VN920-B5H13TR;中文规格书,Datasheet资料

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h-y920干膜技术规格

h-y920干膜技术规格
H-Y920是一种干膜技术，其规格具有以下特点。

1. 材料特性：H-Y920采用高质量的聚脂基材，具有优异的电气绝缘性能和机械强度，能够有效保护电子元件。

2. 厚度控制：H-Y920的干膜技术可以实现非常精确的薄膜厚度控制，可根据客户需求制定不同厚度的膜层，以满足不同应用场景的要求。

3. 粘附性：H-Y920干膜技术具有优异的粘附性能，能够牢固地粘附在基板上，不易剥离或脱落，确保电子元件的稳定性和可靠性。

4. 高温耐性：H-Y920干膜技术经过特殊处理，具有出色的高温耐性，能够在高温环境下保持稳定性，不会产生变形或脱落现象。

5. 抗化学腐蚀性：H-Y920干膜技术对常见的化学物质具有良好的抗腐蚀性能，能够有效防止电子元件受到化学物质的侵蚀，延长元件的使用寿命。

6. 环境友好性：H-Y920干膜技术不含有害物质，符合环保要求，对人体和环境无害。

7. 生产效率高：H-Y920干膜技术使用简便，无需复杂的工艺流程，能够提高生产效率，降低生产成本。

8. 广泛应用：H-Y920干膜技术适用于电子产品、光学仪器、医疗设
备等多个领域，可以满足不同行业的需求。

总的来说，H-Y920干膜技术具有优异的性能特点，能够为电子元件提供有效的保护和增强，保证其稳定性和可靠性。

同时，该技术具有高效、环保等优势，在各个领域都有广泛的应用前景。

无论是电子行业还是其他相关领域，H-Y920干膜技术都将发挥重要作用，为人们的生活带来更多便利和创新。

CCPD-920中文资料

Preheat 180 Secs. Max. 8 Minutes Max.
90 Secs. Max.
260°C for 10 Secs. Max. NOTE: Reflow Profile with 240°C peak also acceptable.
Table 1
Example: CCPD-920X-25-100.000 = 3.3V, 45/55, -40/85°C, 25ppm, 100.000 MHz
Pad 1 2 3 4 5 6
Connection N/C E/D GND OUT COUT Vdd Specifications subject to change without notice.
TD-051101 Rev. B
Aging:
<3ppm 1st/yr, <1ppm every year thereafter SUGGESTED PAD LAYOUT
0.560 (14.2)
Bottom View
0.560 (14.2) 0.210 (5.3)
0.050 (1.2ห้องสมุดไป่ตู้)
0.360 (9.14)
CRYSTEK P/N Frequency Date Code
元器件交易网
ree dF ea oHS nt L R plia m Co
9X14 mm SMD, 3.3V, LVPECL
Frequency Range: Frequency Stability:
CCPD-920 Model
50MHz to 150MHz ±20, ±25, ±50ppm (0°C to 70°C) ±25, ±50ppm (-40°C to 85°C) Temperature Range: 0°C to 70°C (Option X) -40°C to 85°C Storage: -55°C to 120°C Input Voltage: 3.3V ± 0.3V Input Current: 88mA Max Output: Differential LVPECL Symmetry: 45/55% Max @ 50% Vdd Rise/Fall Time: 1ns Max @ 20% to 80% Vdd Linearity: ± 10% Max Logic: Terminated to Vdd-2V into 50 ohms Logic "0" "0" = Vcc-1.85V Min, Vcc-1.62V Max Logic "1" "1" = Vcc-1.02V Min, Vcc-0.81V Max Disable Time 200ns Max Start-up Time 1ms Typ., 2ms Max Phase Jitter: 12KHz to 80MHz 0.5psec Typ., 1psec RMS Max Phase Noise: 10Hz -65dBc/Hz Typical 100Hz -98dBc/Hz Typical 1KHz -125dBc/Hz Typical 10KHz -140dBc/Hz Typical 100KHz - 100MHz -145dBc/Hz Typical

CR920电池规格书

Shenzhen xun jie yuan technology co., LTD深圳市迅捷源科技有限公司CR920Lithium Manganese Dioxide Battery锂锰扣式电池技术规格Signed 签发：Drafted 编制： Li Wei 李伟 Approved 批准： Huang Jian 黄建 Document No.文件编号：QA.S.0225 Edit 版别：A深圳市宝安区西乡臣田工业区 shen zhen City, Baoan District Xixiang Hill Industrial Zone电话（Tel ）：+86-755-29993783 传真（Fax ）：+86-755-29993783 邮箱：xjykj@ 网址：Checked 签名 Approved 批准Corporate name 公司名称： Customer confirmation 客户确认Corporate seal 公司印章：Edition 版本 A XJYBATTERY V alid Date 生效日期 2009-02-19 Document 名称CR920T echnical Specification CR920技术规格书Drafted 编制Li Wei 李伟讯捷源电池Number 编号QA.S.0225Signed 批准Huang Jian 黄建1 Scope 适用范围The specification applies to CR920(Li/MnO 2) battery supplied by Shenzhen xun jie yuan technology co., LTD 本技术规格书适用于深圳市讯捷源科技有限公司生产的CR920锂/二氧化锰扣式电池。

2 Characteristics and Performance 技术参数 2.1 Battery type 电池型号: CR920 2.2 Nominal voltage 标称电压: 3.0 V2.3 Normal capacity 标准容量: 18 mAh (68KΩ to cut-off voltage 2.0V at 23℃±3℃时68KΩ负载电阻连续放电至2.0V)2.4 Operating temperature range 使用温度: -20-60℃ 2.5 Storage temperature range 保存温度: 25±15℃ 2.6 Normal weight 最大重量: 0.5 g2.7 Structure and Outside dimensions 结构和外观尺寸 : Fig1. 2.8: Performance 电池特性表:CR920 Performance 特性表Table 表 1. Item 项目Condition 条件 Test temperature试验温度 Characteristic 特性值 23℃±3℃ ≥3.2V Open circuitvoltage 开路电压 No load 无负载 0℃±3℃≥3.2VShort-circuit current 短路电流after 0.55s 0.5秒内23℃±3℃ ≥50mA23℃±3℃ Normal 标准值100hDischarge Capacity 放电容量Continually discharge at15kΩ resistance to cut-off voltage 2.0V 15kΩ负载连续放电，终止电压2.0V0℃±3℃Normal 标准值95hEdition 版本 A XJYBATTERY V alid Date 生效日期 2009-02-19 Document 名称CR920T echnical Specification CR920技术规格书Drafted 编制Li Wei 李伟讯捷源电池Number 编号QA.S.0225Signed 批准Huang Jian 黄建Table 表 2. Condition of storage 项目Condition 条件Characteristic特性值Discharge capacity after storage 贮存后放电容量 Continually discharge at 15kΩ resistance to cut-off voltage 2.0V at 23±3℃ after storing for 20 days at60±3℃在23℃±3℃下 15kΩ负载连续放电至2.0V 终止 Normal 标准值95hSelf-dischargerate 自放电率 The normal temperature and humidity under normal storage for 12 months 常温常湿下保存12个月Less than 5% 不大于5％3 Test 测试3.1 Conditions 测试环境:Temperature 温度、湿度、大气压: 25±15℃, Relative Humidity：65±10% Pressure: 1.0atm, (unless otherwise specified) 若无特别规定, 试验条件均指：常温（23±3℃）, 常湿（65±10％），常压（1.0 atm）。

ATSTK520;中文规格书,Datasheet资料

STK520 .............................................................................................. User GuideSTK520 User Guide 3Table of ContentsSection 1Introduction............................................................................................1-2Section 2Using the STK520 Top Module.............................................................2-42.1Connecting the STK520 to the STK500 Starter Kit..................................2-42.1.1Placing an AT90PWM3 on the STK520.............................................2-42.1.2Placing an AT90PWM2 on the STK520.............................................2-52.2Programming the AVR..............................................................................2-72.2.1In-System Programming....................................................................2-72.2.2High-voltage Programming................................................................2-82.3JTAGICE mkII Connector.........................................................................2-92.4STK520 Jumpers, Leds & Test Points....................................................2-112.5DALI Interface.........................................................................................2-122.6Potentiometer.........................................................................................2-13Section 3Troubleshooting Guide........................................................................3-14Section 4Technical Specifications......................................................................4-16Section 5Technical Support ...............................................................................5-17Section 6Complete Schematics .........................................................................6-20IntroductionSection 1IntroductionThe STK520 board is a top module designed to add AT90PWM family support to theSTK500 development board from Atmel Corporation.The STK520 includes connectors and hardware allowing full utilization of the new fea-tures of the AT90PWM, while the Zero Insertion Force (ZIF) socket allows easy to use ofSO24 & SO32 packages for prototyping.This user guide acts as a general getting started guide as well as a complete technicalreference for advanced users.Notice that in this guide, the word AVR is used to refer to the target component(AT90PWM2, AT90PWM3...)Figure 1-1. STK520 Top Module for STK500Introduction1.1Features STK520 is a New Member of the Successful STK500 Starter Kit Family.Supports the AT90PWM2 & AT90PWM3.DALI Hardware Interface.Supported by AVR Studio® 4.Zero Insertion Force Socket for SO24 & SO32 Packages.High Voltage Parallell Programming.Serial Programming.DALI Peripherals can be Disconnected from the Device.6 Pin Connector for On-chip Debugging using JTAG MKII Emulator.Potentiometer for the Demo Application.Quick Reference to all Switches and Jumpers in the Silk-Screen of the PCB.Using the STK520 Top Module Section 2Using the STK520 Top Module2.1Connecting the STK520 to theSTK500 Starter Kit Connect the STK520 to the STK500 expansion header 0 and 1. It is important that the top module is connected in the correct orientation as shown in Figure 2-1. The EXPAND0 written on the STK520 top module should match the EXPAND0 written beside the expansion header on the STK500 board.Figure 2-1. Connecting STK520 to the STK500 BoardNote:Connecting the STK520 with wrong orientation may damage the board.2.1.1Placing anAT90PWM3 on theSTK520The STK520 contains both a ZIF socket for a SO32 package. Care should be taken so that the device is mounted with the correct orientation. Figure 2-2 shows the location of pin1 for the ZIF socket.Using the STK520 Top ModuleFigure 2-2. Pin1 on ZIF SocketCaution: Do not mount an AT90PWM3 on the STK520 at the same time as an AVR ismounted on the STK500 board or at the same time as an AT90PWM2 is mounted on theSTK520 board. None of the devices might work as intended.2.1.2Placing anAT90PWM2 on theSTK520The STK520 contains both a ZIF socket for a SO24 package. Care should be taken so that the device is mounted with the correct orientation. Figure 2-2 shows the location of pin1 for the ZIF socket.Figure 2-3. Pin1 on ZIF SocketPIN1PIN1Using the STK520 Top Module Caution: Do not mount an AT90PWM2 on the STK520 at the same time as an AVR is mounted on the STK500 board or at the same time as an AT90PWM3 is mounted on the STK520 board. None of the devices might work as intended.Using the STK520 Top Module2.2Programming theAVR The AVR (AT90PWM2, AT90PWM3...) can be programmed using both SPI and High-voltage Parallel Programming. This section will explain how to connect the programming cables to successfully use one of these two modes. The AVR Studio STK500 software is used in the same way as for other AVR partsNote:The AT90PWM3 also support Self Programming, See AVR109 application note for more information on this topic.2.2.1In-SystemProgramming Figure 2-4. In-System ProgrammingTo program the AT90PWM3 using ISP Programming mode, connect the 6-wire cable between the ISP6PIN connector on the STK500 board and the ISP connector on the STK520 board as shown in Figure 2-4. The device can be programmed using the Serial Programming mode in the AVR Studio4 STK500 software.Note:See STK500 User Guide for information on how to use the STK500 front-end software for ISP Programming.Using the STK520 Top Module2.2.2High-voltageProgramming Figure 2-5. High-voltage (Parallel) ProgrammingTo program the AVR using High-voltage (Parallel) Programming, connect the PROGC-TRL to PORTD and PROGDATA to PORTB on the STK500 as shown in Figure 2-5. Make sure that the TOSC-switch is placed in the XTAL position.As described in the STK500 User Guide (jumper settings), mount the BSEL2 jumper in order to High-voltage Program the ATmega devices. This setting also applies to High-voltage Programming of the AVR.The device can now be programmed using the High-voltage Programming mode in AVR Studio STK500 software.Note:See the STK500 User Guide for information on how to use the STK500 front-end software in High-voltage Programming mode.Note:For the High-voltage Programming mode to function correctly, the target voltage must be higher than 4.5V.Using the STK520 Top Module2.3JTAGICE mkIIConnector See the following document :“JTAGICE mkII Quick Start Guide” which purpose is “Connecting to a target board with the AVR JTAGICE mkII”.This note explains which signals are required for ISP and which signals are required for debugWIRE.Figure 2-6 shows how to connect the JTAGICE mkII probe on the STK520 board. Figure 2-6. Connecting JTAG ICE to the STK520The ISP connector is used for the AT90PWM3 built-in debugWire interface. The pin out of the connector is shown in Table 2-1 and is compliant with the pin out of the JTAG ICE available from Atmel. Connecting a JTAG ICE to this connector allows On-chip Debug-ging of the AT90PWM3.More information about the JTAG ICE and On-chip Debugging can be found in the AVR JTAG ICE User Guide, which is available at the Atmel web site, .分销商库存信息: ATMELATSTK520。

