华晶 3DG3020A1

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陕西省省级单位2018年办公设备批量采购产品配置及价格

5880.00
笔
记
本
电
脑
B1
宏碁TravelMate P249-7142
14.0英寸WLED背光防眩光超薄型液晶显示屏，1920x1080像素显示分辨率；重量：整机2.0KG（含电池）；CPU：英特尔(R)酷睿™第八代4核I5-8250U主频：1.6GHz缓存：6MB；内存：4GB DDR4 2400MHz笔记本内存；显卡：英特尔超高清显卡620；硬盘：1T机械硬盘；接口：3个USB接口（2个USB 3.0支持关机充电）、1个HDMI接口、VGA接口、耳机输出/麦克输入combo接口、RJ45、读卡器；触摸板：支持手势操作.多点触控；集成10/100/1000M高速以太网卡，标配802.11ac/a/b/g/n无线网卡，蓝牙4.1；摄像头：720P高清网络摄像头；电池：四芯锂离子电池，电池容量41.4WH标准续航时间7小时；指纹识别：智能指纹识别锁，支持指纹按压解锁；附件：除标配外，随笔记本电脑配送原厂手提包和无线鼠标；保修：3年保修（包括电池）；操作系统：Windows 10政府版
4780.00
B2
戴尔Latitude 3490
显示器：14寸，WLED背光；CPU：Intel I5,双核，2.4GHz主频；内存：4GB；显卡：HD620；硬盘：1TB，SATA；USB接口2个；定位设备：多点触控板；无线网卡、蓝牙：WIFI AC+BT 4.1；内置720P高清摄像头；电池：42WH；含指纹识别；笔记本包+无线鼠标三年质保
5880.00
一体机
A7
联想启天A710-D002
联想启天A710-D002/19.5英寸LED宽屏显示器1600*900/处理器:Intel第八代Core I3-8100处理器四核3.6G/内存4GB/集成显卡标配64bit/端口：1个HDMI，后置标配/硬盘容量1TB 7200RPM/外部端口1*USB3.1 Gen1(支持快速充电）前置标配，1*USB3.1 Gen2前置标配，3*USB3.1 Gen2后置标配，1*USB3.1 Gen1后置标配/光驱SATA Slim Rambo/无线网卡+蓝牙4.0/立体声音箱2W*2/内置720P摄像头/鼠标+标准键盘/原厂主机5年有限保修服务，显示器5年保修服务/预装Windows正版操作系统

部分电视机CPU型号及简单代换

部分电视机CPU型号及简单代换部分电视机CPU型号及简单代换8879CPBNG6V38 海信CPU8873CPBNG6U73 创维CPUTOSHIBA-HAY-22、8873CSCNG6PR6 通用CPUTDA9373PS/N2/AI1115 SVA CPU13-TB73-TM1V001、LC863332A-5T25、LC863332A-5S97 夏华CPU88CS38N-3P48、TMP88PS38 夏华K2918、K2926，解码TB1251TDA9381PS/N3/2/1741 索尼CPUTDA9381PS/N2/3I0837 LG CPUTDA9381PS/N2/3I0975 三星CPUTDA9373PS/N2/AI0939（Haier9373-V2.0）Haier9373-V1.0 海尔CPU V1.0的可以换空白存储器，按遥控器数字8、V+ 进总线LC863324B-54M2、LC863324A-5W21、LC863324C-55M5 海信CPUOM8370-A-3NC、NOM8370-A-1NC 海信、西湖、夏华、彩星CP-2156TCL-M18V3PNICAN、TCL-M11V1P 王牌CPUH13V02-T0、8829CSNG5CJ2、H13V01-T0 TCL CPUTDA9370PS/N2/AI1429（4706-D93705-64）3P36、4P36 创维CPU 4706-D83702-64CH05T1501 长虹CHD2590M37210M3-551SP日立25M8C CPUTDA9373PS/N2/AI0911（A01V01-PH）TDA9373PS/N2/AI0996 TCL 2990UHD0401、S3F880AXZZ 创维（3S30/5S30/5S31）MN152811TJS 松下CPU 85元LC863524C-55L7、53P4、52Y7、TH-50J2 杂牌CPULC863524C-55L6、55Y5、55K8 杂牌CPU87CK38N-3647（TMP87CK38N-3675、1C48）澳柯玛、松王M37221M6-309S 厦华R2920 CPUTDA9380PS/N1/IS0380（TCL-UOC-V01）王牌CPU，用TDA9383PS代替要把60脚接地13-T00S23-03M01、8879CSBNG6K02 乐华25G6BCH08T2602（8873CSANG6JH8）长虹CPUOM8373PS/N3/2/1870（4706-D83732-64）创维短管机专用CPULC863328A-51J8 嘉华CPU8803CPAN-3PE8（8823CPNG4JR6）换存储器、39脚，C205换1UF，ST6378B1/FKF 4S02-3008 创维数码3008TMP47C434N-3526 通用王牌TCL M14VBC 王牌CPUST6367BB1/BFX 不详LC863324A-5N09 海信CPULC864512V-5C77 海信CPUM34300N4-565SPKY88C94 夏华CPUM34300N4-555SP 日立CPULC863328A-5S15 高路华、海信CPUMC8902A-5Y83 熊猫、高路华CPUMC8904A-5Z25 熊猫、高路华、海信、西湖CPUM37210M3-807SP 康力CPUT-P-16 8823CPNG5RH6 熊猫CPU SAA5647HL/M1 飞利蒲CPUOM8373PS/N3/A/1914（OM8373PS/N3/A/1854）康佳短管CPUTMP47C634AN RC18 厦华CPUHAIER1132S、HAIER1532S 海尔21T8D-S、21F9G-Shisense 8803-1（8803CPBNG3VG6）8823CPNG3PE8 海信TC2111A 换存储器、39脚，C205换1UF，OM8370PS/N3/1（HZ10V01）（TOUL 12-02M00）TCL CPUHAIER8829-V2.0（8829CPNG4PG3）海尔CPUCH0504、CH0503 长虹CPUM34302M8-612SP SONY CPUCH04T1306 长虹CPUNOM8370-A-11B 西湖CPUTCL-T00Y12-02M01（LA76931）、TOOY12-01M01 TCL CPUCKP1302S1（8829CPNG6FP6）CKP1302S 康佳CPUP88P8432N、S3C8849X13-AQB7 嘉华CPU OM8373-B-3NC 海信TF2507FLC863328C-55N6、5T45 康佳CPUTDA9373PS/N2/AI0889、4706-D93731-64 5P30 创维CPULC863328B-53P5、LC863328C-56M9、LC863328B-52E4、50J1 SVA CPUR2J10160G8-A12FP、R2J1016008-A06FP 数源S21A07 等13-TOOS13-08M01、8873CSBNG6N15 TCL CPU8873CPANG6HV9 数源TJ21A23 CPU87CM38N-1K45、87CM38N-1U87 夏华XT-259ATAVC139 三洋CPULC863320A-5N94、LC863320A-5N17（3Y01）创维CPUCH05T1604（TDA9370PS/N2/AI0848）长虹超级芯片CH05T1607（TDA9370PS/N2/AI1092）TDA9370PS 长虹超级芯片CH05T1606（TDA9373PS/N2/AI1087）TDA9373PS 长虹超级芯片CH05T1630、OM8373PS/N3/A/1842（CH05T1621）长虹，按键功能错乱，伴音失控。

电脑硬件工厂代码单

电脑硬件工厂代码单根据这个代码，就可以在电子产品上明白表达是哪一个工厂制造的产品D33002 IBM-Hitachi工厂D33004 FOXCONN*工厂D33005 ASUS华硕电脑D33006 GIGABYTE工厂D33007 FIC大众*工厂D33008 MSI微星科技D33010 HIS金星合资工厂D33011 PowerColor-TUL工厂D33014 WD泰国工厂(原Fujistu工厂)D33015 WD工厂D33017 Hitachi-LG光学工厂D33019 MAXTOR新加坡工厂D33027 Seagate希捷科技D33032 Shuttle浩鑫工厂D41039 Aopen*工厂D33058 Chantech承启工厂D33064 DFI友通科技D33068 Abit罗礼工厂D33071 MITEC工厂D33075 Sparkle旌宇工厂D33080 海韵科技D33083 GIGABYTE原QDI合资工厂D33088 Galaxy嘉威FOXCONN合资工厂D33221 EPOX大陆工厂D33282 Albatron青云国际D33171 ASMART*工厂D31010 ASUS*老工厂D33271 FOXCONN马来西亚工厂D33A27 YUAN聪泰D43136 金星科技D33529 Super FlowerD33108 七盟电子D33373 原IBM-易拓工厂D41126 Logitech苏州工厂D004V0 保德D31010 ASUS*老工厂，板卡制造D31264 微软外设工厂D33002 IBM-Hitachi（日立）工厂，台式硬盘、移动硬盘制造。

