glass fiber 玻璃纖維布pin hole 針孔pit 凹點target hole 靶孔PCBA及PCB专用名词(二)PCBA及PCB专用名词(二)Black Oxide Removal 黑化還原Plug Hole 塞孔Ink Print&precure 印刷及預烤Scrub 表面處理Spray Coating 靜電噴涂Printing of Legend 文字印刷Pumice ( Wet Blasting) 噴砂Immersion Ni/Au(Electoless Ni/Au) 浸鎳金Hot Air Solder Leveling 噴錫N/C routing 撈型Beveling of G/F 金手指斜边Cleanning&Baking 清洗及烘烤Fixture Testing 治具測試original A/W 客戶原稿working A/W 工作片working master 工作母片carlson pin 定位梢component hole(>30mil) 零件孔drill facet 鑽尖切削面drill pointer 鑽尖重磨機drilled blank board 已鑽孔的裸板hole diameter 孔徑hole location 孔位hole number 孔數lay back 刃角磨損margin 鑽頭刃帶open circuits 斷路runout 偏轉slot 開槽spindle 鑽軸tooling hole 工具孔stacking structure 疊板結構blow hole, void in PTH hole 吹孔孔破deburring 去毛頭electroless-deposition 無電鍍化etchback 回蝕air inclusion 氣泡chase 網框fabric 網布liquid 液態\狀mealing 泡點trim line 裁切線v-cut v型切槽golden board 標準板back lighting 背光crack 裂痕crazing 白斑dimension stability 尺寸安全性failure 故障fault 缺陷瑕疵gap 鑽尖分開gel time 膠化時間haloing 白邊白圈hardener 硬化劑hole counter 數孔機hook 外弧insulation resistance 絕緣阻抗ionizable(ionic) contaminants 離子性污染land 焊墊microsectioning 微切片法negative etchback 反回蝕overlap 鑽尖重曡peel strength 抗撕強度pink ring 粉紅圈REJ(reject) 拒收退貨release agent(sheets) 脫膜劑resin content 膠含量resin flow 膠流量resin recession 樹脂下限resin smear 膠渣rework 重工specification(spec.) 規範innerlayer&outlayer 內外層gold plating 鍍金QC(quality control) 品管back up 墊板blister 起泡局部分层caul plate 隔板, 钢板open circuits 断路sampling size 抽樣數edge spacing 板邊空地ground plane 接地層laminator 壓膜機M/T 磁帶disk 磁片。

SMT常见不良中英文对照

1.缺件(MISSING PARTS)2.错件(WRONG PARTS)3.多件(EXCESSIVE PARTS)4.短路(SHORT)5.断路(OPEN)6.线短(WIRE SHORT)7.线长(WIRE LONG)8.拐线(WIREPOORDDRESS)9.冷焊(COLD SOLDER)10.包焊(EXCESSSOLDER)11.空焊(MISSING SOLDER)12.锡尖(SOLDER ICICLE)13.锡渣(SOLDER SPLASH)14.锡裂(SODER CRACK)15.锡洞(PINHOLE)16.锡球(SOLDER BALL)17.锡桥(SOLDER BRIDGE)18.滑牙(SCREWLOOSE)19.氧化(RUST)20.异物(FOREIGNER MATERIAL)21.溢胶(EXCESSIVEGLUE)22.锡短路(SOLDER BRIDGE)24.极性反(WRONG POLARITY)25.脚未入(PINUNSEATED)27.脚未剪(PINNOCUT)28脚未弯(PINNOTBENT)29.缺盖章(MISSINGSTAMP)31.缺序号(MISSINGS/N)32.序号错(WRONGS/N)34.标示错(WRONGMARK)35.脚太短(PINSHORT)36.J1不洁(J1DIRTY)37.锡凹陷(SOLDERSCOOPED)38.线序错(W/LOFWIRE)39.未测试(NOTEST)40.VR变形(VRDEFORMED)41.PCB翘皮(PCB PEELING)42.PCB弯曲(PCB TWIST)43.零件沾胶(GLUEONPARTS)44.零件脚长(PARTSPINLONG)45.浮件(PART SLIFT)46.零件歪斜(PARTSTILT)47.零件相触(PARTSTOUCH)48.零件变形(PARTSDEFORMED)49.零件损坏(PARTSDAMAGED)50.零件脚脏(PINDIRTY)51.零件多装(PARTSEXCESS)52.零件沾锡(SOLDERONPARTS)53.零件偏移(PARTSSHIFT)54.包装错误(WRONGPACKING)55.印章错误(WRONGSTAMPS)56.尺寸错误(DIMENSIONWRONG)57.二极管坏(DIODENG)58.晶体管坏(TRANSISTORNG)59.振荡器坏(X’TLNG)60.管装错误(TUBESWRONG)61.阻值错误(IMPEDANCEWRONG)62.版本错误(REVWRONG)63.电测不良(TESTFAILURE)64.版本未标(NONREVLEBEL)65.包装损坏(PACKINGDAMAGED)66.印章模糊(STAMPSDEFECTIVE)67.卷标歪斜(LABELTILT)68.外箱损坏(CARTONDAMAGED)69.点胶不良(POORGLUE)70.IC座氧化(SOCKETRUST)71.缺UL卷标(MISSINGULLABEL)72.线材不良(WIREFAILURE)73.零件脚损坏(PINDAMAGED)74.金手指沾锡(SOLDERONGOLDENFINGERS)76.包装数量错(PACKINGQ’TYWRONG)77.零件未定位(PARTSUNSEATED)79.垫片安装不良(WASHERUNSEATED)80.线材安装不良(WIREUNSEATED)。