ProductTypeList-optiMOS(20-250V)

N-Channel MOSFETs: OptiMOS™ (20V…250V) Product TypeProduct TypeBSN045NE2LSBSN011NE2LSBSN011NE2LSIBSN012N03LSBSN012N03LSIBSN048N03LSBSB012NE2LXBSB014N04LX3 GBSB015N04NX3 GBSB017N03LX3 GBSB012N03LX3 GBSB028N06NN3 GBSB044N08NN3 GBSB056N10NN3 GBSB013NE2LXIBSB008NE2LXBSB280N15NZ3 G BSB165N15NZ3 G BSB012NE2LXI BSF024N03LT3 G BSF050N03LQ3 G BSF030NE2LQ BSF134N10NJ3 G BSF110N06NT3 G BSF450NE7NH3 G BSF035NE2LQ IPB015N04L G IPB027N10N3 G IPB035N08N3 G IPB015N04N G IPB019N06L3 G IPB083N10N3 G IPB042N10N3 G IPB054N06N3 GIPB037N06N3 G IPB097N08N3 G IPB055N03L G IPB054N08N3 G IPB042N03L G IPB022N04L G IPB065N03L G IPB072N15N3 G IPB025N08N3 G IPB080N03L G IPB081N06L3 G IPB147N03L G IPB096N03L G IPB136N08N3 GIPB090N06N3 G IPB029N06N3 G IPB049NE7N3 G IPB031NE7N3 G IPB020NE7N3 G IPB123N10N3 G IPB038N12N3 G IPB144N12N3 G IPB320N20N3 G IPB107N20N3 G IPB200N25N3 G IPB600N25N3 G BUZ32 H3045A BUZ31 H3045A IPB108N15N3 G BUZ30A H3045AIPB107N20NA IPB057N06N IPB026N06N IPB230N06L3 G IPB067N08N3 G IPB034N03L G IPB009N03L G IPB011N04L G IPB011N04N G IPB016N06L3 G IPB017N06N3 G IPB019N08N3 G IPB020N04N G IPB025N10N3 G IPB030N08N3 GIPB036N12N3 G IPB065N15N3 G IPB010N06NIPB014N06NSPD07N20 GIPD031N06L3 G IPD034N06N3 G IPD035N06L3 G IPD036N04L GIPD038N06N3 G IPD048N06L3 G IPD053N08N3 G SPD50N03S2L-06 G SPD30N03S2L-07 G IPD068N10N3 G SPD50N03S2-07 GIPD082N10N3 G IPD088N06N3 G IPD096N08N3 G SPD30N03S2L-10 G IPD127N06L GIPD135N08N3 G IPD160N04L GIPD170N04N GIPD200N15N3 G SPD30N03S2L-20 G IPD220N06L3 G IPD25CN10N GIPD250N06N3 G IPD33CN10N GIPD350N06L GIPD640N06L G IPD78CN10N G IPD800N06N G IPD122N10N3 G IPD180N10N3 G IPD110N12N3 G IPD031N03L G IPD040N03L G IPD050N03L G IPD060N03L G IPD075N03L G IPD090N03L G IPD320N20N3 G IPD600N25N3 G IPD530N15N3 G IPD105N03L G IPD135N03L GIPD025N06N IPD053N06N IPI023NE7N3 G IPI034NE7N3 G IPI052NE7N3 G IPI126N10N3 G IPI180N10N3 G IPI041N12N3 G IPI076N12N3 G IPI147N12N3 G IPI045N10N3 G IPI086N10N3 G IPI030N10N3 G IPI04CN10N G IPI072N10N3 G IPI26CN10N G IPI35CN10N GIPI075N15N3 G IPI200N15N3 G IPI024N06N3 G IPI032N06N3 G IPI040N06N3 G IPI037N08N3 G IPI320N20N3 G IPI110N20N3 G IPI200N25N3 G IPI600N25N3 G IPI111N15N3 G IPI530N15N3 G IPI020N06NIPI029N06N BUZ31 H3046 IPI084N06L3 GIPU135N08N3 G IPS110N12N3 G IPS060N03L G IPS075N03L G IPS031N03L G IPS040N03L G IPS090N03L G IPS105N03L G IPS135N03L G IPS050N03L G BSZ0908ND BSZ0907ND BSC0921NDI BSC0923NDI BSC0924NDI BSC0925ND BSC0910NDI BSC0911NDBSZ035N03LS G BSZ035N03MS G BSZ040N04LS G BSZ042N04NS G BSZ050N03LS G BSZ050N03MS G BSZ058N03LS G BSZ058N03MS G BSZ067N06LS3 G BSZ076N06NS3 G BSZ088N03MS G BSZ088N03LS G BSZ097N04LS G BSZ100N06LS3 G BSZ100N03MS GBSZ105N04NS G BSZ110N06NS3 G BSZ123N08NS3 G BSZ130N03MS G BSZ130N03LS G BSZ165N04NS G BSZ340N08NS3 G BSZ440N10NS3 G BSZ160N10NS3 G BSZ900N15NS3 G BSZ520N15NS3 G BSZ0909NSBSZ240N12NS3 G BSZ12DN20NS3 G BSZ16DN25NS3 GBSZ42DN25NS3 G BSZ900N20NS3 G BSZ060NE2LS BSZ065N03LS BSZ036NE2LS BSZ018NE2LS BSZ0901NSBSZ0901NSIBSZ0902NSBSZ0904NSIBSZ0902NSIBSZ018NE2LSI BSZ042N06NS BSZ023N04LS BSZ150N10LS3 G BSO615N GBSO033N03MS GBSO083N03MS G BSO110N03MS G BSO330N02K G BSO150N03MD G BSO220N03MD G BSC010NE2LS BSC050NE2LS BSC046N02KS G BSC019N02KS G BSC014N03LS G BSC016N03LS G BSC014N03MS G BSC016N04LS G BSC016N03MS G BSC017N04NS G BSC018N04LS GBSC020N03MS G BSC020N03LS G BSC025N03MS G BSC027N04LS G BSC025N03LS G BSC028N06LS3 G BSC030N03MS G BSC030N04NS G BSC030N03LS G BSC031N06NS3 G BSC034N03LS G BSC035N04LS G BSC042N03MS G BSC042N03LS GBSC050N03MS G BSC050N04LS G BSC050N03LS G BSC054N04NS G BSC057N03MS G BSC057N03LS G BSC057N08NS3 G BSC059N04LS G BSC060N10NS3 G BSC067N06LS3 G BSC076N06NS3 G BSC079N10NS GBSC080N03LS G BSC082N10LS G BSC090N03MS G BSC090N03LS G BSC093N04LS G BSC100N03MS G BSC100N10NSF G BSC100N06LS3 G BSC105N10LSF G BSC110N06NS3 G BSC118N10NS G BSC120N03MS G BSC120N03LS GBSC123N10LS G BSC152N10NSF G BSC190N15NS3 G BSC159N10LSF G BSC196N10NS G BSC205N10LS G BSC252N10NSF G BSC265N10LSF G BSC340N08NS3 G BSC042NE7NS3 G BSC160N10NS3 G 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Amtech Tacky 助焊膏系列安全数据表说明书

Inventec Performance Chemicals USA, LLCSAFETY DATA SHEET (SDS)SECTION 1: PRODUCT AND COMPANY IDENTIFICATIONPRODUCT NAME: Amtech Tacky Paste Flux Series: 200, 400, 500, 600, 4000, SynTECH, WSFC-305L and #61 SYNONYMS:Tacky FluxMANUFACTURER: Inventec Performance Chemicals USA, LLCADDRESS:PO Box 989 Deep River, CT 06417 USAPHONE:860-526-8300FAX:860-526-8243EMERGENCY:Infotrac-(800)535-5035REVISION DATE:December 19, 2014REVISION DATE: 3DOCUMENT NAME:SDS-Tacky Flux-008PRODUCT USE:Bonding solder joints in production and repair of circuit boardsSECTION 2: HAZARDS IDENTIFICATIONCHEMICAL NAME:N/ACHEMICAL FAMILY:MixtureCHEMICAL FORMULA:N/AROUTES OF ENTRY: Inhalation, Ingestion, Skin/Eye ContactGHS:Signal Word: WarningHazard statement(s)H302 Harmful if swallowedH317 May cause an allergic skin reactionH320 Causes eye irritationH335 May cause respiratory irritationPrecautionary statement(s)P102 Keep out of reach of childrenP233 Keep container tightly closedP264 Wash hands thoroughly after handlingP270 Do not eat, drink or smoke when using this productP280 Wear protective gloves/protective clothing/eye protection/face protectionP302+P352 IF ON SKIN: Wash with plenty of soap and waterP305+P351 IF IN EYES: Rinse continuously with water for several minutesP404 Store in a closed containerP501 Dispose of contents/containers in accordance with Federal, State/Provincial, and/or local regulations POTENTIAL HEALTH EFFECTS:EYE CONTACT: May cause moderate irritation. Do not allow material to come in contact with eyes.SKIN CONTACT: May cause moderate skin irritation.INHALATION: May cause irritation to the respiratory tract.INGESTION: Harmful if swallowed. May cause irritation to the mouth, throat, and stomach. May cause abdominal discomfort, nausea, vomiting, and/or diarrhea.CHRONIC: Not established.SECTION 2 NOTES:Inventec Performance Chemicals USA, LLC does not recommend, manufacture, market, or endorse any of its products for human consumption.SECTION 3: COMPOSITION/INFORMATION ON INGREDIENTSIngredient CAS Number Exposure LimitsModified Rosins N/A N/APine Oil Derivatives 8000-41-7 N/AProprietary Ingredients N/A N/AMixed Carboxylic Acids N/A N/ASECTION 3 NOTES:Percentages of individual components are not listed as this information is considered a trade secret.SECTION 4: FIRST AID MEASURESEYES: Flush with plenty of water, contact a physician. If contact lenses can be removed easily, flush eyes without contact lenses. SKIN: Wash affected area with plenty of warm, soapy water. If irritation persists, seek medical attention.INGESTION: Call a physician or Poison Control Center immediately. Do not induce vomiting.INHALATION: Remove to fresh air. If not breathing, seek immediate medical attention.SECTION 5: FIRE-FIGHTING MEASURESEXTINGUISHING MEDIA: Dry chemical, foamSPECIAL FIRE FIGHTING PROCEDURES: Do not use water. Use NIOSH-approved self-contained Breathing Apparatusand full protective clothing if involved in a fire.UNUSUAL FIRE AND EXPLOSION HAZARDS:This product does not present any unusual fire and explosion hazards. SECTION 6: ACCIDENTAL RELEASE MEASURESACCIDENTAL RELEASE MEASURES: If material spills or leaks, collect and place into a properly labeled waste container. Remove traces of tacky flux using cloth rags or paper towels moistened with Isopropyl Alcohol. Follow on-site personal protective equipment recommendations.SECTION 6 NOTES:See Sections 2, 4, and 7 for additional information.SECTION 7: HANDLING AND STORAGEHANDLING/STORAGE: Keep containers tightly closed when not in use. Use care to avoid spills. Avoid inhalation of fumes or dust. Avoid contact with eyes, skin, and clothing.OTHER PRECAUTIONS: Empty containers may retain product residues in vapor, liquid, and/or solid form. All labeled hazard precautions should be observed.WORK HYGIENIC PRACTICES: Cosmetics/Food/Drink/Tobacco should not be consumed or used in work areas. Always wash hands after handling material and before applying or using cosmetics/food/drink/tobacco.SECTION 7 NOTES:For industrial use only.SECTION 8: EXPOSURE CONTROLS/PERSONAL PROTECTIONVENTILATION: Provide sufficient mechanical (general and/or local exhaust) ventilation to maintain exposure below TLVs. RESPIRATORY PROTECTION: Use with adequate ventilation.EYE PROTECTION: Use with appropriate safety glasses.SKIN PROTECTION: Protective gloves and clothing should be worn when handling material. Wash hands thoroughly with soap and water upon leaving the work area.SECTION 9: PHYSICAL AND CHEMICAL PROPERTIESAPPEARANCE: Clear, White, or Yellow to Dark Amber gelODOR: Mild odorODOR THRESHOLD: Not establishedpH as SUPPLIED: N/ASECTION 9: PHYSICAL AND CHEMICAL PROPERTIES (continued)MELTING POINT: Not establishedFREEZING POINT: Not establishedINITIAL BOILING POINT: Not establishedBOILING RANGE: Not establishedFLASH POINT: Not establishedEVAPORATION RATE: Not establishedFLAMMABILITY (solid): Not establishedUPPER/LOWER FLAMMABILITY: Not establishedUPPER/LOWER EXPLOSIVE LIMITS:Not establishedVAPOR PRESSURE (mmHg): N/A (°F/°C)VAPOR DENSITY (AIR = 1): N/A (°F/°C)RELATIVE DENSITY: Not establishedSOLUBILITY IN WATER: PartiallyPARTITION COEFFICIENT (n-octanol/water): Not establishedAUTOIGNITION TEMPERATURE: Not establishedDECOMPOSITION TEMPERATURE: Not establishedVISCOSITY: N/A (°F/°C)SECTION 10: STABILITY AND REACTIVITYSTABILITY: StableCONDITIONS TO AVOID (STABILITY): Freezing temperatures. High temperatures. INCOMPATIBILITY (MATERIAL TO AVOID): Strong oxidizing materialsHAZARDOUS DECOMPOSITION/BY-PRODUCTS: Harmful organic fumes and toxic oxide fumes may form at elevatedtemperatures.POSSIBILITY OF HAZARDOUS REACTIONS: Will not occurSECTION 11: TOXICOLOGICAL INFORMATIONACUTE TOXICITY: Not availableSKIN CORRISION/IRRITATION: Not establishedSERIOUS EYE DAMAGE/IRRITATION: Not availableRESPIRATORY OR SKIN SENSITIZATION: Not establishedGERM CELL MUTAGENICITY: Not availableCARCINOGENICITY: Not availableREPRODUCTIVE TOXICITY: Not availableSTOT-SINGLE EXPOSURE: Not availableSTOT-REPEATED EXPOSURE: Not availableASPIRATION HAZARD: Not availableSECTION 12: ECOLOGICAL INFORMATIONTOXICITY: Product not testedPERSISTENCE AND DEGRADIBILITY: Product not testedBIOACCUMULATIVE POTENTIAL: Product not testedMOBILITY IN SOIL: Product not testedOTHER ADVERSE EFFECTS: Product not testedSECTION 13: DISPOSAL CONSIDERATIONSWASTE DISPOSAL METHOD: Scrap and waste solder should be stored in a dry, sealed container for later disposal. Disposal must be in accordance with Federal, State/Provincial, and Local Regulations.SECTION 14: TRANSPORT INFORMATIONTransport in accordance with applicable regulations and requirements.UN Number: Not availableUN Proper Shipping Name: Not availablePackaging Group:Not applicableEnvironmental Hazards:NoneTRANSPORT HAZARD CLASSES:US DOT Hazardous Material Classification: Tacky Flux is not listed as a DOT hazardous materialWater Transportation: Tacky Flux is not listed as a hazardous materialIATA Hazardous Material Classification: Tacky Flux is not listed as IATA hazardous materialSECTION 15: REGULATORY INFORMATIONAll ingredients used to manufacture this product are listed on the EPA TSCA Inventory.U.S. FEDERAL REGULATIONS: Not regulatedSTATE REGULATIONS: Not regulatedINTERNATIONAL REGULATIONS: Not regulatedSECTION 16: OTHER INFORMATIONHMIS Rating: Health=1 Flammability=1 Physical Hazard=0 Personal Protection=X KEY:N/A: Not applicableGHS: Global Harmonized SystemOSHA: Occupational Safety and Health AdministrationACGIH: American Conference of Governmental Industrial HygienistsNTP: National Toxicology ProgramIARC: International Agency for Research on CancerCAS: Chemical Abstract ServiceNIOSH: National Institute for Occupational Safety & HealthSTOT: Specific target organ toxicityTLV: Threshold limit valueUS DOT: United States Department of TransportationDOT: Department of TransportationIATA: International Air Transport AssociationEPA:Environmental Protection AgencyTSCA:Toxic Substance Control ActHMIS:Hazardous Material Identification SystemPREPARATION INFORMATION:This update supersedes all previously released documents.PREPARED BY: Wendy W. GesickAPPROVED BY: Leigh W. GesickDISCLAIMER:The information contained herein is based on data considered to be accurate but does not purport to be all-inclusive and shall be used only as a guide. No warranty is expressed or implied regarding the accuracy of this data and Inventec Performance Chemicals USA, LLC shall not be held liable for any damage resulting from any handling or contact with the above product. Liability is expressly disclaimed for loss or injury arising out of use of this information or the use of any materials designated. This material is not for resale, unauthorized distribution, or personal use.。

