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人教版高中英语选择性必修第三册精品课件 Unit 2 分层跟踪检测(2)

人教版高中英语选择性必修第三册精品课件 Unit 2 分层跟踪检测(2)
ⅠⅡⅢⅣⅤ
cut out,be composed of,shave off,stick to,take up 4.Developers should have the courage of their convictions and
stick to what they do best. 5.It might be a good idea to shave off your beard before going to Beijing for the interview.
ⅠⅡⅢⅣⅤ
After three months’ training using the stimulators,Marc more or less stopped experiencing pace freezing.Marc says that passing through narrow paths or turning had previously caused pace freezing,which led to him falling five or six times a day.Marc has now been using the stimulator for two years and says he hardly falls any more,allowing him to walk several kilometres at a time.
解析 细节理解题。根据第二段中“However,many people don’t respond to these treatments,particularly if their condition is advanced,says Courtine.”可 知,Courtine 的团队设计这个装置是因为传统的治疗方法对许多人特别是 病情严重的人帮助不大。

modern system-on-chip design on arm 笔记

modern system-on-chip design on arm 笔记

modern system-on-chip design on arm 笔记Modern system-on-chip (SoC) design on ARM involves the integration of multiple components onto a single chip, enabling high-performance computing in a compact and power-efficient package. In this note, we will explore some key aspects of SoC design on ARM.1. Architecture: ARM provides a range of processor architectures, such as ARM Cortex-A, Cortex-R, and Cortex-M, each catering to different application requirements. SoC designers need to select the appropriate architecture based on factors like performance, power consumption, and real-time processing capabilities.2. Integration of Components: SoC design involves integrating various components like the processor core, memory subsystem, peripherals, and interfaces onto a single chip. This integration enables efficient communication between different components, reducing latency and power consumption.3. Power Management: Power management is a critical aspect of SoC design, as modern devices demand high performance while maintaining long battery life. SoC designers use techniques like power gating, clock gating, and voltage-frequency scaling to optimize power consumption in different operating modes.4. Security: With the increasing connectivity of devices, SoC design needs to prioritize security. ARM provides TrustZone technology, enabling the isolation of secure and non-secure software and protecting sensitive data from unauthorized access. SoC designers need to incorporate security features and developrobust encryption and authentication mechanisms.5. Verification and Validation: SoC designers undertake rigorous verification and validation processes to ensure the correct functioning of the integrated components. This involves testing the system for diverse scenarios, corner cases, and performance benchmarks. Advanced verification techniques like simulation, formal verification, and emulation are utilized to detect and fix design flaws.6. Software Development: SoC designers work closely with software developers to optimize software architecture for the specific SoC design. This collaboration involves developing device drivers, firmware, and operating systems that leverage the hardware capabilities effectively.7. Packaging and Manufacturing: Once the SoC design is finalized, it needs to be packaged and manufactured. The packaging involves integrating the chip into a package with appropriate interconnects and thermal management. The manufacturing process includes wafer fabrication, die testing, and final assembly.In conclusion, modern SoC design on ARM involves selecting the right processor architecture, integrating components, optimizing power consumption, ensuring security, thorough verification and validation, software development, and packaging/manufacturing. All these aspects collectively contribute to the successful deployment of efficient and high-performance ARM-based SoCs.。

英语作文-集成电路设计行业的智能芯片与系统解决方案

英语作文-集成电路设计行业的智能芯片与系统解决方案

英语作文-集成电路设计行业的智能芯片与系统解决方案The design and development of intelligent chips and system solutions in the integrated circuit design industry have revolutionized the way we interact with technology. These advancements have not only enhanced the performance and efficiency of electronic devices but have also opened up new possibilities for innovation in various fields.One of the key aspects of intelligent chip design is the integration of artificial intelligence (AI) algorithms. By incorporating AI into the chip architecture, designers are able to create systems that can learn and adapt to different situations, making them more efficient and versatile. This has led to the development of smart devices that can recognize speech, images, and patterns, enabling them to provide personalized experiences for users.Moreover, intelligent chips have also played a crucial role in the development of autonomous systems. By combining sensors, processors, and communication modules, designers have been able to create self-driving cars, drones, and robots that can navigate and interact with their environment without human intervention. These advancements have not only improved efficiency and safety but have also opened up new opportunities for automation in various industries.In addition to AI integration, intelligent chip design also focuses on energy efficiency and miniaturization. By optimizing the power consumption of chips and reducing their size, designers are able to create devices that are not only more environmentally friendly but also more portable and convenient for users. This has led to the development of wearable devices, smart home appliances, and IoT devices that can seamlessly integrate into our daily lives.Furthermore, intelligent chip design has also enabled the development of advanced security features. By incorporating encryption, authentication, and secure bootmechanisms into the chip architecture, designers are able to create systems that can protect sensitive data and prevent unauthorized access. This has become increasingly important in today's interconnected world, where cyber threats are becoming more sophisticated and prevalent.Overall, the integration of intelligent chips and system solutions in the integrated circuit design industry has transformed the way we interact with technology. From AI-powered devices to autonomous systems and energy-efficient gadgets, these advancements have not only improved the performance and efficiency of electronic devices but have also opened up new possibilities for innovation in various fields. As technology continues to evolve, intelligent chip design will play a crucial role in shaping the future of electronics and revolutionizing the way we live and work.。

华为突破技术封锁自主研发芯片英语作文

华为突破技术封锁自主研发芯片英语作文

华为突破技术封锁自主研发芯片英语作文全文共3篇示例,供读者参考篇1Huawei Breaks Through Technological Blockade withSelf-developed ChipsIn recent years, the Chinese tech giant Huawei has been faced with a technological blockade from the United States, which has severely restricted its access to key components such as semiconductors. However, Huawei has not been deterred by these challenges. Instead, the company has focused on developing its own chips, in a bid to achieve self-reliance and break free from the shackles of technological dependence.The development of self-developed chips by Huawei has been a monumental task, requiring significant investment in research and development, as well as a high level of technical expertise. In order to achieve this goal, Huawei has recruited top talent from around the world, investing heavily in training and development programs to nurture a new generation of chip designers and engineers.One of the key milestones in Huawei's journey towardsself-reliance in chip manufacturing was the launch of its flagship Kirin chipset series. This series of chips has been widely acclaimed for its performance and efficiency, and has been used in some of Huawei's most popular smartphones and tablets. The Kirin chipset series has not only enhanced Huawei's competitiveness in the global market but has also served as a testament to the company's ability to innovate and adapt in the face of adversity.In addition to developing its own chips, Huawei has also invested in building a state-of-the-art semiconductor manufacturing facility in China. This facility is equipped with cutting-edge technology and has the capacity to produce a wide range of chips for Huawei's various products. By establishing this manufacturing facility, Huawei has taken a significant step towards achieving self-sufficiency in chip production, reducing its reliance on external suppliers and ensuring a stable supply chain for its products.The success of Huawei in breaking through the technological blockade and developing its own chips has not only bolstered the company's position in the global market but has also inspired a new wave of innovation in the semiconductor industry.Many other Chinese companies have followed in Huawei's footsteps, investing in research and development to develop their own chips and reduce their dependence on foreign suppliers.In conclusion, Huawei's efforts to develop self-developed chips have been a remarkable achievement, demonstrating the company's commitment to innovation and self-reliance in the face of adversity. By breaking through the technological blockade and achieving self-sufficiency in chip manufacturing, Huawei has not only secured its future competitiveness but has also paved the way for a new era of technological innovation in China and beyond.篇2Huawei has recently made a significant breakthrough in overcoming technological blockades through self-developed chips. As a global leader in telecommunications, Huawei has faced challenges due to the restrictions imposed on it by certain governments. However, the company has shown resilience and innovation by investing heavily in its own research and development capabilities to create cutting-edge chips for its devices.Huawei's success in developing its own chips is a result of years of dedication and investment in research and development. The company's chip division, HiSilicon, has been working tirelessly to create top-of-the-line chips that can match or even surpass those produced by Western companies. The recent unveiling of the Kirin 9000 chipset, the world's first 5nm 5G SoC, is a testament to Huawei's technological prowess and its ability to compete on a global scale.The development of the Kirin 9000 chipset represents a major milestone for Huawei as it showcases the company's ability to break through technological barriers and achieveself-sufficiency in chip production. With this new chipset, Huawei can now reduce its reliance on external suppliers and ensure the supply chain for its devices remains secure in the face of external pressures.In addition to the Kirin 9000 chipset, Huawei has also made significant strides in other areas of chip development. The company has invested heavily in artificial intelligence (AI) chips and is working on developing its own AI processing units (APUs) to power its future devices. These AI chips will enable Huawei to deliver cutting-edge features and capabilities in its devices,further solidifying its position as a technological innovator in the industry.Overall, Huawei's breakthrough in self-developed chips is a testament to the company's commitment to innovation and its ability to overcome challenges through technology. By investing in its research and development capabilities, Huawei has shown that it can compete at a global level and continue to push the boundaries of what is possible in the world of telecommunications. With its self-developed chips, Huawei is setting the stage for a new era of technological advancement and shaping the future of the industry.篇3In recent years, Huawei, a leading global provider of information and communications technology (ICT) infrastructure and smart devices, has faced significant challenges due to technological restrictions imposed by the United States government. In response to these challenges, Huawei has been focusing on developing its own semiconductor technology to reduce reliance on foreign suppliers and ensure the security and sustainability of its supply chain.The United States government has placed Huawei on a trade blacklist, citing national security concerns and alleging that the company's products pose a threat to U.S. interests. This move has severely restricted Huawei's access to vital technologies, including semiconductor chips developed and manufactured by American companies. As a result, Huawei has been forced to find alternative ways to source these critical components and maintain its competitive edge in the global market.To overcome these obstacles, Huawei has made significant investments in research and development to accelerate the development of its own semiconductor technology. The company has established a dedicated division, Huawei HiSilicon, which focuses on designing and manufacturing advanced chips for use in its smartphones, telecommunications equipment, and other devices. Huawei has also built partnerships with Chinese semiconductor companies and academic institutions to leverage their expertise and resources in developing cutting-edge semiconductor technology.One of the key achievements of Huawei in its efforts to break through technological constraints is the development of its Kirin series of processors. These chips are designed to deliver high performance, energy efficiency, and advanced features to meetthe demands of today's increasingly complex and data-intensive applications. The latest Kirin processors, such as the Kirin 990 and Kirin 980, incorporate advanced technologies such as artificial intelligence (AI) processing, 5G connectivity, and advanced image processing capabilities.In addition to developing its own semiconductor technology, Huawei has also been exploring alternative sources of chips and components to diversify its supply chain and reduce its dependence on U.S.-based suppliers. The company has partnered with companies in countries such as Taiwan, South Korea, and Japan to secure a stable and reliable supply of key components for its products. Huawei has also invested in building its own manufacturing facilities and production lines to increase its capacity for producing semiconductor chips and other components in-house.Despite the challenges and obstacles it has faced, Huawei's efforts to break through technological constraints and develop its own semiconductor technology have shown promising results. The company's Kirin processors have received positive reviews for their performance, efficiency, and innovation, and have enabled Huawei to maintain its position as a leading player in the global ICT market.Looking ahead, Huawei remains committed to investing in research and development, fostering innovation, and building partnerships with technology companies and academic institutions to drive further advancements in semiconductor technology. By continuing to strengthen its capabilities in chip design and manufacturing, Huawei aims to secure its position as a key player in the global semiconductor industry and ensure the long-term success and sustainability of its business.。

MCUXpresso 配置工具的快速入门指南(网络版)说明书

MCUXpresso 配置工具的快速入门指南(网络版)说明书

1简介MCUXpresso 配置工具属于 NXP Cortex-M 处理器工具。

为了展示部分功能,您可以在 上在线查看引脚和时钟简化版本。

•引脚工具可用于配置引脚路由和电气化属性。

•时钟工具可用于配置系统时钟。

这些工具可用于评估芯片特性和功能,也可用于生成初始化代码。

2启动 MCUXpresso 配置工具一旦选定了器件,电路板,或套件,您可以使用引脚和时钟工具的在线版本检查相关配置。

•打开 。

•选择指定开发板并登录。

•从选择一个器件,电路板,或套件的下拉框中选择或在按名称搜索区域输入关键词来找到您选择的设备。

•一旦选定设备,选择用引脚工具在引脚工具中打开设备配置,或用时钟工具选择在时钟工具中打开设备配置。

您可以在两种工具中切换Figure 1.选择开发板Contents 1简介.................................................12启动 MCUXpresso 配置工具...........13引脚工具..........................................24时钟工具..........................................25生成源代码.. (3)MCUXWQSMCUXpresso 配置工具的快速入门指南 (网络版)Rev. 1 — 1/2021User's Guide所有的工具设置会被保存于配置中。

