MAX4211EEUE+T中文资料

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MAX4291EUK+T中文资料

________________________________________________________________ Maxim Integrated Products
For pricing, delivery, and ordering information, please contact Maxim/Dallas Direct! at 1-888-629-4642, or visit Maxim’s website at .
Applications
2-Cell Battery-Operated Systems Portable Electronic Equipment Battery-Powered Instrumentation Digital Scales Strain Gauges Sensor Amplifiers Cellular Phones
Pin Configurations continued at end of data sheet.
Rail-to-Rail is a registered trademark of Nippon Motorola, Ltd. UCSP is a trademark of Maxim Integrated Products, Inc. 1
ELECTRICAL CHARACTERISTICS
(VCC = 1.8V to 5.5V, VEE = VCM = 0, VOUT = VCC/2, RL = 100kΩ connected to VCC/2, TA = +25°C, unless otherwise noted.) (Note 1) PARAMETER Supply Voltage Range Quiescent Supply Current (Per Amplifier) Input Offset Voltage Input Bias Current Input Offset Current Differential Input Resistance Input Common-Mode Voltage Range SYMBOL VCC IQ VOS IB IOS RIN VCM VCC = 1.8V VCC = 5.0V MAX4291 MAX4292/MAX4294 VCC = 5.0V, 0 ≤ VCM ≤ 5.0V VCC = 5.0V, 0 ≤ VCM ≤ 5.0V |VIN+ - VIN-| < 10mV Inferred from CMRR test Tested for 0 ≤ VCM ≤ 1.8V; VCC = 1.8V Common-Mode Rejection Ratio Common-Mode Rejection Ratio CMRR Tested for 0 ≤ VCM ≤ 5.0V, VCC = 5.0V PSRR MAX4291 MAX4292/MAX4294 60 66 77 90 dB 90 100 dB MAX4291 MAX4292/MAX4294 0 50 57 80 dB 80 CONDITIONS Inferred from PSRR test MIN 1.8 100 100 ±400 ±200 ±15 ±1 0.75 VCC TYP MAX 5.5 210 255 ±2500 ±1200 ±60 ±7 UNITS V µA µV nA nA MΩ V

MAX3301EETJ中文资料

General DescriptionThe MAX3301E/MAX3302E fully integrated USB On-the-Go (OTG) transceivers and charge pumps allow mobile devices such as PDAs, cellular phones, and digital cameras to interface directly with USB peripherals and each other without the need of a host PC. Use the MAX3301E/MAX3302E with an embedded USB host to directly connect to peripherals such as printers or external hard drives.The MAX3301E/MAX3302E integrate a USB OTG trans-ceiver, a V BUS charge pump, a linear regulator, and an I 2C-compatible, 2-wire serial interface. An internal level shifter allows the MAX3301E/MAX3302E to interface with +1.65V to +3.6V logic supply voltages. The MAX3301E/MAX3302E’s OTG-compliant charge pump operates with +3V to +4.5V input supply voltages, and supplies an OTG-compatible output on V BUS while sourcing more than 8mA of output current.The MAX3301E/MAX3302E enable USB OTG communi-cation from highly integrated digital devices that cannot supply or tolerate the +5V V BUS levels that USB OTG requires. The device supports USB OTG session-request protocol (SRP) and host-negotiation protocol (HNP).The MAX3301E/MAX3302E provide built-in ±15kV elec-trostatic-discharge (ESD) protection for the V BUS , ID_IN,D+, and D- terminals. The MAX3301E/MAX3302E are available in 25-bump chip-scale (UCSP™), 25-bump WLP package, 28-pin TQF N, and 32-pin TQF N pack-ages and operate over the extended -40°C to +85°C temperature range.ApplicationsMobile Phones Digital Cameras PDAsMP3 PlayersFeatureso USB 2.0-Compliant Full-/Low-Speed OTG Transceiverso Ideal for USB On-the-Go, Embedded Host, or Peripheral Deviceso ±15kV ESD Protection on ID_IN, V BUS , D+, and D-Terminalso Charge Pump for V BUS Signaling and Operation Down to 3Vo Internal V BUS and ID Comparatorso Internal Switchable Pullup and Pulldown Resistors for Host/Peripheral Functionality o I 2C Bus Interface with Command and Status Registerso Linear Regulator Powers Internal Circuitry and D+/D- Pullup Resistors o Support SRP and HNPMAX3301E/MAX3302EUSB On-the-Go Transceivers and Charge Pumps________________________________________________________________Maxim Integrated Products1Ordering Information19-3275; Rev 3; 10/07For pricing, delivery, and ordering information,please contact Maxim Direct at 1-888-629-4642,or visit Maxim’s website at .Note:All devices specified over the -40°C to +85°C operating range.‡UCSP bumps are in a 5 x 5 array. The UCSP package size is 2.5mm x 2.5mm x 0.62mm. Requires solder temperature profile described in the Absolute Maximum Ratings section. UCSP reli-ability is integrally linked to the user’s assembly methods, circuit board material and environment. See the UCSP Applications Information section of this data sheet for more information.*Future product—contact factory for availability.**EP = Exposed paddle.T = Tape and reel.+Denotes a lead-free package.Selector GuidePin Configurations appear at end of data sheet.M A X 3301E /M A X 3302EUSB On-the-Go Transceivers and Charge PumpsABSOLUTE MAXIMUM RATINGSDC ELECTRICAL CHARACTERISTICS(V CC = +3V to +4.5V, V L = +1.65V to +3.6V, C FLYING = 100nF, C VBUS = 1µF, ESR CVBUS = 0.1Ω(max), T A = T MIN to T MAX , unless otherwise noted. Typical values are at V CC = +3.7V, V L = +2.5V, T A = +25°C.) (Note 2)Note 1:The UCSP package is constructed using a unique set of packaging techniques that impose a limit on the thermal profile the device can be exposed to during board-level solder attach and rework. This limit permits only the use of the solder profiles recom-mended in the industry-standard specification, JEDEC 020A, paragraph 7.6, Table 3 for IR/VPR and convection reflow. Preheating is required. Hand or wave soldering is not allowed.Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.All voltages are referenced to GND.V CC , V L .....................................................................-0.3V to +6V TRM (regulator off or supplied by V BUS )..-0.3V to (V BUS + 0.3V)TRM (regulator supplied by V CC )...............-0.3V to (V CC + 0.3V)D+, D- (transmitter tri-stated)...................................-0.3V to +6V D+, D- (transmitter functional)....................-0.3V to (V CC + 0.3V)V BUS .........................................................................-0.3V to +6V ID_IN, SCL, SDA.......................................................-0.3V to +6V INT , SPD, RESET , ADD, OE/INT , RCV, VP,VM, SUS, DAT_VP, SE0_VM ......................-0.3V to (V L + 0.3V)C+.............................................................-0.3V to (V BUS + 0.3V)C-................................................................-0.3V to (V CC + 0.3V)Short-Circuit Duration, V BUS to GND .........................ContinuousContinuous Power Dissipation (T A = +70°C)25-Bump WLP (derate 12.2mW/°C above +70°C).......976mW 25-Bump UCSP (derate 12.2mW/°C above +70°C)....976mW 32-Pin TQFN (5mm x 5mm x 0.8mm) (derate 21.3mW/°Cabove +70°C).........................................................1702mW 28-Pin TQFN (4mm x 4mm x 0.8mm) (derate 20.8mW/°Cabove +70°C).........................................................1666mW Operating Temperature Range ...........................-40°C to +85°C Junction Temperature......................................................+150°C Storage Temperature Range.............................-65°C to +150°C Lead Temperature (soldering, 10s).................................+300°C Bump Reflow Temperature (Note 1)Infrared (15s)...............................................................+200°C Vapor Phase (20s).......................................................+215°CM MMAX3301E/MAX3302EUSB On-the-Go Transceivers and Charge Pumps_______________________________________________________________________________________3DC ELECTRICAL CHARACTERISTICS (continued)(V CC = +3V to +4.5V, V L = +1.65V to +3.6V, C FLYING = 100nF, C VBUS = 1µF, ESR CVBUS = 0.1Ω(max), T A = T MIN to T MAX , unless otherwise noted. Typical values are at V CC = +3.7V, V L = +2.5V, T A = +25°C.) (Note 2)M A X 3301E /M A X 3302EUSB On-the-Go Transceivers and Charge Pumps 4_______________________________________________________________________________________DC ELECTRICAL CHARACTERISTICS (continued)(V CC = +3V to +4.5V, V L = +1.65V to +3.6V, C FLYING = 100nF, C VBUS = 1µF, ESR CVBUS = 0.1Ω(max), T A = T MIN to T MAX , unless otherwise noted. Typical values are at V CC = +3.7V, V L = +2.5V, T A = +25°C.) (Note 2)MAX3301E/MAX3302EUSB On-the-Go Transceivers and Charge Pumps_______________________________________________________________________________________5TIMING CHARACTERISTICSM A X 3301E /M A X 3302EUSB On-the-Go Transceivers and Charge Pumps 6_______________________________________________________________________________________I 2C-/SMBus™-COMPATIBLE TIMING SPECIFICATIONSNote 3:Guaranteed by bench characterization. Limits are not production tested.Note 4:A master device must provide a hold time of at least 300ns for the SDA signal to bridge the undefined region of SCL’s fallingedge.Note 5:C B is the total capacitance of one bus line in pF, tested with C B = 400pF.Note 6:Input filters on SDA, SCL, and ADD suppress noise spikes of less than 50ns.SMBus is a trademark of Intel Corporation.DRIVER PROPAGATION DELAY HIGH-TO-LOW(FULL-SPEED MODE)MAX3301E toc094ns/divD+1V/divD-1V/divDAT_VP 1V/divDRIVER PROPAGATION DELAY LOW-TO-HIGH(LOW-SPEED MODE)MAX3301E toc08100ns/divD-1V/divD+1V/div DAT_VP 1V/div DRIVER PROPAGATION DELAY HIGH-TO-LOW(LOW-SPEED MODE)MAX3301E toc07100ns/divD+1V/divD-1V/divDAT_VP 1V/div TIME TO EXIT SHUTDOWNMAX3301E toc054μs/div D-1V/divD+1V/divSCL 1V/divV BUS DURING SRP20ns/divV BUS 1V/divV BUS 1V/divC VBUS > 96μFC VBUS > 13μFTIME TO ENTER SHUTDOWNMAX3301E toc04100ns/div D+1V/div D-1V/div SCL 2V/div V BUS OUTPUT VOLTAGE vs. INPUT VOLTAGE (V CC )INPUT VOLTAGE (V CC ) (V)V B U S O U T P U T V O L T A G E (V )5.55.04.54.03.53.04.755.005.255.505.754.502.56.0V BUS OUTPUT VOLTAGE vs. VBUS OUTPUT CURRENTV BUS OUTPUT CURRENT (mA)V B U S O U T P U T V O L T A G E (V )2520151054.254.504.755.005.255.504.0030INPUT CURRENT (ICC )vs. V BUS OUTPUT CURRENTV BUS OUTPUT CURRENT (mA)I N P U T C U R R E N T (I C C ) (m A )16128410203040500020MAX3301E/MAX3302EUSB On-the-Go Transceivers and Charge Pumps_______________________________________________________________________________________7Typical Operating Characteristics(Typical operating circuit, V CC = +3.7V, V L = +2.5V, C FLYING = 100nF, T A = +25°C, unless otherwise noted.)SUPPLY CURRENT vs. TEMPERATURETEMPERATURE (°C)S U P P L Y C U R R E N T (m A )603510-150.20.40.60.81.00-4085DRIVER DISABLE DELAY (LOW-SPEED MODE)MAX3301E toc1410ns/divD+1V/divD-1V/divOE/INT 1V/divDRIVER ENABLE DELAY (LOW-SPEED MODE)MAX3301E toc13100ns/divD-1V/divD+1V/div C D+ = C D- = 400pFOE/INT 1V/divDRIVER DISABLE DELAY (FULL-SPEED MODE)MAX3301E toc1210ns/divD+1V/divD-1V/divOE/INT 1V/divDRIVER ENABLE DELAY (FULL-SPEED MODE)MAX3301E toc1110ns/divD-1V/divD+1V/div OE/INT 1V/divDRIVER PROPAGATION DELAY LOW-TO-HIGH(FULL-SPEED MODE)MAX3301E toc104ns/divD-1V/divD+1V/divDAT_VP 1V/div M A X 3301E /M A X 3302EUSB On-the-Go Transceivers and Charge Pumps 8_______________________________________________________________________________________Typical Operating Characteristics (continued)(Typical operating circuit, V CC = +3.7V, V L = +2.5V, C FLYING = 100nF, T A = +25°C, unless otherwise noted.)MAX3301E/MAX3302EUSB On-the-Go Transceivers and Charge PumpsM A X 3301E /M A X 3302EUSB On-the-Go Transceivers and Charge Pumps 10______________________________________________________________________________________Test Circuits and Timing DiagramsFigure 1. Load for Disable Time MeasurementFigure 2. Load for Enable Time, Transmitter Propagation Delay,and Transmitter Rise/Fall TimesMAX3301E/MAX3302EUSB On-the-Go Transceivers and Charge PumpsTest Circuits and Timing Diagrams (continued)Figure 6. Timing of DAT_VP, SE0_VM to D+, D- in VP_VM Mode (dat_se0 = 0)Figure 7. Timing of DAT_VP, SE0_VM to D+/D- in DAT_SE0Mode (dat_se0 = 1)Figure 8. Enable and Disable TimingFigure 9. D+/D- to RCV, DAT_VP, SE0_VM Propagation Delays(VP_VM Mode)Figure 10. D+/D- to DAT_VP, SE0_VM Propagation Delays (DAT_SE0 Mode)Figure 3. Load for Receiver Propagation Delay and Receiver Rise/Fall TimesFigure 4. Load for DAT_VP, SE0_VM Enable/Disable Time MeasurementsM A X 3301E /M A X 3302EUSB On-the-Go Transceivers and Charge Pumps Block DiagramFigure 11. Block DiagramMAX3301E/MAX3302EUSB On-the-Go Transceivers and Charge PumpsDetailed DescriptionThe USB OTG specification defines a dual-role USB device that acts either as an A device or as a B device.The A device supplies power on V BUS and initially serves as the USB host. The B device serves as the ini-tial peripheral and requires circuitry to monitor and pulse V BUS . These initial roles can be reversed using HNP.The MAX3301E/MAX3302E combine a low- and full-speed USB transceiver with additional circuitry required by a dual-role device. The MAX3301E/MAX3302E employ flexible switching circuitry to enable the device to act as a dedicated host or peripheral USB transceiv-er. For example, the charge pump can be turned off and the internal regulator can be powered from V BUS for bus-powered peripheral applications.The Selector Guide shows the differences between the MAX3301E and MAX3302E. The MAX3301E powers up in its lowest power state and must be turned on by set-ting the sdwn bit to 0. The MAX3302E powers up in the operational, VP/VM USB mode. This allows a micro-processor (µP) to use the USB port for power-on boot-up, without having to access I 2C. To put the MAX3302E into low-power shutdown, set the sdwn bit to 0. In the MAX3302E, special-function register 2 can be addressed at I 2C register location 10h, 11h (as well as locations 16h, 17h) to support USB OTG serial-interface engine (SIE) implementations that are limited to I 2C register addresses between 0h and 15h.TransceiverThe MAX3301E/MAX3302E transceiver complies with the USB version 2.0 specification, and operates at full-speed (12Mbps) and low-speed (1.5Mbps) data rates.Set the data rate with the SPD input. Set the direction of data transfer with the OE/INT input. Alternatively, control transceiver operation with control register 1 (Table 7)and special-function registers 1 and 2 (see Tables 14,15, and 16).Level ShiftersInternal level shifters allow the system-side interface to run at logic-supply voltages as low as +1.65V. Interface logic signals are referenced to the voltage applied to the logic-supply voltage, V L .Charge PumpThe MAX3301E/MAX3302E’s OTG-compliant charge pump operates with +3V to +4.5V input supply voltages (V CC ) and supplies a +4.8V to +5.25V OTG-compatible output on V BUS while sourcing the 8mA or greater out-put current that an A device is required to supply.Connect a 0.1µF flying capacitor between C+ and C-.Bypass V BUS to GND with a 1µF to 6.5µF capacitor, inaccordance with USB OTG specifications. The charge pump can be turned off to conserve power when not used. Control of the charge pump is set through the vbus_drv bit (bit 5) of control register 2 (see Table 8).Linear Regulator (TRM)An internal 3.3V linear regulator powers the transceiver and the internal 1.5k ΩD+/D- pullup resistor. Under the control of internal register bits, the linear regulator can be powered from V CC or V BUS . The regulator power-supply settings are controlled by the reg_sel bit (bit 3) in special-function register 2 (Tables 15 and 16). This flexibility allows the system designer to configure the MAX3301E/MAX3302E for virtually any USB power situation.The output of the TRM is not a power supply. Do not use as a power source for any external circuitry. Connect a 1.0µF (or greater) ceramic or plastic capacitor from TRM to GND, as close to the device as possible.V BUS Level-Detection ComparatorsComparators drive interrupt source register bits 0, 1,and 7 (Table 10) to indicate important USB OTG V BUS voltage levels:•V BUS is valid (vbus_vld)•USB session is valid (sess_vld)•USB session has ended (sess_end)The vbus_valid comparator sets vbus_vld to 1 if V BUS is higher than the V BUS valid comparator threshold. The V BUS valid status bit (vbus_vld) is used by the A device to determine if the B device is sinking too much current (i.e., is not supported). The session_valid comparator sets sess_vld to 1 if V BUS is higher than the session valid comparator threshold. This status bit indicates that a data transfer session is valid. The session_end com-parator sets sess_end to 1 if V BUS is higher than theFigure 12. Comparator Network DiagramM A X 3301E /M A X 3302EUSB On-the-Go Transceivers and Charge Pumpssession end comparator threshold. Figure 12 shows the level-detector comparators. The interrupt-enable regis-ters (Tables 12 and 13) determine whether a falling or rising edge of V BUS asserts these status bits.ID_INThe USB OTG specification defines an ID input that determines which dual-role device is the default host.An OTG cable connects ID to ground in the connector of one end and is left unconnected in the other end.Whichever dual-role device receives the grounded end becomes the A device. The MAX3301E/MAX3302E pro-vide an internal pullup resistor on ID_IN. Internal com-parators detect if ID_IN is grounded or left floating.Interrupt LogicWhen OTG events require action, the MAX3301E/MAX3302E provide an interrupt output signal on INT .Alternatively, OE/INT can be configured to act as an interrupt output while the device operates in USB sus-pend mode. Program INT and OE/INT as open-drain or push-pull interrupts with irq_mode (bit 1 of special-func-tion register 2, see Tables 15 and 16).V BUS Power ControlV BUS is a dual-function port that powers the USB bus and/or provides a power source for the internal linear reg-ulator. The V BUS power-control block performs the various switching functions required by an OTG dual-role device.These actions are programmed by the system logic using bits 5 to 7 of control register 2 (see Table 8) to:•Discharge V BUS through a resistor•Provide power-on or receive power from V BUS •Charge V BUS through a resistorThe OTG supplement allows an A device to turn V BUS off when the bus is not being used to conserve power.The B device can issue a request that a new session be started using SRP. The B device must discharge V BUS to a level below the session-end threshold (0.8V) to ensure that no session is in progress before initiating SRP. Setting bit 6 of control register 2 to 1, discharges V BUS to GND through a 5k Ωcurrent-limiting resistor.When V BUS has discharged, the resistor is removed from the circuit by resetting bit 6 of control register 2. An OTG A device is required to supply power on V BUS .The MAX3301E/MAX3302E provide power to V BUS from V CC or from the internal charge pump. Set bit 5 in control register 2 to 1 in both cases. Bit 5 in control register 2controls a current-limited switch, preventing damage to the device in the event of a V BUS short circuit.An OTG B device (peripheral mode) can request a ses-sion using SRP. One of the steps in implementing SRP requires pulsing V BUS high for a controlled time. A 930Ωresistor limits the current according to the OTG specifi-cation. Pulse V BUS through the pullup resistor by assert-ing bit 7 of control register 2. Prior to pulsing V BUS (bit 7), a B device first connects an internal pulldown resis-tor to discharge V BUS below the session-end threshold.The discharge current is limited by the 5k Ωresistor and set by bit 6 of control register 2. An OTG A device mustMAX3301E/MAX3302EUSB On-the-Go Transceivers and Charge Pumpssupply 5V power and at least 8mA on V BUS . Setting bit 5 of control register 2 turns on the V BUS charge pump.Operating ModesThe MAX3301E/MAX3302E have four operating modes to optimize power consumption. Only the I 2C interface remains active in shutdown mode, reducing supply cur-rent to 1µA. The I 2C interface, the ID_IN port, and the session-valid comparator all remain active in interrupt shutdown mode. RCV asserts low in suspend mode; how-ever, all other circuitry remains active. Table 1 lists the active blocks’ power in each of the operating modes.Applications InformationData TransferTransmitting Data to the USBThe MAX3301E/MAX3302E transceiver features two modes of transmission: DAT_SE0 or VP_VM (see Table 3).Set the transmitting mode with dat_se0 (bit 2 in control register 1, see Table 7). In DAT_SE0 mode with OE/INT low, DAT_VP specifies data for the differential transceiv-er, and SE0_VM forces D+/D- to the single-ended zero (SE0) state. In VP_VM mode with OE/INT low, DAT_VP drives D+, and SE0_VM drives D-. The differential receiver determines the state of RCV.Receiving Data from the USBThe MAX3301E/MAX3302E transceiver features two modes of receiving data: DAT_SE0 or VP_VM (see Table 4). Set the receiving mode with dat_se0 (bit 2 in control register 1, see Table 7). In DAT_SE0 mode with OE/INT high, DAT_VP is the output of the differential receiver and SE0_VM indicates that D+ and D- are both logic-low. In VP_VM mode with OE/INT high, DAT_VP provides the input logic level of D+ and SE0_VM pro-vides the input logic level of D-. The differential receiver determines the state of RCV. VP and VM echo D+ and D-, respectively.OE/INTOE/INT controls the direction of communication. OE/INT can also be programmed to act as an interrupt output when in suspend mode. The output-enable portion con-trols the input or output status of DAT_VP/SE0_VM and D+/D-. When OE/INT is a logic 0, DAT_VP and SE0_VM function as inputs to the D+ and D- outputs in a method depending on the status of dat_se0 (bit 2 in control reg-ister 1). When OE/INT is a logic 1, DAT_VP and SE0_VM indicate the activity of D+ and D-.OE/INT functions as an interrupt output when the MAX3301E/MAX3302E is in suspend mode and oe_int_en = 1 (bit 5 in control register 1, see Table 7). Inthis mode, OE/INT detects the same interrupts as INT .Set irq_mode (bit 1 in special-function register 2, see Tables 15 and 16) to 0 to program OE/INT as an open-drain interrupt output. Set irq_mode to 1 to configure OE/INT as a push-pull interrupt output.RCVRCV monitors D+ and D- when receiving data. RCV is a logic 1 for D+ high and D- low. RCV is a logic 0 for D+low and D- high. RCV retains its last valid state when D+and D- are both low (single-ended zero, or SE0). RCV asserts low in suspend mode. Table 4 shows the state of RCV.SPDUse hardware or software to control the slew rate of the D+ and D- terminals. The SPD input sets the slew rate of the MAX3301E/MAX3302E when spd_susp_ctl (bit 1 in special-function register 1, see Table 14) is 0. Drive SPD low to select low-speed mode (1.5Mbps). Drive SPD high to select full-speed mode (12Mbps). Alternatively,when spd_susp_ctl (bit 1 of special-function register 1)is 1, software controls the slew rate. The SPD input is ignored when using software to control the data rate.The speed bit (bit 0 of control register 1, see Table 7)sets the slew rate when spd_susp_ctl = 1.SUSUse hardware or software to control the suspend mode of the MAX3301E/MAX3302E. Set spd_susp_ctl (bit 1 of special-function register 1, see Table 14) to 0 to allow the SUS input to enable and disable the suspend mode of the MAX3301E/MAX3302E. Drive SUS low for normal operation. Drive SUS high to enable suspend mode.RCV asserts low in suspend mode while all other circuit-ry remains active.Alternatively, when the spd_susp_ctl bit (bit 1 of special-function register 1) is set to 1, software controls the sus-pend mode. Set the suspend bit (bit 1 of control register 1, see Table 7) to 1 to enable suspend mode. Set the suspend bit to 0 to resume normal operation. The SUS input is ignored when using software to control suspend mode. The MAX3301E/MAX3302E must be in full-speed mode (SPD = high or speed = 1) to issue a remote wake-up from the device when in suspend mode. RESETThe active-low RESET input allows the MAX3301E/MAX3302E to be asynchronously reset without cycling the power supply. Drive RESET low to reset the internal registers (see Tables 7–16 for the default power-up states). Drive RESET high for normal operation.M A X 3301E /M A X 3302EUSB On-the-Go Transceivers and Charge Pumps 2-Wire I 2C-Compatible Serial InterfaceA register file controls the various internal switches and operating modes of the MAX3301E/MAX3302E through a simple 2-wire interface operating at clock rates up to 400kHz. This interface supports data bursting, where multiple data phases can follow a single address phase.UART ModeSet uart_en (bit 6 in control register 1) to 1 to place the MAX3301E/MAX3302E in UART mode. D+ transfers data to DAT_VP and SE0_VM transfers data to D- in UART mode.General-Purpose Buffer ModeSet gp_en (bit 7 in special-function register 1) and dat_se0 (bit 2 in control register 1) to 1, set uart_en (bit 6in control register 1) to 0, and drive OE/INT low to place the MAX3301E/MAX3302E in general-purpose buffer mode. Control the direction of data transfer with dmi-nus_dir and dplus_dir (bits 3 and 4 of special-function register 1, see Tables 2 and 14).Serial AddressingThe MAX3301E/MAX3302E operate as a slave device that sends and receives control and status signals through an I 2C-compatible 2-wire interface. The inter-face uses a serial data line (SDA) and a serial clock line (SCL) to achieve bidirectional communication between master(s) and slave(s). A master (typically a microcon-troller) initiates all data transfers to and from the MAX3301E/MAX3302E and generates the SCL clock that synchronizes the data transfer (Figure 13).The MAX3301E/MAX3302E SDA line operates as both an input and as an open-drain output. SDA requires aMAX3302E SCL line only operates as an input. SCL requires a pullup resistor if there are multiple masters on the 2-wire interface, or if the master in a single-master system has an open-drain SCL output.Each transmission consists of a start condition (see F igure 14) sent by a master device, the MAX3301E/MAX3302E 7-bit slave address (determined by the state of ADD), plus an R/W bit (see F igure 15), a register address byte, one or more data bytes, and a stop condi-tion (see Figure 14).Figure 13. 2-Wire Serial-Interface Timing DetailsMAX3301E/MAX3302EUSB On-the-Go Transceivers and Charge PumpsFigure 14. Start and Stop ConditionsFigure 15. Slave AddressM A X 3301E /M A X 3302EUSB On-the-Go Transceivers and Charge PumpsNote 7:Enter suspend mode by driving SUS high or by writing a 1 to suspend (bit 1 in control register 1), depending on the status of spd_susp_ctl in special-function register 1.X = Don’t care.MAX3301E/MAX3302EUSB On-the-Go Transceivers and Charge PumpsStart and Stop ConditionsBoth SCL and SDA assert high when the interface is not busy. A master device signals the beginning of a trans-mission with a start (S) condition by transitioning SDA from high to low while SCL is high. The master issues a stop (P) condition by transitioning SDA from low to high while SCL is high. The bus is then free for another trans-mission (see Figure 14).Bit TransferOne data bit is transferred during each clock pulse. The data on SDA must remain stable while SCL is high (see Figure 16).AcknowledgeThe acknowledge bit (ACK) is the 9th bit attached to any 8-bit data word. ACK is always generated by the receiving device. The MAX3301E/MAX3302E generatean ACK when receiving an address or data by pulling SDA low during the ninth clock period. When transmit-ting data, the MAX3301E/MAX3302E wait for the receiv-ing device to generate an ACK. Monitoring ACK allows for detection of unsuccessful data transfers. An unsuc-cessful data transfer occurs if a receiving device is busy or if a system fault has occurred. In the event of an unsuccessful data transfer, the bus master should reat-tempt communication at a later time.Slave AddressA bus master initiates communication with a slave device by issuing a START condition followed by the 7-bit slave address (see F igure 15). When idle, the MAX3301E/MAX3302E wait for a START condition fol-lowed by its slave address. The LSB of the address word is the read/write (R/W ) bit. R/W indicates whether the master is writing to or reading from the MAX3301E/MAX3302E (R/W = 0 selects the write con-dition, R/W = 1 selects the read condition). After receiving the proper address, the MAX3301E/MAX3302E issue an ACK.The MAX3301E/MAX3302E have two possible addresses (see Table 5). Address bits A6 through A1 are preset,while a reset condition or an I 2C general call address loads the value of A0 from ADD. Connect ADD to GND to set A0 to 0. Connect ADD to V L to set A0 to 1. This allows up to two MAX3301E’s or two MAX3302E’s to share the same bus.Write Byte FormatWriting data to the MAX3301E/MAX3302E requires the transmission of at least 3 bytes. The first byte consists of the MAX3301E/MAX3302E’s 7-bit slave address, fol-lowed by a 0 (R/W bit). The second byte determines which register is to be written to. The third byte is the new data for the selected register. Subsequent bytes are data for sequential registers. F igure 18 shows the typical write byte format.Read Byte FormatReading data from the MAX3301E/MAX3302E requires the transmission of at least 3 bytes. The first byte con-sists of the MAX3301E/MAX3302E’s slave address, fol-lowed by a 0 (R/W bit). The second byte selects the register from which data is read. The third byte consistsFigure 16. Bit TransferFigure 17. Acknowledge。