PCB及PCBA常用英语汇总 1-5

1 板面凹痕dent2 内层白斑I/L white spot3 线路缺口circuit nick4 蚀刻不净under etching5 绿油剥离S/M peel off6 显影不净under developingmeasling7 基材白点 laminate8 铜面氧化copper oxide9 绿油上焊盘s/m on pad10 白字上焊盘c/m on pad11 阻焊不良 poorS/Mscratch12 线路擦花 track13 锡上线 sncircuitonmass14 聚锡 sn15 锡灰sn gray16 焊盘露铜cu exposed on pad17 锡上金手指sn on G/F18 金手指凹痕G/F dent19 金手指擦花G/F scratch20 金手指粗糙G/F roughness21 v-cut不良poor V-cut22 倒边不良poor milling23 针床压伤ET dent24 拖锡不良poor touch up25 补金不良poor repairing Au26 补油不良poor repairing s/m27 针孔 pinholestain28 胶渍 paster29 孔内毛刺burrs in hole30 锡珠入孔solder in hole31 露铜expose Cu32 露镍expose Ni33 绿油起泡solder mask blister34 绿油起皱solder mask wrinkles35 金手指氧化G/F oxiding36 金颜色不良Au discoloration37 金面凸起Au surface blister38 绿油入孔solder mask in holedamage 39 爆板 boardangle40 翘板warp41 漏印字符skip42 金粗 Aubigtoothin43 金簿 Autoo44 金手指缺口G/F voids/nick on G/F45 金手指发黑G/F too black46 字符印反inverse C/M47 金手指针孔G/F pinholes48 标志不清symbol unclearwrong49 标志错 symbol50 绿油鬼影ghost in S/Mprint51 手指印 finger52 补线不良poor line repairingsolder53 锡高 excessiveundersize54 孔小holeC/M55 字符错 wrong56 字符印偏C/M misalignment57 字符入孔C/M in hole58 字符重影C/M double image59 漏镀金手指missing plating G/F60 金手指发白G/F gray61 焊盘脱落pad break off/pad peel off62 焊盘露铜pad expose cu63 断绿油桥missing S/M bridge64 塞孔 blockholeprint65 水迹 waterball66 锡珠 solder67 砂孔 pitting68 油薄mask69 聚油 excesssolderthick70 锡粗 Sntoo71 线路上锡Sn overlap scratch72 绿油下杂物contamination under S/M (Foreign material under S/M)73 焊盘损坏(Pad)land damage74 焊盘翘起lifted (Pad)land75 偏位 misregistrationhole76 漏钻孔 missing77 焊盘缺口nick on pad78 线路缺口nick on trackcircuit1 开路opencircuit2 短路 short3. 线路狗牙circuit wist3 线路缺口circuit nick4 线路凹痕circuit dentbleeding5 渗镀 plating6 焊盘缺口pad nick7 内层白斑I/L white spot8 黑化不良poor B.O9 爆板 delaminationring10 粉红圈 pinking11 层压起泡press blister12 错位 misregistation13 偏位 shift14 孔内无铜no Cu on PTH (PTH V oid)15 孔内毛刺hole burrs16 NPTH有铜Cu on NPTH17 铜面露基材exposed laminate18 铜面凹痕dent on Cu surfacestain19 胶渍 gumnip20 夹膜 D/F21 蚀刻不尽under etchingthintoo22 线幼 lineoversize23 孔大 holeundersize24 孔小 holemisregistration25 偏孔 hole26 铜面瘤粒Cu nodule27 显影不尽under developing28 铜面刮伤scratch on Cu surface29 塞孔 holeplugged30 修理不良poor repairingthin31 铜薄 coppertoo32 内层擦花I/L scratch33 内层偏位I/L misregistation34 内层杂物I/L inclusionsoffpeel35 掉膜 D/F36 干膜碎D/F residual37 退锡不尽poor Sn strippingnarrowtoo38 间隙小 spacethin39 板薄 boardtootoothickness40 板厚 board41 针孔 pinhole42 崩孔 breakout43 侧蚀 undercut44 镀层粗糙plating layer roughnesscolour45 亚色 dull46 焊盘翘起lifted (Pad)landhole47 漏钻孔 missingexposure48 露布纹 weavemisregistratiion 49 钻偏孔 holedamage50 孔损害 hole51 基材分层 delaminationetching52 蚀刻过度 overtoomany53 多孔 hole54 残铜remain Cu55 孔内露基材laminate exposure in holeoff)(peel56 焊盘脱落 padbreakoffdent57 焊盘凹痕 padbulge58 焊盘凸起 paddamaged59 焊盘损坏 padnick60 焊盘缺口 padCu61 焊盘露铜 padexpose1 内层开路Inner open2 内层短路Inner short3 外层开路Outer open4 外层短路Outer