专有名词解释(LCD相关产业)

LCD & LCM專有名詞list“ A ” Start:●ACF : A nisotropic C onductive F ilm (異方性導電膜)●AOP : A cf O n P cb●AT : A pproval T est (承認驗證)●ANSI: A merican N ational S tandard I nstitute(美國國家亮度標準協會)●ASAP: A s S oon A s P ossible(愈快愈好)●AGV : A uto G uide V ehicle(自動導引車)●AMHS: A utomated M aterial H andling S ystem(材料自動處理系統)●AVL : A pproval V endor L ist (合格供應商一覽表)●APL : A pproval P arts L ist (合格部品材料一覽表)●AQL : A cceptive Q uality L imited (允收水準)●Acetone : 丙酮●AFS : A ccess F loor S ystem (高架地板系統)●AHS : Air Handling System (潔淨室的空調系統)●APQP :A dvanced Product Quality Planning(先期產品品質規劃和管制計劃) ●ANOVA: An alysis o f Va riance (變異分析)●ASV : A dvanced S uper-V iew(高速動畫顯示技術)●AJS : A uto J udgment S ystem (自動判定系統)●AHU : recalculating air handler unit (迴風單元)A ir H anding U nit (外氣空調箱)●ALX： Alkali Exhaust(鹼排氣)●AEX： Acid Exhaust(酸排氣)●AMC : A ir M athematics C ontamination(空氣微分子污染)●A/S : A ir S hower●ASV : Advance Super-V●a-Si： Amorphous Silicon●AR : Action/Request●APR :●ASI :●“ B ” Start :●B/L : B ack L ight(背光源)●BM : B lack M atrix(黑色矩陣)●BRP : B usiness R eengineering P rocess (企業再造)●BGA : B all-G ird-A rray(球形封裝技術)●BOM : B ill O f M aterial(物料清單)●BCE : B ack C hannel E tch●BRM : Basic Record Management System(基本情報管理)“ C ” Start :●CCD: C harge C oupled D evice●COB: C hip O n B oard●COF: C hip O n F ilm●COG: C hip O n G lass●CCFL: C old C athode F luorescent L amp(冷陰極射管)●CS : C ustomer S ample(顧客樣品)●CF : C olor F ilter(彩色濾光片)●CR : C ommercial R elease(量產移管)●CVD: C hemical V apour D eposition(化學氣相成長)●CIP: C ontinuous I mprovement P rocess(工程持續改善)●COA: C olor filter O n A rray ;●C ertificate O f A nalysis(供應商出貨檢驗報告)●CLCA: C lose L oop C orrective A ction●CCL: C opper C lad L aminat(銅箔基板)●CP : C apability of P rocess(製程能力指數)●CRM: C ustomer R elationnship M anage(客戶關係管理)●CIM: C omputer I ntergrated M anufacturing(電腦整合製造系統)●CAR: C orrective A ction R eport(查核改善跟催表)●CFT: C ross F unctional T eam(跨功能小組)●C/V: C on v eyer●C/R: C lean R oom●CRT: C athode R ay T ube(陰極射線管)●CGS: C eiling G rid S ystems (天板)●CDA：C lean D ry A ir (高壓乾空氣)●CAH：C omputer Room A ir H andler(恆溫恆濕空調箱)●CWS : C hilling W ater S ystem (冰水系統)●CUB : C entral U tility B uilding (中央設施建築)●CGS : Continuous Grain Silicon●CDC :●CAS :“ D ” Start :●DAT : D esign A pproval T est(設計認定)●DVI : D igital V ideo I nteractive(數位影像穿插)●DISM: D igital I nterface S tandards for M onitors●DFP : D igital F lat P anel port●DQAT: D esign Q uality A pproval T est(設計品質認定)●DLP : D igital L ight P rocessing(數位光學處理技術)●DCC : D ocument C ontrol C enter(文件管理中心)D ry C ooling C oil(乾盤管)●DR : D esign R eview（產品設計審查）●DPT : D ew P oint T emp (露點溫度)●DI-Water: D elete-I on Water (去離子水)●EAD :●“ E ” Start :●EMS : E quipment M anagement S ystem(設備控管)●E/S : E ngineer S ample(工程樣本)●EMI : E lectro M agnetic I nterference(電磁波干擾)●ESD : E lectro S tatic D ischarge(靜電放電)●ESC : E lectro S tatic C harge(靜電電荷)●ESA : E lectro S tatic A