MAX202EEWE+T中文资料

________________________________________________________________Maxim Integrated Products 1General DescriptionThe MAX202E–MAX213E, MAX232E/MAX241E line drivers/receivers are designed for RS-232 and V.28communications in harsh environments. Each transmitter output and receiver input is protected against ±15kV electrostatic discharge (ESD) shocks, without latchup.The various combinations of features are outlined in the Selector Guide.The drivers and receivers for all ten devices meet all EIA/TIA-232E and CCITT V.28specifications at data rates up to 120kbps, when loaded in accordance with the EIA/TIA-232E specification.The MAX211E/MAX213E/MAX241E are available in 28-pin SO packages, as well as a 28-pin SSOP that uses 60% less board space. The MAX202E/MAX232E come in 16-pin TSSOP, narrow SO, wide SO, and DIP packages. The MAX203E comes in a 20-pin DIP/SO package, and needs no external charge-pump capacitors. The MAX205E comes in a 24-pin wide DIP package, and also eliminates external charge-pump capacitors. The MAX206E/MAX207E/MAX208E come in 24-pin SO, SSOP, and narrow DIP packages. The MAX232E/MAX241E operate with four 1µF capacitors,while the MAX202E/MAX206E/MAX207E/MAX208E/MAX211E/MAX213E operate with four 0.1µF capacitors,further reducing cost and board space.________________________ApplicationsNotebook, Subnotebook, and Palmtop Computers Battery-Powered Equipment Hand-Held EquipmentNext-Generation Device Featureso For Low-Voltage ApplicationsMAX3222E/MAX3232E/MAX3237E/MAX3241E/MAX3246E: ±15kV ESD-Protected Down to10nA, +3.0V to +5.5V, Up to 1Mbps, True RS-232Transceivers (MAX3246E Available in a UCSP™Package)o For Low-Power ApplicationsMAX3221/MAX3223/MAX3243: 1µA SupplyCurrent, True +3V to +5.5V RS-232 Transceivers with Auto-Shutdown™o For Space-Constrained ApplicationsMAX3233E/MAX3235E: ±15kV ESD-Protected,1µA, 250kbps, +3.0V/+5.5V, Dual RS-232Transceivers with Internal Capacitorso For Low-Voltage or Data Cable ApplicationsMAX3380E/MAX3381E: +2.35V to +5.5V, 1µA,2Tx/2Rx RS-232 Transceivers with ±15kV ESD-Protected I/O and Logic PinsMAX202E–MAX213E, MAX232E/MAX241E±15kV ESD-Protected, +5V RS-232 TransceiversSelector Guide19-0175; Rev 6; 3/05Pin Configurations and Typical Operating Circuits appear at end of data sheet.YesPARTNO. OF RS-232DRIVERSNO. OF RS-232RECEIVERSRECEIVERS ACTIVE IN SHUTDOWNNO. OF EXTERNAL CAPACITORS(µF)LOW-POWER SHUTDOWNTTL TRI-STATE MAX202E 220 4 (0.1)No No MAX203E 220None No No MAX205E 550None Yes Yes MAX206E 430 4 (0.1)Yes Yes MAX207E 530 4 (0.1)No No MAX208E 440 4 (0.1)No No MAX211E 450 4 (0.1)Yes Yes MAX213E 452 4 (0.1)Yes Yes MAX232E 220 4 (1)No No MAX241E454 (1)YesFor pricing, delivery, and ordering information,please contact Maxim/Dallas Direct!at 1-888-629-4642, or visit Maxim’s website at .AutoShutdown and UCSP are trademarks of Maxim Integrated Products, Inc.Ordering InformationOrdering Information continued at end of data sheet.2_______________________________________________________________________________________M A X 202E –M A X 213E , M A X 232E /M A X 241EABSOLUTE MAXIMUM RATINGSV CC ..........................................................................-0.3V to +6V V+................................................................(V CC - 0.3V) to +14V V-............................................................................-14V to +0.3V Input VoltagesT_IN............................................................-0.3V to (V+ + 0.3V)R_IN...................................................................................±30V Output VoltagesT_OUT.................................................(V- - 0.3V) to (V+ + 0.3V)R_OUT......................................................-0.3V to (V CC + 0.3V)Short-Circuit Duration, T_OUT....................................Continuous Continuous Power Dissipation (T A = +70°C)16-Pin Plastic DIP (derate 10.53mW/°C above +70°C)....842mW 16-Pin Narrow SO (derate 8.70mW/°C above +70°C).....696mW 16-Pin Wide SO (derate 9.52mW/°C above +70°C)......762mW 16-Pin TSSOP (derate 9.4mW/°C above +70°C)...........755mW20-Pin Plastic DIP (derate 11.11mW/°C above +70°C)...889mW 20-Pin SO (derate 10.00mW/°C above +70°C).............800mW 24-Pin Narrow Plastic DIP(derate 13.33mW/°C above +70°C) ...............................1.07W 24-Pin Wide Plastic DIP(derate 14.29mW/°C above +70°C)................................1.14W 24-Pin SO (derate 11.76mW/°C above +70°C).............941mW 24-Pin SSOP (derate 8.00mW/°C above +70°C)..........640mW 28-Pin SO (derate 12.50mW/°C above +70°C)....................1W 28-Pin SSOP (derate 9.52mW/°C above +70°C)..........762mW Operating Temperature RangesMAX2_ _EC_ _.....................................................0°C to +70°C MAX2_ _EE_ _...................................................-40°C to +85°C Storage Temperature Range.............................-65°C to +165°C Lead Temperature (soldering, 10s).................................+300°CELECTRICAL CHARACTERISTICS(V CC = +5V ±10% for MAX202E/206E/208E/211E/213E/232E/241E; V CC = +5V ±5% for MAX203E/205E/207E; C1–C4 = 0.1µF for MAX202E/206E/207E/208E/211E/213E; C1–C4 = 1µF for MAX232E/241E; T A = T MIN to T MAX ; unless otherwise noted. Typical values are at T A = +25°C.)Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.ELECTRICAL CHARACTERISTICS (continued)MAX202E–MAX213E, MAX232E/MAX241E (V CC= +5V ±10% for MAX202E/206E/208E/211E/213E/232E/241E; V CC= +5V ±5% for MAX203E/205E/207E; C1–C4 = 0.1µF forMAX202E/206E/207E/208E/211E/213E; C1–C4 = 1µF for MAX232E/241E; T A= T MIN to T MAX; unless otherwise noted. Typical valuesare at T A= +25°C.)Note 1:MAX211EE_ _ tested with V CC= +5V ±5%._______________________________________________________________________________________34______________________________________________________________________________________M A X 202E –M A X 213E , M A X 232E /M A X 241E__________________________________________Typical Operating Characteristics(Typical Operating Circuits, V CC = +5V, T A = +25°C, unless otherwise noted.)5.00MAX211E/MAX213ETRANSMITTER OUTPUT VOLTAGEvs. LOAD CAPACITANCELOAD CAPACITANCE (pF)V O H , -V O L (V )5.56.06.57.07.58.0100020003000400050000MAX211E/MAX213E/MAX241E TRANSMITTER SLEW RATE vs. LOAD CAPACITANCELOAD CAPACITANCE (pF)S L E W R A T E ( V /µs )5101520253010002000300040005000_______________________________________________________________________________________5MAX202E–MAX213E, MAX232E/MAX241E____________________________Typical Operating Characteristics (continued)(Typical Operating Circuits, V CC = +5V, T A = +25°C, unless otherwise noted.)2MAX202E/MAX203E/MAX232E TRANSMITTER SLEW RATE vs. LOAD CAPACITANCELOAD CAPACITANCE (pF)S L E W R A T E ( V /µs )468101214100020003000400050005.07.5-7.53000MAX205E–MAX208ETRANSMITTER OUTPUT VOLTAGEvs. LOAD CAPACITANCE-5.02.5LOAD CAPACITANCE (pF)O U T P U T V O L T A G E (V )10002000400050000-2.54550203000MAX205E–MAX208E SUPPLY CURRENT vs. LOAD CAPACITANCE2540LOAD CAPACITANCE (pF)S U P P L Y C U R R E N T (m A )100020004000500035302.55.0-10.0180MAX205E –MAX208EOUTPUT VOLTAGE vs. DATA RATE-7.50DATA RATE (kbps)O U T P U T V O L T A G E (V )601202401503090210-2.5-5.010.07.56_______________________________________________________________________________________M A X 202E –M A X 213E , M A X 232E /M A X 241EMAX203EMAX205E_____________________________________________________________Pin DescriptionsMAX202E/MAX232E_______________________________________________________________________________________7MAX202E–MAX213E, MAX232E/MAX241EMAX208E________________________________________________Pin Descriptions (continued)MAX206EMAX207E8_______________________________________________________________________________________M A X 202E –M A X 213E , M A X 232E /M A X 241EMAX211E/MAX213E/MAX241E)(MAX205E/MAX206E/MAX211E/MAX213E/MAX241E)________________________________________________Pin Descriptions (continued)MAX211E/MAX213E/MAX241EFigure 3. Transition Slew-Rate Circuit_______________Detailed Description The MAX202E–MAX213E, MAX232E/MAX241E consist of three sections: charge-pump voltage converters, drivers (transmitters), and receivers. These E versions provide extra protection against ESD. They survive ±15kV discharges to the RS-232 inputs and outputs, tested using the Human Body Model. When tested according to IEC1000-4-2, they survive ±8kV contact-discharges and ±15kV air-gap discharges. The rugged E versions are intended for use in harsh environments or applications where the RS-232 connection is frequently changed (such as notebook computers). The standard (non-“E”) MAX202, MAX203, MAX205–MAX208, MAX211, MAX213, MAX232, and MAX241 are recommended for applications where cost is critical.+5V to ±10V Dual Charge-PumpVoltage Converter The +5V to ±10V conversion is performed by dual charge-pump voltage converters (Figure 4). The first charge-pump converter uses capacitor C1 to double the +5V into +10V, storing the +10V on the output filter capacitor, C3. The second uses C2 to invert the +10V into -10V, storing the -10V on the V- output filter capacitor, C4.In shutdown mode, V+ is internally connected to V CC by a 1kΩpull-down resistor, and V- is internally connected to ground by a 1kΩpull up resistor.RS-232 Drivers With V CC= 5V, the typical driver output voltage swing is ±8V when loaded with a nominal 5kΩRS-232 receiver. The output swing is guaranteed to meet EIA/TIA-232E and V.28 specifications that call for ±5V minimum output levels under worst-case conditions. These include a 3kΩload, minimum V CC, and maximum operating temperature. The open-circuit output voltage swings from (V+ - 0.6V) to V-.Input thresholds are CMOS/TTL compatible. The unused drivers’ inputs on the MAX205E–MAX208E, MAX211E, MAX213E, and MAX241E can be left unconnected because 400kΩpull up resistors to V CC are included on-chip. Since all drivers invert, the pull up resistors force the unused drivers’ outputs low. The MAX202E, MAX203E, and MAX232E do not have pull up resistors on the transmitter inputs._______________________________________________________________________________________9MAX202E–MAX213E, MAX232E/MAX241E10______________________________________________________________________________________M A X 202E –M A X 213E , M A X 232E /M A X 241E±15kV ESD-Protected, +5V RS-232 Transceivers When in low-power shutdown mode, the MAX205E/MAX206E/MAX211E/MAX213E/MAX241E driver outputs are turned off and draw only leakage currents—even if they are back-driven with voltages between 0V and 12V. Below -0.5V in shutdown, the transmitter output is diode-clamped to ground with a 1k Ωseries impedance.RS-232 ReceiversThe receivers convert the RS-232 signals to CMOS-logic output levels. The guaranteed 0.8V and 2.4V receiver input thresholds are significantly tighter than the ±3V thresholds required by the EIA/TIA-232E specification.This allows the receiver inputs to respond to TTL/CMOS-logic levels, as well as RS-232 levels.The guaranteed 0.8V input low threshold ensures that receivers shorted to ground have a logic 1 output. The 5k Ωinput resistance to ground ensures that a receiver with its input left open will also have a logic 1 output. Receiver inputs have approximately 0.5V hysteresis.This provides clean output transitions, even with slow rise/fall-time signals with moderate amounts of noise and ringing.In shutdown, the MAX213E’s R4 and R5 receivers have no hysteresis.Shutdown and Enable Control (MAX205E/MAX206E/MAX211E/MAX213E/MAX241E)In shutdown mode, the charge pumps are turned off,V+ is pulled down to V CC , V- is pulled to ground, and the transmitter outputs are disabled. This reduces supply current typically to 1µA (15µA for the MAX213E).The time required to exit shutdown is under 1ms, as shown in Figure 5.ReceiversAll MAX213E receivers, except R4 and R5, are put into a high-impedance state in shutdown mode (see Tables 1a and 1b). The MAX213E’s R4 and R5 receivers still function in shutdown mode. These two awake-in-shutdown receivers can monitor external activity while maintaining minimal power consumption.The enable control is used to put the receiver outputs into a high-impedance state, to allow wire-OR connection of two EIA/TIA-232E ports (or ports of different types) at the UART. It has no effect on the RS-232 drivers or the charge pumps.N ote: The enabl e control pin is active l ow for the MAX211E/MAX241E (EN ), but is active high for the MAX213E (EN). The shutdown control pin is active high for the MAX205E/MAX206E/MAX211E/MAX241E (SHDN), but is active low for the MAX213E (SHDN ).Figure 4. Charge-Pump DiagramMAX202E–MAX213E, MAX232E/MAX241EV+V-200µs/div3V 0V 10V 5V 0V -5V -10VSHDNMAX211EFigure 5. MAX211E V+ and V- when Exiting Shutdown (0.1µF capacitors)X = Don't care.*Active = active with reduced performanceSHDN E N OPERATION STATUS Tx Rx 00Normal Operation All Active All Active 01Normal Operation All Active All High-Z 1XShutdownAll High-ZAll High-ZTable 1a. MAX205E/MAX206E/MAX211E/MAX241E Control Pin ConfigurationsTable 1b. MAX213E Control Pin ConfigurationsThe MAX213E’s receiver propagation delay is typically 0.5µs in normal operation. In shutdown mode,propagation delay increases to 4µs for both rising and falling transitions. The MAX213E’s receiver inputs have approximately 0.5V hysteresis, except in shutdown,when receivers R4 and R5 have no hysteresis.When entering shutdown with receivers active, R4 and R5 are not valid until 80µs after SHDN is driven low.When coming out of shutdown, all receiver outputs are invalid until the charge pumps reach nominal voltage levels (less than 2ms when using 0.1µF capacitors).±15kV ESD ProtectionAs with all Maxim devices, ESD-protection structures are incorporated on all pins to protect against electrostatic discharges encountered during handling and assembly. The driver outputs and receiver inputs have extra protection against static electricity. Maxim’s engineers developed state-of-the-art structures to protect these pins against ESD of ±15kV without damage. The ESD structures withstand high ESD in all states: normal operation, shutdown, and powered down. After an ESD event, Maxim’s E versions keep working without latchup, whereas competing RS-232products can latch and must be powered down to remove latchup.ESD protection can be tested in various ways; the transmitter outputs and receiver inputs of this product family are characterized for protection to the following limits:1)±15kV using the Human Body Model2)±8kV using the contact-discharge method specifiedin IEC1000-4-23)±15kV using IEC1000-4-2’s air-gap method.ESD Test ConditionsESD performance depends on a variety of conditions.Contact Maxim for a reliability report that documents test set-up, test methodology, and test results.Human Body ModelFigure 6a shows the Human Body Model, and Figure 6b shows the current waveform it generates when discharged into a low impedance. This model consists of a 100pF capacitor charged to the ESD voltage of interest, which is then discharged into the test device through a 1.5k Ωresistor.S H D N ENOPERATION STATUS Tx 1–400Shutdown All High-Z 01Shutdown All High-Z 10Normal Operation 11Normal OperationAll ActiveAll Active Active1–34, 5High-Z ActiveHigh-Z High-Z High-Z Active*High-Z RxM A X 202E –M A X 213E , M A X 232E /M A X 241EIEC1000-4-2The IEC1000-4-2 standard covers ESD testing and performance of finished equipment; it does not specifically refer to integrated circuits. The MAX202E/MAX203E–MAX213E, MAX232E/MAX241E help you design equipment that meets level 4 (the highest level) of IEC1000-4-2, without the need for additional ESD-protection components.The major difference between tests done using the Human Body Model and IEC1000-4-2 is higher peak current in IEC1000-4-2, because series resistance is lower in the IEC1000-4-2 model. Hence, the ESD withstand voltage measured to IEC1000-4-2 is generally lower than that measured using the Human Body Model. Figure 7b shows the current waveform for the 8kV IEC1000-4-2 level-four ESD contact-discharge test.The air-gap test involves approaching the device with a charged probe. The contact-discharge method connects the probe to the device before the probe is energized.Machine ModelThe Machine Model for ESD tests all pins using a 200pF storage capacitor and zero discharge resistance. Its objective is to emulate the stress caused by contact that occurs with handling and assembly during manufacturing. Of course, all pins require this protection during manufacturing, not just RS-232 inputs and outputs. Therefore,after PC board assembly,theMachine Model is less relevant to I/O ports.Figure 7a. IEC1000-4-2 ESD Test ModelFigure 7b. IEC1000-4-2 ESD Generator Current WaveformFigure 6a. Human Body ESD Test ModelFigure 6b. Human Body Model Current Waveform__________Applications InformationCapacitor Selection The capacitor type used for C1–C4 is not critical for proper operation. The MAX202E, MAX206–MAX208E, MAX211E, and MAX213E require 0.1µF capacitors, and the MAX232E and MAX241E require 1µF capacitors, although in all cases capacitors up to 10µF can be used without harm. Ceramic, aluminum-electrolytic, or tantalum capacitors are suggested for the 1µF capacitors, and ceramic dielectrics are suggested for the 0.1µF capacitors. When using the minimum recommended capacitor values, make sure the capacitance value does not degrade excessively as the operating temperature varies. If in doubt, use capacitors with a larger (e.g., 2x) nominal value. The capacitors’ effective series resistance (ESR), which usually rises at low temperatures, influences the amount of ripple on V+ and V-.Use larger capacitors (up to 10µF) to reduce the output impedance at V+ and V-. This can be useful when “stealing” power from V+ or from V-. The MAX203E and MAX205E have internal charge-pump capacitors. Bypass V CC to ground with at least 0.1µF. In applications sensitive to power-supply noise generated by the charge pumps, decouple V CC to ground with a capacitor the same size as (or larger than) the charge-pump capacitors (C1–C4).V+ and V- as Power Supplies A small amount of power can be drawn from V+ and V-, although this will reduce both driver output swing and noise margins. Increasing the value of the charge-pump capacitors (up to 10µF) helps maintain performance when power is drawn from V+ or V-.Driving Multiple Receivers Each transmitter is designed to drive a single receiver. Transmitters can be paralleled to drive multiple receivers.Driver Outputs when Exiting Shutdown The driver outputs display no ringing or undesirable transients as they come out of shutdown.High Data Rates These transceivers maintain the RS-232 ±5.0V minimum driver output voltages at data rates of over 120kbps. For data rates above 120kbps, refer to the Transmitter Output Voltage vs. Load Capacitance graphs in the Typical Operating Characteristics. Communication at these high rates is easier if the capacitive loads on the transmitters are small; i.e., short cables are best.Table 2. Summary of EIA/TIA-232E, V.28 SpecificationsMAX202E–MAX213E, MAX232E/MAX241EM A X 202E –M A X 213E , M A X 232E /M A X 241E____________Pin Configurations and Typical Operating Circuits (continued)Table 3. DB9 Cable ConnectionsCommonly Used for EIA/TIAE-232E and V.24 Asynchronous Interfaces____________Pin Configurations and Typical Operating Circuits (continued)MAX202E–MAX213E, MAX232E/MAX241EM A X 202E –M A X 213E , M A X 232E /M A X 241E____________Pin Configurations and Typical Operating Circuits (continued)MAX202E–MAX213E, MAX232E/MAX241E____________Pin Configurations and Typical Operating Circuits (continued)M A X 202E –M A X 213E , M A X 232E /M A X 241E____________Pin Configurations and Typical Operating Circuits (continued)MAX202E–MAX213E, MAX232E/MAX241E____________Pin Configurations and Typical Operating Circuits (continued)M A X 202E –M A X 213E , M A X 232E /M A X 241E____________Pin Configurations and Typical Operating Circuits (continued)______________________________________________________________________________________21MAX202E–MAX213E, MAX232E/MAX241E Ordering Information (continued)*Dice are specified at T A= +25°C.M A X 202E –M A X 213E , M A X 232E /M A X 241E22________________________________________________________________________________________________________________________________________________Chip Topographies___________________Chip InformationC1-V+C1+V CC R2INT2OUT R2OUT0.117"(2.972mm)0.080"(2.032mm)V-C2+ C2-T2IN T1OUT R1INR1OUT T1INGNDR5INV-C2-C2+C1-V+C1+V CC T4OUTR3IN T3OUTT1OUT 0.174"(4.420mm)0.188"(4.775mm)T4IN R5OUT R4OUT T3IN R4IN EN (EN) SHDN (SHDN)R3OUT T2OUT GNDR1IN R1OUT T2IN R2OUTR2IN T1IN ( ) ARE FOR MAX213E ONLYTRANSISTOR COUNT: 123SUBSTRATE CONNECTED TO GNDTRANSISTOR COUNT: 542SUBSTRATE CONNECTED TO GNDMAX202E/MAX232EMAX211E/MAX213E/MAX241EMAX205E/MAX206E/MAX207E/MAX208E TRANSISTOR COUNT: 328SUBSTRATE CONNECTED TO GNDMAX202E–MAX213E, MAX232E/MAX241E Package InformationM A X 202E –M A X 213E , M A X 232E /M A X 241EPackage Information (continued)MAX202E–MAX213E, MAX232E/MAX241E±15kV ESD-Protected, +5V RS-232 TransceiversMaxim cannot assume responsibility for use of any circuitry other than circuitry entirely embodied in a Maxim product. No circuit patent licenses are implied. Maxim reserves the right to change the circuitry and specifications without notice at any time.Maxim Integrated Products, 120 San Gabriel Drive, Sunnyvale, CA 94086 408-737-7600 ____________________25©2005 Maxim Integrated ProductsPrinted USAis a registered trademark of Maxim Integrated Products, Inc.Package Information (continued)(The package drawing(s) in this data sheet may not reflect the most current specifications. For the latest package outline information go to /packages .)。

