不良现象中英文对照表

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产品不良名称中英文对照

视窗偏位 Window offset
视窗变形 Window deform 凸点 Convex
蜂鸣美工缝偏位 Missmatching
打皱变形模痕
Cockle, crape, crease Transfingeration Mold mark
毛屑 Fiber
冲床/ 修剪
脏污刮伤压伤凹点凸点偏位变形缺料折痕拉裂擦伤
PC膜不良
少切 Under cut 过切 Over Cut 剥离 Delamination 波纹 Wrinkle 压伤 Breaking 原物料不良 Material NG
刮伤 Scratch 透光 Dead Color, Transparency 黑点 Black Dot 起苍 Silver Streak 剥离 Delamination 冲墨 Wash out IMD冲膜 Wash out 缩水 Shrinkage 变形 Transfingeration / Deform 缺料 Void 折痕 Silver Break 脏污 Dirty / Contamination 偏位 Offset 凹点 Dented / Concave
不平/细孔 Ueven
错料 W PoroornAgdMorartmereianlt / Poor Cutting / 修饰不良 Over Cut
移印组装

各种不良的中英文对照表

Defect Description A recess on the surface Conponment position deviation Damage due to fixture,jig Abrasion, groove on the surface. USW parameter not correct USW parameter not correct Gap between two parts after fitting/assembly.
Visiable line at material joint area due to release of internal stress. Gloss different due to internal stress releasing after painting at gate area, weld line, etc.
Defect Description Color deviation from target color Gloss deviation from target gloss visible roughness or powdery appearance on localised surface areas. General rippled or mottled appearance on surface of paint or topcoat. local collection, or build-up of paint or topcoat. Surface not painted which is required Surface painted which is not required. Air bubble on the surface Visible particles in or on the surface such as fiber, dust, grease, etc. Abrasion, groove on the surface. deviations appearing as shiny areas from the defined roughness of the surface.

