IModule 13 Process Capability

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封装专用英语词汇

常见封装形式简介DIP = Dual Inline Package = 双列直插封装HDIP = Dual Inline Package with Heat Sink = 带散热片的双列直插封装SDIP = Shrink Dual Inline Package = 紧缩型双列直插封装SIP = Single Inline Package = 单列直插封装HSIP = Single Inline Package with Heat Sink = 带散热片的单列直插封装SOP = Small Outline Package = 小外形封装HSOP = Small Outline Package with Heat Sink = 带散热片的小外形封装eSOP = Small Outline Package with exposed thermal pad = 载体外露于塑封体的小外形封装SSOP = Shrink Small Outline Package = 紧缩型小外形封装TSSOP = Thin Shrink Small Outline Package = 薄体紧缩型小外形封装TQPF = Thin Profile Quad Flat Package = 薄型四边引脚扁平封装PQFP = Plastic Quad Flat Package = 方形扁平封装LQPF = Low Profile Quad Package = 薄型方形扁平封装eLQPF = Low Profile Quad Flat Package with exposed thermal pad = 载体外露于塑封体的薄型方形扁平封装DFN = Dual Flat Non-leaded Package = 双面无引脚扁平封装QFN = Quad Flat Non-leaded Package = 双面无引脚扁平封装TO = Transistor package = 晶体管封装SOT = Small Outline of Transistor = 小外形晶体管BGA = Ball Grid Array = 球栅阵列封装BQFP = Quad Flat Package With Bumper = 带缓冲垫的四边引脚扁平封装CAD = Computer Aided Design = 计算机辅助设计CBGA = Ceramic Ball Grid Array = 陶瓷焊球阵列CCGA = Ceramic Column Grid Array = 陶瓷焊柱阵列CSP = Chip Size Package = 芯片尺寸封装DFP = Dual Flat Package = 双侧引脚扁平封装DSO = Dual Small Outline = 双侧引脚小外形封装3D = Three-Dimensional = 三维2D = Two-Dimensional = 二维FCB = Flip Chip Bonding = 倒装焊IC = Integrated Circuit = 集成电路I/O = Input/Output = 输入/输出LSI = Large Scale Integrated Circuit = 大规模集成电路MBGA = Metal BGA = 金属基板BGAMCM = Multichip Module = 多芯片组件MCP = Multichip Package =多芯片封装MEMS = Microelectro Mechanical System = 微电子机械系统MFP = Mini Flat Package = 微型扁平封装MSI = Medium Scale Integration = 中规模集成电路OLB = Outer Lead Bonding = 外引脚焊接PBGA = Plastic BGA = 塑封BGAPC = Personal Computer = 个人计算机PGA = Pin Grid Array = 针栅阵列SIP = System In a Package = 系统级封装SOIC = Small Outline Integrated Circuit = 小外形封装集成电路SOJ = Small Outline J-Lead Package = 小外形J形引脚封装SOP = Small Outline Package = 小外形封装SOP = System On a Package = 系统级封装WB = Wire Bonding = 引线健合WLP = Wafer Level Package = 晶圆片级封装常用文件、表单、报表中英文名称清除通知单Purge notice工程变更申请 ECR(Engineering Change Request)持续改善计划CIP(continuous improvement plan)戴尔专案 Dell Projec t收据Receipt数据表Data sheet核对表Check list文件清单Documentation checklist设备清单 Equipment checklist调查表，问卷Questionnaire报名表Entry form追踪记录表 Tracking log日报表Daily report周报表Weekly report月报表Monthly report年报表 Yearly report年度报表 Annual report财务报表 Financial report品质报表 Quality report生产报表Production report不良分析报表FAR(Failure analysis report)首件检查报告 First article inspection report 初步报告（或预备报告）Preliminary report一份更新报告 An undated report一份总结报告 A final report纠正与改善措施报告(异常报告单) CAR (Corrective Action Report)出货检验报告Outgoing Inspection Report符合性报告（材质一致性证明） COC(Certificate of Compliance)稽核报告 Audit report品质稽核报告 Quality audit report制程稽核报告Process audit report5S 稽核报告 5S audit report客户稽核报告Customer audit report供应商稽核报告Supplier audit report年度稽核报告 Annual audit report内部稽核报告 Internal audit report外部稽核报告External audit reportSPC 报表(统计制程管制) Statistical process control工序能力指数(Cpk) Process capability index（规格)上限Upper limit（规格）下限 Lower limit规格上限Upper Specification Limit(USL)规格下限 Lower Specification Limit(LSL)上控制限（或管制上限） Upper Control Limit(UCL)下控制限（或管制下限）Lower Control Limit(LCL)最大值 Maximum value平均值Average value最小值Minimum value临界值 Threshold value / critical value MRB 单(生产异常通知报告) Material Review Board Report工艺流程图Process Flow Diagram物料清单（产品结构表/用料结构表） BOM (Bill of Materials )合格供应商名录AVL (Approved Vendor List)异常报告单 CAR工程规范报告通知单（工程变更通知）ECNTECN自主点检表Self Check List随件单（流程卡） Traveling Card (Run Card)压焊图Bonding diagram晶圆管制卡 Wafer inspection card晶圆进料品质异常反馈单Feedback Report for Wafer Incoming Quality Problems订购单PO(Purchase Order)出货通知单Advanced Ship Notice送货单/交货单DO(Delivery Order)询价单RFQ(Request for quotation)可靠性实验报告Reliability Monitor Report产品报废单PSB特采控制表CRB返工单PRB异常处理行动措施OCAP减薄：Wafer [‘weifə] n .威化饼干、电子晶片（晶圆薄片）Grind [ɡraind ]vt. & vi. 磨碎;嚼碎n .磨,碾Crack [kræk]vt. & vi. (使…)开裂, 破裂n. 裂缝, 缝隙Ink [iŋk] n. 墨水, 油墨Die [dai] vt. & vi. 死亡（芯片）Dot [dɔt] n . 点, 小圆点Mounting [‘mauntiŋ] n. 装备,衬托纸Tape [teip] n. 带子；录音磁带; 录像带Size [saiz] n. 大小, 尺寸，尺码Thick [θik]adj. 厚的，厚重的Thickness [‘θiknis]n. 厚(度), 深(度)宽 (度)Position [pə‘ziʃən]n. 方位，位置Rough [rʌf] adj . 粗糙的; 不平的Fine [fain]adj. 美好的, 优秀的, 优良的, 杰出的Speed [spi:d]n. 速度, 速率Spark[spɑ:k]n. 火花; 火星Out [aut]adv. 离开某地, 不在里面；(火或灯)熄灭Grindstone [‘ɡraindstəun]n. 磨石、砂轮Mount[maunt]vt. & vi. 装上、配有Mounter装配工;安装工;镶嵌工Mounting [‘mauntiŋ]n. 装备,衬托纸Magazine [,mæɡə‘zi:n] n. 杂志, 期刊，弹药库（传递料盒）Cassette [kə‘set] n. 盒式录音带；盒式录像带Inspect [in‘spekt] vt. 检查，检验，视察Inspection [in‘spekʃən] n. 检查，视察Card [kɑ:d]n. 卡, 卡片, 名片划片：Saw [sɔ:] n. 锯vt. & vi. 锯，往复运动Sawing ['sɔ:iŋ]n. 锯,锯切,锯开Film [film] n. 影片, 电影（薄膜，蓝膜）Frame [freim] n. 框架，骨架，构架Clean [kli:n]adj. 清洁的, 干净的；纯净的Cleaner [‘kli:nə]n. 作清洁工作的人或物Oven [‘ʌvən] n . 烤箱, 炉Cassette [kə‘set]n. 盒式录音带；盒式录像带Handler[‘hændlə]n. (物品、商品)的操作者Scribe [skraib] n . 抄写员, 抄书吏Street n. 大街, 街道Blade [bleid] n. 刀口, 刀刃,刀片Cut [kʌt] vt. & vi. 切, 剪, 割, 削Speed[spi:d]n. 速度, 速率Spindle [‘spindl]n. 主轴， (机器的)轴Size [saiz]n. 大小, 尺寸,尺码Cooling ['ku:liŋ]adj. 冷却(的)Kerf [kə:f]n. 锯痕,截口,切口Width [widθ]n . 宽度, 阔度, 广度Chip [tʃip] n. 碎片、缺口Chippi ng[‘tʃipiŋ]n. 碎屑,破片Crack[kræk]vt . (使…)开裂,破裂n . 裂缝, 缝隙Missing [‘misiŋ] adj. 失掉的,失踪的,找不到的Die [dai]vt. & vi. 死亡（芯片）Saw [sɔ:] n. 锯vt. & vi. 锯，往复运动Street [stri:t]n. 大街, 街道Film [film]n. 影片, 电影（薄膜，蓝膜）Frame [freim] n. 框架，骨架，构架Tape [teip]n. 带子；录音磁带; 录像带Bubble ['bʌbl] n. 泡, 水泡, 气泡mount---贴wafer---晶圆frame---框架blade---刀片tape---膜cassette---盒子completion---完成loader---上料un-loader---出料initial---初始化open---打开air---空气pressure---压力failure---失败vacuum---真空alignment---校准ink---黑点die---芯片error---错误limit---限制cover---盖子device---产品data---数据saw---切割water---水elevator---升降机spindle---主轴sensor---感应器wheel---轮子setup---测高rotary---旋转check---检查feed---进给cutter---切割speed---速度height---高度new---新shift---轮班pause---暂停clean---清洗center---中心chip---崩边change---变换enter---确认Off center---偏离中心 broken---破的 alarm---报警上芯：Attach [ə‘tætʃ]vt. & vi. 贴上; 系; 附上Bond [bɔnd]n. 连接, 接合, 结合vt. 使粘结, 使结合Bonder [‘bɔndə]n. 联接器,接合器,粘合器Die attach material epoxy粘片胶Epoxy [e‘pɔksi] n. 环氧树脂（导电胶）Material [mə‘tiəriəl]n. 材料, 原料Non-conductive epoxy绝缘胶Conductive [kən‘dʌktiv] adj. 传导的Dispenser [dis‘pensə]n. 配药师, 药剂师Nozzle [‘nɔzl]n. 管嘴, 喷嘴Rubber [‘rʌbə]n. (合成)橡胶，橡皮Tip [tip] n. 尖端, 末端Die pick-up tool 吸嘴Tool [tu:l]n. 工具, 用具Collect [kə‘lekt]vt. 收集, 采集（吸嘴）Ejector [i‘dʒektə]n. 驱逐者,放出器,排出器Pin [pin]n. 针,大头针, 别针Lead Frame引线框架Lead [li:d]vt. & vi. 带路, 领路, 指引Frame [freim]n. 框架，骨架，构架Magazine [,mæɡə‘zi:n]n. 杂志, 期刊（料盒）Curing [‘kjuəriŋ] n. 塑化, 固化, 硫化, 硬化Oven [‘ʌvən]n. 烤箱, 炉Scrap [skræp]n. 小片, 碎片, 碎屑Dent [dent] n. 凹痕, 凹坑Die Lift-off 晶粒脱落（芯片脱落，掉芯）Skew [skju:] adj. 歪, 偏, 斜Misorientation [mis,ɔ:rien‘teiʃən] n. 定向误差,取向误差Pre squeeze del写胶前气压延时Post squeeze del 写胶后气压延时Squeeze [skwi:z] vt. 榨取, 挤出n. 挤, 榨, 捏Eject [i‘dʒekt]vt. & vi . 弹出, 喷出, 排出Delay [di'lei]n. 延迟Height [hait] n. 高度, 身高Level [‘levl]n. 水平线, 水平面; 水平高度Head [hed]n. 头部，领导, 首脑Eject up delay 顶针延迟Eject up heigh t 顶针高度Bond level粘片高度Pick Level 捡拾芯片高度Head pick delay 粘接头拾取延迟Head bond delay 粘接头粘接延时Pick delay捡拾芯片延时Bond delay 粘接芯片延时Index [‘indeks]n. 索引;标志, 象征; 量度Clamp [klæmp]vt. & vi. 夹紧; 夹住n. 夹具Index clamp delay 步进夹转换延时Index delay 框架步进延时Shear [ʃiə] vt. 剪羊毛, 剪n. 大剪刀Test [test] n. 测验,化验,试验, 检验Die shear test 推晶试验Thickness ['θiknis]n. 厚(度), 粗Coverage [‘kʌvəridʒ] n. 覆盖范围Epoxy thickness & coverage 导电胶厚度和覆盖率Orientation[,ɔ:rien‘teiʃən] n. 方向, 目标Die Orientation 芯片方向Void [vɔid] adj. 空的, 空虚的n. 太空, 宇宙空间;空隙, 空处; 空虚感, 失落感Epoxy void 导电胶空洞Chip [tʃip] n. 碎片Damage[‘dæmidʒ] vt. & vi. 损害, 毁坏, 加害于n. 损失, 损害, 损毁Chip damage芯片损伤Backside [‘bæksaid]n. 臀部, 屁股，背面Chip backside damage 芯片背面损伤Tilt [tilt] vt. & vi. (使)倾斜Tilted die 芯片歪斜Epoxy on die 芯片粘胶Crack [kræk]vt. & vi. (使…)开裂, 破裂n. 裂缝, 缝隙Crack die 芯片裂缝/芯片裂痕Lift [lift]vt. & vi. 举起, 抬起n. 抬, 举Lifted die翘芯片Misplace [,mis‘pleis]vt. 把…放错位置Misplaced die 设置芯片NO die on L/F 空粘Insufficient [,ɪnsə‘fiʃənt] adj. 不足的, 不够的Insufficient epoxy 导电胶不足Epoxy crack 导电胶多胶Epoxy curing银浆烘烤Edge [edʒ] n. 边, 棱, 边缘Partial [‘pɑ:ʃəl] adj. 部分的, 不完全的Mirror [‘mirə] n. 镜子Missing [‘misiŋ] adj. 失掉的,失踪的,找不到的Edge die / partial die边缘片 / 边沿芯片Mirror die光片 / 镜子芯片Missing die 掉芯 / 漏芯 / 掉片Splash [splæʃ]vt. 使(液体)溅起vi.(液体)溅落Splatter [‘splætə] vt. & vi. (使某物)溅泼Diagram [‘daiəɡræm]n. 图解, 简图, 图表Ink splash / ink splatter墨溅Die bonding diagram 上芯图Die shesr test 推片实验/推晶试验Die shear tester 推片试验机Die shesr tool 推片头Metal corrosion晶粒腐蚀/芯片腐蚀Wafer mapping system 芯片分级系统System ['sistəm] n. 系统; 体系wafer---晶圆die---芯片attach---粘贴glue---银胶substrate---基板magazine---盒子inspection---检查parameter---参数manual---操作手册reset---重设enter---确定error---错误input---输入speed---速度stop---停止pressure---压力vacuum---真空sensor---传感器back side---背面pin---针statistics---统计calibration---校正bond---贴片conversion---改机thickness---厚度tilt---倾斜度shape---形状adjust---调整contact---接触cover---覆盖device---产品chip---崩边pause---暂停elevator---升降机 initial---初始化alignment---校准cassette---盒子tape---膜 frame---框架ring---铁圈temperature---温度rubber tip---吸嘴frame type---框架型号nozzle---点胶头 writer---划胶头压焊：Wire [‘waiə] n. 金属丝, 金属线;电线, 导线Bond [bɔnd] n. 接合, 结合vt. 使粘结, 使结合Wire bond / Wiring bonding 压焊/焊丝/球焊Gold wire金丝Pad [pæd]vt. 给…装衬垫, 加垫子n.垫,护垫Bond pad 焊点、铝垫1st bond第一焊点Pad size焊点尺寸 / 铝垫尺寸Capillary [kə‘piləri] n.毛细管;毛细血管（劈刀）Pitch [pitʃ] 程度; 强度; 高度Pad pitch铝垫间距 / 焊点间距Elongation [i:lɔŋ‘ɡeiʃən] n.延长;延长线;延伸率Breaking [‘breikiŋ] n. 破坏,阻断Load [ləud] n. 负荷; 负担;工作量, 负荷量Breaking Load 破断力Pull [pul]vt. & vi.拉, 扯, 拔Shear [ʃiə] vt. 剪羊毛, 剪n. 大剪刀Wire pull / ball pull（焊丝）拉力Wire shear / ball shear（焊丝）推力Ultrasonic [,ʌltrə‘sɔnik] adj. (声波)超声的Power [‘pauə]n. 功力, 动力, 功率Force [fɔ:s]n. 力; 力量; 力气Ultrasonic power超声功率Bonding force压力Bonding time时间Temperature [‘tempəritʃə] n. 温度, 气温Bonding temperature 温度Ultrasonic wire bonding 超声波压焊EFO打火烧球loop [lu:p]n. 圈, 环, 环状物Loop height 孤高Wire pull test 拉力试验Ball shear test 金球推力试验PIN 1 第一脚Ball height 球高Ball diameter球径Cratering [‘kreitəriŋ] n. 缩孔;陷穴（弹坑）KOH etching test KOH腐蚀试验Bond Cratering test 压焊腐蚀试验(弹坑试验) Thermal [‘θə:məl] adj. 热的，热量的Compression [kəm‘preʃən] n. 挤压, 压缩TCB（ Thermal Compression Bond）热压焊Bonding Diagram 压焊图 / 布线图Wrong Bonding 布线错误Incomplete[,ɪnkəm‘pli:t]adj.不完全的,未完成的Incomplete bond 焊不牢No bonding 无焊N2 BOX 氮气柜RTPC 实时过程监控Tray [trei] n. 盘子, 托盘Handing Tray 产品盘FBI 压焊后目检FBI insp-M/C 压焊检验机Microscope [‘maikrəskəup] n. 显微镜Low Power Microscope 低倍显微镜Flux [flʌks] n. 熔剂、焊剂；助熔剂，助焊剂Hook [huk] vt. & vi. 钩住, 吊住, 挂住Wire pull hook线钩（测拉力）Ball shear tool 推球头（测推力）Metal [‘metl]n. 金属Discolor [dis‘kʌlə]v.使脱色;(使)变色,(使)褪色Oxide [‘ɔksaid]n. 氧化物Metal Discolor铝条变色Bond Pad Discolor 铝垫变色Bond Pad Oxide铝垫氧化Stick [stik] vt. & vi. 粘贴, 张贴Peeling [‘pi:liŋ] n. 剥皮,剥下的皮Cratering [‘kreitəriŋ]n. 缩孔;陷穴（弹坑）Nonstick bond on pad 铝垫不粘Bond pad peeling 铝垫脱落Bond pad cratering铝垫弹坑Limit [‘limit]vt. 限制; 限定Scratch [skrætʃ] vt. & vi. 抓, 搔，刮伤Over rework limit超过返工数Bond remove / scratch 剔球划伤Ball bond non-stick金球脱落Ball to large （small）金球过大（小）Ball bond short 金球短路Non-stick on lead 引脚脱落（鱼尾脱落）misplace [,mis‘pleis]vt. 把…放错位置connection [kə‘nekʃən]n. 连接, 联结Misplaced bond on LD压焊打偏Wire broken断线Missing wire漏打Wrong connection 错打defective [di‘fektiv]adj. 有缺陷的，欠缺的Defective looping弧度不良Sagging [‘sæɡiŋ]n. 下垂[沉,陷],松垂,垂度Loop sagging 弧度下陷Low loop 弧度太低High loop弧度太高Loop short 弧度短路Overhang [,əuvə‘hæŋ]vt. 伸出; 悬挂于…之上Residue [‘rezidju:]n. 剩余, 余渣Distortion [dis‘tɔ:ʃən] n. 歪曲,曲解Wire overhang on LD 跨越引线框架Wire residue 残丝LF distortion 引线框架变形Quantity [‘kwɔntiti]n. 数目, 数量Mismatch [‘mis’mætʃ] vt. 使配错,使配合不当Scrap [skræp]n. 废料vt. 废弃, 丢弃Scratch [skrætʃ] vt. 刮伤Quantity Mismatch 数量不符Empty M. not scrap空粘未报废Gold Wire Scratch 金丝受损Parameter---参数Statistics---统计Utility---应用Teach---教习Bond tip offset—焊线点纠偏 Contact search---接触测高Zoom off center---放大倍数偏心校准Calibration---校准BQM---焊接质量控制PR—patterrecognition—图像识别Alignment tolerance—对点偏差PR indexing—图像控制下的步进Capillary---焊线劈刀 Wire spool—送线卷轴Window clamp—窗口夹板Transducer—功率换能器FTN---功能键Wire threading—送线器EFO ---电子打火Linear power ---线性马达Vacuum sensor---真空感应器 Step driver—步进驱动Post bond inspection—焊接后检查 Wire pull—拉线Ball shape—推球 Ball size—焊球大小Ball thickness—焊球高度 Loop height—线弧高度Loop shape—线弧形状Neck crack—线颈折损 Fine adjust–精确调整Conversion–换产品 1st bond non stick—第一点不粘2nd bond non stick—第二点不粘 peeling---拔铝垫（扯皮）Bond off---脱焊Ball deformation—焊球变形 servo motor—伺服电机weld off---管脚脱焊 crater---裂缝 gold wire---金线missing ball---球未烧好 weak bond---虚焊塑封：Mold [məuld] n. 模子,铸型vt. 浇铸,塑造Molding [‘məuldiŋ] n. 成型（塑封）Compound [‘kɔmpaund] n.复合物, 化合物Moiding M/C；Mold Press塑封机Press [pres] n. 印刷机Heater [‘hi:tə] n. 加热器; 炉子Pre-heater 预热机Chase [tʃeis]n.追捕, 追猎Mold die / Mold chase 塑封模具MGP mold MGP多缸模具Auto mold 自动包封机load [ləud]vt. & vi. 1 把…装上车[船] 2 装…loader ['ləudə] n. 装货的人,装货设备,装弹机Auto L / F loader自动排片机handler [‘hændlə] n. (动物)驯化者（抓手）temperature [‘tempəritʃə]n. 温度, 气温Pre-heat Temperature 料饼预热温度Mold Temperature 模具温度Clamp [klæmp] vt. & vi. 夹紧; 夹住n. 夹具Pressure [‘preʃə] n. 压(力), 压强Clamp Pressure 合模压强Transfer pressure 注塑压强Transfer [træns‘fə:]vt. & vi. 转移; 迁移n. 转移Curing [‘kjuəriŋ] n. 塑化, 固化, 硫化, 硬化Curing time 固化时间Curing temperature 固化温度Pre-heat Time （料饼）预热时间Transfer speed注塑速度Transfer time注塑时间PMC time (Post Mold Cure Time)后固化时间Load / unload上料/下料Sweep [swi:p] vt. & vi. 扫, 打扫, 拂去Wire Sweep 冲丝Open 开路Short 短路Fill [fil] vt. & vi. (使)充满, (使)装满, 填满Underfill ['ʌndəfil] n. (孔型)未充满Body underfilled胶体未灌满Incomplete [,ɪnkəm‘pli:t]adj. 不完全的, 未完成的Incomplete mold 未封满Chip [tʃip] n. 碎片，缺口Chip package / body chip-out崩角Porosity [pɔ:‘rɔsiti] n. 多孔性,有孔性Porosity Body 胶体麻点Bubble [‘bʌbl] n.泡, 水泡, 气泡Blister [‘blistə] n. 气泡vt. & vi. (使)起水泡Smear [smiə] vt.弄脏, 弄污n. 污迹, 污斑Surface [‘sə:fis] n. 面, 表面Roough surface 不均匀（表面）Delaminate [di:‘læməneit] v. 将…分层,分成细层Delaminating 分层Void [vɔid]adj. 空的, 空虚的PKG Void 胶体空洞Deep [di:p] adj. 深的Scratch [skrætʃ] vt. 刮伤Body deep scratch胶体刮痕Dimension [di‘menʃən] n.尺寸, 度量Mold PKG dimension 塑封体尺寸BTM width / length 背面宽 / 长Top width / length 正面宽 / 长PKG thick 塑封体厚度Mismatch [‘mis’mætʃ] vt. 使配错,使配合不当Mold mismatch / PKG mismatch 包封偏差(胶体错位) Offset [‘ɔfset] vt. 抵消, 补偿Misalignment [‘misəlainmənt] n. 未对准Mold offset / PKG misalignment偏心PMC（post mold cure）后固化Dummy [‘dʌmi] n. 人体模型Strip [strip] vt.剥去, 剥夺, 夺走Dummy molded strip空封Mold flash 废胶Gate [ɡeit]n.门, 栅栏门Mold gate 注浇口、进浇口Remain [ri‘mein]n. 剩余物; 残余Gate remain 小脚Compound [‘kɔmpaund] n.复合物, 化合物Ag ing [‘eidʒiŋ]n. 老化,成熟的过程Compound Aging 料饼醒料（回温过程）Locator [ləu‘keitə]n. 表示位置之物,土地Block [blɔk] n.大块(木料、石料、金属、冰等) Locator Block 定位块Ejector [i‘dʒektə] n. 驱逐者,放出器Pin [pin]n. 大头针, 别针，针Depth [depθ]n.深, 深度Ejector Pin 顶针E-pin Depth顶针深度Storage [‘stɔ:ridʒ] n.储藏处, 仓库Cold room / compound storage冷藏库/料饼存放库Air [ɛə] n. 空气Gun [ɡʌn] n. 枪, 炮Coating [‘kəutiŋ] n. 涂层, 覆盖层Material [mə‘tiəriəl]n. 材料, 原料,素材, 资料Air Gun气枪Die Coating芯片涂胶Auto die coating M/C 芯片涂胶机Die Coating Material覆晶胶Cart [kɑ:t]n. 手推车ASS’YB Cart 后站推车Tablet [‘tæblit]n. 药片、胶囊Loader [‘ləudə] n. 装货的人,装货设备,装弹机Preheater [‘pri:’hi:tə] n. 预热器Fixture [‘fikstʃə] n. (房屋等的)固定装置Auto Tablet Loader 自动排胶粒机Compoud Preheater 高频预热机Load /Unload Fixture 上料/下料架Tablet Magazine 胶粒盒Compoud Tablets 塑封料饼Molding Cleaning Compoud 洗模饼misorientation [mis,ɔ:rien‘teiʃən]n. 定向误差,取向误差PKG Misorientation胶体压反Mold flash on lead 塑封溢胶Mold crack 胶体裂痕Semiconductor---半导体Molding–模封Onload---上料Offload–出料Belt—皮带Preheater turntable –预热转盘Transfer---传送Safety Door---安全门Pick and place–机械手Motor---马达 Station–模腔Cleaning brush—清洁刷Cylinder---气缸 Sensor---传感器Solenoid---电磁阀Turn over –翻转器 Degate–切料口 Bearing---轴承Picker---爪子 Pusher–推动器 Cull bin –垃圾箱Pin---针Vacuum pump—真空泵 Mornitor–显示器Cable–导线 Profile---温度曲线 Alarm---报警Error---错误 Driver---驱动 Sensor–感应器Inspection---检查Parameter---参数 Manual---手动,手册Reset---复位 Initialing---初始化 Guide–导轨Substrate---基板 Device---产品种类 Lot Traveller---随工单Magazine---盒子 Cylinder –汽缸 Bearing–轴承Stop---停止Emergency Stop---紧急停止 Gripper --夹子Heat–加热器Pipe–管子Temperature---温度Hopper–漏斗Compress air–压缩空气Over flow—反面漏胶Semiconductor---半导体 Molding –模封Operation–操作Flange–法兰盘 Pump–泵Chamber–腔体Vent–气孔Value–值Alarm---报警Error---错误Inspection---检查Parameter---参数Manual---手动,手册Reset---复位Initialing---初始化Incomplete fill模封不全inching---扭曲Overflow---漏胶Misalignment---模封错位 Package mismatch---模封错位Resin Hole / Void ---气孔Foreign materials ---外来物Wire sweep---线弯曲Rough surface---表面粗糙Wrong Orientation---模封方向反Eng. Sample---工程师样品Stain/Dirty on package---表面脏污Resin burr---树脂有毛刺Resin flashes---毛刺Damage frameFRAME--- 损坏Scratch on package---树脂表面划伤Evaluation----评估Crack package---树脂开裂 SPC sample ---SPC样品切筋 Trim-Form1 切筋Trimming Dambar cut2 切筋模 Trim die3 成形模Form die4 分离模singulate5 冲废De-junk6 检测Inspection 外观检测7 再成型机模具Reform Die8 再成型机 Reform system9 料盘 Plastic tray10 连筋 Uncut dambar11 毛刺burr14 溢料Junk15 裂纹Crack16 离层（分层） Delaminating17 管脚反翘 Lead tip bend18 筋未切 Dam-bar uncut19 筋凸出 Dam-bar protrusion20 筋切入Dam-bar cut in打印 Marking1 打印Marking2 印章 Marking layout3 激光打印 Laser marking4 油墨打印 Ink (UV) marking5 正印 Top side mark6 背印 Back side mark7 镜头 Lens8 打印不良\模糊 Illegible marking9 漏打 No marking10 断字 Broken character11 缺字 Missing character12 印字倾斜 Slant marking13 印记错误 Wrong marking14 重印 Remark15 印字模糊（褪色）Fade mark16 印字粘污 Smear19 电流current21 字体（字形） Font22 定位针 Location pin23 胶皮打印机 Pad printer24 激光打印机 Laser Marking M/C25 后固化 PMC(Post Mold Cure)26 后固化烤箱 PMC Oven27 打印污斑 Marking stain28 印记移位Marking shift电镀 Plating1 电镀 Plating2 来料Incoming3 冲废 Dejunk4 热煮软化槽 Socking Tank7 检验 Inspection 外观检测8 烘烤 Curing / Baking 150℃; 60-90ms9 出料 Unload10 高速线电镀 High-speed Plating Line11 统计过程控制 SPC12 搭锡 Solder bridge13 锡丝、锡须Solder flick / Whisker14 镀层不良 Plating defects15 发黄 Yellowish16 发黑 Blacken17 变色 Discolor18 露底材（露铜） Expose copper19 粘污 Smear20 镀层厚度 Plating thickness 7-20um21 镀层成分 Plating composition 电镀成分, Sn22 外观 Outgoing23 易焊性Solder ability24 无铅化 Pb-free / lead free25 结合力 Adhesive force26 可靠性Reliability27 电解Electrolytic deflash28 清洗（自来水）City water29 高压清洗 High pressure rinse30 脱脂 Descale31 清洗（纯水） DI water32 活化（合金） Activation33 预镀、预浸 Pre-dip34 电镀Plating35 吹风 Air blow36 中和Neutralization37 褪镀Stripper38 拖出 Drag out39 上料机 Loader40 下料机 Unloader41 纯锡Tin42 纯水(去离子水) DI water43 水压Water pressure44 理化分析Physical and chemical analysis45 测厚仪Plating Thickness Meter / Electroplated CoatingThickness Test46 离子污染度测试仪 Ion Contamination Tester Contamino CT10047 C含量测试仪Carbon Tester51 去氧化HSCU Descale52 预浸 Pre-dip53 电镀电流 Current54 镀液温度 Temperature电镀液 plating solution55 电镀槽 plating tank56 中和Neutralization59 烘干 Curing60 锡球 Solder ball61 锡厚度和成分 Sn thickness & composition62 冲废De-junk去胶渣63 去溢料 Degate 冲塑，冲胶64 去飞边 Deflash 去胶(塑封工序)65 锡铅电镀 Tin lead plating66 无铅电镀 Lead free plating; Pure tin plating67 镀层起泡Solder bump68 镀层剥落 Solder peel off69 镀层偏厚或偏薄 Thick or Thin Plating70 退锡 Solder remove71 电镀报废Plating scrap72 锡渣 Solder peeling73 电镀锡块Solder bump74 电镀桥接Plating bridge75 电镀变色SP Discoloration76 电镀污染 SP Contamination77 电镀锡攀爬SP adhere 78 电解除油Electro-degreasing 测试 Testing1 测试 Testing2 打印 Laser mark3 编带机 Tape & Reel Machine4 编带 Reel5 测试机 Tester6 分选机 Tray Test Handler7 Vision检测 Direction vision8 划伤 Scratch9 打错 Wrong mark10 断字 Broken character11 漏字No marking12 模糊 Fade mark13 脚长Lead length14 脚宽 Lead width15 站立度 Stand up16 脚间距 Lead pitch17 共面性 Coplanarity18 跨度 Row space19 电性能测试 Electrical test20 塑料管 Plastic tube21 编带 Reel / Tape22 托盘，盘装 Tray23 扫描测脚 Leads Scan/Inspection24 扫描测脚机Leads scanner25 投影仪 Profile Projector测试 TestingLaser 激光Lamp 灯管Lamp current 灯管电流Marking layout打印内容Power supply 电源Frequency 频率On-loader 上料部分Off-loader 下料部分Marking box 打印区域Track 轨道Location pin 定位针Scanner 扫描器Beam 光束Beam path 光路Bar code 条形码Sensor 传感器Motor 马达Driver 驱动器Index 步进Tool 模具Press 模具Punch 刀具Jam 卡料Forming 成型Cylinder气缸Laser head 光头Magazine 盒子Tube 管子Tray 板子Arm 机械臂Safety door 安全门Reset 复位Lamp 灯管Keyboard 键盘Alarm 报警Error 错误Open/Short(O/S) 开路／短路Function Reject 功能失效Parameter Reject参数失效Retention Reject保持力失效Icc Reject 电流失效Test Program 测试程序Cold test冷测Retest 重新测试Rework 返工Sample 抽样Resample 重新抽样Black box盛放未测试产品的黑盒子Testing area 测试区域Test chuck 测试平台Device Interface Board(DIB) 芯片测试接口板DUT 正在测试芯片A/D (analog-to-digital) converter 模/数转换模块EOT 测试结束信号SOT测试开始信号BIN signal 分BIN 信号Socket 测试座JIG/Test Head 测试盒/测试头Interface Card 接口通讯卡Interface Cable 接口通讯线Coaxial Cable 同轴线Test parameter 测试参数Tester Computer 测试机主机Test limit 测试结果的上下限AC Multiplexer 多路交流信号板Digital Driver and Detector 数字输入/输出装置Dual Voltage/Current Source双路电压/电流源Station Monitor显示测试结果的窗口Checker 检测程序High-Speed Digital (HSD) Instrument 高速数字测试设备High-Current-Voltage-Source 高电流电压源Finger 金手指Contactor 金手指动作模块Convey motor 变送马达Contact side 测试位置General Control Panel 总控制面板Ionizer 离子风扇Capacitor box 电容盒。

