Flexible DSP platform for various workload patterns
2、TMS320系列DSP的介绍
OMAP OMAP5910
TM
C5441 532 MIPS C5421 200 MIPS C5420 200 MIPS C5470
C54xTM+ARM7
C54xTM DSP
World’s Most Popular DSP Over 500 Million Shipped $5 Billion in Design-ins
C5407 120 MIPS
Feature Integration
TI所推进的开放式多媒体应用平台 所推进的开放式多媒体应用平台
Open Multimedia Application Platform 处理器
Applications Processor Integrated Baseband and Applications Processor
TV 因特网 浏览器 无线 AP
?
高集成度的OMAP5910提供单片系统功能 提供单片系统功能 高集成度的
OMAP5910 Core TMS320C55xTM DSP
DSP
32 16
3 Timers Watchdog Timer Interrupt Handler 2 McBSP 2MCSI 3 UART 18 GPIO 4 Mailboxes
TMS320C6000DSP的应用
同一应用的多通道复用
蜂窝基站 复用的调制解调器 中央办公交换机 多信道线路回声抵消 多信道话音编码器 Head end cable modem 中央办公XDSL
TMS320C6000DSP的应用(续)
视频图象的压缩、处理、传输
远程监控(PSTN/ISDN/ADSL) 网络视频终端 数码摄像机
Traffic Ctrl 75 MHz
Freescale 微控制器学习套件 (PBMCUSLK) 产品说明说明书
Application Module Student Learning Kit (AP5211SLK Shown)Freescale’s Microcontroller Student Learning Kits The PBMCUSLK can be used standalone for introductory circuit design orused in conjunction with the application modules. The PBMCUSLK allowsyou to easily migrate from one application module to another, providinggreat flexibility in using a range of 8-, 16- and 32-bit microcontrollers.Features:>Integrated HCS12/HCS12X/HCS08USB BDM pod>USB or wall transformer powered(+3.3, +5 or ±15V*)>Replaceable, solderless breadboard>Eight LED’s, push buttons,DIP switches>2-line, 8-character LCD display>Integrated buzzer and potentiometer>COM port (RS-232/MONO8 capable)>Configurable direct connect feature*15V not available when powered from USB BDM Project Board Student Learning Kit (PBMCUSLK)OverviewFreescale’s Microcontroller Student Learning Kits (MCUSLK) now give you the flexibility to choose!The MCUSLKs now come with a feature-rich project board and your choice of an Application Module Student Learning Kit (APSLK).Best of all, the application modules are specifically designed to plug directly into the project board to enrich development.The APSLK can be used standalone for small projects or plugged into the project board. The APSLK contains an application module (microcontroller board), CodeWarrior ®programming development tools, as well as documentation, power and communications cables to provide you with a comprehensive learning environment. Application Modules:>8-bit HCS08• APS08QG8SLK >16-bit HCS12/HCS12X/DSP • APS12DT256SLK • APS12C32SLK • APS12XDT512SLK • AP56F801SLK >32-bit ColdFire ® Processor • AP5211SLK • AP5223SLK (on-chip Ethernet)>RF transceiver**• AP13192USLK **Freescale’s newest SLK keeps you up to date with the latest innovations.Now, wireless development is simple by providing ZigBee™specification-ready RF transceivers, SMAC software andsupport documentation.CodeWarrior Development Studio is a powerful and user-friendly tool suite designed to increase your software development productivity.It shares a common interface across MCU families, making the environmenteasy to use. With unrivaled features such as the Processor Expert TM applicationdesign tool, a highly optimized compiler and the project manager with built-intemplates, the tool suite’s integrated development environment (IDE) allowsthe student to focus on the application software. The CodeWarrior environmentalso features an intuitive graphical source-level debugger with integratedprofiling capabilities, data visualization, instruction set simulation and much more.National Instrument’s Educational Laboratory VirtualInstrumentation Suite (NI ELVIS)is a LabVIEW-based, hands-ondesign and prototyping environment geared for university engineering andscience courses. NI ELVIS consists of LabVIEW virtual instruments, amultifunction data acquisition device and a custom-designed bench-topworkstation. The combination of NI ELVIS with the MCUSLK is ideal forconducting microcontroller instruction, as they provide a powerful developmentand debugging platform through the integrated instrument suite of NI ELVIS.The NI ELVIS integrated instrument suite provides essential functionalityfor teaching microcontrollers, including:> Manual and programmable power supply for poweringthe student project board > Manual and programmable signal generator and digital/analog outputs to provide stimulus to MCU input signals > Multiple instruments to acquire, visualize and analyze MCU output signals > LabVIEW integration to provide flexible design, analysis, testing and reporting Contacts for additional information:Andy Mastronardi Director, University Program Freescale Semiconductor, Inc.******************************John McLellan Applications Engineer Freescale Semiconductor, Inc.********************Ravi Marawar, Ph.D.Academic Program Manager National Instruments*******************A Prototyping Environment for EducationMicrocontroller Student Learning Kit PLUS CodeWarrior Development Tools and National Instruments’Educational Laboratory Virtual Instrumentation Suite (NI ELVIS)Freescale™ and the Freescale logo are trademarks of Freescale Semiconductor, Inc. All other product or service names are the property of their respective owners.© Freescale Semiconductor, Inc. 2006Document Number: STUDENTLEARNFSREV 1Learn More: For more information about other University Program product solutions from Freescale, please visit /universityprogram .The MCUSLKs are excellent teachingsolutions and can be used in a diversemix of coursework, such as:>Electronic Circuit Design I and II>Introduction to Microcontrollers>Microcontroller Interfacingand Applications>Mixed Signals and Circuits>Real-Time Digital Signal Processing>Real-Time Embedded Microcontrollers>Senior Project Design>MechatronicsYour students can also benefit from thereasonable price point and versatilityof MCUSLKs and are encouraged topurchase their own kit to use throughouttheir studies.。
IND560 weighing terminal和Fill-560应用软件商品说明书
2Industrial Weighing and MeasuringDairy & CheeseNewsIncrease productivitywith efficient filling processesThe new IND560 weighing terminal enables you to boost speed and precision during the filling process. Choose from a wide range of scales and weigh modules to connect to the terminal.The versatile IND560 excels in control-ling filling and dosing applications, delivering best-in-class performance for fast and precise results in manual, semi-automatic or fully automatic operations. For more advanced filling, the Fill-560 application software adds additional sequences and component inputs. Without complex and costly programming you can quickly con-figure standard filling sequences, or create custom filling and blending applications for up to four compo-nents, that prompt operators for action and reduce errors.Ergonomic design Reducing operator errors is achieved through the large graphic display which provides visual signals.SmartTrac ™, the METTLER TOLEDO graphical display mode for manual operations, which clearly indicate sta-tus of the current weight in relation to the target value, helps operators to reach the fill target faster and more accurately.Connectivity and reliabilityMultiple connectivity options are offered to integrate applications into your con-trol system, e.g. Allen-Bradley ® RIO, Profibus ®DP or DeviceNet ™. Even in difficult vibrating environments, the TraxDSP ™ filtering system ensures fast and precise weighing results. High reli-ability and increased uptime are met through predictive maintenance with TraxEMT ™ Embedded MaintenanceTechnician.METTLER TOLEDO Dairy & Cheese News 22Speed up manual operations with flexible checkweighingB e n c h & F l o o r S c a l e sHygienic design, fast display readouts and the cutting-edge color backlight of the new BBA4x9 check scales and IND4x9 terminals set the standard for more efficient manual weigh-ing processes.Flexibility through customizationFor optimal static checkweighing the software modules ‘check’ and‘check+’ are the right solutions. They allow customization of the BBA4x9 and the IND4x9 for individual activi-ties and needs, e.g. manual portion-ing or over/under control. Flexibility is increased with the optional battery which permits mobility. Hygienic design Easy-to-clean equipment is vital in food production environments. Both the BBA4x9 scale and the IND4x9 ter-minal are designed after the EHEDGand NSF guidelines for use in hygi-enically sensitive areas.Even the back side of the scale stand has a smooth and closed surfacewhich protects from dirt and allowstrouble-free cleaning.Fast and preciseThe colorWeight ® display with a colored backlight gives fast, clear indication when the weight is with-in, below or above the tolerance.The color of the backlight can be chosen (any mixture of red, greenand blue) as well as the condition itrefers to (e.g. below tolerance). The ergonomic design enables operators to work more efficiently due to less exhaustion.Short stability time, typically between 0.5s and 0.8s, ensures high through-put and increased productivity.PublisherMettler-Toledo GmbH IndustrialSonnenbergstrasse 72CH-8603 Schwerzenbach SwitzerlandProductionMarCom IndustrialCH-8603 Schwerzenbach Switzerland MTSI 44099754Subject to technical changes © 06/2006 Mettler-Toledo GmbH Printed in SwitzerlandYellow – weight above toleranceGreen – weight within toleranceRed – weight below toleranceYour benefits• Fast and precise results and operations • Higher profitability• Ergonomic design, simple to operate • Mobility up to 13h due to optional batteryFast facts BBA4x9 and IND4x9• 6kgx1g, 15kgx2g, 30kgx5g (2x3000d), for higher capacity scales: IND4x9 terminal • Weights and measures approved versions 2x3000e • Functions: simple weighing, static checkweighing, dispensing • Color backlight, bar graph • Tolerances in weight or %• 99 Memory locations • Optional WLAN, battery• Meets the IP69k protection standardsagainst high-pressure and steam cleaning • Complete stainless steel construction Immediate checkweighing resultswith color Weight®EHEDGThe colored backlight of the LC display provides easy-to- recognize indication whether the weight is within the tolerancelimits or not.WLANMETTLER TOLEDO Dairy & Cheese News 23HACCP programs, GMP (Good Manufacturing Practice), pathogen monitoring and good cleaning practices are essential for effective food safety plans. Our scales are constructed for compliance with the latest hygienic design guidelines.Hygienic design to improve food safetyMETTLER TOLEDO supports you in complying with the latest food safety standards like BRC, IFS or ISO 22000 by offering solutions which are:• Compliant with EHEDG (European Hygienic Engineering & Design Group) and NSF (National Sanitation Foundation) guidelines • Full V2A stainless steel construc-tions, optional V4A load plates • Smooth surface (ra < 0.8μm)• Easy-to-clean construction, no exposed holes • Radius of inside corners > 3mm• Ingress protection rating up to IP69k• Hermetically sealed loadcellsYour benefits• Reduce biological and chemical contamination risks • Fast and thorough cleaning procedures • Fulfillment of hygiene regulations • Long equipment life thanks to rugged designGuaranteed serviceKeep your business runningAvoid unnecessary downtime with our wide range of service packages.With a range of innovative service solutions offering regulatory compli-ance, equipment calibration, train-ing, routine service and breakdown assistance, you can profit from sus-tained uptime, together with ongoing performance verification and long life of equipment. There is a range of contract options designed to comple-ment your existing quality systems. Each one offers its own unique set of benefits depending on the equipment and its application.4/serviceFast facts PUA579 low profile scale • 300kgx0.05kg – 1500kgx0.2kg • Open design• Lifting device for easy cleaning • EHEDG conform(300 and 600kg models -CS/-FL)• Free size scale dimensions • Approach rampsExample:PUA579 first EHEDG conform floor scaleEHEDGW e i g h P r i c e L a b e l i n gChallenges faced in the packaging area are:• Responding quickly to retailer demands while improving margins • Improving pack presentation • Minimizing downtime and product giveawaysWith a complete offering of cutting-edge weighing technology, high-per-formance printing, and smart soft-ware solutions, we can help you tackle your labeling challenges whether they are very simple or highly demanding. Intuitive human-machine interfaceTouch-screen operator displays withgraphical icons guide the operator intuitively and reduce nearly every operation to just one or two key-strokes. This interface allows reduced operator training as well as increased operating efficiency.Advanced ergonomics and sani-tary designOur weigh-price labelers are made out of stainless steel for extensive pro-tection against food contamination. Careful attention to hygienic design requirements, with no dead spots and few horizontal parts, ensure that the labelers are easy to clean.Modular designOur product offering includes both manual and automatic weigh-price labelers constructed of flexible “build-ing blocks.” Different combinations and configurations can meet specific budget and operational requirements. METTLER TOLEDO will help you toselect the right:• Scale performance • Display technology • Memory capacity • IT connections • Degree of automation• Integration kitsA large range of options and peripher-als give flexibility for meeting unique requirements e.g. wireless network, hard disks, external keyboards, bar code scanners, RFID transponder, dynamic checkweighing, or metal detection.Weigh-price-labeling Ergonomic, modular, fastEtica 2300 standard manual labelerFor individual weight labeling of various products, high- speed weighing, smart printing and fast product changes are essential. METTLER TOLEDO offers static and automated solutions for both manual and high-speed prepack applica-tions. Choose from our Etica and PAS product range.METTLER TOLEDO Dairy & Cheese News 24Etica 2400i combination with automatic stretch wrappersEtica 2430G multi-conveyer weigh-price labeler rangeEfficient label applicatorsThe unique Etica label applicator (Etica G series) does not require an air compressor, allowing savings on initial equipment expense and ongo-ing maintenance costs. Labels are gently applied in any pre-memorized orientation.PAS systems provide motorized height adjustment and places the label in any corner of the package. Users will have a new degree of freedom in planning their case display layouts to maximize both product presentation and consumer impact.Smart label design tools Retailers want labels to carry clear, correct information, in accordance with their traceability and style requirements. Our solutions are equipped with labeldesign software tools which facili-tate the design of labels customizedfor retailers demands. A touch-screenallows the user to create specific labels– even with scanned elements such aslogos and graphics, pre-programmedlabel templates, or RFID.Versatile integration capabilitiesThe engineers at METTLER TOLEDOworked closely with Europe’s leadingautomatic stretch wrapper suppliersto design performance-enhancingand cost-effective weigh-wrap-labelsystem solutions. Achieving a smallsystem footprint means the systemsrequire only slightly more floor spacethan the wrapper alone.The PAS and Etica weigh-price label-ers can be integrated via TCP/IP ina METTLER TOLEDO scale network,in host computer systems and goodsmanagement systems.Etica weigh-price-labeling systems• Static and automatic weigh-price-labeling up to 55 pieces/min.• Operator displays:– 5.7” color back-lighted LCD (Etica 2300 series)– 10.4” high resolution touch screen (Etica 4400 series)• 3 inch graphic thermal printer (125 to 250mm/sec) withfully programmable label format (max. size 80x200mm)• Data memory:– 64 to 256 Mb RAM– 128 Mb to 10 Gb mass storage– Unlimited number of logo graphics and label descriptions• Interfaces:– 1 serial RS232 interface– Optional second RS232 + RS485 + Centronics port– Ethernet network communication interface(10baseT), TCP/IP, 2 USB ports (1)– Optional: hand-held bar code scanner for automatictraceability data processingGarvens PAS 3008/3012 price labelersEtica 4400METTLER TOLEDO Dairy & Cheese News 2FlexMount ® weigh moduleFast, reproducible and reliable batch-ing and filling are key success factors for your production process. Various factors can affect precision: foam can compromise optical/radar sensors, and solids do not distribute evenly in a tank or silo. Our weighing techno-logy is not affected by these condi-tions and provides direct, accurate and repeatable measurement of mass without media contact. In addition our range of terminals and transmit-ters/sensors enable easy connectivity to your control systems.Key customer benefits• Increased precision and consistencyof your material transfer processes• Faster batching process throughsupreme TraxDSP ™ noise and vibration filtering • Minimal maintenance cost Fast facts terminals/transmitters: PTPN and IND130• Exclusive TraxDSP ™ vibration rejection and superior noise filter-ing system • Easy data integration through a variety of interfaces, including Serial, Allen-Bradley ® RIO, Modbus Plus ®, Profibus ® and DeviceNET • IP65 stainless harsh versionsProcess terminal PTPN• Local display for weight indication and calibration checks • Panel-mount or stainless steel desk enclosureIND130 smart weight transmitter• Direct connectivity where no local display is required • Quick setup and run via PC tool • CalFREE ™ offers fast and easy cali-bration without test weights • DIN rail mounting versionPLCIND1306Tank and silo weighing solutions master your batching processesT a n k & S i l o W e i g h i n g S o l u t i o n sBoost your productivity and process uptime with reliable weighing equipment – improved batching speed and precision, maximum uptime at low maintenance cost.TraxDSP ™ ensures accurate results evenin difficult environments with vibrationPTPN process terminalMETTLER TOLEDO Dairy & Cheese News 27Quality data under control?We have the right solutionConsistently improving the quality of your products requires the ability of efficiently controlling product and package quality parameters in a fast-changing and highly competi-tive environment.Competition in the food industry –with high volumes but tight margins – causes demands for efficient quality assurance systems. Statistical Quality Control (SQC) systems for permanent online information and documenta-tion about your key quality para-meters convert into real cost savings.Our solutions for Statistical Quality Control (SQC) combine ease of opera-tion, quality data management and analysis functionality.• We offer mobile compact solutions with embedded SQC intelligence up to networked systems with an SQL database.• The systems are upgradeable and can be expanded and adapted to meet changing customer needs.• Simple and intuitive prompts guide the user through the sample proc-ess, reducing training costs as well as sampling errors.• Realtime analysis and alarms help to take immediate corrective measures and to save money by reducing overfilling.Throughout the manufacturing pro-cess, METTLER TOLEDO SQC solu-tions analyze your important product and package quality parameters andpresent them the way you want, help-ing to comply to legislation, to control and document your product qualityand your profitability.Metal detectionCheckweigher Sample check ® onlinequality data analysis/dairy-cheeseFor more informationMettler-Toledo GmbH CH-8606 Greifensee SwitzerlandTel. +41 44 944 22 11Fax +41 44 944 30 60Your METTLER TOLEDO contact:1. SevenGo ™ portable pH-meter2. In-line turbidity, pH and conductivity sensors3. DL22 Food and beverage analyzer4. Halogen moisture analyzersA wide range of solutions to improve processes1. Statistical Quality Control/Statistical Process Control2. Process weighing3. Predictive maintenance4. Methods of moisture content determinationShare our knowledgeLearn from our specialists – our knowledge and experience are at your disposal in print or online.Learn more about all of our solutions for the dairy and cheese industry at our website. You can find information on a wide range of topics to improve your processes, including case studies,application stories, return-on invest-ment calculators, plus all the product information you need to make aninformed decision.1 2 341423。
电气自动化专业英语词汇
电气自动化专业英语比较常见的有关词,cylinder 汽缸stopper 死档forklift 叉车chain链条flowchart 流程图pulse frequency modulation control PFMpulse width modulation control P WMtime blet同步带spare parts,buffer备件pneumatic气动electomechanical机电的solenoid 线圈motor 电机valve 阀DD motor 直驱电机(圆盘电机)LIM linear induction motor直线电机SM(servo motor)伺服电机conveyor 传送带inverter 变频器RFID(radio frequency identification)射频识别系统sensor 传感器photoelectric sensor 光电开关light curtain光幕proximity sensor接近开关barcode 条形码barcode reader条码识别器anti-vibration抗震anti-static 抗静电cable tires ,nylon strip(尼龙扎带)电缆扎带wiring duct,wire trough线槽cableveyor电缆拖链optical fiber sensor 光纤传感器optical fiber amp光纤放大器cable marker电缆线号OOBA 开箱检查PLC MAIN BASE plc主基板solt 插槽backboard bus 背板总线POWER SUPPLY MODULE电源模块battary 电池motion module位置模块DC INPUT MODULE DC输入模块DC OUTPUT MODULE DC输出模块anolog output module模拟量输出模块anolog input module模拟量输入模块ETHERNET MODULE以太模块CONNECTOR 连接器terminal resistance终端电阻remote i/o 远程i/ofiber cable 光缆touch panel触摸屏adapater适配器servo amplifer伺服放大器encoder cable编码器电缆rotating transformer旋转变压器motor power plug电机电源插头barker plug制动器插头speed contorler速度控制器breaker,no-fuse breaker,断路器magnatic contactor接触器overload relay 热继led indicator light led指示灯emergency button急停按钮selector switch 选择开关realy继电器timer定时器counter计数器filter滤波器ball screw滚柱丝杠terminal block接线端子排terminal piece终端片symbol bar标志条multilayer sound and light signal lamp多层式声光信号灯buzzer 报警器wire beezer 线鼻子heat shrinkoing tubing热缩管nylon flexible conduit,polyamide tubing波纹管flecible cable曲挠电缆electronic ballast电子镇流器sheathed control cable屏蔽控制电缆horsepower 马力slip转差率SSR(Solid State Relay)固态继电器gain增益power frequency工频harmonic谐波air knife风刀anodizing阳极化DI Water去离子水BJ(bubble jet)二流体exhaust 排气drain排水humidity湿度RH 相对湿度perssure压力temperature 温度negatibe pole负极positive pole正极common 公共端source 原极sink 漏极FFU(fan filter unit)风扇过滤单元intensity,绝缘体conductor导体tact time节拍life time寿命NG(no good)不良品OKREWORK再生laminator,coat,贴膜vaccum真空absolute encoder绝对值编码器ABS absolute position绝对位置INC increase pisition 增量位置velocity速度accelerated time加速时间decelare timeanalog to digital convertet A/Dantenna 天线acceleration加速度stroke 行程bolt螺栓bolt holebypass 旁路interpolation插补100baseT 双绞线电缆相连速率100mbpsthreshole灰度值tolerance容忍度TBD 待决定capacitor电容有功active powerreactive power 无功lower limit 上限upper limit 下限CIM computer integration manufacturing电脑整合制造FA factory automation工厂自动化DIW DE-Ionized Water去离子水UPW Ultra-pure Water超纯水clean room洁净室HEPA high efficient particulate air filter高效粒子空气过滤MGV manual guided vehicle 人力搬运车AGV automatic guided vehicle 自动搬运车IR infra-red 红外线recipe配方maintenance维护exposure 曝光cleaner清洗机etcher蚀刻机plasma等离子vent 破真空CDA compressed dry air压缩干燥空气scribe切割break 掰断grind研磨aligment对位,定位line reactor 进线电抗器tap分接头power factor功率因数no-load空载full load满载lighting光源lens镜头caramer摄像机frame grabber影像采集卡AOI automatic optical inspection自动光学检验line-scan线性扫描,线阵area-scan面阵WD 工作距离Back light 逆光、背光自动聚焦Depth of field 景深pass:指的是用“视觉系统”对被测体进行检测之后的结果为正确。