3引脚工具引脚工具允许显示和配置处理器的引脚。

可在引脚、外设信号或封装视图中完成基本配置。

可在路由引脚视图中调整更高级的设置(引脚电气功能)。

Figure 2.引脚工具4时钟工具时钟工具允许在时钟表视图中显示和更改时钟源以及输出设置。

可通过时钟显示图和详情视图调整更高级的设置。

可在时钟表,时钟显示图,和详情视图中更改时钟环境全局设置,例如运行模式、MCG 模式和 SCG 模式。

Figure 3.时钟工具5生成源代码在主菜单中,选择视图 > 源代码来打开源代码界面以查看生成的源代码。

Datacard Secure ID Solutions产品介绍说明书

Datacard Secure ID Solutions产品介绍说明书

TRUST THE EXPERTSIN SECURE IDENTIFICATIONPROTECT THE PEOPLE AND PLACES THAT MATTER MOSTThink about all the people who interact with your organization every day.Employees, customers, students, visitors — all of them are vital to your success. Equally critical is a secure environment. One that protects your stakeholders, facilities and data from a wide range of threats.Secure ID solutions from Datacard Group can help you increase security in any organization around the world. No other manufacturer offers a wider range of fully integrated solutions.This flexibility is critical. Because for small businesses, a secure ID solution may involve name-and-photo IDs, while schools and universities may require magnetic stripes that integrate with access control. Corporations and government agencies often need highly secure IDs with holographic laminates, and retailers may want to add a photo or digital signature to gift and loyalty cards.Datacard Group offers secure ID solutions to meet your needs and fit your budget.FLEXIBLE CHOICES FOR IMPROVING SECURITYDatacard Group offers one of the broadest portfolios of secure ID solutions available today. Whether you are printing your first ID cards, creating IDs for new facilities or employees, or enhancing your current cards with the latest technologies, we can provide exactly what you need.The key is versatility. We design and test the components of our solutions to work together in many different combinations. That means you can mix-and-match software, capture systems, card printers and other elements in a unique configuration that aligns perfectly with your top priorities.FROM A WORLD LEADER IN SECURE ID SOLUTIONSUnlike other manufacturers, Datacard Group specializes in end-to-endsolutions for secure IDs. Customers around the world insist on the Datacard ®brand because our solutions incorporate advanced technology to solve critical issues in many markets. We also continuously develop innovative features that increase durability, speed and output quality. The end result is exceptional customer satisfaction.Here are the steps your organization can take to create the right secure IDs.Datacard Group sales channels offer all of the products described here — and much more.1. Power Up Your Identification Software Identification software is where it all begins. This application enables you to customize card designs, manage cardholder images and related data, and print custom reports.2. Capture Images and Biometrics Use a digital camera to photograph the cardholder. Capture the cardholder’s fingerprint image and/or other biometrics, and record a digital signature.3. Print CardsAfter data capture, a desktop card printer prints the card in a single color, full-color or rewritable pixels. It may also encode the magnetic stripe or smart card chip.4. Reload SuppliesHigh-quality color ribbons, topcoats and laminates help ensure exceptional image quality, consistency and security.Periodically, you will need to replace supplies as they are consumed.5. Receive Professional Service Whether you work with Datacard SM Global Services directly or with one of the skilled dealers or distributors in our extensive service network, you will gain access to a team with the expertise and experience required to optimize performance.CRITICAL ISSUES TO ADDRESS• Design:One- or two-sided? One-color or full-color? Photos and/or logos?• Functionality:Visual identification or machine-readable authentication?• Environment:Average ID life span, daily usage, physical threats?• Demand:Volume of IDs,centralized/distributed production, growth plans?• Security:Access control integration,biometrics, sophisticated laminates?• Information:Data types, centralized database, secure Web access?HOW TO BUILD A MORE S ECURE ENVIRONMENTCREATE THE RIGHT CARD SOLUTIONS FOR YOUR ENVIRONMENTSecure ID cards can be used in a diverse number of ways. That is why Datacard ®secure ID solutions aredesigned to accommodate a broad array of needs across multiple markets and applications. Regardless of your specific needs, you can expect seamless compatibility, outstanding reliability and superior value. Plus, theseproducts can be integrated with an even wider range of third-party offerings for highly specialized applications.1. VI S UAL IDENTIFICATION S OLUTION• Essential car d d esi g n software • Mi d - to hi g h-volume car d p rintin g IDEAL FOR :• Retail • Gift car d s • Loyalty car d s • S tore d value• Time-an d -atten d ance • C asinos2. TRAN S ACTIONAL S OLUTION• S ecure ima g e ca p ture • Biometric ca p ture• C ar d p rintin g an d security laminate a pp lication • S o p histicate d ID software IDEAL FOR :• Government• National ID p ro g rams • Driverís license p ro g rams • Hi g h-tech cor p orations • Universities4. ADVANCED S ECURITY S OLUTION• Professional ima g e ca p ture • Hi g h-quality car d p rintin g • A d vance d ID software IDEAL FOR :• C or p orations• Hos p itals/healthcare • Visitor mana g ement • Universities3. ACCE SS CONTROL S OLUTION• Basic ima g e ca p ture • Low-volume car d p rintin g • Entry-level ID software IDEAL FOR :• S taff IDs • E d ucation • Health clubs• Membershi p or g anizationsS ecure IDs for ACCE SS CONTROL, which allowem p loyees an d visitors to enter facilities or lo g in to networks, may inclu d e:• Proximity car d s that utilize an embe dd e d ra d io frequency i d entification (RFID) trans p on d er• Magnetic stri p e enco d in g that su pp orts car d -swi p e systemsFor ADVANCED S ECURITY a pp lications, secure IDs require the most so p histicate d features available:• Printe d finger p rint image for p erceive d security • S tore d fin g er p rint minutia or other im p ossible-to-re p licate b iometrics• Datacar d ® DuraGar d ® virtual e dg e-to-e dg e security laminates with holo g ra p hic ima g es, micro p rintin g , g uilloche p atterns an d other o p tical variable d evices (OVDs)• Ultraviolet fluorescent p rintin gFor basic VI S UAL IDENTIFICATION , you can use:• Brilliant color p hotos • Logos an d other gra p hics • C ar d hol d er signature• Tam p er-evi d ent ghost imagesS ecure car d s can store d ata to su pp ort e-p urse, time- an d -atten d ance an d other TRAN S ACTIONAL systems with:• S cannable b ar co d es • Enco d e d magnetic stri p es• C ontact or contactless smart car d s p ersonalize d with machine-rea d able d ataThese offerin g s make it sim p le to ca p ture car d hol d er ima g es an d biometrics with exce p tional efficiency.Datacar d ® Tru ™ Photo Intro solutionFor low-volume, manual ima g e ca p ture an d cro pp in g Datacar d ® Tru ™ Photo solution For automate d one-click ca p ture an d cro pp in g Datacar d ®Tru ™Photo Professional solution For automate d hi g h-quality ima g e ca p ture an d cro pp in gDatacar d ® Tru ™ S ignature solution C a p tures an d stores d i g ital si g natures Datacar d ® Tru ™ Finger p rint solutionC a p tures fin g er p rint ima g es an d /or minutiaEA S Y IMAGE AND BIOMETRIC CAPTUREOur versatile, easy-to-use software fits virtually any user environment.Datacar d ® ID Works ® i d entification software This flexi b le, p owerful p latform comes in four unique versions: • ID Works Intro for entry-level ID car d s• ID Works Basic for essential car d d esi g n an d p rintin g • ID Works S tan d ar d for a d vance d car d d esi g n an d d atabase mana g ement• ID Works Enter p rise for so p histicate d security, biometrics an d smart car d a pp licationsDatacar d ® ID Works ® Visitor Manager solutionS cans g overnment-a pp rove d cre d entials an d p rints secure IDs for fast visitor enrollmentU S ER-FRIENDLY IDENTIFICATION S OFTWAREDatacar d car d p rinters d eliver outstan d in g ima g e quality, reliabilityan d versatility.Datacar d ® S P 25 Plus car d p rinterAffor d able full-color or rewritable car d s for manual-fee d a pp lications Datacar d ® S P35 Plus car d p rinter Easy-to-use p rinter for one-si d e d color car d s Datacar d ®S P55 Plus car d p rinter Fast p rint s p ee d s for one- or two-si d e d color car d sDatacar d ® S P75 Plus car d p rinterPro d uces hi g hly secure IDs an d a pp lies virtual e dg e-to-e dg e laminates Datacar d ® RP90 Plus car d p rinterUses retransfer technolo g y to p rint on heavy-d uty com p osite car d sPOWERFUL, VER S ATILE CARD PRINTER SDatacar d ® Certifie d S u pp lies featurin g Intelli g ent S u pp lies Technolo g y ™hel p ensure su p erior ima g e quality, consistent car d p rintin g an d outstan d in g p erformance. They incor p orate p atente d RFID technolo g y, which allows Datacar d car d p rinters to reco g nize when the su pp lies are installe d , automatically a d just settin g s an d track consum p tion. Datacar d ® DuraGar d ® virtual e d ge-to-e d ge security laminates feature stan d ar d an d customize d o p tical variable d evices (OVDs), inclu d in g holo g ra p hic artwork, micro p rintin g , g uilloche p atterns, laser retrievable covert text an d color shift ink. These exclusive su pp ly items si g nificantly im p rove car d security an d d urability.Datacar d S M Glo b al S ervices an d our extensive network of service ex p erts s p ecialize in hel p in g or g anizations of all kin d s p lan an dim p lement successful secure ID p ro g rams. These d e d icate d ex p erts can work with you to accelerate d e p loyment, resolve common issues an d fine-tune p rocesses.HIGH-QUALITY S UPPLIE S AND DEDICATED S ERVICE STHE INDUSTRY’S BEST-SELLING SECURE ID SOLUTIONSDatacard secure ID solutions include everything you need to build a more secure environment for your organization. Because they are engineered to work together seamlessly, Datacard secure ID solutions provide outstanding uptime and proven long-term reliability. So you can protect your people and facilities — as well as your technology investment.CONVENIENT DESIGN, EXCELLENT EASE OF USEConvenient card printingThe SP35 Plus card printer is designed for easy operationand er-friendly features include:• A printer driver that provides message prompts,recovery instructions,color image previews and online user help• Driver support for Microsoft®Windows®2000,XP and Windows Vista®operating systems • Quick-change supplies• Operator-replaceable printheads • Front-facing input andoutput card hoppers• Small,efficient design• Continuous card cleaning The Datacard®SP35 Plus card printer delivers everything you need to print vivid, one-sided cards. With its productive print speed, superb image quality and easy operation, this convenient printer is ideal for issuing education, healthcare and staff IDs — and more.•Exceptional productivity.The SP35 Plus card printer personalizes up to 160 full-color cards or 750 one-color cards per hour. This printer is also extremely light and portable, weighing only nine pounds. Its sleek design and compact size make it a welcome addition to any desktop.• Superb edge-to-edge imaging. The SP35 Plus card printer leverages Advanced Imaging Technology™to produce vivid and vibrant full- or one-color photos, graphics and text across the entire card surface. This exclusive technology uses optimized print ribbons and user-adjustable controls to yield smooth, uniform and solid backgrounds, improved color matching with image capture devices, enhanced bar code printing and sharp reproduction of edges and fine text.• Multiple options and capabilities.In addition to standard bar code printing, the SP35 Plus card printer gives you the option to integrate magnetic stripe encoding and smart card personalization with a factory option or simple field upgrade. So, you can purchase these printers with confidence, knowing you can upgrade your card printing capabilities at any time.DATACARD®SP35 PLUS CARD PRINTER11111Bren Road WestMinnetonka, MN 55343-9015+1 952 Plus card printer offers an ideal mix of convenience and simplicity in an attractive,Datacard, Intelligent Supplies Technology and Advanced Imaging Technology are registered trademarks, trademarks and/or service marks of DataCard Corporation in the United States and/or other countries. Microsoft, Windows, and Windows Vista are registered trademarks of MicrosoftCorporation. Names and logos on sample cards are fictitious. Any similarity to actual names, trademarks or tradenames is coincidental.©2007-2008 DataCard Corporation. All rights reserved.Specifications subject to change without er-friendly operationAudible and visual message prompts Electrical requirements 100/120V,www.ID (800) 321-4405。

电子密码锁中英文对照外文翻译文献

电子密码锁中英文对照外文翻译文献

电子密码锁中英文对照外文翻译文献This article discusses the design of a matrix keyboard and LCD display based on a microcontroller unit (MCU) for use in electronic password locks。

The keyboard and display are crucial components of the lock。

allowing users to input their password and receive feedback on the lock's status。

The design includes a 4x4 matrix keyboard and a 16x2 LCD display。

both of which are controlled by the MCU。

The article provides a detailed n of the design process。

including the hardware and are components。

and XXX.nXXX and electronic components to provide users with access control。

One key component of these locks is the keyboard and display。

which allow users to input their password and receive feedback on the lock's status。

In this article。

we will discuss the design of a matrix keyboard and LCD display based on an MCU for use in electronic password locks.DesignThe design of the matrix keyboard and LCD display is based on an MCU。

斯普锐SE3102N系列二维码识读引擎集成手册说明书

斯普锐SE3102N系列二维码识读引擎集成手册说明书

SE3102N Embedded 2D Barcode Scan Engine Intergration guideSE3102N 系列二维码识读引擎集成手册苏州斯普锐智能系统有限公司Email:*******************Tel: 400-850-8151目录目录Disclaimer免责声明 (3)Revision History版本记录 (4)Chapter 1 Introduction介绍 (5)1.1Product Overview 产品概述 (5)1.2Illumination 照明指示 (5)Chapter 2 Installation安装 (6)2.1General Requirements 一般要求 (6)2.1.1 ESD 静电保护 (6)2.1.2 Dust and Dirt 防尘防污 (6)2.1.3 Ambient Environment 环境 (6)2.1.4Thermal Considerations 散热考虑 (6)2.1.5 Installation Orientation安装朝向 (7)2.2Optics 光学相关 (7)2.2.1 Window Placement 窗口放置 (7)2.2.2Window Material and Color 窗口材质与颜色 (8)2.2.3Scratch Resistance and Coating 窗口防刮与涂层 (8)2.2.4Window Size窗口尺寸 (8)2.2.5Ambient Light 环境光 (10)2.2.6 Eye Safety 人眼安全 (10)2.2.7Mounting 装嵌 (10)Chapter 3 Electrical Specifications电气特性 (12)3.1Power Supply 电源要求 (12)3.2Ripple Noise纹波噪声 (12)3.3 DC Characteristics 直流特性 (12)3.3.1Operating Voltage 工作电压 (12)3.3.2Current 电流 (13)Chapter 4Interfaces接口 (14)4.1Host Interface Connector主机接口连接器 (15)4.2Flat Flexible Cable扁平柔性电缆 (15)4.3Communication Interfaces通讯接口 (16)4.4Control Interfaces 控制接口 (16)4.4.1 Trigger 触发 (16)4.4.2Beeper 蜂鸣器信号 (17)4.4.3 Decode LED 解码 LED信号 (18)4.4.4 SE3102N engine datasheet 引擎数据表 (19)Disclaimer免责声明2014 Suzhou SuperMax Smart System Co., Ltd. All rights reserved.苏州斯普锐智能系统有限公司对本声明拥有最终解释权。

