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文件控制程序(中英文)

文件控制程序(中英文)

对公司管理体系文件和外来文件进行控制,确保各相关场所使用的文件为满足标准、顾客及法律法规要求的有效版本。

To control all the company management systems documents and external origin documents and to ensure all the documents at relevant points of use are effective based on the standard, customer and regulatory requirements.合用于公司质量( ISO/TS 16949 ) 、环境( ISO 14001 ) 、安全( OHSAS 18001) 管理体系文件及外来文件的控制。

Be applicable to control all the company quality ( ISO/TS 16949 ) & environment ( ISO 14001 ) & safety ( OHSAS 18001) management systems documents and external origin documents.3.1 文件名Document name:文件封面及页眉里标题项下所显示的名称为文件名。

Document name is described on the document cover page and under the title of each page header.3.2 外来文件External Document国际、国家行业标准和非公司内部制定的文件和设计的图纸,包括合用的法律法规文本、顾客或者供应商提供的资料、质量标准、技术要求、顾客提供的图纸等。

Industrial standards of international and internal, and documents compiled and blueprint designed by external company. Including applicable laws & regulations, the material offered by customer and supplier,quality standard,technical requirements,blueprint provided by customers, etc.3.3 受控文件To be controlled document按照发放范围登记、分发或者独立存档管控,并能保证收回以防止失效作废文件的非预期使用的文件。

