74LS373详细资料精心整理

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74LS373中文资料_数据手册_参数

The eight latches of the ’LS373 and ’S373 are transparent D-type latches, meaning that while the enable (C or CLK) input is high, the Q outputs follow the data (D) inputs. When C or CLK is taken low, the output is latched at the level of the data that was set up.
4Q
GND
C†
† C for ’LS373 and ’S373; CLK for ’LS374 and ’S374.
5Q
5D
Schmitt-trigger buffered inputs at the enable/clock lines of the ’S373 and ’S374 devices simplify system design as ac and dc noise rejection is improved by typically 400 mV due to the input hysteresis. A buffered output-control (OC) input can be used to place the eight outputs in either a normal logic state (high or low logic levels) or the high-impedance state. In the high-impedance state, the outputs neither load nor drive the bus lines significantly.

74ls373引脚图管脚功用表阐明

74ls373引脚图管脚功用表阐明74ls373是常用的地址锁存器芯片，它本质是一个是带三态缓冲输出的8D触发器，在单片机体系中为了拓展外部存储器，一般需求一块74ls373芯片，74ls373内部构造图与74ls373引脚图(1).1脚是输出使能(OE),是低电平有用,当1脚是高电往常,不论输入3、4、7、8、13、14、17、18怎么,也不论11脚(锁存操控端,G)怎么,输出2(Q0)、5(Q1)、6(Q2)、9(Q3)、12(Q4)、15(Q5)、16(Q6)、19(Q7)悉数呈现高阻状况(或许叫浮空状况);(2).当1脚是低电往常,只需11脚(锁存操控端,G)上呈现一个下降沿,输出2(Q0)、5(Q1)、6(Q2)、9(Q3)、12(Q4)、15(Q5)、16(Q6)、19(Q7)当即呈现输入脚3、4、7、8、13、14、17、18的状况.锁存端LE由高变低时，输出端8位信息被锁存，直到LE端再次有用。

当三态门使能信号OE为低电往常，三态门导通，容许Q0~Q7输出，OE为高电往常，输出悬空。

当74LS373用作地址锁存器时，应使OE为低电平，此刻锁存使能端C为高电往常，输出Q0~Q7状况与输入端D1~D7状况一样；当C发作负的跳变时，输入端D0~D7数据锁入Q0~Q7。

51单片机的ALE信号能够直接与74LS373的C联接。

1D~8D为8个输入端。

1Q~8Q为8个输出端。

G是数据锁存操控端；当G=1时，锁存器输出端同输入端；当G由1变为0时，数据输入锁存器中。

OE为输出容许端；当OE=0时，三态门翻开；当OE=1时，三态门封闭，输出呈高阻状况。

在MCS-51单片机体系中，常选用74LS373作为地址锁存器运用，其联接办法如上图所示。

其间输入端1D~8D接至单片机的P0口，输出端供给的是低8位地址，G端接至单片机的地址锁存容许信号ALE。

输出容许端OE接地，标明输出三态门一向翻开。

74ls373引脚图管脚功能表

74ls373引脚图管脚功能表74ls373是常用的地址锁存器芯片，它实质是一个是带三态缓冲输出的8D触发器，在单片机系统中为了扩展外部存储器，通常需要一块74ls373芯片，(1).1脚是输出使能(OE),是低电平有效,当1脚是高电平时,不管输入3、4、7、8、13、14、17、18如何,也不管11脚(锁存控制端,G)如何,输出2(Q0)、5(Q1)、6(Q2)、9(Q3)、12(Q4)、15(Q5)、16(Q6)、19(Q7)全部呈现高阻状态(或者叫浮空状态);(2).当1脚是低电平时,只要11脚(锁存控制端,G)上出现一个下降沿,输出2(Q0)、5(Q1)、6(Q2)、9(Q3)、12(Q4)、15(Q5)、16(Q6)、19(Q7)立即呈现输入脚3、4、7、8、13、14、17、18的状态.锁存端LE 由高变低时，输出端8 位信息被锁存，直到LE 端再次有效。

当三态门使能信号OE为低电平时，三态门导通，允许Q0~Q7输出，OE为高电平时，输出悬空。

当74LS373用作地址锁存器时，应使OE为低电平，此时锁存使能端C为高电平时，输出Q0~Q7 状态与输入端D1~D7状态相同；当C发生负的跳变时，输入端D0~D7 数据锁入Q0~Q7。

51单片机的ALE信号可以直接与74LS373的C连接。

74ls373与单片机接口：1D~8D为8个输入端。

1Q~8Q为8个输出端。

G是数据锁存控制端；当G=1时，锁存器输出端同输入端；当G由“1”变为“0”时，数据输入锁存器中。

OE为输出允许端；当OE=“0”时，三态门打开；当OE=“1”时，三态门关闭，输出呈高阻状态。

在MCS-51单片机系统中，常采用74LS373作为地址锁存器使用，其连接方法如上图所示。

其中输入端1D~8D接至单片机的P0口，输出端提供的是低8位地址，G端接至单片机的地址锁存允许信号ALE。

输出允许端OE接地，表示输出三态门一直打开。

74ls373引脚图管脚功能表

74ls373引脚图管脚功能表之马矢奏春创作74ls373是经常使用的地址锁存器芯片，它实质是一个是带三态缓冲输出的8D触发器，在单片机系统中为了扩展外部存储器，通常需要一块74ls373芯片，(1).1脚是输出使能(OE),是低电平有效,当1脚是高电平时,不管输入3、4、7、8、13、14、17、18如何,也不管11脚(锁存控制端,G)如何,输出2(Q0)、5(Q1)、6(Q2)、9(Q3)、12(Q4)、15(Q5)、16(Q6)、19(Q7)全部呈现高阻状态(或者叫浮空状态);(2).当1脚是低电平时,只要11脚(锁存控制端,G)上出现一个下降沿,输出2(Q 0)、5(Q1)、6(Q2)、9(Q3)、12(Q4)、15(Q5)、16(Q6)、19(Q7)立即呈现输入脚3、4、7、8、13、14、17、18的状态.锁存端LE 由高变低时，输出端8 位信息被锁存，直到LE 端再次有效。