short5 内层蚀刻过度Inner over etching6 外层蚀刻过度Outer over etching7 内层树脂气泡Resin void8 内层杂物Foreign material9 内层图形移位Inner pattern mis-registration10 层与层移位Layer to layer mis-registration11 打孔不良Improper targeting12 内层蚀刻不净Inner under etching13 露布纹Weave texture/exposure14 擦花（氧化膜面）Scratch(Oxide surface)15 板损坏Damaged board16 分层（物料）Delamination (Raw material)17 内层不配套Excessive inner core (mismatch inner layer cores)18 板过厚Over thickness19 白点（压板）Measling (Pressing)20 白点（喷锡）Measling (HASL)21 板曲 Warpage22 板焦黄Burnt23 起皱Wrinkle24 起泡（压板）Blistering (Pressing)25 镀层起泡Blistering (Cu plating)26 喷锡起泡Blistering (HASL)27 板面凹痕DENT (Pressing profiling G/F)28 白斑Crazing29 胶渣Gum residue30 孔未穿Incomplete drilling31 披锋Burr32 多孔Extra holeshift33 偏孔 Hole34 孔径大Hole oversize35 孔径小Hole undersize36 少孔Missing Holehole37 塞孔 Blockbreakout38 崩孔 Holeroughness（Cu plating)39 孔粗糙(镀铜） Hole40 孔粗糙机械钻孔）Hole roughness(Mechanical drill)41 崩线、线路缺口 Nick/void on trace42 缺口Nick/void on pad43 曝光过度Over-exposure44 曝光不良Under exposure45 显影不足Under develop46 干膜脱落D/F Peel off47 干膜碎D/F Residue/Residual48 干膜移位D/F Mis-registration49 标志不清（曝光）Illegible marking (exposure)50 错菲林Wrong A/W51 非镀铜孔有铜Copper in NPTH52 镀铜孔内无铜No copper in PTHsmear53 渗镀 Nickelplating54 电镀粗糙 Roughvoid(Cu)55 孔壁缺口 Hole56 金手指颜色不良Gold Finger discolorationdiscoloration57 金面颜色不良 Gold58 金面阴阳色Two tone colour on gold surface59 铜、镍脱落Copper/Nickel peel off60 铜镀厚度超要求Copper thickness out of requirement61 漏镀（金手指等）Skip plating(G/F ENIG Cu)62 金面污点 Staingoldsurfaceon63 电镀针孔Plating pits (Cu) (Plating Pinholes)defect64 镀锡缺点 Tinplatingresidue65 铜碎 Copper66 黑孔Black Hole67 镀层白渍Plating haze68 金手指凸出Protrusion (G/F)contamination69 板污 Boardmark70 手指套印 Glove71 褪锡不良Improper Tin stripping72 微短路Micro shortring73 粉红圈 Pink74 焊盘崩缺Broken annular ring （Broken Pad）75 蚀刻不净Under etching76 焊盘脱落Pad peel off77 绿油上焊盘S/M on pad78 绿油图形移位Pattern mis-registration79 绿油露线Expose tracethickness80 油薄 UnevenS/Minhole81 入孔 S/M82 绿油冲板不良S/M under developunplugged83 漏塞孔 S/M84 IC栏不良Poor IC barrier85 绿油脱落S/M peel off86 塞孔不满Incomplete S/M plugging87 多开绿油窗Extra opening88 溶剂测试失败Fail in solvent test89 漏印 Skipprintingmark(stain)90 水印 Water91 断绿油桥S/M Bridge broken92 绿油下氧化Oxidation under solder mask93 返工不良Poor reworkInk94 错油 Wrong95 漏印字符Missing legend ink96 字符入孔Legend in Hole97 字符脱落Legend peel off98 字符上焊盘Legend on pad99 字符不清Illegible legend100 日期不清Illegible date code101 锣坑次品Milling (Routing) Defects 102 啤板方向错Wrong punch directionrouting103 漏锣 Missingchamfering104 漏斜切 Missing105 斜边过度Over chamfefing106 错外形尺寸Wrong outline dimension 107 倒边不良Bevelling defect108 金手指脱落Gold finger peel off109 露镍、铜Ni/Cu exposure110 缺口 Nick(G/F)111 涂层不良Poor ENTEK112 锡上金手指Solder on G/F113 上锡不良Dewetting114 不上锡 Nonwetting115 锡珠、锡堆Solder ball/lumptraceon116 锡上线 Solder117 针痕Pin mark118 阻抗超出要求Impedance out of requirement 119 工程试验Engineering Evaluation 120 微切片Microsection。