不良品项目定义中英文对照版

S01 刮伤﹕受尖锐硬物划碰而在零件表面留下的,长度相对於宽度和深

度较长的线状痕迹

S02 毛刺﹕产品冲裁后留在零件剪切边的批锋

S03 模痕﹕模具在成形零件过程中造成的均匀类似刮痕现象

S04 压伤﹕由于模具表面有异物﹐使产品在冲压成形过程中受压力作用在表

面留下块状的下凹的现象

S05 切边不齐﹕产品冲裁后零件剪切边呈现出不整齐的现象

S06 晃动:由于产品平面度超出spec﹐而呈现出凹凸不平的现象

S07 尺寸超差﹕产品的尺寸超出Spec

S08 材料外观不良﹕原材料本身就具有的一些如白斑﹐黑点 ,麻点﹐发黑﹐白灰﹐刮伤﹐

氧化等方面的不良

S09 抽牙不良﹕抽牙尺寸超出Spec﹐或是出现抽牙抽歪﹐抽牙抽裂的现象

S10 攻牙不良﹕攻牙孔攻歪﹐通规不通﹐止规不止﹐或是出现实配螺丝打不进,

实配螺丝滑牙的现象

S11 铆合不良﹕铁件铆合后﹐铁件与铁件间间隙超Spec﹐或铆合孔偏位﹐铆合不牢固

之现象

S12 凸包/拱桥冲裂﹕受模具﹐冲床压力﹐或材料硬度的影响﹐产品在成形

过程中凸包/拱桥表面产生明显

的裂纹﹐或完全开裂的现象

S13 少工程﹕产品成形的工程数少于作业文件所规定

的工程数的现象

S14 变形﹕由于受外力作用﹐产品失去其本身所应具有的形状的现象

S15 生锈﹕基体材料表面或切边呈现经色﹐发生化学氧化的现象

S16 不洁﹕产品表面附着除油污﹐毛刺以外的其它异物

S17 油污﹕粘附於零件表面能擦除的呈块状或膜状的

油脂或变色异物

S18 碰刮伤﹕受尖锐硬物刮碰而在零件表面留下的﹐长度相对於宽度和深度

较长的表面斑痕

S19 包装不良﹕产品的包装方式未完全按照相应的作

不良现象英文翻译

中文名称英文名称中文名称英文名称

管脚长lead long 屏蔽罩击穿shield breakdown

脱脚lead pull off PCB不清洁PCB dirty

弯脚角度大lead bend angle big PCB变形PCB deformation

弯脚角度小lead bend angle small PCB来料不良Incoming PCB NG

元件插反component insert inverse PCB线路不良Circuit NG on PCB

元件插错component insert wrong PCB有裂/缺PCB crack/flaw

元件漏插missing component 批峰burr

元件损伤component damaged 破损dilapidation

元件压铜皮component press pad 偏移shift

按键不良keystroke no click 气泡air bulb

按键装反keystroke assemble inverse 其它others

表盖刮伤surface cover scratch 日期印漏missing date code stamp

包焊excess solder 日期印错wrong date code stamp

标签不良label NG 日期印模糊date code stamp vague

标签刮伤label scratch 绕线交叉wrap wire cross

标签漏missing label 绕组不均匀wrap no even

标签来料不良incoming label NG 绕组错coil wrong

不良现象中英对照表(Intel)

Item 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26
English(Intel) Item 錯件 Wrong part 79 缺件 Missing Part 80 多件 Excess part 81 破件 Damaged 82 短路 Short, Solder bridge 83 断路 Open 84 線短 Wire Short 85 線長 Wire Long 86 拐線 Wire Poor Address 87 空焊 Open joint 88 錫未熔/冷焊 Cold Solder 89 包焊 Excess solder 90 折角 Lifted pin 91 錫尖 Solder Icicle 92 錫渣 Solder Splash 93 錫裂 Solder Crack 94 零件沾錫 Solder on Parts 95 錫洞 Pin Hole 96 錫球 Solder Ball 97 錫橋(錫短路) Solder Bridge 98 螺絲滑牙 Screw Stripped/Loose, Shift Screw 99 氧化 Oxdized/Rust 100 異物殘留 Foreign materials contanmination 101 溢錫 Solder Overflow 102 溢膠 Excessive Glue 103 錫不足/吃錫不良 Insufficient Solder 104

不良中英文对照表

不良现象中英文对照表

1.缺件(missing parts)

2.错件(wrong parts)

3.多件(excessive parts)

4.短路(short)

5.断路(open)

6.线短(wire short)

7.线长(wire long)

8.拐线(wire poor ddress)

9.冷焊(cold solder)

10.包焊(excess solder)

11.空焊(missing solder)

12.锡尖(solder icicle)

13.锡渣(solder splash)

14.锡裂(soder crack)

15.锡洞(pin hole)

16.锡球(solder ball)

17.锡桥(solder bridge)

18.滑牙(screw loose)

19.氧化(rust)

20.异物(foreigner material)

21.溢胶(excessive glue)

22.锡短路(solder bridge)

23.锡不足(solder insufficient)

24.极性反(wrong polarity)

25.脚未入(pin unseated)

26.脚未出(pin unvisible)

27.脚未剪(pin no cut)

28.脚未弯(pin not bent)

29.缺盖章(missing stamp)

30.缺标签(missing label)

31.缺序号(missing s/n)

32.序号错(wrong s/n)

33.标签错(wrong label)

34.标示错(wrong mark)

35.脚太短(pin short)

不良项目中英文对照_

1>Abrasion: A surface imperfection that removes or

displaces material characterized by its large

width and length relative to its depth.

中译: 擦破/磨损一个表面的瑕疵。

移动材料时造成较大的宽度、长度、深度之特徵。

2>Bleeding: This defect is the discoloration created by the

diffusion of coloring material through an

applied coating from the substrate to the

surface of the coating.

中译: 渗出染料扩散，自底层到表层，造成表面上的瑕疵。

3＞Blemish: The change in the surface appearance due to a

flaw or cosmetic defect.

中译: 污损/污点因为一个瑕疵或外观不良而改变表面外部

4＞Blister: The raised bumps in the surface, caused by air

or solvent vapors forming within or under the

coating.

中译: 水泡由於来自烤漆内部或表面的空气或溶剂气体造成表

面隆起突出。

5＞Blush: Discoloration or change in gloss, generally appearing at the gates, abrupt thickness

不良项目中英文对照

1>Abrasion: A surface imperfection that removes or

displaces material characterized by its

large width and length relative to its

depth.

