PCI-1712L
台湾研华电气查询表
价格 2000 2000 2400 2900 2500 2000 2200 2600 3000 3000
备注
11 PCA-6186VE 12 PCA-6187 13 PCA-6188 14 序号 1 2 3 4 5 6 7 8 9 10 型号 PCI-1710 PCI-1710HG PCI-1710L PCI-1711 PCI-1711L PCI-1713 PCI-1712 PCI-1716 PCI-1716L PCI-1714
台湾研华系列PC总线工业控制产品系列
研华原装整机
序号 型号 描述 1 研华IPC-610H-PIII 6003V/PIII 1G/256M/80G/1.44M/52XCD/KB/MOUSE/USB 2 研华 PIC-610H-PIV 6006LV/P4 2.8G/512M/80G/1.44M/52XCD/KB/MOUSE/USB 3 研华 PIC-610H-PIV 6007LV/P4 3.0G/1G/160G/1.44M/52XCD/KB/MOUSE/USB 4 价格 6800 8600 9600 备注
平板电脑及键盘
描述 12" 彩色TFT LCD显示的平板PC、PIII500、64M、20G、触摸屏 15" 彩色TFT LCD显示的平板PC、PIII500、64M、20G、触摸屏 104键工业键盘 105键抽屉键盘 105键19"机柜抽屉键盘 价格 15000 20000 500 2400 3250 备注
工业级液晶屏
型号 FPM-3120 FPM-3150 FPM-3175 FPM-3190 描述 12“TFT 15“TFT 17“TFT 19“TFT 价格 8750 12910 25000 35500 备注
主板常用接口结构图
低 功 耗 全 长 卡 板 载 ULV Celeron-M CPU/ 内 存 和 LCD/Audio接口/4 串口
低 功 耗 全 长 卡 板 载 ULV Celeron-M CPU/ 内 存 和 FSC-1712CLNA-2
LCD/Audio接口/2 串口
环境与机械尺寸
l 工作环境: 温度：0°C～60°C； 湿度：5%～95%（非凝结状态）；
安全使用小常识
1. 产品使用前，务必仔细阅读产品说明书； 2. 对未准备安装的板卡，应将其保存在防静电保护袋中； 3. 在从防静电保护袋中拿出板卡前，应将手先置于接地金属物体上
一会儿（比如 10 秒钟），以释放身体及手中的静电；
4. 在拿板卡时，需佩戴静电保护手套，并且应该养成只触及其边缘 部分的习惯；
据需求订购将CPU升级到Celeron-M 1.5G） v 标准板配置板载256MB DDR200/266 MHz系统内存(用户可根据需求订
购将板载512MB DDR200/266 MHz系统内存) v 提供一条184Pin DDR 200/266 DIMM系统内存插槽，主板内存最大容
量可扩充到1G（使用高密度的512-Mbit 内存工艺可将内存条最大容 量可扩充到1.5G）。 v 采用Intel第二代图形控制器, 采用DVMT技术分配显存，最大达 64MB。 v 支持CRT、LVDS双显示输出。 v 最多可支持4个标准RS-232接口(标准板提供4个标准RS-232接口;若 用户无需4个串口,可选择定购“FSC-1712CLNA-2”型号,此型号提供 仅提供2个串口) v 一个RS-485/RS-422接口(与COM2共用端口) v 此外，FSC-1712CLNA还提供一个10M/100Mbps网络接口、两个 ATA33/66/100标准IDE接口、四个USB2.0高速接口、音频输入/输出 接口、一个标准PS/2鼠标/键盘接口、软驱接口、一个并行接口以及 看门狗定时器等功能。
MSI B450 TOMAHAWK 商品说明说明书
© 2023 Micro-Star Int'l Co.Ltd. MSI is a registered trademark of Micro-Star Int'l Co.Ltd. All rights reserved.SPECIFICATIONSModel Name B450 TOMAHAWKCPU Support Supports AMD ® Ryzen™ 1st and 2nd Generation/ Ryzen™ with Radeon™ Vega Graphics Processors for Socket AM4CPU Socket Socket AM4Chipset AMD ® B450 ChipsetGraphics Interface1 x PCI-E 3.0 x16 slot + 1 x PCI-E 2.0 x16 slot Supports 2-way CrossFireDisplay Interface HDMI™, DVI-D – Requires Processor Graphics Memory Support 4 DIMMs, Dual Channel DDR4 up to 3466 MHz Expansion Slots 3 x PCI-E x1 slotsStorage 1 x M.2 slot, 6 x SATA 6Gb/sUSB ports 2 x USB 3.1 (Gen2) + 4 x USB 3.1 (Gen1) + 6 x USB 2.0LAN Realtek® 8111H Gigabit LANAudio8-Channel(7.1) HD Audio with Audio BoostPowered by AMD, ensure an uninterrupted connection with more stability and fastest USB speeds.Core BoostWith premium layout and fully digital power design to support more cores and provide better performance.EZ Debug LEDEasiest way to troubleshoot.Extended Heatsink DesignMSI extended PWM heatsink and enhanced circuit design ensures even high-end processors to run in full speed.Audio BoostReward your ears with studio grade sound quality for the most immersive audio experience.DDR4 BoostAdvanced technology to deliver pure data signals for the best gaming performance and stability.CONNECTIONS1. Flash BIOS Button 3. USB 3.1 Gen15. HD Audio Connectors 7. DVI-D Port9. USB 3.1 Gen2 Type A+C2. PS/2 Combo Port 4. LAN Port 6. USB 2.0 Port 8. HDMI™ PortG e n e r a t e d 2023-03-30, c h e c k f o r t h e l a t e s t v e r s i o n w w w .m s i .c o m /d a t a s h e e t . T h e i n f o r m a t i o n p r o v i d e d i n t h i s d o c u m e n t i s i n t e n d e d f o r i n f o r m a t i o n a l p u r p o s e s o n l y a n d i s s u b j e c t t o c h a n g e w i t h o u t n o t i c e .。
NVIDIA RTX A5000 说明书
NVIDIA RTX A5000PERFECTLY BALANCED. BLAZING PERFORMANCE.Amplified Performance for ProfessionalsThe NVIDIA RTX ™ A5000 delivers the power, performance, capabilities, and reliability professionals need to bring their boldest ideas to life. Built on the NVIDIA Ampere architecture, the RTX A5000 combines 64 second-generation RT Cores, 256 third-generation Tensor Cores, and 8,192 CUDA ® cores with 24 GB of graphics memory to supercharge rendering, AI, graphics, and compute tasks. Connect two RTX A5000s with NVIDIA NVLink 1 to scale memory and performance with multi-GPU configurations 2, allowing professionals to work with memory intensive tasks such as large models, ultra-high resolution rendering, and complex compute workloads. Support for NVIDIA virtual GPU software increases the versatility for enterprise deployments.NVIDIA RTX professional graphics cards are certified with a broad range of professional applications, tested by leading independent software vendors (ISVs) and workstation manufacturers, and backed by a global team of support specialists. Get the peace of mind needed to focus on what matters with the premier visual computing solution for mission-critical business.SPECIFICATIONSGPU memory 24 GB GDDR6Memory interface 384-bit Memory bandwidth768 GB/s Error-correcting code (ECC)Yes NVIDIA Ampere architecture-based CUDA Cores 8,192NVIDIA third-generation Tensor Cores256NVIDIA second-generation RT Cores64Single-precision performance 27.8 TFLOPS 5RT Core performance 54.2 TFLOPS 5Tensor performance 222.2 TFLOPS 6NVIDIA NVLinkLow profile bridges connect two NVIDIA RTX A5000 GPUs 1NVIDIA NVLink bandwidth 112.5 GB/s (bidirectional)System interface PCI Express 4.0 x16Power consumptionTotal board power: 230 W Thermal solution ActiveForm factor 4.4” H x 10.5” L, dual slot, full height Display connectors 4x DisplayPort 1.4a 7Max simultaneous displays4x 4096 x 2160 @ 120 Hz, 4x 5120 x 2880 @ 60 Hz, 2x 7680 x 4320 @ 60 Hz Power connector 1x 8-pin PCIeEncode/decode engines 1x encode, 2x decode (+AV1 decode) VR readyYesvGPU software support 7NVIDIA vPC/vApps, NVIDIA RTX Virtual Workstation, NVIDIA Virtual Compute ServervGPU profiles supported See the Virtual GPU Licensing Guide Graphics APIs DirectX 12.078, Shader Model 5.178, OpenGL 4.689, Vulkan 1.29Compute APIsCUDA, DirectCompute, OpenCL ™Features>PCI Express Gen 4>Four DisplayPort 1.4a connectors >AV1 decode support >DisplayPort with audio >3D stereo support with stereo connector >NVIDIA GPUDirect ®for Video support>NVIDIA virtual GPU (vGPU) software support >NVIDIA Quadro ® Sync II 3 compatibility >NVIDIA RTX Experience ™>NVIDIA RTX Desktop Manager software >NVIDIA RTX IO support >HDCP 2.2 support>NVIDIA Mosaic 4 technologyNVIDIA RTX A5000 | DATASHEET | APR21To learn more about the NVIDIA RTX A5000, visit /nvidia-rtx-a50001 NVIDIA NVLink sold separately. |2 Connecting two RTX A5000 cards with NVLink to scale performance and memorycapacity to 48GB is only possible if your application supports NVLink technology. Please contact your application provider to confirm their support for NVLink. | 3 Quadro Sync II card sold separately. | 4 Windows 10 and Linux. | 5 Peak rates based on GPU Boost Clock. | 6 Effective teraFLOPS (TFLOPS) using the new sparsity feature. | 7 Display ports are on by default for RTX A5000. Display ports are not active when using vGPU software. | 8 GPU supports DX 12.0 API, hardware feature level 12 + 1. | 9 Product is based on a published Khronos specification and is expected to pass the Khronos conformance testing process when available. Current conformance status can be found at /conformance© 2021 NVIDIA Corporation. All rights reserved. NVIDIA, the NVIDIA logo, CUDA, GPUDirect, NVLink, Quadro, RTX Experience, and RTX are trademarks and/or registered trademarks of NVIDIA Corporation in the U.S. and other countries. Other company and product names may be trademarks of the respective companies with which they are associated. All other trademarks are property of their respective owners.PNY Part Number VCNRTXA5000-PB。
信捷科技电子 XC 系列可编程序控制器 说明书（xc 1_xc3_xc5_xcm）
3-1．可编程控制器的各种软元件.......................................................................................................... 35 3-2．软元件编号一览表.......................................................................................................................... 37 3-3．可编程控制器的数据处理.............................................................................................................. 39 3-4．软元件的一些编码原则.................................................................................................................. 40 3-5．定时器的编号和功能[T]................................................................................................................. 42 3-6．计数器的编号和功能[C] ................................................................................................................ 44 3-7．注意事项 ......................................................................................................................................... 47
常用电气元器件统计表(丁志强)
FX1S-20MT-D/FX1S-30MTD
输入16点、输出14点
FX1N-40MT-D/FX1N-60MTD
输入24点、输出16点
FBS-32MCT-D(30/40/60)
2,175
CP1W-8ED
输入8点
900
CP1W-8ET/CP1W-16ET
8/16点晶体管(漏型)输出
900
14 PLC 输入/输出单元 OMRON
24Ｖ直流输出电源 24Ｖ直流输出电源
T-30B/A
24Ｖ直流输出电源
DR-60-24 DR-100-24 N-33HV 20A
BH-D6 2P 6A C型
C65H ICB-6A-2P
C65L-DC-C3A/1P
TFBR-102(101)
270 BH-D6 2P 6A C型/BH-D6 2P 10A C型/BH-D6 2P 16A C型
CJ1M-CPU23
输入36点、输出24点 输入10点、输出6点
2,400 2,500
DC电源型微型一体机型PLC；DC输入36点；晶体管 (漏型)输出24点；内置高速脉冲输入输出功能(各4 点)；最大可扩展3个I/O模块；存储容量 ： 10K步
小型模块化PLC；内置2轴脉冲输入输出；最大可扩 展至640点I/O；程序容量：30K步
通用电气元件(General Electrical components)
黑白显示触摸屏
2,598 2,225
65535色TFT真彩显示触摸屏 152 15
1 伺服马达/驱动器
松下
MSMD012G1C/MADHT1505 50W/100W/200W/400W
4,200
2 伺服马达/驱动器
研华支持MATLAB软件的板卡
PCI-1712
PCI-1710HG
PCI-1711 是一款功能强大的低成本多功能 PCI 数据采集卡。 PCI-1711 有 2 路模拟量输出通道， PCI-1711L 没有模拟量输出通道， 用户可以在 PCI-1711 和 PCI-1711L 之间选择能够满足实际需 要又可节约成本的数据采集卡。 PCI-1711 配套产品 PCL-10168：两端带针型接口 68 芯电缆。 PCLD-8710：接线端子板 PCI-1712 PCI-1712 具有 1MHz 的高速转换速度， 卡上带有 FIFO 缓冲器 （可存储 1K A/D 采样值和 32K D/A 转换数据）。提供 16 路单端或 8 路差分的模拟量输入（也可以单端差分混合使用），2 路 12 位 D/A 模拟量输出通道，16 路数字量输出通道，以及 3 个 10MHz 时钟的 16 位多功能计数器通 道。 PCI-1712 配套产品 PCL-10168：两端带针型接口 68 芯电缆 PCLD-8712：可导轨安装的接线端子板 PCI-1710HG PCI-1710HG PCI 总线的多功能数据采集卡。 其先进的电路设计使得它具有更高的质量和更多的 功能。这其中包含五种最常用的测量和控制功能：12 位 A/D 转换、D/A 转换、数字量输入、数 字量输出及计数器/定时器功能。 PCI-1710HG 配套产品 PCL-10168：两端带针型接口 68 芯电缆 PCLD-8710：接线端子板 Advantech 公司 DAQ 板卡（支持 MATLAB 软件）列表 产品名 总线标准 通道(单端/差分) 分辨率 PCI-1711 PCI 16/12bit PCI-1712 PCI 16/8 12bit PCI-1710HG PCI 16/8 12bit
CompactPCI+a+Specification标准
