GERBER输出各层文件后缀名定义
gerber输出各层文件后缀名
在大多数的EDA软件中设计PCB时都会定义一层Solder Mask,这在生产上就是所谓的阻焊层，对于焊盘上未定义Solder Mask的区域。也就是生产时上焊料、阻焊剂的地方，如果这各区域定义的过大，将会使该焊盘附近的走线或其他导电物体裸露在阻焊剂之处。从而在加工时该焊盘与其附近的金属走线容易形成“桥接”，造成短路现象。由此可见，生产上的“Solder Bridges”现象通常是由于设计阶段的mask数据的不恰当定义并且CAD系统又没有及时发现而引起的。因此，在生产加工之前快速的检测并修复“Solder Bridges”现象是非常必要的。
数据块格式：%AM*,,,[]*
[,,,[>*…*%
为当前自定义光圈定义一个名称
? ū ū ? ? ? ? ? ?
1(圆) Exp 直径 圆心X 圆心Y
2/20(线) Exp 线宽 起点X 起点Y 终点X 终点Y 角度
21(长方形) Exp 宽 高 中心Ｘ 中心Ｙ 角度
7.以上介绍的DFM检验各项功能都可以在Info -> Report菜单中产生一个报告显示检测结果。如Sliver Report、Solder Mask Errors Report、Silkscreen Errors Report等并可保存为*.rpt文件。
如果已经运行过这些检验功能，只是想看看他们具体所在的位置可以通过Info -> Find菜单来实现。也可以在Analysis下的某个菜单项的对话框中直接点击即可。
%ADD10C,0.010*% 定义D10码为圆，直径10MILs
%LNBOXES*% 层名为BOXES
G54D10* 以下为RS0274D数据
gerber层数中英文对照
gerber层数中英文对照在电子制造业中，Gerber文件是一种常用的标准格式，用于传输PCB（Printed Circuit Board，印刷电路板）的设计数据。
Gerber文件中包含了电路板的层信息，例如连接层、焊盘层、丝印层等。
由于电子制造业在国际间的交流越来越频繁，Gerber层数的中英文对照就显得尤为重要。
本文将为大家介绍Gerber层数的中英文对照，方便各国电子制造企业之间的合作与交流。
Gerber层数中英文对照如下：1. Top layer (顶层)2. Bottom layer (底层)3. Inner 1 (内层1)4. Inner 2 (内层2)5. Inner 3 (内层3)6. Inner 4 (内层4)7. Inner 5 (内层5)8. Inner 6 (内层6)9. Inner 7 (内层7)10. Inner 8 (内层8)11. Inner 9 (内层9)12. Inner 10 (内层10)13. Inner 11 (内层11)14. Inner 12 (内层12)15. Inner 13 (内层13)16. Inner 14 (内层14)17. Inner 15 (内层15)18. Inner 16 (内层16)在Gerber文件中，顶层是指PCB布线的最上层，底层是指PCB布线的最下层。
内层1至内层16是指PCB内部的层次，层数越大表示层次越深。
电子制造企业在设计和制造电路板时，会根据实际需求来确定Gerber文件的层数。
层数的增加有时可以提高电路板的复杂性和功能，但同时也增加了制造成本和工艺要求。
通过Gerber文件的中英文对照，不同国家的电子制造企业可以准确理解和交流各自的设计要求和制造需求。
在国际合作中，准确的层数对应可以避免误解和沟通障碍。
此外，中英文对照也为国际间的技术交流提供了便利，提升了电子制造产业的全球化水平。
总结一下Gerber层数中英文对照：- 顶层：Top layer- 底层：Bottom layer- 内层1：Inner 1 - 内层2：Inner 2 - 内层3：Inner 3 - 内层4：Inner 4 - 内层5：Inner 5 - 内层6：Inner 6 - 内层7：Inner 7 - 内层8：Inner 8 - 内层9：Inner 9 - 内层10：Inner 10 - 内层11：Inner 11 - 内层12：Inner 12 - 内层13：Inner 13 - 内层14：Inner 14 - 内层15：Inner 15 - 内层16：Inner 16以上是Gerber层数中英文对照的内容。
gerber文件后缀名含义
gerber文件后缀名含义Top Layer .GTL 顶层走线Bottom Layer .GBL 底层走线Top Overlay .GTO 顶层丝印Bottom Overlay .GBO 底层丝印Top Paste .GTP 顶层表贴(做激光模板用)Bottom Paste .GBP 底层表贴(做激光模板用)Top Solder .GTS 顶层阻焊(也叫防锡层,负片)Bottom Solder .GBS 底层阻焊(也叫防锡层,负片)MidLayer1 .G1 内部走线层1MidLayer2 .G2 内部走线层2MidLayer3 .G3 内部走线层3MidLayer4 .G4 内部走线层4Internal Plane1 .GP1 内平面1(负片)Internal Plane2 .GP2 内平面2(负片)Mechanical1 .GM1机械层1Mechanical2 .GM2 机械层2Mechanical3 .GM3 机械层3Mechanical4 .GM4 机械层4Keep Out Layer .GKO 禁止布线层(可做板子外形)Top Pad Master.GPT 顶层主焊盘Bottom Pad Master .GPB 底层主焊盘Aperture Data.APR光圈文件Drill Data .DRL 钻孔数据Drill Position.TXT钻孔位置Drill Tool size.DRR钻孔尺寸Drill Report.LDP钻孔报告一般只须读取以下档案即可完成雕刻前准备工作:1.零件面: 即GERBER之零件面资料以PROTEL为例零件面资料之格式为＊.GTL2.Aperture File : 即GERBER之Aperture文件以PROTEL为例零件面资料之格式为＊.APT3.焊锡面: 即GERBER之焊锡面资料以PROTEL为例焊锡面资料之格式为＊.GBL4.钻孔档: 即GERBER之钻孔文件资料以PROTEL为例钻孔文件资料之格式为＊.TXT5.成型档: 资料格式依所提供之各种不同之资料作选择以PROTEL为例资料之格式为＊.GKO。
Gerber文件各层的表示
GM2---Mechanical2 机械层2 ...
