LCD英语专业名词对照表

LCD 术语对照表

English Chinese Definition Active AreaPerimeter dimensions of the conductive area, within the viewing area of the LCD glass.AnnunciatorAn active element, such as a symbol, word, or phrase.BezelA metal or plastic frame which fits over the LCD glass. The bezel acts as pressure device, compressing the elastomer connector between the LCD Cell GapThe spacing between the two pieces of glass. This space contains the liquid crystal fluid.Chip-on-board The LCD driver is formatted into an area on the PCB. Electrical connections are made by micro diameter gold wires. The entire area is Chip-on-glass A new technology being developed, where the LCD driver format is actually mounted on the surface of the LCD glass.Chip-on-flex The LCD driver is incorporated into a flex connector, which is attached to the contact edge of the LCD mon/BackplaneThe conductive surface on one of the two pieces of glass, which superimposes the pattern on the second piece of glass. The number of backplanes corresponds to the duty ratio.Cold Cathode BacklightA type of fluorescent backlighting or edge lighting. Used in medium to large size graphic LCD modules.Contact Edge The extended area of the LCD glass which contains the conductive leads/traces, to which electrical connections is made by a connector.Contrast ratio The difference in luminance between the unselected area and the selected area.CursorA row or block of dots, used to indicate the location of the next character or symbol to be entered. Used in dot matrix character and graphic LCD Dil Pins Individual metal pins, bonded by epoxy, to each conductive lead/trace onthe contact edge.LCD 專業術語中英文對照表Direct/Static Drive Each conductive lead on the contact edge, connects to one segment or annunicator.Dot/Pixel Typically a rectangular active element, when combined together in a matrix, forms a character or symbol.Dot Matrix A group of dots/pixels forming a character or symbol. The most common dot matrix is a 5 x 7 matrix (5 dots across; 7 dots down).DIL (Dual-In-Line)Two parallel rows of connection holes on a PCB. Also refers to the type of connector needed with this array.Duty Ratio 1/N, where N equals the number of energized or unenergized segments selected by one complete cycle.Elastomer Connector A strip of silicon rubber made up of sequentially spaced conductive and non-conductive material. This is the most common connection method Electrophresis A phenomenon which occurs when excess DC voltage is applied to an LCD. Conductive particles from one piece of glass are transferred through the LC fluid and deposited on the conductive surface of the opposite piece of glass. A conductive spike is created thus causing a dead Electroluminesc ent Lamp Is a thin membrane consisting of two coated electrode plates with an aluminum reflector. When AC voltage is applied to the electrodes, the electrons collide with the light emission core. The energy given off is Fiber Optic Backlight Fiber optic are flattened and then sandwiched between two pieces of pliable plastic. The top piece is used as the diffuser. The opposite ends are tied into a coupler, which is connected to an LED or Halogen light Fill Hole A space left between the epoxy seals, after assembly on one end of the LCD glass. This space is used to fill the glass with the LC fluid, which is noted by a mound of epoxy on one of the glass.Font The active pattern which has all information to be displayed in the LCD glass.Ghosting A phenomenon which occurs when voltage from energized element leaks to an adjacent OFF element and turns the adjacent element partially ON.Heat Seal A flat, flexible, adhesive connector which is bonded to the contact edgeof the glass by heat. Typically used on large graphic modules.Interconnect Dot Connects pattern piece of glass to each backplane. Consists of silver impregnated epoxy.Inverter (DC to AC)Used to power electroluminescent lamps. Converts DC to AC voltage at a high frequency 300Hz -1 kHz.Isotropic Stage When the fluid heats up or cools down to the point where the fluid is no longer in the twisted nematic state. The molecules can no longer twist light and, therefore, all incoming light is absorbed. In positive image displays, the viewing area turns completely dark. The display will revert back to the twisted nematic state when cooled below the isotropicLeads The conductive trace(s) on the contact edge of the glass.LED Backlight A form of backlighting for small to medium size CDs that use surface mount LEDs on a substrate with a light diffuser over the top. In some cases LEDs are placed at each end of the module and light is directedLiquid Crystal Fluid Has properties of both a fluid and solid. Consisting of rod shaped, bipolar molecules, which in the OFF state are capable of twisting polarized light.Module Consists of LCD (glass) connected to a PCB with drivers on board. Controllers, temperature compensation circuits, etc, are optional.Multiplex Using multiple backplanes (commons) in order to reduce the number of connections betweenNegative Image The viewing area is a dark color in the OFF state. The condition is achieved by having both front and rear polarizers in the same axis. In this mode, light passes through the energized areas. Some type of backlight must be used in order to effectively view the information.Pitch Is the center to center dimension of adjacent conductive traces, dots, or connector holes.Polarizers Are made of a polymer acetate with iodide molecules incorporated in the material. The molecules are arranged to only allow scattered light to enter in one plane/axis. Twisted nematic LCDs require two polarizers,Positive Image Active elements, when energized, appear dark in color against a light background (non-energized); I.e., reflective, transflective, transmissive,RCF (Retardation control Film)A thin (100 micros thick) piece of material laminated to the rear polarizer. Function is to change normal blue colored dots to black. Used on supertwist graphic modules with a CFL light source. CommonlyReflective Typically a smooth silver/gray piece of polished aluminum foil bonded to the rear polarizer. Reflects the incoming ambient light. Note : Backlighting can note used with a reflective type LCD.Response Time(T OFF)Total of delay time (Td off) and rise time Tr.Response Time (T ON)Total of rise time Tr and delay time Td on; Time interval between 10%(on) to 90%(on).Saturation Voltage RMS voltage required to turn fluid to 90%(on).Segment An active element of a digit (i.e., typically numeric digits have 7 segments and alpha/numeric digits can have 14 or 16 segments)SIL (Single-In-Line)An LCD module having a single row of connection holes, LCD glass having a single contact edge.Supertwisted Nematic (STN)An improved twisted nematic fluid (200 degrees twist or greater) which has better contrast and optimum viewing range than standard twisted nematic (90 degrees). Acronyms - SBE, New TN; NTN; SNTN.TAB (Tape Automated Bonding)LCD driver or controller electronics are encapsulated in a thin, hard bubble package, of which the drive leads extend from the bubble package on a thin plastic substrate. The adhesive along the edges is used to attach the TAB to the LCD glass and/or PCB.Threshold Voltage RMS voltage required to turn fluid to 10%(on).Transflective A type of backing which is bonded to the rear polarizer. Enables light to pass through the back, as well as reflecting light from the front.Transmissive A type of LCD which does not have a reflector or transflector laminated to the rear polarizer. A backlight must be used with this type of LCD configuration. Most common is transmissive negative image.Twisted Nematic (TN)A type of liquid crystal whereas the aligment surface and therefore the LC molecules are oriented 90 degrees from each surface of glass.Viewing Angle A cone perpendicular to the LCD in which minimum contrast can be seen.Viewing Area The dimensions measured from the inside perimeter of the LCD bezel or LCD glass epoxy seal.Zebra Connector See Elastomer Connector.。

液晶显示英文专有名词翻译

芯片接在玻璃
ACF (Anisotropic Conductive Film)
异方性导电膜
7.日常使用的英文名词
英文专有名词
中文说明
Organization:
Process
Manufacturing Department
Manager
Section Manager
Supervisor
Line Leader
切割(有一次切割及二次切割)
Break (1stbreak, 2ndbreak)
裂片(有一次裂片及二次裂片)
Grind
研磨
PI Print , PI coater
PI印刷
PI Prebake
PI预烤
PI Post-bake
PI后烤
Rubbing
配向
Seal Pattern, Seal dispense
旷工（没有请假）
Performance Evaluation：
Poor
Fair
Good
Excellent
Outstanding
Improve
绩效考核：
表现差的
普通
表现好的
优秀
卓越
有待改进
Quality Control：
IQC=Incoming Quality Control
IPQC=In-Process Quality Control
Lot
指生产在线的在制品或产品,简称「货」
ID (Identity)
标识符(如Lot ID or Chip ID)
Sheet
片(Array区玻璃基版计数单位)***注.
Chip
片(Cell区玻璃计数单位)***注.

LCD术语

公司名称
COMPANY NAME
产品编号
Product Number
版本号
Revision
客户产品型号
Customer Model Number
出样日期
Sample Delivery Date
尺寸
厚度
Thickness
尺寸
Dimension (Size)
可视区
Viewing Area
VA
显示区
Active Area
LC
偏光片
Polarizer
Pol
定向膜
Polyimide
PI
二氧化硅层
SiO2
边框胶
Sealine
空间粉
Spacer
光刻胶
Photoresist
银浆
Silvery Powder
碳浆
Carbonic Powder
稀释剂
Thinner
氢氧化钠
Sodium hydroxide
NAOH
氢氧化钾
Potassium hydroxide
COF
将IC邦定于印刷线路板上
Chip On Board
COB
斑马条
Zebra (Rubber)
热压纸
Heal Seal
管脚
PIN
光电特性
光电特性
Electro-Optical Characteristics
最大交流电压
Maximum AC applied voltage
AC:交流电Alternating Current
目检
Viewing Inspection
电测
Electronic-Test
贴片

LCD 行业英文专有名词

英文專有名詞
中文說明
Vehicle
運輸工具或載具
AGV (Automatic Guided Vehicle)
自動搬運車
MGV (Manual Guided Vehicle)
人力搬運車
Clean lifter
天井傳送車
LIM (Linear Induction Motor) Carrier
線性感應馬達傳送載具
Edge Exposure
邊緣曝光，指在顯影前將玻璃基板邊緣光阻較厚的部分再曝光，以防曝光量不足，造成光阻在顯影後殘留
Developer
顯影機***註.
Hard bake
硬烤***註.
Etcher
蝕刻機
Wet Etch
濕蝕刻***註.
Dry Etch
乾蝕刻***註.
Plasma
電漿ห้องสมุดไป่ตู้**註.
RIE (Reactive ion etching)
留置在當站製程（如有品質問題時）
Release
將hold住的貨放行,釋出
Equipment
設備（簡稱為EQP）
Tool
工具,機台
WIP (Work In Process)
在製品（製程在製品）
Maintenance
維修保養
Cassette
裝在製品的架子***註.
Empty
空的
Reserve
預約
Report
AMSR (Sheet Resistance)
沈積膜的電阻值測試設備
ATOS (Open/Short Tester)
斷短路測試機
ATTG (TEG Tester or TFT Device Measurement)