MAX3181EEUK-T资料

For free samples & the latest literature: , or phone 1-800-998-8800.For small orders, phone 1-800-835-8769.General DescriptionThe MAX3180E–MAX3183E single RS -232 receivers in a SOT23-5 package are designed for space- and cost-constrained applications requiring minimal RS -232communications. The receiver inputs are protected to ±15kV using IEC 1000-4-2 Air-Gap Discharge, to ±8kV using IEC 1000-4-2 Contact Discharge, and to ±15kV per the Human Body Model, ensuring compliance with international standards.The devices minimize power and heat dissipation by consuming only 0.5µA supply current from a +3.0V to +5.5V supply, and they guarantee true RS -232 perfor-mance up to a 1.5Mbps data rate. The MAX3180E/MAX3182E feature a three-state TTL/CMOS receiver output that is controlled by an EN logic input. The MAX3181E/MAX3183E feature an INVALID output that indicates valid RS-232 signals at the receiver input for applications requiring automatic system wake-up. The MAX3182E/MAX3183E have a noninverting output,while the MAX3180E/MAX3181E have a standard inverting output.ApplicationsFeatureso Tiny SOT23-5 Packageo ESD-Protected RS-232 Input±15kV—Human Body Model±8kV—IEC 1000-4-2, Contact Discharge ±15kV—IEC 1000-4-2, Air-Gap Discharge o 0.5µA Supply Currento 1.5Mbps Guaranteed Data Rateo Meets EIA/TIA-232 and V.28/V.24 Specifications Down to V CC = +3.0V o INVALID Output Indicates Valid RS-232 Signal at Receiver Input (MAX3181E/MAX3183E)o Three-State TTL/CMOS Receiver Output (MAX3180E/MAX3182E)o Noninverting RS-232 Output (MAX3182E/MAX3183E)MAX3180E–MAX3183E±15kV ESD-Protected, 0.5µA, +3V to +5.5V ,1.5Mbps RS-232 Receivers in SOT23-5________________________________________________________________Maxim Integrated Products 119-1479; Rev 1; 7/99Ordering InformationM A X 3180E –M A X 3183E±15kV ESD-Protected, 0.5µA, +3V to +5.5V ,1.5Mbps RS-232 Receivers in SOT23-52_______________________________________________________________________________________ABSOLUTE MAXIMUM RATINGSELECTRICAL CHARACTERISTICS(V CC = +3.0V to +5.5V, T A = T MIN to T MAX , unless otherwise noted. Typical values are at V CC = +5.0V, T A = +25°C.) (Note 1)Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.V CC to GND..............................................................-0.3V to +6V RIN to GND..........................................................................±25V EN , ROUT, INVALID to GND......................-0.3V to (V CC + 0.3V)Continuous Power Dissipation (T A = +70°C)SOT23-5 (derate 7.1mW/°C above +70°C)...................571mWOperating Temperature Range ...........................-40°C to +85°C Storage Temperature Range.............................-65°C to +150°C Lead Temperature (soldering, 10sec).............................+300°CMAX3180E–MAX3183E±15kV ESD-Protected, 0.5µA, +3V to +5.5V ,1.5Mbps RS-232 Receivers in SOT23-5_______________________________________________________________________________________3ELECTRICAL CHARACTERISTICS (continued)(V CC = +3.0V to +5.5V, T A = T MIN to T MAX , unless otherwise noted. Typical values are at V CC = +5.0V, T A = +25°C.) (Note 1)Typical Operating Characteristics(V CC = +5V, T A = +25°C, unless otherwise noted.)00.20.10.40.30.60.50.700.51.0 1.5SUPPLY CURRENT vs. DATA RATEDATA RATE (Mbps)S U P P L Y C U R R E N T (m A )2302702502903303103503.0 3.5 5.04.54.0 5.5RIN TO INVALID HIGH vs. SUPPLY VOLTAGEM A X 3180E -02V CC (V)t I N V H (n s )Note 1:Specifications are 100% tested at T A = +25°C. Limits over temperature are guaranteed by design.Detailed DescriptionThe MAX3180E–MAX3183E are EIA/TIA-232 and V.28/V.24communications receivers that convert RS -232signals to CMOS logic levels. They operate on a +3V to +5.5V supply, have 1.5Mbps data rate capability, and feature enhanced electrostatic discharge (ESD) protec-tion (see ESD Protection ). All of these devices achieve a typical supply current of 0.5µA. The MAX3180E/MAX3182E have a receiver enable control (EN ). The MAX3181E/MAX3183E contain a signal invalid output (INVALID ). The MAX3180E/MAX3181E invert the ROUT signal relative to RIN (standard RS -232). The MAX3182E/MAX3183E outputs are not inverted. The devices come in tiny SOT23-5 packages.M A X 3180E –M A X 3183E±15kV ESD-Protected, 0.5µA, +3V to +5.5V ,1.5Mbps RS-232 Receivers in SOT23-54_______________________________________________________________________________________25353045405550603.03.54.04.55.05.5RIN TO INVALID LOW vs. V CCM A X 3180E -03V CC (V)t I N V L (µs )Typical Operating Characteristics (continued)(V CC = +5V, T A = +25°C, unless otherwise noted.)5V010V 0-10V RINROUTENABLE5V 0500ns/divMAX3180EENABLE ASSERTION TO ROUT RESPONSEV CC = 5.0V R L = 50k ΩC L = 100pFReceiver Output EnablePin DescriptionFUNCTIONOutput of the Valid Input Detector Inverting Receiver Output Figure 1. Receiver Propagation-Delay Timing Noninverting Receiver OutputSignal Invalid DetectorIf no valid signal levels appear on RIN for 30µs (typ),INVALID goes low. This event typically occurs if the RS -232 cable is disconnected, or if the connected peripheral transmitter is turned off. INVALID goes high when a valid level is applied to the RS -232 receiver input. Figure 2 shows the input levels and timing dia-gram for INVALID operation.Enable InputThe MAX3180E/MAX3182E feature an enable input (EN ). Drive EN high to force ROUT into a high-imped-ance state. In this state, the devices ignore incoming RS-232 signals. Pull EN low for normal operation.ESD ProtectionAs with all Maxim devices, ES D protection structures are incorporated on all pins to protect against ES D encountered during handling and assembly. The receiver inputs of the MAX3180E–MAX3183E have extra protection against static electricity. Maxim’s engineers have developed state-of-the-art structures enabling these pins to withstand ESD up to ±15kV without dam-age or latchup. The receiver inputs of the MAX3180E–MAX3183E are characterized for protection to the fol-lowing limits:•±15kV using the Human Body Model•±8kV using the Contact Discharge method specified in IEC 1000-4-2•±15kV using the Air-Gap Discharge method speci-fied in IEC 1000-4-2Human Body ModelFigure 3 shows the Human Body Model, and Figure 4shows the current waveform it generates when dis-charged into a low impedance. This model consists ofa 100pF capacitor charged to the ESD voltage of inter-est, and then discharged into the test device through a 1.5k Ωresistor.MAX3180E–MAX3183E±15kV ESD-Protected, 0.5µA, +3V to +5.5V ,1.5Mbps RS-232 Receivers in SOT23-5_______________________________________________________________________________________5Figure 3. Human Body ESD Test ModelFigure 4. Human Body Model Current WaveformFigure 2. Input Levels and INVALID TimingM A X 3180E –M A X 3183EIEC 1000-4-2The IEC 1000-4-2 standard covers ES D testing and performance of finished equipment; it does not specifi-cally refer to ICs. The MAX3180E–MAX3183E enable the design of equipment that meets the highest level (Level 4) of IEC 1000-4-2 without the need for additional ESD-protection components.The major difference between tests done using the Human Body Model and IEC 1000-4-2 is higher peak current in IEC 1000-4-2. Because series resistance is lower in the IEC 1000-4-2 model, the ES D withstand voltage measured to this standard is generally lower than that measured using the Human Body. Figure 5shows the IEC 1000-4-2 model, and Figure 6 shows thecurrent waveform for the ±8kV IEC 1000-4-2 Level 4ESD Contact Discharge test.The Air-Gap test involves approaching the device with a charged probe. The Contact Discharge method con-nects the probe to the device before the probe is ener-gized.Power-Supply DecouplingIn most circumstances, a 0.1µF V CC bypass capacitor is adequate. Connect the bypass capacitor as close to the IC as possible.±15kV ESD-Protected, 0.5µA, +3V to +5.5V ,1.5Mbps RS-232 Receivers in SOT23-56_______________________________________________________________________________________Figure 5. IEC 1000-4-2 ESD Test ModelFigure 6. IEC 1000-4-2 ESD Generator Current WaveformMAX3180E–MAX3183E±15kV ESD-Protected, 0.5µA, +3V to +5.5V ,1.5Mbps RS-232 Receivers in SOT23-5_______________________________________________________________________________________7Pin Configurations/Functional Diagrams___________________Chip InformationTRANSISTOR COUNT: 41M A X 3180E –M A X 3183E±15kV ESD-Protected, 0.5µA, +3V to +5.5V ,1.5Mbps RS-232 Receivers in SOT23-5Maxim cannot assume responsibility for use of any circuitry other than circuitry entirely embodied in a Maxim product. No circuit patent licenses are implied. Maxim reserves the right to change the circuitry and specifications without notice at any time.8_____________________Maxim Integrated Products, 120 San Gabriel Drive, Sunnyvale, CA 94086 408-737-7600©1999 Maxim Integrated ProductsPrinted USAis a registered trademark of Maxim Integrated Products.Package Information。

MAX4590EAE-T中文资料

General DescriptionThe MAX4580/MAX4590/MAX4600 dual analog switches feature low on-resistance of 1.25Ωmax. On-resistance is matched between switches to 0.25Ωmax and is flat (0.3Ωmax) over the specified signal range. Each switch can handle Rail-to-Rail ®analog signals. The off-leakage current is only 2.5nA max at +85°C. These analog switches are ideal in low-distortion applications and are the preferred solution over mechanical relays in automat-ic test equipment or applications where current switching is required. They have low power requirements, require less board space, and are more reliable than mechanical relays.The MAX4580 has two NC (normally closed) switches,the MAX4590 has two NO (normally open) switches,and the MAX4600 has one NC (normally closed) and one NO (normally open) switch.These switches operate from a +4.5V to +36V single supply or from ±4.5V to ±20V dual supplies. All digital inputs have +0.8V and +2.4V logic thresholds, ensuring TTL/CMOS-logic compatibility when using a +12V sin-gle supply or ±15V dual supplies.ApplicationsReed Relay Replacement Test EquipmentCommunication Systems PBX, PABX SystemsFeatureso Low On-Resistance (1.25Ωmax)o Guaranteed R ON Match Between Channels (0.25Ωmax)o Guaranteed R ON Flatness Over Specified Signal Range (0.3Ωmax)o Rail-to-Rail Signal Handlingo Guaranteed ESD Protection >2kV per Method 3015.7o Single-Supply Operation: +4.5V to +36V Dual-Supply Operation: ±4.5V to ±20V o TTL/CMOS-Compatible Control InputsMAX4580/MAX4590/MAX46001.25Ω, Dual SPST,CMOS Analog Switches________________________________________________________________Maxim Integrated Products119-1394; Rev 1; 6/03Ordering Information continued at end of data sheet.Rail-to-Rail is a registered trademark of Nippon Motorola, Ltd.Pin Configurations/Functional Diagrams/Truth TablesOrdering InformationFor pricing, delivery, and ordering information,please contact Maxim/Dallas Direct!at 1-888-629-4642, or visit Maxim’s website at .M A X 4580/M A X 4590/M A X 46001.25Ω, Dual SPST,CMOS Analog Switches 2_______________________________________________________________________________________ABSOLUTE MAXIMUM RATINGSStresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.V+ to GND..............................................................-0.3V to +44V V- to GND...............................................................+0.3V to -44V V+ to V-...................................................................-0.3V to +44V V L to GND....................................................-0.3V to (V+ + 0.3V)All Other Pins to GND (Note 1) ...........(V- - 0.3V) to (V+ + 0.3V)Continuous Current (COM_, NO_, NC_) .......................±200mA Peak Current (COM_, NO_, NC_)(pulsed at 1ms, 10% duty cycle) ..............................±300mAContinuous Power Dissipation (T A = +70°C)16 SSOP (derate 7.1mW/°C above +70°C).................571mW 16 Wide SO (derate 9.52mW/°C above +70°C) ..........762mW 16 Plastic DIP (derate 10.53mW/°C above +70°C).....842mW Operating Temperature RangesMAX4_ _0C_E ....................................................0°C to +70°C MAX4_ _0E_E ..................................................-40°C to +85°C Storage Temperature Range ...........................-65°C to +160°C Lead Temperature (soldering, 10sec) ............................+300°CELECTRICAL CHARACTERISTICS–Dual Supplies(V+ = +15V, V- = -15V, V L = +5V, V IN_H = +2.4V, V IN_L = +0.8V, T A = T MIN to T MAX , unless otherwise noted. Typical values are at T A = +25°C.)Note 1:Signals on NC_, NO_, COM_, or IN_ exceeding V+ or V- are clamped by internal diodes. Limit forward diode current tomaximum current rating.ELECTRICAL CHARACTERISTICS–Dual Supplies (continued)MAX4580/MAX4590/MAX46001.25Ω, Dual SPST,CMOS Analog Switches (V+ = +15V, V- = -15V, V L= +5V, V IN_H= +2.4V, V IN_L= +0.8V, T A = T MIN to T MAX, unless otherwise noted. Typical values are atT A= +25°C.)_______________________________________________________________________________________3M A X 4580/M A X 4590/M A X 46001.25Ω, Dual SPST,CMOS Analog Switches 4_______________________________________________________________________________________ELECTRICAL CHARACTERISTICS–Single Supply(V+ = +12V, V- = 0, V L = +5V, V INH = 2.4V, V INL = 0.8V, T A = T MIN to T MAX , unless otherwise noted. Typical values are at T = +25°C.)MAX4580/MAX4590/MAX46001.25Ω, Dual SPST,CMOS Analog Switches_______________________________________________________________________________________5ELECTRICAL CHARACTERISTICS—Single Supply (continued)(V+ = +12V, V- = 0, V L = +5V, V IN_H = 2.4V, V IN_L = 0.8V, T A = T MIN to T MAX , unless otherwise noted. Typical values are at T A = +25°C.)Note 2:The algebraic convention, where the most negative value is a minimum and the most positive value a maximum, is used inthis data sheet.Note 3:Guaranteed by design.Note 4:∆R ON = R ON(MAX)- R ON(MIN).Note 5:Flatness is defined as the difference between the maximum and minimum value of on-resistance as measured over thespecified analog signal range.Note 6:Leakage parameters are 100% tested at maximum-rated hot temperature and guaranteed by correlation at +25°C.Note 7:Off-isolation = 20 log 10[V COM / (V NC or V NO )], V COM = output, V NC or V NO = input to off switch.Note 8:Between any two switches.Note 9:Leakage testing at single supply is guaranteed by testing with dual supplies.0.51.01.52.02.5-20-12-8-16-448121620ON-RESISTANCE vs. V COM(DUAL SUPPLIES)V COM (V)R O N (Ω)ON-RESISTANCE vs. V COMAND TEMPERATURE (DUAL SUPPLIES)V COM (V)R O N (Ω)129-12-9-63-360.50.60.70.80.91.01.11.20.4-1515ON-RESISTANCE vs. V COM(SINGLE SUPPLY)V COM (V)R O N (Ω)2220181614121086421234524Typical Operating Characteristics(Circuit of Figure 1, T A = +25°C, unless otherwise noted.)Typical Operating Characteristics (continued)(Circuit of Figure 1, T A = +25°C, unless otherwise noted.)M A X 4580/M A X 4590/M A X 46001.25Ω, Dual SPST,CMOS Analog Switches 6_______________________________________________________________________________________ON-RESISTANCE vs. V COMAND TEMPERATURE (SINGLE SUPPLY)V COM (V)R O N (Ω)11108923456710.250.500.751.001.251.501.752.002.2500120.0010.010.11100101000-4020-20406080100POWER-SUPPLY CURRENTvs. TEMPERATURETEMPERATURE (°C)I +, I - (n A )10,0000.0010.01110-4020-20406080100ON/OFF-LEAKAGE vs. TEMPERATURETEMPERATURE (°C)L E A K A G E (n A )-500-3000200400-400-100100300500-15-50-10515CHARGE INJECTIONvs. V COMV COM (V)Q (p C )10-2000-1000.011100.1100-80FREQUENCY (MHz)L O S S (d B )P H A S E (d e g r e e s )-60-40-20-90-70-50-30-10+180-720-540-360-1800-630-450-270-90+9050100150250300-4010-15356085TURN-ON/TURN-OFF TIME vs. TEMPERATURETEMPERATURE (°C)t O N , t O F F (n s )MAX4580/MAX4590/MAX46001.25Ω, Dual SPST,CMOS Analog Switches_______________________________________________________________________________________7801202001602402801012111314151617181920TURN-ON/TURN-OFF TIME vs. SUPPLY VOLTAGEV+, V- (V)t O N , t O F F (n s )Typical Operating Characteristics (continued)(Circuit of Figure 1, T A = +25°C, unless otherwise noted.)TURN-ON/TURN-OFF TIME vs. V COMV COM (V)t O N , t O F F (n s )8642-2-4-6-8120140160180200220100-1010Pin DescriptionM A X 4580/M A X 4590/M A X 46001.25Ω, Dual SPST,CMOS Analog Switches8__________________________________________________________________________________________________Applications InformationOvervoltage ProtectionProper power-supply sequencing is recommended for all CMOS devices. Do not exceed the absolute maxi-mum ratings, because stresses beyond the listed rat-ings can cause permanent damage to the devices.Always sequence V+ on first, then V-, followed by the logic inputs, NO, or COM. If power-supply sequencing is not possible, add two small signal diodes (D1, D2) in series with supply pins for overvoltage protection (Figure 1). Adding diodes reduces the analog signal range to one diode drop below V+ and one diode drop above V-, but does not affect the devices’ low switch resistance and low leakage characteristics. Device operation is unchanged, and the difference between V+and V- should not exceed 44V. These protection diodes are not recommended when using a single supply.Figure 1. Overvoltage Protection Using External Blocking DiodesFigure 2. Switching-Time Test CircuitMAX4580/MAX4590/MAX46001.25Ω, Dual SPST,CMOS Analog Switches_______________________________________________________________________________________9Figure 4. Off-Isolation Test Circuit Figure 5. Crosstalk Test CircuitM A X 4580/M A X 4590/M A X 46001.25Ω, Dual SPST,CMOS Analog Switches 10______________________________________________________________________________________Ordering Information (continued)___________________Chip InformationTRANSISTOR COUNT: 100Figure 6. Switch Off-Capacitance Test CircuitFigure 7. Switch On-Capacitance Test CircuitPackage InformationMAX4580/MAX4590/MAX46001.25Ω, Dual SPST,CMOS Analog Switches (The package drawing(s) in this data sheet may not reflect the most current specifications. For the latest package outline informationgo to /packages.) Array______________________________________________________________________________________11M A X 4580/M A X 4590/M A X 46001.25Ω, Dual SPST,CMOS Analog Switches S O I C W .E P SPackage Information (continued)(The package drawing(s) in this data sheet may not reflect the most current specifications. For the latest package outline information go to /packages .)Ma xim ca nnot a ssume responsibility for use of a ny circuitry other tha n circuitry entirely embodied in a Ma xim product. No circuit pa tent licenses a re implied. Maxim reserves the right to change the circuitry and specifications without notice at any time.12____________________Maxim Integrated Products, 120 San Gabriel Drive, Sunnyvale, CA 94086 408-737-7600©2003 Maxim Integrated ProductsPrinted USAis a registered trademark of Maxim Integrated Products.。

MAX4130EUK+T,MAX4130EUK+T,MAX4132ESA+,MAX4132EUA+,MAX4131ESA,MAX4131EBT+T, 规格书,Datasheet 资料