GKO---KeepOuter 禁止布线层
GG1---DrillGuide 钻孔引导层
GD1---DrillDrawing 钻孔图层
GPT---Top pad Master 顶层主焊盘
GPB---Bottom pad Master 底层主焊盘
如何在CAM350查看gerber文件
如何在CAM350可能对这些经验也感兴趣
CAM350导出DXF
CAM350导出DXF
CAM350导入GERBER文件的方法
CAM350导入GERBER文件的方法
GTS---Topsolder 顶层阻焊(也叫防锡层/绿油,负片)
GBS---BottomSolder 底层阻焊
G1---Midlayer1 内部走线层1
G2---Midayerr2 内部走线层2
GP1---InternalPlane1 内平面1(负片)
GP2---InternalPlane2 内平面2(负片) ...
CAM350导入GERBER文件步骤
CAM350导入GERBER文件步骤
高速PCB设计如何操作CAM350基本命令
高速PCB设计如何操作CAM350基本命令
cam350拼版攻略
cam350拼版攻略
附上Gerber文件各层的表示
GTL---toplayer 顶层
GBL---bottomlayer 底层
GTO---TopOverlay 顶层丝印层
GBO---Bottomlayer 底层丝印层
GTP---TopPaste 顶层表贴(做激光模板用)
PROTEL99SEGERBER输出各层文件后缀名定义
PROTEL99SE GERBER输出各层文件后缀名定义Protel99SE Gerber output each layer file suffix nameGTL---toplayer top layerGBL---bottomlayer bottomGTO---TopOverlay top screen printing layerGBO---Bottomlayer bottom screen printing layerGTP---TopPaste top level paste (used as laser template)GBP---BottomPaste bottom table pasteGTS---Topsolder top solder (also called tin layer / green, negative)GBS---BottomSolder bottom weldingG1---Midlayer1 internal routing layer 1G2---Midayerr2 internal routing layer 2...GP1---InternalPlane1 plane 1 (negative)GP2---InternalPlane2 plane 2 (negative)...GM1---Mechanical1 mechanical layer 1GM2---Mechanical2 mechanical layer 2...GKO---KeepOuter inhibit wiring layerGG1---DrillGuide drilling boot layerGD1---DrillDrawing drill layerGPT---Top pad Master top master padGPB---Bottom pad Master bottom master padGerber file introduction:The standard Gerber file format can be divided into two types, RS-274 and RS-274X, which differ in that:RS-274, Gerber, file, and aperture are separate files.The aperture in RS-274X format is integrated in Gerber file, so there is no need for aperture files (ie, containing D code).Data format: integer bit + decimal digitCommonly used: 3:3 (metric, integer 3, decimal 3)2:4 (Imperial, integer 2, decimal 4)2:3 (Imperial, integer 2, decimal 3)3:3 (Imperial, integer 3, decimal 3)Leading zero, post zero and no zero:Example: 025690 leading zeros change to: 25690 (Leading) After 025690, zero is changed to: 02569 (Trailing)025690 does not lead to zero: 025690 (None)Company：METRIC (mm)ENGLISH (inch, or, mil)Unit conversion:1 inch = 1000 mil = 2.54 cm = 25.4 mm1 mm = 0.03937 inch = 39.37 milData features in GERBER format:Data code: ASCLL, EBCDIC, EIA, ISO code, commonly used: ASC, II code.Data units: Imperial, metric, and common: english.Coordinate forms: relative coordinates, absolute coordinates, commonly used: absolute coordinates.Data form: the former zero, the fixed length, the after zero, commonly used: fixed length.Introduction to polarity of GERBER FILE:Positive (POSITIVE): the GERBER description is the wiring layer, and the graphics depicted are mainly copper parts. Or "GERBER" describes the anti welding layer, and the description of the figure is mainly the anti welding part (that is, the cover ink part).Negative (NEGTIVE): GERBER description is a circuit layer, and the description of graphics is mainly copper parts. Or "GERBER" describes the anti welding layer, and the description of the figure is mainly non welding part (i.e., no ink part).Composite chip (COMPOSTIVE): the layers described by GERBER are synthesized from different polar layers.Usually, the excavation layer and the positive layer are superimposed.The polarity of excavation is C, mainly from line protection or additional process information.GERBER data is a file format that can be generated by all PCBCAD systems that can be processed by all optical plotters. The GERBER format is a subset of the EIA standard RS-274D. The extended GERBER format is a superset of EIA standard