D33004 FOXCONN*工厂，从事各种板卡类制造。

D33005 ASUS华硕电脑，板卡，笔记本电脑制造。

D33006 GIGABYTE工厂，板卡制造。

D33007 FIC大众*工厂，板卡制造。

D33008 MSI微星科技，板卡制造。

SMD 3020 LED 黄色系列产品说明书

OF-SMD3020Y YELLOWATTENTIONOBSERVE PRECAUTIONSFOR HANDLINGELECTROSTATICDISCHARGESENSITIVEDEVICESDescriptionThe Yellow source color devices are made with Gallium Yellow Light Emitting Diode.Features●PLCC-2 Package●White SMT package●Suitable for all SMT assembly and solder process.●Available on tape and reel●Package:3000pcs/reel.Applications●Optical indicator●Coupling into light●LCD●Cellular phonesPackage DimensionsNotes:1. All dimension units are millimeters.2.All dimension tolerance is ±0.2mm unless otherwise noted.3.An epoxy meniscus may extend about 1.5mm down the leads.4.Burr around bottom of epoxy may be 0.5mm max..Selection GuidePart. No Dice Lens Type Iv(mcd)@20mA Viewing AngleMin.Typ.2Θ1/2 OF-SMD3020Y YELLOW (InGaAIP)Water Clear210280120°Note:1.θ1/2 is the angle from optical centerline where the luminous intensity is 1/2 the optical centerline value.Electrical / Optical Characteristics at TA=25°CParameter Symbol Device Condition Min Typ UnitForwardVoltage DCVF Yellow IF=20mA 1.8 2.0 V ReverseCurrentIR Yellow VR=5V5uADominant Wavelength λDYellow IF=20mA585590nmCapacitance IF(rec)Yellow VF-0V;f=1MHz20pFAbsolute Maximum Ratings at TA=25°CParameter Yellow Units Power Disspation75mW DC Forward Current30mA Peak Forward Current140mA Reverse Voltage5V Operating/Storage Temperature-40°C to +85°CNote:1.1/10 Duty Cycle, 0.1ms Pulse Width.Reliability Test Items And ConditionsThe reliability of products shall be satisfied with items listed below.Confidence level :90% LTPD :10%No.Items Test ConditionTest Hours/Cycles Sample Size Ac/Rc 1 ReflowTemp:240ºC±5ºC Min.5 sec. 6 Min.22Pcs. 0/12Temperature CycleH:+100ºC 15 min.~ 5 min L:-40ºC 15 min.300 Cycles22Pcs.0/13Thermal ShockH:+100ºC 5 min.~ 10 sec.L:-10ºC 5 min.300 Cycles22Pcs.0/14High Temperature StorageTemp.:100ºC1000Hrs.22Pcs.0/15Low Temperature StorageTemp.:-55ºC 1000Hrs.22Pcs. 0/16DC Operating Life I F =20mA 1000Hrs.22Pcs. 0/17HighTemperature/High Humidity85ºC/R.H85%1000Hrs.22Pcs.0/1Recommended Soldering Pattern (Units : mm) Tape Specifications (Units : mm)。

华晶三极管芯片

2009年产品（成品）
产品代号 CS1N60B1 CS1N60B1H CS1N60B3 CS1N60A1H CS1N60A1H-H CS1N60A3 CS1N60A6H CS3N20A3 CS3N20A3 IRF214B CSZ44V CS2N60A3H CS2N60A3H-H CS2N60A4H CS2N60A8H CS2N60A9H CS2N60FA9H CS2NH60A8 CS2NH60A9 CS2N60 CS2N60F CSZ44VA8H CS2N60B8 CS3N50B3 CS820B8 CS630 CS630F CS634 CS4N60A4H CS4N60A8H CS4N60A9H CS4N60FA9H CS4NH60A9 CS4N60B8 CS4N60B9 CS4N60FB9 CS4N60FB9-1 CS5N60A8H CS5N60A9H CS6N60A8H CS6N60A9H CS6N60FA9H CS730B3 CS730B8 CS830B4 CS830B8 CS3410B3 CS3410B4 CS4N60 CS4N60F CS730 CS830 产品名称 CS1N60B1 CS1N60B1H CS1N60B3 CS1N60A1H CS1N60A1H-H CS1N60A3 CS1N60A6H CS3N20A3 CS3N20A3 IRF214B CSZ44V CS2N60A3H CS2N60A3H-H CS2N60A4H CS2N60A8H CS2N60A9H CS2N60FA9H CS2NH60A8 CS2NH60A9 CS2N60 CS2N60F CSZ44VA8H CS2N60B8 CS3N50B3 CS820B8 CS630 CS630F CS634 CS4N60A4H CS4N60A8H CS4N60A9H CS4N60FA9H CS4NH60A9 CS4N60B8 CS4N60B9 CS4N60FB9 CS4N60FB9-1 CS5N60A8H CS5N60A9H CS6N60A8H CS6N60A9H CS6N60FA9H CS730B3 CS730B8 CS830B4 CS830B8 CS3410B3 CS3410B4 CS4N60 CS4N60F CS730 CS830 封装 TO-92 TO-92 TO-251 TO-92 TO-92 TO-251 TO-126 TO-251 TO-251 TO-251 TO-220AB TO-251 TO-251 TO-252 TO-220AB TO-220F TO-220F TO-220AB TO-220F TO-220AB TO-220F TO-220AB TO-220AB TO-251 TO-220AB TO-220AB TO-220F TO-220AB TO-252 TO-220AB TO-220F TO-220F TO-220F TO-220AB TO-220F TO-220F TO-220F TO-220F TO-220F TO-220AB TO-220F TO-220F TO-251 TO-220AB TO-252 TO-220AB TO-251 TO-252 TO-220AB TO-220F TO-220AB TO-220AB 芯片名称 CS56001B CS56001B CS56001B CS5A6007A CS5A6007A MCS5A60007A MCS5A60007A CS52003A CS52003A CS52502 IP18N06 CS5A6002A CS5A6002A CS5A6002A CS5A6002A CS5A6002A CS5A6002A CS5A6002A CS5A6002A CS16002CH CS16002CH CS1A0650B CS56002A CS55003A CS55003A CS12009CH CS12009CH CS12508DH CS5A6004A CS5A6004A CS5A6004A MCS5A6004A CS5A6004A CS56004A CS56004A CS56004A CS56004A CS5A6005A CS5A6005A MCS5A6005A MCS5A6005A MCS5A6005A CS54006A CS54006A CS55005A CS55005A CS51017B CS51017B CS16004CH CS16004CH CS14006CH CS15005CH 芯片尺寸 1.60×1.85 1.60×1.85 1.60×1.85 1.64×1.49 1.64×1.49 1.64×1.49 1.64×1.49 1.73×1.90 1.73×1.90 1.73×1.90 1.91×3.56 2.28×2.31 2.28×2.31 2.28×2.31 2.28×2.31 2.28×2.31 2.28×2.31 2.28×2.31 2.28×2.31 2.30×2.89 2.30×2.89 2.40×4.00 2.55×2.55 2.55×2.55 2.55×2.55 2.69×3.12 2.69×3.12 2.81×3.24 2.91×2.95 2.91×2.95 2.91×2.95 2.91×2.95 2.91×2.95 3.09×3.35 3.09×3.35 3.09×3.35 3.09×3.35 3.09×3.35 3.09×3.35 3.09×3.35 3.09×3.35 3.09×3.35 3.09×3.35 3.09×3.35 3.09×3.35 3.09×3.35 3.19×3.96 3.19×3.96 3.20×3.58 3.20×3.58 3.20×3.58 3.20×3.58 系列 VDMOS管 VDMOS管 VDMOS管 VDMOS管 VDMOS管 VDMOS管 VDMOS管 VDMOS管 VDMOS管 VDMOS管 VDMOS管 VDMOS管 VDMOS管 VDMOS管 VDMOS管 VDMOS管 VDMOS管 VDMOS管 VDMOS管 VDMOS管 VDMOS管 VDMOS管 VDMOS管 VDMOS管 VDMOS管 VDMOS管 VDMOS管 VDMOS管 VDMOS管 VDMOS管 VDMOS管 VDMOS管 VDMOS管 VDMOS管 VDMOS管 VDMOS管 VDMOS管 VDMOS管 VDMOS管 VDMOS管 VDMOS管 VDMOS管 VDMOS管 VDMOS管 VDMOS管 VDMOS管 VDMOS管 VDMOS管 VDMOS管 VDMOS管 VDMOS管 VDMOS管

3DD3020A6中文版

10
100 VCE (V)
0
○R
3DD3020A6
图 2 Ptot – T关系曲线
Ptot-Tc
Ptot-Ta
50
100
T(℃)
图 3 输出特性曲线（IC -VCE）
Ic(A)
Ta=25℃
图 4 hFE - IC关系曲线
hFE
Ta=125℃
VCE=5V
0.25A 0
Ib=2mA
5
Vce(V)
10
Ta=25℃
IC
1.5
A
Ptot（TC=25℃） 50
W
2 产品特点：
TO-126
● 开关损耗低
● 反向漏电流小
● 高温特性好 ● 击穿电压高 ● 可靠性高
1 2 3
1.B 极 2.C 极 3.E 极
3 主要用途：
内部等效原理图主要用于电子适配器、电子充电器、计算机辅助电源等功率开关电路，
是该类电子产品的核心部件。
8 联络方式
无锡华润华晶微电子有限公司
公司地址：中国江苏无锡市梁溪路 14 号市场营销部应用服务
邮编：214061
网址：http://www.
电话：0510-85807228 传真：0510-85800864
邮编：214061
电话：0510-85807228-3663/5508
上升时间
下降时间
ICBO ICEO IEBO VCBO VCEO VEBO
hFEa
hFE1/
hFE2
VCE
a sat
VBE
a sat
ts
tr
tf
特征频率
fT
a: 脉冲测试 tp≤300μs,δ≤2%