MAX4130–MAX4134________________________________________________________________Maxim Integrated Products1For pricing, delivery, and ordering information,please contact Maxim/Dallas Direct!at 1-888-629-4642, or visit Maxim’s website at .General DescriptionThe MAX4130–MAX4134 family of operational amplifiers combines 10MHz gain-bandwidth product and excellent DC accuracy with Rail-to-Rail ®operation at the inputs and outputs. These devices require only 900µA per amplifier, and operate from either a single supply (+2.7V to +6.5V) or dual supplies (±1.35V to ±3.25V) with a common-mode voltage range that extends 250mV beyond V EE and V CC . They are capable of driving 250Ωloads and are unity-gain stable. In addition, the MAX4131/ MAX4133 feature a shutdown mode in which the outputs are placed in a high-impedance state and the supply current is reduced to only 25µA per amplifier.With their rail-to-rail input common-mode range and output swing, the MAX4130–MAX4134 are ideal for low-voltage, single-supply operation. Although the minimum operating voltage is specified at 2.7V, the devices typically operate down to 1.8V. In addition, low offset voltage and high speed make them the ideal signal-conditioning stages for precision, low-voltage data-acquisition systems. The MAX4130 is offered in the space-saving 5-pin SOT23 package. The MAX4131 is offered in the ultra-small 6-bump, 1mm x 1.5mm chip-scale package (UCSP™).________________________ApplicationsBattery-Powered Instruments Portable Equipment Data-Acquisition Systems Signal ConditioningLow-Power, Low-Voltage ApplicationsFeatureso 6-Bump UCSP (MAX4131)o +2.7V to +6.5V Single-Supply Operationo Rail-to-Rail Input Common-Mode Voltage Rangeo Rail-to-Rail Output Voltage Swing o 10MHz Gain-Bandwidth Product o 900µA Quiescent Current per Amplifier o 25µA Shutdown Function (MAX4131/MAX4133)o 200µV Offset Voltageo No Phase Reversal for Overdriven Inputs o Drive 250ΩLoadso Stable with 160pF Capacitive Loads o Unity-Gain StableSingle/Dual/Quad, Wide-Bandwidth, Low-Power,Single-Supply, Rail-to-Rail I/O Op Amps19-1089; Rev 3; 3/03*Dice are specified at T A = +25°C. DC parameters only.Ordering Information continued at end of data sheet.Pin Configurations appear at end of data sheet.Rail-to-Rail is a registered trademark of Nippon Motorola, Ltd.UCSP is a trademark of Maxim Integrated Products, Inc.M A X 4130–M A X 4134Single/Dual/Quad, Wide-Bandwidth, Low-Power,Single-Supply Rail-to-Rail I/O Op Amps 2_______________________________________________________________________________________ABSOLUTE MAXIMUM RATINGSDC ELECTRICAL CHARACTERISTICS(V CC = +2.7V to +6.5V, V EE = 0V, V CM = 0V, V OUT = V CC /2, R L tied to V CC /2, SHDN ≥2V (or open), T A = +25°C , unless otherwise noted.)Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.Supply Voltage (V CC - V EE )...................................................7.5V IN+, IN-, SHDN Voltage...................(V CC + 0.3V) to (V EE - 0.3V)Output Short-Circuit Duration (Note 1).......................Continuous(short to either supply)Continuous Power Dissipation (T A = +70°C)5-Pin SOT23 (derate 7.1mW/°C above +70°C)............571mW 6-Bump UCSP (derate 2.9mW/°C above +70°C).........308mW 8-Pin SO (derate 5.88mW/°C above +70°C)................471mW8-Pin µMAX (derate 4.10mW/°C above +70°C)...........330mW 14-Pin SO (derate 8.00mW/°C above +70°C)..............640mW Operating Temperature RangeMAX413_E__...................................................-40°C to +85°C Maximum Junction Temperature.....................................+150°C Storage Temperature Range.............................-65°C to +160°C Lead Temperature (soldering, 10s).................................+300°C Bump Reflow Temperature .........................................+235°CNote 1:Provided that the maximum package power-dissipation rating is not exceeded.MAX4130–MAX4134Single/Dual/Quad, Wide-Bandwidth, Low-Power,Single-Supply Rail-to-Rail I/O Op AmpsDC ELECTRICAL CHARACTERISTICS (continued)(V CC = +2.7V to +6.5V, V EE = 0V, V CM = 0V, V OUT = V CC /2, R L tied to V CC /2, SHDN ≥2V (or open), T A = +25°C , unless otherwise noted.)DC ELECTRICAL CHARACTERISTICS(V CC = +2.7V to +6.5V, V EE = 0V, V CM = 0V, V OUT = V CC /2, R L tied to V CC /2, SHDN ≥2V (or open), T A = -40°C to +85°C , unlessM A X 4130–M A X 4134Single/Dual/Quad, Wide-Bandwidth, Low-Power,Single-Supply Rail-to-Rail I/O Op Amps 4_______________________________________________________________________________________DC ELECTRICAL CHARACTERISTICS(V CC = +2.7V to +6.5V, V EE = 0V, V CM = 0V, V OUT = V CC /2, R L tied to V CC /2, SHDN ≥2V (or open), T A = -40°C to +85°C , unlessMAX4130–MAX4134Single/Dual/Quad, Wide-Bandwidth, Low-Power,Single-Supply Rail-to-Rail I/O Op Amps_______________________________________________________________________________________5DC ELECTRICAL CHARACTERISTICS (continued)(V CC = +2.7V to +6.5V, V EE = 0V, V CM = 0V, V OUT = V CC /2, R L tied to V CC /2, SHDN ≥2V (or open), T A = -40°C to +85°C , unless otherwise noted.) (Note 2)AC ELECTRICAL CHARACTERISTICSM A X 4130–M A X 4134Single/Dual/Quad, Wide-Bandwidth, Low-Power,Single-Supply, Rail-to-Rail I/O Op Amps 6_______________________________________________________________________________________60-401001k 10k 1M 10M100k 100M GAIN AND PHASE vs. FREQUENCY-20FREQUENCY (Hz)G A I N (d B )02040P H A S E (D E G R E E S )180144720-72-144-180-108-363610860-401001k 10k 1M 10M100k 100MGAIN AND PHASEvs. FREQUENCY (WITH C)-20FREQUENCY (Hz)G A I N (d B )2040P H A S E (D E G R E E S )180144720-72-144-180-108-36361080-100101001k100k1M10M10k 100MPOWER-SUPPLY REJECTIONvs. FREQUENCY-80FREQUENCY (Hz)P S R (d B )-60-40-2001051520253530454050-40-25-105203550658095SHUTDOWN SUPPLY CURRENTvs. TEMPERATURETEMPERATURE (°C)S U P P L Y C U R R E N T (µA )1000.100.011001k100k1M10M10k100MOUTPUT IMPEDANCE vs. FREQUENCYFREQUENCY (Hz)O U T P U T I M P E D A N C E (Ω)1101150800850900950105010001100-40-25-105203550658095SUPPLY CURRENT PER AMPLIFIERvs. TEMPERATURETEMPERATURE (°C)S U P P L Y C U R R E N T (µA )-10-505101520-40-25-105203550658095OUTPUT LEAKAGE CURRENTvs. TEMPERATURETEMPERATURE (°C)L E A K A G E C U R R E N T (µA )Typical Operating Characteristics(V CC = +5V, V EE = 0V, VCM = V CC / 2, T A = +25°C, unless otherwise noted.)-600123456INPUT BIAS CURRENT vs. COMMON-MODE VOLTAGECOMMON-MODE VOLTAGE (V)I N P U T B I A S C U R R E N T (n A )-50-40-30-20-10010203040-60-40-40-25-105203550658095INPUT BIAS CURRENTvs. TEMPERATURETEMPERATURE (°C)I N P U T B I A S C U R R E N T (n A )-200204060MAX4130–MAX4134Single/Dual/Quad, Wide-Bandwidth, Low-Power,Single-Supply, Rail-to-Rail I/O Op Amps_______________________________________________________________________________________712070750600110115OUTPUT VOLTAGE: EITHER SUPPLY (mV)G A I N (d B )30095859080100200500105100400LARGE-SIGNAL GAIN vs. OUTPUT VOLTAGE130-40-25-105203550658095LARGE-SIGNAL GAIN vs. TEMPERATURE90120TEMPERATURE (°C)G A I N (d B )11010085951251151051.21.31.51.41.61.71.81.9-40-25-105203550658095MINIMUM OPERATING VOLTAGEvs. TEMPERATUREM A X 4130/34-21TEMPERATURE (°C)M I N I M U M O P E R A T I N G V O L T A G E (V )Typical Operating Characteristics (continued)(V CC = +5V, V EE = 0V, V CM = V CC / 2, T A = +25°C, unless otherwise noted.)12080859095100105110115-40-25-105203550658095COMMON-MODE REJECTIONvs. TEMPERATURETEMPERATURE (°C)C O M M O N -M ODE R E J E C T I O N (d B )130700600120OUTPUT VOLTAGE: EITHER SUPPLY (mV)G A I N (dB )3001009080100200500110400LARGE-SIGNAL GAIN vs. OUTPUT VOLTAGE12060600110OUTPUT VOLTAGE: EITHER SUPPLY (mV)G A I N (d B )300908070100200500100400LARGE-SIGNAL GAIN vs. OUTPUT VOLTAGE12080-40-25-105203550658095LARGE-SIGNAL GAIN vs. TEMPERATURE90TEMPERATURE (°C)G A I N (d B )105859511511010012070750600110115OUTPUT VOLTAGE: EITHER SUPPLY (mV)G A I N (d B )30095859080100200500105100400LARGE-SIGNAL GAIN vs. OUTPUT VOLTAGE-3.00-2.25-0.75-1.5001.500.752.253.00-40-25-105203550658095INPUT OFFSET VOLTAGE vs. TEMPERATURETEMPERATURE (°C)V O L T A G E (m V )M A X 4130–M A X 4134Single/Dual/Quad, Wide-Bandwidth, Low-Power,Single-Supply, Rail-to-Rail I/O Op Amps 8_______________________________________________________________________________________1408010k 1k 100k 10M 1M CHANNEL SEPARATION vs. FREQUENCYFREQUENCY (Hz)C H A N N E L S E P A R A T I O N (d B )1009013011012010100k10kFREQUENCY (Hz)1001k 0.03000.0050.0100.0150.0200.025 TOTAL HARMONIC DISTORTION AND NOISE vs. FREQUENCYT H D A N D N O I S E (%)0.10.0014.04.44.25.04.84.6TOTAL HARMONIC DISTORTION AND NOISE vs. PEAK-TO-PEAK SIGNAL AMPLITUDEPEAK-TO-PEAK SIGNAL AMPLITUDE (V)T H D + N O I S E (%)0.01INTIME (200ns/div)V O L T A G E (50m V /d i v )OUTMAX4131SMALL-SIGNAL TRANSIENT RESPONSE (NONINVERTING)IN TIME (200ns/div)V O L T A G E (50m V /d i v )OUT MAX4131SMALL-SIGNAL TRANSIENT RESPONSE (INVERTING)A V = -1IN TIME (2µs/div)V O L T A G E (2V/d i v )OUT MAX4131LARGE-SIGNAL TRANSIENT RESPONSE (NONINVERTING)A V = +1INTIME (2µs/div)V O L T A G E (2V /d i v )OUTMAX4131LARGE-SIGNAL TRANSIENT RESPONSE (INVERTING)Typical Operating Characteristics (continued)(V CC = +5V, V EE = 0V, V CM = V CC / 2, T A = +25°C, unless otherwise noted.)1600-40-25-105203550658095MINIMUM OUTPUT VOLTAGEvs. TEMPERATURE20140120TEMPERATURE (°C)V O U T - V E E (m V )100806040050100150200250300-40-25-105203550658095MAXIMUM OUTPUT VOLTAGEvs. TEMPERATURETEMPERATURE (°C)V C C - V O U T (m V )MAX4130–MAX4134Single/Dual/Quad, Wide-Bandwidth, Low-Power,Single-Supply, Rail-to-Rail I/O Op Amps_______________________________________________________________________________________9Figure 1a. Reducing Offset Error Due to Bias Current (Noninverting)Figure 1b. Reducing Offset Error Due to Bias Current (Inverting)M A X 4130–M A X 4134Single/Dual/Quad, Wide-Bandwidth, Low-Power,Single-Supply, Rail-to-Rail I/O Op Amps 10______________________________________________________________________________________Applications InformationRail-to-Rail Input StageDevices in the MAX4130–MAX4134 family of high-speed amplifiers have rail-to-rail input and output stages designed for low-voltage, single-supply opera-tion. The input stage consists of separate NPN and PNP differential stages that combine to provide an input common-mode range that extends 0.2V beyond the supply rails. The PNP stage is active for input volt-ages close to the negative rail, and the NPN stage is active for input voltages near the positive rail. The input offset voltage is typically below 200µV. The switchover transition region, which occurs near V CC / 2, has been extended to minimize the slight degradation in com-mon-mode rejection ratio caused by the mismatch of the input pairs. Their low offset voltage, high band-width, and rail-to-rail common-mode range make these op amps excellent choices for precision, low-voltage data-acquisition systems.Since the input stage switches between the NPN and PNP pairs, the input bias current changes polarity as the input voltage passes through the transition region.Reduce the offset error caused by input bias currents flowing through external source impedances by match-ing the effective impedance seen by each input (Figures 1a, 1b). High source impedances, together with input capacitance, can create a parasitic pole that produces an underdamped signal response. Reducing the input impedance or placing a small (2pF to 10pF)capacitor across the feedback resistor improves response.The MAX4130–MAX4134s ’ inputs are protected from large differential input voltages by 1k Ωseries resistors and back-to-back triple diodes across the inputs (Figure 2). For differential input voltages less than 1.8V,input resistance is typically 500k Ω. For differential input voltages greater than 1.8V, input resistance is approxi-mately 2k Ω. The input bias current is given by the fol-lowing equation:Figure 2. Input Protection CircuitMAX4130–MAX4134Single/Dual/Quad, Wide-Bandwidth, Low-Power,Single-Supply, Rail-to-Rail I/O Op Amps______________________________________________________________________________________11Rail-to-Rail Output StageThe minimum output voltage is within millivolts of ground for single-supply operation where the load is referenced to ground (V EE ). Figure 3 shows the input voltage range and output voltage swing of a MAX4131connected as a voltage follower. With a +3V supply and the load tied to ground, the output swings from 0.00V to 2.90V. The maximum output voltage swing depends on the load, but will be within 150mV of a +3V supply, even with the maximum load (500Ωto ground).Driving a capacitive load can cause instability in most high-speed op amps, especially those with low quies-cent current. The MAX4130–MAX4134 have a high tol-erance for capacitive loads. They are stable with capacitive loads up to 160pF. Figure 4 gives the stable operating region for capacitive loads. Figures 5 and 6show the response with capacitive loads and the results of adding an isolation resistor in series with the output (Figure 7). The resistor improves the circuit ’s phase margin by isolating the load capacitor from the op amp ’s output.INTIME (1µs/div)V O L T A G E (1V /d i v )OUTV CC = 3V, R L = 10k Ω to V EEFigure 3. Rail-to-Rail Input/Output Voltage RangeFigure 4. Capacitive-Load StabilityINTIME (200ns/div)V O L T A G E (50m V /d i v )OUTV CC = 5V R L = 10k Ω C L = 130pFFigure 5. MAX4131 Small-Signal Transient Response with Capacitive Load Figure 6. MAX4131 Transient Response to Capacitive Load with Isolation ResistorINTIME (500ns/div)V O L T A G E (50m V /d i v )OUTV CC = 5V C L = 1000pF R S = 39ΩM A X 4130–M A X 4134Single/Dual/Quad, Wide-Bandwidth, Low-Power,Single-Supply, Rail-to-Rail I/O Op Amps 12______________________________________________________________________________________Power-Up and Shutdown ModeThe MAX4130–MAX4134 amplifiers typically settle with-in 1µs after power-up. Figures 9 and 10 show the out-put voltage and supply current on power-up, using the test circuit of Figure 8.The MAX4131 and MAX4133 have a shutdown option.When the shutdown pin (SHDN ) is pulled low, the sup-ply current drops below 25µA per amplifier and theamplifiers are disabled with the outputs in a high-impedance state. Pulling SHDN high or leaving it float-ing enables the amplifier. In the dual-amplifier MAX4133, the shutdown functions operate indepen-dently. Figures 11 and 12 show the output voltage and supply current responses of the MAX4131 to a shut-down pulse, using the test circuit of Figure 8.Figure 7. Capacitive-Load Driving CircuitFigure 8. Power-Up/Shutdown Test CircuitV CC TIME (5µs/div)V O L T A G E (1V /d i v )OUTFigure 9. Power-Up Output Voltage V CC (1V/div)TIME (5µs/div)I EE(500µA/div)Figure 10. Power-Up Supply CurrentMAX4130–MAX4134Single/Dual/Quad, Wide-Bandwidth, Low-Power,Single-Supply, Rail-to-Rail I/O Op Amps______________________________________________________________________________________13Power Supplies and LayoutThe MAX4130–MAX4134 operate from a single +2.7V to +6.5V power supply, or from dual supplies of ±1.35V to ±3.25V. For single-supply operation, bypass the power supply with a 0.1µF ceramic capacitor in parallel with at least 1µF. For dual supplies, bypass each sup-ply to ground.Good layout improves performance by decreasing the amount of stray capacitance at the op amp ’s inputs and outputs. Decrease stray capacitance by placing external components close to the op amp ’s pins, mini-mizing trace lengths and resistor leads.UCSP Applications InformationFor the latest application details on UCSP construction,dimensions, tape carrier information, PC board tech-niques, bump-pad layout, and the recommended reflow temperature profile, as well as the latest informa-tion on reliability testing results, go to Maxim ’s website at /ucsp and search for the Application Note: UCSP –A Wafer-Level Chip-Scale Package .TIME (1µs/div)OUTFigure 11. Shutdown Output Voltage TIME (1µs/div)Figure 12. Shutdown Enable/Disable Supply CurrentM A X 4130–M A X 4134Single/Dual/Quad, Wide-Bandwidth, Low-Power,Single-Supply, Rail-to-Rail I/O Op Amps 14________________________________________________________________________________________________________________________________________________Pin ConfigurationsMAX4130–MAX4134Single/Dual/Quad, Wide-Bandwidth, Low-Power,Single-Supply, Rail-to-Rail I/O Op Amps______________________________________________________________________________________15Chip InformationOrdering Information (continued)MAX4130 TRANSISTOR COUNT: 170MAX4131 TRANSISTOR COUNT: 170MAX4132 TRANSISTOR COUNT: 340MAX4134 TRANSISTOR COUNT: 680*Dice are specified at T A = +25°C, DC parameters only.Package Information(The package drawing(s) in this data sheet may not reflect the most current specifications. For the latest package outline information,go to /packages .)M A X 4130–M A X 4134Single/Dual/Quad, Wide-Bandwidth, Low-Power,Single-Supply, Rail-to-Rail I/O Op Amps 16______________________________________________________________________________________Package Information (continued)(The package drawing(s) in this data sheet may not reflect the most current specifications. For the latest package outline information,go to /packages .)MAX4130–MAX4134Single/Dual/Quad, Wide-Bandwidth, Low-Power,Single-Supply, Rail-to-Rail I/O Op Amps______________________________________________________________________________________17Package Information (continued)(The package drawing(s) in this data sheet may not reflect the most current specifications. For the latest package outline information,go to /packages .)Maxim cannot assume responsibility for use of any circuitry other than circuitry entirely embodied in a Maxim product. No circuit patent licenses are M A X 4130–M A X 4134Single/Dual/Quad, Wide-Bandwidth, Low-Power,Single-Supply, Rail-to-Rail I/O Op Amps implied. Maxim reserves the right to change the circuitry and specifications without notice at any time.18__________________Maxim Integrated Products, 120 San Gabriel Drive, Sunnyvale, CA 94086 (408) 737-7600©2003 Maxim Integrated ProductsPrinted USAis a registered trademark of Maxim Integrated Products.Package Information (continued)(The package drawing(s) in this data sheet may not reflect the most current specifications. For the latest package outline information,go to /packages .)。

MAX4211EEVKIT中文资料

General DescriptionThe MAX4211E evaluation kit (EV kit) is a fully assembled and tested surface-mount circuit board that provides overpower circuit-breaker and fault protection using the MAX4211E power-monitoring IC. The EV kit demonstrates the programmable overpower monitoring feature with manual or microcontroller reset options of the MAX4211E.The MAX4211E controls an external p-channel high-side power MOSFET to provide overpower fault protection.The MAX4211E EV kit’s circuit overpower threshold is configured for 100W with a maximum input voltage of 20V and up to 5A of load current. This makes it suitable for circuit-breaker applications in notebooks and other portable power systems. The EV kit may be reconfig-ured for other power thresholds with a maximum load current of up to 10A.The EV kit can also be used to evaluate other versions of the MAX4211 power-monitoring ICs.Featureso Configured for 100W Overpower Threshold o Configured for 5V to 20V Maximum Input Voltage o Configured for 5A Load-Current Threshold o Reconfigurable Overpower Thresholds o Immune to Power-Up Capacitive Load Spikes o Configurable Reset (Manual or Microcontroller)o Surface-Mount Components o Fully Assembled and Testedo Evaluates MAX4211A, MAX4211B, MAX4211C,MAX4211D, or MAX4211F (IC Replacement Required)Evaluates: MAX4211A/B/C/D/E/FMAX4211E Evaluation Kit________________________________________________________________Maxim Integrated Products 119-3399; Rev 1; 3/05For pricing, delivery, and ordering information,please contact Maxim/Dallas Direct!at 1-888-629-4642, or visit Maxim’s website at .Ordering InformationComponent ListE v a l u a t e s : M A X 4211A /B /C /D /E /FQuick StartThe MAX4211E EV kit is fully assembled and tested.Follow these steps to verify board operation. Do not turn on the power supply until all connections are completed.Recommended Equipment•0 to 20V power supply capable of providing up to 5A •5V power supply•Electronic load capable of sinking up to 5A (e.g.,HP 6060B)Procedures1)Verify that a shunt is installed across pins 2 and 3 ofjumper JU1.2)Verify that shunts are installed on jumpers J U2and JU3.3)Set the 0 to 20V power supply to 10V and disablethe output.4)Connect the positive terminal of the 0 to 20V DCpower supply to the VSOURCE pad on the EV kit board. Connect the ground of this power supply to the GND pad located above the VSOURCE pads.5)Connect a voltmeter across the VSOURCE andGND pads.6)Connect the positive terminal of the 5A DC electroniccurrent load to the LOAD pad on the EV kit board.Connect the ground terminal of the electronic load to the GND pad located above the LOAD pad on the EV kit.7)Connect the positive terminal of the 5V DC powersupply to the VCC pad. Connect the ground of this power supply to the GND pad located below the VCC pad on the EV kit board.8)Connect a voltmeter across the LOAD and GNDpads on the EV kit board.9)Connect a voltmeter across the TP2 test point andGND pad.10)Turn on the 5V power supply.11)Enable the 0 to 20V (10V) power supply.12)Turn on the electronic current load.13)Verify that the voltmeter connected across theLOAD and GND pads measures 10V.14)Verify that the voltmeter connected at test point TP2measures approximately 1.25V.15)Gradually increase the VSOURCE power supplytowards 20V to cause an overpower fault,16)After the fault, verify that the voltmeter connectedacross the LOAD and GND pads measures 0V.17)Verify that the voltmeter connected at TP2 mea-sures 0V.18)Reduce V SOURCE to 10V and then reset the circuit bymomentarily pressing pushbutton SW1. Verify that the voltmeter connected at TP2 measures approximately 1.25V and LOAD voltage returns to 10V.Detailed DescriptionThe MAX4211E EV kit is a power-monitoring, circuit-breaker circuit that safeguards the supply source against excessive power dissipation due to overvoltage,overcurrent, or short-circuit conditions at the output. The circuit uses the MAX4211E power-monitoring IC that operates with a V CC voltage range of 2.7V to 5.5V.MAX4211E Evaluation Kit 2_______________________________________________________________________________________The load can be supplied through an independent sup-ply source connected across the VSOURCE and GND pads and can range from 5V to 20V. The MAX4211E controls an external high-side p-channel power MOSFET switch that disconnects the supply source from the load under overpower fault conditions.During normal operation, the EV kit circuit continually monitors the power delivered to the load. When the power delivered to the load exceeds the configured maximum power threshold, the circuit disconnects the supply source from the load thus providing overpower fault pro-tection. The EV kit can be reset to normal operation by first removing the fault condition and then momentarily pressing pushbutton SW1. The EV kit is configured for a power threshold of 100W with an input source voltage threshold of 20V and load-current threshold of 5A. The MAX4211E EV kit can be reconfigured to monitor up to 10A of current.Input Voltages The MAX4211E EV kit provides the flexibility of having independent power-supply sources for the IC and the load. The EV kit is configured for a maximum V SOURCE of 20V and a V CC of 5V. To reconfigure the EV kit’s V SOURCE maximum input voltage for up to 28V, see the Overpower Threshold section. Set the V CC voltage in the range of 2.7V to 5.5V.Overpower Threshold The overpower threshold for the MAX4211E EV kit is set to 100W with a maximum V SOURCE input voltage of 20V and maximum load current of 5A. During normal opera-tion, the EV kit circuit continually monitors the power delivered to the load. When the power delivered to the load exceeds the 100W threshold (after exceeding the 20V and 5A thresholds), the MAX4211E disconnects the supply source from the load. This is done by switching MOSFET P1 off when the MAX4211E COUT1 pin latches high.To reconfigure the MAX4211E EV kit for a different overpower threshold, the V SOURCE and load-current thresholds must be modified. Reconfigure the V SOURCE voltage threshold for up to 28V by selecting new resis-tor values for R2 and R3 using the following equation: R2 = R3 x (V SOURCE_THRESHOLD- 1)where resistor R3 is typically 6.98kΩand the V SOURCE_THRESHOLD is the new desired value. This step ensures that the MAX4211E POUT pin is 2.5V when the maximum power is delivered to the load.The MAX4211E EV kit board is configured for a load-current threshold of 5A DC, however, the 2oz PC board traces can handle up to 10A. Use the following equa-tion to select a new value for current-sense resistor R1 (2512 case):Verify that the resistor R1 and MOSFET P1 are rated for the new current level.Reset During an overpower fault condition, the MAX4211E EV kit circuit latches off. To reset the circuit, remove the fault condition and momentarily press the pushbutton switch SW1. This clears the latched COUT1 pin on the MAX4211E.The MAX4211E EV kit circuit reset function can also be controlled by connecting a microcontroller’s output across the CIN2- and GND pads and configuring jumpers J U1, J U2, and J U3. See Table1 for jumperconfiguration. Evaluates: MAX4211A/B/C/D/E/F MAX4211E Evaluation KitE v a l u a t e s : M A X 4211A /B /C /D /E /FInternal ComparatorsThe MAX4211E features two internal comparators. In the EV kit, circuit Comparator1 is used to detect over-power conditions. Comparator2 is disabled but can be configured for microcontroller reset or other comparator applications. To access CIN2+ of Comparator2,remove the shunt across J U3 and connect to pin 2 of J U3. To access CIN2-, remove the shunt across J U2and connect to the CIN2- pad. The Comparator2 output can be accessed through pin 1 of JU1. CIN2+ can be left connected to REF through JU3 or can be accessed directly through pin 2 of jumper JU3.Power-UpTransient surges in power may result when the EV kit is powered up with a capacitive load connected to the out-put (either C5 on the MAX4211E EV kit or to the LOAD PC board pad output). These transient conditions may be detected as an overpower condition and prevent MOSFET P1 from turning on. Though these transients might not always be sufficient to trip the circuit-breaker function, the MAX4211E possesses an INHIBIT circuit,which can prevent such transients from being registered as overpower conditions.The MAX4211E EV kit features an RC network consist-ing of resistors R6 and capacitor C7 that connects the LOAD node to INHIBIT of the MAX4211E. During power-up, this RC network disables the internal com-parator providing immunity against transient events for a period given by the equation:where ∆V is the voltage change at the LOAD during power-up or due to switching between different voltage sources.The MAX4211E EV kit comes configured with t INHIBIT approximately equal to 425µs, for an expected ∆V =10V and a LOAD voltage settling time of 42.5µs. For some applications, this value might be too short to sus-pend the Comparator1 operation as power-up tran-sients could be much slower. To adjust the inhibit time,select a value of t INHIBIT that is larger than the settling time (t LOAD ) of the LOAD voltage. Selecting t INHIBIT =10 x t LOAD , where t LOAD is the time constant of rising voltage at V LOAD during power-up, is a good design criterion. Larger t INHIBIT times will reduce the number of false circuit-breaker trips, but can potentially subject V SOURCE to longer periods of exposure to momentary overpower conditions.Also note that resistor R7 is merely an isolation resistor with a value that does not affect t INHIBIT.Evaluating the MAX4211A/B/C/D/FThe MAX4211E EV kit can also evaluate other versions of the MAX4211 power-monitoring IC. The MAX4211E IC must be removed and replaced with the desired IC.Refer to the MAX4210/MAX4211 IC data sheet for detailed information about the MAX4211 parts.Depending upon your version of the MAX4211, some ofthe external components may need replacement.MAX4211E Evaluation Kit 4_______________________________________________________________________________________Evaluates: MAX4211A/B/C/D/E/F MAX4211E Evaluation Kit Figure 1. MAX4211E EV Kit Schematic_______________________________________________________________________________________5Maxim cannot assume responsib ility for use of any circuitry other than circuitry entirely emb odied in a Maxim product. No circuit patent licenses are implied. Maxim reserves the right to change the circuitry and specifications without notice at any time.6_____________________Maxim Integrated Products, 120 San Gabriel Drive, Sunnyvale, CA 94086 408-737-7600©2005 Maxim Integrated ProductsPrinted USAis a registered trademark of Maxim Integrated Products, Inc.E v a l u a t e s : M A X 4211A /B /C /D /E /FMAX4211E Evaluation Kit Figure 2. MAX4211E EV Kit Component Placement Guide—Component Side Figure 3. MAX4211E EV Kit PC Board Layout—ComponentSideFigure 4. MAX4211E EV Kit PC Board Layout—Solder Side。

MEMORY存储芯片MAX490EESA+T中文规格书

DC SOURCE
Cs 100pF
STORAGE CAPACITOR
Figure 4. Human Body ESD Test Model
RC 50M to 100M RD 330Ω
CHARGE CURRENT LIMIT RESISTOR
DISCHARGE RESISTANCE
HIGHVOLTAGE
4
3
5
DI
put Z high. Similarly, a high on DI forces output Y high
and output Z low.
5
4
6, 7
GND
Ground
—
5
9
Y
Noninverting Driver Output
—
6
10
Z
Inverting Driver Output
______________________________________________________________Pin Description
PIN
MAX481E/MAX483E MAX485E/MAX487E
MAX1487E
MAX488E MAX490E
MAX489E MAX491E
NAME
TIME
tDL CURRENT WAVEFORM
Figure 5. Human Body Model Current Waveform
I 100% 90%
IPEAK
DEVICE UNDER TEST
10%
tr = 0.7ns to 1ns
t
30ns
60ns
Figure 7. IEC1000-4-2 ESD Generator Current Waveform