品质术语

品质管理专业术语DOA(dead on arrival) 一到就死的那些产品，MRB:Material Review Board 原意是“材料审查委员会”（一） QC：品质控制（Quality Control)(1)、QE：品质工程 (Quality Engineering)(2)、QA：品质保证（Quality Assurance）(3)、IQC：进料检验(In Coming Quality Control)) (4)、FQC：最终品质检验 (Final Quality　contro)　(5)、OQC：出货检验(Outgoing Quality　Control)　(6)、IPQC：制程检验(In process Quality Control)(7)、QCC：品管圈 (Quality Control Circle)　(8)、TQM：全面品质经营（Total Quality Manage）或者TQC（Total Quality Control）(9)、SPC：统计制程管制（Statistics Process Control）(10)、COQ：品质成本（Cost Of　Quality） (11)、AQL：允收品质水准（Accept Quality Control）(二)、spc：统计制程控制FMEA：失效模式与效果分析MSA：测量系统分析DOE：试验设计品质人员名称类QC quality control 品质管理人员OQC output quality control 最终出货品质管制人员IQC incoming quality control 进料品质管制人员QA quality assurance 质量保证人员OQA output quality assurance 出货质量保证人员品质保证类FAI first article inspection 新品首件检查FAA first article assurance 首件确认OOBA out of box audit 开箱检查FMEA failure model effectiveness analysis 失效模式分析8D 8 disciplines 8项回复内容FQC运作类AQL Acceptable Quality Level 运作类允收品质水准S/S Sample size 抽样检验样本大小ACC Accept 允收REE Reject 拒收CR Critical 极严重的MAJ Major 主要的MIN Minor 轻微的P/N Part Number 料号L/N Lot Number 批号AOD Accept On Deviation 允许偏差FPIR First Piece Inspection Report 首件检查报告PPM Percent Per Million 百万分之一制程统计品管专类SPC Statistical Process Control 统计制程管制SQC Statistical Quality Control 统计品质管制N Number 样品数其它品质术语类QCC Quality Control Circle 品质圈QIT Quality Improvement Team 品质改善小组PDCA Plan Do Check Action 计划执行检查总结MRB Material Reject Bill 退货单QT Quality Target 品质目标7QCTools 7 Quality Controll Tools 品管七大手法通用之件类ECN Engineering Change Notes 工程变更通知(供应商) ECO Engineering Change Order 工程改动要求(客户) PCN Process Change Notice 工序改动通知PMP Product Management Plan 生产管制计划SIP Specification In Process 制程检验规格SOP Standard Operation Procedure 制造作业规范IS Inspection Specification 成品检验规范BOM Bill Of Material 物料清单PS Package Specification 包装规范SPEC Specification 规格EVT Engineering Validation Test 工程验证测试DVT Design Validation Test 设计验证测试PVT Production Validation Test 生产验证测试P/R Pilot Run 试跑MP Mass Production 大量生产QVL Quality Vendor List 合格厂商清单WIP Work in process 半成品(工作进行中)部类PMC Production & Material Control 生产和物料控制PPC Production Plan Control 生产计划控制MC Material Control 物料控制ME manufacture Engineering 制造工程部PE Project Engineering 产品工程部A/C Accountant Dept 会计部P/A Personal & Administration 人事行政部DC Document Center 资料中心QE Quality Engineering 品质工程(部)QA Quality Assurance 品质保证(处)QC Quality Control 品质管制(课)PD Product Department 生产部IE Industrial Engineering 工业工程R&D Research & Design 设计开发部A Assembly 组装P Packing 包装生产类PCS Pieces 个(根,块等)CTN Carton 卡通箱PAL Pallet/skid 栈板PO Purchasing Order 采购订单MO Manufacture Order 生产单D/C Date Code 生产日期码ID/C Identification Code (供应商)识别码L/N Lot Number 批号P/N Part Number 料号其它OEM Original Equipment Manufacture 原设备制造PCE Personal Computer Enclosure 个人电脑外设PC Personal Computer 个人电脑CPU Central Processing Unit 中央处理器SECC SECC` 电解片SGCC SGCC 热浸镀锌材料NHK North of Hongkong 中国香港PRC People's Republic of China 中国大陆U.S.A the United States of America 美国A.S.A.P As Soon As Possible 尽可能快的E-MAIL Electrical-Mail 电子邮件N/A Not Applicable 不适用QTY Quantity 数量VS 以及REV Revision 版本JIT Just In Time 零库存I/O Input/Output 输入/输出OK Ok 好NG Not Good 不行,不合格C=0 Critical=0 极严重不允许ESD Electry-static Discharge 静电排放5S 希腊语整理,整顿,清扫,清洁,教养ATIN Attention 知会CC Carbon Copy 副本复印相关人员APP Approve 核准,认可,承认CHK Check 确认AM Ante Meridian 上午PM Post Meridian 下午CD Compact Disk 光碟CD-ROM Compact Disk Read-Only Memory 只读光碟FDD Floppy Disk Drive 软碟机HDD Hard Disk Drive 碟碟机REF Reference 仅供参考CONN Connector 连接器CAV Cavity 模穴CAD Computer Aid Design 计算机辅助设计ASS'Y Assembly 装配,组装MAT'S Material 材料IC Integrated Circuit 集成电路T/P True Position 真位度TYP Type 类型WDR Weekly Delivery Requirement 周出货需求C/T Cycle Time 制程周期L/T Lead Time 前置时间(生产前准备时间)S/T Standard Time 标准时间P/M Product Market 产品市场3C Computer, Communication, Consumer electronics’ 消费性电子5WIH When, Where, Who, What, Why, How to5M Man, Machine, Material, Method, Measurement 人,机,料,法,测量SQA Strategy Quality Assurance 策略品质保证DQA Design Quality Assurance 设计品质保证MQA Manufacture Quality Assurance 制造品质保证SSQA Sales and service Quality Assurance 销售及服务品质保证LRR Lot Reject Rate 批退率BS Brain storming 脑力激荡EMI Electronic Magnetion Inspect 高磁测试FMI Frequency Modulatim Inspect 高频测试SPS Switching power supply 电源箱DT Desk Top 卧式(机箱)MT Mini-Tower 立式(机箱)DVD Digital Voice Disk 数位视讯影碟 & 多功能数位碟片VCD Voice Compact Disk 影音光碟LCD Liquid Crystal Display 液晶显示器ABIOS Achanced Basic in put/output system 先进的基本输入/输出系统CMOS Complemeruary Metoll Oxide Semiconductor 互补金属氧化物半导体PDA Personal Digital Assistant 个人数字助理IC Integrated Circuit 集成电路ISA Industry Standard Architecture 工业标准体制结构MCA Micro Channel Architecture 微通道结构EISA Extended Industry Standard Architecture 扩充的工业标准结构SIMM Single in-line memory module 单项导通汇流组件DIMM Dual in-line Memory Module 双项导通汇流组件LED Light-Emitting Diode 发光二级管FMEA Failure Mode Effectiveness 失效模式分析W/H Wire Harness 金属线绪束集组件F/C Flat Caller 排线PCB Printed Circuit Board 印刷电路板CAR Correction Action Report 改善报告NG Not Good 不良WPR Weekly Delivery Requirement 周出货要求PPM Parts Per Million 百万分之一TPM Total Production Maintenance 全面生产保养MRP Material Requirement Planning 物料需计划OSOperation System 作业系统TBA To Be Design 待定,定缺EMI Electrical-Music Industry 电子音乐工业RFI Read Frequency Input 读频输入ECRS eliminate Combine Rearrange Simple 取消合并重排简化DIRFT Do if right the first time 第一次就把事情做好SWOT Strength weakness Opportunity Threat 优势弱势机会危机中英文对照英文缩写中文名称英文全名6 σ 六个希格玛 Six Sigma8D 8D改善程序 8 DisciplinesABC 作业制成本制度 Activity-Based CostingANOVA 变异数分析 Analysis of VarianceAQL 允收品质成本 Acceptable Quality LevelBB 黑带 Black BeltsBSC 平衡计分卡 Balanced ScoreboardBTF 计划生产 Build To ForecastBTO 订单生产 Build To OrderCa 制程准确度 Process Capability of AccuracyCAD 电脑辅助设计系统 Computer Aided Design SystemCAI 电脑辅助检验 Computer Aided InspectionCAT 电脑辅助测试 Computer Aided TestingCI 信赖区间 Confidence IntervalCL 中心线 Center LineCp 制程精密度 Process Capability of PrecisionCpk 制程能力 Process CapabilityCPM 要径法 Critical Path MethodCPM 每一百万个使用者会有几次抱怨 Complaint per MillionCRM 客户关系管理 Customer Relationship ManagementCRP 产能需求规划 Capacity Requirements PlanningCS 顾客满意度 Customer SatisfactionCTO 客制化生产 Configuration To OrderCTQ 关键品质特性 Critical to QualityDFM 为制造设计 Design for ManufactureDFMEA 设计失效模式分析 Design FMEADFSS 六个希格玛设计 Design for six sigmaDMAIC 定义衡量分析改善管制 Define Measure Analyze Improve ControlDOE 实验设计 Design of ExperimentDPM 每百万单位的缺点数 Defects per millionDPMO 每百万个机会的缺点数 Defects per million opportunitiesDPU 单位缺点数 Defects per unitDR 设计审查 Design ReviewDSS 决策支援系统 Decision Support SystemDVT 设计验证 Design Verification TestingEC 设计变更／工程变更 Engineering ChangeEDI 电子资料交换 Electronic Date InterchangeEMC 电磁相容 Electric Magnetic CapabilityEOQ 基本经济订购量 Economic Order QuantityEPC 工程制程控制 Engineering Process ControlERP 企业资源规划 Enterprise Resource PlanningES 工程规格 Engineering SpecificationEV 仪器系统变异 Equipment VariationFMEA 故障模式效应分析 Failure Mode and Effect AnalysisFMECA 故障模式.效应与关键性分析 Failure Mode, Effect, and Criticality Analysis FMS 弹性制造系统 Flexible Manufacture SystemFQC 成品品质管制 Finish or Final Quality ControlFTA 缺陷树分析 Fault Tree AnalysisFTY 初检通过率 First Time YieldGB 绿带 Green BeltsGR&R 仪器再现性及再生性 Gauge Repeatability & ReproducibilityIPQC 制程品质管制 In-Process Quality ControlIQC 进料品质管制 Incoming Quality ControlISAR 首批样品认可 Initial Sample Approval RequestISO 国际标准组织 International Organization for StandardizationJIT 即时管理 Just In TimeKM 知识管理 Knowledge ManagementKPIV 关键输入变数 Key Process Input VariablesKPOV 关键输出变数 Key Process Output VariablesKURT 峰度 KurtosisLCL 管制下限 Lower Control LimitLPCL 前置管制下限 Lower Per-control LimitLSL 规格下限 Lower Specification LimitLTPD 不良率 Lot Tolerance Percent DefectiveMES 制造执行系统 Manufacturing Execution SystemMIL STD 美军标准 Military StandardMO 制令 Manufacture OrderMPS 主生产排程 Master Production ScheduleMRO 请修(购)单 Maintenance Repair OperationMRP 物料需求规划 Material require planningMRP 物料需求规划 Material Requirement PlanningMRPII 制造资源计划 Manufacturing Resource PlanningMSA 量测系统分析 Measurement Systems AnalysisNFCF 更改预估量的通知 Notice for Changing Forecastnp 不良数管制图 Number of DefectivesODM 委托设计与制造 Original Design & ManufactureOEM 委托代工 Original Equipment ManufactureOPT 最佳生产技术 Optimized Production TechnologyOQC 出货品质管制 Outgoing Quality ControlPCL 前置管制中心限 Per-control Central LimitPDCA PDCA管理循环 Plan-Do-Check-ActionPFMEA 制程失效模式分析 Process FMEAPO 订单 Purchase OrderPp 制程绩效指数 Process Performance IndexPPAP 生产零件承认程序 Production Part Approval ProcessPpk 制程绩效指数PPM 每百万不良率 Pareto AnalysisQA 品质保证 Quality AssuranceQC 品质管制 Quality ControlQC Plan QC工程表 Quality Control PlanQCC 品管圈 Quality Control CircleQE 品质工程 Quality EngineeringQFD 品质机能展开 Quality Function DeploymentQLF 品质损失函数 Quality Loss FunctionQMA 品质成熟度分析 Quality Maturity AnalysisRMA 退货验收 Returned Material ApprovalROP 再订购点 Re-Order PointRTY 直通率 Rolled Throughout YieldSCM 供应链管理 Supply Chain ManagementSFC 现场监控 Shop Floor ControlSL 规格界线 Specification LimitsSO 订单 Sales OrderSOP 标准作业程序 Standard Operation ProcedureSOR 特殊订单需求 Special Order RequestSPC 统计制程管制 Statistical Process ControlSQC 统计品质管制 Statistical Quality ControlSTDEV 标准差 Standard DeviationTOC 限制理论 Theory of ConstraintsTPM 全面生产管理 Total Production ManagementTQC 全面品质管制 Total Quality ControlTQM 全面品质管理 Total Quality ManagementUCL 管制上限 Upper Control LimitUPCL 前置管制上限 Upper Per-control LimitUSL 规格上限 Upper Specification LimitVAR 变异数 VarianceWIP 在制品 Work In ProcessXbar-R 平均数- 全距管制图 Average-Range Control ChartXbar-s 平均数- 标准差管制图 Average-Standard Deviation Control Chart ZD 零缺点 Zero Defectσ, s 标准差 Standard deviationσ2, S2 变异数 Variance。