P r o p e r t y o f M o t o r o l a F orI nternalUseO nl y-Ext ernalD is tr ibutionPr ohibi te d PICMG 2.0 R3.0 CompactPCI® Specification October 1, 1999P r o p e r t y o f M o t o r o l aF o r I n t e r n a l U s e O n l y - E x t e r n a l D i s t r i b u t i o n P r o h i b i t e dP r o p e r t y o f M o t o r o l aF orI nternalUseO nl y-Ext ernalD is tr ibutionPr ohibi te dRelease Note for PICMG 2.0 Revision 3.0 CompactPCI ® Specification October 1, 1999P r o p e r t y o f M o t o r o l aF orI nternalUseO nl y-Ext ernalD is tr ibutionPr ohibi te d Purpose This Release Note records some issues raised in the course of developing and balloting PICMG 2.0 Revision 3.0, the CompactPCI core specification. 1. System Management Bus pin assignments . This specification reserves pins on J1/P1 of all slots and J2/P2 of the System Slot for definition as I 2C System Management Busses by PICMG 2.9, CompactPCI System Management Specification. These signals have been tentatively assigned by the PICMG 2.9 as indicated in Section 3.2.7.7 and in Tables 13 through 16 with their notes. The IPMB_SDA pin is an I2C data bus connecting all slots in a backplane. The IPMB_SCL pin is the clock associated with that data line, and the IPMB_PWR pin is a power pin for the IPMB node. The data and clock pins providing System Slot access to platform devices from J2/P2 were designated ICMB_SDA and ICMB_SCL in the draft specification reviewed and adopted by the Executive Membership on October 1, 1999. These signal names are misleading, implying the use of an RS-485 UART bus as specified in the Intel IPMI documents. These signals are designated SMB_SDA and SMB_SCL in the released document. A second System Management power pin, designated ICMB_PWR in the executive draft, was also reserved on J2/P2 of the System Slot. As of the approval of PICMG 2.0 Revision 3.0, the PICMG 2.9 subcommittee is in doubt as to whether this pin will actually be used for power, and is considering assigning a different function to this reserved pin. The released specification accord designates this pin as SMB_RSV. 2. System Slot Hot Swap Signals . This specification designates Pin J1/P1 D15 as a short BD_SEL# (Board Select) signal in agreement with PICMG 2.1, CompactPCI Hot Swap Specification, but only on peripheral slots. The pin is shown as a ground on System Slots. Implementers of CompactPCI boards and systems should anticipate that this signal may also be designated as BD_SEL# on System Slots in PICMG 2.13, CompactPCI Redundant System Slot Specification. J1/P1 Pin B4 is designated as the HEALTHY# signal on System and Peripheral Slots in this specification. ###P r o p e r t y o f M o t o r o l a F orI nternalUseO nl y-Ext ernalD is tr ibutionPr ohibi te d PICMG 2.0 R3.0CompactPCI® SpecificationOctober 1, 1999P r o p e r t y o f M o t o r o l aF orI nternalUseO nl y-Ext ernalD is tr ibutionPr ohibi te d PICMG 2.0 R3.0 10/1/99ii ©Copyright 1995, 1996, 1997, 1998, 1999 PCI Industrial Computers Manufacturers Group (PICMG).The attention of adopters is directed to the possibility that compliance with or adoption of PICMG ® specifications may require use of an invention covered by patent rights.PICMG ® shall not be responsible for identifying patents for which a license may be required by any PICMG ® specification, or for conducting legal inquiries into the legal validity or scope of those patents that are brought to its attention. PICMG ® specifications are prospective and advisory only. Prospective users are responsible for protecting themselves against liability for infringement of patents.NOTICE:The information contained in this document is subject to change without notice. The material in this document details a PICMG ® specification in accordance with the license and notices set forth on this page. This document does not represent a commitment to implement any portion of this specification in any company's products.WHILE THE INFORMATION IN THIS PUBLICATION IS BELIEVED TO BE ACCURATE, PICMG ® MAKES NO WARRANTY OF ANY KIND, EXPRESS OR IMPLIED, WITH REGARD TO THIS MATERIAL INCLUDING, BUT NOT LIMITED TO ANY WARRANTY OF TITLE OR OWNERSHIP, IMPLIED WARRANTY OF MERCHANTABILITY OR WARRANTY OF FITNESS FOR PARTICULAR PURPOSE OR USE.In no event shall PICMG ® be liable for errors contained herein or for indirect, incidental,special, consequential, reliance or cover damages, including loss of profits, revenue, data or use, incurred by any user or any third pliance with this specification does not absolve manufacturers of CompactPCI equipment, from the requirements of safety and regulatory agencies (UL, CSA, FCC,IEC, etc.).PICMG ®, CompactPCI ®, and the PICMG ® and CompactPCI ® logos are registered trademarks of the PCI Industrial Computers Manufacturers Group.All other brand or product names may be trademarks or registered trademarks of their respective holders.P r o p e r t y o f M o t o r o l aF orI nternalUseO nl y-Ext ernalD is tr ibutionPr ohibi te d CompactPCI ® Core Specification PICMG 2.0 R3.0 10/1/99iii Contents1OVERVIEW.........................................................................................................................................91.1C OMPACT PCI O BJECTIVES ................................................................................................................91.2B ACKGROUND AND T ERMINOLOGY ....................................................................................................91.3D ESIRED A UDIENCE ...........................................................................................................................91.4C OMPACT PCI F EATURES .................................................................................................................101.5A PPLICABLE D OCUMENTS ................................................................................................................101.6A DMINISTRATION .............................................................................................................................111.7N AME A ND L OGO U SAGE .................................................................................................................112FEATURE SET..................................................................................................................................132.1F ORM F ACTOR .................................................................................................................................132.2C ONNECTOR .....................................................................................................................................152.3M ODULARITY ...................................................................................................................................162.4H OT S WAP C APABILITY ....................................................................................................................163ELECTRICAL REQUIREMENTS..................................................................................................173.1B OARD D ESIGN R ULES .....................................................................................................................173.1.1Decoupling Requirements......................................................................................................173.1.2CompactPCI Signal Additions...............................................................................................183.1.3CompactPCI Stub Termination..............................................................................................183.1.4Peripheral Board Signal Stub Length ...................................................................................183.1.5Characteristic Impedance......................................................................................................193.1.6System Slot Board Signal Stub Length ..................................................................................193.1.7Peripheral Board PCI Clock Signal Length..........................................................................193.1.8Pull-Up Location...................................................................................................................193.1.9Board Connector Shield Requirements.................................................................................203.2B ACKPLANE D ESIGN R ULES .............................................................................................................213.2.1Characteristic Impedance......................................................................................................213.2.2Eight-Slot Backplane Termination........................................................................................213.2.3Signaling Environment..........................................................................................................223.2.4IDSEL Assignment.................................................................................................................223.2.5REQ#/GNT# Assignment.......................................................................................................233.2.6PCI Interrupt Binding............................................................................................................243.2.7CompactPCI Signal Additions...............................................................................................253.2.8Power Distribution................................................................................................................283.2.9Power Decoupling.................................................................................................................293.2.10Healthy (Healthy#)................................................................................................................303.333 MH Z PCI C LOCK D ISTRIBUTION .................................................................................................303.3.1Backplane Clock Routing Design Rules................................................................................313.3.2System Slot Board Clock Routing Design Rules....................................................................313.464-B IT D ESIGN R ULES ......................................................................................................................313.566 MH Z E LECTRICAL R EQUIREMENTS .............................................................................................333.5.166 MHz Board Design Rules.................................................................................................333.5.266 MHz System Board Design Rules.....................................................................................343.5.366MHz Backplane Design Rules...........................................................................................343.5.466MHz PCI Clock Distribution.............................................................................................343.5.566 MHz System Slot Board Clock Routing Design Rules (35)3.5.666 MHz Hot Swap (35)3.6S YSTEM AND B OARD G ROUNDING (36)3.6.1Board Front Panel Grounding Requirements (36)3.6.2Backplane Grounding Requirements (36)3.7C OMPACT PCI B UFFER M ODELS (36)P r o p e r t y o f M o t o r o l aF orI nternalUseO nl y-Ext ernalD is tr ibutionPr ohibi te d PICMG 2.0 R3.0 10/1/99iv 4MECHANICAL REQUIREMENTS................................................................................................374.1B OARD R EQUIREMENTS ...................................................................................................................374.1.13U Boards..............................................................................................................................374.1.26U Boards..............................................................................................................................374.1.3Rear-panel I/O Boards..........................................................................................................374.1.4ESD Discharge Strip.............................................................................................................384.1.5ESD Clip................................................................................................................................384.1.6Cross Sectional View.............................................................................................................394.1.7Component Outline and Warpage.........................................................................................394.1.8Solder Side Cover..................................................................................................................394.1.9Front Panels..........................................................................................................................484.1.10System Slot Identification......................................................................................................494.2R EAR -P ANEL I/O B OARD R EQUIREMENTS .......................................................................................524.2.1Mechanicals...........................................................................................................................524.2.2Power.....................................................................................................................................524.2.3Rear Panel Keying.................................................................................................................534.3B ACKPLANE R EQUIREMENTS ...........................................................................................................534.3.1Connector Orientation...........................................................................................................534.3.2Slot Spacing...........................................................................................................................534.3.3Slot Designation....................................................................................................................544.3.4Bus Segments.........................................................................................................................544.3.5Backplane Dimensions..........................................................................................................545CONNECTOR IMPLEMENTATION.............................................................................................585.1O VERVIEW .......................................................................................................................................585.1.1Location.................................................................................................................................585.1.2Housing Types.......................................................................................................................595.1.3Connector Tail Lengths.........................................................................................................595.1.4Backplane / Board Population Options.................................................................................595.2J1 (32-B IT PCI S IGNALS ).................................................................................................................595.3J2 C ONNECTOR ................................................................................................................................605.3.1Peripheral Slot 64-Bit PCI....................................................................................................605.3.2Peripheral Slot Rear-Panel I/O.............................................................................................605.3.3System Slot 64-bit PCI...........................................................................................................605.3.4System Slot Rear-Panel I/O...................................................................................................605.4B USSED R ESERVED P INS ..................................................................................................................605.5N ON -B USSED R ESERVED P INS .........................................................................................................605.6P OWER P INS .....................................................................................................................................605.75V/3.3V PCI K EYING ......................................................................................................................615.8P IN A SSIGNMENTS PACTPCI BUFFER MODELS...............................................................................................69B.CONNECTOR IMPLEMENTATION.............................................................................................73B.1G ENERAL .........................................................................................................................................73B.2C ONNECTORS ...................................................................................................................................73B.3A LIGNMENT .....................................................................................................................................73B.3.1Front Plug-In Board Alignment............................................................................................73B.3.2Rear Panel I/O Board Alignment..........................................................................................74B.3.3Backward Compatibility for Rear Panel I/O Boards. (74)P r o p e r t y o f M o t o r o l aF orI nternalUseO nl y-Ext ernalD is tr ibutionPr ohibi te d CompactPCI ® Core Specification PICMG 2.0 R3.0 10/1/99v TablesT ABLE 1. C ODING K EY C OLOR A SSIGNMENTS ..............................................................................................15T ABLE 2. B OARD D ECOUPLING R EQUIREMENTS ...........................................................................................17T ABLE 3. S TUB T ERMINATION R ESISTOR ......................................................................................................18T ABLE 4. B OARD C HARACTERISTICS .............................................................................................................19T ABLE 5. P ULL -UP R ESISTOR V ALUES ...........................................................................................................20T ABLE 6. B ACKPLANE C HARACTERISTICS .....................................................................................................21T ABLE 7. S YSTEM TO L OGICAL S LOT S IGNAL A SSIGNMENTS ........................................................................23T ABLE 8. S YSTEM TO L OGICAL S LOT I NTERRUPT A SSIGNMENTS ..................................................................24T ABLE 9. P HYSICAL S LOT A DDRESSES ..........................................................................................................27T ABLE 10. P OWER S PECIFICATIONS ...............................................................................................................28T ABLE 11. B ACKPLANE D ECOUPLING R ECOMMENDATIONS ..........................................................................30T ABLE 12. C ODING K EY C OLOR A SSIGNMENTS AND P ART N UMBERS ...........................................................61T ABLE 13. C OMPACT PCI P ERIPHERAL S LOT 64-B IT C ONNECTOR P IN A SSIGNMENTS ...................................62T ABLE 14 C OMPACT PCI P ERIPHERAL S LOT R EAR -P ANEL I/O C ONNECTOR P IN A SSIGNMENTS ....................63T ABLE 15. C OMPACT PCI S YSTEM S LOT 64-BIT C ONNECTOR P IN A SSIGNMENT .............................................64T ABLE 16. C OMPACT PCI S YSTEM S LOT R EAR -P ANEL I/O C ONNECTOR P IN A SSIGNMENTS ..........................65T ABLE 17. R EVISION H ISTORY . (67)P r o p e r t y o f M o t o r o l a F o r I n t e r n a l U s e O n l y - E x t e r n a l D i s t r i b u t i o n P r o h i b i t e d PICMG 2.0 R3.0 10/1/99vi This page is left intentionally blank.P r o p e r t y o f M o t o r o l aF orI nternalUseO nl y-Ext ernalD is tr ibutionPr ohibi te d CompactPCI ® Core Specification PICMG 2.0 R3.0 10/1/99vii IllustrationsF IGURE 1. 3U 64-B IT C OMPACT PCI F ORM F ACTOR ......................................................................................13F IGURE 2. 