ASM The-Impact-of-Copper-Ball-Bonding-on-EquipmentHO

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铜线工艺培训教材

ASM
Cu Kit Installation Procedure
• Step 4: Fine tune x, y and z position of nozzle
Distance between capillary wall and tip of nozzle hole < 2mm.
Same or slightly higher level for e torch tip to the lower nozzle position.
New E-torch nozzle assembly
Fine Pitch: 0.5mm Pt E-torch nozzle
Super Heavy: 1mm Pt E-torch nozzle
ASM
Copper Kit Configuration
• E-torch Nozzle Assembly and Nozzle
• Guideline of flow rate
– 0.8 to 1.0 mil wire (Fine pitch, Dual nozzle) L=0.4, R=0.2LPM
– 0.8 to 1.3mil wire (Non fine pitch, Single nozzle) R=0.4-0.6LPM
is why most power devices use copper wires instead of gold wires without affecting process performance and package reliability) – Has ductile properties that allow copper wires to be easily drawn into finer wires (that can be used for ultra fine pitch applications) – Costs less compared to that of gold wire giving as much (sometimes even better) performance as the gold wire

双组分灌封胶的英语

双组分灌封胶的英语Two-Component Potting Compound.Introduction.Two-component potting compounds, commonly known as two-part epoxies or polyurethanes, are widely used in various industrial applications due to their excellent adhesion, chemical resistance, and mechanical strength. These compounds are typically supplied as two separate components that must be mixed in a specific ratio to initiate the curing process. The resulting cured material offers exceptional protection to electronic components, batteries, and other sensitive equipment from environmental factors such as moisture, dust, and corrosion.Components of Two-Component Potting Compounds.The two main components of two-component potting compounds are the base resin and the hardener. The baseresin, typically an epoxy or polyurethane, provides themain structural properties of the cured material. The hardener, on the other hand, initiates the chemicalreaction that leads to the curing of the resin. The mixingof these two components in the correct ratio is crucial to achieve the desired properties and performance of thepotting compound.Applications of Two-Component Potting Compounds.Two-component potting compounds find applications in various industries such as electronics, automotive, aerospace, and medical devices. In the electronics industry, they are used to encapsulate electronic components, connections, and batteries to protect them from moistureand corrosion. In the automotive industry, they are usedfor gasketing, bonding, and sealing applications. In the aerospace industry, they are used for structural bondingand sealing of joints and seams. In medical devices, they are used for bonding, sealing, and coating applications due to their biocompatibility and chemical resistance.Advantages of Two-Component Potting Compounds.Two-component potting compounds offer several advantages compared to other sealing and bonding materials. Firstly, they provide excellent adhesion to a wide range of substrates, including metals, plastics, and ceramics. Secondly, they offer good chemical resistance against solvents, oils, and other chemicals. Thirdly, they have high mechanical strength and can withstand high temperatures and mechanical loads. Additionally, they have good electrical insulation properties and can be used in both indoor and outdoor environments.Curing Process of Two-Component Potting Compounds.The curing process of two-component potting compounds involves the mixing of the base resin and the hardener in the correct ratio. This mixing initiates a chemical reaction that leads to the cross-linking of the polymer chains and formation of a three-dimensional network. The resulting cured material is then solid and has the desired mechanical and chemical properties. The curing process canbe affected by various factors such as temperature, humidity, and the mixing ratio of the components. It is, therefore, essential to follow the manufacturer's recommendations for mixing and curing conditions to achieve the best results.Selection Criteria for Two-Component Potting Compounds.When selecting a two-component potting compound for a specific application, several factors need to be considered. Firstly, the compatibility of the compound with the substrate material is crucial. Secondly, the required mechanical strength, chemical resistance, and temperature resistance should be considered. Additionally, the curing time and conditions, as well as the handling and processing properties of the compound, are important factors. It is also essential to consider the safety and environmental aspects of the compound, such as its toxicity and disposal methods.Conclusion.Two-component potting compounds are versatile materials that offer excellent adhesion, chemical resistance, and mechanical strength. They are widely used in various industries due to their ability to protect sensitive equipment from environmental factors such as moisture, dust, and corrosion. When selecting a two-component potting compound for a specific application, it is essential to consider the compatibility with the substrate, required properties, curing conditions, and safety aspects. By following the manufacturer's recommendations and guidelines, optimal performance and results can be achieved.。

ASM 设备维修

ASM AD896 DIEBOND 作业时监视器中看上去装片位置很好,可停止后返回检查却发显很多位置偏移的,不知为何? 看INDEX(STEP)速度是否,比较快ASM AD829 bondhead Z 马达发烫是何原因? 今天发现到ASM AD829 bondhead Z 马达很烫,温度超过其他正常机器好多.而且会有position error 的报警,做了以下调整:+ P0 y* y, A4 {6 G! a7 U 1.检查了马达碳刷,长度和摩擦面都正常,吸碳粉; 2.检查了皮带,连轴器,清洗了带动Z轴轴承; 3.更换了Z motor 的驱动器: o. b8 出现position error应该是编码器的问题马达有问题,马达内的轴承有间隙了,可以晃动有好多MOTOR有抖动和转动错位的现象.装在设备上转动声音很大.换上新的MOTOR就没问题,请教高手帮助急待处理是直流马达吧, 把你用手转动能动吗? 不动轴承坏了，, 换新的轴承,换完以后,要调整马达的正反向电流,还有就是安装编码器是很关键, 调整编码器波形一样关键,任何地方没弄好都不行.6 {+ A0 B5 q3 Z+ `7 O% L' x% f Y 如果用手能很轻松的转动那么只需要调整波形就好了可能是刚性设置太高了吧。

如果是饲服马达的话。

把速度环调低一点吧。

把刚性降下来吧吸嘴大小，应该根据DIE大小选取。

一般选不小于芯片最小边的75％最小的橡胶吸嘴为716，吸嘴型号很多，应根据DIE定制，大体有圆形，正方形，长方形三种。

W/B热压板精诚或者精微美科精微(Micro-mechanics)、汉阳（HY）韩国汉阳精密，富达仪的产品，用MM公司的吧, SHINKAWA 都找它代工, 很不错的,便宜, 关键是自己要把住进货检验关. 1.是压板材质,二是表面处理方式.7 ^0 t* W( |' L W; s% @4 V 2.压板设计的尺寸规格定义(这点最重要)和进货后的测量(最简单的方法就是上机台走框架试). 如果没有技术力量对尺寸定义推荐你找精微吧他们的设计力量较强质量是我用到现在最好的一家压板还是要整体金属粉末压铸在精加工的好,耐磨热变形小,这是我们找了不少于10个人家得出来的做引线框架的一般对压板的要求比较高的，PBC板的都无所谓了一台KNS ULTRA设备在开启后出现“LAST FUNCTION FAIL"请教是否是软件问题还是其他更换一种版本的系统软件。