线路板PCB专业英语词汇(制造、测试、缺陷名等)

Copper-clad surface
铜箔面
Foil removal surface
去铜箔面
Length wise direction
纵向
cross wise direction
横向
Core material
内层芯材
2.2基材的材料
A-stage resin
A阶树脂
B-stage resin
B阶树脂
Job traveller
工作流程单
4.2照相底版制作
Artwork
照相底图
Phototool
照相底版
Artwork master
照相原版
Working master
工作原版
Production master
生产底版
Photographic film
照相底片
Silver film
银盐底片
Diazo film
Flexible printed circuit board
挠性印制电路板
Flex-rigid printed circuit board
挠性印制电路板
Build-up printed board
积层印制板
Surface laminar circuit (SLC)
表面层合电路板
B2it printd board
circuit board (SSB)
单面印制电路板
double-sided printed
circuit board (SSB)
双面印制电路板
Multilayer printed
circuit board (MLB)
多层印制电路板
Rigid printed circuit board

PCB专业英语汇总持续更新

PCB专业英语汇总持续更新1产品类型刚性板 Rigid board挠性板柔性板刚挄板刚柔结合板印刷电路印制电路板金属基板金属基板 PCB铝基板铝基印制板铜基板铜基印制板高频板高频PCB盲孔板盲板埋孔板埋地板裸板裸板样板快转原型批发订单量产2 物料描述·覆铜板（CCL）（覆铜板）（芯）·prepreg(半固化片)·环氧树脂（环保树脂）·非导电环氧树脂（非导电树脂）·导电环氧树脂（导电树脂）·铜箔（铜箔）·介质（介质）·ptfe (Polytetralluoetylene) 聚四氟乙烯·介电常数（介电常数）3 设备描述·阻抗控制测试系统（阻抗控制测试仪）·飞针测试FPT （飞针检测仪器）·夹具测试（夹具测试）·自动光学仪器AOI（自动光学检测仪器）4表面工艺描述沉金Immersion Gold =Chemical Gold=Immersion Ni/Au=electroless Gold Plating ENIG= electroless Nickel 沉锡（IMSn）:Immersion Sn沉银（IMAg）:Immersion Ag有机保焊膜（OSP）：Organic SolderabilityPreservatives=Entek 106电镀金electroplated gold plating =Electrical Goldplating金手指Gold Fingers=Edge Connector Plating=Tab connector 无铅喷锡Lead Free HASL=HASL LF=HASL for Pb Free=SN100C=RoHS HAL有铅喷锡（HASL/HAL）HAL=Hot Air Leveling HASL=Hot Air Solder Leveling Sn/Pb(63/36) Tin-Lead solder裸铜Bare copper Blank Copper拼板和外形的相关描述倒角 Chamfer桥连 Bridge Connecting/TabConnecting桥连邮票孔 Connecting tabs with Stamp holesConnecting tabs with Mouse(Mice)Bite holes工艺边 Rails(Tooling Rails)/T ooling