IBM System x3400 M3 产品指南(撤回产品)说明书

IBM System x3400 M3 产品指南(撤回产品)说明书

IBM System x3400 M3 (Withdrawn)Product Guide (withdrawn product)The System x3400 M3 servers are self-contained, high-performance, 5U tower systems designed for web and business server applications in remote or distributed environments. These servers are highly scalable in configuration, performance, and availability. They offer two-way SMP power with the latest Intel Xeon 5600 series processors, a dual connector 8-port SAS/SATA RAID controller on hot-swap models, an embedded Gigabit Ethernet controller, and six PCI Express 2.0 slots. These servers support SATA or SAS HDDs.These servers are flexible tower models that deliver the best blend of power, manageability, expandability, and serviceability. They meet the requirements of server applications in the small-to-medium businesses that need an affordable general-purpose network server. These servers fit into business environments where tower configurations are required. Figure 1 shows the IBM® System x3400 M3.Figure 1. The IBM System x3400 M3Did you know?The System x3400 M3 server supports optional spare DIMMs, memory mirroring, and RAID-0, RAID-1, and RAID-1E support standard with optional RAID-5, RAID-6, RAID-10, and RAID-50 available. It features large amounts of internal expansion and I/O support. Comprehensive systems management tools such as advanced diagnostics, Predictive Failure Analysis, and the ability to control resources from a single point make it easy to deploy, integrate, service, and manage from any location.Click here to check for updatesFigure 2. Front view of the IBM System x3400 M3Figure 3. Rear view of the IBM System x3400 M3Figure 4 shows the locations of key components inside the server.Figure 4. Inside view of the IBM System x3400 M3 Standard specificationsThe following table lists the standard specifications. Table 1. Standard specificationsStandard modelsThe following table lists the standard models. Table 2. Standard modelsModel†Intel Processor*(2 maximum)RAM DiskcontrollerDisk bays(std/max)Disks Network Optical PowersupplyModels announced February 20117378/ 7379-A2x 1x E5603 4C 1.60GHz4 MB 1066 MHz1x 2GBIntegratedSATA(no RAID)4x 3.5"SS / 4Open 2 x GbE DVD1x 670 WFixed7378/ 7379-A4x 1x E5603 4C 1.60GHz4 MB 1066 MHz1x 2GBServeRAIDBR10il v24x 3.5"HS / 4Open 2 x GbE DVD1x 670 WFixed7378/ 7379-B2x 1x E5606 4C 2.13GHz8 MB 1066 MHz1x 2GBIntegratedSATA(no RAID)4x 3.5"SS / 4Open 2 x GbE DVD1x 670 WFixed7378/ 7379-B4x 1x E5606 4C 2.13GHz8 MB 1066 MHz1x 2GBServeRAIDBR10il v24x 3.5"HS / 4Open 2 x GbE DVD1x 670 WFixed7378/ 7379-C2x 1x E5607 4C 2.26GHz8 MB 1066 MHz1x 2GBServeRAIDBR10il v24x 3.5"HS / 4Open 2 x GbE DVD1x 670 WFixed7378/ 7379-56x 1x E5620 4C 2.40GHz12 MB 1066 MHz1x 4GBServeRAIDBR10il v24x 3.5"HS / 4Open 2 x GbE DVD1x 670 WFixed7378/ 7379-58x 1x E5620 4C 2.40GHz12 MB 1066 MHz1x 4GBServeRAIDM10158x 2.5"HS / 16Open 2 x GbE DVD 1 x 920 WHot-swap7378/ 7379-D2x 1x E5645 6C 2.40GHz12 MB 1333 MHz1x 4GBServeRAIDM10158x 2.5"HS / 8Open 2 x GbE DVD1x 670 WFixed7378/ 7379-F2x 1x E5649 6C 2.53GHz12 MB 1333 MHz1x 4GBServeRAIDM501416x 2.5"HS / 16Open 2 x GbE DVD 1 x 920 WHot-swap† The x3400 M3 is available as machine type 7378 with a 1-year warranty (AP only) or as machine type 7379 with a 3-year warranty. This is the only difference between systems of the same model (for example, comparing 7378-A2x and 7379-A2x).* In the processor column: Standard quantity of processors, processor model, core speed, cores, L3 cache, memory speed.Refer to the Standard Specifications section for information about standard features of the server.Express modelsThe following table lists the region-specific Express models. Express models are preconfigured with additional components, such as processors and memory, to make the ordering and installation process simpler.Table 3. Express modelsRegion/ model Processor* (2maximum)Memory RAIDcontrollerDiskbays(std /max)Disks Network Optical PowersupplyNA and LA7379-E1U 1x Xeon E5503 2.0GHz 2C 4 MB 800MHz3x 2 GB BR10il v24x 3.5"SS / 4Optional2x GbE DVD-ROM1x 670W7379-E2U 1x Xeon E5506 2.13GHz 4C 4 MB 800MHz3x 4 GB BR10il v24x 3.5"HS / 4Optional2x GbE DVD-ROM1x 670W7379-E3U 1x Xeon E5620 2.40GHz 4C 12 MB 1066MHz3x 4 GB M10158x 2.5"HS / 16Optional2x GbE DVD-ROM1x 920WNE and SW IOT7379-K1G 1x Xeon E5503 2.0GHz 2C 4 MB 800MHz1x 2 GB BR10il v24x 3.5"SS / 4Optional2x GbE DVD-ROM1x 920W7379-K2G 1x Xeon E5506 2.13GHz 4C 4 MB 800MHz1x 4 GB M10154x 3.5"HS / 8Optional2x GbE Multiburner1x 920W7379-K3G 1x Xeon E5507 2.26GHz 4C 4 MB 800MHz1x 4 GB M1015 +AdvanceFeatureKey8x 2.5"HS / 16Optional2x GbE Multiburner1x 920W7379-K4G 1x Xeon E5620 2.40GHz 4C 12 MB 1066MHz1x 4 GB M1015 +AdvanceFeatureKey8x 2.5"HS / 16Optional2x GbE Multiburner2x 920W7379-K8G 1x Xeon E5506 2.13GHz 4C 4 MB 800MHz1x 4 GB M50144x 3.5"HS / 8Optional2x GbE Multiburner2x 920W7379-KDG 1x Xeon E5620 2.40GHz 4C 12 MB 1066MHz1x 4 GB M50148x 2.5"HS / 162x 146 GB2x GbE Multiburner1x 920W7379KXG1x Xeon E5607 2.26GHz 4C 8 MB 1333MHz 1x 4 GB M10158x 2.5"HS / 8Optional2x GbE Multiburner1x 670W7379KZG1x Xeon E5620 2.4GHz 4C 12 MB 1333MHz 1x 2 GB M50146x 2.5"HS / 8Optional2x GbE Multiburner1x 670WCEE and MEA IOT7379-K5G 1x Xeon E5506 2.13GHz 4C 4 MB 800MHz2x 4 GB M10154x 3.5"HS / 8Optional2x GbE Multiburner1x 920W7379-K6G 1x Xeon E5506 2.13GHz 4C 4 MB 800MHz1x 4 GB M50148x 2.5"HS / 162x 146 GB2x GbE Multiburner2x 920W7379-K8G 1x Xeon E5506 2.13GHz 4C 4 MB 800MHz1x 4 GB M50144x 3.5"HS / 8Optional2x GbE Multiburner2x 920W7379-KDG 1x Xeon E5620 2.40GHz 4C 12 MB 1066MHz1x 4 GB M50148x 2.5"HS / 162x 146 GB2x GbE Multiburner1x 920W7379-KBG 1x Xeon E5620 2.40GHz 4C 12 MB 1066MHz1x 4 GB M50144x 3.5"HS / 8Optional2x GbE Multiburner1x 920WRCIS7379-K9G 1x Xeon E5506 2.13GHz 4C 4 MB 800MHz1x 4 GB M50144x 3.5"HS / 8Optional2x GbE Multiburner1x 920W7379-KAG 1x Xeon E5506 2.13GHz 4C 4 MB 800MHz1x 4 GB M5014 +Battery4x 3.5"HS / 8Optional2x GbE Multiburner1x 920W7379-KBG 1x Xeon E5620 2.40GHz 4C 12 MB 1066MHz1x 4 GB M50144x 3.5"HS / 8Optional2x GbE Multiburner1x 920W7379-KCG 1x Xeon E5620 2.40GHz 4C 12 MB 1066MHz2x 4 GB M5015 +Battery8x 2.5"HS / 16Optional2x GbE Multiburner1x 920WJapan7379-PAM 1x Xeon E5503 2.0GHz 2C 4 MB 800MHz2x 2 GB BR10il v24x 3.5"HS / 82x 1 TB2x GbE DVD-ROM1x 920W7379-PAN 1x Xeon E5506 2.13GHz 4C 4 MB 800MHz2x 2 GB M5014 +Battery4x 3.5"HS / 83x 300 GB2x GbE DVD-ROM1x 920WChina7379-I011x Xeon E5506 2.13GHz 4C 4 MB 800MHz 1x 4 GB M10158x 2.5"HS / 81x 146 GB2x GbE DVD-ROM1x 670W7379-I051x Xeon E5506 2.13GHz 4C 4 MB 800MHz 1x 4 GB M5015 (nobattery)8x 2.5"HS / 81x 146 GB2x GbE DVD-ROM1x 670W7379-I211x Xeon E5620 2.40GHz 4C 12 MB 1066MHz 1x 4 GB M10158x 2.5"HS / 81x 146 GB2x GbE DVD-ROM1x 670W7379-I251x Xeon E5620 2.40GHz 4C 12 MB 1066MHz 1x 4 GB M5015 (nobattery)8x 2.5"HS / 81x 146 GB2x GbE DVD-ROM1x 670WISA7379-I4S1x Xeon E5506 2.13GHz 4C 4 MB 800MHz 1x 2 GB BR10i4x 3.5"SS / 41x 250 GB2x GbE DVD-ROM1x 670W7379-I3S1x Xeon E5507 2.26GHz 4C 4 MB 800MHz 1x 4 GB BR10i8x 2.5"HS / 161x 146 GB2x GbE DVD-ROM2x 920WHong Kong7379-I5H1x Xeon E5506 2.13GHz 4C 4 MB 800MHz 2x 2 GB M50144x 3.5"HS / 4Optional2x GbE DVD-ROM1x 670W* In the processor column: standard quantity of processors, processor model, core speed, cores, L3 cache, memory speed.Processor optionsThe server supports the processor options listed in the following table. The server supports up to two processors. The table also shows which server models have each processor standard. If there is no corresponding where-used model for a particular processor, then this processor is only available through CTO.Table 4. Processor optionsFeature code**Description Standard modelswhere usedIntel Xeon 5600 series processorsA0VC / A0VD Intel Xeon Processor E5603 4C 1.60GHz 4 MB Cache 1066MHz 80w A2x, A4xA0VE / A0VF Intel Xeon Processor E5606 4C 2.13GHz 8 MB Cache 1066MHz 80w B2x, B4xA0VG / A0VH Intel Xeon Processor E5607 4C 2.26GHz 8 MB Cache 1066MHz 80w C2x4493 / 4631Intel Xeon Processor E5620 4C 2.40GHz 12 MB Cache 1066MHz 80w52x, 54x, 56x, 58x 4494 / 4632Intel Xeon Processor E5630 4C 2.53GHz 12 MB Cache 1066MHz 80w62x4495 / 4633Intel Xeon Processor E5640 4C 2.66GHz 12 MB Cache 1066MHz 80w72x, 74xA0VJ / A0VK Intel Xeon Processor E5645 6C 2.40GHz 12 MB Cache 1333MHz 80w D2xA0VL / A0VM Intel Xeon Processor E5649 6C 2.53GHz 12 MB Cache 1333MHz 80w F2x0723 / 7683Intel Xeon Processor L5609 4C 1.86GHz 12 MB Cache 1066MHz 40w-0722 / 7682Intel Xeon Processor L5630 4C 2.13GHz 12 MB Cache 1066MHz 40w-0721 / 7681Intel Xeon Processor L5640 6C 2.26GHz 12 MB Cache 1333MHz 60w-4496 / 4634Intel Xeon Processor X5650 6C 2.66GHz 12 MB Cache 1333MHz 95w-4497 / 4635Intel Xeon Processor X5660 6C 2.80GHz 12 MB Cache 1333MHz 95w-4498 / 4636Intel Xeon Processor X5670 6C 2.93GHz 12 MB Cache 1333MHz 95w-A0VS / A0VT Intel Xeon Processor X5675 6C 3.06GHz 12 MB Cache 1333MHz 95w-Intel Xeon 5500 series processors0705 / 4639*Intel Xeon Processor E5503 2C 2.0 GHz 4 MB Cache 800 MHz 80w22x, 24x6656 / 6955Intel Xeon Processor E5504 4C 2.00 GHz 4 MB Cache 800MHz 80w-4428 / 4427Intel Xeon Processor E5506 4C 2.13 GHz 4 MB Cache 800MHz 80w32x, 34x0706 / 4640*Intel Xeon Processor E5507 4C 2.26 GHz 4 MB Cache 800MHz 80w42x4425 / 4424Intel Xeon Processor E5540 4C 2.53 GHz 8 MB Cache 1066MHz 80w-** The first feature code is for Processor 1. The second feature code is for Processor 2.* Withdrawn from marketing.Memory optionsFigure 5. Internal drive configurationsPart number FeaturecodeDescription Maximumsupported*3.5" Simple-Swap SATA and NL SATA HDDs81Y9778A280IBM 3TB 7.2K 6Gbps NL SATA 3.5" SS HDD4 42D07875416IBM 2 TB 7200 NL SATA 3.5" SS HDD4 39M45145288500 GB 7200 RPM 3.5" Simple-Swap SATA II4 3.5" Hot-Swap SATA and NL SATA HDD81Y9774A27Z IBM 3 TB 7.2K 6Gbps NL SATA 3.5" HS HDD8 42D07825415IBM 2 TB 7200 NL SATA 3.5" HS HDD8 43W76265560IBM 1 TB 7200 SATA 3.5" HS HDD8 39M45305196500 GB 7200 RPM 3.5" Hot-Swap SATA II83.5" Hot-Swap SAS HDDs44W22445313IBM 600 GB 15 K 6 Gbps SAS 3.5" Hot-Swap HDD844W22395312IBM 450 GB 15 K 6 Gbps SAS 3.5" Hot-Swap HDD844W22345311IBM 300 GB 15 K 6 Gbps SAS 3.5" Hot-Swap HDD83.5" Hot-Swap NL SAS HDDs81Y9758A281IBM 3 TB 7.2K 6Gbps NL SAS 3.5" HS HDD842D07675417IBM 2 TB 7.2 K 6 Gbps NL SAS 3.5" HS HDD842D07775418IBM 1 TB 7.2 K 6 Gbps NL SAS 3.5" HS HDD82.5" Hot-swap SAS-SSD Hybrid Drive00AD102A4G7IBM 600GB 10K 6Gbps SAS 2.5'' G2HS Hybrid162.5" Hot-Swap NL SATA HDDs81Y9730A1AV IBM 1TB 7.2K 6Gbps NL SATA 2.5" SFF HS HDD1681Y9726A1NZ IBM 500GB 7.2K 6Gbps NL SATA 2.5" SFF HS HDD1681Y9722A1NX IBM 250GB 7.2K 6Gbps NL SATA 2.5" SFF HS HDD162.5" Hot-Swap 10K SAS HDDs00AD075A48S IBM 1.2TB 10K 6Gbps SAS 2.5'' G2HS HDD1681Y9650A282IBM 900GB 10K 6Gbps SAS 2.5" Slim-HS HDD1649Y20035433IBM 600 GB 10 K 6 Gbps SAS 2.5" SFF Slim-HS HDD1642D06375599IBM 300 GB 10 K 6 Gbps SAS 2.5" SFF Slim-HS HDD162.5" Hot-Swap 15K SAS HDDs81Y9670A283IBM 300GB 15K 6Gbps SAS 2.5" SFF HS HDD1642D06775536IBM 146 GB 15 K 6 Gbps SAS 2.5" SFF Slim-HS HDD162.5" Hot-Swap NL SAS HDDs81Y9690A1P3IBM 1TB 7.2K 6Gbps NL SAS 2.5" SFF HS HDD1642D07075409IBM 500 GB 7200 6 Gbps NL SAS 2.5" SFF Slim-HS HDD162.5" Solid state drives00W1125A3HR IBM 100GB SATA 2.5" MLC HS Enterprise SSD1643W7718A2FN IBM 200GB SATA 2.5" MLC HS SSD1649Y5839A3AS IBM 64GB SATA 2.5" MLC HS Enterprise Value SSD1649Y5844A3AU IBM 512GB SATA 2.5" MLC HS Enterprise Value SSD1690Y8643A2U3IBM 256GB SATA 2.5" MLC HS Enterprise Value SSD1690Y8648A2U4IBM 128GB SATA 2.5" MLC HS Enterprise Value SSD16* If the server has a 670 W fixed power supply, then only 4x 3.5-inch drives or 8x 2.5-inch drives can be installed.Internal backup unitsStorage host bus adaptersThe following table lists storage HBAs supported by the x3400 M3 server. Table 12. Storage adaptersPart number FeaturecodeDescription Maximumquantity supportedFibre Channel59Y19873885Brocade 4 Gb FC Single-port HBA for IBM System x359Y19933886Brocade 4 Gb FC Dual-port HBA for IBM System x346M60493589Brocade 8 Gb FC Single-port HBA for IBM System x346M60503591Brocade 8 Gb FC Dual-port HBA for IBM System x381Y1668A2XU Brocade 16Gb FC Single-port HBA for IBM System x381Y1675A2XV Brocade 16Gb FC Dual-port HBA for IBM System x342C20691698Emulex 4 Gbps FC Single-Port PCI-e HBA for IBM System x642C20711699Emulex 4 Gbps FC Dual-Port PCI-e HBA for IBM System x642D04853580Emulex 8 Gb FC Single-port HBA for IBM System x642D04943581Emulex 8 Gb FC Dual-port HBA for IBM System x681Y1655A2W5Emulex 16Gb FC Single-port HBA for IBM System x381Y1662A2W6Emulex 16Gb FC Dual-port HBA for IBM System x339R65253567QLogic 4 Gb FC Single-Port PCIe HBA for IBM System x639R65273568QLogic 4 Gb FC Dual-Port PCIe HBA for IBM System x642D05013578QLogic 8 Gb FC Single-port HBA for IBM System x642D05103579QLogic 8 Gb FC Dual-port HBA for IBM System x600Y3337A3KW QLogic 16Gb FC Single-port HBA for IBM System x300Y3341A3KX QLogic 16Gb FC Dual-port HBA for IBM System x3Converged Network Adapters (CNA)*42C18005751QLogic 10 Gb Dual Port CNA for IBM System x342C18201637Brocade 10 Gb Dual-port CNA for IBM System x3iSCSI39Y61462976QLogic iSCSI Single-Port PCIe HBA for IBM System x642C17702977QLogic iSCSI Dual-Port PCIe HBA for IBM System x6SAS44E87003583IBM 3 Gb SAS HBA v2346M09075982IBM 6 Gb SAS HBA Controller346M09123876IBM 6Gb Performance Optimized HBA1* Converged Network Adapters require SFP+ optical transceivers or DAC cables that must be purchased separately.For more information, see the list of IBM Redbooks Product Guides in the Host bus adapters category: /portals/systemx?Open&page=pg&cat=hbaPCIe SSD adaptersPCIe SSD adaptersThe server does not support High IOPS SSD adapters.Power suppliesThe server supports either one 670 W AC fixed power supply or up to two 920 W AC hot-swap redundant power supplies, providing N+N redundancy. Standard models come with one power supply, either fixed or hot-swap, depending on the model as listed in Table 2. For models with one 920 W AC hot-swap redundant power supply, you can add a second power supply by ordering the option listed in the following table.Note: If the server has a 670 W fixed power supply installed, then only up to four 3.5-inch drives can be installed or up to eight 2.5-inch drives can be installed.Table 13. Power suppliesPart number Feature code Description Maximum supported44X03815056IBM Redundant Power Supply for x3400/3500 2 (One power supply comesstandard with every model.)The power supply ships without a line cord. A line cord must be ordered separately.Note: Power supply option 44X0381 is for both the x3400 M3 and the x3500 M3. The power supply option includes three fans however these fans are only for use with the x3500 M3. They are not used in the x3400 M3. (The x3400 M3 includes physical space for the fans but there is no electrical connection for the fans in the x3400 M3.)Integrated virtualizationThe server supports VMware ESXi installed on a USB memory key. The key is installed in a USB socket inside the server. The following table lists the virtualization options.Table 14. Virtualization optionsPart number FeaturecodeDescription Maximumsupported41Y82781776IBM USB Memory Key for VMware ESXi 41 41Y82873033IBM USB Memory Key for VMware ESXi 4.11 41Y8296A1NP IBM USB Memory Key for VMware ESXi 4.1 Update 11 41Y8300A2VC IBM USB Memory Key for VMware ESXi 5.01 41Y8307A383IBM USB Memory Key for VMware ESXi 5.0 Update 11 41Y8311A2R3IBM USB Memory Key for VMware ESXi 5.11Remote managementExternal backup unitsThe server supports the external backup attachment options listed in the following table. Table 22. External backup optionsPart number DescriptionExternal tape expansion enclosures for internal tape drives87651UX1U Tape Drive Enclosure8767HHX Half High Tape Drive Enclosure87651NX1U Tape Drive Enclosure (with Nema 5-15P LineCord)8767HNX Half High Tape Drive Enclosure (with Nema 5-15P LineCord)Tape enclosure adapters (with cables)44E8869USB Enclosure Adapter Kit40K2599SAS Enclosure Adapter KitInternal backup drives supported by external tape enclosures46C5364IBM RDX Removable Hard Disk Storage System - Internal USB 160 GB Bundle 46C5387IBM RDX Removable Hard Disk Storage System - Internal USB 320 GB Bundle 46C5388IBM RDX Removable Hard Disk Storage System - Internal USB 500 GB Bundle 46C5399IBM DDS Generation 5 USB Tape Drive39M5636IBM DDS Generation 6 USB Tape Drive43W8478IBM Half High LTO Gen 3 SAS Tape Drive44E8895IBM Half High LTO Gen 4 SAS Tape Drive49Y9898IBM Half High LTO Gen 5 Internal SAS Tape DriveExternal backup units*362516X IBM RDX Removable Hard Disk Storage System - External USB 160 GB Bundle362532X IBM RDX Removable Hard Disk Storage System - External USB 320 GB Bundle362550X IBM RDX Removable Hard Disk Storage System - External USB 500 GB Bundle3628L3X IBM Half High LTO Gen 3 External SAS Tape Drive (with US line cord)3628L4X IBM Half High LTO Gen 4 External SAS Tape Drive (with US line cord)3628L5X IBM Half High LTO Gen 5 External SAS Tape Drive (with US line cord)3628N3X IBM Half High LTO Gen 3 External SAS Tape Drive (without line cord)3628N4X IBM Half High LTO Gen 4 External SAS Tape Drive (without line cord)3628N5X IBM Half High LTO Gen 5 External SAS Tape Drive (without line cord)3580S3V System Storage TS2230 Tape Drive Express Model H3V3580S4V System Storage TS2240 Tape Drive Express Model H4V3580S5E System Storage TS2250 Tape Drive Express Model H5S3580S5X System Storage TS2350 Tape Drive Express Model S533572S4R TS2900 Tape Library with LTO4 HH SAS drive & rack mount kit3572S5R TS2900 Tape Library with LTO5 HH SAS drive & rack mount kit35732UL TS3100 Tape Library Model L2U Driveless35734UL TS3200 Tape Library Model L4U Driveless46X2682†LTO Ultrium 5 Fibre Channel Drive46X2683†LTO Ultrium 5 SAS Drive Sled46X2684†LTO Ultrium 5 Half High Fibre Drive Sled46X2685†LTO Ultrium 5 Half High SAS Drive Sled46X6912†LTO Ultrium 4 Half High Fibre Channel Drive Sled46X7117†LTO Ultrium 4 Half High SAS DriveV2 Sled46X7122†LTO Ultrium 3 Half High SAS DriveV2 Sled* Note: The external tape drives listed can be ordered through System x sales channel. Server may support other IBM tape drives that are not listed in this table. Refer to IBM System Storage Interoperability Center for further information.† Note: These part numbers are the tape drives options for 35732UL and 35734UL.For more information, see the list of IBM Redbooks Product Guides in the Backup units category:/portals/systemx?Open&page=pg&cat=tapeTop-of-rack Ethernet switchesThe server supports the following top-of-rack Ethernet switches from IBM System Networking.Table 23. IBM System Networking - Top-of-rack switchesPart number DescriptionIBM System Networking - 1 Gb top-of-rack switches0446013IBM System Networking RackSwitch G8000R7309CFC IBM System Networking RackSwitch G8000F7309CD8IBM System Networking RackSwitch G8000DC7309G52IBM System Networking RackSwitch G8052R730952F IBM System Networking RackSwitch G8052F427348E IBM Ethernet Switch J48E6630010Juniper Networks EX2200 24 Port6630011Juniper Networks EX2200 24 Port with PoE6630012Juniper Networks EX2200 48 Port6630013Juniper Networks EX2200 48 Port with PoEIBM System Networking - 10 Gb top-of-rack switches7309DRX IBM System Networking RackSwitch G8264CS (Rear to Front)7309DFX IBM System Networking RackSwitch G8264CS (Front to Rear)7309BD5IBM System Networking RackSwitch G8124DC7309BR6IBM System Networking RackSwitch G8124ER7309BF7IBM System Networking RackSwitch G8124EF7309G64IBM System Networking RackSwitch G8264R730964F IBM System Networking RackSwitch G8264F7309CR9IBM System Networking RackSwitch G8264TR7309CF9IBM System Networking RackSwitch G8264TF0719410Juniper Networks EX4500 - Front to Back Airflow0719420Juniper Networks EX4500 - Back to Front AirflowIBM System Networking - 40 Gb top-of-rack switches8036ARX IBM System Networking RackSwitch G8316R8036AFX IBM System Networking RackSwitch G8316FFor more information, see the list of IBM Redbooks Product Guides in the Top-of-rack switches category: /portals/systemx?Open&page=pg&cat=torPart number DescriptionSwitched and Monitored PDUs46M4002IBM 1U 9 C19/3 C13 Active Energy Manager DPI® PDU46M4003IBM 1U 9 C19/3 C13 Active Energy Manager 60A 3 Phase PDU46M4004IBM 1U 12 C13 Active Energy Manager DPI PDU46M4005IBM 1U 12 C13 Active Energy Manager 60A 3 Phase PDU46M4167IBM 1U 9 C19/3 C13 Switched and Monitored 30A 3 Phase PDU46M4116IBM 0U 24 C13 Switched and Monitored 30A PDU46M4119IBM 0U 24 C13 Switched and Monitored 32A PDU46M4134IBM 0U 12 C19/12 C13 Switched and Monitored 50A 3 Phase PDU46M4137IBM 0U 12 C19/12 C13 Switched and Monitored 32A 3 Phase PDUEnterprise PDUs71762MX IBM Ultra Density Enterprise PDU C19 PDU+ (WW)71762NX IBM Ultra Density Enterprise PDU C19 PDU (WW)71763MU IBM Ultra Density Enterprise PDU C19 3 phase 60A PDU+ (NA)71763NU IBM Ultra Density Enterprise PDU C19 3 phase 60A PDU (NA)39M2816IBM DPI C13 Enterprise PDU without linecord39Y8923DPI 60A Three Phase C19 Enterprise PDU with IEC309 3P+G (208 V) fixed line cord 39Y8941DPI Single Phase C13 Enterprise PDU without line cord39Y8948DPI Single Phase C19 Enterprise PDU without line cordFront-End PDUs39Y8934DPI 32amp/250V Front-end PDU with IEC 309 2P+Gnd connector39Y8935DPI 63amp/250V Front-end PDU with IEC 309 2P+Gnd connector39Y893830amp/125V Front-end PDU with NEMA L5-30P connector39Y893930amp/250V Front-end PDU with NEMA L6-30P connector39Y894060amp/250V Front-end PDU with IEC 309 60A 2P+N+Gnd connectorUniversal PDUs39Y8951DPI Universal Rack PDU w/ US LV and HV line cords 39Y8952DPI Universal Rack PDU w/ CEE7-VII Europe LC39Y8953DPI Universal Rack PDU w/ Denmark LC39Y8954DPI Universal Rack PDU w/ Israel LC39Y8955DPI Universal Rack PDU w/Italy LC39Y8956DPI Universal Rack PDU w/South Africa LC39Y8957DPI Universal Rack PDU w/UK LC39Y8958DPI Universal Rack PDU with AS/NZ LC39Y8959DPI Universal Rack PDU w/China LC39Y8962DPI Universal Rack PDU (Argentina)39Y8960DPI Universal Rack PDU (Brazil)39Y8961DPI Universal Rack PDU (India)0U Basic PDUs46M4122IBM 0U 24 C13 16A 3 Phase PDU46M4125IBM 0U 24 C13 30A 3 Phase PDU46M4128IBM 0U 24 C13 30A PDU46M4131IBM 0U 24 C13 32A PDU46M4140IBM 0U 12 C19/12 C13 60A 3 Phase PDU46M4143IBM 0U 12 C19/12 C13 32A 3 Phase PDURack cabinetsThe server supports the rack cabinets listed in the following table. Tower-to-Rack Conversion Kit (part number 69Y0893, 5Ux26" Tower to Rack Conversion Kit for x3400/x3500) is required for the server to be installed in a rack.Table 26. Rack cabinetsPart number Description69Y08935Ux26" Tower to Rack Conversion Kit for x3400/x3500201886X IBM 11U Office Enablement Kit14102RX IBM eServer Cluster 25U Rack93072PX IBM 25U Static S2 Standard Rack93072RX IBM 25U Standard Rack93074RX IBM 42U Standard Rack93074XX IBM 42U Standard Rack Extension14104RX IBM 42U S2 standard rack93084EX IBM 42U Enterprise Expansion Rack93084PX IBM 42U Enterprise Rack93604EX IBM 42U 1200 mm Deep Dynamic Expansion Rack93604PX IBM 42U 1200 mm Deep Dynamic Rack93614EX IBM 42U 1200 mm Deep Static Expansion Rack93614PX IBM 42U 1200 mm Deep Static Rack93624EX IBM 47U 1200 mm Deep Static Expansion Rack93624PX IBM 47U 1200 mm Deep Static RackFor more information, see the IBM 47U and 42U 1200mm Deep Racks at-a-glance guide, available from: /abstracts/tips0796.html?OpenTrademarksLenovo and the Lenovo logo are trademarks or registered trademarks of Lenovo in the United States, other countries, or both. A current list of Lenovo trademarks is available on the Web athttps:///us/en/legal/copytrade/.The following terms are trademarks of Lenovo in the United States, other countries, or both:Lenovo®BladeCenter®RackSwitchServeRAIDServerGuideServerProven®System x®The following terms are trademarks of other companies:Intel® and Xeon® are trademarks of Intel Corporation or its subsidiaries.Linux® is the trademark of Linus Torvalds in the U.S. and other countries.Microsoft®, Windows Server®, and Windows® are trademarks of Microsoft Corporation in the United States, other countries, or both.Other company, product, or service names may be trademarks or service marks of others.。

1973年多式联运单证统一规则 UNIFORM RULES FOR A COMBINED TRANSPORT DOCUMENT, 1973

1973年多式联运单证统一规则 UNIFORM RULES FOR A COMBINED TRANSPORT DOCUMENT, 1973
1973年多式联运单证统一规则 UNIFORM RULES FOR A COMBINED TRANSPORT DOCUMENT, 1973
颁布日期:19730101 实施日期:19750101
INTRODUCTION
The single mode tradition
(ii) by the ICC Rules when the loss or damage is "concealed",i. e. cannot be attributed to a particular stage of transport (cf. Rules11 and 12).
(b) The liability for delay has to be governed in all cases by thesingle mode rules regarding delay, where such single mode rules exist,applying to the stage of transport where the delay occurred (cf. Rule 14).Nevertheless, the Rules do not preclude the voluntary acceptance by theCTO of a greater responsibility or obligation than that outlined above.Forward Looking
The Rules are also forward looking, in that they take note of theincreasing tendency to replace negotiable documents of title, which mustbe surrendered at destination before the goods may be delivered, bynon-negotiable documents, whereby delivery is made to a consignee named inthe document without the need to surrender any document, and provide forthe issue of the CT document in either negotiable form, or innon-negotiable form.

