PCB专业用语-中英文对照
中英对照PCB专业术语精选全文
analog circuit
模拟电路
amplitude
电压幅度
amp-hour
安培小时
amperometric titration
电流滴定
ampere
安{培)
amorphous thin film
非晶薄膜
amorphous thin film
非晶薄膜
amorphous semiconductor material
单向导电膜安装，各向异性导电膜连接
anisotropic conductive contact
单向导电接触，各向异性导电接触
anisotropic conductive adhesives
单向导电黏结剂，各向异性导电黏结剂
angstrom unit
埃单位
angle rotor
角转头
angle of contact
烷基咪唑
alkaline permanganate solution
碱性高锰酸盐溶液
alkaline etchant
碱性蚀刻液
alkaline degreasing
化学除油
alkaline cleaner
破性清洗液
alkaline ammonia etchant
氨碱蚀刻液
ALIVH
任意层内导通孔
aliphatic solvent
adhesion promotion
增教处理，附着力增强
by-product
副产品，副产物
butt lead
搭接引线，对接引线
butting connector
对接引脚
butter coat
厚涂层，外表树脂层
PCB术语中英文对照
(Discrete Board) ——复线板，是指用极细的漆包线直接在无铜的板面上进行立体交叉的布线，在用胶固定及钻孔与镀孔后，得到多层互连的线路板，是美国PCK公司所开发。
这种MWB可节约设计时间，适用于复杂线路的少量机种。
Nail Heading ——钉头，由于钻孔的原因导致多层板的孔壁的内层线路张开。
Negative Etchbak ——内层铜箔向内凹陷。
Negative Pattern ——负片，在生产或客户菲林上，图像被制作成透明而其它的地方被制作成非透明。
Nick ——线路边的切口或缺口。
Nodle ——从表面突起的大的或小的块。
Nominal Cured Thickness ——多层板的厚度，或者多层板相邻层与层之间固化后的厚度。
Nonwetting——敷锡导致导体的表面露出。
Overlap ——钻尖点分离，正常的钻尖是有两个第一面和两个第二面，是长刃及凿刃为棱线组成金字塔形的四面共点，此单一点称为钻尖点，当翻磨不良时，可能会出现两个钻尖点，对刺入的定位不利，是钻咀的大缺点。
Pink ring ——粉红圈,由于内层铜的黑氧化层被化学处理掉，而导致在环绕电镀孔的内层出现粉红色的环状区域。
Plated ——在多层板的压合过程中，一种可以活动升降的平台。
Point ——是指钻头的尖部。
Point Angle ——钻尖角，是指钻咀的钻尖上，有两条棱线状的长刃所构成的夹角，称为“钻尖角”。
Polarizing Slot ——偏槽，见“Keying Slot”。
Porosity Test ——孔隙率测试，是对镀金层所做的试验。
Press－Fit Contact——指某些插孔式的镀金插脚，为了以后抽换方便便常不施以填焊连接，而是在孔径的严格控制下，是插入的接脚能做紧迫式的接触。
Press Plate ——钢板，用于多层板的压合。
Rack ——挂架，是板子在进行电镀或其它湿流程处理时，在溶液中用以临时固定板子的夹具。
中英文对照的PCB专业用语
一、综合词汇1、印制电路：printed circuit2、印制线路：printed wiring3、印制板：printed board4、印制板电路：printed circuit board (pcb)5、印制线路板：printed wiring board(pwb)6、印制元件：printed component7、印制接点：printed contact8、印制板装配：printed board assembly9、板：board10、单面印制板：single-sided printed board(ssb)11、双面印制板：double-sided printed board(dsb)12、多层印制板：mulitlay er printed board(mlb)13、多层印制电路板：mulitlay er printed circuit board14、多层印制线路板：mulitlay er prited wiring board15、刚性印制板：rigid printed board16、刚性单面印制板：rigid single-sided printed borad17、刚性双面印制板：rigid double-sided printed borad18、刚性多层印制板：rigid multilay er printed board19、挠性多层印制板：flexible multilay er printed board20、挠性印制板：flexible printed board21、挠性单面印制板：flexible single-sided printed board22、挠性双面印制板：flexible double-sided printed board23、挠性印制电路：flexible printed circuit (fpc)24、挠性印制线路：flexible printed wiring25、刚性印制板：flex-rigid printed board, rigid-flex printed board26、刚性双面印制板：flex-rigid double-sided printed board, rigid-flex double-sided printed27、刚性多层印制板：flex-rigid multilay er printed board, rigid-flex multilay er printed board28、齐平印制板：flush printed board29、金属芯印制板：metal core printed board30、金属基印制板：metal base printed board31、多重布线印制板：mulit-wiring printed board32、陶瓷印制板：ceramic substrate printed board33、导电胶印制板：electroconductive paste printed board34、模塑电路板：molded circuit board35、模压印制板：stamped printed wiring board36、顺序层压多层印制板：sequentially-laminated mulitlay er37、散线印制板：discrete wiring board38、微线印制板：micro wire board39、积层印制板：buile-up printed board40、积层多层印制板：build-up mulitlay er printed board (bum)41、积层挠印制板：build-up flexible printed board42、表面层合电路板：surface laminar circuit (slc)43、埋入凸块连印制板：b2it printed board44、多层膜基板：multi-lay ered film substrate(mfs)45、层间全内导通多层印制板：alivh multilay er printed board46、载芯片板：chip on board (cob)47、埋电阻板：buried resistance board48、母板：mother board49、子板：daughter board50、背板：backplane51、裸板：bare board52、键盘板夹心板：copper-invar-copper board53、动态挠性板：dynamic flex board54、静态挠性板：static flex board55、可断拼板：break-away planel56、电缆：cable57、挠性扁平电缆：flexible flat cable (ffc)58、薄膜开关：membrane switch59、混合电路：hybrid circuit60、厚膜：thick film61、厚膜电路：thick film circuit62、薄膜：thin film63、薄膜混合电路：thin film hybrid circuit64、互连：interconnection65、导线：conductor trace line66、齐平导线：flush conductor67、传输线：transmission line68、跨交：crossover69、板边插头：edge-board contact70、增强板：stiffener71、基底：substrate72、基板面：real estate73、导线面：conductor side74、元件面：component side75、焊接面：solder side76、印制：printing77、网格：grid78、图形：pattern79、导电图形：conductive pattern80、非导电图形：non-conductive pattern81、字符：legend82、标志：mark二、基材：1、基材：base material2、层压板：laminate3、覆金属箔基材：metal-clad bade material4、覆铜箔层压板：copper-clad laminate (ccl)5、单面覆铜箔层压板：single-sided copper-clad laminate6、双面覆铜箔层压板：double-sided copper-clad laminate7、复合层压板：composite laminate8、薄层压板：thin laminate9、金属芯覆铜箔层压板：metal core copper-clad laminate10、金属基覆铜层压板：metal base copper-clad laminate11、挠性覆铜箔绝缘薄膜：flexible copper-clad dielectric film12、基体材料：basis material13、预浸材料：prepreg14、粘结片：bonding sheet15、预浸粘结片：preimpregnated bonding sheer16、环氧玻璃基板：epoxy glass substrate17、加成法用层压板：laminate for additive process18、预制内层覆箔板：mass lamination panel19、内层芯板：core material20、催化板材：cataly zed board ,coated cataly zed laminate21、涂胶催化层压板：adhesive-coated catalyzed laminate22、涂胶无催层压板：adhesive-coated uncataly zed laminate23、粘结层：bonding lay er24、粘结膜：film adhesive25、涂胶粘剂绝缘薄膜：adhesive coated dielectric film26、无支撑胶粘剂膜：unsupported adhesive film27、覆盖层：cover lay er (cover lay)28、增强板材：stiffener material29、铜箔面：copper-clad surface30、去铜箔面：foil removal surface31、层压板面：unclad laminate surface32、基膜面：base film surface33、胶粘剂面：adhesive faec34、原始光洁面：plate finish35、粗面：matt finish36、纵向：length wise direction37、模向：cross wise direction38、剪切板：cut to size panel39、酚醛纸质覆铜箔板：phenolic cellulose paper copper-clad laminates(phenolic/paper ccl)40、环氧纸质覆铜箔板：epoxide cellulose paper copper-clad laminates (epoxy/paper ccl)41、环氧玻璃布基覆铜箔板：epoxide woven glass fabric copper-clad laminates42、环氧玻璃布纸复合覆铜箔板：epoxide cellulose paper core, glass cloth surfaces copper-clad laminates43、环氧玻璃布玻璃纤维复合覆铜箔板：epoxide non woven/woven glass reinforced copper-clad laminates44、聚酯玻璃布覆铜箔板：ploy ester woven glass fabric copper-clad laminates45、聚酰亚胺玻璃布覆铜箔板：poly imide woven glass fabric copper-clad laminates46、双马来酰亚胺三嗪环氧玻璃布覆铜箔板：bismaleimide/triazine/epoxide woven glass fabric copper-clad lamimates47、环氧合成纤维布覆铜箔板：epoxide synthetic fiber fabric copper-clad laminates48、聚四乙烯玻璃纤维覆铜箔板：teflon/fiber glass copper-clad laminates49、超薄型层压板：ultra thin laminate50、陶瓷基覆铜箔板：ceramics base copper-clad laminates51、紫外线阻挡型覆铜箔板：uv blocking copper-clad laminates三、基材的材料1、a阶树脂：a-stage resin2、b阶树脂：b-stage resin3、c阶树脂：c-stage resin4、环氧树脂：epoxy resin5、酚醛树脂：phenolic resin6、聚酯树脂：poly ester resin7、聚酰亚胺树脂：poly imide resin8、双马来酰亚胺三嗪树脂：bismaleimide-triazine resin9、丙烯酸树脂：acry lic resin10、三聚氰胺甲醛树脂：melamine formaldehyde resin11、多官能环氧树脂：polyfunctional epoxy resin12、溴化环氧树脂：brominated epoxy resin13、环氧酚醛：epoxy novolac14、氟树脂：fluroresin15、硅树脂：silicone resin16、硅烷：silane17、聚合物：polymer18、无定形聚合物：amorphous polymer19、结晶现象：crystalline polamer20、双晶现象：dimorphism21、共聚物：copolymer22、合成树脂：sy nthetic23、热固性树脂：thermosetting resin24、热塑性树脂：thermoplastic resin25、感光性树脂：photosensitive resin26、环氧当量：weight per epoxy equivalent (wpe)27、环氧值：epoxy value28、双氰胺：dicy andiamide29、粘结剂：binder30、胶粘剂：adesive31、固化剂：curing agent32、阻燃剂：flame retardant33、遮光剂：opaquer34、增塑剂：plasticizers35、不饱和聚酯：unsatuiated poly ester36、聚酯薄膜：poly ester37、聚酰亚胺薄膜：poly imide film (pi)38、聚四氟乙烯：polytetrafluoety lene (ptfe)39、聚全氟乙烯丙烯薄膜：perfluorinated ethy lene-propylene copolymer film (fep)40、增强材料：reinforcing material41、玻璃纤维：glass fiber42、e玻璃纤维：e-glass fibre43、d玻璃纤维：d-glass fibre44、s玻璃纤维：s-glass fibre45、玻璃布：glass fabric46、非织布：non-woven fabric47、玻璃纤维垫：glass mats48、纱线：yarn49、单丝：filament50、绞股：strand51、纬纱：weft y arn52、经纱：warp y arn53、但尼尔：denier54、经向：warp-wise55、纬向：weft-wise, filling-wise56、织物经纬密度：thread count57、织物组织：weave structure58、平纹组织：plain structure59、坏布：grey fabric60、稀松织物：woven scrim61、弓纬：bow of weave62、断经：end missing63、缺纬：mis-picks64、纬斜：bias65、折痕：crease66、云织：waviness67、鱼眼：fish ey e68、毛圈长：feather length69、厚薄段：mark70、裂缝：split71、捻度：twist of y arn72、浸润剂含量：size content73、浸润剂残留量：size residue74、处理剂含量：finish level75、浸润剂：size76、偶联剂：couplint agent77、处理织物：finished fabric78、聚酰胺纤维：poly armide fiber79、聚酯纤维非织布：non-woven poly ester fabric80、浸渍绝缘纵纸：impregnating insulation paper81、聚芳酰胺纤维纸：aromatic poly amide paper82、断裂长：breaking length83、吸水高度：height of capillary rise84、湿强度保留率：wet strength retention85、白度：whitenness86、陶瓷：ceramics87、导电箔：conductive foil88、铜箔：copper foil89、电解铜箔：electrodeposited copper foil (ed copper foil)90、压延铜箔：rolled copper foil91、退火铜箔：annealed copper foil92、压延退火铜箔：rolled annealed copper foil (ra copper foil)93、薄铜箔：thin copper foil94、涂胶铜箔：adhesive coated foil95、涂胶脂铜箔：resin coated copper foil (rcc)96、复合金属箔：composite metallic material97、载体箔：carrier foil98、殷瓦：invar99、箔（剖面）轮廓：foil profile100、光面：shiny side101、粗糙面：matte side102、处理面：treated side103、防锈处理：stain proofing104、双面处理铜箔：double treated foil四、设计1、原理图：shematic diagram2、逻辑图：logic diagram3、印制线路布设：printed wire lay out4、布设总图：master drawing5、可制造性设计：design-for-manufacturability6、计算机辅助设计：computer-aided design.(cad)7、计算机辅助制造：computer-aided manufacturing.(cam)8、计算机集成制造：computer integrat manufacturing.(cim)9、计算机辅助工程：computer-aided engineering.(cae)10、计算机辅助测试：computer-aided test.(cat)11、电子设计自动化：electric design automation .(eda)12、工程设计自动化：engineering design automaton .(eda2)13、组装设计自动化：assembly aided architectural design. (aaad)14、计算机辅助制图：computer aided drawing15、计算机控制显示：computer controlled display .(ccd)16、布局：placement17、布线：routing18、布图设计：lay out19、重布：rerouting20、模拟：simulation21、逻辑模拟：logic simulation22、电路模拟：circit simulation23、时序模拟：timing simulation24、模块化：modularization25、布线完成率：lay out effeciency26、机器描述格式：machine descriptionm format .(mdf)27、机器描述格式数据库：mdf databse28、设计数据库：design database29、设计原点：design origin30、优化（设计）：optimization (design)31、供设计优化坐标轴：predominant axis32、表格原点：table origin33、镜像：mirroring34、驱动文件：drive file35、中间文件：intermediate file36、制造文件：manufacturing documentation37、队列支撑数据库：queue support database38、元件安置：component positioning39、图形显示：graphics dispaly40、比例因子：scaling factor41、扫描填充：scan filling42、矩形填充：rectangle filling43、填充域：region filling44、实体设计：phy sical design45、逻辑设计：logic design46、逻辑电路：logic circuit47、层次设计：hierarchical design48、自顶向下设计：top-down design49、自底向上设计：bottom-up design50、线网：net51、数字化：digitzing52、设计规则检查：design rule checking53、走（布）线器：router (cad)54、网络表：net list55、计算机辅助电路分析：computer-aided circuit analysis56、子线网：subnet57、目标函数：objective function58、设计后处理：post design processing (pdp)59、交互式制图设计：interactive drawing design60、费用矩阵：cost metrix61、工程图：engineering drawing62、方块框图：block diagram63、迷宫：moze64、元件密度：component density65、巡回售货员问题：traveling salesman problem66、自由度：degrees freedom67、入度：out going degree68、出度：incoming degree69、曼哈顿距离：manhatton distance70、欧几里德距离：euclidean distance71、网络：network72、阵列：array73、段：segment74、逻辑：logic75、逻辑设计自动化：logic design automation76、分线：separated time77、分层：separated lay er78、定顺序：definite sequence五、形状与尺寸：1、导线（通道）：conduction (track)2、导线（体）宽度：conductor width3、导线距离：conductor spacing4、导线层：conductor lay er5、导线宽度/间距：conductor line/space6、第一导线层：conductor lay er no.17、圆形盘：round pad8、方形盘：square pad9、菱形盘：diamond pad10、长方形焊盘：oblong pad11、子弹形盘：bullet pad12、泪滴盘：teardrop pad13、雪人盘：snowman pad14、v形盘：v-shaped pad15、环形盘：annular pad16、非圆形盘：non-circular pad17、隔离盘：isolation pad18、非功能连接盘：monfunctional pad19、偏置连接盘：offset land20、腹（背）裸盘：back-bard land21、盘址：anchoring spaur22、连接盘图形：land pattern23、连接盘网格阵列：land grid array24、孔环：annular ring25、元件孔：component hole26、安装孔：mounting hole27、支撑孔：supported hole28、非支撑孔：unsupported hole29、导通孔：via30、镀通孔：plated through hole (pth)31、余隙孔：access hole32、盲孔：blind via (hole)33、埋孔：buried via hole34、埋/盲孔：buried /blind via35、任意层内部导通孔：any lay er inner via hole (alivh)36、全部钻孔：all drilled hole37、定位孔：toaling hole38、无连接盘孔：landless hole39、中间孔：interstitial hole40、无连接盘导通孔：landless via hole41、引导孔：pilot hole42、端接全隙孔：terminal clearomee hole43、准表面间镀覆孔：quasi-interfacing plated-through hole44、准尺寸孔：dimensioned hole45、在连接盘中导通孔：via-in-pad46、孔位：hole location47、孔密度：hole density48、孔图：hole pattern49、钻孔图：drill drawing50、装配图：assembly drawing51、印制板组装图：printed board assembly drawing52、参考基准：datum referance。
PCB专业用语中英文对照
PCB专业用语中英文对照PCB，全称是Printed Circuit Board，即印制电路板，是电子器件中不可缺少的一部分。
在PCB的生产和使用过程中，有许多特定的专业术语，以下将列出一些常见的PCB专业用语的中英文对照，以帮助PCB行业的从业人员更好地了解和使用这些术语。
1. Pad - 表面贴装元件引脚焊盘2. Via - 通孔3. Trace - 线路走线4. Solder mask - 焊盘阻焊5. Silkscreen - 字体绘制6. Substrate - 基板7. RoHS - 过度有害物质限制指令8. PCB Assembly - PCB组装9. Panel - 夹板10. Gerber file - Gerber文件（PCB板图文件的一种）11. Copper weight - 铜箔厚度12. SMD - 表面贴装元件13. Through-hole - 贯通孔除此之外，还有一些专业用语需要注意：1. Blind via - 盲孔2. Buried via - 埋孔3. Soldering - 焊接4. Copper pour - 铜泡5. Annular ring - 环形垫片6. Plated through-hole - 化学镀铜孔7. Gold finger - 金手指（PCB板边部的带触点金属部件）8. OSP - 有机锡防护（一种PCB表面处理方法）以上仅列举了部分PCB专业用语的中英文对照，如需更全面的了解，需要从事相关行业或有专业经验的人士掌握更多知识。
在PCB制造和使用过程中，正确使用这些专业用语是非常重要的，它们不仅可以帮助我们更好地了解PCB的生产过程和使用方法，还可以提高工作效率和避免出现误解和错误。
PCB行业最常用术语之中英文对照(按字母检索)
PCB行业最常用术语之中英文对照(按字母检索)A/W(artwork)底片Ablation烧溶(laser),切除abrade粗化abrasion resistance耐磨性absorption吸收ACC(accept)允收accelerated corrosion test加速腐蚀accelerated test加速试验acceleration速化反应accelerator加速剂acceptable允收activator活化液active work in process实际在制品adhesion附着力adhesive method黏着法air inclusion气泡air knife风刀amorphous change不定形的改变amount总量amylnitrite硝基戊烷analyzer分析仪anneal回火annular ring环状垫圈;孔环anode slime(sludge)阳极泥anodizing阳极处理AOI(automatic optical inspection)自动:光学检测applicable documents引用之文件AQL sampling允收水准抽样aqueous photoresist液态光阻aspect ratio纵横比(厚宽比)As received到货时back lighting背光back-up垫板banked work in process预留在制品base material基材baseline performance基准绩效batch批beta backscattering贝他射线照射法beveling切斜边;斜边biaxial deformation二方向之变形black-oxide黑化blank controller空白对照组blank panel空板blanking挖空blip弹开blister气泡;起泡blistering气泡blow hole吹孔board-thickness error板厚错误bonding plies黏结层bow;bowing板弯break out从平环内破出bridging搭桥;桥接BTO(Build To Order)接单生产burning烧焦burr毛边(毛头)camcorder一体型摄录放机carbide碳化物carlson pin定位梢carrier载运剂catalyzing催化catholic sputtering阴极溅射法caul plate隔板;钢板calibration system requirements校验系统之各种要求center beam method中心光束法central projection集中式投射线certification认证chamfer倒角(金手指)chamfering切斜边;倒角characteristic impedance特性阻抗charge transfer overpotential电量传递过电压chase网框checkboard棋盘chelator蟹和剂chemical bond化学键chemical vapor deposition化学蒸着镀circumferential void圆周性之孔破clad metal包夹金属clean room无尘室clearance间隙coat镀外表coating error防焊覆盖错误coefficient of thermal expansion(CTE)热澎胀系数cold solder joint冷焊点cold-weld金属粉末冷焊color颜色color error颜色错误compensation补偿competitive performance竞争力绩效complex salt错化物complexor错化物component hole零件孔component side零件面concentric同心conformance密贴性consumer products消费性产品contact resistance接触电阻continuous performance连续发挥效能contract service协力厂controlled split均裂式conventional flow乱流方式conventional tensile test传统张力测试法conversion coating转化层convex突出coordinate list数据清单copper claded laminates(CCL)铜箔基板copper exposure线路露铜copper mirror镜铜copper pad铜箔圆配copper residue(copper splash)铜渣corrosion rate numbering腐蚀速率计数系统corrosion resistance抗蚀性coulombs law库伦定律countersink喇叭孔coupon试样coupon location试样点covering power遮盖力CPU中央处理器crack破裂;裂痕crazing裂痕;白斑cross linking交联聚合cross talk呼应作用crosslinking交联crystal collection结晶收集curing聚合体current efficiency电流效率cut-outs挖空cutting裁板cyanide氰化物cycles of learning学习循环cycle-time reduction交期缩短date code周期deburring去毛头dedicated专用型degradation退变delamination分层dent/pin hole凹陷/针孔department of defense国防部designation字码简示法de-smear除胶渣developing显影dewetting缩锡dewetting time缩锡时间dimension error外形尺寸错误dielectric constant介质常数difficulty困难度difunctional双功能dimension尺寸dimension stability尺寸安定性dimensional stability尺度安定性dimension and tolerance尺寸与公差dirty hole孔内异物discolor hole孔黑;孔灰;氧化discoloration变色disposable eyelet method消耗性铆钉法distortion factor尺寸变形函数double side双面板downtime停机时间drill钻孔drill bit钻头drill facet钻尖切萷面drill pointer钻尖重(研)磨机drilled blank board已钻孔之裸板drilling钻孔dry film干膜ductility延展性economy of scale经济规模edge spacing板边空地edge-board contact(gold finger)金手指efficiency能量效率electric test电测electrical testing电测;测试electrochemical machine ECM电化学加工法electrochemical reactor电化学反应器electroforming电铸electroless plate化学铜electroless-deposition无电镀electropolishing电解拋光electrorefining电解精炼electrowinning电解萃取elliptical set椭圆形embrittlement脆性entitlement performance可达成绩效entrapment电镀夹杂物epoxy环氧树酯equipotential电位线error data file异常情形etch rate蚀铜速率etchants蚀刻液etchback回蚀evaluation program评估用程序exposure曝光external pin method外部插梢法eyelet hole铆钉孔Eyeletting铆眼fabric网布failure故障fast response快速响应fault瑕庛;缺陷fiber exposure纤维显露fiber protrusion纤维突出fiducial mark光学点,基准记号filler填充料film底片filtration过滤finished board成品fixing固着fixture电测夹具(治具)flaking off粹离flammability rating燃性等级flare喇叭形孔flat cable并排电缆feedback loop回馈循环first-in-first-out(FIFO)先进先出flexible manufacturing system(FMS)弹性制造系统flux助焊剂foil distortion铜层变形fold空泡foreign include异物foreign material基材内异物free radical chain polymerization自由基连锁聚合fully additive加成法fully annealed type彻底回火轫化之类形function函数fundamental and basic基本fungus resistance抗霉性funnel flange喇叭形折翼galvanized加法尼化制程gap钻尖分开gauge length有效长度gel time胶化时间general resist ink一般阻剂油墨general通论general industrial一般性(电子)工业级geometrical levelling几何平整glass transition temperature(Tg)玻璃态转换温度Gold金gold finger金手指gold plating镀金golden board标准板gouges刷磨凹沟gouging挖破grain boundary金属晶体之四边green绿色grip夹头ground plane接地层ground plane clearance接地空环hackers骇客HAL(hot air leveling)喷锡haloing白边;白圈hardener硬化剂hardness硬度hepa filter空气滤清器high performance industrial高性能(电子)工业级high reliability高可靠度high resolution高分辨率high temperature elongation(HTE)高温延展性铜箔high temperature epoxy(HTE)高温树酯hit击hole counter数孔机hole diameter孔径hole diameter error孔径错误hole location孔位hole number孔数hole wall quality孔壁品质hook外弧hot dip热浸法hull cell哈氏槽hybrid混成集成电路hydrogen bonding氢键hydrolysis水解hydrometallurgy湿法冶金法image analysis system影像分析系统image transfer影像转移immersion gold浸金(化镍金) immersion plating浸镀法impedance阻抗infrared reflow红外线重熔inhibitor热聚合抑制剂injection mold射模ink油墨innerlayer&outlayer内外层insulation resistance绝缘电阻intended position应该在的位置intensifier增强器intensity强度inter molecular exchange交互改变interconnection互相连通ionic contaminants离子性污染物ionic contamination testing离子污染试验IPA异丙醇5I:inspiration(启蒙)identification确认计划目标implementation改善方案information数据internalization制度化invisible inventory无形的库存knife edges刀缘Knoop努普(硬度单位)kraft paper牛皮纸返回顶部laminar flow层流laminate基层板laminating压合lamination压合laminator压膜机land焊垫lay back刃角磨损lay up组合叠板layout布线;布局lead screw牵引螺丝leakage漏电learning curve学习曲线legend文字标记leveling平整levelling additive平整剂levelling power平整力life support维系生命limiting current极限电流line space线距line width线宽linear variable differential transformer(LVDL)线性可变差动:转换器liquid液状(态)liquid crystal resins液晶树脂liquid photoimageable solder resist ink液态感光防焊油墨liquid photoresist ink液态光阻剂油墨lot size批量lower carrier底部承载板mechanical plating机祴镀法machine scrub刷磨清洁法macrothrowing power巨分布力margin钻头刃带market share市场占有率marking error文字错误masked leveling儰装平整mass lamination大型压板mass transfer质量传送效应mass transfer overpotential质量传递过电压mass transportation质传master drawing主图;蓝图material use factor材料使用率mealing泡点;白点memory记忆装置meniscograph solderability measurement新月型焊锡效果microetch微蚀microetching微蚀microfocus微焦距microfocus system微焦距系统microprofile微表面microsectioning微切片法microthrowing power微分布力migration迁移mini-tensile tester迷你拉力测试仪mis hole location孔位错误misregistration焊锡面与零件面对位偏差misregsitration对不准moisture and insulation resistance test湿气与绝缘电阻试验molded circuit board(MCB)模制电路板monoethanal amine单乙醇氨monohydrate state水化物monomer单分子膜;单体mouse bite锯齿;蚀刻缺口msec毫秒muffle furnace高温焚火炉multichip超大IC型(多芯片模块)mylar保护膜nail head钉头NC drill数字钻孔机negative etchback反回蚀negative film负片negative rake angle负抠耙角network回路;网络neutralization中和nick缺口nickel镍nodule铜瘤;瘤粒no flow resin不流树脂noise噪声nominal标示nominal dimension标定长度nominal gel time标示胶性时间nominal resin content标示胶含量nominal resin flow标示胶流量nominal scaled flow thickness标示比例流量厚度OA equip办公室自动:化设备obsolescence factor报废因素OEM原设备制造商offset-list补偿数据清单ohmmeter欧姆计open断路open circuits断路open short testing断短路测试opening开口original art work(A/W)原稿底片Others其它outgrowth增出over design牛刀杀鸡overlap钻尖重叠overlay entry盖板overpotential过电压oxidation氧化oxide treatment黑化处理oxided cytochrome氧化性之细包色素oxygen evolution氧气发生反应packed bed充填床式pad锡垫;圆配pad copper exposure pad露铜panel小型板面;母板panel plating一次铜电镀parasitic寄生的part no.