HDSP-331A-II000中文资料

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XXHDS产品优势介绍yx

HPQ XP256 XP48 XP512 XP128 XP1024 XP10000 XP12000 XP 24000
SUN N/A SE9910 SE9960 SE9970 SE9980 SE9985 SE9990 SE9990V
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XXHDS产品优势介绍yx
各厂商磁盘产品
• HDS独有虚拟端口模式
– 每一个物理端口支持128个异构主机平台连接
• 各主机拥有自己的存储空间，没有数据覆盖危险
• 多个LUN 0 支持
– 更好的利用FC端口200MB/s的带宽
• 很多应用仅需要5－10MB/s的带宽
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•存储系统
•POR T
•AMS •Virtual Port
SE9985
SE9990
SE9990 V
• HP：高端存储全球OEM战略合作 • SUN：高端存储全球联合品牌合作 • 联想、Gateway、Acer：中、低端模
块化存储联合品牌
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•直销 •代理商
•OEMs
•直销
•分销
XXHDS产品优势介绍yx
•代理商
•OE M
HDS中国区业务
• 4 iSCSI ports—2 per controller (Fibre Channel models available 2008)
• Supports SATA II (500GB or 750GB) or SAS (147GB or 300GB) HDDs
• 6, 8, or 12 HDDs per model, up to 9TB of capacity
• • • •

日立、索尼、夏普投影机参数

索尼EX147参数光学参数：投影机特性：互动亮度：3100流明对比度：2500:1标准分辨率：1024*768最高分辨率：1600×1200光源类型：超高压汞灯灯泡功率：210W灯泡寿命：正常模式：4500小时，经济模式：6000小时投影参数：投影技术：3LCD变焦方式：手动变焦聚集方式：手动聚焦变焦比：1.3倍投影距离：0.762-7.62m投影尺寸：30-300英寸屏幕比例：4:3色彩条目：1677万色梯形校正：垂直：±30度扫描频率：水平：14-93kHZ腹有诗书气自华垂直：47-93HZ扬声器：10W接口参数：输入端子：1×RGB/Y1×立体声迷你型插孔1×S视频接口1×VGA接口1×迷你型DIN4芯1×听筒插孔输出端子：1×迷你型D-sub 15芯（雌头）1×立体声迷你型插孔控制端子：1×RS-2321×RJ45电气规格整机功率：310W，待机功率：11W电源性能：AC100-240V，50/60Hz 其它参数产品尺寸：313.4*114.1*269mm产品重量：3.3kg腹有诗书气自华EX148参数光学参数亮度：3300流明对比度：3000:1标准分辨率：XVGA(1024*768)最高分辨率：1600×1200光源类型：超高压汞灯灯泡功率：210W灯泡寿命：正常模式：4500小时，经济模式：6000小时投影参数：投影技术：3LCD变焦方式：手动变焦聚集方式：手动聚焦变焦比：1.3倍投影距离：0.762-9.62m投影尺寸：30-300英寸屏幕比例：4:3色彩条目：1677万色梯形校正：垂直：±30度扫描频率：水平：14-93kHZ腹有诗书气自华垂直：47-93HZ扬声器：10W接口参数：输入端子：1×RGB/Y PB PR输入接口1×音频输入接口：立体声迷你型插孔1×S视频输入接口：迷你型DIN4芯2×音频输入接口：听筒插孔输出端子：1×监视器输出接口*6：迷你型D-sub 15芯（雌头）1×音频输出接口*7:立体声迷你型插孔(变量输出)控制端子：1×RS-232接口：D-sub 9芯（雌头）1×立体声迷你型插孔控制端子：1×RS-2321×RJ45电气规格整机功率：310W，待机功率：11W电源性能：AC100-240V，50/60Hz其它参数产品尺寸：313.4*114.1*269mm产品重量：3.3kg夏普D256XA参数腹有诗书气自华亮度：2600流明对比度：2000:1标准分辨率：1024*768最高分辨率：1600×1200光源类型：超高压汞灯灯泡功率：210W灯泡寿命：正常模式：4500小时，经济模式：6000小时投影参数：投影技术：DLP变焦方式：手动变焦聚集方式：手动聚焦变焦比：1.3倍投影距离：0.862-9.62m投影尺寸：30-300英寸屏幕比例：4:3/16:9色彩条目：1677万色梯形校正：垂直：±30度扫描频率：水平：14-93kHZ垂直：47-93HZ扬声器：7W腹有诗书气自华输入端子：1×VGA输入1×S视频输入1×视频输入输出端子：1×视频输出控制端子：1×USB1×RJ451×RS232其它参数：产品尺寸：300*236*79mm产品重量：2.8kg爱普C05S参数光学参数：亮度：2600流明对比度：3000:1标准分辨率：SVGA（800*600）光源类型：超高压汞灯灯泡功率：200W灯泡寿命：正常模式：4000小时，经济模式：6000小时投影参数：投影技术：3LCD腹有诗书气自华变焦方式：手动变焦聚集方式：手动聚焦变焦比：1-1.35倍投影距离：0.88-10.4m投影尺寸：23-350英寸屏幕比例：4:3色彩条目：1677万色扬声器：1W接口参数：输入端子：1×VGA输入1×S视频输入1×视频输入输出端子：1×视频输出控制端子：1×USB1×RS232其它参数：产品尺寸：295*228*77mm 纠错产品重量：2.3kg正常模式：270W 待机：0.47W电源性能：AC100-240V，50/60Hz腹有诗书气自华日立3050X/3200X参数光学参数：亮度：3000流明对比度：2000:1标准分辨率：1XVG(1024*768)最高分辨率：1600×1200光源类型：超高压汞灯灯泡功率：210W灯泡寿命：正常模式：4500小时，经济模式：6000小时投影参数：投影技术：3LCD变焦方式：手动变焦聚焦方式：手动聚焦变焦比：1.2倍梯形校正：垂直梯形校正接口参数：输入接口：NTSC，NTSC4.43，PAL，SECAM，M-PAL，N-PAL，PAL60 HDTV：750p(720p)，1125i(1080i)SDTV：525i(480i)，525p(480p)，625i(576i)，625p(576p)模拟RGB：15针微型D-sub端子×2腹有诗书气自华输出接口：模拟RGB：1×15针微型D-sub端子其它参数：产品尺寸：317×98×288mm产品重量：3.6kg电源性能：AC100-240V，50/60Hz整机功率：330W索尼EX242/245参数光学参数：亮度：3200流明对比度：2700:1标准分辨率：1XVG(1024*768)光源类型：超高压汞灯灯泡功率：210W灯泡寿命：正常模式：4500小时，经济模式：6000小时投影参数：投影技术：3LCD变焦方式：手动变焦聚焦方式：手动聚焦变焦比：1.3倍腹有诗书气自华投影尺寸：30-300英寸梯形校正：手动、自动±30度接口参数：输入接口：输入A：1×迷你D-sub 15芯（RGB/Y PB PR）输入B：1×迷你D-sub 15芯（RGB）输入C：1×HDMI（HDCP支持）视频输入：1×针插孔S视频输入：1×4芯迷你插孔输出接口：监视器输出：1×15针迷你D-sub（从输入A到输入B）控制接口：RS-232C：1×D-sub 9芯（公）网络：1×RJ-45，10BASE-T/100BASE-TXUSB：1×Type-A，Type-B其它参数：产品尺寸：317*98*288mm产品重量：3.6kg整机功率：330W电源性能：AC100-240V，50/60Hz爱普生X29参数光学参数：亮度：3000流明对比度：10000:1腹有诗书气自华标准分辨率：XGA(1024*768)灯泡功率：200W光源类型：超高压汞灯投影参数：投影技术：3LCD变焦方式：光学变焦聚焦方式：手动聚焦变焦比：1.2倍投影尺寸：30-300英寸色彩条目：10.7亿色彩条目梯形校正：手动、水平±30度自动、垂直±30度扬声器：5W接口参数：输入接口：2×视频输入：D-Sub15p1×视频输入：RCA1×视频输入：S-Video1×视频输入：HDMI2×音频输入：Stereo mini1×音频输入：RCA输出接口：1×USB-B 1×USB-A 1×RJ45 1×RS-232c腹有诗书气自华其它参数：产品尺寸：297*87*244mm产品重量：2.5kg整机功率：280W电源性能：AC100-240V，50/60Hz爱普生6000光学参数：亮度：3000流明对比度：500:1标准分辨率：XGA(1024*768)最大分辨率：1600*1200灯泡功率：230W光源类型：超高压汞灯投影参数：投影技术：LCD变焦方式：手动变焦聚焦方式：手动聚焦变焦比：1.6倍屏幕宽高比：4:3腹有诗书气自华投影距离：0.8-14.7m投影尺寸：30-300英寸色彩条目：16.77百万色梯形校正：垂直±30度接口参数：输入接口：RCA（黄）×1、S－端子Mini DIN、D-sub 15-pin x 2 、RGB视频输出接口：D-sub 15-pin x 1其它参数：产品尺寸：465*160*340mm产品重量：7kg整机功率：280W电源性能：AC100-240V，50/60Hz索尼EX273光学参数：亮度：3800流明对比度：3000:1标准分辨率：XGA(1024*768)灯泡功率：210W光源类型：超高压汞灯腹有诗书气自华灯泡寿命：正常模式3000小时；经济模式5000小时投影参数：投影技术：LCD变焦方式：手动变焦聚焦方式：手动聚焦变焦比：1.6倍屏幕宽高比：4:3投影尺寸：30-300英寸梯形校正：垂直±30度接口参数：输入接口：1×迷你D-sub 15芯（RGB/Y PB PR）输入B：1×迷你D-sub 15芯（RGB）输入C：1×HDMI（HDCP支持）1×针插孔1×4芯迷你插孔输出接口：1×迷你D-sub15针（雌接口）、1×RS-232C 1×D-sub 9芯（雄接口）控制接口：1×RJ-45，10BASE-T/100BASE-TX 、1×USB 1×Type-A，Type-B其它参数：产品尺寸：365*962*252mm腹有诗书气自华产品重量：3.8kg整机功率：190W出师表两汉：诸葛亮先帝创业未半而中道崩殂，今天下三分，益州疲弊，此诚危急存亡之秋也。

海康客户端SDK使用手册V2.20

3.1.1 设备类型定义....................................................................................................................... 8 3.1.2 显示模式............................................................................................................................... 8 3.1.3 发送模式............................................................................................................................... 9 3.1.4 设备信息结构........................................................................................................................ 9 3.1.5 图像预览参数....................................................................................................................... 9 3.1.6 文件信息结构....................................................................................................................... 9 3.1.7 上传报警信息..................................................................................................................... 10 3.1.8 报警输出状态..................................................................................................................... 10 3.1.9 硬件解码预览图像参数..................................................................................................... 10 3.1.10 日志信息........................................................................................................................... 11 3.1.11 设备的状态信息............................................................................................................... 13 3.1.12 ATM DVR 上传交易信息 ................................................................................................. 14