质量管理专业术语表(中英对照)

英文简称查询表
序号 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 Abbreviation缩写 2TP 2/6/12 MIS 3C 5S 8D 9D 5W1H： 5MIE 7M1i APQP/CP AP AQL AQL ACV APQP ADC Audit AAR ADV AIAG BOM BD BIR BIR Appearancestor Approval Report Analysis Development Verify Auto Motive Industry Action Group Bill of Material Business Development Building Incident Report Build Issues Resolution Advanced Product Quality Plan/Control Plan Advanced purchasing Automotive quality lab Acceptable Quality Level Air control valve Advanced Product Quality Planning Analog to Digital Converter When , Where , Who , What , Why , How 人(Man)机(Machine)料(Material法(Method)) 量测(Measure)Environments（环境）人,机器,材料,方法,测量，环境人力，机器，材料，方法, 市场，管理，资金，资讯产品质量先期策划/控制计划项目）前期采购汽车电子质量实验室运作类允收质量水平进气控制阀先期产品质量策划模数转换器审核，评审外观件认可报告分析、开发、验证汽车工业行动集团零件清单/物料清单业务开发车身问题报告试制问题 Full name全称 Advanced Product Quality Planning 2/6/12 Month in Service Incidents per Thousand Vehicle Chian Compulsory Certification seiri seiton seiso seiketsu shitsuke 8 Disciplines 批量成熟考核使用2/6/12月的每千辆车故障数强制性产品认证制度整理，整顿，清扫，清洁，修养问题报告及解决问题报告与解决 Chinese中文备注

富士康英语书

CCBG (Connector & cable business group)
CPBG (Competition business group) ESBG (Enterprise system business group) 鴻富錦事業群 SABG (system assembly business group) 系統組裝事業群
FOXCONN Microsystem Corporation
"
品質管理人員終點品質管制人員制程中的品質管制人員最終出貨品質管制人員進料品質管制人員全面質量管理段檢人員質量保證人員出貨質量保證人員品質工程人員新品首件檢查首件確認能力指數模具製程能力參數合格供應商品質評估失效模式分析
FOXCONN Microsystem Corporation
"
量具之再制性及重測性判斷量可靠與否尺寸直徑樣品數品質改善小組零缺點品質改善目標方針全面品質管理退料認可品管七大手法
工程變更通知(供應商) 工程改動要求(客戶) 工序改動通知生產管制計劃製程檢驗標準程序
1.4 通用之件类
ECN ECO PCN PMP SIP
Engineering Change Notice Engineering Change Order Process Change Notice Product Management Plan Standard Inspection Procedure
"
目录
摘要……………………………………………………………………………………………（4）第一章企业常用缩写 …………………………………………………………………………（5）

品质管理术语

品质管理术语：SQC 供应商品质控制IQC 来料品质控制LQC 生产线品质控制IPQC 制程品质控制FQC 最终品质控制SQA 供应商品质保证DCC 文控中心PQA 制程品质保证FQA 最终品质保证DAS 缺陷分析系统FA 坏品质分析CPI 连续工序改善CS 客户服务ERP 企业资源规划CRM 客户资源管理MRP 物料需求计划BPR 业务流程重组DOE 实验设计SCM 供应链管理APQP 产品质量先期计划FMEA 失效模式及后果分析MSA 测量系统分析PPAP 生产件批准EV 设备变异FPY 合格率LCL 管理下限LSL 规格下限QE 品质工程QFD 品质技能展开RPN 风险系数SOP 作业标准书TQC 全面品质控制TQM 全面品质管理UCL 管制上限USL 规格上限VOC 客户需求VOE 工程需求QA 品质保证QC 品质管理MBO 目标管理PC 生管MC 物料JIT 准时生产技术LP 精益生产品质管理术语：SQC 供应商品质控制IQC 来料品质控制LQC 生产线品质控制IPQC 制程品质控制FQC 最终品质控制SQA 供应商品质保证DCC 文控中心PQA 制程品质保证FQA 最终品质保证DAS 缺陷分析系统FA 坏品质分析CPI 连续工序改善CS 客户服务ERP 企业资源规划CRM 客户资源管理MRP 物料需求计划BPR 业务流程重组DOE 实验设计SCM 供应链管理APQP 产品质量先期计划FMEA 失效模式及后果分析MSA 测量系统分析PPAP 生产件批准EV 设备变异FPY 合格率LCL 管理下限LSL 规格下限QE 品质工程QFD 品质技能展开RPN 风险系数SOP 作业标准书TQC 全面品质控制TQM 全面品质管理UCL 管制上限USL 规格上限VOC 客户需求VOE 工程需求QA 品质保证QC 品质管理MBO 目标管理PC 生管MC 物料JIT 准时生产技术LP 精益生产窗体顶端窗体底端窗体顶端b5E2RGbCAP窗体底端DOA(dead on arrival> 一到就死的那些产品，MRB:Material Review Board 原意是“材料审查委员会”<一） QC：品质控制<Quality Control>(1>、QE：品质工程 (Quality Engineering>(2>、QA：品质保证<Quality Assurance）(3>、IQC：进料检验(In Coming Quality Control>>(4>、FQC：最终品质检验 (Final Quality contro>(5>、OQC：出货检验(Outgoing Quality Control>(6>、IPQC：制程检验(In process Quality Control>(7>、QCC：品管圈 (Quality Control Circle>(8>、TQM：全面品质经营<Total Quality Manage）或者TQC<Total Quality Control）p1EanqFDPw(9>、SPC：统计制程管制<Statistics Process Control）(10>、COQ：品质成本<Cost Of Quality）(11>、AQL：允收品质水准<Accept Quality Control）二、spc：统计制程控制fmea：失效模式与效果分析msa：测量系统分析doe：实验设计赞同2|评论DXDiTa9E3d2018-11-16 17:59 robet_li| 一级品质人员名称类QC quality control 品质管理人员OQC output quality control 最终出货品质管制人员IQC incoming quality control 进料品质管制人员QA quality assurance 质量保证人员OQA output quality assurance 出货质量保证人员品质保证类FAI first article inspection 新品首件检查FAA first article assurance 首件确认OOBA out of box audit 开箱检查FMEA failure model effectiveness analysis 失效模式分析8D 8 disciplines 8项回复内容FQC运作类AQL Acceptable Quality Level 运作类允收品质水准S/S Sample size 抽样检验样本大小ACC Accept 允收REE Reject 拒收CR Critical 极严重的MAJ Major 主要的MIN Minor 轻微的P/N Part Number 料号L/N Lot Number 批号AOD Accept On Deviation 允许偏差FPIR First Piece Inspection Report 首件检查报告PPM Percent Per Million 百万分之一制程统计品管专类SPC Statistical Process Control 统计制程管制SQC Statistical Quality Control 统计品质管制N Number 样品数其它品质术语类QCC Quality Control Circle 品质圈QIT Quality Improvement Team 品质改善小组PDCA Plan Do Check Action 计划执行检查总结MRB Material Reject Bill 退货单QT Quality Target 品质目标7QCTools 7 Quality Controll Tools 品管七大手法通用之件类ECN Engineering Change Notes 工程变更通知(供应商> ECO Engineering Change Order 工程改动要求(客户> PCN Process Change Notice 工序改动通知PMP Product Management Plan 生产管制计划SIP Specification In Process 制程检验规格SOP Standard Operation Procedure 制造作业规范IS Inspection Specification 成品检验规范BOM Bill Of Material 物料清单PS Package Specification 包装规范SPEC Specification 规格EVT Engineering Validation Test 工程验证测试RTCrpUDGiTDVT Design Validation Test 设计验证测试5PCzVD7HxAPVT Production Validation Test 生产验证测试jLBHrnAILgP/R Pilot Run 试跑xHAQX74J0XMP Mass Production 大量生产 LDAYtRyKfEQVL Quality Vendor List 合格厂商清单Zzz6ZB2LtkWIP Work in process 半成品(工作进行中>dvzfvkwMI1部类PMC Production & Material Control 生产和物料控制PPC Production Plan Control 生产计划控制MC Material Control 物料控制ME manufacture Engineering 制造工程部PE Project Engineering 产品工程部A/C Accountant Dept 会计部P/A Personal & Administration 人事行政部DC Document Center 资料中心QE Quality Engineering 品质工程(部>QA Quality Assurance 品质保证(处>QC Quality Control 品质管制(课>PD Product Department 生产部IE Industrial Engineering 工业工程R&D Research & Design 设计开发部A Assembly 组装P Packing 包装rqyn14ZNXI生产类PCS Pieces 个(根,块等>CTN Carton 卡通箱PAL Pallet/skid 栈板PO Purchasing Order 采购订单MO Manufacture Order 生产单D/C Date Code 生产日期码ID/C Identification Code (供应商>识别码L/N Lot Number 批号P/N Part Number 料号其它OEM Original Equipment Manufacture 原设备制造PCE Personal Computer Enclosure 个人电脑外设PC Personal Computer 个人电脑CPU Central Processing Unit 中央处理器SECC SECC` 电解片SGCC SGCC 热浸镀锌材料NHK North of Hongkong 中国香港PRC People's Republic of China 中国大陆U.S.A the United States of America 美国A.S.A.P As Soon As Possible 尽可能快的E-MAIL Electrical-Mail 电子邮件N/A Not Applicable 不适用QTY Quantity 数量VS 以及REV Revision 版本JIT Just In Time 零库存I/O Input/Output 输入/输出OK Ok 好NG Not Good 不行,不合格C=0 Critical=0 极严重不允许ESD Electry-static Discharge 静电排放5S 希腊语整理,整顿,清扫,清洁,教养ATIN Attention 知会CC Carbon Copy 副本复印相关人员APP Approve 核准,认可,承认CHK Check 确认AM Ante Meridian 上午PM Post Meridian 下午CD Compact Disk 光碟CD-ROM Compact Disk Read-Only Memory 只读光碟FDD Floppy Disk Drive 软碟机HDD Hard Disk Drive 碟碟机REF Reference 仅供参考CONN Connector 连接器CAV Cavity 模穴CAD Computer Aid Design 计算机辅助设计ASS'Y Assembly 装配,组装MAT'S Material 材料IC Integrated Circuit 集成电路T/P True Position 真位度TYP Type 类型WDR Weekly Delivery Requirement 周出货需求C/T Cycle Time 制程周期L/T Lead Time 前置时间(生产前准备时间>S/T Standard Time 标准时间P/M Product Market 产品市场3C Computer, Communication, Consumer electronics’消费性电子EmxvxOtOco5WIH When, Where, Who, What, Why, How to5M Man, Machine, Material, Method, Measurement 人,机,料,法,测量SixE2yXPq5SQA Strategy Quality Assurance 策略品质保证DQA Design Quality Assurance 设计品质保证MQA Manufacture Quality Assurance 制造品质保证SSQA Sales and service Quality Assurance 销售及服务品质保证LRR Lot Reject Rate 批退率BS Brain storming 脑力激荡EMI Electronic Magnetion Inspect 高磁测试FMI Frequency Modulatim Inspect 高频测试SPS Switching power supply 电源箱DT Desk Top 卧式(机箱>MT Mini-Tower 立式(机箱>DVD Digital Voice Disk 数位视讯影碟 & 多功能数位碟片6ewMyirQFLVCD Voice Compact Disk 影音光碟kavU42VRUsLCD Liquid Crystal Display 液晶显示器ABIOS Achanced Basic in put/output system 先进的基本输入/输出系统y6v3ALoS89CMOS Complemeruary Metoll Oxide Semiconductor 互补金属氧化物半导体M2ub6vSTnPPDA Personal Digital Assistant 个人数字助理IC Integrated Circuit 集成电路ISA Industry Standard Architecture 工业标准体制结构MCA Micro Channel Architecture 微通道结构EISA Extended Industry Standard Architecture 扩充的工业标准结构0YujCfmUCwSIMM Single in-line memory module 单项导通汇流组件DIMM Dual in-line Memory Module 双项导通汇流组件LED Light-Emitting Diode 发光二级管FMEA Failure Mode Effectiveness 失效模式分析W/H Wire Harness 金属线绪束集组件F/C Flat Caller 排线PCB Printed Circuit Board 印刷电路板CAR Correction Action Report 改善报告NG Not Good 不良WPR Weekly Delivery Requirement 周出货要求PPM Parts Per Million 百万分之一TPM Total Production Maintenance 全面生产保养MRP Material Requirement Planning 物料需计划OSOperation System 作业系统TBA To Be Design 待定,定缺EMI Electrical-Music Industry 电子音乐工业RFI Read Frequency Input 读频输入ECRS eliminate Combine Rearrange Simple 取消合并重排简化eUts8ZQVRdDIRFT Do if right the first time 第一次就把事情做好sQsAEJkW5TSWOT Strength weakness Opportunity Threat 优势弱势机会危机 GMsIasNXkA赞同1|评论TIrRGchYzg2018-11-28 20:29 chaoge| 二级采纳率：25%中英文对照英文缩写中文名称英文全名6 σ六个希格玛Six Sigma8D 8D改善程序8 DisciplinesABC 作业制成本制度Activity-Based Costing ANOVA 变异数分析Analysis of VarianceAQL 允收品质成本 Acceptable Quality LevelBB 黑带Black BeltsBSC 平衡计分卡Balanced ScoreboardBTF 计划生产Build To ForecastBTO 订单生产Build To OrderCa 制程准确度Process Capability of Accuracy CAD 电脑辅助设计系统Computer Aided Design System CAI 电脑辅助检验 Computer Aided InspectionCAT 电脑辅助测试 Computer Aided TestingCI 信赖区间Confidence IntervalCL 中心线Center LineCp 制程精密度Process Capability of Precision Cpk 制程能力Process CapabilityCPM 要径法Critical Path MethodCPM 每一百万个使用者会有几次抱怨Complaint per MillionCRM 客户关系管理 Customer Relationship Management CRP 产能需求规划 Capacity Requirements PlanningCS 顾客满意度Customer SatisfactionCTO 客制化生产Configuration To OrderCTQ 关键品质特性 Critical to QualityDFM 为制造设计Design for ManufactureDFMEA 设计失效模式分析Design FMEADFSS 六个希格玛设计Design for six sigmaDMAIC 定义衡量分析改善管制 Define Measure Analyze Improve Control 7EqZcWLZNXDOE 实验设计Design of ExperimentDPM 每百万单位的缺点数Defects per millionDPMO 每百万个机会的缺点数Defects per million opportunities lzq7IGf02EDPU 单位缺点数Defects per unitDR 设计审查Design ReviewDSS 决策支援系统D ecision Support SystemDVT 设计验证Design Verification TestingEC 设计变更／工程变更Engineering ChangeEDI 电子资料交换E lectronic Date InterchangeEMC 电磁相容Electric Magnetic CapabilityEOQ 基本经济订购量Economic Order QuantityEPC 工程制程控制E ngineering Process ControlERP 企业资源规划E nterprise Resource PlanningES 工程规格Engineering SpecificationEV 仪器系统变异E quipment VariationFMEA 故障模式效应分析Failure Mode and Effect Analysis FMECA 故障模式.效应与关键性分析F ailure Mode, Effect, and Criticality Analysis zvpgeqJ1hkFMS 弹性制造系统F lexible Manufacture SystemFQC 成品品质管制F inish or Final Quality ControlFTA 缺陷树分析Fault Tree AnalysisFTY 初检通过率First Time YieldGB 绿带Green BeltsGR&R 仪器再现性及再生性Gauge Repeatability & Reproducibility NrpoJac3v1IPQC 制程品质管制I n-Process Quality ControlIQC 进料品质管制I ncoming Quality ControlISAR 首批样品认可I nitial Sample Approval RequestISO 国际标准组织I nternational Organization for Standardization 1nowfTG4KIJIT 即时管理Just In TimeKM 知识管理Knowledge ManagementKPIV 关键输入变数K ey Process Input VariablesKPOV 关键输出变数K ey Process Output VariablesKURT 峰度KurtosisLCL 管制下限Lower Control LimitLPCL 前置管制下限L ower Per-control LimitLSL 规格下限Lower Specification LimitLTPD 不良率Lot Tolerance Percent Defective MES 制造执行系统M anufacturing Execution SystemMIL STD 美军标准Military StandardMO 制令Manufacture OrderMPS 主生产排程Master Production ScheduleMRO 请修(购>单Maintenance Repair OperationMRP 物料需求规划M aterial require planningMRP 物料需求规划M aterial Requirement PlanningMRPII 制造资源计划M anufacturing Resource Planning MSA 量测系统分析M easurement Systems AnalysisNFCF 更改预估量的通知Notice for Changing Forecast np 不良数管制图N umber of DefectivesODM 委托设计与制造Original Design & Manufacture OEM 委托代工Original Equipment ManufactureOPT 最佳生产技术O ptimized Production Technology OQC 出货品质管制O utgoing Quality ControlPCL 前置管制中心限Per-control Central LimitPDCA PDCA管理循环Plan-Do-Check-ActionPFMEA 制程失效模式分析Process FMEAPO 订单Purchase OrderPp 制程绩效指数P rocess Performance IndexPPAP 生产零件承认程序Production Part Approval Process Ppk 制程绩效指数PPM 每百万不良率P areto AnalysisQA 品质保证Quality AssuranceQC 品质管制Quality ControlQC Plan QC工程表Quality Control PlanQCC 品管圈Quality Control CircleQE 品质工程Quality EngineeringQFD 品质机能展开Q uality Function DeploymentQLF 品质损失函数Q uality Loss FunctionQMA 品质成熟度分析Quality Maturity AnalysisRMA 退货验收Returned Material ApprovalROP 再订购点Re-Order PointRTY 直通率Rolled Throughout YieldSCM 供应链管理Supply Chain ManagementSFC 现场监控Shop Floor ControlSL 规格界线Specification LimitsSO 订单Sales OrderSOP 标准作业程序S tandard Operation ProcedureSOR 特殊订单需求S pecial Order RequestSPC 统计制程管制S tatistical Process ControlSQC 统计品质管制S tatistical Quality ControlSTDEV 标准差Standard DeviationTOC 限制理论Theory of ConstraintsTPM 全面生产管理T otal Production ManagementTQC 全面品质管制T otal Quality ControlTQM 全面品质管理T otal Quality ManagementUCL 管制上限Upper Control LimitUPCL 前置管制上限U pper Per-control LimitUSL 规格上限Upper Specification LimitVAR 变异数VarianceWIP 在制品Work In ProcessXbar-R 平均数- 全距管制图Average-Range Control ChartXbar-s 平均数- 标准差管制图Average-Standard Deviation Control Chart fjnFLDa5ZoZD 零缺点Zero Defectσ, s 标准差Standard deviationσ2, S2 变异数Variance申明：个人收集整理资料，仅供交流学习，勿作商业用途所有资料为本人收集整理，仅限个人学习使用，勿做商业用途。