料号pattern plating二次铜电镀PCB(print circuit board)印刷电路板pcs片peel strength抗撕强度peeling off剥离(剥落)performance specification性能规范permittivity透电率perspectives on experience经验透视PET聚酯photodiode detector发光二极管侦测器photo initiator感光启始剂photoresist光阻phototool光具(指工作底片)piece子板面pinceton applied research腐蚀测定仪pink ring粉红圈pit凹点pitch脚距planar平面plating电镀plating exposure下镀层露出plug gauge插规plug hole孔塞PNL(panel)排板polar-polar interaction极性之间的吸力polyester聚酯类polyglycols聚乙二醇polyimide聚亚醯氨poor bevelling磨边加工引起突起,剥离poor drill孔形不良poor HAL喷锡不良poor marking字体不良poor pad锡垫不良poor printed印刷偏差poor solderability焊锡性不良poor touch-up补线不良position control system位置控制系统positive rake angle正抠耙角power curve model幕次曲线模式practice工艺惯例preferred良好premature tearing提前撕裂prepolymer预聚合物prepreg胶片pre-process(front-end)制前press压床press cycle压合周期primary current distribution一次电流分布primary主要product lifetimes生命周期product process制程promoter促进剂protocal初步资料prussic acid普鲁士酸PTF-based process厚膜糊法PTH(plating though hole)导通孔pull away拉开pumice浮石粉pumice scrub喷砂清洁法pyrometallurgy火烧法冶炼QC(quality control)品管QFP(quad flat pack)扁方型封装体qualification inspection资格审查检验qualification testing资格检定quality classification品质等级quantitative计量式测试rack挂架radiometer能量剂rake angle抠耙角RAM[Random Access Memory随机存取内存real time关键时刻recessed trace process凹槽线路法recovery tank回收槽reduction还原re-eninforcement强化refraction折光率reinforcement style补强材料的型式register mark对位用标记registration hole对位孔registration pattern长方形铜地REJ(reject)退货;拒收rejectable拒收release agent脱模剂relief angle浮离角remark备注repair修理resin content树脂含量(胶含量)resin flow胶流量resin flow percentage树脂流量之百分率resin recession树脂下陷resin smear胶渣resist strippers剥干膜剂resistor network排列电阻resolution解像度return on assets资产报酬率reversibility可逆性rework重工rosin天然松香rotating cylinder旋转圆柱形roughtness孔壁粗糙;粗慥routing切外形,成型routing bit铣刀runout偏转S/L on hole孔内沾文字S/M(solder mask),S/L防焊文字S/M(solder mask)防焊S/M error防焊种类错误S/M on hole孔内绿漆salt spray test盐水喷雾试验sampling size抽样数scope范围scored刻痕scoring枢槽;刮线scrap废框scratches刮伤screen printing网版印刷scum透明残膜sealing封孔处理secondary次要semi-additive半加成法sensitize敏化sensitizer敏化液separator钢隔板sequential lamination渐成式压法serrated edges毛边shatter破碎short短路shunt分路silane treatment硅烷处理silicone coupling agent硅烷偶合剂silk screen文字印刷simulator仿真器single axis单轴sizing底片之伸缩补偿skip漏印skip printing跳印;漏印sliver丝条slot开槽slotting开槽SMD(surface mount device)表面黏着组件smear胶渣SMT(surface mount technology)表面黏着技术sodium carbonate monohydrate结晶水碳酸钠soft tooling软性工具solder焊锡;锡铅solder bridge锡桥solder bump锡突solder float漂锡solder mask adhesion绿漆附着力solder on G/F金手指沾锡solder on trace线路沾锡solder plug锡塞solder side焊锡面solderability焊锡性solid carbide实质碳化物spacing间距spacing nonenough间距不足SPC(Statistical Process Control)统计生管specification规范special considerations特别考虑spin coating旋转涂布spindle钻轴spiral contractometer螺旋收缩仪spot face铣靶spray coating喷涂Squeegee刮刀stacking structure叠板结构stamping冲压standard hydraulic lamination标准液压法standardizing标准化starvation缺胶step tablet格片数stock option认股选择权strain应度strength强度stressmeter应力计subtractive减除法surface convex表面突起surface examination表面检查surface insulation resistance(SIR)表面绝缘电阻surface mount表面黏着方式surface roughness表面粗慥度surges突波switch circuit开关线路tab金手指tack free不黏taped hole gauge锥形孔规target hole靶孔task force任务编组tensile strength抗拉强度tensile stress张性应力tent浮盖terms and definitions术语与定义termination load抗匹配负载test circuit测试线路test method试验方法test point测试点thermal shock热震荡试验thermal stress热应力试验thermistor热电感应式thermo cycling热循环试验theoretical cycle time理论性周期时间thickness厚度time to market上市时机thickness distribution厚度分布thief补助阴极thin core薄基板;内层板throwing power分布力tolerance公差;容差tooling hole工具孔torque load扭力拒之负载total quality program全面的品质计划toughness坚度trace error线路错误trace nick&pin hole线路缺口及针孔trace peeling线路剥离trace pin-hole线路针孔trace surface roughness线路表面粗糙tarnish and oxide resist抗污抗氧化剂transmittance透光度trim line裁切线true levelling真平整true position真正位置的孔;真位twist板翘type种类umbra本影undercut侧蚀uneven coating喷锡厚镀不平整universal万用型universal tensile tester万用拉力试验机universal tester泛用型测试机upper carrier顶部承载钢uptime稼动:时间vacuum deposition真空蒸镀法vacuum hydraulic lamination真空液压法vaporizer气化室V-cut V形槽vertical microsection垂直微切片via hole导通孔visible inventory有形的库存vision inspection目视检查Void孔破void in hole孔壁上的破洞void in PTH hole孔破walkman随身听warehouse仓库warp板弯warp,warpage板弯water absorption吸水性wear resistance耐磨度weave exposure纤纹显露weave texture织纹隐现wedge angle契尖角week周wet chemistry湿式化学制程wet film湿膜wet lamination湿膜压膜法wet process湿制程wetting沾锡wetting balance沾锡平衡法wicking渗铜;渗入;灯蕊效应width宽度width reduce线细width-to-thickness ratio宽度与厚度的比值window操作范围work-in-process在制品work order工单working film工作片working master工作母片year年yellow金黄色yield良率（资料整理PCB技术之家）。
PCB专业用语 中英文对照
一、综合词汇1、印制电路：printed circuit2、印制线路：printed wiring3、印制板：printed board4、印制板电路：printed circuit board(pcb)5、印制线路板：printed wiring board(pwb)6、印制元件：printed component7、印制接点：printed contact8、印制板装配：printed board assembly9、板：board10、单面印制板：single-sided printed board(ssb)11、双面印制板：double-sided printed board(dsb)12、多层印制板：mulitlayer printed board(mlb)13、多层印制电路板：mulitlayer printed circuit board14、多层印制线路板：mulitlayer prited wiring board15、刚性印制板：rigid printed board16、刚性单面印制板：rigid single-sided printed borad17、刚性双面印制板：rigid double-sided printed borad18、刚性多层印制板：rigid multilayer printed board19、挠性多层印制板：flexible multilayer printed board20、挠性印制板：flexible printed board21、挠性单面印制板：flexible single-sided printed board22、挠性双面印制板：flexible double-sided printed board23、挠性印制电路：flexible printed circuit(fpc)24、挠性印制线路：flexible printed wiring25、刚性印制板：flex-rigid printed board,rigid-flex printed board26、刚性双面印制板：flex-rigid double-sided printed board,rigid-flex double-sided printed27、刚性多层印制板：flex-rigid multilayer printed board,rigid-flex multilayer printed board28、齐平印制板：flush printed board29、金属芯印制板：metal core printed board30、金属基印制板：metal base printed board31、多重布线印制板：mulit-wiring printed board32、陶瓷印制板：ceramic substrate printed board33、导电胶印制板：electroconductive paste printed board34、模塑电路板：molded circuit board35、模压印制板：stamped printed wiring board36、顺序层压多层印制板：sequentially-laminated mulitlayer37、散线印制板：discrete wiring board38、微线印制板：micro wire board39、积层印制板：buile-up printed board40、积层多层印制板：build-up mulitlayer printed board(bum)41、积层挠印制板：build-up flexible printed board42、表面层合电路板：surface laminar circuit(slc)43、埋入凸块连印制板：b2it printed board44、多层膜基板：multi-layered film substrate(mfs)45、层间全内导通多层印制板：alivh multilayer printed board46、载芯片板：chip on board(cob)47、埋电阻板：buried resistance board48、母板：mother board49、子板：daughter board50、背板：backplane51、裸板：bare board52、键盘板夹心板：copper-invar-copper board53、动态挠性板：dynamic flex board54、静态挠性板：static flex board55、可断拼板：break-away planel56、电缆：cable57、挠性扁平电缆：flexible flat cable(ffc)58、薄膜开关：membrane switch59、混合电路：hybrid circuit60、厚膜：thick film61、厚膜电路：thick film circuit62、薄膜：thin film63、薄膜混合电路：thin film hybrid circuit64、互连：interconnection65、导线：conductor trace line66、齐平导线：flush conductor67、传输线：transmission line68、跨交：crossover69、板边插头：edge-board contact70、增强板：stiffener71、基底：substrate72、基板面：real estate73、导线面：conductor side74、元件面：component side75、焊接面：solder side76、印制：printing77、网格：grid78、图形：pattern79、导电图形：conductive pattern80、非导电图形：non-conductive pattern81、字符：legend82、标志：mark二、基材：1、基材：base material2、层压板：laminate3、覆金属箔基材：metal-clad bade material4、覆铜箔层压板：copper-clad laminate(ccl)5、单面覆铜箔层压板：single-sided copper-clad laminate6、双面覆铜箔层压板：double-sided copper-clad laminate7、复合层压板：composite laminate8、薄层压板：thin laminate9、金属芯覆铜箔层压板：metal core copper-clad laminate10、金属基覆铜层压板：metal base copper-clad laminate11、挠性覆铜箔绝缘薄膜：flexible copper-clad dielectric film12、基体材料：basis material13、预浸材料：prepreg14、粘结片：bonding sheet15、预浸粘结片：preimpregnated bonding sheer16、环氧玻璃基板：epoxy glass substrate17、加成法用层压板：laminate for additive process18、预制内层覆箔板：mass lamination panel19、内层芯板：core material20、催化板材：catalyzed board,coated catalyzed laminate21、涂胶催化层压板：adhesive-coated catalyzed laminate22、涂胶无催层压板：adhesive-coated uncatalyzed laminate23、粘结层：bonding layer24、粘结膜：film adhesive25、涂胶粘剂绝缘薄膜：adhesive coated dielectric film26、无支撑胶粘剂膜：unsupported adhesive film27、覆盖层：cover layer(cover lay)28、增强板材：stiffener material29、铜箔面：copper-clad surface30、去铜箔面：foil removal surface31、层压板面：unclad laminate surface32、基膜面：base film surface33、胶粘剂面：adhesive faec34、原始光洁面：plate finish35、粗面：matt finish36、纵向：length wise direction37、模向：cross wise direction38、剪切板：cut to size panel39、酚醛纸质覆铜箔板：phenolic cellulose paper copper-clad laminates(phenolic/paper ccl)40、环氧纸质覆铜箔板：epoxide cellulose paper copper-clad laminates (epoxy/paper ccl)41、环氧玻璃布基覆铜箔板：epoxide woven glass fabric copper-clad laminates42、环氧玻璃布纸复合覆铜箔板：epoxide cellulose paper core,glass cloth surfaces copper-clad laminates43、环氧玻璃布玻璃纤维复合覆铜箔板：epoxide non woven/woven glass reinforced copper-clad laminates44、聚酯玻璃布覆铜箔板：ployester woven glass fabric copper-clad laminates45、聚酰亚胺玻璃布覆铜箔板：polyimide woven glass fabric copper-clad laminates46、双马来酰亚胺三嗪环氧玻璃布覆铜箔板：bismaleimide/triazine/epoxide woven glass fabric copper-clad lamimates47、环氧合成纤维布覆铜箔板：epoxide synthetic fiber fabric copper-clad laminates48、聚四乙烯玻璃纤维覆铜箔板：teflon/fiber glass copper-clad laminates49、超薄型层压板：ultra thin laminate50、陶瓷基覆铜箔板：ceramics base copper-clad laminates51、紫外线阻挡型覆铜箔板：uv blocking copper-clad laminates三、基材的材料1、a阶树脂：a-stage resin2、b阶树脂：b-stage resin3、c阶树脂：c-stage resin4、环氧树脂：epoxy resin5、酚醛树脂：phenolic resin6、聚酯树脂：polyester resin7、聚酰亚胺树脂：polyimide resin8、双马来酰亚胺三嗪树脂：bismaleimide-triazine resin9、丙烯酸树脂：acrylic resin10、三聚氰胺甲醛树脂：melamine formaldehyde resin11、多官能环氧树脂：polyfunctional epoxy resin12、溴化环氧树脂：brominated epoxy resin13、环氧酚醛：epoxy novolac14、氟树脂：fluroresin15、硅树脂：silicone resin16、硅烷：silane17、聚合物：polymer18、无定形聚合物：amorphous polymer19、结晶现象：crystalline polamer20、双晶现象：dimorphism21、共聚物：copolymer22、合成树脂：synthetic23、热固性树脂：thermosetting resin24、热塑性树脂：thermoplastic resin25、感光性树脂：photosensitive resin26、环氧当量：weight per epoxy equivalent(wpe)27、环氧值：epoxy value28、双氰胺：dicyandiamide29、粘结剂：binder30、胶粘剂：adesive31、固化剂：curing agent32、阻燃剂：flame retardant33、遮光剂：opaquer34、增塑剂：plasticizers35、不饱和聚酯：unsatuiated polyester36、聚酯薄膜：polyester37、聚酰亚胺薄膜：polyimide film(pi)38、聚四氟乙烯：polytetrafluoetylene(ptfe)39、聚全氟乙烯丙烯薄膜：perfluorinated ethylene-propylene copolymer film(fep)40、增强材料：reinforcing material41、玻璃纤维：glass fiber42、e玻璃纤维：e-glass fibre43、d玻璃纤维：d-glass fibre44、s玻璃纤维：s-glass fibre45、玻璃布：glass fabric46、非织布：non-woven fabric47、玻璃纤维垫：glass mats48、纱线：yarn49、单丝：filament50、绞股：strand51、纬纱：weft yarn52、经纱：warp yarn53、但尼尔：denier54、经向：warp-wise55、纬向：weft-wise,filling-wise56、织物经纬密度：thread count57、织物组织：weave structure58、平纹组织：plain structure59、坏布：grey fabric60、稀松织物：woven scrim61、弓纬：bow of weave62、断经：end missing63、缺纬：mis-picks64、纬斜：bias65、折痕：crease66、云织：waviness67、鱼眼：fish eye68、毛圈长：feather length69、厚薄段：mark70、裂缝：split71、捻度：twist of yarn72、浸润剂含量：size content73、浸润剂残留量：size residue74、处理剂含量：finish level75、浸润剂：size76、偶联剂：couplint agent77、处理织物：finished fabric78、聚酰胺纤维：polyarmide fiber79、聚酯纤维非织布：non-woven polyester fabric80、浸渍绝缘纵纸：impregnating insulation paper81、聚芳酰胺纤维纸：aromatic polyamide paper82、断裂长：breaking length83、吸水高度：height of capillary rise84、湿强度保留率：wet strength retention85、白度：whitenness86、陶瓷：ceramics87、导电箔：conductive foil88、铜箔：copper foil89、电解铜箔：electrodeposited copper foil(ed copper foil)90、压延铜箔：rolled copper foil91、退火铜箔：annealed copper foil92、压延退火铜箔：rolled annealed copper foil(ra copper foil)93、薄铜箔：thin copper foil94、涂胶铜箔：adhesive coated foil95、涂胶脂铜箔：resin coated copper foil(rcc)96、复合金属箔：composite metallic material97、载体箔：carrier foil98、殷瓦：invar99、箔（剖面）轮廓：foil profile100、光面：shiny side101、粗糙面：matte side102、处理面：treated side103、防锈处理：stain proofing104、双面处理铜箔：double treated foil四、设计1、原理图：shematic diagram2、逻辑图：logic diagram3、印制线路布设：printed wire layout4、布设总图：master drawing5、可制造性设计：design-for-manufacturability6、计算机辅助设计：computer-aided design.(cad)7、计算机辅助制造：computer-aided manufacturing.(cam)8、计算机集成制造：computer integrat manufacturing.(cim)9、计算机辅助工程：computer-aided engineering.(cae)10、计算机辅助测试：computer-aided test.(cat)11、电子设计自动化：electric design automation.(eda)12、工程设计自动化：engineering design automaton.(eda2)13、组装设计自动化：assembly aided architectural design.(aaad)14、计算机辅助制图：computer aided drawing15、计算机控制显示：computer controlled display.(ccd)16、布局：placement17、布线：routing18、布图设计：layout19、重布：rerouting20、模拟：simulation21、逻辑模拟：logic simulation22、电路模拟：circit simulation23、时序模拟：timing simulation24、模块化：modularization25、布线完成率：layout effeciency26、机器描述格式：machine descriptionm format.(mdf)27、机器描述格式数据库：mdf databse28、设计数据库：design database29、设计原点：design origin30、优化（设计）：optimization(design)31、供设计优化坐标轴：predominant axis32、表格原点：table origin33、镜像：mirroring34、驱动文件：drive file35、中间文件：intermediate file36、制造文件：manufacturing documentation37、队列支撑数据库：queue support database38、元件安置：component positioning39、图形显示：graphics dispaly40、比例因子：scaling factor41、扫描填充：scan filling42、矩形填充：rectangle filling43、填充域：region filling44、实体设计：physical design45、逻辑设计：logic design46、逻辑电路：logic circuit47、层次设计：hierarchical design48、自顶向下设计：top-down design49、自底向上设计：bottom-up design50、线网：net51、数字化：digitzing52、设计规则检查：design rule checking53、走（布）线器：router(cad)54、网络表：net list55、计算机辅助电路分析：computer-aided circuit analysis56、子线网：subnet57、目标函数：objective function58、设计后处理：post design processing(pdp)59、交互式制图设计：interactive drawing design60、费用矩阵：cost metrix61、工程图：engineering drawing62、方块框图：block diagram63、迷宫：moze64、元件密度：component density65、巡回售货员问题：traveling salesman problem66、自由度：degrees freedom67、入度：out going degree68、出度：incoming degree69、曼哈顿距离：manhatton distance70、欧几里德距离：euclidean distance71、网络：network72、阵列：array73、段：segment74、逻辑：logic75、逻辑设计自动化：logic design automation76、分线：separated time77、分层：separated layer78、定顺序：definite sequence五、形状与尺寸：1、导线（通道）：conduction(track)2、导线（体）宽度：conductor width3、导线距离：conductor spacing4、导线层：conductor layer5、导线宽度/间距：conductor line/space6、第一导线层：conductor layer no.17、圆形盘：round pad8、方形盘：square pad9、菱形盘：diamond pad10、长方形焊盘：oblong pad11、子弹形盘：bullet pad12、泪滴盘：teardrop pad13、雪人盘：snowman pad14、v形盘：v-shaped pad15、环形盘：annular pad16、非圆形盘：non-circular pad17、隔离盘：isolation pad18、非功能连接盘：monfunctional pad19、偏置连接盘：offset land20、腹（背）裸盘：back-bard land21、盘址：anchoring spaur22、连接盘图形：land pattern23、连接盘网格阵列：land grid array24、孔环：annular ring25、元件孔：component hole26、安装孔：mounting hole27、支撑孔：supported hole28、非支撑孔：unsupported hole29、导通孔：via30、镀通孔：plated through hole(pth)31、余隙孔：access hole32、盲孔：blind via(hole)33、埋孔：buried via hole34、埋/盲孔：buried/blind via35、任意层内部导通孔：any layer inner via hole(alivh)36、全部钻孔：all drilled hole37、定位孔：toaling hole38、无连接盘孔：landless hole39、中间孔：interstitial hole40、无连接盘导通孔：landless via hole41、引导孔：pilot hole42、端接全隙孔：terminal clearomee hole43、准表面间镀覆孔：quasi-interfacing plated-through hole44、准尺寸孔：dimensioned hole45、在连接盘中导通孔：via-in-pad46、孔位：hole location47、孔密度：hole density48、孔图：hole pattern49、钻孔图：drill drawing50、装配图：assembly drawing51、印制板组装图：printed board assembly drawing52、参考基准：datum referance整理自快点PCB学院。
PCB术语中英文对照表
PCB术语中英文对照表Adｈesiｏn 附着力Annｕｌaｒ Rｉｎg 孔环AOI(aｕtomａtic oｐtｉcal insｐecｔiｏｎ) 自动光学检测AQL(ａccｅptable ｑｕaliｔｙｌｅvel）可接受得质量等级B＆sup2；iｔ(burieｄ bump inｔｅrｃｏnnｅction technolog ｙ）埋入凸块焊点互连技术BBH（bｕriｅd blｉnd ｈoｌｅ）埋盲孔BGA（baｌl grｉｄａrrａy) 球栅阵列Bｌisｔeｒ起泡Boaｒｄ Eｄges 板边Buｒr 毛头/毛刺BＵM（Build—up mｕltｉlayer）积层式多层板BＶH（burieｄ/ｂlinｄ vｉa hoｌe）埋/盲导通孔CAD（puter ａided dｅsign) 计算机辅助设计CAM(puter aided mａnｕfａcturing）计算机辅助制造Ｃａrｂｏｎ oil 碳油CEM(posiｔe ｅpoｘy mａｔｅrｉal）环氧树脂复合板材chaｍfeｒ倒角Characｔeｒistic ｉmpeｄanｃe 特性阻抗CNC(puteriｚed ｎｕmerｉcaｌｃｏnｔroｌ)计算机化数字控制Ｃonductor Ｃrack 导体破裂Condｕctor Spacing 导线间距ｃｏnｎector 连接器Ｃｏｐper fｏil 铜箔(皮）Cｒａziｎｇ微裂纹（白斑）Dｅlaminatiｏn 分层Ｄｅweｔting 半润湿(缩锡）DＦＭ（desｉgn for manuｆacturing）可制造性设计DIP（dｕａl ｉn-ｌine pａcｋagｅ）双列直插式组件Dk（ｄielｅcｔriｃ cｏnｓtａnｔ)介电常数DRC（ｄesign rule ｃhecking) 设计规则检查drａwing 图纸ECN(engineering change nｏtｉce）工程更改通知ECO(enｇineｅｒinｇ changｅｏｒder）工程更改指令E ｇlass 电子级玻璃entek OSP处理Eｐoxy rｅsiｎ环氧树脂ESＤ（eｌeｃtrostaｔiｃ disｃharｇｅ）静电释放Etched Maｒｋing 蚀刻标记Flａｔness 翘曲度Foreiｇｎ Iｎｃlusioｎ外来夹杂物Flame rｅｓiｓtant 阻燃性FR—2（fｌame—ｒetardａnt 2)耐燃酚醛纸基板FR—3(flame－rｅtardant ３）耐燃环氧纸基板FR—4（flame－retａｒdant 4）耐燃环氧玻璃布基板FＲ—５（fｌame-retaｒdanｔ 5）耐燃多功能环氧玻璃布基板ground 地面（层)Haｌｏｉng 晕圈ＨDI(high deｎsitｙ inteｒconneｃｔion）高密度互连技术HAＳL(hot air solｄｅr levelｉng）热风焊料整平（整平）ＩC（inｔeｇraｔｅｄ cｉrcuiｔｓ) 集成电路Ｉnk Stamped Maｒkｉnｇ盖印标记Insulatｉon ｒｅsistancｅ绝缘电阻Ｉon ｃｌeanlineｓs 离子清洁度IPＣ（ｔhe inｓtitutｅfor ｉnｔｅｒconnecting and pａｃkagiｎg of ｅlectrｏnｉc circｕiｔｓ）印制电路互连与封装协会IＳO（Ｉnｔernatiｏｎal ｏrgａnizatｉon ｆor standardization）国际标准化组织Lamiｎａte Vｏidｓ压合空洞ｌａｓer 激光LDI（laser direｃt ｉmaging) 激光直接成像ｌｅｇend 文字标记、符号Ｌｉfｔｅd Lａnds 焊盘浮起logｏ标志LPI（liquiｄｐhotoimａgeablｅ）液态感光成像LPISM(liquｉd phｏｔoimageable soldｅr mask）液态感光阻焊膜mａrkiｎｇ标记Ｍeaｓliｎg 白斑Mｉcrovoids 微坑mil 密耳（千分之一英寸）MIL-ＳTＤ(mｉliｔaｒy ｓtandard）美国军用标准Negatｉｖe Eｔchback 欠蚀Nｉckｓ缺口Noｄuｌes 镀镏Nonｗetting 不润湿(拒锡)open 开路OSP（organic soｌdeｒabilｉty prｅservaｔives) 表面抗氧化ｏxｉｄes 氧化物paｄ焊盘paｎel 拼板pattern 板面图形PCＢ（printeｄ cｉｒcuit ｂｏard) 印制电路板Pcs(piｅｃｅｓ）件、片、只Peeling 剥落pｉnｈole 针孔Pｉnk Rｉng 粉红圈Pits 凹坑pｉtｃh 中心距Pｌａting Ｖoｉdｓ镀层破洞plug 塞Positｉve Eｔｃhback 过蚀power 电源层preｐｒeｇ半固化片PTFE（polytetrａfｌuorｏetｈyｌene) 聚四氟乙烯PTH(plａtｅd through－ｈoｌe）金属化孔PWB（prｉntｅｄ-ｗiriｎg boarｄ) 印制线路板Ｒegisｔration 对准QA（quality ａsｓuranｃｅ）质量保证ＱＣ（qｕaｌity ｃontrol）质量控制QE（qualitｙ engineｅriｎg）质量工程QFP（quad flａt ｐacｋagｅ）方形扁平组件reｐaiｒ修理RCC(ｒｅｓin ｃｏated ｃoppeｒ) 已涂覆树脂得铜箔Refeｒence diｍensｉｏn 参考尺寸ｒegistration 对准度rｅsin 树脂rejectｉon 拒收reviｓioｎ修订版ＲF(rａdｉo frequencｙ）射频Rｉｐples 纹路ｒｏut 外形铣scratch 划伤Screeｎｅd Ｍarkｉnｇ纲印标记scoriｎg 刻槽short 短路sｉgｎal 信号Sｉｌk scrｅen 丝网Skip Coveraｇe 漏印sｌot 开槽SMD（suｒface moｕnt deviｃe）表面安装器件SMＯBC（solder maｓk ｏｖer bare cｏpｐeｒ）裸铜覆盖阻焊膜SMT(suｒfａce ｍount tecｈnologｙ) 表面安装技术smｅaｒ毛刺solder 焊锡Ｓ/Ｍ（solder ｍask）绿油ｓoldｅｒaｂiｌｉty 可焊性Soda Ｓtrawinｇ (汽水)吸管式浮空ＳPC(sｔａtiｓｔicaｌｐrocｅsｓｃontrol) 统计过程控制sｐacing 间距Ｔape ｔest 胶带实验ＴCE（tｈermal coeｆficiｅnt ｏf eｘpａnsiｏｎ）热胀系数TＤR(tｉme-dｏmａｉn refｌｅctometｒｙ)时域反射测试tolｅrancｅ公差Tentｉnｇ盖孔ＴeｘturｅＣoｎdiｔｉon 显布纹Ｔg(glａsｓ tｒaｎsiｔion teｍpeｒaｔｕrｅ) 玻璃软化温度THT （ｔｈｒough hoｌe tｅｃhnｏｌｏgy）通孔（插装)技术ｔrace 线路(条）UL（underｗriteｒs laboratｏries) 安全实验所NPTH 非金属化孔ＵV（ultrａviolet）紫外线辐射v－ｃut V刻Vｉa ｈolｅ导通孔(过线孔)vｏid 空洞wａrp 板弯Waｖes 波浪Wｅａve Exposurｅ露织物ｗetting 沾锡Wiｃking 灯芯效应（渗铜)Wｒｉnｋles 起皱五、形状与尺寸:１、导线（通道）:ｃoｎｄucｔion （tracｋ)2、导线(体）宽度：conduｃtｏr widｔｈ3、导线距离:conductｏr ｓpacｉng４、导线层:conductor layｅｒ5、导线宽度／间距：cｏnductor lｉｎe/sｐａce6、第一导线层:conductor layer no、1７、圆形盘：rouｎd pad８、方形盘:squaｒｅｐad9、菱形盘:diａｍond pad10、长方形焊盘:ｒeｃtanglｅｐad11、子弹形盘：bulｌet ｐaｄ12、泪滴盘:teａrdrop pａd１3、雪人盘：snowmaｎ pａd１4、 v形盘：ｖ-shaped pad１5、环形盘：ａnnulａr paｄ16、非圆形盘:ｎon－ｃirｃular ｐａd１７、隔离盘:isolation pad1８、非功能连接盘:ｍonfｕｎcｔｉonａｌ pａd １９、偏置连接盘:offｓeｔｌaｎd20、腹(背)裸盘：bacｋ—bａrd ｌaｎd２1、盘址：ａnchorｉng spaur22、连接盘图形：lａnd ｐattｅrn2３、连接盘网格阵列:lａnd griｄ array2４、孔环:ａnｎulａr ring2５、元件孔：ponent hｏle２6、安装孔:mountinｇ hole2７、支撑孔：ｓuｐported holｅ28、非支撑孔：unsuppｏrｔed hole29、导通孔：viａ3０、镀通孔:plａted thrｏｕｇh hole （ptｈ）３1、余隙孔：aｃcesｓｈolｅ32、盲孔:blind ｖｉa （ｈolｅ）３３、埋孔:ｂuｒiｅd via hｏle34、埋/盲孔：ｂurｉeｄ /ｂlinｄ via35、任意层内部导通孔：any layeｒ inｎｅr via hole (ａlｉvh）３６、全部钻孔：aｌl drilled holｅ3７、定位孔：toaｌinｇ hｏlｅ38、无连接盘孔:landless ｈole39、中间孔:interstitｉａｌ hole40、无连接盘导通孔：landlｅss via hoｌe41、引导孔:ｐiｌoｔ hole４2、端接全隙孔：ｔerｍinal clearomｅe holｅ４3、准表面间镀覆孔：quａｓｉ-interfａｃing plated—throｕgｈ hｏle 4４、准尺寸孔：ｄimensｉoneｄ holｅ45、在连接盘中导通孔：ｖia－in-pad46、孔位：hoｌe loｃatioｎ47、孔密度:hoｌｅ densitｙ４8、孔图：holｅ pａttern49、钻孔图：driｌl drａwing50、装配图：asｓembly drawing５1、印制板组装图:priｎted boａrd aｓsｅmｂly drａwｉng 5２、参考基准：dａtuｍ reｆeｒaｎｃe。
pcb中英文术语对照