MAX4331ESA+T中文资料

General DescriptionThe MAX4330–MAX4334 single/dual/quad op amps combine a wide 3MHz bandwidth, low-power operation,and excellent DC accuracy with Rail-to-Rail ®inputs and outputs. These devices require only 245µA per amplifier,and operate from either a single +2.3V to +6.5V supply or dual ±1.15V to ±3.25V supplies. The input common-mode voltage range extends 250mV beyond V EE and V CC , and the outputs swing rail-to-rail. The MAX4331/MAX4333 feature a shutdown mode in which the output goes high impedance and the supply current decreases to 9µA per amplifier.Low-power operation combined with rail-to-rail input common-mode range and output swing makes these amplifiers ideal for portable/battery-powered equipment and other low-voltage, single-supply applications.Although the minimum operating voltage is specified at 2.3V, these devices typically operate down to 2.0V. Low offset voltage and high speed make these amplifiers excellent choices for signal-conditioning stages in pre-cision, low-voltage data-acquisition systems. The MAX4330 is available in the space-saving 5-pin SOT23package, and the MAX4331/MAX4333 are offered in a µMAX package.ApplicationsPortable/Battery-Powered Equipment Data-Acquisition Systems Signal ConditioningLow-Power, Low-Voltage Applications____________________________Featureso 3MHz Gain-Bandwidth Product o 245µA Quiescent Current per Amplifier o Available in Space-Saving SOT23-5 Package (MAX4330)o +2.3V to +6.5V Single-Supply Operationo Rail-to-Rail Input Common-Mode Voltage Range o Rail-to-Rail Output Voltage Swing o 250µV Offset Voltageo Low-Power, 9µA (per amp) Shutdown Mode (MAX4331/MAX4333)o No Phase Reversal for Overdriven Inputs o Capable of Driving 2k ΩLoads o Unity-Gain StableMAX4330–MAX4334Single/Dual/Quad, Low-Power, Single-Supply,Rail-to-Rail I/O Op Amps with Shutdown________________________________________________________________Maxim Integrated Products1Pin Configurations19-1192; Rev 3; 2/98Selector GuideRail-to-Rail is a registered trademark of Nippon Motorola Ltd.For free samples & the latest literature: , or phone 1-800-998-8800.For small orders, phone 408-737-7600 ext. 3468.M A X 4330–M A X 4334Single/Dual/Quad, Low-Power, Single-Supply,Rail-to-Rail I/O Op Amps with ShutdownABSOLUTE MAXIMUM RATINGSDC ELECTRICAL CHARACTERISTICS(V = +2.3V to +6.5V, V = 0V, V = 0V, V = (V / 2), R tied to (V / 2), V SHDN = +25°C, unless otherwise noted.)Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.Supply Voltage, V CC to V EE .....................................................7V IN_+, IN_-, SHDN Voltage................(V EE - 0.3V) to (V CC + 0.3V)Output Short-Circuit Duration....................................Continuous(short to either supply)Continuous Power Dissipation (T A = +70°C)5-Pin SOT23 (derate 7.1mW/°C above +70°C).............571mW 8-Pin SO (derate 5.88mW/°C above +70°C).................471mW 8-Pin µMAX (derate 4.10mW/°C above +70°C)............330mW10-Pin µMAX (derate 5.60mW/°C above +70°C)..........444mW 14-Pin SO (derate 8.33mW/°C above +70°C)...............667mW Operating Temperature RangesMAX433_C/D .......................................................0°C to +70°C MAX433_E_ _....................................................-40°C to +85°C Maximum Junction Temperature.....................................+150°C Storage Temperature Range.............................-65°C to +160°C Lead Temperature (soldering, 10sec).............................+300°CMAX4330–MAX4334 Single/Dual/Quad, Low-Power, Single-Supply, Rail-to-Rail I/O Op Amps with Shutdown_______________________________________________________________________________________3DC ELECTRICAL CHARACTERISTICS (continued)(V CC= +2.3V to +6.5V, V EE= 0V, V CM= 0V, V OUT= (V CC/ 2), R L tied to (V CC/ 2), V SHDN≥2V, T A= +25°C, unless otherwise noted.)DC ELECTRICAL CHARACTERISTICS(V CC= +2.3V to +6.5V, V EE= 0V, V CM= 0V, V OUT= (V CC/ 2), R L tied to (V CC/ 2), V SHDN≥2V, T A= -40°C to +85°C,unlessotherwise noted.)M A X 4330–M A X 4334Single/Dual/Quad, Low-Power, Single-Supply,Rail-to-Rail I/O Op Amps with Shutdown 4_______________________________________________________________________________________DC ELECTRICAL CHARACTERISTICS (continued)(V CC = +2.3V to +6.5V, V EE = 0V, V CM = 0V, V OUT = (V CC / 2), R L tied to (V CC / 2), V SHDN ≥2V, T A = -40°C to +85°C,unless otherwise noted.)Note 1:SHDN logic thresholds are referenced to V EE .Note 2:The MAX4330EUK is 100% tested at T A = +25°C. All temperature limits are guaranteed by design.MAX4330–MAX4334Single/Dual/Quad, Low-Power, Single-Supply,Rail-to-Rail I/O Op Amps with Shutdown_______________________________________________________________________________________5AC ELECTRICAL CHARACTERISTICS(V CC = +5V, V EE = 0V, V CM = 0V, V OUT = (V CC / 2), R L = 10k Ωto (V CC / 2), V SHDN ≥2V, C L = 15pF, T A = +25°C,unless otherwise noted.)60-201001k100k10MGAIN AND PHASE vs. FREQUENCY (NO LOAD)FREQUENCY (Hz)G A I N (d B )P H A S E (D E G R E E S )10k1M100M 50403020100-10180-180********-45-90-13560-401001k 100k 10MGAIN AND PHASEFREQUENCY (Hz)G A I N (d B )P H A S E (D E G R E E S )10k 1M 100M 4020-20180-18010836-36-108144720-72-144-1001010010k 1M 10M POWER-SUPPLY REJECTION RATIOFREQUENCY (Hz)P S R R (d B )1k 100k 100M-20-40-60-80__________________________________________Typical Operating Characteristics(V CC = +5V, V EE = 0V, V CM = V CC / 2, V SHDN > 2V, T A = +25°C, unless otherwise noted.)M A X 4330–M A X 4334Single/Dual/Quad, Low-Power, Single-Supply,Rail-to-Rail I/O Op Amps with Shutdown 6_______________________________________________________________________________________-40-20-30100-1040302050-4020-20406080100INPUT BIAS CURRENT vs. TEMPERATURETEMPERATURE (°C)I N P U T B I A S C U R R E N T (n A )25020015010050TEMPERATURE (°C)-20-40-60200608040100OUTPUT SWING HIGH V C C - V O U T (m V )120100804020600TEMPERATURE (°C)-200-60-4020406080100OUTPUT SWING LOW vs. TEMPERATUREV O U T - V E E (m V )1k0.011001k100k 10MOUTPUT IMPEDANCE vs. FREQUENCYFREQUENCY (Hz)O U T P U T I M P E D A N C E (Ω)10k 1M 100M1001010.1120010008004000200600-200TEMPERATURE (°C)-40-200-6020406080100OUTPUT LEAKAGE CURRENTO U T P U T L E A K A G E C U R R E N T (p A)350310330250270290210190170230150TEMPERATURE (°C)-20-602060100-404080SUPPLY CURRENT vs. TEMPERATUREI C C (µA )252015105TEMPERATURE (°C)-40-60-2040608020100SHUTDOWN SUPPLY CURRENTvs. TEMPERATUREI C C (µA)150050001000-500-1000-1500TEMPERATURE (°C)-40-200-6020406080100INPUT OFFSET VOLTAGE vs. TEMPERATUREI N P U T O F F S E T VO L T A G E (µV )-30-10-2010030204002314567INPUT BIAS CURRENT vs. COMMON-MODE VOLTAGECOMMON-MODE VOLTAGE (V)I N P U T B I A S C U R R E N T (n A )____________________________Typical Operating Characteristics (continued)(V CC = +5V, V EE = 0V, V CM = V CC / 2, V SHDN > 2V, T A = +25°C, unless otherwise noted.)MAX4330–MAX4334Single/Dual/Quad, Low-Power, Single-Supply,Rail-to-Rail I/O Op Amps with Shutdown_______________________________________________________________________________________7____________________________Typical Operating Characteristics (continued)(V CC = +5V, V EE = 0V, V CM = V CC / 2, V SHDN > 2V, T A = +25°C, unless otherwise noted.)1181081131039383889878OUTPUT VOLTAGE: EITHER SUPPLY (V)0.100.20.30.50.40.6LARGE-SIGNAL GAIN vs. OUTPUT VOLTAGE (V = 2.3V, R TO V )G A I N (d B )-60-70-80-90-110-130-120-100-140TEMPERATURE (°C)-20-40-60020806040100COMMON-MODE REJECTIONC O M M O N -M ODE R E J E C T I O N (d B )115105110100959085TEMPERATURE (°C)-40-60-20060804020100LARGE-SIGNAL GAINvs. TEMPERATURE (R = 2k Ω)G A I N (d B )11811411010698909410286OUTPUT VOLTAGE: EITHER SUPPLY (V)0.100.20.50.40.30.6LARGE-SIGNAL GAIN vs. OUTPUT VOLTAGE (V CC = 2.3V, R L TO V EE )G A I N (d B)1301201251151059510011090OUTPUT VOLTAGE: EITHER SUPPLY (V)0.100.20.30.50.40.6LARGE-SIGNAL GAIN vs. OUTPUT VOLTAGE (V CC = 6.5V, R L TO V EE )G A I N (d B)1401301201009011080OUTPUT VOLTAGE: EITHER SUPPLY (V)00.10.20.30.40.50.6LARGE-SIGNAL GAIN vs. OUTPUT VOLTAGE (V CC = 6.5V, R L TO V CC )G A I N (d B )130125120115110TEMPERATURE (°C)-40-60-2060804020100LARGE-SIGNAL GAINvs. TEMPERATURE (R = 100k Ω)G A I N (d B )2.001.951.901.851.801.751.701.651.60M A X 4330/34-T O C 18TEMPERATURE (°C)-40-60-2060804020100MINIMUM OPERATING VOLTAGEvs. TEMPERATUREV C C (V )10.00111k10k100kTOTAL HARMONIC DISTORTION AND NOISE vs. FREQUENCY0.010.1FREQUENCY (Hz)T H D + N O I S E (%)10010M A X 4330–M A X 4334Single/Dual/Quad, Low-Power, Single-Supply,Rail-to-Rail I/O Op Amps with Shutdown 8_______________________________________________________________________________________10.0014.05.0TOTAL HARMONIC DISTORTION AND NOISE vs. PEAK-TO-PEAKSIGNAL AMPLITUDE0.010.1PEAK-TO-PEAK SIGNAL AMPLITUDE (V)T H D + N O I S E (%)4.64.84.24.48010090120110130140110100100010000CROSSTALK vs. FREQUENCYM A X 4330/34-T O C 22FREQUENCY (kHz)C R O S S T A L K (d B )102006001000CAPACITIVE LOAD STABILITY8LOAD CAPACITANCE (pF)L O A D R E S I S T A N C E (k Ω)400800642LARGE-SIGNAL TRANSIENT RESPONSE(NONINVERTING)MAX4330/34-TOC24TIME (5µs/div)INOUTV O L T A G E (2V /d i v )A V = -1INOUTSMALL-SIGNAL TRANSIENT RESPONSE(INVERTING)MAX4330/34-TOC23TIME (200ns/div)V O L T A G E (50m V /d i v )LARGE-SIGNAL TRANSIENT RESPONSE(INVERTING)MAX4330/34-TOC25TIME (5µs/div)INOUTV O L T A G E (2V /d i v )A V = +1INOUT SMALL-SIGNAL TRANSIENT RESPONSE(NONINVERTING)MAX4330/34-TOC22TIME (200ns/div)V O L T A G E (50m V /d i v )____________________________Typical Operating Characteristics (continued)(V CC = +5V, V EE = 0V, V CM = V CC / 2, V SHDN > 2V, T A = +25°C, unless otherwise noted.)MAX4330–MAX4334Single/Dual/Quad, Low-Power, Single-Supply,Rail-to-Rail I/O Op Amps with Shutdown_______________________________________________________________________________________9Pin DescriptionM A X 4330–M A X 4334Single/Dual/Quad, Low-Power, Single-Supply,Rail-to-Rail I/O Op Amps with Shutdown 10_____________________________________________________________________________________________________Detailed DescriptionRail-to-Rail Input StageThe MAX4330–MAX4334 have rail-to-rail input and out-put stages that are specifically designed for low-voltage, single-supply operation. The input stage con-sists of separate NPN and PNP differential stages,which operate together to provide a common-mode range extending to 0.25V beyond both supply rails. The crossover region, which occurs halfway between V CC and V EE , is extended to minimize degradation in CMRR caused by mismatched input pairs. The input offset volt-age is typically 250µV. Low offset voltage, high band-width, rail-to-rail common-mode input range, and rail-to-rail outputs make this family of op amps an excel-lent choice for precision, low-voltage data-acquisition systems.Since the input stage consists of NPN and PNP pairs,the input bias current changes polarity as the input volt-age passes through the crossover region. Match the effective impedance seen by each input to reduce the offset error due to input bias currents flowing through external source impedances (Figures 1a and 1b). The combination of high source impedance with input capacitance (amplifier input capacitance plus stray capacitance) creates a parasitic pole that produces an underdamped signal response. Reducing input capaci-tance or placing a small capacitor across the feedback resistor improves response.The MAX4330–MAX4334’s inputs are protected from large differential input voltages by internal 1k Ωseries resistors and back-to-back triple diode stacks across the inputs (Figure 2). For differential input voltages (much less than 1.8V), input resistance is typically 2.3M Ω. For differential input voltages greater than 1.8V,input resistance is around 2k Ω, and the input bias cur-rent can be approximated by the following equation:I BIAS = (V DIFF - 1.8V) / 2k ΩIn the region where the differential input voltage approaches 1.8V, input resistance decreases exponen-tially from 2.3M Ωto 2k Ωas the diode block begins con-ducting. Inversely, the bias current increases with the same curve.Figure 1a. Reducing Offset Error Due to Bias Current (Noninverting)Figure 1b. Reducing Offset Error Due to Bias Current (Inverting)MAX4330–MAX4334Rail-to-Rail I/O Op Amps with Shutdown______________________________________________________________________________________11Rail-to-Rail Output StageThe MAX4330–MAX4334 output stage can drive up to a 2k Ωload and still typically swing within 125mV of the rails. Figure 3 shows the output voltage swing of a MAX4331 configured as a unity-gain buffer. The operat-ing voltage is a single +3V supply, and the input volt-age is 3Vp-p. The output swings to within 70mV of V EE and 100mV of V CC , even with the maximum load applied (2k Ωto mid-supply).Driving a capacitive load can cause instability in many op amps, especially those with low quiescent current.The MAX4330–MAX4334 are stable for capacitive loads up to 150pF. The Capacitive Load Stability graph in the Typical Operating Characteristics gives the stable operating region for capacitive vs. resistive loads.Figures 4 and 5 show the response of the MAX4331with an excessive capacitive load, compared with the response when a series resistor is added between the output and the capacitive load. The resistor improves the circuit’s response by isolating the load capacitance from the op amp’s output (Figure 6).Figure 2. Input Protection CircuitFigure 3. Rail-to-Rail Input/Output Voltage RangeIN1V/div1V/divOUT20µs/divV CC = 3V, R L = 2k Ω TO V CC / 2Figure 4. Small-Signal Transient Response with Excessive Capacitive LoadIN50mV/div50mV/divOUT2µs/divR ISO = 0Ω, A V = +1 C L = 510pF V CC = 3V, R L = 100k ΩM A X 4330–M A X 4334Rail-to-Rail I/O Op Amps with Shutdown 12________________________________________________________________________________________________Applications InformationPower-UpThe MAX4330–MAX4334 outputs typically settle within 5µs after power-up. Using the test circuit of Figure 7,Figures 8 and 9 show the output voltage and supply current on power-up and power-down.Shutdown ModeThe MAX4331/MAX4333 feature a low-power shutdown mode. When the shutdown pin (SHDN ) is pulled low, the supply current drops to 9µA per amplifier (typical), the amplifier is disabled, and the outputs enter a high-impedance state. Pulling SHDN high or leaving it float-ing enables the amplifier. Figures 10 and 11 show the MAX4331/MAX4333’s output voltage and supply-current responses to a shutdown pulse.Figure 5. Small-Signal Transient Response with Excessive Load and Isolation ResistorIN50mV/div50mV/divOUT 2µs/divA V = +1, C L = 510pF R ISO = 39ΩFigure 7. Power-Up/Shutdown Test Circuit SHDN0V TO +2.7V STEP FOR SHUTDOWN TEST0V TO +2.7V STEP FOR POWER-UP TEST, +2.7V STEP FOR SHUTDOWN-ENABLE TESTSUPPLY-CURRENT V CC100Ω2k 2kFigure 8. Power-Up/Down Output Voltage1V/div500mV/div5µs/divMAX4330–MAX4334Rail-to-Rail I/O Op Amps with Shutdown______________________________________________________________________________________13Do not three-state SHDN . Due to the output leakage currents of three-state devices and the small internal pull-up current for SHDN , three-stating this pin could result in indeterminate logic levels, and could adversely affect op-amp operation.The logic threshold for SHDN is always referred to V EE ,not GND. When using dual supplies, pull SHDN to V EE to place the op amp in shutdown mode.Power Supplies and LayoutThe MAX4330–MAX4334 operate from a single +2.3V to +6.5V power supply, or from dual ±1.15V to ±3.25V supplies. For single-supply operation, bypass the power supply with a 0.1µF capacitor to ground (V EE ).For dual supplies, bypass both V CC and V EE with their own set of capacitors to ground.Good layout technique helps optimize performance by decreasing the amount of stray capacitance at the op amp’s inputs and outputs. To decrease stray capaci-tance, minimize trace lengths by placing external com-ponents close to the op amp’s pins.Figure 9. Power-Up/Down Supply Current CC1V/div100CC5µs/divFigure 11. Shutdown Enable/Disable Supply CurrentSHDN 1V/div100CC5µs/divFigure 10. Shutdown Output Voltage Enable/DisableSHDN 1V/div500mV/div5µs/divM A X 4330–M A X 4334Rail-to-Rail I/O Op Amps with Shutdown 14______________________________________________________________________________________Pin Configurations (continued)MAX4330–MAX4334Rail-to-Rail I/O Op Amps with Shutdown______________________________________________________________________________________15Tape-and-Reel InformationChip InformationMAX4330/MAX4331TRANSISTOR COUNT: 199SUBSTRATE CONNECTED TO V EE MAX4332/MAX4333TRANSISTOR COUNT: 398SUBSTRATE CONNECTED TO V EE MAX4334TRANSISTOR COUNT: 796SUBSTRATE CONNECTED TO V EEM A X 4330–M A X 4334Rail-to-Rail I/O Op Amps with Shutdown________________________________________________________Package InformationMaxim cannot assume responsibility for use of any circuitry other than circuitry entirely embodied in a Maxim product. No circuit patent licenses are implied. Maxim reserves the right to change the circuitry and specifications without notice at any time.16____________________Maxim Integrated Products, 120 San Gabriel Drive, Sunnyvale, CA 94086 408-737-7600©1998 Maxim Integrated ProductsPrinted USAis a registered trademark of Maxim Integrated Products.。

MAX3012EUP-T中文资料

General DescriptionThe MAX3000E/MAX3001E/MAX3002–MAX3012 8-channel level translators provide the level shifting nec-essary to allow data transfer in a multivoltage system.Externally applied voltages, V CC and V L , set the logic lev-els on either side of the device. Logic signals present on the V L side of the device appear as a higher voltage logic signal on the V CC side of the device, and vice-versa.The MAX3000E/MAX3001E/MAX3002/MAX3003 use an architecture specifically designed to be bidirectional without the use of a directional pin.The MAX3000E/MAX3001E/MAX3002/MAX3004–MAX3012feature an EN input that, when low, reduces the V CC and V L supply currents to < 2µA. The MAX3000E/MAX3001E also have ±15kV ESD protection on the I/O V CC side for greater protection in applications that route signals externally. The MAX3000E operates at a guaranteed data rate of 230kbps. The MAX3001E operates at a guaranteed data rate of 4Mbps. The MAX3002–MAX3012 operate at a guaranteed data rate of 20Mbps over the entire specified operating voltage range.The MAX3000E/MAX3001E/MAX3002–MAX3012 accept V L voltages from +1.2V to +5.5V and V CC voltages from +1.65V to +5.5V, making them ideal for data transfer between low-voltage ASICs/PLDs and higher voltage systems. The MAX3000E/MAX3001E/MAX3002–MAX3012 are available in 20-bump UCSP™, 20-pin TQFN (5mm x 5mm), and 20-pin TSSOP packages.ApplicationsCMOS Logic-Level Translation CellphonesSPI™ and MICROWIRE™ Level Translation Low-Voltage ASIC Level Translation Smart Card Readers Cellphone Cradles Portable POS SystemsPortable Communication Devices Low-Cost Serial Interfaces GPSTelecommunications EquipmentFeatureso Guaranteed Data Rate Options230kbps (MAX3000E)4Mbps (MAX3001E)20Mbps (MAX3002–MAX3012)o Bidirectional Level Translation Without Using a Directional Pin (MAX3000E/MAX3001E/MAX3002/MAX3003)o Unidirectional Level Translation (MAX3004–MAX3012)o Operation Down to +1.2V on V Lo ±15kV ESD Protection on I/O V CC Lines (MAX3000E/MAX3001E)o Ultra-Low 0.1µA Supply Current in Shutdown o Low Quiescent Current (< 10µA)o UCSP, TQFN, and TSSOP PackagesMAX3000E/MAX3001E/MAX3002–MAX3012+1.2V to +5.5V , ±15kV ESD-Protected, 0.1µA,35Mbps, 8-Channel Level Translators________________________________________________________________Maxim Integrated Products1Ordering InformationTypical Operating Circuit19-2672; Rev 4; 12/06For pricing, delivery, and ordering information,please contact Maxim/Dallas Direct!at 1-888-629-4642, or visit Maxim’s website at .UCSP is a trademark of Maxim Integrated Products, Inc.SPI is a trademark of Motorola, Inc.MICROWIRE is a trademark of National Semiconductor.Ordering Information continued at end of data sheet.Pin Configurations and Functional Diagrams appear at end of data sheet.Note:All devices operate over the -40°C to +85°C operating temperature range.M A X 3000E /M A X 3001E /M A X 3002–M A X 3012+1.2V to +5.5V , ±15kV ESD-Protected, 0.1µA,35Mbps, 8-Channel Level Translators 2_______________________________________________________________________________________ABSOLUTE MAXIMUM RATINGSStresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.(All voltages referenced to GND.)V CC ...........................................................................-0.3V to +6V V L...........................................................................................-0.3V to +6V I/O V CC_......................................................-0.3V to (V CC + 0.3V)I/O V L_...........................................................-0.3V to (V L + 0.3V)EN, EN A/B...............................................................-0.3V to +6V Short-Circuit Duration I/O V L_, I/O V CC_to GND .......Continuous Continuous Power Dissipation (T A = +70°C)20-Pin TSSOP (derate 7.0mW/°C above +70°C).........559mW 20-Bump UCSP (derate 10mW/°C above +70°C).......800mW 20-Pin 5mm x 5mm TQFN(derate 20.0mW/°C above +70°C)......................................1667mWOperating Temperature RangesMAX3001EAUP..............................................-40°C to +125°C MAX300_EE_P.................................................-40°C to +85°C MAX30_ _E_P ..................................................-40°C to +85°C Junction Temperature......................................................+150°C Storage Temperature Range.............................-65°C to +150°C Lead Temperature (soldering, 10s).................................+300°CELECTRICAL CHARACTERISTICSMAX3000E/MAX3001E/MAX3002–MAX3012+1.2V to +5.5V , ±15kV ESD-Protected, 0.1µA,35Mbps, 8-Channel Level Translators_______________________________________________________________________________________3ELECTRICAL CHARACTERISTICS (continued)(V CC = +1.65V to +5.5V, V L = +1.2V to V CC , EN = V L (MAX3000E/MAX3001E/MAX3002/MAX3004–MAX3012), EN A/B = V L or 0(MAX3003), T= T to T . Typical values are at V = +1.65V, V = +1.2V, and T = +25°C.) (Notes 1, 2)M A X 3000E /M A X 3001E /M A X 3002–M A X 3012+1.2V to +5.5V , ±15kV ESD-Protected, 0.1µA,35Mbps, 8-Channel Level Translators 4_______________________________________________________________________________________TIMING CHARACTERISTICSNote 2:For normal operation, ensure that V L < V CC . During power-up, V L > V CC does not damage the device.MAX3000E/MAX3001E/MAX3002–MAX3012+1.2V to +5.5V , ±15kV ESD-Protected, 0.1µA,35Mbps, 8-Channel Level Translators_______________________________________________________________________________________5TIMING CHARACTERISTICS (continued)(V CC = +1.65V to +5.5V, V L = +1.2V to V CC , EN = V L (MAX3000E/MAX3001E/MAX3002/MAX3004–MAX3012), EN A/B = V L or 0(MAX3003), T= T to T . Typical values are at V = +1.65V, V = +1.2V, and T = +25°C.) (Notes 1, 2)M A X 3000E /M A X 3001E /M A X 3002–M A X 3012+1.2V to +5.5V , ±15kV ESD-Protected, 0.1µA,35Mbps, 8-Channel Level Translators 6_______________________________________________________________________________________TIMING CHARACTERISTICS —MAX3002–MAX3012(V CC = +1.65V to +5.5V, V L = +1.2V to V CC , EN = V L (MAX3002/MAX3004–MAX3012), EN A/B = V L or 0 (MAX3003), T A = T MIN to T) (Notes 1, 2)MAX3000E/MAX3001E/MAX3002–MAX3012+1.2V to +5.5V , ±15kV ESD-Protected, 0.1µA,35Mbps, 8-Channel Level Translators_______________________________________________________________________________________7Typical Operating Characteristics(T A = +25°C, unless otherwise noted.)2000150010005000-4010-15356085TEMPERATURE (°C)V L S U P P L Y C U R R E N T (µA )V L SUPPLY CURRENT vs. TEMPERATURE (DRIVING I/O V CC , V CC = 3.3V, V L = 1.8V)0200060004000800010,0001.52.53.02.03.54.04.55.05.5SUPPLY VOLTAGE (V)V C C S U P P L Y C U R R E N T (µA )V CC SUPPLY CURRENT vs. SUPPLY VOLTAGE(DRIVING I/O V L , V L = 1.8V)01002003004005006001.52.52.03.03.54.04.55.05.5V L SUPPLY CURRENT vs. SUPPLY VOLTAGE(DRIVING I/O V L , V L = 1.8V)SUPPLY VOLTAGE (V)V L S U P P L Y C U R R E N T (µA )05001500100020002500-4010-15356085TEMPERATURE (°C)V C C S U P P L Y C U R R E N T (µA )V CC SUPPLY CURRENT vs. TEMPERATURE (DRIVING I/O V CC , V CC = 3.3V, V L = 1.8V)020406080100104050203060708090100CAPACITIVE LOAD (pF)V L S U P P L Y C U R R E N T (µA )V L SUPPLY CURRENT vs. CAPACITIVE LOAD ON I/O V CC (DRIVING I/O V L , V CC = 3.3V, V L = 1.8V)02000100040003000600050007000103040205060708090100CAPACITIVE LOAD (pF)V C C S U P P L Y C U R R E N T (µA )V CC SUPPLY CURRENT vs. CAPACITIVE LOAD ON I/O V CC (DRIVING I/O V L , V CC = 3.3V, V L = 1.8V)CAPACITIVE LOAD (pF)R I S E /F A L L T I M E (n s )9080706050403020500100015002000010100MAX3000ERISE/FALL TIME vs. CAPACITIVE LOAD ON I/O V CC (DRIVING I/O V L , V CC = 3.3V, V L = 1.8V)M A X 3000E /M A X 3001E /M A X 3002–M A X 3012+1.2V to +5.5V , ±15kV ESD-Protected, 0.1µA,35Mbps, 8-Channel Level Translators 8_______________________________________________________________________________________Typical Operating Characteristics (continued)(T A = +25°C, unless otherwise noted.)0102030405060103020405060708090100CAPACITIVE LOAD (pF)R I S E /F A L L T I M E (n s )MAX3001ERISE/FALL TIME vs. CAPACITIVE LOAD ON I/O V CC (DRIVING I/O V L , V CC = 3.3V, V L = 1.8V)864201030204050CAPACITIVE LOAD (pF)R I S E /F A L L T I M E (n s )MAX3002–MAX3012RISE/FALL TIME vs. CAPACITIVE LOAD ON I/O V CC (DRIVING I/O V L , V CC = 3.3V, V L = 1.8V)050010001500200010206080100CAPACITIVE LOAD (pF)R I S E /F A L L T I M E (n s )MAX3000ERISE/FALL TIME vs. CAPACITIVE LOAD ON I/O V L (DRIVING I/O V CC , V CC = 3.3V, V L = 1.8V)30405070900102030405060103020405060708090100CAPACITIVE LOAD (pF)R I S E /F A L L T I M E (n s )MAX3001ERISE/FALL TIME vs. CAPACITIVE LOAD ON I/O V L (DRIVING I/O V CC , V CC = 3.3V, V L = 1.8V)43211020152530CAPACITIVE LOAD (pF)R I S E /F A L L T I M E (n s )MAX3002–MAX3012RISE/FALL TIME vs. CAPACITIVE LOAD ON I/O V L (DRIVING I/O V CC , V CC = 3.3V, V L = 1.8V)100200300400500104050203060708090100CAPACITIVE LOAD (pF)P R O P A G A T I O N D E L A Y (n s )MAX3000EPROPAGATION DELAY vs. CAPACITIVE LOAD ON I/O V CC (DRIVING I/O V L , V CC = 3.3V, V L = 1.8V)MAX3000E/MAX3001E/MAX3002–MAX3012+1.2V to +5.5V , ±15kV ESD-Protected, 0.1µA,35Mbps, 8-Channel Level Translators_______________________________________________________________________________________9Typical Operating Characteristics (continued)(T A = +25°C, unless otherwise noted.)100200300400500600103020405060708090100CAPACITIVE LOAD (pF)P R O P A G A T I O N D E L A Y (n s )MAX3000EPROPAGATION DELAY vs. CAPACITIVE LOAD ON I/O V L (DRIVING I/O V CC , V CC = 3.3V, V L = 1.8V)03961215CAPACITIVE LOAD (pF)P R O P A G A T I O N D E L A Y (n s )1030204050MAX3001EPROPAGATION DELAY vs. CAPACITIVE LOAD ON I/O V L (DRIVING I/O V CC , V CC = 3.3V, V L = 1.8V)013245CAPACITIVE LOAD (pF)P R O P A G A T I O N D E L A Y (n s)1020152530MAX3002–MAX3012PROPAGATION DELAY vs. CAPACITIVE LOAD ON I/O V L (DRIVING I/O V CC , V CC = 3.3V, V L = 1.8V)1µs/divMAX3000E RAIL-TO-RAIL DRIVING (DRIVING I/O V L , V CC = 3.3V, V L = 1.8V,CV CC = 50pF, DATA RATE = 230kbps)GNDI/O V L_1V/div GNDMAX3000E/01E/02-12 toc19I/O V CC_2V/div 40ns/divMAX3001E RAIL-TO-RAIL DRIVING (DRIVING I/O V L , V CC = 3.3V, V L = 1.8V,CV CC = 50pF, DATA RATE = 4Mbps)GNDI/O V L_1V/div GNDMAX3000E/01E/02-12 toc20I/O V CC_2V/div 10ns/divMAX3002–MAX3012 RAIL-TO-RAIL DRIVING (DRIVING I/O V L , V CC = 3.3V, V L = 1.8V,CV CC = 50pF, DATA RATE = 20Mbps)GNDI/O V L_1V/div GNDMAX3000E/01E/02-12 toc21I/O V CC_2V/div 0105201525301030204050CAPACITIVE LOAD (pF)P R O P A G A T I O N D E L A Y (n s )MAX3001EPROPAGATION DELAY vs. CAPACITIVE LOAD ON I/O V CC (DRIVING I/O V L , V CC = 3.3V, V L = 1.8V)428610121020152530CAPACITIVE LOAD (pF)P R O P A G A T I O N D E L A Y (n s )MAX3002–MAX3012PROPAGATION DELAY vs. CAPACITIVE LOAD ON I/O V CC (DRIVING I/O V L , V CC = 3.3V, V L = 1.8V)M A X 3000E /M A X 3001E /M A X 3002–M A X 3012+1.2V to +5.5V , ±15kV ESD-Protected, 0.1µA,35Mbps, 8-Channel Level Translators 10______________________________________________________________________________________Pin DescriptionMAX3000E/MAX3001E/MAX3002MAX3000E/MAX3001E/MAX3002–MAX301235Mbps, 8-Channel Level Translators Pin Description (continued)M A X 3000E /M A X 3001E /M A X 3002–M A X 301235Mbps, 8-Channel Level Translators Pin Description (continued)MAX3004–MAX3012______________________________________________Test Circuits/Timing DiagramsFigure 1a. Driving I/O V L Figure 1b. Timing for Driving I/O V LFigure 2a. Driving I/O V CC Figure 2b. Timing for Driving I/O V CCMAX3000E/MAX3001E/MAX3002–MAX301235Mbps, 8-Channel Level TranslatorsM A X 3000E /M A X 3001E /M A X 3002–M A X 301235Mbps, 8-Channel Level Translators _________________________________Test Circuits/Timing Diagrams (continued)Figure 3. Propagation Delay from I/O V L to I/O V CC After ENFigure 4. Propagation Delay from I/O V CC to I/O V L After ENsourced to each load on the V L side, yet the device does not latch up.The maximum data rate also depends heavily on the load capacitance (see the Typical O perating Characteristics), output impedance of the driver, and the operational voltage range (see the Timing Characteristics table).Input Driver Requirements The MAX3001E/MAX3002–MAX3012 architecture is based on a one-shot accelerator output stage. See Figure5. Accelerator output stages are always in three-state except when there is a transition on any of the translators on the input side, either I/O V L or I/O V CC. When there is such a transition, the accelerator stages become active, charging (discharging) the capacitances at the I/Os. Due to its bidirectional nature, both stages become active during the one-shot pulse. This can lead to some current feeding into the external source that is driving the translator. However, this behavior helps to speed up the transition on the driven side.F or proper full-speed operation, the output current of a device that drives the inputs of the MAX3000E/ MAX3001E/MAX3002–MAX3012 should meet the fol-lowing requirements:•MAX3000E (230kbps):i > 1mA, R drv< 1kΩ•MAX3001E (4Mbps):i > 107x V x (C + 10pF)•MAX3002–MAX3012 (20Mbps):i > 108x V x (C + 10pF)where i is the driver output current, V is the logic-supply voltage (i.e., V L or V CC) and C is the parasitic capaci-tance of the signal line.Enable Output Mode (EN, EN A/B) The MAX3000E/MAX3001E/MAX3002 and the MAX3004–MAX3012 feature an EN input, and the MAX3003 has an EN A/B input. Pull EN low to set the MAX3000E/ MAX3001E/MAX3002/MAX3004–MAX3012s’ I/O V CC1 through I/O V CC8 in three-state output mode, while I/O V L1 through I/O V L8 have internal 6kΩpulldown resis-tors. Drive EN to logic-high (V L) for normal operation. The MAX3003 is intended for bus multiplexing or bus switch-ing applications. Drive EN A/B low to place channels 1B through 4B in active mode, while channels 1A through 4A are in three-state mode. Drive EN A/B to logic-high (V L) to enable channels 1A through 4A, while channels 1B through 4B remain in three-state mode.±15kV ESD Protection As with all Maxim devices, ESD-protection structures are incorporated on all pins to protect against electro-static discharges encountered during handling and assembly. The I/O V CC lines have extra protection against static discharge. Maxim’s engineers have developed state-of-the-art structures to protect these pins against ESD of ±15kV without damage. The ESD structures withstand high ESD in all states: normal operation, three-state output mode, and powered down. After an ESD event, Maxim’s E versions keep working without latchup, whereas competing products can latch and must be powered down to remove latchup.MAX3000E/MAX3001E/MAX3002–MAX301235Mbps, 8-Channel Level Translators Detailed Description The MAX3000E/MAX3001E/MAX3002–MAX3012 logic-level translators provide the level shifting necessary to allow data transfer in a multivoltage system. Externally applied voltages, V CC and V L, set the logic levels on either side of the device. Logic signals present on the V L side of the device appear as a higher voltage logic signal on the V CC side of the device, and vice-versa.The MAX3000E/MAX3001E/MAX3002/MAX3003 are bidirectional level translators allowing data translation in either direction (V L↔V CC) on any single data line.These devices use an architecture specifically designed to be bidirectional without the use of a direc-tion pin. The MAX3004–MAX3012 unidirectional level translators level shift data in one direction (V L →V CC or V CC→V L) on any single data line. The MAX3000E/MAX3001E/ MAX3002–MAX3012 accept V L from +1.2V to +5.5V. All devices have V CC ranging from +1.65V to +5.5V, making them ideal for data trans-fer between low-voltage ASICs/PLDs and higher volt-age systems.The MAX3000E/MAX3001E/MAX3002/MAX3004–MAX3012 feature an output enable mode that reduces V CC supply current to less than 2µA, and V L supply current to less than 2µA when in shutdown. The MAX3000E/MAX3001E have ±15kV ESD protection on the V CC side for greater protection in applications that route signals externally. The MAX3000E operates at a guaranteed data rate of 230kbps; the MAX3001E oper-ates at a guaranteed data rate of 4Mbps and the MAX3002–MAX3012 are guaranteed with a data rate of20Mbps of operation over the entire specified operating voltage range.Level Translation For proper operation, ensure that +1.65V ≤V CC≤+5.5V,+1.2V ≤V L≤+5.5V, and V L≤V CC. During power-up sequencing, V L≥V CC does not damage the device.During power-supply sequencing, when V CC is floating and V L is powering up, up to 10mA current can beM A X 3000E /M A X 3001E /M A X 3002–M A X 301235Mbps, 8-Channel Level Translators ESD protection can be tested in various ways. The I/O V CC lines of the MAX3000E/MAX3001E are char-acterized for protection to ±15kV using the Human Body Model.ESD Test ConditionsESD performance depends on a variety of conditions.Contact Maxim for a reliability report that documents test setup, test methodology, and test results.Human Body ModelFigure 7a shows the Human Body Model and Figure 7b shows the current waveform it generates when dis-charged into a low impedance. This model consists of a 100pF capacitor charged to the ESD voltage of inter-est, which is then discharged into the test device through a 1.5k Ωresistor.Machine ModelThe Machine Model for ESD tests all pins using a 200pF storage capacitor and zero discharge resis-tance. Its objective is to emulate the stress caused by contact that occurs with handling and assembly during manufacturing. Of course, all pins require this protec-tion during manufacturing, not just inputs and outputs.Therefore, after PCB assembly, the Machine Model is less relevant to I/O ports.Figure 5. MAX3001E/MAX3002–MAX3012 Simplified Functional Diagram (1 I/O Line)Figure 6. Typical I IN vs. V INApplications InformationPower-Supply Decoupling To reduce ripple and the chance of transmitting incor-rect data, bypass V L and V CC to ground with a 0.1µF capacitor. To ensure full ±15kV ESD protection, bypass V CC to ground with a 1µF capacitor. Place all capaci-tors as close to the power-supply inputs as possible.I2C Level Translation For I2C level translation for I2C applications, please refer to the MAX3372E–MAX3379E/MAX3390E–MAX3393E datasheet.Unidirectional vs. Bidirectional LevelTranslator The MAX3000E/MAX3001E/MAX3002/MAX3003 bidi-rectional translators can operate as a unidirectionaldevice to translate signals without inversion. TheMAX3004–MAX3012 unidirecitional level translators,level-shift data in one direction (V L→V CC or V CC→V L) on any single data line (see the Ordering Information.)These devices provide the smallest solution (UCSPpackage) for unidirectional level translation withoutinversion. MAX3000E/MAX3001E/MAX3002–MAX301235Mbps, 8-Channel Level TranslatorsM A X 3000E /M A X 3001E /M A X 3002–M A X 301235Mbps, 8-Channel Level TranslatorsFigure 7a. Human Body ESD Test Model Figure 7b. Human Body Current WaveformSelector Guide**See Table 1.Table 1. Data RateMAX3000E/MAX3001E/MAX3002 Functional DiagramMAX3000E/MAX3001E/MAX3002–MAX301235Mbps, 8-Channel Level TranslatorsM A X 3000E /M A X 3001E /M A X 3002–M A X 301235Mbps, 8-Channel Level TranslatorsMAX3003 Functional DiagramMAX3000E/MAX3001E/MAX3002–MAX301235Mbps, 8-Channel Level TranslatorsPin ConfigurationsM A X 3000E /M A X 3001E /M A X 3002–M A X 301235Mbps, 8-Channel Level Translators 22______________________________________________________________________________________Pin Configurations (continued)MAX3000E/MAX3001E/MAX3002–MAX301235Mbps, 8-Channel Level Translators______________________________________________________________________________________23Pin Configurations (continued)Ordering Information (continued)*Future product—contact factory for availability.-T = Tape-and-reel package.Chip InformationTRANSISTOR COUNT: 1184PROCESS: BiCMOSM A X 3000E /M A X 3001E /M A X 3002–M A X 301235Mbps, 8-Channel Level Translators 24______________________________________________________________________________________Package Information(The package drawing(s) in this data sheet may not reflect the most current specifications. For the latest package outline information,go to /packages .)Package Information (continued)MAX3000E/MAX3001E/MAX3002–MAX301235Mbps, 8-Channel Level Translators (The package drawing(s) in this data sheet may not reflect the most current specifications. For the latest package outline information,go to /packages.)M A X 3000E /M A X 3001E /M A X 3002–M A X 301235Mbps, 8-Channel Level Translators Maxim cannot assume responsibility for use of any circuitry other than circuitry entirely embodied in a Maxim product. No circuit patent licenses are implied. Maxim reserves the right to change the circuitry and specifications without notice at any time.26____________________Maxim Integrated Products, 120 San Gabriel Drive, Sunnyvale, CA 94086 408-737-7600©2006 Maxim Integrated Productsis a registered trademark of Maxim Integrated Products.Package Information (continued)(The package drawing(s) in this data sheet may not reflect the most current specifications. For the latest package outline information,go to /packages .)Revision HistoryPages changed at Rev 4: 1, 2, 3, 10, 11, 15, 16, 21,23–26。