LCD专业术语解释

LCD专业术语解释LCD：Liquid Crystal Display 液晶显示LCM：Liquid Crystal Module 液晶模块TN ：Twisted Nematic 扭曲向列。

液晶分子的扭曲取向偏转90°STN：Super Twisted Nematic 超级扭曲向列。

约180~270°扭曲向列FSTN：Formulated Super Twisted Nematic 格式化超级扭曲向列。

一层光程补偿片加于STN ，用于单色显示TFT：Thin Film Transistor 薄膜晶体管COB：Chip On Board 通过邦定将IC裸片固定于印刷线路板上COF：Chip On FPC 将IC固定于柔性线路板上COG ：Chip On Glass 将芯片固定于玻璃上Backlight ：背光LED Light Emitting Diode 发光二极管EL Electro Luminescence 电致发光。

EL层由高分子量薄片构Inverter ：逆变器OSD ：On Screen Display 在屏上显示DVI ：Digital Visual Interface （VGA）数字接口LVDS：Low Voltage Differential Signaling 低压差分信号IC：Integrate Circuit 集成电路TCP ：Tape Carrier Package 柔性线路板Duty：占空比，高出点亮的阀值电压的部分在一个周期中所占的比率CCFL(CCFT) ：Cold Cathode Fluorescent Light/Tube 冷阴极荧光灯PDP ：Plasma Display Panel 等离子显示屏CRT ：Cathode Radial Tube 阴极射线管VGA ：Video Graphic Array 视频图形阵列PCB ：Printed Circuit Board 印刷电路板Composite video：复合视频NTSC ：National Television Systems Committee NTSC制式,全国电视系统委员会制式PAL ：Phase Alternating Line PAL制式(逐行倒相制式)SECAM：SEquential Couleur Avec Memoire SECAM制式(顺序与存储彩色电视系统) VOD ：Video On Demand 视频点播DPI ：Dot Per Inch 点每英寸。

LCD专业术语大集

专业术语大集合MVT: Mass V erification Test__多项验证测试ORT: On Going Reliability Test__出货信赖性测试S/W:software__软件H/W: hardware__硬件DCN: Design Change Notice__设计变更通知PVT: Production V erification Test__生产验证测试MTF: Modulation Transfer Function__调整转换功能CA T: Carriage Alignment Tool____载器调整具ID: Industrial Design__ 工业设计(外观设计)PCBA: Printed Circuit Board Assembly__电路板组装F/T: Function Test__功能测试CCD: Charge Coupled Device__扫描器之读器ERS: External Reference Spec__外部规格PMP: Production Management Plan__工程管理计划QA__Quality Assurance 质量保证QRA :Quality & Reliability Assurance质量与可靠性保证MQA :Manufacturing Quality Assurance 制造质量保证DQA: Design Quality Assurance 设计质量保证QC: Quality Control 质量控制IQC: Incoming Quality Control 收益质量控制专业术语大集合VQC: V endor Quality Control__售货质量控制IPQC: In Process Quality Control 制程质量控制OQA: Out going Quality Control 出货质量控制QE:__Quality Engineer 质量工程AQL: Acceptable Quality Level 可接受的质量水平DPPM: Defective Pieces Per Million units 百万件中有损件数PPM: Pieces Per Million 百万分之一CS: Custom Service__顾客服务MRB: Marerial Review Board__DMR Defective Material Report__材料缺陷报告RMA: Return Marerial Administration__材料回收处理Life Test 寿命测试T/C: Temperature Cycle__温度循环H/T: High Temperature Test__高温测试L/T: Low Temperature Test__低温测试ISO: International Standard Organization__国际标准化组织SPC: Statistic process control__统计过程控制5S: 整理.整顿.清理.清扫.素养VMI: Visual Mechanical Inspection__外观机构检验MIL-STD: Military Standard__美军标准专业术语大集合SPEC: Specification__规格A VL: Approval V endor List__合格厂商QVL: Qualified V endor List__合格厂商FQC: Final Quality Control__最终质量控制OBA: Open Box Audit__成品检验EAR: Engineering Analysis RequestFAI: First Article Inspection__首件检验VQM: V endor Quality Management__厂商质量管理CAR: Corrective Action Request__改进对策要求4M: Man; Machine; Material; Method 人,机,材,方法5M: Man; Machine; Material; Method; Measurement 人,机,材,方法,测量MTBF: Mean Time Between Failure 平均寿命TTL: TotalFIN__Finance&Accounting__财务与账目P&L: Profit & LosePV : Performance V ariance 现象差异3 Element of Cost = M,L,OM:__Material 材料L:__Labor 人力Overhead 管理费用专业术语大集合Fix OH__Fix Overhead 固定管理费用V ar OH__V ariable Overhead 不定管理费用COGS__Cost Of Goods Sold 工厂制造成本AR:__Account Receivable 应收AP: Account Payable 应支MIS__Management Information System 资迅管理系统IS: Information System 资迅系统IT: Information Technology 系统技术MRP: Material Requisition Plan 材料需求计划I2:Information Integration System 资迅整合系统SAP: System Application Programming 系统申请项目ERP: Enterprise Resource Programming 企业资源项目HR Human Resource 人力资源PR: Public relation 公共关系T/O: Turn Over Rate=Monthly T/O Total People*12GR: General Affair 总务Organization__组织HQ__Head Quarter 总公司Chairmen__主席________________Lite-On__Group 光宝集团专业术语大集合President总裁Executive Vice President 常务副总裁Vice President 副总裁HR Human Resource 人力资源部FIN Finance 财务Sales 销售R&D: Research & Developing 研发部QA: 质量保证__ QA__DQA CSMIS: Management Information System 资迅管理系统PUR__采购__PurchasingIMD: Image Management Division 影像管理事业部ITS: Information Technology System 电脑部QRA: Quality Reliability Assurance 品保部MFG: Manufacturing__制造部PMC: Production & Material Control 生(产)物(料)管(理) Materials 材料PC: Production Control 生产控制MPS: Mass Production Schedule 量产计划FGI: Finished goods Inventory 成品存货UTS: Units To Stock 存货单元WIP: Working In Process Inventory 在制品专业术语大集合C/T: Cycle Time 循环时间,瓶颈WD: Working Days 工作天MTD: Month To Days 月初到今日(例如总表整理) YTD: Y ear To Days年初到今日SO: Sales Order 销售清单MO: Manufacture Order 制造清单BTO: Build__To__Order 订单生产P/N: Part Number 料号MC: Material Control 材料控制MRP: Material Requisition Plan 材料需求计划INV: Inventory 存货清单Inv Turn Over Days=INVS/NSB X WD 库存周转天数PSI: Production Shipping Inventory 预备待出货JIT: Just In Time 即时Safety Inventory 安全存量CKD: Completed Kits Delivery 全件组装出货SKD: Semi Kits Delivery 半件(小件)组装出货W/H: Warehouse 仓库Rec: Receiving Center 接收中心Raw MTL 原物料专业术语大集合F/G: finish goods 成品Import/Export 进出口SI: Shipping Instruction 发货指令PL: Packing List 包装清单Inv: Shipping Invoice 出货发票ETD: Estimate Arrive 预估离开时间BL: Bill of Landing 提货单(海运)AWB: Air Way Bill 提货单(空运)MAW A: Master Air Way Bill 主提货单HAWB: House Air Way Bill 副提货单TEU: Twenty foot Equipment Unit(Contain) 二十英尺货柜FEU: Forty foot Equipment Unit(Contain) 四十英尺货柜CY: Container Y ard 货柜场THC: Terminal Handing Charge 码头费ORC: Original Receiving Charge 码头费PUR: Purchasing 采购FOB: Free on Board 货运至甲板(离岸价)CIF: Cost Insurance Freight 成本+运费+保险OA: Open Account 开户TT: Telegram Transfer 电汇专业术语大集合COD: Cash On DeliveryCRP: Cost Reduction Program 降低成本方案PR: Purchasing Requisition 采购申请PO: Purchasing Order 采购单MFG__Manufacturing Production 制造生产DL: Director Labor 直接人工IDL: Indirect Labor 间接人工DLH: Direct Labor Hours 直接工时Productivity=UTS/DLHPPH: Pieces Per Hour 每小时件数Efficiency=Actual/Target(%)DT: Machine Down Time 停机时间AI: Auto Insertion 自动插入MI: Manual Insertion 人工插入SMD: Surface Mount Device 表面粘著零件SMT: Surface mount technology 表面粘著技术B/I: Burn In(for how many hours at how many degree) 烧机WI: Work Instruction 工作说明SOP: Standard Operation Procedure 作业指导书R/I: Run In 运转机器ESD: Electrical Static Discharge 静电释放MP: Mass Production 量产专业术语大集合Engineer 工程PE:__Products Engineer; 生产工程__ Process engineer__制程工程TE:__Test Engineer__测试工程ME:__Manufacturing Engineer;__制造工程; Mechanical Engineer 机械工程IE:__Industrial Engineer__工业工程DCC: Document Control Center__文管中心BOM: Bill OF Material__材料清单ECN:__Engineering Change Notice__工程变动公告TECN: Temporary Engineering Change Notice__ 工程临时变动公告A TY: Assembly Test Yield____ Total Yield__直通率TPM:__Total Productivity Maintenance__PM: Product Manager; Project ManagerECR: Engineering Change Request__工程变更申请ECO: Engineering Change Request__工程变更指令EN:__Engineering Notice__工程通报WPS: Work Procedure Sheet__ 工作说明书ICT: In Circuit Test__电路测试P/R:__pilot__run;__C/R control run__ T/R__trial run 试做EVT: engineer V erification Test__工程验证测试DVT:__Design V erification Test__ 设计验证测试英文简称英文全称中文解释VQA V endor Quality Assurance 供应商品质保证IQC In-coming Quality Control 进料检验IPQC In-process Quality Control 制程检验FQC Final Quality Control 最终品质控制LQC Line Quality Control 线上品质控制CQA Customer Quality Assurance 客户品质保证F.P.Y.R First Pass Yield Rate 直通率(一次成功率)MRB Material Review Board 物料委员会PMP Process Management Plan 制程管理计划SOP Standard Operation Process 标准作业程序英文简称英文全称中文解释X-R Chart 平均值与全距管制图X-Rm Chart 个别值与全距管制图P Chart 不良率管制图U Chart 单位缺点管制图C Chart 缺点数管制图Ca Capability of Accuracy 精确度CP Capability of Precision 准确度CPK 制程能力分析S/N Serial Number 序列号Spec. Specification 规格英文简称英文全称中文解释英文简称英文全称中文解释Pass 合格Fail 失败NG No Good 不合格VER V ersion 版本ESD Electro-Static Discharge 静电释放(放电)DWG Drawing 图纸ISO International Standard Organization 国际标准组织MBO Management By Objective 目标管理CAL Calibration (仪器)校正NCR No-Calibration Requirement 勿需校正(免校)英文简称英文全称中文解释Statement of Conformity 一致声明(状态)License 执照Cyber Solution 信元科技RMA Procedure RMA程序Setup 原始设定Disc Setup 磁片设定Languages 语言设定TV Screen 萤幕比Digital Out 数位输出Finish 结束Return 跳出Enter 执行英文简称英文全称中文解释OEM Original Engineering Manufacture 原厂委托制造COMPAQ 美国COMPAQ电脑公司Fujitsu 日本富士通公司HP Hewlett-Packard 美国惠普公司QM Quality Manual 品质手册QP Quality Procedure 品质程序书WI Working Instruction 作业规范OJT On Job Training 在职训练(工作中教导)FIFO First In First Out 先进先出4M1E Man Machine Material Method Environment 人`机器`材料`方法`环境英文简称英文全称中文解释RMA Return Material Authorization 客户退回PPM Part Per Million 10-6(百万分之…)MIL Military(U.S) 美国军事标准MIS Management Information System 管理认证公司TUV 德国认证公司UL 美国优力安全检验CE 欧盟认证公司SGS 英国远东公证PM Production Market 产品市场M/N Manufacturing Notice 制造通告英文简称英文全称中文解释DCC Document Control Center 资料中心ECN Engineering Change Notice 工程变更通知ECR Engineering Change Request 工程变更需求DCN Document Change Notice 文件变更通知PE/ME Product Engineering/Manufacture Engineering 产品工程/制造工程EPR Engineering Pilot Run 工程试作HR Human Resource 人力资源IE/QE Industrial Engineering/Quality Engineering 工业工程/品质工程R&D Research & Design 研究开发PPR Production Pilot Run 生产试做英文简称英文全称中文解释AC/RE Accept/Reject 接收/拒收AQL Acceptable Quality Level 允收品质水准CR Critical Defect 严重缺点MA Major Defect 主要缺点MI Minor Defect 次要缺点QVL Qualified V endor List 合格品质管理TQM Total Quality Management 全面品质管理PDCA Plan Do Check Action 计划`实施`检查`行动MTBF Mean Time Between Failures 平均失效间隔时间QCDS Quality Cost Delivery Service 品质`成本`交期`服务英文简称英文全称中文解释SPC Statistical Process Control 统计制程管制FMEA Failure Mode Effective Analysis 失效模式分析SWOT Strength Weakness Opportunity Threat 强势,弱势,机会,危机ORT On-going Reliability Test 持续可靠度实验DMR Defect Material Review 不良材料审核SCAR Supplier Corrective Action Requirement 供应商矫正措施需求GR&R Gauge Reproducibility and Repeatability 量测系统再生性与再现性DOE Design of Experiment 实验设计法QCC Quality Control Circle 品管圈(品质改善小组)COQ Cost of Quality 品质成本英文简称英文全称中文解释PCBA Inspection Instruction PCBA检验指导书Production Inspection Instruction 生产检验指导书OQA Inspection Procedure OQA检验程序Critical Parts List 主要零件清单Bar Code Control List 条码控制清单Test Bug List 测试不良清单Test Equipment List 测试设备清单R&D Design Test Report R&D设计测试报告P4 Reliability Test Report P4可靠度测试报告Trouble Shooting Guide 引导如何解决问题(手册与说明书)英文简称英文全称中文解释Assembly Drawing 装配图Preliminary BOM 预备BOMPreliminary Schematics 初步图纸Safety Checklist 安规查检表Engineering V ersion 工程版本IC Master IC主导装置Pick Up 光学头Spindle Motor 主轴马达Sled Motor 传动马达Tray Motor 托盘马达Audio Cable 音频线常见的简称英文简称:__ACF英文全称:__Anisotropic Conductive Film中文全称:__各向异性导电薄膜英文简称:__CCD英文全称:__Charge Coupled Device中文全称:__电荷耦合装置英文简称:__CCL英文全称:__Copper Clad Laminate中文全称:__覆铜板英文简称:__CMOS英文全称:__Complementary Metal Oxide Semiconductor 中文全称:__互补氧化金属半导体常见的简称英文简称:__COB英文全称:__Chip On Board中文全称:__通过邦定将IC裸片固定于印刷线路板上英文简称:__COG英文全称:__Chip On Glass中文全称:__将芯片固定于玻璃上英文简称:__COF英文全称:__Chip On FPC中文全称:__将IC固定于柔性线路板上英文简称:__CPU英文全称:__Center Processor Unit中文全称:__中央处理器常见的简称英文简称:__DOC英文全称:__Disk on Chip中文全称:__芯片磁盘英文简称:__EL英文全称:__Electro Luminescence中文全称:__电致发光英文简称:__EPROM英文全称:__Erasable Programmable Read-Only Memory 中文全称:__紫外擦除只读存储器英文简称:__FPC英文全称:__Flexible Printed Circuit中文全称:__柔性线路板常见的简称英文简称:__GAL英文全称:__Generic Array Logic中文全称:__通用阵列逻辑英文简称:__IC英文全称:__Integrate Circuit中文全称:__集成电路英文简称:__LCD英文全称:__Liquid Crystal Display中文全称:__液晶显示器英文简称:__LCM英文全称:__Liquid Crystal Module中文全称:__液晶模块常见的简称英文简称:__LED英文全称:__Light Emitting Diode中文全称:__发光二极管英文简称:__PAL英文全称:__Programmable Array Logic中文全称:__可编程阵列逻辑英文简称:__PCB英文全称:__Printed Circuit Board中文全称:__印刷线路板英文简称:__PDP英文全称:__Plasma Display Panel中文全称:__等离子显示屏常见的简称英文简称:__PLD英文全称:__Programable Logic Device中文全称:__可编程逻辑器件英文简称:__PLED英文全称:__Polymer Light-Emitting Diode中文全称:__高分子发光二极管英文简称:__QA英文全称:__QUALITY ASSURANCE中文全称:__品质保证英文简称:__QC英文全称:__QUALITY CONTROL中文全称:__品质控制常见的简称英文简称:__RAM英文全称:__Random Access Memory中文全称:__随机存取存储器英文简称:__ROM英文全称:__Read Only Memory中文全称:__只读存储器英文简称:__SGS英文全称:__Societe Generale de Surveillance S.A.中文全称:__通用公证行英文简称:__SMD英文全称:__Surface Mount Device中文全称:__表面贴片元器件常见的简称英文简称:__SMT英文全称:__Surface Mount Technology中文全称:__表面贴片技术英文简称:__TAB英文全称:__Tape Aotomated Bonding中文全称:__各向异性导电胶连接方式英文简称:__TCP英文全称:__Tape Carrier Package中文全称:__柔性线路板英文简称:__TTL英文全称:__Transister-Transister-Logic中文全称:__晶体管-晶体管逻辑电路矩阵图的类型矩阵图法在应用上的一个重要特征，就是把应该分析的对象表示在适当的矩阵图上。