10-tips-for-successful-scan-design-part-one

10-tips-for-successful-scan-design-part-one

10 tips for successful scan design: part oneKen Jaramillo - February 17, 2000Although scan-design methodologies have existed for several years, many companies are just starting to explore the use of scan, particularly as these companies create more complex, system-o--chip (SOC) designs. With gate counts increasing at an enormous rate, producing high-fault-coverage production tests without using scan techniques becomes increasingly difficult. Scan is becoming a necessary design methodology to produce high-quality chips.If you're just starting out in scan design, this two-part series provides useful design tips to ensure successful adoption of scan-design methodologies within your company or design group. Part one reviews the scan methodology and techniques. Part two presents the tips. By adhering to these tips, you can produce chips that current automatic-test-pattern-generation (ATPG) tools can process to generate scan-based test vectors providing high fault coverage.Before starting your project, research scan-design methodologies and read as much as you can. In addition to this series, references 1 and 2 are great introductions to scan. (You can also download "Simple case study." ) Don't expect just the "scan expert" of the project to learn scan techniques. Get everyone involved. The more the designers know, the easier it is for them to produce scan-friendly designs. (See sidebar "Glossary" for a list of definitions and acronyms.)Also, don't underestimate the amount of time it takes to produce a scan design. If your company is just starting out, scan design will require a large amount of time. You may encounter many pitfalls and unexpected problems. Your managers may want to send the chip to the fab without allowing you much time to simulate the test patterns produced by the ATPG tools. But if you don't run back-annotated simulations of the test patterns, then don't expect the patterns to work. These simulations will alert you to timing problems, tool problems, and functional problems.Why is scan important?Designers create functional simulations to verify the proper operation of their designs. For example, a designer of a memory controller creates simulations to verify that the design operates correctly within the system. This approach is fine for the virtual world, in which the chip is only bits and pieces of HDL coding. However, you ultimately want to manufacturer a real chip and verify that it works properly. Production tests can verify that the manufacturer correctly implemented the design and that the design is free from flaws, such as power and ground shorts, open interconnections due to dust particles, and others. In short, production testing ensures that the customer receives high-quality parts with low failure rates.In the past, you could use functional simulations to generate test vectors, which you could then useto verify newly manufactured chips on a tester. But because of the high gate counts and extreme complexity of today's SOC designs, these production-test techniques are quickly running out of steam. You can still use functional simulations to verify the operation of a design, but producing enough simulations to provide high fault coverage is becoming more difficult. For example, consider a 500,000-gate design that contains an embedded ARM processor, an embedded DSP µP, a complex memory controller, and several high-gate-count peripherals. Although design teams can produce enough functional simulations to verify the chip, these functional simulations would probably provide only about 80% fault coverage if you used them to produce production-test vectors. The amount of effort necessary to create additional simulations that result in high fault coverage, 95% for example, would be difficult and time consuming.With the advent of scan-design techniques and ATPG tools, however, you can take this same design and quickly produce several thousand production-test vectors that provide high fault coverage. The use of scan-design techniques simplifies the problem of test-pattern generation by reducing the design, or sections of a design, into purely combinational logic. Then you can make use of fast and efficient algorithms in ATPG tools—algorithms that the tool designer developed for combinational logic—to generate high-fault-coverage vectors.What is scan?The goal of any production-testing scheme is to verify that the chip is manufactured correctly. Consider the simple circuit in Figure 1. If you want to verify that node A is not stuck at 0, due to a manufacturing flaw that shorts this node to ground, you can create the vector (A=1, B=0, C=0). Setting B and C low allows modifications of A to directly control the output at D. If A is stuck at 0, then D will be 0, no matter what value drives A. Similarly, you can create other vectors to verify that each node is not stuck high or low. You can manually create these simple test vectors with little effort. However, if the design is complicated and contains thousands of flip-flops and hundreds of thousands of combinational logic gates, manually creating these test vectors is laborious.The use of scan-design techniques allows you to use all of the flip-flops in a design as a big shift register during scan testing. Thus, you can shift patterns into the chip, for example to drive the inputs of Figure 1's circuit with A=1, B=0, and C=0. The flip-flops capture the functional data that results from the test pattern, for example to capture the value at D, which is 1, and you can shift out the results. This internal scan increases the controllability and observability of internal nodes by connecting storage cells into a long shift register, or scan chain, and by enhancing the logic of these cells to support a scan-shift mode that allows for serial loading and unloading of scan chain's contents.In normal operational mode, the scan chain does not affect system operation. When you select scan mode, however, the outputs of each storage cell in the scan design become primary inputs to the combinational logic, which increases controllability. The inputs of each scan storage cell allow registering of the outputs of the combinational logic, which increases observability. ATPG tools are proficient at generating test patterns to provide high fault coverage for combinational logic. Scan allows the tools to have easy access to all the combinational logic in the design.Figure 2a shows a simple circuit without any scan circuitry. The circuit contains three flip-flops and some combinational logic. This circuit could represent a simple state machine with a registered output. You add scan to this design to create the design in Figure 2b. You need to add only three additional pins, or pads, for scan testing: a scan-input pin for serial data input, a scan-output pin for serial data output, and a scan-enable pin for scan-mode control. This design shares the scan clock with the system clock. You can often use multiplexers to combine these pads with system-operation pads, which reduces the I/O overhead. This example forms a serial scan chain from the scan-inputpad, connecting each flip-flop into a scan register that is 3 bits long. The output of the final flip-flop connects to the scan-output pad. Each of the flip-flops in Figure 2b is now a flip-flop with a multiplexed input. The scan-enable signal selects between the normal functional-data input, which comes from the combinational-logic clouds, and the scan data, which comes from the scan input or the previous flip-flop. The scan-chain ordering is from flip-flop 1 to flip-flop 3.Figure 3 illustrates the timing for scan testing of Figure 2b's circuit. The timing sequence consists of three stages: first scan mode, then normal system mode, then scan mode again. Scan enable=1 selects the scan mode, during which data serially loads into the scan chain from the scan-input signal. When the scan chain is fully loaded, which requires one scan clock for each storage cell in the scan chain, scan enable=0 selects the normal system mode. In this mode, the system applies one system clock, applies data at the primary inputs of the chip, and observes data at the primary outputs of the chip. This procedure captures data from the combinational-logic elements of the design into the scan-storage cells. The system asserts and deasserts the scan-enable signal on the falling edge of the clock, which helps ease timing, especially the hold-time constraints. In the last and third part of the sequence, the system again selects scan mode with scan enable=1 and uses the scan clock to unload the scan chain through the scan output. The tester then checks this output data against expected values. While captured data shifts out of the scan chain, the system can load input data from the next scan-test pattern into the scan chain.Figure 4 shows a circuit with two clock domains and with the scan circuit in place. The upper portion of the figure shows clock domain 1 using clk1 and consists of two flip-flops and some combinational logic. The bottom portion of the figure shows clock domain 2 using clk2; it consists of three flip-flops and some combinational logic. You can think of the circuit as two state machines with a shared communication signal, A, that flip-flop 5 synchronizes to clk2. This example includes two scan chains, one for each clock domain. The first scan chain starts with scan input 1 going through flip-flops 1 and 2 to scan output 1. The second scan chain starts with scan input 2 going through flip-flops 3, 4, and 5 to scan output 2. The circuit has only one scan-enable signal, even though there are two scan chains. Because the two scan chains interact—via the functional path from flip-flop 1 toflip- flop 5—you have to be careful when you assert the clocks during the capture cycle, or you could end up with a hold-time violation at flip-flop 5.Figure 5 illustrates the timing for scan testing of this circuit. Similar to the timing diagram in Figure 3, this sequence has three stages. During scan mode, when scan enable=1, data loads serially into the scan chains from scan input 1 and scan input 2. Each of the two scan chains loads in parallel. The length of the longest scan chain determines the length of the scan-shift operation. Scan chain 2 is three flip-flops long. Therefore, the scan-shift operation takes three clocks. Scan chain 1 is only two flip-flops long. However, you can still shift three data values into this chain as long as the first value is a "don't care."As in Figure 3, when the scan chains are loaded, scan enable=0 selects normal mode: The system applies one clock, applies data at the primary inputs of the chip, and observes the data at the primary outputs of the chip. As before, this action captures data from the combination-logic elements of the design into the scan-storage cells. However, the capture cycle in Figure 5 differs from the cycle in Figure 3, which has only one clock domain. Because two clock domains exist and interact, the capture cycle must stagger the assertion of the clocks. Staggering the clocks prevents any timing problems with the data crossing the clock domains. The capture cycle first clocks data into scan chain 1, at the first clock after scan enable goes low, to capture data into the clk1-based flops. The capture cycle then clocks data into scan chain 2, at the second clock after scan enable goes low, to capture data into the clk2 based flops. After capture data latches into the flip-flops on scan chain 1, the functional input to flip-flop 5 of the second scan chain will change. Only sequential-based ATPG tools can handle this situation. Purely combinational-based ATPG tools cannot. If you're using a combinational ATPG tool, you should tell the tool to assert only one of the clocks during the capture cycle. The tool then asserts clk1 or clk2 only during the capture cycle, which results in a higher number of patterns for the same level of fault coverage.Finally, the cycle again selects scan mode, and the system uses the scan clocks to unload the scan chains through the scan-output pins. While capture data shifts out of the scan chains, input data from the next scan-test pattern can begin loading. Note that Figure 5 shows the first cycle of the shift.Scan techniques and elementsAll of the examples so far use flip-flops with multiplexed inputs for the scan-storage elements. These multiplexed flip-flops are only one type of scan-storage element. The other types of scan elements are clocked scan elements and level-sensitive-scan-design (LSSD) elements. Each type of scan element provides its own benefits. Multiplexed flip-flop and clocked-scan techniques are better suited for designs that contain edge-triggered flip-flops. LSSD techniques are better suited for latch-based designs. The type of scan element you decide to use depends on your design and your ASIC vendor. The examples in this article use the multiplexed flip-flop technique.A multiplexed flip-flop scan element contains a single D-type flip-flop with multiplexed inputs that allows selection of either normal functional data or scan- input data. Figure 6a shows a multiplexed flip-flop scan element. In normal mode (scan enable=0), the system data, or functional input, goes through to the flip-flop, which registers the data. In scan mode (scan enable=1), scan data goes through to the flip-flop so that the flip-flop registers the scan data.Clocked-scan elements are similar to multiplexed flip-flop elements but use a dedicated test clock to register scan data into the flip-flop (Figure 6b). During normal operation, the system clock registers the system data at the functional input into the flip-flop. During scan mode, the scan clock registers the scan data into the flip-flop.LSSD uses three independent clocks to capture data into the two latches within the scan cell (Figure 6c). During normal mode, the master latch uses the system clock to latch system data at the functional input and to output this data to the normal functional-data output path. During scan mode, the two scan clocks control the latching of data through the master and slave latches to generate the data at the scan output.Lockup latchesScan chains are vulnerable to clock-skew problems for two main reasons. The first reason has to do with layout and propagation delay. The same clock may drive hundreds or thousands of scan-storage cells with no circuitry between them. Logically adjacent storage cells in the scan chain may be physically separated in the layout. Clock skew between successive scan-storage cells must be less than the propagation delay between the scan output of the first storage cell and the scan input of the next storage cell. Otherwise, data slippage may occur. Thus, data that latches into the first scan cell also latches into the second scan cell. This situation results in an error because the second scan cell should latch the first scan cell's "old" data rather than its "new" data. Figure 7 demonstrates that the path delay for the data is less than that of the clock. Thus, the "new" data at Da passes all the way through to Dd in one clock period. The second flip-flop should have latched the "old" value at Dc (a logic high) rather than the "new" value.The second reason for clock skew is that clock domains separate the scan chains. For example, allthe flip-flops from the clk1 clock domain in Figure 4 are linked in the same scan chain. Likewise all the flip-flops from the clk2 clock domain form a second scan chain. If you want to link these two scan chains to form a single scan chain, timing problems could result. Two clock trees generate the two clocks, which introduces some amount of skew between the two clocks. You cannot link the two scan chains unless you handle this clock-skew problem. The timing for this scenario would be very much the same as that in Figure 7 except there would be two separate clocks rather than a single clock. Lockup latches are nothing more than transparent latches. You use them to connect two scan-storage elements in a scan chain in which excessive clock skew exists. Figure 8 illustrates the use of lockup latches. The circuit contains two flip-flops. Flip-flop 1 represents the end of the scan chain that contains only elements that are in the clk1 clock domain. Flip-flop 2 represents the beginning of the scan chain that contains only elements that are in the clk2 clock domain. Although the figure doesn't show it, these flip-flops have multiplexed inputs. The inputs of these flip-flops represent the scan inputs of the multiplexers. The latch has an active-high enable, which becomes transparent only when clk1 goes low and effectively adds a half clock of hold time to the output of flip-flop 1. In this figure, you assume that the system synchronously asserts clk1 and clk2, which would be the normal case during scan-mode operation. Although the clocks synchronously assert, some amount of clock skew between them still exists because they come from different clock trees.Figure 8 shows the use of lockup latches to connect scan chains from different clock domains. However, you can just as easily use these latches to connect scan chains from various blocks within a chip that, although on the same scan chain, are physically remote from each other on the die. You want to make the latch transparent during the inactive part of the clock. For example, both flip-flops in Figure 8 trigger on the rising edge of the clock. Therefore, you want to make the lockup latch transparent during the low period of the clock. If the flip-flops trigger on the falling edge of the clock, you want the latch to be transparent when the clock is high.Author infoKen Jaramillo is a principal engineer at Philips Semiconductors, where he has worked for four years. He has worked as designer and architect of ASICs, FPGAs, and boards for products including avionics, high-speed serial buses, high-performance gaming platforms, PCI-bus-related products, high-performance PC audio, and high-speed networking products. He has a BSEE from the University of Missouri (Kansas City) and a BSCE from the University of Missouri (Columbia).Subbu Meiyappan is a senior design engineer at VLSI Technology, a subsidiary of Philips Semiconductors. He has worked for the company for three years, designing, developing, synthesizing, simulating, and validating high-performance intellectual-property blocks for PCI, ARM-ASB-based devices, and high-performance ASICs. He has a BE from Annamalai University (Annamalai Nagar, India) and an MS from Tennessee Technological University (Cookeville, TN).REFERENCE1. Scan Synthesis User Guide, Synopsys, .2. ASIC/IC Design-for-Test Process Guide, Mentor Graphics, .。

芯片失效分析系统Avalon软件系统说明书

芯片失效分析系统Avalon软件系统说明书

DATASHEET Overview Avalon software system is the next-generation CAD navigation standard for failure analysis, design debug and low-yield analysis. Avalon is a power packed product with tools, features, options and networking capability that provides a complete system for fast, efficient and accurate investigation of inspection, test and analysis jobs. Avalon optimizes the equipment and personnel resources of design and semiconductor failure analysis (FA) labs by providing an easy-to-use software interface and navigation capabilities for almost every type of test and analytical failure analysis equipment.Avalon enables closer collaboration of product and design groups with FA labs, dramatically improving time to yield and market. Avalon can import CAD design data from all key design tools and several user-proprietary formats while providing visual representations of circuits that can be annotated, exploded, searched and linked with ease.Benefits • Improves failure analysis productivity through a common software platform for various FA equipment • Significantly decreases time to market with reduced FA cycle time • Faster problem solving by cross-mapping between device nodes to view all three design domains (layout, netlist and schematic) simultaneously • Increases accuracy of FA root cause analysis using advanced debug tools • Single application that overlays images from various FA equipment on to design layout • Secure access to all FA information using KDB™ database • Design independent system that supports all major layout versus schematic (LVS)• Complete access to all debug tools critical to failure trace, circuit debug and killer defect source analysis • Simple deployment setup with support for Linux and Windows • Seamless integration with legacy Camelot™ and Merlin™ databases • Ease of conversion for layout, netlist and schematic data and establishes cross-mapping links between each data entityCAD Navigation andDebug Solutions forFailure AnalysisAvalonFigure 1: Avalon CAD-navigation system integrating layout, signal tracing and 3D viewSupporting all CAD Design DataSynopsys is committed to being the leading provider of software solutions that links all CAD design data. Avalon is a comprehensive package that reads all EDA tools and design data from verification systems and several user-proprietary formats. The KDB™database is designed to interface with all key design formats.Today, there are more EDA developers and more verification package choices; Synopsys is the only company thatsupports all of them.• LVS Conversions: Cadence (Assura, DIVA), Mentor Graphics (CheckMate, Calibre), Synopsys (Hercules, ICV)• Netlist Conversion: SPICE, EDIF, OpenAccess• Layout Conversion: GDSII, OASIS®The highest priorities for Avalon users are faster data accessibility, support diverse failure analysis equipment and availability of debug tools. Avalon provides the optimal solution for both small and continually-expanding FA labs and design debug teams. The Avalon database is design independent and offers a superior level of data consistency and security. The unique design of the internal database schema guarantees compatibility with decades-old databases. This is an indispensable feature for all failure analysis, QAand manufacturing organizations especially in the automotive industry.Figure 2: Avalon SchemView and NetView provide an easy way to navigate inside circuit schematicsProviding Critical Analysis FunctionsIn addition to its CAD navigation and database capabilities, Avalon’s analysis features have become indispensable to the FA lab. Different viewing options are critical in tracking potential failures and determining the source and origin of killer defects. Avalon includes special schematic capabilities and layout features that are invaluable to FA engineers as they debug chips manufactured using new processes.Avalon View Only Client consists of maskview, netview, schemview, i-schemview, K-EDIT, defect wafermap and 3D-SAA. The list below details some of the most commonly used applications.Defect Wafer Map integrates defect inspection data with the device CAD design using the defect coordinates to navigate an equipment stage and pinpoint the defect for closer inspection and characterization. Avalon sorts defects by size, location or class, as well as layout location and allows the user to define custom wafer maps. Additionally, users can classify defects, attach images and write updated information to the defect files.Figure 3: Defect Wafer Map pinpoints defects for closer inspectionSchemView provides tracking of potential failures through visualization of the chip logic. Cross-mapping of nets and instances to the device layout and netlist, SchemView helps determine the source and origin of chip failures. SchemView helps determine the source and origin of chip failures. The entire design is displayed in cell hierarchy format, allowing push-down to a transistor level.Figure 4: K-Edit allows collaboration between design, fab and labI-Schem (Interactive Schematic) creates a schematic from a netlist in a net-oriented format allowing forward and backward tracking to locate a fault. Features like Add Driver or Add Input Cone allow for quick analysis and verification of diagnostic resultsin scan chains.Figure 5: I-Schem creates a schematic from a netlistK-Bitmap allows equipment CAD navigation when analyzing memory chips by identifying the physical location of failingmemory cells. It eliminates tedious screen counting by converting the logical addresses, or row and column coordinates, to thephysical location.Figure 6: K-Bitmap identifies the physical location of bit addresses in memory devices3D Small-Area Analysis provides a three-dimensional cross- section capability to FA engineers, enabling faster localization of circuit failures to accelerate IC manufacturing yield improvement.Figure 7: 3D Small-Area Analysis enables faster localization of circuit failuresHot-Spot Analyzer allows user to draw regions on the layout that correspond to hot-spot regions (emission spots) to detect the crucial nets. It finds the nets in each hot-spot region and plots a pareto graph of nets crossing one or more hotspots which helps to easily locate the killer net.Figure 8: Hot-Spot Analyzer displays number of nets in a hot spotUser-Defined Online Search (UDOS) allows users to search a small area of a die for unique polygon features, repeated features or lack of features. Applications include, but are not limited to, FIB-able regions, repeaters, pattern fidelity and lithographic applications.Figure 9: User-Defined Online Search (UDOS) finds easy-to-access tracesPassive Voltage Contrast Checker (PVC) quickly and accurately validates the integrity of a circuit’s conductivity and provides detailed information for identifying suspect faults at via or metal tracesFigure 10: Passive Voltage Contrast (PVC) Checker identifies suspect vias or metal tracesElectronic Virtual Layer marks objects to represent net connectivity during a FIB deposit or cut using KEdit. The online trace will simulate the new connectivity to the virtual layer. PVC checker could be used on this virtual layer to simulate the crack or short.Check Adjacent Nets allows logical analysis of nets. This command line tool finds the adjacent nets which are within user-specified threshold distance to find shorts.Export Partial Layout enables the customer to share partial layout data with service labs without compromising the IP of the product.Image Mapper automates the image alignment process in Avalon Maskview and saves a lot of time and effort spent inmanual alignment.Advanced 3D Viewer displays real time 3D view of the selected layout area. It shows each process step in the 3D view for which it uses the process data along with design data. It zooms into smaller details and helps to minimize unintended consequences during FIB cuts due to underneath high density structure.Avalon SolutionAvalon brings all the advantages of enterprise-wide computing for FA of the chip. Avalon is an open architecture system that connects users over local and wide area networks for seamless integration and database sharing. Instrument integration throughout the fab and other locations throughout the enterprise enables viewing, modifying, characterizing and testing the same wafer location with different instruments, or the same location on wafers at different facilities using the same chip design.Figure 11: Avalon’s open architecture integrates with Synopsys’ Yield ExplorerIC DesignToolsFigure 12: Avalon server solutionComprehensive Library of FA Tool DriversAvalon provides navigation with almost every equipment used in the FA lab. With a continued commitment to support drivers for all types of test and analysis equipment, Synopsys will continue to develop driver interfaces for new tools as they are introduced to the market, as well as the next generation of existing tools.Equipment Supported by Avalon• Analytical Probe Stations• Atomic Force Microscopes• E-Beam Probers• IR Imaging• Mechanical Stage Controllers• Emission Microscopes• Microanalysis Systems• FIB Workstation• Laser Voltage Probe• LSM• EDA LVS• Microchemical Lasers• OBIC Instruments• Optical Review• SEM Tools• Photon Emission Microscopes• Laser Scan Microscopes©2018 Synopsys, Inc. All rights reserved. Synopsys is a trademark of Synopsys, Inc. in the United States and other countries. A list of Synopsys trademarks isavailable at /copyright.html . All other names mentioned herein are trademarks or registered trademarks of their respective owners.。