MAX412CSA+,MAX412ESA+,MAX410ESA+,MAX412CPA+,MAX412EPA+,MAX414CSD+,MAX410BCSA, 规格书,Datasheet 资料

Applications
Low-Noise Frequency Synthesizers Infrared Detectors High-Quality Audio Amplifiers Ultra Low-Noise Instrumentation Amplifiers Bridge Signal Conditioning
ELECTRICAL CHARACTERISTICS
(V+ = 5V, V- = -5V, TA = +25°C, unless otherwise noted.)
PARAMETER Input Offset Voltage Input Bias Current Input Offset Current Differential Input Resistance Common-Mode Input Resistance Input Capacitance SYMBOL VOS IB IOS RIN(Diff) RIN(CM) CIN MAX410, MAX412, MAX414 Input Noise-Voltage Density en MAX410B, MAX412B, MAX414B fO = 10Hz fO = 1000Hz ±3.5 VCM = ±3.5V VS = ±2.4V to ±5.25V RL = 2kΩ, VO = ±3.6V RL = 600Ω, VO = ±3.5V RL = 2kΩ 115 96 115 110 +3.6 -3.7 10Hz 1000Hz (Note 2) 1000Hz (Note 2) CONDITIONS MAX410, MAX410B, MAX412, MAX412B MAX414, MAX414B MIN TYP ±120 ±150 ±80 ±40 20 40 4 7 1.5 2.4 2.6 1.2 +3.7/ -3.8 130 103 122 120 +3.7/ -3.8 35 10kΩ || 20pF load 10kΩ || 20pF load To 0.1% fO = 1kHz 4.5 28 1.3 135 2.4 4.0 pA√Hz V dB dB dB V mA V/µs MHz µs dB nV√Hz MAX ±250 ±320 ±150 ±80 UNITS µV nA nA kΩ MΩ pF

MAX1951ESA+T中文资料

General DescriptionThe MAX1951/MAX1952 high-efficiency, DC-to-DC step-down switching regulators deliver up to 2A of out-put current. The devices operate from an input voltage range of 2.6V to 5.5V and provide an output voltage from 0.8V to V IN , making the MAX1951/MAX1952 ideal for on-board postregulation applications. The MAX1951total output error is less than 1% over load, line, and temperature.The MAX1951/MAX1952 operate at a fixed frequency of 1MHz with an efficiency of up to 94%. The high operating frequency minimizes the size of external components.Internal soft-start control circuitry reduces inrush current.Short-circuit and thermal-overload protection improve design reliability.The MAX1951 provides an adjustable output from 0.8V to V IN , whereas the MAX1952 has a preset output of 1.8V. Both devices are available in a space-saving 8-pin SO package.ApplicationsASIC/DSP/µP/FPGA Core and I/O Voltages Set-Top Boxes Cellular Base StationsNetworking and TelecommunicationsFeatureso Compact 0.385in 2Circuit Footprinto 10µF Ceramic Input and Output Capacitors, 2µH Inductor for 1.5A Output o Efficiency Up to 94%o 1% Output Accuracy Over Load, Line, and Temperature (MAX1951, Up to 1.5A)o Guaranteed 2A Output Current o Operate from 2.6V to 5.5V Supplyo Adjustable Output from 0.8V to V IN (MAX1951)o Preset Output of 1.8V (1.5% Accuracy) (MAX1952)o Internal Digital Soft-Softo Short-Circuit and Thermal-Overload ProtectionMAX1951/MAX19521MHz, All-Ceramic, 2.6V to 5.5V Input,2A PWM Step-Down DC-to-DC Regulators________________________________________________________________Maxim Integrated Products 1Ordering Information19-2622; Rev 1; 8/03For pricing, delivery, and ordering information,please contact Maxim/Dallas Direct!at 1-888-629-4642, or visit Maxim’s website at .Typical Operating CircuitPin ConfigurationM A X 1951/M A X 19521MHz, All-Ceramic, 2.6V to 5.5V Input,2A PWM Step-Down DC-to-DC Regulators 2_______________________________________________________________________________________ABSOLUTE MAXIMUM RATINGSELECTRICAL CHARACTERISTICSStresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.IN, V CC to GND........................................................-0.3V to +6V COMP, FB, REF to GND.............................-0.3V to (V CC + 0.3V)LX to Current (Note 1).........................................................±4.5A PGND to GND.............................................Internally Connected Continuous Power Dissipation (T A = +85°C)8-Pin SO (derate 12.2mW/°C above +70°C)................976mWOperating Temperature RangeMAX195_ ESA..................................................-40°C to +85°C Junction Temperature Range............................-40°C to +150°C Storage Temperature Range.............................-65°C to +150°C Lead Temperature (soldering, 10s).................................+300°CNote 1:LX has internal clamp diodes to PGND and IN. Applications that forward bias these diodes should take care not to exceedthe IC ’s package power dissipation limits.MAX1951/MAX19521MHz, All-Ceramic, 2.6V to 5.5V Input,2A PWM Step-Down DC-to-DC Regulators_______________________________________________________________________________________3ELECTRICAL CHARACTERISTICS (continued)(V IN = V CC = 3.3V, PGND = GND, FB in regulation, C REF = 0.1µF, T A = 0°C to +85°C , unless otherwise noted. Typical values are at T A = +25°C.)ELECTRICAL CHARACTERISTICSM A X 1951/M A X 19521MHz, All-Ceramic, 2.6V to 5.5V Input,2A PWM Step-Down DC-to-DC Regulators 4_______________________________________________________________________________________Note 3:The LX output is designed to provide 2.4A RMS current.ELECTRICAL CHARACTERISTICS (continued)(V IN = V CC = 3.3V, PGND = GND, FB in regulation, C REF = 0.1µF, T A = -40°C to +85°C , unless otherwise noted.) (Note 2)MAX1951/MAX19521MHz, All-Ceramic, 2.6V to 5.5V Input,2A PWM Step-Down DC-to-DC Regulators_______________________________________________________________________________________5EFFICIENCY vs. LOAD CURRENT(V CC = V IN = 5V)LOAD CURRENT (mA)E F F I C I E N C Y (%)100010010203040506070809010001010,000EFFICIENCY vs. LOAD CURRENT(V CC = V IN = 3.3V)LOAD CURRENT (mA)E F F I C I E N C Y (%)100010010203040506070809010001010,000REF VOLTAGEvs. REF OUTPUT CURRENTREF OUTPUT CURRENT (µA)R E F V O L T A G E (V )35302520151051.9901.9911.9921.9931.9941.9951.98940SWITCHING FREQUENCY vs. INPUT VOLTAGEINPUT VOLTAGE (V)S W I T C H I N G F R E Q U E N C Y (M H z )5.14.63.13.64.10.850.900.951.001.051.101.151.200.802.65.6OUTPUT VOLTAGE DEVIATIONvs. LOAD CURRENTLOAD CURRENT (A)O U T P U T V O L T A G ED E V I A T I O N (m V)1.20.80.4-5-4-3-2-10123456-61.6Typical Operating Characteristics(Typical values are at V IN = V CC = 5V, V OUT = 1.5V, I OUT = 1.5A, and T A = +25°C, unless otherwise noted. See Figure 2.)LOAD TRANSIENT RESPONSEMAX1951 toc0640µs/div0OUTPUT VOLTAGE:100mV/div, AC-COUPLED OUTPUT CURRENT:0.5A/div V IN = 5V V OUT = 2.5V I OUT = 0.5 TO 1ALOAD TRANSIENT RESPONSEMAX1951 toc0740µs/divOUTPUT VOLTAGE:100mV/div, AC-COUPLEDOUTPUT CURRENT:0.5A/div V IN = 3.3V V OUT = 1.5V I OUT = 0.5 TO 1AM A X 1951/M A X 19521MHz, All Ceramic, 2.6V to 5.5V Input,2A PWM Step-Down DC-to-DC Regulators 6_______________________________________________________________________________________Typical Operating Characteristics (continued)(Typical values are at V IN = V CC = 5V, V OUT = 1.5V, I OUT = 1.5A, and T A = +25°C, unless otherwise noted. See Figure 2.)SHUTDOWN CURRENT vs. INPUT VOLTAGEM A X 1951 t o c 12INPUT VOLTAGE (V)S H U T D O W N C U R R E N T (m A )5.04.54.03.53.00.10.20.30.40.50.60.70.80.91.002.55.5SWITCHING WAVEFORMSMAX1951 toc08200ns/div0INDUCTOR CURRENT 1A/divV LX 5V/divOUTPUT VOLTAGE 10mV/div, AC-COUPLEDV IN = 3.3V V OUT = 1.8V I LOAD = 1.5ASOFT-START WAVEFORMSMAX1951 toc091ms/divV COMP 2V/divOUTPUT VOLTAGE 1V/divV IN = V CC = 3.3V V OUT = 2.5V I LOAD = 1.5ASOFT-START WAVEFORMSMAX1951 toc101ms/divV COMP 2V/divOUTPUT VOLTAGE 0.5V/divV IN = V CC = 3.3V V OUT = 0.8VSHUTDOWN WAVEFORMSMAX1951 toc1120µs/divV COMP 2V/divV LX 5V/divOUTPUT VOLTAGE 1V/divV IN = V CC = 3.3V V OUT = 2.5V I LOAD = 1.5AMAX1951/MAX19521MHz, All-Ceramic, 2.6V to 5.5V Input,2A PWM Step-Down DC-to-DC Regulators_______________________________________________________________________________________7Detailed DescriptionThe MAX1951/MAX1952 high-efficiency switching regula-tors are small, simple, DC-to-DC step-down converters capable of delivering up to 2A of output current. The devices operate in pulse-width modulation (PWM) at a fixed frequency of 1MHz from a 2.6V to 5.5V input voltage and provide an output voltage from 0.8V to V IN , making the MAX1951/MAX1952 ideal for on-board postregula-tion applications. The high switching frequency allows for the use of smaller external components, and internal synchronous rectifiers improve efficiency and eliminate the typical Schottky free-wheeling diode. Using the on-resistance of the internal high-side MOSFET to sense switching currents eliminates current-sense resistors,further improving efficiency and cost. The MAX1951total output error over load, line, and temperature (0°C to +85°C) is less than 1%.Controller Block FunctionThe MAX1951/MAX1952 step-down converters use a PWM current-mode control scheme. An open-loop com-parator compares the integrated voltage-feedback signal against the sum of the amplified current-sense signal and the slope compensation ramp. At each rising edge of the internal clock, the internal high-side MOSFET turns on until the PWM comparator trips. During this on-time, cur-rent ramps up through the inductor, sourcing current to the output and storing energy in the inductor. The current-mode feedback system regulates the peak inductor cur-rent as a function of the output voltage error signal. Since the average inductor current is nearly the same as the peak inductor current (<30% ripple current), the circuit acts as a switch-mode transconductance amplifier. To preserve inner-loop stability and eliminate inductor stair-casing, a slope-compensation ramp is summed into the main PWM comparator. During the second half of the cycle, the internal high-side P-channel MOSFET turns off,and the internal low-side N-channel MOSFET turns on.The inductor releases the stored energy as its current ramps down while still providing current to the output. The output capacitor stores charge when the inductor current exceeds the load current, and discharges when the inductor current is lower, smoothing the voltage across the load. Under overload conditions, when the inductor current exceeds the current limit (see the Current Limit section), the high-side MOSFET does not turn on at the rising edge of the clock and the low-side MOSFET remains on to let the inductor current ramp down.Current SenseAn internal current-sense amplifier produces a current signal proportional to the voltage generated by the high-side MOSFET on-resistance and the inductor cur-rent (R DS(ON) x I LX ). The amplified current-sense signal and the internal slope compensation signal are summed together into the comparator ’s inverting input.The PWM comparator turns off the internal high-side MOSFET when this sum exceeds the output from the voltage-error amplifier.Current LimitThe internal high-side MOSFET has a current limit of 3.1A (typ). If the current flowing out of LX exceeds this limit,the high-side MOSFET turns off and the synchronous rectifier turns on. This lowers the duty cycle and causes the output voltage to droop until the current limit is no longer exceeded. A synchronous rectifier current limit of -0.6A (typ) protects the device from current flowing into LX. If the negative current limit is exceeded, the synchro-nous rectifier turns off, forcing the inductor current to flowM A X 1951/M A X 19521MHz, All-Ceramic, 2.6V to 5.5V Input,2A PWM Step-Down DC-to-DC Regulators 8_______________________________________________________________________________________through the high-side MOSFET body diode, back to the input, until the beginning of the next cycle or until the inductor current drops to zero. The MAX1951/MAX1952utilize a pulse-skip mode to prevent overheating during short-circuit output conditions. The device enters pulse-skip mode when the FB voltage drops below 300mV, lim-iting the current to 3A (typ) and reducing power dissipation. Normal operation resumes upon removal of the short-circuit condition.V CC DecouplingDue to the high switching frequency and tight output tolerance (1%), decouple V CC with a 0.1µF capacitor connected from V CC to GND, and a 10Ωresistor con-nected from V CC to IN. Place the capacitor as close to V CC as possible.Soft-StartThe MAX1951/MAX1952 employ digital soft-start circuitry to reduce supply inrush current during startup conditions.When the device exits undervoltage lockout (UVLO), shut-down mode, or restarts following a thermal-overload event, or the external pulldown on COMP is released, the digital soft-start circuitry slowly ramps up the voltages at REF and FB (see the Soft-Start Waveforms in the Typical Operating Characteristics).Undervoltage LockoutIf V CC drops below 2.25V, the UVLO circuit inhibits switching. Once V CC rises above 2.35V, the UVLO clears, and the soft-start sequence activates.Compensationand Shutdown ModeThe output of the internal transconductance voltage error amplifier connects to COMP. The normal operation voltage for COMP is 1V to 2.2V. To shut down the MAX1951/MAX1952, use an NPN bipolar junction transistor or a very low output capacitance open-drain MOSFET to pull COMP to GND. Shutdown mode causes the internal MOSFETs to stop switching, forces LX to a high-impedance state, and shorts REF to G ND.Release COMP to exit shutdown and initiate the soft-start sequence.Thermal-Overload ProtectionThermal-overload protection limits total power dissipation in the device. When the junction temperature exceeds T J = +160°C, a thermal sensor forces the device into shut-down, allowing the die to cool. The thermal sensor turns the device on again after the junction temperature cools by 15°C, resulting in a pulsed output during continuous overload conditions. Following a thermal-shutdown condi-tion, the soft-start sequence begins.Figure 1. Functional DiagramMAX1951/MAX19521MHz, All-Ceramic, 2.6V to 5.5V Input,2A PWM Step-Down DC-to-DC Regulators_______________________________________________________________________________________9Design ProcedureOutput Voltage Selection: Adjustable(MAX1951) or Preset (MAX1952)The MAX1951 provides an adjustable output voltage between 0.8V and V IN . Connect FB to output for 0.8V output. To set the output voltage of the MAX1951 to a voltage greater than V FB (0.8V typ), connect the output to FB and G ND using a resistive divider, as shown in Figure 2a. Choose R2 between 2k Ωand 20k Ω, and set R3 according to the following equation:R3 = R2 x [(V OUT / V FB ) – 1]The MAX1951 PWM circuitry is capable of a stable min-imum duty cycle of 18%. This limits the minimum output voltage that can be generated to 0.18 ✕V IN . Instability may result for V IN /V OUT ratios below 0.18.The MAX1952 provides a preset output voltage.Connect the output to FB, as shown in Figure 2b.Output Inductor DesignUse a 2µH inductor with a minimum 2A-rated DC cur-rent for most applications. For best efficiency, use an inductor with a DC resistance of less than 20m Ωand a saturation current greater than 3A (min). See Table 2for recommended inductors and manufacturers. For most designs, derive a reasonable inductor value (L INIT ) from the following equation:L INIT = V OUT x (V IN - V OUT ) / (V IN x LIR x I OUT(MAX)x f SW )where f SW is the switching frequency (1MHz typ) of the oscillator. Keep the inductor current ripple percentage LIR between 20% and 40% of the maximum load cur-rent for the best compromise of cost, size, and perfor-mance. Calculate the maximum inductor current as:I L(MAX)= (1 + LIR / 2) x I OUT(MAX)Check the final values of the inductor with the output ripple voltage requirement. The output ripple voltage is given by:V RIPPLE = V OUT x (V IN - V OUT ) x ESR / (V IN x L FINAL x f SW )where ESR is the equivalent series resistance of the output capacitors.Input Capacitor DesignThe input filter capacitor reduces peak currents drawn from the power source and reduces noise and voltage ripple on the input caused by the circuit ’s switching.The input capacitor must meet the ripple current requirement (I RMS ) imposed by the switching currents defined by the following equation:For duty ratios less than 0.5, the input capacitor RMS current is higher than the calculated current. Therefore,use a +20% margin when calculating the RMS current at lower duty cycles. Use ceramic capacitors for their low ESR, equivalent series inductance (ESL), and lower cost. Choose a capacitor that exhibits less than 10°C temperature rise at the maximum operating RMS cur-rent for optimum long-term reliability.After determining the input capacitor, check the input ripple voltage due to capacitor discharge when the high-side MOSFET turns on. Calculate the input ripple voltage as follows:V IN_RIPPLE = (I OUT x V OUT ) / (f SW x V IN x C IN )Keep the input ripple voltage less than 3% of the input voltage.Output Capacitor DesignThe key selection parameters for the output capacitor are capacitance, ESR, ESL, and the voltage rating requirements. These affect the overall stability, output ripple voltage, and transient response of the DC-to-DC converter. The output ripple occurs due to variations in the charge stored in the output capacitor, the voltage drop due to the capacitor ’s ESR, and the voltage drop due to the capacitor ’s ESL. Calculate the output voltage ripple due to the output capacitance, ESR, and ESL as:V RIPPLE = V RIPPLE(C)+ V RIPPLE(ESR) + V RIPPLE(ESL)where the output ripple due to output capacitance,ESR, and ESL is:V RIPPLE(C)= I P-P / (8 x C OUT x f SW )V RIPPLE(ESR) = I P-P x ESRV RIPPLE(ESL)= (I P-P / t ON ) x ESL or (I P-P / t OFF ) x ESL,whichever is greater and I P-P the peak-to-peak inductor current is:I P-P = [ (V IN – V OUT ) / f SW x L) ] x V OUT / V INUse these equations for initial capacitor selection, but determine final values by testing a prototype or evalua-tion circuit. As a rule, a smaller ripple current results in less output voltage ripple. Since the inductor ripple current is a factor of the inductor value, the output voltage ripple decreases with larger inductance. Use ceramic capacitors for their low ESR and ESL at the switching frequency of the converter. The low ESL of ceramic capacitors makes ripple voltages negligible.Load transient response depends on the selected output capacitor. During a load transient, the output instantly changes by ESR x I LOAD . Before the controller can respond, the output deviates further, depending on the inductor and output capacitor values. After a short time (see the Load Transient Response graphin theM A X 1951/M A X 19521MHz, All-Ceramic, 2.6V to 5.5V Input,2A PWM Step-Down DC-to-DC Regulators 10______________________________________________________________________________________Typical Operating Characteristic s), the controller responds by regulating the output voltage back to its nominal state. The controller response time depends on the closed-loop bandwidth. A higher bandwidth yields a faster response time, thus preventing the output from deviating further from its regulating value.Compensation DesignThe double pole formed by the inductor and output capacitor of most voltage-mode controllers introduces a large phase shift, which requires an elaborate compensa-tion network to stabilize the control loop. The MAX1951/MAX1952 utilize a current-mode control scheme that reg-ulates the output voltage by forcing the required current through the external inductor, eliminating the double pole caused by the inductor and output capacitor, and greatly simplifying the compensation network. A simple type 1compensation with single compensation resistor (R 1) and compensation capacitor (C 2) creates a stable and high-bandwidth loop.An internal transconductance error amplifier compen-sates the control loop. Connect a series resistor and capacitor between COMP (the output of the error ampli-fier) and G ND to form a pole-zero pair. The external inductor, internal current-sensing circuitry, output capacitor, and the external compensation circuit deter-mine the loop system stability. Choose the inductor and output capacitor based on performance, size, and cost.Additionally, select the compensation resistor and capacitor to optimize control-loop stability. The compo-nent values shown in the typical application circuit (Figure 2) yield stable operation over a broad range of input-to-output voltages.The basic regulator loop consists of a power modulator,an output feedback divider, and an error amplifier. The power modulator has DC gain set by gmc x R LOAD ,with a pole-zero pair set by R LOAD , the output capaci-tor (C OUT ), and its ESR. The following equations define the power modulator:Modulator gain:G MOD = ∆V OUT / ∆V COMP = gmc x R LOAD Modulator pole frequency:fp MOD = 1 / (2 x πx C OUT x (R LOAD +ESR))Modulator zero frequency:fz ESR = 1 / (2 x πx C OUT x ESR)where, R LOAD = V OUT / I OUT(MAX), and gmc = 4.2S.The feedback divider has a gain of G FB = V FB / V OUT ,where V FB is equal to 0.8V. The transconductance error amplifier has a DC gain, G EA(DC),of 70dB. The com-pensation capacitor, C 2,and the output resistance of the error amplifier, R OEA (20M Ω), set the dominantpole. C 2and R 1 set a compensation zero. Calculate the dominant pole frequency as:fp EA = 1 / (2πx C C x R OEA )Determine the compensation zero frequency is:fz EA = 1 / (2πx C C x R C )For best stability and response performance, set the closed-loop unity-gain frequency much higher than the modulator pole frequency. In addition, set the closed-loop crossover unity-gain frequency less than, or equal to, 1/5 of the switching frequency. However, set the maximum zero crossing frequency to less than 1/3 of the zero frequency set by the output capacitance and its ESR when using POSCAP, SPCAP, OSCON, or other electrolytic capacitors.The loop-gain equation at the unity-gain frequency is:G EA(fc) x G MOD(fc) x V FB / V OUT = 1where G EA(fc )= gm EA x R 1, and G MOD(fc)= gmc x R LOAD x fp MOD /f C, where gm EA = 60µS .R 1calculated as:R 1= V OUT x K / (gm EA x V FB x G MOD(fc))where K is the correction factor due to the extra phase introduced by the current loop at high frequencies (>100kHz). K is related to the value of the output capacitance (see Table 1 for values of K vs. C). Set the error-amplifier compensation zero formed by R 1and C 2at the modulator pole frequency at maximum load. C 2is calculated as follows:C 2= (2 x V OUT x C OUT / (R 1 x I OUT(MAX))As the load current decreases, the modulator pole also decreases; however, the modulator gain increases accordingly, resulting in a constant closed-loop unity-gain frequency. Use the following numerical example to calculate R 1and C 2values of the typical application circuit of Figure 2a.Table 1. K ValueV OUT = 1.5VI OUT(MAX)= 1.5A C OUT = 10µF R ESR = 0.010Ωgm EA = 60µSMAX1951/MAX19521MHz, All-Ceramic, 2.6V to 5.5V Input,2A PWM Step-Down DC-to-DC Regulators______________________________________________________________________________________11gmc = 4.2Sf SWITCH = 1MHzR LOAD = V OUT / I OUT(MAX)= 1.5V / 1.5 A = 1Ωfp MOD = [1 / (2πx C OUT x (R LOAD + R ESR )]= [1 / (2 x π×10 ×10-6x (1 + 0.01)] = 15.76kHz.fz ESR = [1/(2πxC OUT R ESR )]= [1 / (2 x π×10 ×10-6×0.01)] = 1.59MHz.For 2µH output inductor, pick the closed-loop unity-gain crossover frequency (f C ) at 200kHz. Determine the power modulator gain at f C :G MOD(fc )= gmc ×R LOAD ×fp MOD / f C = 4.2 ×1 ×15.76kHz / 200kHz = 0.33then:R 1= V O x K / (gm EA x V FB x G MOD(fc )) = (1.5 x 0.55) /(60 ×10-6 ×0.8 ×0.33) ≈51.1k Ω(1%)C 2= (2 x V OUT ×C OUT ) / (R C ×I OUT(max))= (2 ×1.25 × 10 × 10-6)/ (51.1k ×1.5) ≈209pF, choose 220pF, 10%Applications InformationPC Board Layout ConsiderationsCareful PC board layout is critical to achieve clean and stable operation. The switching power stage requires particular attention. Follow these guidelines for good PC board layout:1)Place decoupling capacitors as close to the IC as possible. Keep power ground plane (connected to PG ND) and signal ground plane (connected to GND) separate.2)Connect input and output capacitors to the power ground plane; connect all other capacitors to the signal ground plane.3)Keep the high-current paths as short and wide as possible. Keep the path of switching current (C1 to IN and C1 to PG ND) short. Avoid vias in the switching paths.4)If possible, connect IN, LX, and PGND separately to a large copper area to help cool the IC to further improve efficiency and long-term reliability.5)Ensure all feedback connections are short and direct. Place the feedback resistors as close to the IC as possible.6)Route high-speed switching nodes away from sensi-tive analog areas (FB, COMP).Thermal ConsiderationsThe MAX1951 uses a fused-lead 8-pin SO package with a R THJC rating of 32°C/W. The MAX1951 EV kit layout is optimized for 1.5A. The typical application circuit shown in Figure 2c was tested with the existing MAX1951 EV kit layout at +85°C ambient temperature, and G ND lead temperature was measured at +113°C for a typical device. The estimated junction temperature was +138°C. Thermal performance can be further improved with one of the following options:1) Increase the copper areas connected to G ND, LX,and IN.2) Provide thermal vias next to G ND and IN, to the ground plane and power plane on the back side of PC board, with openings in the solder mask next to the vias to provide better thermal conduction.3) Provide forced-air cooling to further reduce case temperature.M A X 1951/M A X 19521MHz, All-Ceramic, 2.6V to 5.5V Input,2A PWM Step-Down DC-to-DC Regulators 12______________________________________________________________________________________Figure 2a. MAX1951 Adjustable Output Typical Application CircuitFigure 2b. MAX1952 Fixed-Output Typical Application CircuitMAX1951/MAX19521MHz, All-Ceramic, 2.6V to 5.5V Input,2A PWM Step-Down DC-to-DC Regulators______________________________________________________________________________________13Figure 2c. MAX1951 Typical Application Circuit with 2A OutputM A X 1951/M A X 19521MHz, All-Ceramic, 2.6V to 5.5V Input,2A PWM Step-Down DC-to-DC Regulators 14______________________________________________________________________________________Chip InformationTRANSISTOR COUNT: 2500PROCESS: BiCMOSMAX1951/MAX19521MHz, All-Ceramic, 2.6V to 5.5V Input,2A PWM Step-Down DC-to-DC RegulatorsMaxim cannot assume responsibility for use of any circuitry other than circuitry entirely embod ied in a Maxim prod uct. No circuit patent licenses are implied. Maxim reserves the right to change the circuitry and specifications without notice at any time.Maxim Integrated Products, 120 San Gabriel Drive, Sunnyvale, CA 94086 408-737-7600 ____________________15©2003 Maxim Integrated ProductsPrinted USAis a registered trademark of Maxim Integrated Products.Package Information(The package drawing(s) in this data sheet may not reflect the most current specifications. For the latest package outline information go to /packages .)。