17导丝

17导丝

Hi-Torque Progress ® 14 ® Hi-Torque Spartacore 14
AV Overview for Physician Customers International 4 AP2929550, Rev. A Information contained herein for distribution outside the U.S. only and may not be reproduced, distributed, or excerpted. Images include artists’ renditions – not representative of Abbott Product. © 2009 Abbott
2
014” DURASTEEL, high tensile stainless steel Intermediate black polymer sleeve with TURBOCOAT
Distal Coating
Proximal Coating (3)
4
TURBOCOAT, hydrophilic coating
TURBOCOAT
AV Overview for Physician Customers International 9 AP2929550, Rev. A Information contained herein for distribution outside the U.S. only and may not be reproduced, distributed, or excerpted. Images include artists’ renditions – not representative of Abbott Product. © 2009 Abbott

华为:客户接待项目管理表

华为:客户接待项目管理表
supervisor李四项目赞助人a国代表处项目赞助sponsor张三项目经理vip客户接总体负责manager待策划处王五项目核心成员a国代表处客户关系coreteam赵六项目核心成员gts重大项coreteam目部吴丹项目核心成员供应链管理供应链支持coreteam部刘峰项目核心成员psmt固网研发支持coreteam产品线张芳项目核心成员客户工程部客户接待coreteamxxx项目非核心成员vip客户接接待策划extendedteam待策划处xxx项目非核心成员固网产品国产品技术支extendedteam际行销部持xxx项目非核心成员gts重大项技术服务支extendedteam目部持xxx项目非核心成员供应链管理供应链支持extendedteam部xxx项目其他人员a国代表处客户关系otherpersonelxxx项目其他人员客户工程部客户接待otherpersonel签字
责任人 Risk owner 李四 X三 赵六
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X芳
开放/关闭 Open/closed
OPEN OPEN OPEN OPEN
OPEN
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一、项目基本情况 I. Project Basic Info
项目名称 project name:
T 客户考察公司
制作人 prepared by:
X芳
5.2
后续事宜跟
代表处主管回访
5.3

代表处反馈考察效果
3
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计算机的常见英文缩写

计算机的常见英文缩写

计算机常用英文缩写3DPA—3D Positional Audio—3D定位音频3DS—Three Dimension Studio—三维摄影室AAT—Average Access Time—平均存取时间ABS—Auto Balance System—自动平衡系统AC—Alternating Current—交流电ACOPS—Automatic CPU Overheat Prevention System—自动CPU过热预防系统ACPI—Advanced Configuration And Power Interface—高级配置与电源接口ADC—Analog To Digital Convent—模数转换器ADIMM—Advanced Dual In-line Memory Modules—高级双重内嵌式内存模块ADO—Active* Data Object—Active*数据对象ADSL—Asymmetric Digital Subscriber Line—非对称数字用户路线AE—Atmospheric Effect—雾化效果AGP—Accelerated Graphics Port—加速图形接口AGU—Address Generation Unit—地址产生单元AHA—Accelerated Hub Architecture—加速中心架构AH—Authentication Header—鉴定头文件AI—Artificial Intelligence—人工智能AL—Artificial Life—人工生命ALU—Arithmetic Logic Unit—算术逻辑单元ANSI—American National Standard Institute—美国国家标准协会AOL—American Online—美国在线APIC—Advanced Programmable Interrupt Controller—高级程序中断控制器APM—Advanced Power Management—高级电源管理APP—Accelerated Parallel Processing—AMD加速并行处理技术APPE—Advanced Packet Parsing Engine—高级数据包解析引擎ARP—Address Resolution Protocol—地址解析协议ASC—Anti Static Coating—防静电涂层ASCII—American Standard Code For Information Interchange —美国信息交换标准代码ASIC—Application Specific Integrated Circuit—特殊应用集成电路AST—Average Seek Time—平均寻道时间ATAPI—Advanced Technology Attachment Packet Interface—高级技术附加数据包接口ATC—Access Time From Clock—时钟存取时间ATL—Active* Template Library—Active*模版库ATM—Asynchronous Transfer Mode—异步传输模式AV—Analog Video—模拟视频AVI—Audio Video Interleave—音频视频插入B2C—Business To Custom—商家对客户BASIC—Beginner—All-Purpose Symbolic Instruction Code—初学者通用符号指令代码BBS—Bulletin Board System—公告牌系统BCF—Boot Catalog File—启动目录文件BGA—Ball Grid Array—球栅阵列BIF—Boot Image File—启动映像文件BIOS—Basic Input Output System—根本输入输出系统BIS—Boot Integrity Service—启动整体效劳BMS—Black Matri* Screen—超黑矩阵屏幕BOPS—Billion Operation Per Second—十亿次计算每秒BPT—Branch Prediction Table—分支预测表BPU—Branch Processing Unit—分支处理单元BTB—Branch Target Buffer—分支目标缓冲CAD—Computer Aided Design—计算机辅助设计CAE—Computer Aided Engineering—计算机辅助工程CAI—Computer Aided Instruction—计算机辅助教学CAM—Common Access Mode—公共存取模型CAM—Computer Aided Manufacturing—计算机辅助制造CBIC—Cell based Integrated Circuit—基于单元的集成电路CC—Companion Chip—同伴芯片CCD—Charge Coupled Dvice—电流连接设备CCM—Call Control Management—拨号控制管理CC-NUMA—Cache Coherent Non Uniform Memory Access—连贯缓冲非统一内存寻址CCT—Clock Cycle Time—时钟周期CDMA—Code Division Multiple Access—码分多址CDR—Compact Disc Recordable—可刻录光盘CD-ROM—Compact Disc Read Only Memory—光驱CD-RW—Compact Disc Rewriter—刻录机CDSL—Consumer Digital Subscriber Line—消费者数字订阅线路CE—Consumer Electronic—消费电子CEM—Cube Environment Mapping—立方环境映射CEO—Chief E*ecutive Officer—首席执行官CG—Computer Graphic—计算机生成图像CGI—Common Gateway Interface—通用网关界面CHRP—Common Hardware Reference Platform—公用硬件平台CIEA—Commercial Internet E*change Association—商业英特网交易协会CIR—Committed Information Rate—约定信息速率CISC—Comple* Instruction Set Computing—复杂指令集计算机CLV—Constant Linear Velocity—恒定线速度CMOS—Complementary Metal O*ide Semiconductor—互补金属氧化物半导体存储器COB—Cache On Board—板上集成缓存COD—Chip On Board—芯片内集成缓存COM—Component Object Model—组件对象模型COO—Chief Organization Officer—首席管理官CPGA—Ceramic Pin Grid Array—陶瓷针形栅格阵列CPLD—Comple* Programmable Logic Device—复杂可编程逻辑器件CPS—Characters Per Second—每秒字符数CPU—Central Processing Unit—中央处理器CRC—Cyclical Redundancy Check—循环冗余检查CRM—Custom Relationship Management—客户关系管理CRT—cathode Ray Tube—阴极射线管CSE—Configuration Space Enable—可分配空间CSS—Cascading Style Sheets—层叠样式表CTO—Chief Technology Officer—首席技术官CTS—Carpal Tunnel Syndrome—腕管综合症CUDA—Computer Unified Device Architecture—计算机统一装置构造CVS—Computer Visual Syndrome—计算机视觉综合症DAC—Dual Address Cycle—双重地址周期DAE—Digital Audio E*traction—数字音频抓取DB—Deep Buffer—深度缓冲DCD—Dynamic Content Delivery—动态内容推送DC—Domain Controller—域控制器DCE—Data Communication Equipment—数据通信设备DCOM—Distributed Component Object Model—分布式组件对象模型DCT—Display Compression Technology—显示压缩技术DDC—Display Data Chanel—显示数据通道DDN—Digital Data Network—数字数据网DDR—Double Data Rate—双倍速率DDSS—Double Dynamic Suspension System—双层动力悬吊系统DEC—Direct Etching coating—外表蚀刻涂层DES—Data Encryption Standard—数据加密标准DFP—Dynamic Feedback Protocol—动态反响协议DHCP—Dynamic Host Configuration Protocol—动态主机配置协议DIB—Dual Independent Bus—双独立总线DIC—Digital Image Controller—数字图像控制DIMM—Dual Inline Memory Module—双列直插内存模块DIP—Double In-line Package—双列直插式封装DIR—Direct Infrastructure rendering—基层直接渲染DLL—Dynamic Link Library—动态数据链接库DLP—Digital Light Process—数字光处理DME—Direct Memory E*ecute—直接内存执行DMI—Desktop Management Interface—桌面管理界面DMI—Dynamic Method Invocation—动态方法调用DNS—Digital Nervous System—数字神经系统DNS—Domain Name System—域名系统DOS—Disk Operating System—磁盘操作系统DP—Dual Processor—双处理器DPI—Dots Per Inch—每英寸点数DPMS—Display Power Management Signal—显示能源管理信号DQL—Dynamic Quadrapole Lens—动态四极镜DRC—Design Rule Check—设计规则检查DSD—Direct Stream Digital—直接比特流数字DSL—Digital Subscriber Line—数字用户专线DSP—Digital Signal Processing—数字信号处理DST—Drive Self Test—驱动自检程序DTD—Document Type Definition—文件类型定义DTE—Digital Terminal Equipment—数据终端设备DVD—Digital Versatile Disc—数字多功能光DVD—Digital Video Disc—数字视频光盘DVD-RAM—Digital Versatile Disc Random Access Memory—DVD随机存储器DVI—Digital Video Interface—数字视频接口E3—Electronic Entertainment E*po—美国E3大展EA*—Environment Audio E*tension—环境音效扩展EB—E*pansion Bus—扩展总线EBR—E*cess Burst Rate—超频突发速率ECC—Elliptical Curve Crypto—椭圆曲线加密EC—Embedded Controller—嵌入式控制ECP—E*tended Capabilities Port—扩展并行口ECTS—European Computer Trade Show—欧洲计算机商贸展示会EDIF—Electronic Design Interchange Format—电子设计交换格式EEPROM—Electrically Erasable Programmable Read Only Memory—电擦可编程只读存储器EFEAL—E*tension Field Elliptically Aperture Lens—可扩展扫描椭圆孔镜头EIDE—Enhanced Integrated Driver Electronic—增强电子集成驱动器EISA—Enhanced Industry Standard Architecture—增强工业标准架构EMI—Electromagnetic Interference—电磁干扰EMP—Emergency Management Port—紧急事情管理端口EPP—Enhanced Parallel Port—增强并行口EPU—Energy Processing Unit—能耗调控单元ERC—Electronic Rule Check—电气规则检查ERP—Enterprise Resource Planning—企业资源方案ERP—Estimated Retail Place—估计零售价ESCD—E*tended System Configuration Data—扩展系统配置数据FADD—Floating Addition—浮点加FAT—File Allocation Table—文件分配表FBC—Frame Buffer Cache—帧缓冲缓存FCPGA—Flip Chip Pin Grid Array—反转芯片针脚栅格阵列FDBM—Fluid Dynamic Bearing Motor—液态轴承马达FDC—Floppy Disk Controller—软盘控制装置FDD—Floppy Disk Drive—软盘FDIV—Floating Divided—浮点除FDM—Frequency Division Multiple*ing—频分多路复用FIR—Finite Impulse Response—有限推进响应FMUL—Floating Multiplication—浮点乘FMV—Full Motion Video—全动态影像FPGA—Filed Programmable Grate Array—现场可编程门阵列FPS—First Person Shooting—第一人称射击FPU—Floating Processing Unit—浮点运算单元—Frames Per Second—每秒传输帧数FRICC—Federal Research Internet Coordinating Committee—联邦调查因特网协调委员会FSAA—Full Scene Anti—aliasing—全景抗锯齿FSE—Frequency Shifter Effect—频率转换效果FSM—Finite Status Machine—有限状态机FSUB—Floating Subtraction—浮点减FTP—File Transfer Protocol—文件传输协议FWH—Firmware Hub—固件中心GDI—Graphic Device Interface—图形设备接口GIF—Generalized Timing Formula—一般程序时间GMCH—Graphic Memory Control Hub—图形内存控制中心GMR—Giant Magneto Resistive—巨型磁阻GPF—Generation Protection Fault—一般保护性错误GPS—Global Positioning System—全球定位系统GPU—Graphic Processing Unit—图形处理器GSM—Global System For Mobile Communication—全球移动通讯系统GUI—Graphical User Interface—图形用户界面GVPP—Generic Visual Perception Processor—常规视觉处理器HAL—Hardware Abstraction Layer—硬件抽象化层HCI—Host Control Interface—主机控制接口HCT—Hardware Compatibility Test—硬件兼容性测试HDA—Head Disk Assembly—磁头集合HDCP—High-Bandwidth Digital Content Protection—高带宽数字内容保护HDD—Hard Disk Drive—硬盘HDL—Hardware Description Language—硬件描述语言HDMI—High Definition Multimedia Interface—高清晰度多媒体接口HDSL—High-Speed Digital Subscriber Line—高速率数字用户路线HDTV—High Definition TV—高清电视HEL—Hardware Emulation Layer—硬件模拟层HiFDA—High_Capacity Floppy Disk—高容量软盘HMOS—High Performance Metal O*ide Semiconductor—高性能金属氧化物半导体HPA—High Power Amplifier—高功率放大器HPS—High Performance Server—高性能效劳器HPW—High Performance Workstation —高性能工作站HRIF—Head Related Transfer Function—头部关联传输功能HTML—Hyper Te*t Markup Language—超文本标志语言HTPC—Home Theater Personal Computer—家庭影院电脑HTTP—Hyper Te*t Transmission Protocol—超文本传输协议HUD—Head Up Display—平视显示器IA—Intel Architecture—英特尔架构ICD—Installable Client Drive—可安装客户端驱动程序ICMP—Intel Control Message Protocol—英特尔控制报文协议ICU—Instruction Control Unit—指令控制单元IDCT—Inverse Discrete Cosine Transfer—非连续反余弦变换IDF—Intel Developer Forum—因特尔开发者论坛IEEE—The Institute Electrical And Electronic Engineerings—美国电气和电子工程师协会IETF—Intel Engineer Task Force—因特网工程任务组IEU—Integer E*cute Unit—整数执行单元IID—Interaural Intensity Difference—两侧声音强度差异IIR—Infinite Impulse Response—无限推进响应IIS—Internet Information Service—互联网信息效劳IKE—Intel Key E*change—因特网密钥交换协议IMM—Intel Mobil Module—因特尔移动模块IP—Internet Protocol—互联网协议IPPR—Image Processing And Pattern Recognition—图像处理和模式识别IPS—In Plane Switching—平面转换IRC—Internet Relay Chat—互联网接力聊天IRQ—Interrupt Request—中断请求IRST—Intel Rapid Storage Technology—英特尔快速存储技术ISA—Industry Standard Architecture—工业标准构造ISA—Instruction Set Architecture—指令集架构ISDN—Integrated Service Digital Network—综合效劳数字网络IS—Internal Stake—内置堆栈ISO—International Standard Organization—国际标准化组织ISP—Intel Service Provider—因特网效劳供给商JIT—Just In Time—准时制生产JVM—Java Virtual Machine—Java虚拟机KBC—Keyboard Controller—键盘控制器LBA—Logical Block Addressing—逻辑块寻址LCD—Liquid Crystal Display—液晶显示屏LCM—LCD Module—LCD显示模组LCOS—Liquid Crystal On Silicon—硅上液晶LDAP—Lightweight Directory Access Protocol—轻权目录访问协议LDT—Lighting Data Transport—闪电数据传输LED—Light Emitting Diode—发光二极管LF—Linear Filtering—线性过滤LMDS—Local Multipoint Distributed System—局域多点分布式系统LPM—Library Parameterized Module—参数化模块库LTE—Long Term Evolution—长期演进LVDS—Low Voltage Differential Single—低压差分信号LVS—Layout Versus Schematic—幅员原理图比照MAC—Media Access Controller—介质访问控制MALS—Multi Astigmatism Lens System—多重散光聚焦系统MB—Motherboard—主机板MDC—Mobile Daughter Card—移动式子卡MFC—Microsoft Foundation Classes—微软根底库MFD—Multi Function Device—多功能设备MIDI—Musical Instrument Digital Interface—乐器数字接口MIME—Multipurpose Internet Mail E*tension—多用途因特网邮件扩展协议MIOC—Memory And I/O Bridge Controller—内存和I/O桥控制器MiPad—Multimodal Interactive Notepad—多语态互动式记事本MIS—Management Information System—管理信息系统MMVF—Multi-Media Video File—多媒体视频文件MPEG—Moving Picture E*pert Group—运动图像专家组MPP—Massive Parallel Processing—巨量平行处理MPS—Multi Processor Specification—多重处理器标准MRP—Manufacturing Resource Planning—制造资源方案MRW—Midrange Workstation—中型工作站MSI—Microsoft Installer—微软安装程序MS—Magnetic Sensor—磁场感应器MSN—Microsoft Network—微软网络MSP—Media Stream Processor—媒体流处理器MTBF—Mean Time Before Failure—平均故障时间MTH—Memory Transfer Hub—内存转换中心MUD—Multiple User Dungeon—多用户地牢NAOC—No-Account Overclock—无效超频NAS—Network Attached Storage—网络连接式存储NAT—Network Area Translation—网络地址转换NBC—North Bridge Chip—北桥芯片NDIS—Network Driver Interface specification—网络驱动接口标准NDS—Novell Directory Service—网威目录效劳NE—Netlist E*tract—网表提取NIC—Network Interface Card—网络接口卡NNTP—Network News Transport Protocol—网络新闻传输协议NPC—Non Player Character—非玩着人物NT—New Technology—新技术OCR—Optical Character Recognition—光学字符识别OEM—Original Equipment Manufacturer—原始设备制造商OLGA—Organic Land Grid Array—基板栅格阵列OOP—Object Oriented Programming—面向对象的程序设计OPT—Optimized Production Technology—优化生产技术OS—Operating System—操作系统PCAV—Part Constant Angular Velocity—局部恒定角速度PCB—Printed Circuit Board—印刷电路板PCI—Peripheral Component Interconnect—外围装置连接端口PC—Personal Computer—个人计算机PC—Perspective Correction—透视纠正PDA—Personal Digital Assistant—个人数字助理PDS—Public Directory Support—公众目录支持PE—Parameter E*tract—参数提取PGC—Parallel Graphic Configuration—并行图像设置PIB—Processor In a Bo*—盒装处理器PIC—Programmable Interrupt Controller—可编程中断控制器PICS—Platform For Internet Content Selection—英特网内容选择平台PIM—Personal Information Management—个人信息管理系统PLCC—Plastic Leadless Chip Carrier—塑料无引脚芯片载体PLD—Programmable Logic Device—可编程逻辑器件PLL—Phase Locked Loop—锁相环PNP—Plug And Play—即插即用POF—Polymer Optical Fiber—聚合体光纤POST—Power On Self Test—开机自检PPM—Pages Per Minute—每分钟打印页数PPTP—Point To Point Tunneling Protocol—点对点通道协议PQFP—Plastic Quad Flat Package—塑料方型扁平式封装PRML—Partial Response Ma*imum Likelihood—最大可能局部反响PSK—Pre-Shared Key—预共享密钥PSN—Processor Serial Numbers—处理器序列号PSU—Power Supply Unit—计算机电源PSW—Program Status Word—程序状态字P*E—Per-boot E*ecution Environment—预启动运行环境QBM—Quad Band Memory—四倍边带内存QOS—Quality Of Service—效劳质量QPA—Quad Port Acceleration—四倍接口加速RADSL—Rate Adaptive Digital Subscriber Line—速率自适应数字用户路线RAM—Random Access Memory—内存〔随机存储器〕RARP—Reverse Address Resolution Protocol—反相地址解析协议RDF—Resource Description Framework—资源描述框架RISC—Reduced Instruction Ser Computing—精简指令集计算机RMA—Real Media Architecture—实媒体架构RNG—Random Number Generator—随即数字发生器ROB—Reorder Buffer—重新排列缓存区RPG—Role Playing Game—角色扮演游戏RPM—Revolution Per Minute—每分钟转数RRVP—Resource Reser Vation Protocol—资源保存协议RSD—Removable Storage Device—移动式存储设备RSDS—Reduced Swing Differential Single—小幅度摆动差动信号RTC—Real Time Clock—实时时钟RTL—Register Transmit Level—存放器传输级RTSP—Real Time Streaming Protocol—实时流协议RTS—Real Time Strategy—即时战略RTS—Request To Send—需求发送SAM—Sales Available Market—可出售市场SAP—Sideband Address Port—边带寻址端口SATA—Serial Advanced Technology Attachment—串行高级技术附件SBC—South Bridge Chip—南桥芯片SBFS—Sample Boot Flag Specification—简单引导标记标准SCSI—Small Computer System Interface—小型计算机系统接口SC—Static Core—静态内核SCT—Software Compatibility Test—软件兼容性测试SDK—Software Development Kit—软件开发工具包SDRAM—Synchronous Dynamic Random Access Memory—同步动态随机存储器SDTV—Standard Definition Television—标准清晰度电视SEC—Single Edge Connector—单边连接器SEM—Spherical Environment Mapping—球形环境映射SET—Secure Electronic Transaction—平安电子交易SGML—Standard Generalized Markup Language—标准通用标记语言SIMD—SIngle Instruction Multi Data—单指令多数据SIV—System Information Viewer—系统信息观察SLI—Scanline Interleave—扫描线间插SMART—Self-Monitoring Analysis And Reporting Technology —自动检测、分析和报告技术SMB—System Management Bus—系统管理总线SMD—Surface Mount Device—外表安装设备SMIL—Synchronous Multimedia Integrated Language—同步多媒体集成语言SMIP—Simple Mail Transfer Protocol—简单邮件传输协议SMI—System Management Interrupt—系统管理中断SMM—System Management Mode—系统管理模式SMP—Symmetric Multi-Processing—对称式多重处理器架构SNMP—Simple Network Management Protocol—简单网络管理协议SNR—Single To Noise Rate—信噪比SOAC—System ON A Chip—系统集成多功能芯片SOC—System On Chip—片上系统SOI—Silicon On Insulator—绝缘体硅片SOS—Server Operating Systems—效劳器操作系统SPD—Serial Presense Detect—串行存在检查SPEC—System Performance Evaluation Check—系统性能评估测试SPS—Shock Protection System—震动保护系统SP—Stack Pointing—堆栈指针SQRC—Square Root Calculation—平方根计算SRA—Symmetric Rendering Architecture—对称渲染架构SRR—Segment Register Rewrite—区段存放器重写SRS—Sound Retrieval System—声音修复系统SSB—Super South Bridge—超级南桥芯片SSD—Solid State Disk—固态硬盘SSE—Streaming SIMD E*tensions—单一指令多数据流扩展SSI—Small Scall Integration—小规模集成STB—Set Top Bo*es—电视顶置盒STD—Suspend To Disk—磁盘唤醒STR—Suspend To RAM—内存唤醒STS—Switched Internet working Service—交换式网络互联效劳SUA—Single User Account—单用户账号SVR—Switching Voltage Regulator—交换式电压调节TCA—Twin Cache Architecture—双缓冲构造TCO—Total Cost Of Ownership—拥有总本钱TCP—Transmission Control Protocol—传输控制协议TCP—Transmission Control Protocol—传输控制协议TDP—Thermal Design Power—散热设计功耗TFT—Thin Film Transistor—薄膜晶体管TLB—Translate Look Side Buffers—翻译旁视缓冲器TOP—The Olympic Partner—奥林匹克全球合作伙伴TPS—Transactions Per Second—每秒处理事项数TQM—Total Quality Management—全面质量管理UART—Universal Asynchronous Receive/Transmitter—通用异步收发器UCC—Ultra Clear Coating—超清晰涂层UDMA—Ultra Direct Memory Access—高级直接内存访问UDP—User Datagram protocol—用户数据报协议UDP—User Datagram Protocol—用户数据报协议ULS—User Location Service—用户定位效劳UPA—Ultra Port Architecture—超级端口构造UPS—Uninterrupted Power Supply—不连续电源USB—Universal Serial Bus—通用串行总线USDM—Unified System Diagnostic Manager—统一系统检测管理USWC—Uncacheabled Speculative Write Combination—无缓冲随即联合写操作VALU—Vector Arithmetic Logic Unit—向量算术逻辑单元VBI—Vertical Blanking Interval—垂直空白间隙VCMA—Virtual Channel Memory Architecture—虚拟通道内存构造VDM—Windows Driver Model—视窗驱动程序模块VDSL—Very-high-bit-rate Digital Subscriber Loop—甚高速数字用户环路VDT—Video Display Terminal—视频显示终端VESA—Video Electronic Standard Association—视频电子标准协会VFAT—Virtual File Allocation Table—虚拟文件分配表VFM—Wired For Management—有线管理VGA—Video Graphics Array—视频图形阵列VID—Voltage Identification Definition—电压识别认证VIP—Video Interface Port—视频接口VLIW—Very Long Instruction Word—超长指令集VLSI—Very Large Scale Integrated—超大规模集成电路VOD—Video On Demand—视频点播VPN—Virtual Private Network—虚拟局域网VPU—Vector Permutate Unit—向量排列单元VQTC—Vector-Quantization Te*ture Compression—向量纹理单元VRE—Voltage Reduction Enhance—增强型电压调节VRML—Virtual Reality Makeup Language—虚拟现实构造化语言VRM—Voltage Regulator Module—电压调整模块VSA—Virtual System Architecture—虚拟系统架构VSIS—Video Single Standard—视频信号标准V*ML—Voice E*tensible Markup Language—语音扩展标记语言WAIS—Wide Area Information Service—广义信息效劳器WAN—Web Area Network—广域网WG—Wave Guide—波导合成Wi—Fi—Wireless Fidelity—无线保真WLAN—Wireless Local Area Network—无线局域网络WMI—Wired For Management Initiative—主动式管理线路WOL—Wake On Lan—局域网唤醒WPAN—Wireless Personal Area Network—无线个域网WSH—Windows Scripting Host—视窗脚本程序WWW—World Wide Web—万维网*SL—E*tensible Style Sheet Language—可扩展设计语言ZAM—Zero Administration For Windows—零管理视窗系统ECL—Emitter Couple Logic—射极耦合逻辑CAM—Content Addressable Memory—内容寻址存储器MIPS—Million Instruction Per Second—每秒处理百万级指令。