位错缠结英文术语

位错缠结英文术语Dislocation EntanglementDislocation is a fundamental concept in the field of materials science and solid mechanics, as it plays a crucial role in the understanding and prediction of the mechanical properties of materials. A dislocation is a linear defect in the crystalline structure of a material, where the atoms are arranged in a way that deviates from the perfect periodic arrangement. This deviation can significantly impact the material's behavior, including its strength, ductility, and resistance to deformation.One of the most fascinating and complex aspects of dislocations is their tendency to interact and form entangled structures, known as dislocation entanglement. This phenomenon occurs when multiple dislocations in a material become intertwined, creating a complex network that can have a profound impact on the material's properties.The study of dislocation entanglement is a topic of great interest in materials science, as it helps researchers understand the underlying mechanisms that govern the mechanical behavior of materials. Byunderstanding the nature of dislocation entanglement, scientists can develop new strategies for designing and engineering materials with improved performance characteristics.At the heart of dislocation entanglement is the concept of dislocation interactions. When two or more dislocations come into close proximity, they can begin to interact with each other, either through their stress fields or through direct physical contact. These interactions can lead to a variety of outcomes, including the formation of dislocation junctions, the annihilation of dislocations, or the creation of new dislocations.One of the most common forms of dislocation entanglement is the formation of dislocation tangles. Dislocation tangles are complex networks of dislocations that become intertwined, creating a dense and highly localized region of deformation within the material. These tangles can significantly impede the motion of dislocations, making it more difficult for the material to deform under stress.Another form of dislocation entanglement is the formation of dislocation cell structures. In this case, the dislocations arrange themselves into a regular, grid-like pattern, creating a series of enclosed regions or "cells" within the material. These cell structures can act as barriers to dislocation motion, effectively strengthening the material and increasing its resistance to deformation.The formation and evolution of dislocation entanglement is a highly complex and dynamic process, influenced by a variety of factors, including the material's composition, microstructure, and the applied stress or strain. Understanding these factors is crucial for developing accurate models and simulations of dislocation behavior, which can then be used to optimize the design and processing of materials.One of the key challenges in the study of dislocation entanglement is the difficulty in directly observing and characterizing these complex structures. Traditional microscopy techniques, such as transmission electron microscopy (TEM), can provide valuable insights into the structure and arrangement of dislocations, but they are limited in their ability to capture the full complexity of dislocation entanglement.To overcome these challenges, researchers have turned to advanced computational techniques, such as molecular dynamics simulations and finite element analysis, to model the behavior of dislocations and their interactions. These computational approaches allow researchers to explore the dynamics of dislocation entanglement in a controlled and systematic manner, providing valuable insights into the underlying mechanisms that govern the material's mechanical properties.In addition to computational modeling, researchers are also exploring new experimental techniques, such as in-situ TEM and high-resolution X-ray diffraction, to directly observe the evolution of dislocation entanglement under various loading conditions. These advanced characterization methods are helping to bridge the gap between theory and experiment, enabling a more comprehensive understanding of dislocation behavior and its impact on material performance.The study of dislocation entanglement has far-reaching implications for a wide range of industries, from aerospace and automotive engineering to microelectronics and energy production. By understanding and controlling the behavior of dislocations, researchers can develop new materials with improved strength, ductility, and resistance to deformation, paving the way for the development of more efficient and reliable technologies.In conclusion, dislocation entanglement is a complex and fascinating phenomenon that continues to captivate the attention of materials scientists and solid mechanics researchers. Through a combination of advanced computational techniques, innovative experimental methods, and a deep understanding of the underlying physics, researchers are steadily unraveling the mysteries of dislocation entanglement, unlocking new possibilities for the design and engineering of high-performance materials.。

奇思妙想的发明作文防弹球

奇思妙想的发明作文防弹球英文回答：In a world where safety is paramount, the concept of a "Bulletproof Ball" may seem counterintuitive at first glance. However, upon deeper reflection, it reveals intriguing possibilities for revolutionary advancements in personal protection and security. The Bulletproof Ball, as its name suggests, is an innovative invention that merges the principles of ballistics, material science, and design to create a portable, wearable device capable of shielding its user from ballistic threats.The Bulletproof Ball's core component is an advanced material or composite with exceptional resistance to high-velocity projectiles. This material, often a combination of ceramics, polymers, and composites, is meticulously engineered to absorb and disperse the energy of incoming bullets, preventing them from penetrating and causing harm to the wearer. The ball's spherical shape provides optimalcoverage, allowing for 360-degree protection against incoming fire.In addition to its protective capabilities, the Bulletproof Ball also incorporates a range of sophisticated features designed to enhance its functionality and ease of use. It can be equipped with a built-in tracking system for GPS-based location tracking in emergency situations. Advanced communication systems, such as Bluetooth or Wi-Fi, enable seamless connectivity with smartphones or other devices for remote monitoring and control.The Bulletproof Ball's applications extend far beyond personal protection. In law enforcement and military scenarios, it can serve as a valuable tool for riot control, crowd dispersal, and non-lethal self-defense. Its unique design allows officers to engage in close-quarterssituations without the risk of lethal force, reducing the potential for casualties.Moreover, the Bulletproof Ball has the potential to revolutionize the security of public spaces. Schools,hospitals, and entertainment venues could deploy these devices as a proactive measure to protect against active shooter threats and ensure the safety of their occupants. By creating a mobile, easily deployable shield, the Bulletproof Ball empowers individuals and security personnel to safeguard lives in the face of danger.As with any groundbreaking invention, the development and refinement of the Bulletproof Ball present ethical and societal considerations that must be carefully addressed. While its primary purpose is to protect life, its potential for misuse or diversion into the wrong hands cannot be overlooked. Therefore, strict regulations, thorough background checks, and responsible manufacturing practices are essential to ensure that the Bulletproof Ball remains a tool for good, not a threat to society.In conclusion, the Bulletproof Ball is an ingenious invention that has the potential to redefine personal safety and security. By harnessing the power of advanced materials and innovative design, this device offers unparalleled protection against ballistic threats,empowering individuals and law enforcement officers alike to face danger with confidence. While ethical concerns must be considered, the Bulletproof Ball holds immense promise for safeguarding lives and creating a safer world.中文回答：防弹球，顾名思义，是一种创新的发明，它将弹道学、材料科学和设计的原理相结合，创造出一种便携式可穿戴设备，能够保护使用者免受弹道威胁。