MAX471MAX472的中文资料大全

MAX471/MAX472的特点、功能美国美信公司生产的精密高端电流检测放大器是一个系列化产品，有MAX471/MAX472、MAX4172/MAX4173等。

它们均有一个电流输出端，可以用一个电阻来简单地实现以地为参考点的电流/电压的转换，并可工作在较宽电压内。

MAX471/MAX472具有如下特点：●具有完美的高端电流检测功能；●内含精密的内部检测电阻（MAX471）；●在工作温度范围内，其精度为2%；●具有双向检测指示，可监控充电和放电状态；●内部检测电阻和检测能力为3A，并联使用时还可扩大检测电流范围；●使用外部检测电阻可任意扩展检测电流范围（MAX472）；●最大电源电流为100μA；●关闭方式时的电流仅为5μA；●电压范围为3～36V；●采用8脚DIP/SO/STO三种封装形式。

MAX471/MAX472的引脚排列如图1所示，图2所示为其内部功能框图。

表1为MAX471/MAX472的引脚功能说明。

MAX471的电流增益比已预设为500μA/A，由于2kΩ的输出电阻（ROUT）可产生1V/A的转换，因此±3A时的满度值为3V.用不同的ROUT电阻可设置不同的满度电压。

但对于MAX471，其输出电压不应大于VRS+。

对于MAX472，则不能大于。

MAX471引脚图如图１所示，MAX472引脚图如图２所示。

MAX471/MAX472的引脚功能说明引脚名称功能MAX471MAX47211SHDN关闭端。

正常运用时连接到地。

当此端接高电平时，电源电流小于5μA2，3-RS+内部电流检测电阻电池（或电源端）。

“+”仅指示与SIGN输出有关的流动方向。

封装时已将2和3连在了一起-2空脚88OUT 电流输出，它正比于流过TSENSE被测电路的幅度，在MAX741中，此引脚到地之间应接一个2kΩ电阻，每一安培被测电流将产生大小等于1V的电压OUT端为电流幅度输出端，而SIGN端可用来指示输出电流的方向。

MAX3232EEUE+T中文资料

For pricing, delivery, and ordering information, please contact Maxim Direct at 1-888-629-4642,or visit Maxim's website at .General DescriptionThe MAX3222E/MAX3232E/MAX3237E/MAX3241E/MAX3246E +3.0V-powered EIA/TIA-232 and V.28/V.24communications interface devices feature low power con-sumption, high data-rate capabilities, and enhanced electrostatic-discharge (ESD) protection. The enhanced ESD structure protects all transmitter outputs and receiver inputs to ±15kV using IEC 1000-4-2 Air-G ap Discharge, ±8kV using IEC 1000-4-2 Contact Discharge (±9kV for MAX3246E), and ±15kV using the Human Body Model. The logic and receiver I/O pins of the MAX3237E are protected to the above standards, while the transmit-ter output pins are protected to ±15kV using the Human Body Model.A proprietary low-dropout transmitter output stage delivers true RS-232 performance from a +3.0V to +5.5V power supply, using an internal dual charge pump. The charge pump requires only four small 0.1µF capacitors for opera-tion from a +3.3V supply. Each device guarantees opera-tion at data rates of 250kbps while maintaining RS-232output levels. The MAX3237E guarantees operation at 250kbps in the normal operating mode and 1Mbps in the MegaBaud™ operating mode, while maintaining RS-232-compliant output levels.The MAX3222E/MAX3232E have two receivers and two transmitters. The MAX3222E features a 1µA shutdown mode that reduces power consumption in battery-pow-ered portable systems. The MAX3222E receivers remain active in shutdown mode, allowing monitoring of external devices while consuming only 1µA of supply current. The MAX3222E and MAX3232E are pin, package, and func-tionally compatible with the industry-standard MAX242and MAX232, respectively.The MAX3241E/MAX3246E are complete serial ports (three drivers/five receivers) designed for notebook and subnotebook computers. The MAX3237E (five drivers/three receivers) is ideal for peripheral applications that require fast data transfer. These devices feature a shut-down mode in which all receivers remain active, while consuming only 1µA (MAX3241E/MAX3246E) or 10nA (MAX3237E).The MAX3222E, MAX3232E, and MAX3241E are avail-able in space-saving SO, SSOP, TQFN and TSSOP pack-ages. The MAX3237E is offered in an SSOP package.The MAX3246E is offered in the ultra-small 6 x 6 UCSP™package.ApplicationsBattery-Powered Equipment PrintersCell PhonesSmart Phones Cell-Phone Data Cables xDSL ModemsNotebook, Subnotebook,and Palmtop ComputersNext-Generation Device Features♦For Space-Constrained ApplicationsMAX3228E/MAX3229E: ±15kV ESD-Protected, +2.5V to +5.5V, RS-232 Transceivers in UCSP ♦For Low-Voltage or Data Cable ApplicationsMAX3380E/MAX3381E: +2.35V to +5.5V, 1µA, 2Tx/2Rx, RS-232 Transceivers with ±15kV ESD-Protected I/O and Logic PinsMAX3222E/MAX3232E/MAX3237E/MAX3241E †/MAX3246E±15kV ESD-Protected, Down to 10nA, 3.0V to 5.5V ,Up to 1Mbps, True RS-232 Transceivers________________________________________________________________Maxim Integrated Products 119-1298; Rev 11; 10/07Ordering Information continued at end of data sheet.*Dice are tested at T A = +25°C, DC parameters only.**EP = Exposed paddle.Pin Configurations, Selector Guide, and Typical Operating Circuits appear at end of data sheet.MegaBaud and UCSP are trademarks of Maxim Integrated Products, Inc.†Covered by U.S. Patent numbers 4,636,930; 4,679,134;4,777,577; 4,797,899; 4,809,152; 4,897,774; 4,999,761; and other patents pending.M A X 3222E /M A X 3232E /M A X 3237E /M A X 3241E †/M A X 3246EUp to 1Mbps, True RS-232 TransceiversABSOLUTE MAXIMUM RATINGSELECTRICAL CHARACTERISTICS(V CC = +3V to +5.5V, C1–C4 = 0.1µF, T A = T MIN to T MAX , unless otherwise noted. Typical values are at T A = +25°C.) (Notes 3, 4)Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.V CC to GND..............................................................-0.3V to +6V V+ to GND (Note 1)..................................................-0.3V to +7V V- to GND (Note 1)...................................................+0.3V to -7V V+ + |V-| (Note 1).................................................................+13V Input Voltages T_IN, EN , SHDN , MBAUD to GND ........................-0.3V to +6V R_IN to GND.....................................................................±25V Output Voltages T_OUT to GND...............................................................±13.2V R_OUT, R_OUTB (MAX3241E)................-0.3V to (V CC + 0.3V)Short-Circuit Duration, T_OUT to GND.......................Continuous Continuous Power Dissipation (T A = +70°C)16-Pin SSOP (derate 7.14mW/°C above +70°C)..........571mW 16-Pin TSSOP (derate 9.4mW/°C above +70°C).......754.7mW 16-Pin TQFN (derate 20.8mW/°C above +70°C).....1666.7mW 16-Pin Wide SO (derate 9.52mW/°C above +70°C).....762mW 18-Pin Wide SO (derate 9.52mW/°C above +70°C).....762mW 18-Pin PDIP (derate 11.11mW/°C above +70°C)..........889mW 20-Pin TQFN (derate 21.3mW/°C above +70°C)........1702mW 20-Pin TSSOP (derate 10.9mW/°C above +70°C)........879mW 20-Pin SSOP (derate 8.00mW/°C above +70°C)..........640mW 28-Pin SSOP (derate 9.52mW/°C above +70°C)..........762mW 28-Pin Wide SO (derate 12.50mW/°C above +70°C).............1W 28-Pin TSSOP (derate 12.8mW/°C above +70°C)......1026mW 32-Lead Thin QFN (derate 33.3mW/°C above +70°C)..2666mW 6 x 6 UCSP (derate 12.6mW/°C above +70°C).............1010mW Operating Temperature Ranges MAX32_ _EC_ _...................................................0°C to +70°C MAX32_ _EE_ _.................................................-40°C to +85°C Storage Temperature Range.............................-65°C to +150°C Lead Temperature (soldering, 10s).................................+300°C Bump Reflow Temperature (Note 2)Infrared, 15s..................................................................+200°C Vapor Phase, 20s..........................................................+215°C Note 1:V+ and V- can have maximum magnitudes of 7V, but their absolute difference cannot exceed 13V.Note 2:This device is constructed using a unique set of packaging techniques that impose a limit on the thermal profile the devicecan be exposed to during board-level solder attach and rework. This limit permits only the use of the solder profiles recom-mended in the industry-standard specification, JEDEC 020A, paragraph 7.6, Table 3 for IR/VPR and convection reflow.Preheating is required. Hand or wave soldering is not allowed.MAX3222E/MAX3232E/MAX3237E/MAX3241E †/MAX3246EUp to 1Mbps, True RS-232 Transceivers_______________________________________________________________________________________3M A X 3222E /M A X 3232E /M A X 3237E /M A X 3241E †/M A X 3246EUp to 1Mbps, True RS-232 Transceivers4_______________________________________________________________________________________TIMING CHARACTERISTICS—MAX3237E(V CC = +3V to +5.5V, C1–C4 = 0.1µF, T A = T MIN to T MAX , unless otherwise noted. Typical values are at T A = +25°C.) (Note 3)±10%. MAX3237E: C1–C4 = 0.1µF tested at +3.3V ±5%, C1–C4 = 0.22µF tested at +3.3V ±10%; C1 = 0.047µF, C2, C3, C4 =0.33µF tested at +5.0V ±10%. MAX3246E; C1-C4 = 0.22µF tested at +3.3V ±10%; C1 = 0.22µF, C2, C3, C4 = 0.54µF tested at 5.0V ±10%.Note 4:MAX3246E devices are production tested at +25°C. All limits are guaranteed by design over the operating temperature range.Note 5:The MAX3237E logic inputs have an active positive feedback resistor. The input current goes to zero when the inputs are atthe supply rails.Note 6:MAX3241EEUI is specified at T A = +25°C.Note 7:Transmitter skew is measured at the transmitter zero crosspoints.TIMING CHARACTERISTICS—MAX3222E/MAX3232E/MAX3241E/MAX3246EMAX3222E/MAX3232E/MAX3237E/MAX3241E †/MAX3246EUp to 1Mbps, True RS-232 Transceivers_______________________________________________________________________________________5-6-4-202460MAX3237ETRANSMITTER OUTPUT VOLTAGE vs. LOAD CAPACITANCE (MBAUD = GND)LOAD CAPACITANCE (pF)T R A N S M I T T E R O U T P U T V O L T A G E (V )10001500500200025003000531-1-3-5-6-2-42046-5-31-135010001500500200025003000LOAD CAPACITANCE (pF)T R A N S M I T T E R O U T P U T V O L T A G E (V )MAX3237ETRANSMITTER OUTPUT VOLTAGEvs. LOAD CAPACITANCE-7.5-5.0-2.502.55.07.5MAX3237ETRANSMITTER OUTPUT VOLTAGE vs. LOAD CAPACITANCE (MBAUD = V CC )LOAD CAPACITANCE (pF)T R A N S M I T T E R O U T P U T V O L T A G E (V )500100015002000__________________________________________Typical Operating Characteristics(V CC = +3.3V, 250kbps data rate, 0.1µF capacitors, all transmitters loaded with 3k Ωand C L , T A = +25°C, unless otherwise noted.)-6-5-4-3-2-10123456010002000300040005000MAX3241ETRANSMITTER OUTPUT VOLTAGEvs. LOAD CAPACITANCELOAD CAPACITANCE (pF)T R A N S M I T T E R O U T P U T V O L T A G E (V)302010405060020001000300040005000MAX3241EOPERATING SUPPLY CURRENT vs. LOAD CAPACITANCELOAD CAPACITANCE (pF)S U P P L Y C U R R E N T (m A )04286121014010002000300040005000MAX3241ESLEW RATE vs. LOAD CAPACITANCEM A X 3237E t o c 05LOAD CAPACITANCE (pF)S L E W R A T E (V /μs )-6-5-4-3-2-10123456010002000300040005000MAX3222E/MAX3232ETRANSMITTER OUTPUT VOLTAGEvs. LOAD CAPACITANCELOAD CAPACITANCE (pF)T R A N S M I T T E R O U T P UT V O L T A G E (V )624108141216010002000300040005000MAX3222E/MAX3232ESLEW RATE vs. LOAD CAPACITANCELOAD CAPACITANCE (pF)S L E W R A T E (V /μs)2520155103530404520001000300040005000MAX3222E/MAX3232E OPERATING SUPPLY CURRENT vs. LOAD CAPACITANCELOAD CAPACITANCE (pF)S U P P L Y C U R R E N T (m A )M A X 3222E /M A X 3232E /M A X 3237E /M A X 3241E †/M A X 3246EUp to 1Mbps, True RS-232 Transceivers6_______________________________________________________________________________________Typical Operating Characteristics (continued)(V CC = +3.3V, 250kbps data rate, 0.1µF capacitors, all transmitters loaded with 3k Ωand C L , T A = +25°C, unless otherwise noted.)20604080100MAX3237ETRANSMITTER SKEW vs. LOAD CAPACITANCE(MBAUD = V CC )LOAD CAPACITANCE (pF)100015005002000T R A N S M I T T E R S K E W (n s )-6-2-42046-3-51-1352.03.03.52.54.04.55.0SUPPLY VOLTAGE (V)T R A N S M I T T E R O U T P U T V O L T A G E (V )MAX3237ETRANSMITTER OUTPUT VOLTAGE vs. SUPPLY VOLTAGE (MBAUD = GND)10203040502.0MAX3237E SUPPLY CURRENT vs. SUPPLY VOLTAGE (MBAUD = GND)SUPPLY VOLTAGE (V)S U P P L Y C U R R E N T (m A )3.03.52.54.04.55.0MAX3246ETRANSMITTER OUTPUT VOLTAGEvs. LOAD CAPACITANCELOAD CAPACITANCE (pF)T R A N S M I T T E R O U T P U T V O L T A G E (V )4000300010002000-5-4-3-2-101234567-65000468101214160MAX3246ESLEW RATE vs. LOAD CAPACITANCELOAD CAPACITANCE (pF)S L EW R A T E (V /μs )200030001000400050001020304050600MAX3246EOPERATING SUPPLY CURRENT vs. LOAD CAPACITANCEM A X 3237E t o c 17LOAD CAPACITANCE (pF)S U P P L Y C U R R EN T (m A )1000200030004000500055453525155024681012MAX3237ESLEW RATE vs. LOAD CAPACITANCE(MBAUD = GND)LOAD CAPACITANCE (pF)S L E W R A T E (V /μs )10001500500200025003000010203050406070MAX3237ESLEW RATE vs. LOAD CAPACITANCE(MBAUD = V CC )LOAD CAPACITANCE (pF)S L E W R A T E (V /μs )5001000150020001020304050MAX3237ESUPPLY CURRENT vs. LOAD CAPACITANCE WHEN TRANSMITTING DATA (MBAUD = GND)LOAD CAPACITANCE (pF)S U P P L Y C U R R E N T (m A )10001500500200025003000MAX3222E/MAX3232E/MAX3237E/MAX3241E †/MAX3246EUp to 1Mbps, True RS-232 Transceivers_______________________________________________________________________________________7Pin DescriptionM A X 3222E /M A X 3232E /M A X 3237E /M A X 3241E †/M A X 3246EUp to 1Mbps, True RS-232 Transceivers8_______________________________________________________________________________________MAX3222E/MAX3232E/MAX3237E/MAX3241E †/MAX3246EUp to 1Mbps, True RS-232 Transceivers_______________________________________________________________________________________9Detailed DescriptionDual Charge-Pump Voltage ConverterThe MAX3222E/MAX3232E/MAX3237E/MAX3241E/MAX3246Es’ internal power supply consists of a regu-lated dual charge pump that provides output voltages of +5.5V (doubling charge pump) and -5.5V (inverting charge pump) over the +3.0V to +5.5V V CC range. The charge pump operates in discontinuous mode; if the output voltages are less than 5.5V, the charge pump is enabled, and if the output voltages exceed 5.5V, the charge pump is disabled. Each charge pump requires a flying capacitor (C1, C2) and a reservoir capacitor (C3, C4) to generate the V+ and V- supplies (Figure 1).RS-232 TransmittersThe transmitters are inverting level translators that con-vert TTL/CMOS-logic levels to ±5V EIA/TIA-232-compli-ant levels.The MAX3222E/MAX3232E/MAX3237E/MAX3241E/MAX3246E transmitters guarantee a 250kbps data rate with worst-case loads of 3k Ωin parallel with 1000pF,providing compatibility with PC-to-PC communication software (such as LapLink™). Transmitters can be par-alleled to drive multiple receivers or mice.The MAX3222E/MAX3237E/MAX3241E/MAX3246E transmitters are disabled and the outputs are forcedinto a high-impedance state when the device is in shut-down mode (SHDN = G ND). The MAX3222E/MAX3232E/MAX3237E/MAX3241E/MAX3246E permit the outputs to be driven up to ±12V in shutdown.The MAX3222E/MAX3232E/MAX3241E/MAX3246E transmitter inputs do not have pullup resistors. Connect unused inputs to GND or V CC . The MAX3237E’s trans-mitter inputs have a 400k Ωactive positive-feedback resistor, allowing unused inputs to be left unconnected.MAX3237E MegaBaud OperationFor higher-speed serial communications, the MAX3237E features MegaBaud operation. In MegaBaud operating mode (MBAUD = V CC ), the MAX3237E transmitters guarantee a 1Mbps data rate with worst-case loads of 3k Ωin parallel with 250pF for +3.0V < V CC < +4.5V. For +5V ±10% operation, the MAX3237E transmitters guarantee a 1Mbps data rate into worst-case loads of 3k Ωin parallel with 1000pF.RS-232 ReceiversThe receivers convert RS-232 signals to CMOS-logic output levels. The MAX3222E/MAX3237E/MAX3241E/MAX3246E receivers have inverting three-state outputs.Drive EN high to place the receiver(s) into a high-impedance state. Receivers can be either active or inactive in shutdown (Table 1).Figure 1. Slew-Rate Test CircuitsLapLink is a trademark of Traveling Software.M A X 3222E /M A X 3232E /M A X 3237E /M A X 3241E †/M A X 3246EUp to 1Mbps, True RS-232 Transceivers10______________________________________________________________________________________The complementary outputs on the MAX3237E/MAX3241E (R_OUTB) are always active, regardless of the state of EN or SHDN . This allows the device to be used for ring indicator applications without forward biasing other devices connected to the receiver outputs. This is ideal for systems where V CC drops to zero in shutdown to accommodate peripherals such as UARTs (Figure 2).MAX3222E/MAX3237E/MAX3241E/MAX3246E Shutdown ModeSupply current falls to less than 1µA in shutdown mode (SHDN = low). The MAX3237E’s supply current falls to10nA (typ) when all receiver inputs are in the invalid range (-0.3V < R_IN < +0.3). When shut down, the device’s charge pumps are shut off, V+ is pulled down to V CC , V- is pulled to ground, and the transmitter out-puts are disabled (high impedance). The time required to recover from shutdown is typically 100µs, as shown in Figure 3. Connect SHDN to V CC if shutdown mode is not used. SHDN has no effect on R_OUT or R_OUTB (MAX3237E/MAX3241E).±15kV ESD ProtectionAs with all Maxim devices, ESD-protection structures are incorporated to protect against electrostatic dis-charges encountered during handling and assembly.The driver outputs and receiver inputs of the MAX3222E/MAX3232E/MAX3237E/MAX3241E/MAX3246E have extra protection against static electricity. Maxim’s engineers have developed state-of-the-art structures to protect these pins against ESD of ±15kV without damage.The ESD structures withstand high ESD in all states:normal operation, shutdown, and powered down. After an ESD event, Maxim’s E versions keep working without latchup, whereas competing RS-232 products can latch and must be powered down to remove latchup.Furthermore, the MAX3237E logic I/O pins also have ±15kV ESD protection. Protecting the logic I/O pins to ±15kV makes the MAX3237E ideal for data cable applications.SHDN T2OUTT1OUT5V/div2V/divV CC = 3.3V C1–C4 = 0.1μFFigure 3. Transmitter Outputs Recovering from Shutdown or Powering UpMAX3222E/MAX3232E/MAX3237E/MAX3241E †/MAX3246EUp to 1Mbps, True RS-232 TransceiversESD protection can be tested in various ways; the transmitter outputs and receiver inputs for the MAX3222E/MAX3232E/MAX3241E/MAX3246E are characterized for protection to the following limits:•±15kV using the Human Body Model•±8kV using the Contact Discharge method specified in IEC 1000-4-2•±9kV (MAX3246E only) using the Contact Discharge method specified in IEC 1000-4-2•±15kV using the Air-G ap Discharge method speci-fied in IEC 1000-4-2Figure 4a. Human Body ESD Test ModelFigure 4b. Human Body Model Current WaveformFigure 5a. IEC 1000-4-2 ESD Test Model Figure 5b. IEC 1000-4-2 ESD Generator Current WaveformM A X 3222E /M A X 3232E /M A X 3237E /M A X 3241E †/M A X 3246EUp to 1Mbps, True RS-232 Transceiverscharacterized for protection to ±15kV per the Human Body Model.ESD Test ConditionsESD performance depends on a variety of conditions.Contact Maxim for a reliability report that documents test setup, test methodology, and test results.Human Body ModelFigure 4a shows the Human Body Model, and Figure 4b shows the current waveform it generates when dis-charged into a low impedance. This model consists of a 100pF capacitor charged to the ESD voltage of interest,which is then discharged into the test device through a 1.5k Ωresistor.IEC 1000-4-2The IEC 1000-4-2 standard covers ESD testing and performance of finished equipment; it does not specifi-cally refer to integrated circuits. The MAX3222E/MAX3232E/MAX3237E/MAX3241E/MAX3246E help you design equipment that meets level 4 (the highest level)of IEC 1000-4-2, without the need for additional ESD-protection components.The major difference between tests done using the Human Body Model and IEC 1000-4-2 is higher peak current in IEC 1000-4-2, because series resistance is lower in the IEC 1000-4-2 model. Hence, the ESD with-stand voltage measured to IEC 1000-4-2 is generally lower than that measured using the Human Body Model. Figure 5a shows the IEC 1000-4-2 model, and Figure 5b shows the current waveform for the ±8kV IEC 1000-4-2 level 4 ESD Contact Discharge test. The Air-G ap Discharge test involves approaching the device with a charged probe. The Contact Discharge method connects the probe to the device before the probe is energized.Machine ModelThe Machine Model for ESD tests all pins using a 200pF storage capacitor and zero discharge resis-tance. Its objective is to emulate the stress caused by contact that occurs with handling and assembly during manufacturing. All pins require this protection during manufacturing, not just RS-232 inputs and outputs.Therefore, after PC board assembly, the Machine Model is less relevant to I/O ports.Table 2. Required Minimum Capacitor ValuesFigure 6a. MAX3241E Transmitter Output Voltage vs. Load Current Per TransmitterTable 3. Logic-Family Compatibility with Various Supply VoltagesMAX3222E/MAX3232E/MAX3237E/MAX3241E †/MAX3246EUp to 1Mbps, True RS-232 TransceiversApplications InformationCapacitor SelectionThe capacitor type used for C1–C4 is not critical for proper operation; polarized or nonpolarized capacitors can be used. The charge pump requires 0.1µF capaci-tors for 3.3V operation. For other supply voltages, see Table 2 for required capacitor values. Do not use val-ues smaller than those listed in Table 2. Increasing the capacitor values (e.g., by a factor of 2) reduces ripple on the transmitter outputs and slightly reduces power consumption. C2, C3, and C4 can be increased without changing C1’s value. However, do not increase C1without also increasing the values of C2, C3, C4,and C BYPASS to maintain the proper ratios (C1 to the other capacitors).When using the minimum required capacitor values,make sure the capacitor value does not degradeexcessively with temperature. If in doubt, use capaci-tors with a larger nominal value. The capacitor’s equiv-alent series resistance (ESR), which usually rises at low temperatures, influences the amount of ripple on V+and V-.Power-Supply DecouplingIn most circumstances, a 0.1µF V CC bypass capacitor is adequate. In applications sensitive to power-supply noise, use a capacitor of the same value as charge-pump capacitor C1. Connect bypass capacitors as close to the IC as possible.Operation Down to 2.7VTransmitter outputs meet EIA/TIA-562 levels of ±3.7V with supply voltages as low as 2.7V.Figure 6b. Mouse Driver Test CircuitM A X 3222E /M A X 3232E /M A X 3237E /M A X 3241E †/M A X 3246EUp to 1Mbps, True RS-232 TransceiversFigure 7. Loopback Test CircuitT1IN T1OUTR1OUT5V/div5V/div5V/divV CC = 3.3V C1–C4 = 0.1μFFigure 8. MAX3241E Loopback Test Result at 120kbps T1INT1OUTR1OUT5V/div5V/div5V/divV CC = 3.3V, C1–C4 = 0.1μFFigure 9. MAX3241E Loopback Test Result at 250kbps+5V 0+5V 0-5V +5VT_INT_OUT5k Ω + 250pFR_OUTV CC = 3.3V C1–C4 = 0.1μFFigure 10. MAX3237E Loopback Test Result at 1000kbps (MBAUD = V CC )Transmitter Outputs Recoveringfrom ShutdownFigure 3 shows two transmitter outputs recovering from shutdown mode. As they become active, the two trans-mitter outputs are shown going to opposite RS-232 levels (one transmitter input is high; the other is low). Each transmitter is loaded with 3k Ωin parallel with 2500pF.The transmitter outputs display no ringing or undesir-able transients as they come out of shutdown. Note thatthe transmitters are enabled only when the magnitude of V- exceeds approximately -3.0V.Mouse DrivabilityThe MAX3241E is designed to power serial mice while operating from low-voltage power supplies. It has been tested with leading mouse brands from manu-facturers such as Microsoft and Logitech. The MAX3241E successfully drove all serial mice tested and met their current and voltage requirements.MAX3222E/MAX3232E/MAX3237E/MAX3241E †/MAX3246EUp to 1Mbps, True RS-232 TransceiversFigure 6a shows the transmitter output voltages under increasing load current at +3.0V. Figure 6b shows a typical mouse connection using the MAX3241E.High Data RatesThe MAX3222E/MAX3232E/MAX3237E/MAX3241E/MAX3246E maintain the RS-232 ±5V minimum transmit-ter output voltage even at high data rates. Figure 7shows a transmitter loopback test circuit. Figure 8shows a loopback test result at 120kbps, and Figure 9shows the same test at 250kbps. For Figure 8, all trans-mitters were driven simultaneously at 120kbps into RS-232 loads in parallel with 1000pF. For Figure 9, a single transmitter was driven at 250kbps, and all transmitters were loaded with an RS-232 receiver in parallel with 1000pF.The MAX3237E maintains the RS-232 ±5.0V minimum transmitter output voltage at data rates up to 1Mbps.Figure 10 shows a loopback test result at 1Mbps with MBAUD = V CC . For Figure 10, all transmitters were loaded with an RS-232 receiver in parallel with 250pF.Interconnection with 3V and 5V LogicThe MAX3222E/MAX3232E/MAX3237E/MAX3241E/MAX3246E can directly interface with various 5V logic families, including ACT and HCT CMOS. See Table 3for more information on possible combinations of inter-connections.UCSP ReliabilityThe UCSP represents a unique packaging form factor that may not perform equally to a packaged product through traditional mechanical reliability tests. UCSP reliability is integrally linked to the user’s assembly methods, circuit board material, and usage environ-ment. The user should closely review these areas when considering use of a UCSP package. Performance through Operating Life Test and Moisture Resistance remains uncompromised as the wafer-fabrication process primarily determines it.Mechanical stress performance is a greater considera-tion for a UCSP package. UCSPs are attached through direct solder contact to the user’s PC board, foregoing the inherent stress relief of a packaged product lead frame. Solder joint contact integrity must be consid-ered. Table 4 shows the testing done to characterize the UCSP reliability performance. In conclusion, the UCSP is capable of performing reliably through envi-ronmental stresses as indicated by the results in the table. Additional usage data and recommendations are detailed in the UCSP application note, which can be found on Maxim’s website at .Table 4. Reliability Test DataM A X 3222E /M A X 3232E /M A X 3237E /M A X 3241E †/M A X 3246EUp to 1Mbps, True RS-232 Transceivers__________________________________________________________Pin ConfigurationsMAX3222E/MAX3232E/MAX3237E/MAX3241E †/MAX3246EUp to 1Mbps, True RS-232 TransceiversPin Configurations (continued)M A X 3222E /M A X 3232E /M A X 3237E /M A X 3241E †/M A X 3246EUp to 1Mbps, True RS-232 Transceivers__________________________________________________Typical Operating CircuitsMAX3222E/MAX3232E/MAX3237E/MAX3241E †/MAX3246EUp to 1Mbps, True RS-232 Transceivers_____________________________________Typical Operating Circuits (continued)M A X 3222E /M A X 3232E /M A X 3237E /M A X 3241E †/M A X 3246EUp to 1Mbps, True RS-232 Transceivers_____________________________________Typical Operating Circuits (continued)MAX3222E/MAX3232E/MAX3237E/MAX3241E †/MAX3246EUp to 1Mbps, True RS-232 Transceivers______________________________________________________________________________________21Selector Guide___________________Chip InformationTRANSISTOR COUNT:MAX3222E/MAX3232E: 1129MAX3237E: 2110MAX3241E: 1335MAX3246E: 842PROCESS: BICMOSOrdering Information (continued)†Requires solder temperature profile described in the AbsoluteMaximum Ratings section. UCSP Reliability is integrally linked to the user’s assembly methods, circuit board material, and environment. Refer to the UCSP Reliability Notice in the UCSP Reliability section of this datasheet for more information.**EP = Exposed paddle.。