ANPQP 《联合新产品质量程序》英语词汇大全

HCPP
Hierarchisation des Caracteristiques Produit Processus (Hierarchisation of Product and Process Characteristics) Material Data System is the The International automotive industry material data system. Knock Down Features which have significant effects upon Fit, Function, Performance and Reliability in the vehicle Or Features which require assurance or control during production with regard to Fit, Function, Performance, Reliability, Appearance, and Serviceability (e.g. QVCC, QTF, etc. for Nissan; Level 1 and 2 for Renault ).
For Nissan γ + V3P Process: PF-D, PF-C, VC, PT, F A complete functional assembly inclusive of submodule parts as defined by the customer. ExamplesModule (CPM) Cockpit include:
Annualised Production Volume
ANPQP APQP ASAS-P ASES Assessment Level BOM Bottleneck CAD CAE CCR Child Part CKD Control Plan

【英文缩写对照】富士康常用英语

公司英語-----教育訓練部一:常用術語Hon Hai 鴻海CMM Component module move 機動元件整合CEM Contract Manufaction service 合約委托代工IBSC Internet Business Solution Center 國際互聯網應用中心PCEG Personal Computer Enclosure group 個人電腦外設事業群（FOXTEQ）CCBG Connector&cable business groupCPBG Competition business groupESBG Enterprise system business group 鴻富錦事業群SABG system assembly business group 系統組裝事業群NWE Net Work EnclosureNSE Network system enclosureNSG Network system group1NFE Network flexible enclosureFoxcavity = HZ = Hong Zhun 鴻準Stamping tool shop I 沖模一廠Stamping tool shop II 沖模二廠Prototype workshop 樣品中心Steel factory 裁剪廠PCE molding tooling workshop PCE塑模廠Hua Nan test and measurement center 華南檢測中心MPE mobile phone enclosure MPEMBE mobile phone and notebook enclosure 明塑厂MGE Alloy magnesium alloy enclosure 鎂合金Engineer standard 工標Document center (database center)資料中心Design Center 設計中心Painting 烤漆(廠) Assembly組裝(廠)Stamping 沖壓(廠)Education and Training教育訓練proposal improvement/creative suggestion提案改善Technological exchange and study 技術交流研習會Technology and Development Committee 技術發展委員會BS Brain Storming 腦力激蕩QCC Quality Control Circle 品質圈2旗开得胜PDCA Plan Do Check Action 計劃執行檢查總結DCC delivery control center 交貨管制中心3CComputer 電腦類產品Consumer electronics 消費性電子產品Communication 通訊類產品Core value（核心价值）Love 愛心Confidence 信心Decision 決心Corporate culture(公司文化)Integration 融合Responsibility 責任Progress 進步3T STRATEGYTime to market 及時切入生產Time to volume 及時大量生產Time to money 及時大量交貨3。

qc七大手法-QC常用单词中英对照精品

品質系統常見英文簡介1.QC : quality control 品質管制2.IQC : ining quality control 進料品質管制3.OQC : output quality control 出貨品質管制4.PQC : process quality control 製程品質管制也稱IPQC : in process quality control .5 . AQL : acceptable quality level 允收標準 6.CQA: customer quality assurance 客戶品質保証7.MA : major defeat 主要缺點8. MI : minor defeat 次要缺點9. CR :critical defeat 關鍵缺點10. SMT : surface mounting technology 表面粘貼技術11 . SMD : surface mounting device SMC : surface mounting ponent 表面粘貼元件12 . E : engineering change notice 工程變更通知13 . D : design change notice 設計變更通知14 . PCB : printed circuit board 印刷電路板15 . PCBA : printed circuit board assembly裝配印刷電路板16 . BOM : bill of material 材料清單17. BIOS : basically input and output system 基本輸入輸出系統18. MIL-STD-105E : 美國陸軍標準,也稱單次抽樣計劃.19 . ISO : international standard organization 國際標準化組織20 . DRAM: 內存條21 . Polarity : 電性22 . Icicles : 錫尖23 . Non-wetting : 空焊24 . Short circuit : 短路25 . Missing ponent : 缺件26 . Wrong ponent : 錯件27 . Excess ponent : 多件28 . Insufficient solder : 錫少29 . Excessive solder : 錫多30 . Solder residue : 錫渣31 . Solder ball : 錫球32 . Tombstone : 墓碑33 . Sideward : 側立34 . ponent damage : 零件破損35 . Gold finger : 金手指36 . SOP : standard operation process 標準操作流程37 . SIP : standard inspection process 標準檢驗流程38 . The good and not good segregation :良品和不良品區分39 . OBW : on board writer 熸錄BIOS 40 . Simple random sampling : 簡單隨機抽樣41 . Histogram : 直方圖42 . Standard deviation : 標準差43 . CIP : Continuous improvement program 44 . SPC : Statistical process control45 . Sub-contractors : 分包商46 . SQE : Supplier quality engineering47 . Sampling sample :抽樣計劃48 . Loader : 治具49 . QTS: Quality tracking system 品質追查系統50 . Debug : 調試51 . Spare parts :備用品52 . Inventory report for : 庫存表53 . Manpower/Tact estimation 工時預算54 . Calibration : 校驗55 . S/N :serial number 序號56 . Corrugated pad : 波紋墊57 .Takeout tray : 內包裝盒58 . Outerbox : 外包裝箱59 . Vericode : 檢驗碼60 . Sum of square : 平方和61 . Range : 全距62 . Conductive bag : 保護袋63 . Preventive maintenance :預防性維護64 . Base unit : 基體65 . Fixture : 制具66 . Probe : 探針67 . Host probe : 主探針68 . Golden card : 樣本卡69 . Diagnostics program : 診斷程序70 . Frame : 屏面71 . Lint-free gloves : 靜電手套72 .Wrist wrap : 靜電手環73 . Target value : 目標值74. Related department : 相關部門75. lifted solder 浮焊76.plug hole孔塞77. Wrong direction 极性反78.ponent damage or broken 零件破損79.Unmeleted solder熔錫不良80.flux residue松香未拭81.wrong label or upside down label貼反82.mixed parts機種混裝83. poor solder mask綠漆不良84. oxidize 零件氧化85.stand off height浮高86. IC reverse IC反向87.supervisor課長88. Forman組長89. WI=work instruction作業指導90. B.P.V:非擦除狀態91. Internal notification:內部聯絡單92. QP :Quality policy品質政策93.QT: Quality target 品質目標94. Trend:推移圖95.Pareto:柏拉圖96. UCL: Upper control limit管制上限97.LCL:Lower control limit管制下限98. CL: Center line中心線99.R.T.Y: Rolled throughout yield直通率100. PPM: Parts per million 不良率101.DPU: Defects per unit 單位不良率102.Resistor: 電阻103.Capacitor:電容104. Resistor array : 排阻105. Capacitor array: 排容106. DIODE: 二極管107.SOT: 三極管108. Crystal:震盪器109. Fuse:保險絲110.Bead: 電感111.Connector:聯結器112.ADM: Administration Department行政單位113. CE: ponent Engineering零件工程114. CSD :Customer Service Department客戶服務部115. ID: Industrial Design工業設計116.IE: Industrial Engineering工業工程117. IR: Industrial Relationship工業關係118. ME: Mechanical Engineering機構工程119. MIS :Management Information System資訊部120. MM: Material Management資材121. PCC: Project Coordination/Control專案協調控制122. PD: Production Department生產部123. PE: Product Engineering產品工程124. PM: Product Manager產品經理125. PMC: Production Material Control生產物料管理126. PSC: Project Support & Control產品協調127.Magnesium Alloy:鎂合金128. Metal Shearing:裁剪129.CEM: Contract Electronics Manufacturing 又稱電子製造服務企業EMS: Electronics Manufacturing Services130. ERP: Enterprise Resource Planning 企業資源規劃SCM+CRM+ERP+EAI=Network direct TM links procurement , production ,Logistics and sales採購,生產,后勤管理及市場行銷的融合EAI: Enterprise application Intergration 企業應用系統整合CRM: Customer Relationship Planning 客戶服務規劃SCM : Supply chain management 供應鏈管理131. OJT: On job training 在職培訓132.Access Time: 光碟搜尋時間133. B2CEC:Business to consumer electronic merce 企業對消費者的電子商務B2BEC:Business to business electronic merce 企業間的電子商務L:Copper Clad Laminate 銅箔基板135. Intranet: 企業內部通訊網路136. ISP: Internet Service Provider網絡服務提供者ICP: Internet Content Provider網絡內容提供者137. GSM: Global System for Mobile munication 泛歐數位式行動電話系統GPS: 全球衛星定位系統138. Home Page: 網路首頁139.Video Clip:影像檔140.HTML:超文標記語言141.Domainname: 網域名稱142.IP: 網絡網域通訊協定地址143.Notebook:筆記型電腦144.VR:Virtual Reality虛擬實境145.WAP:Wireless Application Protocol 無線應用軟體協定146. LAN : Local area network區域網路: World Wide Web世域網WAN: Wide Area Network 廣域網路147.3C: puter, munication , Consumer electronic 電腦, 通訊, 消費性電子三大產品的整合rmation Supplier Highway:信息高速公路149.UPS:Uninterrupted power system不斷電系統150.Processed material: 流程性材料151.Entity/Item:實體152.Quality loop:質量環153.Quality losses: 質量損失154.Corrective action:糾正措施155. Preventive action:預防措施156.PDCA:Plan/Do/Check/Action計劃/實施/檢查/處理157. Integrated circuits(IC):集成電路158.Application program:應用程序159.Utilities:實用程序160.Auxiliary storage/Second storage:;輔助存儲器161.Silicon chip:硅片162Diskette drive:軟驅163.Display screen/Monitor:顯示器164.Foreground:前面165.Montherboard:母板166.Mermory board:內存板167.Slot:插槽168.Bus:Data-bus/address-bus/Control bus:總線/數據總線/地址總線/控制總線169.Plotter:繪圖170.MPC:Multimedia personal puter多媒體171.Oscillator:振盪器172.Automatic teller terminal:自動終端(出納)機173.Joystick port:控制端口174.VGA: Video Graphics Array顯示卡175.Resolution:分辨率176.Register:寄存器177.ISA: Industry Standard Architecture:工業標準結構178.EISA:Extended Industry Architecture 179.Adapter: 适配器180.Peripheral:外部設備181.Faxmodem:調制解調器181.NIC:Network interface card網絡接口卡182.SCSI:Small puter system interface183.VESA:Video Electronic Standards Association184.SIMM:Single in-line memory module單排座存儲器模塊(內存條) 185.Casing:外箱186.Aluminum:鋁質187.Ceramic: 陶瓷的188.Platter:圓盤片189.Actuator:調節器190.Spindle:軸心191.Actuation arm: 存取臂192.Default code: 缺省代碼193.Auxiliary port:輔助端口194. Carriage return : 回車195.Linefeed:換行196.ASCII:American Standard Code for Information Interchange197.Video analog: 視頻模擬198.TTL:Transistor- Transistor logic晶體管-晶體管邏輯電路199.Three-prong plug:三芯電插頭200.Female connector:連接插座201.Floppy disk:軟盤202.Output level:輸出電平203.Vertical/Horizontal synchronization:場/行同步204.H(Horizontal)-Phase:行相位205.patible:兼容機206.Hardware Expansion Card: 硬件擴充卡207.Buffer:緩沖208.CRM:Customer relationship Management 客戶關係管理209.WIP: Work in process半成品210.Waiver:特別採用211.CXO系列—CEO: Chief Executive Office首COO :Chief Operating OfficeCFO: Chief Finance Officer CBO: Chief Business OfficerCTO: Chief Technology Officer CIO: Chief Information OfficerCGO: Chief Government Officer212.NASDAQ: 納斯達克證券市場NASDAQ Automated Quotation system213.VC:Venture Capital 風險投資214.PDA:Personal Date Assistant個人數字助理PLA: Personal Information Assistant個人信息助理215.PPAP:Advanced Product Quality Planning and Control Plan 生產性零組件核准程序216.FMEA:Protentical Failure Mode and Effects Analysis失效模式與效應分析217.MSA: Measurement Systems Analysis 量測系統分析218.QAS:Quality System Assessment 品質系統評鑑219.Cusum: 累計總合圖220.Overall Equipment Effectiveness設備移動率221.Benchmarking:競爭標竿Analysis of motion/Ergonomics動作分析/人體工程學222.Roka Yoke 防錯法MCR: machine capability ratio 機器利用率223.Mistake Proofing 防呆法Taguchi methods田口式方法224,Vertical integration垂直整合Surveillance定期追蹤審查225.EMS: Electronics Manufacturing Supply-chain226.Cause&Effects charts特性要因圖227.Scattle: 散佈圖Fool-Proof System防呆系統228.VE:Value Engineering 價值工程QFP:Quality Function Development 品質機能展開229.Arrow Chart 箭頭圖法Affiliate Chart親和圖法230.PDPC:Process Decision Program Chart System Chart系統圖法231.Relation Chart 關邊圖法Matrix Chart矩陣圖法232.Matrix Data Analysis矩陣數據分析法234.Brain-storm 腦風暴法JIT: Just In Time:及時性生產模擬235.Deming Prize: 戴明獎Prototype技術試作236 BPM:Business Process Management .業務流程管理MBO:目標管理237. MBP:方針管理FTA:故障樹分析QSCV: 服務品質238.IPPB:Information 情況Planning策劃Programming規劃Budget預算239.EQ:Emotion Quotient:情商IQ: Intelligence Quotient:智商240.Implied Needs:隱含要求Specified Requirement:規定要求241.Probation:觀察期Ining Product released for urgent production 緊急放行242.Advanced quality planning 先進的質量策劃243. AOQ: Average Outgoing Quality 平均檢出質量AOQL: Average Outgoing Quality Limit 平均檢出質量界限244.Approved Supplier List 經核准認可的供應商名單245.Attribute date 特征Benchmarking 基準點Calibration 校準246.Capable process 工序能力Capability Index 工序能力指數Capability ratio 工序能力率247.CHANGE CYCLE TIME 修改的時間周期Continuous improvement 持續改進248.Control plans 控制策劃Cost of quality 質量成本249.Cycle time reduction 減少周期時間250.Design of experiments 實驗設計Deviation / Substitution 偏差/ 置換251.ESD: Electrostatic discharge 靜電釋放252.EH&S: Environmental, Health, and Safely 環境,健康.安全253.ESS: Environmental Stress Screening 環境應力篩選254.FMEA: Failure Mode Effect Analysis 失誤模式效應分析255.First Article approval 產品的首次論證First pass yield 一次性通過的成品率256.First sample inspection 第一次樣品檢驗257.FMECA: Failure mode effect and critically analysis 失誤模式,效應及後果分析258.Gauge control 測量儀器控制GR&R: Gauge repeatability and reproducibility 測量儀器重復性和再現性259.HALT: Highly Accelerated Life Test 高加速壽命試驗HAST: Highly Accelerated Stress Test 高加速應力試驗260.IN-CONTROL PROCESS 受控制工序261.INDUSTRIAL AVERAGE 工業平均數262.JIT (just in time) manufacturing (即時)制程263.Key characteristic 關健特征Key ponent 關健構件264.Life Testing 壽命試驗Lot traceability 批量可追溯性265.Material review board 原材料審查部門MCR: machine capability ratio 機械能力率266.NONCONFORMANCE 不符合267.OUT-OF-CONTROL PROCESS 失控工序268.Pilot Application 試產(試用)269.PPM: Parts per million 百万分之一270.Preventive vs detection 預防與探測Preventive maintenance 預防維護271.Process capability index 工序能力指數272.Process control 工序控制Process improvement 工序改進Process simplification 過程簡化273.Quality Clinic Process Chart (QCPC) 質量診斷過程圖274.Quality information system 質量資料體系275.Quality manual 質量手冊Quality plan 質量計劃Quality planning 質量策劃276.Quality policy 質量方針Quality system 質量體系277.Reliability 可靠性RUN Chart 趨勢表Skill Matrix 技能表278.Statistical quality control (SQC) 統計質量控制279.Teamwork 團隊工作280.Total quality management 全面質量管理281.Variable data 變量數據Variation 影響變量282.Value Analysis 價值分析Visual Factory 形象化工厂283.Survey Instructions 調查指引284.Profile 概況285.Improvement Plan 改進計劃286.Evaluation 評估Implementation 實施pliance 符合287.Supplier Audit Report 供方審核報告288.Site Audit 現場審核289.Typical agenda 典型的議事日程290.Internal and external failure costs 內部和外部的失誤成本291.Failure rate percentage 失誤百分率292.Productivity (output / input) 生產率(產出/投入)293.Customer plaints 客戶投訴Customer satisfaction indices 客戶滿意度指數294.Root cause analysis of failures 失誤根原分析Nominal:名目的295.Enumeration:列舉Screening stage:篩選階段296.Screening materials:屏蔽材料Nonparametric parative experimental:非參數實驗297.Pitfall:缺陷Fractional factorial experiments:部份隨機實驗298.Management by munication:溝通管理技術Management by objective:目標管理技術299.Management by result:績效管理技術Human relationship skill:人際技術300.Conceptial skill:理念性技術Safety stock:安全庫存301.lead time:訂購前置時間EOQ: Economic order Quantity 經濟訂購量302.Run at rate:節拍生產Early production containment : 早期生產管制程序303.Accreditation Body:認可機構Active part在用零件304.Aftermarket part售后零件Analysis of Motion/Ergonomics:運動/人機工程學分析305.Finite Element analysis:有限元分析306.Geometric Dimensioning & Tolerancing:幾何尺寸與公差Match check匹配檢查st off part parison:末件比較Simulation Techniques:倣真技術308.Solid Modeling:實體造型Layout Inspection:全尺寸檢驗309.Service Parts:維修零件Remote location:外部場所310.Overall Equipment effectiveness:設備總效率PPAP: production part approval process生產件批准程序311.Bulk material:散裝材料Perishable Tools:易損工裝312.Growth Projections:企業營運成長企劃Projected Sales figures:行銷企劃藍圖313.Human resource development:人力資源開發Feasibility Reviews:可行性審查314.Pre-launch:量產前Unscheduled machine downtime:非計劃排定的停機時間315.Excessive cycle time:作業周期時間過多Non value-added use of floor space:工廠內的無附加價值事項316.New Target values to Optimized customer process:將顧客作業程序管理到最好的新目標值317.Misshipments:耽誤出貨Inplete orders:交貨不足318.Inventory turns over time:存貨周轉時間Stock rotation :存貨周轉319.Inventory levels:最低庫存量Order-drive:訂單導向320.Interim action:臨時措施321.Permanent action:永久措施322.Integrators:組合體。

品管常用专业术语中英对照

8D Process 8D过程D0 - Emergency Response Action快速反应行动D1 - Establish the Team建立团队D2 - Describe the Problem描述问题D3 - Develop the Interim Containment Action (ICA)开发临时性围堵方案或临时性纠正方案D4 - Define and Verify Root Causes and Escape Point确定和验证问题的根源和逃逸点D5 - Choose Permanent Corrective Actions (PCA)选择永久性纠正方案D6 - Implement and Validate Permanent Corrective Actions 实施和验证永久性方案D7 - Prevent Recurrence防止再发生D8 - Recognize Team and Individual Contributions认可团队和个人的贡献MRB运作流程指导一、目的为合理有效的对来料不合格品进行处置和对重大品质问题进行处理，保证公司产品的品质和交期，特成立MRB委员会。

二、定义MRB：Material Review Board三、适用范围对来料和外协加工过程的不合格品及重大品质问题的处理均可提交MRB委员会处理。

四、组织结构MRB委员会主席：质量总监MRB委员会成员：IQC负责人，QA负责人，工艺负责人，电路设计工程师，结构设计工程师，采购部门相关人员，其他部门相关人员（需要时）五、职责MRB委员会主席：对不合格品或者重大品质问题的最终处理决定；MRB委员会成员：品质部门负责不合格品之品质判定及评审；采购负责来件不合格品之评审及处理（退货，换货等）；结构设计工程师负责对结构类来料不合格品之评审；电路设计工程师负责对电子类来料不合格品之评审；工艺负责人负责对于生产工艺方面的评审；其他部门相关人员负责来料不合格品之评审。