RS-274D format, also called RS-274X. RS-274X enhances handling of polygon fill, plus and minus combinations, custom D codes, and other functions. It also defines the rules for embedding an aperture table in the GERBER data file.The GERBER format file consists of a series of data blocks (parameters and code). Each block is separated by a block ending (EOB) symbol. The EOB character is usually an asterisk (*). According to the order in the file, the data blocks fall into the following two categories:1 RS-274X parameterDivided into the following groups in sequence:Prompt parameterAS coordinate selectionFS format descriptionMI mirror imageMO unitOF offsetSF scale factorImage parameterIJ image alignmentIN image nameIO image offsetIP image positive and negativeIR image rotationPF drawing film nameAperture parameterAD aperture descriptionAM aperture customLayer parameterKO excavationLN layer namePositive and negative of LP layer SR mobile and replicationmiscIF embedded file2 standard RS-274D codeIncluding a character function code, such as D code, G code, M code, and coordinate data. The coordinate data in X, Y format describes the linear position, and the I and J format describes the arc position.N Code: sequential code, named block order. (0-99999)D Code: drawing code, select, control the iris, specify the line type.G Code: general purpose code, used for coordinate positioning.M Code: Specifies the end of the file, etc..Example：*G04 THIS IS DEMO annotation%FSLAX23Y23*% omit leading zeros, absolute coordinates X2.3, Y2.3%MOIN*% set inch units%OFA0B0*% no offset%SFA1.0B1.0*% output ratio X axis 1, Y axis 1%ADD10C, 0.010*% defines D10 code as circle, diameter 10MILs The%LNBOXES*% layer is called BOXESG54D10* below is RS0274D dataX0Y0D02*X5000Y0D01*X5000Y5000D01*X0Y5000D01*X0Y0D01*X6000Y0*X11000Y0D01*X6000Y0D01*D02*M02* data overTwo RS-274X parameterFormat:%[]*%Parameter code, double character code (AD, AM, FS, etc.)The modifier completes the parameter code to define the qualifier requiredAD Aperture Definition aperture descriptionData block format:%ADD, [X]*%N1 D code number (10-9999)C (circle) outside diameter, X direction aperture, Y direction apertureThe R (oblong) X extends from size Y to size X to aperture Y to apertureO (ellipse) X from size Y to size X to aperture Y to apertureP (positive, multilateral) outer diameter, rotation angle, X direction aperture, Y apertureAM Aperture Macro custom irisA data block format:%AM*, []*.[[>*,,... *%Defines a name for the current custom apertureGame game1 (circle) Exp, diameter center X, center Y2/20 (line) Exp, line width starting point, X starting point, Y end point, X end point, Y angle21 (oblong) Exp, wide, high, center, X, center, Y angle22 (rectangular) Exp, wide height, left lower X, lower left Yangle4 (polygon) Exp points, starting point X, starting point Y, X1, Y1... angle5 (regular polygon) Exp, top count center, X center, Y diameter6 (Moire) X0 Y0, outer diameter, ring width, ring spacing, rings tens of width, ten long angle7 (heat dissipation) X0, Y0 outside diameter, inner diameter, mouth size angle3 end customAS, Axis, Select axis selectionData block format:%ASA[X|Y]B[X|Y]*%A B output device coordinate axisX Y data file coordinate axisFS Format StatementData block format:%FS[L|T][A|I][Nn][Gn]XnnYnn[Dn][Mn]*%L T L omit leading zero T, omit tail zeroA, I, A, absolute coordinates, I, relative coordinatesIn most EDA software, when designing the PCB, a Solder Mask is defined, which is called the solder layer in production, and the Solder Mask region is not defined on the pad. That is, where the solder and solder resist are produced, if the area is defined too