StripFrames/Panel Frame/HoldingFrame/Waste Edge/scrap学习学习了学习了支持小编继续品质缺陷常见英语•偏孔hole misregistration•披锋毛刺Burr•多孔Extra hole•破孔Hole breakout•分层 delamination•绿油上焊盘 S/M on pad•开窗露线 Expose trace•绿油入孔 S/M in hole•绿油脱落 S/M peel off•多开绿油窗 Extra opening•漏印字符 Missing legend/silkscreen•字符入孔 Legend in Hole•字符脱落 Legend peel off•字符上焊盘 Legend on pad•字符不清 Illegible legend•锡上金手指 Solder on G/F•锡珠 Solder ball/lump•可焊性不良 bad SolderabilityLaminates (cores ,C-Stage) 覆铜板(芯板)1.Fully cured fiberglass-resin system 完全胶连的玻璃树脂系2.Identified by core thickness, copper weight 由芯板厚度、铜箔重量区分3.Flammability rating/Flame retardant class阻燃等级、4.Dielectric constant 介电常数、5.Glass transition temperature (Tg) 玻璃转化温度6.Coefficient of thermal expansion (CTE) 热膨胀系数Prepreg(B-stage) 半固化片1.Partially cured fiberglass-resin system 部分胶连的玻璃布树脂系统2.Flow and no flow 流动与非流动3.Identified by glass type(Pressed Thickness、Resin Content、Gel time) 依据玻璃布类型区分、鉴别学习~~！生产工程设计英语•PCB Specifications(PCB说明)•CAD (computer aided design) (计算机辅助设计)•lay out(布线)•CAM (computer aided[eidid] manufacture) (计算机辅助制造)•EDA (Electronic design automatic) (电子设计自动化)•MI (manufacture information) (制造说明)•NOPE ( no process engineering ) (重订单)•external layer(外层)•internal layer(内层)•power layer(电源层)•ground layer(接地层)•signal layer(信号层)•conductor track/line(导线)•gap spacing(间隙)•tear pad/teardrop (泪滴焊盘)•isolation pad(隔离焊盘)•thermal pad(热焊盘)•annular ring(孔环)好哎，支持小编学习了，支持小编生产工程设计英语target(标靶)Golden board(黄金板、测试标准板) photo /laser plotting)(激光光绘) positive(正片)negative(负片)origin(原点)datum reference (参考基准) 、offset (偏移)基准（反光点）网格（网格）铜条（残铜）钻头图(钻符图)装配图(装配图)面板图(拼板图)层楼上图(层叠图)纵横比（厚径比）半径(半径，范围)diameter (dia.直线)补偿（补偿）埋头孔尺寸稳定性（尺寸稳定性）misregistration (焊锡面与零件面对位偏差) 收益率(利用率 )。