当三态门使能信号OE为低电平时，三态门导通，允许Q0~Q7输出，OE为高电平时，输出悬空。

51单片机的ALE信号可以直接与74LS373的C连接。

74ls373与单片机接口：1D~8D为8个输入端。

1Q~8Q为8个输出端。

G是数据锁存控制端；当G=1时，锁存器输出端同输入端；当G由“1”变成“0”时，数据输入锁存器中。

OE为输出允许端；当OE=“0”时，三态门打开；当OE=“1”时，三态门关闭，输出呈高阻状态。

在MCS-51单片机系统中，常采取74LS373作为地址锁存器使用，其连接方法如上图所示。

其中输入端1D~8D接至单片机的P0口，输出端提供的是低8位地址，G 端接至单片机的地址锁存允许信号ALE。

输出允许端OE接地，暗示输出三态门一直打开。

74ls373引脚图管脚功能表

74ls373引脚图管脚功效表74ls373是经常应用的地址锁存器芯片,它本质是一个是带三态缓冲输出的8D触发器,在单片机体系中为了扩大外部存储器,平日须要一块74ls373芯片,(1).1脚是输出使能(OE),是低电平有用,当1脚是高电日常平凡,不管输入3.4. 7.8.13.14.17.18若何,也不管11脚(锁存掌握端,G)若何,输出2(Q0).5(Q1).6(Q2).9 (Q3).12(Q4).15(Q5).16(Q6).19(Q7)全体呈现高阻状况(或者叫浮空状况);(2).当1脚是低电日常平凡,只要11脚(锁存掌握端,G)上消失一个降低沿,输出2 (Q0).5(Q1).6(Q2).9(Q3).12(Q4).15(Q5).16(Q6).19(Q7)立刻呈现输入脚3.4.7.8.1 3.14.17.18的状况.锁存端LE 由高变低时,输出端8 位信息被锁存,直到LE 端再次有用. 当三态门使能旌旗灯号OE为低电日常平凡,三态门导通,许可Q0~Q7输出,OE为高电日常平凡,输出悬空.当74LS373用作地址锁存器时,应使OE为低电平,此时锁存使能端C为高电日常平凡,输出Q0~Q7 状况与输入端D1~D7状况雷同;当C产生负的跳变时,输入端D0 ~D7 数据锁入Q0~Q7.51单片机的ALE旌旗灯号可以直接与74LS373的C衔接. 74ls3 73与单片机接口：1D~8D为8个输入端.1Q~8Q为8个输出端.G是数据锁存掌握端;当G=1时,锁存器输出端同输入端;当G由“1”变成“0”时,数据输入锁存器中.OE为输出许可端;当OE=“0”时,三态门打开;当OE=“1”时,三态门封闭,输出呈高阻状况.在MCS-51单片机体系中,常采取74LS373作为地址锁存器应用,其衔接办法如上图所示.个中输入端1D~8D接至单片机的P0口,输出端供给的是低8位地址,G端接至单片机的地址锁存许可旌旗灯号ALE.输出许可端OE接地,暗示输出三态门一向打开。

74ls373中文资料

PD
ｍ
54S373/74S373
7ns
54LS373/74LS373
17ns
525mW 120mW
ｒ
ａ 373 的输出端 O0~O7 可直接与总线相连。
当三态允许控制端 OE 为低电平时，O0~O7 为正常逻辑状态，可用来驱动负载或总
－线。当 OE 为高电平时，O0~O7 呈高阻态，即不驱动总线，也不为总线的负载，但
单位
VIK输入嵌位电压
VOH输出高电平电压
VOL输出低电平电压 II最大输入电压时输入
电流 IIL输入低电平电流 IIH输入高电平电流
Vcc=最小，Iik=-18mA
Vcc＝最小，VIL＝最大， VIH=2V，IOH＝最大
Vcc=最小，VIL＝最大， 54
VIH=2V,IOL=最大
74
Vcc＝最大
VI=5.5V VI=7V
54LS373/74LS373 最小额定最大
单位
电源电压 Vcc
54 4.5
5
74 4.75
5
输入高电平电压ViH
2
输入低电平电压ViL
54 74
5.5
4.5
5
5.5
5.25 4.75
5
5.25
V
2
V
0.8 0.8
0.7 0.8
V
输出高电平电流IOH
54 74
-2
-1
mA
-6.5
-2.6
输出低电平电流IOL
．输出高阻态时高电平电压 ………………………….
工作环境温度
ｗ 54XXX
………………………………….
74XXX
………………………………….

74573资料

74HC573和74LS373原理一样，8数据锁存器。

主要用于数码管、按键等等的控制1. 真值表参见74LS373的PDF的第2页：Dn LE OE OnH H L HL H L LX L L QoX X H Z这个就是真值表,表示这个芯片在输入和其它的情况下的输出情况。

每个芯片的数据手册（datasheet）中都有真值表。

布尔逻辑比较简单,在此不赘述;2. 高阻态就是输出既不是高电平,也不是低电平,而是高阻抗的状态;在这种状态下,可以多个芯片并联输出;但是,这些芯片中只能有一个处于非高阻态状态,否则会将芯片烧毁;高阻态的概念在RS232和RS422通讯中还可以用到。

3. 数据锁存当输入的数据消失时,在芯片的输出端,数据仍然保持;这个概念在并行数据扩展中经常使用到。

4. 数据缓冲加强驱动能力。

74LS244/74LS245/74LS373/74LS573都具备数据缓冲的能力。

OE：output_enable,输出使能;LE：latch_enable,数据锁存使能,latch是锁存的意思;Dn：第n路输入数据;On：第n路输出数据;再看这个真值表,意思如下：第四行：当OE＝1是,无论Dn、LE为何,输出端为高阻态;第三行：当OE＝0、LE＝0时,输出端保持不变;第二行第一行：当OE＝0、LE＝1时,输出端数据等于输入端数据;结合下面的波形图,在实际应用的时候是这样做的：a．OE＝0;b．先将数据从单片机的口线上输出到Dn;c．再将LE从0->1->0d．这时,你所需要输出的数据就锁存在On上了,输入的数据在变化也影响不到输出的数据了;实际上,单片机现在在忙着干别的事情,串行通信、扫描键盘……单片机的资源有限啊。

在单片机按照RAM方式进行并行数据的扩展时,使用movx @dptr, A这条指令时,这些时序是由单片机来实现的。

后面的表格中还有需要时间的参数,你不需要去管它,因为这些参数都是几十ns级别的,对于单片机在12M下的每个指令周期最小是1us的情况下,完全可以实现;如果是你自己来实现这个逻辑,类似的指令如下：mov P0,A ;将数据输出到并行数据端口clr LEsetb LEclr LE ;上面三条指令完成LE的波形从0->1->0的变化74ls573跟74LS373逻辑上完全一样,只不过是管脚定义不一样,数据输入和输出端182回答者：a33090997a - 一级。

74ls373引脚图管脚功能表

当三态门使能信号OE为低电平时，三态门导通，允许Q0~Q7输出，OE为高电平时，输出悬空。

当74L S373用作地址锁存器时，应使OE为低电平，此时锁存使能端C为高电平时，输出Q0~Q7 状态与输入端D1~D7状态相同；当C发生负的跳变时，输入端D0~D7 数据锁入Q0~Q7。