HDS_AMS2100配置手册

1.1 硬件概述AMS2000系列有2100、2300、2500三种型号,其中2500包括直流和交流2种AMS2100:AMS2300:Control UnitsPower UnitCache Backup Battery Units Power/Ready/ Panel AssemblyPower ON/OFF MAIN SW Front view Rear viewControl UnitsPower UnitCache Backup Battery Units Power/Ready/ Panel AssemblyPower ON/OFF MAIN SW Front view Rear viewAMS2500:AMS2500-DC扩展柜：Cache Backup Battery UnitsPower/Ready/ Warning/ Alarm LEDs Panel Assembly Power ON/OFF MAIN SWPower Unit (RKH) Fan Unit Control UnitCache BackupBattery(Option) Front viewRear view Cache Backup Battery Units Power/Ready/ Warning/ Alarm LEDs Panel AssemblyPower ON/OFF MAIN SWFan Unit Control UnitCache BackupBattery(Option) Front viewRear view高密扩展柜：AMS2000系列多了一种高密扩展柜，容量为48块盘，实际上是从中间分开的两个柜子，左右两边的每个柜子各24块盘。

硬件参数对比：•ENCPower Front Rear view Disk Drives1.2 技术亮点(1) 在线升级，实现真正的active-active；(2) 高密扩展柜；只支持1T的SATA盘，与普通盘不同(3) SAS网络；(4) 支持所有多路径软件，将多路径安装部分交给主机工程师；(5) SNM2页面管理软件。

HDS NAS介绍

高性能NAS平台
价格
Essential NAS
2000 2000近线性
用于文件服务器、整合、文件共享和备份的标准解决方案
3100
1100c
1300c
1500c
性能
5
3200
价格
Essential NAS Platform 设备型号
• 现场升级能力 • 可从以前的产品升级
所有的指标基于双节点集群:
Accounts
IP Network LAN
Exchange Server
DB Server
NAS
SAN
FC Backup
IP FC
3
减少或消除部门内部的服务器和存储设备
SW Development
减少或消除部门内部的服务器和存储设备
Engineering
减少或消除部门内部的服务器和存储设备
Sales
25
ProtecTIER 设备架构概述
“它是一个磁带库，同时也是一个磁带驱动器”
Virtual Tape Library Appliance
集成的服务器和磁盘存储系统
光纤通道
备份服务器
ProtecTIER 应用程序
• 模拟磁带库单元，包括驱动器、磁带盒和机械臂 • 使用光纤通道 ( FC) 连接的磁盘存储系统作为备份介质
• 中等级别业务, 远程办公室，大型企业
• 为文件共享，备份和整合提供方案
• 适用于对性能和扩展能力 NAS Platform • 企业及产品，具有高级功能
• 企业级大型环境, 对性能要求高的场合
• 为整合, 高性能的企业应用提供解决方案
• 适用于对性能和扩展能力要求非常高的场合

LM331中文资料_中文手册_芯片中文资料_芯片中文手册

电压-频率变换器LM331LM331是美国NS公司生产的性能价格比较高的集成芯片。

LM331可用作精密的频率电压（F/V）转换器、A/D转换器、线性频率调制解调、长时间积分器以及其他相关的器件。

LM331为双列直插式8脚芯片，其引脚如图3所示。

LM331内部有（1）输入比较电路、（2）定时比较电路、（3）R-S触发电路、（4）复零晶体管、（5）输出驱动管、（6）能隙基准电路、（7）精密电流源电路、（8）电流开关、（9）输出保护点路等部分。

输出管采用集电极开路形式，因此可以通过选择逻辑电流和外接电阻，灵活改变输出脉冲的逻辑电平，从而适应TTL、DTL和CMOS 等不同的逻辑电路。

此外，LM331可采用单/双电源供电，电压范围为4～40V，输出也高达40V。

引脚1（PIN1）为电流源输出端，在f０（PIN3）输出逻辑低电平时，电流源ＩＲ输出对电容ＣＬ充电。

引脚2（PIN2）为增益调整，改变ＲＳ的值可调节电路转换增益的大小。

引脚3（PIN3）为频率输出端，为逻辑低电平，脉冲宽度由Ｒt和Ｃt决定。

引脚4（PIN4）为电源地。

引脚5（PIN5）为定时比较器正相输入端。

引脚6（PIN6）为输入比较器反相输入端。

引脚7（PIN7）为输入比较器正相输入端。

引脚8（PIN8）为电源正端。

LM331频率电压转换器V/F变换和F/V变换采用集成块LM331，LM331是美国NS公司生产的性能价格比较高的集成芯片，可用作精密频率电压转换器用。

LM331采用了新的温度补偿能隙基准电路，在整个工作温度范围内和低到4.0V电源电压下都有极高的精度。

同时它动态范围宽，可达100dB；线性度好，最大非线性失真小于0.01％，工作频率低到0.1Hz时尚有较好的线性；变换精度高，数字分辨率可达12位；外接电路简单，只需接入几个外部元件就可方便构成V/F或F/V等变换电路，并且容易保证转换精度。

图2是由LM331组成的电压频率变换电路，LM331内部由输入比较器、定时比较器、R－S触发器、输出驱动、复零晶体管、能隙基准电路和电流开关等部分组成。

HDSP2112S中文资料

ESD Protection at 1.5 kΩ, 100 pF .....................................................VZ=4.0 kV (each pin)
Figure 1. Enlarged Character Font Dimensions in inches (mm)
Tceh
D0-D7
Twd
Tdh
Input pulse levels —0.6 V to 2.4 v
Input pulse levels –0.6 V to 2.4 V
2000 Inﬁneon Technologies Corp. • Optoelectronics Division • San Jose, CA
0.112 (2.85)
C1 C2 C3 C4 C5
R1 0.030 (0.76) Typ.
R2
R3
0.01 (0.254)
R4
R5
R6
R7
0.189 (4.81)
0.026 (0.65) Typ.
Switching Speciﬁcations (over operating temperature range and VCC=4
Intensity Code Color Bin (For Yellow
0.209 (5.
HDSP211X OSRAM
WW
Z1
0.189 (4.79)
0.018 typ. (.46)
0.100 (2.54) typ.
0.160± (4.06±
DESCRIPTION
The HDSP2110S (Red), HDSP2111S (Yellow), HDSP21 ciency Red), HDSP2113S (Green), HDSP2114S (High E Green), and HDSP2115S (Soft Orange) are eight digit, 5 alphanumeric Intelligent Display devices. The 0.20 inch packaged in a rugged, high quality, optically transparen spacing, 28 pin plastic DIP.

杰斯创说明书

LED 视频处理器
LED Video Processor
用户手册
User manual
目录
声明 .................................................................................................................................................................... 2 关于本手册 .....................................................................................................................................................2 商标信用 ..........................................................................................................................................................2 安全防范措施 ................................................................................................................................................3 附件 .................................................................................................................................................................... 4 功能介绍 ..........................................................................................................................................................6 端口和技术规格说明 .................................................................................................................................. 8 安装................................................................................................................................................................. 10