3U C OMPACT PCI B ACKPLANE E XAMPLE .....................................................................................14F IGURE 3. PCI S IGNAL T ERMINATION ...........................................................................................................22F IGURE 4. L OCAL 64 B IT I NITIALIZATION ......................................................................................................33F IGURE 5. ESD C LIP L OCATION ....................................................................................................................39F IGURE 6. 3U B OARD ....................................................................................................................................40F IGURE 7. 6U B OARD ....................................................................................................................................41F IGURE 8. F RONT S IDE B OARD ESD D IMENSIONS .........................................................................................42F IGURE 9. 3U R EAR -P ANEL I/O B OARD D IMENSIONS ...................................................................................43F IGURE 10. 6U R EAR P ANEL I/O B OARD D IMENSIONS ..................................................................................44F IGURE 11. R EAR P ANEL I/O ESD D IMENSIONS ...........................................................................................45F IGURE 12. C ROSS S ECTIONAL B OARD , C ONNECTOR , B ACKPLANE AND F RONT P ANEL V IEW ......................46F IGURE 13. C OMPONENT O UTLINE ................................................................................................................47F IGURE 15. C OMPACT PCI C OMPATIBILITY G LYPHS ......................................................................................48F IGURE 16. C OMPACT PCI L OGO ...................................................................................................................48F IGURE 17. 3U EMC F RONT P ANEL ..............................................................................................................50F IGURE 18. 6U EMC F RONT P ANEL ..............................................................................................................51F IGURE 19. 3U B ACKPLANE E XAMPLE - F RONT V IEW ..................................................................................53F IGURE 20. 3U B ACKPLANE D IMENSIONS .....................................................................................................56F IGURE 21. 6U B ACKPLANE D IMENSIONS .....................................................................................................57F IGURE 22. 3U C ONNECTOR I MPLEMENTATION ............................................................................................58F IGURE 23. 6U C ONNECTOR I MPLEMENTATION ............................................................................................58F IGURE 24. 5V S TRONG PCI M ODEL ............................................................................................................69F IGURE 25. 5V W EAK PCI M ODEL ...............................................................................................................70F IGURE 26. 3.3V S TRONG PCI M ODEL .........................................................................................................70F IGURE 27. 3.3V W EAK PCI M ODEL (71)P r o p e r t y o f M o t o r o l aF orI nternalUseO nl y-Ext ernalD is tr ibutionPr ohibi te d PICMG 2.0 R3.0 10/1/99viii This page is left intentionally blank.P r o p e r t y o f M o t o r o l aF orI nternalUseO nl y-Ext ernalD is tr ibutionPr ohibi te d 1. Overview CompactPCI ® Core Specification PICMG 2.0 R3.0 10/1/99Page 9 of 741 Overview 1.1 CompactPCI Objectives CompactPCI is an adaptation of the Peripheral Component Interconnect (PCI)Specification 2.1 or later for industrial and/or embedded applications requiring a more robust mechanical form factor than desktop PCI. CompactPCI uses industry standard mechanical components and high performance connector technologies to provide an optimized system intended for rugged applications. CompactPCI provides a system that is electrically compatible with the PCI Specification, allowing low cost PCI components to be utilized in a mechanical form factor suited for rugged pactPCI is an open specification supported by the PICMG (PCI Industrial Co m-puter Manufacturers Group), which is a consortium of companies involved in utiliz-ing PCI for embedded applications. PICMG controls this specification.1.2 Background and Terminology Eurocard - A series of mechanical board form factor sizes for rack-based systems as used in VME, Multibus II, and other applications defined by the Institute of Electri-cal and Electronics Engineers (IEEE) and International Electrotechnical Committee (IEC).ISA - Industry Standard Architecture. A specification by which Personal Com puters (PCs) add boards.PCI - Peripheral Component Interconnect. A specification for defining a common in-terconnect between logic components. Typically used for interconnecting high-speed,PC-compatible chipset components. The PCI specification is issued through the PCI Special Interest Group (PCI SIG).This specification utilizes several key words, which are defined below:may : A key word indicating flexibility of choice with no implied preference.shall : A key word indicating a mandatory requirement. Designers shall im-plement such mandatory requirements to ensure interchangeability and to claim conformance with the specification.should: A key word indicating flexibility of choice with a strongly preferred implementation.1.3 Desired AudienceCompactPCI exists to provide a standard form factor for those applications requiring the high performance of PCI as well as the small size and ruggedness of a rack mount system. CompactPCI provides a mechanism for OEM and end users to di-rectly apply PCI components and technology to a new mechanical form factor while。
MU70-SU0 LGA2011插座R3主板 用户手册说明书
2-3-6-1 IOAT 配置...................................................................................................84
-3-
第3章
2-3-2-3 CPU T State Control（CPU T 状态控制）............................................73
2-3-3 Common RefCode Configuration（通用 RefCode 配置）..............74
2-3-5-1 内存拓扑.....................................................................................................79
2-3-5-2 内存热效应................................................................................................80
目录
包装箱物品...........................................................................................................5 MU70-SU0 主板布局..........................................................................................6 框图.......................................................................................................................9 第 1 章 硬件安装.............................................................................................10
PCI-1712 1712L 快速说明书
PCI-1712/1712L快速安装使用手册PCI-1712/1712L快速安装使用手册 (1)第一章 产品介绍 (2)1.1 概述 (2)1.1.1 PCI总线传输 (2)1.1.2 即插即用功能 (2)1.1.3 自动通道/增益/SD*/BU*扫描 (2)1.1.4 卡上FIFO(先入先出)存储器 (2)1.1.5 卡上可编程多功能计数器/定时器 (3)1.1.6 灵活的触发模式和定时能力 (3)1.1.7 连续的模拟量输出（仅PCI-1712） (3)1.2 特点： (3)第二章 安装与测试 (4)2.1 初始检查 (4)2.2 Windows2K/XP/9X下板卡的安装 (4)2.2.1 软件的安装： (4)2.2.2 硬件的安装： (6)2.3 测试 (11)2.3.1 模拟输入功能测试 (12)2.3.2 模拟输出功能测试 (12)2.3.3 数字量输入功能测试 (13)2.3.4 数字量输出功能测试 (14)2.4.5 计数器功能测试 (15)第三章 信号连接 (16)3.1 模拟信号输入连接： (17)3.1.1 单端模拟输入连接 (17)3.1.2 差分式模拟输入连接 (18)3.2模拟信号输出连接 (19)第四章 例程使用详解 (20)4.1 板卡支持例程列表 (21)4.2 常用例子使用说明 (21)4.2.1 ADSOFT/ADTRIG（软件触发方式例程） (21)4.2.2 DIGOUT（数字量输出）： (21)4.2.3 COUNTER（计数程序） (23)4.2.4 Digin (数字量输入例程) (24)4.2.5 PULSE(脉冲输出例程) (24)4.2.6 Pwmin(输入脉冲宽度测量) (25)第五章 遇到问题，如何解决？ (21)第一章产品介绍1.1 概述PCI-1712/1712L是一款功能强大的高速多功能PCI总线数据采集卡。
它有1M转换速度的12位A/D转换器，卡上带有FIFO缓冲器（可存储1K A/D采样值和32K D/A转换数据）。
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安全性須知.................................................................................................................................. viii 電氣方面的安全性......................................................................................................... viii 操作方面的安全性......................................................................................................... viii 華碩 REACH................................................................................................................... viii
Intel CPU型号规格大全
格大全Intel CPU型号规格大全规格术语Processor Number: 处理器号Architecture: 架构(制造工艺)Cache: 高速缓存Clock Speed: 时钟速度Power: 功耗Front Side Bus: 前端总线Intel(R)VT±: 英特尔虚拟化技术Intel(R) 64Φ: 英特尔64位技术Quad-core: 四核Dual-core: 双核Enhanced Intel SpeedStep(R) Technology: 增强的英特尔加速技术Execute Disable Bit: 执行取消位HT Technology: 超线程技术nm: 纳米HZ: 赫兹G: 吉, 频率为10^9M: 兆, 频率为10^6, CACHE为2^20K: 千, 频率为10^3, CACHE为2^10B: 字节W: 瓦UP: 单核DP: 双核QP: 四核L3: 三级缓存L2: 二级缓存X: 具备该特性0: 不具备该特性1. 至强系列All Intel(R) Xeon(R) processors feature:Intel(R) Virtualization Technology±Intel(R) Extended Memory 64 TechnologyΦ格大全Execute Disable Bit°Intel Xeon 至强所有至强处理器都支持虚拟化技术, 64位和执行取消位Processor NumberArchitectureCacheClock SpeedFront Side BusPowerSystem TypeQuad-CoreDual-CoreHT Technology3070 65 nm 4 MB L2 2.66 GHz 1066 MHz 65W UP 0 X 03060 65 nm 4 MB L2 2.40 GHz 1066 MHz 65W UP 0 X 03050 65 nm 2 MB L2 2.13 GHz 1066 MHz 65W UP 0 X 03040 65 nm 2 MB L2 1.86 GHz 1066 MHz 65W UP 0 X 0X3230 65 nm 8 MB L2 2.66 GHz 1066 MHz 95W UP X 0 0X3220 65 nm 8 MB L2 2.40 GHz 1066 MHz 105W UP X 0 0X3210 65 nm 8 MB L2 2.13 GHz 1066 MHz 105W UP X 0 07150N 65 nm 16 MB L3 2x1 MB L2 3.50 GHz 667 MHz 150W MP 0 X X7140M 65 nm 16 MB L3 2x1 MB L2 3.40 GHz 800 MHz 150W MP 0 X X7140N 65 nm 16 MB L3 2x1 MB L2 3.33 GHz 667 MHz 150W MP 0 X X7130M 65 nm 8 MB L3 2x1 MB L2 3.20 GHz 800 MHz 150W MP 0 X X7130N 65 nm 8 MB L3 2x1 MB L2 3.16 GHz 667 MHz 150W MP 0 X X7120M 65 nm 4 MB L3 2x1 MB L2 3.00 GHz 800 MHz 95W MP 0 X X7120N 65 nm 4 MB L3 2x1 MB L2 3.00 GHz 667 MHz 95W MP 0 X X7110M 65 nm 4 MB L3 2x1 MB L2 2.60 GHz 800 MHz 95W MP 0 X X7110N 65 nm 4 MB L3 2x1 MB L2 2.50 GHz 667 MHz 95W MP 0 X X7041 90 nm 2x2 MB 3.00 GHz 800 MHz N/A MP 0 X X7040 90 nm 2x2 MB 3.00 GHz 667 MHz N/A MP 0 X X7030 90 nm 2x1 MB 2.80 GHz 800 MHz N/A MP 0 X X7020 90 nm 2x1 MB 2.66 GHz 667 MHz N/A MP 0 X X格大全X5355 65 nm 8 MB L2 2.66 GHz 1333 MHz 120W DP X 0 0L5320 65 nm 8 MB L2 1.86 GHz 1066 MHz 50W DP X 0 0L5310 65 nm 8 MB L2 1.60 GHz 1066 MHz 50W DP X 0 0E5345 65 nm 8 MB L2 2.33 GHz 1333 MHz 80W DP X 0 0E5335 65 nm 8 MB L2 2.00 GHz 1333 MHz 80W DP X 0 0E5320 65 nm 8 MB L2 1.86 GHz 1066 MHz 80W DP X 0 0E5310 65 nm 8 MB L2 1.60 GHz 1066 MHz 80W DP X 0 05160 65 nm 4 MB 3.00 GHz 1333 MHz 80W DP 0 X 05150 65 nm 4 MB 2.66 GHz 1333 MHz 65W DP 0 X 05148LV 65 nm 4 MB 2.33 GHz 1333 MHz 40W DP 0 X 05140 65 nm 4 MB 2.33 GHz 1333 MHz 65W DP 0 X 05130 65 nm 4 MB 2.00 GHz 1333 MHz 65W DP 0 X 05120 65 nm 4 MB 1.86 GHz 1066 MHz 65W DP 0 X 05110 65 nm 4 MB 1.60 GHz 1066 MHz 65W DP 0 X 05080 65 nm 2x2 MB 3.73 GHz 1066 MHz 130W DP 0 X X5063 65 nm 2x2 MB 3.20 GHz 1066 MHz 95W DP 0 X X5060 65 nm 2x2 MB 3.20 GHz 1066 MHz 130W DP 0 X X5050 65 nm 2x2 MB 3.00 GHz 667 MHz 95W DP 0 X X5030 65 nm 2x2 MB 2.67 GHz 667 MHz 95W DP 0 X X2. 