7 涂层缺陷(IP-中英对照)

合集下载

7 常见涂层缺陷的定义预防和处理方法

7  常见涂层缺陷的定义预防和处理方法
4)强溶剂涂料,如乙烯沥青涂料在物理干燥型涂料表面
For internal use only – not to be circulated outside AkzoNobel
Protective Coatings
开裂
• 钢材本身的热胀冷缩 • 老化发硬的涂料
如醇酸树脂涂料等 柔韧性不足
For internal use only – not to be circulated outside AkzoNobel
钢材
For internal use only – not to be circulated outside AkzoNobel
Protective Coatings
起泡的原因:二、表面有杂质
表面有油污、石蜡和灰尘等 潮气会向着涂层附着力低的地方渗透而起泡
For internal use only – not to be circulated outside AkzoNobel
变色
• 变色通常是树脂和颜料的问题 • 芳香族的聚氨酯面漆会在紫外下变黄
(脂肪族不存在这个问题) • 环氧树脂和亚麻油涂料容易泛黄 • 含铅颜料的面漆会在含硫大气中变深,
变黑
For internal use only – not to be circulated outside AkzoNobel
胺起霜是水溶的,能被干净的温水抹去
在重涂前必须除去胺的起霜
For internal use only – not to be circulated outside AkzoNobel
Protective Coatings
起皱
涂层表面起皱,通常是的原因是: 油性漆、醇酸和酚醛涂料涂 如果得过厚,表面吸氧膨胀, 而下层尚未起氧化反应 过量的表面催干剂,涂层厚 的地方起皱 烘烤型涂料,表面固化远快 于本体固化 温度太高时施工

缺陷中英文对照

缺陷中英文对照
鐵輪 形狀 銳邊/利邊 利角 短電路 縮水 絲
劃形狀 皮 薄的
裂片 細小
弄髒
布類玩具
沾污
焊錫 溶劑 穩定 編法
poor embroidery poor hair inter-lock stitching poor hair style poor heat sticking poor hot melting poor hot stamp poor hot stamping poor lock stitching poor booted hair poor sewing poor silk-screening poor sketching poor stitch poor stuffing pucker ribbon fray rough surface scratch mark screw burst screw came off screw rust screw unfasten seam allowance expose seam open sewing label loosen sewing machinery mark stitching hole stuffing disproportion stuffing expose/cotton expose stuffing expose the eyes can't move smoothly thread trapped by seam under glue uneven shape uneven stuffing untrimmed thread use unmatched swatches in one boll white powder on body velcro come off/magic tape come off velcro detach velcro position too hight/low water stain mark wrong assembly wrong/missing part

注塑件缺陷中英文对照表

注塑件缺陷中英文对照表

注塑件缺陷中英文对照表中文英文-------- --------------------起泡 Blister起霜 Blooming破孔 Blow hole泛白 Blushing侧壁皱纹 Body wrinkle冒口带肉 Breaking-in膜泡、气泡 Bubble糊斑 Burn mark毛边(金属) Burr (for metal)翘曲 Camber气泡 Cell表面中部波皱 Center buckle细裂痕 Check龟裂 Checking修整表面缺陷 Chipping铸件凹痕 Clamp-off塌陷 Collapse色斑 Color mottle腐蚀 Corrosion外观不良 Cosmetic defect裂痕 Crack碎裂、龟裂 Crazing变形 Deformation切边碎片 Edge裂边 Edge crack退色 Fading填充料斑 Filler speak裂纹 Fissure凸缘起皱 Flange wrinkle毛边 Flash刮伤 Flaw流痕 Flow mark, flow line字体模糊 Foggy毛边 Galling光滑 Glazing光泽 Gloss污斑 Grease pits油污、脏污 Grease, oil stains 磨痕 Grinding defect发裂 Haircrack雾度 Haze水锈 Incrustation杂质 Inclusion压痕 Indentation内部气孔 Internal porosity发霉 Mildewed, moldy, mouldy偏模 Mismatch杂色 Mixed color斑点 Mottle缩颈 Necking割痕 Nick橘皮状表面缺陷 Orange peel溢流 Overflow剥离 Peeling, peel-off坑 Pit点状腐蚀 Pitting corrosion模板印痕 Plate mark麻点 Pock痘斑 Pock mark树脂流纹 Resin streak树脂脱落 Resin wear凹陷 Riding松垂 Sagging皂化 Saponification疤痕 Scar废料 Scrap废料阻塞 Scrap jam刮伤、划痕、划伤 Scratch深冲表面划伤 Scuffing裂痕 Seam模口挤痕 Shock line充填不足 Short shot凹孔 Shrinkage pool缩水 Shrinking, shrinkage凹痕、凹陷 Sink mark, shrink Line , sink mark表皮折迭 Skin inclusion螺丝滑头、滑手 Slipped screw head, slippery screw thread 斑点 Speckle矫直 Straightening条状痕、条纹 Streak表面裂痕 Surface check橘皮状表皮皱折 Surface roughening波动 Surging冒汗 Sweat out扭曲 Torsion翘曲 Warpage波痕 Waviness熔塌 Webbing焊痕、熔接线 Weld mark, weld line 白化 Whitening皱纹 Wrinkle。