注塑及模具英文

Hopper Dryer 料斗干燥器Injection Molding Cycle 注塑周期Crushing Mill 粉砕机Precision Injection 精密成形Gas Injection / AGI 吹气成形、气辅成形Set the condition 设定注塑前提Machine 机械Mold Set-Up 上模Screw 螺杆、螺钉、螺旋Mold Down 下模Screw Head 螺杆头Pressure 压力Joint 接头、接缝Low Pressure 低压Injection 注塑Low Pressure Clamping 低压锁模Feeder 送料（加料）器Holding Time 保压时间Compound 混炼料；Back Pressure 背压Blend 搅混、调合Clamping Force合模力Mixer 混淆器Hold Clamping pressure 锁模型压成力Mixing 混淆Clamping Stroke 合模行程Cooling 冷却Clamping Unit 锁模装配Cooling Tower 冷却塔Mold Opening 开模Chiller冷水机Mold Closing 合模Temperature Controller 温调机Speed 速率Cylinder 料筒Injection Speed 射出速率Heater 加热器Injection Capacity 注塑量Band Heater 加热圈Charging 计量Thermocouple 热电偶Charging Stroke 计量行程Nozzle 射嘴Rib 骨位、筋位、增强筋Nozzle Head 射嘴头子Insert 嵌件、镶嵌Tie Bar 、Tie rod 拉杆、拉杠Wall Thickness 胶厚、壁厚Distance Between Tie rods 拉杆距离Plasticizing 塑化Limit Switch 限位（限定）开关Thermal Decomposition 热分化Operation Switch 操作开关Shrinkage収缩Operation Guide 操作指南Resin 树胶Control Panel 节制器Material 原料、质料Automatic 全自己主动Plastics 份子化合物塑料、塑胶成品Semi Auto 半自己主动Rubber 橡胶Hand 手动Master Batch 色母Handle 手柄Powder 色粉、粉、粉末Extruder 押出机、挤塑机Dry Color 色粉、干色料Extrusion Molding 挤塑Pellet 粒、塑胶粒Blow Molding Machine 吹塑机Glass Fiber, Fibrous Glass 玻璃纤维Blow Molding 吹塑Hose 软管、管Program Control 步伐节制Over Packing 过充填Process 工艺、工序、历程MoldMark 马克模伤、模痕Inject visor 注塑工艺步伐节制装配Shock 冲击、冲击Damage 损坏、毁伤Cold Slug 冷料Sink 马克抽水、紧缩Cold Slug Well 冷料井Short Shot 充填不足、欠料Freeze 冷凝Flash 毛刺、披峰Hydraulic 液压、油压String Flash 胶丝Hydraulic Ejector 液压顶出、液压脱模White 马克白化、顶白Hydraulic Pump 液压泵Silver 雪白、银痕Hydraulic 摩托液压电动机Flow mark 流纹Air Compressor 空器压缩机、空压机Burn 烧黑、烧焦Oil Leakage 漏油异物Black Spot 异物、黑点Oil tank 油箱、油槽Sticking 粘模Piston 活塞Weld 溶接线、联合线Air Cylinder 气缸Flash 料花Alarm 报警Oil 马克油污、油渍Safety Gate 太平门Damage 打痕、击伤Emergency Stop 紧迫遏制Cracking 裂、开裂Color Change 换色Jetting 气纹Purge Material 清机份子化合物塑料Deform 变型Resin Thermal 胶料温度Warping 屈曲、翘曲、外倾Mold Thermal 模温Bend 屈曲Heat Up 升温、升热Torsion 扭曲Air Shot 空射胶、空打Uneven Color 色彩不匀称Try 试模Eccentric Wall Thickness 壁厚不匀称Mold Release 脱模Bladder、Cell 气泡儿、浮泛、空地Mold Release Agent 脱模剂Stripes 条纹Rust Preventatives 防锈剂Dirty 污痕、污点、渗溢Can’t Release （产物）没有办法脱模Flaking 脱落、剥落Shot 注、射、啤Tear Off 上下翻动Gate 进点，浇口Float 浮起Center Gate 中间浇口Screw Damage 螺钉滑牙Sprue Runner 水口，注口、流道料Shortage 员数不足、欠品Clearance 距离、余隔Run out 跃动度、偏疼Sprue 主流道注（塑）口Contraction 紧缩Runner 流道、流道料Assembly NG 嵌合不良、装配不良Air Vent 散气眼、透风口Stress 应力Breathing 排气、散气Internal Stress 内部策应力Anneal 热措置惩罚、退火Preparation 摆设、筹办Mold 生产模型Stopper 挡块Machining Center 加工中间Stripper 推板、脱模型板Universal Milling Machine 刨床、锣床Spacer Plate 垫板Latter 车床Mould Base 模胚Surface Grinder 最简单的面磨制机床Support Plate 托板Grinding Drilling 钻床Support Pillar 撑头Electric Discharge Machine 火花机加工Puller Lock 拉塞Wire EDM 线割切Puller Bolt 拉杆Nitride Steel 氮化钢取付板Top clamp Plate 工字板、水口板Nitrogen 氮气Bottom Plate 底板Nitride 氮化措置惩罚Return回针Titanium 钛Guider Pin 导柱Heat Treatment 热措置惩罚Guider Bush 导套Hardening 淬火Die 生产模型、动模、移动模型板Temper 回火Die Plate 模型板、载模型板Annealing 退火Module 板块、模件、模数Pre harden 预加硬钢Parts 零件、生产模型零件Hardness 硬度Eye Bolt 吊环螺栓Soft 软、软的Crane 吊车、吊车、行车Electrodes 铜公Hook 勾、吊勾Insert 镶件Wire 钢丝、钢丝绳Slide 行位、滑块File 锉子Taper 斜度Oil Stone 油石Taper 斜度、锥度、锥形的Sand Paper 砂纸Draft 脱模斜度Mesh 节号、目Guide Pin 导向柱刻印Engrave 刻印Sleeve Pin 司筒针Texture 蚀纹Square Pin 扁顶针放电目EDM Texture 火斑纹Angular Ejector 斜顶针Rough 粗的Cavity 模腔、前模、母模Trifling 细的、幼的Core 模心、后模、公模Diamond Cut 钻石纹Number of Cavities 取数、模腔数Roulette 滚花刀、刻痕Rocket Ring 定位环Blast 喷沙O Ring O环；胶圈Hot Runner 暖流道Wall Thickness 肉厚、胶厚Repair 补缀Add Material 加胶接Welding 溶接、焊接Building 加胶溶接机Welder 焊机、电焊机Cut Material 减胶溶接棒Welding Rod 焊条、电焊条Modify the tooling 改模（因设变补缀）Argon Arc Welder 氩弧焊Repairing the tooling 生产模型补缀Torch Bumper 喷燃烧现象器、火苗燃烧现象器Design 预设Ejector Pin 顶出Design Drawing 预设图Ejector Pin 顶针Design Change 预设变动、设变Gate Type 水口体式格局Designer 预设者、预设职员Tunnel Gate 隧道式浇口、潜入水下口Designer 预设者Pin Point Gate 针孔形浇口、细水口Mold Design 生产模型预设Side Gate 侧水口、洪流口Mold Specification 生产模型建造仕样书Direct Gate 直接浇口Specification 规格Multi Gate 复式浇口Mold Construction 生产模型机关、生产模型布局Fan Gate 扇形浇口Input 输入Film Gate 扇形浇口Programming 编程Jump Gate 搭接浇口3D Drawing 3D图、3维图Gate Balance 浇口均衡2D Drawing 2D图、最简单的面图Undercut 凹槽、倒扣Front Elevation 正面图Cooling Line 水管、运水Plan 平面图Cross-sectional Drawing 剖面图Cooling 冷却回路、运水CAD Date CAD 数值Modeling 模Mock-up 模子、原尺寸模子Software 软体Hand Made Sample 手板、手工样品Mold Drawing 生产模型图Module 模数、模量；模件Part Drawing 零件图Gear 齿轮；传动装配Diagrammatic Sketch 草图Helical Gear 螺旋齿轮Drawing 绘图Solid 群体的；固体Revised Drawing 图订変换Transformation 变换、转换Dimensioning 记入尺寸Floppy Disk 磁盘、软盘Out Mold Direction 出模标的目的Computer 台式机、计较机Draft 出模斜度Personal Computer 私家用电器脑、手提台式机Pitch 间距；齿距Version 情势、品类（译文，翻译，译本）Angle 角度Reading 读取Projected Area 投影平面或者物体表面的大Readout 读出Taper 锥度；斜度Reading 读数Under cut 倒扣圧缩Compression 压缩2 Plate 两板模开Open 打开；读出文件（软体）3 Plate 三板模Not Open 打（解）不开、读不出Offset 偏置、偏移Miss 纰缪、掉误Mold Layout 分模Condition of the progress 进程项度状态Split Mold 对于开式生产模型Finishing 打光、磨光Slide Core 滑动模芯Polish 研磨、打磨Loose Core 勾当模芯Target 方针、目的、对于准Loose Mold 勾当生产模型Schedule 每一日安排表Press 冲压、压床、压Maintenance 维护、调养Press Machine 冲床Did Casting 压铸Progressive 级进Sintering 加热使黏结Single 单冲Monkey 勾当板子Packing Plate 垫板Clamp 夹具（固定生产模型用）Punch 冲头、凸模、冲床Scrap 废铁；废物、废渣Punch Press 冲孔机Rust 生锈Die 下模Rust Inhibitor 防锈剂Die Set 模座、模架Washing Agent 洗濯剂Press Mold 冲压模、五金模Ultrasonic Cleaning 超音波洗濯Leveler 整平滚；矫平机Feeder 送料机；加料机Burr 反边、毛刺Drawing 拉伸Thinner 天纳水；淡薄剂Burring 去毛刺Triclinic 三氯乙烯脱脂剂Blank 复合Trivalent Chromium 六价铬Cutting] 落料、冲孔Bending 折弯Degreasing 脱脂、去油Bend 折弯、屈曲Harmful Metal 有害物Box-Bending 箱Cut 割切L-Bending L拆弯Press；Sheet Metal 板金V-Bending V折弯Cut 堵截、割断Punching 冲孔、钻孔Iron Plate 铁板SECC 镀锌板Cutting 冲压、抽去Silver Top 镀锌板Shirk 避空Stainless 不锈钢Calking 铆接Copper 铜Tap 螺丝攻Brass 黄铜Dies 板牙Steel 钢Reamer 铰孔Aluminum 铝Reamer 铰刀；扩孔器Width 宽度End Mill 刨刀板厚Thickness 板厚Grinder 砂轮儿机、磨制机床Density 疏密程度Barrel 滚筒Coil 卷材Barrel Tumbling 滚（桶抛）光Width Cut 片材Plating 电镀Nut 螺丝帽、螺帽Electro plating Vacuum真空电镀Bolt 螺栓、螺杆Spot Welding 点溶接、点焊Chrome plating 镀铬Jip 夹具，治具Galvanization 镀锌Clearance 间隙Shave 切、削Matching 接口Assembly 装配、组装Counter 统计器Assembly Unit 装配组件Count Method 统计法Assembly Time 装配工数Timer 按时器Line 出产线、拉线Digital 数码（的）、数码Self 单人装配Digital Camera 数码拍照机Conveyer 传送带Connect 插座、插嘴U Line U形出产线Plug 插头、瓶塞Capacitor 电器皿Lamp 灯Resistor 电阻器Lighting 点灯、灯亮Diode 二极管Fuse 断电丝LED (light-emitting diode) 闪光二极管Power Code 电源线Transistor 形成晶体体管Wire Hamess 电线导线IC集成电路Bar Code 条纹码LCD (liquid crystal display) 液态晶体预示器Vinyl Tape 绝缘带Sensor 传感器Noise 异音、杂音、噪音Relay 替续器Decibel 分贝（声强单元）Connector 保持器Instruction Sheet 功课引导书Transformer 变压器Access Platform 功课台Breaker 断路器Series 串联Buzzer 蜂鸣器Parallel 并联Printed Circuit Board /PCB 印刷电路板Clutch 连轴器、聚散器Driver 螺钉刀、起子Solenoid Coil 电磁线圈Driver 十字批（起）Coil 线圈Driver 一字批（起）Static Electricity 静电Electric Driver 电动螺钉刀、电批Prevent Electricity 防静电Torque 扭矩、转矩Fan Motor 电扇电动机Screw 螺钉Grease 润滑Washer 垫圈（片）Apply 涂油E-Ring 卡环Block Copy 底板、草图Solder 焊锡Film 胶卷、软片Soldering iron 烙铁Silk Print 丝印Tin 锡Pat Print 移印Earth 接地、地线Hot Stamp 烫印Alcohol 火酒、乙醇Ink 印字油墨Foot Switch 脚踏开关Color Sample 色板Terminal 端子印刷不良Print NG 印刷不良Terminal Block 端子板Bleeding 渗溢、飞油Label 标贴、标签Stamp 捺印Bar Code 条纹码、条形码Spray 涂装、喷涂Mile 软片；聚酯树胶Wood Graining 木纹加工Quality Control 品位办理Sample 样品、样本、样板Inspection 查抄Boundary Sample 限度样板I Q C 验收、受入查抄Approval Sample 认可样板O Q C 出货查抄Tolerance 公役P Q C 工程查抄Plus 正、加号Sampling 抽查Minus 负、减号Total Inspection 全检Disperse 不不变、颠簸Visual Inspection 目视查抄不稳固Unstable 不不变Appearance Check 外不雅查抄Balance 均衡、均衡Patrol 巡检工程能力Process Capability/CP 工程能力Measurement 丈量仪三角螺丝刀Detection 检验测定Measurement 丈量、标定Check Point 查验（重）点Measuring Method 丈量要领No Check 漏检Clogging 刻度、分度特采声请Special Adoption Application 特采声请Memory 储存、影象暂定対策Provisional Countermeasure 暂定对于策Three-Dimensional Measuring Machine 3D丈量仪长久対策Permanent Countermeasure 长久对于策Microscope 东西目镜Claim 投诉、报怨、索赔Profile Projector 投影机Appraisal 评价Slide Calipers 卡尺Decide 鉴定Micrometer 量具検査基准Check Standard 查抄基准Lever Type Dial Test 百分表検査基准表Inspection Sheet 查抄基准表Torque Gauge 扭转力计QC工程表QC Flow Chart QC工程表Scale 刻度尺Specula Face 镜面Square 90度角尺Mirror Face 光面、光泽面Steel Tate 皮尺Texture Face 蚀纹面Height Gauge 高度尺First the face 一级面Pin Gauge 柱规Appearance 外不雅面Thickness Gauge 片Appearance Part 外不雅产物Protractor 角度仪Function Part 性能部品Tension Gauge 拉力计Slide 滑动面Indicator 百分表Flatness 最简单的面度Hardness Tester 硬度计Reform 矫正Multitester 万用表Check Jig 查抄用治具Surface Plate 平台、平板Feed Back 反馈V Block V形块Communication 信息、报怨Gauge Block 方块规Manual 指南、手册Dial Gauge 百分表、百分表Flow Chart 流程图Data 数值Process Inspection 工程监查Data Sheet 数值单Qualification 确定地认为Parameter 参量Graph 图表、曲线图Warehouse 堆Customhouse 海关Pallet 卡板Customs Clearance 报关、通关Corrugated Fiberboard 纸箱Customs Clearance 报关手续Partition 刀卡Electronic DataInterchange 电子报关Recycle Box 周转箱Container 货柜车Plastics Box 折叠式周转箱Foot 英尺Container 份子化合物塑料周转箱Packing List 装箱单Poly-bag 胶袋List 详细登记单Tape 封箱品牌一字螺丝刀胶纸Declaration 申请报告Rope 绳索、线Import 入口First in First out 先入先出Export 出口Fork Lift 铲车Fumigation Certificate 薰蒸证实书Hand Lift 手推铲车No Wood Packing Certificate 无木质包装证实书Bogie 台车Wooden box 木箱Truck 卡车Shelf 货架License 批文、容许Stock 在库数License Document 转厂Shelf 盘货Limits 指标、配额指标Dead Stock 死仓储、积压品Import Limits 入口指标Purchasing 采集购买Unbalance 数目不服衡Supply Parts 支给品合约Contract 合约Purchase Parts 采集购买品Contract 手册Lead Time 交货期、定货期Order Placement 发定单Transfer; Carry Over 转余料、拔余料Pay 有偿Erase 核消Free of Charge 没有报酬的Provision of Information 加签Vender 供应商Submit Document 递单Quotation 报价单Brand Name 商物品名称称Invoice 发票、请款单Goods No 商品编码Deposit 预付款、包管金Foreign Enterprise 外资企业Payment 付款Owned Enterprise 独资企业Payment Condition 付款Partnership Enterprise 合资工厂Month Payment 月结Processing 来料加工Over Time 加班（没事了事情日加班）Bailment Processing 委托加工Over Time Fee 加班费Labor Cost 人件费Holiday Work 加班（节沐日上班）Amortization 折旧费Two shift 两班制Hour Charge 加工费；工时费Day Shift 白班Exchange Rate 汇价Night Shift 晚班Material Certificate 质料证实书。

富士康英语

力。
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FOXCONN Microsystem Corporation
AMBIT
第一章企业常用缩写
1.1 常用术语
Hon Hai 鴻海 CMM (Component module move) 機動元件整合 CEM (Contract Manufaction service) 合約委托代工 IBSC (Internet Business Solution Center) 國際互聯網應用中心 PCEG (Personal Computer Enclosure group) 個人電腦外設事業群（FOXTEQ）
-7AMBIT
AQL S/S ACC REE CR MAJ MIN Q/R/S P/N L/N AOD UAI FPIR PPM
Acceptable Quality Level Sample size Accept Reject Critical Major Minor Quality/Reliability/Service Part Number Lot Number Accept On Deviation Use As It First Piece Inspection Report Percent Per Million
-1AMBIT
"
2.3 冲压类……………………………………………………………………………………………（24） 2.4 成型类……………………………………………………………………………………………（24） 2.5 组装类……………………………………………………………………………………………（30） 2.6 烤漆类……………………………………………………………………………………………（31） 2.7 品質類……………………………………………………………………………………………（33） 2.8 SFIS 名詞縮寫与解釋……………………………………………………………………………（36）

六西格玛黑带培训教材73页PPT

Capability is often thought of in terms of the proportion of output that will be within product specification tolerances. The frequency of defectives produced may be measured in
(positional variation) (unit-unit variation) (lot-lot variation) (line-line variation) (time-time variation) (repeatability & reproducibility)
Process Capability Analysis
• A process operating in the presence of assignable causes of variation is said to be “out-of-control”
Process Capability Analysis
4
Information,thewayyouwantit
Process Capability Analysis
7
Information,thewayyouwantit
Three Types of Limits
Specification Limits (LSL and USL)
• created by design engineering in response to customer requirements to specify the tolerance for a product’s characteristic