pcb中英文术语对照A/W (artwork) 底片Ablation 烧溶(laser),切除abrade 粗化abrasion resistance 耐磨性absorption 吸收ACC ( accept ) 允收accelerated corrosion test 加速腐蚀accelerated test 加速试验acceleration 速化反应accelerator 加速剂acceptable 允收activator 活化液active work in process 实际在制品adhesion 附着力adhesive method 黏着法air inclusion 气泡air knife 风刀amorphous change 不定形的改变amount 总量amylnitrite 硝基戊烷analyzer 分析仪anneal 回火annular ring 环状垫圈;孔环anode slime (sludge) 阳极泥anodizing 阳极处理AOI ( automatic optical inspection ) 自动:光学检测applicable documents 引用之文件AQL sampling 允收水准抽样aqueous photoresist 液态光阻aspect ratio 纵横比(厚宽比)As received 到货时back lighting 背光back-up 垫板banked work in process 预留在制品base material 基材baseline performance 基准绩效batch 批beta backscattering 贝他射线照射法beveling 切斜边;斜边biaxial deformation 二方向之变形black-oxide 黑化blank controller 空白对照组blank panel 空板blanking 挖空blip 弹开blister 气泡;起泡blistering 气泡blow hole 吹孔board-thickness error 板厚错误bonding plies 黏结层bow ; bowing 板弯break out 从平环破出bridging 搭桥;桥接BTO (Build To Order) 接单生产burning 烧焦burr 毛边(毛头)camcorder 一体型摄录放机carbide 碳化物carlson pin 定位梢carrier 载运剂catalyzing 催化catholic sputtering 阴极溅射法caul plate 隔板;钢板calibration system requirements 校验系统之各种要求center beam method 中心光束法central projection 集中式投射线certification 认证chamfer 倒角(金手指)chamfering 切斜边;倒角characteristic impedance 特性阻抗charge transfer overpotential 电量传递过电压chase 网框checkboard 棋盘chelator 蟹和剂chemical bond 化学键chemical vapor deposition 化学蒸着镀circumferential void 圆周性之孔破clad metal 包夹金属clean room 无尘室clearance 间隙coat 镀外表coating error 防焊覆盖错误coefficient of thermal expansion (CTE) 热澎胀系数cold solder joint 冷焊点cold-weld 金属粉末冷焊color 颜色color error 颜色错误compensation 补偿competitive performance 竞争力绩效complex salt 错化物complexor 错化物component hole 零件孔component side 零件面concentric 同心conformance 密贴性consumer products 消费性产品contact resistance 接触电阻continuous performance 连续发挥效能contract service 协力厂controlled split 均裂式conventional flow 乱流方式conventional tensile test 传统力测试法conversion coating 转化层convex 突出coordinate list 数据清单copper claded laminates (CCL) 铜箔基板copper exposure 线路露铜copper mirror 镜铜copper pad 铜箔圆配copper residue (copper splash) 铜渣corrosion rate numbering 腐蚀速率计数系统corrosion resistance 抗蚀性coulombs law 库伦定律countersink 喇叭孔coupon 试样coupon location 试样点covering power 遮盖力CPU 中央处理器crack 破裂;裂痕crazing 裂痕;白斑cross linking 交联聚合cross talk 呼应作用crosslinking 交联crystal collection 结晶收集curing 聚合体current efficiency 电流效率cut-outs 挖空cutting 裁板cyanide 氰化物cycles of learning 学习循环cycle-time reduction 交期缩短date code 周期deburring 去毛头dedicated 专用型degradation 退变delamination 分层dent / pin hole 凹陷/ 针孔department of defense 国防部designation 字码简示法de-smear 除胶渣developing 显影dewetting 缩锡dewetting time 缩锡时间dimension error 外形尺寸错误dielectric constant 介质常数difficulty 困难度difunctional 双功能dimension 尺寸dimension stability 尺寸安定性dimensional stability 尺度安定性dimension and tolerance 尺寸与公差dirty hole 孔异物discolor hole 孔黑;孔灰;氧化discoloration 变色disposable eyelet method 消耗性铆钉法distortion factor 尺寸变形函数double side 双面板downtime 停机时间drill 钻孔drill bit 钻头drill facet 钻尖切萷面drill pointer 钻尖重(研)磨机drilled blank board 已钻孔之裸板drilling 钻孔dry film 干膜ductility 延展性economy of scale 经济规模edge spacing 板边空地edge-board contact ( gold finger ) 金手指tab 金手指tack free 不黏taped hole gauge 锥形孔规target hole 靶孔task force 任务编组tensile strength 抗拉强度tensile stress 性应力tent 浮盖terms and definitions 术语与定义termination load 抗匹配负载test circuit 测试线路test method 试验方法test point 测试点thermal shock 热震荡试验thermal stress 热应力试验thermistor 热电感应式thermo cycling 热循环试验theoretical cycle time 理论性周期时间thickness 厚度time to market 上市时机thickness distribution 厚度分布thief 补助阴极thin core 薄基板;层板throwing power 分布力tolerance 公差;容差tooling hole 工具孔torque load 扭力拒之负载total quality program 全面的品质计划toughness 坚度trace error 线路错误trace nick & pin hole 线路缺口及针孔trace peeling 线路剥离trace pin-hole 线路针孔trace surface roughness 线路表面粗糙tarnish and oxide resist 抗污抗氧化剂transmittance 透光度trim line 裁切线true levelling 真平整true position 真正位置的孔;真位twist 板翘type 种类umbra 本影undercut 侧蚀uneven coating 喷锡厚镀不平整universal 万用型universal tensile tester 万用拉力试验机universal tester 泛用型测试机upper carrier 顶部承载钢uptime 稼动:时间vacuum deposition 真空蒸镀法vacuum hydraulic lamination真空液压法vaporizer 气化室V-cut V形槽vertical microsection 垂直微切片via hole 导通孔visible inventory 有形的库存vision inspection 目视检查Void 孔破void in hole 孔壁上的破洞void in PTH hole 孔破walkman 随身听warehouse 仓库warp 板弯warp , warpage 板弯water absorption 吸水性wear resistance 耐磨度weave exposure 纤纹显露weave texture 织纹隐现wedge angle 契尖角week 周wet chemistry 湿式化学制程wet film 湿膜wet lamination 湿膜压膜法wet process 湿制程wetting 沾锡wetting balance 沾锡平衡法wicking 渗铜;渗入;灯蕊效应width 宽度width reduce 线细width-to-thickness ratio 宽度与厚度的比值window 操作围work-in-process 在制品work order 工单working film 工作片working master 工作母片year 年yellow 金黄色yield 良率电路板门户网，商机无限，资讯最新，问答圈子，社区平台 jewwww等级：一级普工文章：46积分：419注册：2006年9月20日发表于2006-9-21 21:32:00第3楼fabric 网布failure 故障fast response 快速响应fault 瑕庛;缺陷fiber exposure 纤维显露fiber protrusion 纤维突出fiducial mark 光学点,基准记号filler 填充料film 底片filtration 过滤finished board 成品fixing 固着fixture 电测夹具(治具) flaking off 粹离flammability rating 燃性等级flare 喇叭形孔flat cable 并排电缆feedback loop 回馈循环first-in-first-out (FIFO) 先进先出flexible manufacturing system (FMS) 弹性制造系统flux 助焊剂foil distortion 铜层变形fold 空泡foreign include 异物foreign material 基材异物free radical chain polymerization 自由基连锁聚合fully additive 加成法fully annealed type 彻底回火轫化之类形function 函数fundamental and basic 基本fungus resistance 抗霉性funnel flange 喇叭形折翼galvanized 加法尼化制程gap 钻尖分开gauge length 有效长度gel time 胶化时间general resist ink 一般阻剂油墨general 通论general industrial 一般性(电子)工业级geometrical levelling 几何平整glass transition temperature (Tg) 玻璃态转换温度Gold 金gold finger 金手指gold plating 镀金golden board 标准板gouges 刷磨凹沟gouging 挖破grain boundary 金属晶体之四边green 绿色grip 夹头ground plane 接地层ground plane clearance 接地空环hackers 骇客HAL ( hot air leveling ) 喷锡haloing 白边;白圈hardener 硬化剂hardness 硬度hepa filter 空气滤清器high performance industrial 高性能(电子)工业级high reliability 高可靠度high resolution 高分辨率high temperature elongation (HTE) 高温延展性铜箔high temperature epoxy (HTE) 高温树酯hit 击hole counter 数孔机hole diameter 孔径hole diameter error 孔径错误hole location 孔位hole number 孔数hole wall quality 孔壁品质hook 外弧hot dip 热浸法hull cell 哈氏槽hybrid 混成集成电路hydrogen bonding 氢键hydrolysis 水解hydrometallurgy 湿法冶金法image analysis system 影像分析系统image transfer 影像转移immersion gold 浸金(化镍金)immersion plating 浸镀法impedance 阻抗infrared reflow 红外线重熔inhibitor 热聚合抑制剂injection mold 射模ink 油墨innerlayer & outlayer 外层insulation resistance 绝缘电阻intended position 应该在的位置intensifier 增强器intensity 强度inter molecular exchange 交互改变interconnection 互相连通ionic contaminants 离子性污染物ionic contamination testing 离子污染试验IPA 异丙醇5I : inspiration (启蒙)identification 确认计划目标implementation 改善方案information 数据internalization 制度化invisible inventory 无形的库存knife edges 刀缘Knoop 努普(硬度单位) kraft paper 牛皮纸laminar flow 层流laminate 基层板laminating 压合lamination 压合laminator 压膜机land 焊垫lay back 刃角磨损lay up 组合叠板layout 布线;布局lead screw 牵引螺丝leakage 漏电learning curve 学习曲线legend 文字标记leveling 平整levelling additive 平整剂levelling power 平整力life support 维系生命limiting current 极限电流line space 线距line width 线宽linear variable differential transformer(LVDL) 线性可变差动:转换器liquid 液状(态)liquid crystal resins 液晶树脂liquid photoimageable solder resist ink 液态感光防焊油墨liquid photoresist ink 液态光阻剂油墨lot size 批量lower carrier 底部承载板mechanical plating 机祴镀法machine scrub 刷磨清洁法macrothrowing power 巨分布力margin 钻头刃带market share 市场占有率marking error 文字错误masked leveling 儰装平整mass lamination 大型压板mass transfer 质量传送效应mass transfer overpotential 质量传递过电压mass transportation 质传master drawing 主图;蓝图material use factor 材料使用率mealing 泡点;白点memory 记忆装置meniscograph solderability measurement 新月型焊锡效果microetch 微蚀microetching 微蚀microfocus 微焦距microfocus system 微焦距系统microprofile 微表面microsectioning 微切片法microthrowing power 微分布力migration 迁移mini-tensile tester 迷你拉力测试仪mis hole location 孔位错误misregistration 焊锡面与零件面对位偏差misregsitration 对不准moisture and insulation resistance test 湿气与绝缘电阻试验molded circuit board (MCB) 模制电路板monoethanal amine 单乙醇氨monohydrate state 水化物monomer 单分子膜;单体mouse bite 锯齿;蚀刻缺口msec 毫秒muffle furnace 高温焚火炉multichip 超大IC型(多芯片模块)线路板流程术语中英文对照流程简介：开料－－钻孔－－干膜制程－－压合－－减铜－－电镀－－塞孔－－防焊(绿漆/绿油)－－镀金－－喷锡－－成型－－开短路测试－－终检－－雷射钻孔A. 开料( Cut Lamination)a-1 裁板( Sheets Cutting)a-2 原物料发料(Panel)(Shear material to Size)B. 钻孔(Drilling)b-1 钻(Inner Layer Drilling )b-2 一次孔(Outer Layer Drilling )b-3 二次孔(2nd Drilling)b-4 雷射钻孔(Laser Drilling )(Laser Ablation )b-5 盲(埋)孔钻孔(Blind & Buried Hole Drilling)C. 干膜制程( Photo Process(D/F))c-1 前处理(Pretreatment)c-2 压膜(Dry Film Lamination)c-3 曝光(Exposure)c-4 显影(Developing)c-5 蚀铜(Etching)c-6 去膜(Stripping)c-7 初检( Touch-up)c-8 化学前处理,化学研磨( Chemical Milling )c-9 选择性浸金压膜(Selective Gold Dry Film Lamination)c-10 显影(Developing )c-11 去膜(Stripping )Developing , Etching & Stripping ( DES )D. 压合Laminationd-1 黑化(Black Oxide Treatment)d-2 微蚀(Microetching)d-3 铆钉组合(eyelet )d-4 叠板(Lay up)d-5 压合(Lamination)d-6 后处理(Post Treatment)d-7 黑氧化( Black Oxide Removal )d-8 铣靶(spot face)d-9 去溢胶(resin flush removal)E. 减铜(Copper Reduction)e-1 薄化铜(Copper Reduction)F. 电镀(Horizontal Electrolytic Plating)f-1 水平电镀(Horizontal Electro-Plating) (Panel Plating) f-2 锡铅电镀( Tin-Lead Plating ) (Pattern Plating)f-3 低于1 mil ( Less than 1 mil Thickness )f-4 高于1 mil ( More than 1 mil Thickness)f-5 砂带研磨(Belt Sanding)f-6 剥锡铅( Tin-Lead Stripping)f-7 微切片( Microsection)G. 塞孔(Plug Hole)g-1 印刷( Ink Print )g-2 预烤(Precure)g-3 表面刷磨(Scrub)g-4 后烘烤(Postcure)H. 防焊(绿漆/绿油): (Solder Mask)h-1 C面印刷(Printing Top Side)h-2 S面印刷(Printing Bottom Side)h-3 静电喷涂(Spray Coating)h-4 前处理(Pretreatment)h-5 预烤(Precure)h-6 曝光(Exposure)h-7 显影(Develop)h-8 后烘烤(Postcure)h-9 UV烘烤(UV Cure)h-10 文字印刷( Printing of Legend )h-11 喷砂( Pumice)(Wet Blasting)h-12 印可剥离防焊(Peelable Solder Mask)I . 镀金Gold platingi-1 金手指镀镍金( Gold Finger )i-2 电镀软金(Soft Ni/Au Plating)i-3 浸镍金( Immersion Ni/Au) (Electroless Ni/Au) J. 喷锡(Hot Air Solder Leveling)j-1 水平喷锡(Horizontal Hot Air Solder Leveling)j-2 垂直喷锡( Vertical Hot Air Solder Leveling)j-3 超级焊锡(Super Solder )j-4. 印焊锡突点(Solder Bump)K. 成型(Profile)(Form)k-1 捞型(N/C Routing ) (Milling)k-2 模具冲(Punch)k-3 板面清洗烘烤(Cleaning & Backing)k-4 V型槽( V-Cut)(V-Scoring)k-5 金手指斜边( Beveling of G/F)L. 开短路测试(Electrical Testing) (Continuity & Insulation Testing) l-1 AOI 光学检查( AOI Inspection)l-2 VRS 目检(Verified & Repaired)l-3 泛用型治具测试(Universal Tester)l-4 专用治具测试(Dedicated Tester)l-5 飞针测试(Flying Probe)M. 终检( Final Visual Inspection)m-1 压板翘( Warpage Remove)m-2 X-OUT 印刷(X-Out Marking)m-3 包装及出货(Packing & shipping)m-4 目检( Visual Inspection)m-5 清洗及烘烤( Final Clean & Baking)m-6 护铜剂(ENTEK Cu-106A)(OSP)m-7 离子残余量测试(Ionic Contamination Test )(Cleanliness Test) m-8 冷热冲击试验(Thermal cycling Testing)m-9 焊锡性试验( Solderability Testing )N. 雷射钻孔(Laser Ablation)N-1 雷射钻Tooling孔(Laser ablation Tooling Hole)N-2 雷射曝光对位孔(Laser Ablation Registration Hole)N-3 雷射Mask制作(Laser Mask)N-4 雷射钻孔(Laser Ablation)N-5 AOI 检查及VRS ( AOI Inspection & Verified & Repaired)N-6 Blaser AOI (after Desmear and Microetching)N-7 除胶渣(Desmear)N-8 微蚀(Microetching )专业线路板厂ＣＡＭ及ＭＩ工程师培训，热线报名:05廖小姐jewwww等级：一级普工文章：46积分：419注册：2006年9月20日发表于2006-9-21 21:35:00第5楼PCB综合词汇中英文对照：1、印制电路：printed circuit2、印制线路：printed wiring3、印制板：printed board4、印制板电路：printed circuit board (pcb)5、印制线路板：printed wiring board(pwb)6、印制元件：printed component7、印制接点：printed contact8、印制板装配：printed board assembly9、板：board10、单面印制板：single-sided printed board(ssb)11、双面印制板：double-sided printed board(dsb)12、多层印制板：mulitlayer printed board(mlb)13、多层印制电路板：mulitlayer printed circuit board14、多层印制线路板：mulitlayer prited wiring board15、刚性印制板：rigid printed board16、刚性单面印制板：rigid single-sided printed borad17、刚性双面印制板：rigid double-sided printed borad18、刚性多层印制板：rigid multilayer printed board19、挠性多层印制板：flexible multilayer printed board20、挠性印制板：flexible printed board21、挠性单面印制板：flexible single-sided printed board22、挠性双面印制板：flexible double-sided printed board23、挠性印制电路：flexible printed circuit (fpc)24、挠性印制线路：flexible printed wiring25、刚性印制板：flex-rigid printed board, rigid-flex printed board26、刚性双面印制板：flex-rigid double-sided printed board, rigid-flex double-sided printed27、刚性多层印制板：flex-rigid multilayer printed board, rigid-flex multilayer print ed board28、齐平印制板：flush printed board29、金属芯印制板：metal core printed board30、金属基印制板：metal base printed board31、多重布线印制板：mulit-wiring printed board32、瓷印制板：ceramic substrate printed board33、导电胶印制板：electroconductive paste printed board34、模塑电路板：molded circuit board35、模压印制板：stamped printed wiring board36、顺序层压多层印制板：sequentially-laminated mulitlayer37、散线印制板：discrete wiring board38、微线印制板：micro wire board39、积层印制板：buile-up printed board40、积层多层印制板：build-up mulitlayer printed board (bum)41、积层挠印制板：build-up flexible printed board42、表面层合电路板：surface laminar circuit (slc)43、埋入凸块连印制板：b2it printed board44、多层膜基板：multi-layered film substrate(mfs)45、层间全导通多层印制板：alivh multilayer printed board46、载芯片板：chip on board (cob)47、埋电阻板：buried resistance board48、母板：mother board49、子板：daughter board50、背板：backplane51、裸板：bare board52、键盘板夹心板：copper-invar-copper board53、动态挠性板：dynamic flex board54、静态挠性板：static flex board55、可断拼板：break-away planel56、电缆：cable57、挠性扁平电缆：flexible flat cable (ffc)58、薄膜开关：membrane switch59、混合电路：hybrid circuit60、厚膜：thick film61、厚膜电路：thick film circuit62、薄膜：thin film63、薄膜混合电路：thin film hybrid circuit64、互连：interconnection65、导线：conductor trace line66、齐平导线：flush conductor67、传输线：transmission line68、跨交：crossover69、板边插头：edge-board contact70、增强板：stiffener71、基底：substrate72、基板面：real estate73、导线面：conductor side74、元件面：component side75、焊接面：solder side76、印制：printing77、网格：grid78、图形：pattern79、导电图形：conductive pattern80、非导电图形：non-conductive pattern81、字符：legend82、标志：mark中国新柳电子开发专业PCB线路设计：02(设计基地)() Email: jewwww等级：一级普工文章：46积分：419注册：2006年9月20日发表于2006-9-21 21:35:00第6楼1、基材：base material2、层压板：laminate3、覆金属箔基材：metal-clad bade material4、覆铜箔层压板：copper-clad laminate (ccl)5、单面覆铜箔层压板：single-sided copper-clad laminate6、双面覆铜箔层压板：double-sided copper-clad laminate7、复合层压板：composite laminate8、薄层压板：thin laminate9、金属芯覆铜箔层压板：metal core copper-clad laminate10、金属基覆铜层压板：metal base copper-clad laminate11、挠性覆铜箔绝缘薄膜：flexible copper-clad dielectric film12、基体材料：basis material13、预浸材料：prepreg14、粘结片：bonding sheet15、预浸粘结片：preimpregnated bonding sheer16、环氧玻璃基板：epoxy glass substrate17、加成法用层压板：laminate for additive process18、预制层覆箔板：mass lamination panel19、层芯板：core material20、催化板材：catalyzed board ,coated catalyzed laminate21、涂胶催化层压板：adhesive-coated catalyzed laminate22、涂胶无催层压板：adhesive-coated uncatalyzed laminate23、粘结层：bonding layer24、粘结膜：film adhesive25、涂胶粘剂绝缘薄膜：adhesive coated dielectric film26、无支撑胶粘剂膜：unsupported adhesive film27、覆盖层：cover layer (cover lay)28、增强板材：stiffener material29、铜箔面：copper-clad surface30、去铜箔面：foil removal surface31、层压板面：unclad laminate surface32、基膜面：base film surface33、胶粘剂面：adhesive faec34、原始光洁面：plate finish35、粗面：matt finish36、纵向：length wise direction37、模向：cross wise direction38、剪切板：cut to size panel39、酚醛纸质覆铜箔板：phenolic cellulose paper copper-clad laminates(phenolic/pa per ccl)40、环氧纸质覆铜箔板：epoxide cellulose paper copper-clad laminates (epoxy/pape r ccl)41、环氧玻璃布基覆铜箔板：epoxide woven glass fabric copper-clad laminates42、环氧玻璃布纸复合覆铜箔板：epoxide cellulose paper core, glass cloth surfaces copper-clad laminates43、环氧玻璃布玻璃纤维复合覆铜箔板：epoxide non woven/woven glass reinforced copper-clad laminates44、聚酯玻璃布覆铜箔板：ployester woven glass fabric copper-clad laminates45、聚酰亚胺玻璃布覆铜箔板：polyimide woven glass fabric copper-clad laminates46、双马来酰亚胺三嗪环氧玻璃布覆铜箔板：bismaleimide/triazine/epoxide woven glass fabric copper-clad lamimates47、环氧合成纤维布覆铜箔板：epoxide synthetic fiber fabric copper-clad laminates48、聚四乙烯玻璃纤维覆铜箔板：teflon/fiber glass copper-clad laminates49、超薄型层压板：ultra thin laminate50、瓷基覆铜箔板：ceramics base copper-clad laminates51、紫外专业线路板厂ＣＡＭ及ＭＩ工程师培训，热线报名:05廖小姐jewwww等级：一级普工文章：46积分：419注册：2006年9月20日发表于2006-9-21 21:36:00第7楼PCB原材料化学用语中英文对照：1、a阶树脂：a-stage resin2、b阶树脂：b-stage resin3、c阶树脂：c-stage resin4、环氧树脂：epoxy resin5、酚醛树脂：phenolic resin6、聚酯树脂：polyester resin7、聚酰亚胺树脂：polyimide resin8、双马来酰亚胺三嗪树脂：bismaleimide-triazine resin9、丙烯酸树脂：acrylic resin10、三聚氰胺甲醛树脂：melamine formaldehyde resin11、多官能环氧树脂：polyfunctional epoxy resin12、溴化环氧树脂：brominated epoxy resin13、环氧酚醛：epoxy novolac14、氟树脂：fluroresin15、硅树脂：silicone resin16、硅烷：silane17、聚合物：polymer18、无定形聚合物：amorphous polymer19、结晶现象：crystalline polamer20、双晶现象：dimorphism21、共聚物：copolymer22、合成树脂：synthetic23、热固性树脂：thermosetting resin24、热塑性树脂：thermoplastic resin25、感光性树脂：photosensitive resin26、环氧当量：weight per epoxy equivalent (wpe)27、环氧值：epoxy value28、双氰胺：dicyandiamide29、粘结剂：binder30、胶粘剂：adesive31、固化剂：curing agent32、阻燃剂：flame retardant33、遮光剂：opaquer34、增塑剂：plasticizers35、不饱和聚酯：unsatuiated polyester36、聚酯薄膜：polyester37、聚酰亚胺薄膜：polyimide film (pi)38、聚四氟乙烯：polytetrafluoetylene (ptfe)39、聚全氟乙烯丙烯薄膜：perfluorinated ethylene-propylene copolymer film (fep)40、增强材料：reinforcing material41、玻璃纤维：glass fiber42、e玻璃纤维：e-glass fibre43、d玻璃纤维：d-glass fibre44、s玻璃纤维：s-glass fibre45、玻璃布：glass fabric46、非织布：non-woven fabric47、玻璃纤维垫：glass mats48、纱线：yarn49、单丝：filament50、绞股：strand51、纬纱：weft yarn52、经纱：warp yarn53、但尼尔：denier54、经向：warp-wise55、纬向：weft-wise, filling-wise56、织物经纬密度：thread count57、织物组织：weave structure58、平纹组织：plain structure59、坏布：grey fabric60、稀松织物：woven scrim61、弓纬：bow of weave62、断经：end missing63、缺纬：mis-picks64、纬斜：bias65、折痕：crease66、云织：waviness67、鱼眼：fish eye68、毛圈长：feather length69、厚薄段：mark70、裂缝：split71、捻度：twist of yarn72、浸润剂含量：size content73、浸润剂残留量：size residue74、处理剂含量：finish level75、浸润剂：size76、偶联剂：couplint agent77、处理织物：finished fabric78、聚酰胺纤维：polyarmide fiber79、聚酯纤维非织布：non-woven polyester fabric80、浸渍绝缘纵纸：impregnating insulation paper81、聚芳酰胺纤维纸：aromatic polyamide paper82、断裂长：breaking length83、吸水高度：height of capillary rise84、湿强度保留率：wet strength retention85、白度：whitenness86、瓷：ceramics87、导电箔：conductive foil88、铜箔：copper foil89、电解铜箔：electrodeposited copper foil (ed copper foil)90、压延铜箔：rolled copper foil91、退火铜箔：annealed copper foil92、压延退火铜箔：rolled annealed copper foil (ra copper foil)93、薄铜箔：thin copper foil94、涂胶铜箔：adhesive coated foil95、涂胶脂铜箔：resin coated copper foil (rcc)96、复合金属箔：composite metallic material97、载体箔：carrier foil98、殷瓦：invar99、箔（剖面）轮廓：foil profile100、光面：shiny side101、粗糙面：matte side102、处理面：treated side103、防锈处理：stain proofing104、双面处理铜箔：double treated foil中国PCB人才网，提供最全面的PCB专业人才信息，.pcbjob.jewwww等级：一级普工文章：46积分：419注册：2006年9月20日发表于2006-9-21 21:36:00第8楼PCB线路设计词汇中英文对照：1、原理图：shematic diagram2、逻辑图：logic diagram3、印制线路布设：printed wire layout4、布设总图：master drawing5、可制造性设计：design-for-manufacturability6、计算机辅助设计：computer-aided design.(cad)7、计算机辅助制造：computer-aided manufacturing.(cam)8、计算机集成制造：computer integrat manufacturing.(cim)9、计算机辅助工程：computer-aided engineering.(cae)10、计算机辅助测试：computer-aided test.(cat)11、电子设计自动化：electric design automation .(eda)12、工程设计自动化：engineering design automaton .(eda2)13、组装设计自动化：assembly aided architectural design. (aaad)14、计算机辅助制图：computer aided drawing15、计算机控制显示：computer controlled display .(ccd)16、布局：placement17、布线：routing18、布图设计：layout19、重布：rerouting20、模拟：simulation21、逻辑模拟：logic simulation22、电路模拟：circit simulation23、时序模拟：timing simulation24、模块化：modularization25、布线完成率：layout effeciency26、机器描述格式：machine descriptionm format .(mdf)27、机器描述格式数据库：mdf databse28、设计数据库：design database29、设计原点：design origin30、优化（设计）：optimization (design)31、供设计优化坐标轴：predominant axis32、表格原点：table origin33、镜像：mirroring34、驱动文件：drive file35、中间文件：intermediate file36、制造文件：manufacturing documentation37、队列支撑数据库：queue support database38、元件安置：component positioning39、图形显示：graphics dispaly40、比例因子：scaling factor41、扫描填充：scan filling42、矩形填充：rectangle filling43、填充域：region filling44、实体设计：physical design45、逻辑设计：logic design46、逻辑电路：logic circuit47、层次设计：hierarchical design48、自顶向下设计：top-down design49、自底向上设计：bottom-up design50、线网：net51、数字化：digitzing52、设计规则检查：design rule checking53、走（布）线器：router (cad)54、网络表：net list55、计算机辅助电路分析：computer-aided circuit analysis56、子线网：subnet57、目标函数：objective function58、设计后处理：post design processing (pdp)59、交互式制图设计：interactive drawing design60、费用矩阵：cost metrix61、工程图：engineering drawing62、方块框图：block diagram63、迷宫：moze64、元件密度：component density65、巡回售货员问题：traveling salesman problem66、自由度：degrees freedom67、入度：out going degree68、出度：incoming degree69、曼哈顿距离：manhatton distance70、欧几里德距离：euclidean distance71、网络：network72、阵列：array73、段：segment74、逻辑：logic75、逻辑设计自动化：logic design automation76、分线：separated time77、分层：separated layer78、定顺序：definite sequence中国PCB人才网，提供最全面的PCB专业人才信息，.pcbjob.jewwww等级：一级普工文章：46积分：419注册：2006年9月20日发表于2006-9-21 21:37:00第9楼PCB线路板其他相关中英文对照：1、主面：primary side2、辅面：secondary side3、支撑面：supporting plane4、信号：signal5、信号导线：signal conductor6、信号地线：signal ground7、信号速率：signal rate8、信号标准化：signal standardization9、信号层：signal layer10、寄生信号：spurious signal11、串扰：crosstalk12、电容：capacitance13、电容耦合：capacitive coupling14、电磁干扰：electromagnetic interference15、电磁屏蔽：electromangetic shielding17、电磁兼容性：electromagnetic compatbility18、特性阻抗：impedance19、阻抗匹配：impedance match20、电感：inductance21、延迟：delay22、微带线：microstrip23、带状线：stripline24、探测点：probe point25、开窗口：cross hatching26、跨距：span27、共面性（度）：coplanarity28、埋入电阻：buried resistance29、黄金板：golden board30、芯板：core board31、薄基芯：thin core32、非均衡传输线：unbalanced transmission line33、阀值：threshold34、极限值：threshold limit value(TLV)35、散热层：heat sink plane36、热隔离：heat sink plane37、导通孔堵塞：via filiing39、卡板：card40、卡板盒/卡板柜：card cages/card racks41、薄型多层板：thin type multilayer board42、埋/盲孔多层板：43、模块：module44、单芯片模块：single chip module (SCM)45、多芯片模块：multichip module (MCM)46、多芯片模块层压基板：laminate substrate version of multichip module (MCM-L)47、多芯片模块瓷基数板：ceramic substrate version o fmultichip module (MCM-C)48、多芯片模块薄膜基板：deposition thin film substrate version of multilayer mod ule (MCM-D)49、嵌入凸块互连技术：buried bump interconnection technology (B2 it)50、自动测试技术：automatic test equipment (ATE)51、芯板导通孔堵塞：core board viafilling52、对准标记：alignment mark53、基准标记：fiducial mark54、拐角标记：corner mark55、剪切标记：crop mark56、铣切标记：routing mark57、对位标记：registration mark58、缩减标记：reduvtion mark59、层间重合度：layer to layer registration60、狗骨结构：dog hone61、热设计：thermal design62、热阻：thermal resistance翱世电子科技，为您提供芯片采购、PCB设计、打样贴片一体化服务！jewwww等级：一级普工文章：46积分：419注册：2006年9月20日发表于2006-9-21 21:38:00第10楼线路板（PCB）常用度量衡单位术语换算1英尺=12英寸1英寸inch=1000密尔mil1mil=25.4um1mil=1000uin mil密耳有时也成英丝1um=40uin（有些公司称微英寸为麦，其实是微英寸）1OZ=28.35克/平方英尺=35微米H=18微米4mil/4mil=0.1mm/0.1mm线宽线距1ASD=1安培/平方分米=10.76安培/平方英尺1AM=1安培分钟=60库仑主要用于贵金属电镀如镀金1平方分米=10.76平方英尺1盎司=28.35克,此为英制单位1加仑(英制)=4.5升1加仑美制=3.785升1KHA=1000安小时1安培小时=3600库仑比重波美度=145-145/比重SG.SG.比重（克/立方厘米）=145/（145-波美度)翱世电子科技，为您提供芯片采购、PCB设计、打样贴片一体化服务！jewwww等级：一级普工文章：46积分：419注册：2006年9月20日发表于2006-9-21 21:38:00第11楼PCB外观及功能性测试相关术语1.综合词汇1.1 as received 验收态提交验收的产品尚未经受任何条件处理,在正常大气条件下机械试验时阿状态1.2 production board 成品板符合设计图纸,有关规和采购要求的,并按一个生产批生产出来的任何一块印制板1.3 test board 测试板用相同工艺生产的,用来确定一批印制板可接受性的一种印制板.它能代表该批印制板的质量1.4 test pattern 测试图形用来完成一种测试用的导电图形.图形可以是生产板上的一部分导电图形或特殊设计的专用测试图形,这种测试图形可以放在附连测试板上液可以放在单独的测试板上(coupon)1.5 composite test pattern 综合测试图形两种或两种以上不同测试图形的结合,通常放在测试板上1.6 quality conformance test circuit 质量一致性检验电路在制板包含的一套完整的测试图形,用来确定在制板上的印制板质量的可接受性1.7 test coupon 附连测试板质量一致性检验电路的一部分图形,用于规定的验收检验或一组相关的试验1.8storage life 储存期2外观和尺寸2.1 visual examination 目检用肉眼或按规定的放大倍数对物理特征进行的检查2.2 blister 起泡基材的层间或基材与导电箔之间,基材与保护性涂层间产生局部膨胀而引起局部分离的现象.它是分层的一种形式2.3 blow hole 气孔由于排气而产生的孔洞2.4 bulge 凸起由于部分层或纤维与树脂分离而造成印制板或覆箔板表面隆起的现象2.5 circumferential separation 环形断裂一种裂缝或空洞.它存在于围绕镀覆孔四周的镀层,或围绕引线的焊点,或围绕空心铆钉的焊点,或在焊点和连接盘的界面处2.6 cracking 裂缝金属或非金属层的一种破损现象,它可能一直延伸到底面.2.7 crazing 微裂纹存在于基材的一种现象,在织物交织处,玻璃纤维与树脂分离的现象.表现为基材表面下出现相连的白色斑点或十字纹,通常与机械应力有关2.8 measling 白斑发生在基材部的,在织物交织处,玻璃纤维与树脂分离的现象,表现位在基材表面下出现分散的白色斑点或十字纹,通常与热应力有关2.9 crazing of conformal coating 敷形涂层微裂纹敷形涂层表面和部呈现的细微网状裂纹2.10 delamination 分层绝缘基材的层间,绝缘基材与导电箔或多层板任何层间分离的现象。