印制电路板各工序缺陷中英文一览

印制电路板各工序缺陷中英文一览

Inner layer dry/film 内层干菲林Blocking boards 卡板Lack copper 少铜Inner scrap 内层报废Uncomplete tearing film 撕膜不净Soft inner 内层变软Conductor lift 崩线Inner misregistration 内层错位Bulge on conductor 线路凸位Inner short 内层短路Poor conductor 线路不良Inner open 内层开路Pattern misregistration 线路图形歪Inner slight short 内层微短Elliptical hole 椭圆孔Pressing 压板DRY PLY DRY PLY Inner shift 内层偏位Tg value out of spec. Tg超出要求Inner hole position incorrect 内层歪孔Tg value not meet the requirement Tg达不到要求Lay up in reverse 排反板Dent凹折The incision length not meetthe requirement切割长度达不到要求Measling 白斑Board poor cutting 切坏板Poor edge 板边不良Burnt 烧焦Burrs on board edge 板边毛刺The resin content lower thanthe requirement树脂含量低于要求Resin shortage in board edge 板边缺树脂Void in resin 树脂空洞Fibre in board edge 板边纤维丝Dissipation factor beyondcriteria损耗因子达不到要求Thin board thickness 板薄Make wrong guide hole 挑错管位Excess board thickness 板厚Thinner copper thickness 铜箔偏薄Board out of spec. 板厚不合要求Dlamination between surfacecopper and prepreg铜箔气泡Lamination wrinkles 板料布纹Bow and twist out of spec 弯曲性超标Lamination blisters 板料气泡Dusty and damage 污损Rough board surface 板面不光滑Absorption beyond criteria 吸水性超标Board surface extrusion 板面突起Construction of fiber not meetrequirement纤维结构不符要求Dent by pressing board 板面压伤Pressing dent 压板凹痕Board warp/bow 板弯/曲Poor lamination 压板不良Board small 板小Failed pressure vessel test 压力锅测试未达标Protective film too thick or thin 保护膜偏厚&偏薄Fracture 压伤Delamination 爆板Oxide 氧化Peel strength under requirement 剥离强度未达标Misuse prepreg 用错P片Black oxide scratch 擦花黑化Laminate misused 用错板料Layer structure not meet MIrequirement层压结构不符MI要求Misuse inner P/R 用错内层P/R Poor dimensional stability 尺寸稳定性未达标Misuse Cu coil 用错铜箔Delamination/Blister 分层/起泡Weave texture 织纹显露Poor cutting 割板不良Wrinkles 皱折痕Guide hole over size 管位大孔Marked legend shift 字唛打偏Guide pin shift 管位钉打偏Marked legend in unit 字唛入单元Guide hole shift 管位歪孔Stain on board 板面污渍Poor black oxide 黑化不良Bow 板弯Board slip in pressing 滑板Copper clad thickness underspec.表面铜薄Foreign material in laminate 基材内异物Copper clad thickness overspec.表面铜厚Joint glue too thick or thin 接着剂偏厚&偏薄Drilling wrong guide hole 打错管位Unqualified dielectric layer 介电层不合格Inner layer cu thickness underspec.内层铜薄Thin dielectric layer thickness 介电层偏薄Inner layer cu thickness overspec.内层铜厚Excess dielectric layer 介电层偏厚Foreign material in innerlayer内层杂物Electronic inductivity beyond standard 介电常数未达标Length and width not meetspec.外围尺寸不符合要求Cutting wrong laminate 开错料Marking wrong 打错字唛Missing guide hole 漏打管位Missing marking 漏打字唛Missing black oxide 漏黑化Poor staff 板料不良Exposed/Disrupted fibres 露纤维/纤维断裂Poor marking 打字唛不良Routing guide hole shift 锣偏管位孔Board break 板裂Pits 麻点The joint of copper foil 铜箔接口Inner white spot 内层白点Skipping inner-layer 少排内层Improper inner layer 内层不配套Skipping prepreg 少排P片Inner scratch 内层擦花Pattern perforation 线路穿孔Inner pink ring 内层粉红圈Poor mechanical pressing 机械压伤不良Inner glue residue 内层胶渍Drilling 钻房Broken guide hole 打爆管位Hole diameter over size 钻大孔Drill bit broken 断针Drilling extra hole 钻多孔Scrape 刮花Drilling in reverse 钻反孔Deformed hole 孔变形Poor drilling 钻孔不良Burrs in hole 孔内披锋Drilling un-through 钻不穿Drilling skip 漏钻孔Drilling hole misalignment 钻歪孔Drilling wrong boards 钻错板Hole diameter under size 钻小孔Drilling wrong hole 钻错孔Hole damaged 钻炸孔Tenting hole/Plugging 塞孔PTH/PP 沉铜/板面电镀Board surface dent 板面凹痕Copper thread in hole 孔内铜丝Board surface copper nubbles 板面铜粒No copper in hole 孔内无铜Board folding and breaking 板折坏Copper in hole(NPTH)孔内有铜(非镀铜孔)Poor plating 电镀不良Board damaged by scrubbing 磨坏板The plating thickness not uniform 电镀层不均匀Plating copper peel off 铜层剥离Rough plating 电镀粗糙Wicking 渗铜Hole plugged by plating 电镀塞孔Drilling hole failure 钻飞孔Burnt board by plating 电镀烧板Board scratched by machine 机械刮伤Boards-drop into the tunnel 缸底板Mechanical drilling holemisalignment机械钻歪孔Burrs on hole-edge 孔边毛刺Poor mechanical drilling 机械钻孔不良Rough hole wall 孔粗Big hole of mechanicaldrilling机械钻大孔Hole black 孔黑Extra hole of mechanicaldrilling机械钻多孔Missing hole of mechanicaldrilling机械钻漏孔Dry/Film 干菲林Hole breakout 崩孔Glue residue 胶渍Film scratch 擦花菲林Missing PAD 漏PAD Scratching prevent tin 擦花锡面Missing date code 漏印周期Under developing 冲板不净Poor in D/F lamination 辘菲林不良Over developing 冲板过度Poor exposure 曝光不良Broken dry film 穿菲林Exposure foreign material 曝光垃圾Overlap boards 叠板Bleeding copper plating(wicking)渗镀Same location trace open 定位断线Peel off D/F 甩菲林Short 短路Misuse film 用错菲林Trace open 断线Foreign inclusions 杂物Put wrong D/F 放错菲林Pin hole 针孔Put D/F in reverse 放反菲林Unclear date code 周期不清Film wring 菲林起皱Mistake date code 用错周期Film in hole 菲林入孔Foreign material under film 菲林下杂物D/F residue 菲林碎Pattern plating & Etching & M/I图电/蚀刻/中检Dishdown 碟形凹痕Trace undersize 线幼Dirty 板污Chemical solution polluting 药水Copper residue 残铜Lower impedance 阻抗偏低Dropped D/F 掉菲林Higher impedance 阻抗偏高Poor tin plating 镀锡不良Resistance out of requirement 电阻不合要求Trace broken by clamper 夹崩线路Hole knocked down 撞崩孔D/F clamping 夹菲林Trace shift (by damage) 撞歪(断)线Under etching 蚀板不净Scrap by machine blocking 塞机报废Over etching 蚀板过度Mechanical broken trace 机械撞断路Unclear etching legend 蚀字不清Poor circuit reworking 补线不良Thin copper plating 铜薄Poor rework 修理不良Excess copper thickness 铜厚Burned trace open 烧断线Film under stripping 褪菲林不净SMT PAD undersize 锡手指幼Tin under stripping 褪锡不净Edge roughness(dull line) 线路狗牙Thin tin coating 锡薄Trace spacing undersize 线隙不足Nicks 缺口Boards damaged 板损坏W/F 湿绿油Board discolor 板黄S/M on SMT PAD 绿油上锡手指S/M skipping 不过油Foreign material under S/M 绿油下杂物Scratch 擦花Poor S/M color 绿油颜色不良Damaged by pin pressing 钉床压伤Poor scrubbing 磨板不良Weave exposure 基材白点Solder mask bleeding 渗油Board poor baking 焗坏板Hand print 手印Expose cu in hole 孔内露铜Solder mask peel off 甩油Exposed conductors 露线Over micro-etching 微蚀过度S/M skip 漏印绿油S/M on PAD 绿油上焊盘S/M uneven 绿油不匀Missing boards 遗失板S/M under developing 绿油冲不净Misuse W/F net 用错W/F网Solder mask misregistration 绿油偏位S/M thickness under spec. 油薄Solder mask blistering 绿油超泡Solder mask over developing 绿油冲过度Solder mask wrinkles 绿油起皱Misuse solder mask 用错油墨Solder mask in hole 绿油入孔S/M thickness over spec. 油厚S/M on gold finger 绿油上金手指C/M 白字C/M in hole 字符入孔Plugging hole shift 塞偏孔C/M on PAD 字符油上焊盘Unclear trademark 商标不清Mark Illegible 字符不清Double C/M 双重白字Legend dissolved 字符溶解Poor carbon ink 碳油不良Carbon ink on board 板面有碳油Carbon ink short 碳油短路Broken ink 爆油Carbon ink saw-tooth shaped 碳油狗牙Yellow C/M in hole 黄油入孔Missing print C/M 印错字符Peelable mask in hole 蓝胶入孔Misuse black oil net 印错黑油网Missing plug hole 漏塞孔Wrong trademark 印错商标Missing C/M 漏印字符Askew C/M 印歪字符S/M blocking hole 绿油塞孔Misuse C/M net 印错字符网Poor plug hole 塞孔不良Exposed conductor 露导体Illegible legend 字符残缺Carbon ink peel off 甩碳油Carbon ink bleeding 渗碳油C/M peel off 甩字符Return cycle print 返印周期Misuse carbon ink net 用错碳油网Solder powder 锡粉HAL 喷锡Scratching solder legend 擦伤锡字Solder thickness over spec. 锡厚Dent in gold finger 金手指凹痕Solder thickness under spec. 锡厚度不足Scratching gold finger 金手指擦花Gray solder 锡面灰Expose cu on gold finger 金手指露铜Tin blocking hole 锡塞孔Solder on gold finger 金手指上锡Line peel off 线路剥离Dirty hole 孔灰Solder on trace 线路上锡Poor melting 熔锡不良Solder on S/M 板面上锡PAD peel off 甩焊盘Non-wetting 不上锡Copper peel off 甩铜Solder whiten 锡白Solder peel off 甩锡Solder surface roughness 锡面粗糙Excessive solder 锡高Solder thread in hole 孔内锡丝Dewetting 缩锡Undersized hole 孔细SMT PAD damaged 损坏锡手指Rust solder 锈色G/F plating & Immersion gold 金手指电镀&沉金Gold burnt in plating 电镀烧金Gold bleeding 渗金Poor gold plating 镀金不良Water residue 水渍印Poor Ni plating 镀镍不良Poor gold stripping 褪金不良Gold plating skip 漏镀金White hole edge 孔边发白Ni plating skip 漏镀镍No gold in hole 孔内无金Ni thickness under spec. 镍薄Gold on guide hole 管位孔上金Gold on trace 线路上金Gold or Ni peel off 甩金镍Ni or gold skipping SKIP Watercolor printing 水纹印Gold on the edge 板边有金Chemical solution on goldsurface药水上金面Poor gold immersion 沉金不良Rough G/F 金手指粗糙Gold whiten 金白G/F damaged 金手指损坏Gold thickness under spec. 金薄Ni spot on board surface 板面镀上镍Poor gold color 金颜色不良Nodule on G/F 金手指有突出块Pin hole on G/F 金手指针孔Profiling 外形加工Poor V-cut V坑不良Board damaged by punching 啤坏板Too shallow V-cut V坑过浅Damage G/F by punching 啤坏金手指Excess depth of V-cut V坑过深Damage board by model 啤模压伤V-cut shift V坑偏位Double V-cut 双重V坑Dimension not meet requirement 尺寸不合要求Out of upper tolerance 外围偏大Missing V-cut 漏V坑Out of lower tolerance 外围偏小Miss routing board 漏锣板Poor bevel 斜边不良Miss punching boards 漏啤板Board cracked by punching 啤爆板Poor routing edge 锣边不良Bevel edge over size 斜边偏大Board damaged by routing 锣坏板Bevel edge under size 斜边偏小Poor punch 啤板不良Missing slot hole 漏SLOT孔Hole cracked by punching 啤爆孔Missing routing G/F bevel edge 漏锣G/F斜边Damaged board 烂板Miss routing hole 漏锣孔Measling after punching 啤后有白点Miss punching hole 漏啤孔Rouging board scrapped by machine 机械锣坏板Outdated boards 周期过期Others 其它Unclear E-T E-T印不清Outdated boards 过期板Damaged edge 板边损坏Old boards(stocked boards 旧板(存仓板)Damaged corner 板角损坏Old boards (customers cleanboard)旧板(客清板)Dent by E-Test 电测压伤Customer returned boards 客户退货Broken board 断板Collected mantissa boards 清尾数板Missing E-T stamp 漏盖E-T印Wrong REV 做错REVOut of inner scraps 超出内层报废ME trial ME试验Old REV 旧REVPE scrap PE报废Receive extra order 接多单QA trial QA试验PPC changed revision PPC转版本ME take board ME取板PE take board PE取板Overdue prepreg 过期P片QA take board QA取板Prepreg broken P片折裂PMC take board PMC取板Black yarn 黑纱Return to material vendor RTV物料供应商Black spot 黑点Return to machine vendor RTV机器供应商Prepreg wrinkle P片折痕Return to subcontractor RTV外发供应商Resin not proportion 树脂分布不均Yellow spot 黄斑(点) Smeary 油污Glue particle 胶粒(印) GT not meet requirement GF不符合要求Fish-eye 鱼眼Dimension deviation 尺寸偏差Extract yarn 抽纱Design defect 设计错误Digging hole 挖洞Distribute wrong laminate 发错物料Dry-ply 树脂脱落Returned materials 退料Discolor 变色White spot in prepreg P片白点Roll edge not neat 卷边不齐Dry ply in prepreg P片缺树脂Cloth weight out of spec. 布重超标Texture expose in prpreg P片织纹显露R/C not meet requirement 树脂含量不符要求Material in prepreg P片杂物F/L not meet requirement 比例流量不符要求Water dipped prepreg P片浸水The joint of cloth decrease 接布头减少Incoming quantity is notenough来料数量不足Voids 空洞Nodules/Burrs 结瘤/披锋Scratches and dents 擦花和凹痕Voids-Copper plating 铜镀层空洞Weave exposed 露织物Plating voids –Finishedcoating成品涂覆层的镀层空间Crazing 微裂纹Panel scratches and dents 板面擦花与凹痕Exposing copper in hole(voids) 孔内露铜(破洞) Skip coverage 跳印Nonmetallic burrs 非金属披锋Weaves/wrinkles/Ripples 波纹/皱褶/皱纹Metallic burrs 金属披锋Tenting (Via holes) 封孔(导通孔) Haloing 晕圈Soda strewing 毛细管空隙Etch back 回蚀Roughness 孔粗Negative etch back 负回蚀Flare 锥口Resin recession 树脂凹痕。