电子专业学术语英文缩写简称对照表

电子专业学术语英文缩写简称对照表

CC CCD CCD CCD CCF CCFL CCFL(CCFT) CCTV CCTV CD CD CDCA CDDI CDES CDMA CDMA CDMA CDR CDVCC CF CFM CIF CIS CISPR CLNP CLP CM CM CM CMI CMISE CMOS CMRS CMTS COB
算术逻辑单元 模拟用户线单元 调幅 管理模块 隔位标志翻转 接入网 美国国家标准学会 美国国家标准协会 全光网络指信号仅在进出网络时才进行电/光和光/电的变 All Optical Network 换,而在网络中传输和交换的过程中始终以光的形式存在。 Automatic Protection Switching 自动保护倒换 Access and Remote Control 接入和遥控 Automati Slope Control 自动斜率控制 American standard code for information interchange 美国信息交换标准码 Application-Specific Integrated Circuits 专用集成电路 Advanced Technology Attachment 高级技术附加装置 pulse code 脉冲码 Analogue Trunk Unit 模拟中继单元 Asynchronous Transfer Mode 异步传输模式 异步转移模式。将话音、图像、数据、视频等多种业务数字 Asynchronous Transfer Mode 化后转换成长度相同的分组(信元),包括信息域和元头, 根据元头的信息进行传送。 Asynchrous Transfer Mode 异步传送方式 Administration Unit 管理单元 AU Pointer Positive Justification 管理单元正指针调整 Administrative Unit Alarm Indication SignalAU 告警指示信号 Administration Unit Group 管理单元组 Loss of Administrative Unit Pointer AU指针丢失 AU Pointer Negative Justification 管理单元负指针调整 Administration Unit Pointer 管理单元指针 audio visual 声视,视听 Auchio &Video Control Device 音像控制装置 American Wire Gauge 美国线缆规格 Bridge Amplifier 桥接放大器 Building Automation & Control net 建筑物自动化和控制网络

2020-2021学年外研版英语必修第三册Unit2课时作业

2020-2021学年外研版英语必修第三册Unit2课时作业

Period One Starting out & Understanding ideasⅠ. 单词拼写1.The US military is in (有效的) control of the entire region.2.If most breadwinners (捐赠) a day's pay to Project Hope, then it will be hopeful.3.With a flash of (顿悟) I realized what the dream meant.4.I finally managed to (说服) her to go out for a drink with me.5.The(现实) is that young people will not go into teaching until salaries are higher.6.Failure hurts grown-ups and children, but it can make a positive c to your life once you learn to use it.7.To our r, clothes and blankets have been distributed among the people in that earthquake-stricken area.8.The concert will raise f for research into AIDS.9.Lin Shuhao has e a good reputation at home and abroad for his excellent basketball skill and won over thousands of fans.10.There has been a severe s of medical supplies across the world since the outbreak of COVID-19.Ⅱ.单句填空1.American economists have made important (contribute) to the field offinancial and corporate economics.2.Telling your sorrow to your friends will (relief) the pain in your heart.3.When my name was called, he looked the room at me.4. costs a fortune to fly first class, which is why I usually travel second class.5.The person addicted to drugs has much difficulty (get) rid of the addiction.6.I'm so (grate) to all those volunteers because they helped my terrible day end happily.7.The new school is built on used to be a wasteland.8.Everyone broke laughter when they saw my haircut.9.I still remember the words my father often spoke the man who has made up his mind to win will never say “impossible”.10.Imagine the (joy) scene when they were uniting with their lost daughter. Ⅲ.短语填空1.Everyone can (产生影响) and every dollar counts. Please join us and donate some money to help earthquake victims.2.I (感激) my high school teachers, without whose help I wouldn't be so excellent.3.What is known to all is that up to now China (为……做出了贡献) preserving the peace.4.Thousands of screaming fans (出席) to welcome the champions home.5.He admitted that he had tried to (闯进) the shop during the night but had got stuck in the chimney.6.A foundation will (被建立) for the families of the firefighters who lost their lives in the fight against the big fire.7.Regular exercise is of benefit to our health; that is to say, our health can(从……中受益) it.8.She and her friends wanted to (公之于众) with their version of the incident.Ⅳ. 句型训练1.She was she came to give the medicine to the lonely old man every day.她每天给那个孤独的老人送药,她实在是太好了。

VITA 46

VITA 46

VITA 46 VITA 46 VITA 46 VITA 46 VITA 46
Who is Developing the VITA 46 Standard?