HDSP-210X_08资料

HDSP-210x Series, HDSP-211x Series, HDSP-250x SeriesFeatures• X stackable (HDSP-21xx)• XY stackable (HDSP-250x)• 128 sharacter ASCII decoder • Programmable functions • 16 user definable characters• Multi-level dimming and blanking • TTL compatible CMOS IC • Wave solderableApplications• Computer peripherals • Industrial instrumentation • Medical equipment• Portable data entry devices • Cellular phones• Telecommunications equipment • Test equipmentDescriptionThe HDSP-210x/-211x/-250x series of products is ideal for applications where displaying eight or more characters of dot matrix information in an aes-thetically pleasing manner is required. These devices are 8-digit, 5 x 7 dot matrix, alphanumeric displays and are all packaged in a standard 15.24 mm (0.6 inch) 28 pin DIP . The on-board CMOS IC has the ability to decode 128 ASCII characters which are permanently stored in ROM. In addition, 16 programmable symbols may be stored in on- board ROM, allowing considerable flexibility for dis-playing additional symbols and icons. Seven brightness levels provide versatility in adjusting the display intensity and power consumption. The HDSP-210x/-211x/-250x products are designed for standard microprocessor interface techniques. The display and special features are accessed through a bidirectional 8-bit data bus.Device Selection Guide AlGaAs High EfficiencyFont Height RedRedOrangeYellowGreen0.2 inches HDSP-2107 HDSP-2112 HDSP-2110 HDSP-2111 HDSP-21130.27 inchesHDSP-2504HDSP-2502HDSP-2500HDSP-2501HDSP-2503HDSP-210x SeriesEight Character 5 mm and 7 mm Smart Alphanumeric DisplaysData SheetESD WARNING: STANDARD CMOS HANDLING PRECAUTIONS SHOULD BE OBSERVED TO AVOID STATIC DISCHARGE.Absolute Maximum RatingsSupply Voltage, V DD to Ground [1] -0.3 to 7.0 V Operating Voltage, V DD to Ground [2] 5.5 VInput Voltage, Any Pin to Ground-0.3 to V DD +0.3 V Free Air Operating Temperature Range, T A [3] -45°C to +85°C Storage Temperature Range, T S -55°C to +100°C Relative Humidity (non-condensing) 85%Soldering Temperature[1.59 mm (0.063 in.) Below Body] Solder Dipping 260°C for 5 secs Wave Soldering250°C for 3 secs ESD Protection @ 1.5 kΩ, 100 pFV Z = 4 kV (each pin)Notes:1. Maximum Voltage is with no LEDs illuminated.2. 20 dots ON in all locations at full brightness.3. Maximum supply voltage is 5.25 V for operation above 70°C.PIN FUNCTION ASSIGNMENT TABLENOTES:1. DIMENSIONS ARE IN mm (INCHES).2. UNLESS OTHERWISE SPECIFIED, TOLERANCE ON ALL DIMENSIONS IS ± 0.25 mm (0.010 INCH).3. FOR YELLOW AND GREEN DEVICES ONLY.NOTES:1. DIMENSIONS ARE IN mm (INCHES).2. UNLESS OTHERWISE SPECIFIED, TOLERANCE ON ALL DIMENSIONS IS ± 0.25 mm (0.010 INCH).3. FOR YELLOW AND GREEN DEVICES ONLY.ASCII Character Set HDSP-210X, HDSP-211X, HDSP-250X SeriesRecommended Operating ConditionsParameter Symbol Minimum Nominal Maximum Units Supply Voltage V DD 4.5 5.0 5.5 VElectrical Characteristics Over Operating Temperature Range (-45°C to +85°C)4.5 V < V DD <5.5 V, unless otherwise specifiedT A = 25°C -45°C < T A < + 85°CV DD = 5.0 4.5 V < V DD < 5.5 VParameter Symbol Typ. Max. Min. Max. Units Test Conditions Input Leakage I IH 1.0 µA V IN = 0 to V DD, (Input without pullup) I IL-1.0 pins CLK, D0-DA0-A4Input Current I IPL-11 -18 -30 µA V IN = 0 to V DD, (Input with pullup) pins CLS, RST,WR, RD, CE, FL I DD Blank I DD (BLK) 0.5 3.0 4.0 mA V IN = V DDI DD 8 digits I DD(V) 200 255 330 mA “V” on in all 812 dots/character[1,2]locationsI DD 8 digits I DD(#) 300 370 430 mA “#” on in al20 dots/character[1,2,3,4] locations Input Voltage High V IH 2.0 V DD V+0.3Input Voltage Low V IL GND 0.8 V-0.3 VOutput Voltage High V OH 2.4 V V DD = 4.5 V,I OH = -40 µA Output Voltage Low V OL0.4 V V DD = 4.5 V, D0-D7 I OL = 1.6 mA Output Voltage Low V OL0.4 V V DD = 4.5 V, CLK I OL = 40 µA High Level Output I OH-60 mA V DD = 5.0 V CurrentLow Level Output I OL50 mA V DD = 5.0 V CurrentThermal Resistance R q J-C15 °C/WIC Junction-to-CaseNotes:1. Average I DD measured at full brightness. See Table 2 in Control Word Section for I DD at lower brightness levels. Peak I DD = 28/15 x I DD (#).2. Maximum I DD occurs at -55°C.3. Maximum I DD(#) = 355 mA at V DD = 5.25 V and IC T J = 150°C.4. Maximum I DD(#) = 375 mA at V DD =5.5 V and IC T J = 150°C.Optical Characteristics at 25°C[1]V DD = 5.0 V at Full BrightnessLuminous Intensity Peak DominantCharacter Average (#) Wavelength Wavelength Part Iv (mcd) l Peak l d Description Number Min. Typ. (nm) (nm) AlGaAs HDSP-2107 8.0 15.0 645 637-2504HER HDSP-2112 2.5 7.5 635 626-2502Orange HDSP-2110 2.5 7.5 600 602-2500Yellow HDSP-2111 2.5 7.5 583 585-2501High Performance HDSP-2113 2.5 7.5 568 574 Green -2503Note:1. Refers to the initial case temperature of the device immediately prior to measurement.AC Timing Characteristics Over Temperature Range (-45°C to +85°C)4.5 V < V DD <5.5 V, unless otherwise specifiedReferenceNumber Symbol Description Min.[1]Units1 t ACC Display Access TimeWrite 210Read 230 ns2 t ACS Address Setup Time to Chip Enable 10 ns3 t CE Chip Enable Active TimeWrite 140Read 160 ns4 t ACH Address Hold Time to Chip Enable 20 ns5 t CER Chip Enable Recovery Time 60 ns6 t CES Chip Enable Active Prior to Rising Edge ofWrite 140Read 160 ns7 t CEH Chip Enable Hold Time to Rising Edge ofRead/Write Signal[2,3]0 ns8 t W Write Active Time 100 ns9 t WSU Data Write Setup Time 50 ns10 t WH Data Write Hold Time 20 ns11 t R Chip Enable Active Prior to Valid Data 160 ns12 t RD Read Active Prior to Valid Data 75 ns13 t DF Read Data Float Delay 10 nst RC Reset Active Time300 ns Notes:1. Worst case values occur at an IC junction temperature of 150°C.2. For designers who do not need to read from the display, the Read line can be tied to V DD and the Write and Chip Enable lines can be tied to-gether.3. Changing the logic levels of the Address lines when CE = “0” may cause erroneous data to be entered into the Character RAM, regardless of the logic levels of the WR and RD lines.4. The display must not be accessed until after 3 clock pulses (110 µs min. using the internal refresh clock) after the rising edge of the reset line.Write Cycle Timing DiagramAC Timing Characteristics Over Temperature Range (-45°C to +85°C)4.5 V < V DD < 5.5 V, unless otherwise specified Symbol Description 25°C Typ. Min.[1]UnitsF OSC Oscillator Frequency 57 28 kHz F RF [2] Display Refresh Rate 256 128 Hz F FL [3] Character Flash Rate 2 1 Hz t ST [4]Self Test Cycle Time4.69.2secNotes:1. Worst case values occur at an IC junction temperature of 150°C.2. F RF = F OSC /224.3. F FL = F OSC /28,672.4. t ST = 262,144/F OSC .INPUT PULSE LEVELS: 0.6 V to 2.4 VRead Cycle Timing DiagramRelative Luminous Intensity vs. TemperatureINPUT PULSE LEVELS: 0.6 V to 2.4 VOUTPUT REFERENCE LEVELS: 0.6 V to 2.2 V OUTPUT LOADING = 1 TTL LOAD AND 100 pFR E L A T I V E L U M I N O U S I N T E NS I T Y (N O R M A L I Z E D T O 1 A T 25°C )T A – AMBIENT TEMPERATURE – °C3.53.02.51.51.00.52.0Electrical DescriptionPin Function DescriptionRESET (RST, pin 1) Initializes the display.FLASH (FL, pin 2) FL low indicates an access to the Flash RAM and is unaffected by thestate of address lines A3-A4.ADDRESS INPUTS Each location in memory has a distinct address. Address inputs (A0-A2) (A0-A4, pins 3-6, 10) select a specific location in the Character RAM, the Flash RAM or aparticular row in the UDC (User-Defined Character) RAM. A3-A4are usedto select which section of memory is accessed. Table 1 shows thelogic levels needed to access each section of memory.Table 1. Logic Levels to Access MemorySection of Memory FL A4 A3A2 A1 A0Flash RAM 0 X X Char. AddressUDC Address Register 1 0 0 Don’t CareUDC RAM 1 0 1 Row AddressControl Word Register 1 1 0 Don’t CareCharacter RAM 1 1 1 Character AddressCLOCK SELECT Used to select either an internal (CLS = 1) or external (CLS = 0) clock source. (CLS, pin 11)CLOCK INPUT/OUTPUT Outputs the master clock (CLS = 1) or inputs a clock (CLS = 0) for slave displays. (CLK, pin 12)WRITE (WR, pin 13) Data is written into the display when the WR input is low and the CE input is low. CHIP ENABLE (CE, pin 17) Must be at a logic low to read or write data to the display and must go high betweeneach read and write cycle.READ (RD, pin 18) Data is read from the display when the RD input is low and the CE input is low. DATA Bus (D0-D7, Used to read from or write to the display.pins 19, 20, 23-28)GND (SUPPLY) (pin 15) Analog ground for the LED drivers.GND (LOGIC) (pin 16) Digital ground for internal logic.V DD (POWER) (pin 14) Positive power supply input.F i g u r e 1. H D S P -210X /-211X /-212X /-250X i n t e r n a l b l o c k d i a g r a m .Character RAM This RAM stores either ASCII character data or a UDC RAM address.Flash RAMThis is a 1 x 8 RAM which stores Flash data.User-Defined Character RAM This RAM stores the dot pattern for custom characters.(UDC RAM)User-Defined Character This register is used to provide the address to the UDC RAM when the user is Address Registerwriting or reading a custom character.(UDC Address Register)Control Word Register This register allows the user to adjust the display brightness, flash individualcharacters, blink, self test, or clear the display.Display Internal Block DiagramFigure 1 shows the internal block diagram of the HDSP-210X/-211X/-250X displays. The CMOS IC consists of an 8 byte Character RAM, an 8 bit Flash RAM, a 128 character ASCII decoder, a 16 character UDC RAM, a UDC AddressRegister, a Control Word Register, and refresh circuitry necessary to synchronize the decoding and driving of eight 5 x 7 dot matrix characters. The major user-acces-sible portions of the display are listed below:Character RAMFigure 2 shows the logic levels needed to access the HDSP-210X/-211X/-250X Character RAM. During a normal access, the CE = “0” and either RD = “0” or WR = “0.” However, erroneous data may be written into the Character RAM if the address lines are unstable when CE = “0” regardless of the logic levels of the RD or WR lines. Address lines A 0-A 2 are used to select the location in the Character RAM. Two types of data can be stored in each Character RAM location: an ASCII code or a UDC RAM address. Data bit D 7 is used to differentiate between the ASCII character and a UDC RAM address. D 7 = 0 enables the ASCII decoder and D 7 = 1 enables the UDC RAM. D 0-D 6 are used to input ASCII data and D 0-D 3 are used to input a UDC address.Figure 2. Logic levels to access the character RAM.CE FL A 4A 3A 2A 1A 0RST WR RD CHARACTER ADDRESSSYMBOL IS ACCESSED IN LOCATIONSPECIFIED BY THE CHARACTER ADDRESS ABOVE 0100011111011UNDEFINEDCONTROL SIGNALSCHARACTER RAM ADDRESSCHARACTER RAM DATA FORMATWRITE TO DISPLAY READ FROM DISPLAY UNDEFINED000 = LEFT MOST 111 = RIGHT MOSTD 7D 6D 5D 4D 3D 2D 1D 00128 ASCII CODEXXXUDC CODE1DISPLAY0 = LOGIC 0; 1 = LOGIC 1; X = DO NOT CAREDIG 0DIG 1DIG 2DIG 3DIG 4DIG 5DIG 6DIG 7001010011100101110111000UDC RAM and UDC Address RegisterFigure 3 shows the logic levels needed to access the UDC RAM and the UDC Address Register. The UDC Address Register is eight bits wide. The lower four bits (D 0-D 3) are used to select one of the 16 UDC locations. The upper four bits (D 4-D 7) are not used. Once the UDC address has been stored in the UDC Address Register, the UDC RAM can be accessed.To completely specify a 5 x 7 character, eight write cycles are required. One cycle is used to store the UDC RAM address in the UDC Address Register and seven cycles are used to store dot data in the UDC RAM. Data is entered by rows and one cycle is needed to access each row. Figure 4 shows the organization of a UDC character assuming the symbol to be stored is an “F.” A 0-A 2 are used to select the row to be accessed and D 0-D 4 are used to transmit the row dot data. The upper three bits (D 5-D 7) are ignored. D 0 (least significant bit) corresponds to the right most column of the 5 x 7 matrix and D 4 (most significant bit) corresponds to the left most column of the 5 x 7 matrix.Flash RAMFigure 5 shows the logic levels needed to access the Flash RAM. The Flash RAM has one bit associated with each location of the Character RAM. The Flash input is used to select the Flash RAM while address lines A 3-A 4 are ignored. Address lines A 0-A 2 are used to select the location in the Flash RAM to store the attribute. D 0 is used to store or remove the flash attribute. D 0 = “1” stores the attribute and D 0 = “0” removes the attribute.When the attribute is enabled through bit 3 of the Control Word and a “1” is stored in the Flash RAM, the corresponding character will flash at approximately 2 Hz. The actual rate is dependent on the clock frequency. For an external clock the flash rate can be calculated by dividing the clock frequency by 28,672.Figure 4. Data to load “”F’’ into the UDC RAM.Figure 3. Logic levels to access a UDC character.CE FL A 4A 3A 2A 1A 0RST WR RD 010001101XXX011UNDEFINEDCONTROL SIGNALSUDC ADDRESS REGISTER ADDRESSUDC ADDRESS REGISTER DATA FORMATWRITE TO DISPLAY READ FROM DISPLAY UNDEFINED000 = ROW 1110 = ROW 7D 7D 6D 5D 4D 3D 2D 1D 0XUDC CODEXXXFL A 