至拉斯声音DPA1202多通道网络音频放大器说明书
o u n d L .P . a n d I n n o v a t i v e E l e c t r o n i c D e s i g n s , L L C . A l l R i g h t s R e s e r v e d . A t l a s S o u n d i s a t r a d e m a r k o f A t l a s S o u n d L .P . I E D i s a r e g i s t e r e d t r a d e m a r k o f I n n o v a t i v e E l e c t r o n i c D e s i g n s , L L C . A l l o t h e r t r a d e m a r k s a r e t h e p r o p e r t y o f t h e i r r e s p e c t i v e o w n e r s . s u b j e c t t o c h a n g e w i t h o u t n o t i c e . A T S 005228 R e v C 4/16DPA1202Multi-Channel Network AmplifierFeatures• C onfiguration Levels • 2 x 600-Watt 70V/100V (Factory Default) • 4 x 300-Watt @ 4Ω • 1 x 600-Watt 70V/100V & 2 x 300-Watt @ 4Ω• No Computer Required to Operate • Networkable• Configurable DSP via GUI•PC Based DPA Site Manager Software with LAN IP Auto-Discovery Fault Reporting, Input & Output Status, Standby Status and Amplifier Remote Activation via a Scheduler Timer• Onboard Web Browser GUI for Remote Monitoring of Status & Levels• User Page with Assignable Level Control, Post Contractor Settings, Password Protected• Mute Assignments Triggered via Audio Signal or Contact Closure • Audio Sense Auto Power Down (APD)• DSP Parameters per Output, Parametric EQ, Hi & Lo Cut Filters, Delay, Limiter• Four (4) Balanced Inputs, Expandable to 8 via Accessory Card • Optional Accessory Card Slot for a DPA-DAC4 4-Channel Dante ™ Receiver or a DPA-AMIX (2) Mic / Line, (2) AUX Input Card • PC, iOS ®, & Android ® Controllable• Assignable Level Controls, Onboard GUI (Security Password Protected) or by Front Panel Pots with Tamper Deterring Covers • Four (4) GPIO Control Ports Assignable in GUI for Mute or Remote Level•Controllable From Third-Party ControllersApplicationsThe flexible DSP , remote web monitoring, and control of the DPA Series amplifiers makes them the perfect choice for presentation rooms, classrooms, conference rooms, and retail background / foreground music applications.General DescriptionThe AtlasIED DPA1202 features a combination of flexibility, performance and control to provide high value features for applications that require more than just great sound. The network based DPA1202 is a DSP controlled 4-channel amplifier that can be configured in three different amplification arrangements to meet the design requirements of any installation.The unit is factory preconfigured in a two-channel 70V mode. If the design requires four channels of low impedance amplification, the amplifier can be configured as 4-channel model with either 4Ω or 8Ω load impedances. Many system designs require both low and highimpedance amplification. This unit can be configured to deliver 70V/100V for a paging/background system on a single channel plus two additional 4Ω/8Ω amplifier channels for foreground stereo applications.The DPA1202 comes standard with four balanced line inputs and an accessory slot for an optional DPA-DAC4 4-channel Dante ™ receiver card or a DPA-AMIX (2) mic / line, (2) AUX input card, giving the DPA1202 a total of 8 inputs. All inputs can be mixed and routed to any of the four amplifier channels. All four amplifier channels have an assortment of DSP tools including level controls, EQ’s, limiters, high & low pass filters, and delay to provide flexibility for a range of applications.The output level can be assigned to either the front panelpotentiometers or to the on board GUI. Wired remote level controlcan be configured to allow simple control for the end user. Eachunit also features GUI based input and output level metering along with assignable mute functions that are triggered via an audio signal or contact closure. Access to the DSP settings is accomplished viacomputer, tablet or mobile device using a web browser. All settings can be password protected.The unit also includes a PC based site manager software thatautomatically searches within a specific network for all DPA amplifiers on the network. It will list them and allow a single click access to any unit. The DPA Site Manager software can do a variety of functions besides locating IP addresses such as; fault reporting, input & output status, standby status and remote activation via a scheduler timer.The flexibility of the DPA Series amplifiers and comprehensiveassortment of local or network control configurations make them an ideal choice in today’s sophisticated commercial audio market.DPA1202 FrontDPA1202 Backo u n d L .P . a n d I n n o v a t i v e E l e c t r o n i c D e s i g n s , L L C . A l l R i g h t s R e s e r v e d . A t l a s S o u n d i s a t r a d e m a r k o f A t l a s S o u n d L .P . I E D i s a r e g i s t e r e d t r a d e m a r k o f I n n o v a t i v e E l e c t r o n i c D e s i g n s , L L C . A l l o t h e r t r a d e m a r k s a r e t h e p r o p e r t y o f t h e i r r e s p e c t i v e o w n e r s . s u b j e c t t o c h a n g e w i t h o u t n o t i c e . A T S 005228 R e v C 4/16o u n d L .P . a n d I n n o v a t i v e E l e c t r o n i c D e s i g n s , L L C . A l l R i g h t s R e s e r v e d . A t l a s S o u n d i s a t r a d e m a r k o f A t l a s S o u n d L .P . I E D i s a r e g i s t e r e d t r a d e m a r k o f I n n o v a t i v e E l e c t r o n i c D e s i g n s , L L C . A l l o t h e r t r a d e m a r k s a r e t h e p r o p e r t y o f t h e i r r e s p e c t i v e o w n e r s . s u b j e c t t o c h a n g e w i t h o u t n o t i c e . A T S 005228 R e v C 4/16o u n d L .P . a n d I n n o v a t i v e E l e c t r o n i c D e s i g n s , L L C . A l l R i g h t s R e s e r v e d . A t l a s S o u n d i s a t r a d e m a r k o f A t l a s S o u n d L .P . I E D i s a r e g i s t e r e d t r a d e m a r k o f I n n o v a t i v e E l e c t r o n i c D e s i g n s , L L C . A l l o t h e r t r a d e m a r k s a r e t h e p r o p e r t y o f t h e i r r e s p e c t i v e o w n e r s . s u b j e c t t o c h a n g e w i t h o u t n o t i c e . A T S 005228 R e v C 4/16NOTES:1. P ower level measurment is define as follows: 1Hz Sine wave signal burst of 20 cycles (20mS) at 1% THD+N, followed by 480 cycles of a 1kHz sine wave at 10% of the max power. Other power measurements are available upon requests.2. Power measurement with Ethernet connected. Without Ethernet connected deduct .2W.3. Average Power is defined as Pink Noise input signal applied to achieve 1/4 of the 4 Ohm or 70.7V power rating.4. Max Power is defined as 1 KHz input signal applied to achieve the maxium power output before clipping into a 4 Ohm or 70.7V load.o u n d. I E D i s a r e g i s t e r e d t r a d e m a r k o f I n n o v a t i v e E l e c t r o n i c D e s i g n s , L L C . A l l o t h e r t r a d e m a r k s a r e t h e p r o p e r t y o f t h e i r r e s p e c t i v e o w n e r s . s u b j e Dimensional Drawings13.70 14.36 14.49Optional AccessoriesDPA-DAC4 - Dante™ 4-Channel Receiver CardDPA-AMIX - 4-Channel Mic / Line AUX Mixer Amp Cardo u n d L .P . a n d I n n o v a t i v e E l e c t r o n i c D e s i g n s , L L C . A l l R i g h t s R e s e r v e d . A t l a s S o u n d i s a t r a d e m a r k o f A t l a s S o u n d L .P . I E D i s a r e g i s t e r e d t r a d e m a r k o f I n n o v a t i v e E l e c t r o n i c D e s i g n s , L L C . A l l o t h e r t r a d e m a r k s a r e t h e p r o p e r t y o f t h e i r r e s p e c t i v e o w n e r s . s u b j e c t t o c h a n g e w i t h o u t n o t i c e . A T S 005228 R e v C 4/16Architect and Engineer SpecificationsThe power amplifier shall be a 4-channel switch mode power amplifier with efficient BASH Hybrid topology output circuitry with a Global Switch Mode PFC power supply. The amplifier shall be configurable as 4-channel low impedance 4Ω or 8Ω mode, 2-channel high impedance 70V/100V mode, or low impedance 2-channel 4Ω or 8Ω and 1-channel high impedance 70V/100V mode. The amplifier shall be factory shipped pre-configured in a two-channel 70V/100V mode. The I/O Router shall be configured as follows: Input 1 routed to Outputs 1 and 2 and Input 3 routed to Outputs 3 and 4 and will not require a computer or network to use in default mode.The performance specifications shall match or exceed the following:70V/100V x 2CH = 600W; 4Ω x 4CH = 300W; 8Ω x 4CH = 150W, (reference specification Notes 1-4 above); Input Sensitivity 750mV Balanced, 0dBU; Input Impedance Balanced 40k Ω; Max Input Level channels 1-4, +14dBU, 7dBU inputs 5-8 with Dante ™; THD 1% at rated output, .2% T ypical;Frequency Response -3dB 20Hz – 20kHz (DSP set to flat); Signal to Noise Ratio -100dB Below Rated Output – A Weighted; Crosstalk >70dB @1kHz; Protection circuits =Thermal, Short, Signal Limiter; Sleep Mode (Ethernet Active) 3.5W, 12BTU; Standby/ADP mode 14W. 48BTU; Max Power All CH driven 70.7V/100V (default mode) = 1511W, 2450BTU. Dimensions: 1 x RU, 19" W x 1.75" H x 14.5" D. Weight 13.1 lbs.The power amplifier shall have a front panel power switch and three states of idle power, Idle Active Mode, Sleep Mode, and Standby Auto Power Down (APD) Mode. Each mode shall have an LED indicator on the front panel indicating the power status. When in Sleep Mode, the Ethernet shall remain active for access to the amplifiers on board GUI.The amplifier shall include convection cooling with dynamic fan assist for extreme conditions. If the unit is not being used or in Standby mode, the fan shall not be needed for cooling and shall remain Off until the unit is in heavy use. As heat is generated in the amplifier during use, the fan shall activate at a low speed and increase as needed to keep the amplifier at safe operating temperature. The amplifier’s air flow shall be from rear to front. The front panel controls shall consist of four volume controls that can be removed and replaced with included security covers. Above each volume control, LED indicators for Signal and Limit/Protect/Mute shall provide the amplifier output operating condition. The 4-channel output operating mode shall be displayed to the right of the output indicators using multicolorLEDs. These indicators illustrate if Channels 1/2 and 3/4 are low impedance 4Ω or 8Ω individually configured or combined making a 70V / 100V output. Amplifier operation mode settings shall be completed using the internal DSP GUI.On the rear panel, the amplifier shall have an IEC AC receptacle thatoperates from 110V - 120V & 220V - 240V and shall automatically sense the AC Mains voltage and change voltage settings. A removable AC Mains fuse shall be provided for protection.The rear-mounted Input connectors for inputs 1 - 4 shall be individuallyremovable 3-way 3.5mm Phoenix type connectors that accept balanced line input signals (+) (–) and (GND) pins and will support unbalanced signals by connecting the (–) and (GND) pins together. The amplifier configuration and I/O Routing shall be done in the GUI. Any Input shall be capable of being routed to any Output.The rear-mounted Output connector shall be a screw terminal block type for connecting speakers to the amplifier. The recommended wire to use shall be Class 3 rated,14-gauge wire or lower for speaker wiring. Amplifier output channel configurations shall be done in the amplifier GUI. The amplifier shall be shipped with two speaker output terminal covers for safety. Included in the carton with the amplifier shall be eight (8) spade crimp terminals that accept 12-gauge wire and four (4) security cover screws (M3 x 8mm). T erminal block screws shall be M4. The amplifier shall be pre-configured at the factory for two-channel 70V/100V mode.The amplifier shall have one (1) rear mounted Accessory Card Slot to add accessory modules. Accessory modules shall make available 4 additional inputs (for a total of 8) that can be routed to any of the four output channels. Optional accessory cards shall be a Four-Channel Dante ™ Digital Audio Input Card and a Four-Channel Analog Mic / Line, Auxiliary Input Card.The amplifier shall have a rear-mounted Ethernet Connector to connect to a Local Area Network (LAN), computer, or router/switch using a standard RJ45 cable to access the amplifier’s DSP and control settings.When network enabled, the amplifier shall have a GUI Home page with Input and Output active meters, Output Configuration indicators, with Tab selections to navigate to User PC Control page, Amplifier Setup page, Mobil Control page, IP Configuration page where you can label I/O, Update page for Firmware upload, and About page. All four amplifier channels shall have an assortment of DSP tools with navigation icons to the following individual GUI pages: Amplifier Configuration, Mute, Link & Ports Assign, I/O Router Assign, Hi & Lo Pass Filters, 5-Band Parametric EQ, Output Level, Delay, and Limiter.The amplifier shall have four (4) rear-mounted Control Ports to allow assigned/configured Remote Level or Mute functions to be activated by external contact closure relay or controlled by voltage. Each Control Port pin shall be assigned to one function such as Mute or Level, but not both. Control Port assignment shall be done in the GUI “Mute, Link, Port Assignment Page”. The factory default assignments for the Amplifier Control Ports shall be as follows: C1 Controls CH 1/2 70V / 100V Output Remote Level, C2 Not Assigned, C3 Controls CH 3/ 4 70V / 100V Output Remote Level, C4 Not Assigned. The Control Ports shall provide +10V and GND connections for Remote Level controls using 10k Ω Linear Taper pots. The amplifier shall have Site Manager software to do a variety of functions including locating DPA amplifiers' IP addresses; fault reporting, input & output status, standby status and remote activation via a scheduler timer. The amplifier shall be an AtlasIED DAP1202.。
英语教研活动议课稿(3篇)
第1篇Introduction:Ladies and gentlemen, esteemed colleagues, and fellow educators, it is my great pleasure to present our English research and teaching activity, focusing on the discussion of lesson planning. Today, we gather here to share our insights, experiences, and innovative ideas that can enhance our teaching practices and contribute to the overall development of our students. Let us delve into the intricacies of lesson planning and explore ways to make our English classes more engaging and effective.I. Introduction to Lesson PlanningA. Definition and Importance of Lesson PlanningB. The Role of Lesson Planning in Student LearningC. The Challenges and Benefits of Effective Lesson PlanningII. Theoretical FrameworkA. Principles of Lesson Planning1. Objectives and Goals2. Content and Materials3. Instructional Strategies4. Assessment and EvaluationB. Theoretical Models of Lesson Planning1. Madeline Hunter’s Model2. Wiliam and Thompson’s Lesson Study3. Van Merrienboer’s 4C ModelIII. Lesson Planning ProcessA. Identifying Objectives and Goals1. Alignment with Curriculum Standards2. Student Learning Outcomes3. Assessment MethodsB. Selecting Content and Materials1. Textbooks and Resources2. Authentic Materials3. Technology IntegrationC. Designing Instructional Strategies1. Direct Instruction2. Inquiry-Based Learning3. Collaborative LearningD. Assessing and Evaluating Learning1. Formative and Summative Assessment2. Student Feedback and Self-Assessment3. Adjusting Instruction Based on Assessment ResultsIV. Case Study: Lesson Planning for a High School English ClassA. Introduction to the Lesson1. Topic: Shakespearean Sonnets2. Grade Level: 11th Grade3. Duration: 45 minutesB. Objectives and Goals1. To analyze the structure and themes of Shakespearean sonnets.2. To improve students' critical thinking and analytical skills.3. To enhance students' appreciation for Shakespearean literature.C. Content and Materials1. Textbook: “Shakespeare: The Complete Sonnets”2. Authentic mater ials: Sonnets from Shakespeare’s works3. Technology: PowerPoint presentation, online resourcesD. Instructional Strategies1. Introduction to the lesson: Teacher presents a brief overview of Shakespearean sonnets and their significance.2. Direct instruction: Teacher explains the structure and themes of Shakespearean sonnets.3. Inquiry-based learning: Students work in groups to analyze and discuss selected sonnets.4. Collaborative learning: Groups present their findings to the class, and the teacher facilitates a discussion.5. Summarizing and closing: Teacher summarizes the key points and highlights the importance of understanding Shakespearean sonnets.E. Assessment and Evaluation1. Formative assessment: Teacher observes students’ participation and engagement during group discussions.2. Summative assessment: Students complete a written assignment, analyzing a selected sonnet and discussing its structure and themes.3. Student feedback and self-assessment: Students reflect on their learning and provide feedback on the lesson.V. Group Discussion and ReflectionA. Sharing Experiences and Challenges1. What are the common challenges faced while planning English lessons?2. How do we overcome these challenges?B. Innovative Ideas and Best Practices1. How can we incorporate technology into our lesson planning?2. What are some effective strategies for engaging students in English classes?3. How can we ensure that our lessons are culturally relevant and inclusive?VI. ConclusionLadies and gentlemen, today’s discussion has provided us with valuable insights and innovative ideas for lesson planning in English classes. By following the principles of effective lesson planning and adapting our strategies to meet the needs of our students, we can create engaging and impactful learning experiences. Let us continue to collaborate, share our experiences, and grow as educators in our quest to enhance the learning and development of our students.Thank you for your participation and contributions to this English research and teaching activity. We look forward to applying these ideas in our classrooms and witnessing the positive impact on our students’ learning journey.[End of the议课稿]第2篇Introduction:Ladies and gentlemen, esteemed colleagues, and guests, welcome to our English teaching and research activity. Today, we are gathered here to engage in a collaborative lesson planning session. This session aims to enhance our teaching skills, share innovative ideas, and foster a conducive learning environment for our students. Let us begin with a brief introduction to the topic and the objectives of this session.I. Introduction to the TopicThe topic of our lesson planning session is "Enhancing Student Engagement in English Language Learning through Interactive Activities." With the increasing importance of English as a global language, it is crucial for us to find effective ways to engage our students in the learning process. Interactive activities not only make the learning experience more enjoyable but also facilitate better understanding and retention of the language.II. Objectives of the Session1. To identify effective interactive activities that can be incorporated into English language lessons.2. To discuss and analyze the impact of these activities on student engagement and learning outcomes.3. To share practical tips and strategies for implementing these activities in our classrooms.4. To encourage collaboration and professional development among English teachers.III. Presentation of Lesson PlansA. Lesson Plan 1: "Role-Playing Scenarios"Objective: To improve students' speaking and listening skills while fostering cultural awareness.Materials:1. A list of common scenarios (e.g., shopping, traveling, dining out)2. Props and costumes (optional)Procedure:1. Divide the class into small groups.2. Assign each group a scenario to act out.3. Provide a few minutes for the groups to prepare their roles and dialogues.4. Conduct the role-playing activity in the classroom.5. Encourage students to observe and participate actively.6. After the activity, hold a class discussion to reflect on the scenarios and cultural aspects.B. Lesson Plan 2: "English Corner"Objective: To provide a platform for students to practice speaking English in a relaxed and informal setting.Materials:1. A designated area in the classroom or school2. A schedule for the English Corner sessionsProcedure:1. Designate a specific time and place for the English Corner sessions.2. Encourage students to bring a topic of their choice for discussion.3. Assign a facilitator to lead the discussions and ensure that everyone gets a chance to speak.4. Provide guidelines on proper grammar and pronunciation.5. Rotate the facilitator role among students to ensure equal participation.C. Lesson Plan 3: "Group Projects"Objective: To enhance students' collaborative skills and critical thinking abilities.Materials:1. Project topics (e.g., research on famous English-speaking countries, creating a short English film)2. Resources for research and productionProcedure:1. Assign groups based on students' interests and abilities.2. Provide guidelines on the project's scope and expectations.3. Hold regular group meetings to monitor progress and offer assistance.4. Encourage students to share their findings and experiences with the class.5. Evaluate the projects based on criteria such as creativity, teamwork, and language proficiency.IV. Discussion and AnalysisNow that we have presented our lesson plans, let us engage in a discussion and analysis of their potential impact on student engagement and learning outcomes.1. What are the strengths and weaknesses of each lesson plan?2. How can we adapt these activities to cater to diverse learning styles and abilities?3. What are some challenges we might face while implementing these activities, and how can we overcome them?4. How can we assess the effectiveness of these activities in improving student engagement and learning outcomes?V. Practical Tips and StrategiesBased on the discussion, let us now share some practical tips and strategies for implementing these interactive activities in our classrooms.1. Be flexible and adapt the activities to suit your students' needs.2. Provide clear instructions and guidelines to ensure a smooth flow of the activity.3. Encourage active participation and create a supportive learning environment.4. Use technology and multimedia resources to enhance the learning experience.5. Regularly assess and reflect on the effectiveness of the activities to make improvements.VI. ConclusionIn conclusion, today's English teaching and research activity has provided us with valuable insights into enhancing student engagement in English language learning through interactive activities. By implementing these activities in our classrooms, we can create a more dynamic and engaging learning environment that fosters better understanding and retention of the language. Let us continue to collaborate, share our experiences, and strive for excellence in our teaching practices.Thank you for your participation and contributions to this session. We look forward to witnessing the positive impact of these interactive activities on our students' language skills and overall learning experience.