PCB及PCBA缺陷中英文对照表

PCB及PCBA缺陷中英文对照表

1板面凹痕dent2内层白斑I/L white spot3线路缺口circuit nick4蚀刻不净undering etching5绿油剥离S/M peel off6显影不净under developing7基材白点laminate measling 8铜面氧化copper oxi9绿油上焊盘s/m on pad10白字上焊盘c/m on pad11阻焊不良poor S/M12线路擦花 track scratch13锡上线sn on circuit14聚锡sn mass15锡灰sn gray16焊盘露铜copper exposed on pad 17锡上金手指sn on G/F18金手指凹痕G/F dent19金手指擦花G/F scratch20金手指粗糙G/F roughness21v-cut不良poor V-cut22倒边不良poor milling23针床压伤ET den24拖锡不良poor touch up25补金不良poor repairing Au26补油不良poor repairing s/m27针孔pinhole28胶渍paster stain29k孔内毛刺burrs in hole30锡珠入孔solder in hole31露铜expose Cu 40翘板warp41漏印字符skip42金粗Au too big43金簿Au too thin44金手指缺口G/F voids/nick on G/F 45金手指发黑G/F too black46字符印反inverse C/M47金手指针孔G/F pinholes48标志不清symbol unclear49标志错symbol wrong50绿油鬼影ghost in S/M51手指印finger print52补线不良poor line repairing53锡高exessive solde54孔小hole undersize55字符错wrong C/M56字符印偏C/M misalignment57字符入孔C/M in hole58字符重影C/M doubloe image59漏镀金手指missing plating G/F 60金手指发白G/F gray61焊盘脱落pad break off/pad peel off 62焊盘露铜pad expose cu63断绿油桥missing S/M bridge64塞孔block hole65水迹water print66锡珠solder ball67砂孔pitting68油薄69聚油excess solder mask70锡粗Sn too thick32露镍expose Ni33绿油起泡solder mask blister 34绿油起皱solder mask winbles 35金手指氧化G/F oxiding36金颜色不良Au discoloration 37金面凸起Au surface blister 38绿油入孔solder mask in hole 39爆板board angle damafe 71线路上锡Sn overlap scratch72绿油下杂物contamination under S/M 73焊盘损坏land damage74焊盘翘起lifted land75偏位misregistration76漏钻孔missing hole77焊盘缺口nick on pad78线路缺口nick on trac1开路open circuit2短路short circuit3线路缺口circuit nick4线路凹痕circuit dent5渗镀plating Bloody6焊盘缺口pad nick7内层白斑I/L white spot8黑化不良poor B.O9白斑measling10粉红圈pinking ring11层压起泡press blister12错位misregistation13偏位shift14孔内无铜no Cu on PTH15孔内毛刺hole burrs16 NPTH有铜Cu on NPTH17铜面露基材exposed laminate 18铜面凹痕dent on Cu surface 19胶渍gum residue20夹膜D/F nip21蚀刻不尽under etching22线幼line too thin23孔大hole oversize24孔小hole undersize25偏孔hole misregistration26铜面瘤粒Cu nodule27显影不尽under developing28铜面刮伤scratch on Cu surface 29塞孔hole plugged30修理不良poor repairing 31铜薄copper too thin32内层擦花I/L scratch33内层偏位I/L misregistation34内层杂物I/L inclusions35掉膜film off36干膜碎D/F meaking37退锡不尽poor Sn stripping38间隙小space too marrow39板薄board too thin40板厚board too thickness41针孔pinhole42崩孔breakout43侧蚀undercut44镀层粗糙plating layer roughness45亚色dull colour46焊盘翘起lifted land47漏钻孔missing hole 线路狗牙circuit wist 48露布纹weave exposure49钻偏孔hole misregistratiion50孔损害hole damage51基材分层delamination52蚀刻过度over etching53多孔hole too much54残铜remain Cu55孔内露基材laminate exposure in hole 56焊盘脱落pad break off57焊盘凹痕pad dent58焊盘凸起pad bulge59焊盘损坏pad damaged60焊盘缺口pad nick61焊盘露铜pad expos。