4A 3A 2A 1A 011ROW SELECTUDC RAM ADDRESSUDC RAM C C DATA FORMATO O L L 150 = LOGIC 0; 1 = LOGIC 1; X = DO NOT CARED 7D 6D 5D 4D 3D 2D 1D 0XDOT DATAXXCE RST WR RD 0100011011UNDEFINEDCONTROL SIGNALSWRITE TO DISPLAY READ FROM DISPLAY UNDEFINEDC C C C C O O O O O L L L L L 1 2 3 4 5D 4D 3D 2D 1D 0UDC CHARACTER HEX CODE 1 1 1 1 1 ROW 1 • • • • • 1F 1 0 0 0 0 ROW 2 • 101 0 0 0 0 ROW 3 •101 1 1 1 0 ROW 4 • • • • 1D 1 0 0 0 0 ROW 5 • 101 0 0 0 0 ROW 6 • 101 0 0 0 0 ROW 7• 10IGNORED0 = LOGIC 0; 1 = LOGIC 1; * = ILLUMINATED LEDFigure 5. Logic levels to access the flash RAM.Table 2. Current Requirements at Different Brightness Levels V DD = 5.0 V % Current at 25°C Symbol D 2 D 1 D 0 Brightness Typ.UnitsI DD (V) 0 0 0 100 200 mA 0 0 1 80 160 mA 0 1 0 53 106 mA 0 1 1 40 80 mA 1 0 0 27 54 mA 1 0 1 20 40 mA111326mAFigure 6. Logic levels to access the control word registerControl Word RegisterFigure 6 shows how to access the Control Word Register. This 8-bit register performs five functions: Brightness control, Flash RAM control, Blinking, Self Test, and Clear. Each function is independent of the others; however, all bits are updated during each Control Word write cycle.Brightness (Bits 0-2)Bits 0-2 of the Control Word adjust the brightness of the display. Bits 0-2 are interpreted as a three bit binary code with code (000) corresponding to maximum brightness and code (111) corresponding to a blanked display. In addition to varying the display brightness, bits 0-2 also vary the average value of I DD . I DD can be calculated at any brightness level by multiplying the percent brightness level by the value of I DD at the 100% brightness level. These values of I DD are shown in Table 2.Flash Function (Bit 3)Bit 3 determines whether the flashing character attribute is on or off. When bit 3 is a“1,” the output of the Flash RAM is checked. If the content of a location in the Flash RAM is a “1,” the associated digit will flash at approximately 2 Hz. For an external clock, the blink rate can be calculated by driving the clock frequency by 28,672. If the flash enable bit of the Control Word is a “0,” the content of the Flash RAM is ignored. To use this function with multiple display systems, see the Display Reset section.Blink Function (Bit 4)Bit 4 of the Control Word is used to synchronize blinking of all eight digits of the display. When this bit is a “1” all eight digits of the display will blink at approximately 2 Hz. The actual rate is dependent on the clock frequency. For an external clock, the blink rate can be calculated by dividing the clock frequency by 28,672. This function will override the Flash function when it is active. To use this function with multiple display systems, see the Display Reset section.CE FL A 4A 3A 2A 1A 0RST WR RD 0100011XX011UNDEFINEDREMOVE FLASH ATSPECIFIED DIGIT LOCATION STORE FLASH ATSPECIFIED DIGIT LOCATIONCONTROL SIGNALS FLASH RAM ADDRESS FLASH RAM DATA FORMAT0 = LOGIC 0; 1 = LOGIC 1; X = DO NOT CAREWRITE TO DISPLAY READ FROM DISPLAY UNDEFINEDD 7D 6D 5D 4D 3D 2D 1D 0XXXXXXX01CHARACTER ADDRESS000 = LEFT MOST 111 = RIGHT MOSTCE FL A 4A 3A 2A 1A 0RST WR RD 01000111XXX1011UNDEFINEDCONTROL SIGNALSCONTROL WORD ADDRESSCONTROL WORD DATA FORMAT0 = LOGIC 0; 1 = LOGIC 1; X = DO NOT CARE0 DISABLE FLASH 1 ENABLE FLASHBRIGHTNESS CONTROL LEVELS 0 DISABLE BLINKING 1 ENABLE BLINKING0 NORMAL OPERATION1 CLEAR FLASH AND CHARACTER RAMS 0 X NORMAL OPERATION; X IS IGNORED 1 X START SELF TEST; RESULT GIVEN IN X X = 0 FAILED X = 1 PASSED WRITE TO DISPLAY READ FROM DISPLAY UNDEFINEDD 7D 6D 5D 4D 3D 2D 1D 0CSSBLFB000100%00180%01053%01140%10027%10120%11013%1110%BBFigure 7. Logic levels to reset the display.CE RST WR RD 0 = LOGIC 0; 1 = LOGIC 1; X = DO NOT CARE NOTE:IF RST, CE, AND WR ARE LOW, UNKNOWN DATA MAY BE WRITTEN INTO THE DISPLAY.FL 01XXXXXA 4 -A 0D 7 -D 0Self Test Function (Bits 5, 6)Bit 6 of the Control Word Register is used to initiate the self test function. Results of the internal self test are stored in bit 5 of the Control Word. Bit 5 is a read only bit where bit 5 = “1” indicates a passed self test and bit 5 = “0” indicates a failed self test.Setting bit 6 to a logic 1 will start the self test function. The built-in self test function of the IC consists of two internal routines which exercise major portions of the IC and illuminate all of the LEDs. The first routine cycles the ASCII decoder ROM through all states and performs a checksum on the output. If the checksum agrees with the correct value, bit 5 is set to “1.” The second routine provides a visual test of the LEDs using the drive circuitry. This is accomplished by writing checkered and inverse checkered patterns to the display. Each pattern is displayed for approximately 2 seconds.During the self test function the display must not be accessed. The time needed to execute the self test function is calculated by multiplying the clock period by 262,144. For example, assume a clock frequency of 58 KHz, then the time to execute the self test function frequency is equal to (262,144/58,000) = 4.5 second duration.At the end of the self test function, the Character RAM is loaded with blanks, the Control Word Register is set to zeros except for bit 5, the Flash RAM is cleared, and the UDC Address Register is set to all ones.Clear Function (Bit 7)Bit 7 of the Control Word will clear the Character RAM and the Flash RAM. Setting bit 7 to a “1” will start the clear function. Three clock cycles (110 ms minimum using the internal refresh clock) are required to complete the clear function. The display must not be accessed while the display is being cleared. When the clear function has been completed, bit 7 will be reset to a “0.” The ASCII character code for a space (20H) will be loaded into the Character RAM to blank the display and the Flash RAM will be loaded with “0”s. The UDC RAM, UDC Address Register, and the remainder of the Control Word are unaffected.Display ResetFigure 7 shows the logic levels needed to Reset the display. The display should be Reset on Power-up. The external Reset clears the Character RAM, Flash RAM, Control Word and resets the internal counters. After the rising edge of the Reset signal, three clock cycles (110 µs minimum using the internal refresh clock) are required to complete the reset sequence. The display must not be accessed while the display is being reset. The ASCII Character code for a space (20H) will be loaded into the Character RAM to blank the display. The Flash RAM and Control Word Register are loaded with all “0”s. The UDC RAM and UDC Address Register are unaffected. All displays which operate with the same clock source must be simultaneously reset to synchronize the Flashing and Blinking functions.Mechanical and Electrical ConsiderationsThe HDSP-210X/-211X/-250X are 28 pin dual-in-line packages with 26 external pins. The devices can be stacked horizontally and vertically to create arrays of any size. The HDSP-210X/-211X/-250X are designed to operate continuously from -45°C to +85°C with a maximum of 20 dots on per character at 5.25 V. Illuminating all thirty-five dots at full brightness is not recommended.The HDSP-210X/-211X/-250X are assembled by die attaching and wire bonding 280 LED chips and a CMOS IC to a thermally conductive printed circuit board. A poly-carbonate lens is placed over the PC board creating an air gap over the LED wire bonds. A protective cap creates an air gap over the CMOS IC. Backfill epoxy environmentally seals the display package. This package construction makes the display highly tolerant to temperature cycling and allows wave soldering.The inputs to the IC are protected against static discharge and input current latchup. However, for best results standard CMOS handling precautions should be used. Prior to use, the HDSP-210X/-211X/-250X should be stored in antistatic tubes or in conductive material. During assembly, a grounded conductive work area should be used, and assembly personnel should wear conductive wrist straps. Lab coats made of synthetic material should be avoided since they are prone to static buildup. Input current latchup is caused when the CMOS inputs are subjected to either a voltage below ground (V IN < ground) or to a voltage higher than V DD (V IN > V DD ) and when a high current is forced into the input. To prevent input current latchup and ESD damage, unused inputs should be connected either to ground or to V DD . Voltages should not be applied to the inputs until V DD has been applied to the display.Thermal ConsiderationsThe HDSP-210X/-211X/-212X/250X have been designed to provide a low thermal resistance path for the CMOS IC to the 26 package pins. Heat is typically conducted through the traces of the printed circuit board to free air. For most applications no additional heatsinking is required.Measurements were made on a 32 character display string to determine the thermal resistance of the display assembly. Several display boards were constructed using 0.062 in. thick printed circuit material, and one ounce copper 0.020 in. traces. Some of the device pins were connected to a heatsink formed by etching a copper area on the printed circuit board surrounding the display. A maximally metallized printed circuit board was also evaluated. The junction temperature was measured for displays soldered directly to these PC boards, displays installed in sockets, and finally displays installed in sockets with a filter over the display to restrict airflow. The results of these thermal resistance measurements, Rq J-A are shown in Table 3 and include the effects of Rq J-C .Ground ConnectionsTwo ground pins are provided to keep the internal IC logic ground clean. The designer can, when necessary, route the analog ground for the LED drivers separately from the logic ground until an appropriate ground plane is available. On long interconnections between the display and the host system, the designer can keep voltage drops on the analog ground from affecting the display logic levels by isolating the two grounds.The logic ground should be connected to the same ground potential as the logic interface circuitry. The analog ground and the logic ground should be connected at a common ground which can withstand the current introduced by the switching LED drivers. When separate ground connections are used, the analog ground can vary from -0.3 V to +0.3 V with respect to the logic ground. Voltage below -0.3 V can cause all dots to be on. Voltage above +0.3 V can cause dimming and dot mismatch.Table 3. Thermal Resistance, q JA , Using Various Amounts of Heatsinking Material Heatsinking Metal W/Sockets W/O Sockets W/Sockets per Device W/O Filter W/O Filter W/Filter sq. in. (Avg.) (Avg.)(Avg.)Units0 31 30 35 °C/W 1 31 28 33 °C/W 330 26 33 °C/W Max. Metal 29 25 32 °C/W 4 Board Avg302733°C/WSoldering and Post SolderCleaning Instructions for the HDSP-210X/-211X/-250XThe HDSP-210X/-211X/-250X may be hand soldered or wave soldered with SN63 solder. When hand soldering, it is recommended that an electronically temperature controlled and securely grounded soldering iron be used. For best results, the iron tip temperature should be set at 315°C (600°F). For wave soldering, a rosin-based RMA flux can be used. The solder wave temperature should be set at 245°C ± 5°C (473°F ± 9°F), and the dwell in the wave should be set between 11 /2 to 3 seconds for optimum soldering. The preheat temperature should not exceed 105°C (221°F) as measured on the solder side of the PC board.For additional information on soldering and post solder cleaning, see Application Note 1027, Soldering LED Com-ponents .Contrast EnhancementThe objective of contrast enhancement is to provide good readability in a variety of ambient lighting condi-tions. For information on contrast enhancement see Application Note 1015, Contrast Enhancement Techniques for LED Displays .Color Bin LimitsColor Range (nm)Color BinMin. Max.Yellow 3 581.5 585.0 4 584.0 587.5 5 586.5 590.0 6 589.0 592.5 7 591.5 595.0Green 1 576.0 580.0 2 573.0 577.0 3 570.0 574.04567.0571.5Note:Test conditions as specified in Optical Char-acteristic table.Intensity Bin Limits for HDSP-2107 Intensity Range (mcd)Bin Min. Max.I 5.12 9.01J 7.68 13.52K 11.52 20.28L 17.27 30.42M25.3945.63Note:Test conditions as specified in Optical Char-acteristic table.Intensity Bin Limits for HDSP-211x and HDSP-250x (Except HDSP-2504) Intensity Range (mcd)Bin Min. Max.G 2.50 4.00H 3.41 6.01I 5.12 9.01J 7.68 13.52K11.5220.28Note:Test conditions as specified in Optical Char-acteristic table.For product information and a complete list of distributors, please go to our website: Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies Limited in the United States and other countries.Data subject to change. Copyright © 2005-2008 Avago Technologies Limited. All rights reserved. Obsoletes 5989-3183EN AV02-0629EN - May 9, 2008Intensity Bin Limit for HDSP-2504BinIntensity Range (mcd)Min.MaxJ 7.6813.52K 11.5220.28L 17.2730.42M 25.9145.63Note:Test conditions as specified in Optical Charac-teristic table.。