The following companies are VITA 46 Working Group participants:


COTS vendors that service a broad Defense & Aerospace customer base Defense and Aerospace customers voicing their future COTS needs All representing a solid membership for critical mass of the ecosystem
Boeing Dy 4 Systems Inc. FCI Foxconn Hybricon Corporation Mercury Computer Systems Naval Surface Warfare Center, Crane Division

Positronic Industries Radstone Technology Pentair/Schroff Tundra Semiconductor Tyco Electronics VISTA Controls
VME parallel bus
PCI parallel bus
3U PCI to VITA 46
VME64x VITA41
Possible heterogeneous backplanes shown with notional VITA46 connectors only

企业英文缩写大全

企业英文缩写大全

企业英文缩写大全5S : 整理(SEIRI)、整頓(SEITON)、清掃(SEISO)、清潔(SEIKETSU)及身美(SHITSUKE)五種行為ABC : 作業製成本制度(Activity-Based Costing)ABB : 實施作業制預算制度(Activity-Based Budgeting)ABM : 作業製成本管理(Activity-Base Management)APS : 先進規畫與排程系統(Advanced Planning and Scheduling)ASP : 應用程式服務供應商(Application Service Provider)ATP : 可承諾量(Available To Promise)AVL : 認可的供應商清單(Approved Vendor List)BOM : 物料清單(Bill Of Material)BPR : 企業流程再造(Business Process Reengineering)BSC : 平衡記分卡(Balanced ScoreCard)BTF : 計畫生產(Build To Forecast)BTO : 訂單生產(Build To Order)CPM : 要徑法(Critical Path Method)CPM : 每一百萬個使用者會有幾次抱怨(Complaint per Million)CRM : 客戶關係管理(Customer Relationship Management)CRP : 產能需求規劃(Capacity Requirements Planning)CTO : 客制化生產(Configuration To Order)DBR : 限制驅導式排程法(Drum-Buffer-Rope)DMT : 成熟度驗證(Design Maturing Testing)DVT : 設計驗證(Design Verification Testing)DRP : 運銷資源計畫(Distribution Resource Planning)DSS : 決策支援系統(Decision Support System)EC : 設計變更/工程變更(Engineer Change)EC : 電子商務(Electronic Commerce)ECRN : 原件規格更改通知(Engineer Change Request Notice)EDI : 電子資料交換(Electronic Data Interchange)EIS : 主管決策系統(Executive Information System)EMC : 電磁相容(Electric Magnetic Capability)EOQ : 基本經濟訂購量(Economic Order Quantity)ERP : 企業資源規劃(Enterprise Resource Planning)FAE : 應用工程師(Field Application Engineer)FCST : 預估(Forecast)FMS : 彈性製造系統(Flexible Manufacture System)FQC : 成品品質管制(Finish or Final Quality Control)IPQC : 制程品質管制(In-Process Quality Control)IQC : 進料品質管制(Incoming Quality Control)SPC : 統計制程管制(Statistic Process Control)TOC : 限制理論(Theory of Constraints)TPM : 全面生產管理Total Production ManagementTQC : 全面品質管制(Total Quality Control)TQM : 全面品質管理(Total Quality Management)WIP : 在製品(Work In Process)ABC Absolute Best Cost (is a procurement strategy to secure thebest costs for a part)AFR Annual Failure ReturnETD Estimated time of departure 估計出發時間ETA Estimated time of arriveAMO After Market OptionsWWAN (Wireless Wide Area Network) 是指傳輸範圍可跨越國家或不同城市之間的無線網路AN The product line code for MCD COMMERCIAL regionsAPJ Asia Pacific and JapanAPL Approved Partner ListFPC PCB" 柔性電路板(柔性RMAPCB): 簡稱"軟板", 又稱"柔性線路板", 也稱"軟性線路板、撓性線路板"或"軟性電路板、撓性電路板","FPCB, Flexible and Rigid-Flex". APO Advanced Planning OptimizationASN Advance Shipment NoticeASP Average Selling PriceATP Acknowledge to Production (order acknowledgement methodology) AUP Average Unit Price (sometimes used interchangeably with ASP)AV Refers to the Marketing Feature level of the BOM (2nd level). Is unique by family/platform/business modelAVL Approved Vendor ListAVLC Available Vendor List CandidateBCPL Blind Corporate Price List - When a product becomes "orderable" for the customerBDD Business Desktop Division - Is now defunct - the HP legacy busines desktop groupBOM Bill of MaterialBPN Business Products North America (Pre-Merger HP term for North America region…sometimes referred to as PPMD)BRD Business Requirements DocumentBRP Business Revenue PlanBT Build TriggerBTCO Build to Customer OrderBTO Build to OrderBTS Build-to-stock (situation where you ask factory to build units and stock FGI at their site before orders arrive)CDS Compal Direct ShipCFZ Code FreezeCIR Consumer IR(OEIC) 光電子集成電路CM Contract ManufacturersCNY Chinese New YearCO Customer Order (a term used in ICON - it is how daily demand is input into ICON) OR Change OrderCOA Certificate of Authenticity - most commonly refers to the Microsoft licensing label that is used on our PCsCRT 阴极射线管(Cathode Ray Tube)的显示器COGS Cost of Goods Sold (usually represented as a percentage of revenue) COS Cost of SalesCPB Company Performance BonusCPC Consumer PC Division - refers to the consumer desktop division based in Cupertino, CaliforniaCPL Corporate Price ListCPMO Region: China (refers to both their operations region and their regional manufacturing site)CPP Commodity Purchase PlanCPU Central Processing UnitCT Commodity TrackingCTO Configure to OrderCWSP Confirmed Weekly Shipment PlanDB Design BuildDC Distribution CenterDIB Drop in BoxDO Design Objective (Project or PLC Milestone - Establish Objectives of a project or new part)DoD Department of DefenseDOS Days of SupplyDR Delivery Request (An order placed by the region on the ODM for delivery)DRCD Driver CDDSM Demand Supply MatchingDSP Depot-Specific Supply Chain - ICON term to describe where/how a product is distributed in the MRP toolFW Firm wareECO Enterprise Core ObjectsECO Engineering Change OrderECR Engineering Change RecordEMEA Europe, Middle-East and Africa (is the Europe region)EOL End of LifeEPC Electronic Product Code (RFID technology provider)ESG Enteriprise Systems GroupEDID Extended Display Identification DATA,即扩展显示识别数据EURP End-User Replaceable PartsFCS First Customer ShipFCT Factory Cycle Time (measures the time it takes the factory to produce and ship the product once they have the ually measured in days) FDD Floppy Disk DriveFLC Factory Learning CurveFPU Factory Produce Unit (IPG term)FTO Flexible Time-off (HP term for vacation time)GBU General Base Unit (Pre-merger HP) OR…General Business Unit (new HP)GFI Go For Intro (PLC and project milestone - indicates this project is ready to start implementation)GPS Global Procurement ServicesHDD Hard Disk DriveHDCP (High-bandwidth Digital Content Protection)HOI HP-Owned InventoryHPD HP DirectHPS HP ServicesI/L Investigation to Lab (PLC milestone - freezes product definition)IDC Inventory Driven CostsIDP Individual Development PlanIDS International Direct ShipOOC Out of characterIES Inventec ChinaIPO International Procurement Organization - now called GPS in some entitiesIQDC Integrated Quality Data CollectionIUR IXXXX Unit RequestPP SAMPLE SP : 指產品的打樣制作;Sample PhasePP :指產品小批量試做;Production PhaseMP :指產品進入大量生產Mass PhaseIWT Inter Warehouse Transfer (a term used in ICON that gives the value of the demand plan per sku)KMAT Configurable Material (SAP term)KV The product line code for MCD RETAIL regionsKWL Keyboard Warning LabelLADO Region: Latin America (Latin America Distribution Organization) LCD Liquid Crystyal DisplayLCPL Live Customer Product List - product number and pricing visibleLi-ION Lithion-Ion: Battery technologyLT Lead TimeLTB Last Time Buy - is used when a component/product is going to become EOLMADP Most Accurate Demand PlanMAP Material Availability Plan OR Mobile Attainment Plan (used by Marketing Ops to outline the volumes we want to ship from a revenue standpoint)MAS Material Availbility Split - HP internal term to refer to our tool/process to support material availability visibility to the regionsMCD Mobile Computing Division (pre-merger HP Mobile Computing Division)MDL Module - is a MCD feature naming convention for Floppy Disk Drive or Optical Disk DriveMF Marketing ForecastMIR Mail In RebateMIT Multimedia Integration TestMOH Manufacturing OverheadMP Mass ProductionMR Manufacturing Release (PLC milestone - beginning of volume production)MRD Marketing Requirements DocumentMRP Materials Requirement PlanningMSP Master Shipment PlanMTD Month to DateMV Manufacturing ValidationNA Another name for North America COMMERCIALNACC North America Consumer Computing - refers to the NA consumer regionNAM North America RegionNB NotebookNiMH Nickel-Metal Hydride: Battery technology (boy…this is old!)NPI New Product IntroductionNRP Net Requirement PlanOCT Order Cycle TimeODD Optical Disk DriveODM Original Design ManufacturerOEM Original Equipment ManufacturerOH On-Hand (usually refers to inventory)OP Order ProcessingOPEC Oem Product data management External Collaboration for PSGOS Operating SystemOSS Outsourced serviceOT OvertimeOTS Observation Tracking SystemPCB Printed Circuit BoardPCBA Printed Ciruit Board AssemblyPDD Program Definition DocumentsPDG Product Data GenerationPDM BOM Data Warehouse System (Product Data Management) 產品資料管理系統PL Product LinePLC Product Life CyclePMC Pre-Merger CompaqPMH Pre-Merger Hewlett-PackardPMP Process Management PlanPNOP Part number on PartPO Purchase order订单pxe 網絡啟動模式POD Print On DemandTPM Total Productive Management全面生產管理POR Plan of Record (a general "roadmap" of a product that indicates estimated product forecast, features, etc.)PPMD Region: North America (Personal Information Products Manufacturing & Distribution) or BPN (see above)PRISM Preinstall Reengineering Initiative of Software Manufacturing PSDA Region: Asia PacificPSDE Region: EuropePSG Personal Systems GroupPTRPTT Post, Telegraph and Telephone AuthorityPV Product ValidationPWSP Preliminary Weekly Shipping PlanQBR Quarterly Business ReviewR10 SCITS Material Availability report (is at subassembly level)R11 SCITS Open Orders at the ODMR12 SCITS Shipments from the factoryR16 SCITS Factory BOMR5 SCITS Inventory reportRACDRACD Region Applicatioin CDRAD Reseller Arrival DatesRAM Random Access MemoryRAR Regional Allocation RulesRASRCD Recovery Compact Disc (Includes Windows, etc.)RCTO Regional Configure to Order - describes the SC postponement model where regionally-managed factories configure notebook unitsRDP Regional Demand PlanRFS Required for SetupRICAR Regional Inventory Cost Allocation Rules (used for allocating inventory costs back to the regions)RMN Regulatory Model NumberRMA Return(ed) Material AuthorizationROW Rest of WorldRQM Release Qual MatrixRSBT Radically Simple Better Together (Marketing Value Proposition for HP products)RSL Recommended Spares ListRSN Regional Supply Netting (solution until SNP)RT MCD code name for the US retail regionRTF Read This FirstRTP Release to Production - describes an order management methodology where orders are released only to available supplySA Subassembly (is the 3rd level of the BOM) and is the level at which regional DSM occursSCBO Supply Chain Business Operations (formerly PSDE, Europe region) SCITS Supply Chain Information Transfer Standard - the standard we use to transfer data between ODM, regions and GBUSCM Support Configuration MatrixSI System IntegrationSKU Stock-Keeping Unit (HP classic uses sku to refer to a model number) SKU Store Keeping UnitSLA Service Level AgreementSMB Small-Medium BusinessSMBC Small-Medium Business and ConsumerSMI Supplier Managed InventorySMT Surface Mounted Technology (used in motherboard preparation) SNP APO Module: Supply Network PlanningSOI Supplier-Owned InventorySR Ship Release (What the delivery engineers must do before a sku can be ordered by the regions)SRP SKU Reengineering ProcessST Sell-ThroughSVTP System Validation Test PlanSWMR Software Manufacturing Release (?)TAC Transfer at Cost - often refers to units we sell internally (for new employee equipemnt setup, etc)TAT Turn Around TimeTCE Total Customer ExperienceUAT User Acceptance TestUCUDF Unit Configuration User Defined Format, pre-CompeqUI User InterfaceVAR Value-Added ResellerVCM Variable Contribution MarginVMI Vendor Managed InventoryWDP Weekly Demand Plan (the same as Weekly Shipping Plan)WIF "What-if" demand - used primarily by NACC to describe their uncommitted demand scenarioWOS Weeks of SupplyWPTR Worldwide Product Tracking Record, pre-HPWSP Weekly Shipping PlanWWF Worldwide FulfillmentWWP Worldwide PlanningWWSNRS World Wide Serial Number Repository。