酷睿2系列2.1 Extreme系列Intel(R) Core(TM) 2 Extreme processorProcessor NumberArchitectureCacheClock SpeedFront Side BusQuad-coreDual-coreIntel(R)VT±Enhanced Intel SpeedStep(R) TechnologyIntel(R) 64ΦExecute Disable Bit°格大全QX6850 65 nm 8MB L3 3.00 GHz 1333 MHz X 0 X X X XQX6800 65 nm 8MB L2 2.93 GHz 1066 MHz X 0 X X X XQX6700 65 nm 8MB L2 2.66 GHz 1066 MHz X 0 X X X XX7800 65 nm 4MB L2 2.60 GHz 800 MHz 0 X X X X XX6800 65 nm 4MB L2 2.93 GHz 1066 MHz 0 X X X X X2.2 桌面4核Intel(R) Core(TM)2 Quad processorProcessor NumberArchitectureCacheClock SpeedFront Side BusQuad-coreIntel(R) VT±Enhanced Intel SpeedStep(R)TechnologyIntel(R) 64ΦExecute Disable Bit°Q6700 65 nm 8MB L21 2.66 GHz 1066 MHz X X X X XQ6600 65 nm 8MB L21 2.40 GHz 1066 MHz X X X X X2.3 桌面双核Intel(R) Core(TM)2 Duo processorProcessor NumberArchitectureCacheClock SpeedFront Side BusDual-coreIntel(R) Virtualization Technology(Intel(R) VT)±Enhanced Intel SpeedStep(R) TechnologyIn tel(R) 64ΦExecute Disable Bit°格大全E6850 65 nm 4MB L2 3.00 GHz 1333 MHz X X X X XE6750 65 nm 4MB L2 2.66 GHz 1333 MHz X X X X XE6700 65 nm 4MB L2 2.66 GHz 1066 MHz X X X X XE6600 65 nm 4MB L2 2.40 GHz 1066 MHz X X X X XE6550 65 nm 4MB L2 2.33 GHz 1333 MHz X X X X XE6540 65 nm 4MB L2 2.33 GHz 1333 MHz X X X X XE6420 65 nm 4MB L2 2.13 GHz 1066 MHz X X X X XE6400 65 nm 2MB L2 2.13 GHz 1066 MHz X X X X XE6320 65 nm 4MB L2 1.86 GHz 1066 MHz X X X X XE6300 65 nm 2MB L2 1.86 GHz 1066 MHz X X X X XE4500 65 nm 2MB L2 2.29 GHz 800 MHz X 0 X X XE4400 65 nm 2MB L2 2.00 GHz 800 MHz X 0 X X XE4300 65 nm 2MB L2 1.80 GHz 800 MHz X 0 X X X2.4 笔记本双核Processor NumberArchitectureCacheClock SpeedFront Side BusDual-coreIntel(R) Virtualization Technology(Intel(R) VT)±Enhanced Intel SpeedStep(R) TechnologyIntel(R) 64ΦExecute Disable Bit°T7700 65 nm 4MB L2 2.40 GHz 800 MHz X X X X XT7600 65 nm 4MB L2 2.33 GHz 667 MHz X X X X XT7500 65 nm 4MB L2 2.20 GHz 800 MHz X X X X XT7400 65 nm 4MB L2 2.16 GHz 667 MHz X X X X XT7300 65 nm 4MB L2 2.00 GHz 800 MHz X X X X XT7200 65 nm 4MB L2 2.00 GHz 667 MHz X X X X XT7100 65 nm 2MB L2 1.80 GHz 800 MHz X X X X XT5600 65 nm 2MB L2 1.83 GHz 667 MHz X X X X XT5500 65 nm 2MB L2 1.66 GHz 667 MHz X 0 X X X格大全T5470 65 nm 2MB L2 1.60 GHz 800 MHz X 0 X X XT5450 65 nm 2MB L2 1.66 GHz 667 MHz X 0 X X XT5250 65 nm 2MB L2 1.50 GHz 667 MHz X 0 X X XT5300 65 nm 2MB L2 1.73 GHz 533 MHz X 0 X X XT5200 65 nm 2MB L2 1.60 GHz 533 MHz X 0 X X X2.5 笔记本双核低压版Intel(R) Core2 Duo Low VoltageProcessor NumberArchitectureCacheClock SpeedFront Side BusDual-coreIntel(R) Virtualization Technology(Intel(R) VT)±Enhanced Intel SpeedStep(R) TechnologyIntel(R) 64ΦExecute Disable Bit°L7500 65 nm 4MB L2 1.60 GHz 800 MHz X X X X XL7400 65 nm 4MB L2 1.50 GHz 667 MHz X X X X XL7300 65 nm 4MB L2 1.40 GHz 800 MHz X X X X XL7200 65 nm 4MB L2 1.33 GHz 667 MHz X X X X X2.6 笔记本双核超低压版Intel(R) Core(TM)2 Duo Ultra Low VoltageProcessor NumberArchitectureCacheClock SpeedFront Side BusDual-coreIntel(R) Virtualization Technology(Intel(R) VT)±Enhanced Intel SpeedStep(R) Technology格大全Intel(R)64ΦExecute Disable Bit°U7600 65 nm 2MB L2 1.20 GHz 533 MHz X X X X XU7500 65 nm 2MB L2 1.06 GHz 533 MHz X X X X X3. 酷睿1系列3.1 笔记本酷睿双核Intel(R) Core(TM) Duo processorProcessor NumberArchitectureCacheClockSpeedFront Side BusPowerDual-coreIntel(R)VT± Enhanced Intel SpeedStep(R) TechnologyExecute Disable Bit°T2700 65 nm 2 MB L2 2.33 GHz 667 MHz 31W X X X 0T2600 65 nm 2 MB L2 2.16 GHz 667 MHz 31W X X X XT2500 65 nm 2 MB L2 2.00 GHz 667 MHz 31W X X X XT2450 65 nm 2 MB L2 2.00 GHz 533 MHz 31W X 0 X XT2400 65 nm 2 MB L2 1.83 GHz 667 MHz 31W X X X XT2350 65 nm 2 MB L2 1.86 GHz 533 MHz 31W X 0 X XT2300 65 nm 2 MB L2 1.66 GHz 667 MHz 31W X X X XT2250 65 nm 2 MB L2 1.73 GHz 533 MHz 31W X 0 X XT2050 65 nm 2 MB L2 1.60 GHz 533 MHz 31W X 0 X XT2300E 65 nm 2 MB L2 1.66 GHz 667 MHz 31W X 0 X X3.2 笔记本酷睿双核低压版Intel(R) Core(TM) Duo processor Low VoltageProcessor NumberArchitecture格大全CacheClockSpeedFront Side BusPowerDual-coreIntel(R)VT±Enhanced Intel SpeedStep(R) TechnologyExecute Disable Bit°L2500 65 nm 2MB L2 1.83 GHz 667 MHz 15W X X X XL2400 65 nm 2MB L2 1.66 GHz 667 MHz 15W X X X XL2300 65 nm 2MB L2 1.50 GHz 667 MHz 15W X X X X3.3 笔记本酷睿双核超低压版Intel(R) Core(TM) Duo processor Ultra Low VoltageProcessor NumberArchitectureCacheClockSpeedFront Side BusPowerDual-coreIntel(R)VT± Enhanced Intel SpeedStep(R) TechnologyExecute Disable Bit°U2500 65 nm 2MB L2 1.20 GHz 533 MHz 9W X X X XU2400 65 nm 2MB L2 1.06 GHz 533 MHz 9W X X X X3.4 酷睿单核Intel(R) Core(TM) Solo processorProcessor NumberArchitecture格大全CacheClock SpeedFront Side BusPowerEnhanced Intel SpeedStep(R) TechnologyExecute Disable BitT1400 65 nm 2 MB L2 1.83 GHz 667 MHz 27W X XT1300 65 nm 2 MB L2 1.66 GHz 667 MHz 27W X X3.5 酷睿单核超低压版Intel(R) Core(TM) Solo processor Ultra Low VoltageProcessor NumberArchitectureCacheClock SpeedFront Side BusPowerIntel(R) VT±Enhanced Intel SpeedStep(R) TechnologyExecute Disable BitU1500 65 nm 2 MB L2 1.33 GHz 533 MHz 5.5W X X XU1400 65 nm 2 MB L2 1.20 GHz 533 MHz 5.5W X X XU1300 65 nm 2 MB L2 1.06 GHz 533 MHz 5.5W X X X4. 奔腾系列4.1 笔记本奔腾双核Intel(R) Pentium(TM) dual-core processorProcessor NumberArchitectureCacheClock SpeedFront Side BusDual-coreEnhanced Intel SpeedStep(R) Technology?格大全Execute Disable Bit°Intel(R) 64ΦE2160 65 nm 1MB L2 1.80 GHz 800 MHz X X X XE2140 65 nm 1MB L2 1.60 GHz 800 MHz X X X XT2130 65 nm 1MB L2 1.86 GHz 533 MHz X X X 0T2080 65 nm 1MB L2 1.73 GHz 533 MHz X X X 0T2060 65 nm 1MB L2 1.60 GHz 533 MHz X X X 04.2 笔记本奔腾移动版FeaturingIntel(R) Pentium(TM) M processorProcessor NumberArchitectureCacheClock SpeedFront Side BusEnhanced Intel SpeedStep(R) TechnologyExecute Disable Bit°780 90 nm 2 MB L2 2.26 GHz 533 MHz X X770 90 nm 2 MB L2 2.13 GHz 533 MHz X X765 90 nm 2 MB L2 2.10 GHz 400 MHz X 0760 90 nm 2 MB L2 2.00 GHz 533 MHz X X755 90 nm 2 MB L2 2.00 GHz 400 MHz X 0750 90 nm 2 MB L2 1.86 GHz 533 MHz X X745 90 nm 2 MB L2 1.80 GHz 400 MHz X 0740 90 nm 2 MB L2 1.73 GHz 533 MHz X X735 90 nm 2 MB L2 1.70 GHz 400 MHz X 0730 90 nm 2 MB L2 1.60 GHz 533 MHz X X725 90 nm 2 MB L2 1.60 GHz 400 MHz X 0715 90 nm 2 MB L2 1.50 GHz 400 MHz X 0705 130 nm 1 MB L2 1.50 GHz 400 MHz X 04.3 笔记本奔腾移动低压版Intel(R) Pentium(TM) M processor Low Voltage格大全Processor NumberArchitectureCacheClock SpeedFront Side BusEnhanced Intel SpeedStep(R) TechnologyExecute Disable Bit°778 90 nm 2MB L2 1.60 GHz 400 MHz X X758 90 nm 2MB L2 1.50 GHz 400 MHz X X738 90 nm 2MB L2 1.40 GHz 400 MHz X 0718 130 nm 1MB L2 1.30 GHz 400 MHz X 04.4 笔记本奔腾移动超低压版Intel(R) Pentium(TM) M processor Ultra Low VoltageProcessor NumberArchitectureCacheClock SpeedFront Side BusEnhanced Intel SpeedStep(R) TechnologyExecute Disable Bit°773 90 nm 2MB L2 1.30 GHz 400 MHz X X753 90 nm 2MB L2 1.20 GHz 400 MHz X X733J 90 nm 2MB L2 1.10 GHz 400 MHz X X733 90 nm 2MB L2 1.10 GHz 400 MHz X 0723 90 nm 2MB L2 1.00 GHz 400 MHz X 0713 130 nm 1MB L2 1.10 GHz 400 MHz X 04.5 奔腾Extreme版Intel(R) Pentium(TM) processor Extreme EditionProcessor NumberArchitectureCache格大全Clock SpeedFront Side BusDual-coreIntel(R)VT±HT Technology?Intel(R)64ΦExecute Disable Bit°965 65 nm 2x2 MB L2 3.73 GHz 1066 MHz X X X X X955 65 nm 2x2 MB L2 3.46 GHz 1066 MHz X X X X X840 90 nm 2x1 MB L2 3.20 GHz 800 MHz X 0 X X X4.6 奔腾双核Intel(R) Pentium(TM) D processorProcessor NumberArchitectureCacheClock SpeedFront Side BusDual-coreIntel(R)VT±Enhanced Intel SpeedStep(R)Technology?Intel(R) 64ΦExecute Disable Bit°960 65-nm technology 2x2 MB L2 3.60 GHz 800 MHz X X X X X950 65-nm technology 2x2 MB L2 3.40 GHz 800 MHz X X X X X945 65-nm technology 2x2 MB L2 3.40 GHz 800 MHz X 0 X X X940 65-nm technology 2x2 MB L2 3.20 GHz 800 MHz X X X X X935 65-nm technology 2x2 MB L2 3.20 GHz 800 MHz X 0 X X X930 65-nm technology 2x2 MB L2 3.00 GHz 800 MHz X X X X X925 65-nm technology 2x2 MB L2 3.00 GHz 800 MHz X 0 X X X920 65-nm technology 2x2 MB L2 2.80 GHz 800 MHz X X X X X915 65-nm technology 2x2 MB L2 2.80 GHz 800 MHz X 0 X X X840 90-nm technology 2x1 MB L2 3.20 GHz 800 MHz X 0 X X X格大全830 90-nm technology 2x1 MB L2 3.00 GHz 800 MHz X 0 X X X820 90-nm technology 2x1 MB L2 2.80 GHz 800 MHz X 0 0 X X805 90-nm technology 2x1 MB L2 2.66 GHz 533 MHz X 0 0 X X4.7 带超线程的奔腾4Intel(R) Pentium(TM) 4 processor HTProcessor NumberArchitectureCacheClock SpeedFront Side BusHT Technology?Enhanced Intel SpeedStep(R) Technology?Intel(R) 64ΦExecute Disable Bit°670 90 nm 2 MB L2 3.80 GHz 800 MHz X X X X661 65 nm 2 MB L2 3.60 GHz 800 MHz X X X X660 90 nm 2 MB L2 3.60 GHz 800 MHz X X X X651 65 nm 2 MB L2 3.40 GHz 800 MHz X X X X650 90 nm 2 MB L2 3.40 GHz 800 MHz X X X X641 65 nm 2 MB L2 3.20 GHz 800 MHz X X X X640 90 nm 2 MB L2 3.20 GHz 800 MHz X X X X631 65 nm 2 MB L2 3.00 GHz 800 MHz X X X X630 90 nm 2 MB L2 3.00 GHz 800 MHz X X X X551 90 nm 1 MB L2 3.40 GHz 800 MHz X 0 X X541 90 nm 1 MB L2 3.20 GHz 800 MHz X 0 X X531 90 nm 1 MB L2 3.00 GHz 800 MHz X 0 X X524 90 nm 1 MB L2 3.06 GHz 533 MHz X 0 X X521 90 nm 1 MB L2 2.80 GHz 800 MHz X 0 X X4.8 奔腾4Mobile Intel(R) Pentium(TM) 4 processorProcessor Number格大全ArchitectureCacheClock SpeedFront Side BusHT technologyEnhanced Intel SpeedStep(R) Technology552 90 nm 1 MB L2 3.46 GHz 533 MHz X X548 90 nm 1 MB L2 3.33 GHz 533 MHz X X538 90 nm 1 MB L2 3.20 GHz 533 MHz X X532 90 nm 1 MB L2 3.06 GHz 533 MHz X X518 90 nm 1 MB L2 2.80 GHz 533 MHz X X5. 