ASM固晶机操作手册

第4章控制功能及參數主操作表:AD809共有八個主要模式。

按[ADV]或[RTD]鍵進行選擇及在選取項目後按[ENTER]確定選擇。

按鍵盤上的[MODE]鍵後, 如下的操作表會顯示在屏幕下方。

按[ADV]或[RTD]鍵選取項目後按[ENTER]執行。

其中: AUTO = 用於執行“AUTO Mode” 功能SETUP = 用於執行“SETUP Mode” 功能PARA = 用於執行“PARAMETER Mode” 功能SERV = 用於執行“SERVICE Mode” 功能DIAG = 用於執行“DIAGNOSTIC Mode” 功能WHPAR = 用於執行“WORKHOLDER Parameter” 功能TCHPCB = 用於執行“TEACH PCB” 功能ALNPCB = 用於執行“ALIGN PCB” 功能4.1 AUTO Mode (自動模式)4.2 SETUP Mode (設定模式)4.3 BOND Parameter (焊接參數)焊臂馬達驅動運動The bond arm motor drives the theta motion of the bondarm itself.4.4 SERVICE Mode (輔助模式)4.5 DIAGNOSTIC Mode (診斷模式)4.6 WH PARAM (工作夾具參數)4.7 Teach PCB Program (編寫PCB程式)4.8 ALN PCB (對準PCB)這個模式功能是用於設定PCB的對準點。

屏幕會自動地轉換攝像機到工作夾具上, 用控制桿瞄準對準點並按[ENTER], 屏幕會顯示[PCB (X,Y) MALN 1], 表示你將要在X行及Y列上輸入PCB的第1對準點。

ASM 自动焊线机器介绍Au wire bonding process ppt课件

page 11
Comparison of Different Wire Bonding Techniques
Wirebonding
Thermocompression
Operating Temperature
300-500°C
Wire Materials
Au
Pad Materials
Al, Au
Note
Thermosonic bonding: utilizes temperature, ultrasonic and low impact force, and ball/ wedge methods.
Ultrasonic bonding: utilizes ultrasonic and low impact force, and the weer Grinding
Wafer Saw
Die Bonding
Toaster
Wire Bonding
Die Surface Coating
Molding
Laser Mark
BGA
SURFACE MOUNTPKG THROUGH HOLE PKG
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Solder Ball Placement
Wedge Bond ( 2nd Bond )
Gold wire
Die Pad
Lead
13.09.2020
ASM Pacific Technology Ltd. © 2009
page 6
Wedge Bonding
13.09.2020
ASM Pacific Technology Ltd. © 2009
Dejunk Trim
Solder Plating