51单片机的ALE信号可以直接与74LS373的C连接。

74ls373与单片机接口：1D~8D为8个输入端。

1Q~8Q为8个输出端。

G是数据锁存控制端；当G=1时，锁存器输出端同输入端；当G由“1”变为“0”时，数据输入锁存器中。

OE为输出允许端；当OE=“0”时，三态门打开；当OE=“1”时，三态门关闭，输出呈高阻状态。

在MCS-51单片机系统中，常采用74LS373作为地址锁存器使用，其连接方法如上图所示。

其中输入端1D~8D接至单片机的P0口，输出端提供的是低8位地址，G端接至单片机的地址锁存允许信号ALE。

输出允许端OE接地，表示输出三态门一直打开。

SN74LS373DWRG4中文资料

PACKAGING INFORMATIONOrderableDevice Status (1)Package Type Package DrawingPins Package Qty Eco Plan (2)Lead/Ball Finish MSL Peak Temp (3)5962-7801102VRA ACTIVE CDIP J 201TBD A42SNPB N /A for Pkg Type 5962-7801102VSAACTIVE CFP W 201TBD A42N /A for Pkg Type 78011022A ACTIVE LCCC FK 201TBD POST-PLATE N /A for Pkg Type7801102RA ACTIVE CDIP J 201TBD A42SNPB N /A for Pkg Type 7801102SA ACTIVE CFP W 201TBD A42N /A for Pkg Type JM38510/32502B2A ACTIVE LCCC FK 201TBD POST-PLATE N /A for Pkg TypeJM38510/32502BRA ACTIVE CDIP J 201TBD A42SNPB N /A for Pkg Type JM38510/32502BSA ACTIVE CFP W 201TBD A42N /A for Pkg Type JM38510/32502SRA ACTIVE CDIP J 201TBD A42SNPB N /A for Pkg Type JM38510/32502SSA ACTIVE CFP W 201TBD A42N /A for Pkg Type JM38510/32503B2A ACTIVE LCCC FK 201TBD POST-PLATE N /A for Pkg TypeJM38510/32503BRA ACTIVE CDIP J 201TBD A42SNPB N /A for Pkg Type JM38510/32503BSAACTIVE CFP W 201TBD A42N /A for Pkg Type SN54LS373J ACTIVE CDIP J 201TBD A42SNPB N /A for Pkg Type SN54LS374J ACTIVE CDIP J 201TBD A42SNPB N /A for Pkg Type SN54S373J ACTIVE CDIP J 201TBD A42SNPB N /A for Pkg Type SN54S374J ACTIVE CDIP J 201TBD A42SNPB N /A for Pkg Type SN74LS373DW ACTIVE SOIC DW 2025Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74LS373DWE4ACTIVE SOIC DW 2025Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74LS373DWG4ACTIVE SOIC DW 2025Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74LS373DWR ACTIVE SOIC DW 202000Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74LS373DWRE4ACTIVE SOIC DW 202000Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74LS373DWRG4ACTIVE SOIC DW 202000Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74LS373N ACTIVE PDIP N 2020Pb-Free (RoHS)CU NIPDAU N /A for Pkg Type SN74LS373N3OBSOLETE PDIP N 20TBD Call TI Call TISN74LS373NE4ACTIVE PDIP N 2020Pb-Free (RoHS)CU NIPDAU N /A for Pkg Type SN74LS373NSR ACTIVE SO NS 202000Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74LS373NSRE4ACTIVE SO NS 202000Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74LS373NSRG4ACTIVE SO NS 202000Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74LS374DBR ACTIVE SSOP DB 202000Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74LS374DBRE4ACTIVE SSOP DB 202000Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74LS374DBRG4ACTIVESSOPDB202000Green (RoHS &no Sb/Br)CU NIPDAULevel-1-260C-UNLIM4-Jun-2007OrderableDevice Status (1)Package Type Package Drawing Pins Package Qty Eco Plan (2)Lead/Ball Finish MSL Peak Temp (3)SN74LS374DW ACTIVE SOIC DW 2025Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74LS374DWG4ACTIVE SOIC DW 2025Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74LS374DWR ACTIVE SOIC DW 202000Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74LS374DWRG4ACTIVE SOIC DW 202000Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74LS374J OBSOLETE CDIP J 20TBD Call TI Call TISN74LS374N ACTIVE PDIP N 2020Pb-Free (RoHS)CU NIPDAU N /A for Pkg Type SN74LS374N3OBSOLETE PDIP N 20TBD Call TI Call TISN74LS374NE4ACTIVE PDIP N 2020Pb-Free (RoHS)CU NIPDAU N /A for Pkg Type SN74LS374NSR ACTIVE SO NS 202000Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74LS374NSRE4ACTIVE SO NS 202000Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74LS374NSRG4ACTIVE SO NS 202000Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74S373DW ACTIVE SOIC DW 2025Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74S373DWE4ACTIVE SOIC DW 2025Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74S373DWG4ACTIVE SOIC DW 2025Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74S373DWR ACTIVE SOIC DW 202000Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74S373DWRE4ACTIVE SOIC DW 202000Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74S373DWRG4ACTIVE SOIC DW 202000Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74S373J OBSOLETE CDIP J 20TBD Call TI Call TISN74S373N ACTIVE PDIP N 2020Pb-Free (RoHS)CU NIPDAU N /A for Pkg Type SN74S373N3OBSOLETE PDIP N 20TBD Call TI Call TISN74S373NE4ACTIVE PDIP N 2020Pb-Free (RoHS)CU NIPDAU N /A for Pkg Type SN74S374DW ACTIVE SOIC DW 2025Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74S374DWE4ACTIVE SOIC DW 2025Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74S374DWG4ACTIVE SOIC DW 2025Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74S374DWR ACTIVE SOIC DW 202000Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74S374DWRE4ACTIVE SOIC DW 202000Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74S374DWRG4ACTIVE SOIC DW 202000Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74S374JOBSOLETECDIPJ20TBDCall TICall TI4-Jun-2007Orderable Device Status (1)Package Type Package DrawingPins Package Qty Eco Plan (2)Lead/Ball Finish MSL Peak Temp (3)SN74S374N ACTIVE PDIP N 2020Pb-Free (RoHS)CU NIPDAU N /A for Pkg Type SN74S374N3OBSOLETE PDIP N 20TBD Call TI Call TISN74S374NE4ACTIVE PDIP N 2020Pb-Free (RoHS)CU NIPDAU N /A for Pkg Type SN74S374NSR ACTIVE SO NS 202000Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74S374NSRE4ACTIVE SO NS 202000Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74S374NSRG4ACTIVE SO NS 202000Green (RoHS &no Sb/Br)CU NIPDAULevel-1-260C-UNLIMSNJ54LS373FK ACTIVE LCCC FK 201TBD POST-PLATE N /A for Pkg Type SNJ54LS373J ACTIVE CDIP J 201TBD A42SNPB N /A for Pkg Type SNJ54LS373W ACTIVE CFP W 201TBD A42N /A for Pkg Type SNJ54LS374FK ACTIVE LCCC FK 201TBD POST-PLATE N /A for Pkg TypeSNJ54LS374J ACTIVE CDIP J 201TBD A42SNPB N /A for Pkg Type SNJ54LS374W ACTIVE CFP W 201TBD A42N /A for Pkg Type SNJ54S373FK ACTIVE LCCC FK 201TBD POST-PLATE N /A for Pkg Type SNJ54S373J ACTIVE CDIP J 201TBD A42SNPB N /A for Pkg Type SNJ54S374FK ACTIVE LCCC FK 201TBD POST-PLATE N /A for Pkg TypeSNJ54S374J ACTIVE CDIP J 201TBD A42SNPB N /A for Pkg Type SNJ54S374WACTIVECFPW201TBDA42N /A for Pkg Type(1)The marketing status valuesare defined as follows:ACTIVE:Product device recommended for new designs.LIFEBUY:TI has announced that the device will be discontinued,and a lifetime-buy period is in effect.NRND:Not recommended for new designs.Device is in production to support existing customers,but TI does not recommend using this part in a new design.PREVIEW:Device has been announced but is not in production.Samples may or may not be available.OBSOLETE:TI has discontinued the production of the device.