H3C产品清单(13年2月)新

00h3cimcwsm无线业务管理组件纯软件cdh3cimcwsm定位功能授权包费用h3cimcwsm实时频谱防护组件包授权费用h3cimcwsm无线业务管理组件wha无线网络质量评估license费用h3cimcwsm无线业务管理组件管理50台fitap设备license费用h3cimcwsm无线业务管理组件管理100台fitap设备license费用h3cimcwsm无线业务管理组件管理200台fitap设备license费用h3cimcwsm无线业务管理组件管理500台fitap设备license费用h3cimcwsm无线业务管理组件管理1000台fitap设备license费用h3cimcwsm无线业务管理组件管理2000台fitap设备license费用h3cimcwsm无线业务管理组件管理5000台fitap设备license费用h3cimcwsm无线业务管理组件管理50台fatap设备license费用h3cimcwsm无线业务管理组件管理100台fatap设备license费用h3cimcwsm无线业务管理组件管理200台fatap设备license费用h3cimcwsm无线业务管理组件管理500台fatap设备license费用h3cimcwsm无线业务管理组件管理1000台fatap设备license费用h3cimcwsm无线业务管理组件管理2000台fatap设备license费用h3cimcwsm无线业务管理组件管理5000台fatap设备license费用h3cimcwsm无线业务管理组件rtls定位功能定位25个终端license费用h3cimcwsm无线业务管理组件rtls定位功能定位50个终端license费用h3cimcwsm无线业务管理组件rtls定位功能定位100个终端license费用h3cimcwsm无线业务管理组件rtls定位功能定位500个终端license费用h3cimcmvmmplsvpn管理组件含50节点纯软件cdh3cimcmvmbgpmplsvpn管理组件包授权费用h3cimcmvmvplsmplsvpn管理组件包授权费用h3cimcmvmmplste管理组件包授权费用h3cimcmvmcisco设备bgpmplsvpn管理软件驱动包授权费用h3cimcmvmmplsvpn管理组件管理50节点license费用h3cimcmvmmplsvpn管理组件管理10

各种电脑块超级单片及各种集成电路ic的代换收集

创维东芝超级单片机使用的微处理器的代用关系创维东芝超级单片机心有：3T30、4T30、5T30、3T36、4T36、5T36等机心，是创维公司与日本东芝公司联合开发的新一代超级单片集成电路彩电机心。

该机心采用了东芝公司最新推出的超大规模集成心片，有：TMPA8803CSN、TMPA8823CSN、TMPA8808CSN、TMPA8809CSN、TMPA8829CSN等。

在创维东芝超级单片机心中，3T30、3T36、4T36是同一种机心，使用的软件基本相同，对应的超级单片型号是’rMPA8803CSN或者TMPA8823CSN。

TMPA8823CSN是TMPA8803CSN软件升级后的版本，但二者配套使用的存储器不同，不能互换使用。

4T30、5T36、5T30是同一种机心，使用的软件基本相同(电源电路不同)，对应的超级单片型号是TMPA8808CSN、TMPA8809CSN 或者TMPA8829CSN。

TPMA8829C8N是TMPA8809CSN软件升级后的版本，其存储器的代换原则配套使用的存储器不同，不能互换使用。

创维的83703可代8370183735可代83702和837325P30的83731没有可代换的。

83703还能带83702，但是会出现无声或者白屏把OP2调成28即可。

创维T系列机型CPU的代换目前T系列机芯共有5种CPU，其分别为：1、87CM38N-3856，在3T01、4T01机芯上使用，其可存储100个频道。

2、87CM38N-1N86，在21寸9000系列机芯上使用，可存储256个频道，并带有游戏功能。

3、87CM38N-1N10，在25寸5T10机芯上使用，可存储228个频道。

4、87CM38N-1R02，在29寸5T10、5T20机芯一使用，可存储256个频道，带有游戏功能。

5、87TPS38N，此种为OTP产品，为T系列最早使用的CPU，在25寸5T10机芯上使用，有两种，其分别为可存储228和256个频道。

华晶产品介绍2011-客户

华润微电子有限公司
2
产品类别与应用领域对应图 Corresponding Figure of Product Categories and Applications
产品类别应用领域
电子照明节能荧光灯电子变压器 LED照明手机及数码绿色电源电源适配器 LCD及显示器汽车电源

SBD产品(45V系列) 研发方向 SBD产品(100V系列) FRD产品（200V系列)
ቤተ መጻሕፍቲ ባይዱ
现有产品典型系列
700V以上超高压系列均流环设计器件系列有源抗饱和网络系列

25V/40V/60V系列产品集成ESD系列产品延伸耗尽型CS1F%系列产品延伸 800/900V系列产品 IGBT系列产品 P-MOS系列产品
华润微电子有限公司
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双极型晶体管产品介绍 BJT Product Introduction
推挽式镇流器用晶体管:
型号 Part No. 3DD742A8 3DD742A4 3DD741A8 Ptot PTc / PTa 70/2.0 40/1.2 50/2.0 IC 5A 5A 2.5 VCBO 1050 1050 1050 VCEO 400 400 400 VEBO 12 12 15 VCE / IC 5/100 5/100 5V/100 hFE min 48 48 48 max 100 100 100 IC 500 500 500 ts(μs) (UI9600) min 1 1 1 max 6 6 6 封装 Package TO-220AB TO-252 TO-220AB 国外型号 ST的BUL742C ST的BULD742C ST的BUL741
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Hann Star(瀚宇彩晶)液晶面板连接器I液晶屏驱屏线I背光板线【产品百I度I搜I索找 →苏州汇成元】

接口脚距 0.5 mm
0.5 mm 0.5 mm
0.5 mm 1.0 mm 0.5 mm 0.5 mm
1.0 mm 1.0 mm 1.0 mm 1.25 mm 1.25 mm 0.5 mm
0.5 mm 1.0 mm 0.5 mm 1.0 mm 1.0 mm 0.5 mm
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20455-040E-12 MSA24046P30B 20455-040E-12 AA01B-P030VA1 196357-30041-3 20455-040E-12 093F30-B0B01A FH12A-40S-05SH HD1S040HA1 805SLS-0502T1R-C1 093F30-B0B01A 093F30-B0B01A 093F30-B0B01A FI-SEB20P-HF10 DF14A-20P-1.25H 20455-040E-12 MSAK24025P400B 20455-040E-12 093F30-B0B01A AF7301-N2G11A FI-XB30SL-HF10 FI-X30SSL-HF 20455-040E-12 MSA24046P30B MSAK24025P40B AA01B-P030VA1 187098-30091 FH12A-40S-0.5SH 20455-040E-12 MSAK24025P40B MSCK240730B 196357-30041-3 MSA24046P30B 20455-040E-12 FI-XB30SL-HF10 FI-XB30SL-HF10 FI-XB30SL-HF10 FI-XB30SSRL-HF16 FI-XB30SL-HF16
FF12-31A-R12BN-D3 MSA24046P30B 20455-040E-12 FH12-40S-0.5SH FI-X30SSL-HF FI-XB30SL-HF10 093F30-B0B01A 20455-040E-12 FI-XB30SL-HF10 FI-XB30SL-HF10 093F30-B0B01A FI-XB30SL-HF10 20455-040E-12 FI-XB30SL-HF10 MDF76URW-30S-1H 20455-040E-12 DF19L-20P-1H MSAK24024P40 FI-XB30SL-HF10 FI-XB30SL-HF10 FI-XB30SL-HF10 20455-040E-12 20455-040E-12 MDF76GW-30W-1H FI-X30SSL-HF10 20455-040E-12 20455-040E-12 FI-X30SSL-HF FI-X30SSL-HF FI-E30S FI-XB30SSRL-HF16 FI-X30SSL-HF DF14-20P-1.25H DF14-20P-1.25H DF14-20P-1.25H MDF76GW-30S-1H FI-XB30SSRL-HF16 FI-XB30SSRL-HF16 FI-XB30SSRL-HF16 FI-XB30SSRLA-HF16 MDF76URW-30S-1H FI-XB30SSRLA-HF16 MDF76URW-30S-1H MDF76URW-30S-1H MDF76URW-30S-1H MDF76URW-30S-1H FI-X30SSL-HF FI-X30SSL-HF