ASM全自动Wire Bonding机编程手册

ASM 全自动Wire Bonding 机编程手册ASM 全自动Wire Bonding 机系微电子封装工艺中常用的金线Bonding 设备,其利用光反射工作原理具有准确定位的优良特性, 超声波发热技术的应用有效保证了熔结点的可靠性,Wire Bonding 设备的应用主要是编程方面,以下将结合实例和图解分步介绍一.编程前的准备:1.取5pcs 待Bonding 的产品(Die Bonding 完成后的产品)依序排列在一片Carrier 上(从Carrier 右端开始排),所有Pin 尽量拉正,切不可往外偏2.将Carrier 装上Tray 后定位于入料口待送入工作区3.按住Shift 键,敲击OM/Main 键将装有产品的Carrier 对准入料口4.击Zoom/Ink 键一次将Carrier 推入工作区5.在1.2菜单下选取第5项Delete Program,按Enter 将目前的程序清除,开始编写新的程序二,Bonding 点数确定:1.先标示出待Bonding 产品的基本拉线(拉线需遵循由高到低的原则)及Bonding 点的编号,以便后续编程时参照2.在菜单1.2.3.1下选取第0项Get Bonding Point,输入需Bonding 的点数(Die 点数+1) 3.依照第1步标好的顺序,用光标依次选中需Bonding 的Die * 以图示的TOSA 为例说明 :从上图我们可以看出,在第2步需要输入的点数为6 (5个Die + 1个Lead),第3步依次用光标选中D1,D2,D3,D4,D5(选中每个Die 后按Enter 输入,再将光标移去下一个). 三.设定参考点:1.所有的Die 选择完成后,界面将会有提示,看到提示后开始选择参考点2.将光标选中第一个Die 的中心按Enter 确定3.再将光标移至与第一个对角位置的Die 中心,按Enter 确定4.以上设定完成后,光标将自动退回第一个Die 的中心位置实例操作说明:A. 将光标选中D-1中心后按Enter 确定B. 将光标移至D-2中心后按Enter 确定,如右图所示C. 以上完成后光标自动退回D-1中心点四,两参照Die 的参数设定:1.在菜单1.2.3.1下选取第_项Template线标号及拉线方向2.通过调整” ←↑ ↓→”键,使光标将第一个Die 刚好完全框住后按Enter 键输入(开始设定D-1的第1个参考点)3.接下来是设定第一个Die 的寻找区域,同样是通过调整” ←↑ ↓→”键,使光标圈定第一个Die 以及周边的一定区域后按 Enter 键输入4.此时我们能看到一个黑白十分分明的图面,将菜单进入第_项Adjust Image 通过调整第1项(同轴光)和第3项(侧光)来设定黑白对比度,直至黑白相当明显后按Enter 存储图片5.以同样方式设定第一个Die 的第2个参考点(因PIN 的面积较少,两参照点可重叠在一点)6.第一个参照Die 两参考点设定好后,光标将自动跳至下一个参照Die 的中心点位置7.再以同样方式设定好第二个参照Die 的参数,到此两参照Die 参数设定完成实例操作说明:A. 在菜单1.2.3.1下选取第_项TemplateB. 两对角点描出一个四边区域刚好圈住整个Die-1后按Enter(设定D-1的第1个参考点)C. 再将Template 后的参数设定为11,再圈定合适区域选取D-1的寻找区域D. 按Enter 后出现黑白明显的图面,调第1和第3项将黑白对比度调至适度E. 按Enter 存储图片F. 以同样方式设定好D-1的第2个参考点G. D-1的两参考点设定好后,光标自动跳到D-2的中心点,以同样方式设定好D-2的两参考点即可图示说明:Die-1参数设定过程(图一~图三为第1个参考点设定,图四~图六为第2个参考点设定)Die-2参数设定过程(图一~图三为第1个参考点设定,图四~图六为第2个参考点设定)五.所有Die 的参数设定:1.两参照Die 的参数设定好后,光标自动回到第一个Die 的中心点,准备开始所有Die 的参数设定2.和第四步同样的方法先在菜单1.2.3.1下选取第_项Template,将第一个Die 全部圈住(开始设定第1个参考点) 3.将Template 后的参数设定为11后在第一个Die 周边圈取适当的寻找范围,按Enter 后开始设定第一个Die 的第2个参考点,方法同上4.方式可分别设定所有Die 的参数,此处特别要说明的是并非所有的Die 两参考点都可选在同一位置,如果Die 是PIN 的话,图-01 图-06图-05 图-04 图-03 图-02 图-07 图-12图-11 图-10 图-09 图-08两参考点选同一位置就可能了,但对于需Bonding 好几条金线的Sub-Mount 则需要将这两个参考点选在对角位置会比较合适些, 实例操作说明:A. 在菜单1.2.3.1下选取第_项TemplateB. 两对角点描出一个四边区域刚好圈住整个Die-1后按Enter(设定D-1的第1个参考点)C. 再将Template 后的参数设定为11,再圈定合适区域选取D-1的寻找区域D. 按Enter 存储图片E. 以同样方式设定好D-1的第2个参考点F. D-1的两参考点设定好后,光标自动跳到D-2的中心点,以同样方式设定好D-2的两参考点即可G. 同样方法设定好D3,D4H. 对于D5,因有较多的Bonding 点,所有我们通常是选取其需Bonding 区域的对角点作为参考点,方法同上,如图示六.设定Wire 走线:1.将2,3,9菜单下的第4项PR Support Mode 设定为None,并确认第1项Teach&Bond 为Disable, 2.选取2.3.9菜单下的第0项Get Bond Point 后按Enter 确认3.先确定第一条线的起始点,通过2.3.9菜单下的第2项Change Bond On 选取点的特性(Die,Lead,GND),如选取的是Die,则需再输入Die 的编号,选好后移动光标至所需Bonding 的具体位置4.再确定第一条线的终止点,和第3步同样方法设定好点的特性后将光标移至需Bonding 位置按Enter,第一条线设定完成5.同样方法依次设定其他走线实例操作说明:A 将2.3.9菜单下的第4项PR Support Mode 设定为None,并确认第1项Teach&Bond 为Disable,B 选取2.3.9菜单下的第0项Get Bond Point 后按Enter 确认C 进入2.3.9菜单下的第2项Change Bond On,按”B ”(选取Die)后输入”4”D 将光标在D-4上选取需要Bonding 的具体位置后按Enter 确认E 同样选取2.3.9菜单下的第2项Change Bond On,按”B ”(选取Die)后输入”5”F 将光标在D-4上选取需要Bonding 的具体位置后按Enter 确认,这样第一条线就设定好了G 依据先前设定好拉线顺序,同样方法将所有走线设定完成,设定点时需观察界面提示,如为所需的点则无需再选2.3.9.2切换七.工作组Copy:1.将菜单2下的第2项Step &Repeat 设定为Matrix2.输入row 参数为1(行数,此设备已限定为1行,输入cols 参数为5(,单个工作组列数,可依据所需选择,一般选取5)3.选取第一个制品的某一特性部位(一般选D-1)作为参考点,移动光标,选取第二个制品的同样部位并按Enter 确认4.选好第二个产品的参照点并按Enter 后,光标将自动移动到最后一个(第5个)制品的相同部位附件,将光标微调至最后一个产品的相同部位后按Enter确认,5.三个参考点选择完成后系统将自动在界面上演示取货过程,按Stop两次退出实例操作说明:A 将菜单2下的第2项Step &Repeat设定为MatrixB 输入row参数为1,输入cols参数为5C 选取第一个制品的D-1中心作为参考点,移动光标,选取第二个制品的D-1中心点并按Enter确认,待光标自动移至第五个制品D-1中心点附件时,微调光标将光标对准中心点按Enter确认,然后按两次Stop推出八.Bonding高度调整:1.滚动滑鼠将光标移回第一个制品.2.选取菜单1.3下的第2项Refer Parameter并按Enter进入Bonding高度确认界面3.依据界面提示由上至下选取Die及Lead的Bonding高度,具体方法是,先通过”↑↓”键选取待设定的点,后按Enter,光标将自动移动到所选定的点上,确认位置没有问题时按Enter确认,如有偏差将光标移动到位后再按Enter确定.4.设定完成后按Stop退出设定界面进入主界面实例操作说明:A. 滚动滑鼠将光标移回第一个制品.B. 选取菜单1.3下的第2项Refer Parameter并按Enter进入Bonding高度确认界面C. 按Enter后光标自动选定D-1的中心,确认OK后按Enter确认,D. 点击”↓”键选取D-2后按Enter,光标自动选定D-2中心,确认OK后按Enter确认E. 同样方法适当好D-3,D-4,D-5F. 设定好D-5后点击”↓”键选取Lead按Enter,将光标移到Header上任意位置后按Enter确认,全部设定完成后按Stop回到主界面九.线形设定:1.选取菜单1.4的第3项Loop Group Frpe后按Enter进入线性设定界面2.参照附件中的线形,依据实际的状况依次选取适当的线形,因以建立好线性库,只须输入相应的字母即可3.设定完成后按Stop退出设定界面进入主界面实例操作说明:A 选取菜单1.4的第3项Loop Group Frpe后按Enter进入线性设定界面B 因W1属MPD→SM,所以在第栏中输入E; W2属SM→PIN, 所以在第栏中输入I; W3属SM→PIN, 所以在第栏中输入I; W4属SM→PIN, 所以在第栏中输入I; W5属SM→Header, 所以在第栏中输入C;C所有五条线形都设定完成后按Stop退回主界面十,程序存盘:1,将菜单选取1.9.0的第0项Save Bond Program,按Enter进入2.用” ←↑ ↓→”键选取所需的字母组成文件名后按Enter键将所编写的程序存盘附录一:线形代码一览表。