整车开发过程中的英文缩写-汽车行业的你一定要知道的

整车开发过程中的英文缩写-汽车行业的你一定要知道的小编整理的一份超级全面的整车开发过程中用到的英语，供大家参考整车开发通用英文缩写（按首字母排序）英文缩写英文全称中文含义（按首字母排序）100% Cal 100% Calibration 100%标定100% IVER 100% Integration Vehicle EngineeringRelease100%集成车工程发布100% PPAP All parts at full PPAP for Vehicleprogram为了整车项目，所有零件PPAP100% SVER 100% Structure Vehicle EngineeringRelease100%结构车工程发布65% Cal 65% Calibration 65%的动力总成标定80% Cal 80% Calibration 80%的动力总成标定8D 8 Disciplines 问题解决8步法A Alpha Alpha阶段（动力总成产品阶段）A MRD Alpha Material Required Date Alpha样件需求日期A/T Automatic Transmission 自动变速器A/T Automatic Transmission 自动变速器AA Architecture Approval 架构批准AAM Alliance of Automobile Manufactures 汽车制造商联盟ABS Anti-lock Brake System or Anti-BlockSteering防抱死制动系统AC Architecture Confirmation 架构确认ACE Assistant Chief Engineer 总工助理ACT Activity 工艺路线ACT BOM Assembly Component Tree BOM 总成件树形BOMAD Alternatives Development 主题开发ADV Analysis / Development / Validation 分析/开发/验证ADV Analysis, Development and Validation 分析，开发和认证AE Application Engineer 应用工程师AE Application Engineer 应用工程师AEM Assimilability evaluation method 可装配性评估方法AFI Architecture Framing Initiation 架构框架启动AIAC Automotive Industry Action Group 美国汽车工业行动集团ALY Alloy 铝合金AMT Automatic Machincal Transmission 机械式自动变速器ANSI American National Standards Institute 美国国家标准协会AP Advanced Purchasing 提前采购AP Assembly Plant 总装厂APB Automotive Product Board 汽车产品委员会APD Approved Product Description 批准的产品描述APE Annual Program Execution 年度项目执行APEC Asia Pacific Economic Cooperation 亚太经济联盟APQP/CP Advanced Product Quality Planning andControl Plan先期产品质量规划和控制计APSB Asia Pacific Strategy Board 亚太战略委员会（通用汽理组织）AR Appropriation Request 项目预算ARC Architecture Refinement Complete 架构优化完成ASB Automotive Strategy Board 汽车战略委员会（通用汽理组织）ASC 经销商售后管理系统ASE Automotive Safety Engineering 汽车安全工程ASE Aftersales Engineering 售后工程ASN Advanced shipping notice 发货通知单ASSI Architecture Statement of StrategicIntent战略意向的架构陈述Assy Check-in Assembly Line Check-in 装配线进场启动现场安调Assy PPAP Assembly Line PPAP 装配线通过PPAPAssy PPAP Assembly Line PPAP 装配线通过PPAPAssy PPV Assembly Line Products and ProcessValidation装配线交付后的产品工艺验Assy PPV Assembly Line Production and ProcessValidation装配线交付后产品工艺验证Assy Run-Off Assembly Line Run-Off 装配线试装交样日期Assy Run-off Assembly Line RUN-Off 装配线整线打通，启动试工装配Assy Run-off MRD Assembly Line RUN-Off Material RequiedDate装配线ATC Auto Temperature Controller 自动空调控制器ATF Automatic Transmission Fluid 自动变速箱油ATT Attachment 附件ATT Actual takt time 实际单件工时AVD Advanced Vehicle Development 先期车辆开发AVDC Advance Vehicle Development Center 先期车辆开发中心AVD-LT Advanced Vehicle Development-LeadershipTeam前期整车开发-领导小组AVDP Advanced Vehicle Development Process(Time between DSI and VPI)先期车辆开发流程（在DS间）AVPM Advanced Vehicle Planning Manager 先期车辆计划经理B Beta Beta阶段（动力总成产品阶段）B Build 制造B MRD Beta Material Required Date Beta样件需求日期B+U Building and Utility 土建公用BAD Build Authorization Document 试制授权文档BC Business Case 业务计划BCM Body Control Module 车身控制器BDC Body Distributon Central 车辆调配中心BESC Base Engine Steering Committee 发动机总成战略转向委员会BIQ Building in Quality 制造质量BIR Prototype Build Issue Report 试制问题报告BIR Build Issues Resolution 试制问题BIR Build Incident Report 装车问题报告BIR Bulding issue report 造车问题报告BIW Body-In-White 白车身BIW Body in White 白车身BOD Bill of Design 设计清单BOE Bill of Equipment 设备清单BOM Bill of Material 物料清单BOM Bill of Material 物料清单BOM Bill of Material 物料清单BOM Bill Of Material 物料清单BOM Bill Of Material 物料清单BOM Bill of Material 物料清单BOP Bill of Process 工艺清单BOP Bill Of Process 工艺清单BP Break Point 断点BPD Business Plant Deployment 业务计划实施BPP Best people practices 最佳人员准则BPR Business plan recompose 业务流程重组BS Body Shop 车身车间BSD Build Site Direction 试制现场指导书BUFFER Buffer 线边缓存区C/CAP Construction/Conversionand Acceleration Plan土建/改造和生产提速计划CAB Change Approval Board 更改审批会CAC 服务热线专员CAFE Corporate Average Fuel Economy 公司平均油耗Cal Calibration 动力总成标定CARE Customer acceptance review evaluation 整车报交检查CARE Customer Acceptance & Review Evaluation 用户接受度和审查评估CC Concept Confirmation 验证概念CC Consolidation Center 集散中心CC Confirmation Clinic 确认临床Cert LSO Certification Lift Stop Order 通过排放认证通知CET Cold Environment Test 寒区试验CH Chassis Department 底盘部CI Concept Initiation 提出项目概念CIM Customer Interface Manager 客户服务经理CIP Continue Improve Process 持续改进CIP Continue Improve Process 持续改进CIT Continuous Improvement Team 不断改进小组CIT Compartment Integration Team 车厢集成小组CMC Container Management Center 空箱管理中心CME Change Management Engineer 更改管理工程师Cmk N/A 临界机器能力指数Cmk Capability Machine Index 机器设备能力CMM 三坐标测量C-NCAP China New CAR Assessment Process 中国标准新车评估体系COC Centre of Competence 能力中心COE Center of Expertise 经验总结中心CP Control Plan 控制计划CPIT Current Product Improvement Team 现有产品改进小组Cpk Complex Process Capability 过程能力指数Cpk Process Capability Index 稳定过程的能力指数CPQE Current Product Quality Engineer 现有产品质量工程师CPV Cost per Vehicle 单车成本CR/DN Change Request / Decision Notice 更改决议CR/DN Change Request/Decision Notice 变更申请/决议通知CRB Change Review Board 更改评审小组CS Contract Signing 动力总成签署项目合同CS Contract Signing 合同签订CS1 Controled Shipping 1 一级受控发运CS2 Controled Shipping 2 二级受控发运CSC Controls Steering Committee 控制模块战略转向委员会CSI Customer Satisfaction Index 用户满意度指标CSI Customer Satisfaction Index 售后满意度CSN Current Sequence Number 流水号CSO Contract Sign-Off 合同签署CSO Contract Sign-Off (VDP) 整车签署项目合同（VDP术CSO HC Contract Sign-Off Health Check 合同签署健康检查CSO HC Contract Sign-Off Health Check 合同签署健康检查CT Cycle Time 制程周期CT Cycle time 周期时间CT Creativity Teams 创造性工作小组CT Critical Test 关键试验CTS Component Technical Specification 零部件技术标准CTT Common Timing Template 标准2级进度模板CVER Concept Vehicle Engineering Release 概念车工程发布CVER LL Concept Vehicle Engineering ReleaseLong Lead概念车工程发布－－长周期CVIS Completed Vehicle Inspection Standards 整车检验标准CVQC Completed vehicle quality ceter 整车质量中心CVQCB Completed vehicle quality ceter board 整车质量目视板CVT Continuously Variable Transmission 无级变速器D.Q.R 合格率概况DAS Design & Analysis Section 设计分析科DC Deliver Charter 递交项目章程DCN Design Change Notice 设计更改通知DCN Design Change Notice 设计更改通知DCP Dimension Control Plan 尺寸控制计划DCS Design Concept Sheet 概念设计表DCT Double Clutch Transmission 双离合器变速箱DD Direct Delivery 直接投线DDSP Driver Door Switch Pack 驾驶席门控开关DEI Die Engineering Integration 模具工程集成DFA Design for Assembly 装配工艺性设计DFM Design for Manufacturability 制造工艺性设计DFMEA Design failure mode and effects analysis 设计失效模式和效果分析DFMEA Design FMEA 设计失效模式分析DIFF Differential 差速器DL 3b Design Level 3b 设计阶段3bDMS Dealer Manage System 经销商管理系统DOL Dealer On Line 经销商在线系统DP Demand Plan 需求计划DPV Defects per vehicle 单车缺陷数DPV Defect per Vehicle 单车缺陷数DQ&V Design Quality & Validation 设计质量和验证DR Direct run 直接通过率DRC Design Review Committee 设计评审委员会DRE Design Responsible Engineer 设计和发布工程师DRE Design Release Engineer 设计发布工程师DRE Design release engineer 设计发布工程师DRL Direct run loss 直接通过损失率Drop Off Drop Off 停产DS44 HIGH SPEED DURABILITY TEST 高速耐久试验（MGRES 标准DSG Direct shift gearbox 双离合器变速箱DSI Document of Strategic Intent 战略意向书DSM Driver Seat Module 驾驶席座椅控制模块DSO Design Sign Off 设计签署DTA Design Theme Alternatives 设计主题选项DTC Diagnostic Trouble Code 诊断故障码DV Design Validation 设计验证DV Design Validation 产品设计验证DVP Design Validation Plan 设计验证计划DVT Dynamic vehicle test 整车综合动态测试E/T/C Engine/Transmission/Controller 发动机/变速器/控制模块EBA Emergency Brake Assistant 紧急制动辅助系统EBD Electronical Brake Distribute 电子制动力分配系统EBOM Engineering BOM 工程BOMEC Embedded Controller 控制模块ECC ERP Central Component ERP核心组建ECR Engineering Change Request 工程更改请求ECR Engineering Change Request 工程更改请求ECR Engineering Change Request 工程更改申请ECR Engineering Change Request 工程项目变更申请ECS Engineering Change Summary 工程变更摘要ECT Emission Control System 电子控制自动变速器EDS Electronic Data Systems 电子数据系统EEVC European Enhanced Vehicle-Safety Committee欧洲提高车辆安全性委员会EFEO Emissions & Fuel Economy 排放和燃料经济EGM Engineering Group Manager 产品工程小组经理EI&S Electronics Integration & Software 电器零件集成和软件ELV End of life vehicle 整车寿命结束EMlS Emission 排放EMS Engine Management System 发动机管理系统ENB Build-Test Section 试制试验科E-NCAP Euro New Car Assessment Process 欧洲标准新车评估体系ENG Engineer 工程师EOA End of Acceleration 生产提速的完成EOLT End of Line Test 生产线试验结束EP Engineering Prototype 工程样车（件）EPA Environmental Protection Agency 环境保护厅EPC Engineering Program Committee 工程项目委员会EPN Engineering Project Number 工程项目数目ERD Early Requirement Document 早期的要求文件ESB European Strategy Board 欧洲战略委员会（通用汽理组织）ESO Engineering Sign Off 发动机整机工程签署ESO Engineering Sign Off 工程签署ESO Engineering Sign-off 工程签署ET Engineering Technology 工程技术EV Engineering Vehicle 工程样车EWO Engineering Work Order 工程工作指令EWO Engineering Work Order 工程更改号EWO Engineering workorder 工程更改流程Exp Cal Experimental Calibration 尝试性标定FA Final Approval 批准正式生产FAC 集团销售经理FATG Final Approval to Grain 生产最终批准FBIW First Body in White Complete 第一轮白车身完成FE Functional Evaluation 功能评估FE LSO Fuel Economy Label Lift Stop Order 通过油耗认证的通知FIVC First Integration Vehicle Complete 第1辆集成车制造完毕FIVC First Integration Vehicle Complete 第一轮集成车完成FLO Factory Layout 工厂布局FM 功能尺寸FM Finance Manager 财务经理FMC First Mule Complete 第一轮骡子车完成FMC 区域售后支持FMEA Failure model effectiveness analysis 失效模式分析FMEA Failure model effectiveness analysis 失效模式分析FMEA Failure Mode and Effects Analysis 潜在失效模式及后果分析FMEA Failure mode and effects analysis 失效模式和后果分析FMEA Failure Mode and Effect Analysis 失效模式和影响分析FMS Flexible manufacturing systems 柔性制造系统FMVSS Federal Motor Vehicle Safety Standards 联邦汽车安全标准FPPV BIW First Product/Process Body in WhiteComplete第一轮产品/工艺白车身完FPPVC First Product/ProcessValidation Vehicle Complete第一轮产品/工艺验证车辆FPS Fixed Point Stop 固定停止位置FTC First Time Capability 首次能力FTP/FTQ First time pass/quality 一次通过合格率FTQ First time quality 下线合格率FWD Four Wheel Drive 四轮驱动G Gamma Gamma阶段（动力总成产品阶段）G MRD Gamma Material Required Date Gamma样件需求日期G/L Group leader 工段长GA General Assembly 总装GA General Assembly 总装GADT Global Architecture Development Team 全球架构开发小组GBOM Global Bill of Material 全球物料清单GMNA General Motors North America 通用汽车北美分部GMPT General Motors Powertrain 通用汽车动力总成分部GPDC Global Product Development Council 全球产品开发理事会GPDP Global Powertrain Development Process 全球动力总成开发流程GPDS Global Product Description System 全球产品管理系统GSD Global Segment Director 全球细分主管GSS Global Sales and Service 全球销售和服务GVDP Global Vehicle Development Process 全球整车开发流程GVDP Global Vehicle Development Process 整车开发流程GVDP Global Vehicle Development Process 整车开发流程GVDP Global Vehicle Development Process 全球汽车开发流程GVDP Global Vehicle Development Process 全球整车开发流程GVDP Global Vehicle Development Process 整车开发流程GVLE Global Vehicle Line Executive 整车平台执行GVW Gross Vehicle Weight 车辆总重GW Gateway 网关HET Hot Environment Test 热带试验HRC Hardware Release Center 硬件发布中心ICD Interface Control Document 接口控制文件IDR Initial Data Release 初始数据发布IDSR Integration DrivenSubsystem Requirement集成驱动子系统要求ILP Inbound Logistic Planning 入厂物流规划IMES Integration Manufacturing ExecutiveSystem生产执行系统Initial Cal Initial Calibration 初始标定IOM Inspection operator method 检验操作方法IOS Inspection operator summary 检验操作概要IPPE integrated Product andProcess Engineering集成产品与工艺工程IPTV Incident per Thousand Vehicles 每千辆车的故障率IPTV Incidents Per Thousand Vehicles 每一千台车事故率IPTV Incidents Per Thousand Vehicles 每千辆车的故障率IPTV Incidents Per Thousand Vehicles 千辆车故障率IR Incident Report 事故报告IRP Issue Resolution Process 问题解决流程IRR Internal Rate of Return 内含报酬率ISO International Standard Organization 国际标准化组织IV Integration Vehicle 集成车IV MRD Integration Vehicle Material RequiredDate集成车的物料需求日期IVBR Integration Vehicle Build ReadinessReview集成车制造准备评审IVER Integration Vehicle Engineering Release 集成车工程发布JIS Just In Sequence 排序供货JIS Just In Sort 供应商排序供货方式JIS Job Instruction Sheet 岗位指导书JIT Just In Time 及时供货JIT Just In Time 供应商及时供货方式JPH Job per Hour 生产节拍JRS Joint Ride Session 联合评审JSC 生产采购委员会JSC-GP Joint Sourcing Committee - Generalpurchase联合采购委员会-一般采购Kcc Key Control Characteristic 关键过程控制特性KCC Key Control Character 关键控制特性KCDS Key Characteristic Designation System 产品关键特性定义系统KO Kick-Off 启动Kpc Key Product Characteristic 关键产品特性KPC Key Product Characteristic 关键产品特性KPC Key product characteristic 主要产品特性KPC Key product characteristic 主要产品特性KPC Key process control 关键过程控制KPC Key process control 关键过程控制LAAMSB Latin America, Africa, Middle EastStrategy Board通用的拉美，非洲，中东战LCL Lower Control Limit 管制下限LCS Logistic Confirmation Sheet 物流确认单LL Learning Loop 学习周期LL Long Lead 长周期LLPR Long Lead Production Release 长周期的产品发布LM Launch Manager 启动经理LOU Line of Usage BOM 整车BOM行LSL Lower Specification Limit 规格下限LSP Lean sales and marketing prograne 精宜营销LTR Launch Team Release 启动小组释放LWO Logistic Work Order 物流属性更改号M+E Machine & Equipment 机器设备MAC 区域经理MBOM Manufacturing BOM 制造BOMMDS Materiel Data Sheet 物料数据单ME Manufacture Engineer 样车试制工程师或生产线制ME Machine and Electronic 电器设备ME Manufacturing Engineering 制造工程ME Manufacturing Engineering 制造工程MEC 区域市场支持MEIS Manufacturing Engineering Info System 制造工程信息系统MES Manufacturing Execution System 制造执行系统MES Manufacturing Execution System 制造执行系统MFG Site Dec Manufacturing Site Decision 确定生产厂址MIC Marketing Information Center 市场信息中心MILKRUN Milkrun 循环取货MKT Marketing 营销MMR Manufacturable Math Release 制造数模发布MO Manufacturing Operations 生产管理部门MP OTS 100% 100% Made Parts in OTS 100%自制件达到OTS状态MP OTS 100％100％ Made Parts in OTS 100%自制件达到OTS状态MP PPAP Made Parts PPAP 自制件通过PPAPMP PPAP Made Parts PPAP 自制件通过PPAPMP PPV Made Parts Production and ProcessValidation自制件生产线交付后的产品MP PPV Made Parts Production and ProcessValidation自制件生产线交付后的产品MPS Master Planning System 主计划系统MPV Multi-Purpose Vehicle 多用途轿车MR Manufacturing Requirements 制造要求MRD Material Required Date 交样日期MRD Material Requirement Date 物料需求日期MRD Material Required Date (for physicalbuilds)物料需求日期（用于制造样MRD Math Required Date (for virtual builds) 数模需求日期（用于虚拟制MRE Manufacturing Responsible Engineer 制造工程师MS Manufacturing Studies 制造车间MSA Measurement System Analysis 测量系统分析手册MSA Measurement System Analysis 测量系统分析MSA Measure System Analyse 测量系统分析MSA Measurement system analysis 测量系统分析MSS Market Segment Specification 市场细分规范MSS 区域销售支持MSS Market Segment Specification 市场分割规范MT Manual Transmission 手动变速箱MT&E Machines, Tools and Equipment 机床，工装和设备MTS Manufacturing Technical Specification 制造技术标准MVB Manufacturing Validation Build 用于认证制造工艺的整车制MVB Manufacturing Validation Build 制造验证造车MVB (ns) Manufacturing Validation Build (nonsaleable)用于认证制造工艺的整车销售的）MVB (s) Manufacturing ValidationBuild (saleable)用于认证制造工艺的整车售的）MVBns Manufacturing Validation Build Non-Salable非销售制造验证造车MVBs Manufacturing Validation Build Salable 销售制造验证造车MVSS Motor Vehicle Safety Standards 汽车安全标准MWO Manufacture Work Order 制造属性更改号MY Model Year年度款 MYM Model Year Manager车型年经理 NAO North American Operations 通用的北美分部 NEO New Employee Orientation 新员工培训 NOA Notice of Authorization 授权书 NOD Notice of Decision 决议 NOD Notice of Decision 决议通知 NPV Net Present Value 净现值 NRD Normal Road一般公路NSB North American Strategy Board通用的北美传略委员会（管理组织）OBD On Board Diagnostics 车载诊断系统 OEMOriginal Equipment manufacturers 原始设备制造商（主机厂）OEM Run-Off Original Equipment Manufacturer Run-Off零件供应商工装设备具备试生产条件OEM Run-off Original Equipment Manufacturer Run-off 零件供应商工装设备具备试OJT On Job Training 在岗培训 OPO Office of Product Operations 产品高层管理组织 ORS Occupant Restraint System 乘员约束系统 OT Overtime 加班 OTD Order to Delivery 订单到货时间 OTP On Time Performance 及时性能 OTS 装车评审 OTS Off-tool Sample 工装样件 OTS Off-tool Sample 工装样件 OTS Off-tool Sample 工装样件 OTS OFF-TOOL-SAMPLE 工装样件OTS QV OTS Quality ValveOTS 质量阀OTS 交付状态满足质保的开OTS QV OTS Quality ValveOTS 质量阀，OTS 交付状态开阀要求OTS TG2 Off Tooling Samples Tooling Go Level 2OTS 设计达到TG2阶段，发供应商启动工装和设备投入OTS TGL2 Off Tooling Samples Tooling Go Level 2 OTS 设计达到TG2阶段 P Pilot 批量试生产 P Pilot 小批量生产 PA Production Approval 批准正式生产 PA Program Administrator 项目管理专员 PaC Physical Alpha for Customer 提交客户的Alpha 样机 PACK Packaging 包装规划 PAD Product Assembly Documentation 产品装配文件 PAM Product Assemble Manual 样车装配指南 PAM Product Assemble Manual 产品装配手册PAPIRProduct and Process Integration Review 产品和工艺集成会议PAS Packaging Approval Sheet 包装确认单PAS Parking Aid System 泊车辅助系统PAS Parking Aid System 泊车辅助系统PbC Physical Beta for Customer 提交客户的Beta样机PBS Painted Body Store 油漆车身存储区PC Deliver Pilot to Customer 向客户提交Pilot产品PC Pullcord 拉环PC Problem Communication 问题信息PC&L Production Control and Logistics PC&L部门（GM的一个部门PCL Production Control Manager 生产控制与支持PCM Powertrain Control Module 动力总成控制模块PCM Process Control Manager 工艺控制负责人PCN Project Cost Change Notice 项目更改通知单PCN Project Costbook Change Notice 项目Costbook更改通知单PCR Problem communication report 问题交流报告PCR Problem communication report 问题交流报告PCR Problem Communication Report 问题交流报告PCR Problem Communication Report 问题交流报告PDC Parking Distance Control 泊车距离控制PDC Parking Distance Control 泊车距离控制PDCA Plan、Do、Check、Action 计划、实施、检查、行动PDCA Plan-Do-Check-Action 计划,实施,检查,行动PDI Product delivery inspection 产品交付检查PDI Preliminary Data Indicator 初步数据指示器PDI Pre-delivery Inspection 车辆行运“零公里”检查报PDS Product Data Structure 产品数据结构，在SCM中用象，集成了BOM、工艺和工PDT Product Development Team 产品开发组PDT Product Development Team 产品开发小组PDT Product Development Team 产品开发小组PDT Product Development Team 产品开发小组PDT Product Development Team 产品开发小组PE Product Engineering 产品工程PET Program Executive Team 项目执行小组PET Program Execution Team 项目组PET Program Execution Team 项目执行小组PFI Program Framing Initiated 项目框架启动PFMEA Process failure modeand effectsanalysis过程失效模式和后果分析PFMEA Process FMEA 工艺失效模式分析PFMEA Process failure mode & effects analysis 过程失效模式分析PFSE Product Focus Systems Engineer 产品系统工程师PG3 Powertrain Gateway 关键里程碑节点PgC Physical Gamma for Customer 向客户发运Gamma样机PGM Program Management / Project Management 项目管理PGM Program Management 项目管理PGM Program Management 项目管理Pilot Pilot 试生产Pilot Pilot 试生产Pilot QV Pilot Quality Valve 试生产质量阀满足启动试要球Pilot MRD Pilot Material Requied Date Pilot交样日期Pilot MRD Pilot Material Required Date Pilot的物料需求日期Pilot QV Pilot Quality Valve 试生产质量阀满足启动试生产的开阀要求PIM Powertrain Interface Manager 动力总成接口经理PLM Production Launch Manager 生产启动经理PLP 单车利润表PM Programme Manager 项目工程经理PM Program Manager 项目经理PM Program Manager 项目经理PM Plan maintain 计划维护PM Prevention Maintenance 预防性维护PM Program Manager 项目经理PMO Program Management Office 项目管理办公室（通用的一PMP 常规尺寸PMT Product Management Team 产品管理小组PN Part NO. 零件号PP Pre-pilot 前期试生产PP Pre-Pilot 预试生产PP Pre-pilot 试生产P-P Pre-Pilot 试生产PP PPAP Purchased Parts ProductionParts Approval Process外购件完成生产件批准程序PP Appr. Purchased Parts Approved 外购件批准SQE开具入库许可单PP ESO Purchased Parts Engineering Sign Off 外购件工程签署，完成OT 认可PP OTS 100％100％ Purchased Parts in OTS 外购件的OTS交样率达到PP OTS 80% 80% Purchased Parts in OTS 外购件的OTS交样率达到PP OTS 80％80％ Purchased Parts in OTS 外购件的OTS交样率达到PP PPAP Purchased Parts PPAP 外购件完成PPAPPPA Product Planning Approval 产品规划批准PPAP Production Parts Approval Process 生产件批准程序PPAP Production Part Approval Process 生产零部件批准程序PPAP Production Part Approval Process 生产件批准程序PPAP Production Part Approval Process 生产件批准程序PPAP Production Parts Approval Process 生产件批准程序PPAP Production Part Approval Process 生产件批准流程PPAP PPAP Production Part Approval Process 产品零部件批准流程PPAP Production Part Approval Process 生产零部件批准程序PPC Deliver Pre-Pilot to Customer 向客户发运Pre-pilot动力PPC Product Program Content 项目任务书。