ATT3020-70H68I资料

Data Sheet February 1997ATT3000 Series Field-Programmable Gate ArraysFeaturess High performance:— Up to 270 MHz toggle rates— 4-input LUT delays <2.7 nss User-programmable gate arrays— Unlimited reprogrammability— Easy design iteration through in-system logic changess Flexible array architecture:— Compatible arrays ranging from 1500 to 6000 gate logic complexity— Extensive register, combinatorial, and I/O capabilities— Low-skew clock nets— High fan-out signal distribution— Internal 3-state bus capabilities— TTL or CMOS input thresholds— On-chip oscillator ampliﬁers Standard product availability:— Low-power 0.55 µm CMOS, static memory technology— Pin-for-pin compatible with Xilinx*XC3000* and XC3100* families— Cost-effective for volume production— 100% factory pretested— Selectable conﬁguration modess ORCA™ Foundry for ATT3000Development System supports All FPGAs processed on a QML-certiﬁed line s Extensive packaging options DescriptionThe CMOS ATT3000 Series Field-Programmable Gate Array (FPGA) family provides a group of high-density, digital integrated circuits. Their regular, extendable, ﬂexible, user-programmable array architecture is composed of a conﬁguration program store plus three types of conﬁgurable elements: a perimeter of I/O blocks, a core array of logic blocks, and resources for interconnection. The general struc-ture of an FPGA is shown in Figure 1.The ORCA Foundry for ATT3000 Development Sys-tem provides automatic place and route of netlists. Logic and timing simulation are available as design veriﬁcation alternatives. The design editor is used for interactive design optimization and to compile the data pattern that represents the conﬁguration pro-gram.The FPGA’s user-logic functions and interconnec-tions are determined by the conﬁguration program data stored in internal static memory cells. The pro-gram can be loaded in any of several modes to accommodate various system requirements. The program data resides externally in an EEPROM, EPROM, or ROM on the application circuit board, or on a ﬂoppy disk or hard disk. On-chip initialization logic provides for optional automatic loading of pro-gram data at powerup. A serial conﬁguration PROM can provide a very simple serial conﬁguration pro-gram storage.*Xilinx, XC3000, and XC3100 are registered trademarks of Xilinx, Inc.Table 1. ATT3000 Series FPGAsFPGAMaxLogicGatesTypical GateRangeConﬁgurableLogicBlocksArrayUser I/OsMaxFlip-FlopsHorizontalLong LinesConﬁgurationData BitsATT30201,5001,000—1,500648 x 8642561614,779 ATT30302,0001,500—2,00010010 x 10803602022,176 ATT30423,0002,000—3,00014412 x 12964802430,784 ATT30644,5003,500—4,50022416 x 141206883246,064 ATT30906,0005,000—6,00032020 x 161449284064,160Data Sheet ATT3000 Series Field-Programmable Gate ArraysFebruary 19972Lucent Technologies Inc.ContentsPagePerformance .............................................................29Device Performance .............................................29Logic Block Performance ......................................30Interconnect Performance .....................................30Power ........................................................................32Power Distribution .................................................32Power Dissipation .................................................33Pin Information .........................................................34Pin Assignments .......................................................39Package Thermal Characteristics .............................50Package Coplanarity .................................................51Package Parasitics ...................................................51Absolute Maximum Ratings ......................................53Electrical Characteristics ..........................................54Outline Diagrams ......................................................68Terms and Deﬁnitions ...........................................6844-Pin PLCC .........................................................6868-Pin PLCC .........................................................6984-Pin PLCC .........................................................70100-Pin QFP .........................................................71100-Pin TQFP .......................................................72132-Pin PPGA ......................................................73144-Pin TQFP .......................................................74160-Pin QFP .........................................................75175-Pin PPGA ......................................................76208-Pin SQFP .......................................................77Ordering Information . (78)ContentsPageFeatures .....................................................................1Description .................................................................1Architecture ................................................................3Conﬁguration Memory................................................ 4I/O Block .....................................................................5Summary of I/O Options .........................................6Conﬁgurable Logic Block ............................................7Programmable Interconnect .......................................9General-Purpose Interconnect .............................10Direct Interconnect ...............................................11Long Lines ............................................................13Internal Buses ......................................................14Crystal Oscillator ..................................................16Conﬁguration ............................................................17Initialization Phase ...............................................17Conﬁguration Data ...............................................19Conﬁguration Modes ................................................22Master Mode ........................................................22Peripheral Mode ...................................................24Slave Mode ..........................................................25Daisy Chain ..........................................................26Special Conﬁguration Functions ..............................27Input Thresholds ...................................................27Readback .............................................................27Reprogram ...........................................................28DONE Pull-Up ......................................................28DONE Timing .......................................................28RESET Timing ......................................................28Crystal Oscillator Division (28)Table of ContentsData Sheet February 1997ATT3000 Series Field-Programmable Gate ArraysLucent Technologies Inc.3ArchitectureThe perimeter of conﬁgurable I/O blocks (IOBs) pro-vides a programmable interface between the internal logic array and the device package pins. The array of conﬁgurable logic blocks (CLBs) performs user-speciﬁed logic functions. The interconnect resources are programmed to form networks, carrying logic signals among blocks, analogous to printed-circuit board traces connecting MSI/SSI packages.The blocks’ logic functions are implemented by programmed look-up tables. Functional options are implemented by program-controlled multiplexers.Interconnecting networks between blocks areimplemented with metal segments joined by program-controlled pass transistors. These functions of the FPGA are established by a conﬁguration program which is loaded into an internal, distributed array of conﬁguration memory cells. The conﬁguration program is loaded into the FPGA at powerup and may bereloaded on command. The FPGA includes logic and control signals to implement automatic or passive conﬁguration. Program data may be either bit serial or byte parallel. The ORCA Foundry for ATT3000 Devel-opment System generates the conﬁguration program bit stream used to conﬁgure the FPGA. The memory loading process is independent of the user logic func-tions.Figure 1. Field-Programmable Gate Array StructureData Sheet ATT3000 Series Field-Programmable Gate ArraysFebruary 19974Lucent Technologies Inc.Conﬁguration MemoryThe static memory cell used for the conﬁguration mem-ory in the FPGA has been designed speciﬁcally for high reliability and noise immunity. Integrity of the FPGA conﬁguration memory based on this design is ensured even under various adverse conditions. Com-pared with other programming alternatives, static mem-ory is believed to provide the best combination of high density, high performance, high reliability, and compre-hensive testability.As shown in Figure 2, the basic memory cell consists of two CMOS inverters plus a pass transistor used for writing and reading cell data. The cell is only written to during conﬁguration and only read from during read-back. During normal operation, the cell provides contin-uous control and the pass transistor is off and does not affect cell stability. This is quite different from the opera-tion of conventional memory devices, in which the cells are frequently read and rewritten.The memory cell outputs Q and Q use full ground and V CC levels and provide continuous, direct control. The additional capacitive load and the absence of address decoding and sense ampliﬁers provide high stability to the cell. Due to their structure, the conﬁguration mem-ory cells are not affected by extreme power supply excursions or very high levels of alpha particle radia-tion. Soft errors have not been observed in reliability testing.Two methods of loading conﬁguration data use serial data, while three use byte-wide data. The internal con-ﬁguration logic utilizes framing information, embedded in the program data by the ORCA Foundry Develop-ment System, to direct memory cell loading. The serial data framing and length count preamble provide pro-gramming compatibility for mixes of various Lucent pro-grammable gate arrays in a synchronous, serial, daisy-chain fashion.Figure 2. Static Conﬁguration Memory CellCONFIGURATION CONTROL 5-3101(F)Data Sheet February 1997ATT3000 Series Field-Programmable Gate ArraysLucent Technologies Inc.5Data Sheet ATT3000 Series Field-Programmable Gate ArraysFebruary 19976Lucent Technologies Inc.I/O Block (continued)For reliable operation, inputs should have transition times of less than 100 ns and should not be left ﬂoat-ing. Floating CMOS input-pin circuits might be at threshold and produce oscillations. This can produce additional power dissipation and system noise. Atypical hysteresis of about 300 mV reduces sensitivity to input noise. Each user IOB includes a programmable high-impedance pull-up resistor which is selected by the program to provide a constant high for otherwise undriven package pins. Normal CMOS handling precautions should be observed.Flip-ﬂop loop delays for the IOB and logic block ﬂip-ﬂops are approximately 3 ns. This short delay provides good performance under asynchronous clock and data conditions. Short loop delays minimize the probability of a metastable condition which can result from asser-tion of the clock during data transitions. Because of the short loop delay characteristic in the FPGA, the IOB ﬂip-ﬂops can be used to synchronize external signals applied to the device. When synchronized in the IOB, the signals can be used internally without further con-sideration of their clock relative timing, except as it applies to the internal logic and routing path delays. Output buffers of the IOBs provide CMOS-compatible 4 mA source-or-sink drive for high fan-out CMOS or TTL compatible signal levels. The network driving IOB pin .o becomes the registered or direct data source for the output buffer. The 3-state control signal (IOB pin .t) can control output activity. An open-drain type output may be obtained by using the same signal for driving the output and 3-state signal nets so that the buffer out-put is enabled only for a LOW.Conﬁguration program bits for each IOB controlfeatures such as optional output register, logical signal inversion, and 3-state and slew rate control of the out-put.The program-controlled memory cells in Figure 3 control the following options:sLogical inversion of the output is controlled by one conﬁguration program bit per IOB.sLogical 3-state control of each IOB output buffer is determined by the states of conﬁguration program bits which turn the buffer on or off or select the output buffer 3-state control interconnection (IOB pin .t). When this IOB output control signal is high, a logic 1, the buffer is disabled and the package pin is high impedance. When this IOB output control signal is low, a logic 0, the buffer is enabled and the package pin is active. Inversion of the buffer 3-state control logic sense (output enable) is controlled by an addi-tional conﬁguration program bit.sDirect or registered output is selectable for each IOB. The register uses a positive-edge, clocked ﬂip-ﬂop. The clock source may be supplied (IOB pin .ok) by either of two metal lines available along each die edge. Each of these lines is driven by an invertible buffer.sIncreased output transition speed can be selected to improve critical timing. Slower transitions reduce capacitive load peak currents of noncritical outputs and minimize system noise.sA high-impedance pull-up resistor may be used to prevent unused inputs from ﬂoating.Summary of I/O OptionssInputs —Direct—Flip-ﬂop/latch—CMOS/TTL threshold (chip inputs)—Pull-up resistor/open circuit sOutputs—Direct/registered —Inverted/not —3-state/on/off—Full speed/slew limited—3-state/output enable (inverse)Data Sheet February 1997ATT3000 Series Field-Programmable Gate ArraysLucent Technologies Inc.7Data Sheet ATT3000 Series Field-Programmable Gate Arrays February 19978Lucent Technologies Inc.Lucent Technologies Inc.9Data Sheet February 1997ATT3000 Series Field-Programmable Gate ArraysProgrammable