一些LCD专业词汇

一些LCD专业词汇LCM(Liquid Crystal Module): 液晶模块LCD(Liquid Crystal Display):液晶显示器Backlight: 背光TN(Twisted Nematic): 扭曲向列的显示类型, 液晶分子的扭曲取向偏转90°STN(Supper Twisted Nematic):超扭曲向列的显示类型,约180~270°扭曲向列FSTN(Formulated STN):薄膜补偿型STN,一层光程补偿片加于STN，用于单色显示TFT(Thin Film Transistor):薄膜晶体管显示类型HTN(High Twisted Nematic):高扭曲向列的显示类型PDP(Plasma Display Panel):等离子体显示VFD(Vacuum Fluorescence Display):真空荧光显示CRT(Cathode Radial Tube):阴极射线管CCFL(CCFT) (Cold Cathode Fluorescent Light/Tube):冷阴极荧光灯LED(Light Emitting Diode):发光二极管EL(Electro luminescence):电致发光。

EL层由高分子量薄片构成.PAL(Phase Alternating Line)AL制式(逐行倒相制式)NTSC(National Television Systems Commi t tee):NTSC制式,全国电视系统委员会制式SECAM(SEquential Couleur Avec Memoire):SECAM制式(顺序与存储彩色电视系统) Inverter: 逆变器Panelink:集成电路IC(Integrate Circuit):集成电路PCB(Print Circuit Board):印刷线路板TCP(Tape Carrier Package):柔性线路板COB(Chip On Board):通过邦定将IC裸片固定于印刷线路板上COF(Chip On Film):将IC封装于柔性线路板上COG(Chip On Glass):将IC封装于玻璃上TMDS:低压差分信号LVDS(Low Voltage Differential Signaling):低压差分信号VGA(Video Graphic Array):视频图形阵列Composite video:复合视频Component video: 分量视频DVI(Digital Visual Interface):（VGA）数字接口VOD(Video On Demand):视频点播DPI(Dot Per Inch):点每英寸TAB(Tape Automated Bonding):柔性带自动连接ECB(Electrically Controlled Birefringence):电控双折射ITO(Indium-Tin Oxide):氧化铟OSD(On Screen Display):在屏上显示S-video:S端子，与复合视频信号比，将对比和颜色分离传输Duty:占空比，高出点亮的阀值电压的部分在一个周期中所占的比率TMDS(Transition Minimized Differential Signaling)转换最小化微分信令。

LCD专业术语

LCD专业术语术语：英文意义，中文解释LCD：Liquid Crystal Display，液晶显示LCM：Liquid Crystal Module，液晶模块TN：Twisted Nematic，扭曲向列。