第3篇Introduction:Ladies and gentlemen, esteemed colleagues, and esteemed guests, welcome to today's English teaching and research activity. The purpose of this session is to engage in a reflective lesson planning process, where we can share our insights, experiences, and best practices in English language teaching. We will discuss various aspects of lesson planning, including curriculum design, teaching strategies, assessment methods, and student engagement. Let's dive into the heart of our discussion and explore the intricacies of effective lesson planning.I. Introduction to the TopicA. Importance of Lesson PlanningLesson planning is a crucial component of effective teaching. It provides a structured framework for teachers to organize their lessons, ensure a logical progression of content, and cater to the diverse needs of students. A well-planned lesson enhances student engagement, promotes critical thinking, and fosters a positive learning environment.B. Objectives of the SessionThe objectives of this session are to:1. Share insights and experiences in lesson planning.2. Discuss different aspects of lesson planning, such as curriculum design, teaching strategies, and assessment methods.3. Identify best practices for engaging students in English language learning.4. Collaboratively develop a comprehensive lesson plan for a selected topic.II. Curriculum Design and Content SelectionA. Understanding the CurriculumThe first step in lesson planning is to have a clear understanding of the curriculum. We should be familiar with the learning objectives, assessment criteria, and the content that needs to be covered.B. Content SelectionSelecting appropriate content is essential for creating engaging and relevant lessons. We should consider the following factors:1. Student interest and prior knowledge.2. Age and proficiency level of the students.3. Integration of cross-curricular themes.4. Alignment with the curriculum objectives.III. Teaching Strategies and MethodsA. Introduction to Different Teaching StrategiesTeaching strategies are the methods used by teachers to facilitate learning. We will explore various strategies such as direct instruction, inquiry-based learning, collaborative learning, and project-based learning.B. Selecting the Right StrategyThe choice of teaching strategy depends on the learning objectives, student needs, and the content being taught. We should consider the following factors:1. Student engagement and motivation.2. Learning outcomes and assessment methods.3. Time and resources available.4. Teacher expertise and comfort level.IV. Student Engagement and MotivationA. Importance of Student EngagementStudent engagement is vital for effective learning. Engaged students are more likely to participate actively, think critically, and retain information.B. Techniques for Student EngagementWe will discuss various techniques for engaging students, such as:1. Interactive activities and games.2. Technology integration.3. Group work and collaborative learning.4. Real-world connections and authentic resources.V. Assessment Methods and EvaluationA. Purpose of AssessmentAssessment is a critical component of lesson planning. It helps us monitor student progress, identify areas of strength and weakness, and make informed decisions about teaching and learning.B. Different Assessment MethodsWe will explore various assessment methods, such as:1. Formative and summative assessments.2. Oral and written assessments.3. Self-assessment and peer-assessment.4. Portfolio assessment and project-based assessment.VI. Collaborative Lesson PlanningA. Sharing Ideas and ResourcesCollaborative lesson planning allows us to leverage the collective expertise and experiences of our colleagues. We will share our ideas, resources, and best practices.B. Developing a Comprehensive Lesson PlanBased on the discussions and insights gained throughout the session, we will collaboratively develop a comprehensive lesson plan for a selected topic. This plan will include the following elements:1. Lesson objectives and learning outcomes.2. Introduction and engagement activities.3. Main content delivery and teaching strategies.4. Student engagement and assessment activities.5. Conclusion and reflection.Conclusion:In conclusion, effective lesson planning is a vital skill for English language teachers. By understanding the curriculum, selecting appropriate content, utilizing various teaching strategies, and incorporating engaging activities, we can create dynamic and effective lessons that cater to the diverse needs of our students. Today's session has provided us with a platform to share our insights, experiences, and best practices in lesson planning. Let us continue to work together, support each other, and strive for excellence in our teaching endeavors.Thank you for your participation and contributions to this enriching session. May our collective efforts contribute to the continuous improvement of English language teaching and student learning outcomes.。
富士通SPARC M12-2S服务器说明书
DatasheetFujitsu SPARC M12-2S Unix ServerThe Fujitsu SPARC M12-2S server is a high-performance, flexible and scalable system based on the latest SPARC64TM XII processor, delivering high availability for mission-critical enterprise workloads and cloud computingProduct OverviewThe Fujitsu SPARC M12-2S server is a flexible and scalable system based on the latest SPARC64 XII (“twelve ”) processor, delivering high performance and high availability for mission-critical enterprise workloads and cloud computing. The SPARC64 XII processor core is up to 2.5 times faster compared to the previous generation SPARC64 core. Innovative Software on Chip capabilities deliver dramatic performance increases by implementing key software functions directly in the processor. The Fujitsu SPARC M12-2S system can scale from 1 to 8 processors using a modulararchitecture, with the flexibility to create large, scale-up and/or scale-out serverconfigurations. In addition, customers can enjoy the benefits of Capacity on Demand with core-level activation, as well as physical partitioning capabilities and a suite of built-in virtualization technologies included at no cost.Flexibility and Scalability for Mission Critical CloudsThe Fujitsu SPARC M12-2S server offers high reliability and outstanding processor core performance and provides flexible scalability by virtue of a modular Building Blockexpansion methodology. The Fujitsu SPARC M12-2S server can scale up to 8 processors and 768 threads or can be used in scale-out configurations for parallel distributedprocessing. The Fujitsu SPARC M12-2S is an ideal server for traditional enterprise-classworkloads such as large-scale onlinetransaction processing (OLTP),business intelligence and data warehousing (BIDW), enterprise resource planning (ERP), and customer relationship management (CRM), as well as new environments in cloud computing or big data processing.Maximum FlexibilityEach Fujitsu SPARC M12-2S Building Block‘s minimum configuration includes oneprocessor. With core-level CPU activation, a minimum of just two processor cores must be activated initially. Core resources can begradually expanded, as needed, in increments of a single core using activation keys. Cores are activated dynamically while the system remains operational. In addition, the Fujitsu SPARC M12-2S Building Block Architecture can be used to create a large, scale-up server with as many as 8 processors and up to 12 TB of memory. Each Fujitsu SPARC M12-2S four rack unit (4RU) Building Block can scale to 24 cores and 192 threads. A Fujitsu SPARC M12-2S server can scale dynamically from 1 to 4 Building Blocks, for maximum configuration flexibility. The Building Blocks are connected via a Fujitsu-developed interconnecttechnology that ensures high bandwidth, low latency, and linear scalability. The server can also be flexibly deployed and operated in a scale-out configuration.■Up to eight 12-core, 4.25 GHz SPARC64 XII processors for a total of 96 cores and 768 powerful threads ■Superior enterprise application performance for small to large ERP, BIDW, SCM, CRM, Big Data, and Analytics workloads■Maximum cost savings with efficient consolidation of a large number of applications with diverse requirements on a single server■Flexible main memory configurations: from 64 GB to 12 TB, and supporting mixed DIMM capacities ■Radically improved response times and throughput performance by running entire databases in memory, eliminating costly disk accesses■Mainframe-class reliability, availability, and serviceability (RAS) capabilities ■Robust RAS features availability to support the most demanding 24/7 mission-critical applications■Modular Building Block Architecture■Dynamically expand resources easily and economicallyfrom 1 to 8 processor sockets■High-speed interconnect technology■Linear scaling from 1 Building Block to 4 Building Blocks tohandle planned and unplanned workload growth■Core-based CPU Activation■Ability to pay for only the resources that are needed,minimizing initial investment and avoiding expensiveupgrades■Fast and economical system capacity growth in incrementsas small as a single processor core with no downtime■Software-on-Chip instructions implementing key software functions directly in SPARC64 XII processors ■Drastic performance gains for a wide range of applications such as encryption, decimal arithmetic operations, anddatabase accelerators built into each CPU core■ 1.5 times higher memory access performance by adopting DDR4 memory directly attached to each processoraccelerates Oracle Database in-memory dramatically■New Vapor and Liquid Loop Cooling (VLLC) technology for innovative and compact system design ■Twice the cooling performance of Liquid Looping Cooling (LLC) technology used in Fujitsu M10 servers■Dramatic reduction in space and completely self-contained, requiring no maintenance■Layered virtualization including Oracle VM Server for SPARC and Oracle Solaris Zones technologies ■Higher levels of system utilization and cost reduction with flexible resource configurations■Massive server consolidation without the need to acquire additional software■Supports Oracle Solaris 11 and Oracle Solaris 10, also Solaris 9 and 8 with Oracle Solaris Legacy Container ■Investment protection for application software as well as system management and administration expertise,avoiding costly and complex migrations■Oracle Solaris Binary Application Guarantee■Preservation of software investments with guaranteedcompatibility, allowing existing SPARC Solaris applicationsto run unmodifiedFeatures and benefitsWorld-Class Enterprise Performance with Extreme Core Technology Fujitsu SPARC M12 servers featuring the 12-core SPARC64 XII processor provide superior performance for mission-critical enterprise workloads and cloud computing. Employing proven Fujitsu supercomputer technology for highly parallel computing and an innovative cooling technology to achieve low latency access time between memory and CPU, the Fujitsu SPARC M12 servers can process large amounts of data in a short period of time. These technologies provide superior performance for enterprise workloads such as online transaction processing (OLTP), enterprise resource planning (ERP), business intelligence and data warehousing (BIDW), supply chain management (SCM), and customer relationship management (CRM), as well as new environments in cloud computing or data processing.Pay as You Grow Dynamic ScalabilityThe modern enterprise needs a flexible platform that provides superior performance and availability for current application environments as well as the ability to scale for future growth and technological needs. The Fujitsu SPARC M12-2S server features unique dynamic scaling to grow as the business grows. With CPU Activation, customers can activate CPU resources on a CPU core basis and expand from a single CPU socket and two cores, while paying for only the processor cores that are needed. In addition, Fujitsu SPARC M12-2S allows for the gradual addition of resources such as CPU, memory, and PCIe slots through the dynamic addition of Building Blocks connected via the high-speed interconnect. Together, CPU Activation and Building Block Architecture enable rapid, granular and cost-effective growth from a very small configuration up to as many as 8 CPU sockets and 96 processor cores.High Availability for Mission-Critical ApplicationsThe Fujitsu SPARC M12-2S server delivers high availability to support demanding mission-critical applications. It comes with mainframe-class reliability, availability, and serviceability (RAS) features including automatic recovery with instruction retry, extended error-correcting code (ECC) protection, guaranteed data path integrity, configurable memory mirroring, and many more RAS capabilities. Furthermore, major system components are redundant and hot-swappable for increased availability and serviceability. Innovative Software on Chip TechnologyFujitsu SPARC M12-2S servers feature Software on Chip (SWoC) technology, which implements common software code sequences directly in the processor hardware, offering significant enhancements for key database functions. Two Software on Chip technologies, SIMD (Single Instruction Multiple Data) and decimal floating point ALUs (Arithmetic Logical Units), directly accelerate Oracle Database in-memory processing with specific hardware instructions. SWoC encryption acceleration is also implemented, providing high-speed encryption processing (encryption/decryption) using the Oracle Solaris encryption library. Also, the load placed on the CPU when the database is encrypted is reduced and a secure work environment can be configured.New High-Efficiency Cooling TechnologyThe new Fujitsu hybrid cooling technology, Vapor and Liquid Loop Cooling (VLLC), in Fujitsu SPARC M12-2S servers is an innovative high-efficiency vapor and liquid cooling technology that maximizes performance, minimizes space, and reduces noise. VLLC achieves twice the cooling performance of Liquid Loop Cooling (LLC) used in FujitsuM10 servers. VLLC also dramatically improves the internal layout of the server, allowing CPUs and memory to be packed closer together; reducing memory latency. VLLC is completely self-contained and requires no maintenance. This efficient cooling system can lead to significant cost savings for businesses.Advanced Virtualization and ConsolidationSPARC processor-based servers are among the world’s best consolidation and virtualization platforms. The Fujitsu SPARC M12-2S server supports up to 4 physical partitions, and as many as 256 Oracle VM Server for SPARC domains per physical partition, enabling massive server consolidation and cost savings.Oracle Solaris: The World’s Most Advanced Enterprise Operating SystemThe Fujitsu SPARC M12-2S server supports Oracle Solaris 11 and Oracle Solaris 10. In addition, all Fujitsu SPARC M12 servers benefit from the Oracle Solaris Binary Application Guarantee, with guaranteed binary and source-code compatibility for legacy applications. Oracle Solaris offers the powerful Solaris ZFS file systems and unmatched capabilities such as dynamic tracing (DTrace), cryptographic infrastructure, user and process rights management, and the Oracle Solaris IP Filter. In addition, Oracle Solaris 9 and 8 are supported using Oracle Solaris Legacy Containers.TopicsSpecificationsProcessorCPU SPARC64 XII: 12-core processor, 8 Simultaneous Multithreading threads per core,Two instruction pipelines per core, SPARC V9 architecture, Error Checking andCorrection (ECC) protectionLevel 1 cache per core64 K data cache and 64 K instruction cacheLevel 2 cache per core512 KBLevel 3 cache per CPU socket32 MBClock speed 4.25 GHzSoftware on Chip features•SIMD Single Instruction Multiple Data Vector Processing•Extended Floating-Point Registers•Decimal Floating-Point Processing. IEEE 754 standard and Oracle Number•Cryptographic Processing. Supported encryption modes are AES, DES, 3DES,DH, DSA, ECC, RSA and SHASystemCPU•Up to 2 CPUs: 1 Building Block configuration•Up to 8 CPUs: 4 Building Block configurationMain memory•Up to 3 TB per unit, with 64 GB DIMMs: 1 Building Block configuration•Up to 12 TB per unit, with 64 GB DIMMs: 4 Building Block configurationI/O•8 PCI Express 3.0 short, low-profile slots (eight lanes):1 Building Block configuration•32 PCI Express 3.0 short, low-profile slots (eight lanes):4 Building Block configuration•Up to 352 PCI Express slots with optional PCI Expansion Units•4-port 10GbE, 1 SAS-2 port, 2-port USB per Building BlockMemory bandwidth (per chip)153 GB/secService processor One per Building BlockStorageLocal storage Up to eight 600 GB or 1.2 TB internal 2.5-in. SAS HDDs or 400 GB or 800GB eMLCSAS SSDs (can be mixed)SoftwareOperating system Control Domain:•Oracle Solaris 11.4 + SRU 11.4.48.126.1 or later*Guest Domains:•Oracle Solaris 11.4 or later•Oracle Solaris 11.3 or later•Oracle Solaris 11.2 or later•Oracle Solaris 11.1 or later•Oracle Solaris 10 1/13**•Oracle Solaris 10 8/11**•Oracle Solaris 10 9/10*** The following operating systems are supported on the condition that theoptional LAN card is mounted, because they cannot use the onboard LAN:Oracle Solaris 11.3 SRU 11.3.17.5.0 or laterOracle Solaris 11.2 SRU 11.2.15.5.1Oracle Solaris 11.1 SRU 11.1.21.4.1Oracle Solaris 10 1/13 150310-03 or laterSoftware** Plus required patchesOracle Solaris 9 or 8 branded zones run within an Oracle Solaris 10 domain.Please see the Fujitsu SPARC M12 Systems Product Notes manual for SRU/patchrequirements.Software included•Oracle Solaris 11.4 or later, which includes Oracle VM Server for SPARC•Oracle Solaris ZFS (default file system)Management software •XSCF monitoring/control facility•XSCF software, which manages hardware configuration and health, domainconfiguration and status, error monitoring, and notifications.System monitoring Oracle Enterprise Manager Ops Center 12c Release 3 Update 2 or laterOracle Enterprise Manager Cloud Control 13c Release 1 or laterVirtualization Built-in, no-cost Oracle VM Server for SPARC provides the flexibility and power ofrunning multiple logical domains in a single server. Multiple Oracle Solaris Zonesmay be run within a single Oracle VM Server for SPARC logical domain.Reliability, Availability, and ServiceabilityKey features •End-to-end ECC protection•Guaranteed data path integrity•Automatic recovery with instruction retry•Dynamic L1, L2 and L3 cache way degradation•ECC and Extended ECC protection for memory, memory mirroring, periodicmemory patrol, and predictive self-healing•Hardware redundancy in memory (when mirroring), HDD, SSD(SoftwareRAID), PCI cards (Multipath configuration), power system, PSU, fan, vaporand liquid cooling pumps, and XSCF (on configuraions with two or moreBuilding Blocks)•Hot-pluggable HDD/SSD, PSU, PCIe cards, fans, and XSCF (on configuraionswith two or more Building Blocks)•Live operating system upgrades•Firmware updates during system operationEnvironmentAC power 200 V to 240 V ±10% (50/60 Hz)Power consumption Single Building Block maximum 3,292 W4 Building Blocks maximum 13,168 WOperating temperature •5° to 35° C (41° to 95° F) at an altitude of 0 m to 500 m•5° to 33° C (41° to 91° F) at an altitude of 501 m to 1,000m•5° to 31° C (41° to 88° F) at an altitude of 1,001 m to 1,500 m•5° to 29° C (41° to 84° F) at an altitude of 1,501 m to 3,000 mNon-operating temperature-25° C to 60° C (-13° F to 140° F) (packed)0 to 50° C (32° F to 122° F) (non-packed)Altitude Up to 3,000 m (9,843 ft.)Acoustic Noise•8.2 B (1 CPU) / 8.5 B (2 CPUs)•64 dB (1 CPU) / 68 dB (2 CPUs)Cooling 11,850 kJ/h per Building BlockDimensions and Weight per Building BlockHeight17.5 cm (6.9 in.)Width44.0 cm (17.3 in.)Depth80.0 cm (31.5 in.)Weight60 kg (132.3 lb.)RegulationsSafety•UL/CSA 60950-1, UL/CSA 62368-1, EN 62368-1, IEC 60950-1, and IECRegulations62368-1 CB Scheme with all country differences EMC•Emissions: FCC 47 CFR 15, ICES-003, EN 55032, KN32, EN 61000-3-2, EN61000-3-3, JIS C 61000-3-2•Immunity: EN 55035, KN35Productshttps:///global/products/ In addition to the Fujitsu SPARC M12 Server, Fujitsu offers a full portfolio of other computing products.Computing products■ S torage systems: ETERNUS■ S erver: PRIMERGY , PRIMEQUEST, Fujitsu SPARC M12, BS2000/OSD Mainframe ■ C lient Computing Devices: LIFEBOOK, STYLISTIC, ESPRIMO, FUTRO, CELSIUS ■ P eripherals: Fujitsu Displays, Accessories ■ S oftware ■ N etworkProduct Support Services with differentservice levels agreements are recommended to safeguard each product and ensure smooth IT operation.Solutionshttps:///global/solutions The Fujitsu solutions combine reliable Fujitsu products with the best in services, know-how and worldwide partnerships.Fujitsu's Solutions include parts of one or more activity groups (e.g., planning,implementation, support, management, and training services) and are designed to solve a specific business need.Infrastructure Solutions are customerofferings created by bringing Fujitsu’s best products, services and technologies together with those from partners to deliver benefit to our customers’ businesses .Industry Solutions are tailored to meet the needs of specific verticals.Business and Technology Solutions provide a variety of technologies developed to tackle specific business issues such as security and sustainability, across many verticals.Serviceshttps:///global/services/ Several customizable Fujitsu Service offerings ensure that IT makes a realdifference and delivers true business value. We do this by leveraging our extensive experience in managing large, complex, transformational IT programs to help clients in planning, delivering and operating IT services in a challenging and changing business environment.Application Services support the development, integration, testing,deployment and on-going management of both custom developed and packagedapplications. The services focus on delivering business and productivity improvements for organizations.Business Services respond to the challenge of planning, delivering and operating IT in a complex and changing IT environment. Managed Infrastructure Services enable customers to deliver the optimal ITenvironment to meet their needs – achieving high levels of IT service quality andperformance for data center and end user environments.Environment - Fujitsu GlobalFujitsu Green Policy Innovation is ourworldwide project for reducing burdens on the environment. Using our global know-how, we aim to resolve issues of environmental energy efficiency through IT. Please find further information at:Learn more about Fujitsu, please contact your Fujitsu sales representative, Fujitsu business partner,or visit our website.https:///sparc© Copyright 2023 Fujitsu limitedFujitsu, the Fujitsu logo, [other Fujitsu trademarks /registered trademarks] are trademarks or registered trademarks ofFujitsu Limited in Japan and other countries.Technical data subject to modification and delivery subject to availability. Any liability that the data and illustrations are complete, actual or correct is excluded. Designations may be trademarks and/or copyrights of the respective manufacturer, the use of which by third parties for their own purposes may infringe the rights of such owner.More informationContact FUJITSUFujitsu SPARC M12 Server https:///sparc 2023-07-11 WW -EN。