涂料常见缺陷名词英汉对照及其成因

涂料常见缺陷名词英汉对照及其成因

缺陷名词英汉对照及其成因发浑 clouding:清漆,清油或稀释剂由于不溶物析出而呈现云雾状不透明现象.原漆变色 discoloration of paints or varnishes涂料在贮存过程中,由于某些成分的化学或物理变化或者与容器发生化学反应而偏离其初始颜色的现象.增稠 thickening涂料在贮存过程中,通常由于稀释剂的损失而引起的稠度增高现象.变稠 fattening色漆在贮存过程中,由于组分之间发生化学反应而引起的稠度增高(不一定增加到不能使用的程度),体积膨胀的现象.同义词:变厚;发胀.絮凝 flocculation在色漆或分散体中形成附聚体的现象.胶化 gelling涂料从液态变为不能使用的固态或半固态的现象.结皮 skinning涂料在容器中,由于氧化聚合作用,其液面上形成皮膜的现象.沉淀 settling涂料在贮存过程中,其固体组分下沉至容器底部的现象.同义词:沉底;沉降.有粗粒 seed涂料在贮存过程中展现出的粗颗粒(即少许结皮,凝胶,凝聚体或外来粗粒).返粗 pig ski色漆在贮存过程中,由于颜料的絮凝而使研磨细度变差的现象.发花 floatin含有多种不同颜料混合物的色漆在贮存或干燥过程中,一种或几种颜料离析或浮出并在色漆或漆膜表面集中呈现颜色不匀的条纹和斑点等现象.浮色 floodin发花的极端状况.某些颜料浮升至表面,虽漆膜表面颜色均匀一致,但明显地不同于刚施涂时的湿膜颜色.起气泡 bubblin涂料在施涂过程中形成的空气或溶剂蒸气等气体或两者兼有的泡,这种泡在漆膜干燥过程中可以消失,也可以永久存在.针孔 pin-holes一种在漆膜中存在着类似于用针刺成的细孔的病态.它是由于湿漆膜中混入的空气泡和产生的其他气泡破裂,且在漆膜干燥[固化]前不能流平而造成,也由于底材处理或施涂不当(漆膜过厚等)而造成.起皱 wrinkling漆膜呈现多少有规律的小波幅波纹形式的皱纹,它可深及部分或全部膜厚.皱纹的大小和密集率可随漆膜组成及成膜时条件(包括温度,湿膜厚度和大气污染情况)而变化.橘皮 orange skin漆膜呈现橘皮状外观的表面病态.喷涂施工(尤其底材为平面)时,易出现此病态.发白 blushing有光涂料干燥过程中,漆膜上有时呈现出乳白色的现象.这是由于空气中水气在湿漆膜表面凝露和(或)涂料中的一种或多种固态组分析出而引起的.流挂 runs;sags;curtains涂料施涂于垂直面上时,由于其抗流挂性差或施涂不当,漆膜过厚等原因而使湿膜向下移动,形成各种形状下边缘厚的不均匀涂层.丝纹 ropiness在湿漆膜表面呈现的近似平行的线状条纹,且在漆膜干燥之后这种条纹仍然存在.这是由某些施涂方法而带来的一种病态.如在浸涂或流涂时,丝纹是沿着流动的方向出现;在刷涂时,丝纹则沿最后刷涂漆膜的刷涂方向出现.刷痕 brush mark刷涂后,在漆膜上留下的一条条脊状条纹现象.这是由于涂料干燥过快,粘度过大,漆刷太粗硬,刷涂方法不当等原因使漆膜不能流平而引起的.收缩 cissing漆膜的若干部位呈现出程度不同,分布状态各异的厚薄不匀的外观.这是由于湿漆膜与底材(或干漆膜)间的界面张力太大,润湿性小,底材表面处理不好,含有油污湿气,喷涂时管线混入油水等而引起的.缩孔 cratering漆膜干燥后仍滞留的若干大小不等,分布各异的圆形小坑的现象.此病态俗称为麻坑[点].厚边 fat edge涂料在涂漆面边缘堆积呈现脊状隆起,使干漆膜边缘过厚的现象.这是由于不正确的施涂而造成的.漏涂区 miss在某些应涂漆部位而完全没有漆膜形成的一种病态.通常由于涂漆操作未按规定而造成.接痕 lapping defect在同一天的涂漆过程中,由于涂料先后不同,而在底材上各漆区的边缘接碴处呈现凸起的现象. 咬底 lifting在干漆膜上施涂其同种或不同种涂料时,在涂层施涂或干燥期间使其下的干漆膜发生软化,隆起或从底材上脱离的现象(通常的外观如起皱).渗色 bleeding来自下层(底材或漆膜)的有色物质,进入并透过上层漆膜的扩散过程,因而使漆膜呈现不希望有的着色或变色.不盖底 non-hiding涂于底面(不论已涂漆与否)上的色漆, 干燥后仍透露出底面的颜色的现象. 同义词:露底show-through.闪光 flashing局部漆膜(尤其在接碴处)光泽高于整体漆膜光泽的现象.通常由于漆膜厚薄不匀引起.起霜花 frosting漆膜表面呈现许多多边形蛛网形细皱纹的现象.同义词:起晶纹.爆孔 popping由底材上一些活性物颗粒爆发,致使其上已部分固化的漆膜出现一个个圆锥形坑穴的现象.漆膜变色 discoloration of film漆膜的颜色因气候环境的影响而偏离其初始颜色的现象.它可包括褪色,变深,漂白,变白等. 漂白 bleaching色漆漆膜因经受酸碱等化学作用,致使其颜色逐渐变浅,最终完全变白的现象.这主要是由于色漆中颜料发生化学作用而分散,失去原有色彩所造成的.破坏 perishing漆膜在老化过程中呈现的各种性能变坏的现象.例如由漆膜强度,柔韧性,附着力等降低,或出现开开明和剥落等现象.起霜 bloom在原来有光泽的漆膜表面上呈现乳白色似霜附着物的现象.在起霜的初始阶段很容易用湿布将霜擦去.同义词:起雾.失光 loss of gloss漆膜的光泽因受气候环境的影响而降低的现象.同义词:倒光,英文同义词:dulling; lost of gloss.变白 whitening漆膜经受水,汽油等液体浸泡后,由于发生蜂窝状的溶胀,而使其表面呈现乳白色的现象.轻微的变白会随液体挥发而消失;严重的变白,即使液体挥发后,漆膜也不能恢复原状.溶胀 swelling漆膜经受液体浸泡后,由于液体渗入整个漆膜,而使其发生增厚,变软的现象.同义词:膨胀;泡胀.软化 softening漆膜经受液体浸泡后,由于溶胀而硬度明显变低的现象.同义词:发软.起泡 blistering涂层因局部失去附着力而离开基底(底材或其下涂层)鼓起,使漆膜呈现似圆形的凸起变形.泡内可含液体,蒸气,其他气体或结晶物.开裂 cracking漆膜出现不连续的外观变化.通常是由于漆膜老化而引起.它的比较重要的几种形式如下.微裂 hair-cracking很细浅的表面裂纹且分布不规则的一种开裂形式.同义词:发丝裂.细裂 checking细浅的表面裂纹且大体上以有规则的图案分布于漆膜上的一种开裂形式.同义词:网状细裂. 小裂 crazing类似于细裂,但其裂纹较为深宽.深裂 deep cracks裂纹至少穿透一道涂层的一种开裂形式,最终可导致漆膜完全破坏.龟裂 crocodiling(or alligatoring)宽裂纹且类似龟壳或鳄鱼皮样的一种开裂形式.同义词:鳄裂.剥落 peeling一道或多道涂层脱离其下涂层,或者涂层完全脱离底材的现象.同义词:脱落;脱皮.粉化 chalking漆膜表面由于其一种或多种漆基的降解以及颜料的分散.而呈现出疏松附着细粉的现象.脆化 embrittlement漆膜由于老化等原因,致使其柔韧性变坏的现象.英文同义词:embrittling.回粘 after tack干燥不发粘的漆膜表面随后又呈现发粘的现象.同义词:回粘性;返粘性.长霉 mildew-growing在温热环境中,漆膜表面滋生各种霉菌的现象.同义词:生霉;霉染.英文同义词:mold-growing,fungus-growing.生锈 rusting漆膜下面的钢铁表面局部或整体产生红色或黄色的氧化铁层的现象.它常伴随有漆膜的起泡,开等病态.同义词:锈蚀.生白锈 white-rusting漆膜下面的有色金属表面局部或整体产生白色粉状氧化层的现象.它常伴随有漆膜的起泡,开裂,片落等病态.针孔状腐蚀 corrosion pin-holes漆膜表面呈现(许多)非常小的圆形腐蚀斑点的现象.这是由金属底材的腐蚀产物引起的.丝状腐蚀 filiform corrosion漆膜由于其下的金属表面发生细丝状腐蚀而呈现的疏松线状隆起的现象.这种丝状腐蚀常由一个或几个腐蚀生长点辐射而成.。

PCB及PCBA缺陷中英文对照表

PCB及PCBA缺陷中英文对照表

1板面凹痕dent 41漏印字符skip2内层白斑I/L white spot 42金粗Au too big3线路缺口circuit nick 43金簿Au too thin4蚀刻不净undering etching 44金手指缺口G/F voids/nick on G/F5绿油剥离S/M peel off 45金手指发黑G/F too black6显影不净under developing 46字符印反inverse C/M7基材白点 laminate measling 47金手指针孔G/F pinholes8铜面氧化copper oxide 48标志不清symbol unclear9绿油上焊盘s/m on pad 49标志错symbol wrong10白字上焊盘c/m on pad 50绿油鬼影ghost in S/M11阻焊不良poor S/M 51手指印finger print12线路擦花 track scratch 52补线不良poor line repairing13锡上线sn on circuit 53锡高exessive solder14聚锡sn mass 54孔小hole undersize15锡灰sn gray 55字符错wrong C/M16焊盘露铜cu exposed on pad 56字符印偏C/M misalignment17锡上金手指sn on G/F 57字符入孔C/M in hole18金手指凹痕G/F dent 58字符重影C/M doubloe image19金手指擦花G/F scratch 59漏镀金手指missing plating G/F20金手指粗糙G/F roughness 60金手指发白G/F gray21v-cut不良poor V-cut 61焊盘脱落pad break off/pad peel off 22倒边不良poor milling 62焊盘露铜pad expose cu23针床压伤ET dent 63断绿油桥missing S/M bridge24拖锡不良poor touch up 64塞孔block hole25补金不良poor repairing Au 65水迹water print26补油不良poor repairing s/m 66锡珠solder ball27针孔pinhole 67砂孔pitting28胶渍paster stain 68油薄29k孔内毛刺burrs in hole 69聚油excess solder mask30锡珠入孔solder in hole 70锡粗Sn too thick31露铜expose Cu 71线路上锡Sn overlap scratch32露镍expose Ni 72绿油下杂物 contamination under S/M 33绿油起泡solder mask blister 73焊盘损坏land damage34绿油起皱solder mask winbles 74焊盘翘起lifted land35金手指氧化G/F oxiding 75偏位misregistration36金颜色不良Au discoloration 76漏钻孔missing hole37金面凸起Au surface blister 77焊盘缺口nick on pad38绿油入孔solder mask in hole 78线路缺口nick on track39爆板board angle damafe40翘板warp1开路open circuit 46焊盘翘起lifted land2短路short circuit 47漏钻孔missing hole线路狗牙circuit wist 48露布纹weave exposure3线路缺口circuit nick 49钻偏孔hole misregistratiion4线路凹痕circuit dent 50孔损害hole damage5渗镀plating Bloody 51基材分层delamination6焊盘缺口pad nick 52蚀刻过度over etching7内层白斑I/L white spot 53多孔hole too much8黑化不良poor B.O 54残铜remain Cu55孔内露基材 laminate exposure in hole 10粉红圈pinking ring 56焊盘脱落pad break off11层压起泡press blister 57焊盘凹痕pad dent12错位misregistation 58焊盘凸起pad bulge13偏位shift 59焊盘损坏pad damaged14孔内无铜no Cu on Pth 60焊盘缺口pad nick15孔内毛刺hole burrs 61焊盘露铜pad expose Cu16NPTH有铜Cu on NPTH 30修理不良poor repairing17铜面露基材exposed laminate 31铜薄copper too thin18铜面凹痕dent on Cu surface 32内层擦花I/L scratch19胶渍gum residue 33内层偏位I/L misregistation20夹膜D/F nip 34内层杂物I/L inclusions21蚀刻不尽under etching 35掉膜film off22线幼line too thin 36干膜碎D/F meaking23孔大hole oversize 37退锡不尽poor Sn stripping24孔小hole undersize 38间隙小space too marrow25偏孔hole misregistration 39板薄board too thin26铜面瘤粒Cu nodule 40板厚board too thickness27显影不尽under developing 41针孔pinhole28铜面刮伤scratch on Cu surface 42崩孔breakout29塞孔hole plugged 43侧蚀undrcut45亚色dull colour 44镀层粗糙plating layer roughness。

