不良现象中英文对照表

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SMT焊接不良现象中英文对照表

SMT焊接不良现象中英文对照表

[replyview]不良现象中英文对照表1.缺件(MISSING PARTS) 28.脚未弯(PIN NOT BENT) 55.印章错误(WRONGSTAMPS)2.错件(WRONG PARTS) 29.缺盖章(MISSING STAMP) 56.尺寸错误(DIMENSION WRONG)3.多件(EXCESSIVE PARTS) 30.缺卷标(MISSING LABEL) 57.二极管坏(DIODE NG)4.短路(SHORT) 31.缺序号(MISSING S/N) 58.晶体管坏(TRANSISTOR NG)5.断路(OPEN) 32.序号错(WRONG S/N) 59.振荡器坏(X’TL NG)6.线短(WIRE SHORT) 33.卷标错(WRONG LABEL) 60.管装错误(TUBESWRONG)7.线长(WIRE LONG) 34.标示错(WRONG MARK) 61.阻值错误(IMPEDANCEWRONG)8.拐线(WIRE POOR DDRESS) 35.脚太短(PIN SHORT) 62.版本错误(REVWRONG)9.冷焊(COLD SOLDER) 36.J1不洁(J1 DIRTY) 63.电测不良(TEST FAILURE)10.包焊(EXCESS SOLDER) 37.锡凹陷(SOLDER SCOOPED) 64.版本未标(NONREV LEBEL)11.空焊(MISSING SOLDER) 38.线序错(W/L OF WIRE) 65.包装损坏(PACKING DAMAGED)12.锡尖(SOLDER ICICLE) 39.未测试(NO TEST) 66.印章模糊(STAMPSDEFECTIVE)13.锡渣(SOLDER SPLASH) 40.VR变形(VR DEFORMED) 67.卷标歪斜(LABELTILT)14.锡裂(SODER CRACK) 41.PCB翘皮(PCB PEELING) 68.外箱损坏(CARTONDAMAGED)15.锡洞(PIN HOLE) 42.PCB弯曲(PCB TWIST) 69.点胶不良(POOR GLUE)16.锡球(SOLDER BALL) 43.零件沾胶(GLUE ON PARTS) 70.IC座氧化(SOCKET RUST)17.锡桥(SOLDER BRIDGE) 44.零件脚长(PARTS PIN LONG) 71.缺UL卷标(MISSING UL LABEL)18.滑牙(SCREW LOOSE) 45.浮件(PARTS LIFT) 72.线材不良(WIRE FAILURE)19.氧化(RUST) 46.零件歪斜(PARTS TILT) 73.零件脚损坏(PIN DAMAGED)20.异物(FOREIGNER MATERIAL) 47.零件相触(PARTS TOUCH) 74.金手指沾锡(SOLDER ON GOLDEN FINGERS)21.溢胶(EXCESSIVE GLUE) 48.零件变形(PARTS DEFORMED) 75.包装文件错(RACKING DOC WRONG)22.锡短路(SOLDER BRIDGE) 49.零件损坏(PARTS DAMAGED) 76.包装数量错(PACKING Q’TY WRONG)23.锡不足(SOLDER INSUFFICIENT) 50.零件脚脏(PIN DIRTY) 77.零件未定位(PARTS UNSEATED)24.极性反(WRONG POLARITY) 51.零件多装(PARTS EXCESS) 78.金手指沾胶(GLUE ON GOLDEN FINGERS)25.脚未入(PIN UNSEATED) 52.零件沾锡(SOLDER ON PARTS) 79.垫片安装不良(WASHER UNSEATED)26.脚未出(PIN UNVISIBLE) 53.零件偏移(PARTS SHIFT) 80.线材安装不良(WIRE UNSEATED)27.脚未剪(PIN NO CUT) 54.包装错误(WRONG PACKING) 81. 立碑(TOMBSTONE)。

不良改善对策中英文

不良改善对策中英文

Identification
Efficiency
8) Efficiency measurement Date 2013.1 1.14 Method used
Closed on
R1405700
相关生产很多 很多跟踪确认
2013.11.14
2013.11.14
2013.11.14
2013.1:刘新银,设计主管: 何军
1) References QCR Nb CF inspection Field Qty of defects Reference Designation Traceability
QCR Nb : HNSR1405700 Issue date : 2013. 11.14
8D-Report
Overview Date日期
Team :
Samples reception date 样品接收日 Start of analysis 开始分析 Immediate corrective action 临时对策 Root causes 根本原因 Definitive corrective action 根本改善措施 Prevention of re-occurance 预防再发生
1.模具压金深度不够,折弯间隙变大导致角度不良。
Contribution
5]根本对策
Intro-Date 2013.11.14
Identification
Efficiency
1.模具深度和间隙进行调整。要求为直角。 下次送样时改善 。2.全检员包装出货前将检测是否有折弯不良的现象。不让不 良流出。
6) Documentation reviewed D-FMEA on : P-FMEA on : Control plan updated on : Others : 如果项目需要改善。,检验标准,进一步提高。 Intro-Date 7) 预防再发生 2013.11.14 1.模具深度和间隙进行调整。要求为直角。记录在案, 下次 送样时改善。 2.全检员包装出货前将检测是否有折弯不良的现象。不让不良 流出。

各种不良的中英文对照表

各种不良的中英文对照表

Visiable line at material joint area due to release of internal stress. Gloss different due to internal stress releasing after painting at gate area, weld line, etc.
Remark
Remark
Rg Code Name Defect Name 201 Color Different/色差 202 Gloss Different/光泽差 Matting/麻点 203 Orange peel/橘皮 204 205 Runs/挂流 206 Miss Painting/漏喷 207 Over Painting/过喷 208 Air Bubble/气泡 Impurity/杂质 209 210 Scratch/划伤 Shiny Mark/亮斑 211
Defect Description A moderate depression on the surface of a part. The part is bent, twisted. Excess material not supposed to be on the part. Injection of the part is not complete. Line of joining of material Colour tone differences by the injection point. Colour tone differences in the surface. Blackened and burnt areas Colour tone stripes or dots in the surface Abrasion, groove on the surface. deviations appearing as shiny areas from the defined roughness of the surface. Air bubble on the surface Color deviation from target color Deviation from defined surface texture. Visible particles in or on the surface such as black dot, white dot, dust, grease, etc. Bump on the surface due to ejecting the part. A recess on the surface Ink was washed on the printing Caused by label is bigger than cavity Caused by label is smaller than cavity Handling Issue Logo, artwork position deviation Damage due to handling, transportation or packaging. The transparency on lens is not good. Missing material step due to slide not at the same level.