(2)Eco Plan -The planned eco-friendly classification:Pb-Free (RoHS),Pb-Free (RoHS Exempt),or Green (RoHS &no Sb/Br)-please check /productcontent for the latest availability information and additional product content details.TBD:The Pb-Free/Green conversion plan has not been defined.Pb-Free (RoHS):TI's terms "Lead-Free"or "Pb-Free"mean semiconductor products that are compatible with the current RoHS requirements for all 6substances,including the requirement that lead not exceed 0.1%by weight in homogeneous materials.Where designed to be soldered at high temperatures,TI Pb-Free products are suitable for use in specified lead-free processes.Pb-Free (RoHS Exempt):This component has a RoHS exemption for either 1)lead-based flip-chip solder bumps used between the die and package,or 2)lead-based die adhesive used between the die and leadframe.The component is otherwise considered Pb-Free (RoHS compatible)as defined above.Green (RoHS &no Sb/Br):TI defines "Green"to mean Pb-Free (RoHS compatible),and free of Bromine (Br)and Antimony (Sb)based flame retardants (Br or Sb do not exceed 0.1%by weight in homogeneous material)(3)MSL,Peak Temp.--The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications,and peak solder temperature.Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided.TI bases its knowledge and belief on information provided by third parties,and makes no representation or warranty as to the accuracy of such information.Efforts are underway to better integrate information from third parties.TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.TI and TI suppliers consider certain information to be proprietary,and thus CAS numbers and other limited information may not be available for release.In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s)at issue in this document sold by TI4-Jun-2007to Customer on an annualbasis.4-Jun-2007TAPE AND REELINFORMATION19-May-2007DevicePackage Pins SiteReel Diameter (mm)Reel Width (mm)A0(mm)B0(mm)K0(mm)P1(mm)W (mm)Pin1Quadrant SN74LS373DWR DW 20MLA 3302410.813.0 2.71224Q1SN74LS373NSR NS 20MLA 330248.213.0 2.51224Q1SN74LS374DBR DB 20MLA 330168.27.5 2.51216Q1SN74LS374DWR DW 20MLA 3302410.813.0 2.71224Q1SN74LS374NSR NS 20MLA 330248.213.0 2.51224Q1SN74S373DWR DW 20MLA 3302410.813.0 2.71224Q1SN74S374DWR DW 20MLA 3302410.813.0 2.71224Q1SN74S374NSRNS20MLA330248.213.02.51224Q1TAPE AND REEL BOX INFORMATIONDevice Package Pins Site Length (mm)Width (mm)Height (mm)SN74LS373DWR DW 20MLA 333.2333.231.75SN74LS373NSR NS 20MLA 333.2333.231.75SN74LS374DBR DB 20MLA 342.9336.628.58SN74LS374DWR DW 20MLA 333.2333.231.75SN74LS374NSR NS 20MLA 333.2333.231.75SN74S373DWR DW 20MLA 333.2333.231.75SN74S374DWR DW 20MLA 333.2333.231.75SN74S374NSRNS20MLA333.2333.231.7519-May-200719-May-2007IMPORTANT NOTICETexas Instruments Incorporated and its subsidiaries(TI)reserve the right to make corrections,modifications,enhancements, improvements,and other changes to its products and services at any time and to discontinue any product or service without notice. Customers should obtain the latest relevant information before placing orders and should verify that such information is current and complete.All products are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment.TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s standard warranty.Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty.Except where mandated by government requirements,testing of all parameters of each product is not necessarily performed.TI assumes no liability for applications assistance or customer product design.Customers are responsible for their products and applications using TI components.To minimize the risks associated with customer products and applications,customers should provide adequate design and operating safeguards.TI does not warrant or represent that any license,either express or implied,is granted under any TI patent right,copyright,mask work right,or other TI intellectual property right relating to any combination,machine,or process in which TI products or services are rmation published by TI regarding third-party products or services does not constitute a license from TI to use such products or services or a warranty or endorsement e of such information may require a license from a third party under the patents or other intellectual property of the third party,or a license from TI under the patents or other intellectual property of TI. Reproduction of TI information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties,conditions,limitations,and notices.Reproduction of this information with alteration is an unfair and deceptive business practice.TI is not responsible or liable for such altered rmation of third parties may be subject to additional restrictions.Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service voids all express and any implied warranties for the associated TI product or service and is an unfair and deceptive business practice.TI is not responsible or liable for any such statements.TI products are not authorized for use in safety-critical applications(such as life support)where a failure of the TI product would reasonably be expected to cause severe personal injury or death,unless officers of the parties have executed an agreement specifically governing such use.Buyers represent that they have all necessary expertise in the safety and regulatory ramifications of their applications,and acknowledge and agree that they are solely responsible for all legal,regulatory and safety-related requirements concerning their products and any use of TI products in such safety-critical applications,notwithstanding any applications-related information or support that may be provided by TI.Further,Buyers must fully indemnify TI and its representatives against any damages arising out of the use of TI products in such safety-critical applications.TI products are neither designed nor intended for use in military/aerospace applications or environments unless the TI products are specifically designated by TI as military-grade or"enhanced plastic."Only products designated by TI as military-grade meet military specifications.Buyers acknowledge and agree that any such use of TI products which TI has not designated as military-grade is solely at the Buyer's risk,and that they are solely responsible for compliance with all legal and regulatory requirements in connection with such use.TI products are neither designed nor intended for use in automotive applications or environments unless the specific TI products are designated by TI as compliant with ISO/TS16949requirements.Buyers acknowledge and agree that,if they use anynon-designated products in automotive applications,TI will not be responsible for any failure to meet such requirements. Following are URLs where you can obtain information on other Texas Instruments products and application solutions:Products ApplicationsAmplifiers Audio /audioData Converters Automotive /automotiveDSP Broadband /broadbandInterface Digital Control /digitalcontrolLogic Military /militaryPower Mgmt Optical Networking /opticalnetworkMicrocontrollers Security /securityRFID Telephony /telephonyLow Power /lpw Video&Imaging /videoWirelessWireless /wirelessMailing Address:Texas Instruments,Post Office Box655303,Dallas,Texas75265Copyright©2007,Texas Instruments Incorporated。

