Test-tube baby
试管婴儿简介
试管婴儿试管婴儿就是采用人工方法让卵细胞和精子在体外受精，并进行早期胚胎发育，然后移植到母体子宫内发育而诞生的婴儿。
不可否认试管婴儿技术是医学界的一个奇迹，这个奇迹给无法生育的人提供了一种繁衍后代的方法，更开辟了医学界的新领域。
今天体外受精已作为一项常规技术为许多不孕家庭带来了欢乐，至今世界上已有上百万试管婴儿诞生。
然而30年前医学技术没有如此精湛，由于身体的种种原因，渴望做父母的夫妻一直不能如愿以偿。
随着生物科学和医学技术的发展，对于这样的夫妇来说，生育可爱的宝宝已经不再是一个难题，他们可以借助试管婴儿技术，圆他们成为父母的梦！试管婴儿并不是真正在试管里长大的婴儿，而是一种医学技术，即体外受精联合胚胎移植技术(in vitro fertilization and embryo transfer，IVF-ET），是指分别将卵子与精子取出后，置于试管内使其受精，再将胚胎前体——受精卵移植回母体子宫内，并在子宫着床，发育成胎儿。
试管婴儿就是采用人工方法让卵细胞和精子在体外受精，并进行早期胚胎发育，然后移植到母体子宫内发育而诞生的婴儿。
所以“试管婴儿”可以简单地理解成由实验室的试管代替了输卵管的功能。
目前试管婴儿技术主要经历了三代，第一代技术是1978年爱德华兹和斯特普托实施成功的，主要解决女性受孕生子的问题。
第二代技术是1992年由比利时Palermo医师及刘家恩博士首次在人体成功应用了卵浆内单精子注射技术。
该技术不仅提高了试管婴儿成功率，而且使试管婴儿适应症扩大。
随着分子生物学的发展，胚胎着床前遗传病诊断开始发展并用于临床。
胚胎着床前遗传病诊断被称为第三代试管婴儿技术。
第三代技术从生物遗传学的角度，帮助人类选择生育最健康的后代。
体外受精研究先驱——张民觉精子获能的发现是人们最终实现体外受精的基础。
20世纪50年代前，人们一直无法实现体外受精。
直到1950年，美藉华人生物学家张民觉先生进行了开拓性研究，他成功揭开了精子获能现象的奥秘。
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V500DJ4-QS1+Approval+SPEC+V0_0_M1_20150514_1
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PRODUCT SPECIFICATION
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MODEL NO.: V500DJ4 SUFFIX: QS1
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5. INPUT TERMINAL PIN ASSIGNMENT .................................................................................................................... 12 5.1 TFT LCD OPEN CELL ....................................................................................................................................... 12 5.3 FLICKER (Vcom) ADJUSTMENT ..................................................................................................................... 17 5.2 COLOR DATA INUT ASSIGNMENT.................................................................................................................. 16
BCA蛋白定量试剂盒(Thermo)使用指南
INSTRUCTIONSPierce® BCA Protein Assay Kit23225 Pierce BCA Protein Assay Kit, sufficient reagents for 500 test-tube or 5000 microplate assays 23227 Pierce BCA Protein Assay Kit, sufficient reagents for 250 test-tube or 2500 microplate assays Kit Contents:BCA Reagent A, 1000mL (in Product No. 23225) or 500mL (in Product No. 23227), containingsodium carbonate, sodium bicarbonate, bicinchoninic acid and sodium tartrate in 0.1M sodiumhydroxideBCA Reagent B, 25mL, containing 4% cupric sulfateAlbumin Standard Ampules, 2mg/mL, 10 × 1mL ampules, containing bovine serum albumin (BSA)at 2mg/mL in 0.9% saline and 0.05% sodium azideStorage: Upon receipt store at room temperature. Product shipped at ambient temperature.Note: If either Reagent A or Reagent B precipitates upon shipping in cold weather or during long-termstorage, dissolve precipitates by gently warming and stirring solution. Discard any kit reagent thatshows discoloration or evidence of microbial contamination.Table of ContentsIntroduction (1)Preparation of Standards and Working Reagent (required for both assay procedures) (2)Test Tube Procedure (Sample to WR ratio = 1:20) (3)Microplate Procedure (Sample to WR ratio = 1:8) (3)Troubleshooting (4)Related Thermo Scientific Products (5)Additional Information (5)References (6)IntroductionThe Thermo Scientific Pierce BCA Protein Assay is a detergent-compatible formulation based on bicinchoninic acid (BCA) for the colorimetric detection and quantitation of total protein. This method combines the well-known reduction of Cu+2 to Cu+1 by protein in an alkaline medium (the biuret reaction) with the highly sensitive and selective colorimetric detection of the cuprous cation (Cu+1) using a unique reagent containing bicinchoninic acid.1 The purple-colored reaction product of this assay is formed by the chelation of two molecules of BCA with one cuprous ion. This water-soluble complex exhibits a strong absorbance at 562nm that is nearly linear with increasing protein concentrations over a broad working range (20-2000µg/mL). The BCA method is not a true end-point method; that is, the final color continues to develop. However, following incubation, the rate of continued color development is sufficiently slow to allow large numbers of samples to be assayed together.The macromolecular structure of protein, the number of peptide bonds and the presence of four particular amino acids (cysteine, cystine, tryptophan and tyrosine) are reported to be responsible for color formation with BCA.2 Studies with di-, tri- and tetrapeptides suggest that the extent of color formation caused by more than the mere sum of individual color-producing functional groups.2 Accordingly, protein concentrations generally are determined and reported with reference to standards of a common protein such as bovine serum albumin (BSA). A series of dilutions of known concentration are prepared from the protein and assayed alongside the unknown(s) before the concentration of each unknown is determined based on the standard curve. If precise quantitation of an unknown protein is required, it is advisable to select a proteinstandard that is similar in quality to the unknown; for example, a bovine gamma globulin (BGG) standard (see Related Thermo Scientific Products) may be used when assaying immunoglobulin samples.Two assay procedures are presented. Of these, the Test Tube Procedure requires a larger volume (0.1mL) of protein sample; however, because it uses a sample to working reagent ratio of 1:20 (v/v), the effect of interfering substances is minimized. The Microplate Procedure affords the sample handling ease of a microplate and requires a smaller volume (10-25µL) of protein sample; however, because the sample to working reagent ratio is 1:8 (v/v), it offers less flexibility in overcoming interfering substance concentrations and obtaining low levels of detection.Preparation of Standards and Working Reagent (required for both assay procedures) A.Preparation of Diluted Albumin (BSA) StandardsUse Table 1 as a guide to prepare a set of protein standards. Dilute the contents of one Albumin Standard (BSA) ampule into several clean vials, preferably using the same diluent as the sample(s). Each 1mL ampule of 2mg/mL Albumin Standard is sufficient to prepare a set of diluted standards for either working range suggested in Table 1. There will be sufficient volume for three replications of each diluted standard.Table 1. Preparation of Diluted Albumin (BSA) StandardsVial Volume of Diluent(µL)Volume and Source of BSA(µL)Final BSA Concentration(µg/mL)A 0 300 of Stock 2000B 125 375 of Stock 1500C 325 325 of Stock 1000D 175 175 of vial B dilution 750E 325 325 of vial C dilution 500F 325 325 of vial E dilution 250G 325 325 of vial F dilution 125H 400 100 of vial G dilution 25I 400 0 0 = BlankVial Volume of Diluent(µL)Volume and Source of BSA(µL)Final BSA Concentration(µg/mL)A 700 100 of Stock 250B 400 400 of vial A dilution 125C 450 300 of vial B dilution 50D 400 400 of vial C dilution 25E 400 100 of vial D dilution 5F 400 0 0 = BlankB.Preparation of the BCA Working Reagent (WR)e the following formula to determine the total volume of WR required:(# standards + # unknowns) × (# replicates) × (volume of WR per sample) = total volume WR required Example: for the standard test-tube procedure with 3 unknowns and 2 replicates of each sample:(9 standards + 3 unknowns) × (2 replicates) × (2mL) = 48mL WR requiredNote: 2.0mL of the WR is required for each sample in the test-tube procedure, while only 200 µl of WR reagent is required for each sample in the microplate procedure.2.Prepare WR by mixing 50 parts of BCA Reagent A with 1 part of BCA Reagent B (50:1, Reagent A:B). For the aboveexample, combine 50mL of Reagent A with 1mL of Reagent B.Note: When Reagent B is first added to Reagent A, turbidity is observed that quickly disappears upon mixing to yield a clear, green WR. Prepare sufficient volume of WR based on the number of samples to be assayed. The WR is stable for several days when stored in a closed container at room temperature (RT).Procedure Summary (Test-tube Procedure, Standard Protocol)Test-tube Procedure (Sample to WR ratio = 1:20)1.Pipette 0.1mL of each standard and unknown sample replicate into an appropriately labeled test tube.2.Add 2.0mL of the WR to each tube and mix well.3.Cover and incubate tubes at selected temperature and time:•Standard Protocol: 37°C for 30 minutes (working range = 20-2000µg/mL)•RT Protocol: RT for 2 hours (working range = 20-2000µg/mL)•Enhanced Protocol: 60°C for 30 minutes (working range = 5-250µg/mL)Notes:•Increasing the incubation time or temperature increases the net 562nm absorbance for each test and decreases both the minimum detection level of the reagent and the working range of the protocol.•Use a water bath to heat tubes for either Standard (37°C incubation) or Enhanced (60°C incubation) Protocol. Usinga forced-air incubator can introduce significant error in color development because of uneven heat transfer.4.Cool all tubes to RT.5.With the spectrophotometer set to 562nm, zero the instrument on a cuvette filled only with water. Subsequently, measurethe absorbance of all the samples within 10 minutes.Note: Because the BCA assay does not reach a true end point, color development will continue even after cooling to RT.However, because the rate of color development is low at RT, no significant error will be introduced if the 562nm absorbance measurements of all tubes are made within 10 minutes of each other.6.Subtract the average 562nm absorbance measurement of the Blank standard replicates from the 562nm absorbancemeasurement of all other individual standard and unknown sample replicates.7.Prepare a standard curve by plotting the average Blank-corrected 562nm measurement for each BSA standard vs. itsconcentration in µg/mL. Use the standard curve to determine the protein concentration of each unknown sample. Microplate Procedure (Sample to WR ratio = 1:8)1.Pipette 25µL of each standard or unknown sample replicate into a microplate well (working range = 20-2000µg/mL).Note: If sample size is limited, 10µL of each unknown sample and standard can be used (sample to WR ratio = 1:20).However, the working range of the assay in this case will be limited to 125-2000µg/mL.2.Add 200µL of the WR to each well and mix plate thoroughly on a plate shaker for 30 seconds.3.Cover plate and incubate at 37°C for 30 minutes.4.Cool plate to RT. Measure the absorbance at or near 562nm on a plate reader.Notes:•Wavelengths from 540-590nm have been used successfully with this method.•Because plate readers use a shorter light path length than cuvette spectrophotometers, the Microplate Procedure requires a greater sample to WR ratio to obtain the same sensitivity as the standard Test Tube Procedure. If higher 562nm measurements are desired, increase the incubation time to 2 hours.