Fine Pitch Copper Wire Bonding Process and Materials Study - Brochure - English

Thermal Conductivity W/mK 394 293
Coefficient of Linear 10-6/K 16.6 14.2
Expansion
Tensile Strength
MP a 240 230
Young Modulus
1010N/m2 13.6
8.8
Elongation
%
15.0 4.5
Shinji Shirakawa Tanaka Electronics Singapore Pte. Ltd. 29 Pandan Crescent, Singapore 128473
Abstract:
Over the years, the maturity of copper wire bonding using (38um and 50um wire diameter) process for mass production mode has demonstrated a great deal of success for standard (non-fine pitch) packages like discrete and power devices having a copper (Cu) bond- aluminum (Al) metallization interface. The advantages of switching from gold (Au) to Cu aside for cost saving reasons, are its higher electrical conductivity characteristics, and its resistant to wire sweeping during molding as Cu has a higher Young’s modulus than Au.

wb c2Copper Wire Ball Bonding

The Cutting Edge of Copper Wire Ball BondingAgendaGrowth of copper wire bondingChallenges and solutionsPd Coated Copper WireSummaryCopper Wire -The JourneyEngineers had been experimenting with alternate wire to gold for more than 20 yearsUntil recently, the only alternative bonding wire is aluminum which is usually wedge bondedCopper is chosen because of the excellent conductivity and a commonly used metal for electricalcircuitsInitial work with copper wire found that forming a FAB is relatively easier -K&S had patented anearlier version of the copper kit in 1999Early Cu Wire Bond adoption cost saving for heavy wire in 1990 sFirst used on discrete s and Power ICs which have a robust pad structuresCu kits designed via trial and errorWire size usually thick than 2.0milRenewed interest to convert 1mil wire to Cu ~2006Gold prices began to shot up significantlyEffort was focus on understanding the fundamental knowledge for Cu wire bondingEngineering models and characterizations were initiated to study the fundamentalsToday Gold prices continuing to rise dramaticallyCu Process Knowledge increased dramatically and reliability had been provenFine Pitch/High performance apps entering Cu Wire production at a rapid paceA few large IDMs are transitioning to Cu very aggressivelySubcons Competing for Cu Business (aggressively adding capacity)Copper Wire PenetrationEstimated ~15% automatic ball bonders worldwide are installed with a copper kits and runningregular productionBy end 2010, estimate about 12~15% units are bonded with copper wire, compared to less than2% before 2008Prismark projects that copper wire penetration will grow from just over5% in 2009 to almost 30% in 2014 IC applications now account for more than 70% of the copper wirevolume.Taiwan and China lead the world intransition to copperCopper kit installed by K&SChallenges And SolutionsCopper Kit ExampleControlled enviroment for EFOIntensive use of gas flow modeling to determine design to exclude oxygen in the EFO FAB RegionCeramic TubeEFO WandFlow rate: 0.2 lpmEFO WandFAB RegionCeramic TubeFlow rate: 0.6 lpmDesigning the KitMaking The Right Free-Air-Ball Establishing the right level of gas flowCopper is a Harder MaterialSUB =46 TIME=9 EPTOX (AVG) RSYS=1 PowerGraphics EFACET=1AVRES=MatDMX =.219E-03 SMN =-.459073 SMX =.48208 Au Total Radial StrainCuDealing With First Bond Issues Critical 1st bond issues arehardnessEquipment maker develop processes to minimizesBall Shear RequirementBall Diameter vs. Current Factor for Au and Cu Wire60.0055.0050.0045.0040.00585654525048Improve Al Pad SplashExtensive research was accomplish to study how the weld was formedTraditional processConcave InterfacePad Damage/SplashSmall process windowSlower UPHAl DepletionNo Al depletion Special Cu ProcessesFlat InterfaceReduced PadDamage/Splash Larger process windowFaster UPHNew Copper Process for 1st BondTraditional ProcessConcave InterfacePad Damage/Splash Require table scrub Small process windowNew Cu ProcessAchieves Flat Interface Reduced Pad Damage/Splash Larger process window Dedicated Copper BonderAu ( baseline process)AuCuCu (baseline process with LOOP FACTOR changed from -2.8 to -4.0)Cu (with baseline process)Cu (baseline process with SF5 changed from 35 to 17)Cu vs Au Looping OptimizationBasic guidelines for copper wire looping optimization is similar to gold wireLow Loop Height Application ExampleCopper Wire Looping Capability Advanced Looping CapabilityCopper Wire SSB Bond Example of a 1-mil die-to-die bonding applicationIn copper wire bonding obtaining a good2nd bond is critical and a challengeAs copper is harder, it a challenge to get agood 2nd bond shape, a bog variation between the 4 sidesThe balance between bond force and USGpower is criticalVarious features and material weredeveloped to improve the 2nd bondperformanceTable scrub and segmented bond are someof the features developed reduces 2nd bond variationsLowering CV to avoid peeling and NSOLs will often result in wire sway Low impact with high USG deformation Low impact with spiral scrubbingBonding SegmentsSpecial Processes have been developed for Cu wire bondingSpecial Stitch Process-S1 XY Dist move toward 1st bond-S2 XY Dist move away from 1st bond2nd Bond ImprovementsGranular Surface ToolsMatte Unique granular morphologyPolishPd Coated WirePd Coated Copper WirePd coated copper wire provides an oxidation resistant coating onthe copper surface -coating is typically about 0.2 µm thickIt also prevents the formation of the lubricious copper oxidesurfaceImproved corrosion resistance on the wire and may easestringent requirements on molding compoundsPossible to use nitrogen instead of forming gas for FAB formation-performance using forming gas is still betterPd Coated Copper Wire FABPd-Cu alloy formation in the FAB causes greater hardness than for FAB s from 120 mA60 mA30 mA100120Metal Peel at Different EFO CurrentCu Pd-CuEffect of EFO current on metal peel with Typical Al pad peelafter pull testAl Splash Comparison using Bare Cu and Pd-Cu WiresAl splash as a function of shear per areaFirst Bond DOE using Pd-Cu Wire2nd Bond ImprovementsStitch Pull with Bare Cu and Pd-Cu wiresStitch Pull results on silver-plated lead frameEach data point corresponds to a cell in a DOEPd-Cu Wire -ConclusionAdvantages of Pd-Cu wireMore robust 2nd bond process in many applicationsAllows the use of the nitrogen instead of forming gas for free air ballformationPossibly more resistance to corrosion in reliability testsDisadvantages of Pd-Cu wireCostAbout 3 times more expensive than bare Cu wire but still about 70% lessexpensive than Au wireHarder free air ball and could cause higher level of bond pad peelingand dielectric damageA smaller 1st bond process window for pad sensitive devicesSummaryBond Pad Structure Key Differences Worked Worked With Optimization Never WorkedCopper Wire RoadmapSummaryThe semiconductor industry had come a long way in copper wirebonding developmentIn fine wire development, pitch capability is getting close to goldwire performance, seeing 40um BPP in production before2012/13Pd coated copper wire is an alternative for the short term andeventually will convert to pure copperA "complete" solution involving material, pad design andequipment capability with accelerate the use of copper wireThe penetration rate to continue to increase rapidly and couldreach 50% of all semiconductor packaging within 5 years, and 70% a couple of years later -excluding LEDs。