赛扬系列5.1 笔记本赛扬MIntel(R) Celeron(TM) M processorProcessor NumberArchitectureCacheClock SpeedFront Side BusIntel(R) 64ΦExecute Disable Bit°530 65 nm 1 MB L2 1.73 GHz 533 MHz X X520 65 nm 1 MB L2 1.60 GHz 533 MHz X X450 65 nm 1 MB L2 2.00 GHz 533 MHz 0 X440 65 nm 1 MB L2 1.86 GHz 533 MHz 0 X430 65 nm 1 MB L2 1.73 GHz 533 MHz 0 X420 65 nm 1 MB L2 1.60 GHz 533 MHz 0 X410 65 nm 1 MB L2 1.46 GHz 533 MHz 0 X390 90 nm 1 MB L2 1.70 GHz 400 MHz 0 X380 90 nm 1 MB L2 1.60 GHz 400 MHz 0 X370 90 nm 1 MB L2 1.50 GHz 400 MHz 0 X格大全360J 90 nm 1 MB L2 1.40 GHz 400 MHz 0 X360 90 nm 1 MB L2 1.40 GHz 400 MHz 0 X350J 90 nm 1 MB L2 1.30 GHz 400 MHz 0 X350 90 nm 1 MB L2 1.30 GHz 400 MHz 0 0340 130 nm 512 KB L2 1.50 GHz 400 MHz 0 0330 130 nm 512 KB L2 1.40 GHz 400 MHz 0 0320 130 nm 512 KB L2 1.30 GHz 400 MHz 0 0310 130 nm 512 KB L2 1.20 GHz 400 MHz 0 05.2 笔记本赛扬M超低压版Intel(R) Celeron(TM) M processor Ultra Low VoltageProcessor NumberArchitectureCacheClock SpeedFront Side BusExecute Disable Bit°443 65 nm 1 MB L2 1.20 GHz 533 MHz X423 65 nm 1 MB L2 1.06 GHz 533 MHz X383 90 nm 1 MB L2 1.00 GHz 400 MHz X373 90 nm 512 KB L2 1.00 GHz 400 MHz X353 90 nm 512 KB L2 900 MHz 400 MHz 0333 130 nm 512 KB L2 900 MHz 400 MHz 05.3 赛扬双核Intel(R) Celeron(TM) D processorProcessor NumberArchitectureCacheClock SpeedFront Side BusIntel(R) 64Φ格大全Execute Disable Bit°365 65 nm 512 KB L2 3.60 GHz 533 MHz X X360 65 nm 512 KB L2 3.46 GHz 533 MHz X X356 65 nm 512 KB L2 3.33 GHz 533 MHz X X355 90 nm 256 KB L2 3.33 GHz 533 MHz X X352 65 nm 512 KB L2 3.20 GHz 533 MHz X X351 90 nm 256 KB L2 3.20 GHz 533 MHz X X350 90 nm 256 KB L2 3.20 GHz 533 MHz 0 0347 65 nm 512 KB L2 3.06 GHz 533 MHz X X346 90 nm 256 KB L2 3.06 GHz 533 MHz X X345J 90 nm 256 KB L2 3.06 GHz 533 MHz 0 X345 90 nm 256 KB L2 3.06 GHz 533 MHz 0 X341 90 nm 256 KB L2 2.93 GHz 533 MHz X X340J 90 nm 256 KB L2 2.93 GHz 533 MHz 0 X340 90 nm 256 KB L2 2.93 GHz 533 MHz 0 X336 90 nm 256 KB L2 2.80 GHz 533 MHz X X335J 90 nm 256 KB L2 2.80 GHz 533 MHz 0 X335 90 nm 256 KB L2 2.80 GHz 533 MHz 0 X331 90 nm 256 KB L2 2.66 GHz 533 MHz X X330J 90 nm 256 KB L2 2.66 GHz 533 MHz 0 X330 90 nm 256 KB L2 2.66 GHz 533 MHz 0 X326 90 nm 256 KB L2 2.53 GHz 533 MHz X X325J 90 nm 256 KB L2 2.53 GHz 533 MHz 0 X325 90 nm 256 KB L2 2.53 GHz 533 MHz 0 0320 90 nm 256 KB L2 2.40 GHz 533 MHz 0 0315 90 nm 256 KB L2 2.26 GHz 533 MHz 0 0310 90 nm 256 KB L2 2.13 GHz 533 MHz 0 05.4 赛扬Intel(R) Celeron(TM) processorProcessor NumberArchitectureCache格大全Clock SpeedFront Side BusIntel(R) 64ΦExecute Disable Bit°540 65 nm 1 MB L2 1.86 GHz 533 MHz X X440 65 nm 512 KB L2 2.00 GHz 800 MHz X X430 65 nm 512 KB L2 1.80 GHz 800 MHz X X420 65 nm 512 KB L2 1.60 GHz 800 MHz X X6. 安腾系列Intel(R) Itanium(TM) 2 processorProcessor NumberPowerFront Side BusClock SpeedL3 CacheDual-Core64-BitIntel(R)VT±Intel(R) Cache SafeTechnology9050 104W 400/533 MHz 1.60 GHz 24 MB X X X X9040 104W 400/533 MHz 1.60 GHz 18 MB X X X X9030 104W 400/533 MHz 1.60 GHz 8 MB X X X X9020 104W 400/533 MHz 1.42 GHz 12 MB X X X X9015 104W 400 MHz 1.40 GHz 12 MB X X X X9010 75W 400/533 MHz 1.60 GHz 6 MB 0 X 0 X。
龙芯处理器应用常见问题解答-Loongson
1.1
2015-2-5
芯片研发部
增加 2GP1A目录
龙芯常用文档资料下载 .................................................................................................................... 9
0.8
2014-06-16 芯片研发部
增加 1 个 3 号系列的崩溃问题
0.9
2014-12-11 芯片研发部
增加 2 号系列问题；增加一个 3 号系列的死机问题；“龙芯 3 号 应用常见问题解析”更名为“龙 芯处理器应用常见问题解答”
1.0
2014-12-25 芯片研发部
增加 1 号系列问题
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2013-10-23 芯片研发部
增加 3 号系列问题 35、36
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2013-12-02 芯片研发部
调整文档结构，增加 1 个 3 号系列 的崩溃问题，1 个 3 号系列的优化问 题
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2013-12-16 芯片研发部
增加 1 个 3 号系列的优化问题
0.7
2014-01-01 芯片研发部
修正 3 号系列问题 17 的回答
文档编号:
文档更新记录
文档名:
龙芯处理器应用常见 问题解答
版本号 1.1
创建人: 芯片研发部
创建日期 : 2015-02-05
更新历史
序号 更新日期
更新人
更新内容
0.2
2013-10-08 芯片研发部
3 号系列部分问题更新
0.3
2013-10-09 芯片研发部
增加 3 号系列问题 32、33、34
AMD加速处理器列表
AMD加速处理器列表AMD Accelerated Processing Unit (APU)前称AMD Fusion，整合CPU和GPU。
目录•1 时程表•2 桌上型平台和笔电平台o 2.1 第一代AMD APU，基于AMD 10h（K10、K12/12h）▪ 2.1.1 Llanoo 2.2 第二代AMD APU，基于AMD Piledriver架构▪ 2.2.1 Trinity▪ 2.2.2 Richlando 2.3 第三代AMD APU，基于AMD Jagaur架构▪ 2.3.1 Kabinio 2.4 第四代AMD APU，基于AMD Steamroller架构▪ 2.4.1 Kaverio 2.5 第六代 AMD APU，基于 AMD Excavator 架构▪ 2.5.1 'Carrizo' (2015, 28 nm)o 2.6 第七代 AMD APU，基于 AMD Excavator 架构▪ 2.6.1 'Bristol Ridge' (2016, 28 nm)o 2.7 'Raven Ridge' (2017)•3 服务器核心o 3.1 Opteron X1100-series 'Kyoto' (28nm)o 3.2 Opteron X2100系列 'Kyoto' (2013, 28 nm)o 3.3 Opteron X3000系列 (2017, 28 nm) [26]•4 低功耗核心o 4.1 基于AMD Bobcat架构▪ 4.1.1 Brazos: 'Desna', 'Ontario', 'Zacate' (2011, 40nm)▪ 4.1.2 Brazos 2.0: 'Ontario', 'Zacate' (2012, 40 nm) ▪ 4.1.3 Brazos-T: 'Hondo' (2012, 40 nm)o 4.2 基于AMD Jagaur架构▪ 4.2.1 Temash▪ 4.2.2 Kabinio 4.3 第五代AMD APU 'Beema', 'Mullins'，基于PUMA 核心 (2014, 28 nm)▪ 4.3.1 Mullins▪ 4.3.2 Beemao 4.4 'Carrizo-L' (2015, 28 nm)o 4.5 'Stoney Ridge' (2016,28nm)•5 嵌入式核心o 5.1 G系列▪ 5.1.1 Brazos: 'Ontario' and 'Zacate' (2011, 40 nm) ▪ 5.1.2 'Kabini' (2013, 28 nm)▪ 5.1.3 'Steppe Eagle' (2014, SoC,28nm)▪ 5.1.4 'Crowned Eagle' (2014, SoC,28nm)▪ 5.1.5 I家族: 'Brown Falcon' (2016, SoC,28nm)▪ 5.1.6 J家族: 'Prairie Falcon' (2016, SoC,28nm)▪ 5.1.7 LX家族 (2016, SoC,28nm)o 5.2 R系列▪ 5.2.1 Comal: 'Trinity' (2012, 32 nm)▪ 5.2.2 'Bald Eagle' (2014,28nm)▪ 5.2.3 'Merlin Falcon' (2015, SoC,28nm)•6 另见•7 备注•8 参考资料•9 外部链接时程表代号状态型号制程TDP 核心Radeon coresOntario 已发售C-30, C-50,C-60,C-7040nmbulk9W 1-2 Bobcat 80Zacate 已发售E-240, E-350,E-45040nmbulk18W 1-2 Bobcat 80Llano 已发售A6-3670, A8-3850等32nmSOI35W~100W2-4 K-10/Stars160~400Wichita 原定2012年上半年产品计划被取消28nmbulk~9W 1-2 Bobcat --Krishna 原定2012年上半年产品计划被取消28nmbulk~18W 2-4 Bobcat --Trinity 已发售A10-5800K 等32nmSOI17W~100W2-4Piledrivers128~384Richland 已发售A10-6800K 等32nmSOI17W~100W2-4Piledrivers128~384Kaveri 已发售A10-7850K等28nmSOI15W~95W2-4Steamrollers256~512Kabini 已发售Athlon5350 ,Sempron3850 等28nmSOI9~25W 2-4 Jaguar 128Beema 已发售A6 6410 ,A46310 等28nmSOI15W 2-4 Puma 128Mullins 已发售A10 Micro6700T , 等28nmSOI15W 2-4 Puma 128Carrizo 已发售Athlon X4 835,84528nmSOI 45W~65W2-4Excavator--Bristol Ridge 已出货A10-9700 等28nmSOI35W~65W2-4Excavator256~512桌上型平台和笔电平台第一代AMD APU，基于AMD 10h（K10、K12/12h）第一款Fusion处理器代号为“Swift”，最早将用于代号为“Shrike”笔记型电脑平台。
PCI-1712中文手册
PCI-1712/1712L快速安装使用手册PCI-1712/1712L快速安装使用手册 (1)第一章 产品介绍 (2)1.1 概述 (2)1.1.1 PCI总线传输 (2)1.1.2 即插即用功能 (2)1.1.3 自动通道/增益/SD*/BU*扫描 (2)1.1.4 卡上FIFO(先入先出)存储器 (2)1.1.5 卡上可编程多功能计数器/定时器 (3)1.1.6 灵活的触发模式和定时能力 (3)1.1.7 连续的模拟量输出（仅PCI-1712） (3)1.2 特点： (3)第二章 安装与测试 (4)2.1 初始检查 (4)2.2 Windows2K/XP/9X下板卡的安装 (4)2.2.1 软件的安装： (4)2.2.2 硬件的安装： (6)2.3 测试 (11)2.3.1 模拟输入功能测试 (12)2.3.2 模拟输出功能测试 (12)2.3.3 数字量输入功能测试 (13)2.3.4 数字量输出功能测试 (14)2.4.5 计数器功能测试 (15)第三章 信号连接 (16)3.1 模拟信号输入连接： (17)3.1.1 单端模拟输入连接 (17)3.1.2 差分式模拟输入连接 (18)3.2模拟信号输出连接 (19)第四章 例程使用详解 (20)4.1 板卡支持例程列表 (21)4.2 常用例子使用说明 (21)4.2.1 ADSOFT/ADTRIG（软件触发方式例程） (21)4.2.2 DIGOUT（数字量输出）： (21)4.2.3 COUNTER（计数程序） (23)4.2.4 Digin (数字量输入例程) (24)4.2.5 PULSE(脉冲输出例程) (24)4.2.6 Pwmin(输入脉冲宽度测量) (25)第五章 遇到问题，如何解决？ (21)第一章产品介绍1.1 概述PCI-1712/1712L是一款功能强大的高速多功能PCI总线数据采集卡。
它有1M转换速度的12位A/D转换器，卡上带有FIFO缓冲器（可存储1K A/D采样值和32K D/A转换数据）。
MSI B550M-A PRO A520M-A PRO主板说明书
1ContentsContentsSafety Information ...........................................................................................2Specifications ...................................................................................................3Rear I/O Panel .................................................................................................6LAN Port LED Status Table . (6)Overview of Components (7)CPU Socket .................................................................................................................8DIMM Slots..................................................................................................................9PCI_E1~2: PCIe Expansion Slots ................................................................................9M2_1: M.2 Slot ..........................................................................................................10SATA1~4: SATA 6Gb/s Connectors ...........................................................................10JFP1, JFP2: Front Panel Connectors .......................................................................11JAUD1: Front Audio Connector ................................................................................11ATX_PWR1, CPU_PWR1: Power Connectors ...........................................................12JUSB1, JUSB2: USB 2.0 Connectors ........................................................................13JUSB3: USB 3.2 Gen1 Connector .............................................................................13CPU_FAN1, SYS_FAN1: Fan Connectors .................................................................14JTPM1: TPM Module Connector ...............................................................................14JCI1: Chassis Intrusion Connector ...........................................................................15JCOM1: Serial Port Connector .................................................................................15JBAT1: Clear CMOS (Reset BIOS) Jumper ...............................................................16EZ Debug LED ...........................................................................................................16UEFI BIOS . (17)BIOS Setup ................................................................................................................18Entering BIOS Setup .................................................................................................18Resetting BIOS ..........................................................................................................18Updating BIOS...........................................................................................................19Installing OS, Drivers & Utilities . (20)Installing Windows® 10 .............................................................................................20Installing Drivers ......................................................................................................20Installing Utilities .....................................................................................................20Thank you for purchasing the MSI® B550M-A PRO/ A520M-A PRO motherboard. This User Guide gives information about board layout, component overview, BIOS setup and software installation.Safety Information∙The components included in this package are prone to damage from electrostatic discharge (ESD). Please adhere to the following instructions to ensure successful computer assembly.