VN920DSPTR-E资料

1/19October 2004VN920DSPHIGH SIDE DRIVERRev. 2Table 1. General Featuress CMOS COMPATIBLE INPUTs ON STATE OPEN LOAD DETECTION s OFF STATE OPEN LOAD DETECTION s SHORTED LOAD PROTECTIONs UNDERVOLTAGE AND OVERVOLTAGESHUTDOWNs PROTECTION AGAINST LOSS OF GROUND s VERY LOW STAND-BY CURRENTs REVERSE BATTERY PROTECTION (*)DESCRIPTIONThe VN920DSP is a monolithic device made by using STMicroelectronics VIPower M0-3Technology, intended for driving any kind of load with one side connected to ground.Active V CC pin voltage clamp protects the device against low energy spikes (see ISO7637 transient compatibility table).Active current limitation combined with thermal shutdown and automatic restart protect the device against overload.The device detects open load condition both is on and off state. Output shorted to V CC is detected in the off state. Device automatically turns off in case of ground pin disconnection.Note:(*) See application schematic at page 9Type R DS(on)I out V CC VN920DSP16 m Ω25 A36 VVN920DSP2/19VN920DSPTable 4. Thermal DataSymbol Parameter Value Unit R thj-case Thermal Resistance Junction-case Max 1.3°C/W R thj-amb Thermal Resistance Junction-ambient Max51.3 (1)37 (2)°C/WNote:(1) When mounted on a standard single-sided FR-4 board with 0.5cm2 of Cu (at least 35µm thick).Note:(2) When mounted on a standard single-sided FR-4 board with 6 cm2 of Cu (at least 35µm thick).3/19VN920DSP4/19ELECTRICAL CHARACTERISTICS(8V<V CC <36V; -40°C <T j <150°C unless otherwise specified)Table 5. PowerTable 6. Switching (V CC =13V)Table 7. Input PinSymbol ParameterTest ConditionsMin Typ Max Unit V CC Operating Supply Voltage 5.51336V V USD Undervoltage Shut-down 34 5.5V V USDhyst Undervoltage Shut-down hysteresis0.5V V OV Overvoltage Shut-down 36V R ONOn State ResistanceI OUT =10A; T j =25°CI OUT =10A I OUT =3A; V CC =6V163050m Ωm Ωm ΩI SSupply CurrentOff State; V CC =13V; V IN =V OUT =0VOff State; V CC =13V; V IN =V OUT =0V; T j =25°COn State; V CC =13V; V IN =5V; I OUT =0A101025205µA µA mA I L(off1)Off State Output Current V IN =V OUT =0V050µA I L(off2) Off State Output Current V IN =0V; V OUT =3.5V-750µA I L(off3) Off State Output Current V IN =V OUT =0V; V CC =13V; T j =125°C 5µA I L(off4)Off State Output CurrentV IN =V OUT =0V; V CC =13V; T j =25°C3µASymbol ParameterTest ConditionsMinTyp MaxUnit t d(on)Turn-on Delay Time R L =1.3Ω 50µs t d(off)Turn-off Delay Time R L =1.3Ω 50µs dV OUT /dt (on)Turn-on Voltage SlopeR L =1.3ΩSee relative diagram V/µsdV OUT /dt (off)Turn-off Voltage Slope R L =1.3Ω See relative diagramV/µsSymbol ParameterTest ConditionsMin TypMax Unit V IL Input Low Level1.25V I IL Low Level Input Current V IN =1.25V 1µA V IH Input High Level3.25V I IH High Level Input Current V IN =3.25V 10µA V I(hyst)Input Hysteresis Voltage 0.5V V ICLInput Clamp VoltageI IN =1mA I IN =-1mA66.8-0.78V V5/19VN920DSPELECTRICAL CHARACTERISTICS (continued)Table 8. VCC - Output DiodeTable 9. Status PinTable 10. Protections (see note 1)Note: 1.To ensure long term reliability under heavy overload or short circuit conditions, protection and related diagnostic signals must beused together with a proper software strategy. If the device operates under abnormal conditions this software must limit the duration and number of activation cycles.Table 11. Openload DetectionSymbol ParameterTest ConditionsMinTypMax Unit V FForward on Voltage-I OUT =5A; T j =150°C0.6VSymbol ParameterTest ConditionsMinTypMax Unit V STAT Status Low Output Voltage I STAT =1.6mA0.5V I LSTAT Status Leakage Current Normal Operation V STAT =5V 10µA C STAT Status Pin Input CapacitanceNormal Operation V STAT =5V 100pF V SCLStatus Clamp VoltageI STAT =1mA I STAT =-1mA66.8-0.78V VSymbol ParameterTest ConditionsMin Typ Max Unit T TSD Shut-down Temperature 150175200°C T R Reset Temperature 135°C T hyst Thermal Hysteresis715°C t SDL Status delay in overload condition T j >T TSD20µs I lim Current limitation 5.5V<V CC <36V30457575A A V demagTurn-off Output Clamp VoltageI OUT =2A; V IN =0V; L=6mHV CC -41V CC -48V CC -55VSymbol ParameterTest ConditionsMinTyp Max Unit I OL Openload ON State Detection Threshold V IN =5V 300500700mA t DOL(on)Openload ON State Detection DelayI OUT =0A 200µsV OL Openload OFF State Voltage Detection ThresholdV IN =0V 1.5 2.5 3.5Vt DOL(off)Openload Detection Delay at Turn Off1000µsVN920DSP6/197/19VN920DSPTable 12. Truth TableTable 13. Electrical Transient Requirements On V CC PinCONDITIONS INPUT OUTPUTSTATUSNormal Operation L H L H H H Current Limitation L H H L X X H(T j < T TSD ) H (T j > T TSD ) LOvertemperature L H L L H L Undervoltage L H L L X X Overvoltage L H L L H H Output Voltage > V OL L H H H L H Output Current < I OLL HL HH LISO T/R 7637/1Test PulseTEST LEVELSI II IIIIV Delays and Impedance 1-25 V -50 V -75 V -100 V2 ms 10 Ω2+25 V +50 V +75 V +100 V 0.2 ms 10 Ω3a -25 V -50 V -100 V -150 V 0.1 µs 50 Ω3b +25 V +50 V +75 V +100 V 0.1 µs 50 Ω4-4 V -5 V -6 V -7 V 100 ms, 0.01 Ω5+26.5 V+46.5 V+66.5 V+86.5 V400 ms, 2 ΩISO T/R 7637/1Test PulseTEST LEVELS RESULTS I II III IV 1C C C C 2C C C C 3a C C C C 3b C C C C 4C C C C 5C E EECLASS CONTENTSC All functions of the device are performed as designed after exposure to disturbance.EOne or more functions of the device is not performed as designed after exposure to disturbance and cannot be returned to proper operation without replacing the device.VN920DSP8/19VN920DSPGND PROTECTION NETWORK AGAINST REVERSE BATTERYSolution 1: Resistor in the ground line (R GND only). This The following is an indication on how to dimension the R GND resistor.1) R GND≤ 600mV / (I S(on)max).2) R GND≥ (−V CC) / (-I GND)where -I GND is the DC reverse ground pin current and can be found in the absolute maximum rating section of the device’s datasheet.Power Dissipation in R GND (when V CC<0: during reverse battery situations) is:P D= (-V CC)2/R GNDThis resistor can be shared amongst several different HSD. Please note that the value of this resistor should be calculated with formula (1) where I S(on)max becomes the sum of the maximum on-state currents of the different devices.Please note that if the microprocessor ground is not common with the device ground then the R GND will produce a shift (I S(on)max * R GND) in the input thresholds and the status output values. This shift will vary depending on many devices are ON in the case of several high side drivers sharing the same R GND.If the calculated power dissipation leads to a large resistor or several devices have to share the same resistor then the ST suggests to utilize Solution 2 (see below).Solution 2: A diode (D GND) in the ground line.A resistor (R GND=1kΩ) should be inserted in parallel to D GND if the device will be driving an inductive load.several different HSD. Also in this case, the presence of the ground network will produce a shift (j600mV) in the input threshold and the status output values if the microprocessor ground is not common with the device ground. This shift will not vary if more than one HSD shares the same diode/resistor network.Series resistor in INPUT line is also required to prevent that, during battery voltage transient, the current exceeds the Absolute Maximum Rating.Safest configuration for unused INPUT pin is to leave it unconnected, while unused SENSE pin has to be connected to Ground pin.LOAD DUMP PROTECTIOND ld is necessary (Voltage Transient Suppressor) if the load dump peak voltage exceeds V CC max DC rating. The same applies if the device will be subject to transients on the V CC line that are greater than the ones shown in the ISO T/R 7637/1 table.µC I/Os PROTECTION:If a ground protection network is used and negative transient are present on the V CC line, the control pins will be pulled negative. ST suggests to insert a resistor (R prot) in line to prevent the µC I/Os pins to latch-up.The value of these resistors is a compromise between the leakage current of µC and the current required by the HSD I/Os (Input levels compatibility) with the latch-up limit of µC I/Os.-V CCpeak/I latchup≤ R prot ≤ (V OHµC-V IH-V GND) / I IHmax Calculation example:For V CCpeak= - 100V and I latchup≥ 20mA; V OHµC≥ 4.5V 5kΩ≤ R prot≤ 65kΩ.Recommended R prot value is 10kΩ.9/19VN920DSP10/1911/1912/19Figure 24. Maximum turn off current versus load inductanceA = Single Pulse at T Jstart=150ºCB= Repetitive pulse at T Jstart=100ºC C= Repetitive Pulse at T Jstart=125ºC Conditions:V CC=13.5V Values are generated with R L=0ΩIn case of repetitive pulses, T jstart (at beginning of each demagnetization) of every pulse must not exceed the temperature specified above forcurves B and C.V IN, I L13/1914/19PowerSO-10™ Thermal DataFigure 25. PowerSO-10™ PC BoardLayout condition of R th and Z th measurements (PCB FR4 area= 58mm x 58mm, PCB thickness=2mm,Cu thickness=35µm, Copper areas: from minimum pad lay-out to 8cm 2).Figure 28. Thermal fitting model of a doublePulse calculation formulaTable 14. Thermal ParameterArea/island (cm2)Footprint6R1 (°C/W)0.02R2 (°C/W)0.1R3( °C/W)0.2R4 (°C/W)0.8R5 (°C/W)12R6 (°C/W)3722C1 (W.s/°C)0.0015C2 (W.s/°C)7.00E-03C3 (W.s/°C)0.015C4 (W.s/°C)0.3C5 (W.s/°C)0.75C6 (W.s/°C)35Z THδR THδZ THtp1δ–()+⋅=whereδt p T⁄=15/1916/19PACKAGE MECHANICALTable 15. PowerSO-10™ Mechanical DataNote:(*) Muar only POA P013PSymbol millimetersMin TypMax A 3.35 3.65A (*) 3.4 3.6A10.000.10B 0.400.60B (*)0.370.53C 0.350.55C (*)0.230.32D 9.409.60D17.407.60E 9.309.50E27.207.60E2 (*)7.307.50E4 5.90 6.10E4 (*) 5.906.30e 1.27F 1.25 1.35F (*) 1.20 1.40H 13.8014.40H (*)13.8514.35h 0.50L 1.20 1.80L (*)0.80 1.10a 0º8ºα (*)2º8º17/19TAPE DIMENSIONSAccording to Electronic Industries Association (EIA) Standard 481 rev. A, Feb. 1986All dimensions are in mm.Tape widthW 24Tape Hole Spacing P0 (± 0.1)4Component Spacing P24Hole Diameter D (± 0.1/-0) 1.5Hole Diameter D1 (min) 1.5Hole PositionF (± 0.05)11.5Compartment Depth K (max) 6.5Hole SpacingP1 (± 0.1)2Top cover tapeEndStartNo componentsNo componentsComponents500mm min500mm minEmpty components pockets saled with cover er direction of feedREVISION HISTORYDate Revision Description of Changes Sep. 20041- First Issue.Oct. 20042- Minor text change.18/19Information furnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsibility for the consequences of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of STMicroelectronics. Specifications mentioned in this publication are subject to change without notice. This publication supersedes and replaces all information previously supplied. STMicroelectronics products are not authorized for use as critical components in life support devices or systems without express written approval of STMicroelectronics.The ST logo is a registered trademark of STMicroelectronics.All other names are the property of their respective owners© 2004 STMicroelectronics - All rights reservedSTMicroelectronics group of companiesAustralia - Belgium - Brazil - Canada - China - Czech Republic - Finland - France - Germany - Hong Kong - India - Israel - Italy - Japan - Malaysia - Malta - Morocco - Singapore - Spain - Sweden - Switzerland - United Kingdom - United States of America19/19。