中英文对照的PCB专业用语
中英文对照的PCB专业用语一、综合词汇1、印制电路：printed circuit2、印制线路：printed wiring3、印制板：printed board4、印制板电路：printed circuit board (pcb)5、印制线路板：printed wiring board(pwb)6、印制元件：printed component7、印制接点：printed contact8、印制板装配：printed board assembly9、板：board10、单面印制板：single-sided printed board(ssb)11、双面印制板：double-sided printed board(dsb)12、多层印制板：mulitlayer printed board(mlb)13、多层印制电路板：mulitlayer printed circuit board14、多层印制线路板：mulitlayer prited wiring board15、刚性印制板：rigid printed board16、刚性单面印制板：rigid single-sided printed borad17、刚性双面印制板：rigid double-sided printed borad18、刚性多层印制板：rigid multilayer printed board19、挠性多层印制板：flexible multilayer printed board20、挠性印制板：flexible printed board21、挠性单面印制板：flexible single-sided printed board22、挠性双面印制板：flexible double-sided printed board23、挠性印制电路：flexible printed circuit (fpc)24、挠性印制线路：flexible printed wiring25、刚性印制板：flex-rigid printed board, rigid-flex printed board26、刚性双面印制板：flex-rigid double-sided printed board, rigid-flex double-sided printed27、刚性多层印制板：flex-rigid multilayer printed board, rigid-flex multilayer printed board28、齐平印制板：flush printed board29、金属芯印制板：metal core printed board30、金属基印制板：metal base printed board31、多重布线印制板：mulit-wiring printed board32、陶瓷印制板：ceramic substrate printed board33、导电胶印制板：electroconductive paste printed board34、模塑电路板：molded circuit board35、模压印制板：stamped printed wiring board36、顺序层压多层印制板：sequentially-laminated mulitlayer37、散线印制板：discrete wiring board38、微线印制板：micro wire board39、积层印制板：buile-up printed board40、积层多层印制板：build-up mulitlayer printed board (bum)41、积层挠印制板：build-up flexible printed board42、表面层合电路板：surface laminar circuit (slc)43、埋入凸块连印制板：b2it printed board44、多层膜基板：multi-layered film substrate(mfs)45、层间全内导通多层印制板：alivh multilayer printed board46、载芯片板：chip on board (cob)47、埋电阻板：buried resistance board48、母板：mother board49、子板：daughter board50、背板：backplane51、裸板：bare board52、键盘板夹心板：copper-invar-copper board53、动态挠性板：dynamic flex board54、静态挠性板：static flex board55、可断拼板：break-away planel56、电缆：cable57、挠性扁平电缆：flexible flat cable (ffc)58、薄膜开关：membrane switch59、混合电路：hybrid circuit60、厚膜：thick film61、厚膜电路：thick film circuit62、薄膜：thin film63、薄膜混合电路：thin film hybrid circuit64、互连：interconnection65、导线：conductor trace line66、齐平导线：flush conductor67、传输线：transmission line68、跨交：crossover69、板边插头：edge-board contact70、增强板：stiffener71、基底：substrate72、基板面：real estate73、导线面：conductor side74、元件面：component side75、焊接面：solder side76、印制：printing77、网格：grid78、图形：pattern79、导电图形：conductive pattern80、非导电图形：non-conductive pattern81、字符：legend82、标志：mark二、基材：1、基材：base material2、层压板：laminate3、覆金属箔基材：metal-clad bade material4、覆铜箔层压板：copper-clad laminate (ccl)5、单面覆铜箔层压板：single-sided copper-clad laminate6、双面覆铜箔层压板：double-sided copper-clad laminate7、复合层压板：composite laminate8、薄层压板：thin laminate9、金属芯覆铜箔层压板：metal core copper-clad laminate10、金属基覆铜层压板：metal base copper-clad laminate11、挠性覆铜箔绝缘薄膜：flexible copper-clad dielectric film12、基体材料：basis material13、预浸材料：prepreg14、粘结片：bonding sheet15、预浸粘结片：preimpregnated bonding sheer16、环氧玻璃基板：epoxy glass substrate17、加成法用层压板：laminate for additive process18、预制内层覆箔板：mass lamination panel19、内层芯板：core material20、催化板材：catalyzed board ,coated catalyzed laminate21、涂胶催化层压板：adhesive-coated catalyzed laminate22、涂胶无催层压板：adhesive-coated uncatalyzed laminate23、粘结层：bonding layer24、粘结膜：film adhesive25、涂胶粘剂绝缘薄膜：adhesive coated dielectric film26、无支撑胶粘剂膜：unsupported adhesive film27、覆盖层：cover layer (cover lay)28、增强板材：stiffener material29、铜箔面：copper-clad surface30、去铜箔面：foil removal surface31、层压板面：unclad laminate surface32、基膜面：base film surface33、胶粘剂面：adhesive faec34、原始光洁面：plate finish35、粗面：matt finish36、纵向：length wise direction37、模向：cross wise direction38、剪切板：cut to size panel39、酚醛纸质覆铜箔板：phenolic cellulose paper copper-clad laminates(phenolic/paper ccl)40、环氧纸质覆铜箔板：epoxide cellulose paper copper-clad laminates (epoxy/paper ccl)41、环氧玻璃布基覆铜箔板：epoxide woven glass fabric copper-clad laminates42、环氧玻璃布纸复合覆铜箔板：epoxide cellulose paper core, glass cloth surfaces copper-clad laminates43、环氧玻璃布玻璃纤维复合覆铜箔板：epoxide non woven/woven glass reinforced copper-clad laminates44、聚酯玻璃布覆铜箔板：ployester woven glass fabric copper-clad laminates45、聚酰亚胺玻璃布覆铜箔板：polyimide woven glass fabric copper-clad laminates46、双马来酰亚胺三嗪环氧玻璃布覆铜箔板：bismaleimide/triazine/epoxide woven glass fabric copper-clad lamimates47、环氧合成纤维布覆铜箔板：epoxide synthetic fiber fabric copper-clad laminates48、聚四乙烯玻璃纤维覆铜箔板：teflon/fiber glass copper-clad laminates49、超薄型层压板：ultra thin laminate50、陶瓷基覆铜箔板：ceramics base copper-clad laminates51、紫外线阻挡型覆铜箔板：uv blocking copper-clad laminates三、基材的材料1、a阶树脂：a-stage resin2、b阶树脂：b-stage resin3、c阶树脂：c-stage resin4、环氧树脂：epoxy resin5、酚醛树脂：phenolic resin6、聚酯树脂：polyester resin7、聚酰亚胺树脂：polyimide resin8、双马来酰亚胺三嗪树脂：bismaleimide-triazine resin9、丙烯酸树脂：acrylic resin10、三聚氰胺甲醛树脂：melamine formaldehyde resin11、多官能环氧树脂：polyfunctional epoxy resin12、溴 费跏髦 篵rominated epoxy resin13、环氧酚醛：epoxy novolac14、氟树脂：fluroresin15、硅树脂：silicone resin16、硅烷：silane17、聚合物：polymer18、无定形聚合物：amorphous polymer19、结晶现象：crystalline polamer20、双晶现象：dimorphism21、共聚物：copolymer22、合成树脂：synthetic23、热固性树脂：thermosetting resin24、热塑性树脂：thermoplastic resin25、感光性树脂：photosensitive resin26、环氧当量：weight per epoxy equivalent (wpe)27、环氧值：epoxy value28、双氰胺：dicyandiamide29、粘结剂：binder30、胶粘剂：adesive31、固化剂：curing agent32、阻燃剂：flame retardant33、遮光剂：opaquer34、增塑剂：plasticizers35、不饱和聚酯：unsatuiated polyester36、聚酯薄膜：polyester37、聚酰亚胺薄膜：polyimide film (pi)38、聚四氟乙烯：polytetrafluoetylene (ptfe)39、聚全氟乙烯丙烯薄膜：perfluorinated ethylene-propylene copolymer film (fep)40、增强材料：reinforcing material41、玻璃纤维：glass fiber42、e玻璃纤维：e-glass fibre43、d玻璃纤维：d-glass fibre44、s玻璃纤维：s-glass fibre45、玻璃布：glass fabric46、非织布：non-woven fabric47、玻璃纤维垫：glass mats48、纱线：yarn49、单丝：filament50、绞股：strand51、纬纱：weft yarn52、经纱：warp yarn53、但尼尔：denier54、经向：warp-wise55、纬向：weft-wise, filling-wise56、织物经纬密度：thread count57、织物组织：weave structure58、平纹组织：plain structure59、坏布：grey fabric60、稀松织物：woven scrim61、弓纬：bow of weave62、断经：end missing63、缺纬：mis-picks64、纬斜：bias65、折痕：crease66、云织：waviness67、鱼眼：fish eye68、毛圈长：feather length69、厚薄段：mark70、裂缝：split71、捻度：twist of yarn72、浸润剂含量：size content73、浸润剂残留量：size residue74、处理剂含量：finish level75、浸润剂：size76、偶联剂：couplint agent77、处理织物：finished fabric78、聚酰胺纤维：polyarmide fiber79、聚酯纤维非织布：non-woven polyester fabric80、浸渍绝缘纵纸：impregnating insulation paper81、聚芳酰胺纤维纸：aromatic polyamide paper82、断裂长：breaking length83、吸水高度：height of capillary rise84、湿强度保留率：wet strength retention85、白度：whitenness86、陶瓷：ceramics87、导电箔：conductive foil88、铜箔：copper foil89、电解铜箔：electrodeposited copper foil (ed copper foil)90、压延铜箔：rolled copper foil91、退火铜箔：annealed copper foil92、压延退火铜箔：rolled annealed copper foil (ra copper foil)93、薄铜箔：thin copper foil94、涂胶铜箔：adhesive coated foil95、涂胶脂铜箔：resin coated copper foil (rcc)96、复合金属箔：composite metallic material97、载体箔：carrier foil98、殷瓦：invar99、箔（剖面）轮廓：foil profile100、光面：shiny side101、粗糙面：matte side102、处理面：treated side103、防锈处理：stain proofing104、双面处理铜箔：double treated foil四、设计1、原理图：shematic diagram2、逻辑图：logic diagram3、印制线路布设：printed wire layout4、布设总图：master drawing5、可制造性设计：design-for-manufacturability6、计算机辅助设计：computer-aided design.(cad)7、计算机辅助制造：computer-aided manufacturing.(cam)8、计算机集成制造：computer integrat manufacturing.(cim)9、计算机辅助工程：computer-aided engineering.(cae)10、计算机辅助测试：computer-aided test.(cat)11、电子设计自动化：electric design automation .(eda)12、工程设计自动化：engineering design automaton .(eda2)13、组装设计自动化：assembly aided architectural design. (aaad)14、计算机辅助制图：computer aided drawing15、计算机控制显示：computer controlled display .(ccd)16、布局：placement17、布线：routing18、布图设计：layout19、重布：rerouting20、模拟：simulation21、逻辑模拟：logic simulation22、电路模拟：circit simulation23、时序模拟：timing simulation24、模块化：modularization25、布线完成率：layout effeciency26、机器描述格式：machine descriptionm format .(mdf)27、机器描述格式数据库：mdf databse28、设计数据库：design database29、设计原点：design origin30、优化（设计）：optimization (design)31、供设计优化坐标轴：predominant axis32、表格原点：table origin33、镜像：mirroring34、驱动文件：drive file35、中间文件：intermediate file36、制造文件：manufacturing documentation37、队列支撑数据库：queue support database38、元件安置：component positioning39、图形显示：graphics dispaly40、比例因子：scaling factor41、扫描填充：scan filling42、矩形填充：rectangle filling43、填充域：region filling44、实体设计：physical design45、逻辑设计：logic design46、逻辑电路：logic circuit47、层次设计：hierarchical design48、自顶向下设计：top-down design49、自底向上设计：bottom-up design50、线网：net51、数字化：digitzing52、设计规则检查：design rule checking53、走（布）线器：router (cad)54、网络表：net list55、计算机辅助电路分析：computer-aided circuit analysis56、子线网：subnet57、目标函数：objective function58、设计后处理：post design processing (pdp)59、交互式制图设计：interactive drawing design60、费用矩阵：cost metrix61、工程图：engineering drawing62、方块框图：block diagram63、迷宫：moze64、元件密度：component density65、巡回售货员问题：traveling salesman problem66、自由度：degrees freedom67、入度：out going degree68、出度：incoming degree69、曼哈顿距离：manhatton distance70、欧几里德距离：euclidean distance71、网络：network72、阵列：array73、段：segment74、逻辑：logic75、逻辑设计自动化：logic design automation76、分线：separated time77、分层：separated layer78、定顺序：definite sequence五、形状与尺寸：1、导线（通道）：conduction (track)2、导线（体）宽度：conductor width3、导线距离：conductor spacing4、导线层：conductor layer5、导线宽度/间距：conductor line/space6、第一导线层：conductor layer no.17、圆形盘：round pad8、方形盘：square pad9、菱形盘：diamond pad10、长方形焊盘：oblong pad11、子弹形盘：bullet pad12、泪滴盘：teardrop pad13、雪人盘：snowman pad14、v形盘：v-shaped pad15、环形盘：annular pad16、非圆形盘：non-circular pad17、隔离盘：isolation pad18、非功能连接盘：monfunctional pad19、偏置连接盘：offset land20、腹（背）裸盘：back-bard land21、盘址：anchoring spaur22、连接盘图形：land pattern23、连接盘网格阵列：land grid array24、孔环：annular ring25、元件孔：component hole26、安装孔：mounting hole27、支撑孔：supported hole28、非支撑孔：unsupported hole29、导通孔：via30、镀通孔：plated through hole (pth)31、余隙孔：access hole32、盲孔：blind via (hole)33、埋孔：buried via hole34、埋/盲孔：buried /blind via35、任意层内部导通孔：any layer inner via hole (alivh)36、全部钻孔：all drilled hole37、定位孔：toaling hole38、无连接盘孔：landless hole39、中间孔：interstitial hole40、无连接盘导通孔：landless via hole41、引导孔：pilot hole42、端接全隙孔：terminal clearomee hole43、准表面间镀覆孔：quasi-interfacing plated-through hole44、准尺寸孔：dimensioned hole45、在连接盘中导通孔：via-in-pad46、孔位：hole location47、孔密度：hole density48、孔图：hole pattern49、钻孔图：drill drawing50、装配图：assembly drawing51、印制板组装图：printed board assembly drawing52、参考基准：datum referance。
PCB术语中英文对照表
Adhesion 附着力Annular Ring 孔环AOI（automatic optical inspection）自动光学检测AQL（acceptable quality level）可接受的质量等级B²it(buried bump interconnection technology) 埋入凸块焊点互连技术BBH(buried blind hole) 埋盲孔BGA(ball grid array) 球栅阵列Blister 起泡Board Edges 板边Burr 毛头/毛刺BUM(Build-up multilayer) 积层式多层板BVH（buried/blind via hole）埋/盲导通孔CAD(computer aided design) 计算机辅助设计CAM(computer aided manufacturing) 计算机辅助制造Carbon oil 碳油CEM(composite epoxy material) 环氧树脂复合板材chamfer 倒角Characteristic impedance 特性阻抗CNC（computerized numerical control）计算机化数字控制Conductor Crack 导体破裂Conductor Spacing 导线间距connector 连接器Copper foil 铜箔（皮）Crazing 微裂纹(白斑)Delamination 分层Dewetting 半润湿(缩锡)DFM（design for manufacturing）可制造性设计DIP(dual in-line package) 双列直插式组件Dk（dielectric constant）介电常数DRC(design rule checking) 设计规则检查drawing 图纸ECN(engineering change notice) 工程更改通知ECO(engineering change order) 工程更改指令E glass 电子级玻璃entek OSP处理Epoxy resin 环氧树脂ESD(electrostatic discharge) 静电释放Etched Marking 蚀刻标记Flatness 翘曲度Foreign Inclusion 外来夹杂物Flame resistant 阻燃性FR-2(flame-retardant 2)耐燃酚醛纸基板FR-3(flame-retardant 3) 耐燃环氧纸基板FR-4(flame-retardant 4) 耐燃环氧玻璃布基板FR-5(flame-retardant 5) 耐燃多功能环氧玻璃布基板ground 地面（层）Haloing 晕圈HDI(high density interconnection) 高密度互连技术HASL(hot air solder leveling) 热风焊料整平（整平）IC(integrated circuits) 集成电路Ink Stamped Marking 盖印标记Insulation resistance 绝缘电阻Ion cleanliness 离子清洁度IPC(the institute for interconnecting and packaging of electronic circu its) 印制电路互连与封装协会ISO(International organization for standardization) 国际标准化组织Laminate Voids 压合空洞laser 激光LDI(laser direct imaging) 激光直接成像legend 文字标记、符号Lifted Lands 焊盘浮起logo 标志LPI(liquid photoimageable) 液态感光成像LPISM(liquid photoimageable solder mask) 液态感光阻焊膜marking 标记Measling 白斑Microvoids 微坑mil 密耳（千分之一英寸）MIL-STD(military standard) 美国军用标准Negative Etchback 欠蚀Nicks 缺口Nodules 镀镏Nonwetting 不润湿(拒锡)open 开路OSP(organic solderability preservatives) 表面抗氧化oxides 氧化物pad 焊盘panel 拼板pattern 板面图形PCB(printed circuit board) 印制电路板Pcs(pieces) 件、片、只Peeling 剥落pinhole 针孔Pink Ring 粉红圈Pits 凹坑pitch 中心距Plating Voids 镀层破洞plug 塞Positive Etchback 过蚀power 电源层prepreg 半固化片PTFE(polytetrafluoroethylene) 聚四氟乙烯PTH(plated through-hole) 金属化孔PWB(printed-wiring board) 印制线路板Registration 对准QA(quality assurance) 质量保证QC(quality control) 质量控制QE(quality engineering) 质量工程QFP(quad flat package) 方形扁平组件repair 修理RCC(resin coated copper) 已涂覆树脂的铜箔Reference dimension 参考尺寸registration 对准度resin 树脂rejection 拒收revision 修订版RF(radio frequency) 射频Ripples 纹路rout 外形铣scratch 划伤Screened Marking 纲印标记scoring 刻槽short 短路signal 信号Silk screen 丝网Skip Coverage 漏印slot 开槽SMD(surface mount device) 表面安装器件SMOBC(solder mask over bare copper) 裸铜覆盖阻焊膜SMT(surface mount technology) 表面安装技术smear 毛刺solder 焊锡S/M(solder mask) 绿油solderability 可焊性Soda Strawing (汽水)吸管式浮空SPC（statistical process control）统计过程控制spacing 间距Tape test 胶带实验TCE（thermal coefficient of expansion）热胀系数TDR（time-domain reflectometry）时域反射测试tolerance 公差Tenting 盖孔Texture Condition 显布纹Tg(glass transition temperature) 玻璃软化温度THT(through hole technology) 通孔（插装）技术trace 线路（条）UL(underwriters laboratories) 安全实验所NPTH 非金属化孔UV(ultraviolet) 紫外线辐射v-cut V刻Via hole 导通孔（过线孔）void 空洞warp 板弯Waves 波浪Weave Exposure 露织物wetting 沾锡Wicking 灯芯效应（渗铜）Wrinkles 起皱五、形状与尺寸：1、导线（通道）：conduction (track)2、导线（体）宽度：conductor width3、导线距离：conductor spacing4、导线层：conductor layer5、导线宽度/间距：conductor line/space6、第一导线层：conductor layer7、圆形盘：round pad8、方形盘：square pad9、菱形盘：diamond pad10、长方形焊盘：rectangle pad11、子弹形盘：bullet pad12、泪滴盘：teardrop pad13、雪人盘：snowman pad14、v形盘：v-shaped pad15、环形盘：annular pad16、非圆形盘：non-circular pad17、隔离盘：isolation pad18、非功能连接盘：monfunctional pad19、偏置连接盘：offset land20、腹（背）裸盘：back-bard land21、盘址：anchoring spaur22、连接盘图形：land pattern23、连接盘网格阵列：land grid array24、孔环：annular ring25、元件孔：component hole26、安装孔：mounting hole27、支撑孔：supported hole28、非支撑孔：unsupported hole29、导通孔：via30、镀通孔：plated through hole (pth)31、余隙孔：access hole32、盲孔：blind via (hole)33、埋孔：buried via hole34、埋/盲孔：buried /blind via35、任意层内部导通孔：any layer inner via hole (alivh)36、全部钻孔：all drilled hole37、定位孔：toaling hole38、无连接盘孔：landless hole39、中间孔：interstitial hole40、无连接盘导通孔：landless via hole41、引导孔：pilot hole42、端接全隙孔：terminal clearomee hole43、准表面间镀覆孔：quasi-interfacing plated-through hole44、准尺寸孔：dimensioned hole45、在连接盘中导通孔：via-in-pad46、孔位：hole location47、孔密度：hole density48、孔图：hole pattern49、钻孔图：drill drawing50、装配图：assembly drawing51、印制板组装图：printed board assembly drawing52、参考基准：datum referance。
PCB行业最常用术语之中英文对照
PCB行业最常用术语之中英文对照(按字母检索)A/W (artwork) 底片Ablation 烧溶(laser),切除abrade 粗化abrasion resistance 耐磨性absorption 吸收ACC ( accept ) 允收accelerated corrosion test 加速腐蚀accelerated test 加速试验acceleration 速化反应accelerator 加速剂acceptable 允收activator 活化液active work in process 实际在制品adhesion 附着力adhesive method 黏着法air inclusion 气泡air knife 风刀amorphous change 不定形的改变amount 总量amylnitrite 硝基戊烷analyzer 分析仪anneal 回火annular ring 环状垫圈;孔环anode slime (sludge) 阳极泥anodizing 阳极处理AOI ( automatic optical inspection ) 自动:光学检测applicable documents 引用之文件AQL sampling 允收水准抽样aqueous photoresist 液态光阻aspect ratio 纵横比(厚宽比)As received 到货时back lighting 背光back-up 垫板banked work in process 预留在制品base material 基材baseline performance 基准绩效batch 批beta backscattering 贝他射线照射法beveling 切斜边;斜边biaxial deformation 二方向之变形black-oxide 黑化blank controller 空白对照组blank panel 空板blanking 挖空blip 弹开blister 气泡;起泡blistering 气泡blow hole 吹孔board-thickness error 板厚错误bonding plies 黏结层bow ; bowing 板弯break out 从平环内破出bridging 搭桥;桥接BTO (Build To Order) 接单生产burning 烧焦burr 毛边(毛头)camcorder 一体型摄录放机carbide 碳化物carlson pin 定位梢carrier 载运剂catalyzing 催化catholic sputtering 阴极溅射法caul plate 隔板;钢板calibration system requirements 校验系统之各种要求center beam method 中心光束法central projection 集中式投射线certification 认证chamfer 倒角(金手指)chamfering 切斜边;倒角characteristic impedance 特性阻抗charge transfer overpotential 电量传递过电压chase 网框checkboard 棋盘chelator 蟹和剂chemical bond 化学键chemical vapor deposition 化学蒸着镀circumferential void 圆周性之孔破clad metal 包夹金属clean room 无尘室clearance 间隙coat 镀外表coating error 防焊覆盖错误coefficient of thermal expansion (CTE) 热澎胀系数cold solder joint 冷焊点cold-weld 金属粉末冷焊color 颜色color error 颜色错误compensation 补偿competitive performance 竞争力绩效complex salt 错化物complexor 错化物component hole 零件孔component side 零件面concentric 同心conformance 密贴性consumer products 消费性产品contact resistance 接触电阻continuous performance 连续发挥效能contract service 协力厂controlled split 均裂式conventional flow 乱流方式conventional tensile test 传统张力测试法conversion coating 转化层convex 突出coordinate list 数据清单copper claded laminates (CCL) 铜箔基板copper exposure 线路露铜copper mirror 镜铜copper pad 铜箔圆配copper residue (copper splash) 铜渣corrosion rate numbering 腐蚀速率计数系统corrosion resistance 抗蚀性coulombs law 库伦定律countersink 喇叭孔coupon 试样coupon location 试样点covering power 遮盖力CPU 中央处理器crack 破裂;裂痕crazing 裂痕;白斑cross linking 交联聚合cross talk 呼应作用crosslinking 交联crystal collection 结晶收集curing 聚合体current efficiency 电流效率cut-outs 挖空cutting 裁板cyanide 氰化物cycles of learning 学习循环cycle-time reduction 交期缩短date code 周期deburring 去毛头dedicated 专用型degradation 退变delamination 分层dent / pin hole 凹陷/ 针孔department of defense 国防部designation 字码简示法de-smear 除胶渣developing 显影dewetting 缩锡dewetting time 缩锡时间dimension error 外形尺寸错误dielectric constant 介质常数difficulty 困难度difunctional 双功能dimension 尺寸dimension stability 尺寸安定性dimensional stability 尺度安定性dimension and tolerance 尺寸与公差dirty hole 孔内异物discolor hole 孔黑;孔灰;氧化discoloration 变色disposable eyelet method 消耗性铆钉法distortion factor 尺寸变形函数double side 双面板downtime 停机时间drill 钻孔drill bit 钻头drill facet 钻尖切萷面drill pointer 钻尖重(研)磨机drilled blank board 已钻孔之裸板drilling 钻孔dry film 干膜ductility 延展性economy of scale 经济规模edge spacing 板边空地edge-board contact ( gold finger ) 金手指efficiency 能量效率electric test 电测electrical testing 电测;测试electrochemical machine ECM 电化学加工法electrochemical reactor 电化学反应器electroforming 电铸electroless plate 化学铜electroless-deposition 无电镀electropolishing 电解拋光electrorefining 电解精炼electrowinning 电解萃取elliptical set 椭圆形embrittlement 脆性entitlement performance 可达成绩效entrapment 电镀夹杂物epoxy 环氧树酯equipotential 电位线error data file 异常情形etch rate 蚀铜速率etchants 蚀刻液etchback 回蚀evaluation program 评估用程序exposure 曝光external pin method 外部插梢法eyelet hole 铆钉孔Eyeletting 铆眼fabric 网布failure 故障fast response 快速响应fault 瑕庛;缺陷fiber exposure 纤维显露fiber protrusion 纤维突出fiducial mark 光学点,基准记号filler 填充料film 底片filtration 过滤finished board 成品fixing 固着fixture 电测夹具(治具)flaking off 粹离flammability rating 燃性等级flare 喇叭形孔flat cable 并排电缆feedback loop 回馈循环first-in-first-out (FIFO) 先进先出flexible manufacturing system (FMS) 弹性制造系统flux 助焊剂foil distortion 铜层变形fold 空泡foreign include 异物foreign material 基材内异物free radical chain polymerization 自由基连锁聚合fully additive 加成法fully annealed type 彻底回火轫化之类形function 函数fundamental and basic 基本fungus resistance 抗霉性funnel flange 喇叭形折翼galvanized 加法尼化制程gap 钻尖分开gauge length 有效长度gel time 胶化时间general resist ink 一般阻剂油墨general 通论general industrial 一般性(电子)工业级geometrical levelling 几何平整glass transition temperature (Tg) 玻璃态转换温度Gold 金gold finger 金手指gold plating 镀金golden board 标准板gouges 刷磨凹沟gouging 挖破grain boundary 金属晶体之四边green 绿色grip 夹头ground plane 接地层ground plane clearance 接地空环hackers 骇客HAL ( hot air leveling ) 喷锡haloing 白边;白圈hardener 硬化剂hardness 硬度hepa filter 空气滤清器high performance industrial 高性能(电子)工业级high reliability 高可靠度high resolution 高分辨率high temperature elongation (HTE) 高温延展性铜箔high temperature epoxy (HTE) 高温树酯hit 击hole counter 数孔机hole diameter 孔径hole diameter error 孔径错误hole location 孔位hole number 孔数hole wall quality 孔壁品质hook 外弧hot dip 热浸法hull cell 哈氏槽hybrid 混成集成电路hydrogen bonding 氢键hydrolysis 水解hydrometallurgy 湿法冶金法image analysis system 影像分析系统image transfer 影像转移immersion gold 浸金(化镍金) immersion plating 浸镀法impedance 阻抗infrared reflow 红外线重熔inhibitor 热聚合抑制剂injection mold 射模ink 油墨innerlayer & outlayer 内外层insulation resistance 绝缘电阻intended position 应该在的位置intensifier 增强器intensity 强度inter molecular exchange 交互改变interconnection 互相连通ionic contaminants 离子性污染物ionic contamination testing 离子污染试验IPA 异丙醇5I : inspiration (启蒙)identification 确认计划目标implementation 改善方案information 数据internalization 制度化invisible inventory 无形的库存knife edges 刀缘Knoop 努普(硬度单位)kraft paper 牛皮纸laminar flow 层流laminate 基层板laminating 压合lamination 压合laminator 压膜机land 焊垫lay back 刃角磨损lay up 组合叠板layout 布线;布局lead screw 牵引螺丝leakage 漏电learning curve 学习曲线legend 文字标记leveling 平整levelling additive 平整剂levelling power 平整力life support 维系生命limiting current 极限电流line space 线距line width 线宽linear variable differential transformer(LVDL) 线性可变差动:转换器liquid 液状(态)liquid crystal resins 液晶树脂liquid photoimageable solder resist ink 液态感光防焊油墨liquid photoresist ink 液态光阻剂油墨lot size 批量lower carrier 底部承载板mechanical plating 机祴镀法machine scrub 刷磨清洁法macrothrowing power 巨分布力margin 钻头刃带market share 市场占有率marking error 文字错误masked leveling 儰装平整mass lamination 大型压板mass transfer 质量传送效应mass transfer overpotential 质量传递过电压mass transportation 质传master drawing 主图;蓝图material use factor 材料使用率mealing 泡点;白点memory 记忆装置meniscograph solderability measurement 新月型焊锡效果microetch 微蚀microetching 微蚀microfocus 微焦距microfocus system 微焦距系统microprofile 微表面microsectioning 微切片法microthrowing power 微分布力migration 迁移mini-tensile tester 迷你拉力测试仪mis hole location 孔位错误misregistration 焊锡面与零件面对位偏差misregsitration 对不准moisture and insulation resistance test 湿气与绝缘电阻试验molded circuit board (MCB) 模制电路板monoethanal amine 单乙醇氨monohydrate state 水化物monomer 单分子膜;单体mouse bite 锯齿;蚀刻缺口msec 毫秒muffle furnace 高温焚火炉multichip 超大IC型(多芯片模块)mylar 保护膜nail head 钉头NC drill 数字钻孔机negative etchback 反回蚀negative film 负片negative rake angle 负抠耙角network 回路;网络neutralization 中和nick 缺口nickel 镍nodule 铜瘤;瘤粒no flow resin 不流树脂noise 噪声nominal 标示nominal dimension 标定长度nominal gel time 标示胶性时间nominal resin content 标示胶含量nominal resin flow 标示胶流量nominal scaled flow thickness 标示比例流量厚度OA equip 办公室自动:化设备obsolescence factor 报废因素OEM 原设备制造商offset-list 补偿数据清单ohmmeter 欧姆计open 断路open circuits 断路open short testing 断短路测试opening 开口original art work (A/W) 原稿底片Others 其它outgrowth 增出over design 牛刀杀鸡overlap 钻尖重叠overlay entry 盖板overpotential 过电压oxidation 氧化oxide treatment 黑化处理oxided cytochrome 氧化性之细包色素oxygen evolution 氧气发生反应packed bed 充填床式pad 锡垫;圆配pad copper exposure pad露铜panel 小型板面;母板panel plating 一次铜电镀parasitic 寄生的part no. 