液晶分子的扭曲取向偏转90°STN：Super Twisted Nematic，超级扭曲向列。

约180~270°扭曲向列FSTN：Formulated Super Twisted Nematic，格式化超级扭曲向列。

一层光程补偿片加于STN，用于单色显示TFT：Thin Film Transistor，薄膜晶体管Backlight：背光Inverter：逆变器OSD：On Screen Display，在屏上显示DVI：Digital Visual Interface，（VGA）数字接口TMDS：Transition Minimized Differential SignalingLVDS：Low V oltage Differential Signaling，低压差分信号Panelink：IC：Integrate Circuit，集成电路TCP：Tape Carrier Package，柔性线路板COB：Chip On Board，通过邦定将IC裸片固定于印刷线路板上COF：Chip On FPC，将IC固定于柔性线路板COG：Chip On Glass，将芯片固定于玻璃上Duty：占空比，高出点亮的阀值电压的部分在一个周期中所占的比率LED：Light Emitting Diode，发光二极管EL：Electro Luminescence，电致发光。

EL层由高分子量薄片构成CCFL(CCFT)：Cold Cathode Fluorescent Light/Tube，冷阴极荧光灯PDP：Plasma Display Panel，等离子显示屏CRT：Cathode Radial Tube，阴极射线管VGA：Video Graphic Array，视频图形阵列PCB：Printed Circuit Board，印刷电路板Composite video：复合视频Component video：分量视频S-video：S端子，与复合视频信号比，将对比和颜色分离传输NTSC：National Television Systems Committee，NTSC制式、全国电视系统委员会制式PAL：Phase Alternating Line，PAL制式(逐行倒相制式)SECAM：SEquential Couleur Avec Memoire，SECAM制式(顺序与存储彩色电视系统)VOD：Video On Demand，视频DPI：Dot Per Inch，点每英寸液晶显示技术综述液晶(Liquid Crystal)是一种介于固态和液态之间的物质，是具有规则性分子排列的有机化合物。

LCD专业术语大集

专业术语大集合MVT: Mass V erification Test__多项验证测试ORT: On Going Reliability Test__出货信赖性测试S/W:software__软件H/W: hardware__硬件DCN: Design Change Notice__设计变更通知PVT: Production V erification Test__生产验证测试MTF: Modulation Transfer Function__调整转换功能CA T: Carriage Alignment Tool____载器调整具ID: Industrial Design__ 工业设计(外观设计)PCBA: Printed Circuit Board Assembly__电路板组装F/T: Function Test__功能测试CCD: Charge Coupled Device__扫描器之读器ERS: External Reference Spec__外部规格PMP: Production Management Plan__工程管理计划QA__Quality Assurance 质量保证QRA :Quality & Reliability Assurance质量与可靠性保证MQA :Manufacturing Quality Assurance 制造质量保证DQA: Design Quality Assurance 设计质量保证QC: Quality Control 质量控制IQC: Incoming Quality Control 收益质量控制专业术语大集合VQC: V endor Quality Control__售货质量控制IPQC: In Process Quality Control 制程质量控制OQA: Out going Quality Control 出货质量控制QE:__Quality Engineer 质量工程AQL: Acceptable Quality Level 可接受的质量水平DPPM: Defective Pieces Per Million units 百万件中有损件数PPM: Pieces Per Million 百万分之一CS: Custom Service__顾客服务MRB: Marerial Review Board__DMR Defective Material Report__材料缺陷报告RMA: Return Marerial Administration__材料回收处理Life Test 寿命测试T/C: Temperature Cycle__温度循环H/T: High Temperature Test__高温测试L/T: Low Temperature Test__低温测试ISO: International Standard Organization__国际标准化组织SPC: Statistic process control__统计过程控制5S: 整理.整顿.清理.清扫.素养VMI: Visual Mechanical Inspection__外观机构检验MIL-STD: Military Standard__美军标准专业术语大集合SPEC: Specification__规格A VL: Approval V endor List__合格厂商QVL: Qualified V endor List__合格厂商FQC: Final Quality Control__最终质量控制OBA: Open Box Audit__成品检验EAR: Engineering Analysis RequestFAI: First Article Inspection__首件检验VQM: V endor Quality Management__厂商质量管理CAR: Corrective Action Request__改进对策要求4M: Man; Machine; Material; Method 人,机,材,方法5M: Man; Machine; Material; Method; Measurement 人,机,材,方法,测量MTBF: Mean Time Between Failure 平均寿命TTL: TotalFIN__Finance&Accounting__财务与账目P&L: Profit & LosePV : Performance V ariance 现象差异3 Element of Cost = M,L,OM:__Material 材料L:__Labor 人力Overhead 管理费用专业术语大集合Fix OH__Fix Overhead 固定管理费用V ar OH__V ariable Overhead 不定管理费用COGS__Cost Of Goods Sold 工厂制造成本AR:__Account Receivable 应收AP: Account Payable 应支MIS__Management Information System 资迅管理系统IS: Information System 资迅系统IT: Information Technology 系统技术MRP: Material Requisition Plan 材料需求计划I2:Information Integration System 资迅整合系统SAP: System Application Programming 系统申请项目ERP: Enterprise Resource Programming 企业资源项目HR Human Resource 人力资源PR: Public relation 公共关系T/O: Turn Over Rate=Monthly T/O Total People*12GR: General Affair 总务Organization__组织HQ__Head Quarter 总公司Chairmen__主席________________Lite-On__Group 光宝集团专业术语大集合President总裁Executive Vice President 常务副总裁Vice President 副总裁HR Human Resource 人力资源部FIN Finance 财务Sales 销售R&D: Research & Developing 研发部QA: 质量保证__ QA__DQA CSMIS: Management Information System 资迅管理系统PUR__采购__PurchasingIMD: Image Management Division 影像管理事业部ITS: Information Technology System 电脑部QRA: Quality Reliability Assurance 品保部MFG: Manufacturing__制造部PMC: Production & Material Control 生(产)物(料)管(理) Materials 材料PC: Production Control 生产控制MPS: Mass Production Schedule 量产计划FGI: Finished goods Inventory 成品存货UTS: Units To Stock 存货单元WIP: Working In Process Inventory 在制品专业术语大集合C/T: Cycle Time 循环时间,瓶颈WD: Working Days 工作天MTD: Month To Days 月初到今日(例如总表整理) YTD: Y ear To Days年初到今日SO: Sales Order 销售清单MO: Manufacture Order 制造清单BTO: Build__To__Order 订单生产P/N: Part Number 料号MC: Material Control 材料控制MRP: Material Requisition Plan 材料需求计划INV: Inventory 存货清单Inv Turn Over Days=INVS/NSB X WD 库存周转天数PSI: Production Shipping Inventory 预备待出货JIT: Just In Time 即时Safety Inventory 安全存量CKD: Completed Kits Delivery 全件组装出货SKD: Semi Kits Delivery 半件(小件)组装出货W/H: Warehouse 仓库Rec: Receiving Center 接收中心Raw MTL 原物料专业术语大集合F/G: finish goods 成品Import/Export 进出口SI: Shipping Instruction 发货指令PL: Packing List 包装清单Inv: Shipping Invoice 出货发票ETD: Estimate Arrive 预估离开时间BL: Bill of Landing 提货单(海运)AWB: Air Way Bill 提货单(空运)MAW A: Master Air Way Bill 主提货单HAWB: House Air Way Bill 副提货单TEU: Twenty foot Equipment Unit(Contain) 二十英尺货柜FEU: Forty foot Equipment Unit(Contain) 四十英尺货柜CY: Container Y ard 货柜场THC: Terminal Handing Charge 码头费ORC: Original Receiving Charge 码头费PUR: Purchasing 采购FOB: Free on Board 货运至甲板(离岸价)CIF: Cost Insurance Freight 成本+运费+保险OA: Open Account 开户TT: Telegram Transfer 电汇专业术语大集合COD: Cash On DeliveryCRP: Cost Reduction Program 降低成本方案PR: Purchasing Requisition 采购申请PO: Purchasing Order 采购单MFG__Manufacturing Production 制造生产DL: Director Labor 直接人工IDL: Indirect Labor 间接人工DLH: Direct Labor Hours 直接工时Productivity=UTS/DLHPPH: Pieces Per Hour 每小时件数Efficiency=Actual/Target(%)DT: Machine Down Time 停机时间AI: Auto Insertion 自动插入MI: Manual Insertion 人工插入SMD: Surface Mount Device 表面粘著零件SMT: Surface mount technology 表面粘著技术B/I: Burn In(for how many hours at how many degree) 烧机WI: Work Instruction 工作说明SOP: Standard Operation Procedure 作业指导书R/I: Run In 运转机器ESD: Electrical Static Discharge 静电释放MP: Mass Production 量产专业术语大集合Engineer 工程PE:__Products Engineer; 生产工程__ Process engineer__制程工程TE:__Test Engineer__测试工程ME:__Manufacturing Engineer;__制造工程; Mechanical Engineer 机械工程IE:__Industrial Engineer__工业工程DCC: Document Control Center__文管中心BOM: Bill OF Material__材料清单ECN:__Engineering Change Notice__工程变动公告TECN: Temporary Engineering Change Notice__ 工程临时变动公告A TY: Assembly Test Yield____ Total Yield__直通率TPM:__Total Productivity Maintenance__PM: Product Manager; Project ManagerECR: Engineering Change Request__工程变更申请ECO: Engineering Change Request__工程变更指令EN:__Engineering Notice__工程通报WPS: Work Procedure Sheet__ 工作说明书ICT: In Circuit Test__电路测试P/R:__pilot__run;__C/R control run__ T/R__trial run 试做EVT: engineer V erification Test__工程验证测试DVT:__Design V erification Test__ 设计验证测试英文简称英文全称中文解释VQA V endor Quality Assurance 供应商品质保证IQC In-coming Quality Control 进料检验IPQC In-process Quality Control 制程检验FQC Final Quality Control 最终品质控制LQC Line Quality Control 线上品质控制CQA Customer Quality Assurance 客户品质保证F.P.Y.R First Pass Yield Rate 直通率(一次成功率)MRB Material Review Board 物料委员会PMP Process Management Plan 制程管理计划SOP Standard Operation Process 标准作业程序英文简称英文全称中文解释X-R Chart 平均值与全距管制图X-Rm Chart 个别值与全距管制图P Chart 不良率管制图U Chart 单位缺点管制图C Chart 缺点数管制图Ca Capability of Accuracy 精确度CP Capability of Precision 准确度CPK 制程能力分析S/N Serial Number 序列号Spec. Specification 规格英文简称英文全称中文解释英文简称英文全称中文解释Pass 合格Fail 失败NG No Good 不合格VER V ersion 版本ESD Electro-Static Discharge 静电释放(放电)DWG Drawing 图纸ISO International Standard Organization 国际标准组织MBO Management By Objective 目标管理CAL Calibration (仪器)校正NCR No-Calibration Requirement 勿需校正(免校)英文简称英文全称中文解释Statement of Conformity 一致声明(状态)License 执照Cyber Solution 信元科技RMA Procedure RMA程序Setup 原始设定Disc Setup 磁片设定Languages 语言设定TV Screen 萤幕比Digital Out 数位输出Finish 结束Return 跳出Enter 执行英文简称英文全称中文解释OEM Original Engineering Manufacture 原厂委托制造COMPAQ 美国COMPAQ电脑公司Fujitsu 日本富士通公司HP Hewlett-Packard 美国惠普公司QM Quality Manual 品质手册QP Quality Procedure 品质程序书WI Working Instruction 作业规范OJT On Job Training 在职训练(工作中教导)FIFO First In First Out 先进先出4M1E Man Machine Material Method Environment 人`机器`材料`方法`环境英文简称英文全称中文解释RMA Return Material Authorization 客户退回PPM Part Per Million 10-6(百万分之…)MIL Military(U.S) 美国军事标准MIS Management Information System 管理认证公司TUV 德国认证公司UL 美国优力安全检验CE 欧盟认证公司SGS 英国远东公证PM Production Market 产品市场M/N Manufacturing Notice 制造通告英文简称英文全称中文解释DCC Document Control Center 资料中心ECN Engineering Change Notice 工程变更通知ECR Engineering Change Request 工程变更需求DCN Document Change Notice 文件变更通知PE/ME Product Engineering/Manufacture Engineering 产品工程/制造工程EPR Engineering Pilot Run 工程试作HR Human Resource 人力资源IE/QE Industrial Engineering/Quality Engineering 工业工程/品质工程R&D Research & Design 研究开发PPR Production Pilot Run 生产试做英文简称英文全称中文解释AC/RE Accept/Reject 接收/拒收AQL Acceptable Quality Level 允收品质水准CR Critical Defect 严重缺点MA Major Defect 主要缺点MI Minor Defect 次要缺点QVL Qualified V endor List 合格品质管理TQM Total Quality Management 全面品质管理PDCA Plan Do Check Action 计划`实施`检查`行动MTBF Mean Time Between Failures 平均失效间隔时间QCDS Quality Cost Delivery Service 品质`成本`交期`服务英文简称英文全称中文解释SPC Statistical Process Control 统计制程管制FMEA Failure Mode Effective Analysis 失效模式分析SWOT Strength Weakness Opportunity Threat 强势,弱势,机会,危机ORT On-going Reliability Test 持续可靠度实验DMR Defect Material Review 不良材料审核SCAR Supplier Corrective Action Requirement 供应商矫正措施需求GR&R Gauge Reproducibility and Repeatability 量测系统再生性与再现性DOE Design of Experiment 实验设计法QCC Quality Control Circle 品管圈(品质改善小组)COQ Cost of Quality 品质成本英文简称英文全称中文解释PCBA Inspection Instruction PCBA检验指导书Production Inspection Instruction 生产检验指导书OQA Inspection Procedure OQA检验程序Critical Parts List 主要零件清单Bar Code Control List 条码控制清单Test Bug List 测试不良清单Test Equipment List 测试设备清单R&D Design Test Report R&D设计测试报告P4 Reliability Test Report P4可靠度测试报告Trouble Shooting Guide 引导如何解决问题(手册与说明书)英文简称英文全称中文解释Assembly Drawing 装配图Preliminary BOM 预备BOMPreliminary Schematics 初步图纸Safety Checklist 安规查检表Engineering V ersion 工程版本IC Master IC主导装置Pick Up 光学头Spindle Motor 主轴马达Sled Motor 传动马达Tray Motor 托盘马达Audio Cable 音频线常见的简称英文简称:__ACF英文全称:__Anisotropic Conductive Film中文全称:__各向异性导电薄膜英文简称:__CCD英文全称:__Charge Coupled Device中文全称:__电荷耦合装置英文简称:__CCL英文全称:__Copper Clad Laminate中文全称:__覆铜板英文简称:__CMOS英文全称:__Complementary Metal Oxide Semiconductor 中文全称:__互补氧化金属半导体常见的简称英文简称:__COB英文全称:__Chip On Board中文全称:__通过邦定将IC裸片固定于印刷线路板上英文简称:__COG英文全称:__Chip On Glass中文全称:__将芯片固定于玻璃上英文简称:__COF英文全称:__Chip On FPC中文全称:__将IC固定于柔性线路板上英文简称:__CPU英文全称:__Center Processor Unit中文全称:__中央处理器常见的简称英文简称:__DOC英文全称:__Disk on Chip中文全称:__芯片磁盘英文简称:__EL英文全称:__Electro Luminescence中文全称:__电致发光英文简称:__EPROM英文全称:__Erasable Programmable Read-Only Memory 中文全称:__紫外擦除只读存储器英文简称:__FPC英文全称:__Flexible Printed Circuit中文全称:__柔性线路板常见的简称英文简称:__GAL英文全称:__Generic Array Logic中文全称:__通用阵列逻辑英文简称:__IC英文全称:__Integrate Circuit中文全称:__集成电路英文简称:__LCD英文全称:__Liquid Crystal Display中文全称:__液晶显示器英文简称:__LCM英文全称:__Liquid Crystal Module中文全称:__液晶模块常见的简称英文简称:__LED英文全称:__Light Emitting Diode中文全称:__发光二极管英文简称:__PAL英文全称:__Programmable Array Logic中文全称:__可编程阵列逻辑英文简称:__PCB英文全称:__Printed Circuit Board中文全称:__印刷线路板英文简称:__PDP英文全称:__Plasma Display Panel中文全称:__等离子显示屏常见的简称英文简称:__PLD英文全称:__Programable Logic Device中文全称:__可编程逻辑器件英文简称:__PLED英文全称:__Polymer Light-Emitting Diode中文全称:__高分子发光二极管英文简称:__QA英文全称:__QUALITY ASSURANCE中文全称:__品质保证英文简称:__QC英文全称:__QUALITY CONTROL中文全称:__品质控制常见的简称英文简称:__RAM英文全称:__Random Access Memory中文全称:__随机存取存储器英文简称:__ROM英文全称:__Read Only Memory中文全称:__只读存储器英文简称:__SGS英文全称:__Societe Generale de Surveillance S.A.中文全称:__通用公证行英文简称:__SMD英文全称:__Surface Mount Device中文全称:__表面贴片元器件常见的简称英文简称:__SMT英文全称:__Surface Mount Technology中文全称:__表面贴片技术英文简称:__TAB英文全称:__Tape Aotomated Bonding中文全称:__各向异性导电胶连接方式英文简称:__TCP英文全称:__Tape Carrier Package中文全称:__柔性线路板英文简称:__TTL英文全称:__Transister-Transister-Logic中文全称:__晶体管-晶体管逻辑电路矩阵图的类型矩阵图法在应用上的一个重要特征，就是把应该分析的对象表示在适当的矩阵图上。