封装专用英语词汇

常见封装形式简介DIP = Dual Inline Package = 双列直插封装HDIP = Dual Inline Package with Heat Sink = 带散热片的双列直插封装SDIP = Shrink Dual Inline Package = 紧缩型双列直插封装SIP = Single Inline Package = 单列直插封装HSIP = Single Inline Package with Heat Sink = 带散热片的单列直插封装SOP = Small Outline Package = 小外形封装HSOP = Small Outline Package with Heat Sink = 带散热片的小外形封装eSOP = Small Outline Package with exposed thermal pad = 载体外露于塑封体的小外形封装SSOP = Shrink Small Outline Package = 紧缩型小外形封装TSSOP = Thin Shrink Small Outline Package = 薄体紧缩型小外形封装TQPF = Thin Profile Quad Flat Package = 薄型四边引脚扁平封装PQFP = Plastic Quad Flat Package = 方形扁平封装LQPF = Low Profile Quad Package = 薄型方形扁平封装eLQPF = Low Profile Quad Flat Package with exposed thermal pad = 载体外露于塑封体的薄型方形扁平封装DFN = Dual Flat Non-leaded Package = 双面无引脚扁平封装QFN = Quad Flat Non-leaded Package = 双面无引脚扁平封装TO = Transistor package = 晶体管封装SOT = Small Outline of Transistor = 小外形晶体管BGA = Ball Grid Array = 球栅阵列封装BQFP = Quad Flat Package With Bumper = 带缓冲垫的四边引脚扁平封装CAD = Computer Aided Design = 计算机辅助设计CBGA = Ceramic Ball Grid Array = 陶瓷焊球阵列CCGA = Ceramic Column Grid Array = 陶瓷焊柱阵列CSP = Chip Size Package = 芯片尺寸封装DFP = Dual Flat Package = 双侧引脚扁平封装DSO = Dual Small Outline = 双侧引脚小外形封装3D = Three-Dimensional = 三维2D = Two-Dimensional = 二维FCB = Flip Chip Bonding = 倒装焊IC = Integrated Circuit = 集成电路I/O = Input/Output = 输入/输出LSI = Large Scale Integrated Circuit = 大规模集成电路MBGA = Metal BGA = 金属基板BGAMCM = Multichip Module = 多芯片组件MCP = Multichip Package =多芯片封装MEMS = Microelectro Mechanical System = 微电子机械系统MFP = Mini Flat Package = 微型扁平封装MSI = Medium Scale Integration = 中规模集成电路OLB = Outer Lead Bonding = 外引脚焊接PBGA = Plastic BGA = 塑封BGAPC = Personal Computer = 个人计算机PGA = Pin Grid Array = 针栅阵列SIP = System In a Package = 系统级封装SOIC = Small Outline Integrated Circuit = 小外形封装集成电路SOJ = Small Outline J-Lead Package = 小外形J形引脚封装SOP = Small Outline Package = 小外形封装SOP = System On a Package = 系统级封装WB = Wire Bonding = 引线健合WLP = Wafer Level Package = 晶圆片级封装常用文件、表单、报表中英文名称清除通知单Purge notice工程变更申请 ECR(Engineering Change Request) 持续改善计划CIP(continuous improvement plan)戴尔专案 Dell Projec t收据Receipt数据表Data sheet核对表Check list文件清单Documentation checklist设备清单 Equipment checklist调查表，问卷Questionnaire报名表Entry form追踪记录表 Tracking log日报表Daily report周报表Weekly report月报表Monthly report年报表 Yearly report年度报表 Annual report财务报表 Financial report品质报表 Quality report生产报表Production report不良分析报表FAR(Failure analysis report)首件检查报告 First article inspection report 初步报告（或预备报告）Preliminary report一份更新报告 An undated report一份总结报告 A final report纠正与改善措施报告(异常报告单) CAR (Corrective Action Report) 出货检验报告Outgoing Inspection Report符合性报告（材质一致性证明） COC(Certificate of Compliance) 稽核报告 Audit report品质稽核报告 Quality audit report制程稽核报告Process audit report5S 稽核报告 5S audit report客户稽核报告Customer audit report供应商稽核报告Supplier audit report年度稽核报告 Annual audit report内部稽核报告 Internal audit report外部稽核报告External audit reportSPC 报表(统计制程管制) Statistical process control工序能力指数(Cpk) Process capability index（规格)上限Upper limit（规格）下限 Lower limit规格上限Upper Specification Limit(USL)规格下限 Lower Specification Limit(LSL)上控制限（或管制上限） Upper Control Limit(UCL)下控制限（或管制下限）Lower Control Limit(LCL)最大值 Maximum value平均值Average value最小值Minimum value临界值 Threshold value / critical value MRB 单(生产异常通知报告) Material Review Board Report工艺流程图Process Flow Diagram物料清单（产品结构表/用料结构表） BOM (Bill of Materials )合格供应商名录AVL (Approved Vendor List)异常报告单 CAR工程规范报告通知单（工程变更通知）ECNTECN自主点检表Self Check List随件单（流程卡） Traveling Card (Run Card)压焊图Bonding diagram晶圆管制卡 Wafer inspection card晶圆进料品质异常反馈单Feedback Report for Wafer Incoming Quality Problems订购单PO(Purchase Order)出货通知单Advanced Ship Notice送货单/交货单DO(Delivery Order)询价单RFQ(Request for quotation)可靠性实验报告Reliability Monitor Report产品报废单PSB特采控制表CRB返工单PRB异常处理行动措施OCAP减薄：Wafer [‘weifə] n .威化饼干、电子晶片（晶圆薄片）Grind [ɡraind ]vt. & vi. 磨碎;嚼碎n .磨,碾Crack [kræk]vt. & vi. (使…)开裂, 破裂n. 裂缝, 缝隙Ink [iŋk] n. 墨水, 油墨Die [dai] vt. & vi. 死亡（芯片）Dot [dɔt] n . 点, 小圆点Mounting [‘mauntiŋ] n. 装备,衬托纸Tape [teip] n. 带子；录音磁带; 录像带Size [saiz] n. 大小, 尺寸，尺码Thick [θik]adj. 厚的，厚重的Thickness [‘θiknis]n. 厚(度), 深(度)宽 (度)Position [pə‘ziʃən]n. 方位，位置Rough [rʌf] adj . 粗糙的; 不平的Fine [fain]adj. 美好的, 优秀的, 优良的, 杰出的Speed [spi:d]n. 速度, 速率Spark[spɑ:k]n. 火花; 火星Out [aut]adv. 离开某地, 不在里面；(火或灯)熄灭Grindstone [‘ɡraindstəun]n. 磨石、砂轮Mount[maunt]vt. & vi. 装上、配有Mounter装配工;安装工;镶嵌工Mounting [‘mauntiŋ]n. 装备,衬托纸Magazine [,mæɡə‘zi:n] n. 杂志, 期刊，弹药库（传递料盒）Cassette [kə‘set] n. 盒式录音带；盒式录像带Inspect [in‘spekt] vt. 检查，检验，视察Inspection [in‘spekʃən] n. 检查，视察Card [kɑ:d]n. 卡, 卡片, 名片划片：Saw [sɔ:] n. 锯vt. & vi. 锯，往复运动Sawing ['sɔ:iŋ]n. 锯,锯切,锯开Film [film] n. 影片, 电影（薄膜，蓝膜）Frame [freim] n. 框架，骨架，构架Clean [kli:n]adj. 清洁的, 干净的；纯净的Cleaner [‘kli:nə]n. 作清洁工作的人或物Oven [‘ʌvən] n . 烤箱, 炉Cassette [kə‘set]n. 盒式录音带；盒式录像带Handler[‘hændlə]n. (物品、商品)的操作者Scribe [skraib] n . 抄写员, 抄书吏Street n. 大街, 街道Blade [bleid] n. 刀口, 刀刃,刀片Cut [kʌt] vt. & vi. 切, 剪, 割, 削Speed[spi:d]n. 速度, 速率Spindle [‘spindl]n. 主轴， (机器的)轴Size [saiz]n. 大小, 尺寸,尺码Cooling ['ku:liŋ]adj. 冷却(的)Kerf [kə:f]n. 锯痕,截口,切口Width [widθ] n . 宽度, 阔度, 广度Chip [tʃip] n. 碎片、缺口Chippi ng[‘tʃipiŋ]n. 碎屑,破片Crack[kræk]vt . (使…)开裂,破裂n . 裂缝, 缝隙Missing [‘misiŋ] adj. 失掉的,失踪的,找不到的Die [dai]vt. & vi. 死亡（芯片）Saw [sɔ:] n. 锯vt. & vi. 锯，往复运动Street [stri:t]n. 大街, 街道Film [film]n. 影片, 电影（薄膜，蓝膜）Frame [freim] n. 框架，骨架，构架Tape [teip]n. 带子；录音磁带; 录像带Bubble ['bʌbl] n. 泡, 水泡, 气泡mount---贴wafer---晶圆frame---框架blade---刀片tape---膜cassette---盒子completion---完成loader---上料un-loader---出料initial---初始化open---打开air---空气pressure---压力failure---失败vacuum---真空alignment---校准ink---黑点die---芯片error---错误limit---限制cover---盖子device---产品data---数据saw---切割water---水elevator---升降机spindle---主轴sensor---感应器wheel---轮子setup---测高rotary---旋转check---检查feed---进给cutter---切割speed---速度height---高度new---新shift---轮班pause---暂停clean---清洗center---中心chip---崩边change---变换enter---确认Off center---偏离中心 broken---破的 alarm---报警上芯：Attach [ə‘tætʃ]vt. & vi. 贴上; 系; 附上Bond [bɔnd]n. 连接, 接合, 结合vt. 使粘结, 使结合Bonder [‘bɔndə]n. 联接器,接合器,粘合器Die attach material epoxy粘片胶Epoxy [e‘pɔksi] n. 环氧树脂（导电胶）Material [mə‘tiəriəl]n. 材料, 原料Non-conductive epoxy绝缘胶Conductive [kən‘dʌktiv] adj. 传导的Dispenser [dis‘pensə]n. 配药师, 药剂师Nozzle [‘nɔzl]n. 管嘴, 喷嘴Rubber [‘rʌbə]n. (合成)橡胶，橡皮Tip [tip] n. 尖端, 末端Die pick-up tool 吸嘴Tool [tu:l]n. 工具, 用具Collect [kə‘lekt]vt. 收集, 采集（吸嘴）Ejector [i‘dʒektə]n. 驱逐者,放出器,排出器Pin [pin]n. 针,大头针, 别针Lead Frame引线框架Lead [li:d]vt. & vi. 带路, 领路, 指引Frame [freim]n. 框架，骨架，构架Magazine [,mæɡə‘zi:n]n. 杂志, 期刊（料盒）Curing [‘kjuəriŋ] n. 塑化, 固化, 硫化, 硬化Oven [‘ʌvən]n. 烤箱, 炉Scrap [skræp]n. 小片, 碎片, 碎屑Dent [dent] n. 凹痕, 凹坑Die Lift-off 晶粒脱落（芯片脱落，掉芯）Skew [skju:] adj. 歪, 偏, 斜Misorientation [mis,ɔ:rien‘teiʃən] n. 定向误差,取向误差Pre squeeze del写胶前气压延时Post squeeze del 写胶后气压延时Squeeze [skwi:z] vt. 榨取, 挤出n. 挤, 榨, 捏Eject [i‘dʒekt]vt. & vi . 弹出, 喷出, 排出Delay [di'lei]n. 延迟Height [hait] n. 高度, 身高Level [‘levl]n. 水平线, 水平面; 水平高度Head [hed]n. 头部，领导, 首脑Eject up delay 顶针延迟Eject up heigh t 顶针高度Bond level粘片高度Pick Level 捡拾芯片高度Head pick delay 粘接头拾取延迟Head bond delay 粘接头粘接延时Pick delay捡拾芯片延时Bond delay 粘接芯片延时Index [‘indeks]n. 索引;标志, 象征; 量度Clamp [klæmp]vt. & vi. 夹紧; 夹住n. 夹具Index clamp delay 步进夹转换延时Index delay 框架步进延时Shear [ʃiə] vt. 剪羊毛, 剪n. 大剪刀Test [test] n. 测验,化验,试验, 检验Die shear test 推晶试验Thickness ['θiknis] n. 厚(度), 粗Coverage [‘kʌvəridʒ] n. 覆盖范围Epoxy thickness & coverage 导电胶厚度和覆盖率Orientation[,ɔ:rien‘teiʃən] n. 方向, 目标Die Orientation 芯片方向Void [vɔid] adj. 空的, 空虚的n. 太空, 宇宙空间;空隙, 空处; 空虚感, 失落感Epoxy void 导电胶空洞Chip [tʃip] n. 碎片Damage[‘dæmidʒ] vt. & vi. 损害, 毁坏, 加害于n. 损失, 损害, 损毁Chip damage芯片损伤Backside [‘bæksaid]n. 臀部, 屁股，背面Chip backside damage 芯片背面损伤Tilt [tilt] vt. & vi. (使)倾斜Tilted die 芯片歪斜Epoxy on die 芯片粘胶Crack [kræk]vt. & vi. (使…)开裂, 破裂n. 裂缝, 缝隙Crack die 芯片裂缝/芯片裂痕Lift [lift]vt. & vi. 举起, 抬起n. 抬, 举Lifted die翘芯片Misplace [,mis‘pleis]vt. 把…放错位置Misplaced die 设置芯片NO die on L/F 空粘Insufficient [,ɪnsə‘fiʃənt] adj. 不足的, 不够的Insufficient epoxy 导电胶不足Epoxy crack 导电胶多胶Epoxy curing银浆烘烤Edge [edʒ] n. 边, 棱, 边缘Partial [‘pɑ:ʃəl] adj. 部分的, 不完全的Mirror [‘mirə] n. 镜子Missing [‘misiŋ] adj. 失掉的,失踪的,找不到的Edge die / partial die边缘片 / 边沿芯片Mirror die光片 / 镜子芯片Missing die 掉芯 / 漏芯 / 掉片Splash [splæʃ]vt. 使(液体)溅起vi.(液体)溅落Splatter [‘splætə] vt. & vi. (使某物)溅泼Diagram [‘daiəɡræm]n. 图解, 简图, 图表Ink splash / ink splatter墨溅Die bonding diagram 上芯图Die shesr test 推片实验/推晶试验Die shear tester 推片试验机Die shesr tool 推片头Metal corrosion晶粒腐蚀/芯片腐蚀Wafer mapping system 芯片分级系统System ['sistəm] n. 系统; 体系wafer---晶圆die---芯片attach---粘贴glue---银胶substrate---基板magazine---盒子inspection---检查parameter---参数manual---操作手册reset---重设enter---确定error---错误input---输入speed---速度stop---停止pressure---压力vacuum---真空sensor---传感器back side---背面pin---针statistics---统计calibration---校正bond---贴片conversion---改机thickness---厚度tilt---倾斜度shape---形状adjust---调整contact---接触cover---覆盖device---产品chip---崩边pause---暂停elevator---升降机 initial---初始化alignment---校准cassette---盒子tape---膜 frame---框架ring---铁圈temperature---温度rubber tip---吸嘴frame type---框架型号nozzle---点胶头 writer---划胶头压焊：Wire [‘waiə] n. 金属丝, 金属线;电线, 导线Bond [bɔnd] n. 接合, 结合vt. 使粘结, 使结合Wire bond / Wiring bonding 压焊/焊丝/球焊Gold wire金丝Pad [pæd]vt. 给…装衬垫, 加垫子n.垫,护垫Bond pad 焊点、铝垫1st bond第一焊点Pad size焊点尺寸 / 铝垫尺寸Capillary [kə‘piləri] n.毛细管;毛细血管（劈刀）Pitch [pitʃ] 程度; 强度; 高度Pad pitch铝垫间距 / 焊点间距Elongation [i:lɔŋ‘ɡeiʃən] n.延长;延长线;延伸率Breaking [‘breikiŋ] n. 破坏,阻断Load [ləud] n. 负荷; 负担;工作量, 负荷量Breaking Load 破断力Pull [pul]vt. & vi.拉, 扯, 拔Shear [ʃiə] vt. 剪羊毛, 剪n. 大剪刀Wire pull / ball pull（焊丝）拉力Wire shear / ball shear（焊丝）推力Ultrasonic [,ʌltrə‘sɔnik] adj. (声波)超声的Power [‘pauə]n. 功力, 动力, 功率Force [fɔ:s]n. 力; 力量; 力气Ultrasonic power超声功率Bonding force压力Bonding time时间Temperature [‘tempəritʃə] n. 温度, 气温Bonding temperature 温度Ultrasonic wire bonding 超声波压焊EFO打火烧球loop [lu:p]n. 圈, 环, 环状物Loop height 孤高Wire pull test 拉力试验Ball shear test 金球推力试验PIN 1 第一脚Ball height 球高Ball diameter球径Cratering [‘kreitəriŋ] n. 缩孔;陷穴（弹坑）KOH etching test KOH腐蚀试验Bond Cratering test 压焊腐蚀试验(弹坑试验)Thermal [‘θə:məl] adj. 热的，热量的Compression [kəm‘preʃən] n. 挤压, 压缩TCB（ Thermal Compression Bond）热压焊Bonding Diagram 压焊图 / 布线图Wrong Bonding 布线错误Incomplete[,ɪnkəm‘pli:t]adj.不完全的,未完成的Incomplete bond 焊不牢No bonding 无焊N2 BOX 氮气柜RTPC 实时过程监控Tray [trei] n. 盘子, 托盘Handing Tray 产品盘FBI 压焊后目检FBI insp-M/C 压焊检验机Microscope [‘maikrəskəup] n. 显微镜Low Power Microscope 低倍显微镜Flux [flʌks] n. 熔剂、焊剂；助熔剂，助焊剂Hook [huk] vt. & vi. 钩住, 吊住, 挂住Wire pull hook线钩（测拉力）Ball shear tool 推球头（测推力）Metal [‘metl]n. 金属Discolor [dis‘kʌlə]v.使脱色;(使)变色,(使)褪色Oxide [‘ɔksaid]n. 氧化物Metal Discolor铝条变色Bond Pad Discolor 铝垫变色Bond Pad Oxide铝垫氧化Stick [stik] vt. & vi. 粘贴, 张贴Peeling [‘pi:liŋ] n. 剥皮,剥下的皮Cratering [‘kreitəriŋ]n. 缩孔;陷穴（弹坑）Nonstick bond on pad 铝垫不粘Bond pad peeling 铝垫脱落Bond pad cratering铝垫弹坑Limit [‘limit]vt. 限制; 限定Scratch [skrætʃ] vt. & vi. 抓, 搔，刮伤Over rework limit超过返工数Bond remove / scratch 剔球划伤Ball bond non-stick金球脱落Ball to large （small）金球过大（小）Ball bond short 金球短路Non-stick on lead 引脚脱落（鱼尾脱落）misplace [,mis‘pleis]vt. 把…放错位置connection [kə‘nekʃən]n. 连接, 联结Misplaced bond on LD压焊打偏Wire broken断线Missing wire漏打Wrong connection 错打defective [di‘fektiv]adj. 有缺陷的，欠缺的Defective looping弧度不良Sagging [‘sæɡiŋ]n. 下垂[沉,陷],松垂,垂度Loop sagging 弧度下陷Low loop 弧度太低High loop弧度太高Loop short 弧度短路Overhang [,əuvə‘hæŋ]vt. 伸出; 悬挂于…之上Residue [‘rezidju:]n. 剩余, 余渣Distortion [dis‘tɔ:ʃən] n. 歪曲,曲解Wire overhang on LD 跨越引线框架Wire residue 残丝LF distortion 引线框架变形Quantity [‘kwɔntiti]n. 数目, 数量Mismatch [‘mis’mætʃ] vt. 使配错,使配合不当Scrap [skræp]n. 废料vt. 废弃, 丢弃Scratch [skrætʃ] vt. 刮伤Quantity Mismatch 数量不符Empty M. not scrap空粘未报废Gold Wire Scratch 金丝受损Parameter---参数Statistics---统计Utility---应用Teach---教习Bond tip offset—焊线点纠偏 Contact search---接触测高Zoom off center---放大倍数偏心校准Calibration---校准BQM---焊接质量控制PR—patterrecognition—图像识别Alignment tolerance—对点偏差PR indexing—图像控制下的步进Capillary---焊线劈刀 Wire spool—送线卷轴Window clamp—窗口夹板Transducer—功率换能器FTN---功能键Wire threading—送线器EFO ---电子打火Linear power ---线性马达Vacuum sensor---真空感应器 Step driver—步进驱动Post bond inspection—焊接后检查 Wire pull—拉线Ball shape—推球 Ball size—焊球大小Ball thickness—焊球高度 Loop height—线弧高度Loop shape—线弧形状Neck crack—线颈折损 Fine adjust–精确调整Conversion–换产品 1st bond non stick—第一点不粘2nd bond non stick—第二点不粘 peeling---拔铝垫（扯皮）Bond off---脱焊Ball deformation—焊球变形 servo motor—伺服电机 weld off---管脚脱焊 crater---裂缝 gold wire---金线missing ball---球未烧好 weak bond---虚焊塑封：Mold [məuld] n. 模子,铸型vt. 浇铸,塑造Molding [‘məuldiŋ] n. 成型（塑封）Compound [‘kɔmpaund] n.复合物, 化合物Moiding M/C；Mold Press塑封机Press [pres] n. 印刷机Heater [‘hi:tə] n. 加热器; 炉子Pre-heater 预热机Chase [tʃeis]n.追捕, 追猎Mold die / Mold chase 塑封模具MGP mold MGP多缸模具Auto mold 自动包封机load [ləud]vt. & vi. 1 把…装上车[船] 2 装…loader ['ləudə] n. 装货的人,装货设备,装弹机Auto L / F loader自动排片机handler [‘hændlə] n. (动物)驯化者（抓手）temperature [‘tempəritʃə]n. 温度, 气温Pre-heat Temperature 料饼预热温度Mold Temperature 模具温度Clamp [klæmp] vt. & vi. 夹紧; 夹住n. 夹具Pressure [‘preʃə] n. 压(力), 压强Clamp Pressure 合模压强Transfer pressure 注塑压强Transfer [træns‘fə:]vt. & vi. 转移; 迁移n. 转移Curing [‘kjuəriŋ] n. 塑化, 固化, 硫化, 硬化Curing time 固化时间Curing temperature 固化温度Pre-heat Time （料饼）预热时间Transfer speed注塑速度Transfer time注塑时间PMC time (Post Mold Cure Time)后固化时间Load / unload上料/下料Sweep [swi:p] vt. & vi. 扫, 打扫, 拂去Wire Sweep 冲丝Open 开路Short 短路Fill [fil] vt. & vi. (使)充满, (使)装满, 填满Underfill ['ʌndəfil] n. (孔型)未充满Body underfilled胶体未灌满Incomplete [,ɪnkəm‘pli:t]adj. 不完全的, 未完成的Incomplete mold 未封满Chip [tʃip] n. 碎片，缺口Chip package / body chip-out崩角Porosity [pɔ:‘rɔsiti] n. 多孔性,有孔性Porosity Body 胶体麻点Bubble [‘bʌbl] n.泡, 水泡, 气泡Blister [‘blistə] n. 气泡vt. & vi. (使)起水泡Smear [smiə] vt.弄脏, 弄污n. 污迹, 污斑Surface [‘sə:fis] n. 面, 表面Roough surface 不均匀（表面）Delaminate [di:‘læməneit] v. 将…分层,分成细层Delaminating 分层Void [vɔid]adj. 空的, 空虚的PKG Void 胶体空洞Deep [di:p] adj. 深的Scratch [skrætʃ] vt. 刮伤Body deep scratch胶体刮痕Dimension [di‘menʃən] n.尺寸, 度量Mold PKG dimension 塑封体尺寸BTM width / length 背面宽 / 长Top width / length 正面宽 / 长PKG thick 塑封体厚度Mismatch [‘mis’mætʃ] vt. 使配错,使配合不当Mold mismatch / PKG mismatch 包封偏差(胶体错位) Offset [‘ɔfset] vt. 抵消, 补偿Misalignment [‘misəlainmənt] n. 未对准Mold offset / PKG misalignment偏心PMC（post mold cure）后固化Dummy [‘dʌmi] n. 人体模型Strip [strip] vt.剥去, 剥夺, 夺走Dummy molded strip空封Mold flash 废胶Gate [ɡeit]n.门, 栅栏门Mold gate 注浇口、进浇口Remain [ri‘mein]n. 剩余物; 残余Gate remain 小脚Compound [‘kɔmpaund] n.复合物, 化合物Ag ing [‘eidʒiŋ]n. 老化,成熟的过程Compound Aging 料饼醒料（回温过程）Locator [ləu‘keitə]n. 表示位置之物,土地Block [blɔk] n.大块(木料、石料、金属、冰等) Locator Block 定位块Ejector [i‘dʒektə] n. 驱逐者,放出器Pin [pin]n. 大头针, 别针，针Depth [depθ] n.深, 深度Ejector Pin 顶针E-pin Depth顶针深度Storage [‘stɔ:ridʒ] n.储藏处, 仓库Cold room / compound storage冷藏库/料饼存放库Air [ɛə] n. 空气Gun [ɡʌn] n. 枪, 炮Coating [‘kəutiŋ] n. 涂层, 覆盖层Material [mə‘tiəriəl]n. 材料, 原料,素材, 资料Air Gun气枪Die Coating芯片涂胶Auto die coating M/C 芯片涂胶机Die Coating Material覆晶胶Cart [kɑ:t]n. 手推车ASS’YB Cart 后站推车Tablet [‘tæblit]n. 药片、胶囊Loader [‘ləudə] n. 装货的人,装货设备,装弹机Preheater [‘pri:’hi:tə] n. 预热器Fixture [‘fikstʃə] n. (房屋等的)固定装置Auto Tablet Loader 自动排胶粒机Compoud Preheater 高频预热机Load /Unload Fixture 上料/下料架Tablet Magazine 胶粒盒Compoud Tablets 塑封料饼Molding Cleaning Compoud 洗模饼misorientation [mis,ɔ:rien‘teiʃən]n. 定向误差,取向误差PKG Misorientation胶体压反Mold flash on lead 塑封溢胶Mold crack 胶体裂痕Semiconductor---半导体Molding–模封Onload---上料Offload–出料Belt—皮带Preheater turntable –预热转盘Transfer---传送Safety Door---安全门Pick and place–机械手Motor---马达 Station–模腔Cleaning brush—清洁刷Cylinder---气缸 Sensor---传感器Solenoid---电磁阀Turn over –翻转器 Degate–切料口 Bearing---轴承Picker---爪子 Pusher–推动器 Cull bin –垃圾箱Pin---针Vacuum pump—真空泵 Mornitor–显示器Cable–导线 Profile---温度曲线 Alarm---报警Error---错误 Driver---驱动 Sensor–感应器Inspection---检查Parameter---参数 Manual---手动,手册Reset---复位 Initialing---初始化 Guide–导轨Substrate---基板 Device---产品种类 Lot Traveller---随工单Magazine---盒子 Cylinder –汽缸 Bearing–轴承Stop---停止Emergency Stop---紧急停止 Gripper --夹子Heat–加热器Pipe–管子Temperature---温度Hopper–漏斗Compress air–压缩空气Over flow—反面漏胶Semiconductor---半导体 Molding –模封Operation–操作Flange–法兰盘 Pump–泵Chamber–腔体Vent–气孔Value–值Alarm---报警Error---错误Inspection---检查Parameter---参数Manual---手动,手册Reset---复位Initialing---初始化Incomplete fill模封不全inching---扭曲Overflow---漏胶Misalignment---模封错位 Package mismatch---模封错位Resin Hole / Void ---气孔Foreign materials ---外来物Wire sweep---线弯曲Rough surface---表面粗糙Wrong Orientation---模封方向反Eng. Sample---工程师样品Stain/Dirty on package---表面脏污Resin burr---树脂有毛刺Resin flashes---毛刺Damage frameFRAME--- 损坏Scratch on package---树脂表面划伤Evaluation----评估Crack package---树脂开裂 SPC sample ---SPC样品切筋 Trim-Form1 切筋Trimming Dambar cut2 切筋模 Trim die3 成形模Form die4 分离模singulate5 冲废De-junk6 检测Inspection 外观检测7 再成型机模具Reform Die8 再成型机 Reform system9 料盘 Plastic tray10 连筋 Uncut dambar11 毛刺burr14 溢料Junk15 裂纹Crack16 离层（分层） Delaminating17 管脚反翘 Lead tip bend18 筋未切 Dam-bar uncut19 筋凸出 Dam-bar protrusion20 筋切入Dam-bar cut in打印 Marking1 打印Marking2 印章 Marking layout3 激光打印 Laser marking4 油墨打印 Ink (UV) marking5 正印 Top side mark6 背印 Back side mark7 镜头 Lens8 打印不良\模糊Illegible marking9 漏打 No marking10 断字 Broken character11 缺字 Missing character12 印字倾斜 Slant marking13 印记错误 Wrong marking14 重印 Remark15 印字模糊（褪色）Fade mark16 印字粘污 Smear19 电流current21 字体（字形） Font22 定位针 Location pin23 胶皮打印机 Pad printer24 激光打印机 Laser Marking M/C25 后固化 PMC(Post Mold Cure)26 后固化烤箱 PMC Oven27 打印污斑 Marking stain28 印记移位Marking shift电镀 Plating1 电镀 Plating2 来料Incoming3 冲废 Dejunk4 热煮软化槽 Socking Tank7 检验 Inspection 外观检测8 烘烤 Curing / Baking 150℃; 60-90ms9 出料 Unload10 高速线电镀 High-speed Plating Line11 统计过程控制 SPC12 搭锡 Solder bridge13 锡丝、锡须Solder flick / Whisker14 镀层不良 Plating defects15 发黄 Yellowish16 发黑 Blacken17 变色 Discolor18 露底材（露铜） Expose copper19 粘污 Smear20 镀层厚度 Plating thickness 7-20um21 镀层成分 Plating composition 电镀成分, Sn22 外观 Outgoing23 易焊性Solder ability24 无铅化 Pb-free / lead free25 结合力 Adhesive force26 可靠性Reliability27 电解Electrolytic deflash28 清洗（自来水）City water29 高压清洗 High pressure rinse30 脱脂 Descale31 清洗（纯水） DI water32 活化（合金） Activation33 预镀、预浸 Pre-dip34 电镀Plating35 吹风 Air blow36 中和Neutralization37 褪镀Stripper38 拖出 Drag out39 上料机 Loader40 下料机 Unloader41 纯锡Tin42 纯水(去离子水) DI water43 水压Water pressure44 理化分析Physical and chemical analysis45 测厚仪Plating Thickness Meter / Electroplated CoatingThickness Test46 离子污染度测试仪 Ion Contamination Tester Contamino CT10047 C含量测试仪Carbon Tester51 去氧化HSCU Descale52 预浸 Pre-dip53 电镀电流 Current54 镀液温度 Temperature电镀液 plating solution55 电镀槽 plating tank56 中和Neutralization59 烘干 Curing60 锡球 Solder ball61 锡厚度和成分 Sn thickness & composition62 冲废De-junk去胶渣63 去溢料 Degate 冲塑，冲胶64 去飞边 Deflash 去胶(塑封工序)65 锡铅电镀 Tin lead plating66 无铅电镀 Lead free plating; Pure tin plating67 镀层起泡Solder bump68 镀层剥落 Solder peel off69 镀层偏厚或偏薄 Thick or Thin Plating70 退锡 Solder remove71 电镀报废Plating scrap72 锡渣 Solder peeling73 电镀锡块Solder bump74 电镀桥接Plating bridge75 电镀变色SP Discoloration76 电镀污染 SP Contamination77 电镀锡攀爬SP adhere 78 电解除油Electro-degreasing测试 Testing1 测试 Testing2 打印 Laser mark3 编带机 Tape & Reel Machine4 编带 Reel5 测试机 Tester6 分选机 Tray Test Handler7 Vision检测 Direction vision8 划伤 Scratch9 打错 Wrong mark10 断字 Broken character11 漏字No marking12 模糊 Fade mark13 脚长Lead length14 脚宽 Lead width15 站立度 Stand up16 脚间距 Lead pitch17 共面性 Coplanarity18 跨度 Row space19 电性能测试 Electrical test20 塑料管 Plastic tube21 编带 Reel / Tape22 托盘，盘装 Tray23 扫描测脚 Leads Scan/Inspection24 扫描测脚机Leads scanner25 投影仪 Profile Projector 测试 TestingLaser 激光Lamp 灯管Lamp current 灯管电流Marking layout打印内容Power supply 电源Frequency 频率On-loader 上料部分Off-loader 下料部分Marking box 打印区域Track 轨道Location pin 定位针Scanner 扫描器Beam 光束Beam path 光路Bar code 条形码Sensor 传感器Motor 马达Driver 驱动器Index 步进Tool 模具Press 模具Punch 刀具Jam 卡料Forming 成型Cylinder气缸Laser head 光头Magazine 盒子Tray 板子Arm 机械臂Safety door 安全门Reset 复位Lamp 灯管Keyboard 键盘Alarm 报警Error 错误Open/Short(O/S) 开路／短路Function Reject 功能失效Parameter Reject参数失效Retention Reject保持力失效Icc Reject 电流失效Test Program 测试程序Cold test冷测Retest 重新测试Rework 返工Sample 抽样Resample 重新抽样Black box盛放未测试产品的黑盒子Testing area 测试区域Test chuck 测试平台Device Interface Board(DIB) 芯片测试接口板DUT 正在测试芯片A/D (analog-to-digital) converter 模/数转换模块EOT 测试结束信号SOT测试开始信号BIN signal 分BIN 信号JIG/Test Head 测试盒/测试头Interface Card 接口通讯卡Interface Cable 接口通讯线Coaxial Cable 同轴线Test parameter 测试参数Tester Computer 测试机主机Test limit 测试结果的上下限AC Multiplexer 多路交流信号板Digital Driver and Detector 数字输入/输出装置Dual Voltage/Current Source双路电压/电流源Station Monitor显示测试结果的窗口Checker 检测程序High-Speed Digital (HSD) Instrument 高速数字测试设备High-Current-Voltage-Source 高电流电压源Finger 金手指Contactor 金手指动作模块Convey motor 变送马达Contact side 测试位置General Control Panel 总控制面板Ionizer 离子风扇Capacitor box 电容盒。