料号pattern plating 二次铜电镀PCB ( print circuit board ) 印刷电路板pcs 片peel strength 抗撕强度peeling off 剥离(剥落) performance specification 性能规范permittivity 透电率perspectives on experience 经验透视PET 聚酯photodiode detector 发光二极管侦测器photo initiator 感光启始剂photoresist 光阻phototool 光具(指工作底片)piece 子板面pinceton applied research 腐蚀测定仪pink ring 粉红圈pit 凹点pitch 脚距planar 平面plating 电镀plating exposure 下镀层露出plug gauge 插规plug hole 孔塞PNL (panel) 排板polar-polar interaction 极性之间的吸力polyester 聚酯类polyglycols 聚乙二醇polyimide 聚亚醯氨poor bevelling 磨边加工引起突起,剥离poor drill 孔形不良poor HAL 喷锡不良poor marking 字体不良poor pad 锡垫不良poor printed 印刷偏差poor solderability 焊锡性不良poor touch-up 补线不良position control system 位置控制系统positive rake angle 正抠耙角power curve model 幕次曲线模式practice 工艺惯例preferred 良好premature tearing 提前撕裂prepolymer 预聚合物prepreg 胶片pre-process ( front-end) 制前press 压床press cycle 压合周期primary current distribution 一次电流分布primary 主要product lifetimes 生命周期product process 制程promoter 促进剂protocal 初步资料prussic acid 普鲁士酸PTF-based process 厚膜糊法PTH (plating though hole) 导通孔pull away 拉开pumice 浮石粉pumice scrub 喷砂清洁法pyrometallurgy 火烧法冶炼QC ( quality control) 品管QFP (quad flat pack ) 扁方型封装体qualification inspection 资格审查检验qualification testing 资格检定quality classification 品质等级quantitative 计量式测试rack 挂架radiometer 能量剂rake angle 抠耙角RAM [Random Access Memory 随机存取内存real time 关键时刻recessed trace process 凹槽线路法recovery tank 回收槽reduction 还原re-eninforcement 强化refraction 折光率reinforcement style 补强材料的型式register mark 对位用标记registration hole 对位孔registration pattern 长方形铜地REJ ( reject ) 退货;拒收rejectable 拒收release agent 脱模剂relief angle 浮离角remark 备注repair 修理resin content 树脂含量(胶含量)resin flow 胶流量resin flow percentage 树脂流量之百分率resin recession 树脂下陷resin smear 胶渣resist strippers 剥干膜剂resistor network 排列电阻resolution 解像度return on assets 资产报酬率reversibility 可逆性rework 重工rosin 天然松香rotating cylinder 旋转圆柱形roughtness 孔壁粗糙;粗慥routing 切外形,成型routing bit 铣刀runout 偏转S/L on hole 孔内沾文字S/M ( solder mask ), S/L 防焊文字S/M (solder mask) 防焊S/M error 防焊种类错误S/M on hole 孔内绿漆salt spray test 盐水喷雾试验sampling size 抽样数scope 范围scored 刻痕scoring 枢槽;刮线scrap 废框scratches 刮伤screen printing 网版印刷scum 透明残膜sealing 封孔处理secondary 次要semi-additive 半加成法sensitize 敏化sensitizer 敏化液separator 钢隔板sequential lamination 渐成式压法serrated edges 毛边shatter 破碎short 短路shunt 分路silane treatment 硅烷处理silicone coupling agent 硅烷偶合剂silk screen 文字印刷simulator 仿真器single axis 单轴sizing 底片之伸缩补偿skip 漏印skip printing 跳印;漏印sliver 丝条slot 开槽slotting 开槽SMD ( surface mount device ) 表面黏着组件smear 胶渣SMT ( surface mount technology )表面黏着技术sodium carbonate monohydrate 结晶水碳酸钠soft tooling 软性工具solder 焊锡; 锡铅solder bridge 锡桥solder bump 锡突solder float 漂锡solder mask adhesion 绿漆附着力solder on G/F 金手指沾锡solder on trace 线路沾锡solder plug 锡塞solder side 焊锡面solderability 焊锡性solid carbide 实质碳化物spacing 间距spacing nonenough 间距不足SPC ( Statistical Process Control ) 统计生管specification 规范special considerations 特别考虑spin coating 旋转涂布spindle 钻轴spiral contractometer 螺旋收缩仪spot face 铣靶spray coating 喷涂Squeegee 刮刀stacking structure 叠板结构stamping 冲压standard hydraulic lamination标准液压法standardizing 标准化starvation 缺胶step tablet 格片数stock option 认股选择权strain 应度strength 强度stressmeter 应力计subtractive 减除法surface convex 表面突起surface examination 表面检查surface insulation resistance (SIR) 表面绝缘电阻surface mount 表面黏着方式surface roughness 表面粗慥度surges 突波switch circuit 开关线路tab 金手指tack free 不黏taped hole gauge 锥形孔规target hole 靶孔task force 任务编组tensile strength 抗拉强度tensile stress 张性应力tent 浮盖terms and definitions 术语与定义termination load 抗匹配负载test circuit 测试线路test method 试验方法test point 测试点thermal shock 热震荡试验thermal stress 热应力试验thermistor 热电感应式thermo cycling 热循环试验theoretical cycle time 理论性周期时间thickness 厚度time to market 上市时机thickness distribution 厚度分布thief 补助阴极thin core 薄基板;内层板throwing power 分布力tolerance 公差;容差tooling hole 工具孔torque load 扭力拒之负载total quality program 全面的品质计划toughness 坚度trace error 线路错误trace nick & pin hole 线路缺口及针孔trace peeling 线路剥离trace pin-hole 线路针孔trace surface roughness 线路表面粗糙tarnish and oxide resist 抗污抗氧化剂transmittance 透光度trim line 裁切线true levelling 真平整true position 真正位置的孔;真位twist 板翘type 种类umbra 本影undercut 侧蚀uneven coating 喷锡厚镀不平整universal 万用型universal tensile tester 万用拉力试验机universal tester 泛用型测试机upper carrier 顶部承载钢uptime 稼动:时间vacuum deposition 真空蒸镀法vacuum hydraulic lamination真空液压法vaporizer 气化室V-cut V形槽vertical microsection 垂直微切片via hole 导通孔visible inventory 有形的库存vision inspection 目视检查V oid 孔破void in hole 孔壁上的破洞void in PTH hole 孔破walkman 随身听warehouse 仓库warp 板弯warp , warpage 板弯water absorption 吸水性wear resistance 耐磨度weave exposure 纤纹显露weave texture 织纹隐现wedge angle 契尖角week 周wet chemistry 湿式化学制程wet film 湿膜wet lamination 湿膜压膜法wet process 湿制程wetting 沾锡wetting balance 沾锡平衡法wicking 渗铜;渗入;灯蕊效应width 宽度width reduce 线细width-to-thickness ratio 宽度与厚度的比值window 操作范围work-in-process 在制品work order 工单working film 工作片working master 工作母片year 年yellow 金黄色yield 良率。
PCB专业用语-英汉对照
PCB专业用语-英汉对照：一、综合词汇:1、印制电路：printed circuit2、印制线路：printed wiring3、印制板：printed board4、印制板电路：printed circuit board (pcb)5、印制线路板：printed wiring board(pwb)6、印制元件：printed component7、印制接点：printed contact8、印制板装配：printed board assembly9、板：board 10、单面印制板：single-sided printed board(ssb) 11、双面印制板：double-sided printed board(dsb) 12、多层印制板：mulitlayer printed board(mlb) 13、多层印制电路板：mulitlayer printed circuit board 14、多层印制线路板：mulitlayer prited wiring board 15、刚性印制板：rigid printed board 16、刚性单面印制板：rigid single-sided printed borad 17、刚性双面印制板：rigid double-sided printed borad 18、刚性多层印制板：rigid multilayer printed board 19、挠性多层印制板：flexible multilayer printed board 20、挠性印制板：flexible printed board 21、挠性单面印制板：flexible single-sided printed board 22、挠性双面印制板：flexible double-sided printed board 23、挠性印制电路：flexible printed circuit (fpc) 24、挠性印制线路：flexible printed wiring 25、刚性印制板：flex-rigid printed board, rigid-flex printed board26、刚性双面印制板：flex-rigid double-sided printed board, rigid-flex double-sided printed 27、刚性多层印制板：flex-rigid multilayer printed board, rigid-flex multilayer printed board 28、齐平印制板：flush printed board 29、金属芯印制板：metal core printed board 30、金属基印制板：metal base printed board 31、多重布线印制板：mulit-wiring printed board 32、陶瓷印制板：ceramic substrate printed board 33、导电胶印制板：electroconductive paste printed board 34、模塑电路板：molded circuit board 35、模压印制板：stamped printed wiring board 36、顺序层压多层印制板：sequentially-laminated mulitlayer 37、散线印制板：discrete wiring board 38、微线印制板：micro wire board 39、积层印制板：buile-up printed board40、积层多层印制板：build-up mulitlayer printed board (bum)41、积层挠印制板：build-up flexible printed board 42、表面层合电路板：surface laminar circuit (slc) 43、埋入凸块连印制板：b2it printed board 44、多层膜基板：multi-layered film substrate(mfs) 45、层间全内导通多层印制板：alivh multilayer printed board 46、载芯片板：chip on board (cob) 47、埋电阻板：buried resistance board 48、母板：mother board 49、子板：daughter board 50、背板：backplane 51、裸板：bare board 52、键盘板夹心板：copper-invar-copper board 53、动态挠性板：dynamic flex board 54、静态挠性板：static flex board 55、可断拼板：break-away planel 56、电缆：cable 57、挠性扁平电缆：flexible flat cable (ffc) 58、薄膜开关：membrane switch 59、混合电路：hybrid circuit 60、厚膜：thick film 61、厚膜电路：thick film circuit 62、薄膜：thin film 63、薄膜混合电路：thin film hybrid circuit 64、互连：interconnection 65、导线：conductor trace line 66、齐平导线：flush conductor 67、传输线：transmission line 68、跨交：crossover 69、板边插头：edge-board contact 70、增强板：stiffener 71、基底：substrate 72、基板面：real estate 73、导线面：conductor side 74、元件面：component side 75、焊接面：solder side 76、印制：printing 77、网格：grid 78、图形：pattern 79、导电图形：conductive pattern 80、非导电图形：non-conductive pattern 81、字符：legend 82、标志：mark二、基材：1、基材：base material2、层压板：laminate3、覆金属箔基材：metal-clad bade material4、覆铜箔层压板：copper-clad laminate (ccl)5、单面覆铜箔层压板：single-sided copper-clad laminate6、双面覆铜箔层压板：double-sided copper-cladlaminate 7、复合层压板：composite laminate 8、薄层压板：thin laminate 9、金属芯覆铜箔层压板：metal core copper-clad laminate 10、金属基覆铜层压板：metal base copper-clad laminate11、挠性覆铜箔绝缘薄膜：flexible copper-clad dielectric film12、基体材料：basis material 13、预浸材料：prepreg 14、粘结片：bonding sheet 15、预浸粘结片：preimpregnated bonding sheer 16、环氧玻璃基板：epoxy glass substrate 17、加成法用层压板：laminate for additive process 18、预制内层覆箔板：mass lamination panel 19、内层芯板：core material 20、催化板材：catalyzed board ,coated catalyzed laminate 21、涂胶催化层压板：adhesive-coated catalyzed laminate 22、涂胶无催层压板：adhesive-coated uncatalyzed laminate 23、粘结层：bonding layer 24、粘结膜：film adhesive 25、涂胶粘剂绝缘薄膜：adhesive coated dielectric film 26、无支撑胶粘剂膜：unsupported adhesive film 27、覆盖层：cover layer (cover lay) 28、增强板材：stiffener material 29、铜箔面：copper-clad surface 30、去铜箔面：foil removal surface 31、层压板面：unclad laminate surface 32、基膜面：base film surface 33、胶粘剂面：adhesive faec 34、原始光洁面：plate finish 35、粗面：matt finish 36、纵向：length wise direction 37、模向：cross wise direction 38、剪切板：cut to size panel 39、酚醛纸质覆铜箔板：phenolic cellulose paper copper-clad laminates(phenolic/paper ccl) 40、环氧纸质覆铜箔板：epoxide cellulose paper copper-clad laminates (epoxy/paper ccl) 41、环氧玻璃布基覆铜箔板：epoxide woven glass fabric copper-clad laminates 42、环氧玻璃布纸复合覆铜箔板：epoxide cellulose paper core, glass cloth surfaces copper-clad laminates 43、环氧玻璃布玻璃纤维复合覆铜箔板：epoxide non woven/woven glass reinforced copper-clad laminates 44、聚酯玻璃布覆铜箔板：ployester woven glass fabric copper-clad laminates 45、聚酰亚胺玻璃布覆铜箔板：polyimide woven glass fabric copper-clad laminates 46、双马来酰亚胺三嗪环氧玻璃布覆铜箔板：bismaleimide/triazine/epoxide woven glass fabric copper-clad lamimates 47、环氧合成纤维布覆铜箔板：epoxide synthetic fiber fabric copper-clad laminates 48、聚四乙烯玻璃纤维覆铜箔板：teflon/fiber glass copper-clad laminates 49、超薄型层压板：ultra thin laminate 50、陶瓷基覆铜箔板：ceramics base copper-clad laminates 51、紫外线阻挡型覆铜箔板：uv blocking copper-clad laminates三、基材的材料:1、 a阶树脂：a-stage resin2、 b阶树脂：b-stage resin3、 c阶树脂：c-stage resin 4、环氧树脂：epoxy resin 5、酚醛树脂：phenolic resin 6、聚酯树脂：polyester resin 7、聚酰亚胺树脂：polyimide resin 8、双马来酰亚胺三嗪树脂：bismaleimide-triazine resin 9、丙烯酸树脂：acrylic resin 10、三聚氰胺甲醛树脂：melamine formaldehyde resin 11、多官能环氧树脂：polyfunctional epoxy resin 12、溴化环氧树脂：brominated epoxy resin 13、环氧酚醛：epoxy novolac 14、氟树脂：fluroresin 15、硅树脂：silicone resin 16、硅烷：silane 17、聚合物：polymer 18、无定形聚合物：amorphous polymer 19、结晶现象：crystalline polamer 20、双晶现象：dimorphism 21、共聚物：copolymer 22、合成树脂：synthetic 23、热固性树脂：thermosetting resin 24、热塑性树脂：thermoplastic resin 25、感光性树脂：photosensitive resin 26、环氧当量：weight per epoxy equivalent (wpe) 27、环氧值：epoxy value 28、双氰胺：dicyandiamide 29、粘结剂：binder 30、胶粘剂：adesive 31、固化剂：curing agent 32、阻燃剂：flame retardant 33、遮光剂：opaquer 34、增塑剂：plasticizers 35、不饱和聚酯：unsatuiated polyester 36、聚酯薄膜：polyester 37、聚酰亚胺薄膜：polyimide film (pi) 38、聚四氟乙烯：polytetrafluoetylene (ptfe) 39、聚全氟乙烯丙烯薄膜：perfluorinated ethylene-propylene copolymer film (fep) 40、增强材料：reinforcing material 41、玻璃纤维：glass fiber 42、 e玻璃纤维：e-glass fibre 43、 d玻璃纤维：d-glass fibre 44、 s玻璃纤维：s-glass fibre 45、玻璃布：glass fabric 46、非织布：non-woven fabric 47、玻璃纤维垫：glass mats 48、纱线：yarn 49、单丝：filament 50、绞股：strand 51、纬纱：weft yarn 52、经纱：warp yarn 53、但尼尔：denier 54、经向：warp-wise 55、纬向：weft-wise, filling-wise 56、织物经纬密度：thread count 57、织物组织：weave structure 58、平纹组织：plain structure 59、坏布：grey fabric 60、稀松织物：woven scrim 61、弓纬：bow of weave 62、断经：end missing 63、缺纬：mis-picks 64、纬斜：bias 65、折痕：crease 66、云织：waviness 67、鱼眼：fish eye 68、毛圈长：feather length 69、厚薄段：mark 70、裂缝：split 71、捻度：twist of yarn 72、浸润剂含量：size content 73、浸润剂残留量：size residue 74、处理剂含量：finish level 75、浸润剂：size 76、偶联剂：couplint agent 77、处理织物：finished fabric 78、聚酰胺纤维：polyarmide fiber 79、聚酯纤维非织布：non-woven polyester fabric 80、浸渍绝缘纵纸：impregnating insulation paper 81、聚芳酰胺纤维纸：aromatic polyamide paper 82、断裂长：breaking length 83、吸水高度：height of capillary rise 84、湿强度保留率：wet strength retention 85、白度：whitenness 86、陶瓷：ceramics 87、导电箔：conductive foil 88、铜箔：copper foil 89、电解铜箔：electrodeposited copper foil (ed copper foil) 90、压延铜箔：rolled copper foil 91、退火铜箔：annealed copper foil92、压延退火铜箔：rolled annealed copper foil (ra copper foil)93、薄铜箔：thin copper foil 94、涂胶铜箔：adhesive coated foil 95、涂胶脂铜箔：resin coated copper foil (rcc) 96、复合金属箔：composite metallic material 97、载体箔：carrier foil 98、殷瓦：invar 99、箔（剖面）轮廓：foil profile 100、光面：shiny side 101、粗糙面：matte side 102、处理面：treated side 103、防锈处理：stain proofing 104、双面处理铜箔：double treated foil四、设计:1、原理图：shematic diagram2、逻辑图：logic diagram3、印制线路布设：printed wire layout4、布设总图：master drawing5、可制造性设计：design-for-manufacturability6、计算机辅助设计：computer-aided design.(cad)7、计算机辅助制造：computer-aided manufacturing.(cam)8、计算机集成制造：computer integrat manufacturing.(cim)9、计算机辅助工程：computer-aided engineering.(cae) 10、计算机辅助测试：computer-aided test.(cat) 11、电子设计自动化：electric design automation .(eda) 12、工程设计自动化：engineering designautomaton .(eda2) 13、组装设计自动化：assembly aided architectural design. (aaad) 14、计算机辅助制图：computer aided drawing 15、计算机控制显示：computer controlled display .(ccd) 16、布局：placement 17、布线：routing 18、布图设计：layout 19、重布：rerouting 20、模拟：simulation 21、逻辑模拟：logic simulation 22、电路模拟：circit simulation 23、时序模拟：timing simulation 24、模块化：modularization 25、布线完成率：layout effeciency 26、机器描述格式：machine descriptionm format .(mdf) 27、机器描述格式数据库：mdf databse 28、设计数据库：design database 29、设计原点：design origin 30、优化（设计）：optimization (design) 31、供设计优化坐标轴：predominant axis 32、表格原点：table origin 33、镜像：mirroring 34、驱动文件：drive file 35、中间文件：intermediate file 36、制造文件：manufacturing documentation 37、队列支撑数据库：queue support database 38、元件安置：component positioning 39、图形显示：graphics dispaly 40、比例因子：scaling factor 41、扫描填充：scan filling 42、矩形填充：rectangle filling 43、填充域：region filling 44、实体设计：physical design 45、逻辑设计：logic design 46、逻辑电路：logic circuit 47、层次设计：hierarchical design 48、自顶向下设计：top-down design 49、自底向上设计：bottom-up design 50、线网：net 51、数字化：digitzing 52、设计规则检查：design rulechecking 53、走（布）线器：router (cad) 54、网络表：net list 55、计算机辅助电路分析：computer-aided circuit analysis 56、子线网：subnet 57、目标函数：objective function 58、设计后处理：post design processing (pdp) 59、交互式制图设计：interactive drawing design 60、费用矩阵：cost metrix 61、工程图：engineering drawing 62、方块框图：block diagram 63、迷宫：moze 64、元件密度：component density 65、巡回售货员问题：traveling salesman problem 66、自由度：degrees freedom 67、入度：out going degree 68、出度：incoming degree 69、曼哈顿距离：manhatton distance 70、欧几里德距离：euclidean distance 71、网络：network 72、阵列：array 73、段：segment 74、逻辑：logic 75、逻辑设计自动化：logic design automation 76、分线：separated time 77、分层：separated layer 78、定顺序：definite sequence五、形状与尺寸：1、导线（通道）：conduction (track)2、导线（体）宽度：conductor width3、导线距离：conductor spacing4、导线层：conductor layer5、导线宽度/间距：conductor line/space6、第一导线层：conductor layer no.1 7、圆形盘：round pad 8、方形盘：square pad 9、菱形盘：diamond pad 10、长方形焊盘：oblong pad 11、子弹形盘：bullet pad 12、泪滴盘：teardrop pad 13、雪人盘：snowman pad 14、 v形盘：v-shaped pad 15、环形盘：annular pad 16、非圆形盘：non-circular pad 17、隔离盘：isolation pad 18、非功能连接盘：monfunctional pad 19、偏置连接盘：offset land 20、腹（背）裸盘：back-bard land 21、盘址：anchoring spaur 22、连接盘图形：land pattern 23、连接盘网格阵列：land grid array 24、孔环：annular ring 25、元件孔：component hole 26、安装孔：mounting hole 27、支撑孔：supported hole 28、非支撑孔：unsupported hole 29、导通孔：via 30、镀通孔：plated through hole (pth) 31、余隙孔：access hole 32、盲孔：blind via (hole) 33、埋孔：buried via hole 34、埋/盲孔：buried /blind via 35、任意层内部导通孔：any layer inner via hole (alivh) 36、全部钻孔：all drilled hole 37、定位孔：toaling hole 38、无连接盘孔：landless hole 39、中间孔：interstitial hole 40、无连接盘导通孔：landless via hole 41、引导孔：pilot hole 42、端接全隙孔：terminal clearomee hole 43、准表面间镀覆孔：quasi-interfacing plated-through hole 44、准尺寸孔：dimensioned hole 45、在连接盘中导通孔：via-in-pad 46、孔位：hole location 47、孔密度：hole density 48、孔图：hole pattern 49、钻孔图：drill drawing 50、装配图：assembly drawing 51、印制板组装图：printed board assembly drawing 52、参考基准：datum referance。
PCB专业术语中英文对照
1影响电性及外观Affect upon electrical performance or appearance2过度的Excessively3异常Abnormal4规格不符specification is below standard5品质异常quality is below standard6严格按照QC规定Strictly according to QC regulation7定期研磨To make regularly re-sharpen8设备device(另義:主動零件) \ machine \9参数设置错误parameters setting error10依保养计划According to the maintaining plan11压力过小lack of pressure12曝光不全\过度exposure-energy insufficient\excessive 13间距不足spacing nonenough14线细width reduce15光强度Light Intensity16缺口nick\chipping17气泡Bubble\blister\air inclusion18异物foreign particle \ foreign material（壓合異物）\dust(灰塵)19被污染contaminated20干膜附著力不足 Poor adhesion of dry film21固定点开路fixed position open22固定点短路fixed position short23线路针孔trace pin-hole24孔破void in PTH hole\Barrel Crack25断脖子Open near pad26静置时间Holding time27识别方法identify method28膜屑反粘Contrary to adhere of scum29碎屑,残材 Debris30显影不洁Developing uncleanness 31外观不良Appearace defective32传动\传送速度convey speed33偏离deviation\shifted34单轴single axis35底片涨缩A/W expand or contract 36漏失率 Loss Rate37补偿compensation\balancing 38零件孔\面component hole\side39覆铜箔层压板\铜箔基板copper clad laminates (CCL)40线路露铜copper exposure41织纹显露weave exposure42光学点\基准标记fiducial mark43环氧树脂epoxy44蚀刻速率etch rate45网布fabric46助焊剂不均匀flux coating uneven 47过滤filtration48电测治具fixture49钻尖分离gap50标准板golden board1影响上件及外观affect upon mounting or appearance2铜厚测量仪Copper thickness Measuring Instrument 3佐证evidence4微蚀量microetching quantity5 湿度humidity6内部校正周期(校验矫正)internal proofread cycle\calibrationsystem cycle7板面刮伤Surface Scratch8制定handling 标Define standard of handling 9目视检查\目检visual inspection10规定频率defined frequency11压力计\表pressure gauge12工程程式designed program13超规格out of the tolerance14毛头\去毛头burr\deburring15影响下工序制作difficult to product in the following process16化学铜electroless plating17除胶速率desmearing rate18电流current19分层delamination\bulge20湿润Damped21预浸Pre-dipped22活化液activator23速化accelerator24漂锡solder float25热应力测试thermal stress test26孔环(焊垫)Lifted land\annular ring 27热水洗Hot water rinsing28震动马达vibrating motor29铜渣copper residue (copper splash)\cosmetics island獨立銅渣30清洁滤网purifying filters31定期换水replace water regularly32回收槽recovery tank33加强管控to strengthen the control of sth.34酸洗\硷洗acid\alkali rinse35定期分析浓度Analyze Conc. regularly36金属杂质污染Contamination of metal impurities37碳化物carbide38碳处理carbon treatment39整流器(电流矫正)Current rectifier40铜厚测量仪Copper Thickness Measuring Instrument 41刷磨速度Brush Speed42速度控制器velocity controller43电流控制器current controller44吸水滚轮破旧water-absorptive roller worn-out45新水补充不足Insufficient for water replenishment 46滤芯Filter element47化学药液chemicals liquid48孔塞(孔内异物)dirty hole49多与\少与1mil厚度Less\More than 1 mil Thickness50色差color variation1板面粘油墨屑(显影段)sticky ink debris2挡水滚轮water apart roller3网板高度Screen height4网板张力不足Screen tension insufficient5刮刀行程Squeegee distance6刮刀刃钝化Squeegee edge blunt7油墨黏度过大viscosity of ink too thick8张力应力tensile stress9后烤Post cure10印C面Printing Top(COMP) Side11印S面Printing (SOLD)Bottom Side12静电喷涂Spray Coating13印可剥胶Peelable Solder Mask14风刀air knife15隔离环clearance16烧焦burning17化镍金immersion nickel and gold18铜镍层接著不良Poor combination the copper and nickel 19刷磨滚轮brush roller20刷幅测试brush breadth\width test21脱脂温度Defatting Temp.22流量计flowmeter23执行\导电Conduct24助焊剂\熔合液rosin(天然松香)\flux\fusing fluids25锡粗Tin roughness26焊料中铜离子含量过高The cu2+ content out of upper in solder 27机台异常machine-motion error28缺点标示卡nominal card of defects29程序\程式错误Programbug30人员疏忽operator's carelessness31日保养daily maintainance32人员技能不熟练Operator is not skilled33口头考核examine orally34阻抗异常Impedance Abnormal35阻抗测量仪impedance measuring instrument36漏气puncture37受潮moisture absorption38膜面污染film surface contaminated39漏检Leaking inspection40二次元 2D(biaxial) dimension-measuringinstrument41工单run card\work order42飞针Flying Probe43目检Visual Inspection44专用治具测试Dedicated Tester45特殊特性Critical Feature46重要特性Important Feature47铜箔厚度Copper foil Thickness48板弯翘Bow and Twist(warp)49尺寸(含对角)Size(Diagonal)\dimensions(成型) 