阿特美 AT97SC3204 信任平台模块数据手册摘要说明书

阿特美 AT97SC3204 信任平台模块数据手册摘要说明书

This is a summary document. The complete document is available under NDA. For more information, please contact your local Atmel sales office. Features●Fully compliant to the Trusted Computing Group (TCG) Trusted Platform Module(TPM) version 1.2 specification●Compliant with TCG PC client-specific TPM Interface Specification (TIS) version 1.2●Single-chip, turnkey solution●Hardware asymmetric crypto engine●Atmel® AVR® RISC microprocessor●Internal EEPROM storage for RSA keys●33MHz Low Pin Count (LPC) bus for easy PC interface●Secure hardware and firmware design and chip layout●Internal, high-quality Random Number Generator (RNG) – FIPS 140-2 compliant●NV storage space for 1756 bytes of user defined data● 3.3V supply voltage●28-lead thin TSSOP, 28-lead wide TSSOP, or 40-pad QFN packages●Offered in both commercial (0 to 70°C) and industrial (-40 to +85°C)temperature rangesDescriptionThe Atmel AT97SC3204 is a fully integrated security module designed to be integrated into personal computers and other embedded systems. It implements version 1.2 of the Trusted Computing Group (TCG) specification for Trusted Platform Modules (TPM).The TPM includes a cryptographic accelerator capable of computing a 2048-bit RSA signature in 200ms and a 1024-bit RSA signature in 40ms. Performance of the SHA-1 accelerator is 20μs per 64-byte block.The chip communicates with the PC through the LPC interface. The TPM supports SIRQ (for interrupts) and CLKRUN to permit clock stopping for power savings in mobile computers.Atmel AT97SC3204Trusted Platform Module LPC InterfaceSUMMARY DATASHEET1.Pin Configurations and PinoutsTable 1-1.Pin ConfigurationsTable 1-2.Pinouts2.Block DiagramThe TPM includes a hardware random number generator, including a FIPS-approved Pseudo Random NumberGenerator that is used for key generation and TCG protocol functions. The RNG is also available to the system togenerate random numbers that may be needed during normal operation.The chip uses a dynamic internal memory management scheme to store multiple RSA keys. Other than the standard TCG commands (TPM_FlushSpecific, TPM_Loadkey2), no system intervention is required to manage this internal key cache.The TPM is offered to OEM and ODM manufacturers as a turnkey solution, including the firmware integrated on the chip.In addition, Atmel provides the necessary device driver software for integration into certain operating systems, along with BIOS drivers. Atmel will also provide manufacturing support software for use by OEMs and ODMs during initialization and verification of the TPM during board assembly.Full documentation for TCG primitives can be found in the TCG TPM Main Specification, Parts 1 to 3, on the TCG Web site located at https://. TPM features specific to PC Client platforms are specified in the “TCG PC Client Specific TPM Interface Specification, Version 1.2”, also available on the TCG web site. Implementation guidance for 32-bit PC platforms is outlined in the “TCG PC Client Specific Implementation Specification for Conventional BIOS for TCG Version 1.2”, also available on the TCG website.3.Ordering InformationNote: 1.Please see the AT97SC3204 datasheet addendum for the complete catalog number ordering code.4.Package Drawings4.128X1 — 28-lead Thin TSSOP4.240ML1 — 40-pad VQFN5.Revision HistoryAtmel Corporation1600 Technology Drive, San Jose, CA 95110 USA T: (+1)(408) 441.0311F: (+1)(408) 436.4200| © 2013 Atmel Corporation. All rights reserved. / Rev.: Atmel-5295ES-TPM-AT97SC3204-LPC-Interface-Datasheet-Summary-032013Atmel®, Atmel logo and combinations thereof, Enabling Unlimited Possibilities®, AVR®, and others are registered trademarks or trademarks of Atmel Corporation or its subsidiaries. Other terms and product names may be trademarks of others.Disclaimer: The information in this document is provided in connection with Atmel products. No license, express or implied, by estoppel or otherwise, to any intellectual property right is granted by this document or in connection with the sale of Atmel products. EXCEPT AS SET FORTH IN THE ATMEL TERMS AND CONDITIONS OF SALES LOCATED ON THE ATMEL WEBSITE, ATMEL ASSUMES NO LIABILITY WHATSOEVER AND DISCLAIMS ANY EXPRESS, IMPLIED OR STATUTORY WARRANTY RELATING TO ITS PRODUCTS INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTY OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE, OR NON-INFRINGEMENT. IN NO EVENT SHALL ATMEL BE LIABLE FOR ANY DIRECT, INDIRECT, CONSEQUENTIAL, PUNITIVE, SPECIAL OR INCIDENTAL DAMAGES (INCLUDING, WITHOUT LIMITATION, DAMAGES FOR LOSS AND PROFITS, BUSINESS INTERRUPTION, OR LOSS OF INFORMATION) ARISING OUT OF THE USE OR INABILITY TO USE THIS DOCUMENT, EVEN IF ATMEL HAS BEEN ADVISED OF THE POSSIBILITY OF SUCH DAMAGES. Atmel makes no representations or warranties with respect to the accuracy or completeness of the contents of this document and reserves the right to make changes to specifications and products descriptions at any time without notice. Atmel does not make any commitment to update the information contained herein. Unless specifically provided otherwise, Atmel products are not suitable for, and shall not be used in, automotive applications. Atmel products are not intended, authorized, or warranted。

半导体制造的常用名词

半导体制造的常用名词

半导体制造的常用名词发表于: 2007-5-07 17:10 作者: luhaoxinglhx 来源: 半导体技术天地Ingot - A cylindrical solid made of polycrystalline or single crystal silicon from which wafers are cut.晶锭- 由多晶或单晶形成的圆柱体,晶圆片由此切割而成。

Laser Light-Scattering Event - A signal pulse that locates surface imperfections on a wafer.激光散射- 由晶圆片表面缺陷引起的脉冲信号。

Lay - The main direction of surface texture on a wafer.层- 晶圆片表面结构的主要方向。

Light Point Defect (LPD) (Not preferred; see localized light-scatterer)光点缺陷(LPD) (不推荐使用,参见“局部光散射”)Lithography - The process used to transfer patterns onto wafers.光刻- 从掩膜到圆片转移的过程。

Localized Light-Scatterer - One feature on the surface of a wafer, such as a pit or a scratch that scatters light. It is also called a light point defect.局部光散射- 晶圆片表面特征,例如小坑或擦伤导致光线散射,也称为光点缺陷。

Lot - Wafers of similar sizes and characteristics placed together in a shipment.批次- 具有相似尺寸和特性的晶圆片一并放置在一个载片器内。

封装测试

封装测试
modes have been tested (designer expertise required)
Ø Modeled fault testing
Ø Will detect 100% of detectable modeled faults Ø Requires only 47 vectors Ø Vectors can be generated and analyzed by ATPG tools Ø Note: some of the faults are not able to be detected by
Ø Stuck-short: a single transistor is permanently stuck in short state
Ø Detection of a stuck-open fault requires two vectors
Ø A collapsed fault set contains one fault from each equivalence subset
Ø The length of ATPG patterns is reduced significantly after considering the fault collapse
Microelectronics
上海交通大学微电子学院
Transistor (Switch)Faults
Ø MOS transistor is considered an ideal switch and two types of faults are modeled:
Ø Stuck-open: a single transistor is permanently stuck in open state

IT专业英语词典-E

IT专业英语词典-E

e-beam 电子束e-commerce portal 电子商务入口e-printing 远程网络输出e2prom (electrically-erasable programmable read-only memory) 电可擦除可编只读存储器early binding 初期联编early packet discard (EPD) 早期信息包删除,早期信息包废弃earth radius factor 地球半径因子(地球有效半径与实际半径之比,约为1.33)earth station 地球站,地面站earthing接地eccentricity error 偏心误差echo 回波;回音echo cancellation 回波消除echo suppression 回波抑制echo-suppression control 回波抑压控制eddy current 涡流eddy-current loss 涡流损耗edge connector 卡缘连接器edge detection 边缘检测edge, falling 下建边缘edge, input 输入边缘edge, refracting 折射边edge, rising 上升边缘edge, timing 定时边缘edge-defined film-fed growth (EFG) 边缘限定硅膜生长工艺edge-emitting chip 边缘发射芯片edge-sensitive 边缘敏感edge-sensitive scan design 边缘敏感扫描设计edge-trigger 边缘触发edge-trigger phase and frequency detector 边缘触发相位及频率检测器edge-triggered interrupt 边缘触发中断edit 编辑editor 编辑程序;编辑器effect 效应effect, Faraday 法拉第效应effect, Hall 霍尔效应effect, Seebeck塞贝克效应effect, Zeebeck齐北克效应effect, Zeeman 塞曼效应effect, Zener齐纳效应effect, cooling 冷却效应effect, current-spreading 电流扩散效应effect, dispersion 散射效果effect, field 电场效应effect, greenhouse 温室效应effect, inverse photoelectric 反光电效应effect, mirror 镜像效应effect, photoconductive 光传导效应effect, photoelectric 光电效应effect, physical 物理效应effect, quantum Hall 量子霍尔效应effect, quantum tunnel 量子隧道效应effect, saturated 饱和效应effect, thermoelectric 热电效应effect, transmission line 传输线效应effect, tunnel 隧道效应effect, volta伏特效应effective address 有效地址effective isotropic radiated power (EIRP) 各向同性辐射有效功率effective magnetic moment 有效磁距effective permeability 有效磁导率,有效渗透性effective power 有效功率effective resistance 有效电阻effective value 有效值efficiency 效率efficiency, conversion 转换效率efficiency, luminous 发光效率efficiency, machine 机械效率efficiency, mechanical 机械效率efficiency, quantum (QE) 量子效率efficiency, rectifier 整流效率efficiency, thermal 热效率effluent 污水effort 力;施力elapsed time 经过时间elastic collision 弹性碰撞elastic constant 弹性常数elastic store 弹性存储[器]elasticity 弹性elasticity buffer 弹性缓冲器elasticity, modulus of 弹性模数elastomer 弹性体elastomeric 弹性体的,合成橡胶的electret 驻极体electric 电;电动;带电electric charge 电荷electric conductance 电导electric current 电流electric dipole 电偶极子electric dipole moment 电偶极electric discharge 放电electric field 电场electric field intensity 电场强度electric field strength 电场强度electric force 电力electric oscillation 电振荡electric potential 电位;电势electric potential difference 电位差;电势差electric potential energy 电位能electric potential energy 电势能electric power 电功率electric power steering (EPS) 电力控制electric resistance 电阻electric vehicle (EV) 电动车辆electric-dipole moment 电偶极electric-field intensity 电场强度electrical 电力的;电气的electrical conductivity 电气导电能力electrical consideration 电气特性考虑electrical emission 电气放射electrical ground loop 电气接地环路electrical load 电气负载electrical overstress (EOS) 电过载,电超载electrical potential 电位electrical resonance 电气共振electrical rule check (ERC) 电气检测规则electrical zero 电零点electrically erasable programmable read only memory(EEPROM) 电气可拭除可编程只读存储器electricity 电;电学electricity, heating effect of 电流之热效应electricity, static 静电electrification 起电electrification by friction 摩擦起电electrified body 带电体electro-deposit copper 电解铜electro-engraving 电刻electro-luminescent (EL) 场致发光electro-luminescent display 场致发光显示electro-optic modulator 电光调制器electroacoustic 电声学electrochemical equivalent 电流当量electrochemical means 电化学方法electrochemistry 电化学electrocoating电涂层electrocution 触电死亡electrode 电极electrode cut wire 电极线electrode potential 电极电位electrode, drain 漏极电极electrode, negative 负电极electrode, positive 正电极electrodeposit 电沉淀物electrodynamics 电动力学electrodynamometer 电流计electroless copper 无电解铜electrolysis 电解electrolyte 电解溶液;电解质electrolytic capacitor 电解电容器electrolytic corrosion 电解侵蚀,电蚀electrolytic plating 电镀electromagnet 电磁体electromagnetic 电磁的electromagnetic compatibility (EMC) 电磁兼容性electromagnetic field 电磁场electromagnetic force 电磁力electromagnetic induction 电磁感应electromagnetic interference (EMI) 电磁干扰electromagnetic radiation 电磁辐射electromagnetic relay 电磁继电器electromagnetic spectrum 电磁波谱electromagnetic wave 电磁波electromagnetism 电磁学electromagnetization电流磁化electromechanical 电机的electrometer 静电的electromigration电子漂移electromotive force (EMF) 电动势electron 电子electron beam 电子束electron beam epitaxy (EBE) 电子束外延生长[技术] electron beam lithography 电子束刻蚀法,电子束平印术electron beam prober 电子束探测器electron cyclotron resonance (ECR) 电子回旋磁力加速器谐振electron flow 电子流electron gun 电子枪electron microscope 电子显微镜electron probe microanalysis (EPMA) 电子探头微量分析electron projection lithography 电子投影金属版印刷,电子投影光刻electron spectroscopy for chemical analysis (ESCA) 化学分析电子光谱法electron track 电子轨迹electron volt (eV) 电子伏特electron, bound 束缚电子electron, free 自由电子electron, valence 原子价电子electronic cash (e-cash) 电子现金, 电子货币electronic commerce 电子商务electronic commerce modeling language (ECML) 电子商务建模语言electronic control gear (ECG) 电子控制装置electronic control unit (ECU) 电子控制单元,电子控制部件electronic data interchange (EDI) 电子数据交换electronic data interchange for administration,commerce and transport 管理.商业和运输的电子数据交换electronic data processing (EDP) 电子数据处理electronic data system (EDS) 电子数据系统electronic design automation (EDA) 电子设计自动化electronic emission 电子放射electronic fuel injection (EFI) 电子燃油喷注electronic funds transfer (EFT) 电子资金转帐electronic load 电子负载electronic mail 电子邮递electronic numerical integrator and calculator (ENIAC) 电子数字积分器和计算器electronic packaging 电子封装electronic performance support system (EPSS) 电子性能支持系统electronic reservation system 电子预订系统electronic switching system 电子交换系统electronic toll collection (ETC) 电子长途收费electronic toll-collection system 电子道路收费系统electronics 电子学electronics manufacturing service (EMS) 电子制造业服务electronics, integrated device (IDE) 整合器件电子学electrophorus 起电盘electroplating 电镀electroscope 验电器electroscope, gold-leaf 金箔验电器electrostatic 静电electrostatic capacity 静电容量electrostatic deflection 静电偏向;静电偏转electrostatic discharge (ESD) 静电释放electrostatic field 静电场electrostatic force 静电力electrostatic induction 静电感应electrostatic shield 静电屏蔽[罩]electrostatic unit 静电单位electrostatic voltmeter 静电伏特计electrostatics 静电学electrotyping 电铸element 元素element list file (ELF) 元素表列档案elementary particle 基本粒子elementary wave 元波elliptical polarization 椭圆极化,椭圆偏振elongation 伸长elongation, coefficient of 伸长系数embedded 嵌入的embedded Java 嵌入式Javaembedded Web server 嵌入式网络服务器embedded control 嵌入式控制embedded controller 嵌入式控制器embedded servo system 嵌入式伺服系统embedded software 嵌入式软件embedded system 嵌入式系统embedded test 嵌入式测试embossed carrier tape 模压载体带emergence angle 出射角emergency power 应急能力emergency shut down (ESD) 事故停机,紧急停机,紧急关机emission 放射emission spectrum 放射光谱emission, electrical 电气放射emission, electronic 电子放射emission, field 电场放射emission, spontaneous 自发放射emission, thermionic 热离子放射emissivity 放射能力emitter 放射器;射极emitter dotting 射极连线emitter voltage 射极电压emitter, common 共射极emitter, panel 平板射极emitter-coupled logic (ECL) 射极耦合逻辑emitter-coupled transistor logic (ECTL) 射极耦合晶体管逻辑empirical 经验的emulate 仿真emulation, analog 模拟仿真emulation, bus-timing 总线定时仿真emulator 仿真器emulator, in-circuit (ICE) 内电路仿真器emulsifier 乳化剂enable 允许;生效enable dis- 抑制enabled, write- 使能写入enameled wire 漆包铜线encapsulant密封剂encapsulating compound 密封剂,封装料encapsulating material 灌封材料encapsulating security payload (ESP) 数据打包安全有效载荷(为IP数据包提供完整性和安全性)encapsulation 灌封enclosure 包围encode 编码encoder 编码器encoder/decoder 编码/解码器encoder/decoder data separator 编码器/解码器数据分隔器encoding, multiplex sub-Nyquist sampling (MUSE) 亚尼奎斯特取样编码encroachment 侵蚀encroachment, lateral 横向侵蚀encryption 加密encryption, data 数据加密end distortion 末端畸变end system 终端系统end user 终端用户end, back- 后端end, front- 前端end, high- 高档end, low- 低档end-of-burst 成组传递结束,猝发结束end-of-burst confirmation (EOBC) 成组传递结束确认,猝发结束确认end-of-file character 尾档字符end-to-end 端对端endpoint 终点;末端endurance tests 耐久性测试energy 能;能量energy band 能带energy consumption 能量消耗energy density 能量密度energy dispersive spectrograph (EDS) 能量扩散光谱仪energy dispersive x-ray (EDX) 能量扩散X射线energy level 能量水平energy, activation 活化能量energy, atomic 原子能energy, binding 结合能energy, conservation of 能量守恒energy, electric potential 电位能energy, gravitational potential 引力位能energy, heat 热能energy, internal 内能energy, kinetic 动能energy, luminous 光能energy, mechanical 机械能energy, potential (PE) 位能energy, radiant 辐射能energy, solar 太阳能energy, surface 表面能energy, translational 平移能量engine 引擎;机器engine, internal combustion 内燃机engineering change order (ECO) 工程变更次序engineering change request (ECR) 工程变动请求engineering verification testing (EVT) 工程验证测试engineering workstation 工程工作站engineering, computer-aided (CAE) 电脑辅助工程engineering, computer-aided software (CASE) 电脑辅助软件工程engineering, concurrent 并行工程engineering, reverse 还原工程enhanced GPRS 增强型通用无线分组业务enhanced audio processor (EAP) 增强声频处理器enhanced circuit-switched data (ECSD) 增强型电路交换数据enhanced color graphics adapter (EGA) 增强图像标准enhanced data rates for GSM evolution 改进的GSM数据速率enhanced expanded memory specification (EEMS) 增强扩充存储器规格enhanced full rate (EFR) 增强型全速率enhanced plastic ball grid array 增强型塑料球栅阵列enhanced serial communication controller (ESCC) 增强式串行通讯控制器enhanced small device interface (ESD) 增强式小型器件接口enhanced specialized mobile radio (ESMR) 增强型专用移动无线电enhancement-mode FET 增强型场效应晶体管enterprise network 企业网络enterprise resources planning (ERP) 企业资源计划,企业资源规划enterprises and private carriers 企业和私人运营商entity 实体entrapment 截留entrapment, gas 气体截留entropy coding 熵编码,平均信息量编码entry 入口entry point 进入点entry, bus 总线入口environment 环境environment mapped bump mapping 环境凹凸映射environment, application execution 应用执行环境environment, computer-aided test (CATE) 电脑辅助测试环境environment, distributed computing (DCE) 分布式运算环境environment, fuzzy inference development (FIDE) 模糊推论开发环境environment, fuzzy system standard (FSSE) 模糊系统标准环境environment, virtual terminal (VTE) 虚拟终端机环境environmental impact 环境冲击environmental temperature 环境温度enzyme 酶,酵素epitaxial 外延epitaxial diode 外延二极管epitaxial layer 外延层epitaxial passivated integrated circuit (EPIC) 外延钝化集成电路epitaxy外延生长技术,取向附生epitaxy, molecular-beam 分子束外延epoxy 环氧epoxy resin 环氧树脂epoxy-glass laminate 环氧玻璃层压板epoxy-paper laminate 环氧纸基层压板equalization 均衡;等化equalization, adaptive 自适应等化equalization, attenuation 衰减均衡equalization, decision feedback (DFE) 决策反馈等化equalization, time-domain 时域均衡equalizer 均衡器;等化器equalizer, graphic 图形均衡器equalizer, stereo graphic 立体声图形均衡器equalizing pulse 等化脉冲equally tempered scale 等程音阶equation 方程equation, Boolean 布尔方程equation, circuit 电路方程equator, magnetic 磁赤道equilibrant 平衡;平衡状态equilibrium potential 平衡状态位能equilibrium, dynamic 动态平衡equilibrium, neutral 随遇平衡equilibrium, radioactive 放射平衡equilibrium, rotational 转动平衡equilibrium, stable 稳定平衡equilibrium, temperature 温度平衡equilibrium, thermal 热平衡equilibrium, unstable 不稳定平衡equipment 设备;装置equipment terminal, (TE) 终端设备equipment, automatic test (ATE) 自动化测试器材equipment, data communication (DCE) 数据通讯设备equipment, data terminal (DTE) 数据终端设备equipotential 等位的equipotential line 等位线equipotential surface 等位面equiripple finite impulse response filter (EFIR) 平波有限脉冲反应滤波器equivalent 等效的;当量equivalent circuit 等效电路equivalent gate 等效门equivalent integrated circuit 等效集成电路equivalent load 等效负载equivalent resistance 等效电阻equivalent series inductance (ESI) 等效串联电感equivalent series resistance (ESR) 等效串联电阻equivalent time sampling 等效时间取样equivalent weight 当量equivalent, electrochemical 电化当量equivalent, gram 克当量equivalent, thermal 热当量equivalent, water 水当量erasable optical drive 可拭除式光盘机erasable programmable logic device (EPLD) 可拭除式可编程逻辑器件erasable programmable read only memory (EPROM) 可拭除式可编程只读存储器erase 拭除erase, block 区段式拭除erasing head 拭除头;消磁磁头erbium (Er) 铒erbium-doped optical fiber amplifier 掺铒光纤放大器erect image 正立像erg 尔格ergonomics 人体工学error 故障;错误error amplifier 误差[信号]放大器error bit 误码,差错位error burst 错误资组error checking and correction (ECC) 错误检测及改正error condition 错误条件error correction 错误更正error detection and correction 检错与纠错error free second (EFS) 无误码秒,无差错秒error tolerance 错误容限error, absolute 绝对错误error, alignment 定位错误error, coplanarity共面误差error, crossover 交接错误;交越错误error, experimental 实验误差error, fatal 致命错误error, gain 增益误差error, hard 不可更正的错误;硬错误error, head position 磁头定位错误error, marginal timing 边际定时错误error, mean-squared (MSE) 均方误差error, overwrite 重写错误;覆写错误error, parity 奇偶错误error, probable 可能误差error, random 无规误差error, relative 相对误差error, soft 可更正的错误;软错误error, standard 标准错误error, timing 时序错误error, transposition 对换错误error-correction code (ECC) 错误更正编码error-detection protocol 错误检测协定error-free 无误errored second (ES) 误码秒escape velocity 逃逸速度esonant flip-flop 共振触发器estimator 估值器estimator, numerical 数字估值器estimator, physical 实体估值器etch back 回蚀etching 蚀刻法etching, photo- 光蚀刻法etching, plasma 等离子蚀刻法etching, reactive ion (RIE) 反应离子蚀刻法ethane 乙烷ethernet以太网ethernet network 以太网络ethyl 乙基eutectic bond 低熔点粘接,低熔点焊接evaluation 评价evaporation 蒸发evaporation rate 蒸发率evaporation temperature 蒸发温度evaporation, heat of 蒸发热evaporator 蒸发器even harmonic 偶谐波even parity 偶数奇偶校验event 事件event control 事件控制event driven 事件驱动event trigger 事件触发event-driven simulation 事件驱动模拟exalted carrier reception 恢复载波接收exception 例外;异常exception mode 异常状态;异常模式excessive solder joint 多余焊点exchange capability 信息互换能力exchange computerized branch, (CBX) 电脑化分机交换exchange identification (XID) 交换识别exchange termination (ET) 交换终端exchange, computerized branch (CBX) 电脑化分机交换exchange, dynamic data (DDE) 动态数据交换exchange, mobile telephone (MTX) 移动电话交换机exchange, private automatic branch (PABX) 专用自动分机交换exchange, private branch (PBX) 专用分机交换exchanger, heat 热交换器excising 删除;收税excitation 激发excitation potential 激发电位excitation voltage 激发电压excited state 受激状态exclusive NOR (XNOR) 逻辑同exclusive OR (XOR) 逻辑或excursion 摆幅execute 执行execution engine 执行引擎execution unit 执行单元exosphere 外大气层expanded memory 扩充存储器expanded memory block (EMB) 扩充存储器区块expanded memory manager (EMM) 扩充存储器管理器expanded memory specification (EMS) 扩充存储器规格expanded sweep 扩充扫描expander 扩充器expansion 膨胀expansion ratio 膨胀比率expansion slot 扩展槽expansion, Boolean 布尔延伸式expansion, absolute 绝对膨胀expansion, adiabatic 绝热膨胀expansion, anomalous 反常膨胀expansion, apparent 视膨胀expansion, coefficient of 膨胀系数expansion, coefficient of thermal (CTE) 热膨胀系数expansion, cubical 体膨胀expansion, free 自由膨胀expansion, real 真膨胀expansion, superficial 表面膨胀expansion, surface 面膨胀expansion, thermal 热膨胀expansivity膨胀性;膨胀系数expansivity, cubic 体膨胀系数expansivity, superficial 表面膨胀系数expansivity, volume 体膨胀系数experimental error 实验误差expert 专家expert routing approach 专家路由法expert system 专家系统explicit congestion notification (ECN) 显式拥塞通知exploit 充份利用;全面应用exponent 指数;幂exponential 指数的exponential decay 衰变常数express transfer protocol (XTP) 直达传送协议expression 表达式extended 延伸;扩展extended ASCII code 美国国家信息交换标准扩展码extended basic input/output system data area (EBDA) 基本输入/输出延伸系统数据区域extended binary coded decimal interchange code (EBCDIC) 扩充的二—十进制交换码extended data out (EDO) 延伸数据输出extended device 扩展器件extended graphics array (XGA) 延伸图像阵列extended hypertext markup language (XHTML) 扩展的超文本标识语言extended industry standard architecture (EISA) 工业标准延伸架构extended longword serial 扩展的长字串extended memory 延伸存储器extended memory specification (XMS) 延伸存储器规格extended processing architecture (EPA) 延伸存储器架构extended processing unit (EPU) 延伸处理单元extended super frame (ESF) 扩展的超帧extended total access communications systems (E-TACS) 扩展型可全接入通信系统extensibility 延长性extensible computing 可扩展计算extensible markup language (XML) 可扩展标识语言extension 引伸;外延;延伸;延续extension, multiprocessor architecture (MPAX) 多处理器延伸架构exterior gateway protocol (EGP) 外部网关协议external 外部;外置external access 外部存取external data representation (XDR) 外部数据表示external force 外力external interrupt 外部中断external memory 外存存储器;外置存储器external memory interface 外置存储器接口external routine 外部例行程序external search 外部搜寻external sort 外部排序external test 外部测试external trigger 外触发;外触发器external work 外功extinction voltage 熄灭电压extraction 析出extraction, parasitic 寄生析出extraction, resistance 电阻析出extractor, timing 时序析取器extrapolation 推演extreme high frequency (EHF) 极高频extreme ultraviolet 远紫外,超紫外[线]extreme ultraviolet lithography 远紫外线金属版印刷,远紫外光刻extrinsic 外表的,外在的;非本质的,非本征的extrusion forming 挤压成形eye phone 可视电话eye piece 目镜eyelet 眼孔,小孔。