Cap Studies Module_2013_Final

Process Voice
LSL
© TRW Automotive 2012
Customer’s Voice
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USL
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பைடு நூலகம்
What is Process Capability? Process Capability vs Process Performance
© TRW Automotive 2012
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TYPES OF DATA
© TRW Automotive 2012
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Types of Data
Attribute Data
© TRW Automotive 2012 Insert Presentation Name & Date Here 2
WHAT IS PROCESS CAPABILITY?
© TRW Automotive 2012
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What is Process Capability? Process Capability Process Capability is how well a process can operate and meet customer requirements on a consistent basis The range of inherent variation within customer requirements Measures how well the voice of the process fits within the voice of the customer requirements

工业英语专用名词

M1-MD Common WordsMD 模組工程部Module Engineering Dept.MA 模組制程課Module AssemblyMJ 微結合制程課Micro JointME 設備課Module EquipmentTE 測試課Test新材料新技術課New Material & Technology KPI 關鍵績效指數Key Performance IndexECR 工程變更申請Engineering Change Request SWR 特殊工作需求Special Work RequestFN 工廠聯絡單Factory NoticeCPK 關鍵制程能力指數Capability Index of Process SPC 統計制程控制Statistical Process ControlQIT 品質改善小組Quality Improvement TeamES 工程標準Engineering StandardGS 一般規格General SpecificationN/A 不適用Not ApplicableZD 零缺點Zero DefectCAR 改善報告Correction Action ReportD/C 生產日期碼Date CodeUPH 每小時產能Unit Per-hour Deadline 預定完成日Meeting Minutes 會議記錄Yield Rate 良率Defect Rate 不良率Target Rate 管制目標Accumulation Yield Rate 累積良率Absolute Rate 絕對比Straight Rate 直通率Run Rate 嫁動率Up Time 妥善率Production Capability 產能Production Efficiency 生產效率Allowance Rate 寬放率Bottleneck 瓶頸Work Scheduling 工作進度安排Facilities Design 設施規劃Verification 驗證Instrument Check 儀校discriminating 識別retracing 追朔Start date 啟動日期End date 截止日期Root cause 真因Reoccurrence prevention 再發防止Benefit assessment 效益評估Remained problems 殘留問題Profile曲線圖Weekly Report Common Words Accumulation Yield Rate 累積良率Bonding Shift 對位偏移Machine Breakdown 機台故障Bonding Fail 壓痕不良Temperature Abnormality溫度異常Down Rate(Function out Rate) 當機率Rate 佔有率Out time 停機時間Stop on Schedule 計劃停機Output 產出White Dot 白點Dirty 髒污Foreign Matter 異物Scrap 報廢Block defect 區塊缺陷( V~垂直/ H~水平) Abnormal display 畫面異常Half display 半畫面No display 無畫面Residual shadow 殘影LCD TerminologyESD 靜電放電Electrostatic DischargeEOS 電壓過應力Electrical Over StressTFT 薄膜電晶體Thin Film TransistorLCM 液晶模組Liquid Crystal ModuleTN 扭曲向列,液晶分子的扭曲取向偏轉90°Twisted Nematic STN 超級扭曲向列,約180~270°扭曲向列Super Twisted Nematic FSTN 格式化超級扭曲向列。

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Long -Term Capability Indices
USL LSL Cp 6 * sshortterm
C pk min (C pk (USL) , C pk ( LSL) )
C pk (USL) (USL X ) 3 * sshortterm
USL LSL Pp 6 * slongterm
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DFSS Phase Plan
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DFSS Phase Identify
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DFSS Phase Design
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File is “Problem 13-1.MPJ
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Example
• Step 4: Check data for normality
– stat>basic statistics>normality test (use RR col)
Probability Plot of RR
DFSS Phase Design (cont)
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DFSS Phase Optimize
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DFSS Phase Validate
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What is Process Capability?
Mean Median 7120 7140 7160 7180 7200 7220 7240
0.30 0.581 7188.7 247.9 61446.0 0.321660 -0.138176 100 6678.2 7005.1 7170.5 7340.5 7872.3 7237.8 7225.2 288.0
•(criteria for all above objectives is 80% score or better on exam)
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Module Agenda
• • • • Basic process capability concepts Steps in conducting process capability Various capability indices Working with non-normal data
Example
• Step 6: Draw a picture
Pix says we will have more fallout at USL
6000
7000
8000
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Example
• Step 7: Calculate Z-scores
• The Z transform converts all normal distributions into the standard normal distributions with mean 0 and standard deviation 1. It indicates how many standard deviations a critical value is from the mean
• An assessment of the ability of the process to meet specifications • Assumes the process is in a state of statistical control (see module on process control) and the data is normally distributed
Normal
99.9 99 95 90 80 70 60 50 40 30 20 10 5 1 0.1 Mean StDev N AD P-Value 7189 247.9 100 0.298 0.581
Appears to be normal
Percent
6500
6750
7000
7250 RR
7500
Ppk min ( Ppk (USL) , Ppk ( LSL) )
Ppk (USL) (USL X ) 3 * slongterm
C pk ( LSL)
( X LSL) 3 * sshortterm
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Ppk ( LSL )
( X LSL) 3 * slongterm
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Example
• Step 1: The specification is 7000 +/- 1000 for RR • Step 2,3: We have preliminary process capability data from polish (one day of running). The process was in control. The data is short-term
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What Are the Steps?
• Step 6: Draw a picture • Step 7: Determine Z scores, assess DPM • Step 8: Estimate appropriate capability index
7750
8000
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Example
• Step 5: calculate mean and standard deviation
– Stat>basic statistics>graphical summary
Summary for RR
A nderson-D arling N ormality Test A -S quared P -V alue M ean S tDev V ariance S kew ness Kurtosis N M inimum 1st Q uartile M edian 3rd Q uartile M aximum 7139.5 7119.8 9 5 % C onfidence Inter vals
discussion
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Zbench
• Zbench (benchmark) is a consistent way to compare different processes
– Attribute and variable – Normal and other distributions – Multivariate and univariate
6800
7000
7200
7400
7600
7800
95% C onfidence Interv al for M ean 95% C onfidence Interv al for M edian 95% C onfidence Interv al for S tDev 217.6
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Capability Statistics
• There are numerous popular capability statistics. • The formulas are:
Short -Term Capability Indices
– (Note: Later in the module we discuss how to handle non-normal data)

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What Are the Benefits?
• If key assumptions are met, this calculation allows you to predict product quality for CTQ’s • Allows for the assessment of potential gaps • Using process capability in conjunction with DFSS scoresheets provides important information for phase and gate new products development process
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What Are the Steps?
• Step 1: Determine specification limits for CTQ of interest • Step 2: Collect the necessary data (remember the assumptions). Technically, the data must be in a state of statistical control before we can calculate the process capability (without a demonstration of process capability we can only discuss potential capability) • Step 3: Decide if the data is short-term or long-term • Step 4: Test for normality (stat>basic statistics>normality test) • Step 5: Estimate the mean and standard deviation

IModule 13 Process Capability

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qc七大手法-QC常用单词中英对照 精品

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封装专用英语词汇

Cap Studies Module_2013_Final

工业英语专用名词

qc七大手法-QC常用单词中英对照精品