液晶显示行业LCD专业术语中英文

LCD专业术语中英文版Backlight:背光。

CCFL(CCFT) (Cold Cathode Fluorescent Light/Tube):冷阴极荧光灯。

Composite vide复合视频。

Component vide分量视频。

COB(Chip On Board):IC裸片通过邦定固定于印刷线路板上。

COF(Chip On Film):将IC封装于柔性线路板上。

COG(Chip On Glass):将IC封装于玻璃上。

CRT(Cathode Radial Tube):阴极射线管。

DPI(Dot Per Inch):点每英寸。

Duty:占空比，高出点亮的阀值电压的部分在一个周期中所占的比率。

DVI(Digital Visual Interface):（VGA）数字接口。

ECB(Electrically Controlled Birefringence):电控双折射。

EL(Electro luminescence):电致发光。

EL层由高分子量薄片构成FSTN(Formulated STN):薄膜补偿型STN,用于黑白显示。

HTN(High Twisted Nematic):高扭曲向列的显示类型。

IC(Integrate Circuit):集成电路。

Inverter:逆变器。

ITO(Indium-Tin Oxide):氧化铟锡。

LCD(Liquid Crystal Display):液晶显示器。

LCM(Liquid Crystal Module): 液晶模块。

LED(Light Emitting Diode):发光二极管。

LVDS(Low Voltage Differential Signaling):低压差分信号。

NTSC(National Television Systems Committee):NTSC制式,全国电视系统委员会制式OSD(On Screen Display):在屏上显示。