HDSP-3351-G0000中文资料

Features• Low Power Consumption • Industry Standard Size• Industry Standard Pinout • Choice of Character Size7.6 mm (0.30 in), 10 mm (0.40 in), 10.9 mm (0.43 in), 14.2 mm (0.56 in), 20 mm (0.80 in)• Choice of ColorsAlGaAs Red, High Efficiency Red (HER), Yellow, Green• Excellent Appearance Evenly Lighted Segments±50° Viewing Angle• Design FlexibilityCommon Anode or Common CathodeSingle and Dual DigitLeft and Right Hand Decimal Points±1. Overflow Character• Categorized for Luminous IntensityYellow and Green Categorized for ColorUse of Like Categories Yields a Uniform Display• Excellent for Long Digit String Multiplexing DescriptionThese low current seven segment displays are designed for applica-tions requiring low power consumption. They are tested and selected for their excellent low current characteristics to ensure that the segments are matched at low currents. Drive currents as low as 1 mA per segment are available.Pin for pin equivalent displays are also available in a standard current or high light ambient design. The standard current displays are available in all colors and are ideal for most applica-tions. The high light ambient displays are ideal for sunlight ambients or long string lengths. For additional information see the 7.6 mm Micro Bright Seven Segment Displays, 10 mm Seven Segment Displays, 7.6 mm/10.9 mm Seven Segment Displays, 14.2 mm Seven Segment Displays, 20 mm Seven Segment Displays, or High Light Ambient Seven Segment Displays data sheets.Low Current Seven SegmentDisplays Technical Data HDSP-335x SeriesHDSP-555x SeriesHDSP-751x SeriesHDSP-A10x Series HDSP-A80x Series HDSP-A90x Series HDSP-E10x Series HDSP-F10x Series HDSP-G10x Series HDSP-H10x Series HDSP-K12x, K70x Series HDSP-N10x SeriesHDSP-N40x SeriesDevicesAlGaAs HER Yellow Green Package HDSP-HDSP-HDSP-HDSP-Description Drawing A1017511A801A9017.6 mm Common Anode Right Hand Decimal A A1037513A803A9037.6 mm Common Cathode Right Hand Decimal B A1077517A807A9077.6 mm Common Anode ±1. Overflow C A1087518A808A9087.6 mm Common Cathode ±1. Overflow D F10110 mm Common Anode Right Hand Decimal E F10310 mm Common Cathode Right Hand Decimal F F10710 mm Common Anode ±1. Overflow G F10810 mm Common Cathode ±1. Overflow H G10110 mm Two Digit Common Anode Right Hand Decimal X G10310 mm Two Digit Common Cathode Right Hand Decimal Y E100335010.9 mm Common Anode Left Hand Decimal I E101335110.9 mm Common Anode Right Hand Decimal J E103335310.9 mm Common Cathode Right Hand Decimal K E106335610.9 mm Universal ±1. Overflow[1]L H101555114.2 mm Common Anode Right Hand Decimal M H103555314.2 mm Common Cathode Right Hand Decimal N H107555714.2 mm Common Anode ±1. Overflow O H108555814.2 mm Common Cathode ±1. Overflow P K121K70114.2 mm Two Digit Common Anode Right Hand Decimal R K123K70314.2 mm Two Digit Common Cathode Right Hand Decimal S N10020 mm Common Anode Left Hand Decimal Q N101N40120 mm Common Anode Right Hand Decimal T N103N40320 mm Common Cathode Right Hand Decimal U N10520 mm Common Cathode Left Hand Decimal V N106N40620 mm Universal ±1. Overflow[1]W Note:1. Universal pinout brings the anode and cathode of each segment’s LED out to separate pins. See internal diagrams L or W.Part Numbering System5082-x xx x-x x x xxHDSP-x xx x-x x x xxMechanical Options[1]00: No mechanical optionColor Bin Options[1,2]0: No color bin limitationMaximum Intensity Bin[1,2]0: No maximum intensity bin limitationMinimum Intensity Bin[1,2]0: No minimum intensity bin limitationDevice Configuration/Color[1]G: GreenDevice Specific Configuration[1]Refer to respective datasheetPackage[1]Refer to Respective datasheetNotes:1. For codes not listed in the figure above, please refer to the respective datasheet or contact your nearest Agilent representative fordetails.2. Bin options refer to shippable bins for a part-number. Color and Intensity Bins are typically restricted to 1 bin per tube (excep-tions may apply). Please refer to respective datasheet for specific bin limit information.Package DimensionsPackage Dimensions (cont.)Package Dimensions (cont.)*The Side View of package indicates Country of Origin.Package Dimensions (cont.)Package Dimensions (cont.)Package Dimensions (cont.)Internal Circuit DiagramInternal Circuit Diagram (cont.)Absolute Maximum RatingsAlGaAs Red - HDSP-HERA10X/E10X/H10X HDSP-751X/Yellow GreenK12X/N10X/N40X335X/555X/HDSP-A80X HDSP-A90X Description F10X, G10X Series K70X Series Series Series Units Average Power per Segment or DP375264mW Peak Forward Current per 45mA Segment or DPDC Forward Current per15[1]15[2]mA Segment or DPOperating Temperature Range-20 to +100-40 to +100°C Storage Temperature Range -55 to +100°C Reverse Voltage per Segment 3.0V or DPWave Soldering Temperature for 3Seconds (1.60 mm [0.063 in.] below 250°C seating body)Notes:1. Derate above 91°C at 0.53 mA/°C.2. Derate HER/Yellow above 80°C at 0.38 mA/°C and Green above 71°C at 0.31 mA/°C.Electrical/Optical Characteristics at T A = 25°CAlGaAs RedDeviceSeriesHDSP-Parameter Symbol Min.Typ.Max.Units Test Conditions315600I F = 1 mA A10x3600I F = 5 mA330650I F = 1 mAF10x, G10x3900I F = 5 mA390650I F = 1 mA E10x Luminous Intensity/Segment[1,2]I Vµcd(Digit Average)3900I F = 5 mA400700I F = 1 mAH10x, K12x4200I F = 5 mA270590I F = 1 mAN10x, N40x3500I F = 5 mA1.6I F = 1 mAForward Voltage/Segment or DP V F 1.7V I F = 5 mA1.82.2I F = 20 mA PkAll Devices Peak WavelengthλPEAK645nmDominant Wavelength[3]λd637nmReverse Voltage/Segment or DP[4]V R 3.015V I R = 100 µATemperature Coefficient of∆V F/°C-2 mV mV/°CV F/Segment or DPA10x255F10x, G10x320E10x340Thermal Resistance LED RθJ-PIN°C/W/SegH10x, K12x Junction-to-Pin400N10x, N40x430High Efficiency RedDeviceSeriesHDSP-Parameter Symbol Min.Typ.Max.Units Test Conditions160270I F = 2 mA 751x1050I F = 5 mA200300I F = 2 mA Luminous Intensity/Segment[1,2]I V mcd(Digit Average)1200I F = 5 mA335x, 555x,K70x270370I F = 2 mA1480I F = 5 mA1.6I F = 2 mAForward Voltage/Segment or DP V F 1.7V I F = 5 mA2.1 2.5I F = 20 mA Pk All Devices Peak WavelengthλPEAK635nmDominant Wavelength[3]λd626nmReverse Voltage/Segment or DP[4]V R 3.030V I R = 100 µATemperature Coefficient of∆V F/°C-2mV/°CV F/Segment or DP751x200335x Thermal Resistance LED RθJ-PIN280°C/WJunction-to-Pin555x, K70x345YellowDeviceSeriesHDSP-Parameter Symbol Min.Typ.Max.Units Test Conditions Luminous Intensity/Segment[1,2]250420I F = 4 mA(Digit Average)I V mcd1300I F = 10 mA1.7I F = 4 mAForward Voltage/Segment or DP V F 1.8V I F = 5 mA A80x2.1 2.5I F = 20 mA PkPeak WavelengthλPEAK583nmDominant Wavelength[3,5]λd581.5585592.5nmReverse Voltage/Segment or DP[4]V R 3.030V I R = 100 µATemperature Coefficient of∆V F/°C-2mV/°CV F/Segment or DPThermal Resistance LED RθJ-PIN200°C/WJunction-to-PinGreenDeviceSeriesHDSP-Parameter Symbol Min.Typ.Max.Units Test Conditions Luminous Intensity/Segment[1,2]250475I F = 4 mA(Digit Average)I V mcd1500I F = 10 mA1.9I F = 4 mAForward Voltage/Segment or DP V F 2.0V I F = 10 mA A90x2.1 2.5I F = 20 mA PkPeak WavelengthλPEAK566nmDominant Wavelength[3,5]λd571577nmReverse Voltage/Segment or DP[4]V R 3.030V I R = 100 µATemperature Coefficient of∆V F/°C-2mV/°CV F/Segment or DPThermal Resistance LED RθJ-PIN200°C/WJunction-to-PinNotes:1. Device case temperature is 25°C prior to the intensity measurement.2. The digits are categorized for luminous intensity. The intensity category is designated by a letter on the side of the package.3. The dominant wavelength, λd, is derived from the CIE chromaticity diagram and is the single wavelength which defines the color of thedevice.4. Typical specification for reference only. Do not exceed absolute maximum ratings.5. The yellow (HDSP-A800) and Green (HDSP-A900) displays are categorized for dominant wavelength. The category is designated by anumber adjacent to the luminous intensity category letter.AlGaAs RedIntensity Bin Limits (mcd)AlGaAs RedHDSP-A10xIV Bin Category Min.Max.E0.3150.520F0.4280.759G0.621 1.16H0.945 1.71I 1.40 2.56J 2.10 3.84K 3.14 5.75L 4.708.55HDSP-E10x/F10x/G10xIV Bin Category Min.Max.D0.3910.650E0.5320.923F0.755 1.39G 1.13 2.08H 1.70 3.14HDSP-H10x/K12xIV Bin Category Min.Max.C0.4150.690D0.5650.990E0.810 1.50F 1.20 2.20G 1.80 3.30H 2.73 5.00I 4.097.50HDSP-N10xIV Bin Category Min.Max.A0.2700.400B0.3250.500C0.4150.690D0.5650.990E0.810 1.50F 1.20 2.20G 1.80 3.30H 2.73 5.00I 4.097.50Intensity Bin Limits (mcd), continued HERHDSP-751xIV Bin Category Min.Max.B0.1600.240C0.2000.300D0.2500.385E0.3150.520F0.4280.759G0.621 1.16HDSP-751xIV Bin Category Min.Max.B0.2400.366C0.3000.477D0.3910.650E0.5320.923F0.755 1.39G 1.13 2.08H 1.70 3.14HDSP-555x/K70xIV Bin Category Min.Max.A0.2700.400B0.3250.500C0.4150.690D0.5650.990E0.810 1.50F 1.20 2.20G 1.80 3.30H 2.73 5.00I 4.097.50Intensity Bin Limits (mcd), continued YellowHDSP-A80xIV Bin Category Min.Max.D0.2500.385E0.3150.520F0.4250.760G0.625 1.14H0.940 1.70I 1.40 2.56J 2.10 3.84K 3.14 5.76L 4.718.64M7.0713.00N10.6019.40O15.9029.20P23.9043.80Q35.8065.60GreenHDSP-A90xIV Bin Category Min.Max.E0.3150.520F0.4250.760G0.625 1.14H0.940 1.70I 1.40 2.56J 2.10 3.84K 3.14 5.76L 4.718.64M7.0713.00N10.6019.40O15.9029.20P23.9043.80Q35.8065.60Electrical/OpticalFor more information on electrical/optical characteristics, please see Application Note 1005.Contrast Enhancement For information on contrast enhancement, please see Application Note 1015.Soldering/Cleaning Cleaning agents from the ketone family (acetone, methyl ethyl ketone, etc.) and from the chorinated hydrocarbon family (methylene chloride, trichloro-ethylene, carbon tetrachloride, etc.) are not recommended for cleaning LED parts. All of these various solvents attack or dissolve the encapsulating epoxies used to form the package of plastic LED parts.For information on soldering LEDs, please refer to Application Note 1027.Note:All categories are established for classification of products. Productsmay not be available in all categories. Please contact your localAgilent representatives for further clarification/information.Color Categories/semiconductorsFor product information and a complete list ofdistributors, please go to our web site.For technical assistance call:Americas/Canada: +1 (800) 235-0312 or(916) 788 6763Europe: +49 (0) 6441 92460China: 10800 650 0017Hong Kong: (+65) 6271 2451India, Australia, New Zealand: (+65) 6271 2394Japan: (+81 3) 3335-8152(Domestic/International), or0120-61-1280(Domestic Only)Korea: (+65) 6271 2194Malaysia, Singapore: (+65) 6271 2054Taiwan: (+65) 6271 2654Data subject to change.Copyright © 2005 Agilent Technologies, Inc.Obsoletes 5988-8412ENJanuary 19, 20055989-0080EN。

