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不合格樣品參考圖片/定義
Chips
缺口/崩邊No V-type sharp
chip
Length of edge chip
≦ 5mm,
Depth ≦ 0.5mm,
No. of chip ≦ 3
ICOS PV Wafer
Inspector
Saw mark 切割線痕≦ 15μm (Depth)
1. 目視檢驗
2. 使用SJ-201量測
Crack and pin holes
裂痕與針狀列口None
不可有
ICOS Microcrack
Inspector
Micro-crack
Inclusions
Surface Cleanliness 表面潔淨度
As cut and cleaned,
No stains, scratch,
contamination,
watermark and
fingerprints
表面須清洗乾淨, 無可
見斑點, 玷汙及化學殘
留物Contaminations
ICOS PV Wafer
Inspector Standard Wafer Specification
外觀
檢驗項目檢驗規格檢驗工具
Micro-crack, pitting holes and inclusions 內部微裂痕, 凹陷與內含物Non-penetrating,
None penetrating
micro crack,
inclusions and
holes 不可有
ICOS Microcrack
Inspector
2F-11, No.32, Jiajheng 9th St., Jhubei City, Hsinchu County 302, Taiwan R.O.C.
Page 1 of 3
Angle between
square sides 直角角度90 ± 0.3 deg.-
ICOS PV Wafer
Inspector
Bevel edge
width (hypotenuse)斜邊長1.5 ± 0.5 mm
Bevel edge
angle
斜邊角度
45 ± 10 deg. Length of wafer
edge 邊長156 ± 0.5 mm
ICOS PV Wafer
Inspector
Thickness
厚度
200 ± 20 μm Semilab WLT-5
TTV
厚度變異數
≦ 40 μm Semilab WLT-5
Bow
彎曲度
≦ 50 μm非接觸電容式測試儀
Warp/Warpage
撓曲度
< 100 μm
Dopant 摻雜型態P型-Semilab WLT-5
Resitivity 電阻率0.5 Ω-cm-Semilab WLT-5
Lifetime 少子壽命≧ 1.0μs (wafer-
level)
-Semilab WLT-5
電阻
尺寸
Page 2 of 3
Carbon
concentration 碳含量
≦ 1x 1018 atms/cm 3
-
Oxygen
concentration 氧含量≦ 8 x 1017atms/cm
3
-其他開箱破片
一片換一片
-
Seller
Buyer
Dazz Sun Energy Industry Company Limited
Date: Date: February 4, 2010
Please signed back if agreed above standard specification
電阻Page 3 of 3