不良中英文对照表

不良中英文对照表

PU表面略刮伤 Slight scratch on PU surfacePU下面的泡棉不平 Foam is uneven包装漏放五金包 Missing Hardware Kit爆钉穿破PVC特别刮手 Explored staple piercing PVC and it is easy to scratch hand背侧PVC拉太紧起皱 PVC of side of back cushion is too tight背垫PVC刮伤 Scratches on PVC of back cushion背垫PVC略刮伤 Slight scratch on PVC of back cushion背垫PVC破损 PVC of back cushion torn背垫背封车缝未车牢 Broken stitching on back cover背垫背封浮钉 Float staple on back cover背垫背封破损 Back cover torn背垫背钢板孔距与底盘孔距不吻合,螺丝无法组立 Assembly can't be done due to the distance of holes on back bar and seat plate is different背垫边条管处露底线 The inner thread which is located welting strip of back cushion coming out 背垫边条管略刮伤 Slight scratch on welting strip of back cushion背垫边条管外翻 Welting strip of back cushion protruding outward背垫边条管压伤 Indentation on welting strip of back cushion背垫表面有一死皱 Wrinkle on back cushion occurred by defective stitching背垫表面皱大 Much wrinkles on back cushion背垫表面皱大,腰靠太平 Wrinkles on back cushion and lumber is too flat背垫布料刮伤 Fabric of back cushion is scratched背垫布料破 Fabric of back cushion torn背垫侧包压皱 Indentation on side of back cushion背垫侧边管条弯曲 Welting strip of back cushion is crooked背垫侧边皱折 Wrinkles on back cushion背垫车缝开线 Broken stitching on back cushion背垫车缝松线 Loose stitching on back cushion背垫车缝跳针 Skip stitching on back cushion背垫吊卡有折痕 Folds on the hangtag of back cushion背垫缝套二层皮有皮疤 Scar on leather of back cover背垫扶手孔位漏烙孔 Hole on back cushion for assembling arm is missing背垫扶手孔无丝牙 Hole for assembling arm on back cushion has no thread背垫管条刮伤 Scratch on welting strip of back cushion背垫管条弯曲 Welting strip of back cushion is crooked背垫肩部凹陷 Indentation on shoulder of back cushion背垫肩部厚度不够 Thickness of shoulder of back cushion is not enough背垫肩部内缩 Shoulder of back cushion shrinking to the inner背垫肩侧空,皱 Side of back cushion is empty and wrinkled背垫胶袋用错(本应为三国语言,错用为七国语言的胶袋)Plastic bag of back cushion is wrong, it should be three kind of language on bag, but there is seven kind of language on bag 背垫拉点太浅 Pulling strength isn't enough背垫拉扣太松,易拔出 Button on back cushion is too loose and easy to pull out背垫拉链开裂 Zipper on back cushion broken背垫漏烙孔 Missing hole on back cushion背垫露棉 Foam inside of back cushion exposed背垫略刮伤 Slight scratch on back cushion背垫略歪斜 Back cushion is slight crooked背垫略有针孔露白 Pinholes on back cushion revealing white背垫略有皱折 Slight wrinkle on back cushion背垫螺丝孔被套子堵住 Screw hole on back cushion is jammed背垫面料上粉笔印未清洁干净 Chalk marking on fabric of back cushion背垫内外板线条对不上 Two stitching lines of back cushion aren't aligned背垫皮吊卡烫金字体模糊 The golden letters of hangtag on seat cushion are not clear背垫皮料腐皮 Leather of back cushion is decayed背垫皮料刮伤 Scratches on leather of back cushion背垫枪钉外露 Staple on back cushion exposed背垫清洁不良 Poor cleanness on back cushion背垫清洁不良(灰尘) Poor cleanness on back cushion (Dust)背垫清洁不良(水银笔印) Poor cleanness on back cushion (Silver pen mark)背垫上粘有贴纸 Tape sticking on back cushion背垫松线 Loose stitching on back cushion背垫头部凹凸不平 Headrest of seat cushion is uneven背垫头部空 Headrest of back cushion is flat背垫头枕略有皱折 Slight wrinkle on headrest of back cushion背垫头枕内外板缝隙处PVC外露 PVC which is located the headrest of back cushion exposed 背垫歪斜 Back cushion is crooked背垫歪斜较严重 Back cushion is crooked seriously背垫线头 Untrimmed thread on back cushion背垫严重碰破 Back cushion broken背垫针孔过大 Obvious pinholes on back cushion背垫皱折 Wrinkles on back cushion背封PVC刮伤 Scratches on PVC of back cover背封PVC破 PVC of back cover torn背封边条管弯曲 Welting strip of back cover is crooked背封处断钉 Broken staple on back cover背封封钉未封不牢 Staple for fastening back cover is not fast背封浮钉刮手 Float staple on back cover背封刮破 Back cover broken背封刮伤 Back cover is scratched背封漏封钉 Missing staple on back cover背封露棉 Foam inside of back cover exposed背封清洁不良 Poor cleanness on back cover背封压伤 Indentation on back cover背封有压痕 Indentation on back cover背封皱折 Wrinkles on back cover背钢板处PVC压皱 Indentation on PVC beside the back bar背钢板掉漆生锈 Back bar is rusty背钢板套子PVC破损 PVC of cover for back bar torn背钢板套子皱折 Wrinkles on cover of back bar背弯管略掉漆 Metal frame is scratched背下露PVC PVC which is located underside of back cushion exposed背下露木板露 Plywood of back cushion exposed本应用CP143N五爪;混用:CP144-26五爪 Base is misapplied, it should be CP-143N, but CP-144N-26 is used标签位置不对 Label is adhered improperly标签字体模糊 Letter of label is not clear布料表面有线结 Thread kink on fabric布料上有杂色线 Mottle on fabric车缝线外露 Stitching thread exposed车缝压线宽窄不一致 Width of two stitching lines is different成品箱内漏放左手铁架 Missing left metal arm frame from box冲孔皮皮层纤维外露 Fiber inside of punching leather exposed底盘把柄布套车缝松线 Loose stitching on fabric cover of handle of seat plate底盘把柄顶到扶手铁无法升降 The handle of seat plate touching the bracket resulted in the lift and drop can't be done底盘把柄皮套粘贴不牢 Leather cover for handle of seat plate is not fast底盘把手上有胶水 Glue on handle of seat plate底盘表面磨伤 Scratches on seat plate底盘胶袋上有水 Glue on plastic bag for packing seat plate底盘上有油渍 Stain on the seat plate垫子无防布烫破 Fabric on cushion burned out二节杯上毛边 Burrs on the 2 tier cup防尘套破 Telescoping cover broken仿皮皮文较浅,且发亮 Grain on PVC is too flat and light扶手边管条未打紧 Welting strip of arm pad is not fast扶手边条管刮伤 Welting strip of arm is scratched扶手边条管内缩 Welting strip of arm shrinking to the inner扶手边条压线不对称 Two stitching lines of arm pad aren't aligned扶手车缝线错位 Two stitching lines of arm pad aren't aligned扶手底布未打好 Fabric which is loacted bottom of arm pad is not fast扶手底布有粉笔痕迹 Chalk marking on fabric of arm扶手垫边条管略刮伤 Slight scratch on the welting strip扶手垫边条管略外露 Welting strip of arm pad exposed扶手垫边条管内缩 Welting strip of arm pad shrinking to the inner扶手垫车缝松线 Loose stitching on arm pad扶手垫车缝线接口不牢(易拔出) Stitching joint on arm pad is not fast扶手垫底部有粉笔痕迹 Chalk marking on bottom of arm pad扶手垫刮伤 Arm pad is scratched扶手垫略有针孔露白 Pinholes on arm pad revealing white扶手垫略有皱折 Slight wrinkle on arm pad扶手垫面料有暗疤 Scar on fabric of arm pad扶手垫明线不顺畅且打的凹凸不平 Stitching line on arm pad is not smooth 扶手垫前端略皱折 Slight wrinkle on the front of arm pad扶手垫轻微皱折 Slight wrinkle on arm pad扶手垫清洁不良 Poor cleanness on arm pad扶手垫清洁不良(灰尘) Poor cleanness on arm pad (Dust)扶手垫清洁不良(水银笔印) Poor cleanness on arm pad (Silver pen mark)扶手垫跳线 Skip stitching on arm pad扶手垫头部皱折 Wrinkles on front of arm pad扶手垫下不织布外露 Non-woven fabric on arm pad exposed扶手垫线头 Untrimmed thread on arm pad扶手垫压线跳线 Skip stitching on arm pad扶手垫皱折 Wrinkles on arm pad扶手刮伤 Arm is scratched扶手管条接头处缝隙大 Space on welting strip of arm pad扶手厚薄不一致 Thickness of arm pad is inconsistent扶手架表面刮伤 Arm is scratched扶手架表面较粗糙 Surface of arm is not smooth扶手架表面气泡袋印 Bubble bag marking on the surface of arm扶手架表面汽泡 Bubble on the arm (Coating for arm is defective)扶手架车缝松线 Loose stitching on arm support扶手架掉漆 Arm is scratched扶手架刮伤 Arm is scratched扶手架灰尘 Dust on the arm扶手架烤漆不良 Coating for arm support is defective扶手架略有掉漆 Slight scratch on arm support扶手架毛边(略刮手) Burrs on arm (Scratch hand)扶手架毛边(未打磨平) Burrs on the arm due to the arm didn't be polished扶手架磨伤 Arm is scratched扶手架清洁不良 Poor cleanness on arm扶手架清洁不良(EVA粘在扶手架上) Poor cleanness on arm (EVA sticking on arm)扶手架清洁不良(灰尘) Poor cleanness on arm support (Dust)扶手架上向前标贴的不规范 Location of FRONT label on arm is not correct扶手架上有污渍未清洁干净 Smut on arm pad扶手架脱漆 Arm is scratched扶手架与背垫间隙太大 Distance between arm and back cushion is too big扶手螺丝头毛刺严重刺手 Strictly burrs on screw of arm扶手轻微刮伤 Slight scratch on arm扶手铁片灰尘 Dust on the metal bracket of arm扶手同边 Two arms are the same side扶手线头 Untrimmed thread on arm扶手压变形 Arm pad distorted扶手左右标贴错 L or R label on arm is wrong胶垫易破 Plastic washer is easy to break角铁孔烙太大 Hole on bracket is too big角铁孔上棉屑 Foam on the hole of arm bracket漏贴西班牙文向前标 Missing Spanish FRONT label轮子有白色斑点 White stain on caster面料上有折痕 Folds on fabric能摸到扶手组装螺丝 Screw for assembling the arm pad can be felt能摸到铁条 Metal line in the back cushion can be felt能直接摸到木板棱角 Plywood corner can be touched汽压棒外管生锈 Canister of gas lift is rusty枪钉堵孔 Hole is jammed with staples三节杯上有灰尘 Dust on 3-tier-cap手工太差 Poor handcraft手工太差,有海棉棱角 Poor handcraft, foam corner铁架刮伤 Metal frame scratched铁架横杆变形(不能组立) Assembly can't be done due to the crossing pole distorted铁架胶垫晃动(螺丝未上紧) Plastic washer of metal frame is wobbly as the screw is not fast铁架胶塞未塞到位 Plastic cap of metal frame filled improperly铁架孔位与座底孔位不对无法组装 Assembly can't be done due to the holes on metal frame and seat cushion are not matched铁架略刮伤 Metal frame is scratched铁五爪插销孔内有焊渣,轮子差不进去 Hole of meat base is jammed with solder resulted in caster can't insert五爪掉漆 Base is scratched五爪盖脱落 Cap of base falling off五爪刮伤 Base is scratched五爪胶盖上有灰尘 Dust on plastic caps of base五爪脚盖破 Caps of base broken五爪清洁不良 Poor cleanness on base五爪清洁不良(有灰尘) Poor cleanness on base (Dust)五爪生锈 Rusty base线头 Untrimmed thread纸箱SKU#错误 SKU# on carton is wrong纸箱唛头错误 Shipping mark on carton is wrong坐垫皮料破 Leather of seat cushion torn座背垫侧边缝隙 Gap between side of seat and back cushion座背垫间隙 Gap between seat and back cushion座背垫线条不对称 Two stitching lines of seat and back cushion aren't aligned座背垫组立后略有缝隙 Space between seat and back cushion座底标签破损 Label on bottom of seat cushion torn座底不织布破损 Non-woven fabric on seat cushion torn座底钉距太稀 The distance of staples is too big座底扶手螺丝孔位漏烙 Missing hole on bottom of seat cushion for assembling arm 座垫PVC刮伤 Scratches on PVC of seat cushion座垫PVC略刮伤 Slight scratch on PVC of seat cushion座垫PVC破损 PVC of seat cushion torn座垫边条管角易拨出 End of welting strip of seat cushion is easy to pull out座垫边条管略刮伤 Slight scratch on welting strip of seat cushion座垫边条管弯曲 Welting strip of seat cushion is crooked座垫布料破碎 Fabric of seat cushion torn座垫侧边凹凸不平 Side of seat cushion is uneven座垫侧边空 Side of seat cushion is flat座垫侧边皱折 Wrinkles on side of seat cushion座垫车缝松线 Loose stitching on seat cushion座垫车缝跳针 Skip stitching on seat cushion座垫底盘组立困难 It is difficult to assemble seat plate and seat cushion座垫浮钉 Float staple on seat cushion座垫浮钉刮手 Float staple on seat cushion and it is easy to scratch hand座垫华司灰尘过多 Much dust on plastic washer of seat cushion座垫拉点太浅 Pulling strength for seat cushion isn't enough座垫漏放电话卡 Missing toll-card座垫漏烙底盘孔 Missing hole on seat cushion for assembling seat plate座垫略刮伤 Slight scratch on seat cushion座垫略有浮钉 Float staple on seat cushion座垫略有皱折 Slight wrinkle on seat cushion座垫螺丝孔处拉线未清理干净 Pulling wire which is loacted the hole on seat cushion is remnant 座垫内缩 Seat cushion shrinking to the inner座垫皮料磨伤 Leather of seat cushion is scratched座垫皮料破 Leather on seat cushion torn座垫清洁不良 Poor cleanness on seat cushion座垫清洁不良(木屑) Poor cleanness on seat cushion (Wood scraps)座垫清洁不良(水银笔印) Poor cleanness on seat cushion (Silver pen mark)座垫松线 Loose stitching on seat cushion座垫头部压皱 Wrinkles on the front of seat cushion座垫头枕边条管弯曲 Welting strip of seat cushion is crooked座垫线头 Untrimmed thread on seat cushion座垫压皱 Indentation on seat cushion座垫有轻微针孔露白现象 Pinholes on seat cushion revealing white座垫皱折 Wrinkles on seat cushion座前凹凸不平 Front of seat cushion is uneven座中两侧手工不对称 Two sides of seat cushion aren't aligned手工太差,有海棉棱角Poor handcraft, foam corner标签位置不对 Label is adhered improperly能摸到扶手组装螺丝Screw for assembling the arm pad can be felt底盘上有油渍Stain on the seat plate皮面疤痕Scar on leather on back cushion五爪胶盖没有装好Cap of base is apart皮/布下面的泡棉不平 uneven foam under the leather /fabric二节杯上毛边 burrs on the 2 tier cup扶手厚薄不一致 Thickness of arm pad is different背垫上粘有贴纸 Tape sticks on back cushion座底标贴不规范 label on seat cushion doesn't adhere properly座底不织布外露 non woven exposed under the seat cushion铁管架脚垫脏污 poor clean on plastic pads of metal frame扶手角铁螺母没有露在外面 nut on arm bracket of back cushion doesnot outside exposed铁架管塞没塞好 plastic cap on the top of metal frame doesn't stopper三节杯杯口太大,自由坠落 center hole of telescoping cover is too big,cover can't be done to the gas lift角铁孔上棉屑 foam on the hole of arm bracket能摸到铁条 metal line in the back cushion can be felt枪钉堵孔 staple plug up the hole of nut座底钉距太稀 Staple on seat cushion is very sparse座垫树脂棉外露 Colophony foam inside of seat cushion exposed椅脚颜色错误 Color of base is not correct扶手架损坏 Defective hole on arm背钢板套没有装好 Cover border of back bar exposed背封边条接头没接好 Joint on welting strip of back cover is not acceptable背后"serta"LOGO 没有放正 "serta" logo on back cushion is reverse底盘把柄没有装好 Handle of seat plate is loose底盘把柄装反 Handle of seat plate is reverse座底不织布烙坏 Non-woven fabric on bottom of seat cushion torn by welding背钢板表面粗糙 Bac bar is rough背封内枪钉未打平 Staple inside of back cover can be felt扶手垫上凹槽 Dent on arm pad车缝子口宽窄不一致 Defective stitching on back cushion底盘锥孔太大,组装后椅子自动升降 Hole on seat plate is too big resulting the chair fall down automatically车缝线接头没有叠在一起 Defective stitching on cushion背侧内缩 Side of back cushion shrinking to the inner目的地错误,与订单不符 Destination on carton is not correct座底不织布下泡棉未修饰 Foam exposed扶手装饰条没装好 Welting strip of arm pad is not acceptable扶手垫下边条枪钉没打牢 Staples for fastening the arm pad are loose皮面纹路不一致 Embossing of leather is not matched铁架横杆生锈 Crossing pole is rust座底枪钉盖住标签字体 Staples covering the letter on label缺少一个拉链头 Zipper has not handle漏组螺丝 Missing screw螺丝没有锁紧 Screw is not locked tight扶手装饰条没装好 Welting strip of arm pad is not acceptable座底不织布太薄 Non-woven fabric is too thin扶手边条管接头处没包好 Joint of welting line of arm pad is not packed well多放保证卡 This item no need guarantee card, but guarantee card is put in the carton 背垫内外板开裂 The inner and outer plywood of back cushion is apart扶手前端组装略有缝隙 Space between arm pad and support扶手垫装反 Arm pad is assembled in reverse布料断纱 Broken yarn纸箱压变形 Carton distorted车缝线没有重合在一起 Defective stitching on cushions背角铁上锁针生锈 locking pin of arm bracket is rust扶手架前端边缘外露 Arm pad can't cover totally the arm support冲孔皮面绒毛 Floss on the punching leather公英制螺丝五金包混用 Screws with Metric system and British & U.S. system mixed 背钢板套发霉 Moldy on back cover扶手孔变形堵塞无法组装 Hole on arm is distorted扶手孔铁片颜色不一致 The color of metal slips on arm is different三节杯杯口形状不一致 The tape of 3-tier-caps is different扶手架表面水印 Watermark on arm support扶手表面处理颜色不一致 Coating for arm is defective说明书错用为旧版 Assembly instruction is not correct座垫露丝棉 Silk foam exposed扶手孔边缘未修饰 Burrs on hole of arm扶手装饰条装好后有缝隙 Space between the inserts and arm support能摸到铁条 Metal rod can be felt扶手上小孔大小不一致 Hole on arm is defective 座垫露丝棉 Silk foam exposed拉点深浅不一致 Pulling strength is different。