50拉力计\张力计tensile meter1棕化\黑化Brow\black oxide2循环水洗circulating water rinsing3PP胶片Prepreg4物理性质\化学性质physical\chemical character5暂存时间Temporary store time6铆钉组合Eyelet7叠板结构stacking(lay up) structure8铆钉rivet9热熔机heat-melting machine10有用寿命useful life11印制电路板Printed Circuit Board(PCB)12根本原因\真因Root Cause13围堵措施Containment Plan14现状Current Status15原因分析Gap Analysis16内部稽核\外部稽核Internal\outside Audit17修改\变更Modify18无卤素Halogen Free19更新\修订Update/Revise20改进措施ure Plan21长期异常Chronic22突发异常Excursion23陶尔(压力单位)Torr24靶孔距Space between target holes25层偏misalignment26组合线Combined producing line27钢板\隔板steel plate\caul plate\separator28板厚测量仪Board-thickness measuring instrument 29钢印机 steel seal machine30品质检验 quality examination31介质厚度dielectric thickness32吸水性moisture absorbability33耐磨性wear resistance34剥离强度stripping strength35焊锡耐热性heat-resistant of solder36抗麻斑测试spot-resistant test37信赖性测试reliability test38介电常数测量仪dielectric constant measuring device 39包装标籤packing tag40电子天平electrical balances41焊锡炉solder furnace42孔径规calliper gauge43比色计color comparing meter44密度计density meter45蚀刻均匀性Etching uniformability46化验单 laboratory list47出货单manifest48双面板\多层板 Reversible Board\Multi layer board 49定位孔 Location Hole50叠板数stack boards count1硝基戊烷amylnitrite2阳极泥anode slime (sludge)3液态光阻aqueous photoresist4纵横比aspect ratio5预留在制品banked work in process 6贝他射线照射法beta backscattering7斜边beveling8吹孔blow hole9黏结层bonding plies10焊桥solder bridge11接单生产Build To Order(BTO)12金手指斜边\倒角chamfering13网框chase14螯合剂chelator15化学键chemical bond16热膨胀Thermal Expansion17同心圆concentric circle18密贴性conformance19消费类产品consumer products20库伦定理coulombs law21喇叭孔countersink22试样coupon\sample23覆盖力covering power24挖空cut-outs25交期缩短cycle-time reduction 26专用型dedicated27缩锡dewetting28介质常数dielectric constant29孔黑\孔灰discolor hole30停机\稼动时间downtime\uptime31钻针切削面drill facet32钻针研磨机drill pointer33裸板(未镀铜) blank board34延展性ductility\Elongation35留边宽度edge spacing36金手指edge-board contact ( gold finger )\tab 37电化学反应器electrochemical reactor38脆性embrittlement39植PIN法\外部插梢法external pin method40织维突出fiber protrusion41成品final board42固著fixing43燃烧等级flammability rating44抗菌性\抗酶性fungus resistance45胶化时间gel time46一般阻焊油墨general resist ink47玻璃态转换温度glass transition temperature (Tg)48多孔\少孔Extra/Missing Hole49硬化剂hardener50空气滤清器\过滤器hepa filter1规范specification\standard2铣靶spot face3衝压\钢印stamping4标准液压法standard hydraulic lamination 5缺胶starvation6应力\应度strain7应力计stress meter8板面突起surface convex\swelling9板面检查surface examination10板面粗糙度surface roughness11热震荡试验thermal shock12厚度不均uneven thickness distribution 13抗污抗氧化剂tarnish and oxide resist14透光度transmittance15裁切线trim line16测试undercut17万用型universal18有形库存visible inventory19仓库warehouse20湿化学制程wet chemistry process21灯芯\渗铜wicking22纵横比width-to-thickness ratio23良率yield24点灯次数Times of Light switch25真空延迟时间Vacuum delayed time26+/-2 周The front or rear two weeks 27无尘室clean room28上喷压Upper spray pressure29下喷压Lower spray pressure30显影剂developer31主轴转速(RPM) Spindle Revolution Speed\Revolution PerMinute RPM32光电耦合器(Charge Couple Device) CCD3390° 孔切破90 degree breakage34缺点侦测\检测defect detection35聚焦focus36光校正calibration37极性Polarity38正极\阳极Positive39负极\阴极Negative40下钻点\下刀点entry41量杯measuring cup42微切片Microsection43爆孔hole breakout(鑽孔)\hole overflow(防焊油墨)44温差temperature difference45文字不清marking(symbol) blurred46文字白点S/L white point47补充显影additional developing48烘烤baking49确认检修系统Visual Repair System(VRS)50图表Diagram1腐蚀Corrosive2致癌物carcinogenic3有机体突变的Mutagenic4染色体错位chromosome aberration5畸形teratogenic6有害气体poisonous gas7易燃性Inflammability8爆炸性explosion9吸入\吸入剂inhalation10护目镜goggle11棉手套Cotton glove12化学特性Chemical properties13熔点Melting point14抽样检查spot check15沸水boiling water16冲模Punching17氢溴化物hydrochloride18醇\酒精alcohol19持续改进continual improvement20纠正措施corrective action21环境因素\影响\方针environment aspect\impact\policy22环境管理体系environment management system23污染预防prevention of pollution24品质关键点critical to quality(CTQ)25客户需求分析Customer Needs Mapping(CNM)26质量功能分布Quality Function Deployment(QFD)27失效模式及后果分析Failure Mode & Effects Analysis(FMEA) 28跨功能小组Cross-functional involvement29传感器sensor30点阵图tally chart31全面品质管理Total Quality Management(TQM)如QC七大手法32柏拉图Pareto Chart33因果图\鱼骨图Cause and Effect diagrams34脑力激荡Brainstorming35散布图Scatter diagrams36全面设备保养Total Productive Maintenance(TPM)37控制图Conttrol Chart38测定系统分析Gage Repeatability&Reproducibility(GRR) 39印制电路板协会Institute of printed circuit(IPC)40有机保焊膜Organic Solderability Preservative(OSP) 41进刀Feed42金盐Potassium Gold Cyanide(金氰化鉀PGC)43辐射式红外线焊接Radiation(輻射) Infrared Rays(IR)Reflow(焊接)44锡膏熔焊Reflow Soldering45缩锡Dewetting46锡炉浮渣Dross47锡尖Solder Icicle48锡球Solder Ball49电容器capacitor50波峰焊Wave Soldering1石油petroleum2线圈\缠绕coil3代理商agency4自由基Free Radical5镀金Golden Plating6防焊阻剂Polymer coating(solder resistent) 7内层(外层)孔环Internal(external) Annular ring8隧道式烤箱transmission toaster9直立式烤箱vertical toaster10光面\雾面油墨glossy\matte ink11晶片直接组装Chip On Board(COB)12组装密度packaging density13球状阵列Ball Grid Array(BGA)14焊膏solder paste\solder cream15焊料粉末(焊粉)solder powder16触变性thixotropy(粘度變化特性)17储存寿命shelf life18网版(脱网)高度snap off distance19拉丝stringing20平移偏差shifting deviation21贴装几Placement equipment22虚焊点(焊点不佳)colder solder connection23焊盘起翘lifted land24锡珠solder ball25波峰焊wave soldering26迴流焊reflow soldering27离子清洁度ion cleaning28印制电路元件printed circuit assembly(PCA)29特采Accept on Deviation\Use As It30首件检验报告First Piece Inspection Report31工序变更通知Process Chang Notice（PCN）32孔铜厚度Barrel Copper thickness\Hole CopperThickness33面铜厚度Surface Copper Thickness34皱折wrinkle35置信区间Confidence interval36相关性Correlation37相关矩阵Correlation Matrix38任意抽样法Haphazard Sampling39不合格品Nonconforming units40不合格Nonconformity41正态分布Normal Distribution42排列图(柏拉图)Pareto Chart43预测区间Prediction Interval44基于概率的控制图Probability Based Chart45制程能力Process Capability46二次函数Quadratic47随机抽样Random sampling48极差Range49合理子组Rational Subgroup50回归控制图Regression control chart1故障failure\breakdown2夹头grip holder3解析度\解像度resolution4可靠度reliability5孔位错误(孔偏)mis hole location6孔径\钻孔直径错误Hole Diameter error7离子污染度试验ionic contamination testing8线距line space9线宽line width\trace width10感光油墨liquid photoimageable solder resist ink 11批batch\lot12 裂痕\白斑\白点\白边crazing\mealing(白點)\Haloing(白邊)13对位不准misregistration14钉头nail heading15数位钻孔机NC drill16原稿底片original art work (A/W)17钻针重叠overlap18氧化oxidation19剥离\抗撕强度peel strength20感光起始剂photo initiator21凹陷dent22塞孔plug hole\stuffing23补线不良poor touch-up24循环周期Periodically cycle25初始资料protocal26喷砂pumice scrub27对位孔registration hole28文字印刷silk screen printing\printing of legend29胶渣resin smear30孔壁粗糙度roughtness31防焊文字S/L32毛边serrated edges 33跳印skip printing34漂锡solder float35喷涂spray coating36刮刀Squeegee37孔规taped hole gauge 38薄基板\内层板thin core39工作片工作母片working gerberworking master gerber40粗化abrade41电流密度Current Density42风刀Air Knife43获取资格的Qualify/qualified + n. or + to44现场locality(PD)45浓度偏低Conc. Lower46浓度偏高Conc. Higher47人员疏忽Operator careless48经纬向错误longitude and latitude contrary49上件不良failed componmt mounting50防呆孔Poka-Yoke hole\ mistake proofing hole1假性露铜unreal copper exposure2积墨ink accumulation3印偏ink printing deviated4遵照现场作业规范comply with the handling standardization 5放置时间Holding time6烘乾温度不足Insufficient in dry temperature7设备故障breakdown of machine8压膜滚轮 D/F laminated roller9sth. 受损或污染Damaged or contaminated10粘尘压力sticky pressure11曝光灯管exposure fluorescent tube12光阶 light step condition13曝偏Exposure misregistration14层间对准度alignment registration15吸气不良vacuum treatment abnormal16曝光藏点Exposure shelter17人员动作不当improper handling18显影Developing19蚀刻Etching20去膜stripping21Mylar 未撕Mylar non tearing off22教育训练instruction and trainning23进行显破点测试conduct developing point broken test 24喷压Spraying pressure25蚀刻不洁Etching incompletely\underetch26蚀刻液Etchants27首件确认First article confirm28电性不良Electrical performance defective29去膜不净Film stripping uncleanness 30几台漏测Equipment test leaking31领班Foreman32主管Chief33稳定性Stability34误判Misjudgement35混料Mixture36铝粉浓度(火山灰)Aluminum percentage37超音波测试(锡箔纸)Tin foil perforating test 38水破测试water broken test39油墨黏度ink viscosity40黏度计viscosimeter41数孔机hole counter42振动马达vibration motor43网版调偏net screen misregistration 44试印膜trial printing film45机台未清洁worktable uncleaness46万用塞孔垫板universal plugging back-up 47预烤Precure48上锡\焊锡性不良poor solderability49温度均匀性Temp. uniformability5010倍放大镜10X magnifier1捲尺measuring tape2千分尺micrometer3剥离强度Peeling strength4尺寸安定性Dimensional stability5有害物质Hazardous substance6元素分析仪 element analyzing instrument7显微镜microscope8游标卡尺vernier caliper9膜厚测量仪membrane thickness measuring intrument 10铣刀milling cutter\routing bit11钻针drill bit12化学元素chemical elements13化学药水chemical liquid14裁切刀具cutting tool15控制面板control panel16日点检表daily check list17光面油墨glossy green ink\resist(阻焊劑防染劑) 18公差\误差 tolerance\variance\bias(偏差)19量产mass production20白色文字white ident21成型外型routed outline22连片尺寸PNL drawing dimension23折断边break-away tabs24检查表inspection sheet25记录表data sheet\record chart26报表report forms27点检表Check list28磨边机Grind- edging machine\ Edger29打磨机polisher30板面光滑Board surface smooth31滴定法分析Titration analysis32温度计Temp. meter\Thermograph33压力计Pressure meter34能量格测试Energy-step tablet test35黏纸viscosity paper36六点测温仪Six points Temp. uniformability testInstrument37催化剂catalyst38稳定剂\安定剂stabilizer39硫酸铜回收机CuSO4 retrieve equipment40秒錶stopwatch41预热preheat42计时器chronograph\timepiece43能量计energy meter44靶孔机target hole equipment45铜含量The contents of Cu46液体比重计hydrometer47比重测定法stereometry48杀菌剂sterilant49蚀刻因子Etching factor\value\element50自动光学检测Automatical optical inspection(AOI)1精度Precision2栈板pallet3电动拖车\叉车electric trailer\fork lifter4针盘bit holder5放置架placement rack6静止消泡时间static\rest defoaming time7转板Transfer plate8水性笔Mark pen9尼龙\不织布\陶瓷nylon\non-woven fabric\ceramic10比色计chromo meter11湿度卡Humidity Indicator Cards12测温仪Thermoscope13龙门吊gantry crane14摇摆\摆动swing15PIN孔重合pin hole superposing16首躺first cycle17中和洗neutralization cleaning18流量flow amount19除胶速率desmear rate20湿润(电镀)moisten21获准供应商supplier warrant22供应商批准程序书Supplier Part Approval Process(SPAP) 23V-cut残厚Remain thickness of V-cut24冷媒油refrigerant oil25压力脚pressure foot26块规block gauge27高度规vernier height gage28金刚砂carborundum\Emery29火山灰volcanic ash30高阻计high resistance meter31模具图mold draw32支架Chassis33治具fixture34超音波浸洗ultrasonic dip35酸浸acid dipping36电流强度current amperage37化验分析表Assay analysis report forms38加压水洗Pressurized water rinsing39酸洗acid rinsing40溢流水洗cascade water rinsing\overflow 41沉淀缸sediment tank42冲污水waste water rinsing43水柱式冲洗Jet cleaning44高压水柱式冲洗High pressure rotating jet rinse 45清水洗Fresh water rinsing46干板组合Drying module47抗腐蚀测试accelerated corrosion test48速化反应acceleration49实际在制品active work in process50总量amount1高性能(电子)工业级high performance industrial2高延展性铜箔high temperature elongation copper(HTEC) 3高温树脂high temperature epoxy (HTE)4孔数hole number5哈氏槽hull cell6水解hydrolysis7改善方案implementation8努普(硬度单位)Knoop(Hardness)9牛皮纸kraft paper10压膜机laminator11刃角磨损lay back12牵引\定位螺丝lead screw13平整剂levelling additive14线性可变差动转换器linear variable differential transformer(LVDL)15 刷磨清洁法machine scrub16钻头刃带margin17主图\机构图master drawing18基材利用率material use factor19湿度与绝缘电阻测试moisture and insulation resistance test 20锯齿\蚀刻缺口mouse bite21负片negative film22结瘤\铜瘤nodule23流胶量百分比resin flow percentage24胶含量resin content25报废因素obsolescence factor26一铜panel plating27二铜pattern plating28透电率\介电常熟permittivity29极性吸引力polar-polar interaction30聚酯类polyester31孔变形poor drill32预聚合物prepolymer33原始资料protocal34喷砂清洁法pumice scrub35挂架rack36折光率refraction37对位元用标记register mark(對位點)38孔内沾文字S/L on hole39孔内防焊S/M on hole40干膜屑\透明残膜scum41漏印\跳印skip printing42表面附著元件SMD ( surface mount device )43表面附著技术SMT ( surface mount technology )44锡突solder bump45漂锡solder float46油墨附著力solder mask adhesion47金手指上锡solder on G/F48线路沾锡solder on trace49锡塞solder plug50统计制程管控SPC ( Statistical Process Control )1自检Self-examine2柠檬酸浓度Citric acid conc.3液位Liquid Level4析出物educt5垂直的perpendicular6喷砂能力pumice capability7阀门 Valve8外包加工contract-production9退货拒收REJ ( reject )10植PIN深度Depth of external pin11上PIN beat PIN12精确度Precision13准确度accuracy14操作员技术不娴熟operator technique unskilled 15套环深度depth of sleeve-ring16精修(成型)finely couting17漏钻\漏捞Leaking drilling\routing18多钻\多捞surplus drilling\routing19排屑chip load20排屑槽flute21蜂鸣器check beeper22建立档案资料(建档)Archive data building23合格qualified24电子称Electronic scale25封口时间sealing time26超出范围out of scope27微蚀速率Micro-etching ratio28变色\褪色discolor29破损breakage30电导率conductance ratio31履历表biographic sketch32公式formula33扩孔针reaming drill bit34电木板bakelite board35允收水准general criteria36理想状况Target Condition37模板\模具Template38基准孔reference holes39压敏开关Piezo-switch40指示灯indicator41直方图Histogram42并联导体parallel conductors43导体连接处area of adjacent conductors44金属导体Metal conductors45防焊侧露(焊垫\线路)Adjacent isolated lands or conductorsexposed46有害物质公约Restriction of Hazardous Substances(RoHS) 47预防措施Precaution48生物可降解Biodegradability49生态环境ecology50(垃圾\废弃物)处Disposal理1浸焊Immersion Soldering2焊接点Solder Joint3焊锡丝Solder Wire4待工温度Idle Temp.\+Time(空轉時間)5静电释放Electrostatic Discharge(ESD)6静电压力Electrostatic Overstress(ESO)7电阻係数Electrical Resistivity8内应力Internal Stress9导热係数Thermal Conductivity10磷含量Phosphorous11颗粒大小Grain Size(μm)12X光测量X-ray Diffraction13抗拉强度Tensil Strength(N/mm2)14介面化合物Intermstallic Compound(IMC)15贾凡尼效应Galvanic Effect(不同金屬電位差加速腐蝕)16高频信号High Frequency Signal17肌肤效应Skin Effect(高頻線路沿道題表面傳輸)18阻隔效应Barrier Effect(合金層可有效減低離子遷移度) 19银Silver20硫酸sulfuric acid21仪器Apparatus(測試用儀器)22抛光Polish23磨切片grind microsection24文件保存期限Documentation of age25内部管理政策Internal Policies26工资支付Salary payments27责任书Responsibility28法定最小年龄The legal minimum age29熟练\技能Facility30隐私权right to privacy31贪污\腐败corruption32有效日期valid period33温度循环实验Temperature Cycling Test(TCT)34热衝击实验Thermal Shock Test(TST)35离子迁移试验Electrochemical Migration Test(ECM) 36绝缘电阻试验Surface Insulation Resistance(SIR) 37阳极灯丝Conductive Anode Filament(CAF)38爆板popcorn39生产车间Fabricating Plant40吊车crane41危险物品hazardous substance42文字脱落symbol fading43锯齿Worm-Eaten-Crack44经纬方向Grain Direction45V-cut Slit46幻灯片slide47预算budget48运输工具transport49货物cargo50容器vessel。
PCB术语中英文对照表
PCB术语中英文对照表下面是一些常见的PCB术语的中英文对照表：1. PCB (Printed Circuit Board) - 印刷电路板2. PWB (Printed Wiring Board) - 印刷布线板3. FR4 (Flame Retardant 4) - 阻燃44. SMT (Surface Mount Technology) - 表面贴装技术5. THT (Through-Hole Technology) - 过孔技术6. BGA (Ball Grid Array) - 球栅阵列7. QFP (Quad Flat Package) - 四边平封装8. DIP (Dual Inline Package) - 双列直插封装9. SMD (Surface Mount Device) - 表面贴装元件10. CEM (Composite Epoxy Material) - 复合环氧材料11. HASL (Hot Air Solder Leveling) - 热空气焊锡平整12. OSP (Organic Solderability Preservatives) - 有机焊接性保护剂13. ENIG (Electroless Nickel Immersion Gold) - 无电镀镍浸金14. OSP (Organic Solderability Preservative) - 有机焊接性保护剂15. DRC (Design Rule Check) - 设计规则检查16. EMI (Electromagnetic Interference) - 电磁干扰17. EMC (Electromagnetic Compatibility) - 电磁兼容性18. NPTH (Non-Plated Through Hole) - 非电镀过孔19. PTH (Plated Through Hole) - 电镀过孔20. RoHS (Restriction of Hazardous Substances) - 有害物质限制21. UL (Underwriters Laboratories) - 美国安全实验室22. IPC (Institute for Interconnecting and Packaging Electronic Circuits) - 集成电路互连与封装协会这些是一些常见的PCB术语，希望对你有帮助！。
pcb常见术语中英资料
A/W (artwork) 底片Ablation 烧溶(laser),切除abrade 粗化abrasion resistance 耐磨性absorption 吸收ACC ( accept ) 允收accelerated corrosion test 加速腐蚀accelerated test 加速试验acceleration 速化反应accelerator 加速剂acceptable 允收activator 活化液active work in process 实际在制品adhesion 附着力adhesive method 黏着法air inclusion 气泡air knife 风刀amorphous change 不定形的改变amount 总量amylnitrite 硝基戊烷analyzer 分析仪annular ring 环状垫圈;孔环anode slime (sludge) 阳极泥anodizing 阳极处理AOI ( automatic optical inspection ) 自动:光学检测applicable documents 引用之文件AQL sampling 允收水准抽样aqueous photoresist 液态光阻aspect ratio 纵横比(厚宽比)As received 到货时back lighting 背光back-up 垫板banked work in process 预留在制品base material 基材baseline performance 基准绩效batch 批beta backscattering 贝他射线照射法beveling 切斜边;斜边biaxial deformation 二方向之变形black-oxide 黑化blank controller 空白对照组blank panel 空板blanking 挖空blip 弹开blister 气泡;起泡blistering 气泡blow hole 吹孔board-thickness error 板厚错误bonding plies 黏结层bow ; bowing 板弯break out 从平环内破出bridging 搭桥;桥接BTO (Build To Order) 接单生产burning 烧焦burr 毛边(毛头)camcorder 一体型摄录放机carbide 碳化物carlson pin 定位梢carrier 载运剂catalyzing 催化catholic sputtering 阴极溅射法caul plate 隔板;钢板calibration system requirements 校验系统之各种要求central projection 集中式投射线certification 认证chamfer 倒角(金手指)chamfering 切斜边;倒角characteristic impedance 特性阻抗charge transfer overpotential 电量传递过电压chase 网框checkboard 棋盘chelator 蟹和剂chemical bond 化学键chemical vapor deposition 化学蒸着镀circumferential void 圆周性之孔破clad metal 包夹金属clean room 无尘室clearance 间隙coat 镀外表coating error 防焊覆盖错误coefficient of thermal expansion (CTE) 热澎胀系数cold solder joint 冷焊点cold-weld 金属粉末冷焊color 颜色compensation 补偿competitive performance 竞争力绩效complex salt 错化物complexor 错化物component hole 零件孔component side 零件面concentric 同心conformance 密贴性consumer products 消费性产品contact resistance 接触电阻continuous performance 连续发挥效能contract service 协力厂controlled split 均裂式conventional flow 乱流方式conventional tensile test 传统张力测试法conversion coating 转化层convex 突出coordinate list 数据清单copper claded laminates (CCL) 铜箔基板copper exposure 线路露铜copper mirror 镜铜copper residue (copper splash) 铜渣corrosion rate numbering 腐蚀速率计数系统corrosion resistance 抗蚀性coulombs law 库伦定律countersink 喇叭孔coupon 试样coupon location 试样点covering power 遮盖力CPU 中央处理器crack 破裂;裂痕crazing 裂痕;白斑cross linking 交联聚合cross talk 呼应作用crosslinking 交联crystal collection 结晶收集curing 聚合体current efficiency 电流效率cut-outs 挖空cutting 裁板cyanide 氰化物cycles of learning 学习循环date code 周期deburring 去毛头dedicated 专用型degradation 退变delamination 分层dent / pin hole 凹陷/ 针孔department of defense 国防部designation 字码简示法de-smear 除胶渣developing 显影dewetting 缩锡dewetting time 缩锡时间dimension error 外形尺寸错误dielectric constant 介质常数difficulty 困难度difunctional 双功能dimension 尺寸dimension stability 尺寸安定性dimensional stability 尺度安定性dimension and tolerance 尺寸与公差dirty hole 孔内异物discolor hole 孔黑;孔灰;氧化discoloration 变色disposable eyelet method 消耗性铆钉法distortion factor 尺寸变形函数double side 双面板downtime 停机时间drill 钻孔drill bit 钻头drill facet 钻尖切萷面drill pointer 钻尖重(研)磨机drilled blank board 已钻孔之裸板drilling 钻孔dry film 干膜ductility 延展性economy of scale 经济规模edge spacing 板边空地edge-board contact ( gold finger ) 金手指efficiency 能量效率electric test 电测electrical testing 电测;测试electrochemical machine ECM 电化学加工法electroforming 电铸electroless plate 化学铜electroless-deposition 无电镀electropolishing 电解拋光electrorefining 电解精炼electrowinning 电解萃取elliptical set 椭圆形embrittlement 脆性entitlement performance 可达成绩效entrapment 电镀夹杂物epoxy 环氧树酯equipotential 电位线error data file 异常情形etch rate 蚀铜速率etchants 蚀刻液etchback 回蚀evaluation program 评估用程序exposure 曝光external pin method 外部插梢法eyelet hole 铆钉孔Eyeletting 铆眼fabric 网布failure 故障fast response 快速响应fault 瑕庛;缺陷fiber exposure 纤维显露fiber protrusion 纤维突出fiducial mark 光学点,基准记号filler 填充料film 底片filtration 过滤finished board 成品fixing 固着fixture 电测夹具(治具)flaking off 粹离flammability rating 燃性等级flare 喇叭形孔flat cable 并排电缆feedback loop 回馈循环first-in-first-out (FIFO) 先进先出flexible manufacturing system (FMS) 弹性制造系统flux 助焊剂foil distortion 铜层变形fold 空泡foreign include 异物foreign material 基材内异物free radical chain polymerization 自由基连锁聚合fully additive 加成法fully annealed type 彻底回火轫化之类形function 函数fundamental and basic 基本fungus resistance 抗霉性funnel flange 喇叭形折翼galvanized 加法尼化制程gap 钻尖分开gauge length 有效长度gel time 胶化时间general resist ink 一般阻剂油墨general 通论general industrial 一般性(电子)工业级geometrical levelling 几何平整glass transition temperature (Tg) 玻璃态转换温度Gold 金gold finger 金手指gold plating 镀金golden board 标准板gouges 刷磨凹沟gouging 挖破grain boundary 金属晶体之四边green 绿色grip 夹头ground plane 接地层ground plane clearance 接地空环hackers 骇客HAL ( hot air leveling ) 喷锡haloing 白边;白圈hardener 硬化剂hardness 硬度hepa filter 空气滤清器high performance industrial 高性能(电子)工业级high reliability 高可靠度high resolution 高分辨率high temperature elongation (HTE) 高温延展性铜箔high temperature epoxy (HTE) 高温树酯hit 击hole counter 数孔机hole diameter 孔径hole diameter error 孔径错误hole location 孔位hole number 孔数hole wall quality 孔壁品质hook 外弧hot dip 热浸法hull cell 哈氏槽hybrid 混成集成电路hydrogen bonding 氢键hydrolysis 水解hydrometallurgy 湿法冶金法image analysis system 影像分析系统image transfer 影像转移immersion gold 浸金(化镍金) immersion plating 浸镀法impedance 阻抗infrared reflow 红外线重熔inhibitor 热聚合抑制剂injection mold 射模ink 油墨innerlayer & outlayer 内外层insulation resistance 绝缘电阻intended position 应该在的位置intensifier 增强器intensity 强度inter molecular exchange 交互改变interconnection 互相连通ionic contaminants 离子性污染物ionic contamination testing 离子污染试验IPA 异丙醇5I : inspiration (启蒙)identification 确认计划目标implementation 改善方案information 数据internalization 制度化invisible inventory 无形的库存knife edges 刀缘Knoop 努普(硬度单位)kraft paper 牛皮纸返回顶部laminar flow 层流laminate 基层板laminating 压合lamination 压合laminator 压膜机land 焊垫lay back 刃角磨损lay up 组合叠板layout 布线;布局lead screw 牵引螺丝leakage 漏电learning curve 学习曲线legend 文字标记leveling 平整levelling additive 平整剂levelling power 平整力life support 维系生命limiting current 极限电流line space 线距line width 线宽linear variable differential transformer(LVDL) 线性可变差动:转换器liquid 液状(态)liquid crystal resins 液晶树脂liquid photoimageable solder resist ink 液态感光防焊油墨liquid photoresist ink 液态光阻剂油墨lot size 批量lower carrier 底部承载板mechanical plating 机祴镀法machine scrub 刷磨清洁法macrothrowing power 巨分布力margin 钻头刃带market share 市场占有率marking error 文字错误masked leveling 儰装平整mass lamination 大型压板mass transfer 质量传送效应mass transfer overpotential 质量传递过电压mass transportation 质传master drawing 主图;蓝图material use factor 材料使用率mealing 泡点;白点memory 记忆装置meniscograph solderability measurement 新月型焊锡效果microetch 微蚀microetching 微蚀microfocus 微焦距microfocus system 微焦距系统microprofile 微表面microsectioning 微切片法microthrowing power 微分布力migration 迁移mini-tensile tester 迷你拉力测试仪mis hole location 孔位错误misregistration 焊锡面与零件面对位偏差misregsitration 对不准moisture and insulation resistance test 湿气与绝缘电阻试验molded circuit board (MCB) 模制电路板monoethanal amine 单乙醇氨monohydrate state 水化物monomer 单分子膜;单体mouse bite 锯齿;蚀刻缺口msec 毫秒muffle furnace 高温焚火炉multichip 超大IC型(多芯片模块)mylar 保护膜nail head 钉头NC drill 数字钻孔机negative etchback 反回蚀negative film 负片negative rake angle 负抠耙角network 回路;网络neutralization 中和nick 缺口nickel 镍nodule 铜瘤;瘤粒no flow resin 不流树脂noise 噪声nominal 标示nominal dimension 标定长度nominal gel time 标示胶性时间nominal resin content 标示胶含量nominal resin flow 标示胶流量nominal scaled flow thickness 标示比例流量厚度OA equip 办公室自动:化设备obsolescence factor 报废因素OEM 原设备制造商offset-list 补偿数据清单ohmmeter 欧姆计open 断路open circuits 断路open short testing 断短路测试opening 开口original art work (A/W) 原稿底片Others 其它outgrowth 增出over design 牛刀杀鸡overlap 钻尖重叠overlay entry 盖板overpotential 过电压oxidation 氧化oxide treatment 黑化处理oxided cytochrome 氧化性之细包色素oxygen evolution 氧气发生反应packed bed 充填床式pad 锡垫;圆配pad copper exposure pad露铜panel 小型板面;母板panel plating 一次铜电镀parasitic 寄生的part no. 