VN5E010MHTR-E;VN5E010MH-E;中文规格书,Datasheet资料

May 2010Doc ID 15681 Rev 51/34VN5E010MH-ESingle-channel high-side driver with analog current sensefor automotive applicationsFeatures■General–Inrush current active management by power limitation–Very low standby current – 3 V CMOS compatible inputs–Optimized electromagnetic emissions –Very low electromagnetic susceptibility –In compliance with the 2002/95/EC european directive–Very low current sense leakage ■Diagnostic functions–Proportional load current sense–High current sense precision for wide current range–Current sense disable–Output short to ground indication–Overload and short to ground (power limitation) indication–Thermal shutdown indication■Protections–Undervoltage shutdown –Overvoltage clamp –Load current limitation–Self limiting of fast thermal transients–Protection against loss of ground and loss of V CC–Overtemperature shutdown with autorestart (thermal shutdown)–Reverse battery protection with self switch on of the Power MOSFET–Electrostatic discharge protectionApplication■All types of resistive, inductive and capacitive loadsDescriptionThe VN5E010MH-E is a single-channel high-side driver manufactured in the ST proprietaryVIPower M0-5 technology and housed in the tiny HPAK package. The VN5E010MH-E is designed to drive 12 V automotive grounded loadsdelivering protection, diagnostics and easy 3 V and 5 V CMOS compatible interface with any microcontroller.The device integrates advanced protectivefunctions such as load current limitation, inrush and overload active management by power limitation, overtemperature shut-off with auto restart and overvoltage active clamp.A dedicated analog current sense pin isassociated with every output channel in order to provide enhanced diagnostic functions including fast detection of overload and short-circuit to ground through power limitation indication and overtemperature indication.The current sensing and diagnostic feedback of the whole device can be disabled by pulling the CS_DIS pin high to allow sharing of the external sense resistor with other similar devices .Max supply voltage V CC41 VOperating voltage range V CC 4.5 V to 28 V T yp. ON-state resistance R ON 10 m ΩCurrent limitation (typ)I LIMH 85 A OFF-state supply currentI S2 µA (1)1.Typical value with all loads connected.Contents VN5E010MH-EContents1Block diagram and pin configuration . . . . . . . . . . . . . . . . . . . . . . . . . . . 52Electrical specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 72.1Absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 72.2Thermal data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 82.3Electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 92.4Waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 172.5Electrical characteristics curves . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 192.6Application information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 222.7Load dump protection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 222.8MCU I/Os protection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 222.9Current sense and diagnostic . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 232.10Maximum demagnetization energy (V CC=13.5 V) . . . . . . . . . . . . . . . . . 243Package and PC board thermal data . . . . . . . . . . . . . . . . . . . . . . . . . . . 253.1HP AK thermal data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 254Package and packing information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 284.1ECOP ACK® . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 284.2HP AK mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 284.3HP AK suggested land pattern . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 304.4Packing information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31 5Order codes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32 6Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 332/34 Doc ID 15681 Rev 5VN5E010MH-E List of tables List of tablesTable 1.Pin functions. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 Table 2.Suggested connections for unused and not connected pins . . . . . . . . . . . . . . . . . . . . . . . . 6 Table 3.Absolute maximum ratings. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 Table 4.Thermal data. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 Table 5.Power section. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 Table 6.Switching (VCC = 13 V, Tj = 25 °C) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 Table 7.Logic inputs. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 Table 8.Protection and diagnostics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 Table 9.Current sense (8 V < V CC < 18 V). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 Table 10.Truth table. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 Table 11.Electrical transient requirements (part 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 Table 12.Electrical transient requirements (part 2) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 Table 13.Electrical transient requirements (part 3) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 Table 14.Thermal parameter. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27 Table 15.HPAK mechanical data. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29 Table 16.Device summary. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32 Table 17.Document revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33Doc ID 15681 Rev 53/34List of figures VN5E010MH-E List of figuresFigure 1.Block diagram. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 Figure 2.Configuration diagram (top view) not in scale. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 Figure 3.Current and voltage conventions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 Figure 4.Current sense delay characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 Figure 5.Switching characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 Figure 6.Delay response time between rising edge of ouput current and rising edge of current sense (CS enabled). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 Figure 7.Output voltage drop limitation. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 Figure 8.I OUT/I SENSE vs. I OUT . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 Figure 9.Maximum current sense ratio drift vs. load current(1). . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 Figure 10.Normal operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 Figure 11.Overload or short to GND. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 Figure 12.Intermittent overload. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 Figure 13.T J evolution in overload or short to GND . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 Figure 14.OFF-state output current . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19 Figure 15.High-level input current. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19 Figure 16.Input clamp voltage. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19 Figure 17.Low-level input voltage. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19 Figure 18.High-level input voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19 Figure 19.Input hysteresis voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19 Figure 20.ON-state resistance vs. T case. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 Figure 21.ON-state resistance vs. V CC. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 Figure 22.Undervoltage shutdown . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 Figure 23.Turn-on voltage slope. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 Figure 24.ILIMH vs. Tcase . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 Figure 25.Turn-off voltage slope. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 Figure 26.High-level CS_DIS voltage. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21 Figure 27.CS_DIS clamp voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21 Figure 28.Low-level CS_DIS voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21 Figure 29.Application schematic. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22 Figure 30.Current sense and diagnostic. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23 Figure 31.Maximum turn-off current versus inductance(1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24 Figure 32.PC board(1). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25 Figure 33.Rthj-amb vs. PCB copper area in open box free air condition . . . . . . . . . . . . . . . . . . . . . . 25 Figure 34.HPAK thermal impedance junction ambient single pulse. . . . . . . . . . . . . . . . . . . . . . . . . . 26 Figure 35.Thermal fitting model of a single-channel HSD in HPAK(1) . . . . . . . . . . . . . . . . . . . . . . . . 26 Figure 36.HPAK package dimension . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28 Figure 37.HPAK suggested pad layout(1). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30 Figure 38.HPAK tube shipment (no suffix) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31 Figure 39.HPAK tape and reel (suffix “TR”) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31 4/34 Doc ID 15681 Rev 5VN5E010MH-E Block diagram and pin configurationDoc ID 15681 Rev 55/341 Block diagram and pin configurationFigure 1.Block diagramTable 1.Pin functionsName FunctionV CC Battery connection OUT Power output (1)1.Pins 1 and 7 must be externally tied together.GND Ground connectionIN Voltage controlled input pin with hysteresis, CMOS compatible. Controls output switch stateCSAnalog current sense pin, delivers a current proportional to the load current CS_DISActive high CMOS compatible pin, to disable the current sense pinBlock diagram and pin configurationVN5E010MH-E6/34 Doc ID 15681 Rev 5Figure 2.Configuration diagram (top view) not in scaleTable 2.Suggested connections for unused and not connected pinsConnection / pinCS OUT IN CS_DIS Floating Not allowed X X X T o groundThrough 1k Ω resistorThrough 22 k ΩresistorThrough 10 k ΩresistorThrough 10 k ΩresistorIN Vcc CS CS_DIS 1234567GND OUT OUTVN5E010MH-E Electrical specificationsDoc ID 15681 Rev 57/342 Electrical specificationsFigure 3.Current and voltage conventions2.1 Absolute maximum ratingsStressing the device above the rating listed in the Table 3: Absolute maximum ratings may cause permanent damage to the device. These are stress ratings only and operation of the device at these or any other conditions above those indicated in the operating sections of this specification is not implied. Exposure to absolute maximum rating conditions forextended periods may affect device reliability. Refer also to the STMicroelectronics SURE program and other relevant quality document.I SI GNDV CCV CCOUTINV INV SENSEGNDCS_DISI CSDV CSDI IN CSV OUTI OUTI SENSETable 3.Absolute maximum ratingsSymbol ParameterValue Unit V CC DC supply voltage 41V -V CC Reverse DC supply voltage 16V I OUT DC output currentInternally limitedA -I OUT Reverse DC output current 20A I IN DC input current-1 to 10mA I CSDDC current sense disable input current-1 to 10mA V CSENSE Current sense maximum voltage (V CC > 0)V CC - 41+V CC V V E MAXMaximum switching energy (single pulse)(L = 2.2 mH; R L = 0 Ω; V BA T = 13.5 V; T jstart = 150 °C;I OUT = I limL (T yp.))645mJElectrical specificationsVN5E010MH-E8/34 Doc ID 15681 Rev 52.2 Thermal dataV ESDElectrostatic discharge(human body model: R= 1.5 K Ω; C= 100 pF)–IN –CS–CS_DIS –OUT –V CC40002000400050005000V V V V V V ESD Charge device model (CDM-AEC-Q100-011)750V T j Junction operating temperature -40 to 150°C T stgStorage temperature-55 to 150°CTable 3.Absolute maximum ratings (continued)SymbolParameterValueUnitTable 4.Thermal dataSymbol ParameterMax. valueUnit R thj-case Thermal resistance junction-case0.55°C/W R thj-ambThermal resistance junction-ambient 67.7°C/WVN5E010MH-E Electrical specificationsDoc ID 15681 Rev 59/342.3 Electrical characteristicsValues specified in this section are for 8 V < V CC < 28 V, -40 °C < T j < 150 °C, unlessotherwise specified.Table 5.Power sectionSymbol ParameterTest conditionsMin.Typ.Max.Unit V CC Operating supply voltage 4.51328V V USD Undervoltage shutdown 3.5 4.5V V USDhystUndervoltage shutdown hysteresis0.5VR ONON-state resistanceI OUT = 6 A; T j = 25 °C10m ΩI OUT = 6 A; T j = 150 °C20I OUT = 6 A; V CC = 5 V; T j = 25 °C13R ON-Rev R DSON in reverse battery condition V CC = -13 V; I OUT = -6 A;T j = 25 °C 10m ΩV clampClamp voltageI CC = 20 mA; I OUT = 0 A414652V I SSupply currentOFF-state: V CC = 13 V; T j = 25 °C;V IN = V OUT = V SENSE = 0 V 2 5 µA ON-state: V CC = 13 V; V IN = 5 V; I OUT = 0 A1.53mA I L(off)OFF-state output currentV IN = V OUT = 0 V; V CC = 13 V;T j = 25 °C00.013µAV IN = V OUT = 0 V; V CC = 13 V;T j = 125 °C5Table 6.Switching (V CC = 13 V, T j = 25 °C)Symbol Parameter Test conditions Min.Typ.Max.Unit t d(on)Turn-on delay time R L = 2.2 Ω(see Figure 5)-40-µs t d(off)Turn-off delay time R L = 2.2 Ω(see Figure 5)-28-µs (dV OUT /dt)on Turn-on voltage slopeR L = 2.2 Ω -(see Figure 23)-V /µs (dV OUT /dt)offTurn-off voltage slopeR L = 2.2 Ω -(see Figure 25)-V /µsW ONSwitching energy losses at turn-on (t won )R L = 2.2 Ω(see Figure 5)-2-mJW OFFSwitching energy losses at turn-off (t woff )R L = 2.2 Ω(see Figure 5)-0.6-mJElectrical specificationsVN5E010MH-E10/34 Doc ID 15681 Rev 5Table 7.Logic inputsSymbol ParameterTest conditionsMin.Typ.Max.Unit V IL Low-level input voltage 0.9V I IL Low-level input current V IN = 0.9 V1µA V IH High-level input voltage 2.1V I IH High-level input current V IN = 2.1 V10µA V I(hyst)Input hysteresis voltage 0.25V V ICL Input clamp voltage I IN = 1 mA 5.57V I IN = -1 mA -0.7V CSDL Low-level CS_DIS voltage 0.9V I CSDL Low-level CS_DIS current V CSD = 0.9 V1µA V CSDH High-level CS_DIS voltage 2.1V I CSDHHigh-level CS_DIS currentV CSD = 2.1 V10µA V CSD(hyst)CS_DIS hysteresis voltage 0.25V V CSCLCS_DIS clamp voltageI CSD = 1 mA 5.57VI CSD = -1 mA-0.7Table 8.Protection and diagnostics (1)1.To ensure long term reliability under heavy overload or short-circuit conditions, protection and relateddiagnostic signals must be used together with a proper software strategy. If the device is subjected to abnormal conditions, this software must limit the duration and number of activation cycles.Symbol Parameter Test conditions Min.Typ.Max.Unit I limH Short-circuit currentV CC = 13 V 6085120A 5 V < V CC < 28 V120I limL Short-circuit currentduring thermal cycling V CC = 13 V; T R < T j < T TSD21A T TSD Shutdown temperature 150175200°C T R Reset temperature T RS + 1T RS + 5°C T RS Thermal reset of status135°C T HYST Thermal hysteresis (T TSD -T R )7°C V DEMAG Turn-off output voltage clamp I OUT = 2 A; V IN = 0;L = 6 mH V CC - 41V CC - 46V CC - 52V V ONOutput voltage drop limitationI OUT = 0.5 A;T j = -40 °C to 150 °C25mV分销商库存信息:STMVN5E010MHTR-E VN5E010MH-E。