ttraction(靜電吸附)●EMC : E lectro M agnetic C ontain(電磁相容性)●ERP : E nterprise R esource P lanning(企業資源規劃)●EL : E lectro L uminescent(電激發光)●EDID: E xtended D isplay I dentification D ata(延伸顯示識別資料) ●ECN : E ngineering C hange N otice(工程變更指示書)●ECP : E ngineering C hange P roposal (工程變更依賴書)●ERT : E mergency R esponse T eam(緊急應變小組)●EMS : E SD M onitoring S ystem (靜電氣監控系統)●EDA : E ngineering D ata A nalysis (工程資料分析)●“ F ” Start :●FPC : F lexible P rinted C ircuit(軟性印刷電路)●FET : F ield E ffect T ransistor(場效電晶體)●FI : F inal I nspection(最終檢查)●FPD : F lat P anel D isplay(平面顯示器)●FIFO: F irst I n First O ut(先進先出)●FQC : F inished goods Q uality C ontrol●FMEA: F ailure M ode E ffect A nalysis (失效模式與效應分析)●FFU : F an F ilter U nits (濾網風車組)●FFC : F an F ilter C asing●FAI : F irst A rticle I nspection (初物檢驗)●FM ：F actory M utual（工廠互助保險實驗室）●FWS : F ine W ater S pray system（水霧噴水系統）●FM : F actory M utual（工廠互助保險實驗室）●FMCS: F acility M onitor C ontrol S ystem(廠務監控系統)●FMS : F acility M onitoring S ystem●FCU : F an C oil U nit (風車盤管機組)●FIB ：F ocusing an I on B eam (聚焦離子束顯微鏡)●FFS : F ringe F ield S witching●FEA： Finite Element Anlysis●FAE : Facture Application (產品應用)“ G ” Start :●G/A : G ate A rray●GVIF: G igabit V ideo I nter F ace●Gage R&R(GRR) :量具(Gage)再現性(Repeatability)與再生性(Reproducibility)之變異總合●GEX：General Exhaust(一般排氣)“ H ” Start :●HTO : H igh T emperature O peration (高溫動作測試)●HAU : H anding A ssistant U nit●HEPA: H igh E fficiency P articulate A ir (高效率濾網)●HRM : H uman R esource M anagement (人力資源管理)●HEX：Heat Exhaust(熱排氣)●HVAC：General H eating V entilation A ir C ondition System(一般空調系統)●HP :Home Position●HAR :“ I ” Start :●ITO : I ndium T in O xide (氧化銦錫導電膜)●I/F : I nter-F ace (界面)●IT : I nformation T echnology (情報技術學)●IPS : I n-P lane –S witching (橫向電場切換)●ISO : I nternational S tandards O rganization (國際標準組織)●ILB : I nner L ead B onding (內引腳接合)●IC : I ntegrated C ircuit (積體電路)●IPQC: I n-P rocess Q uality C ontrol●IQC : I ncoming Q uality C ontrol (進料品質管制)●IPA : Isopropanol alcohol (異丙醇)●IMS : I on M obility S pectrometry (離子流動分析儀)●ISP :“ J ” Start :●JIT : J ust I n T ime (即時管理)●JDM : J oint D esign M anagement (共同研發管理)“ K ” Start :●KPI :K ey P erformance I ndex (關鍵績效指標)“ L ” Start :●LCM : L iquid C rystal M odule (液晶模組)●LVDS: L ow V oltage D ifferential S ignal (低電壓差動信號)●LTO : L ow T emperature O peration (低溫動作測試)●LSI : L arge S cale I ntegration (超大型積體電路)●LC : L ine C ontroller●L/R : L aser R epair (雷射修正)●LP : L ead P itch●LCD : L iquid C rystal D isplay (液晶顯示器)●LTPS: L ow T emperature P oly S ilica (低溫多晶矽)●LGP : L ight G uide P anel (導光板)●LUX : ILLUMINATION (照明度之國際單位)“ M ” Start :●MA : M odule A ssembly (模組組裝)●MVA : M ulti-D omain V ertical A lignment(超級/多疇垂直排列)●MIS : M anagement I nformation S ystem (資訊管理系統)●MOW : M anganese O xygen W olfram (氧化錳鎢)●MTBF: M ean T ime B etween F ailure (平均失效間隔時間)●MGV : M anual G uide V ehicle (手動搬運車)●MSA : M easurement S ystem A