large, the line or other conductive object near the pad will be exposed to the solder resist. Thus, in the process of processing, the bond plate and its vicinity metal wire are easy to form "bridging", causing short circuit phenomenon. Thus, the "Solder Bridges" phenomenon in production is usually caused by the improper definition of the mask data in the design stage and the CAD system is not found in time. Therefore, it is necessary to detect and repair "Solder Bridges" phenomenon quickly before processing.CAM350 not only can quickly find "Solder Bridge", but also can be repaired. Before processing to realize this function as long as the use of Analysis Find Solder Bridges to open the menu - > "Solder Bridging" dialog box.Tick in the "Top Check/Bottom Check" in front of a small box can choose only to detect surface or bottom detection or at the same time. In the following "Mask, Layer, Check, Against", select the correct layer, note that Soldermask_top corresponds to the Top layer; Soldermask_bottom corresponds to the Bottom layer. In Bridge Distance, enter the minimum tolerance bridge spacing. In the following "Search Area", select "Process Entire Layer" to indicate that the system will detect all layers currently open. If you choose "Window Area to Process", you would like to select a window first, and the system will detect the area of the window. After OK, the system will continue to be tested for some time. If an error is detected, a dialog boxis popped up. OK, the screen will jump to another edit window, and an information display / edit bar appears on the upper right.Here you can see all of the error specific locations, you can click on "All" to show all the errors, or you can select a error in the drop-down box, so you can query the specific location of the error.6.Check DrillThis function item is used to examine various problems in the drilling. For example, the distance between the hole and the hole is reasonable, whether or not there are two holes of the same size or different size in the same position.Analysis Check Drill Alalysis - > Drills, pop-up dialog box."Overlapped Drill Hits" can check whether there are two overlapping vias at the same location. "Coincident Drill Hits (Different Sizes)" can test whether there are two or more vias of the same size in the same location, but these vias are produced by different Tools. "Redundant Drill Hits (Same Size") can check whether or not there are two or more vias of the same size at the same location, but these vias are generated by the same Tool. "Drill, Hole, to, Drill, Hole, Clearance" can test whether the spacing between the holes meets certain rules. Next, select the layer you want to test in the Layers to Analyze.More than 7. of the DFM test the function can produce a report in the Info Report menu - > display test results. Such as Sliver,Report, Solder, Mask, Errors, Report, Silkscreen, Errors, Report, etc., and can be saved as a *.rpt file.If you have run the test function, just want to look at their specific location can be achieved by using Info - Find menu. You can also click directly in the dialog box of a menu item under Analysis.3. Copper Slivers"Copper Slivers" refers to those thin and narrow areas of copper that may easily fall off during production. This feature not only detects the narrow areas of copper deposits, but also the repair / trim function. Before you perform this operation, first open the relevant layers that you need to detect. Analysis - > Copper Slivers "Copper Slivers Detection" will pop up a dialog box.The first input can tolerate the minimum number of copper in the "Find Slivers Less than". In "Processing Control", you