SL Loudspeaker 52 A W 产品说明说明书
FEATURESActive loudspeaker with inbuilt power supplyOptimized for speech intelligibilityIntegrated DSP with frequency adjust-ments and high pass filterAuto sleep modeFlexible wallmount included in deliveryARCHITECT’S SPECIFICATIONSSL Loudspeaker 52 A WThe loudspeaker shall be optimized for speech intelligibility and shall be suitable for meeting rooms with up to 16 partici-pants on site.The loudspeaker shall feature two input sockets for connecting audio signals: one balanced input terminal (e.g. Phoenix Con-tact MC 1.5/3-ST-3.5 or similar) and one unbalanced RCA input.The loudspeaker shall feature three 3-posi-tion adjustment switches for adjusting its high, medium and low frequency levels for optimum sound quality depending on the mounting position and the room charac-teristics. The loudspeaker‘s high pass filter shall be adjustable to 50 Hz, 70 Hz or 100 Hz. The input sensitivity shall be selectable between −6 dBu, 0 dBu or +10 dBu. Input impedance (balanced and unbalanced) shall be > 10 k O.TECHNICAL DATAACOuSTICSFrequency response ± 3 dB .................................53 − 30,000 Hz Max. SPL at 1 m (150 − 5,000 Hz) .....................97 dB SPLTHD at 90 dB SPL at 1 m > 200 Hz ....................< 1 % ELECTROnICSnominal output power woofer ............................40 WRMS at 1 % THD(with deactivated limiter)nominal output power tweeter ...........................40 WRMS at 1 % THD(with deactivated limiter)THD + n vs. frequency at 1 W output ................0.16 %SnR at 1 kHz ............................................................95 dBCMRR ..........................................................................71 dBCrossover frequency ...............................................4.5 kHzSlope low pass woofer ...........................................12 dB/oct. (2nd order) Slope high pass tweeter ........................................24 dB/oct. (4th order) Resonance frequency high pass woofer ............55 Hz; 75 Hz; 100 Hz Slope high pass woofer ........................................24 dB/oct. (4th order)SL Loudspeaker 52 A W2Bass reflex portContinued on page 2 Continued on page 2The loudspeaker shall have a frequency response (+-3 dB) of 53 – 30,000 Hz. Ma-ximum sound pressure level at 1 m (150 to 5,000 Hz) shall be 97 dB SPL. THD at 90 dB SPL at 1 m > 200 Hz shall be < 1 %. nominal output power of the woofer and the tweeter (RMS at 1% THD and with deactivated limiter) shall be 40 W, respec-tively. THD plus noise vs. frequency at 1 W output power shall be 0.16 %. Signal-to-noise ratio at 1 kHz shall be 95 dB. Com-mon mode rejection ratio shall be 71 dB. The loudspeaker shall operate on 100−240 V AC, 50 – 60 Hz. The loudspeaker shall have an On/OFF power switch and shall feature a second switch for activating/ deactivating the auto standby mode.If enabled, the auto standby mode shall become active after 20 minutes without audio signal.The loudspeaker shall have a housing with pre-drilled mounting points and shall be supplied complete with a wall mounting kit (consisting of a wall bracket, a loudspeaker bracket, 2 spacers, a safety wire, screws and anchors).The loudspeaker’s dimensions shall be approximately 240mm x 140mm x 161mm (9.45" x 5.51" x 6,34"); its weight shall be approximately 3.1kgThe loudspeaker shall be the Sennheiser SL Loudspeaker 52 A W.TECHNICAL DATAPOSITIOn ADJuSTMEnTSHF ................................................................................ f = 2800 Hz, Gain +1.4dBflatf = 2800 Hz, Gain −1.5dBMF ............................................................................... fl atf = 100 Hz, Gain −2.7dBf = 230 Hz, Gain −3.7dBLF ................................................................................ fl atf = 800 Hz, Gain −2.0dB, 6dB Lowshelff = 800 Hz, Gain −4.0dB, 6dB Lowshelf Input sensitivity at 97 dB SPL .............................. S witch positions−6 dBu0 dBu10 dBuSwitch−on level switch–on automatics .............1.4 mVRMSAuto standby ...........................................................20 minInput impedance: .................................................... b alanced > 10 k Ounbalanced > 10 k OPRODuCT PROPERTIESPower consumption (standby) ............................ 230 V AC; 0.47 W /110 V AC; 0.34 WPower consumption (idle) .................................... 230 V AC; 4.75 W /110 V AC; 4.53 WPower consumption (max) ................................... 230 V AC; 95 W /110 V AC; 91 WDimensions (H x W x D) .........................................240mm x 140mm x 161mm Weight .......................................................................3.1 kgMounting points ...................................................... 2 x M6 on rear panel with depth10mmDELIVERY INCLUDES1 SL Loudspeaker 52 A W1 SpeakerMount 1001 wall bracket1 loudspeaker bracket2 spacers1 set of safety wire, screws and anchors1 quick guide1 safety guideThe mains cable is not included in the delivery.Mains cables with different lengths and for different countries are available as an accessory.Sennheiser electronic GmbH & Co. KG Am Labor 1, 30900 Wedemark, Germany 0 1 / 1 4 S e n n h e i s e r i s a r e g i s t e r e d t r a d e m a r k o f S e n n h e i s e r e l e c t r o n i c G m b H & C o . K G . w w w . s e n n h e i s e r . c o m . C o p y r i g h t ©0 5 / 2 0 1 3 . A l l r i g h t s r e s e r v e d . E r r o r s a n d o m i s s i o n s e x c e p t e d .。
Digital Signal Processing
Digital Signal Processing Digital Signal Processing (DSP) is a vital field that has revolutionized various aspects of our lives. From audio and video processing to telecommunications and medical imaging, DSP plays a crucial role in enhancing the quality of signals and extracting useful information from them. In this response, I will discuss the significance of DSP from multiple perspectives, highlightingits impact on different industries and the emotional elements associated with its advancements. From a technological perspective, DSP has opened up a world of possibilities. With the advent of high-speed processors and advanced algorithms, DSP techniques have become more powerful and versatile. This has enabled the development of sophisticated audio and video processing systems that can remove noise, enhance clarity, and even manipulate signals to create special effects. For example, in the entertainment industry, DSP is used to improve the audio quality of music recordings, making them more enjoyable for listeners. It also plays a crucial role in video editing, allowing professionals to enhance visual effects and create stunning visuals. In the field of telecommunications, DSP has revolutionized the way we communicate. From mobile phones to satellite communication systems, DSP algorithms are used to encode, transmit, and decode signals, ensuring reliable and high-quality communication. This has led to improved voice and video call quality, faster data transfer rates, and increased capacity in wireless networks. The emotional impact of these advancements is evident in our daily lives. We can now connect with our loved ones, no matter where they are in the world, with crystal-clear audio and video, bridging the distance and bringing us closer together. Another area where DSP has made significant contributions is medical imaging. Techniques like computed tomography (CT), magnetic resonance imaging (MRI), and ultrasound heavily rely on DSP algorithms to process and reconstruct images from raw data. This hasrevolutionized the diagnosis and treatment of various medical conditions, enabling doctors to visualize internal structures with unprecedented detail. The emotional impact of this cannot be overstated. DSP has saved countless lives by enabling early detection of diseases, guiding surgical procedures, and monitoring treatment progress. In addition to these industries, DSP has also found applications infields like radar and sonar systems, seismology, speech recognition, and even financial analysis. In radar and sonar systems, DSP algorithms are used to process the received signals and extract useful information about the surrounding environment. In seismology, DSP helps in detecting and analyzing earthquakes, providing valuable insights into the Earth's structure and predicting potential hazards. Speech recognition systems, like those used in virtual assistants, rely on DSP techniques to accurately interpret and respond to human speech. Infinancial analysis, DSP algorithms are used to analyze market data and make predictions, aiding in decision-making and risk management. The advancements in DSP have undoubtedly improved our lives in numerous ways, but it is essential to consider the ethical implications as well. With the increasing use of DSP in surveillance systems, privacy concerns have become more prominent. The ability to process and analyze vast amounts of audio and video data raises questions about the balance between security and individual privacy. It is crucial to develop regulations and guidelines to ensure that DSP technologies are used responsibly and ethically. In conclusion, Digital Signal Processing has had a profound impact on various industries, enhancing the quality of signals and extracting valuable information. From technological advancements to emotional impacts, DSP has revolutionized fields like entertainment, telecommunications, medical imaging, and more. However, it is important to consider the ethical implications and ensurethat DSP technologies are used responsibly. As we continue to push the boundaries of DSP, we must strive to strike a balance between technological advancements and the well-being of individuals and society as a whole.。
Digital Signal Processing in Audio
Digital Signal Processing in Audio Digital Signal Processing (DSP) in audio is a crucial aspect of modern audio technology, playing a significant role in the creation, manipulation, and transmission of audio signals. DSP involves the use of algorithms to modify and enhance audio signals, allowing for a wide range of applications in audio production, music recording, telecommunications, and more. This technology has revolutionized the way we experience and interact with audio, enabling the development of advanced audio processing techniques that have greatly improved the quality and versatility of audio systems. One of the key areas where DSP has had a profound impact is in the field of audio production and music recording. DSP algorithms are used to clean up audio recordings, remove background noise, and enhance the overall sound quality of the recordings. This has allowed for the creation of high-fidelity audio recordings that accurately capture the nuances of live performances, providing listeners with an immersive and authentic listening experience. Additionally, DSP has enabled the development of audio effects such as reverb, delay, and equalization, which are essential tools for music producers and audio engineers in shaping the sound of a recording. In the realm of telecommunications, DSP plays a vital role in the transmission and reception of audio signals over various communication channels. DSP algorithms are used to compress audio data for efficient transmission over limited bandwidth channels, such as in the case of internet audio streaming or mobile phone calls. This compression allows for the real-time transmission of high-quality audio with minimal latency, ensuring clear and uninterrupted communication between users. Furthermore, DSP is also utilized in noise cancellation technologies, which help to eliminate background noise during phone calls, resulting in improved voice clarity and intelligibility. Moreover, DSP has significantly contributed to the development of audio processing hardware and software, leading to the creation of digital audio workstations (DAWs) and audio plugins that are widely used in the music and film industry. These tools leverage DSP algorithms to provide musicians, producers, and sound designers with a wide array of creative possibilities, allowing for the manipulation of audio signals in ways that were previously unattainable. From time-stretching and pitch-shifting to spectral processing andconvolution reverb, DSP has empowered artists to push the boundaries of sonic experimentation and innovation. Despite the numerous advancements facilitated by DSP in audio, there are also challenges and limitations associated with its implementation. One of the primary concerns is the potential loss of audio quality due to excessive digital processing. While DSP algorithms can enhance audio signals, improper or excessive use of these algorithms can introduce artifacts and distortion, ultimately degrading the quality of the audio. This is particularly relevant in the context of audio mastering, where the delicate balance between enhancing the audio and preserving its original character must be carefully maintained. Furthermore, the proliferation of DSP in audio technology has raised questions regarding the ethical use of audio processing tools. With the ability to manipulate audio signals in virtually limitless ways, there is a concern about the authenticity and integrity of audio content. The rise of auto-tune and vocal manipulation software, for instance, has sparked debates about the impact of DSP on the natural expression and performance of musicians. Additionally, the use of DSP for audio forensics and manipulation in the context of law enforcement and legal proceedings has raised ethical and privacy concerns, highlighting the need for responsible and transparent use of audio processing technologies. In conclusion, digital signal processing in audio has revolutionized the way we create, experience, and interact with audio content. From its pivotal role in audio production and telecommunications to its influence on music technology and creative expression, DSP has reshaped the landscape of audio engineering and opened up new possibilities for artistic innovation. However, as with any technology, the responsible and ethical use of DSP is paramount in ensuring that its potential benefits are maximized while mitigating its potential drawbacks. As DSP continues to evolve, it is essential to approach its application in audio with a thoughtful and discerning mindset, recognizing both its immense potential and the ethical considerations that accompany its use.。
数字信号和模拟信号的英文缩写
数字信号和模拟信号的英文缩写Digital Signal: Advantages and Applications1. Introduction:Digital signal refers to a signal that is represented by discrete and quantized values. In contrast, analog signal represents continuous variations in amplitude and time. The processing, transmission, and storage of digital signals are widespread in today's technology-driven world due to its numerous advantages over analog signals. This paper explores the advantages and applications of digital signals in various fields.2. Advantages of Digital Signals:2.1. Noise Immunity:Digital signals are less prone to noise interference compared to analog signals. Since digital signals are encoded with discrete values, it becomes easier to differentiate between the signal and noise. Additionally, error detection and correction techniques can be implemented, allowing for reliable transmission and reproduction.2.2. Scalability:Digital signals can be efficiently scaled up or down without significant loss of quality. This scalability enables flexible transmission across different systems and platforms, making digital signals suitable for various applications.2.3. Data Compression:Digital signals can be easily compressed using various algorithms. This compression reduces the data size, making the transmissionand storage of digital signals more efficient. Consequently, digital signal processing (DSP) techniques can be employed to extract and interpret the compressed information.2.4. Storage Efficiency:Digitizing signals allows for efficient storage. The encoded digital signals can be stored in a compact and reliable format, thereby occupying less physical space compared to analog signals. Additionally, digital signals can be encrypted and protected from unauthorized access.2.5. Signal Processing:Digital signals can be manipulated and processed using advanced techniques such as filtering, equalization, and modulation. These operations enable enhanced signal quality and enable the extraction of valuable information from the signal, leading to improved communication and analysis.3. Applications of Digital Signals:3.1. Telecommunications:Telecommunication networks largely rely on digital signals for transmitting voice, video, and data. The proliferation of digital communication technologies such as fiber optics, satellite systems, and wireless networks would not have been possible without the digitization of signals.3.2. Audio and Video Processing:The entertainment industry heavily relies on digital signals for audio and video processing. Digital audio signals, represented as discrete samples, allow for high-fidelity reproduction andmanipulation. Similarly, digital video signals enable high-definition displays, video streaming, and video editing.3.3. Biomedical Engineering:Digital signals play a critical role in biomedical engineering applications. Medical imaging techniques such as magnetic resonance imaging (MRI) and computed tomography (CT) scan rely on digitized signals to capture and analyze internal body structures. Moreover, digital biosensors and wearable devices facilitate real-time monitoring and analysis of physiological signals for health assessments.3.4. Industrial Automation:In industrial automation processes, digital signals are extensively used for control, monitoring, and data acquisition. Digital sensors, programmable logic controllers (PLCs), and industrial networks enable efficient and reliable control of complex systems. The digitization of signals in this domain simplifies integration, enhances precision, and improves productivity.3.5. Electronic Commerce and Financial Systems:Digital signals are integral to electronic commerce and financial systems. Secure and fast transmission of financial data is facilitated through digitization. High-frequency trading, online banking, and digital payment systems make use of digital signals to execute transactions efficiently and securely.3.6. Internet of Things (IoT):The Internet of Things (IoT) ecosystem relies on digital signals for connecting various devices and enabling machine-to-machinecommunication. The numerous sensors and actuators in IoT devices generate digital signals that are processed, analyzed, and transmitted for intelligent decision-making.4. Conclusion:Digital signals have revolutionized the way information is processed, transmitted, and stored across various domains. The distinct advantages of digital signals, including noise immunity, scalability, data compression, storage efficiency, and enhanced signal processing, have made them indispensable in modern technological applications. The continued advancement in digital signal processing techniques and the increasing integration of digital signals with emerging technologies will further broaden the range of applications and drive innovation in diverse fields.。
基于dSPACE的刚柔耦合多电机控制实验平台
ISSN 1002-4956 CN11-2034/T实验技术与管理Experimental Technology and Management第37卷第11期2020年11月Vol.37 No. 11Nov. 2020DOI: 10.16791/ki.sjg.2020.11.024基于d S P A C E的刚柔耦合多电机控制实验平台周林娜,王众,刘金浩,常俊林,杨春雨(中国矿业大学信息与控制工程学院,江苏徐州221008 )摘要:为了满足刚柔耦合多电机控制的教学和科研需要,设计了一种基于dSPACE的刚柔耦合多电机控制实验平台。
首先,综合考虑多电机之间刚性、柔性和刚柔耦合机械结构,设计了刚柔耦合多电机实验装置;然后,基于dSPACE硬件和软件设计了刚柔耦合多电机控制实验平台,使平台能够实时监测各种信号,在线 修改控制参数和更新控制算法;最后,通过实验表明该平台能够有效验证刚柔耦合多电机控制算法,为多电 机控制的科研和教学提供必要的验证条件。
关键词:d S P A C E;刚柔耦合;多电机系统;实验平台中图分类号:TP271+.4 文献标识码: B 文章编号:1002-4956(2020)11-0120-05Rigid-flexible coupling multi-motor control experimentplatform based on dSPACEZHOU Linna,WANG Zhong,LIU Jinhao,CHANG Junlin,YANG Chunyu(School of Information and Control Engineering, China University of Mining and Technology, Xuzhou 221008, China)Abstract:In order to meet the needs of scientific research and teaching of control methods for rigid-flexible coupling multi-motor, a dSPACE-based rigid-flexible coupling multi-motor control experiment platform is designed. Firstly, the rigid-flexible coupling multi-motor experiment device is designed, which contains the mechanical structure of rigid, flexible and rigid-flexible coupling connection. Secondly, the rigid-flexible coupling multi-motor control experiment platform is designed based on the dSPACE software and hardware, by which various signals can be monitored in real time, the controlling parameters can be modified online and the controlling algorithms can be changed. Finally, the experimental results show that the platform can effectively verify the rigid flexible coupling multi motor controlling algorithm and provide necessary verification conditions for the research and teaching of multi-motor control.Key words: dSPACE; rigid-flexible coupling; multi-motor system; experiment platfonn电机控制是控制科学与工程、电气工程等学科领 域的重要教学内容和科研对象〜4]。
A practical approach to digital signal processing
An important part of our teaching is a set of stand-alone DSP hardware, developed in house, which have
provided useful and inexpensive platforms for demonstrating simple DSP algorithms in real-time and to support f n l year degree project work. Case studies are used to explore .real world problems and the ia interactions between DSP and other technologies, such as artificial neural networks and satellite communications.