•Increasing the incubation time or ratio of sample volume to WR increases the net 562nm measurement for each well and lowers both the minimum detection level of the reagent and the working range of the assay. As long as allstandards and unknowns are treated identically, such modifications may be useful.5.Subtract the average 562nm absorbance measurement of the Blank standard replicates from the 562nm measurements ofall other individual standard and unknown sample replicates.6.Prepare a standard curve by plotting the average Blank-corrected 562nm measurement for each BSA standard vs. itsconcentration in µg/mL. Use the standard curve to determine the protein concentration of each unknown sample.Note: If using curve-fitting algorithms associated with a microplate reader, a four-parameter (quadratic) or best-fit curve will provide more accurate results than a purely linear fit. If plotting results by hand, a point-to-point curve is preferable to a linear fit to the standard points.A.Interfering substancesCertain substances are known to interfere with the BCA assay including those with reducing potential, chelating agents, and strong acids or bases. Because they are known to interfere with protein estimation at even minute concentrations, avoid the following substances as components of the sample buffer:Ascorbic Acid EGTA Iron Impure SucroseCatecholamines Impure Glycerol Lipids TryptophanCreatinine Hydrogen Peroxide Melibiose TyrosineCysteine Hydrazides Phenol Red Uric AcidOther substances interfere to a lesser extent with protein estimation using the BCA assay, and these have only minor (tolerable) effects below a certain concentration in the original sample. Maximum compatible concentrations for many substances in the Standard Test Tube Protocol are listed in Table 2 (see last page of Instructions). Substances were compatible at the indicated concentration in the Standard Test Tube Protocol if the error in protein concentration estimation caused by the presence of the substance was less than or equal to 10%. The substances were tested using WR prepared immediately before each experiment. Blank-corrected 562nm absorbance measurements (for a 1000µg/mL BSA standard + substance) were compared to the net 562nm measurements of the same standard prepared in 0.9% saline. Maximum compatible concentrations will be lower In the Microplate Procedure where the sample to WR ratio is 1:8 (v/v). Furthermore, it is possible to have a substance additive affect such that even though a single component is present at a concentration below its listed compatibility, a sample buffer containing a combination of substances could interfere with the assay.B.Strategies for eliminating or minimizing the effects of interfering substancesThe effects of interfering substances in the Pierce BCA Protein Assay may be eliminated or overcome by one of several methods. •Remove the interfering substance by dialysis or gel filtration.•Dilute the sample until the substance no longer interferes. This strategy is effective only if the starting protein concentration is sufficient to remain in the working range of the assay upon dilution.•Precipitate the proteins in the sample with acetone or trichloroacetic acid (TCA). The liquid containing the substance that interfered is discarded and the protein pellet is easily solubilized in ultrapure water or directly in the alkaline BCA WR.4A protocol detailing this procedure is available from our website. Alternatively, Product No. 23215 may be used (seeRelated Pierce Products).•Increase the amount of copper in the WR (prepare WR as 50:2 or 50:3, Reagent A:B), which may eliminate interference by copper-chelating agents.Note: For greatest accuracy, the protein standards must be treated identically to the sample(s).Related Thermo Scientific Products15041 Pierce 96-Well Plates, 100/pkg.15075 Reagent Reservoirs, 200/pkg.15036 Sealing Tape for 96-Well Plates, 100/pkg.23209 Albumin Standard Ampules, 2mg/mL, 10 × 1mL ampules, containing bovine serum albumin (BSA) 23208 Pre-Diluted Protein Assay Standards: Bovine Serum Albumin (BSA) Set, 7 × 3.5mL23212 Bovine Gamma Globulin Standard, 2mg/mL, 10 × 1mL ampules23213 Pre-Diluted Protein Assay Standards, (BGG) Set, 7 × 3.5mL aliquots23235 Pierce Micro BCA Protein Assay Kit, working range of 0.5-20µg/mL23236 Coomassie Plus (Bradford) Assay Kit, working range of 1-1500µg/mL23215 Compat-Able™ Protein Assay Preparation Reagent Set23250Pierce BCA Protein Assay Kit−Reducing Agent CompatibleAdditional InformationA.Please visit our website for additional information including the following items:•Frequently Asked Questions•Tech Tip protocol: Eliminate interfering substances from samples for BCA Protein AssayB.Alternative Total Protein Assay ReagentsIf interference by a reducing substance or metal-chelating substance contained in the sample cannot be overcome, try the Thermo Scientific Coomassie Plus (Bradford) Assay Kit (Product No. 23236), which is less sensitive to such substances.C.Cleaning and Re-using GlasswareExercise care when re-using glassware. All glassware must be cleaned and given a thorough final rinse with ultrapure water.D.Response characteristics for different proteinsEach of the commonly used total protein assay methods exhibits some degree of varying response toward different proteins. These differences relate to amino acid sequence, pI, structure and the presence of certain side chains or prosthetic groups that can dramatically alter the protein’s color response. Most protein assay methods use BSA or immunoglobulin (IgG) as the standard against which the concentration of protein in the sample is determined (Figure 1). However, if great accuracy is required, prepare the standard curve from a pure sample of the target protein.Typical protein-to-protein variation in color response is listed in Table 3. All proteins were tested at 1000µg/mL using the 30-minute/37°C Test Tube Protocol. The average net color response for BSA was normalized to 1.00 and the average net color response of the other proteins is expressed as a ratio to the response of BSA.Figure 1: Typical color response curves for BSA and BGG using the Standard Test Tube Protocol (37°C/30-minute incubation). Table 3. Protein-to-protein variation. Absorbance ratios (562nm) for proteins relative to BSA using Protein Tested Ratio Albumin, bovine serum 1.00 Aldolase, rabbit muscle 0.85 α-Chymotrypsinogen, bovine 1.14 Cytochrome C, horse heart 0.83 Gamma globulin, bovine1.11 IgG, bovine 1.21 IgG, human 1.09 IgG, mouse 1.18 IgG, rabbit 1.12 IgG, sheep1.17 Insulin, bovine pancreas 1.08 Myoglobin, horse heart0.74 Ovalbumin 0.93 Transferrin, human 0.891.02 Standard Deviation 0.15Coefficient of Variation14.7%Cited References1. Smith, P.K., et al. (1985). Measurement of protein using bicinchoninic acid. Anal. Biochem . 150:76-85.2. Wiechelman, K., et al. (1988). Investigation of the bicinchoninic acid protein assay: Identification of the groups responsible for color formation. Anal Biochem . 175:231-7.3. Kessler, R. and Fanestil, D. (1986). Interference by lipids in the determination of protein using bicinchoninic acid. Anal. Biochem . 159:138-42.4.Brown, R., et al. (1989). Protein measurement using bicinchoninic acid: elimination of interfering substances. Anal. Biochem . 180:136-9.Product ReferencesAdilakshami, T. and Laine, R.O. (2002). Ribosomal protein S25 mRNA partners with MTF-1 and La to provide a p53-mediated mechanism for survival ordeath. J. Biol. Chem. 277:4147-51.Fischer, T., et al. (1999). Clathrin-coated vesicles bearing GAIP possess GTPase-activating protein activity in vitro. Proc. Nat. Acad. Sci. 96:6722-7. Prozialeck, W.C., et al. (2002). Chlamydia trachomatis disrupts N-cadherin-dependent cell-cell junctions and sequester β-catenin in human cervicalepithelial cells. Infection and Immunity 70:2605-13.Roberts, K.P., et al. (2002). A comparative analysis of expression and processing of the rat epididymal fluid and sperm-bound forms of proteins D and E.Biology of Reproduction 67:525-33.Triton ® is a registered trademark of Rohm & Haas Co.Brij ®, Tween ® and Span ® are registered trademarks of ICI Americas. Zwittergent ® is a registered trademark of American Hoechst Corporation.This product (“Product”) is warranted to operate or perform substantially in conformance with published Product specifications in effect at the time of sale, as set forth in the Product documentation, specifications and/or accompanying package inserts (“Documentation”) and to be free from defects in material and workmanship. Unless otherwise expressly authorized in writing, Products are supplied for research use only. No claim of suitability for use in applications regulated by FDA is made. The warranty provided herein is valid only when used by properly trained individuals. Unless otherwise stated in the Documentation, this warranty is limited to one year from date of shipment when the Product is subjected to normal, proper and intended usage. This warranty does not extend to anyone other than the original purchaser of the Product (“Buyer”).No other warranties, express or implied, are granted, including without limitation, implied warranties of merchantability, fitness for any particular purpose, or non infringement. Buyer’s exclusive remedy for non-conforming Products during the warranty period is limited to replacement of or refund for the non-conforming Product(s).There is no obligation to replace Products as the result of (i) accident, disaster or event of force majeure, (ii) misuse, fault or negligence of or by Buyer, (iii) use of the Products in a manner for which they were not designed, or (iv) improper storage and handling of the Products.Current product instructions are available at /pierce . For a faxed copy, call 800-874-3723 or contact your local distributor. © 2011 Thermo Fisher Scientific Inc. All rights reserved. Unless otherwise indicated, all trademarks are property of Thermo Fisher Scientific Inc. and its subsidiaries. Printed in the USA.Table 2. Compatible substance concentrations in the BCA Protein Assay (see text for details).§* Diluted with ultrapure water.** Detergents were tested using high-purity Thremo Scientific Surfact-Amps Products, which have low peroxide content.-- Dashed-line entry indicates that the material is incompatible with the assay.§ For a more extensive list of substances, download Tech Tip # 68: Protein Assay Compatibility Table from our website. This Tech Tip includes compatible substances for all of our protein assays and enables easy comparisons.。
全国通用2024高考英语一轮复习Unit2练习牛津译林版必修3
必修三 Unit 2 单元话题语篇训练（每单元3练）练(一) 阅读理解组块专练——练速度(限时：35分钟)Ⅰ.阅读理解A(2024·石家庄模拟)International Competitions in 2024A．Creating the story in English.B．Having the work scanned.C．Paying money for the entry.D．Submitting the work by July.解析：选A 细微环节理解题。
依据The H．G.Wells Short Story Competition部分中的“Entries must be in English and must be entirely your own work”可知，写故事竞赛要求参赛者的作品是用英语写的原创作品，故选A。
2．What is special about “16th Annual Smithsonian Photo Contest”？A．It gives a theme. B．It offers a grand prize.C．It has an age limit. D．It has two categories.解析：选C 细微环节理解题。
依据16th Annual Smithsonian Photo Contest部分中的“Who may enter: Open to photographers who are 18 years old or older”并结合其他三个竞赛的“Who may enter”的信息可知，这个竞赛对参赛者的年龄有肯定的限制，故选C。
3．Who may get Margaret Reid Prize after winning the contest?A．Short story writers. B．Photographers.C．Art designers. D．Poem writers.解析：选D 推理推断题。
试管婴儿-PPT(精)PPT
什么是试管婴儿？试管婴儿真的是在试管中长大的 吗？
• 试管婴儿是体外受精—胚胎移 植技术(IVF-ET)的一种通俗说法 。试管婴儿并不是真的在试管 里长大的婴儿。试管婴儿是从 女方的卵巢内取出卵母细胞， 在实验室里让它们与男方的精 子自然结合，形成胚胎，然后 将胚胎转移到妈妈的子宫内， 使之着床、妊娠的一种人类辅 助生殖技术。
试管婴儿〔Test tube baby〕 〔Test tube baby〕
2021/5/16
1
试管婴儿出现的原因？
• WHO调查显示不孕症患病 率为15%左右，1995年调 查显示全世界有60000万 到80000万不孕患者
2021/5/16
“人生最重要的事情是有一个孩子， 世上有什么比孩子更2 特别的呢？”
•试管婴儿的先天性缺陷比普 通婴儿高
•试管婴儿引发的伦理道德危 机
•高科技并不能解决所有的生 育问题
•试管婴儿的成功率低
2021/5/16
15
谢谢！
2021/5/16
16
杨培丹，2021021019 董陈娣，2021021028 徐林新，2021021113
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17
2021/5/16
10
第一代试管婴儿是指将患者的卵子和精子在培养皿内混合让卵子受精， 然后将受精卵在体外培养所产生的胚胎移植到患者子宫内的一种 辅助生殖技术。
•
2021/5/16
致解第 的决一 不的代 孕是试
因管 女婴 性儿 因技 素术 引，
11
1992年由比利时Palermo医师及刘家恩博士等首次在人体成功应用卵浆内单精子 注射〔ICSI〕，使试管婴儿技术的成功率得到很大的提高
2021/5/16
NEMA TS2
TS 2-2003 v02.06 Page i
CONTENTS
................................................................................................................................................xv Scope ..........................................................................................................................................................xvi History .........................................................................................................................................................xix TS 2-1998 Update.......................................................................................................................................xxi TS 2-2003 Update........................................................................................................................