日立HDS AMS2000系列存储简介

3.88 amps
3.90 amps
© 2008 Hitachi Data Systems
19
SAS设备接口的带宽（4WL=3Gb/s x 4 x 2）
每条SAS链路 (Rx&Tx): – 3Gbps – 6Gbps (全双工) 宽芯SAS线缆 • 2 ports – 12Gbps (全双工) • 4 ports – 24Gbps (全双工)
7
遍布全国的HDS安全保障网络
乌鲁木齐北京沈阳
服务中心东北：沈阳西北：西安华北：北京华东：上海华中：武汉华南：广州西南：重庆
© 2008 Hitachi Data Systems
济南
西安郑州武汉成都重庆长沙南昌福州合肥杭州南京上海
HDS分公司 HDS地区中心办事处
LUN: 0
LUN: 1
LUN: 2
LUN: 3
０
Owning controller of LUN 0
Unique for Midrange
© 2008 Hitachi Data Systems
14
动态智能负载均衡技术 Dynamic Load Balance -前后端Any to Any的访问
以太网服务器 1 应用 A HBA卡 HBA卡服务器 2 应用 2 HBA卡 HBA卡
• 1989 年成立于美国硅谷(美国国家半导体子公司)
–
– – –
承传30余年大型主机设计及制造经验
在全球 60+ 个国家有直接生意往来在全球 170+ 个国家有间接生意往来总部位于美国的Santa Clara
•
自 2000年 3月起专注于存储

site_masterS331A操作指南(驻波比

天线分析仪Site Master S331A 使用说明书（之一）日本安立公司的天线分析仪Site Master S331A在GSM基站测试中主要用途是：在基站天线安装好了以后，除了可以测试天线系统在某个频段内（如发射频段870MHz—960MHz）的驻波比（SWR0）、回损（R.L.）外（以连续曲线表示），最重要的是：还可以在发现天线系统出现故障后，测试整个天线各位置点的SWR或R.L.,以定位故障位置—Distance To Fault（DTF）。

测试结果曲线可以通过外接的打印机直接打印出来。

需要特别指出的是：Site Master S331A的工作原理是一种小信号的驻波的测量方法，与通常的实际环境（大信号情况），其Test Ports口输出频谱的电平在-75dBm左右。

天线分析仪Site Master使用时需要知道并必须输入被测电缆的相对传播速率Vf和每米的线缆损耗CABLE LOSS（两者缺一不可），以及被测线缆的长度等，经与ANDREW公司联系，获得其如下型号/馈线的相对传播速率Vf和每米的线缆损耗CABLE LOSS数值，如下：1/2”跳线：Vf=0.81, CABLELOSS=0.11DB/米7/8”馈线：Vf=0.89, CABLELOSS=0.043DB/米5/4”馈线：Vf=0.89, CABLELOSS=0.032DB/米其中被测线缆的长度D可以从工程文件中得到,不过请增加5米左右的余量。

一、SWR、RETURN LOSS测试步骤1、将被测天线接到仪器的Test Port口，然后开启Site Master；第一次使用时最好先定标（按[CAL]键，依照提示在测试口先后接上：短路器（SHORT）、开路器（OPEN）、标准负载（LOAD）即可）。

2、设置横座标：测试频段（主菜单[FREQ]—启始频率F1、终止频率F2）和纵座标：测试项目[OPT]—[B1]—SWR/RETURN LOSS），同时还可以设置横纵标SWR/RETURN LOSS的范围以及门限（主菜单[SCALE]—[TOP]、[BOTTOM]和[LIMIT]），然后就可以开始测试。

HDS系列存储产品技术资料

HDS系列存储产品技术资料HDS存储目录第1章 HDS系列产品手册资料 (4)1.1 HDS VSP G1000（高端存储－1及高端存储扩容－1/2）产品介绍 (4)14.1.1概述 (4)14.1.2 VSP G1000产品亮点 (4)14.1.3 VSP G1000产品技术优势 (5)14.1.4 VSP G1000软件包 (14)14.1.5 VSP G1000产品技术指标 (25)1.2 HDS HUS-VM（高端存储－2/3及高端存储扩容－3/4）产品介绍 (30)14.2.1概述 (30)14.2.2 HUS VM技术的技术优势 (33)14.2.3HUS VM软件包 (40)14.2.4 HUS VM产品技术指标 (43)1.3 HDS VSP G200（中端存储1/2/3）产品介绍 (46)14.3.1概述 (46)14.3.2VSP Gx00系列产品亮点 (47)14.3.3 VSP Gx00技术优势 (48)14.3.4 VSP Gx00软件包 (49)14.3.5 VSP Gx00产品技术指标 (49)1.4 存储虚拟化兼容列表（VSP G1000/G200/HUS-VM通用） (54)1.5 HDS HCP（归档存储网关）产品介绍 (58)14.5.1什么是归档及其影响 (58)14.5.2归档平台与SAN和NAS的区别 (60)14.5.3HCP 概述 (61)14.5.4HCP优势 (62)14.5.5HCP功能介绍 (63)1.6 HDS Brocade 6510（光纤交换机－1/2及光纤交换机扩容）产品介绍 (69)14.6.1 亮点 (69)14.6.2 概述 (70)14.6.3 超高的性价比，支持不断增长的 SAN 工作负载 (70)14.6.4行业领先的技术，灵活、简单而且简便易用 (71)14.6.5拟化私有云存储的有机组成部分 (71)14.6.6 Brocade Access Gateway（接入网关）模式错误！未定义书签。