SN74LS373中文资料

PACKAGING INFORMATIONOrderable Device Status(1)PackageType PackageDrawingPins PackageQtyEco Plan(2)Lead/Ball Finish MSL Peak Temp(3)5962-7801102VRA ACTIVE CDIP J201TBD Call TI Level-NC-NC-NC 5962-7801102VSA ACTIVE CFP W201TBD Call TI Level-NC-NC-NC 78011022A ACTIVE LCCC FK201TBD Call TI Level-NC-NC-NC 7801102RA ACTIVE CDIP J201TBD Call TI Level-NC-NC-NC 7801102SA ACTIVE CFP W201TBD Call TI Level-NC-NC-NCJM38510/32502B2A ACTIVE LCCC FK201TBD Call TI Level-NC-NC-NCJM38510/32502BRA ACTIVE CDIP J201TBD Call TI Level-NC-NC-NCJM38510/32502BSA ACTIVE CFP W201TBD Call TI Level-NC-NC-NCJM38510/32502SRA ACTIVE CDIP J201TBD Call TI Level-NC-NC-NCJM38510/32502SSA ACTIVE CFP W201TBD Call TI Level-NC-NC-NCJM38510/32503B2A ACTIVE LCCC FK201TBD Call TI Level-NC-NC-NCJM38510/32503BRA ACTIVE CDIP J201TBD Call TI Level-NC-NC-NCJM38510/32503BSA ACTIVE CFP W201TBD Call TI Level-NC-NC-NC SN54LS373J ACTIVE CDIP J201TBD Call TI Level-NC-NC-NC SN54LS374J ACTIVE CDIP J201TBD Call TI Level-NC-NC-NC SN54S373J ACTIVE CDIP J201TBD Call TI Level-NC-NC-NC SN54S374J ACTIVE CDIP J201TBD Call TI Level-NC-NC-NC SN74LS373DW ACTIVE SOIC DW2025Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74LS373DWE4ACTIVE SOIC DW2025Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74LS373DWR ACTIVE SOIC DW202000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74LS373DWRE4ACTIVE SOIC DW202000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74LS373N ACTIVE PDIP N2020Pb-Free(RoHS)CU NIPDAU Level-NC-NC-NC SN74LS373N3OBSOLETE PDIP N20TBD Call TI Call TISN74LS373NSR ACTIVE SO NS202000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74LS373NSRE4ACTIVE SO NS202000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74LS374DBR ACTIVE SSOP DB202000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74LS374DBRE4ACTIVE SSOP DB202000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74LS374DW ACTIVE SOIC DW2025Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74LS374DWG4ACTIVE SOIC DW2025Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74LS374DWR ACTIVE SOIC DW202000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74LS374DWRG4ACTIVE SOIC DW202000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74LS374J OBSOLETE CDIP J20TBD Call TI Call TISN74LS374N ACTIVE PDIP N2020Pb-Free CU NIPDAU Level-NC-NC-NCOrderable Device Status(1)PackageType PackageDrawingPins PackageQtyEco Plan(2)Lead/Ball Finish MSL Peak Temp(3)(RoHS)SN74LS374N3OBSOLETE PDIP N20TBD Call TI Call TISN74LS374NE4ACTIVE PDIP N2020Pb-Free(RoHS)CU NIPDAU Level-NC-NC-NCSN74LS374NSR ACTIVE SO NS202000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74LS374NSRE4ACTIVE SO NS202000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74S373DW ACTIVE SOIC DW2025Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74S373DWE4ACTIVE SOIC DW2025Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74S373DWR ACTIVE SOIC DW202000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74S373DWRE4ACTIVE SOIC DW202000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74S373J OBSOLETE CDIP J20TBD Call TI Call TISN74S373N ACTIVE PDIP N2020Pb-Free(RoHS)CU NIPDAU Level-NC-NC-NC SN74S373N3OBSOLETE PDIP N20TBD Call TI Call TISN74S374DW ACTIVE SOIC DW2025Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74S374DWE4ACTIVE SOIC DW2025Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74S374DWR ACTIVE SOIC DW202000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74S374DWRE4ACTIVE SOIC DW202000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74S374J OBSOLETE CDIP J20TBD Call TI Call TISN74S374N ACTIVE PDIP N2020Pb-Free(RoHS)CU NIPDAU Level-NC-NC-NC SN74S374N3OBSOLETE PDIP N20TBD Call TI Call TISN74S374NE4ACTIVE PDIP N2020Pb-Free(RoHS)CU NIPDAU Level-NC-NC-NCSN74S374NSR ACTIVE SO NS202000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74S374NSRE4ACTIVE SO NS202000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SNJ54LS373FK ACTIVE LCCC FK201TBD Call TI Level-NC-NC-NC SNJ54LS373J ACTIVE CDIP J201TBD Call TI Level-NC-NC-NC SNJ54LS373W ACTIVE CFP W201TBD Call TI Level-NC-NC-NC SNJ54LS374FK ACTIVE LCCC FK201TBD Call TI Level-NC-NC-NC SNJ54LS374J ACTIVE CDIP J201TBD Call TI Level-NC-NC-NC SNJ54LS374W ACTIVE CFP W201TBD Call TI Level-NC-NC-NC SNJ54S373FK ACTIVE LCCC FK201TBD Call TI Level-NC-NC-NC SNJ54S373J ACTIVE CDIP J201TBD Call TI Level-NC-NC-NC SNJ54S374FK ACTIVE LCCC FK201TBD Call TI Level-NC-NC-NC SNJ54S374J ACTIVE CDIP J201TBD Call TI Level-NC-NC-NCOrderable Device Status(1)PackageType PackageDrawingPins PackageQtyEco Plan(2)Lead/Ball Finish MSL Peak Temp(3)SNJ54S374W ACTIVE CFP W201TBD Call TI Level-NC-NC-NC(1)The marketing status values are defined as follows:ACTIVE:Product device recommended for new designs.LIFEBUY:TI has announced that the device will be discontinued,and a lifetime-buy period is in effect.NRND:Not recommended for new designs.Device is in production to support existing customers,but TI does not recommend using this part in a new design.PREVIEW:Device has been announced but is not in production.Samples may or may not be available.OBSOLETE:TI has discontinued the production of the device.(2)Eco Plan-The planned eco-friendly classification:Pb-Free(RoHS)or Green(RoHS&no Sb/Br)-please check /productcontent for the latest availability information and additional product content details.TBD:The Pb-Free/Green conversion plan has not been defined.Pb-Free(RoHS):TI's terms"Lead-Free"or"Pb-Free"mean semiconductor products that are compatible with the current RoHS requirements for all6substances,including the requirement that lead not exceed0.1%by weight in homogeneous materials.Where designed to be soldered at high temperatures,TI Pb-Free products are suitable for use in specified lead-free processes.Green(RoHS&no Sb/Br):TI defines"Green"to mean Pb-Free(RoHS compatible),and free of Bromine(Br)and Antimony(Sb)based flame retardants(Br or Sb do not exceed0.1%by weight in homogeneous material)(3)MSL,Peak Temp.--The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications,and peak solder temperature.Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided.TI bases its knowledge and belief on information provided by third parties,and makes no representation or warranty as to the accuracy of such information.Efforts are underway to better integrate information from third parties.TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.TI and TI suppliers consider certain information to be proprietary,and thus CAS numbers and other limited information may not be available for release.In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s)at issue in this document sold by TI to Customer on an annual basis.元器件交易网元器件交易网IMPORTANT NOTICETexas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications,enhancements, improvements, and other changes to its products and services at any time and to discontinueany product or service without notice. Customers should obtain the latest relevant information before placingorders and should verify that such information is current and complete. All products are sold subject to TI’s termsand conditions of sale supplied at the time of order acknowledgment.TI warrants performance of its hardware products to the specifications applicable at the time of sale inaccordance with TI’s standard warranty. T esting and other quality control techniques are used to the extent TIdeems necessary to support this warranty. Except where mandated by government requirements, testing of allparameters of each product is not necessarily performed.TI assumes no liability for applications assistance or customer product design. Customers are responsible fortheir products and applications using TI components. T o minimize the risks associated with customer productsand applications, customers should provide adequate design and operating safeguards.TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right,copyright, mask work right, or other TI intellectual property right relating to any combination, machine, or processin which TI products or services are used. Information published by TI regarding third-party products or servicesdoes not constitute a license from TI to use such products or services or a warranty or endorsement thereof.Use of such information may require a license from a third party under the patents or other intellectual propertyof the third party, or a license from TI under the patents or other intellectual property of TI.Reproduction of information in TI data books or data sheets is permissible only if reproduction is withoutalteration and is accompanied by all associated warranties, conditions, limitations, and notices. Reproductionof this information with alteration is an unfair and deceptive business practice. TI is not responsible or liable forsuch altered documentation.Resale of TI products or services with statements different from or beyond the parameters stated by TI for thatproduct or service voids all express and any implied warranties for the associated TI product or service andis an unfair and deceptive business practice. TI is not responsible or liable for any such statements.Following are URLs where you can obtain information on other Texas Instruments products and applicationsolutions:Products ApplicationsAmplifiers Audio /audioData Converters Automotive /automotiveDSP Broadband /broadbandInterface Digital Control /digitalcontrolLogic Military /militaryPower Mgmt Optical Networking /opticalnetworkMicrocontrollers Security /securityTelephony /telephonyVideo & Imaging /videoWireless /wirelessMailing Address:Texas InstrumentsPost Office Box 655303 Dallas, Texas 75265Copyright 2005, Texas Instruments Incorporated。