can choose "Fix Silvers" to repair the fine copper. Select "Remove Old Slivers" to eliminate the detection results that have been generated, such as "Mask Silvers"". In the following "Search Area", select "Process Entire Layer" to indicate that the system will detect all layers currently open. If you choose "Window Area to Process", you would like to select a window first, and the system will detect the area of the window. OK, detection system will continue to end time, finally pops up a message, if no error will show "Found no new Slivers". If you find errors will pop up an error message box, determine the screen will jump to another edit window. You can see all theexact locations here,You can click on "All" to display all the errors, or you can select a error in the drop down box so that you can query the exact location of the error.4.Mask Slivers"Mask Slivers" refers to those thin and narrow areas which are easily removed in the production process (commonly known as "green" solder barrier). Once the solder is removed, the solder is easily slid into the solder, causing undesirable results. This function can be detected and repaired before production, so as not to cause unnecessary consequences. Analysis, Mask Silvers, Mask Sliver Detection, a pop-up dialog box.The first input can tolerate the minimum number of copper in the "Find Slivers less than". In "Processing Control", you can choose "Fix Slivers" to repair the fine copper. Select "Remove Old Slivers" to cancel the previously detected results, such as "Mask Slivers"". In the following "Search Area", select "Process Entire Layre" to indicate that the system will detect all layers currently open. If you choose "Window Area to Process", you would like to select a window first, and the system will detect all layers currently open. After OK, the system will continue to be tested for a while and finally pop up a tooltip message. If there is no error, "Found no new Slivers" will be displayed". If an error is detected, a false dialog box is popped up. OK, the screen will jump to another edit window, and an information display / edit bar appears on the upper right. Here you can see all of the error specificlocations, you can click on "All" to show all the errors, or you can choose a error in the drop-down box, so you can query the specific location of the error.1., Silk, to, Solder, SpacingThis is the software to automatically test the screen printing layer and the spacing of the solder resist. Analysis Silk to Solder Spacing, "Check Silkscreen" dialog box will pop up.First, select the two layer you want to check, that is, Sildcreen_top/Soldermask_top, select both andSildcreen_bottom/Soldermask_bottom at the same time. Then enter the most tolerable spacing in the Clearance. The best tick in the "Remove Old Silkscreen Errors", to avoid confusion. After OK, the system performs the lookup, and at the bottom of the screen shows the "Silk to Sold Check" on the left: the percentage shown on the right shows a message box for error after execution. After "OK", the screen jumps to these two levels of information, and a display / edit bar is added to the top right of the screen. Here you can see all of the error specific locations, you can click on "All" to show all the errors, or you can choose a error in the drop-down box, so you can query the specific location of the error.2., Solder, Mask, to, Trace, SpacingIn general EDA software, defined as Solder Mask place, in fact, when the board is painted solder place. Where there is no Solder Mask, the solder is stopped when the board is made.In the process of welding solder to avoid disorderly flow caused between "pad lead