InterconnectProgrammable interconnection resources in the FPGA provide routing paths to connect inputs and outputs of the IOBs and logic blocks into logical networks. Inter-connections between blocks are composed from a two-layer grid of metal segments. Specially designed pass transistors, each controlled by a conﬁguration bit, form programmable interconnect points (PIPs) and switching matrices used to implement the necessary connections between selected metal segments and block pins.Figure 7 is an example of a routed net. The ORCA Foundry Development System provides automatic rout-ing of these interconnections. Interactive routing is also available for design optimization. The inputs of the logic or IOBs are multiplexers which can be programmed to select an input network from the adjacent interconnect segments. Since the switch connections to block inputs are unidirectional (as are block outputs), they areusable only for block input connection and not routing. Figure 8 illustrates routing access to logic block input variables, control inputs, and block outputs.Three types of metal resources are provided to accom-modate various network interconnect requirements:s General-purpose interconnect s Direct connectionsLong lines (multiplexed buses and wide-AND gates)Figure 7. Example of Routing ResourcesFigure 8. CLB Input and Output RoutingData Sheet ATT3000 Series Field-Programmable Gate ArraysFebruary 199710Lucent Technologies Inc.Figure 9. FPGA General-Purpose InterconnectFigure 10. Switch Matrix Interconnection Options1234567891011121314151617181920Programmable Interconnect (continued)Direct interconnect (shown in Figure 11) provides themost efﬁcient implementation of networks betweenadjacent logic or IOBs. Signals routed from block toblock using the direct interconnect exhibit minimuminterconnect propagation and use no general intercon-nect resources. For each CLB, the .x output may beconnected directly to the .b input of the CLB immedi-ately to its right and to the .c input of the CLB to its left.The .y output can use direct interconnect to drive the .dinput of the block immediately above, and the .a inputof the block below. Direct interconnect should be usedto maximize the speed of high-performance portions oflogic. Where logic blocks are adjacent to IOBs, directconnect is provided alternately to the IOB inputs (.i)and outputs (.o) on all four edges of the die. The rightedge provides additional direct connects from CLB out-puts to adjacent IOBs. Direct interconnections of IOBswith CLBs are shown in Figure 12.Figure 11. Direct InterconnectProgrammable Interconnect (continued)Figure 12. ATT3020 Die Edge I/O Blocks with Direct Access to Adjacent CLBProgrammable Interconnect (continued)Long LinesThe long lines bypass the switch matrices and are intended primarily for signals which must travel a long distance, or must have minimum skew among multiple destinations. Long lines, shown in Figure 13, run vertically and horizontally the height or width of the interconnect area. Each interconnection column has three vertical long lines, and each interconnection row has two horizontal long lines. Additionally, two longlines are located adjacent to the outer sets of switching matrices. Two vertical long lines in each column are connectable half-length lines, except on the ATT3020, where only the outer long lines serve that function. Long lines can be driven by a logic block or IOB output on a column-by-column basis. This capability provides a common low-skew control or clock line within each column of logic blocks. Interconnections of these long lines are shown in Figure 14. Isolation buffers are pro-vided at each input to a long line and are enabled auto-matically by the development system when a connection is made.Figure 13. Horizontal and Vertical Long Lines in the FPGA3--Programmable Interconnect (continued)A buffer in the upper left corner of the FPGA chip drives a global net which is available to all .k inputs of logic blocks. Using the global buffer for a clock signal pro-vides a skew-free, high fan-out, synchronized clock for use at any or all of the I/O and logic blocks. Conﬁgura-tion bits for the .k input to each logic block can select this global line, or another routing resource, as the clock source for its ﬂip-ﬂops. This net may also be pro-grammed to drive the die edge clock lines for IOB use. An enhanced speed, CMOS threshold, offers direct access to this buffer and is available at thesecond pad from the top of the left die edge.A buffer in the lower right corner of the array drives a horizontal long line that can drive programmed connec-tions to a vertical long line in each interconnection column. This alternate buffer also has low skew and high fan-out. The network formed by this alternate buf-fer’s long lines can be selected to drive the .k inputs of the logic blocks. CMOS threshold, high-speed access to this buffer is available from the third pad from the bottom of the right die edge.Internal BusesA pair of 3-state buffers is located adjacent to each CLB. These buffers allow logic to drive the horizontal long lines. Logical operation of the 3-state buffer controls allows them to implement wide multiplexing functions. Any 3-state buffer input can be selected as drive for the horizontal long line bus by applying a low logic level on its 3-state control line (see Figure 15A). The user is required to avoid contention that can result from multiple drivers with opposing logic levels. Control of the 3-state input by the same signal that drives the buffer input creates an open-drain wired-AND function.A logical high on both buffer inputs creates a high impedance which represents no contention. A logical low enables the buffer to drive the long line low (see Figure 15B). Pull-up resistors are available at each end of the long line to provide a high output when all con-nected buffers are nonconducting. This forms fast, wide gating functions. When data drives the inputs and sep-arate signals drive the 3-state control lines, these buff-ers form multiplexers (3-state buses). In this case, care must be used to prevent contention through multiple active buffers of conﬂicting levels on a common line. Figure 16 shows 3-state buffers, long lines, and pull-up resistors.Figure 14. Programmable Interconnection of Long Lines3-STATEProgrammable Interconnect (continued)Crystal OscillatorFigure 16 shows the location of an internal high-speed inverting ampliﬁer which may be used to implement an on-chip crystal oscillator. It is associated with the auxil-iary buffer in the lower right corner of the die. When the oscillator is conﬁgured and connected as a signal source, two special user IOBs are also conﬁgured to connect the oscillator ampliﬁer with external crystal oscillator components as shown in Figure 17. A divide-by-two option is available to ensure symmetry. The oscillator circuit becomes active before conﬁguration is complete in order to allow the oscillator to stabilize. Actual internal connection is delayed until completion of conﬁguration. In Figure 17, the feedback resistor, R1, between output and input biases the ampliﬁer at threshold. The value should be as large as is practicalto minimize loading of the crystal. The inversion of the ampliﬁer, together with the R-C networks and an AT cut series resonant crystal, produces the 360° phase shift of the Pierce oscillator. A series resistor, R2, may be included to add to the ampliﬁer output impedance when needed for phase shift control or crystal resistance matching, or to limit the ampliﬁer input swing to control clipping at large amplitudes. Excess feedback voltage may be corrected by the ratio of C2/C1. The ampliﬁer is designed to be used from 1 MHz to one-half the speci-ﬁed CLB toggle frequency. Use at frequencies below 1 MHz may require individual characterization with respect to a series resistance. Crystal oscillators above 20 MHz generally require a crystal which operates in a third overtone mode, where the fundamental frequency must be suppressed by an inductor across C2. When the oscillator inverter is not used, these IOBs and their package pins are available for general user I/O.Suggested component values:R1—0.5 M Ω to 1 M ΩR2—0 k Ω to 1 k Ω (may be required for low frequency, phase shift, and/or compensation level for Crystal Q)C1, C2—10 pF to 40 pFY1—1 MHz to 20 MHz AT cut series resonant Figure 17. Crystal Oscillator InverterPin44-Pin PLCC 68-Pin PLCC 84-Pin PLCC 100-Pin 132-Pin PPGA 144-Pin TQFP 160-Pin QFP 175-Pin PPGA 208-Pin SQFP QFP TQFP XTAL1 (OUT)3047578279P137582T14110XTAL2 (IN)2643537673M136976P15100ConﬁgurationInitialization PhaseAn internal power-on-reset circuit is triggered when power is applied. When V CC reaches the voltage where portions of the FPGA begin to operate (2.5 V to 3 V), the programmable I/O output buffers are disabled and a high-impedance pull-up resistor is provided for the user I/O pins. A time-out delay is initiated to allow the power supply voltage to stabilize. During this time, the power-down mode is inhibited. The initialization state time-out (about 11 ms to 33 ms) is determined by a 14-bit counter driven by a self-generated, internal timer. This nominal 1 MHz timer is subject to variations with pro-cess, temperature, and power supply over the range of 0.5 MHz to 1.5 MHz. As shown in Table 2, ﬁve conﬁgu-ration mode choices are available, as determined by the input levels of three mode pins: M0, M1, and M2.In master conﬁguration mode, the FPGA becomes the source of conﬁguration clock (CCLK). Beginning con-ﬁguration of devices using peripheral or slave modes must be delayed long enough for their initialization to be completed. An FPGA with mode lines selecting a master conﬁguration mode extends its initialization state using four times the delay (43 ms to 130 ms) to ensure that all daisy-chained slave devices it may be driving will be ready, even if the master is very fast and the slave(s), very slow (see Figure 18). At the end of initialization, the FPGA enters the clear state where it clears conﬁguration memory. The active-low, open-drain initialization signal INIT indicates when the initial-ization and clear states are complete. The FPGA tests for the absence of an external active-low RESET before it makes a ﬁnal sample of the mode lines and enters the conﬁguration state. An external wired-AND of one or more INIT pins can be used to control conﬁguration by the assertion of the active-low RESET of a master mode device or to signal a processor that the FPGAs are not yet initialized.If a conﬁguration has begun, a reassertion of RESET for a minimum of three internal timer cycles will be recog-nized and the FPGA will initiate an abort, returning to the clear state to clear the partially loaded conﬁgura-tion memory words. The FPGA will then resample RESET and the mode lines before reentering the con-ﬁguration state.A reprogram is initiated when a conﬁgured FPGA senses a high-to-low transition on the DONE/PROG package pin. The FPGA returns to the clear state where conﬁguration memory is cleared and mode lines resampled, as for an aborted conﬁguration. The com-plete conﬁguration program is cleared and loaded dur-ing each conﬁguration program cycle.Table 2. Conﬁguration ModesM0M1M2Clock Mode Data000Active Master Bit Serial 001Active Master Byte Wide(Address = 0000up) 010—Reserved—011Active Master Byte Wide(Address = FFFFdown) 100—Reserved—101Active Peripheral Byte Wide 110—Reserved—111Passive Slave Bit SerialLength count control allows a system of multiple FPGAs in assorted sizes to begin operation in a syn-chronized fashion. The conﬁguration program gener-ated by the ORCA Foundry Development System begins with a preamble of 111111110010 (binary), fol-lowed by a 24-bit length count representing the total number of conﬁguration clocks needed to complete loading of the conﬁguration program(s). The data fram-ing is shown in Figure 19. All FPGAs connected in series read and shift preamble and length count in (on positive) and out (on negative) CCLK edges. An FPGA which has received the preamble and length count then presents a HIGH data out until it has intercepted the appropriate number of data frames. When the conﬁgu-ration program memory of an FPGA is full and the length count does not compare, the FPGA shifts any additional data through, as it did for preamble and length count.When the FPGA conﬁguration memory is full and the length count compares, the FPGA will execute a syn-chronous start-up sequence and become operational (see Figure 20 on page 20). Two CCLK cycles after the completion of loading conﬁguration data, the userI/O pins are enabled as conﬁgured. As selected in ORCA Foundry, the internal user-logic reset is released either one clock cycle before or after the I/O pins become active. A similar timing selection is program-mable for the DONE/PROG output signal. DONE/PROG may also be programmed to be an open drain or include a pull-up resistor to accommodate wired-ANDing. The high during conﬁguration (HDC) and low during conﬁguration (LDC) are two user I/O pins which are driven active when an FPGA is in initialization, clear, or conﬁgure states. These signals and DONE/ PROG provide for control of external logic signals such as reset, bus enable, or PROM enable duringconﬁguration.For parallel master conﬁguration modes, these signals provide PROM enable control and allow the data pins to be shared with user logic signals.User I/O inputs can be programmed to be either TTL or CMOS compatible thresholds. At powerup, all inputs have TTL thresholds and can change to CMOS thresh-olds at the completion of conﬁguration, if the user has selected CMOS thresholds. The threshold of PWRDWN and the direct clock inputs are ﬁxed at a CMOS level. If the crystal oscillator is used, it will begin operation before conﬁguration is complete to allow time for stabilization before it is connected to the internal circuitry.。