Schneider Electric 变速机配件 VW3A9207 的产品数据表说明书

A9206
a
9.45
b
2.36
A9207 240 51.5
A9207 9.45 2.03
A9208 320 136
A9208 12.60 5.35
2
Offer Sustainability
California proposition 65 EU RoHS Directive Toxic heavy metal free Mercury free RoHS exemption information China RoHS Regulation
Contractual warranty
Pro-active compliance (Product out of EU RoHS legal scope) ration
Yes
Yes
EU RoHS Dclaration
18 months
1
The information provided in this documentation contains general descriptions and/or technical characteristics of the performance of the products contained herein. This documentation is not intended as a substitute for and is not to be used for determining suitability or reliability of these products for specific user applications. It is the duty of any such user or integrator to perform the appropriate and complete risk analysis, evaluation and testing of the products with respect to the relevant specific application or use thereof. Neither Schneider Electric Industries SAS nor any of its affiliates or subsidiaries shall be responsible or liable for misuse of the information contained herein.

维萨拉HUMICAP温湿度变送器HMT331墙面安装型说明书

2016年3月起执行HMT331 温湿度变送器墙面安装型1234567891011121314151617181920212223维萨拉HUMICAP® 温湿度变送器HMT33010A1价格变送器类型HMT3311墙面安装型探头固定式A带一根短的探头电缆8无附加温度探头0测量参数RH+T ARH+T+Td+Tdf+a+x+Tw+ppm+pw+pws+h+dT B显示无0背光LCD图形显示1供电10...35 VDC, 24 VAC010...35 VDC, 24 VAC 带电源隔离 1普通AC供电 (100....240 VAC)2普通AC供电 (100....240 VAC)，美国标准3普通AC供电 (100....240 VAC)，欧洲标准4普通AC供电 (100....240 VAC)，英国标准5普通AC供电(100....240 VAC) + 澳大利亚标准6外接美国适用的AC适配器（用于美国和加拿大的LAN/WLAN界面）非IP659输出信号模拟输出通道（通道1，2 和3） 4... 20 mA1模拟输出通道（通道1，2 和3） 0... 20 mA2模拟输出通道（通道1，2 和3） 0... 1 V3模拟输出通道（通道1，2 和3） 0... 5 V4模拟输出通道（通道1，2 和3） 0... 10 V5*RS232串口界面或选择其它通讯模块模拟输出范围无第3模拟输出A通道1，2和3RH (0…100%RH)B B B(根据不同参数）T(温度范围见下表)C C CTd (-20…100ºC)D D DTdf (-20…100ºC) E E Ea (0…600g/m³) F F FTw (0…100ºC)G G Gx (0…500g/kg d.a)H H Hh （-40…1500kJ/kg)J J Jppm (0…5000)K K Kpw (0…100hPa)L L Lpws (0…100hPa)M M MdT (-10…+50ºC)N N N自定义自定参数/单位 Ch1:_____(___) Ch2:____(___) 选择 Ch3:_____(___)X X X自定量程 Ch1:_________ Ch2:_________ 选择 Ch3:___________通道1通道2通道3，如不需要，选择A模拟输出无温度输出A温度范围-40...+60°C B-20...+60°C F如果没有温度0...+60°C K输出，请选择A自定义:_______________________X单位公制1非公制2模块插槽1选项无0继电器输出1RS-485数字串口，带隔离2LAN(以太网）接口＋2米电缆（RJ45）请注意下面的*)中解释4WLAN(无线以太网)接口和天线只适用于短电缆探头型5数据记录模块6模块插槽2选项无0继电器输出1第3模拟输出选择第3通道模拟输出3数据记录模块如果模块插槽1已选数据记录模块，这无法在插槽2再选。

ProSafe 无线N 8端口Gigabit VPN 火墙数据表说明书

Connects to powerConnects toservers with PCI Ethernet Adapter (GA311)Connects to cable/DSL modemConnects to desktop PCs withPCI Ethernet Adapter (GA511)ProSafe 8-portGigabit VPNFirewall (FVS318N)BroadbandSite to Site VPNConnectivity through350 E. Plumeria DriveSan Jose, CA 95134-19111-888-NETGEAR (638-4327) E-mail: info@ © 2011 NETGEAR, Inc., NETGEAR, the NETGEAR Logo, and Connect with Innovation are trademarks and/or registered trademarks of NETGEAR, Inc. and/or subsidiaries in the United States and/or other countries. Mac and the Mac logo are trademarks of Apple Inc., registered in the U.S. and other countries. Other brand names mentioned herein are for identiﬁcation purposes only and may be trademarks of their respective holder(s). Information is subject to change without notice. All rights reserved.This product comes with a limited warranty, the acceptance of which is a condition of sale.*Basic technical support provided for 90 days from date of purchase.D-FVS318N-0System Requirements–Cable, DSL or wireless broadbandmodem and–Internet service–Ethernet connectivity from broadbandmodem–Network card for each connected PC–Network software (e.g. Windows)–Internet Explorer® 5.0 or higher orNetscape–Navigator 4.7 or higher or Firefox® 2.0or higherTechnical Speciﬁ cations• Pro to co l Suppo rt–Network: IP routing, TCP/IP, UDP, ICMP,PPPoE–IPV4/IPV6 support–IP addressing: DHCP (client and server)–Routing: RIP v1, RIPv2 (static routing,dynamic routing)–VPN/security: IPsec (ESP), IKE, PKI, HTTPS• Applicatio n Suppo rt–IPsec pass-through, H.323, InstantMessenger™, RealPlayer®, QuickTime®,DialPad, SIP proxy, two-factorauthentication• Functio ns–VPN Wizard to simplify conﬁ guration ofIPsec VPNs–Auto Detect to automatically detect ISPaddress type (static, dynamic, PPPoE)–Port range forwarding–Port triggering–Enable/disable WAN ping–DNS proxy–MAC address cloning/spooﬁ ng–Network Time Protocol NTP support–Diagnostic tools (ping, DNS lookup, trace route, other)–Port/service • Functio ns (co ntinued)–Auto-Uplink on switch ports–L3 Quality of Service (QoS) LAN-to-WANand WAN-to-LAN (ToS)–b/g/n Wireless Interface 2.4Ghz–SIP ALG–GUI-selectable DMZ port• Maintenance–Save/restore conﬁ guration, restoredefaults, upgrades via Web browser,display statistics• Firewall–Stateful packet inspection (SPI), DoSattack detection/logging, dropped packetlog, security event log, email log–95 Mbps LAN-WAN Throughput–6000 Concurrent Connections• VPN–Box-to-box, client-to-box, authentication(MD5, SHA-1), Manual Key, sharedsecret, key management (IKE, Difﬁ e-Hellman, manual), X.509 certiﬁ catesupport, DES, 3DES and AES IPsecencryption• Po wer Adapter–Plug is localized to country of sale inNorth America, Australia, Europe, UnitedKingdom, Japan• Physical Speciﬁ cations–Dimensions (w x d x h): 190 x 125 x 35mm (7.5 X 4.9 X 1.4 in)–Weight: 0.59 kg (1.3 lb)• Hardware–300 MHz 32-bit RISC CPU–32 MB Flash, 128MB DRAM• Interface Speciﬁ cations–LAN: 10/100/1000 Mbps–WAN: 10/100/1000 Mbps–Wireless b/g/n 2.4GhzWarranty–Firewall: NETGEAR Lifetime Warranty–Power supply: NETGEAR 3-yearWarrantyPackage Contents–ProSafe Wireless-N 8-port Gigabit VPNFirewall (FVS318N)–Ethernet cable–Power adapter–Install guide–Resource CDProSupport Maintenance Services–Optional support packages are available:–OnCall 24x7 advanced technical support–XPressHW next business day hardwarereplacement–For more information:NETGEAR Related Products• So ftware–ProSafe VPN Client (Trial Version)–VPNG01L ProSafe VPN ClientProfessional Software single-user license–VPNG05L ProSafe VPN ClientProfessional Software 5-user licenseOrdering Information–North America: FVS318N-100NAS–Europe: FVS318N-100EUS–Asia: FVS318N-100AUS。

PDV-P9203;中文规格书,Datasheet资料

CdS Photoconductive Photocells PDV-P9203
FEATURES
• Visible light response • Sintered construction • Low cost
DESCRIPTION
APPLICATIONS
The PDV-P9203 are (CdS), Photoconductive • Camera exposure photocells designed to sense light from 400 to 700 • Shutter controls nm. These light dependent resistors are available in • Night light Controls a wide range of resistance values. They’re packaged in a two leaded plastic-coated ceramic header. CELL RESISTANCE VS. ILLUMINANCE
* 0.200 inch from base for 3 seቤተ መጻሕፍቲ ባይዱonds with heat sink.
ELECTRO-OPTICAL CHARACTERISTICS RATING (TA)= 23°C UNLESS OTHERWISE NOTED
SYMBOL RD RI S lrange lpeak tr Tf CHARACTERISTIC Dark Resistance Illuminated Resistance TEST CONDITIONS MIN 5 10 0.9 400 570 60 25 700 TYP MAX 30 UNITS MW KW W/Lux nm nm ms ms After 10 sec. @ 10 Lux @ 2856 °K 10 Lux @ 2856 °K LOG(R100)-LOG(R10)** Sensitivity LOG(E100)-LOG(E10)*** Spectral Application Range Flooded Spectral Application Range Flooded Rise Time 10 Lux @ 2856 °K Fall Time After 10 Lux @ 2856 °K