料号pattern plating 二次铜电镀PCB ( print circuit board ) 印刷电路板pcs 片peel strength 抗撕强度peeling off 剥离(剥落)performance specification 性能规范permittivity 透电率perspectives on experience 经验透视PET 聚酯photodiode detector 发光二极管侦测器photo initiator 感光启始剂photoresist 光阻phototool 光具(指工作底片)piece 子板面pinceton applied research 腐蚀测定仪pink ring 粉红圈pit 凹点pitch 脚距planar 平面plating 电镀plating exposure 下镀层露出plug gauge 插规plug hole 孔塞PNL (panel) 排板polar-polar interaction 极性之间的吸力polyester 聚酯类polyglycols 聚乙二醇polyimide 聚亚醯氨poor bevelling 磨边加工引起突起,剥离poor drill 孔形不良poor HAL 喷锡不良poor marking 字体不良poor pad 锡垫不良poor printed 印刷偏差poor solderability 焊锡性不良poor touch-up 补线不良position control system 位置控制系统positive rake angle 正抠耙角power curve model 幕次曲线模式practice 工艺惯例preferred 良好premature tearing 提前撕裂prepolymer 预聚合物prepreg 胶片press cycle 压合周期primary current distribution 一次电流分布primary 主要product lifetimes 生命周期product process 制程promoter 促进剂protocal 初步资料prussic acid 普鲁士酸PTF-based process 厚膜糊法PTH (plating though hole) 导通孔pull away 拉开pumice 浮石粉pumice scrub 喷砂清洁法pyrometallurgy 火烧法冶炼QC ( quality control) 品管QFP (quad flat pack ) 扁方型封装体qualification inspection 资格审查检验qualification testing 资格检定quality classification 品质等级quantitative 计量式测试radiometer 能量剂rake angle 抠耙角RAM [Random Access Memory 随机存取内存real time 关键时刻recessed trace process 凹槽线路法recovery tank 回收槽reduction 还原re-eninforcement 强化refraction 折光率reinforcement style 补强材料的型式register mark 对位用标记registration hole 对位孔registration pattern 长方形铜地REJ ( reject ) 退货;拒收rejectable 拒收release agent 脱模剂relief angle 浮离角remark 备注repair 修理resin content 树脂含量(胶含量)resin flow percentage 树脂流量之百分率resin recession 树脂下陷resin smear 胶渣resist strippers 剥干膜剂resistor network 排列电阻resolution 解像度return on assets 资产报酬率reversibility 可逆性rework 重工rosin 天然松香rotating cylinder 旋转圆柱形roughtness 孔壁粗糙;粗慥routing 切外形,成型routing bit 铣刀runout 偏转S/L on hole 孔内沾文字S/M ( solder mask ), S/L 防焊文字S/M (solder mask) 防焊S/M error 防焊种类错误S/M on hole 孔内绿漆salt spray test 盐水喷雾试验sampling size 抽样数scope 范围scored 刻痕scoring 枢槽;刮线scrap 废框scratches 刮伤screen printing 网版印刷scum 透明残膜sealing 封孔处理secondary 次要semi-additive 半加成法sensitize 敏化sensitizer 敏化液separator 钢隔板sequential lamination 渐成式压法serrated edges 毛边shatter 破碎short 短路shunt 分路silane treatment 硅烷处理silicone coupling agent 硅烷偶合剂silk screen 文字印刷simulator 仿真器single axis 单轴sizing 底片之伸缩补偿skip 漏印skip printing 跳印;漏印sliver 丝条slot 开槽slotting 开槽SMD ( surface mount device ) 表面黏着组件smear 胶渣SMT ( surface mount technology )表面黏着技术sodium carbonate monohydrate 结晶水碳酸钠soft tooling 软性工具solder 焊锡; 锡铅solder bridge 锡桥solder bump 锡突solder float 漂锡solder mask adhesion 绿漆附着力solder on G/F 金手指沾锡solder on trace 线路沾锡solder plug 锡塞solder side 焊锡面solderability 焊锡性solid carbide 实质碳化物spacing 间距spacing nonenough 间距不足SPC ( Statistical Process Control ) 统计生管specification 规范special considerations 特别考虑spin coating 旋转涂布spindle 钻轴spiral contractometer 螺旋收缩仪spot face 铣靶spray coating 喷涂Squeegee 刮刀stacking structure 叠板结构stamping 冲压standard hydraulic lamination标准液压法standardizing 标准化starvation 缺胶step tablet 格片数stock option 认股选择权strain 应度strength 强度stressmeter 应力计subtractive 减除法surface convex 表面突起surface examination 表面检查surface insulation resistance (SIR) 表面绝缘电阻surface mount 表面黏着方式surface roughness 表面粗慥度surges 突波switch circuit 开关线路tab 金手指tack free 不黏taped hole gauge 锥形孔规target hole 靶孔task force 任务编组tensile strength 抗拉强度tensile stress 张性应力tent 浮盖terms and definitions 术语与定义termination load 抗匹配负载test circuit 测试线路test method 试验方法thermal shock 热震荡试验thermal stress 热应力试验thermistor 热电感应式thermo cycling 热循环试验theoretical cycle time 理论性周期时间thickness 厚度time to market 上市时机thickness distribution 厚度分布thief 补助阴极thin core 薄基板;内层板throwing power 分布力tolerance 公差;容差tooling hole 工具孔torque load 扭力拒之负载total quality program 全面的品质计划toughness 坚度trace error 线路错误trace nick & pin hole 线路缺口及针孔trace peeling 线路剥离trace pin-hole 线路针孔trace surface roughness 线路表面粗糙transmittance 透光度trim line 裁切线true levelling 真平整true position 真正位置的孔;真位twist 板翘type 种类umbra 本影undercut 侧蚀uneven coating 喷锡厚镀不平整universal 万用型universal tensile tester 万用拉力试验机universal tester 泛用型测试机upper carrier 顶部承载钢uptime 稼动:时间vacuum deposition 真空蒸镀法vacuum hydraulic lamination真空液压法vaporizer 气化室V-cut V形槽vertical microsection 垂直微切片via hole 导通孔vision inspection 目视检查Void 孔破void in hole 孔壁上的破洞void in PTH hole 孔破walkman 随身听warehouse 仓库warp 板弯warp , warpage 板弯water absorption 吸水性wear resistance 耐磨度weave exposure 纤纹显露weave texture 织纹隐现wedge angle 契尖角week 周wet chemistry 湿式化学制程wet film 湿膜wet lamination 湿膜压膜法wet process 湿制程wetting 沾锡wetting balance 沾锡平衡法wicking 渗铜;渗入;灯蕊效应width 宽度width reduce 线细width-to-thickness ratio 宽度与厚度的比值window 操作范围work-in-process 在制品work order 工单working film 工作片working master 工作母片year 年yellow 金黄色yield 良率。
中英文对照的PCB专业用语
中英文对照地PCB 专业用语作者：深圳村村长 分类：英汉词汇大全 提交日期：2007-4-2 20:41:00 访问量：366综合词汇1、印制电路：printed circuit 2、印制线路：printed wiring 3、印制板：printed board 4、印制板电路： printed circuit board (pcb> 5、印制线路板： printed wiring board(pwb> 6、印制元件： printed component 7、印制接点： prin ted con tact 8、印制板装配： printed board assembly 9、 板：board单面印制板： sin gle-sided prin ted board(ssb> 双面印制板：double-sided prin ted board(dsb> 多层印制板： mulitlayer prin ted board(mlb> 多层印制电路板： mulitlayer prin ted circuit board 多层印制线路板： mulitlayer prited wiri ng board 刚性印制板：rigid prin ted board rigid sin gle-sided prin ted borad rigid double-sided prin ted borad rigid multilayer prin ted board flexible multilayer prin ted board挠性印制板：flexible printed board 挠性单面印制板：flexible si ngle-sided printed board22、 挠性双面印制板：flexible double-sided printed board 23、 挠性印制电路：flexible printed circuit (fpc> 24、挠性印制线路：flexible printed wiring 25、冈H 性印制板：flex-rigid printed board, rigid-flex printed board26、刚性双面印制板：flex-rigid double-sided printed board, rigid-flex double-sided prin ted 27、刚性多层印制板：flex-rigid multilayer printed board, rigid-flex multilayer prin ted board 28、齐平印制板：flush printed board 29、金属芯印制板：metal core printed board 30、 金属基印制板：metal base printed board31、 多重布线印制板：mulit-wiri ng prin ted board 32、 陶瓷印制板： ceramic substrate printed board33、 导电胶印制板： electroconductive paste printed board 34、模塑电路板：molded circuit board 35、 模压印制板： stamped printed wiring board10、 11、 12、 13、14、15、 16、17、 18、 19、 20、 21、 刚性单面印制板 刚性双面印制板 刚性多层印制板 挠性多层印制板36、顺序层压多层印制板：sequentially-laminated mulitlayer、 散线印制板： discrete wiri ng board 、 微线印制板： micro wire board 、 积层印制板： buile-up prin ted board 、 积层多层印制板： build-up mulitlayer prin ted board (bum> 、 积层挠印制板：build-up flexible prin ted board 、 表面层合电路板： surface lam inar circuit (slc> 、埋入凸块连印制板：b2it pri nted board 、 多层膜基板： multi-layered film substrate(mfs>、层间全内导通多层印制板：alivh multilayer prin ted board 、载芯片板：chip on board (cob> 、埋电阻板：buried resista nee board 、母板：mother board 、子板：daughter board 、背板：backplane 、裸板：bare board 、键盘板夹心板：copper- inv ar-copper board 、动态挠性板：dyn amic flex board 、静态挠性板：static flex board 、可断拼板：break-away pla nel 、电缆：cable 、挠性扁平电缆：flexible flat cable (ffc> 、薄膜开关：membra ne switch 、混合电路：hybrid circuit 、厚膜：thick film 、厚膜电路：thick film circuit 、薄膜：thin film 、薄膜混合电路：thin film hybrid circuit 、互连：interconnection 、导线：con ductor trace line 、齐平导线：flush conductor 、传输线：transmission line 、跨交：crossover 、板边插头：edge-board contact 、增强板：stiffener 、基底：substrate 、基板面：real estate 、导线面：con ductor side 、元件面：component side 、焊接面：solder side 、印制：printing 、网格：grid 、图形：pattern3738394041424344 4546 47 48 49 50 51 52 53 54 55 56 57 58 59 60 61 62 63 64 65 66 67 68 69 70 71 72 73 74 75 76 77 787980、导电图形：con ductive pattern、非导电图形：non-con ductive pattern81、字符：lege nd82、标志：mark二、基材：1、基材：base material2、层压板：laminate3、覆金属箔基材：metal-clad bade material4、覆铜箔层压板：copper-clad laminate (ccl>5、单面覆铜箔层压板：single-sided copper-clad laminate6、双面覆铜箔层压板：double-sided copper-clad laminate7、复合层压板：composite laminate8、薄层压板：thin laminate9、金属芯覆铜箔层压板：metal core copper-clad lam in ate10、金属基覆铜层压板：metal base copper-clad lam in ate11、挠性覆铜箔绝缘薄膜：flexible copper-clad dielectric film12、基体材料：basis material13、预浸材料：prepreg14、粘结片：bon di ng sheet15、预浸粘结片：preimpregnated bonding sheer16、环氧玻璃基板：epoxy glass substrate17、力卩成法用层压板：laminate for additive process18、预制内层覆箔板：mass lamination panel19、内层芯板：core material20、催化板材：catalyzed board ,coated catalyzed lam in ate21、涂胶催化层压板：adhesive-coated catalyzed lami nate22、涂胶无催层压板：adhesive-coated uncatalyzed laminate23、粘结层：bon di ng layer24、粘结膜：film adhesive25、涂胶粘剂绝缘薄膜：adhesive coated dielectric film26、无支撑胶粘剂膜：unsupported adhesive film27、覆盖层：cover layer (cover lay>28、增强板材：stiffener material29、铜箔面：copper-clad surface30、去铜箔面：foil removal surface31、层压板面：un clad lami nate surface32、基膜面：base film surface33、胶粘剂面：adhesive faec34、原始光洁面：plate finish35、粗面：matt finish36、纵向：len gth wise direct ion37、模向：cross wise direct ion38、剪切板：cut to size panel39、酚醛纸质覆铜箔板：phe no lie cellulose paper copper-clad lami nates(phe nolic/paper ccl>40、环氧纸质覆铜箔板：epoxide cellulose paper copper-cladlam in ates (epoxy/paper ccl>41、环氧玻璃布基覆铜箔板：epoxide wove n glass fabric copper- cladlam in ates42、环氧玻璃布纸复合覆铜箔板：epoxide cellulose paper core, glasscloth surfaces copper-clad lam in ates43、环氧玻璃布玻璃纤维复合覆铜箔板：epoxide non woven/woven glassrein forced copper-clad lam in ates44、聚酯玻璃布覆铜箔板：ployester woven glass fabric copper- cladlam in ates45、聚酰亚胺玻璃布覆铜箔板：polyimide woven glass fabric copper-cladlam in ates46、双马来酰亚胺三嗪环氧玻璃布覆铜箔板：bismaleimide/triaz in e/epoxidewove n glass fabric copper-clad lamimates47、环氧合成纤维布覆铜箔板：epoxide synthetic fiber fabric copper-cladlam inates48、聚四乙烯玻璃纤维覆铜箔板：teflon/fiber glass copper-cladlam in ates49、超薄型层压板：ultra thin laminate50、陶瓷基覆铜箔板：ceramics base copper-clad lam in ates51、紫外线阻挡型覆铜箔板：uv block ing copper-clad lami nates三、基材地材料1、 a 阶树脂：a-stage res in2、 b 阶树脂：b-stage res in3、 c 阶树脂：c-stage res in4、环氧树脂：epoxy resin5、酚醛树脂：phenolic resin6、聚酯树脂：polyester resin7、聚酰亚胺树脂：polyimide res in8、双马来酰亚胺三嗪树脂：bismaleimide-triazi ne res in9、丙烯酸树脂：acrylic resin10、三聚氰胺甲醛树脂：melamine formaldehyde resin11、多官能环氧树脂：polyfu ncti onal epoxy resin12、溴化环氧树脂：brominated epoxy resin13、环氧酚醛：epoxy novolac14、氟树脂：fluroresin15、硅树脂：silic one res in16、硅烷：silane17、聚合物：polymer18、无定形聚合物：amorphous polymer19、结晶现象：crystalline polamer20、双晶现象：dimorphism21、共聚物：copolymer22、合成树脂：synthetic23、热固性树脂：thermosetti ng res in24、热塑性树脂：thermoplastic res in25、感光性树脂：photose nsitive res in26、环氧当量：weight per epoxy equivale nt (wpe>27、环氧值：epoxy value28、双氰胺：dicyandiamide29、粘结剂：binder30、胶粘剂：adesive31、固化剂：curi ng age nt32、阻燃剂：flame retardant33、遮光剂：opaquer34、增塑剂：plasticizers35、不饱和聚酯：unsatuiated polyester36、聚酯薄膜：polyester37、聚酰亚胺薄膜：polyimide film (pi>38、聚四氟乙烯：polytetrafluoetylene (ptfe>39、聚全氟乙烯丙烯薄膜：perfluorinated ethylene-propylene copolymer film (fep>40、增强材料：reinforcing material41、玻璃纤维：glass fiber42、 e 玻璃纤维：e-glass fibre43、 d 玻璃纤维：d-glass fibre44、s 玻璃纤维：s-glass fibre45、玻璃布：glass fabric46、非织布：non-woven fabric47、玻璃纤维垫：glass mats48、纱线：yarn49、单丝：filament50、绞股：strand51、纬纱：weft yarn52、经纱：warp yarn53、但尼尔：denier54、经向：warp-wise55、纬向：weft-wise, filling-wise56、织物经纬密度：thread count57、织物组织：weave structure58、平纹组织：plain structure59、坏布：grey fabric60、稀松织物：woven scrim61、弓纬：bow of weave62、断经：end missing63、缺纬：mis-picks64、纬斜：bias65、折痕：crease66、云织：wav in ess67、鱼眼：fish eye68、毛圈长：feather length69、厚薄段：mark70、裂缝：split71、捻度：twist of yarn72、浸润剂含量：size content73、浸润剂残留量：size residue74、处理剂含量：finish level75、浸润剂：size76、偶联剂：coupli nt age nt77、处理织物：finished fabric78、聚酰胺纤维：polyarmide fiber79、聚酯纤维非织布：non-woven polyester fabric80、浸渍绝缘纵纸：impregnating insulation paper81、聚芳酰胺纤维纸：aromatic polyamide paper82、断裂长：breaking length83、吸水高度：height of capillary rise84、湿强度保留率：wet strength retention85、白度：whitenness86、陶瓷：ceramics87、导电箔：conductive foil88、铜箔：copper foil89、电解铜箔：electrodeposited copper foil (ed copper foil>90、压延铜箔：rolled copper foil91、退火铜箔：annealed copper foil92、压延退火铜箔：rolled annealed copper foil (ra copper foil>93、薄铜箔：thin copper foil94、涂胶铜箔：adhesive coated foil95、涂胶脂铜箔：res in coated copper foil (rcc>96、复合金属箔：composite metallic material97、载体箔：carrier foil98、殷瓦：invar99、箔<剖面)轮廓：foil profile100、光面：shiny side101、粗糙面：matte side102、处理面：treated side103、防锈处理：stai n proofi ng104、双面处理铜箔：double treated foil设计 原理图：shematic diagram 逻辑图：logic diagram 印制线路布设：printed wire layout 布设总图：master draw ing 可制造性设计：desig n-for-ma nu facturabilitycomputer-aided desig n.(cad> computer-aided manu facturi ng.(cam> computer in tegrat manu facturing.(cim> computer-aided engin eeri ng.(cae> computer-aided test.(cat>electric design automation .(eda> engin eeri ng desig n automat on .(eda2> assembly aided architectural desig n. (aaad> computer aided draw ing computer con trolled display .(ccd>布局：placement 布线：routing 布图设计：layout重布：rerouting 模拟：simulation 逻辑模拟：logic simulatio n 电路模拟：circit simulation 时序模拟：timing simulation 模块化：modularization 布线完成率：layout effecie ncy机器描述格式： mach ine descripti onm format .(mdf> 机器描述格式数据库：mdf databse 设计数据库：desig n database 设计原点：desig n origi n 优化 <设计)：optimization (design> 供设计优化坐标轴：predo minant axis 表格原点：table origin 镜像： mirroring 驱动文件：drive file 中间文件：in termediate file 制造文件：manufacturing documentation 队歹U 支撑数据库： queue support database 元件安置：comp onent positi oning 图形显示：graphics dispaly 比例因子：scaling factor 扫描填充：sca n filli ng 矩形填充：recta ngle filli ng 填充域：region filling 四、1、2、3、4、5、 6、 7、 8、 9、 10、 11、 12、 13、 14、15、 16、 17、 18、 19、 20、 21、 22、 23、 24、25、26、27、28、29、30、31、32、33、34、35、36、37、38、39、40、41、42、43、计算机辅助设计: 计算机辅助制造: 计算机集成制造:计算机辅助工程: 计算机辅助测试 电子设计自动化 工程设计自动化 组装设计自动化 计算机辅助制图 计算机控制显示、实体设计：physical desig n 、逻辑设计：logic desig n 、 逻辑电路：logic circuit 、层次设计：hierarchical desig n 、 自顶向下设计：top-dow n desig n 、 自底向上设计： bottom-up desig n 、 线网：net 、数字化：digitzing 、设计规贝 U 检查：desig n rule check ing 、走 <布）线器：router （cad>、 网络表：net list 、 计算机辅助电路分析： computer-aided circuit an alysis 、 子线网：sub net 、 目标函数：objective function 、设计后处理： post desig n process ing （pdp> 、交互式制图设计：in teractive draw ing desig n 、 费用矩阵：cost metrix 、工程图：engineering drawing 、 方块框图：block diagram 、迷宫：moze、元件密度：comp onent den sity 、 巡回售货员问题：traveli ng salesma n problem 、 自由度：degrees freedom 、 入度：out going degree 、 出度：incoming degree 、曼哈顿距离：man hatt on dista nee 、欧几里德距离：euclidea n dista nee 、网络：network 、阵列：array 、段: segment 、逻辑：logic 、 逻辑设计自动化：logic desig n automati on 、分线：separated time 、分层：separated layer 、定顺序：definite sequenee形状与尺寸： 导线 <通道）：con duct ion （track> 导线 <体）宽度：con ductor width导线距离：con ductor spaci ng 导线层：con ductor layer 导线宽度 / 间距：con ductor lin e/space 第一导线层： con ductor layer n o.1 44 45 46 47 48 49 50 51 52 53 545556 57 58 59 60 61 62 63 64 65 66 67 68 69 70 71 72 73 74 75 76 77 78五、 1、 2、 3、 4、 5、6、7、8、圆形盘：round pad 方形盘：square pad9、菱形盘：diamond pad10、长方形焊盘：oblong pad11、子弹形盘：bullet pad12、泪滴盘：teardrop pad13、雪人盘：snowman pad14、v 形盘：v-shaped pad15、环形盘：annular pad16、非圆形盘：non-circular pad17、隔离盘：isolation pad18、非功能连接盘：monfunctional pad19、偏置连接盘：offset land20、腹<背)裸盘：back-bard land21、盘址：anchoring spaur22、连接盘图形：land pattern23、连接盘网格阵列：land grid array24、孑L环：annular ring25、元件孔：component hole26、安装孔：mounting hole27、支撑孔：supported hole28、非支撑孔：unsupported hole29、导通孔：via30、镀通孔：plated through hole (pth>31、余隙孔：access hole32、盲孔：blind via (hole>33、埋孔：buried via hole34、埋/ 盲孔：buried /blind via35、任意层内部导通孔：any layer inner via hole (alivh>36、全部钻孔：all drilled hole37、定位孔：toaling hole38、无连接盘孔：Iandless hole39、中间孔：interstitial hole40、无连接盘导通孔：Iandless via hole41、引导孔：pilot hole42、端接全隙孔：terminal clearomee hole43、准表面间镀覆孔：quasi-interfacing plated-through hole44、准尺寸孔：dimensioned hole45、在连接盘中导通孔：via-in-pad46、孔位：hole location47、孔密度：hole density48、孔图：hole pattern49、钻孔图：drill drawing50、装配图：assembly drawing51、印制板组装图：prin ted board assembly drawing52、参考基准：datum referanee b5E2RGbCAP。
PCB专业术语中英文翻译
PCB专业术语中英文翻译很多PCB的书上使用的是英文，但是大多数的人又看不懂英文，这时候怎么办呢，我们需要翻译，但是如果每看到一个不会的词儿就去翻译，那么就太耗费时间了，所以我们捷多邦总结了一些常用的专业术语的中英文对照，希望能对大家有用。
1.印制电路：printed circuit2.印制线路：printed wiring3.印制板：printed board4.印制板电路：printed circuit board (pcb)5.印制线路板：printed wiring board(pwb)6.印制元件：printed component7.印制接点：printed contact8.印制板装配：printed board assembly9.板：board 110.表面层合电路板：surface laminar circuit (slc)11.埋入凸块连印制板：b2it printed board12.多层膜基板：multi-layered film substrate(mfs)13.层间全内导通多层印制板：alivh multilayer printed board14.载芯片板：chip on board (cob)15.埋电阻板：buried resistance board16.母板：mother board17.单面印制板：single-sided printed board(ssb)18.双面印制板：double-sided printed board(dsb)19.多层印制板：mulitlayer printed board(mlb)20.多层印制电路板：mulitlayer printed circuit board21.多层印制线路板：mulitlayer prited wiring board22.刚性印制板：rigid printed board23.刚性单面印制板：rigid single-sided printed borad24.刚性双面印制板：rigid double-sided printed borad25.刚性多层印制板：rigid multilayer printed board26.子板：daughter board27.背板：backplane28.裸板：bare board29.键盘板夹心板：copper-invar-copper board30.动态挠性板：dynamic flex board31.静态挠性板：static flex board32.可断拼板：break-away planel33.电缆：cable34.挠性扁平电缆：flexible flat cable (ffc)35.薄膜开关：membrane switch36.混合电路：hybrid circuit37.厚膜：thick film38.厚膜电路：thick film circuit39.薄膜：thin film40.挠性多层印制板：flexible multilayer printed board41.挠性印制板：flexible printed board42.挠性单面印制板：flexible single-sided printed board43.挠性双面印制板：flexible double-sided printed board44.挠性印制电路：flexible printed circuit (fpc)45.挠性印制线路：flexible printed wiring46.刚性印制板：flex-rigid printed board, rigid-flex printedboard47.刚性双面印制板：flex-rigid double-sided printed board,rigid-flex double-sided printed48.刚性多层印制板：flex-rigid multilayer printed board,rigid-flex multilayer printed board49.齐平印制板：flush printed board50.金属芯印制板：metal core printed board51.金属基印制板：metal base printed board52.多重布线印制板：mulit-wiring printed board53.陶瓷印制板：ceramic substrate printed board54.导电胶印制板：electroconductive paste printed board55.模塑电路板：molded circuit board56.模压印制板：stamped printed wiring board57.顺序层压多层印制板：sequentially-laminated mulitlayer58.散线印制板：discrete wiring board59.微线印制板：micro wire board60.积层印制板：buile-up printed board61.积层多层印制板：build-up mulitlayer printed board (bum)62.积层挠印制板：build-up flexible pr上面是一些比较常见的专业用语，有一些不是特别常用的有时候我们也会遇到，所以我们捷多邦也总结了一些不怎么常用的中英文对照，希望对你来说是有用的：1.Absorption 吸收、吸入2.Accelerated Test（Aging）加速试验、加速老化3.Accelerator 加速剂、速化剂4.Accept/Acceptance 允收5.Acceptable Quality Level（AQL）允收品质水准6.Accuracy 准确度ACF：7.Adhesive copper foil 有胶铜箔8.Activator 活化剂、添加剂比称为9.Activator Active parts（Devices）主动零件，指积体电路或电晶体10.Addition Agent 添加剂11.Additive Process 加成法、分全加成、半加成及部份加成12.Back Light（Back Lighting）背光法13.Back-UP 垫板14.Backpanels/ Backplanes 背板、支持板，厚度较厚，15.Ball Grid Array（BGA）球脚车列（封装）16.Barrel 孔壁17.Base Material 基材18.Batch 批（同时间发料某一数量的板子）19.Bevelling 切斜边20.Binder 黏结剂21.Capacitance 电容22.Carbide 碳化物、碳化钨钻头23.CAR: Corrective Action Report 改善报告24.Carbon Treatment 活性碳处理25.Card 卡板26.Carrier 载体27.Cartridge 滤芯28.Cathode 阴极L: Copper Clad Laminates 铜箔基板30.Ceramics 陶瓷31.Certificate 证明书32.CFC 氟氯碳化物33.Chloro-Fluoro-Carbon Chamfer 倒角、去掉直角34.Characteristic Impedance 特性阻抗35.Cheek list 检察清单36.Chip 晶粒、晶片37.Chip On Board 晶片黏著板38.Clean Room 无尘室(Class 100)39.Cleanliness 清洁度40.Clearance 余隙、余环41.COB（Chip on Board）晶片在板上直接组装42.COC（Certificate of Compliance）出货合格书。
PCB专业用语-中英文对照