TFTLCD行业英语解析、专业术语解析

英文專闻名詞介紹1. General (一般專闻名詞)英文專闻名詞LCD (Liquid Crystal Display)Glass, substrate or glass substrateTFT(Thin Film Transistor)PanelArrayCellModuleMonitorPixelXGA: eXtended Graphics Array=1024*768Pixels SXGA: Super XGA=1280*1024Pixels ComputerNotebookRGB (Red, Green, Blue)PM (Preventive Maintenance)QualityStandardMaterialYieldCIM (Computer Integration Manufacturing)FA (Factory Automation)ExitPrecautionWarningEmergencyAlarm2. Clean Room (潔淨室專闻名詞)英文專闻名詞Clean roomParticleHEPA (High Efficient Particulate Air) filter ContaminationTemperature (TEMP)Humidity 中文明（數字表示有詳註）液晶顯示器 * 註.玻璃基版 *註.薄膜電晶體 * 註.面板摆列 ,指在玻璃基板上做TFT的製程LCD-ArrayLCD-FEOL（ Cell 前段）LCD-BEOL（Cell 後段含 Cell Tester）模組 ,指後段組裝製程LCM監視器像素 *註.PS. 像素越多表示分析度越高電腦筆記型電腦（簡稱為NB）指紅綠藍三原色預防保養品質標準 (指作業標準或品質指標)资料良率電腦整合製造（指以電腦系統整合製造流程）工廠自動化出口預防举措警示緊急警報中文明潔淨室 *** 註 .微粒子 *** 註 .高效能粒子空氣過濾網染溫度濕度Pressure壓力UPW (Ultra-Pure Water)超純水DIW (De-Ionized Water)去離子水IPA (Isopropyl Alcohol)異丙醇Sticky mat腳踏黏墊 ***註. Cleanliness潔淨度ESD (Electro-static Discharge)靜電破壞 ***註.Laminar flow層流（流體力學名詞）Turbulent flow擾流（流體力學名詞）Alcohol酒精Acetone丙酮Particle微粒子Dust灰塵Gowning room換衣間 *** 註 .Raised floor (grating floor)高架地板 ***註.Air shower氣浴室 ***註 .Prohibit严禁Clean suit (bunny suit, dust-free garment)無塵衣 ***註 .Glove手套Hairnet網帽Hood頭罩Mask口罩Clean shoes (dust-free shoes, boots)無塵鞋3. Factory Automation (工廠自動化專闻名詞)英文專闻名詞中文說明Vehicle運輸工具或載具AGV (Automatic Guided Vehicle)自動搬運車MGV (Manual Guided Vehicle)人力搬運車Clean lifter天井傳送車LIM (Linear Induction Motor) Carrier線性感應馬達傳送載具OHS (Overhead Shuttle)天車或稱軌道車Stocker (clean depot)寄存 Cassette(架子 )的暫存區Battery電池Bay作業區Bumper保險槓Charger充電器Controller控制器Conveyor輸送帶Crane吊車（在 Stocker 內）FFU (Fan Filter Unit)風扇過濾器Host主機I/O (Input / Output)輸入 /輸出Inter-bay作業區和作業區之間Intra-bay作業區之內IR (Infra-Red)紅外線IRIF(Infra-Red InterFace)紅外線介面Load進料Unload卸貨Magnetic tape AGV 路徑所使用的磁條POSEIDON海神生產作業系統Retrieve【電腦】檢索 ,擷取 (資料 )RTM (Rotary Transfer Machine)旋轉傳送機SCARA arm AGV 之傳送手臂Reset从头設定Transportation傳輸* 註 .OPI(Operation POSEIDON Instruction)海神生產作業系統專闻名詞介紹英文專闻名詞中文說明Recipe程式 ,製程參數Stock out將 Cassette 拿出Request請求 ,要求Transfer傳送 ,運送Instruction命令 ,指令Select選擇Cancel撤消Operation作業 ,操作Support增援Process製程Start開始pletion 的縮寫 ,意指达成Batch批量Lot指生產線上的在製品或產品,簡稱「貨」ID (Identity)識別碼 (如 Lot ID or Chip ID)Sheet片(Array 區玻璃基版計數單位 )*** 註 . Chip片(Cell 區玻璃計數單位 )***註 . Inspection檢驗Defect缺点Production生產Hold留置在當站製程（若有品質問題時）Release將 hold 住的貨放行 ,釋出Equipment設備（簡稱為 EQP）Tool工具 ,機台WIP (Work In Process)在製品（製程在製品）Maintenance Cassette Empty Reserve Report Scrap ReworkLog onLog off 維修保養裝在製品的架子空的預約報告報廢重工登帳除帳註解*** 註.6.Cell 段製程專闻名詞介紹英文專闻名詞中文說明Material资料PI (polyimide)聚亞醯胺CF (Color Filter)彩色濾光片Detergent洗劑γ- Butyrolactoneγ-丁內酯 , 簡稱γ液, 用於消除 APR版上的 PIRubbing cloth 配向布 , 為棉類材質 , 用於 rubbing 機台 , 使基板產生配向 , 使用前須先挑除雜質 , 稱為挑布Seal 框膠 , 功能在於圍住液晶不外漏及防止水氣進入,使用前須先調配 , 稱為調膠Spacer 或 MP(Micro Pearl)間隙球 , 功能在於維持 CF 與 TFT 兩塊玻璃間之間隙距離PS (Photo Spacer)功能與一般的 Spacer 同样 , 一般用於大尺寸產品 ,且可获得較好的 cell gapTransfer 或 Conductive Paste 或 Ag paste銀膠或稱導電膠UV sealant UV 膠 , 用於兩塊玻璃基板組合時假固定用Polyfron 均壓紙 , 基板壓合時使用 , 用於分开基板 , 可使壓力均勻散布以及減少雜質所造成的損害LC (Liquid Crystal)液晶Polarizer偏光膜Equipment設備CDA (Compressed Dry Air)壓縮高壓乾燥空氣DIW, DI water去離子水 , 純水Control box電源控制箱Valve閥門 , 控制閥Breaker電源開關 , 繼電器Chamber槽Clean booth潔淨工作台Process製程FEOL (Front End of Line)BEOL (Back End of Line)Scribe (1st scribe, 2nd scribe)Break (1st break, 2nd break)GrindPI Print , PI coaterPI PrebakePI Post-bakeRubbingSeal Pattern, Seal dispenseSpacer SprayerJig PressAlignmentCureSeal Pre-bakeVacuum AnnealInjectionEnd SealPolarizer Lamination7.平时使用的英文名詞英文專闻名詞Organization:ProcessManufacturing Department ManagerSection ManagerSupervisorLine LeaderOperatorSick LeaveAccident LeaveTake a Day offAWOL(absence without official leave) Performance Evaluation：PoorFairGoodExcellentOutstandingImproveQuality Control ：cell 前段cell 後段切割 (有一次切割及二次切割)裂片 (有一次裂片及二次裂片)研磨PI 印刷PI 預烤PI 後烤配向框膠塗布Spacer 散佈Jig 壓合對位, 對準鍵結硬化Seal 預烤真空回火注射 (LC-Injection:注入液晶 )封口膠偏光片貼合中文說明組織方面：製程製造部經理協理（企业中稱為主任）管理者（企业中稱為Coordinator ）組長（企业中稱為Keyman）作業員病假事假歇息一天曠工（沒有請假）績效查核：表現差的一般表現好的優秀优秀有待改進品管：IQC=Incoming Quality Control IPQC=In-Process Quality Control OQC=Outgoing Quality Control 進料品管製程中品質管束出料品管M.R.B.=Material Review BoardWaiveC.A.R.=Correct Action Report 特採改良举措報告F.M.A.=Failure Mode AnalysisMO=Misoperation操作錯誤（人為失誤）通用术语Array Line 进行 Thin Film, Photo, Etch 工艺的生产 Line 是 Array Line，主要制造 Glass上边 TFT (Thin Film Transistor) 构造。

LCD专业术语19页word

目前最全的LCD专业术语(中英文资料)<超全面+超长>Backlight:背光。

CCFL(CCFT) (Cold Cathode Fluorescent Light/Tube):冷阴极荧光灯。

Composite vide复合视频。

Component vide分量视频。

COB(Chip On Board):IC裸片通过邦定固定于印刷线路板上。

COF(Chip On Film):将IC封装于柔性线路板上。

COG(Chip On Glass):将IC封装于玻璃上。

CRT(Cathode Radial Tube):阴极射线管。

DPI(Dot Per Inch):点每英寸。

Duty:占空比，高出点亮的阀值电压的部分在一个周期中所占的比率。

DVI(Digital Visual Interface):（VGA）数字接口ECB(Electrically Controlled Birefringence):电控双折射。

EL(Electro luminescence):电致发光。

EL层由高分子量薄片构成FSTN(Formulated STN):薄膜补偿型STN,用于黑白显示。

HTN(High Twisted Nematic):高扭曲向列的显示类型。

IC(Integrate Circuit):集成电路。

Inverter:逆变器。

ITO(Indium-Tin Oxide):氧化铟锡。

LCD(Liquid Crystal Display):液晶显示器。

LCM(Liquid Crystal Module): 液晶模块。

LED(Light Emitting Diode):发光二极管。

LVDS(Low Voltage Differential Signaling):低压差分信号。

NTSC(National Television Systems Committee):NTSC制式,全国电视系统委员会制式OSD(On Screen Display):在屏上显示。

TFT-LCD工程中英对照表

沉积
显影
干刻
干刻
清除边缘光刻胶
边缘曝光，指在显影前将玻璃基板边缘光阻较厚的部分再曝光，以防曝光量不足，造成光阻在显影后残留
简称ER，指在旋转涂布光阻后，用NBA洗净残留在玻璃边缘的光阻
曝光
Technology Management Dept. BOE OT Copyright ⓒ 2008
8
工程名词
Technology Management Dept. BOE OT Copyright ⓒ 2008
3
材料名词
用语
Glass, substrate or glass substrate Glove H2 Hairnet HCl He Hood ILB (Inner Lead Bonding) IPA ( Isopropyl Alcohol) IR (Infra-Red) ITO (Indium Tin Oxide) ITO-Etchant Kr L.G.P: Light Guide Plate LAL-50 Lamp Reflector LED Cover LC (Liquid Crystal) LED: Light Emitting Diode Mask
Company Confidential
用语说明
玻璃基版手套氢气，制程气体网帽氯化氢，制程气体，蚀刻n+时的电浆源之一氦气，制程气体，混合在其它制程气体中，共同形成电浆源，使电浆组成分布均匀头罩内引线焊接异丙醇：主要用来作为设备擦拭液，在去光阻制程中亦用来清除玻璃基板上的有机残留物（如光阻或去光阻液）红外线铟锡氧化物 ITO刻蚀液：成份中含盐酸HCl及硝酸HNO3，主要用来蚀刻7PEP中的Poly-ITO 氪气……制程气体，用来轰击溅镀机上的金属靶导光板:将从光源收到的水平光线进行方向改变，转换成向上端出射含NH4F与HF，为清洗机用来清洗玻璃表面氧化层的化学溶液灯反射罩：将从光源发出的光集中导向到导光板的入射面液晶，既具有液体的流动性，又具有晶体的各向异性，液晶显示元件的主要原材料之一