不良现象英文翻译

不良现象英文翻译

中文名称英文名称中文名称英文名称管脚长lead long 屏蔽罩击穿shield breakdown脱脚lead pull off PCB不清洁PCB dirty弯脚角度大lead bend angle big PCB变形PCB deformation弯脚角度小lead bend angle small PCB来料不良Incoming PCB NG元件插反component insert inverse PCB线路不良Circuit NG on PCB元件插错component insert wrong PCB有裂/缺PCB crack/flaw元件漏插missing component 批峰burr元件损伤component damaged 破损dilapidation元件压铜皮component press pad 偏移shift按键不良keystroke no click 气泡air bulb按键装反keystroke assemble inverse 其它others表盖刮伤surface cover scratch 日期印漏missing date code stamp包焊excess solder 日期印错wrong date code stamp标签不良label NG 日期印模糊date code stamp vague标签刮伤label scratch 绕线交叉wrap wire cross标签漏missing label 绕组不均匀wrap no even标签来料不良incoming label NG 绕组错coil wrong标签模糊label vague 输出插头松output plug loose标签填错fill wronly in label 手插管脚长M/I lead long标签贴错label stick wrongly 手插管脚短M/I lead short标签贴反label stick inverse 输出.输入线破损output&input wire dameged 标签贴偏label stick with offset 少插跳线missing jumper wire标签贴斜label stick lean 输出线断output wire open标签有气泡label with air bulb 输出线内部错位output wire wrong inside 标签脏污label dirty 输出线头断output wire head breakdown 有灰尘dust 手插元件插错M/I component wrong板响board with noise 手插元件插反M/I component inverse保险管夹松fuse clip loose 手插元件多插M/I component excessive变压器断线wire of transformer breakdown 手插元件高M/I component high插错insert wrongly 手插元件漏插miss M/I component初,次级绕反inverse 手插元件损伤M/I component damage贴反mounting inverse 少垫片lack of gasket次级对磁蕊短路secondary short to magnet 上盖变形upper case deformation初级短路primary circuit short 少件lack of component次级短路secondary circuit short 高件component raise up初级断线open circuit in primary 红胶溢出red adhesive overflow次级断线open circuit in secondary 竖件component stand up初级胶带破tape damage in primary 少锡insufficient solder次级胶带破tape damage in secondary 元件氧化component oxidize初级圈数多excessive primary wrap 元件虚焊empty solder初级圈数少insufficient primary wrap 元件短路component short circuit次级圈数少insufficient secondary wrap 元件贴反component mount inverse次级圈数多excessive secondary wrap 元件翘起component lift up次级绕错匝数is wrong 元件损伤component damage插破侧盖side cover break 元件偏移component excursion插破骨架bobbin break 元件翻面component turnover超声波压伤ultrasonic press injury 元件多贴excessive component磁头装反magnetic core inverse 元件漏贴missing component错位wrong position 元件脱落component break off磁芯不干净magnetic core dirty 输入插头松input plug loose中文名称英文名称中文名称英文名称磁芯破magnetic core break 输入线头断input wire head breakdown磁芯松动magnetic core loose 上下盒不吻合the upper case can't match lower case磁芯套变形deformation 丝印不良silkscreen NG插座不良socket NG 贴错mount wongly插针漏插miss inserting connector 贴反mount inverse插座破connector break 套管破sleeve tube break插针倾斜connector bent 套管松脱sleeve tube peel off插针少lack of connector 脱焊solder peel off插针松动connector loose 条码不能扫描barcode can't be scanned插针歪connector twist 铜箔断copper foil broken对地短路short to ground 铜箔短路copper foil short多垫片excessive gasket 铜箔开路copper foil open电感倾斜inductor bent 元件掉件component fall off钉刮伤scratched by nail 元件贴翻component mount inverse打胶不良add adhesive NG 烫伤&刮伤scald&scratch,短路short circuit 跳铜皮copper pad peel off钉来料不良incoming nail NG 跳线断jump wire break off垫片破损washer damaged 铜线露出copper wire come out多锡excessive solder 无标记no mark多元件,数量多excessive parts 外壳划伤case scatched断柱column break 外壳沾有异物case with foreign body底座划伤base scratch 未露管脚leads hide缝隙过大big gap 无输出no output盖板断扣the buckle of top case broken 未上锡no solder高件component raise up 线包不良wrap NG管脚短short lead 线包大wrap big骨架断钉bobbin with broken nail 小板坏small board damage管脚长longlead 线不良wire NG骨架开裂bobbin crack 线插错wire insert wrongly管脚连铜线lead connect with copper wire 线断wire break off骨架破损bobbin broken 矽钢片变形lamination deformation骨架烫伤bobbin scald 矽钢片多插insert excessive laminations 挂锡pending solder 矽钢片松lamination loose光学盒断裂optics box broken 矽钢片少插insufficient lamination焊错位solder wrong position 矽钢片氧化lamination oxidize焊点不良solder NG 线刮伤wire scratched盒座刮伤box base with scratch 线焊反wire solder inverse后盖划伤back cover with scratch 线路割错circuit cut wrongly焊接不良defective solder 锡裂solder crack盒内有响声noise in box 线路划伤circuit scratched簧片不清洁spring dirty 线路开/断路circuit open簧片刮伤spring scratch 线路露铜copper out of wire簧片来料不良incoming spring NG 线路没割断circuit no cut off簧片松spring loose 线路起泡circuit blister焊盘氧化pad oxidize 线没接好wire connect no well焊盘有绿油pad with green oil 线内部开路wire open inside盒座变形box base deformation 线破皮insulation of wire broken盒座来料不良incoming box base NG 线圈变形coil deformation盒座烫伤box base scald 线头长wire head long盒座装反box base assemble inverse 线头短wire head short中文名称英文名称中文名称英文名称盒座脏污box base dirty 线烫伤wire scald胶带少缠tape wrap insufficiently 线脏污wire dirty加工反manufacture inverse 锡珠&锡渣solder ball&solder residue假焊void solder 有灰尘dust结合缝大connective gap is big 溢胶adhesive overflow金脚上锡gold foot wih solder 元件表面脏污component surface dirty镜面污点mirror surface with spot 元件变形component deformation键盘坏keyboard brokrn 元件成型反componet moulding inverse金手指长短不一variance 元件脚插错位lead insert to wrong position金手指划伤gold finger scratch 元件脚断lead broken金手指上锡gold finger with solder 元件开路component open金手指脏gold finger dirty 元件内部短路component short inside绝缘片破insulative sheet broken 元件内部开路component open inside绝缘片歪insulative sheet bent 元件破损component damaged绝缘线破insulative wire broken 元件贴错part mount wrongly接触不良contact NG 元件贴歪part mount incline刻度盘刮伤dial scratch 元件用错wrong component刻度盘黑点dial macula 元件一脚未插入one of lead no insert刻度盘印刷不良dial print NG路component short with heat sink 开关刷变形switch brush deformation 元件装反component assemble inverse控制面板划伤control panel scratch 元件阻值偏差resistor value deviation滤波器响filter with noise 有亮点light dotLCD多划LCD with excessive display 压伤press injuryLCD少划LCD with insufficient display 压铜皮press copper foil漏插&漏贴miss insertion/mounting 有响声with noise漏灌胶missing filling glue 异物foreign body冷焊cold solder 支架未装到位bracket don't be fixed correctly 漏焊miss soldering 针孔(锡孔)soldering hole漏件miss component 磁芯间有间隙gap between magnetic cores来料不良incoming material NG 装配不良assemble NG螺丝不良screw NG 扎线不符合要求tie out of requirement螺丝打错wrong screw 总装错误final assemble NG螺丝漏打miss screw 绿油掉green oil peel off螺丝没打紧no fasten screw tightly 绿油起泡green oil blister连铜皮connect with copper foil 漏装绝缘片miss assembling insulative sheet 连锡solder bridge 漏装塑胶上壳case连锡致短路solder bridge to short 漏装磁芯miss assembling magnetic core尼龙盖破nylon cover broken。