Fundamentalsandapplications

Fundamentalsandapplications

TUTORIAL 6Co-simulation of Power Systems and ICT:fundamentals and applicationsBackgroundIn Smart Grids, Information and Communication Technologies (ICT) are no-longer add-ons of the power system but they are an enabling technology. Co-simulation refers to the simultaneous simulation of power delivery and communications networks. At the time of this writing, very often each function is simulated separately with each study discipline assuming the other works perfectly. Obviously, this cannot always be the case. For example, a storm that disables part of the power grid may likewise destroy part of the communications system. Messages intended for devices that could restore all or part of the power system, and thus improve the reliability, may never arrive. Another example can be referred to the latency in the control sampling and communications that can adversely impact the expected behaviour of the power system, if the control and communications scheme is not correctly planned. Simulations capturing the operation and interactions of both systems will likely be needed to fully assess the potential reliability benefits and impacts. Interactive simulation utilizing existing distribution and cyber simulation platforms, or co-simulation, is a potential avenue for performing proper distribution studies. High-level technical and economic functions which are desirable in co-simulation tools should provide to simulate the operation of the power system, communications infrastructure and information technology control systems are provide in the following sections.Aim of the tutorialCo-Simulation based approaches should be utilized to develop, test and verify paradigms for next generation monitoring, control and operation of energy systems. The co- simulation approach usually involves the integration of two or more simulators to capture the cyber physical dependency of a process. The aim of the tutorial is offer attendees the basic of co-simulation with examples of applications in distribution systemsContent1.Introduction to co-simulation and applications for the simulation of distribution system(Fabrizio Pilo)2.Modeling of complex cyber-physical systems: concepts and methods (Peter Palensky)3.Scenario Design of Smart Grid Co-Simulations (Sebastian Lehnhoff)4.ICT and Power System Co-simulation for the analysis of networked control strategies indistribution systems (Alberto Borghetti)5.Applications of Cyber-physical simulation to active distribution networks (Emilio Ghiani) Expected benefitsParticipants will gain an improved understanding of the latest co-simulation methods and techniques as well as how they are being applied in various research fields in Energy systems. Emphasis will be given on the correct choice of models and time granularity for distribution planning and operation studies.Who should attendExperienced power engineers can improve background on ICT in Power Systems by embracing the most innovative techniques for the simulation of modern distribution systems. Young engineers can complete their fresh education on power and distribution engineering with topics that are not normally covered by standard curricula. Finally, the tutorial is also suited to PhD students that are working in the field of smart grids.Support materialA copy of all the presentation material used in the tutorial will be supplied to delegates.About the presenter(s)Alberto BORGHETTIAlberto Borghetti was born in Cesena, Italy, in 1967. He graduated (with honors) inelectrical engineering from the University of Bologna, Italy, in 1992. Since then he hasbeen working with the power system group of the same University, where he wasappointed Researcher in 1994 and Associate Professor in 2004. His research andteaching activities are in the areas of power system analysis, with particular reference tovoltage collapse, power system restoration after black-out, electromagnetic transients,optimal generation scheduling and distribution system operation. He is a Fellow of the Institute of Electrical and Electronics Engineers (class 2015) for contributions to modeling of power distribution systems under transient conditions. He serves as an Editor of IEEE Trans. on Smart Grid and is on the editorial board of Electric Power System Research.Emilio GhianiEmilio Ghiani received is Ph.D in Electrical Engineering and Computer Science in 2005 fromUniversity of Cagliari, where currently is an Assistant Professor of Power System at theDepartment of Electrical and Electronic Engineering (DIEE).His research focuses mainly on the development of methodologies and tools for decisionmaking process in planning and operation of power distribution networks with largepenetration of distributed energy sources.His research interests include co-simulation of power and communication system related to Smartgrid operation (e.g., automatic control of voltage and frequency, demand response and management of storage devices).He is author of more than 50 papers published on international journals or presented in various national and international conferences. He is IEEE and AEIT member.Sebastian LEHNHOFFSebastian Lehnhoff is a Professor for Energy Information Systems at the University of Array Oldenburg. He received his doctorate at the TU Dortmund University in 2009. Prof.Lehnhoff is a member of the executive board of the Energy R&D division at the OFFISInstitute for Information Technology. He is speaker of the special interest group …EnergyInformation Systems“ within the German Informatics Society (GI), assoc. editor of the IEEEComputer Society’s Computing and Smart Grid Special Technical Community as well asan active member of numerous committees and working groups focusing on ICT in future Smart Grids. His research interests are self-organizing energy systems, distribution grid automation as well as methods for in Co-Simulation and experimental design in energy system engineering. Prof. Lehnhoff is author of more than 100 papers, published in international journals or presented in national and international conferences.Fabrizio PILOFabrizio Pilo is Full Professor of Power Systems at the Department of Electrical and Array Electronic Engineering (DIEE) of the University of Cagliari from October 2014.He graduated in Electrical Engineering at the University of Cagliari in 1992 (magna cumlaude); in 1998 he earned the Ph.D. from the University of Pisa. In 1996 he becameAssistant Professor and in 2001 Associate Professor at DIEE. Fabrizio Pilo has 20 yearsexperience in the field of power distribution planning and development. He was one of theadvisors of the Italian Regulatory Agency with reference to the implementation of Smart Grid in the Italian power system. He is the Chairman of the CIRED Session 5, Distribution SystemDevelopment and Convener of the CIGRE WG C6.19 – Planning for Active Distribution Systems. He is IEEESenior Member and AEIT member. Prof. Pilo is author of more than 150 papers, published in international journals or presented in national and international conferences. He is registered professional engineer and consultant.Peter PALENSKYPeter Palensky is Professor for intelligent electric power grids at TU Delft, Netherlands, andPrincipal Scientist for Complex Energy Systems at the Austrian Institute of Technology (AIT)/ Energy Department, Austria. Before that he was Head of Business Unit ”SustainableBuilding Technologies” at the AIT, CTO of Envidatec Corp., Hamburg, Germany, associateProfessor at the University of Pretoria, South Africa, Department of Electrical, Electronic andComputer Engineering, University Assistant at the Vienna University of Technology, Austria,and researcher at the Lawrence Berkeley National Laboratory, California. He is active ininternational committees like ISO, IEEE and CEN, and is associate editor for the IEEE Transactions on Industrial Informatics. His main research field is complex energy systems.___________________________。

英语作业

英语作业
Dfull of
正确答案:B
学生答案:B得分:2分
解析:
25
2分
He said that he ____________to the United States.
Ahad never been
Bhad never gone
Cwas never
Dhas never been
正确答案:A
学生答案:A得分:2分
Bnot make
Cnot to make
Dnor to make
正确答案:C
学生答案:C得分:2分
解析:
12
2分
If you____________quiet, I'll tell you what happened.
Abe
Bare to be
Care
Dwill be
正确答案:C
学生答案:D得分:0分
18
2分
We all know knowledge begins ___ practice.
Aat
Bfrom
Cin
Dwith
正确答案:D
学生答案:D得分:2分
解析:
19
2分
If you refuse to go to the party,____________.
Aso would she
Bso does she
DGood idea.
正确答案:B
学生答案:B得分:2分
解析:
4
2分
No one can avoid ____________by advertisements.
Ato be influenced
Bbeing influenced

操作系统概念第六版重点部分中文答案

操作系统概念第六版重点部分中文答案

1.1 What are the three main purposes of an operat ing system?1 To provide an en vir onment for a computer user to execute programs on computerhardware in a convenient and ef ?cie nt manner.2 To allocate the separate resources of the computer as n eeded to solve the problemgive n. The allocati on process should be as fair and ef ?cie nt as possible.3 As a control program it serves two major functions: (1) supervision of the execution of user programs to preve nt errors and improper use of the computer, and (2) man age- ment of the operati on and con trol of I/O devices.环境提供者,为计算机用户提供一个环境,使得能够在计算机硬件上方便、高效的执行程序资源分配者,为解决问题按需分配计算机的资源,资源分配需尽可能公平、高效控制程序监控用户程序的执行,防止岀错和对计算机的不正当使用管理I/O设备的运行和控制1.2 List the four steps that are n ecessary to run a program on a completely dedicatedmachi ne.An swer: Gen erally, operati ng systems for batch systems have simpler requireme nts tha n for pers onal computers. Batch systems do not have to be con cer ned with in teract ing with a useras much as a personal computer. As a result, an operating system for a PC must be concernedwith resp onse time for an in teractive user. Batch systems do not have such requireme nts.A pure batch system also may have not to handle time sharing,whereas an operating systemmust switch rapidly betwee n differe nt jobs.木有找到中文答案1.6 Define the esse ntial properties of the follow ing types of operat ing systems:a. Batchb. In teractivec. Time shar ingd. Real timee. Networkf. Distributeda. Batch. Jobs with similar n eeds are batched together and run through the computer as a group by an operator or automatic job seque ncer. Performa nee is in creased by attempting to keep CPU and I/O devices busy at all times through buffering, off-line operati on, spooli ng, and multiprogram ming. Batch is good for executi ng large jobs that need little interaction; it can be submitted and picked up later.b. In teractive. This system is composed of many short tran sacti ons where the results of the n ext tran sacti onmay be un predictable. Resp onse time n eeds to be short (sec on ds) since the user submits and waits for the result.c. Time shar in g.Thissystemsuses CPU scheduli ng and multiprogram ming to provide econo mical in teractive use of a system. The CPU switches rapidly from one user toano ther. In stead of hav ing a job de? ned by spooled card images, each program readsits next control card from the terminal, and output is normally printed immediately to the scree n.d. Real time. Often used in a dedicated application, this system reads information fromsen sors and must resp ond with in a ?xed amou nt of time to en sure correct perfor-man ce.e. Network.f. Distributed.This system distributes computati on among several physical processors.The processors do not share memory or a clock. In stead, each processor has its own local memory. They commu ni cate with each other through various commu ni cati on lin es, such as a high-speed bus or teleph one line.a. Batch相似需求的Job分批、成组的在计算机上执行,Job由操作员或自动Job程序装置装载;可以通过采用buffering, off-line operation, spooling, multiprogramming 等技术使CPU 禾口I/O不停忙来提高性能批处理适合于需要极少用户交互的Job。

宠物定时喂食器设计中英文翻译

宠物定时喂食器设计中英文翻译

The digital temperature sen sor of DS18B20The digital temperature sensor of DS18B20, This product uses the American DALLAS company's DS18B20 network digital temperaturesensor chip package.but become wear-resista nt touch, the physical volume is small, convenient, packagi ng form is varied , Suitable for all kinds of n arrow space in digital temperature test and con trol field equipme nt.Un ique 1-Wirer M in terface requires only one port pin for com muni cati on. Multidrop capability simplifies distributed temperature sensing applicati on s, requires no exter nal comp onents, Can be powered from data line. Power supply range is 3.0V to 5.5V, Zero standby power required, Measurestemperaturesfrom -55 °Cto+125 °C. Fahre nheit equivale nt is -67 °F to+257 °F 0.5 C accuracy from -10 °C to +85 °C, Thermometer resoluti on is programmablefrom 9 to 12 bits, Conv erts 12-bit temperature to digital word in750 ms (max.).User-definablenonvolatile temperature alarm sett in gs, Alarm search comma nd ide ntifies and addresses devices whose temperature is outside of programmed limits (temperature alarm con diti on ).Applicatio ns in clude thermostatic con trols, in dustrial systems, con sumer products, thermometers, or any thermally sen sitive system.1、the description oftechnique function:1) Sin gle-li ne in terface is uniq ue, DS18B20 while lin ki ng with microprocessor only need a line can immediately carry out the double of microprocessor and DS18B20toward the com muni catio n.2) measure scope-5 °C~ +125 °C , proper measure resolution's 0.53) support several set nets function, several DS18B20 can merge at unique three on-line, the mostcan merge 8, if amount was excessive, it would make power supply the power electric voltage over low, result in thus the signal delivers of unsteady, the realizations order to measure more4) work the power:3~5V|DC5) don't need any outer circle component in the use6) measure the result measure a way string with 9~12 numbers line transmission7) stai nl ess steels protect to take care of diamete68) be applicable to DN15~25, DN40~ DN250 various equipments that lie industrial piping of qualityand narrow and small space measure9) standards install the thread M10 X1, M12 X1.5, the G 1|2 term chooses10) PVC electric cable direct the line or virtuous type ball type connect line box line, the easy to andother electric appliances equipments links.2、Application1) products are applicable to cold storage, food Cang, keep a bottle, tele-communications engineroom, electric power engine room, cable slot etc. measures moderate control realm2) stalk tiles, urn body, the Fang machine, the air condition, waits industrial equipments of narrowand small space to measure a moderate control.3) car air condition, refrigerator, cold cabinet, and medium low temperature dry box of etc.s.4) provide hot|make cold piping calories to calculate, the central air condition divides athermal en ergy to calculate to measure a moderate con trol with in dustrial realm3、Product model number and specification4、Connect line instructionThe characteristics special front line connects, needs a line to correspond by letter to order moreability and simplified a distribute type the temperature spread the feeling applicati on did n't n eed anexter nal comp onent to use data total li ne power supply, the electric voltage scope has neverneeded to provide for use the power diagraph temperature scope for the 3.0-5.5 Vs BE-55 °Cto+125 °C .The Fahrenheit is equal hen ce-67-257 Fahre nheit degree- C go to+85 C accuracy in±0.5 side the scope isThe temperaturespreadsa feeli ng machi ne'sprogrammableresolutio n to convert into 12number formats for 9~12 temperaturesbiggest be worth to 750 a milli- of sec ond the customer candefi ne of not and easily lose sex temperature to report to the police to establisha n applicati on to include a con sta nt temperaturec on trol, i ndustrial system, con sume electr onics productthermometer, or any hot sen sitive systemThe number thermometer that describes the DS18B20 provides 9-12(theprogrammableequipme nts temperatureread a nu mber. The in formatio n is disheveled hair to sendto connect through a line from the DS18B20, so cen tral microprocessor andDS18B20 only have a per line conjunction. For read and write and the temperature conversion canacquire energy from the data line, don't need to circumscribe the power. Because each DS18B20includes a special ordinal number, several ds 18 bs 20 seses can be existed to a total line at the same time. This makes the temperature spread a feeling machine to place in many different places.Its use is a lot of, include an air condition environment control, detect equipments inside the building or machine, and carry on process monitor and control.The DS18B20 internal structure mainly constitutes to from the four-part cent: 64 temperatures that only engrave ROM and temperature to spread a feeling machine and don't vaporize report to the police to trigger a machine TH and TL and allocation to deposit a machine. While equiping signal line Gao, the internal capacitor stores an energy from a line and corresponds by letter circuit to the film power supply, and at low electricity even period for film power supply until next Gao Dian Ping's arrival refreshes .The power of the DS18B20 can also.5V electric voltages get from 3 Vs-5s in the exterior.The DS18B20 adopts front line correspondence to connect. Because the front line correspondenceconnects, have to previously complete ROM enactment, otherwise memory and control function will can not use. Mainly provide following function to order any first of a:1) read ROM2) ROM match3) search ROM4) jump ROM5) report to the police a check.These instruction operation the function has no 64 sequencesthat only engrave ROM of a spare part, can be hanging severalspare parts on the front line to make selection a certain spare part, at the same time, the total line can also know always on-line hang how much, what kind of equipments.If the instruction successfully makes the DS18B20 completion temperature measure, the data saves in the saving machine of DS18B20.The performance of a control function conductor designation DS18B20 measures. Measure result will be placed in the DS18B20 memories, and can let reading to send out the conductor of remembering the function, reading contents of slice ascend saving machine.The temperature reports to the police to trigger machine TH and TLs to all have one word stanza EEPROM data. If DS18B20 not the use report to the police to check instruction, these deposit a machine to be a generalcustomer to remember use. Still carry to there is allocation word's the stanza converting by ideal solution temperature number on the slice. Write TH, TL instruction and allocation word stanza makes use of instruction completion that remembers function. Pass to slowly save a machine to read to deposit a machine. All datas read writing all a beginning from the lowest.The DS18B20 has 4 main data parts:1、only engrave 64 sequences in ROM are what factory front be only engraved likes, it can see make the addresssequencethat is the DS18B20 code.64alignmentsthat only engrave ROM are: Starting8(28 Hs) is the product type mark number, immediately after of 48 sequences that is the DS18 B20 oneself, last 8 is 56 front circulating redundancy schools to check code.(CRC=X 8+ Xs 5+ Xs 4+s1)The function that only engraves ROM is to make each DS18B20 all each not same, so can carryouta purpose that is always on-line to hang to connect several DS18 B20s.2、the temperature in the DS18B20 spread a feeling machine to complete the diagraph to the temperatureand take 12 conversions as an exampleT: he binary system expanding with 16 sig ns repairs code to read to count a form to provide, with0.0625 °C |the LSBform express, among them, the S is a sign.The saving machineof DS18B20 includes high speed to temporary save machine RAM and can give or get an electric shock to wipe in addition to RAM, can give or get an electric shock to wipe in addition to RAM includes temperature to trigger machine TH and TL again, and an allocation deposits a machine. Saving machine ability the integrity really settle the communication of front-line port, the number starts using to write the order of depositing the machine to write into deposit a machine,immediately after can also use order of reading to deposit the machine to confirm these numbers. After confirming can use the order that the replication deposits a machine can give or get an electric shock to wipe to transfer these numbers to in addition to RAM in. While once modifying to deposit the number in the machine, this process can ensure the integrity of number.The high speed temporary saves machine RAM to constitute to from the saving ° machine of 8 word stanzas; Thefirst and the second word stanza are temperatures to show. The fourth Sha-ho word stanza is to make duplicate TH and TL, at the same time the fourth Sha-ho number of word stanza can renew; The fifth word stanza is to make duplicate allocation to deposit a machine, the fifth number of word stanza can renew at the same time;6, 7, 8, three word stanzas are calculator oneself use. Using reads that the order that deposit a machine can read the ninth word stanza, this word stanza is eight word stanzas to the front to carry on schools to check.64 8 ex- oneself codes that is a DS18B20that only engrave ROM, next 48 are acontinuous number code, 8 of end is to 56 ex- of the CRC schools check.64-the light of engraveROM and include the function order of 5 ROMs:ReadROM, match ROM, jump up ROM, check to seek ROM and report to the police to check to seek.The DS18B20 can use external power VDD as well as use the power in the livingon of inner part. When the VDD port connects the electric voltage with 3.0 Vs~Vs-5.5ses is use external power; When the VDD port connects ground used the powerin the living on of inner part. No matter is an inner part to live on the power or anexternal power supply, l|the O line want to connect a 5 K Q to or soly and up pull electric resistance.Allocation's depositing a machine is the conversion that installs different number to make sure temperature and number.R1, the R0 is the decision of temperature, from the R1, the different combination ofR0 can install for 9, 10, 11, 12 temperatures show. So can know a different temperature conversion to should of conversion time, four kinds of resolutions of allocations distinguish to 0.5 °C , 0.25 °C , 0.125 °C and 0.0625 °C , factory take installingDS18B20 at factory with install for 12, read temperaturetotally read 16, so the empress is 112 enter make to convert into 10 enter make after at multiply 0.0625 is then measure of temperature, also need to be judged plus or minus. Front 5 piece words are signs, current 5 is 1:00, read of temperature is minus quantity;5 is 0:00, read at present of temperature is plus quantity.16 numbers put from low to Gao Wei.The instruction agrees on code operating instructions:1) The temperature converts the 44 H start DS18B20 to carry on a temperature conversion2) Read to temporary save machine BEH to read to temporary save machine 9 word stanzacontentses3) Write temporary and save the machine 4 EHs to write in a data temporary TH of saving themachine and TL word stanza4) The replication temporary savesthe machine 48 Hs temporary save the TH of machine and TLword stanza to write E2 RAM5) Re- adjust the E2 RAM B8's Hs write the E2 TH within RAMs and TL word stanzato arrive to temporary save machine TH and TL word stanza and read that the signal that the B4H start DS18B20 of the power supply method sends out the power supply method gives lord CPU The beginning of DS18B20 starts to turn.1) place data line first Gao Dian Ping"1".2) postpone(what the time request isn't very strict, but possibly a little bit shorter)3) the data line pull a low electricity even"0".4) postpone 750.(the horary time scope can from 480-960)5) the data line pull Gao Dian Ping"1".6) wait for while postp onin g(if is early to start to become an achieveme nt the n in 15-60time in side produce a low electricity that is returned by the DS18 B20 eve n" 0".Ca nmake sure its existenceaccording to the status, but should notice can not be infini tely carry on wait ing for, otherwise will make procedure get in to to die circulat ing, so con trol while wanting to carry on to be super).7) if CPU read the data is on-I ine low to give or get an electric shock eve n"0" after,while also n eedi ng to do to postp one time for it to postp ones from send out of GaoDia n Ping start to calculate to at least want 480.8) pull data line aga in Gao Dao Gao to end after givi ng or gett ing an electric shock iseve n"1".As the simple structure, convenient installment, low loss and wide range of temperature test,DS18B20 temperature test sen sors are applied to the fields which n eeds the multipoint temperature test, such as the chemical industry, the grain, the en vir onment supervisi on and so on. Because of the adopti on of one bus in the DS18B20 multipoi nt temperature test system,all DS18B20 are hung on one bus, and the n the temperature conv ersi on value of each test point is read by turns. As the conv ersi on value must be read after read in g-p in state for 8 times, and positi on and store data must be moved, so time spe nd much in read ing one point of the data system by every time. If the temperature test system is large-scaled, the system loss caused by it is rather much, and the n the alter nate test speed of the system decreasesobviously, which in flue nces the efficie ncy of the multipoi nt temperaturetest systemseriousl y.ln this paper, DS18B20 are hung on some I/O buses by grouping DS18B20 evenly, and the conversion temperature data is obtained by reading the state of DS18B20, then the system loss decreases and the alter nate test speed in creases obviously, whichwon ' t i precisi on and the reliability of the con versi on. A set of multipo int temperature test of artificial environment laboratory is achieved in this paper, which increasesthe test efficie ncy of the former system.DS18B20 is the single bus digital temperature sensor from American DallasCompany. DS18B20 is consisted of the 64 figures ROM engraved by laser, the temperature sensitivity component, non-volatile temperature alarms trigger (Device TH and TL).DS18B20 communicates with the microprocessor by the single bus port and the test range of DS18B20 is from -55 centigrade to+125 centigrade, and the incremental value is 0.5 centigrade. The temperature can be changed into figures within 720ms and each DS18B20 has the sole 64 figures serial number. The specific content is revealed as Fig 1: There are two 8 figures storages (No.0 and No.1) for storing temperature value in DS18B20. No.0 storage stores complement of the temperaturevalue, and No.1 stores symbols of the temperature value. The user can define non-volatile temperature alarms sets and distinguish the alarms search order and seek the component temperature alarms state outside the scheduled limit. There are two alternative ways of power supply: Signal bus high-level borrow power is adopted, or the +5v power supply externally is adopted directly.DS-18B20 数字温度传感器DS-18B20数字温度传感器,该产品采用美国DALLAS公司生产的DS18B20 可组网数字温度传感器芯片封装而成,具有耐磨耐碰,体积小,使用方便,封装形式多样,适用于各种狭小空间设备数字测温和控制领域。