bridge" short circuit main purpose of solder resist, ensure the quality of the installation, to provide electrical environment for a long time and anti chemical protection, forming printed circuit board coat".This command is when an implementation software automatically checks the line and Sold (solder) pitch function.Analysis Solder Mask to Trace - > Spacing, "Check Solder Mask" will pop up a dialog box.In this dialog, select the Electrical Layer and Solder Mask Layer two layers to check respectively. Select theTop/Soldermask_top layer at the same time, or check the Bottom/Soldermask_Bottom layer at the same time. Then enter the minimum tolerable spacing in the Clearance. The best tick in the "Remove Old Solder Mask Errors", to avoid confusion. After OK, the system performs the lookup. At this time, the bottom of the screen shows the "Solder to Trace Check": the percentage displayed on the right. After the execution, if an error is detected, an error message box will pop up.Similarly, the screen will jump to the two level of information after the confirmation, and a display / edit bar will be added to the top right of the screen. Here you can see all of the error specific locations, you can click on "ALL" to show all the errors, or you can select a error in the drop-down box, so you can query the specific location of the error.。
Allegro软件输出Gerber文件 说明参考
Allegro软件系统输出PCB Gerber文件参考姓名：XX 部门：XX1Gerber 文件系统名词解释：1.1.光绘文件的正负片概念为更好的适应不同的设计方式和便于文件传递，光绘文件被定义为正片和负片两种,如图1所示：正片(Positive): Gerber 描述的是线路层，并且描述之图形主要是有铜部分；正片的优点是所见即所得，方便直观，缺点是数据量比较大，尤其是在大量铜箔填充的情况下。
负片(Negative): Gerber 描述的是线路层，并且描述之图形主要是无铜部分；负片的优点是数据量小，方便文件传输，但显示不直观，不利于进行布线设计，所以一般应用于电源地等整片铜箔的平面层。
而且在设计及生产时需要特别注意处理方式于与正片的不同。
复合片(Compostive): Gerber 所描述的层次有不同极性层合成。
通常是挖层和正极性叠加。
挖层极性为负，主要起线路防护或追加制成资料等作用。
实际上，在Allegro 系统中，负片显示方式和正片差别并不大，只是在光绘文件输出的时候会遵循负片的数据形式，这样的设置是为了更加直观的显示设计情况。
图1 正负片1.2.什么是Gerber 文件Gerber 也叫“光绘”，通常只代表一种格式如RS-274, 274D, 274X 等，充当了将设计的图形数据转换成PCB制造的中间媒介，即一种CAD-CAM 数据转换格式标准。
主要用途就是PCB 版图绘制,最终由PCB 制作商完成PCB的制作。
无论是哪种CAD系统，最后都必须将内部CAD 数据库转换成GERBER格式文件。
在这个过程中，Aperture table描述了绘图机的镜头大小、形状、位置信息。
两者的转换通常是无形的，一旦Gerber 产生，绘图机就可以开始工作。
绘图机是一种较昂贵但很精确的设备，精确度可以小于1mil。
1.3.Gerber 的几种常见格式Gerber Format 是电子业之间通用的资料格式，它是被用于设计完成与上线制造PCB 的中间体，就像土木或机械五金业常用的AutoCAD 软体所输出的DXF 或HPGL 格式一般，是设计师把图稿设计完成所产生的文件与其它系统连结的工作资料。
PCB各层定义及输出Gerber文件定义
Protel 99 SE所提供的工作层大致可以分为7类:Signal Layers(信号层)、InternalPlanes(内部电源/接地层)、Mechanical Layers(机械层)、Masks(阻焊层)、Silkscreen(丝印层)、Others(其他工作层面)及System(系统工作层)，在PCB设计时执行菜单命令[Design]设计/[Options...]选项可以设置各工作层的可见性。
1.Signal Layers(信号层)Protel 99 SE提供有32个信号层，包括[TopLayer](顶层)、[BottomLayer](底层)、[MidLayer1](中间层1)、[MidLayer2](中间层2)……[Mid Layer30](中间层30)。
信号层主要用于放置元件(顶层和底层)和走线。
信号层是正性的，即在这些工作层面上放置的走线或其他对象是覆铜的区域。
2.InternalPlanes(内部电源/接地层)Protel 99 SE提供有16个内部电源/接地层(简称内电层):[InternalPlane1]—[InternalPlane16]，这几个工作层面专用于布置电源线和地线。
放置在这些层面上的走线或其他对象是无铜的区域，也即这些工作层是负性的。
每个内部电源/接地层都可以赋予一个电气网络名称，印制电路板编辑器会自动地将这个层面和其他具有相同网络名称(即电气连接关系)的焊盘，以预拉线的形式连接起来。
在Protel 99 SE中。
还允许将内部电源/接地层切分成多个子层，即每个内部电源/接地层可以有两个或两个以上的电源，如+5V和+l5V等等。
3.Mechanical Layers(机械层)Protel 99 SE中可以有16个机械层:[Mechanical1]—[Mechanical16]，机械层一般用于放置有关制板和装配方法的指示性信息，如电路板物理尺寸线、尺寸标记、数据资料、过孔信息、装配说明等信息。
Gerber文件各层扩展名与原PCB各层的对应关系审批稿
G e r b e r文件各层扩展名与原P C B各层的对应关系YKK standardization office【 YKK5AB- YKK08- YKK2C- YKK18】Gerber文件各层扩展名与原PCB各层的对应关系protel所产生的gerber，都是统一规范的，具体表现以下方面：1.扩展名的第一位g一般指gerber的意思2.扩展名的第二位代表层的面，b代表bottom面，t代表top面，g+数字代表中间线路层，g+p+数字代表电源层。
3.扩展名的最后一位代表层的类别。