不良中英文对照表

不良中英文对照表

不良现象中英文对照表1.缺件(missing parts)2.错件(wrong parts)3.多件(excessive parts)4.短路(short)5.断路(open)6.线短(wire short)7.线长(wire long)8.拐线(wire poor ddress)9.冷焊(cold solder)10.包焊(excess solder)11.空焊(missing solder)12.锡尖(solder icicle)13.锡渣(solder splash)14.锡裂(soder crack)15.锡洞(pin hole)16.锡球(solder ball)17.锡桥(solder bridge)18.滑牙(screw loose)19.氧化(rust)20.异物(foreigner material)21.溢胶(excessive glue)22.锡短路(solder bridge)23.锡不足(solder insufficient)24.极性反(wrong polarity)25.脚未入(pin unseated)26.脚未出(pin unvisible)27.脚未剪(pin no cut)28.脚未弯(pin not bent)29.缺盖章(missing stamp)30.缺标签(missing label)31.缺序号(missing s/n)32.序号错(wrong s/n)33.标签错(wrong label)34.标示错(wrong mark)35.脚太短(pin short)36.j1不洁(j1 dirty)37.锡凹陷(solder scooped)38.线序错(w/l of wire)39.未测试(no test) 40.vr变形(vr deformed)43.零件沾胶(glue on parts)41.pcb翘皮(pcb peeling)42.pcb弯曲(pcb twist)44.零件脚长(parts pin long)45.浮件(parts lift)46.零件歪斜(parts tilt)47.零件相触(parts touch)48.零件变形(parts deformed)49.零件损坏(parts damaged)50.零件脚脏(pin dirty)51.零件多装(parts excess)52.零件沾锡(solder on parts)53.零件偏移(parts shift)54.包装错误(wrong packing)55.印章错误(wrong stamps)56.尺寸错误(dimension wrong)57.二极管坏(diode ng)58.晶体管坏(transistor ng)59.振荡器坏(x’tl ng)60.管装错误(tubes wrong)61.阻值错误(impedance wrong)62.版本错误(rev wrong)63.电测不良(test failure)64.版本未标(non rev lebel)65.包装损坏(packing damaged)66.印章模糊(stamps defective)67.标签歪斜(label tilt)68.外箱损坏(carton damaged)69.点胶不良(poor glue)70.ic座氧化(socket rust)71.缺ul标签(missing ul label)72.线材不良(wire failure)73.零件脚损坏(pin damaged)74.金手指沾锡(solder on golden fingers)75.包装文件错(racking doc wrong)76.包装数量错(packing q’ty wrong)77.零件未定位(parts unseated)78.金手指沾胶(glue on golden fingers)79.垫片安装不良(washer unseated)80.线材安装不良(wire unseated)81.立碑(tombstone)。

不良项目中英文对照_

不良项目中英文对照_

1>Abrasion: A surface imperfection that removes ordisplaces material characterized by its largewidth and length relative to its depth.中译: 擦破/磨损一个表面的瑕疵。

移动材料时造成较大的宽度、长度、深度之特徵。

2>Bleeding: This defect is the discoloration created by thediffusion of coloring material through anapplied coating from the substrate to thesurface of the coating.中译: 渗出染料扩散,自底层到表层,造成表面上的瑕疵。

3>Blemish: The change in the surface appearance due to aflaw or cosmetic defect.中译: 污损/污点因为一个瑕疵或外观不良而改变表面外部4>Blister: The raised bumps in the surface, caused by airor solvent vapors forming within or under thecoating.中译: 水泡由於来自烤漆内部或表面的空气或溶剂气体造成表面隆起突出。

5>Blush: Discoloration or change in gloss, generally appearing at the gates, abrupt thicknesschanges or other structures along flow pat.中译: 异色通常发生在射出进料口、肉厚突然缩减、或流道交错之处6>Bubble: A gas pocket in a plastic molded part. For acoating, it is the same as blister.中译: 气泡一个气体包覆(中空)在塑胶件上,对烤漆来说,与blister意义相同7>Burn Mark: A condition where supper-heated trapped air inthe cavity heats or burns the surface of theplastic part.中译: 焦痕8>Burr:This defect appears as a rough or sharp edgeon metal after it has been cast, cut, drilled,stamped, and so forth. Burrs will usually snagor tear a cleaning cloth.中译: 毛边(头) 在材料经过铸造、切割、钻孔、冲压等等外观形成一个粗糙或锐利边缘,毛边总是会刺穿或扯裂整齐的衣物。

不良项目中英文对照

不良项目中英文对照

1>Abrasion: A surface imperfection that removes ordisplaces material characterized by itslarge width and length relative to itsdepth.中译: 擦破/磨损一个表面的瑕疵。

移动材料时造成较大的宽度、长度、深度之特徵。

2>Bleeding: This defect is the discoloration created bythe diffusion of coloring material throughan applied coating from the substrate to thesurface of the coating.中译: 渗出染料扩散,自底层到表层,造成表面上的瑕疵。

3>Blemish: The change in the surface appearance due toa flaw or cosmetic defect.中译: 污损/污点因为一个瑕疵或外观不良而改变表面外部4>Blister: The raised bumps in the surface, caused byair or solvent vapors forming within orunder the coating.中译: 水泡由於来自烤漆内部或表面的空气或溶剂气体造成表面隆起突出。

5>Blush: Discoloration or change in gloss, generallyappearing at the gates, abrupt thickness changes or other structures along flow pat.中译: 异色通常发生在射出进料口、肉厚突然缩减、或流道交错之处6>Bubble: A gas pocket in a plastic molded part. Fora coating, it is the same as blister.中译: 气泡一个气体包覆(中空)在塑胶件上,对烤漆来说,与blister意义相同7>Burn Mark: A condition where supper-heated trapped airin the cavity heats or burns the surface ofthe plastic part.中译: 焦痕8>Burr:This defect appears as a rough or sharp edgeon metal after it has been cast, cut,drilled, stamped, and so forth. Burrs willusually snag or tear a cleaning cloth.中译: 毛边(头) 在材料经过铸造、切割、钻孔、冲压等等外观形成一个粗糙或锐利边缘,毛边总是会刺穿或扯裂整齐的衣物。

常见不良中英文对照

常见不良中英文对照

常見不良現象中英文對照表
英文 poor solder mask PAD defect forming defect board bent extra component component deform ICT test fail voltage defect no voltage wire open no boot BIOS flash error cann't flash BIOS cann't RESET battery no voltage
中文 CACHE MEMORY不良 A磁碟機不讀 IDE1硬碟機不讀或不抓 KEYBOARD LOCK不良 GREEN不良 速度不對或不能切換 LED燈不亮或不良 喇叭不叫或亂叫 COM 1/2不良 LPT1不良 CMOS設定不良 時間不動 ID 00不良 CARD不良 WINDOWS當機
power short CPU frequency error MEMORY defect KEYBOARD defect HIMEM ERROR or hang up shrinkage pool streak surface check surface roughening surging sweat out torsion warpage waviness webbing weld mant G/F scratch G/F residue glue G/F etching defect
中文 PCB不良 空焊 短路 缺件 錯件 反向 位移 偏移 翻面 立碑 側立 錫球 錫多 吃錫不良 條碼不良
殘留助焊劑 板面不澍 零件破損 溢錫 零件氧化 矯直 色差 霧化 凸料紋 咬入 塗料孔(鑄疵) 塗料疤 起泡 起霜 泛白 皺紋 冒口帶肉 膜泡 糊斑 毛邊 毛邊 翹曲 表面中部波皺 細裂痕 龜裂 修整表面缺陷 鑄件凹痕

不良描述中英文对照

不良描述中英文对照

不良描述中英文对照Goods Supplement补货1.Plastic parts 塑胶部件Abrasion/划痕、Bubbles/气泡、Burrs/毛刺、Bad Plating/电镀不良、Contamination/杂质、Crack/爆裂、Combine Lines/结合线、Deformation/变形、Flow Marks/流痕、GreasyDirt/油污、Haze/雾状、Jelly/泠胶、Mold Marks/模痕、Melange Color/混色、Oppilation Hole/盲孔、Pull White/拉白、Pour Hole uneven/浇口不平、Wrong Stamping/字麦不符、Short Shots/缺料、Shrinkage/缩水、Stripped Screw/螺丝滑牙、Top White/顶白、Weld Lines/夹水纹、Wrong Dimension/尺寸不符、Wrong Texture/纹理错误、Light/发亮,Gaps裂缝、Steps 披峰、表面有手指印Surface finger prints、丝印错误Wrong printing、丝印偏移Printing slanted、丝印重影Printing double image、丝印有污点,拖尾Printing smearing、丝印不平坦(多油或少油)Printing uneven ( thin / thick )、丝印对于中心偏位Printing off centre、压痕或凹痕Press mark 或dented mark、反光或毛刺Flashing 或 burr、镜片有针孔Pin hole on lens.光泽luster/白点white dot、黑点black dot、装配不合格assembled NG、缺口Nick裂split2.Metal Parts 五金部件Abrasion/划痕、Bad Weld/焊接不良、Burrs/毛刺、Bad Plating/电镀不良、Bend angle/折弯角度、Contamination/杂质、Crack/爆裂、Deformation/变形、Dents/凹痕、Greasy Dirt/油污、Mold Marks/模痕、Missing Stamp/漏冲压、Oppilation Hole/盲孔、Pressing Marks/压痕、Rust/生锈、Wrong Stamping/字麦错误、Short Shots/缺料、Stripped Screw/螺丝滑牙、Pits/疤痕、Specks/斑点、Wrong Texture/纹理错误、Wrong Dimension/尺寸不符3.Painting partsSilkScreen parts 喷油/丝印部件Inspection Points /检查要点 :Bleeding/渗色 ,Bad Painting/喷油不良 ,Contamination/杂质 ,deviate position/偏位 ,Flow Marks/流痕 ,Missing paint/漏喷,Over Paint/肥油 ,Pits/疤痕 ,Poor Adhesion/附着力差 ,Print Words Leans/印刷字体倾斜 ,Pooring Paint/薄油,Silkscreen Haze/丝印模糊 ,Silkscreen Stamping Inconsistency/丝印字样不一致 , Scratch/划伤 ,Speck/斑点 ,Uneven Surface Oil/表面油层不均匀 ,Words Break Off/字体断开 ,Wrong Color/错误颜色 ,Wrong Texture/纹理错误 ;4.PCB 印制线路板Open/开路;Short/短路;Weave Texture/板料席纹;Foreign Residue/外来杂物;Delamination/爆板,分层;Dent/凹陷;Dent on G/F/金手指凹陷;Scratch/擦花;Misregistration/对位不正;Board Damage/板子损坏;C/M Illegible/白字不清;C/M on pad/白字上垫;Copper expoure/露铜;Solder Mask on Pad/绿油上垫;Uneven Solder Mask/绿油不平均;Solder Mask peeling off/绿油脱落;Missing Hole/漏孔;Excess Hole/多孔;Wrong Hole Size/孔径错误;Hole Breakout/崩孔;Nick Trace/线路缺口;Void on Trace/线路铜穿;Diskdown/线路不良/狗牙;Solder Mask inside hole/绿油入孔; Discolouration under Solder Mask/绿油颜色不良; Foreign matter under Solder Mask/绿油下杂物; Solder Mask skipping/不过油;Solder on Gold Finger/金手指上锡;Poor Bevelling/斜边不良;Gold Finger burrs/金手指损坏;Ping Ring/粉红圈5.Electronic parts 电子元件No AVL/没AVL;not on AVL/不在AVL上;Mfg/Mfg P/N dis-match AVL/ 与AVL不符;D/C overdue/ D/C 过期;无D/C;wrong part/错料;no reel/无卷轴;bulk packing for chip/ 散装;No dry packing(HIC change color)/ 无真空包装(防潮卡变色); No ESD packing/无防静电包装;illegible marking/印字不清,wrong marking/印字错;deformation/变型 ;micro crack/裂料;damaged part/ 烂料 ;Lead bent(PTH/SMT)/脚弯;Solder balls damaged/锡球坏wrong lead form/脚型错;wrong pitch/脚距不符;coplanar problem/平整度不良;pad(lead) oxidization/锡垫(引脚)氧化;wrong direction in tape(tray)/带中(盘中)方向错;short pins/引脚短;failed in solderability/ 焊锡不良;size(dimensions) out of specification/ 尺寸超标;function fail/ 功能不良;no tolerance/无误差范围;contamination/杂质;wrong identification for pin1/ 第1脚标识错.Broker Buy/炒料;(巻装物料)巻带前无空余巻带No blank cover tape for feeder loading 巻带粘力不足Not enough adhesive for the cover tape. 料盘变形Reel Deforming/卷带变型.。