中译: 擦破/磨损一个表面的瑕疵..

移动材料时造成较大的宽度、长度、深度之

特徵..

2>Bleeding: This defect is the discoloration created by

the diffusion of coloring material through

an applied coating from the substrate to the

surface of the coating.

中译: 渗出染料扩散;自底层到表层;造成表面上的瑕

疵..

3＞Blemish: The change in the surface appearance due to

a flaw or cosmetic defect.

中译: 污损/污点因为一个瑕疵或外观不良而改变表面外部

4＞Blister: The raised bumps in the surface; caused by

air or solvent vapors forming within or

under the coating.

中译: 水泡由於来自烤漆内部或表面的空气或溶剂气体

造成表面隆起突出..

5＞Blush: Discoloration or change in gloss; generally

焊接中英文对照表

不良现象中英文对照表

1.缺件(MISSING PARTS)

2.错件(WRONG PARTS)

3.多件(EXCESSIVE PARTS)

4.短路(SHORT)

5.断路(OPEN)

6.线短(WIRE SHORT)

7.线长(WIRE LONG)

8.拐线(WIRE POOR DDRESS)

9.冷焊(COLD SOLDER)

10.包焊(EXCESS SOLDER)

11.空焊(MISSING SOLDER)

12.锡尖(SOLDER ICICLE)

13.锡渣(SOLDER SPLASH)

14.锡裂(SODER CRACK)

15.锡洞(PIN HOLE)

16.锡球(SOLDER BALL)

17.锡桥(SOLDER BRIDGE)

18.滑牙(SCREW LOOSE)

19.氧化(RUST)

20.异物(FOREIGNER MATERIAL)

21.溢胶(EXCESSIVE GLUE)

22.锡短路(SOLDER BRIDGE)

23.锡不足(SOLDER INSUFFICIENT)

24.极性反(WRONG POLARITY)

25.脚未入(PIN UNSEATED)

26.脚未出(PIN UNVISIBLE)

27.脚未剪(PIN NO CUT)

28.脚未弯(PIN NOT BENT)

29.缺盖章(MISSING STAMP)

30.缺标签(MISSING LABEL)

31.缺序号(MISSING S/N)

32.序号错(WRONG S/N)

33.标签错(WRONG LABEL)

34.标示错(WRONG MARK)

产品不良描述-详细中英文对照

CATEGORY/分類
GENERAL/一般 GENERAL/一般 GENERAL/一般 GENERAL/一般 GENERAL/一般 GENERAL/一般 GENERAL/一般 GENERAL/一般 GENERAL/一般 GENERAL/一般 GENERAL/一般 GENERAL/一般 GENERAL/一般 GENERAL/一般 GENERAL/一般 GENERAL/一般 GENERAL/一般 GENERAL/一般 GENERAL/一般 GENERAL/一般 GENERAL/一般 GENERAL/一般 GENERAL/一般 GENERAL/一般 GENERAL/一般 GENERAL/一般 GENERAL/一般 GENERAL/一般 GENERAL/一般 GENERAL/一般 GENERAL/一般 GENERAL/一般 GENERAL/一般 GENERAL/一般 GENERAL/一般 GENERAL/一般 GENERAL/一般 GENERAL/一般 GENERAL/一般 GENERAL/一般 GENERAL/一般 GENERAL/一般 GENERAL/一般 GENERAL/一般 GENERAL/一般 GENERAL/一般 GENERAL/一般 GENERAL/一般 GENERAL/一般 GENERAL/一般 GENERAL/一般 GENERAL/一般 GENERAL/一般 GENERAL/一般 GENERAL/一般 GENERAL/一般 GENERAL/一般 GENERAL/一般 GENERAL/一般 GENERAL/一般 GENERAL/一般 GENERAL/一般 GENERAL/一般 GENERAL/一般 GENERAL/一般