74LS373应用介绍

74ls373是常用的地址锁存器芯片，它实质是一个是带三态缓冲输出的8D触发器，在单片机系统中为了扩展外部存储器，通常需要一块74ls373芯片.本文将介绍74ls373的工作原理,引脚图(管脚图),内结构图、主要参数及在单片机系统中的典型应用电路.74ls373工作原理简述:(1).1脚是输出使能(OE),是低电平有效,当1脚是高电平时,不管输入3、4、7、8、13、14、17、18如何,也不管11脚(锁存控制端,G)如何,输出2(Q0)、5(Q1)、6(Q2)、9(Q3)、12(Q4)、15(Q5)、16(Q6)、19(Q7)全部呈现高阻状态(或者叫浮空状态);(2).当1脚是低电平时,只要11脚(锁存控制端,G)上出现一个下降沿,输出2(Q0)、5(Q1)、6(Q2)、9(Q3)、12(Q4)、15(Q5)、16(Q6)、19(Q7)立即呈现输入脚3、4、7、8、13、14、17、18的状态.锁存端LE 由高变低时，输出端8 位信息被锁存，直到LE 端再次有效。

当三态门使能信号OE为低电平时，三态门导通，允许Q0~Q7输出，OE为高电平时，输出悬空。

74ls373内部逻辑结构图74LS373的真值表(功能表)，表中：L——低电平；H——高电平；X——不定态；Q0——建立稳态前Q的电平；G——输入端，与8031ALE连高电平：畅通无阻低电平：关门锁存。

图中OE——使能端，接地。

当G=“1”时，74LS373输出端1Q—8Q与输入端1D—8D相同；当G为下降沿时，将输入数据锁存。

E G 功能0 0 直通Qi = Di0 1 保持（Qi保持不变）1 X 输出高阻74ls373引脚(管脚)排列图:74ls373电气特性74ls373推荐工作条件74ls373在单片机系统中的应用电路图:当74LS373用作地址锁存器时，应使OE为低电平，此时锁存使能端C为高电平时，输出Q0~Q7 状态与输入端D1~D7状态相同；当C发生负的跳变时，输入端D0~D7 数据锁入Q0~Q7。

54ls373_74ls373

注：Icc 在输出控制端加 4.5V 时测量。
74Ⅱ 参数值最小典型最大
-1.5
2.4 3.1
54 参数值最小典型最大
-1.5
2.4 3.4
单位
V V
0.35 0.5
0.25 0.4 V
0.1
20 -0.4
20
0.1 mA
20 μA -0.4 mA
20 μA
-20
-20 μA
-30
-130 -30
电性能：（除特别说明外，均为全温度范围）
符号参数名称
测试条件
VIK 输入钳位电压 Vcc=最小 II=-18mA
VOH
输出高电平电压
Vcc=最小 VIH=2V
VIL=最大 IOH=最大
VOL
输出低电平电压
Vcc=最小 VIH=2V
VIL=最大 IOL=最大
II
输入电流 (最大输入电压时)
Vcc=最大
VI=7V
IIH 输入高电平电流 Vcc=最大 VI=2.7V
IIL 输入低电平电流 Vcc=最大 VI=0.4V
IOZH
高关态输出电流 Vcc=最大 Vo=2.7V
VI=2.0V
IOZL
低关态输出电流 Vcc=最大 Vo=0.4V
VI=2.0V
IOS 输出短路电流 Vcc=最大 VO=0V
ICC
电源电流 Vcc=最大 (注)
-130 mA
24 40
24 40 mA
所有典型值均在 Vcc=5.0V, TA=25℃下测量得出。
交流（开关）参数：Vcc=5.0V, TA=25℃
符号参数名称从（输入）到（输出）

74ls373引脚图管脚功能表

74ls373引脚图管脚功能表之樊仲川亿创作74ls373是经常使用的地址锁存器芯片，它实质是一个是带三态缓冲输出的8D触发器，在单片机系统中为了扩展外部存储器，通常需要一块74ls373芯片，(1).1脚是输出使能(OE),是低电平有效,当1脚是高电平时,不管输入3、4、7、8、13、14、17、18如何,也不管11脚(锁存控制端,G)如何,输出2(Q0)、5(Q1)、6(Q2)、9(Q3)、12(Q4)、15(Q5)、16(Q6)、19(Q7)全部呈现高阻状态(或者叫浮空状态);(2).当1脚是低电平时,只要11脚(锁存控制端,G)上出现一个下降沿,输出2(Q 0)、5(Q1)、6(Q2)、9(Q3)、12(Q4)、15(Q5)、16(Q6)、19(Q7)立即呈现输入脚3、4、7、8、13、14、17、18的状态.锁存端LE 由高变低时，输出端8 位信息被锁存，直到LE 端再次有效。

当三态门使能信号OE为低电平时，三态门导通，允许Q0~Q7输出，OE为高电平时，输出悬空。

51单片机的ALE信号可以直接与74LS373的C连接。

74ls373与单片机接口：1D~8D为8个输入端。

1Q~8Q为8个输出端。

G是数据锁存控制端；当G=1时，锁存器输出端同输入端；当G由“1”变成“0”时，数据输入锁存器中。

OE为输出允许端；当OE=“0”时，三态门打开；当OE=“1”时，三态门关闭，输出呈高阻状态。

在MCS-51单片机系统中，常采取74LS373作为地址锁存器使用，其连接方法如上图所示。

其中输入端1D~8D接至单片机的P0口，输出端提供的是低8位地址，G 端接至单片机的地址锁存允许信号ALE。

输出允许端OE接地，暗示输出三态门一直打开。

L新编应用介绍

74ls373是常用的地址锁存器芯片，它实质是一个是带三态缓冲输出的8D触发器，在单片机系统中为了扩展外部存储器，通常需要一块74ls373芯片.本文将介绍74ls373的工作原理,引脚图(管脚图),内结构图、主要参数及在单片机系统中的典型应用电路. 74ls373工作原理简述:(1).1脚是输出使能(OE),是低电平有效,当1脚是高电平时,不管输入3、4、7、8、13、14、17、18如何,也不管11脚(锁存控制端,G)如何,输出2(Q0)、5(Q1)、6(Q2)、9(Q3)、12(Q4)、15(Q5)、16(Q6)、19(Q7)全部呈现高阻状态(或者叫浮空状态);(2).当1脚是低电平时,只要11脚(锁存控制端,G)上出现一个下降沿,输出2(Q0)、5(Q1)、6(Q2)、9(Q3)、12(Q4)、15(Q5)、16(Q6)、19(Q7)立即呈现输入脚3、4、7、8、13、14、17、18的状态.锁存端LE 由高变低时，输出端8 位信息被锁存，直到LE 端再次有效。