∙Ensure that all components are securely connected. Loose connections may cause the computer to not recognize a component or fail to start.∙Hold the motherboard by the edges to avoid touching sensitive components. ∙It is recommended to wear an electrostatic discharge (ESD) wrist strap when handling the motherboard to prevent electrostatic damage. If an ESD wrist strap is not available, discharge yourself of static electricity by touching another metal object before handling the motherboard.∙Store the motherboard in an electrostatic shielding container or on an anti-static pad whenever the motherboard is not installed.∙Before turning on the computer, ensure that there are no loose screws or metal components on the motherboard or anywhere within the computer case.∙Do not boot the computer before installation is completed. This could cause permanent damage to the components as well as injury to the user.∙If you need help during any installation step, please consult a certified computer technician.∙Always turn off the power supply and unplug the power cord from the power outlet before installing or removing any computer component.∙Keep this user guide for future reference.∙Keep this motherboard away from humidity.∙Make sure that your electrical outlet provides the same voltage as is indicated on the PSU, before connecting the PSU to the electrical outlet.∙Place the power cord such a way that people can not step on it. Do not place anything over the power cord.∙All cautions and warnings on the motherboard should be noted.∙If any of the following situations arises, get the motherboard checked by service personnel:▪Liquid has penetrated into the computer.▪The motherboard has been exposed to moisture.▪The motherboard does not work well or you can not get it work according touser guide.▪The motherboard has been dropped and damaged.▪The motherboard has obvious sign of breakage.∙Do not leave this motherboard in an environment above 60°C (140°F), it may damage the motherboard.2Safety Information3Specifications4SpecificationsNorton™ Internet Security SolutionPlease refer to http:///manual/mb/DRAGONCENTER2.pdf formore details.5SpecificationsAudio 7.1-channel ConfigurationTo configure 7.1-channel audio, you have to connect front audio I/O module to JAUD1 connector and follow the below steps.1. Click on the Realtek HD Audio Manager > Advanced Settings to open the dialogbelow.2. Select Mute the rear output device, when a front headphone plugged in.3. Plug your speakers to audio jacks on rear and front I/O panel. When you plug intoa device at an audio jack, a dialogue window will pop up asking you which deviceis current connected.6Rear I/O Panel7Overview of ComponentsOverview of Components* Distance from the center of the CPU to the nearest DIMM slot.M2_1JTPM1PCI_E1PCI_E2Important∙Always unplug the power cord from the power outlet before installing or removing the CPU.∙Please retain the CPU protective cap after installing the processor. MSI will deal with Return Merchandise Authorization (RMA) requests if only the motherboard comes with the protective cap on the CPU socket.∙When installing a CPU, always remember to install a CPU heatsink. A CPU heatsink is necessary to prevent overheating and maintain system stability.∙Confirm that the CPU heatsink has formed a tight seal with the CPU before booting your system.∙Overheating can seriously damage the CPU and motherboard. Always make sure the cooling fans work properly to protect the CPU from overheating. Be sure to apply an even layer of thermal paste (or thermal tape) between the CPU and the heatsink to enhance heat dissipation.∙If you purchased a separate CPU and heatsink/ cooler, Please refer to the docu-mentation in the heatsink/ cooler package for more details about installation.8Overview of Componentscard’s documentation to check for any necessary additional hardware or softwarechanges.9Overview of ComponentsSATA1~4: SATA 6Gb/s ConnectorsThese connectors are SATA 6Gb/s interface ports. Each connector can connect to one SATA device.⚠Important∙Please do not fold the SATA cable at a 90-degree angle. Data loss may result during transmission otherwise.∙SATA cables have identical plugs on either sides of the cable. However, it is recommended that the flat connector be connected to the motherboard for space saving purposes.M2_1: M.2 SlotPlease install the M.2 device into the M.2 slot as shown below.13StandoffSupplied10Overview of ComponentsJFP1, JFP2: Front Panel ConnectorsJAUD1: Front Audio Connector11Overview of ComponentsATX_PWR1, CPU_PWR1: Power ConnectorsImportantMake sure that all the power cables are securely connected to a proper ATX power supply to ensure stable operation of the motherboard.12Overview of Components13Overview of ComponentsJUSB3: USB 3.2 Gen1 ConnectorImportantNote that the Power and Ground pins must be connected correctly to avoid possible damage.JUSB1, JUSB2: USB 2.0 Connectors∙Note that the VCC and Ground pins must be connected correctly to avoid possible damage.∙In order to recharge your iPad,iPhone and iPod through USB ports, please install MSI® SUPER CHARGER software.14Overview of ComponentsImportantYou can adjust fan speed in BIOS > Hardware Monitor.CPU_FAN1, SYS_FAN1: Fan ConnectorsPWM Mode fan connectors provide constant 12V output and adjust fan speed with speed control signal. When you plug a 3-pin (Non-PWM) fan to a fan connector in PWM mode, the fan speed will always maintain at 100%, which might create a lot ofnoise.JTPM1: TPM Module ConnectorThis connector is for TPM (Trusted Platform Module). Please refer to the TPMJCI1: Chassis Intrusion Connector(default)intrusion eventUsing chassis intrusion detector1. Connect the JCI1 connector to the chassis intrusion switch/ sensor on the chassis.2. Close the chassis cover.3. Go to BIOS > SETTINGS > Security > Chassis Intrusion Configuration.4. Set Chassis Intrusion to Enabled.5. Press F10 to save and exit and then press the Enter key to select Yes.6. Once the chassis cover is opened again, a warning message will be displayed on screen when the computer is turned on.Resetting the chassis intrusion warning1. Go to BIOS > SETTINGS > Security > Chassis Intrusion Configuration.2. Set Chassis Intrusion to Reset.3. Press F10 to save and exit and then press the Enter key to select Yes. JCOM1: Serial Port Connector15Overview of ComponentsJBAT1: Clear CMOS (Reset BIOS) JumperThere is CMOS memory onboard that is external powered from a battery located on the motherboard to save system configuration data. If you want to clear the system(default)BIOSResetting BIOS to default values1. Power off the computer and unplug the power cord.2. Use a jumper cap to short JBAT1 for about 5-10 seconds.3. Remove the jumper cap from JBAT1.4. Plug the power cord and power on the computer.EZ Debug LEDThese LEDs indicate the status of the motherboard.CPU - indicates CPU is not detected or fail.DRAM - indicates DRAM is not detected or fail.VGA - indicates GPU is not detected or fail.BOOT - indicates booting device is not detected or fail.16Overview of ComponentsUEFI BIOSMSI UEFI BIOS is compatible with UEFI (Unified Extensible Firmware Interface) architecture. UEFI has many new functions and advantages that traditional BIOS cannot achieve, and it will completely replace BIOS in the future. The MSI UEFI BIOS uses UEFI as the default boot mode to take full advantage of the new chipset’s capabilities. However, it still has a CSM (Compatibility Support Module) mode to be compatible with older devices. That allows you to replace legacy devices with UEFI compatible devices during the transition.⚠ImportantThe term BIOS in this user guide refers to UEFI BIOS unless otherwise noted. UEFI advantages∙Fast booting - UEFI can directly boot the operating system and save the BIOS self-test process. And also eliminates the time to switch to CSM mode during POST.∙Supports for hard drive partitions larger than 2 TB.∙Supports more than 4 primary partitions with a GUID Partition Table (GPT).∙Supports unlimited number of partitions.∙Supports full capabilities of new devices - new devices may not provide backward compatibility.∙Supports secure startup - UEFI can check the validity of the operating system to ensure that no malware tampers with the startup process.Incompatible UEFI cases∙32-bit Windows operating system - this motherboard supports only 64-bit Windows 10 operating system.∙Older graphics card - the system will detect your graphics card. When display a warning message There is no GOP (Graphics Output protocol) support detected in this graphics card.⚠ImportantWe recommend that you to use a GOP/ UEFI compatible graphics card.How to check the BIOS mode?17UEFI BIOSBIOS SetupThe default settings offer the optimal performance for system stability in normal conditions. You should always keep the default settings to avoid possible system damage or failure booting unless you are familiar with BIOS.⚠Important∙BIOS items are continuous update for better system performance. Therefore, the description may be slightly different from the latest BIOS and should be held for reference only. You could also refer to the HELP information panel for BIOS item description.∙The BIOS items will vary with the processor. Entering BIOS SetupPress Delete key, when the Press DEL key to enter Setup Menu, F11 to enter Boot Menu message appears on the screen during the boot process.Function keyF1: General HelpF2: Add/ Remove a favorite itemF3: Enter Favorites menuF4: Enter CPU Specifications menuF5: Enter Memory-Z menuF6: Load optimized defaultsF7: Switch between Advanced mode and EZ modeF8: Load Overclocking ProfileF9: Save Overclocking ProfileF10: Save Change and Reset*F12: Take a screenshot and save it to USB flash drive (FAT/ FAT32 format only). Ctrl+F: Enter Search page* When you press F10, a confirmation window appears and it provides the modification information. Select between Yes or No to confirm your choice. Resetting BIOSYou might need to restore the default BIOS setting to solve certain problems. There are several ways to reset BIOS:∙Go to BIOS and press F6 to load optimized defaults.