ASM 自动焊线机器介绍Au wire bonding process参考文档
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Section 9.3
Basic Au Wire Bond Process
8-Apr-20
ASM Pacific Technology Ltd. © 2009
page 1
Contents
Basic Introduction Gold Wire Bonder Bonding Sequence Material & Tools Bond Quality
page 11
Comparison of Different Wire Bonding Techniques
Wirebonding
Thermocompression
Operating Temperature
300-500°C
Wire Materials
Au
Pad Materials
Al, Au
Note
8-Apr-20
ASM Pacific Technology Ltd. © 2009
page 10
Advantages of Thermosonic
Metallurgical joining is more reliable than conductive particles and adhesive joining.
Wafer Grinding
Wafer Saw
Die Bonding
Toaster
Wire Bonding
Die Surface Coating
Molding
Laser Mark
BGA
SURFACE MOUNTPKG THROUGH HOLE PKG
8-Apr-20
Solder Ball Placement
Thermosonic welding, the interface temperature can be much lower, typically between 100 to 150°C, which avoids such problems. The ultrasonic energy helps disperse contaminates during the early part of the bonding cycle and helps complete the weld in combination with the thermal energy.
ASM Pacific Technology Ltd. © 2009
page 3
Cross-section of an IC Package
Gold Wire
Die
Lead Frame
8-Apr-20
ASM Pacific Technology Ltd. © 2009
page 4
IC Manufacturing Flow
Thermocompression bonding: utilizes temperature and high impact force, and the wedge method only.
8-Apr-20
ASM Pacific Technology Ltd. © 2009
page 9
Thermocompression vs Thermosonic
Process cycle time can be reduced from several minutes to less than 10 seconds.
Lower manufacturing cost per unit.
8-Apr-20
ASM Pacific Technology Ltd. © 2009
What technique is used in Gold Wire Bonding?
8-Apr-20
ASM Pacific Technology Ltd. © 2009
page 8
Wire Bonding Techniques
There are three basic wire bonding techniques:
High pressure, no ultrasonic energy
8-Apr-20
ASM Pacific Technology Ltd. © 2009
page 2
Basic Introduction
Understand an IC Package IC Manufacturing Flow Wire Bonding Introduction
8-Apr-20
Wedge Bond ( 2nd Bond )
Gold wire
Die Pad
Lead
8-Apr-20
Baidu Nhomakorabea
ASM Pacific Technology Ltd. © 2009
page 6
Wedge Bonding
8-Apr-20
ASM Pacific Technology Ltd. © 2009
page 7
Thermocompression welding usually requires interfacial temperature of the order of >300°C. This temperature can damage some die attach plastics, packaging materials, and laminates, as well as some sensitive chips.
Dejunk Trim
Solder Plating
Singulation
Solder Plating
Forming/ Singulation
Trim/
Forming
ASM Pacific Technology Ltd. © 2009
Packing
page 5
Gold Wire Bonding
Ball Bond ( 1st Bond )
Thermosonic bonding: utilizes temperature, ultrasonic and low impact force, and ball/ wedge methods.
Ultrasonic bonding: utilizes ultrasonic and low impact force, and the wedge method only.
Basic Au Wire Bond Process
8-Apr-20
ASM Pacific Technology Ltd. © 2009
page 1
Contents
Basic Introduction Gold Wire Bonder Bonding Sequence Material & Tools Bond Quality
page 11
Comparison of Different Wire Bonding Techniques
Wirebonding
Thermocompression
Operating Temperature
300-500°C
Wire Materials
Au
Pad Materials
Al, Au
Note
8-Apr-20
ASM Pacific Technology Ltd. © 2009
page 10
Advantages of Thermosonic
Metallurgical joining is more reliable than conductive particles and adhesive joining.
Wafer Grinding
Wafer Saw
Die Bonding
Toaster
Wire Bonding
Die Surface Coating
Molding
Laser Mark
BGA
SURFACE MOUNTPKG THROUGH HOLE PKG
8-Apr-20
Solder Ball Placement
Thermosonic welding, the interface temperature can be much lower, typically between 100 to 150°C, which avoids such problems. The ultrasonic energy helps disperse contaminates during the early part of the bonding cycle and helps complete the weld in combination with the thermal energy.
ASM Pacific Technology Ltd. © 2009
page 3
Cross-section of an IC Package
Gold Wire
Die
Lead Frame
8-Apr-20
ASM Pacific Technology Ltd. © 2009
page 4
IC Manufacturing Flow
Thermocompression bonding: utilizes temperature and high impact force, and the wedge method only.
8-Apr-20
ASM Pacific Technology Ltd. © 2009
page 9
Thermocompression vs Thermosonic
Process cycle time can be reduced from several minutes to less than 10 seconds.
Lower manufacturing cost per unit.
8-Apr-20
ASM Pacific Technology Ltd. © 2009
What technique is used in Gold Wire Bonding?
8-Apr-20
ASM Pacific Technology Ltd. © 2009
page 8
Wire Bonding Techniques
There are three basic wire bonding techniques:
High pressure, no ultrasonic energy
8-Apr-20
ASM Pacific Technology Ltd. © 2009
page 2
Basic Introduction
Understand an IC Package IC Manufacturing Flow Wire Bonding Introduction
8-Apr-20
Wedge Bond ( 2nd Bond )
Gold wire
Die Pad
Lead
8-Apr-20
Baidu Nhomakorabea
ASM Pacific Technology Ltd. © 2009
page 6
Wedge Bonding
8-Apr-20
ASM Pacific Technology Ltd. © 2009
page 7
Thermocompression welding usually requires interfacial temperature of the order of >300°C. This temperature can damage some die attach plastics, packaging materials, and laminates, as well as some sensitive chips.
Dejunk Trim
Solder Plating
Singulation
Solder Plating
Forming/ Singulation
Trim/
Forming
ASM Pacific Technology Ltd. © 2009
Packing
page 5
Gold Wire Bonding
Ball Bond ( 1st Bond )
Thermosonic bonding: utilizes temperature, ultrasonic and low impact force, and ball/ wedge methods.
Ultrasonic bonding: utilizes ultrasonic and low impact force, and the wedge method only.