当三态门使能信号OE为低电平时，三态门导通，允许Q0~Q7输出，OE为高电平时，输出悬空。

图中OE——使能端，接地。

当G=“1”时，74LS373输出端1Q—8Q与输入端1D—8D相同；当G为下降沿时，将输入数据锁存。

74LS373

PACKAGING INFORMATIONOrderable Device Status(1)PackageType PackageDrawingPins PackageQtyEco Plan(2)Lead/Ball Finish MSL Peak Temp(3)5962-7801102VRA ACTIVE CDIP J201TBD Call TI Level-NC-NC-NC 5962-7801102VSA ACTIVE CFP W201TBD Call TI Level-NC-NC-NC 78011022A ACTIVE LCCC FK201TBD Call TI Level-NC-NC-NC 7801102RA ACTIVE CDIP J201TBD Call TI Level-NC-NC-NC 7801102SA ACTIVE CFP W201TBD Call TI Level-NC-NC-NCJM38510/32502B2A ACTIVE LCCC FK201TBD Call TI Level-NC-NC-NCJM38510/32502BRA ACTIVE CDIP J201TBD Call TI Level-NC-NC-NCJM38510/32502BSA ACTIVE CFP W201TBD Call TI Level-NC-NC-NCJM38510/32502SRA ACTIVE CDIP J201TBD Call TI Level-NC-NC-NCJM38510/32502SSA ACTIVE CFP W201TBD Call TI Level-NC-NC-NCJM38510/32503B2A ACTIVE LCCC FK201TBD Call TI Level-NC-NC-NCJM38510/32503BRA ACTIVE CDIP J201TBD Call TI Level-NC-NC-NCJM38510/32503BSA ACTIVE CFP W201TBD Call TI Level-NC-NC-NC SN54LS373J ACTIVE CDIP J201TBD Call TI Level-NC-NC-NC SN54LS374J ACTIVE CDIP J201TBD Call TI Level-NC-NC-NC SN54S373J ACTIVE CDIP J201TBD Call TI Level-NC-NC-NC SN54S374J ACTIVE CDIP J201TBD Call TI Level-NC-NC-NC SN74LS373DW ACTIVE SOIC DW2025Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74LS373DWE4ACTIVE SOIC DW2025Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74LS373DWR ACTIVE SOIC DW202000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74LS373DWRE4ACTIVE SOIC DW202000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74LS373N ACTIVE PDIP N2020Pb-Free(RoHS)CU NIPDAU Level-NC-NC-NC SN74LS373N3OBSOLETE PDIP N20TBD Call TI Call TISN74LS373NSR ACTIVE SO NS202000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74LS373NSRE4ACTIVE SO NS202000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74LS374DBR ACTIVE SSOP DB202000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74LS374DBRE4ACTIVE SSOP DB202000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74LS374DW ACTIVE SOIC DW2025Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74LS374DWG4ACTIVE SOIC DW2025Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74LS374DWR ACTIVE SOIC DW202000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74LS374DWRG4ACTIVE SOIC DW202000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74LS374J OBSOLETE CDIP J20TBD Call TI Call TISN74LS374N ACTIVE PDIP N2020Pb-Free CU NIPDAU Level-NC-NC-NCOrderable Device Status(1)PackageType PackageDrawingPins PackageQtyEco Plan(2)Lead/Ball Finish MSL Peak Temp(3)(RoHS)SN74LS374N3OBSOLETE PDIP N20TBD Call TI Call TISN74LS374NE4ACTIVE PDIP N2020Pb-Free(RoHS)CU NIPDAU Level-NC-NC-NCSN74LS374NSR ACTIVE SO NS202000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74LS374NSRE4ACTIVE SO NS202000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74S373DW ACTIVE SOIC DW2025Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74S373DWE4ACTIVE SOIC DW2025Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74S373DWR ACTIVE SOIC DW202000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74S373DWRE4ACTIVE SOIC DW202000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74S373J OBSOLETE CDIP J20TBD Call TI Call TISN74S373N ACTIVE PDIP N2020Pb-Free(RoHS)CU NIPDAU Level-NC-NC-NC SN74S373N3OBSOLETE PDIP N20TBD Call TI Call TISN74S374DW ACTIVE SOIC DW2025Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74S374DWE4ACTIVE SOIC DW2025Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74S374DWR ACTIVE SOIC DW202000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74S374DWRE4ACTIVE SOIC DW202000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74S374J OBSOLETE CDIP J20TBD Call TI Call TISN74S374N ACTIVE PDIP N2020Pb-Free(RoHS)CU NIPDAU Level-NC-NC-NC SN74S374N3OBSOLETE PDIP N20TBD Call TI Call TISN74S374NE4ACTIVE PDIP N2020Pb-Free(RoHS)CU NIPDAU Level-NC-NC-NCSN74S374NSR ACTIVE SO NS202000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74S374NSRE4ACTIVE SO NS202000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SNJ54LS373FK ACTIVE LCCC FK201TBD Call TI Level-NC-NC-NC SNJ54LS373J ACTIVE CDIP J201TBD Call TI Level-NC-NC-NC SNJ54LS373W ACTIVE CFP W201TBD Call TI Level-NC-NC-NC SNJ54LS374FK ACTIVE LCCC FK201TBD Call TI Level-NC-NC-NC SNJ54LS374J ACTIVE CDIP J201TBD Call TI Level-NC-NC-NC SNJ54LS374W ACTIVE CFP W201TBD Call TI Level-NC-NC-NC SNJ54S373FK ACTIVE LCCC FK201TBD Call TI Level-NC-NC-NC SNJ54S373J ACTIVE CDIP J201TBD Call TI Level-NC-NC-NC SNJ54S374FK ACTIVE LCCC FK201TBD Call TI Level-NC-NC-NC SNJ54S374J ACTIVE CDIP J201TBD Call TI Level-NC-NC-NCOrderable Device Status(1)PackageType PackageDrawingPins PackageQtyEco Plan(2)Lead/Ball Finish MSL Peak Temp(3)SNJ54S374W ACTIVE CFP W201TBD Call TI Level-NC-NC-NC(1)The marketing status values are defined as follows:ACTIVE:Product device recommended for new designs.LIFEBUY:TI has announced that the device will be discontinued,and a lifetime-buy period is in effect.NRND:Not recommended for new designs.Device is in production to support existing customers,but TI does not recommend using this part in a new design.PREVIEW:Device has been announced but is not in production.Samples may or may not be available.OBSOLETE:TI has discontinued the production of the device.(2)Eco Plan-The planned eco-friendly classification:Pb-Free(RoHS)or Green(RoHS&no Sb/Br)-please check /productcontent for the latest availability information and additional product content details.TBD:The Pb-Free/Green conversion plan has not been defined.Pb-Free(RoHS):TI's terms"Lead-Free"or"Pb-Free"mean semiconductor products that are compatible with the current RoHS requirements for all6substances,including the requirement that lead not exceed0.1%by weight in homogeneous materials.Where designed to be soldered at high temperatures,TI Pb-Free products are suitable for use in specified lead-free processes.Green(RoHS&no Sb/Br):TI defines"Green"to mean Pb-Free(RoHS compatible),and free of Bromine(Br)and Antimony(Sb)based flame retardants(Br or Sb do not exceed0.1%by weight in homogeneous material)(3)MSL,Peak Temp.--The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications,and peak solder temperature.Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided.TI bases its knowledge and belief on information provided by third parties,and makes no representation or warranty as to the accuracy of such information.Efforts are underway to better integrate information from third parties.TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.TI and TI suppliers consider certain information to be proprietary,and thus CAS numbers and other limited information may not be available for release.In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s)at issue in this document sold by TI to Customer on an annual basis.IMPORTANT NOTICETexas Instruments 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74ls373中文资料

Vcc＝最大，OE 接 4.5V
160
40
c IOZH输出高阻态时高 i 电平电流
Vcc＝最大，VIH=2V
V0＝2.4V V0＝2.7V
50
20
7 IOZL输出高阻态时低 1 电平电流
Vcc＝最大，VIH=2V
V0＝0.5V V0＝0.4V
-50
-20
[1]: 测试条件中的“最小”和“最大”用推荐工作条件中的相应值。
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脉冲宽度tw
LE(H)
6
LE(L)
7.3
保持时间tH
D
10↓
建立时间tset
D
0↓
静态特性（TA 为工作环境温度范围）
参数
测试条件【1】
15 15
ns
10↓
ns
0↓
ns
S373 最小最大
OE 到 O0~O7
(LS373 为 667 Ω)
45pF)
15
28
ns
18
36
tPHZ
OE 到
tPLZ
O0~O7
9
20
CL=5pF
12
ns 25
[2] tPLH输出由低到高传输延迟时间 tPHL输出由高到低传输延迟时间
17ic电子渠道网可为您提供免费的中文资料、电路图等资料并可提供在线采购电子元器件等
m 锁存器内部的逻辑操作不受影响。
当锁存允许端 LE 为高电平时，O 随数据 D 而变。当 LE 为低电平时，O 被锁存在
o 已建立的数据电平。
c 当 LE 端施密特触发器的输入滞后作用，使交流和直流噪声抗扰度被改善 400mV。

