R-500-2油墨参数
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3. SPECIFICATION
3-1. Characteristic
*After mixing with hardener.
3-2. Tack Dry Window
Tack dry window (min. @72¢J )
40 50 60 70 80 Develop ability
Development condition : 1%Na 2CO 3 , 32¢J , 60 sec , 2.5kg/cm 2
3-3. Holding Time
Hold time 12hr 24hr 36hr 48hr Develop ability
Holding at 22¢J / 60%RH after drying at 72¢J / 25 mins.
Item Specification Main agent R-500 Hardener HD – 5 Mixing ratio depend on product Viscosity depend on product Solid content 75 ~ 80wt%
Tack- dry window 72¢J X 80 min (maximum) Exposure energy
400 – 600 mj / cm 2 (on the solder mask) * Pot life 24 hours ( stored in dark and below 25¢J )
Shelf life
6 months after manufacturing ( stored in dark and below 25¢J )
3-4. Photosensitivity
Item Ink Thickness Energy Dwell time Sensitivity Sensitivity
Kodak No.2 (2l steps tablet) 25 µm
300 mj/cm2
400 mj/cm2
500 mj/cm2
60 sec
6~8 steps
7~9 steps
9~11 steps
Resolution (Between QFP) 30 µm
300 mj/cm2
400 mj/cm2
500 mj/cm2
60 sec
70~80 µ m
60 ~70µ m
50~60 µ m
4. PROCESS CONDITIONS
Surface treatment :Chemical and mechanical treatment
Coating:Screen printing with 90~120 mesh screen
Holding time:10 – 20 min.
Tack dry: A.Single side process
1st side : 72-75¢/15~20 min.( Hot air convention oven )
2nd side : 72-75¢/20~30 min. ( Hot air convention oven )
B.Both sides process
72-75¢/30~40 min.( Hot air convention oven )
Exposure:400 – 600 mj / cm2 (on the solder mask)
Hold time:10 – 30 min.
Development: Developer : 1 wt% Na
2
CO3
Temperature : 31-33¢
Spray pressure : 2.5 – 3.0 kg / cm2
Dwell time : 70-100 sec.
Post cure: for Immersing gold process150¢/ 60 min.(Hot air convention oven) for HAL process 160¢/ 60 min. (Hot air convention oven)
5. PROPERTIES
Item Test method Result
Adhesion JIS D0202 Cross hatch peeling 100/100 Pencil hardness JIS K5400 standard Above 6H Solder heat resistance Rosin flux 260¢J/ 30sec , 1 cycle Pass
Solvent resistance PGM-Ac, room temp./30min.
Cross hatch peeling
Pass
Acid resistance 10vo1¢M H2SO4 ,room temp./20min.
Cross hatch peeling
Pass
Alkaline resistance 10wt¢M NaOH , room temp./20min.
Cross hatch peeling
Pass
Insulation resistance
IPC-B-25 pattern
25¢J/ 65¢M RH , 500V/l・min.
Initial
1.0 1013Ω
E’less gold plate Ni 125 µ-inch ; Au 3 µ-inch Pass
Note : The all test data mentioned in this technical data sheet are based on our laboratory tests and only for reference, we suggest testing for suitability in your application.