HDSP-4703中文资料

Features• Multiple Colors Available • Large Character Height• 5 X 7 Dot Matrix Font• Viewable Up to 18 Meters (26.5 mm Display)• X-Y Stackable• Ideal for Graphics Panels • Available in Common Row Anode and Common Row Cathode Configurations• AlGaAs Displays Suitable for Low Power or Bright AmbientsTypical Intensity 1650 mcdat 2 mA Average DriveCurrent • Categorized for Intensity• Mechanically Rugged• Green Categorized for ColorDescriptionThe large 5 X 7 dot matrix alpha-numeric display family consists of26.5 mm (1.04 inch) and 17.3mm (0.68 inch) character heightpackages. These devices haveexcellent viewability; the 26.5mm character can be read at upto 18 meters (12 meters for the0.68 inch part).The 26.5 mm font has a 10.2mm(0.4 inch) dual-in-line (DIP) con-figuration, while the 17.3mm fonthas an industry standard 7.6 mm(0.3 inch) DIP configuration.HDSP-440X SeriesHDSP-450X SeriesHDSP-470X SeriesHDSP-510X SeriesHDSP-540X SeriesHDSP-L10X SeriesHDSP-L20X SeriesHDSP-M10X SeriesApplications include electronicinstrumentation, computerperipherals, point of sale termi-nals, weighing scales, and indus-trial electronics.Large 5 X 7 Dot MatrixAlphanumeric Displays17.3/26.5 mm Character HeightsTechnical DataDevicesHigh HighStandard AlGaAs Efficiency PerformanceRed Red Red Green Description HDSP-4701HDSP-L101HDSP-L201HDSP-540117.3 mm Common Row AnodeHDSP-4703HDSP-L103HDSP-L203HDSP-540317.3 mm Common Row CathodeHDSP-4401HDSP-M101HDSP-4501HDSP-510126.5 mm Common Row AnodeHDSP-4403HDSP-M103HDSP-4503HDSP-510326.5 mm Common Row Cathode 元器件交易网Package DimensionsHDSP-470X/L10X/L20X/540X SeriesFUNCTIONPIN HDSP-4701/-5401/ HDSP-4703/-5403/L101/L201 L103/L2031COLUMN 1 CATHODE ROW 1 CATHODE2ROW 3 ANODE ROW 2 CATHODE3COLUMN 2 CATHODE COLUMN 2 ANODE4ROW 5 ANODE COLUMN 1 ANODE5ROW 6 ANODE ROW 6 CATHODE6ROW 7 ANODE ROW 7 CATHODE7COLUMN 4 CATHODE COLUMN 3 ANODE8COLUMN 5 CATHODE ROW 5 CATHODE9ROW 4 ANODE COLUMN 4 ANODE10COLUMN 3 CATHODE ROW 4 CATHODE11ROW 2 ANODE ROW 3 CATHODE12ROW 1 ANODE COLUMN 5 ANODE HDSP-440X/M10X/450X/510X SeriesFUNCTIONPIN123456789101112131415161718Internal Circuit DiagramsHDSP-4401/M101/4501/5101HDSP-4403/M103/4503/5103HDSP-4701/L101/L201/5401HDSP-4703/L103/L203/5403COMMON ANODE ROWCOMMON CATHODE ROWCOMMON ANODE ROWCOMMON CATHODE ROWNotes:1. Average power is based on 20 dots per character. Total package power dissipation should not exceed 1.5 W.2. Do not exceed maximum average current per dot.3. For the HDSP-440X/470X series displays, derate maximum average current above 35°C at 0.43 mA/°C. For the HDSP-L10X/M10X series displays, derate maximum average current above 35°C at 0.31 mA/°C. For the HDSP-L20X/450X series and HDSP-540X/510X series displays, derate maximum average current above 35°C at 0.2 mA/°C. This derating is based on a device mounted in a socket having a thermal resistance junction to ambient of 50°C/W per package.Absolute Maximum Ratings at 25°CHDSP-470X/HDSP-L10X/HDSP-L20X/HDSP-540X/Description440X SeriesM10X Series450X Series510X SeriesAverage Power per Dot 75 mW(T A = 25°C)[1]Peak Forward Current per Dot 125 mA 125 mA 90 mA 90 mA (T A = 25°C)[1,2]Average Forward Current per Dot 32 mA 23 mA15 mA15 mA(T A = 25°C)[1,3]Operating Temperature Range -40°C to +85°C -20°C to +85°C -40°C to +85°C -20°C to +85°CStorage Temperature Range -40°C to +85°C Lead Solder Temperature 260°C for 3 s(1.59 mm [0.062 in.] below seating plane)Electrical/Optical Characteristics at T A = 25°CStandard Red HDSP-440X/470X SeriesDescriptionSymbol Test Conditions Min.Typ.Max.UnitsLuminous Intensity/Dot [4]100 mA pk: 1 of 5(Digit Average)I VDuty Factor (20 mA Avg.)HDSP-470X (17.3 mm)360770HDSP-440X (26.5 mm)400800Peak Wavelength λPEAK 655nm Dominant Wavelength [5]λd 640nm Forward Voltage V F I F = 100 mA 1.8 2.2V Reverse Voltage [6]V R I R = 100 µA3.012V Temperature Coefficient of V F ∆V F /°C-2.0mV/°CThermal Resistance LED Junction-to-Pin per package HDSP-470X R θJ-PIN15°C/W/HDSP-440X13PACKAlGaAs Red HDSP-L10X/M10X SeriesDescriptionSymbol Test Conditions Min.Typ.Max.UnitsLuminous Intensity/Dot [4]10 mA pk: 1 of 5(Digit Average)I VDuty Factor (2 mA Avg.)HDSP-L10X (17.3 mm)7301650HDSP-M10X (26.5 mm)7601850Luminous Intensity/Dot [4]30 mA pk: 1 of 14(Digit Average)I VDuty Factor (2.1 mA Avg.)HDSP-L10X 1750HDSP-M10X 1980Peak Wavelength λPEAK 645nm Dominant Wavelength [5]λd 637nm Forward Voltage V F I F = 10 mA 1.7 2.1V Reverse Voltage [6]V R I R = 100 µA3.015.0V Temperature Coefficient of V F ∆V F /°C-2.0mV/°CThermal Resistance LED Junction-to-Pin per package HDSP-L10X R θJ-PIN20°C/W/HDSP-M10X18PACKµcd µcdµcdHigh Efficiency Red HDSP-450X/L20X SeriesDescriptionSymbol Test Conditions Min.Typ.Max.UnitsLuminous Intensity/Dot [4]50 mA pk: 1 of 5(Digit Average)I VDuty Factor (10 mA Avg.)HDSP-L20X (17.3 mm)11502800HDSP-450X (26.5 mm)14003500Luminous Intensity/Dot [4]30 mA pk: 1 of 14(Digit Average)I VDuty Factor (2.1 mA Avg.)HDSP-L20X 740HDSP-450X 930Peak Wavelength λPEAK 635nm Dominant Wavelength [5]λd 626nm Forward Voltage V F I F = 50 mA 2.6 3.5V Reverse Voltage [6]V R I R = 100 µA3.025.0V Temperature Coefficient of V F ∆V F /°C-2.0mV/°CThermal Resistance LED Junction-to-Pin per package HDSP-L20X R θJ-PIN15°C/W/HDSP-450X13PACKHigh Performance Green HDSP-540X/510X SeriesDescriptionSymbol Test Conditions Min.Typ.Max.UnitsLuminous Intensity/Dot [4]50 mA pk: 1 of 5(Digit Average)I VDuty Factor (10 mA Avg.)HDSP-540X (17.3 mm)12904000HDSP-510X (26.5 mm)15404500Luminous Intensity/Dot [4]30 mA pk: 1 of 14(Digit Average)I VDuty Factor (2.1 mA Avg.)HDSP-540X 570HDSP-510X 630Peak Wavelength λPEAK 566nm Dominant Wavelength [5,7]λd 571nm Forward Voltage V F I F = 50 mA 2.6 3.5V Reverse Voltage [6]V R I R = 100 µA3.025.0V Temperature Coefficient of V F ∆V F /°C-2.0mV/°CThermal Resistance LED Junction-to-Pin per package HDSP-540X R θJ-PIN15°C/W/HDSP-510X13PACKNotes:4.The displays are categorized for luminous intensity with the intensity category designated by a letter on the left hand side of the package. The luminous intensity minimum and categories are determined by computing the numerical average of the individual dot intensities.5.The dominant wavelength is derived from the C.I.E. Chromaticity diagram and is that single wavelength which defines the color of the device.6.Typical specification for reference only. Do not exceed absolute maximum ratings.7.The displays are categorized for dominant wavelength with the category designated by a number adjacent to the intensity category letter.µcdµcd µcdµcdOperational ConsiderationsElectrical DescriptionThese display devices are com-posed of light emitting diodes,with the light from each LED optically stretched to form individual dots.These display devices are well suited for strobed operation. The typical forward voltage values can be scaled from Figure 2. These values should be used to calculate the current limiting resistor value and the typical power dissipation.Expected maximum V F values, for driver circuit design and maxi-mum power dissipation, may be calculated using the following V F MAX models:Red (HDSP-440X/470X):V F MAX = 1.55 V + I PEAK (6.5 Ω)For I PEAK ≥ 5 mA AlGaAs Red(HDSP-L10X/M10X):V F MAX = 1.8 V + I PEAK (20 Ω)For I PEAK ≤ 20 mAV F MAX = 2.0 V + I PEAK (10 Ω)For I PEAK ≥ 20 mAHER (HDSP-450X/L20X):V F MAX = 1.75 V + I PEAK (35 Ω)For I PEAK ≥ 5 mAGreen (HDSP-540X/510X):V F MAX = 1.75 V + I PEAK (38 Ω)For I PEAK ≥ 5 mA Figure 3 allows the designer to calculate the luminous intensity at different peak and averagecurrents. The following equation calculates intensity at different peak and average currents:I V AVG = (I F AVG/I F AVG DATA SHEET)(ηPEAK )(I V DATA SHEET)Where:I F AVG is the desired time averaged LED current.I F AVG DATA SHEET is the time averaged data sheet test current for I V DATA SHEET.ηPEAK is the relative efficiency at the peak current, scaled fromFigure 3.Figure 1. Maximum Allowable Average Current Per Dot as a Function of Ambient Temperature.Figure 2. Forward Current vs. Forward Voltage.Figure 3. Relative Efficiency(Luminous Intensity per Unit Dot) vs.Peak Current per Dot.I V DATA SHEET is the time averaged data sheet luminous intensity, resulting from I F AVG DATA SHEET.I V AVG is the calculated time averaged luminous intensity resulting from I F AVG.For example, what is theluminous intensity of an AlGaAs Red (HDSP-L10X) driven at 50mA peak 1/5 duty factor?I F AVG = 50 mA * 0.2 = 10 mA I F AVG DATA SHEET = 2 mA ηPEAK = 0.98I V DATA SHEET = 1650 µcd ThereforeI V AVG = (10 mA/2 mA)(0.98)(1650 µcd) = 8085 µcdI PEAK = 125 mA I F AVG = 10 mA R θJ-A = 50°C/W N = 35T J MAX = 110°CV F MAX = 2.0 V + (0.125 A)(10)= 3.25 VP D = (3.25 V)(0.01 A) = 0.0325 W T A = 110°C –(50°C/W)(0.0325 W)(35) = 53°C The maximum number of dots ON for the ASCII character set is 20.What is the maximum ambient temperature an HDSP-L10X can operate with the following conditions:I PEAK = 125 mA I F AVG = 10 mA R θJ-A = 50°C/W N = 20T J MAX = 110°CV F MAX = 3.25 V P D = 0.0325 W T A = 110°C –(50°C/W)(0.0325 W)(20) = 77°C Therefore, the maximum ambient temperature can be increased by reducing the average number of dots ON from 35 to 20 dots ON per display .Thermal ConsiderationsThe device thermal resistance may be used to calculate the junction temperature of thecentral LED. The equation below calculates the junction tem-perature of the central (hottest)LED.T J =T A + (P D )(R θJ-A )(N)P D =(V F MAX)(I F AVG)R θJ-A = R θJ-PIN + R θPIN-AT J is the junction temperature of the central LED.T A is the ambient temperature.P D is the power dissipated by one LED.N is the number of LEDs ON per character.V F MAX is calculated using the appropriate V F model.R θJ-A is the package thermalresistance from the central LED to the ambient.R θJ-PIN is the package thermal resistance from the central LED to pin.R θPIN-A is the package thermal resistance from the pin to the ambient.For example, what is the maxi-mum ambient temperature an HDSP-L10X can operate with the following conditions:Contrast EnhancementFor information on contrast enhancement please see Application Note 1015.Soldering/CleaningFor Soldering/Cleaning infor-mation on soldering LEDs please refer to Application Note 1027.元器件交易网Data subject to change.Copyright © 1999 Agilent Technologies, Inc.Obsoletes 5963-7392E5964-6373E (11/99)。

FAIRCHILD NDS331N 说明书

(Note 1a)
250
(Note 1)
°C/W °C/W
Thermal Resistance, Junction-to-Case
75
© 1997 Fairchild Semiconductor Corporation
NDS331N Rev.E
ELECTRICAL CHARACTERISTICS (TA = 25°C unless otherwise noted)
1.75
R DS(ON), NORMALIZED
RDS(on) , NORMALIZED
I D = 1.3A VGS = 2.7V
VGS = 2.7 V
1.5
TJ = 125°C
1.25
25°C
1
0.75
-55°C
0.5 -25 0 25 50 75 100 TJ , JUNCTION TEMPERATURE (°C) 125 150
3
0
0.5 I
1
D
1.5 2 , DRAIN CURRENT (A)
2.5
3
Figure 1. On-Region Characteristics.
Figure 2. On-Resistance Variation with Drain Current and Gate Voltage.
1.8 DRAIN-SOURCE ON-RESISTANCE DRAIN-SOURCE ON-RESISTANCE 1.6 1.4 1.2 1 0.8 0.6 -50
Symbol Parameter Conditions Min Typ Max Units OFF CHARACTERISTICS BVDSS IDSS IGSSF IGSSR VGS(th) RDS(ON) Drain-Source Breakdown Voltage Zero Gate Voltage Drain Current VGS = 0 V, ID = 250 µA VDS = 16 V, VGS= 0 V TJ =125°C Gate - Body Leakage, Forward Gate - Body Leakage, Reverse VGS = 8 V, VDS = 0 V VGS = -8 V, VDS = 0 V VDS = VGS, ID = 250 µA TJ =125°C Static Drain-Source On-Resistance VGS = 2.7 V, ID = 1.3 A TJ =125°C VGS = 4.5 V, ID = 1.5 A ID(ON) gFS Ciss Coss Crss tD(on) tr tD(off) tf Qg Qgs Qgd On-State Drain Current VGS = 2.7 V, VDS = 5 V VGS = 4.5 V, VDS = 5 V Forward Transconductance VDS = 5 V, ID = 1.3 A, VDS = 10 V, VGS = 0 V, f = 1.0 MHz DYNAMIC CHARACTERISTICS Input Capacitance Output Capacitance Reverse Transfer Capacitance 162 85 28 pF pF pF 3 4 3.5 S 0.5 0.3 0.7 0.53 0.15 0.24 0.11 20 1 10 100 -100 V µA µA nA nA