asmwirebond重要参数位置及影响

重要參數位置及影響SetupPower Calibration路徑: Main \ setup \ more ..\ power Calibration …\影響: 此為機台設定，將影響power 輸出值，不準更動Auto Bond 前確認之開關Enable PR路徑: main \ auto \ enable PR yes影響: 此為auto bond PR之開關Auto Index路徑:Main \ Auto \ auto Index Yes影響: 此項功能為LF 自動輸送，假如此auto index　關閉，則auto bond 時無法自動送導線架Ball Detect路徑:Main \ Auto \ Ball Detect Yes影響：此開關為燒球之偵測如選NO，無偵測可能造成空卬Stick Detect 1路徑:Main \ Auto \ Stick Dectect 1 Yes影響：此為第一點偵測（１st bond Non-stick ）之開關，如關閉則不偵測Stick Detect 2路徑:Main \ Auto \ Stick Dectect 2 Yes影響：此為第一點偵測（２st bond Non-stick ）之開關，如關閉則不偵測Heater Alarm路徑:Main \ Auto \ More \ Heater Alarm Yes影響：此為檢查熱板及預熱板溫度偵測是否超出設定範圍，yes 表未到達設定溫度時，警告ＶLL Retry路徑:Main \ Auto \ More \ VLL Retry No影響：第一次VLL尋找失敗時，重新找尋ＶＬＬEnable Index路徑:Main \ Auto \ More \ Enable PR Index Every影響：爪夾在運送時，每一unit 皆以 Index　PR 作定位影響品值之重要參數路徑:Main \ Auto \ More \TaieBar (.1 mil ) XX影響：此為設定TaiBar 之公差路徑:Main \ Parameter \ Bond Parameter \ Alignment Tolerance L / D XX X影響:此為設定手動平移點位置與原本教定的平移點容許的偏移量/路徑:Main \ Parameter \ Bond Parameter \ Search Delay (ms) L / D XX XX影響: PR 辨識前的延遲時間路徑:Main \ Parameter \ Bond Parameter \ Search Range (id )L / D XX XX影響: PR 搜尋的範圍路徑:Main \ Parameter \ Bond Parameter \ Fire level XXX影響:E_torch 和capillary　之間的距離，如改變會影響偵測燒球之功能判定路徑:Main \ Parameter \ Bond Parameter \ EFO Control \ EFO Parameter \ Gap Wide Warning Volt XXX影響：打火的電壓大小路徑:Main \ Parameter \ Bond Parameter \ EFO Control \ EFO Parameter \ EFO Current (*0.01)影響:打火的電流大小路徑:Main \ Parameter \ Bond Parameter | EFO Control \ EFO Setting \ Enable Dual FAB NO影響:此為燒大小球的開關路徑:Main \ parameter \ Bond Parameter \ Heater Control影響: 熱板及預熱板的控制系統路徑:Main \ Parameter \ Bond Parameter \ More \ VLL Lead Position Tol (%)影響:VLL尋找時所能允許的偏移量路徑:Main \ Parameter \ Bond Parameter \ more \ VLL Lead Width Tolerance um影響:VLL尋找時，所能允許導線架本身寬度變化的容忍值路徑:Main \ Wire Parameter \ Edit Non –Stick Detection \ Edit Stick Detection 1影響:第一銲點的個別偵測開關路徑:Main \ Wire Parameter \ Edit Non- Stick Detection \ Edit Stick Detection 2影響:第二銲點的個別偵測開關路徑:Main \ show statistics \ set statistics limit …\ Capil Warn XXXX *100路徑:Main \ Show Statistic \ Set Statistics Limit …\ Capil Stop XXx * 100影響:自動打線時的銲針次數路徑:Main \ WH Menu ..\ Service ..\ Control Parameter \ Miscellaneous…\ 1st / L& R offset Update NO影響:如開yes 會輸送導線架時會自動更新所補償的偏移量路徑: F15 \ Bonding Control \Safety Control \Edit Bond PT Tol .影響:當修改打線位置時，所允許的修改範圍偵測設定tail short路徑: Main \ Auto \ Start single Bond \ 9 Tail shortRange: -15 到15 ，通常設-2 到2設為-15 表偵測功能關閉stickadj路徑:Main \ Auto \ Start Single Bond \ F1 \ 7StickadjRange: sample值為５　到３０設為３５表偵測功能關閉　正常設定值須高single Bond時之 sample 值如設定值低於Single Bond 之sample值則假偵測關鍵：1須tail break Control off2路徑:Main \ Wire Parameter \ More \ Edit Tail Break Control相對開關：1 stick detect 1路徑:Main \ Auto \ More \ Stick Detect 12 stick detect 2路徑:Main \ Auto \ More \ Stick Detect 23 edit Non-Stick Detection路徑:Main \ Wire Parameter \ Edit Non-Stick DetectionTail Stick路徑:Main \ Auto \ Start Single Bond \ F1 \ 9Tail stickRange: sample值為20　到170　正常設定值須高single Bond時之 sample 值如設定值低於Single Bond 之sample值則假偵測關鍵：1須tail break Control YES2路徑:Main \ Wire Parameter \ More \ Edit Tail Break ControlBFM路徑:F15(2002)\ Bonding Control \ EFO Control \ Ball Formation \ Monitor …\ Enable BFM 程序: 1設定sampling bons (redo) xx2設定contamination　level x3設定Abnormality level x4切換enable BFM5 auto bond 時自動取樣影響:偵測燒球對應開關: ball detect (main\ auto \ ball detect)Bond Stick Detection路徑: F15 (2002)\ Bonding Control \ Bond Stick Detection程序:1設定total sample xx (取樣數值)2切換enable sample yes3 auto bond 時自動取樣影響:偵測一銲點之靈敏度。