信息技术英语单词缩写

信息技术英语单词缩写

信息技术英语单词缩写## A Comprehensive Guide to Essential Information Technology (IT) English Word Abbreviations.In the rapidly evolving landscape of Information Technology (IT), efficient and concise communication is paramount. To facilitate seamless collaboration and understanding, a plethora of English word abbreviations have emerged, creating a specialized language that permeates the industry. This comprehensive guide aims to provide a comprehensive overview of the most frequently encountered IT English word abbreviations, empowering you to navigate the technical jargon with ease.### Networking and Infrastructure.LAN: Local Area Network.WAN: Wide Area Network.VPN: Virtual Private Network.DNS: Domain Name System.DHCP: Dynamic Host Configuration Protocol. FTP: File Transfer Protocol.SSH: Secure Shell.Telnet: Telecommunications Network.### Operating Systems.OS: Operating System.GUI: Graphical User Interface.CLI: Command Line Interface.RAM: Random Access Memory.ROM: Read-Only Memory.HDD: Hard Disk Drive.SSD: Solid State Drive.### Programming and Software Development. IDE: Integrated Development Environment. API: Application Programming Interface. SDK: Software Development Kit.OOP: Object-Oriented Programming.MVC: Model-View-Controller.SQL: Structured Query Language.NoSQL: Not Only SQL.HTML: Hypertext Markup Language.CSS: Cascading Style Sheets.JavaScript: A cross-platform scripting language. ### Cloud Computing.IaaS: Infrastructure as a Service.PaaS: Platform as a Service.SaaS: Software as a Service.AWS: Amazon Web Services.Azure: Microsoft Azure.GCP: Google Cloud Platform.### Security.DoS: Denial of Service.DDoS: Distributed Denial of Service.IDS: Intrusion Detection System.IPS: Intrusion Prevention System.Firewall: A network security system that monitors and controls incoming and outgoing network traffic.VPN: Virtual Private Network.### Data Management.DBMS: Database Management System.CRM: Customer Relationship Management.ERP: Enterprise Resource Planning.BI: Business Intelligence.AI: Artificial Intelligence.ML: Machine Learning.DL: Deep Learning.### Agile Development.Scrum: A framework for agile software development.Sprint: A fixed-length period of time during which a Scrum team works to achieve a specific set of goals.Kanban: A method for visualizing work and managing workflow.CI/CD: Continuous Integration/Continuous Delivery. ### Other Common Abbreviations.IT: Information Technology.CEO: Chief Executive Officer.CIO: Chief Information Officer.CTO: Chief Technology Officer.CFO: Chief Financial Officer.QA: Quality Assurance.R&D: Research and Development.### Tips for Using IT Abbreviations.Use abbreviations sparingly and only when their meaning is clear to the intended audience.Define abbreviations the first time they are used in a document or presentation.Avoid using multiple abbreviations in a singlesentence or paragraph.Use consistent abbreviation formats throughout your communications.Be aware of the potential for confusion when using abbreviations that have multiple meanings.### Conclusion.By mastering the essential IT English word abbreviations presented in this guide, you willsignificantly enhance your ability to engage effectively in technical discussions, comprehend documentation, and navigate the complex world of information technology. Remember to use these abbreviations judiciously and with clarity, fostering seamless communication and collaboration within the IT ecosystem.。

冠状动脉介入治疗球囊的选择课件

冠状动脉介入治疗球囊的选择课件
Tapered Tip:The tapered soft tip combined with advanced laser welding technology provides the most competitive tip profile
Slidematrix dual coating is specially formulated with two unique proprietary blends. Hydrophilic and Invio coatings are applied to the distal leading tip section and the balloon/shaft section, respectively to provide an optimal balance between lubricious crossing and minimizing watermelon seeding
Sprinter Legend等
长病变:原则上选用较长的球囊,以防两 端撕裂并减少扩张次数。
分叉病变:可选双导丝球囊、切割球囊。 目的:减少斑块移位、降低分支闭塞的概 率。
编辑ppt
常用的球囊特点
编辑ppt
Maverick® PTCA Balloon Catheters
Proprietary laser bonded technology creates an extraordinary TrakTip™ Design and precise, smooth bonds throughout the shaft.
编辑ppt
预扩张
有利于支架的植入 有利于病变的测量 选择小于血管直径0.5-1mm的球囊进行预扩张,球囊长度

Adobe GenStudio生成AI指南说明书

Adobe GenStudio生成AI指南说明书

Getting started with Adobe GenStudio. Supercharge your content creation-to-activation process with the power of generative AI.Marketing continues its massive shift from traditional channels to digital where brands are serving customers immersive, tailored experiences. These personalized experiences build trust and bring customers back again and again, deepening relationships and determining a company’s success in the long term. At the same time, the way these experiences are being created and delivered is also rapidly shifting.Generative AI is redefining what’s possible with content generation, and companies are trying to keep up with this rapid shift. But many are still unsure about how to leverage AI in a commercially safe manner while also maintaining creative and compliance controls. Because the demand for personalization isn’t slowing down, technologies like generative AI that can rapidly expand an enterprise's ability to scale content creation and delivery are here to stay. Companies mustbe quick to assess and adopt these tools so they can deliver the content that fuels digital customer engagements.Generative AI has the potential to add the equivalent of $2.6 trillion to $4.4 trillion annually to the global economy.Source: McKinsey & CompanyWorking to deliver such a high volume and variety of tailored and dynamic content puts tremendous pressure on creatives and marketers—especially if they’re using the same processes and tools they always have, including email and spreadsheets, to manage their content supply chain.But outdated and manual ways of working slow everyone down, and they waste time and money. Creating such a high volume of content has become a bottleneck to launching products and delivering dynamic experiences. Teams spend weeks in the content creation-to-activation cycle—ideating, writing, reviewing, versioning, and activating through extensive manual tasks and handoffs—all of which add not only hours, but also additional costs. Delivering a myriad of different assets it takes to get personalized experiences in front of various audience segments across every digital channel becomes impossible.•Content takes too long to create and activate•The cost of creating the variety of content customers want is too high•Teams are siloed and collaboration is difficult•Business priorities are disconnected from execution •Creativity and quality suffer under massive workloads•Quickly shifting markets and customer expectations require faster insights•Content creation tools are centralized and it becomes difficult to quickly leverage full scale across distributed teamsEnterprise content is expected to increase from an estimated47 exabytes in 2021 to 155 exabytes by 2026, and as such,organizations need to find efficiencies in the content supply chain.Considering the many steps of the content life cycle—storage, processing, measurement, and delivery of content as a whole—there are many opportunities to find efficiencies in helping content owners and related stakeholders in the business to get jobs donefaster and with higher quality.Source: IDCWhat’s standing in the way of delivering the personal experience customers want?Organizations that are struggling with content velocity risk falling behind their competition without an agile, streamlined, and cost-effective content supply chain.What is a content supply chain?A content supply chain brings together people, tools, and workstreams to effectively plan, create, produce, deliver, and measure content. With customers demanding higher quality experiences at an increasingly faster pace, coupled with the complexity of multiple channels and formats, brands need to revolutionize the way they think about content.Build a strategyaround content thatwill keep the targetaudience engaged Develop and create visual or written marketing assets.Drive cross-functional processes to share, review, and edit content.Finalize and upload content for storage in a content repository.Publish content across marketing channels via marketing programs.Collect data on performance to optimize future effortsIdeation/brief Creation Production Deployment Collaboration and reviews Measurement and optimizationA better content supply chain with Adobe GenStudio.Adobe’s solution for running a simplified and efficient content supply chain is Adobe GenStudio. This end-to-end integrated offering gives creative and marketing teams the power of generative AI and the tools they need to plan, create, and activate on-brand content to deliver personalized customer experiences at scale.Integrations certainly make it much more efficient on our sidefrom an overall tool stack, ecosystem, connectivity, and evenan authentication standpoint. It’s really exciting to see whereAdobe’s taking this whole content supply chain.Christopher GroveVP of Operations,Xfinity CreativeTogether, the powerful tools that comprise Adobe GenStudio bring a generative AI-driven approach to creating content at scale that enable full visibility across teams and their network of agencies. Adobe GenStudio also gives organizations the ability to ensure brand standards and overall governance are maintained.From ideation through activation, Adobe GenStudio allows creative and marketing teams to:•Rapidly create and activate new and variant content in a simple-to-use interfacethat is connected to enterprise data and workflows•Create enterprise content workflows and enable content re-use through asingle enterprise portal•Activate content through any channel and immediately gain insights intocontent performance•Use the applications they are familiar with so they can create content at scal eWe wanted our creatives spending every hour creating. Everyhour that they’re not trying to toggle between systems andfigure out where to get a job number or where to post an assetbecause they’re in a tool that’s familiar to them on a day-to-day basis is an hour gained in terms of real creative output.Christopher GroveVP of Operations,Xfinity CreativeThe three pillars of GenStudio.Workflow andplanningCreative CloudWhile the solutions within each pillar deliver standalone benefits, they’re even more powerful when you use them together. Adobe GenStudio is built with Adobe Firefly generative AI so you can create content that is designed to be commercially safe and ready in the time it takes you to type a prompt. Similarly, you can add to, remove, or replace images with Generative Fill in Adobe Photoshop all with a text prompt to help bring your creative vision to life faster than ever. And whether it’s your creative teams generating original content or your downstream marketers remixing existing assets to deliver better personalization, teams can instantly turn ideas into creative assets—driving scale and customization faster and better than ever before.See Adobe Express with Firefly in action.Adobe 100% stands behind the belief that generative AI isan accelerator for creative uses, not a replacement. Thesetechnologies become another tool that can accelerate theproduction process.Ely GreenfieldCTO,Adobe Digital MediaAdobe GenStudio capabilities[People] are the most creative when their brain is notpreoccupied with answering the next email and answering thenext project and attending the next meeting—there’s no waycreativity will grow just out of the box because of the day-to-day that everybody has.Marketing Director, IT ConsultingSource: The State of Work in 2023, AdobeAdobe GenStudio success stories.Our customers are already leveraging the power of Adobe solutions to improve their content supply chain and seeing incredible results. From increasing content velocity to tremendous time and cost savings, these real-world success stories underscore the transformative power of a supercharged content supply chain.•Orvis saw a 75% reduction in time to produce project plans •JLL creative team increased their deliverable output by 260% in two years•T-Mobile increased campaign output by 47% without adding headcount•Asics saw a 30% reduction in waste through increased asset reuseAs we look to the future of a rapidly evolving digital landscape, it's clearcompanies that have transformed their content supply chains with Adobe are at the cutting edge of what relevant digital content experiences look like.Learn moreWith Adobe's help, Prudential was able to transform its content creation process.1234567811。

吉林省高一英语教材

吉林省高一英语教材

吉林省高一英语教材高一年级第一次学程考试英语科试卷露人。

我第1日选件进部分(A1009)第一部分力(月两节、满分20分)2一1(共3小器。

每小题15分,满分15分)新下面5段对话,每及对话后有一个小数,从题中所给的A.8.C 三个选项中造出能作比项,并标在试题费的相位位置,究物表时话后,你都有1090的时间来日在有天小眼和网次下小题,你取对话仅读一词。

1. How is the weather in the woman's opinion?A. Warm.B. Cold.C. Hot.2 What does the man mean?A. He alnrady las planiB. The woman should decide.C. He will make ia reurvation 3. Why did the man go to Beijing?A. To visit his parentsB. To have an interview.C. To receive job training 4. What are the two speakers talking about?A. What to take up (A) an a hobby.B. How to keep fit.C. How to deal with stress (E)5. What will the man do fina"A. Clean his noom B. Go on a picmic.C. Wee clothes.第二节(共15小题,每小题1.5分,清分22.5分)请所下面5设时话成确门。