LCD液晶屏幕行业英语专用词

英文专有名词介绍1. General (一般专有名词)英文专有名词中文说明（数字表示有详注）LCD (Liquid Crystal Display) 液晶显示器*注.Glass, substrate or glass substrate 玻璃基版*注.TFT(Thin Film Transistor) 薄膜晶体管*注.Panel 面板Array 排列,指在玻璃基板上做TFT的制程LCD-ArrayCell 液晶填充制程…….分为LCD-FEOL（Cell前段）LCD-BEOL（Cell后段含Cell Tester）Module 模块,指后段组装制程LCMMonitor 监视器PixelXGA: eXtended Graphics Array=1024*768Pixels SXGA: Super XGA=1280*1024Pixels 像素*注.PS. 像素越多表示分辨率越高Computer 计算机Notebook 笔记型计算机（简称为NB）RGB (Red, Green, Blue) 指红绿蓝三原色PM (Preventive Maintenance) 预防保养Quality 品质Standard 标准(指作业标准或品质指针)Material 材料Yield 良率CIM (Computer Integration Manufacturing) 计算机整合制造（指以计算机系统整合制造流程）FA (Factory Automation) 工厂自动化Exit 出口Precaution 预防措施Warning 警告Emergency 紧急Alarm 警报2. Clean Room (洁净室专有名词)英文专有名词中文说明Clean room 洁净室***注.Particle 微粒子***注.HEPA (High Efficient Particulate Air) filter 高效能粒子空气过滤网Contamination 污染Temperature (TEMP) 温度Humidity 湿度Pressure 压力UPW (Ultra-Pure Water) 超纯水DIW (De-Ionized Water) 去离子水IPA (Isopropyl Alcohol) 异丙醇Sticky mat 脚踏黏垫***注.Cleanliness 洁净度ESD (Electro-static Discharge) 静电破坏***注.Laminar flow 层流（流体力学名词）Turbulent flow 扰流（流体力学名词）Alcohol 酒精Acetone 丙酮Particle 微粒子Dust 灰尘Gowning room 换衣间***注.Raised floor (grating floor) 高架地板***注.Air shower 气浴室***注.Prohibit 禁止Clean suit (bunny suit, dust-free garment) 无尘衣***注.Glove 手套Hairnet 网帽Hood 头罩Mask 口罩Clean shoes (dust-free shoes, boots) 无尘鞋3. Factory Automation (工厂自动化专有名词)英文专有名词中文说明Vehicle 运输工具或载具AGV (Automatic Guided Vehicle) 自动搬运车MGV (Manual Guided Vehicle) 人力搬运车Clean lifter 天井传送车LIM (Linear Induction Motor) Carrier 线性感应马达传送载具OHS (Overhead Shuttle) 天车或称轨道车Stocker (clean depot) 存放Cassette(架子)的暂存区Battery 电池Bay 作业区Bumper 保险杠Charger 充电器Controller 控制器Conveyor 输送带Crane 吊车（在Stocker内）FFU (Fan Filter Unit) 风扇过滤器Host 主机I/O (Input / Output) 输入/输出Inter-bay 作业区和作业区之间Intra-bay 作业区之内IR (Infra-Red) 红外线IRIF(Infra-Red InterFace) 红外线界面Load 进料Unload 卸货Magnetic tape AGV路径所使用的磁条POSEIDON 海神生产操作系统Retrieve 【计算机】检索,撷取(数据)RTM (Rotary Transfer Machine) 旋转传送机SCARA arm AGV之传送手臂Reset 重新设定Transportation 传输*注.OPI(Operation POSEIDON Instruction)海神生产操作系统专有名词介绍英文专有名词中文说明Recipe 程序,制程参数Stock out 将Cassette取出Request 请求,要求Transfer 传送,运送Instruction 命令,指令Select 选择Cancel 取消Operation 作业,操作Support 支援Process 制程Start 开始Comp. Completion的缩写,意指完成Batch 批量Lot 指生产在线的在制品或产品,简称「货」ID (Identity) 识别码(如Lot ID or Chip ID)Sheet 片(Array区玻璃基版计数单位)***注. Chip 片(Cell区玻璃计数单位)***注. Inspection 检验Defect 缺陷Production 生产Hold 留置在当站制程（如有品质问题时）Release 将hold住的货放行,释出Equipment 设备（简称为EQP）Tool 工具,机台WIP (Work In Process) 在制品（制程在制品）Maintenance 维修保养Cassette 装在制品的架子***注.Empty 空的Reserve 预约Report 报告Scrap 报废Rework 重工Log on 登帐Log off 除帐Note 批注5. Array段制程专有名词介绍英文专有名词中文说明Material 材料Metal 金属Target 靶MoW (Moly-tungsten) 钨化钼Mo (Molybdenum) 钼ITO (Indium Tin Oxide) 铟锡氧化物Al (Aluminum) 铝AlNd(Aluminum and Neodymium Alloy) 铝和钕的合金以上皆为溅镀机金属靶的材料之一Reticle or Mask 光罩Detergent (LH-300) 界面活性剂的一种（清洗机用来清洗玻璃表面用LH-300为供货商型号）LAL-50 含NH4F与HF，为清洗机用来清洗玻璃表面氧化层的化学溶液O3（Ozone）臭氧，主要为各制程用来清除有机物的污染或残留NBA (1-butyl Acetate) 乙酸正丁酯，主要用来清洗旋转涂布光阻时残留在玻璃边缘的光阻液Resist or Photo Resist 光阻（简称PR）HMDS Hexamethyldisilazane的简写，为一种化学中间体，用以增加光阻涂布时对芯片表面之附着力AC-1 带静电防止剂（ESD-Preventer），在上光阻机内使用，防止静电产生，破坏玻璃组件TMAH (供货商型号为KTM-25) Tetra-Methyl Ammonium Hydroxide的简写，为厂内所使用之显影液Oxalic Acid (H2C2O4) 草酸，湿蚀刻机中用来蚀刻5PEP中的a-ITO膜DHF 成份为49%氢氟酸HF，主要为湿蚀刻机中用来蚀刻7PEP中的SiNx膜ITO-Etchant 成份中含盐酸HCl及硝酸HNO3，主要用来蚀刻7PEP中的Poly-ITOBHF 成份中含氟化铵NH4F及HF，主要用来蚀刻7PEP中的SiONAl-Etchant 成份中含乙酸CH3COOH、磷酸H3PO4及硝酸HNO3，主要用来蚀刻Mo/Al/Mo的沈积层IPA 异丙醇Isopropyl Alcohol的简称，主要用来作为设备擦拭液，在去光阻制程中亦用来清除玻璃基板上的有机残留物（如光阻或去光阻液）N-300 去光阻液，N-300为厂商型号，成份为单乙醇铵与单丁醚的混合物(Process) Gas (制程)气体…目前大多数种类的气体，多为提供CVD，Sputter及干蚀刻电浆源之用SiH4硅甲烷……制程气体（泄漏有爆炸危险）NH3氨……制程气体N2O 笑气……制程气体PH3磷化氢……制程气体N2氮气……制程气体，常用为破真空Vent或吹干的媒介H2氢气……制程气体NF3氟化氮……制程气体，常用为清除CVD反应室壁沈积硅Si媒介Kr 氪气……制程气体，用来轰击溅镀机上的金属靶Ar 氩气……制程气体，用来轰击溅镀机上的金属靶或常用为加热设备的热传媒介O2常用来作电浆的基本组成，BCl3氯化硼……制程气体，在干蚀刻中用以作为蚀刻AlNd的电浆源SF6氟化硫……制程气体，常用的主要干蚀刻电浆源以为提供蚀刻主原料氟的来源He 氦气……制程气体，混合在其它制程气体中，共同形成电浆源，使电浆组成分布均匀Cl2氯气……制程气体HCl 氯化氢……制程气体，蚀刻n+时的电浆源之一CF4四氟化碳……制程气体，常用的主要干蚀刻电浆源以为提供蚀刻主原料氟的来源Equipment 机台(仪器)Vender 厂商Cleaner 清洗机***注.CVD (Chemical Vapor Deposition) 化学气相沉积***注. Sputter 溅镀机***注. Coater 上光阻机***注.Pre-bake 预烘***注.Stepper 步进式曝光机***注. Exposure 曝光Backside-Exposure 背面曝光Titler 刻号机，厂内部分的显影机具有此功能，将玻璃基板的Chip ID, Glass ID及Veri-Code曝出，以为人员及机台办认之用Edge Remover 简称ER，指在旋转涂布光阻后，用NBA洗净残留在玻璃边缘的光阻Edge Exposure 边缘曝光，指在显影前将玻璃基板边缘光阻较厚的部分再曝光，以防曝光量不足，造成光阻在显影后残留Developer 显影机***注.Hard bake 硬烤***注.Etcher 蚀刻机Wet Etch 湿蚀刻***注.Dry Etch 干蚀刻***注.Plasma 电浆***注.RIE (Reactive ion etching) 反应性离子蚀刻***注. PE (Plasma Etch) 电浆蚀刻机***注ICP (Inductive Coupled Plasma) 电感偶式电浆蚀刻机***注Stripper 去光阻机***注O3 Asher 为去光阻机的模块之一，用来去除制程的有机残留**注Tester 测试机Anneal 回火***注.AMSR (Sheet Resistance) 沈积膜的电阻值测试设备ATOS (Open/Short Tester) 断短路测试机ATTG (TEG Tester or TFT DeviceMeasurement)TFT的电性测试设备ATAR (Array Tester) Array Defect的测试设备ALSR (Laser Repair) 雷射修补机ANNI (Anneal Oven) 回火设备AMGI (Particle Counter) 微粒子侦测，侦测玻璃表面微粒子数目及大小分布AMOR; AMKL (Pattern Inspection) 图案或线路检验设备; 主要在检视沈积膜后、曝光后、蚀刻后及去光阻后表面的线路图案检查(前者简称Orbo, 后者简称KLA)AMSP (Surface Profiler) 表面轮廓检查机，测量线路图案的高低分布状况，亦可藉此求得蚀刻速率(简称KLA-Tencor)AMOV (CD/Overlay) 量测设备用以测量关键线宽CD, 及藉量测Box重迭状况来检视Stepper的精度**注AMSH (Microscope) 高倍显微镜，主要在检视曝光后、蚀刻后及去光阻后表面的线路图案检查(简称Olympus)AMEL; AMOT (Film Thickness) 膜厚量测仪(前者简称Sopra, 后者简称Nano)AMVI (Visual Inspection) 目视检查机，Array段制程的最后出货前检查CJ 指高压水洗MS 指超音波水洗Conveyor 传送Spin 旋转（如Spin Dryer：高速旋干器）Chamber 反应室（如CVD, Sputter或干蚀刻）Load Lock简称LL 闭锁，为大气进入真空或真空进入大气的媒介Heat 加热Cool 冷却Probe （测试机的）探针Process 制程Spec 制程的品质标准Pin-Hole 针点小凹陷PEP (photo engraving process) 完成一次黄光制程叫做一个PEPMI 第一次沈积的（阐极）金属膜如MoWMII 第二次沈积的（源极和汲极）金属膜如MoAlMo a-Si (amorphous silicon) 非结晶硅，TFT沈积层之一n+ (或n+a-Si) 掺杂磷的非结晶硅，TFT沈积层之一SiON (应写为SiOxNy 因O,N的比例不一定)氮氧化硅，TFT沈积层之一SiNx (x为Si与N的比例) 氮化硅，TFT沈积层之一Cleaning 清洗（Cleaner的动作称为Cleaning）Brush 清洗机所使用之软刷DI; DI water; Deionized Water 去离子水UPW 超纯水Vent 破真空，真空环境下的玻璃送至LoadLock闭锁时，通入氮气平衡压力，以防止剧烈的气压变化造成破片Purge 用CF或NF系列的气体通入CVD清除器壁累积的硅Rinse 水洗Veri-Code 光学办认码**注Vacuum 真空Deposition 沉积Wet etching 湿蚀刻Dry etching 干蚀刻Plasma 电浆RIE (Reactive Ion Etching) 反应式离子蚀刻机**注ICP (Inductive Coupled Plasma) 电感偶式电浆蚀刻机**注PE (Plasma Etch) 电浆蚀刻机**注Uniformity 均匀性(类似(大-小)/平均值的概念)Etching Rate 蚀刻速率(=蚀刻厚度/时间)Anneal 回火Laser repair 雷射修补Inspection 检视Pre-bake 预烤Coating 上光阻Exposure 曝光Develop 显影Alignment 对准CD (critical dimension) 关键尺寸（线路关键处的线宽或间距）Overlay 重迭Cure 烘烤Bake 烘烤6.Cell段制程专有名词介绍英文专有名词中文说明Material 材料PI (polyimide) 聚亚醯胺CF (Color Filter) 彩色滤光片Detergent 洗剂γ- Butyrolactoneγ-丁内酯, 简称γ液, 用于清除APR版上的PIRubbing cloth 配向布, 为棉类材质, 用于rubbing机台, 使基板产生配向, 使用前须先挑除杂质, 称为挑布Seal 框胶, 功能在于围住液晶不外漏及避免水气进入, 使用前须先调配, 称为调胶Spacer 或MP(Micro Pearl) 间隙球, 功能在于维持CF与TFT两块玻璃间之间隙距离PS (Photo Spacer) 功能与普通的Spacer相同, 一般用于大尺寸产品, 且可得到较好的cell gapTransfer 或Conductive Paste 或Ag paste 银胶或称导电胶UV sealant UV 胶, 用于两块玻璃基板组合时假固定用Polyfron 均压纸, 基板压合时使用, 用于分隔基板, 可使压力均匀分布以及减少杂质所造成的损害LC (Liquid Crystal) 液晶Polarizer 偏光膜Equipment 设备CDA (Compressed Dry Air) 压缩高压干燥空气DIW, DI water 去离子水, 纯水Control box 电源控制箱Valve 阀门, 控制阀Breaker 电源开关, 继电器Chamber 槽Clean booth 洁净工作台Process 制程FEOL (Front End of Line) cell 前段BEOL (Back End of Line) cell 后段Scribe (1st scribe, 2nd scribe) 切割(有一次切割及二次切割) Break (1st break, 2nd break) 裂片(有一次裂片及二次裂片) Grind 研磨PI Print , PI coater PI 印刷PI Prebake PI 预烤PI Post-bake PI 后烤Rubbing 配向Seal Pattern, Seal dispense 框胶涂布Spacer Sprayer Spacer 散布Jig Press Jig 压合Alignment 对位, 对准Cure 键结硬化Seal Pre-bake Seal 预烤Vacuum Anneal 真空回火Injection 注射(LC-Injection:注入液晶) End Seal 封口胶Polarizer Lamination 偏光片贴合7.Module(模块)段制程专有名词英文专有名词中文说明Cell cell 完成后的在制品(货) Backlight 背光板Bezel 外框Driver IC 驱动集成电路Soldering 焊接Assembly 组装Aging 老化Packing 包装Chip 芯片Tape 胶带Screw 螺丝FPC (Flexible Printed Cable) 可挠性印刷线路PCB (Printed Circuit Board) 印刷电路板TAB (Tape Automated Bonding) 卷带式晶粒接合OLB (Outer Lead Bonding) 外引脚接合ILB (Inner Lead Bonding) 内引脚接合COG (Chip on Glass) 芯片接合在玻璃ACF (Anisotropic Conductive Film) 异方性导电膜7. 日常使用的英文名词英文专有名词中文说明Organization:ProcessManufacturing Department ManagerSection Manager SupervisorLine LeaderOperator 组织方面：制程制造部经理协理（公司中称为主任）管理者（公司中称为Coordinator）组长（公司中称为Keyman）作业员Sick Leave 病假Accident Leave 事假Take a Day off 休息一天AWOL(absence without official leave) 旷工（没有请假）Performance Evaluation：PoorFairGoodExcellentOutstandingImprove 绩效考核：表现差的普通表现好的优秀卓越有待改进Quality Control：品管：IQC=Incoming Quality Control IPQC=In-Process Quality Control OQC=Outgoing Quality Control M.R.B.=Material Review Board WaiveC.A.R.=Correct Action Report F.M.A.=Failure Mode Analysis MO=Misoperation 进料品管制程中质量管理出料品管特采改善措施报告操作错误（人为失误）。