∙Short the Clear CMOS jumper on the motherboard.⚠ImportantPlease refer to the Clear CMOS jumper section for resetting BIOS.18UEFI BIOSUpdating BIOSUpdating BIOS with M-FLASHBefore updating:Please download the latest BIOS file that matches your motherboard model from MSI website. And then save the BIOS file into the USB flash drive.Updating BIOS:1. Insert the USB flash drive that contains the update file into the USB port.2. Please refer the following methods to enter flash mode.▪Reboot and press Ctrl + F5 key during POST and click on Yes to reboot the system.▪Reboot and press Del key during POST to enter BIOS. Click the M-FLASH button and click on Yes to reboot the system.3. Select a BIOS file to perform the BIOS update process.4. When prompted click on Yes to start recovering BIOS.5. After the flashing process is 100% completed, the system will reboot automatically.Updating the BIOS with Dragon CenterBefore updating:Make sure the LAN driver is already installed and the internet connection is set properly.Updating BIOS:1. Install and launch MSI DRAGON CENTER and go to Support page.2. Select Live Update and click on Advance button.3. Click on Scan button to search the latest BIOS file.4. Select the BIOS file and click on Download icon to download and install the latest BIOS file.5. Click Next and choose In Windows mode. And then click Next and Start to start updating BIOS.6. After the flashing process is 100% completed, the system will restart automatically.19UEFI BIOSInstalling OS, Drivers & UtilitiesPlease download and update the latest utilities and drivers at Installing Windows® 101. Power on the computer.2. Insert the Windows® 10 installation disc/USB into your computer.3. Press the Restart button on the computer case.4. Press F11 key during the computer POST (Power-On Self Test) to get into BootMenu.5. Select the Windows® 10 installation disc/USB from the Boot Menu.6. Press any key when screen shows Press any key to boot from CD or DVD...message.7. Follow the instructions on the screen to install Windows® 10. Installing Drivers1. Start up your computer in Windows® 10.2. Insert MSI® Driver Disc into your optical drive.3. Click the Select to choose what happens with this disc pop-up notification,then select Run DVDSetup.exe to open the installer. If you turn off the AutoPlayfeature from the Windows Control Panel, you can still manually execute theDVDSetup.exe from the root path of the MSI Driver Disc.4. The installer will find and list all necessary drivers in the Drivers/Software tab.5. Click the Install button in the lower-right corner of the window.6. The drivers installation will then be in progress, after it has finished it will promptyou to restart.7. Click OK button to finish.8. Restart your computer.Installing UtilitiesBefore you install utilities, you must complete drivers installation.1. Open the installer as described above.2. Click the Utilities tab.3. Select the utilities you want to install.4. Click the Install button in the lower-right corner of the window.5. The utilities installation will then be in progress, after it has finished it willprompt you to restart.6. Click OK button to finish.7. Restart your computer.20Installing OS, Drivers & Utilities。
ADAM-3968_DS
ADAM-3962DB62 DIN-rail Wiring BoardFeaturesLow cost universal DIN-rail mounting screw terminal module for DAQ cards with DB62 female connector Screw-clamp terminal blocks allow easy and reliable connections Case dimensions (W x L x H): 77.5 x 124.5 x 63.5 mm (3.1" x 4.9" x 2.5")To Be Used WithPCI-1762ADAM-3900 SeriesDIN-rail TerminalBoards ADAM-3968/5068-pin SCSI to 2 50-pin Box Header BoardFeaturesLow cost universal DIN-rail mounting screw terminal module for industrial applications with 68-pin SCSI female connector Case dimensions (W x L x H): 77.5 x 191.2 x 51 mm (3.1" x 8.4" x 2.0")To Be Used WithPCI-1710U/UL, PCI-1710HGU, PCI-1711U/UL, PCI-1712/L, PCI -1716/L, PCI-1741U, PCI-1742U, PCI-1747U, PCI-1721, PCI-1723, PCI-1751, PCI-1753, PCI-1723, PCI-1780UADAM-3968/2068-pin SCSI to 3 20-pin Box Header BoardADAM-39100100-pin DIN-rail SCSI Wiring BoardFeaturesLow cost universal DIN-rail mounting screw terminal module for PC-LabCard™ products with 68-pin SCSI connectors Converts one 68-pin SCSI connector to three 20-pin connectors Case dimensions (W x L x H): 77.5 x 80 x 54.3 mm (3.1” x 3.2" x 2.1")To Be Used WithPCI-1751, PCI-1753FeaturesLow cost universal DIN-rail mounting screw terminal module for industrial applications with 100-pin SCSI female connector Case dimensions (W x L x H): 80 x 230 x 42 mm (3.14" x 9.05" x 1.65")To Be Used WithPCI-1240U, PCI-1755ADAM-396868-pin DIN-rail SCSI WiringBoardFeaturesLow cost universal DIN-rail mounting screw terminal module for PC-LabCard™ products with 68-pin SCSI connectors Converts one 68-pin SCSI connector to two 50-pin Opto-22 compatible box headers Case dimensions (W x L x H): 77.0 x 101.0 x 54.3 mm (3.0" x 4.0" x 2.1")To Be Used WithPCI-1751, PCI-1753。
PCI-1730 快速说明书
1.1.2 宽的输入范围
PCI-1730 具有宽的输入范围，适合于很多供电电源 12VDC 和 24VDC 的工 业应用场合。
1.1.3 复位保护满足了工业应用的需求
当系统热重启动（不关闭系统电源）时，PCI-1730 根据卡上的跳线设置， 能够保持每个通道的输出值，或返回到它们打开状态的默认配置。该功能能够避 免在系统意外重启动过程中的误操作对系统带来的危险。
PCI-1730 快速安装使用手册
PCI-1730 快速安装使用手册
PCI-1730 快速安装使用手册 ...................................... 1 第一章 产品介绍 ............................................... 2
2.2 跳线的设置
PCI-1730 卡面板上有 3 个跳线来实现两种功能和 1 个功能开关 SW1。如何 使用它们将在下面详细讨论。
2.2.1 版本设置
跳线 JP4 到 JP5 是用来设置选择板卡版本。设置如下图所示：
3
PCI-1730 快速安装使用手册
2.2.2 设置重启状态 PCI-1730 用跳线 JP2 来选择设置重启后每个数字输出通道保持上一次的数 字输出设置和输出值，或者返回到默认配置。这种特有的功能能使用户选择是在 每次重启后清除原来输出设置和输出值还是保持原有设置和输出值而只有当系 统断电后才清除。卡上输出通道的默认配置是“OFF”配置。在断电后，卡将清 除它的设置和输出值返回默认状态。具体如下图所示：
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PCI-1712/1712L快速安装使用手册PCI-1712/1712L快速安装使用手册 (1)第一章 产品介绍 (2)1.1 概述 (2)1.1.1 PCI总线传输 (2)1.1.2 即插即用功能 (2)1.1.3 自动通道/增益/SD*/BU*扫描 (2)1.1.4 卡上FIFO(先入先出)存储器 (2)1.1.5 卡上可编程多功能计数器/定时器 (3)1.1.6 灵活的触发模式和定时能力 (3)1.1.7 连续的模拟量输出（仅PCI-1712） (3)1.2 特点： (3)第二章 安装与测试 (4)2.1 初始检查 (4)2.2 Windows2K/XP/9X下板卡的安装 (4)2.2.1 软件的安装： (4)2.2.2 硬件的安装： (6)2.3 测试 (11)2.3.1 模拟输入功能测试 (12)2.3.2 模拟输出功能测试 (12)2.3.3 数字量输入功能测试 (13)2.3.4 数字量输出功能测试 (14)2.4.5 计数器功能测试 (15)第三章 信号连接 (16)3.1 模拟信号输入连接： (17)3.1.1 单端模拟输入连接 (17)3.1.2 差分式模拟输入连接 (18)3.2模拟信号输出连接 (19)第四章 例程使用详解 (20)4.1 板卡支持例程列表 (21)4.2 常用例子使用说明 (21)4.2.1 ADSOFT/ADTRIG（软件触发方式例程） (21)4.2.2 DIGOUT（数字量输出）： (21)4.2.3 COUNTER（计数程序） (23)4.2.4 Digin (数字量输入例程) (24)4.2.5 PULSE(脉冲输出例程) (24)4.2.6 Pwmin(输入脉冲宽度测量) (25)第五章 遇到问题，如何解决？ (21)第一章产品介绍1.1 概述PCI-1712/1712L是一款功能强大的高速多功能PCI总线数据采集卡。
它有1M转换速度的12位A/D转换器，卡上带有FIFO缓冲器（可存储1K A/D采样值和32K D/A转换数据）。
PCI-1712提供16路单端或8路差分的模拟量输入（也可单端差分混合使用），2路12位D/A模拟量输出通道，16路数字量输出通道，以及3个10M Hz时钟的16位多功能计数器通道。
PCI-1712/1712L系列能够为不同用户提供专门的功能：PCI-1712 1MS/s 高速多功能数据采集卡PCI-1712L 1MS/s 高速多功能数据采集卡，不带AO功能1.1.1 PCI总线传输PCI-1712/1712L支持PCI总线DMA功能用于高速数据传输和无间隔的模拟量输入和模拟量输出。
通过设置PC的内存，PCI-1712/1712L可执行总线数据传输，而不需要CPU的干预，可使CPU去执行其它更重要的工作，比如：数据分析和图形操作。
这种功能允许用户全速使用所有I/O功能且不丢失数据。
1.1.2 即插即用功能PCI-1712/1712L是一个即插即用设备，完全符合PCI规格Rev 2.1标准。
在安装插卡时，用户不需要设置任何跳线和DIP拨码开关。
实际上，所有与总线相关的配置，比如基地址、中断，均由即插即用功能自动完成。
1.1.3 自动通道/增益/SD*/BU*扫描PCI-1712/1712L有一个自动通道/增益/SD/BU扫描电路。
由电路控制采样中的多路选通器，这种方法比由软件控制具有更高的效率。
卡上的SRAM存储有不同通道的增益、SD和BU值，这种设计方法使用户可以执行多通道的高速采样，并且每个通道可以设定为不同的增益、SD和BU值。
SD：单端/差分；BU：双极/单极1.1.4 卡上FIFO(先入先出)存储器PCI-1712/1712L卡上提供了FIFO（先入先出）存储器，可储存1K A/D 采样值和32K用于D/A转换的数据（仅PCI-1712）。
1.1.5 卡上可编程多功能计数器/定时器PCI-1712/1712L有3个可编程多功能计数器/定时器，可用于A/D转换时的定时触发。
计数器芯片为82C54或与82C54兼容的芯片，它包含了三个16位的10MHz时钟计数器。
另外，研华还增强了门控和时钟输入功能，比如事件计数、脉冲产生、频率产生、频率测量和脉冲宽度测量等功能。
1.1.6 灵活的触发模式和定时能力PCI-1712/1712L提供灵活的触发模式，对模拟量输入来说包括触发模式和触发事件。
用户可以使用后触发、预触发、延时触发和匹配触发四种触发模式来获得数据。
触发源既可以是模拟量，也可以是数字量。
模拟量触发信号可以由一个专门的输入管脚产生。
实际上，用户可以设置任何从0到满刻度的电压范围作为触发电平。
1.1.7 连续的模拟量输出（仅PCI-1712）PCI-1712提供2路模拟量输出通道。
这两路输出通道均可产生连续的波形输出，对一个模拟量输出通道可以产生每秒500k的数据输出，用户也可以将波形数据存储在卡上的FIFO中，这样可以产生循环的波形输出。
PCI-1712卡上的FIFO可以存储2到32K的波形采样。
1.2 特点：1. PCI总线数据传输2. 16路单端或8路差分模拟量输入，或组合输入方式3. 12位A/D转换器，采样速率可达1MHz4. 模拟量输入通道的数据采集触发模式可使用预触发、后触发、匹配触发和延时触发5. 每个模拟量输入通道的增益可编程6. 自动通道/增益/SD*/BU*扫描7. 卡上带有用于A/D采样的1K FIFO和用于D/A输出的32K FIFO8. 2路12位模拟量输出通道，可连续输出波形9. 模拟量输入通道和输出通道自动校准10. 16路数字量输入通道和16路数字量输出通道11. 3路16位可编程多功能10MHz计数器/定时器第二章安装与测试2.1 初始检查研华PCI-1712/1712L，包含如下三部分：一块PCI-1712/1712L 高速多功能PCI数据采集卡，一本使用手册和一个内含板卡驱动的光盘。
打开包装后，请您查看这三件是否齐全，请仔细检查有没有在运送过程中对板卡造成的损坏，如果有损坏或者规格不符,请立即告知我们的服务部门或是本地经销代理商，我们将会负责维修或者更换。
取出板卡后，请保留它的防震包装，以便在您不使用时将采集卡保护存放。
在您用手持板卡之前，请先释放手上的静电（例如，通过触摸您电脑机箱的金属底盘释放静电），不要接触易带静电的材料，比如塑料材料等。
手持板卡时只能握它的边沿，以免您手上的静电损坏面板上的集成电路或组件。
2.2 Windows2K/XP/9X下板卡的安装安装流程图，如下：2.2.1软件的安装：2.3.1．1 安装Device Manager和32bitDLL驱动注意：测试板卡和使用研华驱动编程必须首先安装安装Device Manager和32bitDLL驱动。
第一步：将启动光盘插入光驱；第二步：安装执行程序将会自动启动安装，这时您会看到下面的安装界面：图2-1注意：如果您的计算机没有启用自动安装，可在光盘文件中点击autorun.exe 文件启动安装程第三步: 点击CONTINUE,出现下图界面（见图2-2）首先安装Device Manager。
也可以在光盘中执行\tools\DevMgr.exe直接安装。
图2-2第四步:点击IndividualDriver，然后选择您所安装的板卡的类型和型号,然后按照提示就可一步一步完成驱动程序的安装。
图2-32.3.1．2 32bitDLL驱动手册（软件手册）说明安装完Device Manager后相应的驱动手册Device Driver’s Manual也会自动安装。
有关研华32bitDLL驱动程序的函数说明，例程说明等资料在此获取。
快捷方式位置为：开始/ 程序/ Advantech Automation/ Device Manager/ DeviceDriver's Manual。
也可以直接执行C:\ProgramFiles\ADVANTECH\ADSAPI\Manual\General.chm。
2.3.1．3 32bitDLL驱动编程示例程序说明点击自动安装界面的Example&Utility出现以下界面（见图四）选择对应的语言安装示例程序。
例程默认安装在C:\Program Files\ADVANTECH\ADSAPI\Examples下。
可以在这里找到32bitDLL驱动函数使用的示例程序供编程时参考。
示例程序的说明在驱动手册Device Driver’s Manual中有说明，见下图2-5。
图2-4图2-52.3.1．4 labview驱动程序安装使用说明研华提供labview驱动程序。
注意：安装完前面步骤的Device Manager和32bitDLL驱动后labview驱动程序才可以正常工作。
光盘自动运行点击Installation再点击Advance Options 出现以下界面（见图2-6）。
点击：LavView Drivers来安装labview驱动程序和labview驱动手册和示例程序。
也可以在光盘中直接执行：光盘\labview\ labview.exe来安装。
图2-6安装完后labview驱动帮助手册快捷方式为：开始/ 程序/ Advantech Automation/LabView/XXXX.chm。
默认安装下也可以在C:\Program Files\National Instruments\LabVIEW 7.0\help\Advantech 中直接打开labview 驱动帮助手册。
labview驱动示例程序默认安装在C:\Program Files\National Instruments\LabVIEW 7.0\examples\Advantech DAQ 目录下。
2.3.1．5 Active Daq控件安装使用说明研华提供Active Daq控件，供可视化编程使用。
注意：安装完前面步骤的Device Manager和32bitDLL驱动后安装Active Daq控件，才能正常工作。
光盘自动运行点击Installation再点击Advance Options 出现安装界面（见图2-6）。
点击：ActiveDaq Installlation来安装Active Daq控件和示例程序。
也可以在光盘中直接执行：光盘\ActiveDAQ\ActiveDAQ.exe来安装。
Active Daq控件使用手册快捷方式为开始/ 程序/ Advantech Automation/ActiveDaq Pro/ ActiveDAQPro.chm。
默认安装下也可以在C:\Program Files\ADVANTECH\ActiveDAQ Pro 中直接打开Active Daq驱动手册：ActiveDAQPro.chm。