DSP i Plymonth n
DSP is a very wide subject and as such can only be taught selectively. In Plymouth, the bulk of DSP is taught in the f d year of our B.Eng degree programmes. On the B.Eng Electrical & Electronic Engineering programme, the DSP course involves an in-depth study of analogue Input/Output design techniques (including sampling, quantisation, anti-aliasindimaging filtering and o v e m p l i n g techniques), discrete transforms (especially the Discrete Fourier Transform and the Fast Fourier Transform) and digital filter design, plus a selection of special topics (e.g. adaptive filters, speech processing and multi-rate processing). All the topics are illustrated with application examples to which the student can easily relate, these include biomedical engineering, digital audio and communication engineering. Students on the Communication Engineering degree programme cover broadly similar topics, but there is more emphasis on computer simulation using SPW (Signal Processing Workstation). Assignments currently set on SPW include modulation schemes (e.g. BPSK and QPSK), channel filtering (the raised cosine filter and its effect on Inter Symbol Interference), Bit Error Rate measurements with additive noise, clock recovery and error control coding. In the near future, SPW will be covered in the second1 year, which is common to all engineering degree students within the School. A prerequisite for DSP in the final year, is a second year course which covers the basic concepts of signal processing and coding.
Crystal Instruments Spider-80SG 数据采集设备说明书
W W W.C R Y S TA L I N S T R U M E N T S.C O MGeneral Data Acquisition Device with Strain Gage MeasurementSpider Measurement SolutionSPIDER-80SGPAGE 1 | The Spider-80SG is a high precision, general purpose data acquisition device featuring strain gage functionality. This device can be used in a variety of physical and measurement tests. The Spider-80SG can acquire data from a strain gage or a wide range of measurement quantities. A va-riety of general purpose and strain gage based sensors are supported. The Spider-80SG is built on the proven outstanding performance and reli-ability of Crystal Instruments’ DSP-based hard-ware platform. It features the same form factor as other Spider-80X front-ends from Crystal In-struments and can be configured into one mea -surement system with excellent compatibility and scalability. This gives the Spider-80SG capabili-ties to reliably acquire data from multiple sensors and for multiple measurement quantities simulta-neously.The Spider-80SG front-end connects to the net-work switch of a PC using an Ethernet connec-tion. When used with a strain gage, it measures the strain based on arriving signals, measuring the changes in resistance when the strain gauge is stretched or compressed. It can also be used to measure Force, Torque, Pressure, Acceleration,Velocity and Displacement. The Spider-80SG can be configured to output an excitation voltage to power up the sensors and measure a range of measurement quantities.Pluggable front-ends provide the system with maximum flexibility of analog channel configura -tion, making it ideal for a range of measurement tests under various circumstances. The modular design allows configurations with 8 input chan -nels of isolated analog inputs and one analog output.With Crystal Instruments’ unique Ethernet based time synchronization technology, multiple Spider-80SG front-ends can be chained together to construct a system with higher number of input channels. High channel systems scale up to 512 channels.Each Spider-80SG front-end has its own mass storage media that houses the operating soft-ware and stores measurement data. This truly distributed system guarantees data recording at full speed without being subject to network speed limitations.Introducing the Spider-80SGSpider-80SG Modular Strain Gage Measurement System | PAGE 2Dual Modes of ExcitationThe Spider-80SG is equipped with dual excitation modes. There is an option for Precision Excita-tion Voltage of ± 2.5V or ± 5V that can be used to excite a strain gage or a strain gage based sen-sor and measure the minute change in resistance accurately. It is also equipped with a user con-figurable DC power supply of 2.5V, 5V and 10V which can be used as an excitation voltage for a wide variety of sensors.Remote SensingThe Spider-80SG has been tested to work on strain gages up to 1000 ft away from the ana-lyzer using the remote sensing feature. Using an 18AWG 5 conductor cable to measure the excita-tion voltage using remote sensing and changes in output voltage, the error was measured to be less than 1.5% for up to signal frequencies of 10 KHz. Use with Vibration ControllerThe Spider-80SG’s compatibility allows it to be chained together with Spider–80X front-end(s), extending the capabilities of the Spider-80SG to read and record general purpose measurements simultaneously while performing a vibration con-trol test.High Performance Hardware CapabilitySince all the processing and data recording is executed locally inside the Spider-80SG, the front-end can be located far from the host PC andcloser to the test article. This flexibility in loca -tion prevents the measurement results from be-ing affected by the network connection limitations and other environmental errors. This decentral-ized and distributed structure greatly reduces the noise and electrical interference in the system. One PC can monitor and control multiple Spider-80SG front-ends over the network. With wireless network routers, the PC can easily connect to the Spider-80SG remotely via Wi-Fi.Multiple Front-ends & Time Synchronization The Spider-80SG is built on IEEE 1588 time syn-chronization technology. The Spider-80SG front-ends on the same network can be synchronized with up to 50 ns accuracy, which guarantees ±1 degree cross channel phase match up to 20 kHz. With such unique technology and high-speed Ethernet data transfer capability, the distributed components on the network truly act as one inte-grated system.Black Box Mode: Run without PCThe Spider-80SG can operate in Black Box mode, which allows the measurements to take place without a PC. In this mode, a PC is used only to configure the Spider-80SG system before the system starts operating and to download data after the test is complete. During the test, the sys-tem can operate according to a preset schedule or is controlled from a variety of external devices, such as a tablet or iPad.Product Applications8 Strain Gage InputsOutput ChannelPowerPower Input EthernetReset Button Master/Slave SwitchData Port RS-485Digital I/OPAGE 3| | PAGE 4Measurement Channel Specifications■Input Channels: 8 channels per front-end, ex -pandable to 512 channels in a system ■Connector Type: 7-pin LEMO■Coupling: DC Differential, AC Differential■Excitation Voltage / Power Supply: 2.5V, 5V, 10V■AC Coupling Cutoff Freq. @ -3dB: 0.375Hz ■Input Type: Differential ■Input Impedance: 1M Ω ■A/D Resolution: 24 bit■Input Protection Voltage: +/-40Vpk ■Input Range: ±10mV, ±100mV, ±10V■Sampling Rate per Channel: 0.48 Hz to 102.4 kHz, with 54 stages■Maximum Useful Bandwidth: 46% of sampling rate■Crosstalk: less than -130 dB■Frequency Accuracy: better than 1/100,000 ■Amplitude Accuracy: 0.1% typical■Amplitude Accuracy (Extended Cable Length): Less than 1.5% (up to 10 KHz), cable length up to 1000 ft (18AWG)■Noise Floor: 0.5 μV/V (10mV Range) ■DC Drift: 1.5 μV/V in 48 Hours■Anti-Aliasing Filter: analog anti-aliasing filters ■Max Sampling rate: 102.4 kHz■Digital Filter: digital high-pass and low-pass filters■Total THD + Noise: -90dBfs (DC to 1 kHz) ■Amplitude Channel Match: 0.1dB■Phase Channel Match: better than 0.3 de -grees up to 20 kHz■Common Mode Range: 100% input range ■Common Mode Rejection: better than 85 dB ■Shunt Calibration: Internal 100K Ω (0.1%, 25 ppm/c)■Excitation Sense: local sensing and remote sensing Strain functions:■Quarter-120, Quarter-350 ■Half bridge ■Full bridgeBridge Completion:■120 Ω: 0.1%, 25 ppm/c■Back Half resistor: 120 Ω/120 Ω, 0.1% 25 ppm/c Excitation Voltage for Strain Gauge ■±2.5V, ±5V■Current: 30mA max/channelZero Suppression/Auto Balancing/Offset Nulling Power Supply (Excitation Voltage for other kind of sen-sors): 2.5V, 5V, 10 VOutput Channel Specifications■Channels: 1 output channel per front-end ■Configuration: Output for voltage calibration ■Connector Type: 2-pin LEMO ■D/A Resolution: 24 bit■Max Output Frequency: 46 kHz ■Dynamic Range: 100 dB ■Output Impedance: 50 Ω■Maximum Output Current: 25 mA■Sine Amplitude Accuracy: ±1% (0.34 dB) for 0.1 to 5 Vpk, at 1 kHz■Anti-Imaging Filtering: 160 dB/oct digital plus analog filters■Digital Filter: high-pass and low-pass digital filters■Source Waveforms: sine, triangle, square, white noise, DC, chirp, swept sine, arbitrary waveform■Arbitrary Waveform Size Limit: 16,000 points typical. Special configuration allows up to 128,000 points.■Output Range: ± 10 VoltsHardware SpecificationsIsolated Digital Input and Output■Connector: 25-pin female D-SUB■External Circuit Power Supply: 3.3 ‒ 12 VDC (±10%)■Internal Power: 12 VDC 400 mA■Maximum Allowable Distance of Signal Exten-sion: 50 metersInputs■Input Format: opto-isolated input (compatible with current-sink output)■Number of Channels: 4■Input Resistance: 6.1 kΩ■Input On Current: 2.0 mA or more■Input Off Current: 0.16 mA or less■Interrupt: 8 input signals are arranged into a single interrupt output signal. An interrupt is generated either at the rising edge (HIGH-to-LOW transition) or falling edge (LOW-to-HIGH transition).Outputs■Output Format: opto-isolated input (current sink output)■Number of Channels: 4■Output Rating: output voltage 12 VDC max, output current 100 mA per channel max■Residual Voltage with Output On: 1.0 V or less (Output current < 100 mA)■Pulse Width: 47 ms■Rise Time: 250 µs■Fall Time: 50 µsHigh Speed Data Port interfacing to Spider-NAS ■Connector Type: 5-pin LEMO■Maximum distance of cable: 2 meters■Data Transfer Speed: Higher than 819.2 K Sample/secondSystem Specifications■On-Board Memory: 4 GB non-volatile flash memory, 32 MB DRAM■Power Management: active and sleep mode■Ethernet: 100Base-T, RJ45 female connector supports connection to PC or network switch■Internal Clock: maintains date and time■System Disaster Recovery: dedicated reset pin. Watch-dog based recovery can be en-abled.■Cooling: no cooling fan requiredNetwork Protocols & IEEE 1588 Time Syn-chronizationMultiple Spider front-ends are synchronized through IEEE 1588 protocol. The synchroniza-tion accuracy is better than ±50 ns with a certi-fied network switch. The data acquired by all the measurement channels will be synchronized. The phase match between channels across dif-ferent Spider-Strain front-ends is within 1.0 de-gree at 20 kHz.■IPv4 Protocol Stack: ICMP, IP, UDP, TCP, IGMP■IPv4 Configuration: manual or via DHCP■IEEE 1588v2 Protocol: PTP Ordinary clock, with both E2E and P2P synchronization sup-ported and hardware level timestamp for PTP event messages(+)The Spider-80SG features an easy-to-useand flexible Shunt calibration wizard. Thiswill allow the user to select any availableleg of the strain gage bridge, dependingon the bridge type (i.e. quarter, half, fullbridge,) for shunt calibration.PAGE 5 | Power Specifications■Power Supply: external DC power■External DC Power: AC adaptor accepts 100 to 240 VAC (50/60 Hz), DC power 15 V (±10%)/3 A■Power Consumption: less than 15 wattsEnvironmental & General Specifications Enclosure: sealed metal box, electrical safety compliant, rugged metal design, shock proof with integrated protective holster and internal EMI shielding.■Size : 240 x 35 x 310 mm (w x h x l)■Weight: 1.87 kg■Electromagnetic Compatibility and Sensi-tivity: EN 61326:1997+A1:1998+A2:2001, EN61000-3-2: 2000, EN61000-3-3: 1995+A1:2001■Operating Temperature:-10 to +55 °C■Storage Temperature -20 to +70 °C■Shock: 50 g’s, 315 in/sec, tested at 6 sides, non-operational test■Vibration: 5 - 500 Hz, 0.3 gRMS, tested at 3 sides, operational test■Vibration: 5 - 500 Hz, 2.42 gRMS, tested at 3 sides, non-operational testCompatible Measurement Quantities & Sug-gested SensorsMultiple sensors of various measurement quan-tities are supported with the Spider-80SG. The following list gives an overview of measurement quantities with sample sensors that are support-ed. The actual list of compatible sensors contains much more than specified here.■Acceleration – Dytran 7603B, 7503, 7523A2,Endevco 7264C, Kistler Type 8395A, DTS 6DX PRO Series■Force – Omega LCM 901, Futek FFP350■Torque – Omega TQ-130 Series, Futek TDD400, Futek TRS300, Futek TAT200, TAT420■Pressure – Omega PX309 series, Measure-ment Spec EB100, Futek PMP927■Angular Velocity – DTS ARS Pro-300, ARS Pro-1500, ARS Pro-8K, ARS Pro-18k■Displacement – Omega E2E-3DC Series■Magnetic Field – Analog Devices AD22151■Sound Pressure – InvenSense ICS40618■Strain – Configurable as Quarter, Half or Full BridgeHardware/Software Compatibility Specifica-tionsThe Spider-80SG can be used with the following devices:1. Spider-80X2. Spider-813. Spider-NAS4. Spider-HUBModes of Operation:1. Standalone mode as a General Purpose Dataacquisition device2. In conjunction with Spider-80X for Generalpurpose Data Acquisition3. In conjunction with Spider-80X for generaldata acquisition during vibration control.For further software specifications related to the Spider-80SG, please refer to the EDM DSA or EDM VCS specification documents by Crystal Instruments.ε =∆LLPoisson Ratio ParameterThe Poisson ratio is also included as a measurement parameter in Spider-80SGsystem. The user will have the option of using a Poisson ratio value, or to not use it atall depending on the unit under test or test configurations. | PAGE 6CRYSTAL INSTRUMENTS2370 OWEN STREETSANTA CLARA, CA 95054 (USA)PHONE: +1-408-986-8880FAX: +1-408-834-7818EMAIL:**************To find a distributor near you, please visit our website:© 2016 Crystal Instruments Corporation. All Rights Reserved. 11/2016Notice: This document is for informational purposes only and does not set forth any warranty, expressed or implied, concerning any equipment, equipment feature, or service offered or to be offered by Crystal Instruments. Crystal Instruments reserves the right to make changes to this document at any time, without notice, and assumes no responsibility for its use. This informational document describes features that may not be currently available. Contact a Crystal Instruments sales representative for information on features and product availability.。
SRIO_Programming_Performance (1)
Application ReportLit. Number – October 2011 SRIO Programming andPerformance Data on Keystone DSP Zhan Xiang, Brighton Feng Communication InfrastructureABSTRACTSRIO (Serial RapidIO) on Keystone DSP is a very flexible and powerful; it provides many modes and options for customer to use it, the SRIO user’s guide describes a lot about these. Thisapplication note provides some complementary information about the programming of the SRIO.This application report also discusses the performance of SRIO, provides measuredperformance data achieved under various operating conditions. Some factors affectingSRIO performance are discussed.1Overwrite this text with the Lit. Number2SRIO Programming and Performance Data on Keystone DSPContents1Introduction (4)2SRIO configuration (4)2.11x/2x/4x configuration (4)2.2Device ID configuration (7)2.3LSU (Load Store Unit) setup (9)2.4Message and Packet DMA setup (12)2.5Interrupt setup (16)2.6Loopback (22)2.6.1Internal Digital loopback (22)2.6.2Internal SERDES loopback (23)2.6.3External line loopback (24)2.7Packet forwarding (25)2.8Rx Mode (27)3SRIO transfer programming (28)3.1LSU transfer (28)3.2Message transfer (32)44.1Match ACKID .4.2Soft reset .4.3Tricks/Tips4.3.14.3.255.15.25.35.4ReferencesFiguresFigure 1SRIO Port Mode Configuration (5)Figure 2Port number for different configurations (7)Figure 3LSU registers (9)Figure 4LSU interrupt setup (10)Figure 5SRIO message TX data path (12)Figure 6SRIO message RX data path (13)Figure 7SRIO interrupt control (16)Figure 8Digital loopback test (23)Figure 9SERDES loopback test (24)Figure 10External line loopback test (25)Figure 11External forwarding back test (25)Figure 12Check SRIO registers in CCS watch Window (40)Figure 13Throughput of different packet types (41)Figure 14Throughput of different link configuration (42)Figure 15Throughput of different destination. (43)Overwrite this text with the Lit. Number Figure 16Directory Structure of Example Codes (44)TablesTable 1.Shadow Registers Configuration (9)Table 2.SRIO Rx Mode (27)Table 3.SRIO Transfer overhead (40)SRIO Programming and Performance Data on Keystone DSP3Overwrite this text with the Lit. Number4SRIO Programming and Performance Data on Keystone DSP1IntroductionRapidIO is a non-proprietary, high-bandwidth, system-le vel interconnect. It’s a packet-switched interconnect intended primarily as an intra-system interface for chip-to-chip andboard-to-board communications at gigabyte-per-second performance levels. The RapidIOperipheral used in KeyStone devices is called Serial RapidIO (SRIO).SRIO (Serial RapidIO) on Keystone DSP is a very flexible and powerful; it provides many modes and options for customer to use it, the SRIO user’s guide describes a lot about these. Thisapplication note provides some complementary information about the programming of the SRIO.Example code/project is provided along with this application note. The example code aboutprogramming of the SRIO is based on register layer CSL (Chip Support Layer). Most code use the SRIO register pointer defined as below:#include <ti/csl/cslr_srio.h>#include <ti/csl/cslr_device.h>CSL_SrioRegs * srioRegs = (CSL_SrioRegs *)CSL_SRIO_CONFIG_REGS;This application report also discusses the performance of SRIO, provides measuredperformance data on EVM. Some factors22.1Overwrite this text with the Lit. NumberSRIO Programming and Performance Data on Keystone DSP5Overwrite this text with the Lit. Number6SRIO Programming and Performance Data on Keystone DSP(4<<CSL_SRIO_RIO_PLM_SP_PATH_CTL_PATH_CONFIGURATION_SHIFT)| (3<<CSL_SRIO_RIO_PLM_SP_PATH_CTL_PATH_MODE_SHIFT),SRIO_PATH_CTL_4xLaneABCD =(4<<CSL_SRIO_RIO_PLM_SP_PATH_CTL_PATH_CONFIGURATION_SHIFT)| (4<<CSL_SRIO_RIO_PLM_SP_PATH_CTL_PATH_MODE_SHIFT)}SRIO_1x2x4x_Path_Control;/*configure SRIO 1x 2x or 4x path mode*/void Keystone_SRIO_set_1x2x4x_Path(SRIO_1x2x4x_Path_Control srio_1x2x4x_path_control){/*This register is a global register, even though it can be accessedfrom any port. So you do not need to program from each port, it isbasically a single register. */srioRegs->RIO_PLM[0].RIO_PLM_SP_PATH_CTL=(srioRegs->RIO_PLM[0].RIO_PLM_SP_PATH_CTL&(~SRIO_1x2x4x_PATH_CONTROL_MASK))| srio_1x2x4x_path_control;}……Keystone_SRIO_set_1x2x4x_Path(SRIO_PATH_CTL_1xLaneA);Overwrite this text with the Lit. NumberSRIO Programming and Performance Data on Keystone DSP 72.2 KeyStone family SRIO support 16 local device ID and 8 multicast device ID. For the local device ID configuration, we should use the TLM Port Base Routing Register (n) Control Registers and TLM Port Base Routing Register (n) Pattern & Match Registers.The TLM Port Base Routing Register (n) Pattern & Match Registers hold the 15 allowable DestIDs, the first register set is not used; the first DestID is hold in the BASE_ID CSR instead. Below is the example code to configure the device IDs.typedef struct {/*PATTERN provides the 16 bits compared one-for-one against the inbound destID.*/ Uint16 idPattern;/*MATCH indicates which of the 16 bits of the destID is compared against PATTERN.