不良缺陷中英文对照

不良缺陷中英文对照

19 20 21 22 23 24 25
铭牌同边框平行度 接线盒到长边框外侧距离 接线盒到短边框外侧距离 边框条码位置 长边框外凸 长边框内凹 焊带扭曲
英文
Cell to Glass edge Parallel Difference (Laminator) Big side string bus to glass edge Parallel Difference (big side string bus to glass edge) Small side string bus to glass edge Parallel Difference (small side string bus to glass edge) Cell to frame edge Parallel Difference (Module) Big side outer strings bus to frame distance Parallel Difference (Module) Big side outer strings bus to cell distance Big side inner strings bus to cell distance Small side strings bus to frame String distance Cell to cell offset in difference string Parallel Difference (from first to last cell) Label postion to long frame Label postion to long frame
44 45 46 47 48 49 50
ቤተ መጻሕፍቲ ባይዱ
cell connector offset

涂料缺陷以及英文名字

涂料缺陷以及英文名字

涂料常见缺陷名词英汉对照及其成因发浑 clouding:清漆、清油或稀释剂由于不溶物析出而呈现云雾状不透明现象。

原漆变色discoloration of paints or varnishes涂料在贮存过程中,由于某些成分的化学或物理变化或者与容器发生化学反应而偏离其初始颜色的现象。

增稠 thickening涂料在贮存过程中,通常由于稀释剂的损失而引起的稠度增高现象。

变稠 fattening色漆在贮存过程中,由于组分之间发生化学反应而引起的稠度增高(不一定增加到不能使用的程度),体积膨胀的现象。

同义词:变厚;发胀。

絮凝 flocculation在色漆或分散体中形成附聚体的现象。

胶化 gelling涂料从液态变为不能使用的固态或半固态的现象。

结皮 skinning涂料在容器中,由于氧化聚合作用,其液面上形成皮膜的现象。

沉淀 settling涂料在贮存过程中,其固体组分下沉至容器底部的现象。

同义词:沉底;沉降。

有粗粒 seed涂料在贮存过程中展现出的粗颗粒(即少许结皮、凝胶、凝聚体或外来粗粒)。

返粗pig ski色漆在贮存过程中,由于颜料的絮凝而使研磨细度变差的现象。

发花 floatin含有多种不同颜料混合物的色漆在贮存或干燥过程中,一种或几种颜料离析或浮出并在色漆或漆膜表面集中呈现颜色不匀的条纹和斑点等现象。

浮色 floodin发花的极端状况。

某些颜料浮升至表面,虽漆膜表面颜色均匀一致,但明显地不同于刚施涂时的湿膜颜色。

起气泡 bubblin涂料在施涂过程中形成的空气或溶剂蒸气等气体或两者兼有的泡,这种泡在漆膜干燥过程中可以消失,也可以永久存在。

针孔 pin-holes一种在漆膜中存在着类似于用针刺成的细孔的病态。

它是由于湿漆膜中混入的空气泡和产生的其他气泡破裂,且在漆膜干燥[固化]前不能流平而造成,也由于底材处理或施涂不当(漆膜过厚等)而造成。

起皱 wrinkling漆膜呈现多少有规律的小波幅波纹形式的皱纹,它可深及部分或全部膜厚。

注塑件缺陷中英文对照表

注塑件缺陷中英文对照表

注塑件缺陷中英文对照表(2010-12—13 8:00:00)中文英文-—--—-————-----——-———--—--—- 起泡Blister起霜Blooming破孔Blow hole泛白Blushing侧壁皱纹Body wrinkle冒口带肉Breaking-in膜泡、气泡Bubble糊斑Burn mark毛边Burr翘曲Camber气泡Cell表面中部波皱Center buckle细裂痕Check龟裂Checking修整表面缺陷Chipping铸件凹痕Clamp-off塌陷Collapse色斑Color mottle腐蚀Corrosion外观不良Cosmetic defect裂痕Crack碎裂、龟裂Crazing变形Deformation切边碎片Edge裂边Edge crack退色Fading填充料斑Filler speak裂纹Fissure凸缘起皱Flange wrinkle毛边Flash (金属的毛边:Burr) 刮伤Flaw流痕Flow mark, flow line字体模糊Foggy毛边Galling光滑Glazing光泽Gloss污斑Grease pits油污、脏污Grease, oil stains磨痕Grinding defect发裂Haircrack雾度Haze水锈Incrustation杂质Inclusion压痕Indentation内部气孔Internal porosity发霉Mildewed, moldy, mouldy 偏模Mismatch杂色Mixed color斑点Mottle缩颈Necking割痕Nick橘皮状表面缺陷Orange peel溢流Overflow剥离Peeling, peel-off坑Pit点状腐蚀Pitting corrosion模板印痕Plate mark麻点Pock痘斑Pock mark树脂流纹Resin streak树脂脱落Resin wear凹陷Riding松垂Sagging皂化Saponification疤痕Scar废料Scrap废料阻塞Scrap jam刮伤、划痕、划伤Scratch深冲表面划伤Scuffing裂痕Seam模口挤痕Shock line充填不足Short shot凹孔Shrinkage pool缩水Shrinking, shrinkage凹痕、凹陷Sink mark, shrink Line , sink mark表皮折迭Skin inclusion螺丝滑头、滑手Slipped screw head, slippery screw thread 斑点Speckle矫直Straightening条状痕、条纹Streak表面裂痕Surface check橘皮状表皮皱折Surface roughening波动Surging冒汗Sweat out扭曲Torsion翘曲Warpage波痕Waviness熔塌Webbing焊痕、熔接线Weld mark, weld line 白化Whitening皱纹Wrinkle。

品质不良现象 -- 中英对照表 - 0809

品质不良现象 -- 中英对照表 - 0809

毛邊:於邊緣多出的料。 結合線:發生於塑膠料流到障礙物 (如通風孔) 分開後再結合的位 置。 合模線:模具組之接合處或滑條所造成。 模板:因射入時,趕出揮發性氣體或松脂揮發性物凝結於模具表面 造成粉白色差。 應力痕:不同光澤的圓形圈圈, 大部份出現於入料口正對面。 凹陷:表面凹陷,出現於柱子之正對面 (因該處塑膠厚度突然變化 造成)。 滑塊:模具組可移 (拆解) 部份,供作部份切除用。 水痕:變色如銀帶狀,由於塑膠於成型過程流過擦洗的表面造成 (又形如蝸牛走過的痕跡)。 缺料:由於凹穴塑膠填充不足,造成表面或內面柱凹陷之缺點 (又 稱短射)。
名詞解釋-ห้องสมุดไป่ตู้-中英文對照 序號 1
2
3
4 5
6 7 8 9 10 11 12 13 14
15
16
17 18 19
20 21 22 23 24 25
名詞解釋---中英文對照 名詞定義---中文 表面髒:污點, 髒, 油漬, 漆, 墨或其它外物加於表面,無法 用無毒無害的清潔濟清除者。
原材料髒 / 變色 (髒) :材料不均勻的部份,如大塊斑點,銀色條 型延伸及變色歸屬不可量型的缺點。
Flash:Excess material at parting of edge lines. (Usually caused by mold itself or higher press of molding) Welding Line:Lines occurring where plastic flow rejoins after separation of passing an obstacle (such as events). Parting line:Line of separation of tool halves or slides. "Parting Line Mismatch" refers to the offset between mating surface of the tool. Plate out:Chalky discoloration resulting from gassing out of volatiles during injection or condensation of resin volatiles on tool surface. Stress trace:Circular halo with variation in gloss, it is mostly centered opposite to the gate. Sink:A depression on a surface (sheik mark) / concave areas on surface opposite to ribs location (where sudden changes in thickness). Slide:Moveable portion of tool to allow undercuts on part. Splay:" Slivery" discoloration caused by plastic flow through scrubbing surface during molds (snail tracks). Void:Defect of plastic surface due to incompletely fill a cavity (short shot).