工厂不良中英文对照表

工厂不良中英文对照表
9 CN020 CN021 CN022 CN023 CN024 CN025 CN026 CN027 CN028 CN029 CN030 CN034 CN031 CN032 CN033 CN034 CN035 FC001 FC001 FC002 FC003 FC004 FC005 FC006 FC007 FC008 OT031 OT058 OT005 OT013 OT022 OT025 OT084 OT085 OT028 OT040 OT042 OT043 OT064 OK001 OK002 SP002 SP003
The feet for component are too long 元件腳過長 SMT failed Component foot on the PCB Crystal fail Crystal intermittent Crystal foot short Diode broken Diode inverted assembled E/Cap inverted assembled Raw E/Cap. Failed Raw EL-Lamp fail Raw Inverter failed Inductor failed Inductor broken Inductor broken Resistor missed Raw resistor failed Resistor broken Resistor short/bridge Wrong value resistor Resistor Hight-up Component solder short/bridge E/Cap inverted assembled Wrong E/Cap applied Diode inverted assembled Component foot on the PCB Wrong resistor applied Resistor no solder / missed Component inverted insert Component solder insufficient Connector debris Connector finger bent on PCB Connector finger snapped on PCB Connector finger poor contact Connector pin missing(MTL) Connector spring lifted Connector have debris Connector solder short/bridge Raw connector failed Connector spring deformed/bent Connector pin oxidation Connector No solder / missed Connector open Connector deformed Connector short Connector reverse SMT不良 元件腳在PCB板上 晶振不良 晶振不穩定 晶振腳短路 二极管來料破裂 二极管插反向 電解電容插反向 電解電容不良 冷光片不良 變壓器不良 電感不良 電感破裂 電感破裂 電阻漏插 電阻來料不良 電阻來料破裂 電阻焊點短路/有錫橋 電阻用錯值 電阻浮高 元件焊點短路 電解電容插反向 電解電容用錯 二极管插反向 元件腳在PCB板上 電阻用錯值 電阻漏焊 元件插反 元件虛焊 Connector 異物 PCB上Connector pin彎曲 PCB上Connector pin折斷 Connector接觸不良 Connector缺pin 排插彈片高翹 排插內有異物 排插焊點短路/有錫橋 排插不良 排插內部彈片變形/彎曲 排插pin 氧化 排插腳漏(空)焊 排插Open 排插變形 排插短路 排插反向

不良项目中英文对照

不良项目中英文对照

1>Abrasion: A surface imperfection that removes ordisplaces material characterized by itslarge width and length relative to itsdepth.中译: 擦破/磨损一个表面的瑕疵..移动材料时造成较大的宽度、长度、深度之特徵..2>Bleeding: This defect is the discoloration created bythe diffusion of coloring material throughan applied coating from the substrate to thesurface of the coating.中译: 渗出染料扩散;自底层到表层;造成表面上的瑕疵..3>Blemish: The change in the surface appearance due toa flaw or cosmetic defect.中译: 污损/污点因为一个瑕疵或外观不良而改变表面外部4>Blister: The raised bumps in the surface; caused byair or solvent vapors forming within orunder the coating.中译: 水泡由於来自烤漆内部或表面的空气或溶剂气体造成表面隆起突出..5>Blush: Discoloration or change in gloss; generallyappearing at the gates; abrupt thickness changes or other structures along flow pat.中译: 异色通常发生在射出进料口、肉厚突然缩减、或流道交错之处6>Bubble: A gas pocket in a plastic molded part. Fora coating; it is the same as blister.中译: 气泡一个气体包覆中空在塑胶件上;对烤漆来说;与blister意义相同7>Burn Mark: A condition where supper-heated trapped airin the cavity heats or burns the surface ofthe plastic part.中译: 焦痕8>Burr:This defect appears as a rough or sharp edgeon metal after it has been cast; cut;drilled; stamped; and so forth. Burrs willusually snag or tear a cleaning cloth.中译: 毛边头在材料经过铸造、切割、钻孔、冲压等等外观形成一个粗糙或锐利边缘;毛边总是会刺穿或扯裂整齐的衣物..9>Chip: This defect is defined as the loss ofadhesion and the removal usually in smallfragments; of the surface coating resultingfrom impact by hard objects. Sometimes itis also known as Mar; Ding or Nick.中译: 漆屑因为烤漆表面受到硬质物体压迫;产生小碎片;失去附着力而剥落;如损坏、压印或刻痕.. 10>Crack: A thin break splitting in the coating orplastic material or sheet-metal.中译: 裂痕/裂缝在烤漆或塑胶或钣件上;一条细薄破裂拉裂..11>Crater: This type of defect is characterized by acup-shaped depression or cavity in thecoated surface. Sometimes confused withpinholes; craters begin as blisters withthe depression formed as the gas forming theblister escapes before surface hardening.中译: 气孔这不良形态特徵;是在烤漆表面上;有一个杯形洼地或洞穴形状..有时候会跟针孔混淆..气孔的形成就像水泡;在烤漆表面硬化之前;气体从水泡中逸出而形成..12>Color Variance: A difference in hue or color from thespecified color.中译: 色差13>Contamination: It is a condition created by foreignmaterial becoming mixed with virgin plasticmaterial. The contamination spots areusually black or brown in color.中译: 污染就是外来原料与原塑料混合掺杂一起所形成..一般污点颜色近似黑色或棕色..14>Corrosion: This defect is caused by chemical reactionwith hot humid air or any other solvent.中译: 腐蚀因湿热空气或任何溶剂而产生化学反应;形成不良现像..15>Crazing: This defect is noticeable in surfacecoatings by slight break in the coating thatdo not penetrate through to the substrateor a previously applied coating.中译: 烧裂烤漆表面上细微裂痕16>Dent: A surface depression caused by a blow orpressure from another object. Dents have nocharacteristic size or shape.中译: 凹痕来自另一个物体的捶击或挤压造成一个表面洼地..凹痕没有特定的大小或形状..17>Ding:An impression or depression formed on thesurface with impact from another hardobject.中译: 压印来自其它硬物的碰撞;在表面上形成一个压痕..18>Die Mark: This type of defect is an indentation;depression; or line that occurs in the samelocation of every part due to a damaged die;mold; tool and so forth.中译: 模痕不良形态像是一个压痕、凹陷洼地、线状..因为冲模、铸模、工具等等损坏;而发生在每个零件的相同位置..19>Dirt:This defect often appears in the form ofirregularly distributed dust particles;usually appearing burnt and black. Theseparticles generally have no common shape orsize and may appear long in shape much liketiny hairs. Particles that are 15-20 milsin diameter can usually be felt.中译: 污秽/灰尘时常呈现不规则分布灰尘微粒;总是显现焦黑..这些微粒没有共同形状或大小20>Ejector Mark:This defect is found in compression moldedparts. It is caused by distorted the moldejector pin and leaves a scar on the part.中译: 冲头压印不良常见於冲压件..它是模具冲头歪曲;在零件上所留下伤痕....21>Fracture: This defect is characterized by a tear;separation; or pulling apart of metal. Afracture is generally found at corners orwherever sharp radii are located.中译: 裂口/断裂不良现象是一个撕裂、分开、扯断的钣件通常可以在转角或任何一个尖锐的弧径位置上发现到..22>Flash:This is unwanted excess plastic that occursat the parting line or interface of moldedparts.中译: 毛边这是多余额外的塑料..发生在塑胶铸造件的分模线或接合面..23>Gloss Variance: This is a difference in the degree of lightreflected from a surface. This is alsosometimes call loss of sheen; shine; lusteror brightness.中译: 光泽偏差度来自一个表面反射光泽度数的差异..24>Grainy Coating: This coating defect is characterized by thepresence of irregularly shaped; angular orround protrusions evenly spread over thearea of concern.中译: 烤漆颗粒烤漆的不良特徵;有不规则形状、尖角、或圆形凸点均匀范围超出关心的区域..25>Gouge: A gouge is characterized as a scratch ofwider width.中译: 圆凿一个圆凿的特徵就像是一个较宽广宽度的抓痕..26>Jetting: It is flow mark that is caused by theimproper injection of plastic melt into amold cavity. This defect sometimes alsocalled “Snaking”.中译: 流痕因不当射出的塑料融入模穴所引起的..27>Knit Lines: A noticeable line or mark in the surface ofa part formed by the flow of the plasticmaterial.中译: 结合线塑料流动形成..28>Mar: This is coating scraped with no colorchange.中译: 伤痕烤漆被刮到而没有颜色改变..29>Pinhole:Pinholes are sharp; round or irregularlyshaped depressions randomly distributedover a surface and may range in size fromthose barely visible to those the size ofa pin-head. These defects will sometimeshave residual varnish or some other solidin their centers surrounding by a hollow;halo-like space.中译: 针孔针孔是尖锐的、圆形的或不规则地形成洼地随机散布在一个平面上..从针头的大小可勉强看出;或许能按大小区分排列..30>Pit: A pinhole bigger in size is called a pit.中译: 坑/洞31>Plate Out: Separation of a portion of the materialduring the injection process that resultsin this material being deposited on the mold.Parts from a mold that is experiencing plateout will have variations in the gloss of thepart; possible filling of fine texturedareas and in the extreme case; theappearance of the layers of missingmaterial.中译: 表面黏模意指塑胶件射出脱模後;表层残留在模具里;造成外表光泽度不一样..32>Press Mark: This is also called mold mark; tool mark ordie mark. This is an indentation;depression or line that occurs due to adamaged die; mold or press tool.中译: 同18项33>Run A run is generally a long; narrow; linearband of discoloration on a finishedsurface.中译: 滑走痕迹通常是一条较长、狭窄、线状条纹的退色在已加工完成的表面上..34>Rust: Rust is the visible manifestation ofcorrosion of the iron or iron alloys. Thisdefect is usually seen as a reddish browncoating; composed mostly of hydrated ironoxides formed on iron or its alloys; asresult of exposure to humid surroundings.中译: 铁锈铁锈是显而易见铁或铁系合金被腐蚀的证明..通常看到就像一层红褐色的涂层..大部份是由与水化合作用的氧化铁所组成..就像是暴露在潮湿的环境..35>Scratch: A scratch may be described as a roughlylinear break in a surface produced byexternal influences. Scratches varygreatly in length and depth. Acharacteristic common to all scratches isthat they are thin relative to theirlengths.中译: 刮伤受到外部影响产生粗糙线状破裂在表面上..在长度与深度上;刮伤变化极大..36>Smudge: A dirty mark or smear appearing as a run.Smudges usually can be wiped off thesurface.中译: 污点/脏污点状37>Sink Mark: Sink marks are unwanted depressions thatoccur when a mass of hot plastic in a thickwall section is not thoroughly cooledduring the molding cycle. The outside iscool; but the inside is still hot; resultingin the wall collapsing or sinking inward.中译: 缩水意指多於的洼地..在塑模循环期间、当大量的热融塑料在较厚的肉壁;不能彻底冷却时会发生..外部冷却;但是内部依然很热;结果肉壁塌陷或向内部凹陷....38>Stain: This type of defect is generally brown incolor and appears as runs. Stains canusually be wiped off the surface.中译: 沾污片状通常是褐色而呈现就像很多滑线..39>Step: The difference in surface alignment betweentwo plastic parts.中译: 段差40>Streaking: This defect characterized by long narrowmarks; smears; or undesirable bands ofcolor in or on the surface. Streaking cannotusually be felt and in many cases may bewiped off the surface.中译: 条纹状特徵是较长狭窄痕迹;被弄脏或多余带状的颜色..通常不容易查觉;在许多例子是能够被擦掉..41>Stress Mark: This type of defect usually occurs at thesharp corners and characterized by stresscracking due to deformation or plasticdecoration process.中译: 应力裂缝通常会发生在尖锐转角..特徵是应力裂缝;发生於变形或塑胶装饰品加工42>Tapped Hole A threaded hole.中译: 螺孔43>Tooling Mark: This type of defect is an indentation;depression; or line that occurs in the samelocation of every part due to damaged tool.中译: 刀痕/模痕同第18项44>Underfill: A plastic part that is not complete in termsof the amount of plastic required.中译:不饱模45>Weld Line: A noticeable line or mark in the surface ofa part formed by the flow of the plasticmaterial.中译: 融合线同第27项46>Warpage: Distortion of a part characterized by abowing or twisted condition.中译: 翘曲变形的零件..特徵弯曲或卷曲..。