l是线路层，o是丝印层，s是阻焊层，p代表锡膏，m 代表外框、基准孔、机械孔，其它一般不重要文件扩展名：顶层Top (copper) Layer : ...........................................GTL底层Bottom (copper) Layer :....................................... .GBL中间信号层Mid Layer 1, 2, ... , 30 : ...............G1, .G2, ... . .G30内电层Internal Plane Layer 1, 2, ... , 16 : ......GP1, .GP2, ... . .GP16顶丝网层Top Overlay :............................................. .GTO底丝网层Bottom Overlay : ...........................................GBO顶锡膏层Top Paste Mask : ...........................................GTP底锡膏层Bottom Paste Mask :....................................... .GBP顶阻焊层Top Solder Mask : ..........................................GTS底阻焊层Bottom Solder Mask :...................................... .GBS禁止布线层Keep-Out Layer : .........................................GKO机械层Mechanical Layer 1, 2, ... , 16 : ..........GM1, .GM2, ... , .GM16顶层主焊盘Top Pad Master : .........................................GPT底层主焊盘Bottom Pad Master : ......................................GPB钻孔图层Drill Drawing, Top Layer - Bottom Layer (Through Hole) : ...GD1Drill Drawing, other Drill (Layer) Pairs : ...................GD2, .GD3钻孔引导层Drill Guide, Top Layer - Bottom Layer (Through Hole) : ...GG1Drill Guide, other Drill (Layer) Pairs : .............GG2, .........GG3机械层：定义整个PCB板的外观的，其实我们在说机械层的时候就是指整个PCB板的外形结构.禁止布线层：定义我们在布电气特性的铜一时的边界，也就是说我们先定义了禁止布线层后，我们在以后的布过程中，所布的具有电气特性的线是不可能超出禁止布线层的边界.Top overlay和bottom overlay：定义顶层和底的丝印字符，就是一般我们在PCB板上看到的元件编号和一些字符。
Gerber文件各层用途
Gerber文件的应用什么是gerber文件GERBER文件是一种国际标准的光绘格式文件,它包含RS-274-D和RS-274-X 两种格式,其中RS-274-D称为基本GERBER格式,并要同时附带D码文件才能完整描述一张图形;RS-274-X称为扩展GERBER格式,它本身包含有D码信息。
常用的CAD软件都能生成此二种格式文件。
Gerber数据是由象片测图仪（Photoplotters）生成的。
象片测图仪由一个精密的伺服系统组成，该系统控制着一个X-Y工作台，上面附着一片高对比度菲林。
光源透过一个快门照在菲林上。
该快门含有一个光圈并聚焦在菲林上。
控制器把Gerber指令转换为适当的工作台移动，光圈旋转和快门的开合。
其结果就是我们通常看到的Gerber文件。
Protel中Design/Board Layers&Color（1）Signal Layers：信号层ProtelDXP电路板可以有32个信号层，其中Top是顶层，Mid1～30是中间层，Bottom是底层。
习惯上Top层又称为元件层，Botton层又称为焊接层。
信号层用于放置连接数字或模拟信号的铜膜走线。
（2）Masks：掩膜Top/Bottom Solder：阻焊层。
阻焊层有2层，用于阻焊膜的丝网漏印，助焊膜防止焊锡随意流动，避免造成各种电气对象之间的短路。
Solder表面意思是指阻焊层，就是用它来涂敷绿油等阻焊材料，从而防止不需要焊接的地方沾染焊锡的，这一层会露出所有需要焊接的焊盘，并且开孔会比实际焊盘要大。
这一层资料需要提供给PCB厂。
Top/Bottom Paste：锡膏层。
锡膏层有2层，用于把表面贴装元件（SMD）粘贴到电路板上。
利用钢膜（Paste Mask）将半融化的锡膏倒到电路板上再把SMD元件贴上去，完成SMD元件的焊接。
Paete表面意思是指焊膏层，就是说可以用它来制作印刷锡膏的钢网，这一层只需要露出所有需要贴片焊接的焊盘，并且开孔可能会比实际焊盘小。
Gerber 文件简介--匠人的百宝箱
Gerber 文件简介--匠人的百宝箱Gerber 文件简介2004-11-28 14:02:57 阅读次数： 2362一、 Gerber文件的来源1．客供文件A 客户直接发的Gerber文件;B 根据*.PCB格式文件转出的Gerber文件.2．根据客户提供的PCB采点，所得的公制3.2格式的Gerber文件。
二、原始PCB文件可以用下几种软件转出Gerber格式：1．Pads 2000 (*.job) D码（*.rep）Gerber（*.pho）2．PowerPCB (*.job/*.pcb) D码（*.rep）Gerber（*.pho）3．Protel (*.PCB) D码（*.APT）Gerber（*.GTL/ *GTP/ *GTO）4．AutoCAD (*.dwg) Gerber（*.dxf）5．Orcad (*.max) D码（*.APP）Gerber（*.TOP/ *.SST/ *.SPT/ *.SMT）三、Protel (*PCB)1．D码（*.APT/ *.APR (99se)）2．Gerber文件（下面扩展格式名中“T”表示顶层，“B”表示底层）A．线路层 *.GTL *.GBLB．丝印层（字符） *.GTO *.GBOC．贴片层 *.GTP *.GBPD．绿油层（阻焊） *.GTS *.GBSE．边框层 *.GKO或*.GM1四、Power PCB (*.job/ *.pcb)1．D码（*.REP)2．Gerber文件（下面扩展格式名中“01”表示顶层，“02”表示双面板底层，“04”表示4层板底层，“06”表示6层板底层）A．线路层 art01.pho art04.phoB．丝印层（字符） sst0126.pho sst0429.phoC．贴片层 smd0123.pho smd0422.phoD 绿油层（阻焊） smo0121.pho smo0428.pho五、OrCAD (*.max )1．D码（*.APP）2．Gerber文件A．线路层 *.TOP (toplayer) *.BOT (bottomlayer)B．丝印层（字符）*.SST( silkscreentop) *.SSB( silkscreenbottom)C．贴片层 *.SPT(solderpastetop) *.SPB(solderpastebottom) D．绿油层（阻焊）*.SMT(solermasdtop) *.SMB(solermasdtop。
PROTEL99SE GERBER输出各层文件后缀名定义.
PROTEL99SE GERBER输出各层文件后缀名定义.txt 1 inch ＝ 1000 mil ＝ 2.54 cm ＝ 25.4 mm 1 mm ＝ 0.03937 inch ＝ 39.37 mil GERBER 格式的数据特点： 数据码：ASCLL、EBCDIC、EIA、ISO 码，常用：ASC II 码。 数据单位：英制、公制、常用：英制。 坐标形式：相对坐标、绝对坐标，常用：绝对坐标。 数据形式：省前零、定长、省后零，常用：定长。 GERBER FILE 极性介绍：
Gerber文件介绍: 标准的gerber file 格式可分为RS-274 与RS-274X 两种，其不同在于： RS-274 格式的gerber file 与aperture 是分开的不同文件。 RS-274X 格式的aperture 是整合在gerber file 中的，因此不需要aperture 文件(即，内含D 码)。 数据格式：整数位+小数位 常用：3：3（公制，整数3 位，小数3 位）
AM Aperture Macro 自定义光圈
数据块格式：%AM*,,,[]*
[,,,[>*…*%
为当前自定义光圈定义一个名称
?ūū??????
