0201 01005 chip component design assembly

Special pick up tools Inconsistent packaging Component size variation Static electricity charges/cover tape Component contingence requirements
0201 Component Placement
Solder Mask Defined Pads
Printed Board Layout
0.006”
0.150um
The component separation will decrease but will be limited by PCB fabrication issues rather than placement or design layout
Printed Board Layout Via-in-Pad
Open via design which is poor practice when using via in pad the visible voids in the x-ray are the result of the open vias
0201 - 01005 Filletless Assembly Design
With this type of footprint there is no fillet and the resulting joint is more like a bulbous joint one of the problems is paste contamination of the top surface of the component during placement. This then results in paste in or on the nozzle causing blockage
Printing 0201 Solder Paste Video
Video shows paste being printed on to a glass surface through stencil apertures
0201/01005 Component Placement Issues
Assembleon
Chip Component Static Pick Up
Harting Fair Production Line
Example production line set up to demonstrate lead-free assembly with complete component range, including 01005 and intrusive reflow connectors
Maximum Temperature Recorded 247oC
Temperature Differential DT 17oC
Lead-Free Vapour Phase Soldering
Maximum Temperature Recorded 233oC
Temperature Differential DT 3oC
01005 Chip Component Joints
Tombstone only seen on reflow video simulations not on production, so far!!
Throughput capability for the highest thermal demand board. Fast cooling capability with option of nitrogen System needs positive board support, measured down stop force and height control vision/pressure check on part pickup. Capability for small tape feed
Component Lift & Tombstoning
Video simulation on NPI design trials and defect investigations
Solder Paste Stencil Design
Laser cut stencil 0.005”/125um stainless steel 0.006”/150um stainless steel Electroform 0.004”/100um nickel provided the best results with a type 4 powder Stencil aperture size for size with pads with rounded corners for better paste release
Component Placement 01005
Assembleon
Productronica 0201 Test Board
0.012” (0.30mm)
0.016” (0.42mm)
0.007” (0.18mm)
01005 Chip Component Assembly
0.007” (0.180mm)
0201-01005 Chip Component Design & Assembly
Bob Willis
Edited by Bob Willis – 2002 for the Red Cross 9/11 Fund
0.010” (250um)
0.020” (500um) 0.010” (250um)
AOI inspection with proven capability for 01005 placement, solder joint and QFN termination joints
Stencil for 01005 & 0201 areas need to be 0.004”/100um. Solder paste particle size 4 is necessary. Printer needs to be capable of ultra fine pitch and repeatable with positive board support 3D vision or separate AOI station
Convection Reflow with Lead-Free
Poor coalescence of solder paste particles due to flux exhaustion on 0201 chip. Poor coalescence of solder paste particles due to flux exhaustion on 01005 chips in air reflow.
Printed Board Layout
Direction of component placement does not have an impact on reflow based on trials with convection or vapour phase reflow
Printed Board Layout Via-in-Pad
Printed Board Layout
Although changing the stencil overcomes production problem its better to correct the cause, otherwise the design defect then is recreated on future designs
LGA/QFN Via Hole Options
Printed Board Layout Via-in-Pad
Mobile phone application with blind, stacked vias with resist defined pads and fillet less joints the photographs are taken from microsections as part of a product teardown
Reflow Soldering 01005 with Lead-Free Paste
Chip Resistors
Chip Capacitors
X-Ray Images of 01005 Chip Joints
X-ray images of capacitors and a resistor after convection reflow in air
Process Defects - Billboards
01005 Chip Component Assembly
0201 Rework and Repair
01005 Rework and Repair
Video Clip showing rewChip Component Tape
Package On Package Assembly
Package on Package Microsections
Microsections taken from a 14mm package
X-Ray Inspection of Joints
Images of a four high package POP with larger base balls and some evidence of solder balling on the PCB. Evidence was also found on different layers of the component.
0.007” (0.18mm) 0.008” (0.20mm)