常见塑件缺陷中英文版

常见塑件缺陷中英文版
3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 Defect Description AB不良(AB defect) 膠區尺寸不同(dimision change) 口小(mouth small) 變形(deformation) 開口大(mouth big) 破損(damaged) 長度偏大(length too long) 刮傷(scratch) 試機(test defect) 有孔洞(hole defect) 偏薄(too thin) 無插頭(have not plug) 無粘性(stickiness NG) 有孔(have hole) 沒彈性(no flexibility) 生鏽(rustiness) 折皺(fold wrinkle) 套筒過小(sleeve too small) 異音(noise) 線斷(wire break) 黑邊(black edge) 尺寸不符(dimension NG) 沒彈性(no flexibility) 尺寸過長(dimension too long) 顏色不同(color differ) 孔大(hole too big) 划傷(scratch) 斷裂(crack) 結合線披峰(weldling burr) 結合線錯位(weldling step) 頂針披峰(injector pin burr) 頂針凸台(injector pin convex) 頂針下陷(injector concave) 進膠口高出(gate too high) 進膠口穿孔(gate have hole) 進膠口拉絲(gate have silks) 進膠口余肉(gate extra material) 色差(chromatic aberration) 披峰(overflow edge) 毛刺(burr) 毛邊(raw edge) 縮水(sink) 殘缺(mutilation) 殘肉(extra material) No. Defect Description 45 碰傷(bump injury) 46 印刷不良(printing defect) 47 打折(wrinkle) 48 斷線(break line) 49 裂縫(crack) 50 燙傷(burned defect) 51 無螺紋(screw NG) 52 多膠(extra plastic) 53 錯料(wrong material) 54 鏍孔裝反(screw assembly wrong) 55 白點(white spot) 56 轉不動(rotate NG) 57 變白(change white) 58 卡不緊(assembly defect) 59 從FUSER中取出(fetch out from fuser) 60 料號與實物不同(part No. differ part) 61 臟污(dirty) 62 熔斷(weld break ) 63 白線(white line 64 破裂(crack) 65 無膠(no plastic) 66 無軸(no shaft) 67 插頭不良、燈不亮(plug defect,lamp don't light) 68 損缺(damaged) 69 黑點(macula) 70 皺紋(wrinkle) 71 毛邊(burr) 72 測試不良(test defect) 73 損壞(damage) 74 銀紋(silver lines) 75 渦輪(worm) 76 頂白(pin mark) 77 拉傷.拉白(pull defect) 78 拉斷(pull break) 79 凸點(protruding spot) 80 汽泡(bubble) 81 雜色(varicolored) 82 雜物(sundies) 83 熔結線(weldline) 84 偏芯(leaaning core) 85 粘模(stick cavity) 86 面振(face vibrate) 87 芯振(core vibrate)

产品缺陷中英文对照表

产品缺陷中英文对照表
MA
保溫杯內雜物
Foreign object inside carafe
MA
漏裝漏斗插針孔膠塞
Missing the plug of pin hole of basket
MA
玻璃杯邊刮手
Sharp edge on carafe
CR/MA
漏斗內有披峰堵塞
Flashing block the outlet of basket
MI
拔槳刮桶底
Paddle scratch bottom
MA
自檢摩打不轉
Motor no rotation while self-inspection
MA
內框与外殼离拉
Gap between metal jacket and metal housing
MI
燙斗
溫度偏高
Soleplate temperature higher than the spec
MI
漏斗軸漏裝膠塞
Missing plug on basket axes
Ma
保溫板密封圈未裝到位
Keep warming plate seal ring out the position
Ma
底蓋隔熱板氧化
Oxidate mark on bottom cover
Ma
水箱与底蓋夾有膠紙
Protective paper clamped between tank and base
Flashing on measuring cup
MI
發熱管松動
Loose heater
MI
電壓貼紙不洁
Dirty on rating label
MI
自動開机

注塑件缺陷中英文对照表

注塑件缺陷中英文对照表

注塑件缺陷中英文对照表中文英文----------------------------起泡Blister起霜Blooming破孔Blow hole泛白Blushing侧壁皱纹Body wrinkle冒口带肉Breaking-in膜泡、气泡Bubble糊斑Burn mark毛边(金属)Burr(for metal)翘曲Camber气泡Cell表面中部波皱Center buckle细裂痕Check龟裂Checking修整表面缺陷Chipping铸件凹痕Clamp-off塌陷Collapse色斑Color mottle腐蚀Corrosion外观不良Cosmetic defect裂痕Crack碎裂、龟裂Crazing变形Deformation切边碎片Edge裂边Edge crack退色Fading填充料斑Filler speak裂纹Fissure凸缘起皱Flange wrinkle毛边Flash刮伤Flaw流痕Flow mark,flow line字体模糊Foggy毛边Galling光滑Glazing光泽Gloss污斑Grease pits油污、脏污Grease,oil stains磨痕Grinding defect发裂Haircrack雾度Haze水锈Incrustation杂质Inclusion压痕Indentation内部气孔Internal porosity发霉Mildewed,moldy,mouldy偏模Mismatch杂色Mixed color斑点Mottle缩颈Necking割痕Nick橘皮状表面缺陷Orange peel溢流Overflow剥离Peeling,peel-off坑Pit点状腐蚀Pitting corrosion模板印痕Plate mark麻点Pock痘斑Pock mark树脂流纹Resin streak树脂脱落Resin wear凹陷Riding松垂Sagging皂化Saponification疤痕Scar废料Scrap废料阻塞Scrap jam刮伤、划痕、划伤Scratch深冲表面划伤Scuffing裂痕Seam模口挤痕Shock line充填不足Short shot凹孔Shrinkage pool缩水Shrinking,shrinkage凹痕、凹陷Sink mark,shrink Line,sink mark表皮折迭Skin inclusion螺丝滑头、滑手Slipped screw head,slippery screw thread 斑点Speckle矫直Straightening条状痕、条纹Streak表面裂痕Surface check橘皮状表皮皱折Surface roughening波动Surging冒汗Sweat out扭曲Torsion翘曲Warpage波痕Waviness熔塌Webbing焊痕、熔接线Weld mark,weld line 白化Whitening皱纹Wrinkle欢迎您的下载,资料仅供参考!致力为企业和个人提供合同协议,策划案计划书,学习资料等等打造全网一站式需求。

常用产品外观缺陷中英文对照 (2)

常用产品外观缺陷中英文对照 (2)

裂纹Leabharlann crack杂质/颗粒
impurity/particle
气/射纹 jetting mark
发霉
mildew
起皱
corrugation
断裂
Broken
缩痕/缩水 sink mark
水印
Water mark
缺口
gap
水口削缺
Sprue damage
模伤/模痕 mould mark
阴阳色
Color different/Color variation
热熔不良 badly welded
常用产品外观缺陷中英文对照
胶件不良 黑点 披锋 流纹 气纹 缩水 变形 亮印 擦花/划伤 胶泡 夹线 缺胶 顶针印 烧焦 打砂印 多胶 漏光 模伤/模痕
Black Dot Flash Flow mark Gas mark/Flow mark Sink mark Deformation Bright spot Scratch Bubble Weld line / nit line Short Shot Ejector mark Burn sand paper mark extra material Light Leaks mould mark
白点
white dot
沙粒
Grain
亮点
Shining dot
光剂
Bright liquid/Brightness chemistry
too Milk
通常用于描述产品沙很 细,哑铬较颜色标准板来 说颜色偏白,表面目视感 觉很过于光滑
表面粗糙/沙粗 Rough
绝缘不良
通电
Over plating
积油
paint accumulation