2.9inch e-Paper Module 用户手册说明书

2.9inch e-Paper Module用户手册产品概述●本品是2.9英寸电子墨水屏模块，分辨率为296x128，带有内部控制器，使用SPI接口通信，支持局部刷新。

●具有耗低、视角宽、阳光直射下仍可清晰显示等优点，常用于货架标签、工业仪表等显示应用。

●本模块基于SPI通信协议来对墨水屏进行操作，通过相应函数，就可以完成显示功能，包括几何图形绘制、文字、图片显示，同时本模块支持局部刷新，本产品提供树莓派（基于BCM2835，Wringpi和python），SMT32以及Arduino例程，方便客户进行移植。

规格●工作电压：3.3V●通信接口：3-wire SPI、4-wire SPI●外形尺寸：89.5mm ×38mm●显示尺寸：66.89mm ×29.05mm●点距：0.138 ×0.138●分辨率：296 ×128●显示颜色：黑、白●灰度等级：2●刷新功耗：26.4mW(typ.)●待机功耗：<0.017mW●可视角度：>170°接口说明12工作原理器件介绍本产品使用的电子纸采用“微胶囊电泳显示”技术进行图像显示，其基本原理是悬浮在液体中的带电纳米粒子受到电场作用而产生迁移。

电子纸显示屏是靠反射环境光来显示图案的，不需要背光，即使是在阳光底下，电子纸显示屏依然清晰可视，可视角度几乎达到了180°。

因此，电子纸显示屏非常适合阅读。

通信协议注：与传统的SPI协议不同的地方是：由于是只需要显示，故而将从机发往主机的数据线进行了隐藏。

CS为从机片选，仅当CS为低电平时，芯片才会被使能。

DC为芯片的数据/命令控制引脚，当DC = 0时写命令，当DC = 1时写数据。

SCLK为SPI通信时钟。

SDIN为SPI通信主机发往从机数据。

对于SPI通信而言，数据是有传输时序的，即时钟相位（CPHA）与时钟极性(CPOL)的组合：31)CPOL的高低决定串行同步时钟的空闲状态电平，CPOL = 0，为低电平。

VN920-B5;VN920;VN920-B513TR;VN920(012Y);VN920SO13TR;中文规格书,Datasheet资料

December 2008Rev 51/34VN920Single channel high-side solid-state relayFeatures■CMOS compatible input ■Proportional load current sense ■Shorted load protection■Under-voltage and over-voltage shutdown ■Over-voltage clamp ■Thermal shutdown ■Current limitation■Protection against loss of ground and loss of V CC■Very low standby power dissipation ■Reverse battery protected (see Application schematic )DescriptionThe VN920 is a monolithic device designed in STMicroelectronics VIPower M0-3 technology. The VN920 is intended for driving any type of load with one side connected to ground. The active V CC pin voltage clamp protects the device against low energy spikes (see ISO7637 transient compatibility table). Active current limitationcombined with thermal shutdown and automatic restart protects the device against over-load. The device integrates an analog current sense output which delivers a current proportional to the load current. The device automatically turns off in the case where the ground pin becomes disconnected.Type R DS(on)I OUT V CC VN920VN920-B5VN920SO16 m Ω30 A36 VP 2PAKTable 1.Device summary PackageOrder codesTubeTape and reelPENTAWATT VN920-P 2PAK VN920-B5VN920-B513TR SO-16LVN920SOVN920SO13TRContents VN920Contents1Block diagram and pin description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 52Electrical specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 62.1Absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 62.2Thermal data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 72.3Electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 82.4Electrical characteristics curves . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 143Application information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 163.1GND protection network against reverse battery . . . . . . . . . . . . . . . . . . . 163.1.1Solution 1: resistor in the ground line (RGND only) . . . . . . . . . . . . . . . . 163.1.2Solution 2: diode (DGND) in the ground line . . . . . . . . . . . . . . . . . . . . . 173.2Load dump protection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 173.3MCU I/Os protection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 173.4P2P AK maximum demagnetization energy (VCC = 13.5V) . . . . . . . . . . . 183.5SO-16L maximum demagnetization energy (VCC = 13.5V) . . . . . . . . . . . 194Package and PCB thermal data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 204.1SO-16L thermal data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 204.2P2P AK thermal data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 225Package and packing information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 255.1ECOP ACK® packages . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 255.2PENTAWATT mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 265.3P2P AK mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 285.4SO-16L packing information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 305.5PENTAWATT packing information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 315.6P2P AK packing information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31 6Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 332/34VN920List of tables List of tablesTable 1.Device summary. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Table 2.Suggested connections for unused and not connected pins . . . . . . . . . . . . . . . . . . . . . . . . 5 Table 3.Absolute maximum ratings. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 Table 4.Thermal data. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 Table 5.Power . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 Table 6.Switching (V CC=13V) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 Table 7.Logic inputs. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 Table 8.Current sense (9V ≤ VCC ≤ 16V) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 Table 9.V CC output diode. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 Table 10.Protections . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 Table 11.Truth table. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 Table 12.Electrical transient requirements . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 Table 13.SO-16L thermal parameters. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22 Table 14.P2PAK thermal parameter . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24 Table 15.SO-16L mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25 Table 16.PENTAWATT mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27 Table 17.P2PAK mechanical data. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29 Table 18.Document revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 333/34List of figures VN920 List of figuresFigure 1.Block diagram. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 Figure 2.Configuration diagram (top view) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 Figure 3.Current and voltage conventions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 Figure 4.Switching characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 Figure 5.I OUT/I SENSE versus I OUT. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 Figure 6.Waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 Figure 7.Off-state output current. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 Figure 8.High-level input current. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 Figure 9.Input clamp voltage. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 Figure 10.Turn-on voltage slope. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 Figure 11.Over-voltage shutdown. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 Figure 12.Turn-off voltage slope. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 Figure 13.ILIM vs Tcase. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 Figure 14.On-state resistance vs VCC. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 Figure 15.Input high-level. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 Figure 16.Input hysteresis voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 Figure 17.On-state resistance vs Tcase. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 Figure 18.Input low level. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 Figure 19.Application schematic. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 Figure 20.P2PAK maximum turn-off current versus inductance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 Figure 21.SO-16L maximum turn-off current versus inductance . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19 Figure 22.SO-16L PC board. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 Figure 23.SO-16L Rthj-amb Vs PCB copper area in open box free air condition . . . . . . . . . . . . . . . 20 Figure 24.SO-16L thermal impedance junction ambient single pulse . . . . . . . . . . . . . . . . . . . . . . . . 21 Figure 25.Thermal fitting model of a single channel HSD in SO-16L . . . . . . . . . . . . . . . . . . . . . . . . . 21 Figure 26.P2PAK PC board . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22 Figure 27.P2PAK Rthj-amb Vs. PCB copper area in open box free air condition . . . . . . . . . . . . . . . 23 Figure 28.P2PAK thermal impedance junction ambient single pulse . . . . . . . . . . . . . . . . . . . . . . . . . 23 Figure 29.Thermal fitting model of a single channel HSD in P2PAK. . . . . . . . . . . . . . . . . . . . . . . . . . 24 Figure 30.SO-16L package dimensions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25 Figure 31.PENTAWATT package dimensions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26 Figure 32.P2PAK package dimensions. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28 Figure 33.SO-16L tube shipment (no suffix). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30 Figure 34.SO-16L tape and reel shipment (suffix “TR”) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30 Figure 35.PENTAWATT tube shipment (no suffix). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31 Figure 36.P2PAK tube shipment (no suffix) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31 Figure 37.P2PAK tape and reel (suffix “13TR”). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32 4/34VN920Block diagram and pin description5/341 Block diagram and pin descriptionFigure 2.Configuration diagram (top view)Table 2.Suggested connections for unused and not connected pinsConnection / pinCurrent SenseN.C.Output Input Floating XXX To groundThrough 1K Ω resistorXThrough 10K ΩresistorOUTPUT C.SENSE V CC INPUT GND54321P2PAK/ PENTAWATTV CC OUTPUT OUTPUT OUTPUT OUTPUT V CCOUTPUT OUTPUT V CCN.C.N.C.C.SENSE INPUT V CC GND N.C.18916SO-16L6/342 Electrical specificationsFigure 3.Current and voltage conventions2.1 Absolute maximum ratingsStressing the device above the rating listed in the “Absolute maximum ratings” table maycause permanent damage to the device. These are stress ratings only and operation of the device at these or any other conditions above those indicated in the operating sections of this specification is not implied. Exposure to Absolute maximum rating conditions for extended periods may affect device reliability. Refer also to the STMicroelectronics sure program and other relevant quality document.I SI GNDV CCV CCV SENSEOUTPUTI OUTCURRENT SENSEI SENSEINPUTI INV INV OUTGNDV FTable 3.Absolute maximum ratingsSymbol ParameterValueUnitSO-16LPENTAWATTP 2PAKV CC DC supply voltage 41V - V CC Reverse DC supply voltage - 0.3V - I gnd DC reverse ground pin current - 200mA I OUT DC output currentInternally limitedA - I OUT Reverse DC output current - 21A I INDC input current+/- 10mA V CSENSE Current sense maximum voltage- 3+ 15V VV ESDElectrostatic discharge(human body model: R = 1.5K Ω; C = 100pF)INPUTCURRENT SENSE OUTPUT V CC4000200050005000V V V V7/342.2 Thermal dataSymbolParameterValueUnitSO-16LPENTAWATTP 2PAKE MAXMaximum switching energy (L = 0.25mH; R L = 0Ω;V bat = 13.5V; T jstart = 150ºC; I L = 45A)352364mJP tot Power dissipation T C ≤ 25°C 8.396.196.1W T j Junction operating temperature Internally limited °C T c Case operating temperature - 40 to 150°C T stgStorage temperature- 55 to 150°CTable 3.Absolute maximum ratings (continued)Table 4.Thermal dataSymbolParameterMax. valueUnitSO-16LPENTAWATTP 2PAK R thj-case Thermalresistance junction-case - 1.3 1.3°C/W R thj-lead Thermalresistance junction-lead 15-°C/W R thj-ambThermalresistance junction-ambient65(1)1.When mounted on a standard single-sided FR-4 board with 0.5cm 2 of Cu (at least 35µm thick) connected to all V CC pins.61.351.3(2)2.When mounted on a standard single-sided FR-4 board with 0.5cm 2 of Cu (at least 35µm thick).°C/W 48(3)3.When mounted on a standard single-sided FR-4 board with 6cm 2 of Cu (at least 35µm thick) connected to all V CC pins.37(4)4.When mounted on a standard single-sided FR-4 board with 6cm 2 of Cu (at least 35µm thick).°C/W8/342.3 Electrical characteristicsValues specified in this section are for 8V < V CC < 36V; -40°C < T j < 150°C, unless otherwisestated.Note:V CLAMP and V OV are correlated. Typical difference is 5V .Table 5.PowerSymbol ParameterTest conditionsMin.Typ.Max.Unit V CC Operating supply voltage 5.51336V V USD Under-voltage shutdown 345.5V V OV Over-voltage shutdown 36V R ONOn-state resistanceI OUT = 10A; T j = 25°C; I OUT = 10A;I OUT = 3A; V CC = 6V 163255m Ωm Ωm ΩV CLAMP Clamp voltageI CC = 20mA414855V I SSupply currentOff-state; V CC = 13V; V IN = V OUT = 0VOff-state; V CC = 13V;V IN = V OUT = 0V; T j = 25°C On-state; V CC = 13V; V IN = 5V;I OUT = 0A; R SENSE = 3.9 k Ω101025205µAµAmA I L(off1)Off-state output current V IN = V OUT = 0V 050µA I L(off2)Off-state output current V IN = 0V; V OUT = 3.5V -750µA I L(off3) Off-state output current V IN = V OUT = 0V; V CC = 13V;T j = 125°C5µA I L(off4)Off-state output currentV IN = V OUT = 0V; V CC = 13V; T j = 25°C3µATable 6.Switching (V CC =13V)Symbol Parameter Test conditionsMin.Typ.Max.Unitt d(on)Turn-on delay time R L = 1.3Ω (see Figure 4.)50µs t d(off)Turn-off delay timeR L = 1.3Ω (see Figure 4.)50µs dV OUT /dt (on)Turn-on voltage slope R L = 1.3Ω (see Figure 4.)See Figure 10.V/µs dV OUT /dt (off)Turn-off voltage slope R L = 1.3Ω (see Figure 4.)See Figure 12.V/µsTable 7.Logic inputsSymbol Parameter Test conditions Min.Typ.Max.Unit V IL Input low level voltage 1.25VI IL Low level input current V IN = 1.25V1µAV IH Input high-level voltage 3.25VI IH High-level input current V IN = 3.25V10µA V I(hyst)Input hysteresis voltage0.5VV ICL Input clamp voltageI IN = 1mAI IN = - 1mA6 6.8- 0.78VVTable 8.Current sense (9V ≤ V CC ≤16V)Symbol Parameter Test conditions Min.Typ.Max.UnitK1I OUT/I SENSE I OUT = 1A; V SENSE = 0.5V;T j = -40°C...150°C330044006000dK1/K1Current senseratio driftI OUT = 1A; V SENSE = 0.5V;T j= - 40°C...150°C-10+10%K2I OUT/I SENSE I OUT = 10A; V SENSE = 4V;T j = - 40°CT j= 25°C...150°C420044004900490060005750dK2/K2Current senseratio driftI OUT = 10A; V SENSE = 4V;T j = -40°C...150°C-8+8%K3I OUT/I SENSE I OUT = 30A; V SENSE = 4V;T j = -40°CT j = 25°C...150°C420044004900490055005250dK3/K3Current senseratio driftI OUT = 30A; V SENSE = 4V;T j = -40°C...150°C-6+6%I SENSE0Analog sensecurrentV CC = 6...16V; I OUT = 0A;V SENSE = 0V;T j = -40°C...150°C010µAV SENSE Max analogsense outputvoltageV CC = 5.5V; I OUT = 5A;R SENSE = 10kΩV CC > 8V, I OUT = 10A;R SENSE = 10kΩ24VVV SENSEH Sense voltage inover-temperatureconditionV CC = 13V; R SENSE = 3.9kΩ 5.5V9/3410/34R VSENSEH Analog sense outputimpedance inover-temperature condition V CC = 13V; T j > T TSD ;output open400Ωt DSENSECurrent sense delay responseT o 90% I SENSE (1) 500µs1.Current sense signal delay after positive input slope.Table 9.V CC output diodeSymbol Parameter Test conditions Min.Typ.Max.Unit V FForward on voltage- I OUT = 5A; T j = 150°C0.6VTable 10.Protections (1)1.To ensure long term reliability under heavy over-load or short circuit conditions, protection and relateddiagnostic signals must be used together with a proper software strategy. If the device operates under abnormal conditions this software must limit the duration and number of activation cycles.Symbol ParameterTest conditionsMin.Typ.Max.Unit T TSD Shutdown temperature 150175200°C T R Reset temperature 135°C T hyst Thermal hysteresis 715°C I limCurrent limitation V CC = 13V 5V < V CC < 36V 30457575A A V demag T urn-off output clamp voltageI OUT = 2 A; V IN = 0V;L = 6mH V CC - 41V CC - 48V CC - 55VV ONOutput voltage drop limitationI OUT = 1 A; T j = -40°C...150°C 50mVTable 8.Current sense (9V ≤ V CC ≤ 16V) (continued)SymbolParameterTest conditionsMin.Typ.Max.Unit分销商库存信息:STMVN920-B5VN920VN920-B513TR VN920(012Y)VN920SO13TR VN920SO。