*/ Uint16 idMatchMask;/*maintenance request/reserved packets with destIDs which match this BRR are routed to the LLM*/Uint8 routeMaintenance;} SRIO_Device_ID_Routing_Config;/*configure SRIO device ID*/void Keystone_SRIO_set_device_ID( SRIO_Device_ID_Routing_Config * device_id_routing_config,Overwrite this text with the Lit. NumberThe four TLM Port Base Routing Register sets belong to four port data paths, so corresponding BLK5~BLK8 must be enabled for the register sets. If only part of port data path blocks is enabled, then, fewer dest ID can be supported. For example, if only BLK5 (port 0 data path) is enabled, then, only 4 dest ID can be supported. Another example, if you use configuration 0, mode 1 (1x mode), normally, you only need enable BLK5, but if you want to support more than 4 IDs, youmust enable BLK6~BLK8.The IDs configured in the register set for one port data path, and it can be used for other ports if the PRIVATE bits = 0.8SRIO Programming and Performance Data on Keystone DSPOverwrite this text with the Lit. Number The PATTERN and MATCH field are 16 bits. In systems that use exclusively 8-bit DeviceIDs,the upper eight bits may be removed from the comparison by appropriately setting the MATCH field. In systems which use a mixture of 8-bit and 16-bit DeviceIDs, the full 16 bits may be used for comparison, in this case, received 8-bit destIDs are prepended with eight bits of zeros byhardware for comparison purposes.2.3LSU (Load Store Unit) setupIn the KeyStone family SRIO, Direct IO, doorbell and maintenance transfers are implemented in LSU module. There are 8 LSU. Each LSU registers set represents one transfer request, tosupport multiple pending DirectIO transfer requests, there are two groups of shadow LSUregisters, each group have 16 shadow registers sets, group 0 is shared by LSU0~LSU3, group 1 is shared by LSU4~LSU7.Figure 3LSU registersThe LSU_SETUP_REG0 is used to setup number of shadow registers for each LSU. Following table shows the shadow registers configuration.Table 1.Shadow Registers ConfigurationSRIO Programming and Performance Data on Keystone DSP9Overwrite this text with the Lit. NumberIf the LSU_EDMA bit in LSU_SETUP_REG1 is clear to 0, the Source ID map index of thetransfer is used to select a flag bit in LSU interrupt status register 0 (LSU0_ICSR). The source ID index is the index of the 16 device ID in TLM Port Base Routing Register (n) Pattern & Match Registers. For example, if the transfer uses the device ID 1 as source ID, then bit 1 of the LSU interrupt status register 0 (LSU0_ICSR) will be set when the transfer complete.If the LSU_EDMA bit in LSU_SETUP_REG1 is set to 1, the LSU number of the transfer is used to select a flag bit in LSU interrupt status register 1. For example, if LSU number is 2, then bit 2 of the LSU interrupt status register 1 (LSU1_ICSR) is set.Please note, the LSU_SETUP_REG0 and LSU_SETUP_REG1 are only programmable when the LSU is disabled while the peripheral is enabled. If the SRIO initialize code disable the SRIO first, these register also can’t be written correctly, t he following code shows the procedure. typedef enum{SRIO_LSU_SHADOW_REGS_SETUP_4_4_4_4,SRIO_LSU_SHADOW_REGS_SETUP_5_5_5_1,10SRIO Programming and Performance Data on Keystone DSP{cfgValue |= srio_cfg->lsu_cfg->lsuIntSetup[i] << i;}srioRegs->RIO_LSU_SETUP_REG1 = cfgValue;}/*enable other optional blocks*/Keystone_SRIO_enable_blocks(&srio_cfg->blockEn);2.4Message and Packet DMA setupIn KeyStone family SRIO, the Type 11 (Message) and Type 9(Data Streaming) uses Packet DMA to transmit and receive data inside the DSP.There are 16 dedicated queues for SRIO message TX, the queue number is from 672 to 687.Following figure shows the SRIO type 9 and type 11 packet RX data path.Figure 6SRIO message RX data pathThere are 20 Rx flows. The flows configuration is out of the range of this application note. Please refer to KeyStone Architecture Multicore Navigator User Guide (SPRUGR9) for details. The key configuration in SRIO is to map Rx message to a flow according to SrcId, DstId, Mailbox, Letter, StreamId, COS …The Type 11 use RIO_RXU_MAP_L and RIO_RXU_MAP_H to configure the mapping according to mailbox, letter and device ID…; the Type 9 use RIO_RXU_TYPE9_MAP0,RIO_RXU_TYPE9_MAP1 and RIO_RXU_TYPE9_MAP2 to configure the mapping according to the COS, stream ID and device ID…. The Type 11 and Type 9 share the sameRIO_RXU_MAP_QID for RX flow and destination queue selection. Please note, when the destination queue is set as 0x1FFF here, the RX destination queue will be determined by theIf error happens during message packet transfer, Packet DMA will discard the packet and send the packet to a garbage queue according to the error type. RIO_GARBAGE_COLL_QID0,RIO_GARBAGE_COLL_QID1 and RIO_GARBAGE_COLL_QID2 registers are used to configure the garbage queue. Below is the example code.2.5Interrupt setupThe SRIO generates 112 interrupt events; these events are mapped to 24 interrupt outputs which can be routed to DSP core or DMA.DBLL_ROUTE in INTERRUPT_CTL registerFigure 7SRIO interrupt controlAll the 112 interrupts can be mapped to INTDST0~15. The 64 doorbell events can be mapped to INTDST0~15 or INTDST16~23 depending on the INTERRUPT_CTL register, ifINTERRUPT_CTL= 0, the Doorbell events are map to INTDST16~23; if INTERRUPT_CTL= 1, the Doorbell events are map to INTDST16~23.Please note, interrupt pacing is enabled by default. Interrupt pacing requires DSP core rewrite INTDSTn_RATE_CNT register after each interrupt service to enable the next interrupt, otherwise, the interrupt will not be trigger again regardless of the internal interrupt status changes. This is the common reason user only sees one SRIO interrupt. If interrupt pacing is not desired for a particular INTDST, it can be disabled using INTDST_RATE_DIS register.All message related interrupt or events are handled by Packet DMA and QMSS (Queue Manager Subsystem), Please refer to KeyStone Architecture Multicore Navigator User Guide (SPRUGR9) for details.2.6.1Internal Digital loopbackIn internal digital loopback mode, the TX data is loopback in digital domain.2.6.2If external line loopback is enabled, data received on RX “line” will be directly send back to TX “line”.Following figure show an external line loopback test. In this test, DSP 1 is configured in line loopback mode to support DSP 0 test the external “line” between two DSPs. In this mode, DSP 1 can not send or receive data.Figure 10 External line loopback test2.7 Following figure show an external forwarding back test. In this mode, DSP 1 can send or receive its own data when some packets are forwarding out.Figure 11 External forwarding back testThe KeyStone family SRIO forwarding function is handled by the MAU (Memory Access Unit) module, it only supports the NREAD, NWRITE, NWRITE_R, SWRITE and Doorbell. All other types are not supported and may cause undefined behavior, include the generation of an ERROR response.The PF_16b_CNTL[0:7] and PF_8b_CNTL[0:7] control the packet forwarding device ID boundary and output port selection. When the inbound Device ID matches the packet forward entry setup, the packet will be forwarded to the MAU and do further processing.{DSP0_SRIO_BASE_ID+0, DSP0_SRIO_BASE_ID+1, DSP0_SRIO_BASE_ID+0, DSP0_SRIO_BASE_ID+1, 2}, {DSP0_SRIO_BASE_ID+2, DSP0_SRIO_BASE_ID+2, DSP0_SRIO_BASE_ID+2, DSP0_SRIO_BASE_ID+2, 2}, {DSP0_SRIO_BASE_ID+3, DSP0_SRIO_BASE_ID+3, DSP0_SRIO_BASE_ID+3, DSP0_SRIO_BASE_ID+3, 3}, {DSP0_SRIO_BASE_ID+4, DSP0_SRIO_BASE_ID+7, DSP0_SRIO_BASE_ID+4, DSP0_SRIO_BASE_ID+7, 3} };……Keystone_SRIO_packet_forwarding_Cfg(&DSP1_PktForwarding_Cfg,sizeof(DSP1_PktForwarding_Cfg)/sizeof(SRIO_PktForwarding_Cfg));2.8Rx ModeHow the SRIO handle Rx packets are controlled by three configuration bit.Table 2.SRIO Rx Modeprogramming the registers. Below is example code to programming the LSU./** @brief SRIO LSU Transfer* This structure is used to configure LSU module for Transfer*/typedef struct SRIO_LSU_Transfer{Uint32 rioAddressMSB;Uint32 rioAddressLSB_ConfigOffset;Uint32 localDspAddress;Uint32 bytecount;SRIO_Packet_Type packetType;Uint16 dstID;Uint16 doorbellInfo;Bool waitLsuReady; /*if BUSY or FULL, should we wait for them?*/ Uint8 lsuNum; /*the LSU used for this transfer*/Uint8 doorbellValid;Uint8 intrRequest;completion code is valid. Below is the example code for LSU completion checking./* LSU states are in 6 LSU state registers as below:--------------------------------------------------------------------------------------------------------------|31 28| 24| 20| 16| 12| 8| 4| 0| ---------------|----------|-----------|-----------|-----------|-----------|-----------|-----------|-----------| LSU_STAT_REG0 |Lsu0_Stat7| Lsu0_Stat6| Lsu0_Stat5| Lsu0_Stat4| Lsu0_Stat3| Lsu0_Stat2| Lsu0_Stat1| Lsu0_Stat0| LSU_STAT_REG1 |Lsu2_Stat0| Lsu1_Stat5| Lsu1_Stat4| Lsu1_Stat3| Lsu1_Stat2| Lsu1_Stat1| Lsu1_Stat0| Lsu0_Stat8| LSU_STAT_REG2 |Lsu3_Stat3| Lsu3_Stat2| Lsu3_Stat1| Lsu3_Stat0| Lsu2_Stat4| Lsu2_Stat3| Lsu2_Stat2| Lsu2_Stat1| LSU_STAT_REG3 |Lsu4_Stat7| Lsu4_Stat6| Lsu4_Stat5| Lsu4_Stat4| Lsu4_Stat3| Lsu4_Stat2| Lsu4_Stat1| Lsu4_Stat0| LSU_STAT_REG4 |Lsu6_Stat0| Lsu5_Stat5| Lsu5_Stat4| Lsu5_Stat3| Lsu5_Stat2| Lsu5_Stat1| Lsu5_Stat0| Lsu4_Stat8| LSU_STAT_REG5 |Lsu7_Stat3| Lsu7_Stat2| Lsu7_Stat1| Lsu7_Stat0| Lsu6_Stat4| Lsu6_Stat3| Lsu6_Stat2| Lsu6_Stat1| ---------------------------------------------------------------------------------------------------------------below is a table to indicate the index of state for a transaction of a LSUin the LSU state registers*/Uint8 LSU_state_index_table[SRIO_MAX_LSU_NUM][SRIO_LSU0_4_MAX_SHADOW_REG_SET]= {/*LSU0*/ {0, 1, 2, 3, 4, 5, 6, 7, 8},/*LSU1*/ {9, 10, 11, 12, 13, 14},/*LSU2*/ {15, 16, 17, 18, 19},/*LSU3*/ {20, 21, 22, 23},/*LSU4*/ {24, 25, 26, 27, 28, 29, 30, 31, 32},lsuTransfer.outPortID = uiPort;lsuTransfer.idSize = 0;lsuTransfer.srcIDMap = 0;lsuTransfer.hopCount = 0;Keystone_SRIO_LSU_transfer(&lsuTransfer);return Keystone_SRIO_wait_LSU_completion(uiLSU_No,lsuTransfer.transactionID, lsuTransfer.contextBit);}3.2Message transferThe KeyStone family SRIO Type 11 and Type 9 packets are handled by QMSS and PacketDMA. Please refer to KeyStone Architecture Multicore Navigator User Guide (SPRUGR9) for details.For data receive, if the message Rx map and Rx flow setup properly, once the data is received,Uint32 MailBox : 6; //Destination MailboxUint32 LTR : 3; //Destination LetterUint32 TT : 2; //RapidIO tt field, 8 or 16bit DeviceIDsUint32 reserved1 : 6;Uint32 SSIZE : 4; //standard message payload size.Uint32 Retry_Count : 6; //Message Retry CountUint32 reserved0 : 5;} SRIO_Type11_Message_TX_Descriptor;#endifAnother point we need pay attention to is, for data transmit, the Packet_Type field of host packet descriptor must be set correctly, it is used to identify the SRIO transaction type, thePacket_Type should be set as 30 for the Type 9; if the Packet_Type is 31, the Type 11 isselected. The application only need to pop a descriptor from the FDQ and fill the PS filed in the descriptor, and then push the descriptor to the related TX queue.hostDescriptor->packet_length= uiByteCount;hostDescriptor->buffer_len= uiByteCount;hostDescriptor->psv_word_count= 2; //SRIO uses 2 Protocol Specific wordstype9MsgTxDesc= (SRIO_Type9_Message_TX_Descriptor *)(((Uint32)hostDescriptor)+32);type9MsgTxDesc->Dest_ID = uiDestID;type9MsgTxDesc->SRC_ID = uiSrcID;type9MsgTxDesc->StreamID = uiStreamID;type9MsgTxDesc->TT = 0;type9MsgTxDesc->COS = uiCOS;}Please note, the Type 9 packet can support up to 64K bytes payload, and the Type 11 only supports up to 4K bytes payload.4Other SRIO programming considerations4.1Match ACKIDwill be accepted.and then rerun DSP0…Below is the procedure to match ACKID:1.Write 4 to the register RIO_SP_LM_REQ to send a "restart-from-error" command, requestthe inbound ACK_ID of the other side;2.Check the RIO_SP_LM_RESP, polling the response valid bit till the response has beenreceived correctly, extract the inbound ACK_ID of the other side;3.Set the local OUTBOUND_ACKID to be same as the ACKID get in above steps;4.Set the remote outbound ACK_ID with maintenance packet to the RIO_ACKID_STATUSregisters of the remote side;5.Read back remote outbound ACK_ID through maintenance packet to verify it match localinbound ACKIDBelow is the example code for ACKID matching./* Make the ACK_ID of both sides match */4.2Soft resetThe KeyStone SRIO can be reset by the software, the application can implement the software reset with the following steps:1.Set Teardown bit in RX/TX channel global configure registers.2.Flush all LSU transfer, and waiting for completion.3.Disable the PEREN bit of RIO_PCR register to stop all new logical layer transactions4.Disable all the SRIO block with BLK_EN and GBL_EN;5.Disable Serdes by writing 0 to the SRIO SERDES configuration registers;6.Disable the SRIO through the PSC module;Keystone_disable_PSC_Power_Domain(CSL_PSC_PD_SRIO);}When the above procedure is finished, the SRIO can be enabled and initialized again. To rerun the SRIO program without reset the board, we normally call above function as the first step of SRIO initialization, below is the example:void Keystone_SRIO_Init(SRIO_Config * srio_cfg){if(srioRegs->RIO_PCR&CSL_SRIO_RIO_PCR_PEREN_MASK)Keystone_SRIO_soft_reset(); //soft reset SRIO if it is already enabled//enable SRIO power and clock domainKeystone_enable_PSC_module(CSL_PSC_PD_SRIO, CSL_PSC_LPSC_SRIO);……4.3Tricks/Tips4.3.1their own application, the lower the buffer number, the higher throughput. Below is examplecode to configure it./*Allocates ingress Data Nodes and Tags based on priority.These registers must only be changed while boot_complete isdeasserted or while the port is held in reset.*/for(i=0;i<SRIO_MAX_PORT_NUM;i++){if(FALSE == srio_cfg->blockEn.bBLK5_8_Port_Datapath_EN[i])continue;/*maximum data nodes and tags are 72 (0x48).Each data node stores 32 bytes of data*/srioRegs->RIO_PBM[i].RIO_PBM_SP_IG_WATERMARK0 =(36<<CSL_SRIO_RIO_PBM_SP_IG_WATERMARK0_PRIO0_WM_SHIFT)|(32<<CSL_SRIO_RIO_PBM_SP_IG_WATERMARK0_PRIO0CRF_WM_SHIFT);srioRegs->RIO_PBM[i].RIO_PBM_SP_IG_WATERMARK1 =(28<<CSL_SRIO_RIO_PBM_SP_IG_WATERMARK1_PRIO1_WM_SHIFT)|(24<<CSL_SRIO_RIO_PBM_SP_IG_WATERMARK1_PRIO1CRF_WM_SHIFT);srioRegs->RIO_PBM[i].RIO_PBM_SP_IG_WATERMARK2 =(20<<CSL_SRIO_RIO_PBM_SP_IG_WATERMARK2_PRIO2_WM_SHIFT)|(16<<CSL_SRIO_RIO_PBM_SP_IG_WATERMARK2_PRIO2CRF_WM_SHIFT);srioRegs->RIO_PBM[i].RIO_PBM_SP_IG_WATERMARK3 =(12<<CSL_SRIO_RIO_PBM_SP_IG_WATERMARK3_PRIO3_WM_SHIFT)|8<<CSL_SRIO_RIO_PBM_SP_IG_WATERMARK3_PRIO3CRF_WM_SHIFT);}4.3.2Check SRIO registersWhen we debug SRIO program, we often need check the SRIO register values, the best way to check it in CCS is to watch it through the SRIO register pointer in the watch window, theregisters can be show in a struct tree as below. Please note, if the programmer want to watch the registers in the watch window, the compiler option –g must be selected, otherwise theregisters can’t be shown in the watch window.Figure 1255.1SRIO transfer OverheadIn this application report, transfer overhead is defined as the time to transfer minimum dataelement (1 double-word), it is measured with Serdes loopback test.Following table shows the average measured overhead for different cases.Table 3.SRIO Transfer overheadTransfer overhead is a big concern for short transfers. Single-element transfer performance is overhead-dominated.5.2Throughput of different typesTest Condition: The SERDES loopback is used to test the throughput, and the port is 4X mode, each lane is 5Gbps;Figure 13Throughput of different packet typesAccording to the above test result, we can find if we want to get the highest throughput, theSWRITE should be used. Please note, packet size of SWRITE must be multiple of 8 bytes.For message type, the Type 9 throughput is higher than the Type 11, and the packet size of type9 is up to 64K bytes, which is useful for the large data transaction.5.3Throughput of different link configuration5.4Effect of different memory buffer on SRIO throughputAppendix A.Example Project IntroductionThe example project for this application note is built with CCS4.2.2, it consists of twosource code folders as following figure shows.The files in common folder are the common configuration files which are used to configurethe peripherals in the KeyStone devices. It includes the DDR3 configuration functions,Navigator configuration and driver functions, Serdes configuration functions and SRIOconfiguration and driver functions.Figure 16Directory Structure of Example CodesThe files in SRIO/src folder are code for different test case, for example, internal loopback test, external loopback, DSP to DSP test, interrupt test. Packet DMA and QMSS configurations are in the SRIO_PktDMA_Init.c. SRIO_debug.c includes some functions to check and print status registers for debug purpose.The test mode is chosen by following code in “SRIO_Test.c”.SRIO_Loopback_Mode loopback_mode= SRIO_DIGITAL_LOOPBACK;The loopback mode is defined as below:typedef enum{SRIO_NO_LOOPBACK = 0,SRIO_DIGITAL_LOOPBACK,SRIO_SERDES_LOOPBACK,SRIO_EXTERNAL_LINE_LOOPBACK,SRIO_EXTERNAL_FORWARD_BACK}SRIO_Loopback_Mode;SRIO_NO_LOOPBACK actually selects the test between two DSPs.For each test mode, the program iterates many transfers with different configurations. In thesource code for each test mode, you may change these test configurations.Below array setup all link speeds be tested.float internal_speed[]= {5, 3.125, 2.5, 1.25};Endian mode of this project can also be changed in build properties of CCS.To rebuild the project after configuration change, you may need change the including path of CSL header files. Only register layer CSL header files are used by this project, PDK is not used by this project. The including path can be changed in compiler include options dialog or be changed through CSL_INSTALL_PATH in the macros.ini file under the SRIO folder.The project can be run on C6678 EVM or C6670 EVM, the code automatically indentify theboard, so user do not need modify code between these two boards. Since C6678 EVM only has one DSP, so only the digital loopback and Serdes loopback tests can be run.To run digital loopback and Serdes loopback, just load the program to one DSP and run it.On C6670 EVM, lane 2 and 3 are connected between two DSPs, so external loopback ortransfer between two DSPs can be run on them. The software detects the DSP numberautomatically, so same program is run on the two DSP for different purpose. The first DSP ismaster for the tests, and the second DSP is slave for the tests, the second DSP should be run firstly and then the first DSP.After run the program you should see output in CCS like below.SRIO_DIGITAL_LOOPBACK test start............................................Initialize main PLL = x236/29Initialize DDR PLL = x20/1configure DDR at 666 MHzSRIO link speed is 5.000GbpsSRIO path configuration 1xLaneASWRITE from 0x10802200 to 0x1080a200, 8 bytes, 635 cycles, 100 Mbps, completion code = 0 SWRITE from 0x10802200 to 0x1080a200, 16 bytes, 794 cycles, 161 Mbps, completion code = 0 SWRITE from 0x10802200 to 0x1080a200, 32 bytes, 792 cycles, 323 Mbps, completion code = 0 SWRITE from 0x10802200 to 0x1080a200, 64 bytes, 931 cycles, 549 Mbps, completion code = 0 SWRITE from 0x10802200 to 0x1080a200, 128 bytes, 1164 cycles, 879 Mbps, completion code = 0 SWRITE from 0x10802200 to 0x1080a200, 256 bytes, 1568 cycles, 1306 Mbps, completion code = 0 SWRITE from 0x10802200 to 0x1080a200, 512 bytes, 2075 cycles, 1973 Mbps, completion code = 0 SWRITE from 0x10802200 to 0x1080a200, 1024 bytes, 3235 cycles, 2532 Mbps, completion code = 0 SWRITE from 0x10802200 to 0x1080a200, 2048 bytes, 5426 cycles, 3019 Mbps, completion code = 0 SWRITE from 0x10802200 to 0x1080a200, 4096 bytes, 9939 cycles, 3296 Mbps, completion code = 0 SWRITE from 0x10802200 to 0x1080a200, 8192 bytes, 18829 cycles, 3480 Mbps, completion code = 0 SWRITE from 0x10802200 to 0x1080a200, 16384 bytes, 36739 cycles, 3567 Mbps, completion code = 0 SWRITE from 0x10802200 to 0x1080a200, 32768 bytes, 72312 cycles, 3625 Mbps, completion code = 0 SWRITE from 0x10802200 to 0x c00a000, 8 bytes, 649 cycles, 98 Mbps, completion code = 0 References1.2.3.4.5.6.。
腊肠加勒克智能音频平台开发套件说明书