音频设备连接器类型说明书

Sound & Lighting Manufacturers ListHey, take a look at our new LED lites. They work anywhere standard Littlites work! MPALLEN & HEATH..................GL 3, GL 4..........................................................................18G-HIGL 2000, 3300....................................................................18GML 3000, 4000, 5000..........................................................18XR-HI 4 PINPA12-CP, PA20-CP, PA12, PA20, PA28............................18XR-HI-4GL-4000..............................................................................12X-4 (X 2)GL 2400, GL 2800..............................................................18XR-HI-4GL 3800, GL 4800..............................................................18X-HI-4MIX WIZARD......................................................................18X-HI-4 ALTAIR..................................ELECTRA SERIES............................................................12X-HI NGLEY...........................................................................XLR-4 PINSR 6000..............................................................................XLR-4 PINSR 4000..............................................................................18GAMERICAN DJ......................XDM-352, XDM 242, XDM-3633 COMMANDER................12G-HIQ2422/SX, Q-2422/X, Q-3433/SX, Q-SPANDASM STEUERUNGSTE........R2D2...................................................................................12X-HIDX33...................................................................................6G-HIAUDIO INDEPENDENCE.....PARAGON..........................................................................12 OR 18X AVOLITES.............................AZURE SHADOW, AZURE PANEL...................................12XR-HI (SPECIAL WIRING)PEARL 2000.......................................................................12X-HI (SPECIAL WIRING)SAPPHIRE 96, SAPPHIRE 2000........................................12XR-HI (SPECIAL WIRING)DIAMOND II AND III AND 4................................................12XR-HI (SPECIAL WIRING) BEHRINGER.........................EURODESK MX8000A, 9000A, UB2442FX-PRO..............18G-HIEURODESK MX3282A, 2442A...........................................12G-HIBI AMP..................................COLUMBIA & OLYMPIA.....................................................12G CARVIN.................................FX.......................................................................................12GDX1642,1642P,2442...........................................................18X-HIFX1244,1244P,1644,2444..................................................18GMX2488...............................................................................6V BNCSL24....................................................................................18X-HI CASE....................................PROFESSIONAL 1 & 2.......................................................12XR-HI CELCO..................................NAVIGATOR 3....................................................................12GAVIATOR............................................................................18XRSERIES II GOLD................................................................12GPATHFINDER.....................................................................12GPULSAR MASTER..............................................................12GEXPLORER.........................................................................12GVENTURA 1000..................................................................12XR-HIR2D2...................................................................................12X-HICOLOR TRAN.......................MADILLION 2 -3.................................................................18XR-HI 4 PININNOVATOR.......................................................................18XR-HIENCORE.............................................................................18XR-HI 4 PIN COMPULITE.........................SPARK, SABRE. OVATION4D, MICRON 4D,SPARK4D...12XR-HI OR 18XR-HISPARK TOP, SPARK, PHOTON, RAVE............................12XR-HI OR 18XR-HI CRATE..................................CSX SERIES......................................................................12G-HI OR 18G-HICREST AUDIO......................OLD STYLES......................................................................12GSP,TC,GT,LM, X-FOUR.....................................................12X-HIGTX,VX, LMX, V-12............................................................18XR-HICENTURY GT AND VX......................................................18X-HIX-EIGHT, X-MONITOR, X-VCA..........................................18X-HIHS-48+4..............................................................................18XR-HIXR-20, XR-24, XR-M...........................................................12G-HIHP-8....................................................................................18G or 18G-LEDHPW...................................................................................18G-HID & R.....................................MERLIN..............................................................................12XR-HIVISION................................................................................18XR-HIORION................................................................................18XR-HITRITON..............................................................................18XR 4 PINAXION.................................................................................18XR 4 PIN DDA.......................................CS3, CS8, CS12.................................................................18XR-HIFORUM, Q2........................................................................12X-HIINTERFACE........................................................................12GDEVON..............................SMX-2000..............................................................................12G-HI DOD...................................822XL, 822RM.......................................................................12G-HI1222XL, 1222RM....................................................................12G-HICM300, 350, 750, 1642..........................................................12G-HI DENON..............................SMX 200DJ............................................................................6G-HISMX 2000...............................................................................12G-HI DOVE.................................1Q 24.....................................................................................12GTS48D....................................................................................12G-HIE-MU..................................MP-7, XL-7, PX-7...................................................................12G-HI ELECTRA...........................18:8:2, 24:8:2, 32:8:2, 40:8:2,................................................12X-HI48:8:2.....................................................................................12X-HI ELECTRO VOICE/TELEX..BK 32 AND 43SERIES...........................................................12GEVT 52 SERIES.....................................................................12GELAN......................................................................................12-18G-HIINTERFACE CONSOLES......................................................18XR-HIVECTOR................................................................................12GPSX1000, 1600, 2200............................................................12 or 18X ETC....................................EXPRESS SERIES...............................................................18X-HIOBSESSION SERIES............................................................18XR-HI FENDER............................PX 2208..................................................................................12G-HIPX 2208D...............................................................................12G-HIPX 2212D...............................................................................12G-HIPX 2216D...............................................................................12G-HIMX-5200.................................................................................18G-HIMX 5232.................................................................................18G-HIFLYING PIG.......................WHOLE HOG 1 & 2...............................................................12XR-HI FROG.................................FROG 2, FROG 24/48, FAT FROG, FROG BOX,.................18XR-HIFAT FROG, BULL FROG, LEAP FROG, MAMBO FROG GLI.....................................PMX 7000, 8000, 9500, 9900.................................................12G-HIGEM SOUND.....................DS 9000, 9905, DSP-6PRO...................................................12G-HIDMX-6, 52..............................................................................12G-HIDMX-525, 1030 & 1070..........................................................12G-HIMX-5216,5224,5232, MP3-PRO.............................................12G-HI GEMINI..............................TURNTABLES.......................................................................12G-HIHIGH END..........................STATUS CUE,.......................................................................12 OR 18X-HIPOWER CUE.........................................................................12G INKEL.................................CMX 1664..............................................................................18G INNOVASON......................SY80......................................................................................18XR-HI-4 (X 4)SY48......................................................................................12X-HI (X 2) INTER M............................CMX 1264/1664/2464.............................................................18G-HIKENSINGTON.......................................................................18XR-HI-4 JANDS...............................ESPII-24,................................................................................18XR-HIESPII-48, 60...........................................................................18XR-HI (X2)EVENT 24..............................................................................18XR-HI (X2)EVENT 36,48, 408, 416.........................................................18XR-HI (X2)EVENT PLUS 48 AND 60......................................................18XR-HI (X2)JANDS HOG 250, 600...........................................................18XR-HI (X2)HOG 500................................................................................18XR-HIHOG 1000..............................................................................18XR-HI (X2) JUICE GOOSE...................RP-100, RP-200-L..................................................................12G LEPRECON