不良事件报告表-中英文对照表

参考编号Ref. No.:_________________ 1.基本资料BASIC INFORMATION

2.行政信息ADMINISTRATIVE INFORMATION

3.递交者信息SUBMITTER INFORMATION

4.医疗器械信息MEDICAL DEVICE INFORMATION

5.不良事件信息INCIDENT INFOMRATION

6.患者信息PATIENT INFORMATION

7.医疗护理机构信息HEALTHCARE FACILITY INFORMATION

8.制造商初步意见/跟进MANUFACTURER PRELIMINARY COMMENTS/FOLLOW UP

9.最终调查结果RESULTS OF FINAL INVESTIGATION

10.产品分销PRODUCT DISTRIBUTION

11.其他备注OTHER COMMENTS

本报告的提交本身并不代表制造商和／或其授权代表或国家主管当局对本报告的内容完整

或准确的结论，也不代表所列医疗器械的任何错误和／或医疗器械引起或促成了宣称的任何

人的死亡或其健康六况的严重损坏。

Submission of this report does not, in itself, represent a conclusion by the manufacturer and/or authorized representative or the National Competent Authority that the content of this report is complete or accurate, that the medical device(S) caused or contributed to the alleged death or deterioration the state of the health of any person.

SMT常见不良中英文对照

1.缺件(MISSING PARTS)

2.错件(WRONG PARTS)

3.多件(EXCESSIVE PARTS)

4.短路(SHORT)

5.断路(OPEN)

6.线短(WIRE SHORT)

7.线长(WIRE LONG)

8.拐线(WIREPOORDDRESS)

9.冷焊(COLD SOLDER)

10.包焊(EXCESSSOLDER)

11.空焊(MISSING SOLDER)

12.锡尖(SOLDER ICICLE)

13.锡渣(SOLDER SPLASH)

14.锡裂(SODER CRACK)

15.锡洞(PINHOLE)

16.锡球(SOLDER BALL)

17.锡桥(SOLDER BRIDGE)

18.滑牙(SCREWLOOSE)

19.氧化(RUST)

20.异物(FOREIGNER MATERIAL)

21.溢胶(EXCESSIVEGLUE)

22.锡短路(SOLDER BRIDGE)

24.极性反(WRONG POLARITY)

25.脚未入(PINUNSEATED)

27.脚未剪(PINNOCUT)

28脚未弯(PINNOTBENT)

29.缺盖章(MISSINGSTAMP)

31.缺序号(MISSINGS/N)

32.序号错(WRONGS/N)

34.标示错(WRONGMARK)

35.脚太短(PINSHORT)

36.J1不洁(J1DIRTY)

37.锡凹陷(SOLDERSCOOPED)

38.线序错(W/LOFWIRE)

39.未测试(NOTEST)

40.VR变形(VRDEFORMED)

41.PCB翘皮(PCB PEELING)

不良现象中英文对照表

不良現象中英文對照表

1.缺件(MISSING PARTS) 28.腳未彎(PIN NOT BENT) 55.印章錯誤(WRONG STAMPS)

2.錯件(WRONG PARTS) 29.缺蓋章(MISSING STAMP) 56.尺寸錯誤(DIMENSION WRONG)

3.多件(EXCESSIVE PARTS) 30.缺標籤(MISSING LABEL) 57.二極體壞(DIODE NG)

4.短路(SHORT) 31.缺序號(MISSING S/N) 58.電晶體壞(TRANSISTOR NG)

5.斷路(OPEN) 32.序號錯(WRONG S/N) 59.振盪器壞(X’TL NG)

6.線短(WIRE SHORT) 33.標籤錯(WRONG LABEL) 60.管裝錯誤(TUBES WRONG)

7.線長(WIRE LONG) 34.標示錯(WRONG MARK) 61.阻值錯誤(IMPEDANCE WRONG)

8.拐線(WIRE POOR DDRESS) 35.腳太短(PIN SHORT) 62.版本錯誤(REV WRONG)

9.冷焊(COLD SOLDER) 36.J1不潔(J1 DIRTY) 63.電測不良(TEST FAILURE)

10.包焊(EXCESS SOLDER) 37.錫凹陷(SOLDER SCOOPED) 64.版本未標(NON REV LEBEL)

11.空焊(MISSING SOLDER) 38.線序錯(W/L OF WIRE) 65.包裝損壞(PACKING DAMAGED)