SMT 不良描述中英文对照

SMT 不良描述中英文对照

常用英语词汇与缩写:Accuracy:精度Additive Process:加成工艺Adhesion:附着力Aerosol:气溶剂Angle of attack:迎角Anisotropic adhesive:各异向性胶Annular ring:环状圈Application specific integrated circuit :ASIC特殊应用集成电路Array:列阵Artwork:布线图Automated test equipment:ATE自动测试设备Bond lift-off:焊接升离Bonding agent:粘合剂CAD/CAM system:计算机辅助设计与制造系统Capillary action:毛细管作用Chip on board :COB板面芯片Circuit tester:电路测试机Cladding:覆盖层Cold cleaning:冷清洗Cold solder joint:冷焊锡点Conductive epoxy:导电性环氧树脂Conductive ink:导电墨水Conformal coating:共形涂层Copper foil:铜箔Copper mirror test:铜镜测试Cure:烘焙固化AOI(Automatic optical inspection):自动光学检查Assembly:组件ATE(Automated test equipment):自动测试设备Bare Chip:裸芯片BGA(Ball grid array)球栅列阵Blind via:盲孔Blowholes:吹孔Bridge:锡桥Bridging:搭锡bulk feeder:散装式供料器Buried via:埋孔Chamber System:炉膛系统Chip:片状元件Circuit tester:电路测试机cleaning after soldering:焊后清洗Cold solder joint:冷焊锡点Component Check:元件检查Component density:元件密度Component Pick-Up:元件拾取Component Transport:元件传送Component:元件convection reflow soldering:热对流再流焊Copper Clad Laminates:覆铜箔层压板Copper foil:铜箔Copper mirror test:铜镜测试CSP(Chip Scale Package):芯片规模的封装CTE(Coefficient of the thermal expansion):温度膨胀系数Cure:烘焙固化Cursting:发生皮层Cycle rate:循环速率Data recorder:数据记录器Defect:缺陷Delamination:分层Desoldering:卸焊Dewetting:去湿DFM:为制造着想的设计Dispersant:分散剂Documentation:文件编制Downtime:停机时间Durometer:硬度计Desoldering:卸焊Device:器件Dewetting:缩锡DIP:双列直插Downtime:停机时间Dpm(defects per million):百万缺陷率dual wave soldering:双波峰焊Dull Joint:焊点灰暗Environmental test:环境测试Eutectic solders:共晶焊锡Excessive Paste:膏量太多FCT(Functional test):功能测试feeder holder:供料器架feeders:供料器Fiducial:基准点Fillet:焊角Fine-pitch technology :FPT密脚距技术Fixture:夹具Flexibility:柔性flexible stencil:柔性金属漏版Flip chip:倒装芯片flux bubbles:焊剂气泡flying:飞片FPT(Fine-pitch technology):密脚距技术Full liquidus temperature:完全液化温度Golden boy:金样Fundamentals of Solders and Soldering焊料及焊接基础知识Soldering Theory焊接理论Microstructure and Soldering显微结构及焊接Effect of Elemental Constituents on Wetting焊料成分对润湿的影响Effect of Impurities on Soldering杂质对焊接的影响Solder Paste Technology焊膏工艺Solder Powder 锡粉Solder Paste Rheology锡膏流变学Solder Paste Composition & Manufacturing锡膏成分和制造SMT Problems Occurred Prior to Reflow回流前SMT问题Flux Separation助焊剂分离Paste Hardening焊膏硬化Poor Stencil Life网板寿命问题Poor Print Thickness印刷厚度不理想Poor Paste Release From Squeegee锡膏脱离刮刀问题Smear印锡模糊Insufficiency锡不足Needle Clogging针孔堵塞Slump塌落Low Tack低粘性Short Tack Time 粘性时间短SMT Problems Occurred During Reflow回流过程中的SMT问题Cold Joints冷焊Nonwetting不润湿Dewetting反润湿Leaching浸析Intermetallics金属互化物Tombstoning立碑Skewing歪斜Wicking焊料上吸Bridging桥连Voiding空洞Opening开路Solder Balling锡球Solder Beading锡珠Spattering飞溅SMT Problems Occurred at Post Reflow Stage回流后问题White Residue白色残留物Charred Residue炭化残留物Poor Probing Contact探针测接问题Surface Insulation Resistance or Electrochemical Migration Failure表面绝缘阻抗或电化迁移缺陷Delamination/Voiding/Non-curing Of Conformal Coating/Encapsulants分层/空洞/敷形涂覆或包封的固化问题Challenges at BGA and CSP Assembly and Rework Stage BGA、CSP组装和翻修的挑战Starved Solder Joint少锡焊点Poor Self-Alignment自对位问题Poor Wetting润湿不良Voiding空洞Bridging桥连Uneven Joint Height焊点高度不均Open开路Popcorn and Delamination爆米花和分层Solder Webbing锡网Solder Balling锡球Problems Occurred at Flip Chip Reflow Attachment倒装晶片回流期间发生的问题Misalignment位置不准Poor Wetting润湿不良Solder Voiding空洞Underfill Voiding底部填充空洞Bridging桥连Open开路Underfill Crack底部填充裂缝Delamination分层)Filler Segregation填充分离Insufficient Underfilling底部填充不充分Optimizing Reflow Profile via Defect Mechanisms Analysis回流曲线优化与缺陷机理分析Flux Reaction助焊剂反应Peak Temperature峰值温度Cooling Stage冷却阶段Heating Stage加热阶段Timing Considerations时间研究Optimization of Profile曲线优化Comparison with Conventional Profiles与传统曲线的比较Discussion讨论Implementing Linear Ramp Up Profile斜坡式曲线general placement equipment:中速贴装机Golden boy:金样Halides:卤化物Hard water:硬水Hardener:硬化剂high speed placement equipment:高速贴装机hot air reflow soldering:热风再流焊ICT(In-circuit test):在线测试In-circuit test:在线测试Insufficient Paste:膏量不足JIT(Just-in-time):刚好准时laser reflow soldering:激光再流焊LCCC(Leadless Ceramic Chip Carrier):无引脚陶瓷芯片载体Lead configuration:引脚外形Line certification:生产线确认located soldering:局部软钎焊low speed placement equipment:低速贴装机low temperature paste:低温焊膏Machine vision:机器视觉Mean time between failure :MTBF平均故障间隔时间Manhattan effect:曼哈顿现象melf:圆柱形元件metal stencil:金属漏版Misalignment:偏斜Modularity:模块化Movement:移位no-clean solder paste:免清洗焊膏Non-Dewetting:不沾锡Nonwetting:不熔湿的optic correction system :光学校准系统Organic activated :OA有机活性的Packaging density:装配密度Photoploter:相片绘图仪Placement equipment:贴装设备past mask:焊膏膜(漏板)paste shelf life:焊膏贮存寿命PCB(Printed circuit board):印刷电路板Pick-and-place:拾取-贴装设备placement accuracy:贴装精度placement direction:贴装方位Placement equipment:贴装设备placement pressure:贴装压力Placement Procedure:元件放置placement speed:贴装速度PLCC(Plastic Leaded Chip Carrier):塑型有引脚芯片载体Poor Tack Retention:粘着力不足precise placement equipment:精密贴装机PTH (Pin Through the Hole):通孔安装QFP(Quad Flat Package):多引脚方形扁平封装Reflow soldering:回流焊接Repair:修理Repeatability:可重复性Rheology:流变学repeatability:重复性resolution:分辨率Rework:返工rotating deviation:旋转偏差Schematic:原理图Semi-aqueous cleaning:不完全水清洗Shadowing:阴影Silver chromate test:铬酸银测试Slump:坍落Solder bump:焊锡球Solderability:可焊性Soldermask:阻焊Solids:固体。

品质不良现象 -- 中英对照表 - 0809

品质不良现象 -- 中英对照表 - 0809

毛邊:於邊緣多出的料。 結合線:發生於塑膠料流到障礙物 (如通風孔) 分開後再結合的位 置。 合模線:模具組之接合處或滑條所造成。 模板:因射入時,趕出揮發性氣體或松脂揮發性物凝結於模具表面 造成粉白色差。 應力痕:不同光澤的圓形圈圈, 大部份出現於入料口正對面。 凹陷:表面凹陷,出現於柱子之正對面 (因該處塑膠厚度突然變化 造成)。 滑塊:模具組可移 (拆解) 部份,供作部份切除用。 水痕:變色如銀帶狀,由於塑膠於成型過程流過擦洗的表面造成 (又形如蝸牛走過的痕跡)。 缺料:由於凹穴塑膠填充不足,造成表面或內面柱凹陷之缺點 (又 稱短射)。
名詞解釋-ห้องสมุดไป่ตู้-中英文對照 序號 1
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名詞解釋---中英文對照 名詞定義---中文 表面髒:污點, 髒, 油漬, 漆, 墨或其它外物加於表面,無法 用無毒無害的清潔濟清除者。
原材料髒 / 變色 (髒) :材料不均勻的部份,如大塊斑點,銀色條 型延伸及變色歸屬不可量型的缺點。
Flash:Excess material at parting of edge lines. (Usually caused by mold itself or higher press of molding) Welding Line:Lines occurring where plastic flow rejoins after separation of passing an obstacle (such as events). Parting line:Line of separation of tool halves or slides. "Parting Line Mismatch" refers to the offset between mating surface of the tool. Plate out:Chalky discoloration resulting from gassing out of volatiles during injection or condensation of resin volatiles on tool surface. Stress trace:Circular halo with variation in gloss, it is mostly centered opposite to the gate. Sink:A depression on a surface (sheik mark) / concave areas on surface opposite to ribs location (where sudden changes in thickness). Slide:Moveable portion of tool to allow undercuts on part. Splay:" Slivery" discoloration caused by plastic flow through scrubbing surface during molds (snail tracks). Void:Defect of plastic surface due to incompletely fill a cavity (short shot).

