杜邦产品介绍

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Substrates
• Aramid Paper:
– Sold under DuPont trade name “Nomex” – Used in specialized application – Good thermal insulation material
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Dielectric Substrates
Aluminum Electrical Properties Thermal Properties Mechanical Properties
Excellent
Copper
Excellent
Gold
Good
Nickel
Good
Silver
Excellent
Fair
Excellent
Fair
Very Good Very Good
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Conductors/Foil
• 必備之特性
– – – – – – Current-carrying capacity Flexibility Service temperature Chemical resistance Mechanical strength Cost
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Conductors/Foil
– Dry Film – Fine-Line Application
• Camera • Automotive
• Others
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Dielectric rates
• Definition
– A base film on which the printed conductors are laid. – A film which provides electrical insulation between conductors. – A film which provides mechanical strength of the circuit.
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Conductors/Foil
• Major types of conductors
– Metals – Metal alloys – conductive inks
• Copper (the most commonly used conductor in FPC)
– Electrolytically deposited copper (ED) – Rolled Annealed copper (RA)
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Part II : (~ 40 minutes)
Introduction to
Flexible Circuit Materials
Presented by: Jonathan C. Li
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簡報大綱
• 軟性電路板基材之介紹 • 基材的主要Composition
– Dielectric Substrates (絕緣體) – Adhesive (膠質) – Conductor (導體)
Good
Good Excellent 200-230 Low Good High
Fair
Very Good Fair 150-180 High Excellent Very Low
Cost Trade Name
Low Mylar
High Kapton
High Teflon/Tedlar
Moderate Nomex
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Adhesive
• Adhesive之種類
– – – – – Polyester Acrylic Epoxy Polyimide Butyral Phenolic
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Adhesive
• Polyester:
– Used where the dielectric is also polyester – Used where no soldering is needed – Typical application:
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Dielectric Substrates
• 必備之特性
– – – – – – – – Mechanical Strength Flexibility Dimensional Stability Dielectric Properties Thermal Properties Chemical Resistance Moisture Absorption Cost
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簡報大綱 (continue)
• 杜邦產品
– 壓克力膠系列(Modified WA Acrylic)之基材 – 環亞樹脂膠系列(Modified Epoxy)之基材
• 杜邦 料號解說
– Pyralux® – Telcam®
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軟性電路板之主要基材
• Copper Clad Laminates (銅箔基材)
– Single-Sided C.C.L.(單面銅箔基材)
Conductor Adhesive
Dielectric Substrate
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軟性電路板之主要基材
– Double-Sided C.C.L. .(雙面銅箔基材)
Conductor Adhesive Dielectric Substrate
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Substrates
• Polyester:
– – – – – – Popularized by DuPont under “Mylar” Also known as PET Lowest cost dielectric material Mostly used in low-cost consumer application Good mechanical properties Bad thermal properties
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Adhesive
• Polyimide:
– – – – Used in adhesiveless ccl and coverlay Used where dimension stability is critical Used in high temperature application High moisture absorption
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Part III: (~ 15 minutes)
Introduction to
DuPont Products
DuPont Product Family
• Pyralux
– – – – Pyralux FR Pyralux LF Pyralux AP Pyralux PC
• Teclam
– Teclam FNC – Teclam DNC
Fair
Good
Good
Good
Excellent
Relative Cost
Best
Fair/ Good
Excellent
Good
Excellent
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軟板基材製造過程
Heater 2
Copper Clad Laminate
Heater 1
Aging
Kapton Roll
Copper Roll
Liquid Adhesive
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Pyralux ®
• FR - series (Acrylic Based)
– Copper-Clad Laminates
• • • • • • • • Panel Form Packaging. (24” x 36”) UL Approved. (File# E124294) Very Good Flexure Endurance Ex. FR9111, FR9110, FR8510, FR8515 Roll Form Packaging. (24” x 250’) UL Approved. (File# E124294) Excellent Dimensional Stability Ex. FR0110, FR0210
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Adhesive
Polyester Temp.Resist.
Fair
Acrylic Epoxy Polyimide
Very Good Good Good Excellent Good Moderate Poor Good Fair Good Excellent Excellent Fair High Good Excellent Very Good Good Good Fair Very High Poor
Property
Tensile Strength
Polyester
Excellent
Polyimide Fluorocarbon Aramid Paper
Excellent Fair Good
Composite
Best
Flexibility
Dim. Stability
Dielectric Str. Solderibility C.O.T. (C) Thermal Exp. Chem. Resist. Moisture Absorp.
• Instant camera film interconnects • Instrument cluster connection in automobiles
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Adhesive
• Acrylic:
– Used in demanding temperature requirement application – Most popular acrylic system is Pyralux by DuPont – Excellent adhesion
Excellent Excellent Excellent
Fair/Good
Good Poor 105 Low Good Very Low
Good
Good