PCB及PCBA缺陷中英文对照表

PCB及PCBA缺陷中英文对照表

PCB及PCBA缺陷中英文对照表PCB及PCBA缺陷中英文对照表1板面凹痕dent 41漏印字符skip2内层白斑I/L white spot 42金粗Au too big3线路缺口circuit nick 43金簿Au too thin4蚀刻不净undering etching 44金手指缺口G/F voids/nick on G/F 5绿油剥离S/M peel off 45金手指发黑G/F too black6显影不净under developing 46字符印反inverse C/M7基材白点laminate measling 47金手指针孔G/F pinholes8铜面氧化copper oxide 48标志不清symbol unclear9绿油上焊盘s/m on pad 49标志错symbol wrong10白字上焊盘c/m on pad 50绿油鬼影ghost in S/M11阻焊不良poor S/M 51手指印finger print12线路擦花track scratch 52补线不良poor line repairing13锡上线sn on circuit 53锡高exessive solder14聚锡sn mass 54孔小hole undersize15锡灰sn gray 55字符错wrong C/M16焊盘露铜cu exposed on pad 56字符印偏C/M misalignment17锡上金手指sn on G/F 57字符入孔C/M in hole18金手指凹痕G/F dent 58字符重影C/M doubloe image19金手指擦花G/F scratch 59漏镀金手指missing plating G/F20金手指粗糙G/F roughness 60金手指发白G/F gray21v-cut不良poor V-cut 61焊盘脱落pad break off/pad peel off 22倒边不良poor milling 62焊盘露铜pad expose cu23针床压伤ET dent 63断绿油桥missing S/M bridge24拖锡不良poor touch up 64塞孔block hole25补金不良poor repairing Au 65水迹water print26补油不良poor repairing s/m 66锡珠solder ball27针孔pinhole 67砂孔pitting28胶渍paster stain 68油薄S/M too thin29k孔内毛刺burrs in hole 69聚油excess solder mask 30锡珠入孔solder in hole 70锡粗Sn too thick31露铜expose Cu 71线路上锡Sn overlap scratch 32露镍expose Ni 72绿油下杂物contamination under S/M 33绿油起泡solder mask blister 73焊盘损坏land damage34绿油起皱solder mask winbles 74焊盘翘起lifted land35金手指氧化G/F oxiding 75偏位misregistration36金颜色不良Au discoloration 76漏钻孔missing hole37金面凸起Au surface blister 77焊盘缺口nick on pad 38绿油入孔solder mask in hole 78线路缺口nick on track 39爆板board angle damafe40翘板warp1开路open circuit 46焊盘翘起lifted land2短路short circuit 47漏钻孔missing hole线路狗牙circuit wist 48露布纹weave exposure3线路缺口circuit nick 49钻偏孔hole misregistratiion 4线路凹痕circuit dent 50孔损害hole damage5渗镀plating Bloody 51基材分层delamination6焊盘缺口pad nick 52蚀刻过度over etching7内层白斑I/L white spot 53多孔hole too much8黑化不良poor B.O 54残铜remain Cu9爆板measling 55孔内露基材laminate exposure in hole10粉红圈pinking ring 56焊盘脱落pad break off 11层压起泡press blister 57焊盘凹痕pad dent12错位misregistation 58焊盘凸起pad bulge13偏位shift 59焊盘损坏pad damaged14孔内无铜no Cu on Pth 60焊盘缺口pad nick15孔内毛刺hole burrs 61焊盘露铜pad expose Cu 16NPTH有铜Cu on NPTH 30修理不良poor repairing17铜面露基材exposed laminate 31铜薄copper too thin18铜面凹痕dent on Cu surface 32内层擦花I/L scratch19胶渍gum residue 33内层偏位I/L misregistation20夹膜D/F nip 34内层杂物I/L inclusions21蚀刻不尽under etching 35掉膜film off22线幼line too thin 36干膜碎D/F meaking23孔大hole oversize 37退锡不尽poor Sn stripping 24孔小hole undersize 38间隙小space too marrow 25偏孔hole misregistration 39板薄board too thin26铜面瘤粒Cu nodule 40板厚board too thickness27显影不尽under developing 41针孔pinhole28铜面刮伤scratch on Cu surface 42崩孔breakout29塞孔hole plugged 43侧蚀undrcut45亚色dull colour 44镀层粗糙plating layer roughness PCB及PCBA常用度量衡单位换算所属目录:FASTPCBA靖邦公司资料发布时间:2009-01-01 1英尺=12英寸1英寸inch=1000密尔mil1mil=25.4um1mil=1000uin mil密耳有时也成英丝1um=40uin(有些公司称微英寸为麦,其实是微英寸)1OZ=28.35克/平方英尺=35微米H=18微米4mil/4mil=0.1mm/0.1mm线宽线距1ASD=1安培/平方分米=10.76安培/平方英尺1AM=1安培分钟=60库仑主要用于贵金属电镀如镀金1平方分米=10.76平方英尺1盎司=28.35克,此为英制单位1加仑(英制)=4.5升1加仑美制=3.785升1KHA=1000安小时1安培小时=3600库仑比重波美度=145-145/比重SG.SG.比重(克/立方厘米)=145/(145-波美PCB及PCBA行业专用名词PCB及PCBA行业专用名词BOM(Bill of material) 物料需求單Laminate 基板Copper foil 銅箔Solder mask(s/m) 防焊Bare Board 空板Microetching 微蝕Exposure 曝光Dry Film 干膜Matte side 毛面Rcc(Resin coated copper) 背膠銅箔Final shaping 成型Electrical test(ET) 電測Visual Inspection 外觀檢查Gold Finger(G/F) 金手指Legend 文字Post Cure 后烤Desmear 除膠渣Developing 顯影Pattern Plating 線路電鍍Panel Plating 全板電鍍Puddle Effect 水坑效應Oxide Coating 黑氧化Routing Bit 銑刀Tolerance 公差Post Treatment 后處理Adhesion 附著力Stripping 去膜Baking 烘烤AQL(acceptable quality level) 品質允收水準Optical Target 光學靶點Lay up 疊合Chromation 鉻化處理Undercut 側蝕Microvia 微孔Annular Ring 孔環Burr 毛頭Entek 有機保焊處理Conformal Mask 銅窗Drum Side 光面Diazo Film 偶氮棕片Cut Lamination 下料Sheets Cutting 裁板Inner Layer Drilling 內層鑽孔Outter Layer Drilling 一次孔2nd Drilling 二次孔PCB及PCBA专用名词Laser Drilling 雷射鉆孔Blind&Burried Hole Drilling 盲(埋)孔鉆孔screen printing 網版印刷silk screen 絲網印刷scum 透明殘膜skip printing 跳印漏印squeege 刮刀type 种類abietic acid 松脂酸air knife 風刀bridging 搭橋橋接flux 助焊劑product process 制程pre-process 制前solder bridge 錫橋soler bump 錫突solder plug 錫塞immersion gold 浸金(化金)thin core 薄基板twist 板翘, 板扭warp ,warpage 板彎weave eposure 織紋顯露wicking 燈蕊效應yield 良品abrasion resistance 耐磨性absorption 吸收accelerated test 加速實驗acceleration 速化反應accelerator 加速剂batch 批cold solder joint 冷焊點component side 零件面double side 雙面double side board 雙面板fiducial mark 基準記號finished board 成品板lot size 批量rack 掛架register mark 對準用標記solder side 錫鉛面thickness 厚度warehouse 仓库wet process 濕制程Beveling 斜邊chamfer 道角dimension 尺寸Fixture 治具interconnection 互相連通line space 線距line width 線寬misregistration 對不准mouse bite 蝕刻缺口nick 缺口master drawing 主圖print and etch board 印刷後及蝕刻後板crease 皺褶dent 凹陷glass fiber 玻璃纖維布pin hole 針孔pit 凹點target hole 靶孔PCBA及PCB专用名词(二)PCBA及PCB专用名词(二)Black Oxide Removal 黑化還原Plug Hole 塞孔Ink Print&precure 印刷及預烤Scrub 表面處理Spray Coating 靜電噴涂Printing of Legend 文字印刷Pumice ( Wet Blasting) 噴砂Immersion Ni/Au(Electoless Ni/Au) 浸鎳金Hot Air Solder Leveling 噴錫N/C routing 撈型Beveling of G/F 金手指斜边Cleanning&Baking 清洗及烘烤Fixture Testing 治具測試original A/W 客戶原稿working A/W 工作片working master 工作母片carlson pin 定位梢component hole(>30mil) 零件孔drill facet 鑽尖切削面drill pointer 鑽尖重磨機drilled blank board 已鑽孔的裸板hole diameter 孔徑hole location 孔位hole number 孔數lay back 刃角磨損margin 鑽頭刃帶open circuits 斷路runout 偏轉slot 開槽spindle 鑽軸tooling hole 工具孔stacking structure 疊板結構blow hole, void in PTH hole 吹孔孔破deburring 去毛頭electroless-deposition 無電鍍化etchback 回蝕air inclusion 氣泡chase 網框fabric 網布liquid 液態\狀mealing 泡點trim line 裁切線v-cut v型切槽golden board 標準板back lighting 背光crack 裂痕crazing 白斑dimension stability 尺寸安全性failure 故障fault 缺陷瑕疵gap 鑽尖分開gel time 膠化時間haloing 白邊白圈hardener 硬化劑hole counter 數孔機hook 外弧insulation resistance 絕緣阻抗ionizable(ionic) contaminants 離子性污染land 焊墊microsectioning 微切片法negative etchback 反回蝕overlap 鑽尖重曡peel strength 抗撕強度pink ring 粉紅圈REJ(reject) 拒收退貨release agent(sheets) 脫膜劑resin content 膠含量resin flow 膠流量resin recession 樹脂下限resin smear 膠渣rework 重工specification(spec.) 規範innerlayer&outlayer 內外層gold plating 鍍金QC(quality control) 品管back up 墊板blister 起泡局部分层caul plate 隔板, 钢板open circuits 断路sampling size 抽樣數edge spacing 板邊空地ground plane 接地層laminator 壓膜機M/T 磁帶disk 磁片。

7 涂层缺陷(IP-中英对照)

7 涂层缺陷(IP-中英对照)

涂层缺陷分析和处理Coating Failures Analysis and Handling•调查研究表明:A great deal of investigations indicatedthat:•80%的涂料的缺陷是由于施工不当造成的•Almost 80% of coating failures were caused by improperapplication.•20%是由于其它原因造成的•20% of coating failures werecaused by other matters.涂层中夹渣/有灰尘杂物Abrasive residues/Dust •喷砂与机械处理方法所产生的灰尘,锈皮等•Dust or other types ofcontaminations caused by blast-cleaning or mechanical pre-treatment process.•要特别注意脚手架上的的磨料和灰尘•Advert to abrasives/dust from the scaffoldings.•如果不清除的话,磨料夹渣和灰尘会与刚喷的涂层合为一体•Abrasive residues/dust may be left or incorporated in the fresh coats.底漆中夹渣引起锈蚀Rust spots due to residues in primer coat刷痕Brushing marks•漆刷不良,引起漆膜成高一道,低一道的不均匀条状•Uneven streaks caused by improper application with brush •高固体份涂料,不易进行刷涂•High solids paint may not be applied with brush.漆膜过厚Excessive film thickness•对靠溶剂挥发来干燥的涂料来说,漆膜过厚会导致溶剂残留在漆膜中,表层干燥,但是下层较软,容易引起涂层内聚力及与底材的附着力问题,并且涂层在以后可能会出现起泡。

喷涂缺陷中英文

喷涂缺陷中英文

涂装工艺英语涂层:coating涂料:coating涂膜:film coating溶剂 Solvent稀释剂 Thinner丙烯酸 Acrylic树脂 Resin丙烯酸 Acrylic Resin环氧树脂 Epoxy Resin聚酯树脂 Polyester Resin氨基树脂 Amino Resin色浆Colorant蜡粉(浆)Wax powder(Dispersion)玻璃珠Glass Bead流平剂Leveling Agent硅类消泡剂Deformer附着力促进剂 Adhesion Promoter颜料分散剂 Dispersing Agent(dispersant)UV固化涂料 UV-curing Paints 卷材涂料 Coil Coating粘合剂 Adhesives塑胶材料 Plastic material 金属材料 Metal material 配方 formulation性能 Performance耐磨性Abrasion performance 喷涂性Applicability附着力Adhesion硬度Hardness表干Touch Dry硬干hard Dry固体份NON-V olatile比重Specific Gravity粘度Viscosity细度Fineness厚度Thickness漆膜外观Appearance颜色 Color光泽 Gloss包装 Parking批号 Batch. NO检测 Back-check底漆 Primer清漆 varnish不良缺陷专业术语20.黄变yellowing 漆膜在老化过程中出现的变黄倾向。