nalysis (量測系統分析)●MAU：M ake-up A ir U nit(外氣空調箱)●MSU：M ist S eparator U nit(冷凝設備)●MSDS:M aterial S afety D ata S heet(物質安全資料表)●MDL : Manufacturing Department L●MRB : Material Review Board●MQC : M onitoring Q uality C ontrol (監控品質管制)●MCR : M aterial C onstruction R esentment(原物料品質異常工程訴怨單)●MPS : Master Product Schedule●MES : Manufacturing Execution System(製造執行系統)●MCS : Material Control System(材料管理系統)●MTD : Month To Daily vernier●MO :●“ N ” Start :●ND : N eutral D ensity filter●NB : N ote B ook●NB : N ormally B lack (常態黑)●NW : N ormally W hite (常態白)●NTSC: N ational T elevision S ystem C ommittee (國家電視標準委員會) ●NC : N oise C riterion (噪音權衡基準法)“ O ” Start :●OLB : O uter L ead B onding (外引腳接合)●OD : O ptical D ensity (光學密度)●ORT : O utgoing R eliability T est (出貨信賴性測試)●OEM : O riginal E quipment M anufacturer (委託代工)●ODM : O riginal D esign M anufacture (委託設計與製造)●OLED: O RGANIC L IGHT E MITTER D EVICE (有機電激發光二極體)●OSD : O n S creen D isplay (視控調整功能)●OQC : O ut-going Q uality C ontrol (出貨品質管制)●OPI : O ne P iece I nspection (片次檢驗)●OPI : Operation interface(操作介面)●OHS : O ver H ead S ystem (高空搬運系統)●ORP : O xidation R eduction P otential (氧化還原電位計)●OCB : O ptically C ompensated B end●ODF : O ne D rop F ill (液晶滴下方式)●OM : O ptical M icroscope (光學顯微鏡)●OEX ：Organic Exhaust (有機排氣)●OITS: O perator I nterface T ouch S creen (觸摸式操作屏)●OCAP: O ut of C ontrol A ction P lan (異常反應計劃)●OOC : O ut O f C ontrol (管制外)●OOS : O ut O f S pecification (規格外)●OSS : O ne S top S hopping (一次購足)●OA : Office Automation (辦公室自動化)●OP : Opposite Position●OHV :●ORB :●OI :“ P ” Start :●PCB: P rinted C ircuit B oard (印刷電路板)●PWB: P rinted W iring B oard (印刷電路板)●PAT: P rocesses A pproval T est (製程認定)●PDAT: P rocess D esign A pproval T est (製程設計認定)●PDA: P ersonal D igital A ssistant (個人數位秘書)●PEP: P hoto E ngraving P rocess (寫真蝕刻工程)●PECVD: P hoto E ngraving C hemical V apour D eposition (化學氣相沉積)●PPM: P arts P er M illion (百萬分之…)●PZ : P olarizer (偏光板)●PE : P rocess E ngineer (製程工程師)●PMLCD:P assive M atrix LCD●PDP: P lasma D isplay P anel (電漿顯示器)●PLC: P rogrammable L ogic C ontroller (可程式化邏輯控制系統)●PNP: P lay &P lug (即插即用)●PDCA :P lan-D o-C heck-A ction (PDCA管理循環)●PSS :P roduct S pecification S heet (產品規格一覽表)●PI : Polyamide (配向膜,聚亞醘氨)●PVA: P atterned V ertical A lignment●PMS: P article M onitoring S ystem (微粒子監控系統)●PM : P roject M anagement (專案管理)●PV : P rocess V acuum System (製程真空系統)●PLV : P rocess L ow V acuum System (製程低真空系統)●PAH ：P ackaged A ir H anding Unit (箱型空調箱)●PHA : P reliminary H azard A nalysis (初步危害分析)●PVA : P atterned V ertical A lignment(垂直配向)●PLM : P roduct L ife M anagement（產品生命週期管理）●PDCR: Pigment Dispersed Color Resist(顏料分散型彩色光阻)●PDM : Pigment Dispersed Method(顏料分散法)●PPI : P ixel P itch I nch“ Q ” Start :●QAT : Q uality A pproval T est (品質認定)●QCC : Q uality C ontrol C ircle (品管圈)●QOS : Q uality O f S ervice (服務品質)●QRM : Q uality R eview M eeting(服務品質)●QIT : Q uality I mprovement