1(圆)
Exp 直径 圆心X 圆心Y
2/20(线) Exp 线宽 起点X 起点Y 终点X 终点Y 角度
21(长方形) Exp 宽 高 中心Ｘ 中心Ｙ 角度
22(长方形) Exp 宽 高 左下X 左下Y 角度
G1---Midlayer1 内部走线层1 G2---Midayerr2 内部走线层2 ... GP1---InternalPlane1 内平面1(负片) GP2---InternalPlane2 内平面2(负片) ... GM1---Mechanical1 机械层1 GM2---Mechanical2 机械层2 ... GKO---KeepOuter 禁止布线层 GG1---DrillGuide 钻孔引导层 GD1---DrillDrawing 钻孔图层 GPT---Top pad Master 顶层主焊盘 GPB---Bottom pad Master 底层主焊盘
Gerber文件设置
输出Gerber 文件设置全局设置：在全局设置中，可以指定输出的Gerber 文件的单位（Units ）和格式（Format ），单位可以是公制（Millimeters ）和英制（Inches ）；格式定义可以设置相关数据的精度，为PCB 加工指定对象放置的精度。
如，2：3表示1mil 的分辨率（1mil=1/1000 inch ）。
如果设计中对象放置的网格为1mil ，你在输出Gerber 文件时应将格式设置小于1mil 。
层设置：在层设置中，选择要输出产生Gerber 文件的层定义；还可以指定任何需要产生镜像的层定义。
同时，还可以指定那些机械层需要被添加到所有的Gerber 图片。
w ww .p cb t ec h.n e t绘制钻孔设置：在绘制钻孔设置中，可以指定那些层对需要一个钻孔绘制；还可以指定用于表示各种尺寸钻孔绘制符号的类型和大小。
同时，还可以指定那些层对需要一个钻孔向导文件，钻孔向导是一幅可以标定PCB 上每个钻孔点的图。
光圈设置：在光圈设置中，可以使能或设置设计中特定的光圈信息。
当使能了嵌入式光圈（RS274X ）参数，系统将会自动为输出的Gerber 文件产生一个光圈列表并根据RS274X 标准将光圈嵌入在Gerber 文件中，为此，将不必担心是否当前的光圈列表中已经包含了所有必要的光圈信息。
如果没有使能该参数，需要在主要的光圈区域内调用、编辑或添加符合要求的光圈表。
w ww .p cb te c h.n e t需要产生新的光圈时，将出现DCode 对话框。
在D000到D9999之间，尽管，通常从D00到D09是为特定的一些图片预留的，用户仍然可以最大指定1000个不同的代码方案。
在输入新的代码方案时是不需要在每个代码前添加字符“D ”的。
在输入新的代码方案后，将会出现如下图的光圈对话框，用户在此编辑光圈的属性，并保存。
w ww .p cb t ec h.n e t高级设置：在高级设置中，诸如在输出Geber 文件时的可视的胶片尺寸、光圈匹配公差及零抑止等参数将可以被指定。
Gerber文件各层扩展名与原PCB各层的对应关系
G e r b e r文件各层扩展名与原P C B各层的对应关系公司内部编号：（GOOD-TMMT-MMUT-UUPTY-UUYY-DTTI-G e r b e r文件各层扩展名与原P C B各层的对应关系protel所产生的gerber，都是统一规范的，具体表现以下方面：1.扩展名的第一位g一般指gerber的意思2.扩展名的第二位代表层的面，b代表bottom面，t代表top面，g+数字代表中间线路层，g+p+数字代表电源层。
3.扩展名的最后一位代表层的类别。
l是线路层，o是丝印层，s是阻焊层，p代表锡膏，m代表外框、基准孔、机械孔，其它一般不重要文件扩展名：顶层Top (copper) Layer : ...........................................GTL底层Bottom (copper) Layer :....................................... .GBL中间信号层Mid Layer 1, 2, ... , 30 : ...............G1, .G2, ... . .G30内电层Internal Plane Layer 1, 2, ... , 16 : ......GP1, .GP2, ... . .GP16顶丝网层Top Overlay :............................................. .GTO底丝网层Bottom Overlay : ...........................................GBO顶锡膏层Top Paste Mask : ...........................................GTP底锡膏层Bottom Paste Mask :....................................... .GBP顶阻焊层Top Solder Mask : ..........................................GTS底阻焊层Bottom Solder Mask :...................................... .GBS禁止布线层Keep-Out Layer : .........................................GKO机械层Mechanical Layer 1, 2, ... , 16 : ..........GM1, .GM2, ... , .GM16顶层主焊盘Top Pad Master : .........................................GPT底层主焊盘Bottom Pad Master : ......................................GPB钻孔图层Drill Drawing, Top Layer - Bottom Layer (Through Hole) : ...GD1Drill Drawing, other Drill (Layer) Pairs : ...................G D2, .GD3钻孔引导层Drill Guide, Top Layer - Bottom Layer (Through Hole) : ...GG1Drill Guide, other Drill (Layer) Pairs : .............GG2, .........GG3机械层：定义整个PCB板的外观的，其实我们在说机械层的时候就是指整个PCB板的外形结构.禁止布线层：定义我们在布电气特性的铜一时的边界，也就是说我们先定义了禁止布线层后，我们在以后的布过程中，所布的具有电气特性的线是不可能超出禁止布线层的边界.Top overlay和bottom overlay：定义顶层和底的丝印字符，就是一般我们在PCB板上看到的元件编号和一些字符。