不良现象中英文对照表

不良现象中英文对照表

不良現象中英文對照表1.缺件(MISSING PARTS) 28.腳未彎(PIN NOT BENT) 55.印章錯誤(WRONG STAMPS)2.錯件(WRONG PARTS) 29.缺蓋章(MISSING STAMP) 56.尺寸錯誤(DIMENSION WRONG)3.多件(EXCESSIVE PARTS) 30.缺標籤(MISSING LABEL) 57.二極體壞(DIODE NG)4.短路(SHORT) 31.缺序號(MISSING S/N) 58.電晶體壞(TRANSISTOR NG)5.斷路(OPEN) 32.序號錯(WRONG S/N) 59.振盪器壞(X’TL NG)6.線短(WIRE SHORT) 33.標籤錯(WRONG LABEL) 60.管裝錯誤(TUBES WRONG)7.線長(WIRE LONG) 34.標示錯(WRONG MARK) 61.阻值錯誤(IMPEDANCE WRONG)8.拐線(WIRE POOR DDRESS) 35.腳太短(PIN SHORT) 62.版本錯誤(REV WRONG)9.冷焊(COLD SOLDER) 36.J1不潔(J1 DIRTY) 63.電測不良(TEST FAILURE)10.包焊(EXCESS SOLDER) 37.錫凹陷(SOLDER SCOOPED) 64.版本未標(NON REV LEBEL)11.空焊(MISSING SOLDER) 38.線序錯(W/L OF WIRE) 65.包裝損壞(PACKING DAMAGED)12.錫尖(SOLDER ICICLE) 39.未測試(NO TEST) 66.印章模糊(STAMPS DEFECTIVE)13.錫渣(SOLDER SPLASH) 40.VR變形(VR DEFORMED) 67.標籤歪斜(LABEL TILT)14.錫裂(SOLDER CRACK) 41.PCB翹皮(PCB PEELING) 68.外箱損壞(CARTON DAMAGED)15.錫洞(PIN HOLE) 42.PCB彎曲(PCB TWIST) 69.點膠不良(POOR GLUE)16.錫球(SOLDER BALL) 43.零件沾膠(GLUE ON PARTS) 70.IC座氧化(SOCKET RUST)17.錫橋(SOLDER BRIDGE) 44.零件腳長(PARTS PIN LONG) 71.缺UL標籤(MISSING UL LABEL)18.滑牙(SCREW LOOSE) 45.浮件(PARTS LIFT) 72.線材不良(WIRE FAILURE)19.氧化(RUST) 46.零件歪斜(PARTS TILT) 73.零件腳損壞(PIN DAMAGED)20.異物(FOREIGNER MA TERIAL) 47.零件相觸(PARTS TOUCH) 74.金手指沾錫(SOLDER ON GOLDEN FINGERS)21.溢膠(EXCESSIVE GLUE) 48.零件變形(PARTS DEFORMED) 75.包裝文件錯(RACKING DOC WRONG)22.錫短路(SOLDER BRIDGE) 49.零件損壞(PARTS DAMAGED) 76.包裝數量錯(PACKING Q’TY WRONG)23.錫不足(SOLDER INSUFFICIENT) 50.零件腳髒(PIN DIRTY) 77.零件未定位(PARTS UNSEA TED)24.極性反(WRONG POLARITY) 51.零件多裝(PARTS EXCESS) 78.金手指沾膠(GLUE ON GOLDEN FINGERS)25.腳未入(PIN UNSEATED) 52.零件沾錫(SOLDER ON PARTS) 79.墊片安裝不良(WASHER UNSEATED)26.腳未出(PIN UNVISIBLE) 53.零件偏移(PARTS SHIFT) 80.線材安裝不良(WIRE UNSEATED)27.腳未剪(PIN NO CUT) 54.包裝錯誤(WRONG PACKING) 81. 立碑(TOMBSTONE)。

不良现象中英文对照表

不良现象中英文对照表

良现象中英文对照表不良现象中英文对照表1.缺件(MISSING PARTS)…missing parts2.错件(WRONG PARTS) wrong parts3.多件(EXCESSIVE PARTS…excessive parts4.短路(SHORT…short5.断路(OPEN)-open6.线短(WIRE SHORT…wire short7.线长(WIRE LONG)…wire long8.拐线(WIRE POOR DDRESS)-wire poor adress9.冷焊(COLD SOLDER)…cold solder10.包焊(EXCESS SOLDER)-excess solder11.空焊(MISSING SOLDER)- missing solder12.锡尖(SOLDER ICICLE) … icicle13.锡渣(SOLDER SPLASH)-• solder splash14.锡裂(SODER CRACK)-solder crack15.锡洞(PIN HOLE)..solder hole16.锡球(SOLDER BALL)..sloder ball17.锡桥(SOLDER BRIDGE…solder bridge18.滑牙(SCREW LOOSE)-screw loose19.氧化(RUST) … rust20.异物(FOREIGNER MATERIAL)-• foreigner material21.溢胶(EXCESSIVE GLUE)22.锡短路(SOLDER BRIDGE)23.锡不足(SOLDER INSUFFICIENT)24.极性反(WRONG POLARITY)25.脚未入(PIN UNSEATED)26.脚未出(PIN UNVISIBLE)27.脚未剪(PIN NO CUT)28.脚未弯(PIN NOT BENT)29.缺盖章(MISSING STAMP)30.缺标签(MISSING LABEL) … missing label31.缺序号(MISSING S/N)32.序号错(WRONG S/N)33.标签错(WRONG LABEL)34.标示错(WRONG MARK)35.脚太短(PIN SHORT)36.J1 不洁(J1 DIRTY)37.锡凹陷(SOLDER SCOOPED)38.线序错(W/L OF WIRE)39.未测试(NO TEST)40.VR 变形(VR DEFORMED]・deformel43.零件沾胶(GLUE ON PARTS)41.PCB 翘皮(PCB PEELING)42.PCB 弯曲(PCB TWIST)44.零件脚长(PARTS PIN LONG)45.浮件(PARTS LIFT)46.零件歪斜(PARTS TILT) ] tilt47.零件相触(PARTS TOUCH)48.零件变形(PARTS DEFORMED)49.零件损坏(PARTS DAMAGED)50.零件脚脏(PIN DIRTY)51.零件多装(PARTS EXCESS)52.零件沾锡(SOLDER ON PARTS)53.零件偏移(PARTS SHIFT)54.包装错误(WRONG PACKING)55.印章错误(WRONG STAMPS)56.尺寸错误(DIMENSION WRONG)57.二极管坏(DIODE NG)58.晶体管坏(TRANSISTOR NG)59.振荡器坏(X'TL NG)60.管装错误(TUBES WRONG)61.阻值错误(IMPEDANCE WRONG])impedance62.版本错误(REV WRONG)63.电测不良(TEST FAILURE)] test failure64.版本未标(NON REV LEBEL)65.包装损坏(PACKING DAMAGED)66.印章模糊(STAMPS DEFECTIVE)67.标签歪斜(LABEL TILT)68.外箱损坏(CARTON DAMAGED])carton damaged69.点胶不良(POOR GLUE)70.IC 座氧化(SOCKET RUST)71.缺UL 标签(MISSING UL LABEL)72.线材不良(WIRE FAILURE)73.零件脚损坏(PIN DAMAGED)74.金手指沾锡(SOLDER ON GOLDEN FINGERS)75.包装文件错(RACKING DOC WRONG)76.包装数量错(PACKING Q'TY WRONG)77.零件未定位(PARTS UNSEATED)78.金手指沾胶(GLUE ON GOLDEN FINGERS)79.垫片安装不良(WASHER UNSEATED])unseat80.线材安装不良(WIRE UNSEATED)81.立碑(TOMBSTONE)。

