THERMAL PAD(导热膏性能对比)

X-65- Power 705G strate 64.19 53.74 53.56 50.42 50.06 46.12 46.27 26.53 58.35 54.34 55.05 49.63 50.61 46.55 46.25 26.10
Tmate 2907 64.74 53.19 52.90 49.46 50.40 45.75 46.01 25.78
Hi-Flow PCS- PCS- X-65- Power T225UT TC-11 A-11 705G strate mate 2907 Tc 68.77 58.20 58.93 64.19 58.35 64.74 Tb.av 55.28 53.17 53.38 53.65 54.70 53.05 R(c-b.a) 0.385 0.144 0.159 0.301 0.104 0.334 L 0.08 0.13 0.11 0.25 0.064 0.167 K 2.076 9.046 6.937 8.302 6.137 5
26.58 0.0785 1.3256
OTHER GREASE
T-grease 401

Thermal Conductivity: 0.6w/m.k THERMAGON,INC. 不會分離 可真空使用 不腐蝕 THERMAGON,INC.
AOS 非矽導熱膏

xTIC-3000

代理商
Color
Dow Shin-Etsu Corning Chemical 喬越 昶賓電子 White Gray
Component Silicone Silicone Silicone Siliconecompo compound compoun free und d Aluminum and Zinc Oxide Thermal 1w/m.k 4w/m.k 3.3w/m.k 3.8w/m.k Conductivity
THERMAL PAD
CLASSIFICATION
Grease CPU Pad Gap Pad
GREASE
GREASE
SC102 X-23-7762 TC5021 T2500
SC102
廠商
7762
TC5021
Dow Corning Gray
T2500
THERMA GON Tennmax White
TESTING REPORT
以 Willson 為例,進行實驗測試,比較四種 Grease 的性能 均以 80w功率 ,15kg 力逕行測試 風扇額定電壓 12v Q = KFΔT/L F = 31 * 31 = 961mm² L = 0.1mm
Tf1
Tsink1
Tf2
Tb
Tf3
Tsink2
Tc Tb Tsink1 Tsink2 Tf1 Tf2 Tf3 Ta R(c-b) K
MAESTRO
MAESTRO MAESTRO
TESTING REPORT
以 VM5 為例,進行實驗測試,比較幾種 CPU PAD 的性能 均以 35w功率 ,10kg 力逕行測試 風扇額定電壓 5v Q = KFΔT/L F = 10 * 10 = 100mm²
Tb2
Tf1
Th1
Tb1
Tf2
Th2
2.5
0.09 0.034
0.076
廠商
Thermstrate Powerstrate T-mate-2900 LOCTITE LOCTITE THERMAGON
代理商
HENKEL HENKEL 航能
Hi-Flow 225UT
PCS-TC X-65-705G
BERGQUIST
BERGQUIST BERGQUIST
TC5021 51.15 45.08 36.20 38.48 36.18 32.39 35.85
26.71 0.0759 1.3714
SC102 53.14 45.34 35.96 38.56 36.30 31.86 34.73
26.23 0.0975 1.0673
T2500 51.10 44.82 36.24 38.00 35.31 31.86 35.65
Etc…
GAP PAD TESTING
同樣以VM5為例逕行實驗比較 Q = KFΔT/L F = 10 * 10 = 100mm² L = 0.5mm
VO Tc 138.73 Tb1 41.32 Tb2 42.96 Tb.av 42.14 Th1 39.14 Th2 39.11 Tf1 36.45 Tf2 37.21 Ta 26.25 R(c-b.a) 2.76 K 1.81
SOFT 120.59 38.60 38.87 38.74 36.20 36.41 34.34 34.73 26.07 2.34 2.14
MTC330 107.98 43.68 44.48 44.08 41.08 41.06 38.33 38.60 26.17 1.83 2.74
FSL-D 85.16 49.93 49.18 49.56 46.55 46.49 42.96 43.37 26.09 1.02 4.92
Tc Tb1 Tb2 Th1 Th2 Tf1 Tf2 Ta
HiFlow 225UT 68.77 55.07 55.48 49.91 48.90 44.08 45.36 25.36
PCS- PCSTC-11 A-11 58.20 53.05 53.29 50.05 50.12 46.59 46.42 26.54 58.93 53.67 53.08 49.86 50.01 45.95 46.38 26.37
厚度
Thermstrate Powerstrate T-mate-2907 0.076 0.064 0.167
相變化 溫度 60
60 50-70
熱傳導 係數
3.0
熱抗阻
0.03 0.02
Hi-Flow 225UT PCS-TC
X-65-705G
0.077 0.13
0.25
55 48
40-70
0.7 4.7
Thermal Conductivity: 2.9w/m.k The Bergquist Company Thermal Conductivity: 0.9w/m.k CHOMERICS Company
T660
源自文库
Etc…
CPU PAD
THERMSTRATE POWERSTRATE T-mate 2900 Series Hi-Flow 225UT PCS-TC X-65-705G
TCTXE050 89.30 50.11 50.96 50.54 46.74 47.13 43.44 44.27 26.41 1.11 4.51
GAP PAD
BERGQUIST

BOND-PLY 0.8w/m.k 0.2mm GAP PAD VO; GAP PAD VO SOFT 0.8w/m.k
0.5-3mm


GAP PAD 1500; GAP PAD 1500R GAP PAD A2000; GAP PAD A3000 Etc…
DENKA

FSL-D 3.0w/m.k 0.5-3.0mm FSL-B A570; G570 1.2w/m.k 1.0-5.1mm A174; G174; T174 1.0w/m.k 1.0-5.1mm
CHOMERICS

THERMAGON


T-flex200 0.25-5.08mm 1w/m.k T-flex400 0.51-5.08mm 1.5w/m.k T-flex600 0.51-5.08mm 3w/m.k