74ls373中文资料

mA -20
动态特性(TA=25℃)
ｗ
参
ｗ数【2】
测试条件
S373 最大
LS373 最大
单位
tPLH tPHL
D到O
12 12
18 18
ns
tPLH tPHL
LE 到
Vcc =5V CL=50pF(L 14
O0~O7 RL=280Ω
S373 为
18
30 30
ns
tPZH tPZL
OE 到 O0~O7
．ｃ
ｍ
ｒ
ａ
－
ａ
ｇ
ｐ
ｆ
．
ｗ
ｗ
ｗ
锁存器内部的逻辑操作不受影响。
ａ当锁存允许端 LE 为高电平时，O 随数据 D 而变。当 LE 为低电平时，O 被锁存在
已建立的数据电平。
ｇ当 LE 端施密特触发器的输入滞后作用，使交流和直流噪声抗扰度被改善 400mV。
引出端符号：
ｐ D0～D7
数据输入端
OE LE
ｆ三态允许控制端（低电平有效）
单位
VIK输入嵌位电压
VOH输出高电平电压
VOL输出低电平电压 II最大输入电压时输入
电流 IIL输入低电平电流 IIH输入高电平电流
Vcc=最小，Iik=-18mA

Vcc＝最小，VIL＝最大， VIH=2V，IOH＝最大
Vcc=最小，VIL＝最大， 54
VIH=2V,IOL=最大
74
Vcc＝最大
VI=5.5V VI=7V
54 74
20 20
12 24
mA
海纳电子资讯网ｗｗｗ．ｆｐｇａ－ａｒｍ．ｃｏｍ
脉冲宽度tw

74ls373中文资料

型号
tPd
54S373/74S373
7ns
54LS373/74LS373
17ns
PD 525mW 120mW
373 的输出端 O0~O7 可直接与总线相连。
当三态允许控制端 OE 为低电平时，O0~O7 为正常逻辑状态，可用来驱动负载或总
线。当 OE 为高电平时，O0~O7 呈高阻态，即不驱动总线，也不为总线的负载，但
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74ls373引脚图管脚功能表

74ls373引脚图管脚功能表之蔡仲巾千创作74ls373是经常使用的地址锁存器芯片，它实质是一个是带三态缓冲输出的8D触发器，在单片机系统中为了扩展外部存储器，通常需要一块74ls373芯片，(1).1脚是输出使能(OE),是低电平有效,当1脚是高电平时,不管输入3、4、7、8、13、14、17、18如何,也不管11脚(锁存控制端,G)如何,输出2(Q0)、5(Q1)、6(Q2)、9(Q3)、12(Q4)、15(Q5)、16(Q6)、19(Q7)全部呈现高阻状态(或者叫浮空状态);(2).当1脚是低电平时,只要11脚(锁存控制端,G)上出现一个下降沿,输出2(Q 0)、5(Q1)、6(Q2)、9(Q3)、12(Q4)、15(Q5)、16(Q6)、19(Q7)立即呈现输入脚3、4、7、8、13、14、17、18的状态.锁存端LE 由高变低时，输出端8 位信息被锁存，直到LE 端再次有效。

当三态门使能信号OE为低电平时，三态门导通，允许Q0~Q7输出，OE为高电平时，输出悬空。

51单片机的ALE信号可以直接与74LS373的C连接。

74ls373与单片机接口：1D~8D为8个输入端。

1Q~8Q为8个输出端。

G是数据锁存控制端；当G=1时，锁存器输出端同输入端；当G由“1”变成“0”时，数据输入锁存器中。

OE为输出允许端；当OE=“0”时，三态门打开；当OE=“1”时，三态门关闭，输出呈高阻状态。

在MCS-51单片机系统中，常采取74LS373作为地址锁存器使用，其连接方法如上图所示。

其中输入端1D~8D接至单片机的P0口，输出端提供的是低8位地址，G 端接至单片机的地址锁存允许信号ALE。

输出允许端OE接地，暗示输出三态门一直打开。

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74LS373 引脚图、内部结构、参数、典型应用电路
【功能简介】
74LS373是一款常用的地址锁存器芯片，由八个并行的、带三态缓冲输出的D触发器构成。

在单片机系统中为了扩展外部存储器，通常需要一块74LS373芯片。

本文将介绍74LS373的工作原理，内容涵盖引脚图、内部结构、主要参数以及在单片机扩展系统中的典型应用电路。

【内部逻辑结构图】
74LS373地址锁存器的内部逻辑结构如图一所示。

图1
【74LS373的真值表(功能表)】
G—与8031/8051的ALE相连，控制八个D型锁存器的导通与截止：高电平时，八个D型锁存器正常运行（导通），即锁存器的输出端
与输入端D的反相信号始终同步；低电平时锁存器截止，D锁存器输出
端的状态保持不变。

OE（Output Enable = Output Control）—使能端，接地时锁存
【74LS373引脚排列图】
【74LS373电气参数】
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74ls373推荐工作条件
【74LS373在单片机扩展系统中的典型应用电路】
当74LS373用作地址锁存器时，应使OE为低电平，此时锁存使能端G为高电平时，输出Q0-Q7的状态与输入端D1-D7状态相同；当G发生负的跳变时，输入端D0-D7 数据锁入Q0-Q7。

51单片机的ALE信号可以直接与74LS373的G 连接。

在MCS-51单片机系统中，其连接方法如下图所示。

其中输入端1D-8D接
至单片机的P0口，输出端提供的是低8位地址，G端接至单片机的地址锁存允
许信号ALE。

输出允许端OE接地，表示三态输出门一直导通，可以送出地址信
号。

1D-8D为8个输入端。

1Q-8Q为8个输出端。

【说明】基础比较好的同学请直接忽略。

G是数据锁存控制端；当G=1时，锁存器输出端同输入端；当G由“1”变为“0”时，数据输入锁存器中。

OE为输出允许端；当OE=“0”时，三态门打开；当OE=“1”时，三态门关闭，输出呈高阻状态。

(1).1脚是输出使能(OE),是低电平有效,当1脚是高电平时,不管输入3、4、7、8、13、14、17、18如何,也不管11脚(锁存控制端,G)如何,输出2(Q0)、5(Q1)、6(Q2)、9(Q3)、12(Q4)、15(Q5)、16(Q6)、19(Q7)全部呈现高阻状态(或者叫浮空状态);
(2).当1脚是低电平时,只要11脚(锁存控制端,G)上出现一个下降沿,输出2(Q0)、5(Q1)、6(Q2)、9(Q3)、12(Q4)、15(Q5)、16(Q6)、19(Q7)立即呈现输入脚3、4、7、8、13、14、17、18的状态.
锁存端LE 由高变低时，输出端8 位信息被锁存，直到LE 端再次有效。

当三态门使能信号OE为低电平时，三态门导通，允许Q0~Q7输出，OE为高电平时，输出悬空。