VN808SR13TR;VN808SR;中文规格书,Datasheet资料

August 2009Doc ID 11624 Rev 51/17VN808SROctal channel high side driverFeatures■V CC /2 compatible input■Junction overtemperature protection ■Case overtemperature protection for thermal independence of the channels ■Current limitation ■Shorted load protection ■Undervoltage shut-down ■Protection against loss of ground ■Very low stand-by current■Compliance to 61000-4-4 IEC test up to 4 kVDescriptionThe VN808SR is a monolithic device designed in STMicroelectronics VIPower M0-3 technology, intended for driving any kind of load with one side connected to ground.Active current limitation combined with thermalshutdown and automatic restart, protect the device against overload. In overload condition, the channel turns OFF and back ONautomatically so as to maintain the junction temperature between T TSD and T R . If this condition makes the case temperature reach T CSD , the overloaded channel is turned OFF and restarts only when the case temperature has decreased to T CR (see waveform 3 Figure 7 on page 10). Non overloaded channels continue to operate normally. The device automatically turns OFF in the case of a ground pin disconnection. This device is especially suitable for industrial applications and conforms to IEC 61131.Type R DS(on)I out V CC VN808SR150 m Ω0.7 A45 VPowerSO-36du c t(s ) - O bs o l e t eP ro d u ct(s )Contents VN808SR2/17Doc ID 11624 Rev 5Contents1Maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32Electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 43Pin connections . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 64Current, voltage conventions and internal diagram . . . . . . . . . . . . . . . 85Switching time waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 96Reverse polarity protection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 127Package mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 138Order codes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 159Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16O b s o l et e Pr o du c t(s ) - O bs o l e t eP ro d u ct(s )VN808SR Maximum ratingsDoc ID 11624 Rev 53/171 Maximum ratingsTable 1.Absolute maximum ratingSymbol ParameterValue Unit V CC DC supply voltage45V -I GND DC ground pin reverse currentTRAN ground pin reverse current (pulse duration < 1 ms) -250-6mA AI OUT DC output current Internally limitedA -I OUT Reverse DC output current -2AI IN DC Input current ± 10mA V IN Input voltage range-3/+V CCV V ESD Electrostatic discharge (R = 1.5 k Ω; C = 100 pF) 2000VP TOT Power dissipation at T c = 25 °C96W L MAX Max inductive load (V CC = 24 V , R LOAD = 48 Ω, T A = 100 °C)2H T J Junction operating temperature Internally limited °C T C Case operating temperature Internally limited °C T STGStorage temperature-40 to 150°CTable 2.Thermal dataSymbolParameterValue Unit R thJCThermal resistance junction-case Max 1.3°C/W R thJAThermal resistance junction-ambient (1)1.When mounted on FR4 printed circuit board with 0.5 cm 2 of copper area (at least 35 µm think) connected toall TAB pins.Max50°C/WO b s o l et e Pr o du c t(s )- O bs o l et eP ro d u ct(s )Electrical characteristics VN808SR4/17Doc ID 11624 Rev 52 Electrical characteristics(10.5 V < V CC < 32 V; -40 °C < T J < 125 °C ; unless otherwise specified)Table 3.Power sectionSymbol Parameter Test conditionsMin TypMax Unit V CC Operating supplyvoltage 10.545V V USD Undervoltage shutdown710.5VR ONOn state resistanceI OUT = 0.5 A; T J = 25 °C I OUT = 0.5 A;150185280m Ωm ΩI SSupply currentOFF state; V CC = 24 V; T CASE = 25 °CON state (all channels ON); V CC = 24 V , T CASE = 100 °C15012µAmAI LGND Output current at turn-offV CC = V STAT = V IN = V GND = 24 V V OUT = 0 V 1mA I L(off)OFF state output currentV IN = V OUT = 0 V ; 05µA t d(Vccon)Power-on delay time from V CC rising edgeTable 7.1msTable 4.Switching (V CC = 24 V)SymbolParameterTest conditionsMinTyp Max Unit t ON T urn-on time R L = 48 Ω from 80% V OUT Figure 5.50100µs t OFFT urn-off timeR L = 48 Ω to 10% V OUT Figure 5.75150µs dV OUT/dt (on)T urn-on voltage slope R L = 48 Ω from V OUT = 2.4 V to V OUT = 19.2 V Figure 5.0.7V /µs dV OUT/dt (off)T urn-off voltage slopeR L = 48 Ω from V OUT = 21.6 V to V OUT = 2.4 V Figure 5.1.5V /µsO b s o l et e Pr o du c t(s )- O bs o l e t eP ro d u ct(s )VN808SR Electrical characteristicsDoc ID 11624 Rev 55/17Table 5.Input pinSymbol Parameter Test conditionsMinTypMax Unit V INL Input low level V CC /2-1V I INL Low level input current V IN = V CC / 2 - 1 V80µΑV INH Input high level V CC /2+1V I INH High level input currentV IN = V CC / 2 + 1 V 150260µΑV I(HYST)Input hysteresis voltage 0.6VI INInput currentV IN = V CC = 32 V 300µΑTable 6.ProtectionsSymbol Parameter Test conditionsMin Typ Max Unit T CSD Case shut-down temperature 125130135°C T CR Case reset temperature 110°CT CHYST Case thermal hysteresis715°CT TSD Junction shutdown temperature150175200°C T RJunction resettemperature135°CT HYSTJunction thermal hysteresis 715°C I limDC Short circuit currentV CC = 24 V; R LOAD = 10 m Ω0.71.7A V demagTurn-off output clampvoltageI OUT = 0.5 A; L = 6mHV CC -57V CC -52V CC -47VTable 7.Status pinSymbol Parameter Test conditionsMin Typ Max Unit I HSTA T High level output currentV CC = 18...32 V; R ST AT = 1 k Ω(Fault condition)234mA I LSTAT Leakage current Normal operation; V CC = 32 V 0.1µA V CLST ATClamp voltageI ST AT = 1 mA I ST AT = -1 mA6.06.8-0.78.0V VO b s o l et e Pr o du c t(s )- O bs o l et eP ro d u ct(s )Pin connections VN808SR6/17Doc ID 11624 Rev 53 Pin connectionsFigure 2.Connection diagram (top view)Table 8.Pin functionsPin N °SymbolFunctionTAB V CCPositive power supply voltage 1V CC Positive power supply voltage2,3,4,5NCNot connected 6Input 1Input of channel 17Input 2Input of channel 28Input 3Input of channel 39Input 4Input of channel 410Input 5Input of channel 511Input 6Input of channel 612Input 7Input of channel 713Input 8Input of channel 814,15,16,17,18NC Not connected 19GNDLogic ground20ST A TUS Common open source diagnostic for over-temperature 21,22Output 8High-side output of channel 823,24Output 7High-side output of channel 725,26Output 6High-side output of channel 6O b s o l et e Pr o du c t(s ) - O bs o l e t eP ro d u ct(s )VN808SRPin connectionsDoc ID 11624 Rev 57/1727.28Output 5High-side output of channel 529,30Output 4High-side output of channel 431,32Output 3High-side output of channel 333,34Output 2High-side output of channel 235,36Output 1High-side output of channel 1Table 8.Pin functions (continued)Pin N °Symbol FunctionO b s o l et e Pr o du c t(s ) - O bs o l e t eP ro d u ct(s )Current, voltage conventions and internal diagram VN808SR8/17Doc ID 11624 Rev 54 Current, voltage conventions and internal diagramFigure 4.Equivalent internal block diagram (same structure for all channel)Table 9.Truth tableConditionsINPUTn OUTPUTnSTATUSNormal operation L H L H L L Current limitationL H L X L L Overtemperature(see waveforms 3, 4 Figure 7) -> T J > T TSD L H L L L H UndervoltageL HL LX XO b s o l et e Pr o du c t(s ) - O bs o l e t eVN808SR Switching time waveformsDoc ID 11624 Rev 59/175 Switching time waveformsO b s o lSwitching time waveformsVN808SR10/17Doc ID 11624 Rev 5Figure 7.WaveformsO b s o l et e Pr o du c t(s ) - O bs o l e t eP ro d u ct(s )分销商库存信息:STMVN808SR13TR VN808SR。