T eam﹝品質改善團隊﹞●QFD : Q uality F unction D eployment(品質機能展開)●QA : Q uality A ssurance (品質保證)●QC : Q uality C ontrol (品質管制)●QCS : Q uality C ontrol S tandard (品質管制標準)●QE : Q uality E ngineering (品質工程)●QMP : Q uality Management Plan (品質管制計畫)●QNR : Q uality N on-conformance R eport (原物料品質不合格報告) ●QIS :●QSM :“ R ” Start :●RTO : R oom T emperature O peration (常溫動作測試)●RMA : R eturn M aterial A uthorization (退貨驗收)●RWK : R e W or K (重工)●RSDS: R educed S wing D ifferential S ignaling●RGV : R ail G uide V ehicle(自動軌道導引車)●RTM : R otate T ransfer M achine (OHS~~stock)●RM : R isk M anagement(風險管理)●RAS : R eturn A ir S ystem (迴風系統)●RH ：R elative H umidity(相對濕度)“ S ” Start :●SVGA: S uper V ideo G raphics A rray(800*600)●SXGA: S uper X tended Video G raphics A rray(1280*1024)●SXGA+: S uper X tended Video G raphics A rray PLUS(1400*1050)●Solder:焊接(製程)●Shock:衝擊測試●STN: S uper T wisted N ematic●SPWG : S tandard P anels W orking G roup●SOP : S tandard O perating P rocedure(標準作業程序)S ystem O n P anel●SS : S uper S pacer(間隙材)●SD : S ales & D istribution(銷售管理)●SCM : S UPPLY CHAIN MANAGEMENT(供應鍊管理)●SAP : S ystemalyse A nd P rogrammentwicklung(系統分析與軟體發展)●SMT : S urface M ount T echnology(表面黏著技術)●SMD : S urface M ount D evice(表面黏裝元件)●SEM : S canning E lectron M icroscope(掃瞄式電子顯微鏡)●S.T : S tandard T ime(標準工時)●SPC : Statistical Process Control (統計製程管制)●STS : S hip T o S tock(直接入庫上線,免檢作業)●SPX : Stripper(Condensible) Exhaust(高沸點有機排氣)●SOC : Spacer on Color Filter●SOG : S ystem O n G lass●SAW : S urface A coustic W ave●SQE : S upplier Q uality E ngineering●SEX： Stripper Exhaust●SGS :●“ T ” Start :●TFT: T hin F ilm T ransistor (薄膜電晶體液晶顯示器)●TTL: T ransistor T ransistor L ogic (電晶體電晶體邏輯)●THB: T emperature H umidity B urning (高溫/高濕動作測試)●TST：T emperature S hock T est (溫度急變測試)●TCT: T emperature C ycle T est (溫度循環測試)●TAB: T ape A utomate B onding (捲帶自動接合技術)●TCP: T ape C arrier P ackage●TAC: T ri A cetyl C ellulose (三酸醋纖維)●TQM: T otal Q uality M anagement (全面品質管理實務)●TMDS: T ransition M inimized D ifferential S ignaling●TECN: T emporary E ngineering C hange N otice (暫時性工程變更指示書) ●TEG : Testing Element Group●TAT : Tact Time●TCS :●●“ U ” Start :●UV : U ltra V iolet (紫外線的..)●UXGA:U ltra S uper X tended Video G raphics A rray(1600*1200)●USB : U niversal S erial B us (萬用串列匯流排)●UWA : U ltra Wide View (超廣視角)●ULC : U ltra L ow-power C onsumption(低耗電技術)●UPS : Uninterruptible Power System (不斷電系統)●UDI : Ultra Duplex Image（單片雙影像）●UHA : Ultra High Aperture●ULPA:“ V ” Start :●Vibration：振動測試●VAC: Vac uum(真空吸著)●VGA: V ideo G raphics A rray (640*480/16色圖形之顯示模式 )●VESA: V ideo E lectronic S tandard A ssociation(視訊電子標準協會)●VESDS: V ery E arly S moke D etection S ystem (極早期火警探測系統)●“ W ” Start :●WB : W hite B alance (白平衡)●WIP: W ork I n P rocess (在製品)●WI : W ork I nstruction (工作教導)●WV-Film : W ide V iew Film (廣視角膜)“ X ” Start :●XGA: X tended video G raphics A rray (1024*768) “ Y ” Start :“ Z ” Start :。