ScanDIMM-SO204 DDR3 Boundary-Scan Based Digital Te

ScanDIMM-SO204 DDR3 Boundary-Scan Based Digital Te

ScanDIMM-SO204/DDR3Boundary-Scan BasedDigital TesterUser's ManualDocument Part Number: 70405 Revision ACopyright © Corelis 2010. All rights reserved.Corelis12607 Hiddencreek WayCerritos, CA 90703-2146Telephone: (562) 926-6727Fax: (562) 404-6196Table of ContentsChapter 1: Product Overview. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Introduction. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Features of the ScanDIMM-SO204/DDR3. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 ScanDIMM-SO204/DDR3 Specifications. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2Chapter 2: ScanDIMM-SO204/DDR3 Installation. . . . . . . . . . . . . . . . . . . . . . . . 4 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 OverviewScanDIMM-SO204/DDR3 Hardware. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 ScanDIMM-SO204/DDR3 Software. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 Connecting to the Boundary-Scan Controller. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 Indicator LEDs. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 Mating Connectors. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 AccessoriesChapter 3: Preparation of Test Input Files. . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 Overview. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 PreparationAdd the ScanDIMM BSDL File. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 Add BSDL Files Dialog. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 TAP Pins Not Found in Netlist Warning (Safe to Ignore). . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 Insert a TAP Break. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 Testing the Socket Power and Ground Pins. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10Chapter 4: Executing Selftest. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 Overview. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 Infrastructure Test. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 StepsChapter 5: Troubleshooting. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 OverviewNotes. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13Chapter 6: Legal and Contact Information. . . . . . . . . . . . . . . . . . . . . . . . . . . 14Chapter 1:Product Overview IntroductionThe ScanDIMM-SO204/DDR3 Digital Tester module provides an easy-to-use method for structurally testing 204-pin Small Outline Dual Inline Memory Module (SO-DIMM or SODIMM) sockets. Through the use of boundary-scan technology, theScanDIMM-SO204/DDR3 Digital Tester provides 196 fully bi-directional test signals. A Boundary-Scan Test Access Port (TAP) connects to a host computer, which provides virtually unlimited memory depth for testing each of the SO-DIMM socket pins. The 204-pin sockets are often used for Double Data Rate Dynamic Random Access Memory (DDR3 SDRAM) modules. The ScanDIMM-SO204/DDR3 offers an accurate and easy-to-use mechanical and electrical solution for connecting test equipment to SO-DIMM sockets.Features of the ScanDIMM-SO204/DDR3•Tests 204-pin DDR3 SO-DIMM sockets•Tests for opens on the socket's power and ground pins• 1.5V DIMM interface, 3.3V tolerant• 1.8V TAP interface, 3.3V tolerant•LEDs indicate power status and active TAP connection•Compatible with the Corelis ScanExpress boundary-scan test development tools and other third party softwareThe figure below shows the ScanDIMM-SO204/DDR3 module with Pin 1 of the TAP IN connector identified.Figure 1-1. ScanDIMM-SO204/DDR3 module (top view)ScanDIMM-SO204/DDR3 SpecificationsSize and Form FactorMechanical Compatibility JEDEC MO-268C (204-pin DDR3 SO-DIMM)Dimensions67.6 mm x 30.00 mm ± 0.15 mm[2.66 inches x 1.18 inches ± 0.01 inches]PCB thickness 1.00 mm ± 0.10 mm[0.039 ± 0.01 inches]Connector Keying 1.5V-compatibleMaximum Test Clock (TCK) FrequencyMaximum TCK Frequency25 MHzLEDsPWR Indicates the 1.5V power source is presentTAP ON Indicates the TAP is connectedTAP ConnectorsTAP IN Connector10-pin Single Row 0.100-inch spacing(Samtec part no. TSM-110-01-G-SH or equivalent) Power Requirements (Provided by the 204-pin mating socket)1.50 V0.250 A (Maximum)Operating EnvironmentTemperature0° C to 55° CRelative Humidity10% to 90%, non-condensingAbsolute Maximum RatingsTable 1-1. Absolute Maximum RatingsRecommended Operating ConditionsTable 1-2. Recommended Operating ConditionsDC Electrical Characteristics (SO-DIMM Socket Interface)(1.5V DC Over Recommended Operating Conditions)Table 1-3. DC Electrical Characteristics (SO-DIMM Socket Interface)DC Electrical Characteristics (JTAG Interface)(1.8V DC Over Recommended Operating Conditions)Table 1-4. DC Electrical Characteristics (JTAG Interface)Chapter 2:ScanDIMM-SO204/DDR3 Installation OverviewTo ensure reliable operation of the ScanDIMM-SO204/DDR3, it is important to connect it properly to both the Corelisboundary-scan controller and the 204-pin DDR3 SO-DIMM socket on the unit under test (UUT).ScanDIMM-SO204/DDR3 HardwareThe ScanDIMM-SO204/DDR3 product consists of the following components:•ScanDIMM-SO204/DDR3, Corelis P/N 10408•User's Manual, Corelis P/N 70405•Host Adapter Cable, 10-pin, Corelis P/N 15336The ScanDIMM-SO204/DDR3 product is also available in a 'mirrored' version that is functionally identical but has a reversed form factor.The ScanDIMM-SO204/DDR3/Mirrored product consists of the following components:•ScanDIMM-SO204/DDR3/Mirrored, Corelis P/N 10409•User's Manual, Corelis P/N 70405•Host Adapter Cable, 10-pin, Corelis P/N 15336The files related to the ScanDIMM-SO204/DDR3 are installed by the ScanExpress installer.Ensure that all materials listed are present and free from visible damage or defects before proceeding. If anything appears to be missing or damaged, contact Corelis at the number listed on the title page immediately.The figure below shows the ScanDIMM-SO204/DDR3 and the cables that are included with the product.Figure 2-1. ScanDIMM-SO204/DDR3 and Cable AccessoriesScanDIMM-SO204/DDR3 SoftwareThe ScanExpress CD installs the files to a subdirectory of the ScanExpress TPG application.The default location is:"C:\Program Files\Corelis\ScanExpressTPG\ScanDIMM-SO204-DDR3".Table 2-5. ScanDIMM-SO204/DDR3 FilesConnecting to the Boundary-Scan ControllerThe external boundary-scan controller connects to the ScanDIMM-SO204/DDR3 TAP IN connector via the 10-pin Host Adapter Cable.Connect one end of the Host Adapter Cable P/N 15336 to the TAP IN connector of the ScanDIMM-SO204/DDR3.Connect the 10-pin cable from the boundary-scan controller (ScanTAP-4, ScanTAP-8, etc.) to the other end of the adapter cable. The TAP Voltage for the boundary-scan controller should be set to 1.8VThe figure below shows a block diagram for the a typical TAP connection to a ScanDIMM-SO204/DDR3 module.Figure 2-2. Block Diagram of Connection to a ScanDIMM-SO204/DDR3This table shows the pin assignments for the TAP IN connector.Table 2-6. TAP IN Connection ListThe TAP IN connector conforms to the popular Corelis 10-pin TAP connector pinout except that it is a single row (10 x 1) instead of dual row (5 x 2). The Host TAP Adapter Cable P/N 15336 is a 1:1 adapter cable. The pin assignment is standard, connecting to any Corelis controller using the appropriate standard 10-pin TAP cable. It is best to use the PCI-1149.1/Turbo equipped with a ScanTAP-4 Intelligent Pod, with one TAP connected to the ScanDIMM-SO204/DDR3 and with additional TAP(s) connected to the UUT. Other Corelis controllers like the NetUSB-1149.1/E can also be used so that the UUT can connect on a separate TAP.The figure below shows the TAP connections for a ScanDIMM-SO204/DDR3 module on TAP1 and the Target UUT on TAP2.Figure 2-3. Connection of a ScanDIMM-SO204/DDR3 Module and the Target using Separate TAPs Indicator LEDsTwo LEDs indicate the status of the ScanDIMM-SO204/DDR3 module. D1 is labeled PWR. It illuminates if theScanDIMM-SO204/DDR3 is receiving power from the target (through pins 57, 60 and 176). If the LED is not illuminated, the ScanDIMM-SO204/DDR3 module is not powered up. D2 is labeled TAP ON. It indicates that a connection to a controller is detected. The ScanDIMM-SO204/DDR3 module will not operate unless D2 is illuminated.Mating ConnectorsThe table below shows the mating connectors needed to make cables for the Boundary-Scan connector.Table 2-7. Mating Connectors for the ScanDIMM-SO204/DDR3 AccessoriesAdditional TAP Adapter Cables (P/N 15336) can be ordered from Corelis:Table 2-8. Cable Accessories for the ScanDIMM-SO204/DDR3Chapter 3:Preparation of Test Input Files OverviewThe ScanDIMM-SO204/DDR3 integrates easily with a boundary-scan test plan. When the ScanDIMM-SO204/DDR3 is installed in a socket, the socket behaves like a boundary-scan component. Once the ScanDIMM-SO204/DDR3 is plugged into the socket on the target board, the boundary-scan test system will automatically test the socket. However, regeneration of the boundary-scan tests with ScanExpress TPG is required.PreparationCopy the provided BSDL file to your local project directory.Add the ScanDIMM BSDL FileWhile in the "Preparation:BSDL Files" stage of ScanExpress TPG, click "Add..." to launch the "Add BSDL Files" dialog.Figure 3-1. ScanExpress TPG Test Preparation: Select BSDL FilesAdd BSDL Files DialogFigure 3-2. Add BSDL Files DialogUncheck the box "Show Only Devices Connected to JTAG Signals"Select the Device that corresponds to the DIMM socket on the board in the left pane.Select the BSDL File for the ScanDIMM-SO204-DDR3 in the right pane.Click "Add".Click "Close" to exit the Add BSDL Files dialog.TAP Pins Not Found in Netlist Warning (Safe to Ignore)In some cases a popup message may appear that indicates that the ScanDIMM TAP pins are not found in the netlist. The TAP connection between the boundary-scan controller and ScanDIMM module won't be in the board netlist and this warning is safe to ignore.Figure 3-3. TAP Pins Not Found in Netlist Warning (Safe to Ignore)Insert a TAP BreakThe ScanDIMM is now in the scan chain. Insert a "TAP Break" by selecting the last device in the scan chain before the ScanDIMM, right clicking and selecting "Insert TAP Break"Figure 3-4. ScanExpress TPG Test Preparation: ScanDIMM BSDL File AddedTesting the Socket Power and Ground PinsTo test the power and ground pins on the ScanDIMM-SO204/DDR3 socket, the constraint file should have the following syntax added:SENSE_HIGH VDDSENSE_LOW GNDVDD and GND are the net names of the 1.5V SDRAM power and ground signals on the target board. This syntax may already be present to test other power or ground connections in the target system.ScanExpress TPG will automatically add these constraints if the power and ground nets are specified during the Power and Ground screen of the preparation phase.Chapter 4:Executing Selftest OverviewScanExpress Runner (sold separately) can load and run the compact vector file, ScanDIMM-SO204-DDR3_Selftest_inf.cvf, and quickly verify that the ScanDIMM-SO204/DDR3 is functional. Both the ScanExpress Runner software and a Corelis Boundary-Scan controller such as the PCI-1149.1/Turbo are required to execute this file.Infrastructure TestThe infrastructure test verifies the TAP connection between the controller and the ScanDIMM-SO204/DDR3. It also verifies that the boundary-scan infrastructure of the device on the ScanDIMM-SO204/DDR3 is fully functional. The infrastructure test requires a Corelis Boundary-Scan controller, a ScanDIMM-SO204/DDR3 unit and a Host TAP cable (P/N 15336). The following steps execute an infrastructure test.Steps1.Remove any memory modules from the Unit Under Test (UUT) DIMM socket(s) to be tested.2.Install the ScanDIMM-SO204/DDR3 in the socket.3.Connect the Host TAP Adapter cable P/N 15336 to the "TAP IN" connector on the ScanDIMM-SO204/DDR3.4.Connect the 10-pin TAP cable from the external controller to the other end of the Host TAP Adapter cable.5.Apply power to the UUT.6.Make sure that both LEDs on the ScanDIMM-SO204/DDR3 illuminate.7.Double-click on the ScanExpress Runner Icon.8.Select New Test Plan from the File menu and click on the Add button.9.With the file browser, find and select the "ScanDIMM-SO204-DDR3_Selftest_inf.cvf" file. Click OK.10.Select Controller from the Setup menu, then choose the appropriate Boundary-Scan controller.11.Set the TCK frequency to 1 MHz and the TAP voltage to 1.8V.12.Select Run Test. The test should run and pass.The figure below shows a passing infrastructure test.Figure 4-1. ScanExpress Runner Infrastructure TestTroubleshooting OverviewUse the following general guidelines to troubleshoot problems when the ScanDIMM-SO204/DDR3 is added to the test system.1.Make sure the ScanDIMM-SO204/DDR3's TAP Voltage is set to 1.8V2.Make sure power is being supplied to the ScanDIMM-SO204/DDR3, the boundary-scan controller, and the target. TheScanDIMM-SO204/DDR3's green LEDs will be illuminated if power (1.5V) is being supplied to the DIMM socket and the boundary-scan controller is connected.3.Run the provided self-test and make sure that it passes.4.Reduce the TCK (test clock) frequency to 1 MHz. The TCK frequency can be set too high for the scan chain andsometimes using a lower frequency will allow the test steps to pass. Once the scan chain is known to be stable, then the TCK frequency can be increased to the maximum frequency that will allow the test steps to pass.Notes1.DDR3 modules are not backwards compatible with DDR2 modules and DDR3 modules will not fit into DDR2 sockets;forcing them can damage the ScanDIMM and/or the board.Legal and Contact InformationPRINTING HISTORYRevision A, May 2010GENERAL NOTICEInformation contained in this document is subject to change without notice. CORELIS shall not be liable for errors contained herein for incidental or consequential damages in connection with the furnishing, performance, or use of material contained in this manual.This document contains proprietary information that is protected by copyright. All rights reserved. No part of this document may be reproduced or translated to other languages without the prior written consent of CORELIS. This manual is a CORELIS proprietary document and may not be transferred to another party without the prior written permission of CORELIS. CORELIS assumes no responsibility for the use of or reliability of its software on equipment that is not furnished by CORELIS.ENVIRONMENTAL NOTICEThis product must be disposed of in accordance with the WEEE directive.TRADEMARK NOTICEScanExpress and ScanDIMM are trademarks of Corelis Inc.Other products and services named in this manual are trademarks or registered trademarks of their respective companies. All trademarks and registered trademarks in this manual are the property of their respective holders.PRODUCT WARRANTYFor product warranty and software maintenance information, see the PRODUCT WARRANTY AND SOFTWARE MAINTENANCE POLICY statement included with your product shipment.EXCLUSIVE REMEDIESTHE REMEDIES CONTAINED HEREIN ARE THE CUSTOMER'S SOLE AND EXCLUSIVE REMEDIES. CORELIS SHALL NOT BE LIABLE FOR ANY DIRECT, INDIRECT, SPECIAL, INCIDENTAL, OR CONSEQUENTIAL DAMAGES, WHETHER BASED ON CONTRACT, TORT, OR ANY OTHER LEGAL THEORY. Product maintenance agreements and other customer assistance agreements are available for Corelis products. For assistance, contact your nearest Corelis Sales and Service Office.RETURN POLICYNo items returned to CORELIS for warranty, service, or any other reason shall be accepted unless first authorized by CORELIS, either direct or through its authorized sales representatives. All returned items must be shipped pre-paid and clearly display a Return Merchandise Authorization (RMA) number on the shipping carton. Freight collect items will NOT be accepted. Customers or authorized sales representatives must first contact CORELIS with notice of request for return of merchandise. RMA's can only originate from CORELIS. If authorization is granted, an RMA number will be forwarded to the customer either directly or through its authorized sales representative.CONTACT INFORMATIONFor sales inquiries, please contact *****************.For any support related questions, please enter a support request at /support or email *******************. For more information about other products and services that Corelis offers, please visit .。

芯片校验流程

芯片校验流程

芯片校验流程The process of chip verification is an essential step in ensuring the functionality and security of electronic devices. 芯片校验流程是确保电子设备功能和安全性的重要步骤。

Chip verification involves checking the integrity and performance of the chip design through various testing methods and simulations. 芯片校验涉及通过各种测试方法和模拟来检查芯片设计的完整性和性能。

This is crucial to identify any potential issues or vulnerabilities in the chip that could compromise the functionality or security of the device. 这对于识别可能影响设备功能或安全性的芯片潜在问题或漏洞至关重要。

One of the key aspects of chip verification is functional verification, which involves testing the chip against its functional specifications. 芯片校验的一个关键方面是功能验证,它涉及根据其功能规格对芯片进行测试。

This ensures that the chip behaves as intended and meets the required functionality for the device it will be used in. 这确保了芯片的行为符合预期,并满足其将要使用的设备所需的功能。

理光streamline nx v3 说明书

理光streamline nx v3 说明书