PCB-专用术语

85 吸嘴 86 定心爪 87 贴装精度 88 焊接 89 再流焊 90 波峰焊 91 气相焊接 92 组装密度 93 混装技术 94 引线 95 平移偏差 96 旋转偏差 97 贴装速度
98 低中高速贴装机 99 焊端 100 球栅阵列 101 贴装 102 贴装机 103 供料器 104 活化剂
七、机械加工成形术语
208 数控 209 电脑数控 210 垫板 211 盖板 212 钻套 213 钻柄 214 切削量 215 犁沟 216 树脂钻污 217 铜箔毛刺 218 玻璃纤维突出 219 碎屑 220 破出 221 磨钻头机 222 激光穿孔 223 牛皮纸 224 粘结层 225 滑移 226 缺胶
brushing,scrubbing scrubber mechanical cleaning
181 超声波清洗 182 喷射清洗 183 化学除油 184 溢流 185 去离子水(DI)
1六86 污化、检测术语
195 粘合强度 196 拉脱强度 197 剥离强度 198 弯曲强度 199 伸长率 200 抗扭强度
47 晕圈
haloing
48 粉红圈
pink ring
49 起泡
blister
50 夹杂物
incusion
51 槽边有毛刺
excessive burrs around cavity
52 白斑
measling
53 粉点
mealing
54 漏啤
missing punching
55 锣板不良
poor rounting
187 磨刷 188 磨刷机 189 机械清洗
alkali etchant under cut catalyzing rectifier plating rack anode

PCB缺陷英语汇总open circuit 开路short circuit2短路circuit wist开路狗牙circuit nick3开路缺口circuit dent4开路凹痕plating Bloody5渗开pad nick6开开缺口I/L white spot7内开白斑poor B.O8黑化不良measling9爆板pinking ring10粉开圈press blister11开开起泡misregistation12开位shift13偏位no Cu on Pth14孔无开内hole burrs15孔毛刺内Cu on NPTH16NPTH有开exposed laminate17开面露基材dent on Cu surface18开面凹痕gum residue19胶开D/F nip20开膜under etching21开刻不尽line too thin22开幼hole oversize23孔大hole undersize24孔小hole misregistration25偏孔Cu nodule26开面瘤粒under developing27开影不尽scratch on Cu surface28开面刮开hole plugged29塞孔poor repairing30修理不良copper too thin31开薄I/L scratch 32内开擦花I/L misregistation33内开偏位I/L inclusions34内开开物film off35掉膜D/F meaking36干膜碎poor Sn stripping37退开不尽space too marrow38开隙小board too thin39板薄board too thickness40板厚pinhole41开孔breakout42崩孔undrcut43开开plating layer roughness44开开粗糙dull colour45开色lifted land46开开开起missing hole47漏开孔weave exposure48露布开hole misregistratiion49开偏孔hole damage50孔开害delamination51基材分开over etching52开刻开度hole too much53多孔remain Cu54残开laminate exposure in hole55孔露基材内pad break off56开开落脱pad dent 57开开凹痕pad bulge 58开开凸起pad damaged59开开开坏pad nick60开开缺口pad expose Cu61开开露开dent1板面凹痕I/L white spot2内开白斑circuit nick3开路缺口undering etching4开刻不开S/M peel off5开油剥离under developing6开影不开laminate measling7基材白点copper oxide8开面化氧s/m on pad9开油上开开c/m on pad10白字上开开poor S/M11阻开不良12开路擦花track scratchsn on circuit13开上开sn mass14聚开sn gray15开灰cu exposed on pad16开开露开sn on G/F17开上金手指G/F dent18金手指凹痕G/F scratch19金手指擦花G/F roughness20金手指粗糙poor V-cut21v-cut不良poor milling22倒开不良ET dent23开床开开poor touch up24拖开不良poor repairing Au25开金不良poor repairing s/m26开油不良pinhole27开孔paster stain28胶开burrs in hole29k孔毛刺内solder in hole30开珠入孔expose Cu31露开expose Ni32露开solder mask blister33开油起泡solder mask winbles34开油起开G/F oxiding35金手指化氧Au discoloration36金开色不良Au surface blister37金面凸起solder mask in hole38开油入孔board angle damafe39爆板warp40开板。