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IEC 61215-edition 3 Draft I (Nov 2011)
CONTENTS FOREWORD (4)1Scope and object (6)2Normative references (6)3Sampling (7)4Marking (7)5Testing (8)6Pass criteria (8)7Major visual defects (9)8Report (9)9Modifications (12)10Test procedures (16)10.1Visual inspection (16)10.2Maximum power determination (16)10.3Insulation test (17)10.4Measurement of temperature coefficients (18)10.5Measurement of nominal module operating temperature(NMOT) (18)10.6Performance at STC and NMOT (19)10.7Performance at low irradiance (20)10.8Outdoor exposure test (21)10.9Hot-spot endurance test (22)10.10UV preconditioning test (25)10.11Thermal cycling test (26)10.12Humidity-freeze test (28)10.13Damp-heat test (29)10.14Robustness of terminations test (30)10.15Wet leakage current test (33)10.16Mechanical load test (34)10.17Hail test (35)10.18Bypass diode thermal test (38)Figure1−Qualification test sequence (10)Figure2-Module I-V characteristics with different cells totally shadowed (22)Figure3-Case SP:series-parallel connection (23)Figure4-Module I-V characteristics with the test cell shadowed at different levels (25)Figure5-Thermal cycling test (27)Figure6-Humidity-freeze cycle (29)Figure7–Typical arrangement for cable anchorage pull test (31)Figure8–Typical arrangement for torsion test (32)Figure9–Hail-test equipment (36)Figure10-Impact locations illustrated (38)Figure11-Bypass Diode Thermal Test (40)Table1–Summary of test levels (11)Table2-Pull forces for cord anchorage test (31)Table3-Values for Torsion Test (32)Table4–Ice-ball masses and test velocities (37)Table5–Impact locations (37)INTERNATIONAL ELECTROTECHNICAL COMMISSION________CRYSTALLINE SILICON TERRESTRIALPHOTOVOLTAIC(PV)MODULES-DESIGN QUALIFICATION AND TYPE APPROVALFOREWORD1)The IEC(International Electrotechnical Commission)is a worldwide organization for standardization comprisingall national electrotechnical committees(IEC National Committees).The object of the IEC is to promote international co-operation on all questions concerning standardization in the electrical and electronic fields.To this end and in addition to other activities,the IEC publishes International Standards.Their preparation is entrusted to technical committees;any IEC National Committee interested in the subject dealt with may participate in this preparatory work.International,governmental and non-governmental organizations liaising with the IEC also participate in this preparation.The IEC collaborates closely with the International Organization for Standardization(ISO)in accordance with conditions determined by agreement between the two organizations.2)The formal decisions or agreements of the IEC on technical matters express,as nearly as possible,aninternational consensus of opinion on the relevant subjects since each technical committee has representation from all interested National Committees.3)The documents produced have the form of recommendations for international use and are published in the formof standards,technical specifications,technical reports or guides and they are accepted by the National Committees in that sense.4)In order to promote international unification,IEC National Committees undertake to apply IEC InternationalStandards transparently to the maximum extent possible in their national and regional standards.Any divergence between the IEC Standard and the corresponding national or regional standard shall be clearly indicated in the latter.1)The IEC provides no marking procedure to indicate its approval and cannot be rendered responsible for anyequipment declared to be in conformity with one of its standards.2)Attention is drawn to the possibility that some of the elements of this International Standard may be the subjectof patent rights.The IEC shall not be held responsible for identifying any or all such patent rights. International Standard IEC61215has been prepared by IEC technical committee82:Solar photovoltaic energy systems.This third edition cancels and replaces the second edition published in2005and constitutes a technical revision.This edition includes the following significant technical changes with respect to the previous edition:a)Maximum power at STC has been made a pass/fail criteria.b)Added retest guidelines.c)Completely changed the hot spot test.d)Update the other tests to be consistent with changes in IEC61646.e)Removed the method for measuring temperature coefficients and refer to IEC60891.f)Renamed NOCT as NMOT and referenced IEC61853-2for the test procedure.g)Rewrote the Robustness of termination test to include evaluation of both cables andjunction boxes.FDIS Report on voting82/XXX/FDIS8s/XXX/RVDFull information on the voting for the approval of this standard can be found in the report on voting indicated in the above table.This publication has been drafted in accordance with the ISO/IEC Directives,Part2.The committee has decided that the contents of the publication will remain unchanged until 2018.At this date the publication will be-reconfirmed;-withdrawn;-replaced by a revised edition;or-amended.CRYSTALLINE SILICON TERRESTRIALPHOTOVOLTAIC(PV)MODULES–DESIGN QUALIFICATION AND TYPE APPROVAL1Scope and objectThis International Standard lays down IEC requirements for the design qualification and type approval of terrestrial photovoltaic modules suitable for long-term operation in general open-air climates,as defined in IEC60721-2-1.It applies only to crystalline silicon modules types.A standard for thin-film modules has been published as IEC61646.This standard does not apply to modules used with concentrated sunlight although it may be utilized for low concentrator modules(1to3suns)that use diffuse light.For low concentration modules,all tests must be performed using the current,voltage and power levels expected at the design concentration.The object of this test sequence is to determine the electrical and thermal characteristics of the module and to show,as far as is possible within reasonable constraints of cost and time, that the module is capable of withstanding prolonged exposure in climates described in the scope.The actual lifetime expectancy of modules so qualified will depend on their design, their environment and the conditions under which they are operated.2Normative referencesThe following referenced documents are indispensable for the application of this document. For dated references,only the edition cited applies.For undated references,the latest edition of the referenced document(including any amendments)applies.IEC60068-1:Environmental testing–Part1:General and guidanceIEC60068-2-78:Environmental testing–Part2-78:Tests–Test Cab:Damp heat,steady stateIEC60068-2-21:Environmental testing–Part2-21:Tests–Test U:Robustness of termin ations and integral mounting devicesIEC60410:Sampling plans and procedures for inspection by attributesIEC60721-2-1:Classification of environmental conditions–Part2:Environmental conditions appearing in nature–Temperature and humidityIEC60891:Photovoltaic devices-Procedures for temperature and irradiance corrections to measured I-V characteristicsIEC60904-1:Photovoltaic devices–Part1:Measurements of photovoltaic current-voltage characteristicsIEC60904-2:Photovoltaic devices–Part2:Requirements for reference solar devicesIEC60904-3:Photovoltaic devices–Part3:Measurement principles for terrestrial photovoltaic(PV)solar devices with reference spectral irradiance dataIEC60904-7:Photovoltaic devices–Part7:Computation of spectral mismatch error introduced in the testing of a photovoltaic deviceIEC60904-9:Photovoltaic devices–Part9:Solar simulator performance requirementsIEC60904-10:Photovoltaic devices–Part10:Methods of linearity measurementIEC61853-1,Photovoltaic(PV)module performance testing and energy rating–Part1: Irradiance and temperature performance measurements and power ratingIEC61853-2,Photovoltaic(PV)module performance testing and energy rating–Part2: Spectral response,incidence angle,and module operating temperature measurements1ISO/IEC17025:General requirements for the competence of testing and calibration laboratories3SamplingEight modules for qualification testing(plus spares as desired)shall be taken at random from a production batch or batches,in accordance with the procedure given in IEC60410.The modules shall have been manufactured from specified materials and components in accordance with the relevant drawings and process sheets and have been subjected to the manufacturer's normal inspection,quality control and production acceptance pro cedures. The modules shall be complete in every detail and shall be accompanied by the manufacturer's handling,mounting and connection instructions,including the maximum permissible system voltage.If the bypass diodes are not accessible in the standard modules,a special sample can be prepared for the bypass diode thermal test(10.18).The bypass diode should be mounted physically as it would be in a standard module.This sample does not have to go through the other tests in the sequence depicted in Figure1.When the modules to be tested are prototypes of a new design and not from production,this fact shall be noted in the test report(see Clause8).4MarkingEach module shall carry the following clear and indelible markings:–name,monogram or symbol of manufacturer;–type or model number;–serial number;–polarity of terminals or leads(colour coding is permissible);–maximum system voltage for which the module is suitable.–nominal and minimum values of maximum output power at STC after preconditioning,as specified by the manufacturer for the product type(Clause5)1Under considerationThe date and place of manufacture shall be marked on the module or be traceable from the serial number.Note:If the modules to be tested are prototypes of a new design and not from production,the results of this test sequence may be used to establish the module power rating.5TestingBefore beginning the testing,all modules including the control shall be exposed to sunlight (either real or simulated)to an irradiation level of5kWh×m-2to20kWh×m-2while open-circuited to stabilize the performance.After this preconditioning all of the test modules shall be measured for STC power.