Modular suite provides device management,scanning, secure printing and moreIf you’re like most organizations, your scan, fax, print, device management, security and accounting processes don’t exist in a vacuum. You use a combination of these functions to do your work. Shouldn’t your software be the same way? It’s time for a simpler, more intuitive way to work.RICOH Streamline NX v3 is not a combination of software products — rather, this modular suite takes a platform solution approach to address your essential document related process needs. These include device and driver management, card authentication, chargeback, scanning, mobile and secure printing and extensive reporting. Streamline NX users access all functions from a single interface at the multifunction device and administrators utilize one admin console. Because Streamline NX is modular, it can grow with you. When you have user-friendly access to the features, functions and information you need, the result is a complete solution that’s easier for users and simpler for IT departments to manage their fleet and control their output.Why RICOH Streamline NX v3?• Supports devices from multiple manufacturers• Powerful printing rules engine• Quick installation, simple integration• Powerful, secure scanning• Convenient mobile printing• Robust reporting out of the box• New “scan to destination” connectors• Optimized for Ricoh’s Smart Operation PanelPlatform solutionRicoh Streamline NX v3 covers these important areas — device management, authentication, administration & reporting, mobile support,scan & capture and secure printing.Device managementWith Streamline NX, device management becomes proactive rather than reactive — automatically alerting you when toner is low or a device is due for service. You can also perform remote fleet management, batch configuration and firmware upgrades.Administration & reportingUse one unified management console to administer all facets of Streamline NX. Access 90+ standard reports and 35+ dashboard reports. Track all user activity by login — and extend tracking to secure printing, scan and fax by adding optional modules. Set user quotas for print and empower youraccounting staff to better allocate print costs with chargeback capabilities.Scan & capture (optional module)With the Scan & Capture Option, you can convert scanned paper documents into electronic files and route them to email, network and home folders, ECM, fax, FTP and other systems. Connectors provide integration with line of business systems, perform processes like barcode and OCR andhandle data input — including mobile and scan-to-cloud destinations. Card authentication manages user workflows and regulates scanning.AuthenticationImprove security while making it easier for users to access Streamline NX. Users can access Streamline NX at the MFP with a network login, PIN or by using card authentication (part of the Scan &Capture Option and Secure Print Option modules).Mobile supportPush status alerts to administrators’ mobile devices and enable them to view usage reports on-the-go. Mobile capabilities grow as you add optional modules. Capture data using your mobile device’s camera and route to a selected folder with the Streamline NX Input Connector. Extend printing capabilities to mobile workers. Support third-party printers registered by QR code or NFC tag via mobile app.Secure printing (optional module)With the Secure Print Option, you can enable printing for mobile users and ensure the right people pick up the right documents with locked print for your centralized MFPs and printers. Easily access print queues with card authentication — the Secure Print Option holds your print jobs on the server until you arrive and authenticate at a device.Key advantagesSingle user interfaceUsers access the same interface at the MFP to securely perform copy, fax and scan functions and to release documents for print. Streamline NX learns individual user preferences and processes to eliminate common steps.Easy to install and expandStreamline NX installs quickly, including all modules and capabilities. The solution is scalable to an unlimited number of networked and non-networked print devices. You don’t have to separately install and configure multiple applications to achieve the functionality you need.Unified management consoleSimplify administration with one application to manage both devices and users — including setting color output privileges for individuals and having control over their print, copy, scan and fax permissions.Rules enginePowerful printing rules keep workers productive and help eliminate waste and unnecessary cost. Streamline NX can redirect jobs if a device is down, re-route jobs for efficiency and enforce policies such as duplex printing or avoiding color for certain jobs.With the optional Ricoh Streamline NX v3 PC Client, rules can also be enforced with secure print and client delegation print.Real-time statusYou can know what’s going on in your device fleet to avoid surprises and downtime with real-time status alerts, the ability to see devices “at-a-glance” from the mobile administration app or the management console and the option to drill down for more details.Security & controlStreamline NX supports 15 built-in security roles and allows for the creation of custom security roles plus security by device groups. No confidential data is stored on the server, no passwords are stored and Streamline NX uses Windows® security SQL server connections. Additional security is also provided in each optional module. Analytics & reportingUsage reporting helps you make important decisions, such as device placement and assignments. Over 90+ standard reports can be generated automatically and emailed as well as customized.35+ dashboard reports include key analytics data — such as document usage summary, device usage, power usage and accounting reports.On-ramp to digitalBring documents and forms into your digital processes through powerful and highly accurate Optical Character Recognition (OCR) to create editable data files. Optional Zonal OCR & Barcode support provides targeted data extraction to support pre-defined routing workflows.No more switching between applicationsCapabilities at-a-glance• Monitor devices for total print meter, toner, paper levels and other functions • Collect detailed meter, alert and status information • Service alerts by email (locally generated)• Remote fleet management• Set roles-based administrative levels• Establish printing rules to allow/restrict certain settings • Manage user privileges, access and audit user job logs • Establish chargebacks and set budgetary account limits• Over 90 standard reports — including 35+ dashboard reports and Green reports• Scan & route to email, folder, fax, desktop PC, FTP , ODBC, WebDAV• OCR with support for editable formats, including PDF , Microsoft ® Word ®, Excel ® and Word Perfect ®• Included connectors provide direct scanning integration with Microsoft SharePoint Online ®, SharePoint 365® , Exchange ® Online, OneDrive ® for Business, RICOH Content Manager ™, FileNet ®, Documentum ®, OpenText ™ Content Manager and RightFax ™• Manage user privileges with card authentication — such as restricting the use of color and regulating scanningDevice managementAdministration & reportingScan & capture• Authentication at the MFP by network login, PIN or user card • Single sign-on for all tasks available to the user• Authentication with a range of proximity cards, including HID/iClass, CASI-Rusco, Mifare and NxtWtch (requires the Scan & Capture or Secure Print Options)• Also supports authentication by Near Field Communication (NFC) and biometric devices (requires the Scan & Capture or Secure Print Options)Authentication• Easily release confidential documents at the MFP with card authentication • Held print jobs are encrypted and can be easily accessed with card authentication • Mobile printing supportSecure printingMobile support• Device support for many common mobile devices running iOS, Android ™, Windows Phone 10 and above • Print to remote networks using Mobile Intranet Extenders (MIE)• Receive notifications and alerts and manage devices on-the-go• Submit print jobs to the Ricoh AirPrint service on an organization’s network — jobs are accepted via IPP/IPPS protocol and credentials, if involved, are exchanged with File ServerAdministration overviewManage all your devicesRicoh Streamline NX v3 discovers the devices in your network and automatically collects performance data. Real-time device status and reports are accessible on tablets, laptops and smartphones, so you’ll always know what’s happening from wherever you are.Monitor toner, paper levels and other basic device status indicators. Learn about issues before they cause downtime with enhanced error polling. Set alerts for specific devices or certain statuses in short intervals — so you’re able to act quickly. Access to toner and ink histories can also help determine the most effective timeline for refills.Easily export MFP settingsBatch Configuration saves you time andlets you work with multiple devices at once. Export settings from one MFP to create a template, then “clone” that template to configure similar MFPs. Perform remote fleet updates, firmware upgrades, configuration and maintenance. Control user print settings with pre-configured, prepackaged print drivers. You can modify and set default values, lock or hide specific settings and even set mandatory pop-ups to enter billingcodes or authentication.Extend capabilities withenhancementsIf you need to extend the included devicemanagement capabilities of Streamline NX,there are several fee-based enhancementsavailable. The SP connector option allowsyou to program and set the ExtendedSettings for devices and manage thesesettings, giving you even more controland flexibility. Set additional levels ofauthentication at the device, scan jobsdirectly to the HD storage, personalize thedisplay and more.Gather insights withenvironmental reportsThe @Remote Connector NX enhancementcan help you gather actual usage data that’seasily accessible via web portal. Access tothis trending data helps you make informeddecisions on fleet efficiency to minimizeyour print costs. Analyze which devices areunderutilized or overworked to balance thefleet. Gain insight into your environmentalimpact with targeted Green Reports thatshow corresponding cost savings, treessaved and resulting CO2reduction. Devicesissue their own critical service alerts,communicating directly with your ServiceProvider to solve problems before theytrigger downtime.Gain advanced driver deploymentoptionsThe Advanced Driver Distribution Licenseenhancement gives users three additionalways to download drivers: by browsingthe device list, choosing from the floormap view or searching for specific criteria.The software can even auto-detect users’operating systems to ensure a correct matchand successful driver deployment.Improve security with card authenticationWith Streamline NX, users can authenticate at the MFP using the same card issued to access buildings. Choose from a range of proximity cards, including HID/iClass, CASI-Rusco, Mifare and NxtWtch. Streamline NX also supports authentication by Near Field Communication (NFC) and biometric devices. Improve the user experience with a single sign-on for all tasks available to the user. No more unauthorized usage or usersleft guessing which applications they are permitted to access. Issued cards can also manage user privileges — such as restricting the use of color and regulating scanning with the Scan & Capture Option. Card authentication with the Secure Print Option can also help provide users peace of mind when printing confidential documents — restricting access to the cardholder alone.Access administration &reporting capabilitiesWith Streamline NX, you can easily performcommon administration & reporting tasks.Monitor printing from the Streamline NXserver, copies made at the MFP and scansand faxes completed. Distinguish color usagefrom black & white and measure output byduplex settings or paper size. Establish printrules to allow/restrict settings and set roles-based administrative levels.Enforce rules and manage usersA single interface makes it easy to configuresettings, enforce policies, manage quotasand generate reports. You can also manageuser privileges and access/audit user joblogs. With authentication against externalLDAP or Kerberos databases supported,you can manage client user roles andaccounts at a global level — including loginauthentication, privileges and reportingrestrictions.Consult relevant reportsIt can be time consuming to piece togetherusage data. Pre-formatted reports caneliminate these manual calculations andcompile data for your entire fleet in an easy-to-read format. With easy access to over90 standard reports and over 35 dashboardreports, it’s easy to find the information youneed. Standard reports cover accountinginformation, job details and scan usage.Dashboard reports deliver real-time data —including device summary, usage, status andenvironmental impact — in a visual way. Youcan also run simulations of future deviceperformance to support resource planning.Get all the detailsGet an at-a-glance view with summaryreports, or choose to drill down into thedetails. It’s easy to customize the level ofdetail in reports through the user interface.Choose to filter data by document usage percost center, department, device, user, dateor workflow. View device usage by hour, jobsize, color usage, duplex and more. Discoverpower usage per printed page and potentialcost savings by date, department or user.Track activity and enable userchargebackWith Streamline NX’s tracking & chargebackcapabilities, you can establish accountabilityby tracking costs back to the identity ofindividual users, groups, departments orproject codes. Track all user activity (copy,print, scan and fax) initiated at the MFP,from a desktop or from mobile devices.Set user quotas, empower your accountingstaff to better allocate print costs and giveadministrators a platform for configuringchargeback settings.With the ability to easily track all usagedetails, you can make informed decisionswhen it comes time to establish print rules,determine user quotas and set budgetaryaccount limits.See these related documentsfor more information on RicohStreamline NX v3• Secure Print Option• Scan & Capture Option• Reporting capabilities• Mobile supportTechnical information• PC: PC/AT Compatible• CPU: Intel ® Xeon Processor 5000 Series 3.0 GHz (2CPU) or above recommended; AMD Athlon X2/Phenom or above recommended; AMD Opteron 4100/6100 series or above recommended • Memory: 4 GB or above recommended• Operating System: Refer to the supported OS, DBMS, Browser section • Database Engine: Refer to the supported OS, DBMS, Browser section• Virtualization: Microsoft Windows Server 2008 Hyper-V 2.0; VW Ware ESX 4.0; VW Ware ESX 5.0Server PC requirementClient PC requirement• PC: PC/AT Compatible• CPU: Pentium Compatible 500 MHz or above minimum; Pentium Core2Duo 1.6 GHz or above recommended (2 core 2 thread)• Memory: 128 MB or above minimum; OS recommended memory size • Supported Browser: Refer to the supported OS, DBMS, Browser section • Adobe ® Flash Player: Latest version• Core ServerThis is the center of Ricoh Streamline NX v3. The admin can access the Core Server from a PC Client to manage the entire system. A single Core Server can manage up to 100,000 devices and up to 250 Delegation Servers. • Delegation Server (DS)Managed by the Core Server and responsible for all the processing of jobs, image conversion, delivery of scanned documents, processing of information obtained from devices and enabling the PC Client software. Each Delegation Server can manage the following — Polling: 10,000 Devices; Device Management: 5,000 Devices; Scan & Capture and Secure Print: 1,000 Devices. • MIE ServerRequired to use the mobile app and submit a print job. MIE Server connects to the DS Server and links with the mobile app.Server implementationServer environment• Windows Server 2012 Std/Datacenter (64-bit)• Windows Server 2012 R2 Std/Datacenter (64-bit)• Windows Server 2016 R2 Std/Datacenter (64-bit)Mobile application• iOS 7.0.x or later • Android 4.4 or later• Windows Phone 10.0 or laterAdmin console client environment• Any environment with supported web browserRicoh USA, Inc., 70 Valley Stream Parkway, Malvern, PA 19355, 1-800-63-RICOHRicoh and the Ricoh logo are registered trademarks of Ricoh Company, Ltd. All other trademarks are the property of their respective owners. ©2017 Ricoh USA, Inc. All rights reserved. The content of this document and the appearance, features and specifications of Ricoh products and services are subject to change from time to time without notice. Products are shown with optional features. While care has been taken to ensure the accuracy of this information, Ricoh makes no representation or warranties about the accuracy, completeness or adequacy Technical information (cont.)• VMWare ESXi 5.1, 5.5, 6.0• Windows Hyper-V Server 2012• Windows Hyper-V Server 2012 R2• Windows Hyper-V Server 2016 R2VirtualizationBrowser support• Microsoft Internet Explorer ® 8, 9, 10, 11• Firefox ® 38esrStandard• Microsoft SQL Server 2016 (Express) Optional external databases• Microsoft SQL Server 2012 (Standard, BI, Enterprise)• Microsoft SQL Server 2014 (Standard, BI, Enterprise)• Microsoft SQL Server 2016 R2 (Standard, Enterprise)Database supportWeb services• Internal web server (Jetty)• IIS 7.5, 8, 8.5。