LLC................850.........................................................................................12XR1500.......................................................................................12G1600.......................................................................................12G2000.......................................................................................18XR-HI3000.......................................................................................18XR-HILP-X24, LP-X48.....................................................................12XR-HI 4 PIN (2) LMI.....................................CH 200...................................................................................12GDESIGNER............................................................................12G LSC....................................FOCAL CONSOLES..............................................................12X-HIFOCAL TOURING DIMMING................................................12X-HIATOM.....................................................................................12XR-HIAXIOM....................................................................................12X-HIMAXIM S, MAXIM M..............................................................12XR-HIMAXIML, MAXIMXL, MAXIM XXL..........................................12XR-HI (2)LINEARTECH.................................SL-2600, SL-3100, SL-4600.......................................12G LIGHTRONICS...............................TL-2448......................................................................18G-HI LITEPUTER........................................................................................................................18G-LED MA..................................................GRAND MA, LIGHT COMMANDER 48/6..................18XR-HI (X2)LIGHT COMMANDER 24/6........................................18XR-HIGRAND MA LIGHT, GRAND MA ULTRA-LIGHT......18X-HIGRAND MA MICROLIGHT COMMANDER 12/2 19".................................18X-HILIGHT COMMANDER 12/2, SCANCOMMANDER 19"MACKIE1604...........................................................................18G-HIOTTO 1604................................................................6G-HISR 24-4 VLZ PRO, ONYX 1640...............................18G-HISR 40.8, SR 56.8,......................................................18X-HI-4 PINCFX12, 1642-VLZ, ONYX 1620.................................12G-HICFX16........................................................................18G-HICFX 18, CFX20..........................................................18G-HISR24-4 VLZ PRO.......................................................18G-HISR32-4 VLX PRO.......................................................18G-HIONYX 4880, ONYX 4080, ONYX 3280......................18X-HI-4 (X3)ONYX 2480................................................................18X-HI-4 (X2)TT24...........................................................................12X-HI-4ONYX 24-4.................................................................18G-HI MARTIN.........................................CASE CONTROLLER P1, P2....................................18XR-HICASE CONTROLLER P1+, P2+................................18XR-HICASE CONTROLLER PLAYBACK WING.................18XR-HI MIDAS.............................................MIDAS, XL3, XL200, XL250, LEGEND.....................18X-HIHERITAGE 1000, 2000, 3000...................................18XR-HIXL-4...........................................................................12G-HIVENICE,....................................................................18X-HI-4 PINVENICE,....................................................................18X-4-LED-ISOHERITAGE 4000, SIENA, VERONA..................................18XR-HIMOOG MUSIC...............................VOYAGER................................................................12X-HI MITEC.............................................EVENT......................................................................18X-HI NSI..................................................PMC, TC...................................................................18X-HIMEL, MLC, 7424, 7500, 7532....................................12, OR 18G-HI NUMARK.........................................DM 1600X..................................................................12G-HI PANASONIC...................................WR-SX-1...................................................................12G-HI PEAVEY..........................................24-FX, 32-FX.............................................................12G-HIS-24...........................................................................18G-HI PHONIC..........................................DX SERIES...............................................................18G-HI PULSAR..........................................MASTERPIECE.........................................................12G RACKMAN......................................INNOVATIONS.........................................................12G-HI RAMSA...........................................SX-1..........................................................................12G OR 12G-HIWR-S840...................................................................12 OR 18G-HIWR-C900..................................................................12 OR 18G-HIWR-4000...................................................................12 OR 18G-HIROSS MIXING................................RCS 2842..................................................................12X-HIPC 8400....................................................................12G802, 1202, 1602, 2402...............................................12GSEE FACTOR.................................LD-500, LD-1000.......................................................12XR-HI SPECIAL WIRING S OUNDCRAFT...............................EUROPA, SERIES 2, SERIES 5 MONITOR & FOH18XR-HI 4-PINVIENNA, VENUE, DELTA.........................................18G-HIK-3 AND SM12, SM20..............................................18X-HI-4 PINK-2, MH3, MH4..........................................................18XR-HI-4SPIRIT 8 (24-40 CHANNEL......................................18X-HI-4 PINSPIRIT LX-7..............................................................18X-HISPIRIT MONITOR (24-40 CHANNEL)......................18X-HI-4 PINGB-4/16, GB-4/24, GB-4/32, GB-4/40.......................18X-HI-4 (2)GB-2/16, GB-2/24, GB-2/32......................................18X-HI-4SOUND TECH4150, 306D, 308D, ST-122, PC 803, PC1250...........12G-HIPANORAMIC.............................................................12G-HIST 164.......................................................................18GDJ 252, 262D............................................................12G-HISOUNDTRAC.................................MEGAS STAGE........................................................18G-HIMEGAS 2..................................................................18X-HISEQUEL....................................................................18X-HISEQUEL 2.................................................................18X-HISOLO........................................................................18G-HISOLO 8.....................................................................18X-HI STRAND.........................................500 SERIES..............................................................18X-HI STUDIO MASTER...........................SHOW MIX................................................................12 OR 18G-HISTAGEMASTER.......................................................12 OR 18G-HI TAPCO............................................BLEND 16.................................................................18G-HITAC(TOTAL AUDIO CONCEPTS)..SR 6000....................................................................18X-HI TACTILE TECHNOLOGY...............M4000.......................................................................18G-HI TARGET.........................................Q 328+6....................................................................12X-HIL 160+5.....................................................................12X-HIL 244+5.....................................................................12X-HI TASCAM.........................................200, 300....................................................................12G THEATRELIGHT.............................ALL MODELS............................................................N/A ULTRALITE.....................................MISSION CONTROL VX2.........................................18XR-HIMISSION CONTROL 1024........................................18X-HIVARI-LITE.......................................ALL MODELS............................................................18X-HI VOCO PRO.....................................KJ6200,PKJ-9090 PRO, KJ7800 PRO......................12G-HI YAMAHA.........................................PM 2000....................................................................18G-HIPM 1800A..................................................................18XR-HI-4 PINPM 3000 & 3500........................................................18XR-HI-4 PINPM 4000. PM 6000....................................................18XR-HI-4 PINPM-5D, PM-5D-RH....................................................18XR-HI-4 PINM3000.......................................................................18XR-HI-4 PINM2500.......................................................................18XR-HI-4 PINMX12/6, MV12/6........................................................12X-HIMX20/6, MV20/6........................................................18X-HIEMX 5000..................................................................18X-HI9000 PRO KYBD.......................................................18XR-HI-4 PINDM 2000 Ver 2..........................................................18XR-HI-4 PIN ZERO 88.........................................FROG........................................................................12XR-HIFAT FROG................................................................18XR-HILEAP FROG..............................................................12XR-HIBULL FROG..............................................................12XR-HILIGHTMASTER XL...................................................18XR-HILIGHTMASTER XLS.................................................18XR-HIILLUSION, SIRIUS 250, 24.......................................12XR-HI3G LIMITED........................................................................................................................18X-HIRight Angle 4 Pin XLRP SeriesPermanentG SeriesBNC Connector4 Pin XLR 3 Pin XLRRight Angle3 Pin XLRFor questions on any Littlite product contact: Littlite/ LLC, P. O. Box 430, Hamburg, MI 48139-0430PH810-231-9373orFAX810-231-1631,******************,Limited Lifetime Warranty Made in the USA Copyright Littlite LLC 2006 Publication #28-1024 6/2006This information is accurate to the best of our knowledge. Please consult your owner's manual.。