加拿大影 До亚马斯宽带 DS1_C_PC-350C 电视剧格商品说明书

Parts Manual cFor Technical Assistance call: 800-227-2233, Fax: 888-329-8207 To Order Parts call: 888-227-2233, Fax: 888-329-023460D Carton Clamp60D-CCS-116ModelSerial Number cascadeாcorporation123Safety DecalsPART NO.DESCRIPTION670487Service Manual 670834Operators Guide670488Installation Instructions680664Servicing Cascade Cylinders-VHS 679929Tool Catalog673964Literature Index Order FormPublicationsREF QTY PART NO.DESCRIPTION 11679150No Step Decal22665595No Hand Hold Decal31679059Quick Change Hook DecalBase Unit GroupREF QTY PART NO.DESCRIPTION 12207425Hose, 24.00 in.22688696Hose, 17.50 in.31675326Shim Kit q44665707Nut51601377Fitting, 8-8633602Capscrew724750Capscrew, 3/8 NC x .758 2 670289 Cylinder v927861Roll Pin - Inner1027962Roll Pin - Outer 111340356Frame - Upper 128667225Washer138667644Capscrew141670084Bumper152665707Nut, 1/2 in. IDq Includes two .015 Shims and eight .020 Shims.v See Cylinder page for parts breakdown.REF QTY PART NO.DESCRIPTION 162633523Capscrew, 1/2 NC x 2.50 174667662Bearing184667663Bearing194667661Bearing201678939Mounting Plate - RH 211678938Mounting Plate - LH 221674167Frame - Lower 231669957Plate241670078Lower Bumper2546205Washer, 1/2 in. ID 264640013Capscrew, 1/2 NC x 1.75 272602580Fitting, 82810611288Fitting, 6-82936288WasherReference: Basic Group 363779, S-3198.60D60DREF QTY PART NO.DESCRIPTION670289Cylinder Assembly 126511Cotter Pin s 22667667Nut Retainer s 32671424Nut s 41553761Shell 51602580Fitting 61670894Piston 712722O-Ring v 81557479Seal v92637565Nylon Ring v 1012793O-Ring v111615136Back-Up Ring v 121670895Retainer 131662451Seal v141638246Nylon Ring v 151628047Wiper v 161561012Nut 171667670Rod 181667676Washer 191660765Bearing 201—Spacer211671050Seal Loader, Piston v 221671052Seal Loader, Retainer v 670922Service Kitv Included in Service Kit 670922.s Included in Nut Service Kit 671425.Reference: S-7662.CylinderREF QTY PART NO.DESCRIPTION669762Check Valve – Flow Divider 11667490Special Fitting 212841O-Ring q 31667471Spool 42609453Fitting, 1052667487Spring 66604510Fitting, 671678270Check Valve – VPO 82659058Check Valve – PO 92667516Service Kit q101679846Low Flow Spool Kitq Included in Service Kit 667513.s For eliminating regeneration circuit only. See Tech. Bulletin 121.Reference: SK-5302.Check ValveREF QTY PART NO.DESCRIPTION112667494Fitting 1222840O-Ring q 132673098Spring 142667492Poppet151673089Spool Assembly 162667491Sleeve 171669763Valve Body 181661347Service Kit q191676343Regeneration Elimination Plug s 667513Service KitContact Pad and Arm60D48 x 60REF QTY PART NO.DESCRIPTION12677277Arm22661212Spring3s629312Washer44677208Bushing54677206Pin61675626Bushing Driver Tool74602579Plug81363778Stabilizer - R.H.91363777Stabilizer - L.H.1014550218Nut11 6 4674 Capscrew, .5 x 1.75 GR8 122364985Contact Pad131677146Tip - L.H.141677145Tip - R.H.156 4672Capscrew16 22675614Stabilizer Wear Tile 172208860Tip Wear Tile - L.H. 182208860Tip Wear Tile - R.H.19v676841Contact Pad Repair Kit20 s677094Shims As required for proper adjustment.v Repairs one hole.Reference: Basic Group 363779, S-3198Contact Pad Group60D48 x 60REF QTY PART NO.DESCRIPTION3000373Contact Pad Group 12364985Contact Pad24364355Edge Guard 343000368Wear Strip4484731Capscrew5486097Nut6404871Capscrew743000369Wear StripQuick Change Mounting GroupClass IIIREF QTY PART NO.DESCRIPTION678834Lower Hook Group12675957Hook24678943Capscrew, 5/8 NC x 1.5032675958Guide42678832PinReference: S-3197.Backrest GroupREF QTY PART NO.DESCRIPTION3000372Backrest Group 113000370Backrest212674452Capscrew3126290Washer4—674356Tube EndDo you have questions you need answered right now? Call your nearest Cascade Parts Department. Visit us online at Cascade (UK) Ltd.15, Orgreave Crescent Dore House Industrial Estate HandsworthSheffield S13 9NQ EnglandTel: 742-697524FAX: 742-695121Cascade Scandinavia AB Box 124Hammarvägen 10567 23 Vaggeryd SwedenTel: 42-0-393-36950 FAX: 46-0-393-36959Cascade N.V. European Headquarters P.O. Box 30091300 El Almere Damsluisweg 561332 ED AlmereThe NetherlandsTel: 31-36-5492911 FAX: 31-36-5492964Cascade Norway Østerliveien 37A 1153 Oslo NorwayTel: 47-22-743160 FAX: 47-22-743157Cascade France S.A.R.L.1D Rue De CharaintruBP 18, 91360 Epinay-Sur-OrgeMorangis Cedex, FranceTel: 33-1- 64547500FAX: 33-1-64547501Cascade Hispania S.A.Carrer 5 Sector CZona Franca DuaneraPoligono de la Zon Franca08040 Barcelona, SpainOffice No. 256Tel: 93-264-07-30FAX: 93-264-07-31Cascade Canada Inc.5570 Timberlea Blvd.Mississauga, OntarioCanada L4W-4M6Tel: 905-629-7777FAX: 905-629-7785Cascade GmbHD-41199 MonchengladbachKlosterhofweg 52GermanyTel: 49-216-668230FAX: 49-216-6682323Cascade N.V.Benelux Sales and ServiceP.O. Box 30091300 El AlmereDamsluisweg 561332 ED AlmereThe NetherlandsTel: 31-36-5492950FAX: 31-36-5492974Cascade FinlandAlbert Petreliuksenkatu 301370 VantaaFinlandTel: 358-9-836-1925FAX: 358-9-836-1935Cascade Corporation2501 Sheridan AvenueSpringfield, OH 45505Tel:888-CASCADE (227-2233)FAX: 888-329-0234Cascade Japan Ltd.5-5-41,Torikai KamiSettsu, OsakaJapan, 566Tel: 81-726-53-3490FAX: 81-726-53-3497Cascade Korea108B, Namdong Ind Complex 658-3 Gojan-Dong Namdong-GuInchon, 405-310 KoreaTel: 82-32-821-2051FAX: 82-32-821-2055Cascade Australia1445 Ipswich RoadRocklea, QLD 4106AustraliaTel: 1-800227-223FAX: (07) 3373-7333Cascade New Zealand15 Ra Ora DriveEast Tamaki, AucklandNew ZealandTel: 9-273-9136FAX: 9-273-9137Cascade (Africa) Pty. Ltd.P.O. Box 625, Isando 160060A Steel RoadSparton, Kempton ParkSouth AfricaTel: 27-11-975-9240FAX: 27-11-394-1147Cascade-XiamenNo. 668 Yangguang Rd. Xinyang Industrial Zone Haicang, Xiamen City Fujian ProvinceP.R. China 361026 Tel: 86-592-651-2500 FAX: 86-592-651-2571Cascade (Singapore) Trading Co.Four Seasons Park Autumn Block - Apt. 1802 12 Cuscaden Walk SingaporeTel: 65-834-1935FAX: 65-834-1936c。

徕卡测量系统HDS产品说明书

徕卡测量系统1993199820032005200752009徕卡ScanStation C10三维激光扫描仪适合于任何工程类型的一体化扫描仪新高清晰测量设备,C10引领了地面三维激光扫描仪产品技术的新方向.ScanStation C10三维激光扫描仪在整体设计,扫描流程控制,设备兼容性,扫描方式等方面都有重大的创新.徕卡ScanStation c10是新一代一体化智能型扫描仪性能特点智能镜面设计，自动切换镜面方式，扫描视场角360˚x270˚内置数码相机与扫描仪同轴，能够自动获取扫描点云的颜色信息,并具有实时视频功能扫描范围：1～300m54徕卡ScanStation C10 是一款全新的高清晰三维激光扫描仪,它集一体化设计,智能扫描,高精度,高速度,等特点为一身.适合于更加复杂的扫描工程。

徕卡ScanStation C10主要技术参数仪器类型全视场角一体化紧凑型双轴补偿三维激光扫描仪光学取景一体化高分辨率数码相机点位±6mm单点精度 (50m距离)距离±4mm角度±12”徕卡ScanStation 2三维激光扫描仪全球扫描速度最快的脉冲式三维激光扫描仪用QuickScan TM钮定义扫描范围影像和点云数据获取实时生成点云图徕卡ScanStation 2是一款脉冲式、高精度、快速三维激光扫描仪，它集多功能、高效率、高精度于一身，广泛地应用于市政工程、工厂规划、改建设计、建筑测量、文物考古等工程领域。

性能特点双扫描窗口设计，扫描视场角360°×270°内置数码相机与扫描仪同轴，能够自动获取扫描点云的颜色信息扫描速度：50,000点/秒50m测量距离点位测量精度小于6mm内置高精度双轴补偿器56徕卡ScanStation 2三维激光扫描仪超高速全站式三维激光扫描仪徕卡ScanStation 2是徕卡ScanStation三维激光扫描仪的第二代产品，除了具有徕卡ScanStation三维激光扫描仪的所有特点之外，新的ScanStation 2三维激光扫描仪的扫描速度是徕卡ScanStation三维激光扫描仪扫描速度的10倍，达到每秒5万点。

HDS存储产品线概述

HDS存储产品概述(thunder,lightning,wms,ams,nsc55,usp)HDS（Hitachi Data Systems）的整体产品线定位偏高，重点集中在中高端系列，其中低端产品在整体SMB（中小企业）市场中的定位也较高。

主要低端产品目前共有四款，分别是较早的Thunder9500系列中的9530V和9520V，以及新推出的4Gb光纤产品WMS100和AMS200。

HDS的产品线主要有雷霆系列（thunder series）、闪电系列（lightning series）、模块化存储系列（工作组WMS、可调整AMS）以及通用存储平台（NSC55和USP）。

总体开来，thunder→WMS，Lightning→AMS，NSC55属中高端产品，USP属高端产品1、HDS中低端产品HDS是存储业内拥有自主研发和制造能力的为数不多的厂商之一，其全系列产品都融入了独有的设计理念和专利。

尽管HDS的中高端产品以“通用存储平台”的兼容性著称，但由于针对SMB市场的低端产品本身没有突出的虚拟化功能，因此在兼容性上并没有突出的优势，同样不能与其他品牌存储产品混合搭建统一管理的存储平台。

HDS拥有强大的软件研发能力，所有软件都基于自身硬件平台开发的，其硬件产品从最低端到高端存储系统全部采用相同的设计架构，因此HDS系列产品具有很好的兼容性，用户购买其产品，可从低端无缝向中端甚至高端升级，满足成长性企业飞速扩张的业务需求对后台数据中心的升级和迁移需求。

Thunder9200V. 这款太古老了，最多100个硬盘（36GB,72GB（10000rpm）），存储容量可达7.2TB （RAID-0），6.7TB（RAID-5），支持RAID-0,RAID1,RAID0+1,RAID5Thunder9530VThunder9530V是一款全光纤产品，该产品仅能支持FC硬盘，端到端的光纤设计虽然提供了良好的性能，但无法满足低端用户对价格的敏感需求。