6223N-SRD Module Datasheet说明书

6223N-SRDWi-Fi Single-band 1X1 + Bluetooth 4.2 Combo Module DatasheetOffice: 6 Floor, Building U6, Junxiang U8 Park,Hangcheng Avenue, Bao'an District,Shenzhen City, CHINAFactory: No.8, Litong Road, Liuyang Economic & TechnicalDevelopment Zone, Changsha, Hunan, CHINATEL: +86-755-2955-8186Website: Customer Approval :CompanyTitleSignatureDateFn-Link6223N-SRD Revision HistoryVersion Date Revision Content Draft Approvedversion fcNew1.0 2020/11/9CONTENTS1 Overview (1)1.1 Introduction (1)1.2 Features (1)1.3 General Specification (2)1.4 Recommended Operating Rating (2)2 General Specification (3)2.1 Wi-Fi RF Specifications (3)2.2 BT RF Specifications (3)3 Pin Assignments (5)3.1 Pin Outline (5)3.2 Pin Definition (5)4 Dimensions (7)4.1 Module Picture (7)4.2 Marking Description (7)4.3 Module Physical Dimensions (8)4.4 Layout Reference (9)6 Host Interface Timing Diagram (10)6.1 SDIO Pin Description (10)6.2 SDIO Default Mode Timing Diagram (11)6.3 SDIO Power-on sequence (11)6.4 UART Interface Characteristics (12)6.5 UART Interface Power-on Sequence (12)7 Reference Design (12)8 Ordering Information (14)9 The Key Material List (14)10 Environmental Requirements (15)10.1 Recommended Reflow Profile (15)10.2 Patch Wi-Fi/BT modules installed before the notice (15)11 Package (17)11.1 Reel (17)11.2 Packaging Detail (17)1 Overview1.1 Introduction6223N-SRD is a highly integrated and excellent performance Wireless LAN (WLAN) and BT. It provides SDIO interface for Wi-Fi to connect with host processor and high speed UART interface for BT. High-speed wireless connection up to 150 Mbps and Bluetooth can support BT2.1+EDR/BT3.0 and BT4.2. It can be easily manufactured on SMT process.This WLAN Module design is based on Realtek RTL8723DS-CG QFN484.4X4.4mm(Realtek).It combines a MAC, a 1T1R capable baseband, and RF in a single chip. It is designed to provide excellent performance with low power Consumption and enhance the advantages of robust system and cost-effective.6223N-SRD integrates whole Wi-Fi/BT function blocks into a chip, such asSDIO/UART, MAC, BB, AFE, RFE, PA, EEPROM and LDO/SWR, except fewer passive components remained on PCB.This compact module is a total solution for a combination of Wi-Fi + BT technologies. The module is specifically developed for Smart phones and Portable devices.1.2 Features●Operate at ISM frequency bands (2.4GHz)●CMOS MAC, Baseband PHY, and RF in a single chip for 802.11b/g/n compatibleWLAN●Wi-Fi 1 transmitter and 1 receiver allow data rates supporting up to 150 Mbpsdownstream and 150 Mbps upstream PHY rates●SDIO for Wi-Fi and UART for Bluetooth●Fully Qualified for Bluetooth 2.1+EDR specification including both 2Mbps and 3Mbpsmodulation mode●Fully qualified for Bluetooth 3.0●Fully qualified for Bluetooth 4.2 Dual mode●Full_speed Bluetooth operation with Piconet and Scatternet supportBlock Diagram:1.3 General SpecificationModel Name 6223N-SRDProduct Description Support Wi-Fi/BT functionalitiesDimension L x W x T: 23 x 21 x 4.8 (typical) mmBT Interface Support UARTWi-Fi Interface Support SDIO 2.0Operating temperature 0°C to 70°CStorage temperature -40°~125°1.4 Recommended Operating RatingUnitMax.Typ.Min.Operating Temperature 0 25 70 deg.CV VBAT 3.03.63.3VDDIO 1.7 1.8 or 3.3 3.6 V6223N-SRD2 General Specification2.1 Wi-Fi RF SpecificationsFeature DescriptionWLAN Standard IEEE 802.11b/g/n, Wi-Fi compliantFrequency Range 2412MHz-2462MHzChannels 2.4GHz:CH1~CH11Output Power 802.11b /11Mbps:17dBm ± 1.5dB@EVM<=-10dB 802.11g /54Mbps:14dBm ± 1.5dB@EVM<=-25dB 802.11n/MCS7@HT20:13dBm ± 1.5dB@EVM<=-28dB 802.11n/MCS7@HT40:13dBm ± 1.5dB@EVM<=-28dBSpectrum Mask IEEE compliantFreq. Tolerance ±15 ppmReceive Sensitivity(11b) @8% PER802.11b/11Mbps: PER@≤-76 Receive Sensitivity(11g) @10% PER802.11g/54Mbps: PER@≤-65 Receive Sensitivity(11n,20MHz) @10% PER802.11n/MCS7@HT20: PER@≤-64 Receive Sensitivity(11n,40MHz) @10% PER802.11n/MCS7@HT40: PER@≤-612.2 Bluetooth SpecificationFeature DescriptionGeneral SpecificationBluetooth Standard Bluetooth V4.2 of 1, 2 and 3 Mbps.Host Interface UARTFrequency Band 2402 MHz ~ 2480 MHzNumber of Channels 79 channelsModulation GFSK,π/4-DQPSK and 8DPSKRF SpecificationMin. Typical. Max. Output Power (Class 1.5) 6dBmOutput Power (Class 2) 2dBmSensitivity @ BER=0.1%for GFSK (1Mbps)-86dBm Sensitivity @ BER=0.01%for π/4-DQPSK (2Mbps)-86dBm Sensitivity @ BER=0.01%for 8DPSK (3Mbps)-80dBmMaximum Input Level GFSK (1Mbps): -20dBmπ/4-DQPSK (2Mbps) : -20dBm 8DPSK (3Mbps) : -20dBmSensitive @PER=30.8% FOR BLE-90dBm3 Pin Assignments3.1 Pin Outline<TOP>3.2 Pin DefinitionNO. Name Type Description Voltage1 UART-CTS UART-CTS VDDIO2 UART-RTS UART-RTS VDDIOconnections3 GND Groundconnections4 GND Groundconnections5 GND Groundoutput VDDIO6 UART-OUT O UART7 UART-IN I UARTinput VDDIO3.3V 3.3V8 VBAT P Supply9 NC Floating (Don’t connected toground)10 VDDIO PI/O Voltage supply input 1.8V to3.3V 1.8V ~ 3.3V11 GND Ground connections12 CHIP_EN I chip enable pin, default pull high 3.3V 13 WL_WAKE_HOSTI/O WLAN device wake-up host1.8V ~ 3.3V 14 SD_D2 I/O SDIO Data line 2 1.8V ~ 3.3V 15 SD_D3 I/O SDIO Data line 3 1.8V ~ 3.3V 16 SD_CMD I/O SDIO Command Input 1.8V ~ 3.3V 17 SD_CLK I SDIO Clock Input 1.8V ~ 3.3V 18 SD_D0 I/O SDIO Data line 0 1.8V ~ 3.3V 19 SD_D1 I/O SDIO Data line 11.8V ~ 3.3V20 GNDGround connections 21 BT_HOST_WAKE BT host wake-up device VDDIO 22BT_WAKE_HOSTBT device wake-up host VDDIO23 GND Ground connections 24 GND Ground connections 25 GNDGround connections26 WIFI_DIS#Pull high: ON , Pull low: OFFExternal pull low can disable WL 27 BT_DIS#Pull high: ON , Pull low: OFFExternal pull low can disable BTP:POWER I:INPUT O:OUTPUT6223N-SRD 4 Dimensions4.1 Module PictureL x W : 23 x 21 (+0.3/-0.1) mmH: 4.8 (±0.2) mmWeight 1.65g4.2 Marking Description4.3 Module Physical Dimensions (unit: mm )(TOP)4.4 Layout Reference(unit: mm )TOP6 Host Interface Timing Diagram6.1 SDIO Pin DescriptionThe module supports SDIO version 2.0 for all 1.8V 4-bit UHSI speeds: SDR12(25 Mbps), and SDR25(50Mbps) in addition to the 3.3V default speed(25MHz) and high speed (50 MHz). It has the ability to stop the SDIO clock and map the interrupt signal into a GPIO pin. This ‘out-of-band’ interrupt signal notifies the host when the WLAN device wants to turn on the SDIO interface. The ability to force the control of the gated clocks from within the WLAN chip is also provided.SDIO Pin DescriptionSD 4-Bit ModeDATA0 Data Line 0DATA1 Data Line 1 or InterruptDATA2 Data Line 2 or Read WaitDATA3 Data Line 3CLK ClockLineCMD Command6.2 SDIO Default Mode Timing DiagramClockInputOutputSDIO Interface Timing ParametersSDIO Interface Timing6.3 SDIO Power-on sequenceSymbolMinTypicalMaxUnitT 33ramp0.2 - No Limit msT off 250 500 1000 ms T 33ramp 0.2 0.5 2.5 ms T 12ramp 0.1 0.5 1.5 ms T POR 2 2 8 ms T non_rdy 12 10 ms6.4 UART Interface CharacteristicsThe RTL8723DS UART interface is a standard 4-wire interface with RX,TX,CTS and RTS. The interface supports the Bluetooth 2.0 UART HCI H4 and H5 specifications. The default baud rate is 115.2K baud. In order to support high and low speed baud rate,the RTL8723DS provides multiple UART clocks.6.5 UART Interface Power-on Sequence7 Reference DesignNote:1. BAT_EN could not use for module power off, please switch the 3.3V power for module on/off.2.please keep the antenna on no metal area.8 Ordering Information Part No. DescriptionFG6223NSRD-00 RTL8723DS,b/g/n,wifi1T1R,21*23.21mm,SDIO+UART,with metal antenna.9 The Key Material ListMain Shieldingcover6223NSRD V1.0 Shielding cover no insulation layer14.8X11mm-full height of 1.4 copper, no positioning pin(信太)Alternative Shieldingcover6223NSRD V1.0 Shielding cover no insulation layer14.8X11mm-full height of 1.4 copper, no positioning pin (精力通)Main Crystal3225 24MHZ CL=12pF, ±10ppm (东晶) Alternative Crystal 3225 24MHZ CL=12pF, ±10ppm (泰晶) Alternative Crystal 3225 24MHZ CL=12pF, ±10ppm (晶威特) Alternative Crystal 3225 24MHz CL=12pF ±10ppm (鸿星) Alternative Crystal 3225 24MHz CL=12pF ±10ppm (TXC) Main TVS 0201 5V 0.05pF 15KV TVS (Murata) Alternative TVS 0201 5V 0.05pF 15KV TVS (Sunlord) Alternative TVS 0201 5V 0.05pF 15KV TVS (维安)MainMainChipsetRTL8723DS-CG QFN48 4.4X4.4mm (Realtek)Main antenna 6223N-SRD metal antenna.Main PCB6223N-SRD-V1.0,FR4,green,21X23X0.8mm (翔宇) Alternative PCB 6223N-SRD-V1.0,FR4,green,21X23X0.8mm（广东科翔）Alternative PCB 6223N-SRD-V1.0,FR4,green,21X23X0.8mm（顺络）Alternative PCB 6223N-SRD-V1.0,FR4,green,21X23X0.8mm（深联）10 Environmental Requirements10.1 Recommended Reflow ProfileReferred to IPC/JEDEC standard.Peak Temperature : <250°CNumber of Times : ≤2 times10.2 Patch Wi-Fi/BT modules installed before the noticeWi-Fi/BT module installed note:1.Please press 1 : 1 and then expand outward proportion to 0.7 mm, 0.12 mm thickness When open a stencil.2.Take and use the WIFI/BT module, please insure the electrostatic protective measures.3.Reflow soldering temperature should be according to the customer the main size of the products, such as the temperature set at 250 + 5 ℃for the MID motherboard. About the module packaging, storage and use of matters needing attention are as follows:1.The module of the reel and storage life of vacuum packing: 1). Shelf life: 8 months, storage environment conditions: temperature in: < 40 ℃, relative humidity: < 90% r.h.2.The module vacuum packing once opened, time limit of the assembly:6223N-SRD Card:1) check the humidity display value should be less than 30% (in blue), such as: 30% ~ 40% (pink), or greater than 40% (red) the module have been moisture absorption.2.) factory environmental temperature humidity control: ≦ -30 ℃, ≦ 60% r.h..3). Once opened, the workshop the preservation of life for 168 hours.3. Once opened, such as when not used up within 168 hours:1). The module must be again to remove the module moisture absorption.2). The baking temperature: 125 ℃, 8 hours.3). After baking, put the right amount of desiccant to seal packages.6223N-SRDFN-LINK TECHNOLOGY LIMITEDProprietary & Confidential1711 Package11.1 ReelTBD11.2 Packaging DetailTBDFCC StatementFCC standards: FCC CFR Title 47 Part 15 Subpart C Section 15.247Integral antenna with antenna gain 2dBiThis device complies with part 15 of the FCC Rules. Operation is subject to the following two conditions: (1)This device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation.Any Changes or modifications not expressly approved by the party responsible for compliance could void the user's authority to operate the equipment.Note: This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates, uses and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more of the following measures:—Reorient or relocate the receiving antenna.—Increase the separation between the equipment and receiver.—Connect the equipment into an outlet on a circuit different from that to which the receiver is connected.—Consult the dealer or an experienced radio/TV technician for help.FCC Radiation Exposure StatementThe modular can be installed or integrated in mobile or fix devices only. This modular cannot be installed in any portable device if without further certify for example C2PC with SAR.This modular complies with FCC RF radiation exposure limits set forth for an uncontrolled environment. This transmitter must not be co-located or operating in conjunction with any other antenna or transmitter. This modular must be installed and operated with a minimum distance of 20 cm between the radiator and user body.If the FCC identification number is not visible when the module is installed inside another device, then the outside of the device into which the module is installed must also display a label referring to the enclosed module. This exterior label can use wording such as the following: “Contains Transmitter Module FCC ID: 2AATL-6223N-SRD Or Contains FCC ID: 2AATL-6223N-SRD”When the module is installed inside another device, the user manual of the host must contain below warning statements;1.This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions:(1)This device may not cause harmful interference;(2)This device must accept any interference received, including interference that may cause undesired operation.Note: This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates, uses and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications.However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more of the following measures:—Reorient or relocate the receiving antenna.—Increase the separation between the equipment and receiver.—Connect the equipment into an outlet on a circuit different from that to which the receiver is connected. —Consult the dealer or an experienced radio/TV technician for help.2.Changes or modifications not expressly approved by the party responsible for compliance could void the user's authority to operate the equipment.The devices must be installed and used in strict accordance with the manufacturer's instructions as described in the user documentation that comes with the product.Any company of the host device which install this modular with modular approval should perform the test of radiated & conducted emission and spurious emission, etc. according to FCC part 15C : 15.247 and 15.209 & 15.207 ,15B Class B requirement, Only if the test result comply with FCC part 15C : 15.247 and 15.209 & 15.207 ,15B Class B requirement，then the host can be sold legally.。