MAX4351EKA+T中文资料

General DescriptionThe MAX4350 single and MAX4351 dual op amps are unity-gain-stable devices that combine high-speed per-formance with rail-to-rail outputs. Both devices operate from dual ±5V supplies. The common-mode input volt-age range extends to the negative power-supply rail. The MAX4350/MAX4351 require only 6.9mA of quies-cent supply current per op amp while achieving a 210MHz -3dB bandwidth and a 485V/µs slew rate. Both devices are excellent solutions in low-power systems that require wide bandwidth, such as video, communi-cations, and instrumentation.The MAX4350 is available in an ultra-small 5-pin SC70package and the MAX4351 is available in a space-saving 8-pin SOT23 package.ApplicationsSet-Top BoxesSurveillance Video Systems Video Line DriversAnalog-to-Digital Converter Interface CCD Imaging SystemsVideo Routing and Switching Systems Digital CamerasFeatures♦Ultra-Small 5-Pin SC70, 5-Pin SOT23, and 8-Pin SOT23 Packages ♦Low Cost♦High Speed210MHz -3dB Bandwidth 55MHz 0.1dB Gain Flatness 485V/µs Slew Rate ♦Rail-to-Rail Outputs♦Input Common-Mode Range Extends to V EE ♦Low Differential Gain/Phase: 0.02%/0.08°♦Low Distortion at 5MHz-65dBc SFDR-63dB Total Harmonic DistortionMAX4350/MAX4351Ultra-Small, Low-Cost, 210MHz, Dual-SupplyOp Amps with Rail-to-Rail Outputs________________________________________________________________Maxim Integrated Products 1Pin ConfigurationsTypical Operating Circuit19-1989; Rev 1; 10/05For pricing, delivery, and ordering information,please contact Maxim/Dallas Direct!at 1-888-629-4642, or visit Maxim’s website at .M A X 4350/M A X 4351Ultra-Small, Low-Cost, 210MHz, Dual-Supply Op Amps with Rail-to-Rail Outputs 2_______________________________________________________________________________________ABSOLUTE MAXIMUM RATINGSDC ELECTRICAL CHARACTERISTICS(V CC = +5V, V EE = -5V, R L = ∞to 0V, V OUT = 0, T A = T MIN to T MAX , unless otherwise noted. Typical values are at T A = +25°C.) (NoteSupply Voltage (V CC to V EE )................................................+12V IN_-, IN_+, OUT_..............................(V EE - 0.3V) to (V CC + 0.3V)Output Short-Circuit Current to V CC or V EE ......................150mA Continuous Power Dissipation (T A = +70°C)5-Pin SC70 (derate 2.5mW/°C above +70°C).............200mW 5-Pin SOT23 (derate 7.1mW/°C above +70°C)...........571mW8-Pin SOT23 (derate 5.26mW/°C above +70°C).........421mW 8-Pin SO (derate 5.9mW/°C above +70°C).................471mW Operating Temperature Range ...........................-40°C to +85°C Storage Temperature Range.............................-65°C to +150°C Lead Temperature (soldering, 10s).................................+300°CStresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or at any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.MAX4350/MAX4351Ultra-Small, Low-Cost, 210MHz, Dual-SupplyOp Amps with Rail-to-Rail Outputs_______________________________________________________________________________________3AC ELECTRICAL CHARACTERISTICSM A X 4350/M A X 4351Ultra-Small, Low-Cost, 210MHz, Dual-Supply Op Amps with Rail-to-Rail Outputs 4_______________________________________________________________________________________Typical Operating Characteristics(V CC = +5V, V EE = -5V, V CM = 0V, A VCL = +1V/V, R F = 24Ω, R L = 100Ωto 0, T A = +25°C, unless otherwise noted.)4-6100k10M 100M1M1GSMALL-SIGNAL GAIN vs. FREQUENCYFREQUENCY (Hz)G A I N (d B )-5-4-3-2-101234-6100k 10M 100M 1M 1G LARGE-SIGNAL GAIN vs. FREQUENCYFREQUENCY (Hz)G A I N (d B )-5-4-3-2-101230.4-0.6100k 10M 100M 1M 1GGAIN FLATNESS vs. FREQUENCYFREQUENCY (Hz)G A I N (d B )-0.5-0.4-0.3-0.2-0.100.10.20.3100k10M 1M100M1GOUTPUT IMPEDANCE vs. FREQUENCYM A X 4350-05FREQUENCY (Hz)I M P E D A N C E (Ω)1000.010.1110-10-100100k100M10M1MDISTORTION vs. FREQUENCY-70-90-30-500-60-80-20-40FREQUENCY (Hz)D I S T O R T I O N (d B c )-10-100100k100M10M1MDISTORTION vs. FREQUENCY-70-90-30-500-60-80-20-40FREQUENCY (Hz)D I S T O R T I O N (d B c )-10-100100k100M10M1MDISTORTION vs. FREQUENCY-70-90-30-500-60-80-20-40FREQUENCY (Hz)D I S T O R T I O N (d B c )-100-70-80-90-60-50-40-30-20-100040020060080010001200DISTORTION vs. LOAD RESISTANCER LOAD (Ω)D I S T O R T I O N (d B c )0.4-0.6100k1M10M 100M1GGAIN FLATNESS vs. FREQUENCY-0.4FREQUENCY (Hz)G A I N (d B )-0.200.20.1-0.1-0.3-0.50.3MAX4350/MAX4351Ultra-Small, Low-Cost, 210MHz, Dual-SupplyOp Amps with Rail-to-Rail Outputs_______________________________________________________________________________________51000100DIFFERENTIAL GAIN AND PHASE-0.01000.0050.0150.025IRED I F F P H A SE (d e g r e e s )D I F F G A I N (%)M A X 4350-11IRE-0.0050.0200.010-0.040.020.040.080.1200.100.06-0.020-100100k 10M 100M 1M 1GCOMMON-MODE REJECTIONvs. FREQUENCYM A X 4350-12FREQUENCY (Hz)C M R (d B )-90-80-70-60-50-40-30-20-10P S R (d B )0-100100k10M 100M1M1GPOWER-SUPPLY REJECTIONvs. FREQUENCYM A X 4350-13FREQUENCY (Hz)-90-80-70-60-50-40-30-20-1000.40.21.00.80.61.41.21.60300400100200500600700800900OUTPUT VOLTAGE SWING vs. LOAD RESISTANCER LOAD (Ω)V S W I N G (V )INPUT 50mV/divOUTPUT 50mV/divSMALL-SIGNAL PULSE RESPONSE20ns/divR F = 24ΩA VCL = +1V/VINPUT 25mV/divOUTPUT 50mV/divSMALL-SIGNAL PULSE RESPONSE20ns/div R F = 500ΩA VCL = +2V/V INPUT 10mV/divOUTPUT 50mV/divSMALL-SIGNAL PULSE RESPONSE20ns/div R F = 500ΩA VCL = +5V/VINPUT 1V/divOUTPUT 1V/divLARGE-SIGNAL PULSE RESPONSE20ns/divR F = 24ΩA VCL = +1V/V-100-70-80-90-60-50-40-30-20-1000.51.01.52.0DISTORTION vs. VOLTAGE SWINGVOLTAGE SWING (Vp-p)D I S T O R T I O N (d B c )Typical Operating Characteristics (continued)(V CC = +5V, V EE = -5V, V CM = 0V, A VCL = +1V/V, R F = 24Ω, R L = 100Ωto 0, T A = +25°C, unless otherwise noted.)M A X 4350/M A X 4351Ultra-Small, Low-Cost, 210MHz, Dual-Supply Op Amps with Rail-to-Rail Outputs 6_______________________________________________________________________________________Typical Operating Characteristics (continued)(V CC = +5V, V EE = -5V, V CM = 0V, A VCL = +1V/V, R F = 24Ω, R L = 100Ωto 0, T A = +25°C, unless otherwise noted.)20ns/divINPUT 1V/divINPUT 1V/divLARGE-SIGNAL PULSE RESPONSER F = 500ΩA VCL = +2V/VV O L T A G E N O I S E (n V /H z )110k100101k100k1M10MVOLTAGE NOISE vs. FREQUENCYFREQUENCY (Hz)11010091110131********20010030040050250150350450500ISOLATION RESISTANCE vs. CAPACITIVE LOADC LOAD (pF)R I S O (Ω)0501001502002503000200100300400500600700800SMALL-SIGNAL BANDWIDTH vs. LOAD RESISTANCEM A X 4350-24R LOAD (Ω)B A N D W I D T H (M H z )8001001k 10kOPEN-LOOP GAIN vs. LOAD RESISTANCE2010M A X 4350-25R LOAD (Ω)O P E N -L O O P G A I N (d B c )4030506070C U R R E N T N O I S E (p A /H z)110k100101k100k1M10MCURRENT NOISE vs. FREQUENCYFREQUENCY (Hz)110100MAX4351CROSSTALK vs. FREQUENCYM A X 4350-26FREQUENCY (Hz)C R O S S T A L K (d B )-140-80-100-120-60-40-2002040600.1M1M10M 100M1GINPUT 500mV/divOUTPUT 1V/divLARGE-SIGNAL PULSE RESPONSE20ns/divR F = 500ΩA VCL = +2V/VDetailed DescriptionThe MAX4350/MAX4351 are single-supply, rail-to-rail,voltage-feedback amplifiers that employ current-feed-back techniques to achieve 485V/µs slew rates and 210MHz bandwidths. Excellent harmonic distortion and differential gain/phase performance make these ampli-fiers an ideal choice for a wide variety of video and RF signal-processing applications.The output voltage swings to within 125mV of each sup-ply rail. Local feedback around the output stage ensures low open-loop output impedance to reduce gain sensitivity to load variations. The input stage per-mits common-mode voltages beyond the negative sup-ply and to within 2.25V of the positive supply rail.Applications InformationChoosing Resistor ValuesUnity-Gain ConfigurationThe MAX4350/MAX4351 are internally compensated for unity gain. When configured for unity gain, a 24Ωresis-tor (R F ) in series with the feedback path optimizes AC performance. This resistor improves AC response by reducing the Q of the parallel LC circuit formed by the parasitic feedback capacitance and inductance.Inverting and Noninverting ConfigurationsSelect the gain-setting feedback (R F ) and input (R G )resistor values to fit your application (Figures 1a and 1b). Large resistor values increase voltage noise and interact with the amplifier’s input and PC board capaci-tance. This can generate undesirable poles and zeros and decrease bandwidth or cause oscillations. For example, a noninverting gain-of-two configuration (R F =R G ) using 1k Ω resistors, combined with 1pF of amplifier input capacitance and 1pF of PC board capacitance,causes a pole at 159MHz. Since this pole is within the amplifier bandwidth, it jeopardizes stability. Reducing the 1k Ωresistors to 100Ωextends the pole frequency to 1.59GHz, but could limit output swing by adding 200Ωin parallel with the amplifier’s load resistor.Layout and Power-Supply BypassingThese amplifiers operate from dual ±5V supplies. Bypass each supply with a 0.1µF capacitor to ground.Maxim recommends using microstrip and stripline tech-niques to obtain full bandwidth. To ensure that the PC board does not degrade the amplifier’s performance,design it for a frequency greater than 1GHz. Pay care-MAX4350/MAX4351Ultra-Small, Low-Cost, 210MHz, Dual-SupplyOp Amps with Rail-to-Rail Outputs_______________________________________________________________________________________7Figure 1a. Noninverting Gain ConfigurationFigure 1b. Inverting Gain Configurationful attention to inputs and outputs to avoid large para-sitic capacitance. Whether or not you use a constant-impedance board, observe the following design guide-lines:•Don’t use wire-wrap boards; they are too inductive.•Don’t use IC sockets; they increase parasitic capaci-tance and inductance.•Use surface-mount instead of through-hole compo-nents for better high-frequency performance.•Use a PC board with at least two layers; it should be as free from voids as possible.•Keep signal lines as short and as straight as possi-ble. Do not make 90°turns; round all corners.Rail-to-Rail Outputs, Ground-Sensing InputThe input common-mode range extends from V EE to (V CC - 2.25V) with excellent common-mode rejection. Beyond this range, the amplifier output is a nonlinear function of the input, but does not undergo phase reversal or latchup. The output swings to within 125mV of either power-supply rail with a 2k Ωload.Output Capacitive Load and StabilityThe MAX4350/MAX4351 are optimized for AC perfor-mance. They are not designed to drive highly reactive loads, which decrease phase margin and may produce excessive ringing and oscillation. Figure 2 shows a cir-cuit that eliminates this problem. Figure 3 is a graph of the I solation Resistance (R ISO ) vs. Capacitive Load.Figure 4 shows how a capacitive load causes exces-sive peaking of the amplifier’s frequency response if the capacitor is not isolated from the amplifier by a resistor. A small isolation resistor (usually 20Ωto 30Ω)placed before the reactive load prevents ringing and oscillation. At higher capacitive loads, AC performance is controlled by the interaction of the load capacitance and the isolation resistor. Figure 5 shows the effect of a 27Ωisolation resistor on closed-loop response.Coaxial cable and other transmission lines are easily driven when properly terminated at both ends with their characteristic impedance. Driving back-terminated transmission lines essentially eliminates the line’s capacitance.M A X 4350/M A X 4351Ultra-Small, Low-Cost, 210MHz, Dual-Supply Op Amps with Rail-to-Rail Outputs 8_______________________________________________________________________________________Figure 2. Driving a Capacitive Load Through an Isolation Resistor 302520510150CAPACITIVE LOAD (pF)50100200150250I S O L A T I O N R E S I S T A N C E (Ω)Figure 3. Isolation Resistance vs. Capacitive LoadMAX4350/MAX4351Ultra-Small, Low-Cost, 210MHz, Dual-SupplyOp Amps with Rail-to-Rail Outputs_______________________________________________________________________________________9Figure 4. Small-Signal Gain vs. Frequency with Load Capacitance and No Isolation ResistorFigure 5. Small-Signal Gain vs. Frequency with Load Capacitance and 27ΩIsolation ResistorPin Configurations (continued)Chip InformationMAX4350 TRANSISTOR COUNT: 86MAX4351 TRANSISTOR COUNT: 170M A X 4350/M A X 4351Ultra-Small, Low-Cost, 210MHz, Dual-Supply Op Amps with Rail-to-Rail OutputsPackage Information(The package drawing(s) in this data sheet may not reflect the most current specifications. For the latest package outline information go to /packages .)implied. Maxim reserves the right to change the circuitry and specifications without notice at any time.Maxim Integrated Products, 120 San Gabriel Drive, Sunnyvale, CA 94086 408-737-7600 ____________________11©2005 Maxim Integrated Products Printed USA is a registered trademark of Maxim Integrated Products, Inc.MAX4350/MAX4351Ultra-Small, Low-Cost, 200MHz, Dual-SupplyOp Amps with Rail-to-Rail OutputsPackage Information (continued) (The package drawing(s) in this data sheet may not reflect the most current specifications. For the latest package outline information go to /packages.)元器件交易网。