英语作文万模板介绍某物

英语作文万模板介绍某物

英语作文万模板介绍某物Title: Introduction to the iPhone 12。

The iPhone 12 is the latest model of Apple's iconic smartphone. It was released in October 2020 and has quickly become one of the most popular and sought-after devices on the market. In this article, we will explore the key features and specifications of the iPhone 12, as well as its design, performance, and overall user experience.Design:The iPhone 12 features a sleek and modern design, with a flat-edge aluminum frame and a Ceramic Shield front cover, which is tougher than any smartphone glass. It is available in five stunning colors: black, white, green, blue, and (PRODUCT)RED. The device is also water and dust resistant, with an IP68 rating, making it durable and reliable for everyday use.Display:The iPhone 12 boasts a Super Retina XDR display, which provides an immersive viewing experience with true-to-life colors, deep blacks, and a high contrast ratio. The 6.1-inch OLED display offers a resolution of 2532 x 1170 pixels, resulting in sharp and detailed visuals for watching videos, playing games, and browsing the web.Performance:Equipped with the A14 Bionic chip, the iPhone 12 delivers exceptional performance and efficiency. The A14 Bionic is the first chip in the smartphone industry built on a 5-nanometer process, enabling faster CPU and GPU performance, as well as improved power efficiency. This allows for seamless multitasking, smooth gaming, and swift app launches.Camera:The iPhone 12 features a dual-camera system, consisting of a 12-megapixel Ultra Wide and Wide cameras. The Ultra Wide camera captures a 120-degree field of view, perfect for landscapes, architecture, and group photos. The Wide camera offers Night mode, Deep Fusion, and Smart HDR 3, resulting in stunning photos with enhanced detail and dynamic range. The device also supports 4K Dolby Vision HDR recording, allowing users to capture cinema-quality videos.5G Connectivity:With 5G capability, the iPhone 12 enables faster download and upload speeds, lower latency, and improved performance in congested areas. This allows for seamless streaming, faster downloads, and enhanced gaming experiences. The device also supports Smart Data mode, which intelligently switches between 5G and LTE to conserve battery life.MagSafe:The iPhone 12 introduces MagSafe, a new ecosystem of accessories that attach magnetically to the back of the device. This includes MagSafe chargers, cases, and wallets, which provide a secure and efficient way to power up and protect the device. MagSafe also enables new experiences, such as easy-to-attach accessories and faster wireless charging.iOS 14:The iPhone 12 runs on iOS 14, the latest version of Apple's mobile operating system. iOS 14 introduces a range of new features, including redesigned widgets, App Library, App Clips, and enhanced privacy controls. The software is designed to be intuitive and user-friendly, providing a seamless and secure experience for users.In conclusion, the iPhone 12 is a powerful and innovative smartphone that offers a stunning design, exceptional performance, advanced camera capabilities, 5G connectivity, MagSafe technology, and the latest iOS software. It represents the pinnacle of Apple's engineering and design, setting a new standard for what a smartphone can achieve.Whether for work, play, or creativity, the iPhone 12 is a versatile and reliable companion for users around the world.。

产品描述英语作文模版套用

产品描述英语作文模版套用

产品描述英语作文模版套用Product Description: iPhone X。

The iPhone X is the latest addition to Apple's iPhone series. It was released on November 3, 2017, and hasquickly become one of the most popular smartphones on the market. With its sleek design, advanced features, and powerful performance, the iPhone X is a must-have for anyone who wants to stay connected and stay ahead of the curve.Design。

The iPhone X boasts a stunning all-glass design that is both beautiful and durable. The front and back of the phone are made from the strongest glass ever used in a smartphone, and the surgical-grade stainless steel band that wraps around the phone adds to its durability and elegance. The phone is also water and dust resistant, making it perfectfor use in any environment.Display。

The iPhone X features a 5.8-inch Super Retina display that is the largest and most advanced ever used in an iPhone. The OLED screen delivers stunning colors and deep blacks, and the True Tone technology adjusts the white balance to match the ambient light for a more natural viewing experience. The screen also features HDR support, which provides a wider range of colors and greater detail in bright and dark areas.Face ID。

AXIS M3086-V 4 MP 微型天线相机

AXIS M3086-V 4 MP 微型天线相机

AXIS M3086-V Dome CameraFixed4MP mini dome with deep learningThis cost-efficient mini dome features Wide Dynamic Range(WDR)to ensure clarity even when there’s both dark and light areas in the scene.With Lightfinder,it delivers sharp color images even in low light.A deep learning processing unit enables intelligent analytics based on deep learning on the edge.And AXIS Object Analytics offers detection and classification of different types of objects–all tailored to your specific needs.Furthermore,this compact,easy-to-install,vandal-resistant camera offers a wide-angle view of130°and comes factory focused so there’s no manual focusing required.>Great image quality in4MP>Compact,discreet design>WDR and Lightfinder>Support for analytics with deep learning>Built-in cybersecurity featuresDatasheetAXIS M3086-V Dome Camera CameraImage sensor1/2.7”progressive scan RGB CMOSLens 2.4mm,F2.1Horizontal field of view:130°Vertical field of view:93°Fixed iris,IR correctedDay and night Automatically removable infrared-cut filterMinimum illumination With Lightfinder:Color:0.19lux at50IRE F2.1 B/W:0.03lux at50IRE F2.1Shutter speed1/38500s to1/5sCamera angle adjustment Pan:±175°Tilt:±80°Rotation:±175°Can be directed in any direction and see the wall/ceilingSystem on chip(SoC)Model CV25Memory1024MB RAM,512MB Flash ComputecapabilitiesDeep learning processing unit(DLPU) VideoVideo compression H.264(MPEG-4Part10/AVC)Main and High Profiles H.265(MPEG-H Part2/HEVC)Main Profile Motion JPEGResolution2688x1512(4MP)to320x240Frame rate25/30fps with power line frequency50/60Hz in H.264andH.265aVideo streaming Multiple,individually configurable streams in H.264,H.265and Motion JPEGAxis Zipstream technology in H.264and H.265Controllable frame rate and bandwidthVBR/MBR H.264/H.265Average bitrateMulti-viewstreamingUp to2individually cropped out view areas in full frame rateImage settings Compression,color,brightness,sharpness,contrast,whitebalance,exposure control,motion-adaptive exposure,WDR:upto120dB depending on scene,dynamic overlays,mirroring ofimages,privacy maskRotation:0°,90°,180°,270°,including Corridor FormatPan/Tilt/Zoom Digital PTZAudioAudio streaming Audio output via edge-to-edge technologyAudio input/output Audio features through portcast technology:two-way audio connectivity,voice enhancerNetwork speaker pairingNetworkNetwork protocols IPv4,IPv6USGv6,ICMPv4/ICMPv6,HTTP,HTTPS,HTTP/2,TLS,QoS Layer3DiffServ,FTP,SFTP,CIFS/SMB,SMTP,mDNS(Bonjour), UPnP®,SNMP v1/v2c/v3(MIB-II),DNS/DNSv6,DDNS,NTP, NTS,RTSP,RTCP,RTP,SRTP/RTSPS,TCP,UDP,IGMPv1/v2/v3, DHCPv4/v6,SSH,LLDP,CDP,MQTT v3.1.1,Secure syslog(RFC 3164/5424,UDP/TCP/TLS),Link-Local address(ZeroConf)System integrationApplication Programming Interface Open API for software integration,including VAPIX®and AXIS Camera Application Platform;specifications at One-click cloud connectionONVIF®Profile G,ONVIF®Profile M,ONVIF®Profile S,and ONVIF®Profile T,specification at Event conditions Device status:above operating temperature,above or belowoperating temperature,below operating temperature,IP addressremoved,live stream active,network lost,new IP address,systemready,within operating temperatureEdge storage:recording ongoing,storage disruption,storagehealth issues detectedI/O:manual trigger,virtual input,digital input via accessoriesusing portcast technologyMQTT:subscribeScheduled and recurring:scheduleVideo:average bitrate degradation,tamperingEvent actions Notification:HTTP,HTTPS,TCP and emailRecord video:SD card and network shareMQTT:publishPre-and post-alarm video or image buffering for recording oruploadRecord video:SD card and network shareSNMP traps:send,send while the rule is activeUpload of images or video clips:FTP,SFTP,HTTP,HTTPS,networkshare and emailExternal output activation via accessories using portcasttechnologyBuilt-ininstallation aidsPixel counterAnalyticsAXIS ObjectAnalyticsObject classes:humans,vehicles(types:cars,buses,trucks,bikes)Features:line crossing,object in area,crossline counting BETA,occupancy in area BETA,time in area BETAUp to10scenariosMetadata visualized with color-coded bounding boxesPolygon include/exclude areasPerspective configurationONVIF Motion Alarm eventMetadata Object data:Classes:humans,faces,vehicles(types:cars,buses, trucks,bikes),license platesAttributes:Vehicle color,upper/lower clothing color,confidence,positionEvent data:Producer reference,scenarios,trigger conditions Applications IncludedAXIS Object Analytics,AXIS Video Motion DetectionSupport for AXIS Camera Application Platform enablinginstallation of third-party applications,see /acap CybersecurityEdge security Software:Signed firmware,brute force delay protection,digest authentication,password protection,AES-XTS-Plain64256bitSD card encryptionHardware:Axis Edge Vault cybersecurity platformSecure element(CC EAL6+),system-on-chip security(TEE),Axisdevice ID,secure keystore,signed video,secure boot,encryptedfilesystem(AES-XTS-Plain64256bit)Network security IEEE802.1X(EAP-TLS),IEEE802.1AR,HTTPS/HSTS,TLS v1.2/v1.3, Network Time Security(NTS),X.509Certificate PKI,IP addressfilteringDocumentation AXIS OS Hardening GuideAxis Vulnerability Management PolicyAxis Security Development ModelAXIS OS Software Bill of Material(SBOM)To download documents,go to /support/cybersecu-rity/resourcesTo read more about Axis cybersecurity support,go to/cybersecurityGeneralCasing IP42water-and dust-resistant(to comply with IP42,followInstallation Guide),IK08impact-resistant,polycarbonate/ABScasingEncapsulated electronicsColor:white NCS S1002-BFor repainting instructions,contact your Axis partner. Sustainability57%recycled plastics,PVC free,BFR/CFR freePower Power over Ethernet(PoE)IEEE802.3af/802.3at Type1Class2Typical3.6W,max4.2WConnectors RJ4510BASE-T/100BASE-TX PoEAudio:Audio and I/O connectivity via portcast technology Storage Support for microSD/microSDHC/microSDXC cardSupport for SD card encryption(AES-XTS-Plain64256bit)Recording to network-attached storage(NAS)For SD card and NAS recommendations see Operatingconditions0°C to45°C(32°F to113°F)Humidity10–85%RH(non-condensing)Storage conditions -40°C to65°C(-40°F to149°F) Humidity5–95%RH(non-condensing)Approvals EMCICES-3(A)/NMB-3(A),EN55032Class A,EN55035,EN61000-6-1,EN61000-6-2,FCC Part15Subpart B Class A,ICES-003Class A,VCCI Class A,KS C9835,KS C9832Class A,RCM AS/NZS CISPR32Class A,SafetyIEC/EN/UL62368-1,IS13252EnvironmentIEC60068-2-1,IEC60068-2-2,IEC60068-2-6,IEC60068-2-14,IEC60068-2-27,IEC/EN60529IP42,IEC/EN62262Class IK08NetworkNIST SP500-267Dimensions Height:56mm(2.2in)ø101mm(4.0in)Weight150g(0.33lb)IncludedaccessoriesInstallation guide,Windows®decoder1-user licenseOptionalaccessoriesAXIS TM3812Tamper CoverBlack casingSmoked domeAXIS Surveillance microSDXC™CardFor more accessories see VideomanagementsoftwareAXIS Companion,AXIS Camera Station and video managementsoftware from Axis Application Development Partners.For moreinformation,see /vmsLanguages English,German,French,Spanish,Italian,Russian,Japanese,Korean,Portuguese,Simplified Chinese,Traditional Chinese,Dutch,Czech,Swedish,Finnish,Turkish,Thai,Vietnamese Warranty5-year warranty,see /warrantya.Reduced frame rate in Motion JPEG©2022-2023Axis Communications AB.AXIS COMMUNICATIONS,AXIS,ARTPEC and VAPIX are registered trademarks ofAxis AB in various jurisdictions.All other trademarks are the property of their respective owners.We reserve the right tointroduce modifications without notice.T10180096/EN/M11.2/2309。