液晶显示技术常用名词术语表

液晶显示技术常用名词术语表
液晶显示技术常用名词术语表
英语缩写（英语）汉语
COB（Chip On Board）将IC裸片固定于印刷线路板上
COF（Chip On FPC）将芯片固定于TCP上
COG（Chip On Glass）将芯片固定于玻璃板上
EI (Electro Luminescence) 电致发光，EL层由高分子量薄片构成，用作LCD的EL光源
FTN（Formutated STN）一层光程补偿片加于STN，用于黑白显示
PCB(Print Circuit Board) 印刷线路板
QFP(Quad Flat Package)四方扁平封装
QTP(Quad Tape Carrier Package)四向型TCP
SMT(Surface Mount Technology)表面贴装技术
TCP（Tape Carrier Package）柔性线路板，IC可固定于其上
STN（Super Twisted Nematic）带有约180度到270度曲向列的显示类型
tf（Fall Time）响应速度：下降沿时间
TN(Twisted Nematic)带有约90度扭曲的显示类型
TNR(Tn With Retardation Film)一种彩色显示，它不采用彩色滤光片，而是在普TN玻璃上附加光程补偿片
tr（Rise Time）响应速度：上升沿时间
Vop（Operating Voltage） LCD驱动电压
Vth （Threshold Voltage）阀值电压。

LCD术语中英文

生产工艺
背景色Leabharlann 可靠性涂胶曝光显影蚀刻脱膜 PI印刷磨纹银点丝印边框印刷喷粉贴合热压固化切割打条(打粒）灌液晶封口目检电测贴片加压网印装拼邦定包装入仓出货钻孔磨角磨边背景色黄绿色灰色灰白色蓝色黑色寿命可靠性高温高湿贮存高温贮存低温贮存冷热冲击静电放电面底欧姆等离子显示
PR coating Exposure Developing Etching Striping PI Printing Rubbing Silvery Printing Segnet frame Spacer Aligning (Couple) Hot-pressSolidify Scribing Breaking LC Filling End-Seal Viewing inspection Electronic-Test Pasting Pressure Printing Pin Attaching Bonding Packing Warehouse Shipment Drilling Cutting Corner Edge-grinding Background Color Yellow-Green Y-G Grey White-Grey Blue Black Life time Reliability Storge at high temperature and humidity Storge at high temperature Storge at low temperature Thermal shock Electro-Static Discharge ESD Front Back Surface Mount Technology SMT Ohm Plasma Display Panel PDP

LCD术语

LCD术语术语：英文意义，中文解释LCD：Liquid Crystal Display，液晶显示LCM：Liquid Crystal Module，液晶模块TN：Twisted Nematic，扭曲向列。

液晶分子的扭曲取向偏转90°STN：Super Twisted Nematic，超级扭曲向列。

约180~270°扭曲向列FSTN：Formulated Super Twisted Nematic，格式化超级扭曲向列。

一层光程补偿片加于STN，用于单色显示TFT：Thin Film Transistor，薄膜晶体管Backlight：背光Inverter：逆变器OSD：On Screen Display，在屏上显示DVI：Digital Visual Interface，（VGA）数字接口TMDS：Transition Minimized Differential SignalingLVDS：Low Voltage Differential Signaling，低压差分信号Panelink：－IC：Integrate Circuit，集成电路TCP：Tape Carrier Package，柔性线路板COB：Chip On Board，通过邦定将IC裸片固定于印刷线路板上COF：Chip On FPC，将IC固定于柔性线路板COG：Chip On Glass，将芯片固定于玻璃上Duty：占空比，高出点亮的阀值电压的部分在一个周期中所占的比率LED：Light Emitting Diode，发光二极管EL：Electro Luminescence，电致发光。

EL层由高分子量薄片构成CCFL(CCFT)：Cold Cathode Fluorescent Light/Tube，冷阴极荧光灯PDP：Plasma Display Panel，等离子显示屏CRT：Cathode Radial Tube，阴极射线管VGA：Video Graphic Array，视频图形阵列PCB：Printed Circuit Board，印刷电路板Composite video：复合视频Component video：分量视频S-video：S端子，与复合视频信号比，将对比和颜色分离传输NTSC：National Television Systems Committee，NTSC制式、全国电视系统委员会制式PAL：Phase Alternating Line，PAL制式(逐行倒相制式)SECAM：SEquential Couleur Avec Memoire，SECAM制式(顺序与存储彩色电视系统) VOD：Video On Demand，视频DPI：Dot Per Inch，点每英寸。