封装专用英语词汇

实用文档

文案大全常见封装形式简介

DIP = Dual Inline Package = 双列直插封装

HDIP = Dual Inline Package with Heat Sink = 带散热片的双列直插封装

SDIP = Shrink Dual Inline Package = 紧缩型双列直插封装

SIP = Single Inline Package = 单列直插封装

HSIP = Single Inline Package with Heat Sink = 带散热片的单列直插封装

SOP = Small Outline Package = 小外形封装

HSOP = Small Outline Package with Heat Sink = 带散热片的小外形封装

eSOP = Small Outline Package with exposed thermal pad = 载体外露于塑封体的小外形封装

SSOP = Shrink Small Outline Package = 紧缩型小外形封装TSSOP = Thin Shrink Small Outline Package = 薄体紧缩型小外形封装

TQPF = Thin Profile Quad Flat Package= 薄型四边引脚扁平封装

PQFP = Plastic Quad Flat Package = 方形扁平封装

LQPF = Low Profile Quad Package = 薄型方形扁平封装

eLQPF = Low Profile Quad Flat Package with exposed

thermal pad = 载体外露于塑封体的薄型方形扁平封装

DFN = Dual Flat Non-leaded Package = 双面无引脚扁平封装QFN = Quad Flat Non-leaded Package = 双面无引脚扁平封装

TO = Transistor package = 晶体管封装

SOT = Small Outline of Transistor = 小外形晶体管BGA = Ball Grid Array = 球栅阵列封装

BQFP = Quad Flat Package With Bumper = 带缓冲垫的四边引脚扁平封装

CAD = Computer Aided Design = 计算机辅助设计

CBGA = Ceramic Ball Grid Array = 陶瓷焊球阵列

CCGA = Ceramic Column Grid Array = 陶瓷焊柱阵列

CSP = Chip Size Package = 芯片尺寸封装

DFP = Dual Flat Package = 双侧引脚扁平封装

DSO = Dual Small Outline = 双侧引脚小外形封装

3D = Three-Dimensional = 三维

2D = Two-Dimensional = 二维

FCB = Flip Chip Bonding = 倒装焊

IC = Integrated Circuit = 集成电路

I/O = Input/Output = 输入/输出

LSI = Large Scale Integrated Circuit = 大规模集成电路MBGA = Metal BGA = 金属基板BGA MCM = Multichip Module = 多芯片组件

MCP = Multichip Package =多芯片封装

MEMS = Microelectro Mechanical System = 微电子机械系统

MFP = Mini Flat Package = 微型扁平封装

实用文档

文案大全MSI = Medium Scale Integration = 中规模集成电路

OLB = Outer Lead Bonding = 外引脚焊接

PBGA = Plastic BGA = 塑封BGA PC = Personal Computer = 个人计算机

PGA = Pin Grid Array = 针栅阵列

SIP = System In a Package = 系统级封装

SOIC = Small Outline Integrated Circuit = 小外形封装集成电路SOJ = Small Outline J-Lead Package = 小外形J形引脚封装SOP = Small Outline Package = 小外形封装

SOP = System On a Package = 系统级封装

WB = Wire Bonding = 引线健合

WLP = Wafer Level Package = 晶圆片级封装

常用文件、表单、报表中英文名称

清除通知单Purge notice

工程变更申请 ECR(Engineering Change Request) 持续改善计划CIP(continuous improvement plan)戴尔专案 Dell Projec t 收据

Receipt

数据表Data sheet 核对表

Check list

文件清单Documentation checklist

设备清单 Equipment checklist 调查表，问卷Questionnaire

报名表Entry form

追踪记录表 Tracking log

日报表Daily report 周报表

Weekly report 月报表Monthly report

年报表 Yearly report

年度报表 Annual report

财务报表 Financial report 品质报表

Quality report 生产报表Production report 不良分析报表FAR(Failure analysis report) 首件检查报告 First article inspection report

初步报告（或预备报告）Preliminary report

一份更新报告 An undated report 一份总结报告

A final report

纠正与改善措施报告(异常报告单) CAR (Corrective Action Report) 出货检验报告Outgoing Inspection Report

符合性报告（材质一致性证明） COC(Certificate of Compliance) 稽核报告 Audit report

品质稽核报告 Quality audit report