(10.2)The modules shall be divided into groups and subjected to the qualification test sequences in Figure1,carried out in the order laid down.Each box refers to the corresponding subclause in this standard.Test procedures and severities,including initial and final measurements where necessary,are detailed in Clause10.NOTE Where the final measurements for one test serve as the initial measurements for the next test in the sequence,they need not be repeated.In these cases,the initial measurements are omitted from the test.In carrying out the tests,the tester shall strictly observe the manufacturer's handling, mounting and connection instructions.The order of tests in the“electrical and thermal performance sequence”are not important although tests10.4,10.5and10.6must be performed before the subsequent stress tests10.8,10.18and10.9.If desired separate modules may be utilized for10.8,10.18and10.9.Test conditions are summarized in Table1.The test levels in Table1are the minimum levels required for qualification.If the laboratory and the module manufacturer agree,the tests may be performed with increased severities.If so this shall be noted in the Test Report.6Pass criteriaA module design shall be judged to have passed the qualification tests and therefore to be IEC type-approved,if each test sample meets all the following criteria:a)The STC power measured in10.2shall meet the manufacturer’s power rating range afterpreconditioning.NOTE:The pass/fail criteria must consider the laboratory uncertainty of the measurement.As an example if the laboratory extended uncertainty at2sigma of the STC measurement is±5%,then a maximum power measurement greater than or equal to95,2%of the minimum specified value would be the pass criteria.b)the degradation of maximum output power does not exceed the prescribed limit after eachtest nor8%after each test sequence;c)no sample has exhibited any open circuit during the tests;d)there is no visual evidence of a major defect,as defined in Clause7;e)the insulation test requirements are met after the tests;f)the wet leakage current test requirements are met at the beginning and the end of eachsequence and after the damp heat test;g)specific requirements of the individual tests are met.If two or more modules do not meet these test criteria,the design shall be deemed not to have met the qualification requirements.Should one module fail any test,another two modules meeting the requirements of Clause3shall be subjected to the whole of the relevant test sequence from the beginning.If one or both of these modules also fail,the design shallbe deemed not to have met the qualification requirements.If,however,both modules pass the test sequence,the design shall be judged to have met the qualifi cation requirements.7Major visual defectsFor the purposes of design qualification and type approval,the following are considered to be major visual defects:a)broken,cracked,bent,misaligned or torn external surfaces,including superstrates,substrates,frames and junction boxes;b)bubbles or delaminations forming a continuous path between any part of the elec tricalcircuit and the edge of the module;c)loss of mechanical integrity,to the extent that the installation and/or operation of themodule would be impaired.8ReportFollowing type approval,a certified report of the qualification tests,with measured performance characteristics and details of any failures and re-tests,shall be prepared by the test agency in accordance with ISO/IEC17025.The report shall contain the detail specification for the module.Each certificate or test report shall include at least the following information:a)a title;b)name and address of the test laboratory and location where the tests were carried out;c)unique identification of the certification or report and of each page;d)name and address of client,where appropriate;e)description and identification of the item tested;f)characterization and condition of the test item;g)date of receipt of test item and date(s)of test,where appropriate;h)identification of test method used;i)reference to sampling procedure,where relevant;j)any deviations from,additions to,or exclusions from,the test method and any other information relevant to a specific tests,such as environmental conditions;k)measurements,examinations and derived results supported by tables,graphs,sketches and photographs as appropriate including temperature coefficients of short-circuit current, open-circuit voltage and peak power,NMOT,power at NMOT,STC and low irradiance, spectrum of the lamp used for the UV preconditioning test,mounting method(s)utilized in the mechanical load test and for measurement of NMOT,maximum power loss observed after all of the tests,and any failures observed;l)a statement of the estimated uncertainty of the test results(where relevant);m)a signature and title,or equivalent identification of the person(s)accepting responsibility for the content of the certificate or report,and the date of issue;n)where relevant,a statement to the effect that the results relate only to the items tested;o)a statement that the certificate or report shall not be reproduced except in full,without the written approval of the laboratory.A copy of this report shall be kept by the manufacturer for reference purposes.Table1–Summary of test levelsTest Title Test conditions10.1Visual inspection See detailed inspection list in10.1.210.2Maximum power determination See IEC60904-110.3Insulation test Dielectric withstand at1000V d.c.+twice the maximum systemsvoltage for1minFor modules with an area of less than0,1m2,the insulationresistance shall not be less than400MΩ.For modules with anarea larger than0,1m2the measured insulation resistancetimes the area of the module shall not be less than40MΩ×m2measured at500V or maximum systems voltage,whichever isgreater10.4Measurement of temperaturecoefficients(see note1)See IEC60891See IEC60904-10for guidance10.5Measurement of NMOT See IEC61853-2Module operating near peak power pointTotal solar irradiance:800W×m–2Ambient temperature:20°CWind speed:1m×s–110.6Performance at STC and NMOT(s ee note1)Cell temperature:25°C and NMOTIrradiance:1000and800W×m–2with IEC60904-3reference solar spectral irradiance distribution10.7Performance at low irradiance(s ee note1)Cell temperature:25°CIrradiance:200W×m–2with IEC60904-3reference solar spectral irradiance distribution10.8Outdoor exposure test60kWh×m–2total solar irradiance10.9Hot-spot endurance test Three lowest shunt resistance cells exposed to1000W×m–2irradiance in worst-case hot-spot condition for1hour eachOne highest shunt resistance cell exposed for5hours to1000W×m–2irradiance in worst-case hot-spot condition10.10UV Preconditioning15kWh×m-2total UV irradiance in the wavelength range from280nm to400nm with3to10%UV irradiance in the wavelengthrange from280to320nm10.11Thermal cycling test50and200cycles from–40°C to+85°C with STC peak powercurrent during200cycles10.12Humidity-freeze test10cycles from+85°C,85%RH to–40°CWith circuitry continuity monitoring10.13Damp-heat test1000h at+85°C,85%RH10.14Robustness of termination test Test of cable anchorage and junction box adhesion.See details in10.14.10.15Wet leakage current test See details in10.15For modules with an area of less than0,1m2the insulationresistance shall not be less than400MΩ.For modules with anarea larger than0,1m2the measured insulation resistancetimes the area of the module shall not be less than40MΩ×m2,to be measured at500V or maximum systems voltage,whichever is greater10.16Mechanical load test Three cycles of2400Pa uniform load,applied for1h to frontand back surfaces in turnOptional snow load of5400Pa during last front cycle10.17Hail test25mm diameter ice ball at23,0m×s–1,directed at11impactlocations10.18Bypass diode thermal test One hour at I sc and75°COne hour at1,25times I sc and75°CNOTE1 These tests may be omitted if IEC61853has been performed on this module type.9ModificationsChanges in material selection,components and manufacturing process can impact the qualification of the modified product.Material in direct contact with each other shall be tested in all applicable combinations unless equality can be proven.The recommended test sequences given below have been selected to identify adverse changes to the modified product.The number of samples to be included in the retesting program and the pass/fail criteria are to be taken from the relevant sections of this standard.For the modifications listed below,the re-test programme shall be used as a guideline to maintain product certification.Each test shall meet the individual pass criteria.Note:Tests10.1,10.2,10.3and10.15shall be performed before and after the specific tests listed below.a)Change in cell technologyFor modifications such as:*metallization material composition and/or process,*Metallization width and/or height change by more than20%,*anti-reflective coating material,*type of diffusion process*semiconductor layer materials,*order of cell process if the change involves the metallization system,*change of manufacturing site of the solar cells not under the same QA system,*use of cells from a different manufacturer*major reduction in cell thickness(greater than25%for cell thicknesses>200µm and greater than17.5%for cell thicknesses≤200µm).Repeat:*Thermal cycling,200cycles(10.11),Damp heat(10.13),may be omitted if outer surface of cell is chemically identical(metallization and AR coating)*Hot spot endurance(10.9),*Mechanical Load test(10.16)for reduction of cell thickness only.b)Modification to encapsulation systemFor modifications such as:*different materials,*different additives*different encapsulation process:e.g.curing rate change*more than20%reduction in thickness of encapsulant,Repeat:*UV(10.10)/thermal cycling,50cycles(10.11)/humidity freeze sequence(10.12), *Damp heat(10.13),*Hail impact(10.17)if not tempered glass,*Hot spot(10.9)if material composition changes.c)Modification to superstrateFor modifications such as:*different material,*different thickness,reduced by more than10%*if glass,retest if there is a reduction in the heat strengthening process(for example retest if change is from tempered glass to heat strengthened or annealed), *different surface treatments,adhesives or primers if they are in direct contact with encapsulate material.*If the change is from glass to non-glass or vice-versa,it should be considered a new product altogether.Note:Tempered Glass is defined as glass with a surface compression in excess of69Megapascals.Heatstrengthened glass is defined as glass with a surface compression between24Megapascals and69Megapascals.Annealed glass is defined as glass with a surface compression of less than24Megapascals.Repeat:*UV(10.10)/thermal cycling,50cycles(10.11)/humidity freeze(10.12)sequence, *Mechanical load test(10.16),*Hail test(10.17),*Damp heat(10.13)(if non-glass)*Hot spot(10.9)for non-glass if material changes or thickness is reduced*Outdoor exposure(10.8)if change in material.d)Increase in module size*For increase by more than20%of length or width.Repeat:*Thermal cycling,200cycles(10.11),*Mechanical load(10.16),*Hail impact(10.17)(for size increases of more than50%).e)Modification to backsheet/substrateFor modifications such as:*Different material*Reduction of thickness of more than20%in any one of the individual layers,*Different additives,surface treatments,adhesives and primers.Repeat:*UV(10.10)/thermal cycling,50cycles(10.11)/humidity freeze(10.12)sequence, *Robustness of terminations(10.14),*Damp heat(10.13)(if non-glass),*Hail impact(10.17)if rigidity depends on the backsheet,*Mechanical load(10.16)if mounting depends on the backsheet/substrate.If there is a change from superstrate to substrate design or from substrate to superstrate design,the entire qualification test sequence in IEC61215shall be conducted.f)Modification to frame and/or mounting structureFor modifications such as:*cross section of frame*different framing material*different mounting techniqueRepeat:*Mechanical load test(10.16),*Outdoor exposure(10.18)if plastic material is used,*UV(10.10)/thermal cycling(10.11),50cycles/humidity freeze(10.12)sequence,if plastic material is used,*Damp heat(10.13)if an adhesive system is used to mount the module,*Thermal cycling(10.11),200cycles,if an adhesive system is used to mount the module,andg)Modification to junction box/electrical terminationFor modifications such as:*different material,*different design,*different potting material,*different method of attachment.Repeat:*TC50(10.11),10HF(10.12),*Robustness of terminations(10.14),*Damp heat(10.13),*Bypass diode thermal test(10.18)(if bypass diode is in the box).h)Change in cell interconnect and string interconnect materials or techniqueFor modifications such as:*Different interconnect material,*increased thickness of interconnect material(for thickness increases greater than40µm.If the new ribbon thickness is below100µm thickness no retest is required.)*different bonding technique*different number of interconnects*different number of bonds per cell(Solder or other bonding technique)*different solder material or flux.Repeat:*Temperature cycling,200cycles(10.11),*Damp heat(10.13)for changes in materials,*Hot spot for changes in bonding technique or solder material(10.9).i)Change in electrical circuit of an identical packageFor modifications such as:*Modifications to the interconnection circuitry(for example more cells per bypass diode or re-routing of output leads)*Reconfiguration of voltage(ie.12to24)Repeat:*Hot spot(10.9),only if more cells per by-pass diode.