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Scan Design and Secure ChipDavid Hély1, Marie-Lise Flottes2, Frédéric Bancel1, Bruno Rouzeyre2, Nicolas Bérard1, and MichelRenovell21ST MicroelectronicsZI de Rousset BP 2F-13106 Rousset CEDEX, France david.hely@2 LIRMM – UMII161 rue AdaF-34392 Montpellier, FranceAbstractTesting a secure system is often considered as a severe bottleneck. While testability requires to an increase in both observability and controllability, secure chips are designed with the reverse in mind, limiting access to chip content and on-chip controllability functions. As a result, using usual design for testability techniques when designing secure ICs may seriously decrease the level of security provided by the chip. This dilemma is even more severe as secure applications need well-tested hardware to ensure that the programmed operations are correctly executed. In this paper, a security analysis of the scan technique is performed. This analysis aims at pointing out the security vulnerability induced by using such a DfT technique. A solution securing the scan is finally proposed.1. IntroductionSecure cryptographic hardware is intensively used in order to perform confidential operations (e.g. financial transactions, personal authentication...) [Tho97], [Rag03]. During these operations, data (plaintext) is converted (encrypted) into code (ciphertext) by combining it with a small piece of information (key). As a consequence such chips are designed so that attackers have serious difficulties in uncovering on-chip content or using it without the required permission. Thus, in order to prevent security failures, designers are introducing more and more tamper-resistant hardware in such a way that the secure IC fulfils the following properties [Haf91]:·It never permits access to plain-text, partially encrypted text or unencrypted keys·System failure (such as hardware damage) is immediately detected and indicated [Bon01].·Each attempt of unauthorised access is immediately detected, keys and sensitive data are erased, and system operation is inhibited (the transaction is cancelled, and none others are possible).Moreover, a secure design implies high quality test processes in order not to deliver a supposedly "secure chip" on which secure operations may fail. High quality testing of security hardware is thus primordial to ensure an acceptable level of security. Whilst a secure design aims at reducing controllability and observability to a minimum, an easily testable one should be very controllable and observable. Thus, testability and security may be difficult to associate [Bon93], even if the second requires the first. Introducing on-chip testability features in a secure design may decrease significantly the degree of security offered by the on-chip circuitry. This paper presents the risks encountered when inserting testability features into a secure design and proposes a new architectural solution for improving security in scan designs. Section 2 discusses the potential vulnerability of secure systems due to design for test principles. Section 3 presents a vulnerability analysis of scan technique. In section 4, current countermeasures against DfT vulnerability are discussed. Section 5 presents a new scan design for secure chip.2.General vulnerability induced by DFTWhen analysing the vulnerability, which may be induced by the design for testability techniques, we are faced with two different issues. Indeed we can consider the vulnerabilities from two different points of view: ·The controllability point of view: controllability-induced vulnerability·The observability point of view: observability-induced vulnerability2.1. ControllabilityDesign for controllability techniques aim at improving the application of test data from outside to the on-chip circuitry. However a test access mechanism is also a potential path for introducing corrupted data into the chip.A design for controllability technique could be used for controlling some on-chip security blocks. For instance, for testability purpose, it may be possible to deactivate security features such as memory firewall or on-chip data encryption. Thus using such controllability capability, ahacker may decrease the on-chip security level by disabling some security block. Controllability may also facilitate 'side channel attacks' such eavesdropping attack, which consists in deducing secret information from accessible sources. For instance, the various instructions or data processed by the chip cause variations in power consumption, then using statistical analysis on the power traces [Koc99] it is possible to identify what is being processed on chip. Controlling the chip clock facilitates the analysis of power trace and thus increases the effectiveness of such an attack [Hes00]. In test mode, the clock is controllable from external pad in order to synchronise the chip and the tester together, creating thus an opportunity for the hacker to control it also.2.2. ObservabilityThe observability enhancement offered by design for testability technique also induces security hazard. During test operation, the chip is configured so that it is possible to observe on-chip data resulting from applied test patterns. A common attack against cryptographic equipment consists in injecting error during the run of a cryptographic algorithm and to compare the result with a fault safe one. Iterating this process, cryptanalysts are able to retrieve secret key of secret key algorithm. Increasing data observability may make such an attack more easily realisable thanks to the increase of accessible data, which permits to analyse not only primary output but also some internal registers.3. Security vulnerability with the scan Technique3.1. Observability-induced vulnerabilityA scan circuitry links all the storage elements of a design, or part of them, to realise a large shift register the so-called scan chain. A major vulnerability of the scan designs relies on the fact that activating the scan mode provides full controllability and observability of the memory elements included in the scan chain [Mue02]. Namely, during the scan mode, all the data present in the scan chain are shifted out and can thus be observed at the extremity of the scan chain: the scan-out pin. In other words, the observation of only one node in the circuit (the last flip-flop's output in the scan chain) provides full observation of all the data stored into the scan flip-flops.A signal monitoring attack is thus simplified. Indeed, let consider the hardly realisable attack which consists in probing a data register which contains for instance a secret key. This attack requires placement of as many probes as the register bit width. Here no matter the bit-width of the register, only two probes are sufficient. The attack requires one probe on the scan-out signal in order to observe the data flow, and another one on the scan-enable signal in order to control the shift operation (figureA new attack based on the differential fault analysis [Bih97] concept can also be imagined using scan circuitry. The hacker can abuse the scan circuitry to shift out the chip content during a cryptographic operation. By iterating this process, the hacker can have the on-chip content of the chip at different times of the cryptographic operation. Then analysing these different 'snapshots' bit to bit, identification of the registers dedicated to cryptographic algorithm becomes possible. Then by knowledge of the algorithm, data reconstruction leading to secret key is realizable [Sko02].3.2. Controllability-induced vulnerabilityScan circuitry can also be exploitable in order to perform a "control-oriented" attack on a secured chip (figure 2). A hacker can use the scan circuitry in order to introduce data to a part of the chip, which is not usually accessible to the user for security reasons. For instance, consider a flag register whose purpose is to indicate if the user has the right to access a certain zone of a memory. If this flag is part of the scan chain, the desired value can be easily set into this flag using the scan-in shift operation. The desired functionality is then activated when the chip is switched back to the functional mode.Fortunately, the drawback of such an attack is that when inserting a value into the Nth element of a scan chain, all the N-1 elements preceding the Nth element are impacted. It is thus extremely difficult to control the value of only one element without disturbing the other storage elements. The modification of the values stored into these N flip-flops may hopefully provoke a malfunction (i.e. for instance place the CPU into an illegal state), which in secure design is immediately detected and often induces a full-chip reset. Moreover, such a precise attack implies pre-required information on the scan architecture as the position of the target register into the scan chain. Despite this, the hacker has still the possibility to perform a kind of random attack which consists in shifting in random data with the idea of disabling security features. The most sensitive attack due to this controllability opportunity may be the fact that a new channel to perform fault injection is provided through the scan-in pin. All the circuitry added in order to make the chip scannable is at least as sensible to fault injection as the original circuitry. Then inserting scan statically increases the sensitivity to such attack.3.3. Side effectDesign modifications implied by the scan insertion introduce other vulnerabilities, namely concerning the control of asynchronous signal used for security purpose. Asynchronous signals are commonly used for security in order to instantaneously reset the chip in case an anomaly is detected. However, for ATPG purpose, all asynchronous signals should be controlled by a “Test_Mode” signal [Jar00]. When scan data are shifted in and out of the design under test, the asynchronous reset and clear pins of storage cells must be held in an inactive state. Thus, when the test mode is active, all the asynchronous signals are disabled, which introduces a real vulnerability since the reset designed to protect the data is no longer effective. Attacks requiring to inhibit the reset of chips are simplified since the test mode signal is much more accessible than an asynchronous reset signal generated by combinational logic. 4. Existing countermeasureA common practice concerning secure IC is to blowtest circuitry [Sou93] after production test. This techniqueconsists in disabling the test mode activation, so that after production test, only a restrictive end-user mode isaccessible. Actually, these fuses configure the chip eitherin test mode (i.e. all the test functions are available) orend user mode. This technique, broadly used in the smart-card community, guarantees to the chip maker that thechip secrecy will not be abuse using the chip as a test engineer could do. In order to overcome such aprotection, chip modification is necessary to either bypassthe configuration or rebuild the fuse. Such an attackbecomes then hardly realizable since such fuses are oftendeeply hidden in the chip and thus hardly accessible[Kuh99].Concerning the particular case of scan technique, in[Mue02], the authors propose to make the SCAN pathunusable by interrupting the SCAN chain at a majority of locations by means of fuses as EEPROM fuses for instance. With this solution, the SCAN chain is no moreusable from outside, since only small scan chain segments remain on-chip. Most of the vulnerabilities presented in section 3 are inhibited with such a protection. However "probing attack" remains possible on the small segments present between the fuses. Moreover, the main drawback of this countermeasure relies on the fact that in order to be efficient against brute attack, many fuses would be necessary. This solution is unfortunately not acceptable for designs for which area is a major concern. Finally, such techniques make impossible all opportunity of diagnosis in case of chip return after the production step.5. Scan chain scrambling5.1. MotivationsThe following countermeasure, the so-called scan chain scrambling, consists in making the analysis of data stolen via the scan chain hardly realizable. The major risk induced by the scan chain remains on the possibility of on chip data analysis by shifting the chain during cryptographic operations. The hazard is real if the hacker is capable of shifting the scan chain several time so that data analysis is possible by comparing the different shifting results.We propose to introduce a new module, the scan chain scrambler (figure 3), that controls the scan chain elements order such a manner that:·When the scan mode has been securely reached (before the fuses are blown and after a strong authentication for instance), the scan chain elements order is fixed to a predetermined order.·When the chip is not in test configuration, the scanchain elements order changes at a given frequency.Retrieving secret key or data becomes then much more difficult, since data analysis by comparing scan chain out data cannot be performed directly. The scan chain (or sensitive part of it) is divided into small segments, each segments are connected together through the scrambler,For instance let's consider a scan chain divided into 8 segments. These segments are connected together through the scan chain scrambler, which can either order them in a fix configuration or a random configuration. Figure 4 shows the element order at two different times when the test mode is not active. Let’s assume the hacker needs n shifting out of the chip at different times of the cryptographic process.Seg. 2Seg. 7Seg. 6Seg. 3Seg. 8Seg. 5Seg. 1Seg. 4Seg. 8Seg. 5Seg. 3Seg. 1Seg. 7Seg. 2Seg. 4TT+ D tSnapshot timeFigure 4: Segment order at two different instants At time t, the segments order is [8, 5, 3, 1, 7, 2, 4, 6]. The scan chain is unloaded by activating the scan_enable signal either by brute attack or by corrupting the test controller. In order to analyse the data, successive unloads are necessary, at different times. So the hacker unloads the chain one more time at time t+dt, but at this time the order is [2, 7, 6, 3, 8, 5, 1, 4]. Comparing data of the two unloads becomes then much more difficult since comparison bit to bit has no sense here.5.2. ImplementationIn order to perform such scrambling a multiplexer is inserted between scan chain segments. The test input of the i th segment is fed by the multiplexer output; the multiplexer data in can either come from the (i-1) th segment (in test mode) or from one of the segmentsconnected to this multiplexer through the scrambler (figure 5).A scrambling controller generates the control signals of the multiplexers inserted between the scan chain segments. During the test mode, a test key allows to certify the validity of the mode of operation. The scrambler controller reads this key and generates adequate control signals in order to connect the scan chain segment in the appropriate and fixed order. In any other mode of operation, or when the test key is not valid, the scrambling controller sends random values to the multiplexer control inputs.Figure 6 shows a possible simplified implementation, the bold path corresponds to the scan path used in test mode. Between the four segments (here only one scan cell per segment), two-to-one multiplexers are inserted. In the “segment connexion block”, the multiplexers are connected together so that the i th element is fed either by the (i-1)th or the (i+1)th combined with other segments (dot line). The scan path is fixed when the test mode is activated otherwise segments connexion is made random following the unpredictable number generator, which commands the multiplexers.5.3. Trade-off efficiency versus costThe protection relies on the scan chain data scrambling, thus in order to improve the scrambling it is necessary to decrease the segment length i.e. to increase the number of segments. Decreasing the segment length will increase security since when the scrambling is active; it is hardly likely to find long bit sequence corresponding to the same flip-flops comparing two shift-outs.Nevertheless, decreasing the segment length can have a non negligible impact on the design. First concerning area, increasing the number of segments will require more logic cells to manage connexions between them. The routing constraints will also be more difficult to reach since scan dedicated nets will increase with the segments number. Last of all, during scan insertion, a new step is required in order to define and specify the different segments, which needs more attention than standard scan insertion.6. Discussion and conclusionsIn this paper, scan induced vulnerabilities have been presented. It has been shown that introducing such a DfT technique into secure chip is not without risks. In order to improve existing countermeasure, scan chain scrambling can be a potential solution. This solution benefits from the fact that at the opposite of other solutions, this one still offers diagnosis capability since the test circuitry is not irremediably disabled after production.AcknowledgementsWe are very grateful for the helpful discussions with Director Laurent Sourgen (ST Microelectronics). References[Bih97] E. Biham and A. Shamir, "Differential Fault Analysis of Secret Key Cryptosystems ", CRYPTO '97, pp. 156-171, 1997[Bon01] "On the importance of checking cryptographic protocols for faults" by D. Boneh, R. DeMillo, and R. Lipton. Journal of Cryptology, Springer-Verlag, Vol. 14, No. 2, pp. 101--119, 2001.[Bon93] H. Bonnenberg, "Secure Testing of VLSI Cryptographic Equipment", ETH Zurich, Series in Microelectronics vol.25[Gan01] K. Gandolfi, C. Mourtel, F. Olivier "Electromagnetic Analysis: Concrete Results", CHES 2001, vol. 2162 of Lecture Notes in Computer Science, pp. 251-261, Springer-Verlag, 2001.[Haf91] K. Hafner, H.C. Ritter, T.M. Schwair, S. Wallstrab, M. Depperman, J. Gessner, S. Koesters, W-D. Moeller and G. Sandweg. "Design and Test of an Integrated Cryptochip" IEEE Design & Test, pages 6-17, December 1991[Hes00] E. Hess, N. Janssen, B. Meyer, T. Schütze "Information Leakage Attacks Against Smartcard Implementations of Cryptographic Algorithms and Countermeasure: a Survey" in Proc. Eurosmart Conference, pp 55-64, June 2000[Jar00] Ken Jaramillo and Subbu Meiyappan, Philips Semiconductors, “10 tips for successful design: part one” -- EDN, 2/17/2000[Koc99] P. Kocher, J. Jaffe, B. Jun "Differential Power Analysis". Advances in Cryptology--CRYPTO'99, LNCS 1666 (1999), 388- 397[Kuh99] M.G. Kuhn, O. Kommerling, "Design principles for tamper resistant smart-card processors", USENIX Workshop on Smart-card Technology Proceedings, Chicago Illinois, pp9-20. May 10-11 1999[Mue02] D. Mueller, United States Patent, "Method of protecting a circuit arrangement for processing data". US 2002/0087284[Rag03] A. Raghunathan, S. Hattangady, J-J. Quisquater "Securing Mobile Appliances: New Challenges for the System Designer”, Design Automation and Test in Europe, 2003, 2003 pages 176-181[Sko02] Sergei P. Skorobogatov, Ross J. Anderson: "Optical Fault Induction Attacks", Cryptographic Hardware and Embedded Systems Workshop (CHES-2002), San Francisco, CA, USA, 13-15 August 2002[Sou93] L. Sourgen, US Patents 638459, “Security Locks for Integrated Circuits”[Tho97] J.-P. Thomasson, L.Baldi "Smartcards: portable security" Proceedings, Second Annual IEEE International Conference on Innovative Systems in Silicon, pp 259 -265, 8-10 Oct. 1997.。

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