The Qualcomm Smart Audio PlatformDevelopment Kit is designed to include the building blocks for creating a smart speaker, making it simpler for audio manufacturers to start developing straight out of the box. By helping to reduce the development time, effort and costs associated with designing and customizing smart speaker products, the Qualcomm Smart Audio Platform Development Kit can help audio manufacturers to create differentiated smart speaker products, and capitalize on growing smart speaker opportunities across a range of price points.Based on our highly-flexible Qualcomm Smart Audio Platform, the development kit is designed to bring together a powerful combination of our processing, connectivity, voice user interface and premium audio technologies in a unique end-to-end example design for smart speakers.Developers have the flexibility to choose one of two operating systems: either Linux, along with support for Amazon Alexa Voice Service (AVS), Qualcomm ® aptX™ audio, and our multi-room networked audio technology; or Android Things™, which includes support for the Google Assistant with Cast built-in.Additional extensions are available thatbring support for our advanced audio codecs and speaker amplifiers, such as Qualcomm ® DDFA™ amplifier chipsets with premium Class D digital amplifier technology.Qualcomm Smart Audio Platform, Qualcomm aptX, Qualcomm DDFA and APQ8009 are products of QualcommT echnologies, Inc. and/or its subsidiaries.This material is subject to change without notice.87-CF483-1 Rev. BA comprehensive, customizabledevelopment kit and example design that helps to streamline the process of developing smart speakers.Kit ContentsT wo variants of the Qualcomm Smart Audio Platform Development Kit are available:without AcousticsDB- SMART-AUDIO-APQ8009-0-A• APQ8009 SoM • Carrier board • Power supply • Power cable • Antennas• Quick Start Guide and User Guidewith AcousticsDK- SMART-AUDIO-APQ8009-0-A• APQ8009 SoM (System-on-Module)• Carrier board• Six microphone array board • Microphone array module • Speaker casing and dual-drivers • Power supply• Cables: power cable, carrier board to speaker cable • Antennas• Quick Start Guide and User Guide • Design files and schematicsSoM and Carrier Boardzz Wi-Fi certified SoM featuring theAPQ8009 processor and containing key system componentszz Best in class connectivity with 2x2 MIMO 802.11ac, Bluetooth ® 4.2 with profiles such as A2DP (SBC, AAC, MP3, aptX), HFP and AVRCPzz High-quality Bluetooth/Wi-Fi coexistence through separate Bluetooth and Wi-Fi signal pathszz Reference speaker casing with bi-amped, two-way speakerszz Six-microphone array board designed to meet far-field voice user interface performance qualityzz Multi-microphone far-field voice with keyword detection, noise suppression,beamforming, and stereo echo cancellation technologyzz Premium audio, high resolution 24-bit audio and multi-room networked audio z z Support for leading voice assistantszz Compatible with our DDFA Class D digital amplifier which supports a superiorlistening experiencez z Qualcomm ® Hexagon ™ SDK whichincludes a rich set of tools which supportcustomization of the Hexagon DSP software and help to reduce developmenttime and effortFeaturesQualcomm Hexagon, Qualcomm Adreno, QCA9379, WCD9326, WGR7640 and PM8916 are products of Qualcomm T echnologies, Inc. and/or its subsidiaries.SoM SpecificationsDimensions 46.5 x 50mm Pro c essor APQ8009 **********************************Hexagon V56 DSP Qualcomm ® Adreno™ 304 GPU Connectivity QCA9379 2x2 11ac MIMO + Bluetooth/Bluetooth Low Energy v4.2with integrated RF front endMemory/Storage 1GB LPDDR3 RAM/ 4GB eMMC Flash PMIC PM8916 GPS WGR7640Audio Codec WCD9326Interfaces UART, USB 2.0, I 2C, TDM mode capable I 2S,SPI, GPIOs, Aux input and Line outOperating SystemsLinux Embedded, Android Things©2018 Qualcomm T echnologies, Inc. All Rights Reserved. Qualcomm, Hexagon and Adreno are trademarks of Qualcomm Incorporated, registered in the United States and other countries. aptX and DDFA are trademarks of Qualcomm T echnologies International, Ltd., registered in the United States and other countries. The Bluetooth ® word mark and logos are registered trademarks owned by the Bluetooth SIG, Inc. and any use of such marks by Qualcomm T echnologies International, Ltd. is under license. Android Things is a trademark of Google Inc. Other products and brand names may be trademarks or registered trademarks of their respective owners. 0618AA rich set of tools is available to help customize the Hexagon DSP software and support reduced development effort.Visit Qualcomm ® Developer Network to download the dedicated Hexagon DSP SDK.https:///software/hexagon-dsp-sdkSoftware Development KitSpeaker Casingy 360 degree audio y Bi-amped, 2-way speakers y Detachable Mic Array Module y Includes both TDM and PDM microphonesy Buttons: Power/Vol+/Vol-/Activate/Mute y RGB LEDs with LED controller y Dedicated Mute LED indication(Included in Qualcomm Smart Audio Platform Development Kit with Acoustics)ProductPart NumberQualcomm Smart Audio Platform Dev Kit with acousticsDK- SMART-AUDIO-APQ8009-0-A Qualcomm Smart Audio Platform Dev Kit (without acoustics)DB- SMART-AUDIO-APQ8009-0-AOrdering Information。
华为AR100和AR120系列企业路由器数据手册说明书
DatasheetProduct OverviewThe AR100 and AR120 series are fixed interface routers that provide a comprehensive platform for a variety of network topologies, including IMS, NGN, WAN and PSTN. The AR100 and AR120 also employ embedded hardware encryption for security as well as a voice Digital Signal Processor (DSP) for voice services.The AR100 and AR120 series are mature, stable and quiet routers that offer high performance functionality for small networks, enabling small businesses to greatly increase productivity at a lower cost.AR100s and AR120s are easy to deploy, configure and customize, greatly reducing cost of deployment and maintenance, while offering maximum value to customers. These models allow network administrators to expand their networks easily and quickly, saving time and costs. The routers support firewalls, call processing, and application program functionalities.The AR100 and AR120 series includes the following models:●AR109, AR109W, AR109GW-L●AR129CVW, AR129CGVW-L, AR129CVThe specifications for these models are shown in the following table.Table1: AR100 ModelsAR109AR109WAR109GW-LTable2: AR120 ModelsAR129CVAR129CVWAR129CGVW-LProduct Features and BenefitsSmall Size and High Performance●More applications: Huawei series routers use the dual-core processor that isolates the control plane from the forwarding plane and processes more enterprise applications. Huawei series routers improve user experience for multimedia service when streams overlap.●Higher performance: The AR100s and AR120s can process various enterprise applications, and its service processing capability is four times that in the industry.●Greater potential: Huawei series routers provide the capability to migrate services to the 3G and LTE networks.Low Investment with High Returns●Easy to construct: The AR100s and AR120s supports plug-and-play, intelligent configuration, and deployment using the USB flash drive. It can function immediately after being installed. Users do not need to configure an IP address manually. The PPP and VPN indicators show the status of corresponding services. The AR100s and AR120s helps to quickly construct an enterprise IT network.●Simplified solution: Huawei provides an all-around solution that integrates the routing, switching, voice, security, and wireless services. Customers can customize solutions as required.●Easy to expand: Huawei series routers have four/eight FE/GE ports, can access more employee for small enterprises. The two uplink WAN ports implement load balancing and link protection, maximizing the return on investments.Small footprint on a Comprehensive Platform●Maturity and Stableness: The AR100s and AR120s uses the Huawei VRP operating system and VSP voice platform. In addition, the AR100s and AR120s uses modularized hardware design, which brings good user experience.●Low-noise office: Huawei series routers have no fan, which brings low noise and good user experience.●Secure environment: The lightning failure rate of AR100s and AR120s is only 3% of industry average. The AR100s and AR120s can be applied in the harsh environment.Sample DeploymentsWAN AccessExample deployment in branch networks for WAN access. In this example, the AR100s and AR120s function as the egress routers on enterprise branch networks and provide multiple access methods, including Ethernet, xDSL, 3G, LTE and WLAN. Enterprise Voice Services DeploymentIP PBX with WAN and PSTN AccessThis illustration shows AR120 series router deployed at an enterprise branch with access to a WAN and a PSTN. If a fault occurs on the WAN, the PSTN acts as a backup to the WAN and ensures that call services remain uninterrupted. AR120s are deployed at enterprise branch offices to provide intelligent, integrated dialing across the network. When deployed as voice service gateways, AR120s can function as IP PBX boxes and SIP access gateways.IP PBX.AR120s have a built-in PBX, which supports the enterprise main number, interactive voice response (IVR), and billing query functions. These features help enhance the corporate image of small businesses by allowing them to look more professional to their customers, while simultaneously improving the efficiency of their enterprise communications.SIP Server.AR120s have a built-in SIP server that ensures reliability of voice services. If the SIP server at the headquarters office becomes unreachable, the local built-in SIP server at the branch office ensures that communication remains uninterrupted between branch offices and the PSTN network.SIP Access GatewayThe AR120 series routers provide integrated voice, fax, and IP services. The AR120s can function as SIP access gateways for enterprise branch offices that transform traditional phone signals into Voice over IP (VoIP). Typically, AR120s are connected upstream from the IMS and NGN networks to enable anytime voice communication on any media, such as phones, handsets, and computers.VPN Deployment for Secure Enterprise CommunicationsVPNs Connecting Branches and Partners to HeadquartersThis illustration shows how to deploy AR100s and AR120s using VPNs to connect branches and partners to headquarters.AR100s and AR120s provide various VPN tunnel protocols to ensure secure communications between:∙Enterprise branches and other branch offices∙Enterprise branches and headquarters∙Partners and enterprise resourcesAR100s and AR120s support the following VPN tunnel protocols:∙GRE VPN∙IPSEC VPN∙DSVPNL2TP VPNAR100s and AR120s support fast tunnel set-up and authentication.Wireless Access and Management in Branch3G/LTE and Wi-Fi Wireless Access applicationThe AR100s, AR120s routers complied with 3G and LTE standards including HSPA+ and FDD LTE, meeting the wireless communication requirements between branches and the headquarters. In addition, the 3G or LTE data link can be used as a backup for wired link to protect the xDSL, FE/GE uplinks. The backup link improves network stability and reduces network construction costs.Some models of AR100s, AR120s routers are dual SIM devices, providing dual SIM standby. The customers can switch the SIM card manually according to 3G/LTE network standards. In addition, the device can switch to the backup SIM card when signal is weak to avoid link interruption.The AR100s, AR120s routers integrated WLAN wireless access capabilities, support 802.11a/b/g/n standard communication, Built-in AC function make the deployment and management more conveniently. Its wireless features can meet users’ demand for wireless access, and help enterprises to build a branch network flexibly.Wireless AC Management applicationThe AR120s routers integrated AC (Access Controller, a wireless controller) functionality, which can manage the wireless AP (Access Point) in wireless LAN. AR supported rich certification and flexible user access control, which can provide security access guarantee for Wi-Fi users. The rich wireless capabilities integrated in one device, this can realize centralized management of wired and wireless network, meet the customers’ requirements of building different scale enterprises networks.Technical Specifications Table 1: AR100s Technical SpecificationsTable 2: AR120s Technical SpecificationsThis content is applicable only to regions outside mainland China. Huawei reserves the right to interpret this content.*** Note: Service performance depending on specific feature configuration.****Note: When the altitude is between 1800 m and 5000 m, the highest operating temperature reduces by 1°C every time the altitude increases by 220 m.Ordering InformationThe AR100, AR120 series routers are configured by selecting and installing the appropriate configuration module. The configuration module ordering information and descriptions are shown in the following table1-3.Table 1: Chassis OptionsTable 2: Power Module OptionsTable 3: SD Card and USB Disk OptionsHUAWEI AR100 and AR120 Series Enterprise RoutersDatasheetCopyright © Huawei Technologies Co., Ltd. 2019. All rights reserved.No part of this document may be reproduced or transmitted in any form or by any means without priorwritten consent of Huawei Technologies Co., Ltd.Trademarks and Permissionsand other Huawei trademarks are trademarks of Huawei Technologies Co., Ltd.All other trademarks and trade names mentioned in this document are the property of their respectiveholders.NoticeThe purchased products, services and features are stipulated by the contract made between Huaweiand the customer. All or part of the products, services and features described in this document may notbe within the purchase scope or the usage scope. Unless otherwise specified in the contract, allstatements, information, and recommendations in this document are provided "AS IS" withoutwarranties, guarantees or representations of any kind, either express or implied.The information in this document is subject to change without notice. Every effort has been made in thepreparation of this document to ensure accuracy of the contents, but all statements, information, andrecommendations in this document do not constitute a warranty of any kind, express or implied. Huawei Technologies Co., Ltd. Address: Huawei Industrial Base Bantian, Longgang Shenzhen 518129 People's Republic of China Website: 。
MPLAB Harmony 开发平台用户指南说明书
STANDARD FEATURES•MPLAB® Harmony is a flexible, abstracted, fully integrated firmware development platform for PIC32 microcontrollers•Broad range of Middleware Stack/Libraries, including: USB, TCP/IP, Wi-Fi™, File System, Graphics, Bootloaders, Bluetooth™, Audio, DSP, Math, Cryptography, Drivers, System Services, and more•Over 160 Application Demonstrations with up to 600 application configurations to accelerate applicationdevelopment•Seamlessly integrates third-party solutions (RTOS, Middleware, Drivers, etc.) into the software frame-work•RTOS support, which includes: FreeRTOS™, OPENRTOS, Express Logic Thread X, SEGGER embOS®, Micriμm® μC/OS-II™, Micriμm μC/OS-III™ •Middleware support, which includes: SEGGER emWin®,InterNiche T echnologies, Inc., wolfSSL, and PubNub®•Both free and enabling license terms providedFor a detailed list of features, please visit the MPLAB Harmony Web page at:/harmonyFrom the landing page, scroll down and select the Features tab.DESCRIPTIONMPLAB Harmony is a flexible, abstracted, fully integrated firmware development platform for PIC32 microcontrollers. MPLAB Harmony's modular architec-ture allows drivers and libraries to work together with minimal effort. It is scalable across PIC32 Microchip devices to custom fit customers’ requirements. MPLAB Harmony takes key elements of modular and object oriented design, adding an Operating System Abstraction Layer (OSAL) that provides the flexibility to use a Real-Time Operating System (RTOS) or work without one, and provides a framework of software modules that are easy to use, configurable for your specific needs, and that work together in complete har-mony.In addition, the MPLAB Harmony Configurator (MHC) and code development format allows for maximum reuse and reduces time to PLIANCECompliant with MISRA-C:2012 Mandatory Standards:•MPLAB Harmony Peripheral Libraries•TCP/IP LibraryDEVELOPMENT TOOLS•MPLAB X IDE v4.0 or later is required•MPLAB XC32 C/C++ Compiler v1.44 (ISO 26262)•MPLAB X IDE plug-ins:-MPLAB Harmony Configurator (MHC) v2.04.xx THIRD-PARTY DEVELOPERSMicrochip offers a range of documentation to assist you with the design of your own software offerings for MPLAB® Harmony. These documents, which are pro-vided with the installation Help, are also available for download from the MPLAB Harmony website (see “Download Information” for details).•MPLAB Harmony Overview•MPLAB Harmony Compatibility Guide•MPLAB Harmony Tutorial•MPLAB Harmony Driver Development Guide •MPLAB Harmony Configurator User's Guide •MPLAB Harmony Configurator Developer's Guide •MPLAB Harmony Graphics Composer User's Guide •MPLAB Harmony Test Harness User's Guide•MPLAB Harmony Compatibility Checklist WorksheetSoftwareFrameworkMPLAB HARMONY v2.04ADDITIONSAria User Interface Library:•Improved drawing performance•Added caching and pre-emption options•Updated touch driver for maXTouch support, performance MPLAB Harmony Graphics Composer:•New windows environment, docking, organization •Enhanced asset manager, filtering, graphical displays•Screen edit copy plus paste, zoom External Display Controllers:•SSD1963 – new driver and example using PIC32MK devices•ILI9488 – new drivers for SPI, parallel interfaces, maXTouch Xplained Ultra board•8-bit display buffer for LCCG, new global palette options•Updated GPU library, new application examples for PIC32MZ DA devices•Updated display manager to support above driver templates New Application Examples:•BM64 Bluetooth BLE communication •8-bit palette support with simple motion•External graphics assets from SQI memory and USB MSD•Updates to graphics using GPU in the aria_coffee_maker demonstration•New application example for PIC32MK using SSD1963•New example with multiple language support for the SEGGER emWin Graphics Library•Updated examples showing the 5” WVGA display •Updated audio decoder using FLAC•New application for audio encoding example to USB MSD plus FS•Multiple new graphics and audio application configurations for PIC32MX devices DSP Library:•Added CMSIS Library and support•Revised C Math libraries, updated to include multiple family support Third Party :•Updated WolfSSL with TLS 1.3 supportMPLAB Harmony, including the current release notes and Software License Agreement, is available for download by visiting:/mplabharmonyADDITIONAL RESOURCESMPLAB Harmony TV offers a wide range of getting started and training videos. The video content is available by scrolling to the bottom of the MPLAB Harmony webpage at:/mplabharmony The Microchip Developer Site provides short introductory videos, self-paced training modules, and answers to frequently asked questions./harmony:start。
Mettler Toledo IND560 weighing terminal 产品说明书
W e i g h i n g T e r m i n a lsVersatile Technology focused weighing solutionsIND560Weigh Control ComplyConnect2Increase productivity Across your applicationsWeigh from milligrams to tonnes Control manual, semi-automatic and automatic processes Comply with industry regulations and global approvals Connect your system to PLCs, LANs, WANs and the InternetThe IND560 represents the latest in METTLER TOLEDO technology and is one of the most versatile weighing terminals available today. Choose from conventional strain gauge or high precision electro-magnetic force restoration weighing technologies. Specify direct PLC/PC communication interfaces or digital I/O control. Combine these selections with either panel, desk, wall, or column mounting, and the IND560 is the perfect match for most weighing applications.• Basic weighing• General process weighing • Filling and blending • Formulation•Over/under checkweighingWeighEnhance your measurement or control applications with an ultra fast A/D conversion rate of 366Hz,I N D 560 W e i g h i n g T e r m i n a lTraxDSP™ digital filtering technol-ogy, and an I/O bus update rate of 50Hz. The IND560 delivers precise repeatable measurement data from milligrams to tonnes in a single cost effective package that easily integrates into existing systems.ControlThe versatile IND560 excels in con-trolling filling and dosing applica-tions. It delivers best-in-class per-formance for fast, precise, accurate results in manual, semi-automatic, or fully automatic operations.For more advanced filling, the Fill-560 application software adds additional sequences and com-ponent inputs. Quickly configure standard filling sequences or cre-ate custom filling and blending applications withoug complex and costly programs.ComplyThe IND560 is designed specifically for industries subject to regulatory controls, such as pharmaceutical, chemical, food and beverage, and has been certified by multiple glo-bal agency standards including UL, CE, NTEP and OIML.ConnectThe IND560 offers multiple connec-tivity options to improve your appli-cations. Direct PLC connectivity is available using 4-20mA Analogue output, Allen-Bradley RIO, Profibus L2 DP or DeviceNet* protocols. Interfaces are also available for serial data via RS-232/422/485 and Ethernet TCP/IP networking.*When used with the METTLER TOLEDO DeviceNet BridgeModule.3Flexible features for focused solutionsLarge graphic display provides visual cues for operators The 47mm (1.9”) vacuum fluo-rescent display uses bright 21mm (0.8”) characters for weight indica-tion. Programmable softkeys define single button operations for faster product throughput and consistent product quality.Enable the SmartTrac™ graphical display mode for manual operations to clearly indicate the status of cur-rent weight in relation to the targetvalue, reducing operator error.Solutions for the harshest environmentsTo withstand the environments of the pharmaceutical and chemical industries, the IND560 is assured Type 4/12 (Panel) and IP69K (Harsh) protection categories.The needs of the food and beverage industries are also met. The unit’s 304 stainless steel construction and polished, sanitary finish resist aggressive cleaning agents, high pressure and temperature cleaning requirements dictated by EHEDG and NSF guidelines.Common platformRegardless of sensor technologySelect an analogue scale interface for use with an analogue base or weigh module system for fast sys-tem performance, or match with an appropriate METTLER TOLEDO K-Line high precision scale base for the high weighing resolutions (to 0.1g or 0.0002lb).Interface to new or existing control systemsTechnologies are quickly advanc-ing, outdating many common protocols. The IND560 provides interface options for either the latest in communications technology or to integrate with legacy systems. Utilise the IND560 features today on your existing network, then add an option card later to communicateon your network standards.Visit for more informationMettler-Toledo GmbH PO Box VI-400, CH-8606 Greifensee, Switzerland Tel. +41-44-944 22 11Fax +41-44-944 31 70METTLER TOLEDO® is a registered trade-mark of Mettler-Toledo Inc. All other brand of product names are trademarks of their respective companies.Subject to technical changes ©2005 Mettler-Toledo Inc.MarCom MTWT - IN03437.0EU MTA - 22013845Quality certification. Development, pro-duction, and auditing in accordance withISO9001. Environmental management system in accordance with ISO14001.Tailored Services. Our extensive service network is among the best in the world and ensures maximum availability and service life of your product.Conformité EuropéeneThis label is your guarantee that our products conform to the latest guidelines.exclusive CalFREE™ technology to get up and running without test weights.• The InSite™ Configuration Tool provides connected or offline access to the IND560 terminal for efficient and repeatable setup. Quickly and accurately upload or download system parameters via a serial or Ethernet connec-tion. • MinWeigh functionality helps insure the weighing of your criti-cal ingredients are always within acceptable limits by displaying a warning when the weight is below the minimum weight threshold.• TraxEMT™, the Embedded Maintenance Technician, sets the IND560 apart. Monitor and analyse system performance, enabling action before a failure occurs. • Advanced calibration options allow for the most cost effective operation. Use the automated 5-Point or Step Calibration rou-tines for the highest accuracy, orMaintain uptime and ensure sys-tem quality。