PCB专业用语一、综合词汇1、印制电路：printed circuit2、印制线路：printed wiring3、印制板：printed board4、印制板电路：printed circuit board (pcb)5、印制线路板：printed wiring board(pwb)6、印制元件：printed component7、印制接点：printed contact8、印制板装配：printed board assembly9、板：board10、单面印制板：single-sided printed board(ssb)11、双面印制板：double-sided printed board(dsb)12、多层印制板：mulitlayer printed board(mlb)13、多层印制电路板：mulitlayer printed circuit board14、多层印制线路板：mulitlayer prited wiring board15、刚性印制板：rigid printed board16、刚性单面印制板：rigid single-sided printed borad17、刚性双面印制板：rigid double-sided printed borad18、刚性多层印制板：rigid multilayer printed board19、挠性多层印制板：flexible multilayer printed board20、挠性印制板：flexible printed board21、挠性单面印制板：flexible single-sided printed board22、挠性双面印制板：flexible double-sided printed board23、挠性印制电路：flexible printed circuit (fpc)24、挠性印制线路：flexible printed wiring25、刚性印制板：flex-rigid printed board, rigid-flex printed board26、刚性双面印制板：flex-rigid double-sided printed board, rigid-flex double-sided printed27、刚性多层印制板：flex-rigid multilayer printed board, rigid-flex multilayer printed board28、齐平印制板：flush printed board29、金属芯印制板：metal core printed board30、金属基印制板：metal base printed board31、多重布线印制板：mulit-wiring printed board32、陶瓷印制板：ceramic substrate printed board33、导电胶印制板：electroconductive paste printed board34、模塑电路板：molded circuit board35、模压印制板：stamped printed wiring board36、顺序层压多层印制板：sequentially-laminated mulitlayer37、散线印制板：discrete wiring board38、微线印制板：micro wire board39、积层印制板：buile-up printed board40、积层多层印制板：build-up mulitlayer printed board (bum)41、积层挠印制板：build-up flexible printed board42、表面层合电路板：surface laminar circuit (slc)43、埋入凸块连印制板：b2it printed board44、多层膜基板：multi-layered film substrate(mfs)45、层间全内导通多层印制板：alivh multilayer printed board46、载芯片板：chip on board (cob)47、埋电阻板：buried resistance board48、母板：mother board49、子板：daughter board50、背板：backplane51、裸板：bare board52、键盘板夹心板：copper-invar-copper board53、动态挠性板：dynamic flex board54、静态挠性板：static flex board55、可断拼板：break-away planel56、电缆：cable57、挠性扁平电缆：flexible flat cable (ffc)58、薄膜开关：membrane switch59、混合电路：hybrid circuit60、厚膜：thick film61、厚膜电路：thick film circuit62、薄膜：thin film63、薄膜混合电路：thin film hybrid circuit64、互连：interconnection65、导线：conductor trace line66、齐平导线：flush conductor67、传输线：transmission line68、跨交：crossover69、板边插头：edge-board contact70、增强板：stiffener71、基底：substrate72、基板面：real estate73、导线面：conductor side74、元件面：component side75、焊接面：solder side76、印制：printing77、网格：grid78、图形：pattern79、导电图形：conductive pattern80、非导电图形：non-conductive pattern81、字符：legend82、标志：mark二、基材：1、基材：base material2、层压板：laminate3、覆金属箔基材：metal-clad bade material4、覆铜箔层压板：copper-clad laminate (ccl)5、单面覆铜箔层压板：single-sided copper-clad laminate6、双面覆铜箔层压板：double-sided copper-clad laminate7、复合层压板：composite laminate8、薄层压板：thin laminate9、金属芯覆铜箔层压板：metal core copper-clad laminate10、金属基覆铜层压板：metal base copper-clad laminate11、挠性覆铜箔绝缘薄膜：flexible copper-clad dielectric film12、基体材料：basis material13、预浸材料：prepreg14、粘结片：bonding sheet15、预浸粘结片：preimpregnated bonding sheer16、环氧玻璃基板：epoxy glass substrate17、加成法用层压板：laminate for additive process18、预制内层覆箔板：mass lamination panel19、内层芯板：core material20、催化板材：catalyzed board ,coated catalyzed laminate21、涂胶催化层压板：adhesive-coated catalyzed laminate22、涂胶无催层压板：adhesive-coated uncatalyzed laminate23、粘结层：bonding layer24、粘结膜：film adhesive25、涂胶粘剂绝缘薄膜：adhesive coated dielectric film26、无支撑胶粘剂膜：unsupported adhesive film27、覆盖层：cover layer (cover lay)28、增强板材：stiffener material29、铜箔面：copper-clad surface30、去铜箔面：foil removal surface31、层压板面：unclad laminate surface32、基膜面：base film surface33、胶粘剂面：adhesive faec34、原始光洁面：plate finish35、粗面：matt finish36、纵向：length wise direction37、模向：cross wise direction38、剪切板：cut to size panel39、酚醛纸质覆铜箔板：phenolic cellulose paper copper-clad laminates(phenolic/paper ccl)40、环氧纸质覆铜箔板：epoxide cellulose paper copper-clad laminates (epoxy/paper ccl)41、环氧玻璃布基覆铜箔板：epoxide woven glass fabric copper-clad laminates42、环氧玻璃布纸复合覆铜箔板：epoxide cellulose paper core, glass cloth surfacescopper-clad laminates43、环氧玻璃布玻璃纤维复合覆铜箔板：epoxide non woven/woven glass reinforced copper-clad laminates44、聚酯玻璃布覆铜箔板：ployester woven glass fabric copper-clad laminates45、聚酰亚胺玻璃布覆铜箔板：polyimide woven glass fabric copper-clad laminates46、双马来酰亚胺三嗪环氧玻璃布覆铜箔板：bismaleimide/triazine/epoxide woven glass fabric copper-clad lamimates47、环氧合成纤维布覆铜箔板：epoxide synthetic fiber fabric copper-clad laminates48、聚四乙烯玻璃纤维覆铜箔板：teflon/fiber glass copper-clad laminates49、超薄型层压板：ultra thin laminate50、陶瓷基覆铜箔板：ceramics base copper-clad laminates51、紫外线阻挡型覆铜箔板：uv blocking copper-clad laminates三、基材的材料1、 a阶树脂：a-stage resin2、 b阶树脂：b-stage resin3、 c阶树脂：c-stage resin4、环氧树脂：epoxy resin5、酚醛树脂：phenolic resin6、聚酯树脂：polyester resin7、聚酰亚胺树脂：polyimide resin8、双马来酰亚胺三嗪树脂：bismaleimide-triazine resin9、丙烯酸树脂：acrylic resin10、三聚氰胺甲醛树脂：melamine formaldehyde resin11、多官能环氧树脂：polyfunctional epoxy resin12、溴化环氧树脂：brominated epoxy resin13、环氧酚醛：epoxy novolac14、氟树脂：fluroresin15、硅树脂：silicone resin16、硅烷：silane17、聚合物：polymer18、无定形聚合物：amorphous polymer19、结晶现象：crystalline polamer20、双晶现象：dimorphism21、共聚物：copolymer22、合成树脂：synthetic23、热固性树脂：thermosetting resin24、热塑性树脂：thermoplastic resin25、感光性树脂：photosensitive resin26、环氧当量：weight per epoxy equivalent (wpe)27、环氧值：epoxy value28、双氰胺：dicyandiamide29、粘结剂：binder30、胶粘剂：adesive31、固化剂：curing agent32、阻燃剂：flame retardant33、遮光剂：opaquer34、增塑剂：plasticizers35、不饱和聚酯：unsatuiated polyester36、聚酯薄膜：polyester37、聚酰亚胺薄膜：polyimide film (pi)38、聚四氟乙烯：polytetrafluoetylene (ptfe)39、聚全氟乙烯丙烯薄膜：perfluorinated ethylene-propylene copolymer film (fep)40、增强材料：reinforcing material41、玻璃纤维：glass fiber42、 e玻璃纤维：e-glass fibre43、 d玻璃纤维：d-glass fibre44、 s玻璃纤维：s-glass fibre45、玻璃布：glass fabric46、非织布：non-woven fabric47、玻璃纤维垫：glass mats48、纱线：yarn49、单丝：filament50、绞股：strand51、纬纱：weft yarn52、经纱：warp yarn53、但尼尔：denier54、经向：warp-wise55、纬向：weft-wise, filling-wise56、织物经纬密度：thread count57、织物组织：weave structure58、平纹组织：plain structure59、坏布：grey fabric60、稀松织物：woven scrim61、弓纬：bow of weave62、断经：end missing63、缺纬：mis-picks64、纬斜：bias65、折痕：crease66、云织：waviness67、鱼眼：fish eye68、毛圈长：feather length69、厚薄段：mark70、裂缝：split71、捻度：twist of yarn72、浸润剂含量：size content73、浸润剂残留量：size residue74、处理剂含量：finish level75、浸润剂：size76、偶联剂：couplint agent77、处理织物：finished fabric78、聚酰胺纤维：polyarmide fiber79、聚酯纤维非织布：non-woven polyester fabric80、浸渍绝缘纵纸：impregnating insulation paper81、聚芳酰胺纤维纸：aromatic polyamide paper82、断裂长：breaking length83、吸水高度：height of capillary rise84、湿强度保留率：wet strength retention85、白度：whitenness86、陶瓷：ceramics87、导电箔：conductive foil88、铜箔：copper foil89、电解铜箔：electrodeposited copper foil (ed copper foil)90、压延铜箔：rolled copper foil91、退火铜箔：annealed copper foil92、压延退火铜箔：rolled annealed copper foil (ra copper foil)93、薄铜箔：thin copper foil94、涂胶铜箔：adhesive coated foil95、涂胶脂铜箔：resin coated copper foil (rcc)96、复合金属箔：composite metallic material97、载体箔：carrier foil98、殷瓦：invar99、箔（剖面）轮廓：foil profile100、光面：shiny side101、粗糙面：matte side102、处理面：treated side103、防锈处理：stain proofing104、双面处理铜箔：double treated foil四、设计1、原理图：shematic diagram2、逻辑图：logic diagram3、印制线路布设：printed wire layout4、布设总图：master drawing5、可制造性设计：design-for-manufacturability6、计算机辅助设计：computer-aided design.(cad)7、计算机辅助制造：computer-aided manufacturing.(cam)8、计算机集成制造：computer integrat manufacturing.(cim)9、计算机辅助工程：computer-aided engineering.(cae)10、计算机辅助测试：computer-aided test.(cat)11、电子设计自动化：electric design automation .(eda)12、工程设计自动化：engineering design automaton .(eda2)13、组装设计自动化：assembly aided architectural design. (aaad)14、计算机辅助制图：computer aided drawing15、计算机控制显示：computer controlled display .(ccd)16、布局：placement17、布线：routing18、布图设计：layout19、重布：rerouting20、模拟：simulation21、逻辑模拟：logic simulation22、电路模拟：circit simulation23、时序模拟：timing simulation24、模块化：modularization25、布线完成率：layout effeciency26、机器描述格式：machine descriptionm format .(mdf)27、机器描述格式数据库：mdf databse28、设计数据库：design database29、设计原点：design origin30、优化（设计）：optimization (design)31、供设计优化坐标轴：predominant axis32、表格原点：table origin33、镜像：mirroring34、驱动文件：drive file35、中间文件：intermediate file36、制造文件：manufacturing documentation37、队列支撑数据库：queue support database38、元件安置：component positioning39、图形显示：graphics dispaly40、比例因子：scaling factor41、扫描填充：scan filling42、矩形填充：rectangle filling43、填充域：region filling44、实体设计：physical design45、逻辑设计：logic design46、逻辑电路：logic circuit47、层次设计：hierarchical design48、自顶向下设计：top-down design49、自底向上设计：bottom-up design50、线网：net51、数字化：digitzing52、设计规则检查：design rule checking53、走（布）线器：router (cad)54、网络表：net list55、计算机辅助电路分析：computer-aided circuit analysis56、子线网：subnet57、目标函数：objective function58、设计后处理：post design processing (pdp)59、交互式制图设计：interactive drawing design60、费用矩阵：cost metrix61、工程图：engineering drawing62、方块框图：block diagram63、迷宫：moze64、元件密度：component density65、巡回售货员问题：traveling salesman problem66、自由度：degrees freedom67、入度：out going degree68、出度：incoming degree69、曼哈顿距离：manhatton distance70、欧几里德距离：euclidean distance71、网络：network72、阵列：array73、段：segment74、逻辑：logic75、逻辑设计自动化：logic design automation76、分线：separated time77、分层：separated layer78、定顺序：definite sequence五、形状与尺寸：1、导线（通道）：conduction (track)2、导线（体）宽度：conductor width3、导线距离：conductor spacing4、导线层：conductor layer5、导线宽度/间距：conductor line/space6、第一导线层：conductor layer no.17、圆形盘：round pad8、方形盘：square pad9、菱形盘：diamond pad10、长方形焊盘：oblong pad11、子弹形盘：bullet pad12、泪滴盘：teardrop pad13、雪人盘：snowman pad14、 v形盘：v-shaped pad15、环形盘：annular pad16、非圆形盘：non-circular pad17、隔离盘：isolation pad18、非功能连接盘：monfunctional pad19、偏置连接盘：offset land20、腹（背）裸盘：back-bard land21、盘址：anchoring spaur22、连接盘图形：land pattern23、连接盘网格阵列：land grid array24、孔环：annular ring25、元件孔：component hole26、安装孔：mounting hole27、支撑孔：supported hole28、非支撑孔：unsupported hole29、导通孔：via30、镀通孔：plated through hole (pth)31、余隙孔：access hole32、盲孔：blind via (hole)33、埋孔：buried via hole34、埋/盲孔：buried /blind via35、任意层内部导通孔：any layer inner via hole (alivh)36、全部钻孔：all drilled hole37、定位孔：toaling hole38、无连接盘孔：landless hole39、中间孔：interstitial hole40、无连接盘导通孔：landless via hole41、引导孔：pilot hole42、端接全隙孔：terminal clearomee hole43、准表面间镀覆孔：quasi-interfacing plated-through hole44、准尺寸孔：dimensioned hole45、在连接盘中导通孔：via-in-pad46、孔位：hole location47、孔密度：hole density48、孔图：hole pattern49、钻孔图：drill drawing50、装配图：assembly drawing51、印制板组装图：printed board assembly drawing52、参考基准：datum referance。
PCB专业术语中英文汇总
中文
代码
英文名称
图形电镀去膜
SAP
Stripping after Pattern Plating
退锡
TSR
Tin Stripping
蚀刻/退锡
ETS
Etching, Tin Stripping
去膜/蚀刻/退锡
SES
DF Stripping, Etching, Tin Stripping
AOI：AOI
中文
代码
英文名称
外层离线AOI
OOA
Outer Offline AOI
外层AOI
OAO
Outer AOI
层间对准度测试1
QRE1
IPQC for Registration 1
外层VRS
OVR
Outer VRS
MASKAOI
MAO
Mask AOI
填孔AOI
SAO
Solid Via Filling Plating AOI
减铜干膜曝光
DER
D/F Exposuring before Copper Reduction
减铜干膜显影
DDR
D/F Development before Copper Reduction
减铜干膜LDI
DDC
D/F Laser Direct Image before Copper Reduction
脉冲全板电镀
PPP
Pulse Panel Plating
POFV沉铜
PBP
PTH before POFV
POFV电镀
POFV
Plate over Filling Via
全板电镀
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PCB专业用语一、综合词汇1、印制电路：printed circuit2、印制线路：printed wiring3、印制板：printed board4、印制板电路：printed circuit board (pcb)5、印制线路板：printed wiring board(pwb)6、印制元件：printed component7、印制接点：printed contact8、印制板装配：printed board assembly9、板：board10、单面印制板：single-sided printed board(ssb)11、双面印制板：double-sided printed board(dsb)12、多层印制板：mulitlayer printed board(mlb)13、多层印制电路板：mulitlayer printed circuit board14、多层印制线路板：mulitlayer prited wiring board15、刚性印制板：rigid printed board16、刚性单面印制板：rigid single-sided printed borad17、刚性双面印制板：rigid double-sided printed borad18、刚性多层印制板：rigid multilayer printed board19、挠性多层印制板：flexible multilayer printed board20、挠性印制板：flexible printed board21、挠性单面印制板：flexible single-sided printed board22、挠性双面印制板：flexible double-sided printed board23、挠性印制电路：flexible printed circuit (fpc)24、挠性印制线路：flexible printed wiring25、刚性印制板：flex-rigid printed board, rigid-flex printed board26、刚性双面印制板：flex-rigid double-sided printed board, rigid-flex double-sided printed27、刚性多层印制板：flex-rigid multilayer printed board, rigid-flex multilayer printed board28、齐平印制板：flush printed board29、金属芯印制板：metal core printed board30、金属基印制板：metal base printed board31、多重布线印制板：mulit-wiring printed board32、陶瓷印制板：ceramic substrate printed board33、导电胶印制板：electroconductive paste printed board34、模塑电路板：molded circuit board35、模压印制板：stamped printed wiring board36、顺序层压多层印制板：sequentially-laminated mulitlayer37、散线印制板：discrete wiring board38、微线印制板：micro wire board39、积层印制板：buile-up printed board40、积层多层印制板：build-up mulitlayer printed board (bum)41、积层挠印制板：build-up flexible printed board42、表面层合电路板：surface laminar circuit (slc)43、埋入凸块连印制板：b2it printed board44、多层膜基板：multi-layered film substrate(mfs)45、层间全内导通多层印制板：alivh multilayer printed board46、载芯片板：chip on board (cob)47、埋电阻板：buried resistance board48、母板：mother board49、子板：daughter board50、背板：backplane51、裸板：bare board52、键盘板夹心板：copper-invar-copper board53、动态挠性板：dynamic flex board54、静态挠性板：static flex board55、可断拼板：break-away planel56、电缆：cable57、挠性扁平电缆：flexible flat cable (ffc)58、薄膜开关：membrane switch59、混合电路：hybrid circuit60、厚膜：thick film61、厚膜电路：thick film circuit62、薄膜：thin film63、薄膜混合电路：thin film hybrid circuit64、互连：interconnection65、导线：conductor trace line66、齐平导线：flush conductor67、传输线：transmission line68、跨交：crossover69、板边插头：edge-board contact70、增强板：stiffener71、基底：substrate72、基板面：real estate73、导线面：conductor side74、元件面：component side75、焊接面：solder side76、印制：printing77、网格：grid78、图形：pattern79、导电图形：conductive pattern80、非导电图形：non-conductive pattern81、字符：legend82、标志：mark二、基材：1、基材：base material2、层压板：laminate3、覆金属箔基材：metal-clad bade material4、覆铜箔层压板：copper-clad laminate (ccl)5、单面覆铜箔层压板：single-sided copper-clad laminate6、双面覆铜箔层压板：double-sided copper-clad laminate7、复合层压板：composite laminate8、薄层压板：thin laminate9、金属芯覆铜箔层压板：metal core copper-clad laminate10、金属基覆铜层压板：metal base copper-clad laminate11、挠性覆铜箔绝缘薄膜：flexible copper-clad dielectric film12、基体材料：basis material13、预浸材料：prepreg14、粘结片：bonding sheet15、预浸粘结片：preimpregnated bonding sheer16、环氧玻璃基板：epoxy glass substrate17、加成法用层压板：laminate for additive process18、预制内层覆箔板：mass lamination panel19、内层芯板：core material20、催化板材：catalyzed board ,coated catalyzed laminate21、涂胶催化层压板：adhesive-coated catalyzed laminate22、涂胶无催层压板：adhesive-coated uncatalyzed laminate23、粘结层：bonding layer24、粘结膜：film adhesive25、涂胶粘剂绝缘薄膜：adhesive coated dielectric film26、无支撑胶粘剂膜：unsupported adhesive film27、覆盖层：cover layer (cover lay)28、增强板材：stiffener material29、铜箔面：copper-clad surface30、去铜箔面：foil removal surface31、层压板面：unclad laminate surface32、基膜面：base film surface33、胶粘剂面：adhesive faec34、原始光洁面：plate finish35、粗面：matt finish36、纵向：length wise direction37、模向：cross wise direction38、剪切板：cut to size panel39、酚醛纸质覆铜箔板：phenolic cellulose paper copper-clad laminates(phenolic/paper ccl)40、环氧纸质覆铜箔板：epoxide cellulose paper copper-clad laminates (epoxy/paper ccl)41、环氧玻璃布基覆铜箔板：epoxide woven glass fabric copper-clad laminates42、环氧玻璃布纸复合覆铜箔板：epoxide cellulose paper core, glass cloth surfacescopper-clad laminates43、环氧玻璃布玻璃纤维复合覆铜箔板：epoxide non woven/woven glass reinforced copper-clad laminates44、聚酯玻璃布覆铜箔板：ployester woven glass fabric copper-clad laminates45、聚酰亚胺玻璃布覆铜箔板：polyimide woven glass fabric copper-clad laminates46、双马来酰亚胺三嗪环氧玻璃布覆铜箔板：bismaleimide/triazine/epoxide woven glass fabric copper-clad lamimates47、环氧合成纤维布覆铜箔板：epoxide synthetic fiber fabric copper-clad laminates48、聚四乙烯玻璃纤维覆铜箔板：teflon/fiber glass copper-clad laminates49、超薄型层压板：ultra thin laminate50、陶瓷基覆铜箔板：ceramics base copper-clad laminates51、紫外线阻挡型覆铜箔板：uv blocking copper-clad laminates三、基材的材料1、 a阶树脂：a-stage resin2、 b阶树脂：b-stage resin3、 c阶树脂：c-stage resin4、环氧树脂：epoxy resin5、酚醛树脂：phenolic resin6、聚酯树脂：polyester resin7、聚酰亚胺树脂：polyimide resin8、双马来酰亚胺三嗪树脂：bismaleimide-triazine resin9、丙烯酸树脂：acrylic resin10、三聚氰胺甲醛树脂：melamine formaldehyde resin11、多官能环氧树脂：polyfunctional epoxy resin12、溴化环氧树脂：brominated epoxy resin13、环氧酚醛：epoxy novolac14、氟树脂：fluroresin15、硅树脂：silicone resin16、硅烷：silane17、聚合物：polymer18、无定形聚合物：amorphous polymer19、结晶现象：crystalline polamer20、双晶现象：dimorphism21、共聚物：copolymer22、合成树脂：synthetic23、热固性树脂：thermosetting resin24、热塑性树脂：thermoplastic resin25、感光性树脂：photosensitive resin26、环氧当量：weight per epoxy equivalent (wpe)27、环氧值：epoxy value28、双氰胺：dicyandiamide29、粘结剂：binder30、胶粘剂：adesive31、固化剂：curing agent32、阻燃剂：flame retardant33、遮光剂：opaquer34、增塑剂：plasticizers35、不饱和聚酯：unsatuiated polyester36、聚酯薄膜：polyester37、聚酰亚胺薄膜：polyimide film (pi)38、聚四氟乙烯：polytetrafluoetylene (ptfe)39、聚全氟乙烯丙烯薄膜：perfluorinated ethylene-propylene copolymer film (fep)40、增强材料：reinforcing material41、玻璃纤维：glass fiber42、 e玻璃纤维：e-glass fibre43、 d玻璃纤维：d-glass fibre44、 s玻璃纤维：s-glass fibre45、玻璃布：glass fabric46、非织布：non-woven fabric47、玻璃纤维垫：glass mats48、纱线：yarn49、单丝：filament50、绞股：strand51、纬纱：weft yarn52、经纱：warp yarn53、但尼尔：denier54、经向：warp-wise55、纬向：weft-wise, filling-wise56、织物经纬密度：thread count57、织物组织：weave structure58、平纹组织：plain structure59、坏布：grey fabric60、稀松织物：woven scrim61、弓纬：bow of weave62、断经：end missing63、缺纬：mis-picks64、纬斜：bias65、折痕：crease66、云织：waviness67、鱼眼：fish eye68、毛圈长：feather length69、厚薄段：mark70、裂缝：split71、捻度：twist of yarn72、浸润剂含量：size content73、浸润剂残留量：size residue74、处理剂含量：finish level75、浸润剂：size76、偶联剂：couplint agent77、处理织物：finished fabric78、聚酰胺纤维：polyarmide fiber79、聚酯纤维非织布：non-woven polyester fabric80、浸渍绝缘纵纸：impregnating insulation paper81、聚芳酰胺纤维纸：aromatic polyamide paper82、断裂长：breaking length83、吸水高度：height of capillary rise84、湿强度保留率：wet strength retention85、白度：whitenness86、陶瓷：ceramics87、导电箔：conductive foil88、铜箔：copper foil89、电解铜箔：electrodeposited copper foil (ed copper foil)90、压延铜箔：rolled copper foil91、退火铜箔：annealed copper foil92、压延退火铜箔：rolled annealed copper foil (ra copper foil)93、薄铜箔：thin copper foil94、涂胶铜箔：adhesive coated foil95、涂胶脂铜箔：resin coated copper foil (rcc)96、复合金属箔：composite metallic material97、载体箔：carrier foil98、殷瓦：invar99、箔（剖面）轮廓：foil profile100、光面：shiny side101、粗糙面：matte side102、处理面：treated side103、防锈处理：stain proofing104、双面处理铜箔：double treated foil四、设计1、原理图：shematic diagram2、逻辑图：logic diagram3、印制线路布设：printed wire layout4、布设总图：master drawing5、可制造性设计：design-for-manufacturability6、计算机辅助设计：computer-aided design.(cad)7、计算机辅助制造：computer-aided manufacturing.(cam)8、计算机集成制造：computer integrat manufacturing.(cim)9、计算机辅助工程：computer-aided engineering.(cae)10、计算机辅助测试：computer-aided test.(cat)11、电子设计自动化：electric design automation .(eda)12、工程设计自动化：engineering design automaton .(eda2)13、组装设计自动化：assembly aided architectural design. (aaad)14、计算机辅助制图：computer aided drawing15、计算机控制显示：computer controlled display .(ccd)16、布局：placement17、布线：routing18、布图设计：layout19、重布：rerouting20、模拟：simulation21、逻辑模拟：logic simulation22、电路模拟：circit simulation23、时序模拟：timing simulation24、模块化：modularization25、布线完成率：layout effeciency26、机器描述格式：machine descriptionm format .(mdf)27、机器描述格式数据库：mdf databse28、设计数据库：design database29、设计原点：design origin30、优化（设计）：optimization (design)31、供设计优化坐标轴：predominant axis32、表格原点：table origin33、镜像：mirroring34、驱动文件：drive file35、中间文件：intermediate file36、制造文件：manufacturing documentation37、队列支撑数据库：queue support database38、元件安置：component positioning39、图形显示：graphics dispaly40、比例因子：scaling factor41、扫描填充：scan filling42、矩形填充：rectangle filling43、填充域：region filling44、实体设计：physical design45、逻辑设计：logic design46、逻辑电路：logic circuit47、层次设计：hierarchical design48、自顶向下设计：top-down design49、自底向上设计：bottom-up design50、线网：net51、数字化：digitzing52、设计规则检查：design rule checking53、走（布）线器：router (cad)54、网络表：net list55、计算机辅助电路分析：computer-aided circuit analysis56、子线网：subnet57、目标函数：objective function58、设计后处理：post design processing (pdp)59、交互式制图设计：interactive drawing design60、费用矩阵：cost metrix61、工程图：engineering drawing62、方块框图：block diagram63、迷宫：moze64、元件密度：component density65、巡回售货员问题：traveling salesman problem66、自由度：degrees freedom67、入度：out going degree68、出度：incoming degree69、曼哈顿距离：manhatton distance70、欧几里德距离：euclidean distance71、网络：network72、阵列：array73、段：segment74、逻辑：logic75、逻辑设计自动化：logic design automation76、分线：separated time77、分层：separated layer78、定顺序：definite sequence五、形状与尺寸：1、导线（通道）：conduction (track)2、导线（体）宽度：conductor width3、导线距离：conductor spacing4、导线层：conductor layer5、导线宽度/间距：conductor line/space6、第一导线层：conductor layer no.17、圆形盘：round pad8、方形盘：square pad9、菱形盘：diamond pad10、长方形焊盘：oblong pad11、子弹形盘：bullet pad12、泪滴盘：teardrop pad13、雪人盘：snowman pad14、 v形盘：v-shaped pad15、环形盘：annular pad16、非圆形盘：non-circular pad17、隔离盘：isolation pad18、非功能连接盘：monfunctional pad19、偏置连接盘：offset land20、腹（背）裸盘：back-bard land21、盘址：anchoring spaur22、连接盘图形：land pattern23、连接盘网格阵列：land grid array24、孔环：annular ring25、元件孔：component hole26、安装孔：mounting hole27、支撑孔：supported hole28、非支撑孔：unsupported hole29、导通孔：via30、镀通孔：plated through hole (pth)31、余隙孔：access hole32、盲孔：blind via (hole)33、埋孔：buried via hole34、埋/盲孔：buried /blind via35、任意层内部导通孔：any layer inner via hole (alivh)36、全部钻孔：all drilled hole37、定位孔：toaling hole38、无连接盘孔：landless hole39、中间孔：interstitial hole40、无连接盘导通孔：landless via hole41、引导孔：pilot hole42、端接全隙孔：terminal clearomee hole43、准表面间镀覆孔：quasi-interfacing plated-through hole44、准尺寸孔：dimensioned hole45、在连接盘中导通孔：via-in-pad46、孔位：hole location47、孔密度：hole density48、孔图：hole pattern49、钻孔图：drill drawing50、装配图：assembly drawing51、印制板组装图：printed board assembly drawing52、参考基准：datum referance。