SMT焊接不良现象中英文对照表

[replyview]不良现象中英文对照表

1.缺件(MISSING PARTS) 28.脚未弯(PIN NOT BENT) 55.印章错误(WRONG STAMPS)

2.错件(WRONG PARTS) 29.缺盖章(MISSING STAMP) 56.尺寸错误(DIMENSION WRONG)

3.多件(EXCESSIVE PARTS) 30.缺卷标(MISSING LABEL) 57.二极管坏(DIODE NG)

4.短路(SHORT) 31.缺序号(MISSING S/N) 58.晶体管坏(TRANSISTOR NG)

5.断路(OPEN) 32.序号错(WRONG S/N) 59.振荡器坏(X’TL NG)

6.线短(WIRE SHORT) 33.卷标错(WRONG LABEL) 60.管装错误(TUBES WRONG)

7.线长(WIRE LONG) 34.标示错(WRONG MARK) 61.阻值错误(IMPEDANCE WRONG)

8.拐线(WIRE POOR DDRESS) 35.脚太短(PIN SHORT) 62.版本错误(REV WRONG)

9.冷焊(COLD SOLDER) 36.J1不洁(J1 DIRTY) 63.电测不良(TEST FAILURE)

10.包焊(EXCESS SOLDER) 37.锡凹陷(SOLDER SCOOPED) 64.版本未标(NON REV LEBEL)

11.空焊(MISSING SOLDER) 38.线序错(W/L OF WIRE) 65.包装损坏(PACKING DAMAGED)

SMT焊接不良现象中英文对照表讲课教案

S M T焊接不良现象中英文对照表

•[replyview]不良现象中英文对照表

1.缺件(MISSING PARTS) 28.脚未弯(PIN NOT BENT) 55.印章错误(WRONG

STAMPS)

2.错件(WRONG PARTS) 29.缺盖章(MISSING STAMP) 56.尺寸错误

(DIMENSION WRONG)

3.多件(EXCESSIVE PARTS) 30.缺卷标(MISSING LABEL) 57.二极管坏

(DIODE NG)

4.短路(SHORT) 31.缺序号(MISSING S/N) 58.晶体管坏(TRANSISTOR NG)

5.断路(OPEN) 32.序号错(WRONG S/N) 59.振荡器坏(X’TL NG)

6.线短(WIRE SHORT) 33.卷标错(WRONG LABEL) 60.管装错误(TUBES

WRONG)

7.线长(WIRE LONG) 34.标示错(WRONG MARK) 61.阻值错误(IMPEDANCE

WRONG)

8.拐线(WIRE POOR DDRESS) 35.脚太短(PIN SHORT) 62.版本错误(REV

WRONG)

9.冷焊(COLD SOLDER) 36.J1不洁(J1 DIRTY) 63.电测不良(TEST

FAILURE)

10.包焊(EXCESS SOLDER) 37.锡凹陷(SOLDER SCOOPED) 64.版本未标

(NON REV LEBEL)

11.空焊(MISSING SOLDER) 38.线序错(W/L OF WIRE) 65.包装损坏

不良现象中英文对照表

良现象中英文对照表

不良现象中英文对照表

1.缺件(MISSING PARTS)…missing parts

2.错件(WRONG PARTS) wrong parts

3.多件(EXCESSIVE PARTS…excessive parts

4.短路(SHORT…short

5.断路(OPEN)-open

6.线短(WIRE SHORT…wire short

7.线长(WIRE LONG)…wire long

8.拐线(WIRE POOR DDRESS)-wire poor adress

9.冷焊(COLD SOLDER)…cold solder

10.包焊(EXCESS SOLDER)-excess solder

11.空焊(MISSING SOLDER)- missing solder

12.锡尖(SOLDER ICICLE) … icicle

13.锡渣(SOLDER SPLASH)-• solder splash

14.锡裂(SODER CRACK)-solder crack

15.锡洞(PIN HOLE)..solder hole

16.锡球(SOLDER BALL)..sloder ball

17.锡桥(SOLDER BRIDGE…solder bridge

18.滑牙(SCREW LOOSE)-screw loose

19.氧化(RUST) … rust

20.异物(FOREIGNER MATERIAL)-• foreigner material

21.溢胶(EXCESSIVE GLUE)

22.锡短路(SOLDER BRIDGE)