21.耐湿变性temperature change resistance 丽缤纷牌油漆涂料漆膜经过受冷热交替的温度变化而保持其原性能的能力。

22.发混clouding 清漆或稀释剂由于不溶物析出而呈现云雾状不透明现象。

23. 增稠thickening 涂料在贮存过程中通常由于稀释剂的损失而引起的稠度增高现象。

注塑缺陷中英文名称对照

注塑缺陷中英文名称对照

Aberration 色差 atomization 化bank mark 滞料纹 bite 咬入blacking hole 涂料孔(铸疵) blacking scab 涂料疤blister 起泡 blooming 起霜blow hole 破孔 blushing 泛白body wrinkle 侧壁皱纹 breaking-in 冒口带肉Bubble 膜泡 burn mark 糊斑Burr 毛边 camber 翘曲Cell 气泡 center buckle表面中部波皱Check 细裂痕 checking 龟裂Chipping 修整表面缺陷 clamp-off 铸件凹痕Collapse 塌陷 color mottle 色斑Corrosion 腐蚀 crack 裂痕Crazing 碎裂 crazing 龟裂Deformation 变形 edge 切边碎片edge crack 裂边 fading 退色filler speak 填充料斑 fissure 裂纹flange wrinkle 凸缘起皱 flaw 刮伤flow mark流痕 galling毛边glazing光滑 gloss光泽grease pits污斑 grinding defect磨痕haircrack发裂 haze雾度incrustation水锈 indentation压痕internal porosity内部气孔 mismatch偏模mottle斑点 necking缩颈nick割痕 orange peel橘皮状表面缺陷overflow溢流 peeling剥离pit坑 pitting corrosion点状腐蚀plate mark模板印痕 pock麻点pock mark痘斑 resin streak树脂流纹resin wear树脂脱落 riding凹陷sagging松垂 saponification皂化scar疤痕 scrap废料scrap jam废料阻塞 scratch刮伤/划痕scuffing深冲表面划伤 seam裂痕shock line模口挤痕 short shot充填不足shrinkage pool凹孔 sink mark凹痕skin inclusion表皮折叠 straightening矫直streak条状痕 surface check表面裂痕surface roughening橘皮状表皮皱折surging波动sweat out冒汗 torsion扭曲warpage翘曲 waviness波痕webbing熔塌 weld mark焊痕whitening白化 wrinkle皱纹。

  1. 1、下载文档前请自行甄别文档内容的完整性,平台不提供额外的编辑、内容补充、找答案等附加服务。
  2. 2、"仅部分预览"的文档,不可在线预览部分如存在完整性等问题,可反馈申请退款(可完整预览的文档不适用该条件!)。
  3. 3、如文档侵犯您的权益,请联系客服反馈,我们会尽快为您处理(人工客服工作时间:9:00-18:30)。

涂层缺陷分析和处理Coating Failures Analysis and Handling•调查研究表明:A great deal of investigations indicatedthat:•80%的涂料的缺陷是由于施工不当造成的•Almost 80% of coating failures were caused by improperapplication.•20%是由于其它原因造成的•20% of coating failures werecaused by other matters.涂层中夹渣/有灰尘杂物Abrasive residues/Dust •喷砂与机械处理方法所产生的灰尘,锈皮等•Dust or other types ofcontaminations caused by blast-cleaning or mechanical pre-treatment process.•要特别注意脚手架上的的磨料和灰尘•Advert to abrasives/dust from the scaffoldings.•如果不清除的话,磨料夹渣和灰尘会与刚喷的涂层合为一体•Abrasive residues/dust may be left or incorporated in the fresh coats.底漆中夹渣引起锈蚀Rust spots due to residues in primer coat刷痕Brushing marks•漆刷不良,引起漆膜成高一道,低一道的不均匀条状•Uneven streaks caused by improper application with brush •高固体份涂料,不易进行刷涂•High solids paint may not be applied with brush.漆膜过厚Excessive film thickness•对靠溶剂挥发来干燥的涂料来说,漆膜过厚会导致溶剂残留在漆膜中,表层干燥,但是下层较软,容易引起涂层内聚力及与底材的附着力问题,并且涂层在以后可能会出现起泡。

•The solvent may be entrapped in films if applying the solvent evaporation coatings in excessive thickness. Surface drying but soft underneath may cause poor cohesion of coats and worse adhesion between the coats and substrates, otherwise blistering may beoccurred in service.•对于固化型涂料来说,会产生内部收缩,引起涂料开裂、剥落,这种现象在内角的流淌处较为常见•For the chemical curing coatings, interior shrinkage of coats may cause cracking, flaking if applying in excessive thickness. These defects usually occur at some corners of structures where to beprone to stack the paints.内角由于流挂产生局部堆厚而开裂Cracking at the corner due to stacking paints partially caused by sagging.溶剂在过厚的漆膜中截留The solvents were entrapped in excessive films and cause into the porous coat.流挂Runs and Sags •流挂的发生,通常是因为:Runs and sags caused by:•超过了规定的膜厚•Too high wet film thickness•加入过量的稀释剂•Too much thinner added•喷枪过分靠近被涂物表面•Spray guns too close to surface •施工时发现流挂,可以快速地用刷子抹平•Brushing to smoothen rapidly once runs and sags occur•干膜的流挂状态,打磨平整后重新薄涂一遍•Abrasion/sanding excessive runs/sags to smoothen and re-coat缩孔/ 鱼眼Fisheye •施工在有油脂、水份、硅油等污染物的表面。

这些油污和湿气可能是打磨工具或不干净的压缩空气带来的•Paint applied on oil/grease, moisture, silicone or other contaminations whichmay be caused by power tools orunclean pressure air•表面张力高的涂料也容易引起缩孔(如施工在具较高光泽度的油漆上面则其表面润湿性较差)•Painted on incompatible coating (Glossy paints give poor wetting)针孔/漏点Pinholes/Pores•以下情况下,极易发生针孔和漏点•Pinholes/Pores caused by:•压力过大Excessive air pressure•涂膜过厚Excessive film thickness•过份的通风或大风环境Too good ventilation or strong wind •喷涂时距离太远Too long spray distance•喷锌、喷铝和无机富锌底漆:•Spraying of Zinc, Aluminum and Inorganic zinc-rich primer:•表面多孔有空气在内,极易产生针孔•Porous substrate contains air inside may be prone to pinholing.•可以用稀释后的涂料薄喷30微米再涂下道漆,称之为雾喷/全喷技巧•Spraying a thin coat in 30 microns via additional thinning and apply the subsequent coat. It is so called “Mist coat/Tiecoat” technique.漏涂Holidays•局部没有涂上油漆称之为漏涂•Holidays are recognized as areas where the applicator has missed applying paint to that part of surface.•球扁钢的球头部位Behind bars ,stiffeners etc•粗糙焊缝At rough welding seams•切口和自由边On notches, cut outs and edges•其它难以喷涂的地方On other areas where is inaccessible to spray•喷涂不良Improper spray application:•行枪时走弧线,中间漆膜过厚,而两侧偏薄•Arcing/tilting the spray gun shall cause into heavy films in the middle and thin films at the beginnings and ends ofspraying.•形成针状点锈•Pin rusting may be formed.•最好的解决办法是对这些地方进行预涂/条涂,并且在喷涂过程中保证每道喷幅间重叠50%以搭接。

•The recommended method is that stripe coating prior to spray and overlap 50% of each pass or cross of spraying.干喷/过喷Dryspray/Overspray •漆膜表面粗糙不平,呈颗粒在表面附着•An uneven film and a rough, sandpaper texture on the surface•这种漆雾附着力极差•Poor adhesion•干喷主要是以下原因造成:•Dryspray caused by:•喷涂距离过远,或涂料干燥太快,高温下施工,喷涂压力过高,强风或通风过度等•Too long spraying distance, drying too fast, too high temperature, too high air pressure , too windy ortoo good ventilation•主要的原因是溶剂还没有到被涂物表面就过早地损失了•The primary cause is that solvent has been lost prematurely not to reach the sprayed object.白化/ 胺起霜Blooming/amine blushing •涂料在完全固化前,有可能会产生发花或白化现象。

冷凝与湿气会在涂层表面形成白点。

•The surface of coatings may be occurring blooming before completely curing and the white spots shall be formed by condensation/moisture.•胺固化的环氧涂料,在较冷或湿润大气环境下进行固化时,胺会与空气中的二氧化碳(CO2)和湿气(H2O)发生反应形成铵盐。

通常我们把这种情况叫做胺起霜或胺白化,其结果就是漆膜发粘,经常呈白色污迹。

•Epoxy paints especially amine cured are particularly subject to poor curing at cold, humid weather conditions. The amines react withcarbon dioxide(CO2),humidity(H2O) in the air to form an aminecarbamate, commonly referred to as ”amine blooming” or“amine blushing”. The result is a tacky film often appearing aswhite stains.•胺起霜是水溶的,能被干净的温水抹去.。

相关文档
最新文档