*Bypass diode thermal test if the current in each diode increases(10.18),*Temperature cycling,200cycles(10.11)if there are internal conductors behind the cells. j)Higher or lower power output(by10%)in the identical package including size and using the identical cell processRepeat:*Hot spot(10.9),—Bypass diode thermal test(10.18)if greater than10%higher.k)Qualification of a frameless module after the design has received certification as a framed moduleRepeat the following tests with the laminate mounted using the manufacturers mounting instructions.*Damp heat(10.13)(If frame is part of the package seal),*Mechanical load(10.16),*Hail impact(unless superstrate is tempered glass)(10.17).l)Change in Bypass diode—Lower current rating or lower temperature rating—Different number of bypass diodes per module—Use of different bypass diode.Repeat:—Bypass diode thermal test(10.18)m)The following changes would require retest of NMOT for informative reasons not to maintain Type Approval—Anti-reflective coating—Cell texturing—Encapsulant—Backsheet—SuperstrateModifications that do not require re-testingProvided that all structural components,materials used and processes(including cell process), and minimum spacings between components and edges remain the same,the following modifications shall not require re-testing:*fewer cells in module;*fewer cells in a smaller module.*smaller cells in module,as long as each cell has the same number or area of interconnects and equivalent numbers of solder bonds per unit area.10Test procedures10.1Visual inspection10.1.1PurposeTo detect any visual defects in the module.10.1.2ProcedureCarefully inspect each module under an illumination of not less than1000lux for the following conditions:–cracked,bent,misaligned or torn external surfaces;–broken cells;–cracked cells;–faulty interconnections or joints;–cells touching one another or the frame;–failure of adhesive bonds;–bubbles or delaminations forming a continuous path between a cell and the edge of the module;–tacky surfaces of plastic materials;–faulty terminations,exposed live electrical parts;–any other conditions which may affect performance.Make note of and/or photograph the nature and position of any cracks,bubbles or delaminations,etc.which may worsen and adversely affect the module performance in sub sequent tests.10.1.3RequirementsVisual conditions other than the major visual defects listed in Clause7are acceptable for the purposes of type approval.10.2Maximum power determination10.2.1PurposeTo determine the maximum power of the module before and after the various environmental tests.Repeatability of the test is the most important factor.10.2.2Apparatusa)A radiant source(natural sunlight or a solar simulator class BBA or better in accordancewith IEC60904-9).b)A PV reference device in accordance with IEC60904-2.If a Class BBA simulator isused,the reference device shall be a reference module of the same size with the same cell technology to match spectral response.。
trial,experiment,test,try 对比
`test-tube n slender glass tubmical experiments 试管. `test-tube baby baby that is conceived by artificial insemination, or that develops elsewhere than in a mother's body 试管婴儿.
2 [Tn, Tn.pr] ~ sb (on sth) test sb's knowledge or ability (in a particular area) 测验某人（在某方面的知识或能力）: She tested the whole class on irregular verbs. 她对全班学生进行不规则动词测验.
examination of a person's knowledge or ability in a particular area （对人在某方面的知识或能力的）测验, 测试, 考查: give the pupils a test in arithmetic 对小学生进行算术测验 * an I`Q/in`telligence test 智商[智力]测验 * a`driving-test, ie to obtain a driving licence 驾驶执照考试.
牛津高阶英汉双解词典
trial
/ ?tra??l; ˋtra??l/ n
[C, U] examination of evidence in a lawcourt, by a judge and often a jury, to decide if sb accused of a crime is innocent or guilty 审问; 审讯; 审理; 审判: The trial lasted a week. 审讯持续了一个星期. * trial by jury 陪审 * commit sb for trial, ie send sb to prison, for later trial 将某人拘押候审 * The defendant claimed that he had not had a fair trial. 被告声称未获公正审讯. * The case comes to trial/comes up for trial (iewill be tried) next month. 该案将於下月开庭审理.
3GPP 5G基站(BS)R16版本一致性测试英文原版(3GPP TS 38.141-1)
4.2.2
BS type 1-H.................................................................................................................................................. 26
4.3
Base station classes............................................................................................................................................27
1 Scope.......................................................................................................................................................13
All rights reserved. UMTS™ is a Trade Mark of ETSI registered for the benefit of its members 3GPP™ is a Trade Mark of ETSI registered for the benefit of its Members and of the 3GPP Organizational Partners LTE™ is a Trade Mark of ETSI registered for the benefit of its Members and of the 3GPP Organizational Partners GSM® and the GSM logo are registered and owned by the GSM Association
TEST-CD试音极品系列
TEST-CD试音极品系列【0212】TEST-CD试音极品系列部分内容已隐藏，回复后可看全部动听绝伦的发烧极品,顶级专业发烧器材的试音精品! i5 I& N3 t+ v- USHM-CD是SUPER HIGH MATERIAL CD的缩写,意即超高端材料CD音质、解像度、音量感、歪感、透明感五大方面均优于普通CD) W6 g8 D8 [/ X, h低频比XRCD24的表现要好,更加有现场感!115云文件列表115云[]是中国最大的个人网盘，访问 免费注册150GB个人网盘。
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0212 TEST-CD试音极品71CD【沙洲海洋整理】|-- 1| |-- 封底.jpg (453.35KB)| |-- 封面.jpg (501.74KB)| |-- 专辑简介.txt (874B)| |-- CDA| | |-- CDImage.cue (1.34KB)| | |-- CDImage.wav (745.69MB)| | `-- 抓轨日志.log (1.78KB)| `-- CDB| |-- CDImage.cue (1.36KB)| |-- CDImage.wav (694.04MB)| `-- 抓轨日志.log (1.78KB)|-- 2| |-- 华声音乐地带.url (349B)| |-- 试音极品②.jpg (749.64KB)| |-- 音乐港湾.url (225B)| |-- 专辑简介.txt (897B)| |-- CDA| | |-- CDImage.cue (3.1KB)| | |-- CDImage.wav (703.73MB)| | `-- 试音极品②.jpg(749.64KB)| `-- CDB| |-- CDImage.cue (3.17KB)||-- CDImage.wav (776.75MB)| `-- 试音极品②.jpg(749.64KB)|-- 3| |-- 封底.jpg (1.08MB)| |-- 封面.jpg (912.03KB)| |-- 华声音乐地带.url (349B)| |-- 音乐港湾.url (225B)| |-- 专辑简介.txt (920B)| |-- CDA| | |-- CDImage.cue (3.18KB)| | `-- CDImage.wav (724.61MB)| `-- CDB| |-- CDImage.cue (1.47KB)| `-- CDImage.wav(731.54MB)|-- 4| |-- readme.txt (76B)| |-- 试音极品④TEST.jpg (806.24KB)| |-- 专辑简介.txt (898B)| |-- CDA| | |-- CDImage.cue (3.59KB)| | |-- CDImage.wav (793.8MB)| | |-- 鼓王.wav (70.51MB)| | `-- 试音极品④TEST.jpg (806.24KB)| `-- CDB| |-- CDImage.cue (3.6KB)||-- CDImage.wav (722.87MB)| `-- 试音极品④TEST.jpg (806.24KB)|-- 5| |-- 华声爱格格收藏之《TEST-CD试音极品5》CDA| | |-- CD1.jpg (570.9KB)| | |-- CD2.jpg (394.39KB)| | |-- CDImage.cue (3.55KB)| | |-- CDImage.wav (748.56MB)| | |-- readme.txt (76B)| | |-- 封底.jpg (835.03KB)| | |-- 封面.jpg (666.72KB)| | `-- 专辑介绍.txt (1.07KB)| `-- 华声爱格格收藏之《TEST-CD试音极品5》CDB| |-- CD1.jpg (570.9KB)| |-- CD2.jpg (394.39KB)| |-- CDImage.cue (3.58KB)| |-- CDImage.wav (751.91MB)| |-- readme.txt (76B)||-- 封底.jpg (835.03KB)| |-- 封面.jpg (666.72KB)|`-- 专辑介绍.txt (1.06KB)|-- 6| |-- readme.txt (76B)| |-- 专辑简介.txt (894B)| |-- CDA| | |-- CDImage.cue (3.6KB)| | |-- CDImage.wav (699.52MB)| | `-- 专辑图片.jpg (292.39KB)| `-- CDB| |-- CDImage.cue (3.58KB)| |-- CDImage.wav (737.25MB)| `-- 专辑图片.jpg (292.39KB)|-- 7| |-- 专辑简介.txt (947B)| |-- CDA| | |-- 07.jpg (34.19KB)| | |-- CDImage.cue (2.33KB)| | `-- CDImage.wav (677.11MB)| `-- CDB| |-- 07.jpg (34.19KB)| |-- CDImage.cue (1.35KB)| `-- CDImage.wav (709.94MB)|-- 8| |-- CDA| | |-- 08.jpg (37.47KB)| | |-- CDImage.cue (2.27KB)| | |-- CDImage.wav (720.42MB)| | `-- 专辑简介.txt (857B)| `-- CDB| |-- 08.jpg (37.47KB)| |-- CDImage.cue (2.35KB)| |-- CDImage.wav (715.83MB)| `-- 专辑简介.txt (857B)|-- 9| |-- CD1| | |-- CDImage.cue (1.6KB)| | |-- CDImage.wav (645.22MB)| | |-- 华声音乐地带.url (349B)| | `-- 音乐港湾.url (225B)| `-- CD2| |-- CDImage.cue (4.3KB)||-- CDImage.wav (724.03MB)| |-- 华声音乐地带.url (349B)| `-- 音乐港湾.url (225B)|-- 10| |-- 201305271222053191-2345139.jpg (122.98KB)| |-- CDImage.cue (2.1KB)| |-- CDImage.wav (669.32MB)| `-- 专辑简介.txt (629B)|-- 11| |-- CD1| | |-- CDImage.cue (4.23KB)| | |-- CDImage.wav (722.11MB)| | |-- 华声音乐地带.url (349B)| | `-- 音乐港湾.url (225B)| `-- CD2| |-- CDImage.cue (1.3KB)| |-- CDImage.wav (745.87MB)| |-- 华声音乐地带.url (349B)| |-- 音乐港湾.url (225B)| `-- 专辑简介.txt (803B)|-- 12| |-- 大梁收藏-试音极品⑿TEST-CD-CDA| | |-- CDA.jpg (50.28KB)| | |-- CDB.jpg (48.62KB)| | |-- CDImage.cue (2.71KB)| | |-- CDImage.wav (599.42MB)| | |-- 背面.jpg (63.73KB)| | |-- 封面.jpg(61.3KB)| | `-- 专辑简介.txt (961B)| `-- 大梁收藏-试音极品⑿TEST-CD-CDB| |-- CDImage.cue (2.66KB)| |-- CDImage.wav (581.59MB)| `-- 专辑简介.txt (961B)|-- 13| |-- 大梁收藏-TEST-CD试音极品13-SHM-CDA| | |-- CDImage.cue (2.15KB)| | |-- CDImage.wav (681.5MB)| | |-- 封面.jpg (171.74KB)| | |-- 专辑简介.txt (887B)| | `-- 抓轨日志.log (1.68KB)| `-- 大梁收藏-TEST-CD试音极品13-SHM-CDB| |-- CDImage.cue (2.03KB)| |-- CDImage.wav (649.71MB)| |-- 封面.jpg (171.74KB)| |-- 专辑简介.txt (887B)| `-- 抓轨日志.log (1.68KB)|-- 14| |-- [linm收藏]试音极品14-CDA| | |-- CDImage.cue (2.08KB)| | |-- CDImage.wav (676.87MB)| | `-- 专辑简介.txt (842B)| `-- [linm收藏]试音极品14-CDB| |-- CDImage.cue (2.23KB)| `-- CDImage.wav(756.24MB)|-- 15| |-- 大梁收藏-TEST-CD试音极品15-SHM-CDA| | |-- CDImage.cue (2.36KB)| | |-- CDImage.wav (724.44MB)| | |-- 专辑简介.txt (887B)| | `-- 抓轨日志.log (1.79KB)| `-- 大梁收藏-TEST-CD试音极品15-SHM-CDB| |-- CDImage.cue (2.26KB)| |-- CDImage.wav (728.86MB)| |-- 专辑简介.txt (887B)| `-- 抓轨日志.log (1.79KB)|-- 16| |-- 大梁收藏-TEST-SHMCD试音极品16-CDA| | |-- CDImage.cue (2.99KB)| | |-- CDImage.wav (649.4MB)| | |-- 封面.jpg (148.16KB)| | |-- 音乐地带-影音帝国区- 华声论坛.url (1.52KB)| | `-- 专辑简介.txt (857B)| `-- 大梁收藏-TEST-SHMCD试音极品16-CDB| |-- CDImage.cue (2.99KB)| |-- CDImage.wav (658.7MB)| |-- 封面.jpg (148.16KB)| `-- 音乐地带-影音帝国区- 华声论坛.url (1.52KB)|-- 17| |-- %5Blinm收藏%5D试音极品17-CDA| | |-- CDImage.cue (1.87KB)| | |-- CDImage.wav (739.29MB)| | `-- 专辑简介.txt (1.1KB)| `-- [linm收藏]试音极品17-CDB| |-- CDImage.cue (1.83KB)| |-- CDImage.wav (731.36MB)| `-- 专辑简介.txt (748B)|-- 18| |-- 《TEST-CD试音极品18》CD1| | |-- 01 我是真的真的爱你我的宝贝.wav (45.52MB)| | |-- 02 如果爱你只有一次.wav (46.63MB)| | |-- 03 春暖花开.wav (41.18MB)| | |-- 04 谁为我停留.wav (47.53MB)| | |-- 05 谁在窗外流泪.wav(57.45MB)| | |-- 06 小情歌.wav (46.66MB)| | |-- 07 为你我受冷风吹.wav (38.51MB)| | |-- 08 会哭的人不一定流泪.wav (46.58MB)| | |-- 09 爱情物语.wav (52.04MB)| | |-- 10 借我一点爱.wav (39.64MB)| | |-- 11 谁见过梦中的草原梦中的河.wav (49.14MB)| | |-- 12 难忍的悲.wav (53.34MB)| | |-- 13 老地方的雨.wav (52.96MB)| | |-- 14 风平浪静.wav (49.29MB)| | |-- 15 你寂寞才找我.wav (41.83MB)| | |-- readme.txt (69B)| | |-- 专辑介绍.txt (839B)| | |-- 专辑封面.jpg (230.57KB)| | `-- 专辑底面.jpg (248.44KB)| `-- 《TEST-CD试音极品18》CD2| |-- 01 请您恰恰.wav (39.61MB)| |-- 02 掌声响起来.wav (56MB)| |-- 03 独舞的枫叶.wav (54.63MB)| |-- 04 怨苍天变了心.wav (42.72MB)| |-- 05 烟雨蒙蒙.wav (33.47MB)| |-- 06 此情可持.wav (41.14MB)| |-- 07 我最亲爱的.wav (48.82MB)| |-- 08 玉萨.wav (53.89MB)| |-- 09 情义无价.wav (43.59MB)| |-- 10 最后的倾诉.wav (44.04MB)| |-- 11 挥不去的思念.wav (46.41MB)||-- 12 邻妹妹爱上假宝玉.wav (36.31MB)| |-- 13 月光上行走.wav (37.72MB)| |-- 14 如果你是我的传说.wav (36.02MB)| |-- 15 花儿像人人像花.wav (45.79MB)||-- readme.txt (69B)| |-- 专辑介绍.txt (839B)| |-- 专辑封面.jpg (230.57KB)| `-- 专辑底面.jpg(248.44KB)|-- 19| |-- BACK.jpg (803.65KB)| |-- COVER.jpg (619.4KB)| |-- TEST-CD试音极品19.txt (892B)| |--TEST-CD试音极品19CDA.cue (1.41KB)| |-- TEST-CD试音极品19CDA.log (1.79KB)| |-- TEST-CD试音极品19CDA.wav (767.02MB)| |-- TEST-CD试音极品19CDB.cue (1.37KB)| |-- TEST-CD试音极品19CDB.log (1.78KB)| `-- TEST-CD试音极品19CDB.wav(713.02MB)|-- 20| |-- BACK.jpg (321.77KB)| |-- COVER.jpg (208.77KB)| |-- TEST-CD试音极品20.txt (866B)| |--TEST-CD试音极品20CDA.cue (1.1KB)| |-- TEST-CD试音极品20CDA.log (1.75KB)| |-- TEST-CD试音极品20CDA.wav (673.06MB)| |-- TEST-CD试音极品20CDB.cue (1.61KB)| `-- TEST-CD试音极品20CDB.wav (743.68MB)|-- 21| |-- Back.jpg (38.38KB)| |-- Cover.jpg (56.11KB)| |-- TEST-CD试音极品21粤唱粤浓.txt (873B)| |-- TEST-CD试音极品21粤唱粤浓CD1.cue (1.92KB)| |-- TEST-CD试音极品21粤唱粤浓CD1.log (1.79KB)| |-- TEST-CD试音极品21粤唱粤浓CD1.wav (610.73MB)| |-- TEST-CD试音极品21粤唱粤浓CD2.cue (1.94KB)| |-- TEST-CD试音极品21粤唱粤浓CD2.log (1.8KB)| `-- TEST-CD试音极品21粤唱粤浓CD2.wav (644.35MB)|-- 24| `-- TEST-CD 试音极品24 2CD.rar (959.44MB)|-- 22| |--COVER.jpg (202.24KB)| |-- TEST-CD试音极品NO.22休闲民乐吧2CD.txt (1.06KB)| |-- CD1| | |-- 01.浏阳河(古筝).wav (33.61MB)| | |-- 02.二泉映月(二胡).wav (63.16MB)| | |-- 03.乌苏里船歌(古筝).wav (38.22MB)| | |-- 04.蝴碟泉边(葫芦丝).wav (44.28MB)| | |-- 05.小白杨(琵琶).wav (27.93MB)| | |-- 06.绣金匾(古筝).wav (32.37MB)| | |-- 07.北风吹(二胡).wav (41.73MB)| | |-- 08.红梅赞歌(琵琶).wav (37.94MB)| | |-- 09.苗岭的早晨(笛子).wav (33.05MB)| | |-- 10.