每段对话成株白的有几个小题,从照小用始的A3,C 三个选理中为出住选境。

开和在试器参的相应位置,而每段对动或性白前。

你的有时问能读各个小题,每小题5的钟,完,各个器给出5秒种的作时间,每及对试成社白计两。

最新朗阁雅思入学测试-答案

最新朗阁雅思入学测试-答案

Part 1 Vocabulary✠Choose the most appropriate answer A, B, C or D.1Some creatures were better at surviving and ________ themselves than others, so they thrived at the others’ expense.A ad optingB subsistingC reproducingD germinating2 A 59-year-ol d man was executed by ________ injection this morning.A lethalB inherentC animateD fertil e3Sometimes a ________ of ants will holl ow out a tree trunk leaving just the bark.A swarmB packC herdD col ony4Sheep and cows were two of the most important animals to be ________.A spawnedB domesticatedC slaughteredD constituted5What began as an isolated outbreak of flu has now developed into a countrywide ________.A phobiaB epidemicC toxinD contamination✠Fill in the blank in each sentence with the most suitable words from the box.6Feminism is about liberating women from enforced d omestic and ________ drudgery. 7We owe it to our ________ to l eave them a cl ean worl d to live in.8She decid ed to turn vegan after watching a documentary about how ________ is raised. 9Many illnesses in the temporary refugee camps are the result of inadequate ________. 10They hol d widely divergent opinions on controversial issues like ________.Part 2 GrammarChoose the correct letter to complete the sentences below.11I d on’t enjoy ________ at by other people.A being laughedB to be laughedC being laughingD to be laughing12I hurt my back. I ________ that heavy box up two flights of stairs.A must not carryB might not have carriedC coul d not carryD should not have carried13At the present time, the ol dest house in town ________ by the History Society. When the restoration ________, the house is sure to be a popular tourist attraction.A is to be restored, finishesB is being restored, is finishedC is restored, will be finishedD is being restored, is going to be finished14According to a newspaper articl e which I read, the police arrested the man who ________ the First National Bank. The man who ________ a plaid shirt and bluejeans was caught shortly after he had l eft the bank.A was robbing, had been wornB was robbed, had wornC had robbed, was wearingD had been robbed, was to wear15The crime rate has continued to rise ________ the local police d epartment has implemented several new crime prevention programs.A simply becauseB even thoughC in spite ofD in the event that16________ the secret of how to make silk remained insid e Asia, Europeans were forced to pay high sums of money for this mysterious material ________ overland to Europe.A Although, to have broughtB Only if, to bringC Due to, to be bringingD As l ong as, to be brought17The psychologist spoke to us about some of the ________ coincidences in the lives of twins ________ apart from each other from birth.A amazing, to liveB amazing, livingB amazed, to live D amazed, living18It is estimated by those ________ in the hunger program that 3500 people ________ starvation in the worl d every day.A who work, die fromB that work, die ofC whose work, die outD which work, die for19The house ________ born and grew up ________ in an earthquake ten years ago.A where I was, has destroyedBin which I was, was destroyedCfor which I was, was destroyed Damong which I was, had been destroyed20 When Mr. Brown walked into the kitchen, he caught the children ________ some candy even though he’d tol d them ________ their dinn ers.A to eat, to be spoiledB to be eaten, spoiling Ceating, not to spoilDbeing eaten, not spoil edPart 3 ReadingPassage 1 Birthday traditions in different countriesBirthdays are celebrated all over the world. Some traditions are fairly similar from country to country: candles, cakes and birthday wishes, birthday games and pinches for good luck. Other customs are quite different. Here are a few.Argentina – In Argentina, as in many Latin American countries, one of the most important birthday parties is a girl’s fifteenth. When girls turn 15, they have a huge party and dance the waltz first with their father, and then the boys at the party.China – The birthday child pays respect to the parents and receives a gift of money. Friends and relatives are invited to lunch, and noodl es are served to wish the birthday chil d a l ong life.Denmark – A flag is fl own outsid e a wind ow to show that someone who lives in that house is having a birthday. Presents are placed around the chil d’s bed while they are sleeping so they will see them immediately when they wake up.The Netherlands – Special year birthdays such as 5, 10, 15, 20, 21 are called “crown” years and the birthday child receives an especially large gift. The family also decorates the birthday chil d’s chair with fl owers or paper streamers, paper fl owers and ball oons.India – Usually Indian chil dren wear white to school. However, on their birthday children wear col oured clothes to school and give out chocolates to everyone in the class. Their best friend helps them to d o this.Japan – The birthday child wears new clothes to mark the occasion. Certain birthdays are more important than others and these are celebrated with a visit to the local shrine. These are the third and seventh birthdays for girls and the fifth for boys.Match the countries in the box with their descriptions.21A country where l ongevity is celebrated by a special dish________22 A country where candies are distributed among peers ________23 A country where the birthday is made known to the community ________24 A country where the household is full of birthday ornaments ________25 A country where religious worship is sometimes involved ________Passage 2 Intelligence across culturesWhat is intelligence? Is it about being clever and getting A grades in all your school subjects? Or is it more complicated than that? Recent research in Asia, Africaand Latin America suggests the concept of intelligence differs from culture to culture.This research has shown that people in non-Western cultures often have ideas about intelligence that differ fundamentally from those in Western cultures. The studies show that peopl e in Western cultures tend to see intelligence in terms of one’s ability to solve problems engage in rational debate. Meanwhil e, Eastern cultures see intelligence in terms of people’s ability to successfully play their roles within social hierarchies both at home and at work.Researchers at the National Chi-Nan University in Taiwan found that Chinese id eas of intelligence emphasize understanding and relating to others, including knowing when to show and when not to show one’s intelligence.In a study conducted in San Jose, California, immigrant parents from Cambodia, Mexico, the Philippines and Vietnam, as well as native-born Anglo-Americans and Mexican-Americans, were asked what they saw as important in the devel opment of their children’s intelligence. Parents from all groups – except Anglo-Americans – indicated that motivation and social skills were as important as, or more important than, academic skills in the devel opment of their children.Another study shows major differences in how much importance is given to verbal and non-verbal communication skills. Western cultures seem to value more highly the ability to say things clearly, whereas non-Western cultures seem to value the use and understanding of gestures and facial expressions. Intelligence expert David Lazear says that in the Western worl d we tend to think that the most important thing about being smart is to have skills in reading, writing and mathematics. ‘However, many Asian cultures place at least equal value on the devel opment of one’s interpersonal skills. These includ e being an effective team member, or the ability to create agreement within a group of people.Many Asian cultures also highly rate the development of a person’s introspective abilities. This is the ability to “go inside” and acquire knowledge about yourself and then to be able to act on this increased self-knowledge. When I lived and worked in Africa, I found great importance given to such things as dance, music, art and drama as ways to express the deep wisd om of the culture and to reinforce key personal and social values.All the intelligences were valued, but somehow capacity in these areas was seen as special and even more profound.’Complete the summary below with ONLY ONE WORD from the passage.The notion of intelligence varies significantly from one culture to another. In Western cultures, a person’s intelligence is shown in his or her skills in seeking answers and participating in 26________________ discussions. However, Eastern cultures emphasize a person’s capability to undertake their 27________________ rol es within a ranking system.One research has shown that most immigrant families regard 28________________ and interpersonal skills as more crucial than learning skills in their kids’personal development. In another study, many non-Western cultures are found to place a lot of importance on utilizing 29________________ communication techniques such as gestures and facial expressions. Moreover, many Asian cultures think very highly of a person’s 30 ________________ ability, which means getting to know more about oneself.Part 4 Writing✠Put the following sentences into the correct order to form a coherent paragraph.A With the arrival of rock and pop in the second half of the last century, theprotest song became more and more popular as artists discovered they couldget their message across immediately to a wide audience.B Music proved an extremely effective way of getting people to think andchallenge political d ecisions.C Music has always been used to express all the different human feelings, fromlove and happiness, to sadness and anger.D One of the most famous exampl es of this was the importance of music in the1960s counterculture movement –a movement which played an enormouspart in events such as getting American soldiers out of Vietnam and fighting forthe civil rights of African-Americans.E It is generally agreed that music as a form of protest probably originated in thecotton fields of America, with African slaves singing songs of freedom.The correct order of the above five sentences should be:31________32________33________34________35________✠For each of the items below, choose the most suitable sentence that makessense to you.36 A Until you l earn to relax, you won’t improve your ability to speak English.B Until you relax to l earn, you aren’t improving your ability to speak English.C Until you l earn to relax, you haven’t improved your ability to speak English.D Until you relax more and l earn harder, you don’t improve your ability to speakEnglish.37 A Under the law, drivers and all passengers are permitted to wear seat belts whilea vehicl e is moving.B Under the law, while some drivers are encouraged to wear seat belts, otherpassengers might not d o so unless the vehicl e is moving.C Under the law, both drivers and all passengers are warned to wear seat belts nomatter whether the vehicl e is moving or not.D Under the law, drivers and all passengers are required to wear seat belts whil ein a moving vehicle.38 A The fact that he lacks interest in academic learning indicates his frequentabsence from class.B The fact that he is frequently absent from class indicates his lack of interest inacademic learning.C It is a fact that he is frequently absent from class; as a result, he is notinteresting in academic learning.D It is the fact that his frequent absence from class resulting from his lack ofinterest in academic l earning.39 A Some peopl e protest certain commercial fishing operations, consideringdolphins to be highly intelligent mammals, since they are killed unnecessarily.B Even though some people protest certain commercial fishing operations, theyconsider the highly intelligent mammals – d olphins – to be killed unnecessarily.C Some peopl e protest certain commercial fishing operations because dolphins,considered to be highly intelligent mammals, are kill ed unnecessarily.D Regardl ess of how some peopl e protest certain commercial fishing operations,dolphins are consid ered highly intelligent mammals to be killed unnecessarily.40 A The researchers are doing case studies of people that their family history hashigh blood pressure and heart disease to determine how important is heredityin health and l ongevity.B The researchers are doing case studies of people whose families have a historyof high blood pressure and heart disease to determine the importance ofheredity in health and longevity.C The researchers are doing case studies of peopl e’s family history whether ornot there is high blood pressure and heart disease to determine heredity is really important in health and longevity.D The researchers are d oing case studies of family history in peopl e who havehigh blood pressure and heart disease to determine the important heredity in their health and l ongevity.。

LearningSpark:Lightning-FastBigDataAnalysis中文翻译

LearningSpark:Lightning-FastBigDataAnalysis中文翻译

LearningSpark:Lightning-FastBigDataAnalysis中⽂翻译Learning Spark: Lightning-Fast Big Data Analysis 中⽂翻译⾏为纯属个⼈对于Spark的兴趣,仅供学习。

如果我的翻译⾏为侵犯您的版权,请您告知,我将停⽌对此书的开源翻译。

Translation the book of Learning Spark: Lightning-Fast Big Data Analysis is only for spark developer educational purposes. If I violated your copyright, please let me know.Learning Spark 英⽂原版Learning Spark: Lightning-Fast Big Data Analysis在 databricks 官⽹上发布了此书的优惠码(promo code: BWORM),在购买时别忘了使⽤省银⼦。

中⽂翻译GitHub:GitBook:GitBook is a tool for building beautiful books using Git and Markdown. It can generate your book in multiple formats: PDF, ePub, mobi or as a website.GitHub上分享了中⽂翻译的PDF版和原书源码,GitBook则可分享中⽂翻译的多种⽂件格式(PDF, ePub, mobi and website)。

⽬前此书的翻译进度由我的业余空余时间和兴趣所决定,⽆法预知翻译的结束时间和进度表。

另外对于此书的翻译只关注技术部分,因此翻译从第⼆章开始。

Examples for Learning Sparkcodes forked fromAbout the Orignal AuthorAbout the Orignal AuthorHolden Karau is a software development engineer at Databricks and is active in open source. She is the author of an earlier Spark book. Prior to Databricks she worked on a variety of search and classification problems at Google, Foursquare, and Amazon. She graduated from the University of Waterloo with a Bachelors of Mathematics in Computer Science. Outside of software she enjoys playing with fire, welding, and hula hooping.Most recently, Andy Konwinski co-founded Databricks. Before that he was a PhD student and then postdoc in the AMPLab at UC Berkeley, focused on large scale distributed computing and cluster scheduling. He co-created and is a committer on the Apache Mesos project. He also worked with systems engineers and researchers at Google on the design of Omega, their next generation cluster scheduling system. More recently, he developed and led the AMP Camp Big Data Bootcamps and first Spark Summit, and has been contributing to the Spark project.Patrick Wendell is an engineer at Databricks as well as a Spark Committer and PMC member. In the Spark project, Patrick has acted as release manager for several Spark releases, including Spark 1.0. Patrick also maintains several subsystems of Spark's core engine. Before helping start Databricks, Patrick obtained an M.S. in Computer Science at UC Berkeley. His research focused on low latency scheduling for large scale analytics workloads. He holds a B.S.E in Computer Science from Princeton UniversityMatei Zaharia is the creator of Apache Spark and CTO at Databricks. He holds a PhD from UC Berkeley, where he started Spark as a research project. He now serves as its Vice President at Apache. Apart from Spark, he has made research and open source contributions to other projects in the cluster computing area, including Apache Hadoop (where he is a committer) and Apache Mesos (which he also helped start at Berkeley).。

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Distributed One more member for the CTools - and this one is big. Available through the
ctools-installer using the -b dev flag, and requires Pentaho 4.5.
About
CDC stands for Community Distributed Cache and allows for high-performance, scalable and distributed memory clustering cache based on Hazelcast for both CDA and Mondrian.
CDC is a pentaho plugin that provides the following features:
∙CDA distributed cache support
∙Mondrian distributed cache support
∙Ability to switch between default and CDC cache for cda and mondrian
∙Gracefully handles adding / removing new cache nodes
∙Allows to selectively clear cache of specific CDE dashboards
∙Allows to selectively clear cache of specific schemas / cubes / dimensions of mondrian cubes
∙Provides an API to clean the cache from the outside (eg: after running etl)
∙Provides a view over cluster status
∙Supports multiple pentaho servers using the same cluster (eg: stage and production)
∙Supports several memory configuration options
Motivation
Performance is a key point not only in business intelligence softwares but generally in any user interface. The goal of CDC is to give a Pentaho implementation based on Mondrian / CDA a distributed caching layer that can prevent as much as possible the database to be hit.
One added functionality is the ability to clear the cache of only specific mondrian cubes. Even though Mondrian has a very complete api to control the member's cache, Pentaho only exposes a clean all functionality that ends up being very limited in production environments.
The cache being able to survive server restarts is a design bonus, and supported by CDA out of the box. It will be supported by Mondrian as soon as MONDRIAN-1107 is fixed.
Requirements
∙Mondrian 3.4 or newer (in Pentaho 4.5)
∙CDA 12.05.15
Usage
It's very simple to configure CDC.
∙Install CDC using either the installer (soon to be available) or ctools-installer. If you do a manual install, be sure to copy the contents of solution/system/cdc/pentaho/lib to server's
WEB-INF/lib
∙Download the standalone cache node
∙Execute the standalone cache node in the same machine as pentaho or in the same internal network (launch-hazelcast.sh), optionally editing the file and changing the memory
settings (defaults to 1Gb, increase at will). You can launch as many nodes as you want.
∙Launch pentaho and click on the CDC button:
∙Enable cache usage on CDA and Mondrian
∙Restart pentaho server
∙Check if the settings screen are satisfactory. Usually the defaults work fine.
Open analyzer, jpivot or a CDE dashboard that uses CDA and you should see the cache being populated
Cluster info
Hazelcast has a very good Management Center, so it's outside the scope of CDC to reimplement that kind of features. However, we do support a simple cluster information dashboard gives an overview of the state of the nodes.
Note about lite nodes: Pentaho server is itself a cache node. However, it's configured in such a way that doesn't hold data, thus the term lite node
Clean cache
With CDC you can selectively control the contents of the cache, allowing you to clean either specific dashboards or cubes. The business case around this is simple: We need to clear the cache after new data is available (usually as a result of a etl job). CDC allows not only to do that but also to do it from within the etl process.
CDA
CDC offers a solution navigator so that we can select a dashboard. When we select that dashboard, all the CDA queries used by that dashboard will be cleaned.
Clicking on the URL button we'll get a url that we can call externally (from an etl job). Be aware that you need to add the user credentials when calling from the outside (eg:
&userid=joe&password=password)
Mondrian
This one is very similar to the previous one, but navigates through the available cubes. One can then either clean the entire schema, a specific cube or even the individual cell cache for a specific dimension (use this latest one with care).
Issues, bugs and feature requests
In order to report bugs, issues or feature requests, please use the Webdetails CDC Project Page License
CDC is licensed under the MPLv2 license.。

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