Bonding培训教材分析

GIANT ELECTRONICS LTD嘉音电子有限公司BONDING(邦定)培训教材第一章通用（特殊岗位）培训教材第一节 BONDING（邦定）基本原理一、 BONDING（邦定）组成部分1、印制线路板2、铝线3、芯片4、自动铝线焊线机--（焊接原理）超声波发生器超声波焊接原理：超声波焊接的能量是机械能而非热能，在超声波装置中，弹性震动是由高速交换电流驱动紧密磁力转换器的快速伸缩而产生，此高频压力波传送至钢嘴再由钢嘴将此震动能量转换至被焊接的材料上，钢嘴尖端与焊接平行的运动，包含一种材料上的电动剪切模式，整个的过程包括压力、重力以及钢嘴尖端附加的震动。

影响焊接程序的现象：1、在焊接过程中，焊接点高压力部分的弹性磁滞导致的温度上升。

2、金属结晶结构由于高频机械震动的变换，同时在做各种不同的焊接程序，有四个参数可以改变：⑪钢嘴⑫焊接压力（机械压力）⑬能量（输出功率）⑭焊接时间3、超声波焊线机是专为铝线设计，但是它的程序也可用在金线上。

二、BONDING（邦定）工艺生产流程BONDING（邦定）生产线流程：将微小的芯片IC用红胶粘贴在规定的PCB板位置处，烘干后，用1.25mil(31.75µm)或1.0mil(25.4µm)铝线在自动铝线焊线机上将芯片IC与PCB板线路(金手指)连接起来,然后用绝缘黑胶将芯片IC和金手指封盖后进入烘炉烘干固定。

1生产工艺流程图：2三、BONDING（邦定）生产的主要设备例: 生产一台机所需时间AB510-----(70×0.26+4+3)÷0.9AB520-----(70×0.21+0.8+3)÷0.95四、BONDING （邦定）生产材料及其使用1、印制线路板2、芯片IC3、红胶伟邦4、黑胶振基 URC5、铝线振基 C.C.C6、其它辅料红胶：储藏条件25℃6--8个月5℃12个月膠化条件25℃5--8min固化条件25℃50min红胶在使用前将其温度恢复到室温，才能使用。

ASM自动焊线机器介绍Auwirebondingprocess专题培训课件

12/25/2019
ASM Pacific Technology Ltd. © 2009
page 9
Advantages of Thermosonic
Metallurgical joining is more reliable than conductive particles and adhesive joining.
page 10
Comparison of Different Wire Bonding Techniques
Wirebonding
Thermocompression
Operating Temperature
300-500°C
Wire Materials
Au
Pad Materials
Al, Au
Note
Contents
Basic Introduction Gold Wire Bonder Bonding Sequence Material & Tools Bond Quality
12/25/2019
ASM Pacific Technology Ltd. © 2009
page 1
Thermosonic welding, the interface temperature can be much lower, typically between 100 to 150°C, which avoids such problems. The ultrasonic energy helps disperse contaminates during the early part of the bonding cycle and helps complete the weld in combination with the thermal energy.

bondingpair中文翻譯

bondingpair中文翻譯The following results are achieved : ( 1 ) in accordance with the empirical electron theory of sopds and molecules , considering the number of covalent bond pairs on the strongest bond in a segregation structure na , the elements for matrix - strengthening can be chosen . ( 2 ) on the basis of the available phase - equipbrium thermodynamics calculation of alloy system and phase diagrams , which have been worked out , the contents of alloy elements can be identified with reference to the types , quantity and phase - transformation of carbides . ( 3 ) both the values relating to toughness ( including bending strength , yield strength , impact value of unnotched samples ) and hardness of new dm9 die steel are higher than those of crl2mov die steel 結果得出：( 1 )根據固體與分子經驗電子理論，利用偏聚結構單元的最強共價鍵上的共用電子對數n _ a ，可以選擇工模具鋼基體相的強化元素；( 2 )根據合金系相平衡熱力學計算及已有的相圖，可以碳化物類型、數量及其相變確定合金元素含量； ( 3 )新型dm9鋼在強韌性(抗彎強度、屈服強度、無缺口沖擊值)和硬度方面均高于cr12mov 鋼；( 4 )以dm9鋼與6crw2si 、7cr2wmovsi ( dm7 ) 、h13和cr12mov四種模具鋼的實驗比較，進一步驗證了上述冷作模具鋼合金設計方案是合適的。

ASM Wire Bond Introduction abo (2)

ASM
X Y Table
Linear 3 phase AC Servo motor High power AC Current Amplifier DSP based control platform High X-Y positioning accuracy of +/- 1 mm Resolution of 0.2 mm
ASM
Trajectory
pad
Tool less conversion window clamps and top plate enables fast device
ASM
Eagle
Machine Specifications (I)
Bonding System
Bonding Method Thermosonic (TS) BQM Mode Constant Current, Voltage, Power and Normal (Programmable) Loop Type Normal, Low, Square & J Wire XY Resolution 0.2 um Z Resolution 2.5 um Fine Pitch Capability 35 um pitch @ 0.6 mil wire No. of Bonding Wires up to 1000 Program Storage 1000 programs on Hard Disk Multimode Transducer System Programmable profile, control and vibration modes
RH
pad
Lead
ASM
Formation of a loop

半导体封装植球工艺英文简称

半导体封装植球工艺英文简称Flip Chip with Solder Bump.Flip chip with solder bump (FCB) is a semiconductor packaging technology in which the integrated circuit (IC) die is mounted upside down on the substrate, with solder bumps connecting the die to the substrate. FCB is a high-density, high-performance packaging technology that is widely used in a variety of electronic applications, including mobile phones, computers, and automotive electronics.The FCB process begins with the fabrication of the IC die. The die is typically made of silicon and is patterned with the desired circuit layout. The next step is to form the solder bumps on the die. This is done by depositing a thin layer of solder on the die and then reflowing the solder to form the bumps. The solder bumps are typically made of a lead-tin alloy or a lead-free alloy such as SnAgCu.Once the solder bumps have been formed, the die is flipped over and placed on the substrate. The substrate is typically made of a ceramic or organic material and is patterned with the desired circuit layout. The solder bumps on the die are aligned with the corresponding pads on the substrate.The next step is to reflow the solder bumps to connect the die to the substrate. This is done by heating the assembly to a temperature above the melting point of the solder. The solder melts and flows, forming a permanent connection between the die and the substrate.After the solder bumps have been reflowed, the assembly is cooled and inspected. The assembly is then ready to be tested and packaged.FCB offers a number of advantages over other semiconductor packaging technologies. These advantages include:High density: FCB allows for the highest possible density of interconnections between the die and the substrate. This is due to the fact that the solder bumpsare formed on the die itself, rather than on the substrate.High performance: FCB provides excellent electrical performance due to the short electrical path between thedie and the substrate. This results in low inductance and capacitance, which is important for high-speed applications.Low cost: FCB is a relatively low-cost packaging technology due to the fact that it does not require expensive materials or processes.FCB is a versatile packaging technology that can beused in a wide variety of applications. Some of the most common applications include:Mobile phones: FCB is a popular packaging technologyfor mobile phones due to its high density and low cost.Computers: FCB is used in a variety of computerapplications, including motherboards, graphics cards, and memory modules.Automotive electronics: FCB is used in a variety of automotive electronics applications, including engine control units, transmission control units, and infotainment systems.FCB is a mature technology that has been used in production for many years. It is a reliable and cost-effective packaging technology that is well-suited for a wide variety of applications.。