不良品项目定义中英文对照版

不良品项目定义中英文对照版

Defect Defect Description不良现象CodeScratch刮伤S1Burr毛刺S2Die tracking模痕S3Dent压伤S4The edge not neat切边不齐S5S6Bad flatness晃动Dimension out of spec尺寸超差S7S8Poor appearance材料外观不良Defective upsiding down抽牙不良S9Poor Tapping攻牙不良S10Poor staking铆合不良S11Crack with article bridge凸包 / 拱桥冲裂S12Missing operation少工程S13Deformation变形S14Rusty生锈S15Dirty不洁S16Oil Stains油污S17S18Scratch碰刮伤Poor Packing包装不良S19S20S21S22 Defect Code A01 AO2 AO3 AO4 A05A06A07A08A09A10A11A12A13A14A15A16Mixed Parts混料Poor Welding点焊不良Fragmentary Mark / Incorrect Mark字模不清/残缺/错误Defect Description不良现象Missing Piece Part少件More Piece Part多件Gap Out Of Spec间隙超差Step Out Of Spec断差超差Wrong Part错件Deformation变形Cracking破损Broken断裂Loosen松脱Wrong Location错位Humified受潮Poor Assy不良的组装Label Duplicate标签重复Label Can't Be Scanned标签不能扫描Poor Printing印刷不良SFCS fail SFCS错误Scanning Fail刷不进A17A18A19A20A21A22A23A24A25A26 Defect Code M01 MO2 MO3 MO4 M05 M06 M07 M08 M09 M10Missing Scanning漏刷Screw slant螺丝锁斜Screw Stripped滑牙Adhesive residues残胶Poor Packing包装不良Mixed Parts混料Incoming material defect来料不良Fitting NG实配不良Function NG功能不良Defect Description不良现象Inclusion/Speck/Contamination杂质Flash毛边Melding结合线Sink缩水Marbling发白Cracking破裂Splay起疮Short shot缺料Burn烧焦Flow mark流痕Bubble气泡M11M12 M13 M14 M15 M16 M17 M18 M19 M20 M21 M22 M23 M24 M25 M26 M27 M28 M29 M30 M31 M32Silver streak银条Porosity针孔Discoloration色差Abrasion模痕Drag mark脱模不良Nastiness不洁Pointer wrong指针错误Tooling wrong模具不良Pulling变形Dimension out of spec尺寸超出规格Material brittleness材料脆Poor Package包装不良Mixed Parts混料Character test NG物性测试NG Scratch刮伤Non-uniform texture咬花不均Blush黑纹Gas mark气纹Pitting凹痕Shine亮痕Nick碰伤5.2.1不良项目定义S01 刮伤﹕受尖锐硬物划碰而在零件表面留下的, 长度相对於宽度和深度较长的线状痕迹S02 毛刺﹕产品冲裁后留在零件剪切边的批锋S03 模痕﹕模具在成形零件过程中造成的均匀类似刮痕现象S04 压伤﹕由于模具表面有异物﹐使产品在冲压成形过程中受压力作用在表面留下块状的下凹的现象S05切边不齐﹕产品冲裁后零件剪切边呈现出不整齐的现象S06晃动 : 由于产品平面度超出 spec﹐而呈现出凹凸不平的现象S07尺寸超差﹕产品的尺寸超出 SpecS08材料外观不良﹕原材料本身就具有的一些如白斑﹐黑点, 麻点﹐发黑﹐白灰﹐刮伤﹐氧化等方面的不良S09 抽牙不良﹕抽牙尺寸超出 Spec﹐或是出现抽牙抽歪﹐抽牙抽裂的现象S10 攻牙不良﹕攻牙孔攻歪﹐通规不通﹐止规不止﹐或是出现实配螺丝打不进 ,实配螺丝滑牙的现象S11 铆合不良﹕铁件铆合后﹐铁件与铁件间间隙超Spec﹐或铆合孔偏位﹐铆合不牢固之现象S12 凸包 / 拱桥冲裂﹕受模具﹐冲床压力﹐或材料硬度的影响﹐产品在成形过程中凸包 / 拱桥表面产生明显的裂纹﹐或完全开裂的现象S13 少工程﹕产品成形的工程数少于作业文件所规定的工程数的现象S14 变形﹕由于受外力作用﹐产品失去其本身所应具有的形状的现象S15 生锈﹕基体材料表面或切边呈现经色﹐发生化学氧化的现象S16 不洁﹕产品表面附着除油污﹐毛刺以外的其它异物S17 油污﹕粘附於零件表面能擦除的呈块状或膜状的油脂或变色异物S18 碰刮伤﹕受尖锐硬物刮碰而在零件表面留下的﹐长度相对於宽度和深度较长的表面斑痕S19 包装不良﹕产品的包装方式未完全按照相应的作业文件来执行﹐可能会造成品质隐患的现象S20 混料﹕两种或两种以上的产品同时放置在某单一产品所存放的区域S21 点焊不良﹕产品点焊后铁件与铁件间连接不牢固﹐拉力测试超 Spec.存在点焊点错位﹐漏焊 , 虚焊 , 烧穿 , 焊渣等缺陷的现象S22 字模不清 / 残缺 / 错误﹕ Mark 字体不完整﹐模糊不清﹐字模的位置﹐式样等未完全按作业文件要求作业的现象?5.2.2涂装不良项目定义P01 杂质 : 由于烤漆面粘附有杂质﹐烤漆后在表面形成一种凸起的可剥落的块状或点状漆的现象P02 刮伤 / 掉漆﹕烤漆表面在外力 ( 碰撞﹐擦刮 ) 作用下﹐漆层呈点状﹐块状或成线状 ( 刮伤 ) 破坏﹐可见或不可见底材的不良现象P03 凝漆﹕由于雾化不良或油漆未完全溶解造成在烤漆表面形成凸包状漆块的现象P04 发白﹕烤漆面受手指或包材碰擦﹐目视烤漆面有不同于烤漆本体颜色的白色痕迹P05 喷漆不良均匀﹕烤漆面油漆形成高低不平﹐或膜厚不一致的现象P06 少喷漆﹕产品的烤漆区域少于作业文件所规定的烤漆区域﹐或烤漆的膜厚太低﹐未达到所规定的标准P07 溢漆﹕烤漆时油漆雾化到非烤漆区域的现象P08 漆层剥落﹕由于油漆着力太差﹐膜厚过厚﹐油漆未充分烤干造成油漆剥离素材的现象P09 凹痕﹕由于烤漆素材表面有下陷不平﹐造成烤漆后表面有下凹的痕迹的现象P10 凸点﹕由于烤漆素材表面有凸包﹐造成烤漆后表面有上凸的现象P11 磨痕 : 素材表面被打磨过所留下的长度及宽度相对大於其深度之表面缺失P12 桔皮﹕由于油漆流平性不佳﹐或涂装过厚使烤漆面形成类似于桔子皮的现象P13 膜厚超规格﹕烤漆层厚度超出QII所规定的范围P14 色差﹕烤漆的颜色超出SPC﹐与标准色板比对存在明显颜色差异P15 酒精擦拭 NG﹕使用 98%以上纯度无水乙醇和棉布﹐1kgf的力在烤漆表面来回擦拭20~50 次后 , 目视烤漆面有明显变化﹐或油漆有迁移到棉布上的现象P16 百格测试 NG﹕用百格刀在烤漆表面划出见底材的 1mm*1mm*100格﹐用 3M胶带紧紧粘住百格区域 1 分钟﹐将胶带撕去﹐用 4 倍的放大镜观察百格区域﹐脱漆面积大于总面积的5%的现象P17 冲击测试 NG﹕使用检验文件所规定的冲头直径和重锤下落高度﹐对烤漆件进行正冲和反冲后﹐烤漆件出现漆层剥落或龟裂的现象P18 表面发黑 / 发黄 : 产品前处理后表面镀层颜色出现偏黑 / 偏黄的现象P19 皮膜发白 : 前处理后产品表面有白灰 , 或是表面镀层颜色与正常产品相比偏白的现象P20 水渍 :前处理后在产品表面形状不规则的白色或暗色部份P21 包装不良﹕产品的包装方式未完全按照相应的作业文件来执行 , 可能会造成品质隐患的现象P22 混料﹕两种或两种以上的产品同时放置在某单一产品所存放的区域P23 咬花不良﹕咬花形状与规格不符﹐或咬花表面分布不均匀的现象P24 油点﹕烤漆面存在类似于油渍点状的现象P25 针孔﹕由于油漆粘度或烤漆炉温过高﹐使产品在烤漆过程中形成气泡破裂﹐在烤漆表面呈现针孔状的现象P26 异色点﹕烤漆表面存在不同于烤漆本体颜色的色点P27 残漆粉﹕由于作业不良导致的在产品非喷漆区域出现油漆的不良现象P28 光泽过高 / 过低 : 喷漆产品光泽度测试超出或低于标准?5.2.3组装不良项目定义A01 少件﹕组装后产品零部件个数少于文件规定所应有个数A01 多件﹕组装后产品零部件个数多于文件规定所应有个数。

8D 报告中英文对照模板

8D 报告中英文对照模板

原因把握与否 (Catch the cause)
□ Yes
□ No
□ On-going
1. Machine
2. Method
3. Man
(Y)-- 5001B
4. Material
XX有限公司
4D
发生根本原因 (Root Cause)
原因分析 (Root Cause Analysis)
原因把握与否 (Catch the cause)
7D
再发防止对策 (Prevent Recurrence)
做成部署 / 担当者 (Department / Member)
适用日期 (Date)
适用文件 (Standardization) □ FMEA □ 管理计划书(Control Plan) □ QC Flow Chart □ 作业指导书(Work Instruction) □ Etc
品质总责任人 (Champion)
(Y)-- 5001B
XX有限公司
构成员名 (Name)
部署 (Department)
职责 (Position)
联系方式 (E-mail / Phone)
TEAM构成员 (Member)
2D
不良现象把握 (Problem Description)
(Y)-- 5001B
XX有限公司
2D
Hale Waihona Puke 不良现象把握 (Problem Description)
3D
做成部署 / 担当者 (Department / Member)
临时对策树立 (Containment Action)
Implementation Date
(Y)-- 5001B

8D报告(中英文版)

8D报告(中英文版)

Fax传真: Fax传真:
E-mail: E-mail:
D2
Problem description问题描述
Affected location on production/ 对产品的影响:
Severity不良等级/严重度: D3 Containment action(s)临时措施
Action to products in-process ,products in warehouse and in customers/ 对在制品、库存品和客户处产品的检查和处理 Products in-process/在制品: Products in warehouse/库存品: Products in customers/客户处产品: Other/其它: Responsible负责人: Completed on完成日期: Root-cause analysis根本原因分析 D4 Why could the non-conformity occur?/ 为什么会发生此不良现象?
Completed on完成日期:
D5
Responsible负责人: Completed on完成日期: Potential Corrective actions and proof of effectiveness 确定可能的纠正措施及其有效性的验证:
Responsible负责人: Completed on完成日期: Introduction of corrective actiห้องสมุดไป่ตู้ns and tracking of effectiveness 执行纠正措施及跟踪其有效性: D6 Description of the action(s)/描述该措施:
Date日期: Date日期:
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1.缺件(MISSING PARTS)
2.错件(WRONG PARTS)
3.多件(EXCESSIVE PARTS)
4.短路(SHORT)
5.断路(OPEN)
6.线短(WIRE SHORT)
7.线长(WIRE LONG)
8.拐线(WIRE POOR DDRESS)
9.冷焊(COLD SOLDER)
10.包焊(EXCESS SOLDER)
11.空焊(MISSING SOLDER)
12.锡尖(SOLDER ICICLE)
13.锡渣(SOLDER SPLASH)
14.锡裂(SODER CRACK)
15.锡洞(PIN HOLE)
16.锡球(SOLDER BALL)
17.锡桥(SOLDER BRIDGE)
18.滑牙(SCREW LOOSE)
19.氧化(RUST)
20.异物(FOREIGNER MATERIAL)
21.溢胶(EXCESSIVE GLUE)
22.锡短路(SOLDER BRIDGE)
23.锡不足(SOLDER INSUFFICIENT)
24.极性反(WRONG POLARITY)25.脚未入(PIN UNSEATED)
26.脚未出(PIN UNVISIBLE)
27.脚未剪(PIN NO CUT)
28.脚未弯(PIN NOT BENT)
29.缺盖章(MISSING STAMP)
30.缺标签(MISSING LABEL)
31.缺序号(MISSING S/N)
32.序号错(WRONG S/N)
33.标签错(WRONG LABEL)
34.标示错(WRONG MARK)
35.脚太短(PIN SHORT)
36.J1不洁(J1 DIRTY)
37.锡凹陷(SOLDER SCOOPED)
38.线序错(W/L OF WIRE)
39.未测试(NO TEST)
40.VR变形(VR DEFORMED
41.PCB翘皮(PCB PEELING)
42.PCB弯曲(PCB TWIST)
43.零件沾胶(GLUE ON PARTS)
44.零件脚长(PARTS PIN LONG)
45.浮件(PARTS LIFT)
46.零件歪斜(PARTS TILT)
47.零件相触(PARTS TOUCH)
48.零件变形(PARTS DEFORMED)
49.零件损坏(PARTS DAMAGED)
50.零件脚脏(PIN DIRTY)
51.零件多装(PARTS EXCESS)
52.零件沾锡(SOLDER ON PARTS)
53.零件偏移(PARTS SHIFT)
54.包装错误(WRONG PACKING)
55.印章错误(WRONG STAMPS)
56.尺寸错误(DIMENSION WRONG)
57.二极管坏(DIODE NG)
58.晶体管坏(TRANSISTOR NG)
59.振荡器坏(X'TL NG)
60.管装错误(TUBES WRONG)
61.阻值错误(IMPEDANCE WRONG)
62.版本错误(REV WRONG)
63.电测不良(TEST FAILURE)
64.版本未标(NON REV LEBEL)
65.包装损坏(PACKING DAMAGED)
66.印章模糊(STAMPS DEFECTIVE)
67.标签歪斜(LABEL TILT)
68.外箱损坏(CARTON DAMAGED)
69.点胶不良(POOR GLUE)
70.IC座氧化(SOCKET RUST)
71.缺UL标签(MISSING UL LABEL)
72.线材不良(WIRE FAILURE)73.零件脚损坏(PIN DAMAGED)
74.金手指沾锡(SOLDER ON GOLDEN FINGERS)
75.包装文件错(RACKING DOC WRONG)
76.包装数量错(PACKING Q'TY WRONG)
77.零件未定位(PARTS UNSEATED)
78.金手指沾胶(GLUE ON GOLDEN FINGERS)
79.垫片安装不良(WASHER UNSEATED)
80.线材安装不良(WIRE UNSEATED)
81.立碑(TOMBSTONE)。

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