小河淌水(葫芦丝).wav (28.75MB)| | |-- 11.渔家姑娘在海边(二胡).wav (34.5MB)| | |-- 12.婚誓(葫芦丝).wav (39.48MB)| | |-- 13.洗衣歌(笛子).wav (35.37MB)| | |-- 14.彩云追月(古筝).wav (52.55MB)| | `-- 15.月光下的凤尾竹(葫芦丝).wav(48.65MB)| `-- CD2| |-- 01.竹缕情歌(笛子).wav (44.17MB)| |-- 02.远飞的大雁(二胡笛子).wav(42.41MB)| |-- 03.红楼梦(二胡).wav (35.21MB)||-- 04.春江花月夜(洞笛).wav (42.91MB)| |-- 05.兰花草(三弦).wav (26.36MB)| |-- 06.赛马(二胡).wav(17.23MB)| |-- 07.采红菱(三弦).wav (39.71MB)||-- 08.泉水叮咚响(琵琶).wav (35.39MB)| |-- 09.边疆的泉水清又纯(古筝).wav (29.5MB)| |-- 10.嘎达梅林(马头琴).wav (44.33MB)| |-- 11.洪湖水浪打浪(古筝).wav (30.08MB)| |-- 12.月亮走我也走(二胡).wav (41.72MB)||-- 13.抬花轿(唢呐).wav (42.92MB)| |-- 14.夫妻双双把家还(葫芦丝).wav (35.25MB)| `-- 15.一道道水一道道山(古筝).wav (32.46MB)|-- 23| |-- BACK.jpg (56.62KB)| |-- COVER.jpg (50.77KB)| |-- DISC.jpg (46.15KB)| |-- DISCB.jpg (51.47KB)| |-- TEST-CD试音极品NO.23情歌对唱经典2CD.txt (888B)| |-- TEST-CD试音极品NO.23情歌对唱经典CD1.cue (1.38KB)| |-- TEST-CD试音极品NO.23情歌对唱经典CD1.log (1.8KB)| |-- TEST-CD试音极品NO.23情歌对唱经典CD1.wav (691.29MB)| |-- TEST-CD试音极品NO.23情歌对唱经典CD2.cue (1.2KB)| |-- TEST-CD 试音极品NO.23情歌对唱经典CD2.log (1.86KB)| `-- TEST-CD试音极品NO.23情歌对唱经典CD2.wav (681.15MB)|-- 27| `-- 【】-TEST-CD试音极品27[2CD][正版CD低速原抓WAV+CUE].rar (1GB)|-- 28| `-- 【】-TEST-CD试音极品28[2CD][正版CD低速原抓WAV+CUE].rar (1.02GB)|-- 29| `-- 【】-TEST-CD试音极品29[2CD][正版CD低速原抓WAV+CUE].rar (1GB)|-- 30| `-- 【】-TEST-CD试音极品30[2CD][正版CD低速原抓WAV+CUE].rar (1.01GB)|-- 33| |-- 捌零[亲浪]DTS-《TEST-CD 试音极品33》CD1| | |-- 01.琵琶语.wav (43.56MB)| | |-- 02.踏古.wav (52.12MB)| | |-- 03.欢沁.wav(32.67MB)| | |-- 04.秋月夜.wav (40.3MB)| | |-- 05.对歌.wav (63.27MB)| | |-- 06.声声思.wav (51.77MB)| | |-- 07.凡人歌.wav (40.12MB)| | |-- 08.暮色.wav (37.95MB)| | |-- 09.返璞.wav (46.13MB)| | |-- 10.探寻.wav (55.92MB)| | |-- 11.弄云.wav (37.2MB)| | `-- 12.渡·红尘.wav (60.3MB)| `-- 捌零[亲浪]DTS-《TEST-CD 试音极品33》CD2| |-- 01 闲云孤鹤.wav (56.86MB)| |-- 02 无所不至.wav(63.94MB)| |-- 03 孤芳自赏.wav (59.03MB)| |-- 04 虚怀若谷.wav (52.66MB)| |-- 05 一息尚存.wav (68.77MB)| |-- 06 轮回.wav (53.91MB)| |-- 07 行云流水.wav (54.91MB)| |-- 08 即兴曲（一）.wav (65.01MB)| |-- 09 遥遥长路.wav (55.16MB)| |-- 10 一意孤行.wav (56.42MB)| `-- 11 即兴曲（二）.wav (55.11MB)|-- 35| |-- CDImage.cue (1.24KB)| |-- CDImage (1).cue (1.24KB)| |-- cover (1).jpg (50.94KB)| |-- cover.jpg (50.94KB)| |-- 专辑简介(1).txt (797B)| |-- 专辑简介.txt (797B)| |-- CDImage (1).wav (655.08MB)| `-- CDImage.wav (655.08MB)|-- 26| |-- TEST-CD试音极品26-BACK.jpg (156.26KB)| |-- TEST-CD试音极品26-COVER.jpg (115.43KB)| |-- 专辑简介.txt (904B)| |-- CDA| | |-- CDImage.cue (2.17KB)| | `-- CDImage.wav (530.1MB)| `-- CDB| |-- CDImage.cue (1.94KB)| |--CDImage.wav (550.27MB)| `-- 炫音音乐论坛总有一种声音能打动你！.url (223B)`-- 25|-- 《TEST-CD试音极品25》CD2 UPDTS-WAV分轨| |-- 01.狩猎之歌.wav(21.49MB)| |-- 02.胡桃夹子进行曲.wav (24.8MB)| |-- 03.胡桃夹子世花之园舞曲.wav (66.93MB)| |-- 04.第九交响曲第四乐章欢乐颂.wav (59.75MB)| |-- 05.沉思选自泰依丝.wav (56.98MB)| |-- 06.匈牙利舞曲第一首.wav(30.48MB)| |-- 07.蓝色多瑙河施特劳斯.wav (79.77MB)| |-- 08.斗牛者之歌.wav (50.52MB)| |-- 09.哈巴里拉舞曲.wav (42.76MB)| |-- 10.军刀舞曲.wav (24.58MB)| |-- 11.以舒伯特(鳟鱼)为主题.wav (38.09MB)| |-- 12.饮酒歌选自《茶花女》第一幕.wav (30.17MB)| |-- 13.轻骑兵前奏曲.wav(62.93MB)| |-- 14.印度之歌.wav (45.57MB)| |-- 15.黄河船夫曲.wav (36.39MB)| |-- logo.jpg (22.52KB)| |-- wav音乐下载,dts音乐下载,5.1声道音乐下载,dts5.1无损音乐免费下载-wav dts 5.1多声道音乐网精品汽车音乐下载.url (154B)| |-- 介绍和曲目CD2.txt (965B)| |-- 免责声明.txt (225B)| `-- 封面.jpg (102.51KB)`-- 《TEST-CD试音极品25》CD1 UPDTS-WAV分轨|-- 01.土耳其进行曲.wav (24.47MB)|-- 02.阿莱城姑娘法兰都舞曲.wav (32.96MB)|-- 03.匈牙利舞曲第五首.wav (25.32MB)|-- 04.拉达锡奇进行曲.wav(29.77MB)|-- 05.喜庆选自烟花音乐.wav (13.87MB)|-- 06.天鹅湖场景.wav (29.18MB)|-- 07.天鹅湖圆舞曲.wav (70.34MB)|-- 08.弦乐小夜曲第一乐章.wav (56.85MB)|-- 09.军队进行曲.wav (54.2MB)|-- 10.培尔金特清晨情调.wav (45.91MB)|-- 11.维也纳音乐盒.wav (24.61MB)|-- 12.卡门第一幕序曲.wav (22MB)|-- 13.卡门第四幕序曲.wav (21.29MB)|-- 14.在波斯市场.wav (56.88MB)|-- 15.结婚进行曲.wav (50.16MB)|-- 16.荣耀兴威仪进行曲第一首.wav (66.29MB)|-- logo.jpg (22.52KB)|-- wav音乐下载,dts音乐下载,5.1声道音乐下载,dts5.1无损音乐免费下载-wav dts 5.1多声道音乐网精品汽车音乐下载.url (154B)|-- 介绍和曲目CD1.txt (978B)|-- 免责声明.txt (225B)`-- 封面.jpg (102.51KB)74个文件夹，338个文件音像图书123免责声明:本专辑来自网络仅用于个人试听交流,请下载后24小时内删除。
DS_da280
MEMS digital output motion sensor low-power high performance 3-axes “DSC-XYZ” accelerometerKey Features•Supply voltage, 1.62V to 3.6V •For 2x2x1.1 mm LGA-12 package •User selectable range, ±2g, ±4g, ±8g, ±16g •User selectable data output rate •Digital I 2C/SPI output interface •14 bit resolution •Low power consumption •2 Programmable interrupt generators with independent function for motion detection •Free-fall detection •Embedded self-test function •Factory programmable offset and sensitivity • RoHS compliantApplications•User interface for mobile phone and PMP •Display orientation •Gesture recognition •Active/inactive monitoring •Free-fall detection •Double/ Click recognition •Power management •Vibration monitoring •Inclination and tilt sensing •PedometerProduct OverviewThe da280 sensor is a low power high performance capacitive three-axis linear accelerometer developed by micro-machined technology. The device is available in a 2x2x1.1mm land grid array (LGA) and it is guaranteed to operate over an extended temperature range from -40°C to +85°C. The sensor element is fabricated by single crystal silicon with DRIE process and is protected by hermetically sealed silicon cap from the environment. The device features user selectable full scale of ±2g/ ±4g/ ±8g/ ±16g measurement range with data output rate from 1Hz to 1 kHz with signal condition, temperature compensation, self-test, motion detection imbedded. The da280 has a self-test mode for user to check the functioning of the sensor and a power-down mode that makes it good for handset power management. Two independent and flexible interrupts provided greatly simplify the algorithm for various motion status detections. Standard I2C and SPI interfaces are used to communicate with the chip.Content1 Block diagram and pin description (9)1.1 Block diagram (9)1.2 Pin description (9)2 Mechanical and electrical specifications (11)2.1 Mechanical characteristics (11)2.2 Electrical characteristics (12)2.3 Absolute maximum ratings (13)3 Communication interface (14)3.1 Communication interface Electrical specification (14)3.1.1 SPI Electrical specification (14)3.1.2 I2C Electrical specification (15)3.2 Digital interface operation (16)3.2.1 SPI Operation (16)3.2.2 I2C Operation (18)4 Terminology and functionality (20)4.1 Terminology (20)4.1.1 Sensitivity (20)4.1.2 Zero-g level (20)4.2 Functionality (21)4.2.1 Power mode (21)4.2.2 Sensor data (21)4.2.3 Self-test (21)4.2.4 Factory calibration (22)4.3 Interrupt controller (22)4.3.1 General features (22)4.3.2 Mapping (23)4.3.3 Electrical behavior (INT1/INT2 to open-drive or push-pull) (24)4.3.4 New data interrupt (24)4.3.5 Active detection (24)4.3.6 Tap detection (24)4.3.7 Orientation recognition (26)4.3.8 Freefall interrupt (27)5 Application hints (29)6 Register mapping (30)7 Registers description (32)7.1 SOFT_RESET (00H) (32)7.2 CHIPID (01h) (32)7.3 ACC_X_LSB (02H), ACC_X_MSB (03H) (32)7.4 ACC_Y_LSB (04H), ACC_Y_MSB (05H) (32)7.5 ACC_Z_LSB (06H), ACC_Z_MSB (07H) (33)7.6 MOTION_FLAG (09H) (33)7.7 NEWDATA_FLAG (0AH) (34)7.8 TAP_ACTIVE_STATUS (0BH) (34)7.9 ORIENT_STATUS (0CH) (35)7.10 RESOLUTION_RANGE (0FH) (35)7.11 ODR_AXIS (10H) (35)7.12 MODE_BW (11H) (36)7.13 SWAP_POLARITY (12H) (37)7.14 INT_SET1 (16H) (37)7.15 INT_SET2 (17H) (38)7.16 INT_MAP1 (19H) (38)7.17 INT_MAP2 (1AH) (38)7.18 INT_MAP3 (1BH) (39)7.19 INT_CONFIG (20H) (39)7.20 INT_LTACH (21H) (40)7.21 FREEFALL_DUR (22H) (40)7.22 FREEFALL_THS (23H) (41)7.23 FREEFALL_HYST (24H) (41)7.24 ACTIVE_DUR (27H) (41)7.25 ACTIVE_THS (28H) (42)7.26 TAP_DUR (2AH) (42)7.27 TAP_THS (2BH) (42)7.28 ORIENT_HYST (2CH) (43)7.29 Z_BLOCK (2DH) (43)7.30 SELF_TEST (32H) (44)7.31 CUSTOM_OFF_X (38H) (44)7.32 CUSTOM_OFF_Y (39H) (44)7.33 CUSTOM_OFF_Z (39H) (45)7.34 CUSTOM_FLAG (4EH) (45)7.35 CUSTOM_CODE (4FH) (45)7.36 Z_ROT_HODE_TM (51H) (45)7.37 Z_ROT_DUR (52H) (46)7.38 ROT_TH_H (53H) (46)7.39 ROT_TH_L (54H) (46)8 Package information (47)8.1 Outline dimensions (47)8.2 Tape and reel specification (47)9 Revision history (49)List of tablesTable 1.Pin description (10)Table 2.Mechanical characteristic (11)Table 3.Electrical characteristics (12)Table 4.Absolute maximum ratings (13)Table 5.Electrical specification of the SPI interface pins (14)Table 6.Electrical specification of the I2C interface pins (15)Table 7.Mapping of the interface pins (16)Table 8.W1 and W0 settings (17)Table 9.I2C Address (18)Table 10.SAD+Read/Write patterns (18)Table 11.Transfer when master is writing one byte to slave (18)Table 12.Transfer when master is writing multiple bytes to slave (18)Table 13.Transfer when master is receiving (reading) one byte of data from slave (19)Table 14.Transfer when master is receiving (reading) multiple bytes of data from slave (19)Table 15.Self-test difference values (22)Table 16.Interrupt mode selection (22)Table 17.meaning of ‘orient’ bits in symmetric mode (26)Table 18.meaning of ‘orient’ bits in high-asymmetric mode (26)Table 19.meaning of ‘orient’ bits in low-asymmetric mode (27)Table 20.blocking conditions for orientation recognition (27)Table 21.Register address map (30)Table 22. SOFT_RESET register (32)Table 23. I2C Configuration description (32)Table 24. CHIPID register (32)Table 25.ACC_X_LSB register (32)Table 26.ACC_X_MSB register (32)Table 27.ACC_Y_LSB register (33)Table 28.ACC_Y_MSB register (33)Table 29.ACC_Z_LSB register (33)Table 30.ACC_Z_MSB register (33)Table 31.MOTION_FLAG register (33)Table 32.MOTION_FLAG register description (33)Table 33.NEWDATA_FLAG register (34)Table 34.NEWDATA_FLAG register description (34)Table 35.TAP_ACTIVE_STATUS register (34)Table 36.TAP_ACTIVE_STATUS register description (34)Table 37.ORIENT_STATUS register (35)Table 38.ORIENT_STATUS register description (35)Table 39.RESOLUTION_RANGE register (35)Table 40.RESOLUTION_RANGE register description (35)Table 41.ODR_AXIS register (35)Table 42.ODR_AXIS register description (36)Table 44.MODE_BW register description (36)Table 45.SWAP_POLARITY register (37)Table 46.SWAP_POLARITY register description (37)Table 47.INT_SET1 register (37)Table 48.INT_SET1 register description (37)Table 49.INT_SET2 register (38)Table 50.INT_SET2 register description (38)Table 51.INT_MAP1 register (38)Table 52.INT_MAP1 register description (38)Table 53.INT_MAP2 register (38)Table 54.INT_MAP2 register description (39)Table 55.INT_MAP3 register (39)Table 56.INT_MAP3 register description (39)Table 57.INT_CONFIG register (39)Table 58.INT_CONFIG register description (39)Table 59.INT_LTACH register (40)Table 60.INT_LTACH register description (40)Table 61.FREEFALL_DUR register (40)Table 62.FREEFALL_DUR register description (40)Table 63.FREEFALL_THS register (41)Table 64.FREEFALL_THS register description (41)Table 65.FREEFALL_HYST register (41)Table 66.FREEFALL_HYST register description (41)Table 67.ACTIVE_DUR register (41)Table 68.ACTIVE_DUR register description (41)Table 69.ACTIVE_THS register (42)Table 70.ACTIVE_THS register description (42)Table 71.TAP_DUR register (42)Table 72.TAP_DUR register description (42)Table 73.TAP_THS register (42)Table 74.TAP_THS register description (43)Table 75.ORIENT_HYST register (43)Table 76.ORIENT_HYST register description (43)Table 77.Z_BLOCK register (43)Table 78.Z_BLOCK register description (43)Table 79.SELF_TEST register (44)Table 80.SELF_TEST register description (44)Table 81.CUSTOM_OFF_X register (44)Table 82.CUSTOM_OFF_X register description (44)Table 83.CUSTOM_OFF_Y register (44)Table 84.CUSTOM_OFF_Y register description (44)Table 85.CUSTOM_OFF_Z register (45)Table 86.CUSTOM_OFF_Z register description (45)Table 88.CUSTOM_FLAG register description (45)Table 89.CUSTOM_CODE register (45)Table 90.CUSTOM_CODE register description (45)Table 91.Z_ROT_HODE_TM register (45)Table 92.Z_ROT_HODE_TM register description (46)Table 93.Z_ROT_DUR register (46)Table 94.Z_ROT_DUR register description (46)Table 95.ROT_TH_H register (46)Table 96.ROT_TH_H register description (46)Table 97.ROT_TH_L register (46)Table 98.ROT_TH_L register description (46)Table 99.Document revision history (49)List of figuresFigure 1 Block Diagram (9)Figure 2 Pin description (9)Figure 3 SPI slave timing diagram (14)Figure 4 I2C Slave timing diagram (15)Figure 5 Instruction Phase Bit Field (16)Figure 6 MSB First and LSB First Instruction and Data Phases (17)Figure 7 I2C Protocol (18)Figure 8 power mode (21)Figure 9 Interrupt mode (23)Figure 10 Timing of tap detection (25)Figure 11 Definition of vector components (26)Figure 12 da280 I2C electrical connection (29)Figure 13 12 Pin LGA Mechanical data and package dimensions (47)Figure 14 Tape and reel dimension in mm (48)1 Block diagram and pin description1.1 Block diagramCSB SDIOSCLKSDOPS INT1INT2GNDIOFigure 1 Block Diagram1.2 Pin descriptionFigure 2 Pin description2Mechanical and electrical specifications2.1Mechanical characteristicsVdd = 2.5 V, T = 25 °C unless otherwise noted (a)a. The product is factory calibrated at 2.5 V. The operational power supply range is from 1.62V to 3.6 V.Table 2.Mechanical characteristicSymbol Parameter Test conditions Min Type Max UnitFS Measurement range FS bit set to 00±2 g FS bit set to 01 ±4 g FS bit set to 10 ±8 g FS bit set to 11 ±16 gSo Sensitivity FS bit set to 00 4096 LSB/g FS bit set to 01 2048 LSB/g FS bit set to 10 1024 LSB/g FS bit set to 11 512 LSB/gTCSo Sensitivity change vs.temperatureFS bit set to 00 0.01 %/°CTyoff Typical zero-g level offsetaccuracy70 mgTcoff Zero-g level change vs.temperatureMax delta from 25°C ±0.6 mg/°CAn Acceleration noise density FS bit set to 00,Normal Mode,ODR = 1000Hz150 200 ug/sqrt(Hz)Vst Self-test output change X: FS bit set to 00 400 mg Y: FS bit set to 00 400 mg Z: FS bit set to 00 400 mgTop Operation temperature range -40 85 °C2.2Electrical characteristicsVdd = 2.5 V, T = 25 °C unless otherwise notedTable 3.Electrical characteristicsSymbol Parameter Test conditions Min Typ. Max Unit Vdd Supply voltage 1.62 2.5 3.6 V Vdd_IO I/O Pins supply voltage 1.62 3.6 VIdd current consumption innormal modeTop=25℃,ODR=1kHz220 uAIdd_lp current consumption in lowpower modeTop=25℃,ODR=62.5Hz,BW=500Hz40 uAIdd_sm current consumption insuspend modeTop=25℃ 1 uAVIH Digital high level inputvoltageSPI&I2C 0.7*Vdd_IO VVIL Digital low level inputvoltageSPI&I2C 0.3*Vdd_IO VVOH high level output voltage 0.9*Vdd_IO V VOL Low level output voltage 0.1*Vdd_IO V BW System bandwidth 1.95 500 Hz ODR Output data rate 1 1000 Hz Wake-uptimetwu From stand-by 1 ms Start-uptimetsu From power off 3 ms PSRR Power Supply Rejection Rate Top=25℃20 mg/V2.3Absolute maximum ratingsStresses above those listed as “absolute maximum ratings” may cause permanent damage to the device. This is a stress rating only and functional operation of the device under these conditions is not implied. Exposure to maximum rating conditions for extended periods may affect device reliability.Table 4.Absolute maximum ratingsParameter Test conditions Min Max Unit Storage Temperature -45 125 ℃Supply Voltage Supply pins -0.3 4.25 VSupply Voltage Logic pins -0.3 Vdd_IO+0.3 VESD Rating HMB,R=1.5k,C=100pF ±2 kV Mechanical Shock Duration<200us 10,000 gNote: Supply voltage on any pin should never exceed 4.25VThis is a mechanical shock sensitive device, improper handling can cause permanent damages to the part.This is an ESD sensitive device, improper handling can cause permanent damages to the part.3Communication interface3.1Communication interface Electrical specification3.1.1SPI Electrical specificationTable 5.Electrical specification of the SPI interface pinsSymbol Parameter Condition Min Max Unit fsclk Clock frequency Max load on SDIO or SDO = 25pF 10 MHz tsclk_l SLCK low pulse 20tsclk_h SLCK high pulse 20Tsdi_setup SDI setup time 20 ns Tsdi_hold SDI hold time 20 nsTsdo_od SDO/SDI output delay Load = 25pF 30 ns Load = 250pF 40 nsTcsb_setup CSB setup time 20 ns Tcsb_hold CSB hold time 40 nsThe figure below shows the definition of the SPI timing given in Table5:Figure 3 SPI slave timing diagram3.1.2I2C Electrical specificationTable 6.Electrical specification of the I2C interface pinsSymbol Parameter Min Max Unitfscl Clock frequency 400 kHztscl_l SCL low pulse 1.3 ustscl_h SCL high pulse 0.6 us Tsda_setup SDA setup time 0.1 us Tsda_hold SDA hold time 0.0 ustsusta Setup Time for a repeated start condition 0.6 usthdsta Hold time for a start condition 0.6 ustsusto Setup Time for a stop condition 0.6 ustbuf Time before a new transmission can start 1.3 us The figure below shows the definition of the I2C timing given in Table 6:Figure 4 I2C Slave timing diagram3.2Digital interface operationThe da280 supports two serial digital interface protocols for communications as slave with a host device: SPI and I2C. The active interface is selected by the state of the pin PS, 0 selects SPI and 1 selects I2C. By default, SPI operates in 3-wire mode and it can be re-configured by writing 1 to bit ‘SDO_active’ to work in 4-wire mode. Both interfaces share the same pins. The mapping for each interface is given in the following table:Table 7.Mapping of the interface pinsPIN name I2C SPISCL/SCLK Serial clock Serial clockSDA/SDI Serial Data Data input (4-wire mode).Data input/output (3-wire mode)SDO Used to set LSB of I2C address Data output (4-wire mode)CSB Unused Chip select3.2.1SPI OperationThe falling edge of CSB, in conjunction with the rising edge of SCLK, determines the start of framing. Once the beginning of the frame has been determined, timing is straightforward. The first phase of the transfer is the instruction phase, which consists of 16 bits followed by data that can be of variable lengths in multiples of 8 bits. If the device is configured with CSB tied low, framing begins with the first rising edge of SCLK.The instruction phase is the first 16 bits transmitted. As shown in Figure5, the instruction phase is divided into a number of bit fields.Figure 5 Instruction Phase Bit FieldThe first bit in the stream is the read/write indicator bit (R/W). When this bit is high, a read is being requested, otherwise indicates it is a write operation.W1 and W0 represent the number of data bytes to transfer for either read or write (Table8). If the number of bytes to transfer is three or less (00, 01, or 10), CSB can stall high on byte boundaries. Stalling on a non-byte boundary terminates the communications cycle. If these bits are 11, data can be transferred until CSB transitions high. CSB is not allowed to stall during the streaming process.The remaining 13 bits represent the starting address of the data sent. If more than one word is being sent, sequential addressing is used, starting with the one specified, and it either increments (LSB first) or decrements (MSB first) basedon the mode setting.Table 8.W1 and W0 settingsW1:W0 Action CSB stalling00 1 byte of data can be transferred. Optional01 2 bytes of data can be transferred. Optional10 3 bytes of data can be transferred. OptionalNo11 4 or more bytes of data can be transferred. CSB must be heldlow for entire sequence; otherwise, the cycle is terminated.Data follows the instruction phase. The amount of data sent is determined by the word length (Bit W0 and Bit W1). This can be one or more bytes of data. All data is composed of 8-bit words.Data can be sent in either MSB-first mode or LSB-first mode (by setting ‘LSB_first’ bit). On power up, MSB-first mode is the default. This can be changed by programming the configuration register. In MSB-first mode, the serial exchange starts with the highest-order bit and ends with the LSB. In LSB-first mode, the order is reversed. (Figure6)Figure 6 MSB First and LSB First Instruction and Data PhasesRegister bit ‘SDO_active’ is responsible for activating SDO on devices. If this bit is cleared, then SDO is inactive and read data is routed to the SDIO pin. If this bit is set, read data is placed on the SDO pin. The default for this bit is low, making SDO inactive.3.2.2I2C OperationI2C bus uses SCL and SDA as signal lines. Both lines are connected to VDDIO externally via pull-up resistors so that they are pulled high when the bus is free. The I2C device address of da280 is shown below. The LSB bit of the 7bits device address is configured via SA0pin.Table 9.I2C AddressSAD6 SAD5 SAD4 SAD3 SAD2 SAD1 SAD0 W/R0 1 0 0 1 1 SAO 0/1Table 10.SAD+Read/Write patternsCommand SAD[6:1] SAD[0]=SA0 R/W SAD+R/W Read 010011 0 1 01001101(4dh)Write 010011 0 0 01001100(4ch)Read 010011 1 1 01001111(4fh)Write 010011 1 0 01001110(4eh)The I2C interface protocol has special bus signal conditions. Start (S), stop (P) and binary data conditions are shown below. At start condition, SCL is high and SDA has a falling edge. Then the slave address is sent. After the 7 address bits, the direction control bit R/W selects the read or write operation. When a slave device recognizes that it is being addressed, it should acknowledge by pulling SDA low in the ninth SCL (ACK) cycle.At stop condition, SCL is also high, but SDA has a rising edge. Data must be held stable at SDA when SCL is high. Data can change value at SDA only when SCL is low.Figure 7 I2C Protocol4Terminology and functionality4.1Terminology4.1.1SensitivitySensitivity describes the gain of the sensor and can be determined e.g. by applying 1 g acceleration to it. As the sensor can measure DC accelerations this can be done easily by pointing the axis of interest towards the center of the earth, noting the output value, rotating the sensor by 180 degrees (pointing to the sky) and noting the output value again. By doing so, ±1 g acceleration is applied to the sensor. Subtract the larger output value from the smaller one, and dividing the result by 2, leads to the actual sensitivity of the sensor. This value changes very little over temperature and also time. The sensitivity tolerance describes the range of sensitivities of a large population of sensors.4.1.2Zero-g levelZero-g level offset (TyOff) describes the deviation of an actual output signal from the ideal output signal if no acceleration is present. A sensor in a steady state on a horizontal surface measure 0 g in X axis and 0 g in Y axis whereas the Z axis measure 1 g. The output is ideally in the middle of the dynamic range of the sensor (content of output data registers are 00h, data expressed as 2’s complement number). A deviation from ideal value in this case is called Zero-g offset. Offset is to some extent a result of stress to MEMS sensor and therefore the offset can slightly change after mounting the sensor onto a printed circuit board or exposing it to extensive mechanical stress. Offset changes little over temperature; see “Zero-g level change vs. temperature”. The Zero-g level tolerance (TyOff) describes the standard deviation of the range of Zero-g levels of a population of sensors.4.2Functionality4.2.1Power modeThe da280 has three different power modes. Besides normal mode, which represents the fully operational state of the device, there are two special energy saving modes: low-power mode and suspend mode.Figure 8 power modeIn normal mode, all parts of the electronic circuit are held powered-up and data acquisition is performed continuously. In suspend mode, the whole analog part, including the oscillator, Ana LDO, Dig LDO and Drive Buffer are all powered down, no data acquisition is performed and the only supported operation is to read/write the registers. Suspend mode is entered by writing ‘11’ or ‘10’ to the (0x11) ‘pwr_mode’ bits.In low power mode, the device is periodically switching between a sleep phase and a wake-up phase. The wake-up phase essentially corresponding to operation in normal mode with complete power-up of the circuitry. During the sleep phase the analog part except the oscillator is powered down.During the wake-up phase, if a enabled interrupt is detected, the device stays in the wake-up phase as long as the interrupt condition endures (non-latched interrupt), or until the latch time expires (temporary interrupt), or until the interrupt is reset (latched interrupt). If no interrupt detected, the device enters the sleep phase.4.2.2Sensor dataThe width of acceleration data is 14bits given in two’s complement