ASM焊线要求教育训练

Bond quality in wire bonder(焊線的品質問題)
1) 2) 3) 4) 5)
Ball size(金球) Ball Shear(金球剪切) Wire Pull(金線拉力) Wedge size(焊點尺寸) Inter-metallic(內部金屬)
Ball Size(金球尺寸)
Wire Pull(金線拉力)
How to do Wire Pull
Neck Pull(頸部拉力) Wire Pull(金線拉力) Stitch Pull(魚尾拉力)
Gold wire(金線)
Die(晶片)
Lead(支架)
1/3 of wire length(金線的1/3)
Wedge size(焊點尺寸)
Strong bonding with lead 與電極接觸良好焊點不完整
Wedge size Good wedge size can give out strong 2nd bond 尺寸正常的焊點可以完全和2焊點接觸
After stitch pull, the wedge still remain on lead (2nd bond) 經過對金線測拉力后, 焊點仍在2焊點上
Inter-metallic at 1st bond 第一焊點的金屬
Inter-metallic at 1st bond (第一焊點的內部金屬)
For safety, sometimes customer will request intermetallic test.(出于安全考慮, 有時候客戶會要求內部金屬測試) Inter-metallic test are use to confirm 1st bond quality(內部金屬測試可以確定一焊點的品質) 1 There have no damage on die surface. (晶片表面沒有損壞的跡象) 2 There have enough inter-metallic bond between die pad & gold ball. (在電極和金球之間有足夠的金屬)

孔内圆棒上下活动时有卡阻现象的英文

孔内圆棒上下活动时有卡阻现象的英文When a round rod gets stuck while moving up or down, it is referred to as the phenomena of jamming or sticking. This can occur due to various factors, including material properties, surface conditions, friction, and the presence of foreign particles. In this article, we will explore in detail the causes and possible solutions to the jamming phenomenon on the cylindrical rod.1. Material Properties:The properties of the round rod can significantly influence the likelihood of jamming. For instance, if the material is too rigid or brittle, it may be prone to cracking or getting stuck in the inner walls of the surrounding structure. On the other hand, if the material is too soft or elastic, it may lose its shape and create obstacles while moving within a confined space.2. Surface Conditions:The surface roughness of the round rod is crucial in determining the likelihood of jamming. A rough surface can increase friction and cause the rod to get stuck. On the contrary, a smooth surface can reduce friction, allowing for smooth movement.3. Friction:Friction is a primary cause of jamming on a cylindrical rod. When the rod interacts with the inner walls or surfaces of a structure, the frictional forces can overcome the driving force, causing the rod to get stuck. This can be particularly problematic when the rod is moving against gravity or when there is insufficient lubrication. 4. Foreign Particles:The presence of foreign particles, such as dust, particles, or debris, can easily lead to jamming. These particles can accumulate on the rod's surface or within the surrounding structure, obstructing its movement and causing it to get stuck.Possible solutions to overcome the jamming phenomenon on a cylindrical rod:1. Surface Modification:To reduce the friction and likelihood of jamming, one solution is to modify the surface of the round rod. Different coating techniques, such as applying lubricants or utilizing self-lubricating materials, can help reduce friction and facilitate smooth movement.2. Material Selection:Choosing the right material for the round rod is essential. By considering the required mechanical properties and environmental conditions, a material can be selected that is less prone to jamming. For example, using materials with better wear resistance or incorporating additives for enhanced lubrication can prevent sticking.3. Regular Cleaning and Maintenance:Regularly cleaning the rod and the surrounding structure can prevent the accumulation of foreign particles, reducing the risk of jamming. Proper maintenance, including periodic lubrication or surface treatments, can also help maintain smooth motion.4. Design Optimization:Optimizing the design of the structure or system in which thecylindrical rod operates can prevent jamming. This can involve ensuring sufficient clearance between the moving rod and surrounding components, minimizing contact points, or incorporating structures that facilitate easy movement.5. Lubrication:Applying lubricants to the rod's surface or within the surrounding structure can effectively reduce friction and prevent jamming. The lubricants create a thin film that acts as a barrier, reducing the direct contact between surfaces and facilitating smooth motion.In conclusion, the phenomena of jamming or sticking on a cylindrical rod can occur due to various factors. Understanding and addressing the material properties, surface conditions, friction, and the presence of foreign particles are crucial in preventing such occurrences. Implementing solutions such as surface modification, material selection, regular cleaning and maintenance, design optimization, and lubrication can significantly reduce the likelihood of jamming and ensure smooth movement of the round rod.。

BSOB模式与BBOS模式

Loop base is the distance between the capillary tip and contact point.
W/clamp ‘open’
Contact Pt.
Loop Base
Device 1
Recommended setting = 2
Device 2
8
3.4) Capillary move to programme ball offset. Ball offset can be programmed towards or away from the first bond. + ve towards 2nd bond
- ve away 2nd bond
W/clamp ‘open’
Actual Ball Offset = Setting x 10um If Ball Offset Setting = 22 Then Actual Loop Base =220um Device 1
Recommended Setting = - ve 35
Figure 2 : Bond Ball On Stitch (BBOS)
Bond Ball
2nd Bond (wedge)
5
3.0 STANDOFF BALL CONTROL BONDING SEQUENCE
3.1) Free Air Ball (FAB 2)is aligned to the center of the bond pad on device 2.
Range : Tail Length Setting : 35
30 ~ 40
18
4.6) Time Base 1/2
This setting controls the bond time applied to the standoff ball control only. Time 1 for the 1st bond and Time 2 for the 2nd bond.