6010d-2018翻译
6010d-2018翻译6010d-2018是一种高性能的数字信号处理器(DSP),广泛应用于音频处理、语音识别、图像处理等领域。
它具有多种功能和特点,如高速运算能力、低功耗、多通道处理能力等。
该DSP采用了先进的数字信号处理算法,能够高效地处理复杂的数字信号。
它具有多个运算单元和并行处理能力,能够同时处理多个信号通道,提高了处理效率。
与传统的处理器相比,6010d-2018具有更高的运算速度和更低的功耗,能够在保证性能的同时节省能源。
6010d-2018还具有丰富的接口和功能模块,可以与各种外部设备进行通信和连接,实现更多样化的应用。
它支持多种数字接口标准,如I2C、SPI、UART等,可以方便地与其他设备进行数据交换。
此外,它还支持多种音频编解码算法和语音识别算法,可以实现高质量的音频处理和语音识别功能。
以下是一些使用6010d-2018的中英文对照例句:1. This audio processing system is powered by the 6010d-2018 DSP.这个音频处理系统由6010d-2018 DSP提供动力。
2. The 6010d-2018 DSP can handle multiple audio channelssimultaneously.6010d-2018 DSP可以同时处理多个音频通道。
3. With its advanced algorithms, the 6010d-2018 DSP delivers high-quality image processing.借助其先进的算法,6010d-2018 DSP可以提供高质量的图像处理。
4. The low power consumption of the 6010d-2018 DSP makes it ideal for portable devices.6010d-2018 DSP的低功耗使其非常适合便携设备。
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Flexible DSP platform for various workload patterns Antti Pelkonen, Jussi Roivainen, Juha-Pekka SoininenVTT ElectronicsP.O.Box 1100 (Kaitoväylä 1), FIN-90571 OuluFINLANDTel. +358 8 551 2111, Fax. +358 8 551 2320E-mail: {Antti.Pelkonen, Jussi.Roivainen, Juha-Pekka.Soininen} @vtt.fiABSTRACTFuture multimedia communication products require system chips that provide sufficient computing capacity and configuration flexibility for achieving interoperability between different communication systems and support for various multimedia signal processing standards. A flexible DSP platform that utilises pre-designed IP cores, such as DSP and RISC processors, advanced coprocessors for critical functions and configurable memory organisation is presented. ADSL, HiperLAN2 subset and MPEG2 decoding algorithms have been analysed as a basis of IHIP architecture design. The initial performance results look promising and it seems that the IP block based configurable architecture could provide satisfactory performance for various types of workloads.1.INTRODUCTIONFuture multimedia products must be capable to provide both high computational capacity and effective execution of different kinds of algorithms and applications. Algorithmic complexity of DSL (digital subscriber line), mobile and wireless communication standards are increasing heavily [1, 2]. Interoperability of different systems, such as UMTS (universal mobile telecommunication system) and WLAN (wireless local area network), and a need to support various compression and source coding standards, such as MPEG4 and MP3, set demanding requirements for processing platforms [3, 4, 5].Integrated computer systems, e.g. system chips have been the kernels of telecommunication products. Integration capacity of System Chip technology is developing rapidly [6]. The capacity of a single chip doubles in every 18 months according to Moore’s law and within next years, tens of complete computer systems can be integrated into a single ASIC. It will mean that a high-performance PC with memories can be scaled down to a single system on chip that has both capabilities to base-band and application processing.The development of system chips is a huge effort even to best organisations. The reuse of existing designs and procurement of intellectual property make design more effective. The IP (intellectual property) based design requires standardised ways for interconnecting different virtual components [7]. Platform based design have been proposed as a solution for design complexity management [8]. Manufacturing integration platforms provide implemented hardware resources that can be used in the various applications. The application can be designed using hardware or software configuration or both [9].The research hypothesis in this paper is that by combining ideas from configurable architectures and intellectual property based design it is possible to have effective platform architecture for various types of algorithms and applications. The key issues in the design of flexible DSP platform are the analysis of application characteristics and the evaluation of platform performance.2.APPLICATION CHARACTERISTICS There are basically three different categories of signal processing, when using the data timing characteristics for classification: stream, block and sporadic data processing. In stream based processing, size of incoming data token is usually small (from few bits to few bytes), token arrive periodically or, at leas1t in some degree, predictably. Data is processed in many stages and SAR (segmentation and re-assembly) functions between stages are common. Number of operation for data token in each stage is usually quite small. Streaming data processing is be done most naturally in pipelined processing architecture, because the SAR functions can be implemented in between pipeline stages and pipelining is associated with high data throughput requirements. Due to high throughput requirements, stream based processing requires fast clock speed, small but fast buffer memories between stages and solid method of inter-process or inter-stage synchronisation. Examples of stream based processing in this paper are HiperLAN2 and ADSL base-band processing.In block based processing data tokens to be processed are large, ranging from hundreds of bytes to thousands or even millions bytes. This causes number of requirementsfor processing architecture. Data transfers happen in long bursts with inactivity times in between, which causes requirements for peak bandwidth of buses. Address space, memories, and memory bandwidth must also be large. Block based processing usually allow data parallel processing with MIMD (multiple instructions, multiple data) or SIMD (single instruction, multiple data) type of processors.In Internet era, a hybrid form of streaming and block based data processing has emerged with the internet protocol based communications. Implementations of physical and data link layer manifest streaming characteristics, but network layer manifests block based processing characteristics with large packet sizes, large memory requirements associated with ordering and error detection codes for whole packet. Therefore current and especially future Internet infrastructure requires programmable signal processing platforms that are well suited for both types of processing.Most difficult form of data processing is sporadic data processing. Size of data token is predictable but only worst case estimates and some statistics of data arrival rate is known. If hard real-time requirements are associated for this type of data processing, architecture must be designed for the worst case. This however may leave significant resources idle for most of the time. For achieving acceptable power consumption, chip should comprise of several parallel blocks where clocking of unneeded blocks can be switched off. Other solution is the use of adapting clock speed.1.1.ADSL, HiperLAN2 and MPEG2Case examples for flexible DSP platform are ADSL and HiperLAN2 processing and MPEG2 video decoding. Programmable implementation of ADSL remote modem requires approximately 900-1300 MOPS (millions of operations in second) on typical DSP processor with MAC (multiply-accumulate) unit [1].The estimated resources for HiperLAN2 modem in simplest case (6Mbit/s data-rate, BPSK modulation scheme) are around 600 MOPS for transmitter and 850 MOPS for receiver, excluding the Viterbi-decoding [4]. As block based processing example, MPEG-2 MP@ML video decoding at 30 frames per second sampled in YCrCb 4:2:0 and MP3 audio or MPEG2 audio is considered [5]. The most essential design parameter considering MPEG-2 video decoding is the high memory, memory bus and system bus bandwidth requirements. Raw uncompressed data stream bandwidth is 15 Mbits/s but internal communication results in huge bandwidth requirement. The amount of needed memory is at least 16 Mbit. The required processing resources estimation of the video decoding is estimated to be 620-750 MOPS [10]. This could, however, to be somewhat less since estimates were based on general-purpose processor and the multiplication was estimated to take 4 clock cycles. With VS56000 DSP, multiplication can be done in single clock cycle.3.IHIP ARCHITECTURECase example presented in this paper is the IHIP (information highway interface platform) chip. The IHIP consists of RISC computer that is based on of Leon 32-bit SparcV8 RISC core designed by European Space Agency, and DSP cluster with four VS56000 24-bit fixed point DSPs and Viterbi and FFT coprocessors. The basic architecture is shown in Fig. 1.In addition IHIP chip has a DMA unit, 16 Mbit on-chip memory and an interface to external bus. Components are connected with 32-bit AMBA (Advanced Microcontroller Bus Architecture) bus that supports pipelining bus accesses, split transactions, burst transactions and multiple bus-masters. Leon core can also access the memory blocks of DSP cluster in some operation modes.Fig. 1 IHIP ArchitectureThe components in the chip are introduced into the design as third party IP-blocks (intellectual property). These individual blocks are connected to the system bus via VSIA OCB (on-chip-bus) wrappers so the system bus can be modified or changed if needed without modifying the IP blocks and vice versa [7, 8].In the DSP-cluster, the cores are connected with a configurable shared memory system (each core can access 64 kwords of memory per bus). There are four memory banks for each X and Y data buses and four 16kword segments in each bank. Each 16kword segment can be mapped to any processor or even for all processors at the same time. All processors can access to same piece of memory when needed or make a pipeline from one processor to another.Two co-processors are needed in most computing intensive tasks of applications. For ADSL’s FFT and IFFT there is an IP-block that can calculate 256-point complex to complex transform ations. For the Viterbi-decoding in HiperLAN2 receiver, there is a dedicated IP block.The estimated processing capacity of the chip is at GOPS (giga operations per second) range. The chip is targeted to 0.13µm (or even more advanced) CMOS process technology that has ability to implement large on-chip DRAM memories. Target clock frequency is 200 MHz, which would provide 200 MIPS per DSP processor core and 200 MIPS for the Leon RISC core. The main on-chip DRAM memory would be 16Mbit and the used clock frequency would provide a peak bandwidth of 6400 Mbits/s for AMBA bus. The conceptual design and VHDL and SystemC implementation so far has been made without concerning too much on the technology constraints, as the chip is supposed to use future state-of-the-art technology process.1.2.Configurable memory systemThe configurable shared-memory system has three basic configurations, but the architecture allows others too.−In parallel mode each DSP processor has private data and program memories.−In pipelined mode memory is configured so that a core feeds a shared memory segment and another reads from the same segment. In Fig. 2, and example of pipeline configuration is shown. DMEM means data memory and PMEM program memory.−In concurrent mode, common memory banks are mapped for all cores.Input buffer Output BufferFig. 2 DSP Cluster in pipeline mode.Inter-processor synchronisation is achieved by reserving the 64-word peripheral memory area from DSP core’s X-bus. These registers are used as semaphores or status registers between DSP cores and the Leon.1.3.Operation modes and controlThe basic idea in the control of IHIP architecture is that the LEON core controls DSP clusters operation, operation mode changes and configuration changes. There are four possible states:−In the initialization state the basic system checks are performed.−In operation mode change state the program and data are loaded to DSP cluster and system is configured according to operation mode−In operation mode data is processed at DSP Cluster and RISC computer. During the operation the configuration of the memory system does not change.−In configuration change mode, the memory configuration is changed. This used for transferring data between processing units.The state of DSP cluster is controlled via the status registers and interrupts. The platform control must be explicitly programmed. The benefits are full control over the execution and possibility to fully exploit the capacity of DSP cluster.1.4.Operation scenariosIn ADSL modem mode, one DSP core acts as transmitter and three DSP cores and RISC core are allocated to receiver side. The FFT block is also required for the receiver. In the receiver side two DSPs handle Reed-Solomon decoding, FFT-block handles fast Fourier transformation and RISC core and the remaining DSP handle the rest of the processing. The shared memory of the DSP cluster and FFT in the receiver side is configured as pipeline to allow easy data transfer and synchronisation between processing stages.In HiperLAN2 case, two DSP cores are allocated on the transmitter side and two DSP cores, RISC core, FFT-block and Viterbi-decoder are allocated for the receiver side. The processing and memory bandwidth requirements are so high that additional FFT block might be needed, but this is confirmed in further simulations. The shared memory and co-processor blocks are configured as two parallel pipelines, one pipeline consisting of transmitting side DSP cores andpossible additional FFT block and the other pipeline consisting of receiver side DSP cores, FFT-block and Viterbi-decoder. In MPEG2 case DSP cores handle the IDCT (inverse discrete cosine transformation) and the RISC core handles other tasks. The shared memory of the DSP cores is configured as concurrent mode, where all cores can access same data.4.EVALUATION OF ARCHITECTUREInitial performance estimations suggest that ADSL and MPEG-2 fit in to the IHIP architecture easily. However if a Reed-Solomon decoder would be implemented as additional IP block it would take 400 MIPS of processing burden off the DSP cores. The HiperLAN2 might need additional FFT block to allow both receiver FFT and transmitter IFFT to be processed in hardware co-processor. These open questions should have an answer after further simulations are done.The register-based configuration of DSP cores, the DSP shared memory and co-processors is very software friendly and intuitive and the programming of the chip is very similar to a single embedded RISC processor programming. The problematic software development for the DSP cluster is not yet tackled. For the DSP shared memory, the programmable switch matrix approach is proving to be very efficient solution to add flexibility to architecture.The 16Mbit of on-chip memory is very challenging part of the design, although IBM provides up to 16Mbit of embedded DRAM memory blocks even today [11]. Also the clock frequency of 200 MHz for the DSP cores and the Leon core might not be feasible.There is also an option of changing the processor cores to achieve better performance. The Leon RISC core could be exchanged for a more state-of-the-art ARM or MIPS processor core and 24-bit VS56000 DSPs could be changed to floating point or 32-bit fixed point cores. The current choice of cores is partly done because of the easy availability of VHDL implementations of the cores.5.CONCLUSIONSA flexible DSP platform that utilises pre-designed IP cores, such as DSP and RISC processors, advanced coprocessors for critical functions and configurable memory organis ation is presented. The proposed architecture can be configured so that execution of various workload patterns is efficient so that unnecessary on-chip communication load can be minim ised. The control solution for DSP cluster and configuration management approach seem to provide good basis for software development.ADSL, HiperLAN2 subset and MPEG2 decoding algorithms have been analysed as a basis of IHIP architecture design. The initial performance results look promising and it seems that the IP block based configurable architecture could provide satisfactory performance for various types of workloads.The implementation complexity of IHIP chip has not been studied yet. The next step is to implement development and verification platform for the architecture and to study in detail the operation of architecture and application mapping issues.ACKNOWLEDGEMENTSThe authors gratefully acknowledge the financial support given by the SciFi project and its funding organizations TEKES, Nokia Mobile Phones, Nokia Networks, Nokia Research Center, ABB Corporate Research, ABB Substation Automation, Elektrobit, Hantro Products, Synopsys Finland Smartech Group, VLSI Solution, DSLBit and Fincitec.REFERENCES[1]Wiese, B.R., Chow, J.S. "Programmable Implementations ofxDSL Transceiver Systems", IEEE Communications Magazine,May, 2000, pages 114-119[2] Starr, T., Cioffi, J.M. and Silvermann, P.J., UnderstandingDigital Subscriber Line Technology, Prentice Hall, 1999, 474pages[3]Kourtis, S., McAndrew, P. & Tottle, P. TechnologyRequirements of the 3GPP-TDD terminal, Proceedings of the1st International Conference on 3G Mobile CommunicationTechnologies, 27-29 March 2000, pages 89-93[4] Khun-Jush, J., et al, "Structure and Performance of theHIPERLAN/2 Physical Layer". Proceedings of VehicularTechnology Conference 5, 19-22 September 1999, Amsterdam,Netherlands, p. 2667-2671.[5]Parhi & Nishitani. Digital Signal Processing for MultimediaSystems, Marcel Dekker Inc, June 1999.[6]International Technology Roadmap for Semiconductors,Edition 1999, World Semiconductor Council[7] Virtual Component Interface Standard (OCB 2 1.0), March2000, VSI Alliance[8] Chang, H., et al. Survining the SOC Revolution – A Guide toPlatform-Based Design, Kluwer Academic Publishers, 1999,235 pages[9]K. Keutzer, S. Malik, A. R. Newton, J. Rabaey and A.Sangiovanni-Vincentelli. “System Level Design:Orthogonolization of Concerns and Platform-Based Design”,IEEE Transactions on Computer-Aided Design of IntegratedCircuits and Systems, Volume 19, Issue 12, December 2000.pages 1523 –1543[10]Chang-Guo Zhou; Ihtisham Kabir; Leslie Kohn; Aman Jabbi;Rice, D.; Xio-Ping Hu "MPEG Video Decoding with theUltraSPARC Visual Instruction Set", CompCon '95'Technologies for the Information Superhighway' Digest ofPapers. 1995 Pages 470-477[11]ASIC Cu-11 Gate array product brief, 2000, IBM,。