representation. The 14bits for each axis are split into an MSB part (one byte containing bits 13 to 6) and an LSB lower part (one byte containing bits 5 to 0)4.2.3Self-testThis feature permits to check the sensor functionality by applying electrostatic forces to the sensor core instead of external accelerations. By actually deflecting the seismic mass, the entire signal path of the sensor can be tested. Activating the self-test results in a static offset of the acceleration data; any external acceleration or gravitational forceapplied to the sensor during active self-test will be observed in the output as a superposition of both acceleration and self-test signal.The self-test is activated individually for each axis by writing 1 to the (0x32) ‘self_test_en’ bit. It is possible to control the direction of the deflection though bit ‘self_test_sign’ for each axis. The excitation occurs in positive (negative) direction if ‘self_test_sign’ = ‘0b’ (‘1b’).In order to ensure a proper interpretation of the self-test signal it is recommended to perform the self-test for both directions and then to calculate the difference of the resulting acceleration values. Table15 show the difference for each axis.Table 15.Self-test difference valuesX-axis signal Y-axis signal Z-axis signalResulting difference value +0.4g +0.4g +0.4g4.2.4Factory calibrationThe IC is factory calibrated for sensitivity (So) and Zero-g level (TyOff). The trimming values are stored inside the chip’s nonvolatile memory. The trimming parameters are loaded to registers while da280 reset (POR or software reset). This allows using the device without further calibration.4.3Interrupt controllerInterrupt engines are integrated in the da280. Each interrupt can be independently enabled and configured. If the condition of an enabled interrupt is fulfilled, the corresponding status bit is set to 1 and the selected interrupt pin is activated. There are two interrupt pins, INT1 and INT2; interrupts can be freely mapped to any of these two pins. The pin state is a logic ‘or’ combination of all mapped interrupts.4.3.1General featuresAn interrupt is cleared depending on the selected interrupt mode, which is common to all interrupts. There are three different interrupt modes: non-latched, latched and temporary. The mode is selected by the ‘latch_int’ bits according to table16.Table 16.Interrupt mode selectionlatch_int Interrupt mode0000 non-latched0001 temporary latched 250ms0010 temporary latched 500ms0011 temporary latched 1s0100 temporary latched 2s0101 temporary latched 4s0110 temporary latched 8s0111 latched1000 non-latched1001 temporary latched 1ms1010 temporary latched 1ms1011 temporary latched 2ms1100 temporary latched 25ms1101 temporary latched 50ms1110 temporary latched 100ms1111 latchedAn interrupt is generated if its activation condition is met. It can’t be cleared as long as the activation condition is fulfilled. In the non-latched mode the interrupt status bit and the selected pin (INT1 or INT2) are cleared as soon as the activation condition is no more valid. Exceptions to this behavior are the new data and orientation, which are automatically reset after a fixed time.In the latched mode an asserted interrupt status and the selected pin are cleared by writing 1 to (0x21) ‘reset_int’ bit. If the activation condition still holds when it is cleared, the interrupt status is asserted again with the next change of the acceleration registers.In the temporary mode an asserted interrupt and selected pin are cleared after a defined period of time. The behavior of the different interrupt modes is shown in figure 9.Figure 9 Interrupt mode4.3.2MappingThe mapping of interrupts to the interrupt pins is done by registers ‘INT_MAP_x’ (0x19 0x1a and 0x1b), setting int1_inttype (e.g. int1_freefall) to 1 can map this type of interrupt to INT1 pin and setting int2_inttyp to 1 can map this type interrupt to INT2 pin.4.3.3Electrical behavior (INT1/INT2 to open-drive or push-pull)Both interrupt pins can be configured to show desired electrical behavior. The active level for each pin is set by register bit int1_lvl (int2_lvl), if int1_lvl (int2_lvl) = 0 (1), then the pin INT1 (INT2) is 0 (1) active.Also the electric type of the interrupt pin can be selected. By setting int1_od (int2_od) = 1 (0), the interrupt pin output type can be set to be open-drive (push-pull).4.3.4New data interruptThis interrupt serves for synchronous reading of acceleration data. It is generated after an acceleration data was calculated. The interrupt is cleared automatically before the next acceleration data is ready.4.3.5Active detectionActive detection uses the slope between successive acceleration signals to detect changes in motion. An interrupt is generated when the slope (absolute value of acceleration difference) exceeds a preset threshold. The threshold is set with the value of register ‘active_th’ with the LSB corresponding to 16 LSB of acceleration data, that is 3.9mg in 2g-range, 7.8mg in 4g-range, 15.6mg in 8g-range and 31.3mg in 16g-range. And the maximum value is 1g in 2g-range, 2g in 4g-range, 4g in 8g-range and 8g in 16g-range.The time difference between the successive acceleration signals depends is fixed to 1ms.Active detection can be enabled (disabled) for each axis separately by writing ‘1’ to bits ‘active_int_en_x/y/z’. The active interrupt is generated if the slope of any of the enabled axes exceeds the threshold for [‘active_dur’+1] consecutive times. As soon as the slopes of all enabled axes fall below this threshold for [‘active_dur’+1] consecutive times, the interrupt is cleared unless the interrupt signal is latched.The interrupt status is stored in the (0x09) ‘active_int’ bit. The (0x0b) bit ‘active_first_x/y/z’ records which axis triggered the active interrupt first and the sign of this acceleration data that triggered the interrupt is recorded in the (0x0b) bit ‘active_sign’.4.3.6Tap detectionTap detection has a functional similarity with a common laptop touch-pad or clicking keys of a computer mouse. A tap event is detected if a pre-defined pattern of the acceleration slope is fulfilled at least for one axis. Two different tap events are distinguished: A single tap is a single event within a certain time, followed by a certain quiet time. A double tap consist a first such event followed by a second event within a defined time.Single tap interrupt is enabled by writing 1 to the (0x16) ‘s_tap_int_en’ bit and double tap interrupt is enabled by writing 1 to the (0x16) ‘d_tap_int_en’ bit. The status of the single tap interrupt is stored in the (0x09) ‘s_tap_int’ bit and the status of the double tap interrupt is stored in the (0x09) ‘d_tap_int’ bit.The slope threshold for detecting a tap event is set by the (0x2b) “tap_th” bits with the LSB corresponding to 256LSB。
科尼变频器中英文手册
2 START-UP PROCEDURE 启动步骤 .................................................................................... 209
3 PARAMETER ADJUSTMENTS 参数调整 ............................................................................... 23
3.1 Control keypad operation 控制显示屏操作 .................................................................. 23 3.1.1 Navigation on the control keypad 控制显示屏演示 ......................................... 25 3.1.2 Value line editing 数值的编辑........................................................................ 25 3.1.3 Passwords 密码 ........................................................................................... 26 3.1.4 Monitoring 监控 .......................................................................................... 287
高一英语《21世纪中学生英文报 第3637期》课件
4. When school was out, he would spend up to _1_5_h_o_u_rs_a day teaching himself languages.
5. Doner e posted videos about his language-learning experiences on YouTube .
又如：这个五岁的小孩写的和中学的学生一样 漂亮。
That five-year-old boy writes as beautifully as advanced high school 他st和ud他en妈ts妈. 一样高。 He is as tall as his mother.
3. Edwards received a Nobel Prize in 2010 and was knighted by Queen Elizabeth II the following year.
Comprehension: Answer the questions below
1. How many languages can Doner speak? Twenty-three.
2. Who taught him the languages? He taught himself.
3.What tools did he use to learn foreign language basics? Movies, TV dramas, instructional books and apps on his iPhone.
He was 87 years old.
2.Did people think test-tube babies would be successful at first ?
the test-tube affair课文续写
Title: The Test-Tube AffairThe story of the test-tube baby continued to make waves in the scientific community. As the technology became more advanced, more and more parents were turning to it as an option for having a child.One couple, John and Jane, had been trying for years to have a baby but were unsuccessful. They had gone through multiple rounds of fertility treatment, but nothing had worked. They were told by doctors that their chances of conceiving naturally were extremely low.After hearing about the success of test-tube babies, John and Jane decided to give it a try. They visited a leading fertility clinic and underwent the necessary tests and procedures. A few months later, they were thrilled to learn that their embryos had taken and they were pregnant.The pregnancy was smooth, and soon enough, a healthy baby boy was born. John and Jane named him Michael and doted on him with love and care. They felt like their dreams had come true, and they couldn't imagine life without him.However, some in their community had mixed feelings about the test-tube baby. Some thought it was unnatural and saw it as playing God. Others were concerned about the ethics of creating life in a laboratory dish, wondering if it was right to bring a child into the world without a father and mother.John and Jane ignored the critics and focused on raising their son. They believed that every child deserved a chance at life, and they were happy to have had the opportunity to give Michael that chance. As Michael grew, he became a happy and healthy child, full of life and energy.The test-tube baby controversy continued to rage on, but for John, Jane, and Michael, the only thing that mattered was the family they had created and the love they shared. They were living proof that with the help of technology, dreams could come true.。
试管婴儿技术(英文版)
1983．5．20 Singapore，boy，
1981．10．19 UK ，girl， the first mulatto test-tube baby
1981．12．28America， girl 1982．1．20 Greek ， girl 1982．2．24 French， girl
the first test-tube baby of southeast Asia
Gamete and embryo cryopreservation technology
A single sperm injection of Oocyte plasma
The technology of ooplasm substitution
The genetic diagnosis of embryos before planting
High cost for each offspring: an artificial insemination needs 2-30000 yuan, the successful rate is about 20%. The test-tube babys made by artificial fertilization have the three times higher risk of suffering from cerebral palsy. than by natural fertilization when they were born .
Up to now，the global test-tube babys have more than 3 billion.
3.Several common ivf
Drugs to stimulate superovulation Conventional in vitro fertilization and embryo transfer
组胚中植入的名词解释
组胚中植入的名词解释导言：组胚中植入的名词，在医学和生物技术领域内往往是一些关键性的概念和术语，对于理解和研究生物进化、生物医学和生殖技术等方面都具有重要意义。
本文将对几个与组胚中植入相关的名词进行解释，以期帮助读者更好地理解这些概念与技术。
1. 胚胎植入（Embryo Transfer）胚胎植入是生殖医学中的一种技术，指将由体外受精或人工授精产生的已受精卵移植至母体子宫内。
这项技术广泛应用于人类辅助生殖技术（ART）和动物繁殖领域。
胚胎植入通常在后期胚胎发育的特定阶段进行，以提高胚胎存活和植入成功率。
它为无法自然受孕的夫妇和动物提供了一种机会，能够实现他们的繁殖愿望。
2. 试管婴儿（Test-tube baby）试管婴儿是由体外受精（IVF）技术所产生的婴儿。
体外受精是指在实验室中将卵子和精子结合，使其在体外发生受精。
这个技术为那些无法以自然方式受孕的夫妇提供了一种选择。
在体外受精过程中，卵子和精子结合后产生的胚胎会经过培养，并在合适的时机被植入到母体子宫中进行妊娠。
3. 胚胎选择（Embryo Selection）胚胎选择是在IVF过程中的一项技术，旨在从多个受精卵中选择质量最好的胚胎用于植入。
通过评估胚胎的形态、发育阶段和染色体组成等因素，医生可以选择最具发育潜力和最有可能成功着床和发育成健康婴儿的胚胎。
这项技术能够提高IVF的成功率，并减少因为植入低质量胚胎而导致的妊娠失败率。
4. 人类胚胎干细胞（Human Embryonic Stem Cells）人类胚胎干细胞是从早期胚胎中提取的一类特殊细胞，具有自我更新和分化为多种不同类型细胞的能力。
这些细胞具有无限的增殖潜力，可以分化为心脏细胞、神经细胞、肝脏细胞等各种组织细胞，因此在再生医学和疾病治疗领域具有巨大潜力。
然而，人类胚胎干细胞的使用也带来了一些道德和伦理问题，因为要获得这些细胞需要对早期胚胎进行破坏。
5. 生殖克隆（Reproductive Cloning）生殖克隆是一种通过将个体的遗传物质植入一个无性生殖细胞质中，从而产生与捐赠者遗传物质完全相同的个体的技术。