Moxa DA-820系列3U电脑机，Intel 3rd Gen Core CPU，IEC-6185

DA-820SeriesIntel®3rd Gen Core™CPU,IEC-61850,3U rackmount computer with PRP/HSR card supportFeatures and Benefits•IEC61850-3,IEEE1613,and IEC60255compliant for power substationautomation systems•Intel®Celeron™/Intel®Core™i3and i7CPU and QM77chipset•1CFast slot for the OS and4SATA III slots for storage expansion(supportsIntel®RST RAID0/1/5/10)•6USB2.0ports for high-speed peripherals•3PCIe x1slots and2PCI slots for expansion modules•1PCIe x16slot for an additional video card•Highly reliable design,supporting dual power and PRP/HSR technology(withPRP/HSR expansion module)•Onboard TPM module for enhanced cybersecurityCertificationsIntroductionThe DA-820Series is based on the Intel®Celeron™/Intel®Core™i3or i7CPU,and QM77chipset,which supports the standard x86OS and comes with2VGA ports,6USB ports,4Gigabit LAN ports,and23-in-1RS-232/422/485serial ports.The DA-820is equipped with a4SATA disk interface and supports RAID0/1/5/10functionality.The DA-820is specifically designed for substation applications that require precise time synchronization and adherence to the IEC61850-3standards.The flexible design makes the DA-820suitable for local SCADA,environmental monitoring,video surveillance,protocol conversion,and PRP/HSR redundancy applications.In addition,the cybersecurity functions make the DA-820an ideal solution for secure network communication applications.The DA-820complies with the IEC60255standard to enable the protection of electrical relays in a smart substation.IEC60255is one of the most widely used standards for testing relays and protection equipment,and compliance ensures that the DA-820will work reliably and seamlessly with IEDs(intelligent electronic devices)as a part of a robust substation automation system.The housing is a standard3U,19-inch wide,rack-mountable rugged enclosure.This robust,rack-mountable design provides the hardened protection needed for industrial environment applications.Smart Recovery FunctionThe DA-820’s Smart Recovery function makes it easy to troubleshoot system software errors on computers to minimize downtime.Engineers who are experts in a particular vertical market may not have enough computer domain knowledge to know how to fix operating system problems.Moxa Smart Recovery™is an automated BIOS-level recovery system tool that allows engineers to automatically trigger OS recovery to minimize downtime.Proactive Monitoring FunctionMoxa Proactive Monitoring is a small-footprint,resource-friendly,easy-to-use utility that allows users to track a number of system parameters. Users can view the current parameter values for these key parts by simply clicking on the icons corresponding to the parameters in the user er-defined key part indicators(KPIs)are used to monitor the computer’s key parts.Visible and/or audio alerts are triggered automatically via relay and SNMP traps when these KPIs exceed their preset threshold values,making it extremely convenient for operators to avoid system downtime by setting up predictive maintenance tasks well in advance.AppearanceFront View Rear ViewSpecificationsComputerCPU Intel®Celeron®Processor1047UE(2M cache,1.40GHz)Intel®Core™i3-3217UE Processor(3M cache,1.6GHz)Intel®Core™i7-3555LE Processor(4M cache,up to3.20GHz)Intel®Core™i7-3612QE Processor(6M cache,up to3.10GHz)System Chipset Mobile Intel®QM77Express ChipsetGraphics Controller Intel®HD Graphics4000(integrated)System Memory Slot SODIMM DDR3/DDR3L slot x2DRAM16GB max.capacity(204-pin SODIMM x2,each supporting unbuffered ECC DDR3memory at1333and1600MT/s and8GB maximum per module)Supported OS Windows7Pro for Embedded SystemsWindows Embedded Standard7(WS7P)64-bitLinux Debian7Note:OS available by CTOSStorage Slot 2.5-inch HDD/SSD slots x4CFast slot x1Computer InterfaceEthernet Ports Auto-sensing10/100/1000Mbps ports(RJ45connector)x4Serial Ports RS-232/422/485ports x2,software selectable(DB9male)USB2.0USB2.0hosts x6,type-A connectorsExpansion Slots PCIe x1slots x3PCIe x16slot x1PCI slots x2Video Input VGA x2,15-pin D-sub connector(female)LED IndicatorsSystem Power x1Storage x1Programmable x8LAN8per port(10/100/1000Mbps)Serial2per port(Tx,Rx)Serial InterfaceBaudrate50bps to115.2kbpsConnector DB9maleESD8kV(level4)Isolation2kVSerial Standards RS-232/422/485Surge2kVSerial SignalsRS-232TxD,RxD,RTS,CTS,DTR,DSR,DCD,GND RS-422Tx+,Tx-,Rx+,Rx-,GNDRS-485-2w Data+,Data-,GNDRS-485-4w Tx+,Tx-,Rx+,Rx-,GNDPower ParametersPower Button Reset button(front panel)ON/OFF(rear panel)Power Consumption60W(max.)Physical CharacteristicsHousing MetalDimensions(without ears)361x440x133mm(14.23x17.32x5.24in) Weight14,000g(31.11lb)Installation19-inch rack mountingEnvironmental LimitsOperating Temperature Standard Models:-40to60°C(-40to140°F)Wide Temp.Models:-40to75°C(-40to167°F) Storage Temperature(package included)-40to85°C(-40to185°F)Ambient Relative Humidity5to95%(non-condensing)Standards and CertificationsEMC EN61000-6-2/-6-4EMI CISPR32,FCC Part15B Class AEMS IEC61000-4-11DIPsIEC61000-4-2ESD:Contact:8kV;Air:15kVIEC61000-4-3RS:80MHz to1GHz:10V/mIEC61000-4-4EFT:Power:4kV;Signal:4kVIEC61000-4-5Surge:Power:4kV;Signal:4kVIEC61000-4-6CS:10VIEC61000-4-8:20A/mPower Substation IEC61850-3,IEEE1613Protection Relay IEC60255Safety EN60950-1,IEC60950-1,UL60950-1Shock IEC60068-2-27,IEC60870-2-2,IEC61850-3Edition1.0 DeclarationGreen Product RoHS,CRoHS,WEEEMTBFTime DA-820-C1-SP-HV-T:193,537hrsDA-820-C1-DP-HV-T:222,207hrsDA-820-C1-SP-LV-T:283,281hrsDA-820-C1-DP-LV-T:288,116hrsDA-820-C3-SP-HV-T:193,537hrsDA-820-C3-DP-HV-T:222,207hrsDA-820-C3-SP-LV-T:283,281hrsDA-820-C3-DP-LV-T:288,116hrsDA-820-C7-SP-HV-T:191,570hrsDA-820-C7-DP-HV-T:219,618hrsDA-820-C7-SP-LV-T:240,015hrsDA-820-C7-DP-LV-T:285,508hrsDA-820-C8-SP-HV:172,182hrsDA-820-C8-DP-HV:194,509hrsDA-820-C8-SP-LV:240,015hrsDA-820-C8-DP-LV:285,508hrsStandards Telcordia(Bellcore)Standard TR/SRWarrantyWarranty Period3yearsDetails See /warrantyPackage ContentsDevice1x DA-820Series computerInstallation Kit1x rack-mounting earDocumentation1x quick installation guide1x warranty cardNote This product requires additional modules(sold separately)to function. DimensionsOrdering InformationDA-820-C8-SP-HV i7-3612QE Single✓–-40to60°C DA-820-C8-DP-HV i7-3612QE Dual✓–-40to60°C DA-820-C8-SP-LV i7-3612QE Single–✓-40to60°C DA-820-C8-DP-LV i7-3612QE Dual–✓-40to60°C DA-820-C7-SP-HV i7-3555LE Single✓–-40to60°C DA-820-C7-SP-HV-T i7-3555LE Single✓–-40to75°C DA-820-C7-DP-HV i7-3555LE Dual✓–-40to60°C DA-820-C7-DP-HV-T i7-3555LE Dual✓–-40to75°C DA-820-C7-SP-LV-T i7-3555LE Single–✓-40to75°C DA-820-C7-DP-LV-T i7-3555LE Dual–✓-40to75°C DA-820-C3-SP-HV-T i3-3217UE Single✓–-40to75°C DA-820-C3-DP-HV-T i3-3217UE Dual✓–-40to75°C DA-820-C3-SP-LV-T i3-3217UE Single–✓-40to75°C DA-820-C3-DP-LV-T i3-3217UE Dual–✓-40to75°C DA-820-C1-SP-HV-T Celeron1047UE Single✓–-40to75°C DA-820-C1-DP-HV-T Celeron1047UE Dual✓–-40to75°C DA-820-C1-SP-LV-T Celeron1047UE Single–✓-40to75°C DA-820-C1-DP-LV-T Celeron1047UE Dual–✓-40to75°C Accessories(sold separately)Expansion ModulesDA-IRIG-B-S-02-T IRIG-B expansion module,PCI interface,1fiber IRIG-B in,1DB9M in/out,1DB9M outDA-IRIG-B-S-04-T IRIG-B expansion module,PCI interface,1fiber IRIG-B in,1DB9M in/out,3DB9M outDA-PRP-HSR2-port Gigabit Ethernet expansion module compliant with IEC62439-3protocol for DA-820Seriesindustrial computersDE-GX02-SFP-T2-port1000Mbps fiber card,SFP slot x2,PCIe interface(SFP module excluded)DE-FX02-SFP-T2-port100Mbps fiber card,SFP slot x2,PCIe interface(SFP module excluded)CablesCBL-RG58AUBNCMF9-150DB9female to BNC male cable for the DA-IRIG-B-S-02-T and DA-IRIG-B-S-04-T,1.5m ConnectorsMini DB9F-to-TB DB9female to terminal block connectorStorage KitsFAN-KIT-82001DA-820HDD/SSD kit with heat dissipation vent for heat dispatch and lock for securityFAN-KIT-82002DA-820HDD/SSD kit with heat dissipation vent for heat dispatch(lock not included)HDD-DOOR-LOCK-82001DA-820HDD/SSD kit with lock for securityUSB Dongle KitsUSB Dongle Kit Internal USB dongle kit installation packageThermal KitsDDR3-THERMAL-KIT-82001DDR3SDRAM thermal kit©Moxa Inc.All rights reserved.Updated Feb21,2020.This document and any portion thereof may not be reproduced or used in any manner whatsoever without the express written permission of Moxa Inc.Product specifications subject to change without notice.Visit our website for the most up-to-date product information.。

2015年笔记本配置参数

配置名称
配置级别
建议价格
配置参数说明是否能旋转 :否;触摸屏:否;尺寸:14寸;分辨率: ≥1366*768;操作系统:正版操作系统;电池:≥6 芯;电脑包:黑色;服务支持:售后服务标准必须与该产品出厂市场标准服务一致,同时还应包括:≥ 3年5*8小时技术支持服务；2小时电话响应，故障报修后第二个工作日现场服务；两个工作日解决问题，否则在三个工作日内提供备机,免费送货到中央单位指定的地点。;重量:<2.4KG;CPU(intel AMD 对应):核心数:≥I3 双核或同档次AMD CPU、主频:≥2.0GHz、缓存类型:三级缓存、缓存容量:≥3M;硬盘:容量:≥320G 、硬盘-接口类型:SATA、硬盘-缓存:≥8M、转速: ≥5400转;内存:内存-容量:≥4G、频率:≥DDRIII 、内存插槽数量:≥2;显卡:显卡-类型:集成显卡;光驱:光驱-类型:DVDRW、光驱-接口:SATA;网卡:无线网卡:支持、有线网卡:10/100/1000M自适是否能旋转 :否;触摸屏:否;尺寸:14寸;分辨率: ≥1366*768;操作系统:正版操作系统;电池:≥6 芯;电脑包:黑色;服务支持:售后服务标准必须与该产品出厂市场标准服务一致,同时还应包括:≥ 3年5*8小时技术支持服务；2小时电话响应，故障报修后第二个工作日现场服务；两个工作日解决问题，否则在三个工作日内提供备机,免费送货到中央单位指定的地点。;重量:<2.4KG;CPU(intel AMD 对应):核心数:≥I5 双核或同档次AMD CPU、主频:≥2.2GHz、缓存类型:三级缓存、缓存容量:≥3M;硬盘:容量:≥500G 、硬盘-接口类型:SATA、硬盘-缓存:≥8M、转速:≥5400转;内存:内存-容量:≥4G、频率:≥ DDRIII、内存插槽数量:≥2;显卡:显卡-类型:独立显卡、显存容量:≥1G;光驱:光驱- 类型:DVDRW 、光驱-接口:SATA;网卡:无线网卡:支持、有线网是否能旋转 :否;触摸屏:否;尺寸:11.5寸-12.5 寸;分辨率:≥1366*768;操作系统:正版操作系统; 电池:≥6芯;电脑包:黑色;服务支持:售后服务标准必须与该产品出厂市场标准服务一致,同时还应包括:≥3年5*8小时技术支持服务；2小时电话响应，故障报修后第二个工作日现场服务；两个工作日解决问题，否则在三个工作日内提供备机, 免费送货到中央单位指定的地点。;重量:<2.4KG;CPU(intel AMD 对应):核心数:≥I5 双核或同档次AMD CPU、主频:≥1.6GHz、缓存类型:三级缓存、缓存容量:≥3M;硬盘:容量:≥500G 、硬盘-接口类型:SATA、硬盘-缓存:≥8M、转速:≥5400转;内存:内存-容量:≥4G、频率:≥ DDRIII、内存插槽数量:≥2;显卡:显卡-类型:集成显卡;光驱:光驱-类型:DVDRW、光驱-接口:SATA;网卡:无线网卡:支持、有线网

NVIDIA显卡发展史

NVIDIA显卡发展史
注：
1.本表包含了NVIDIA从发展初期至现在所能查询到的全部产品型号和主要参数，包括移动版产品；
2.本表只列出民用显卡的参数，由于专业显卡的应用面和市场份额极小，因此未涉及专业显卡；
3.表中所有参数均为NVIDIA官方公版参数，与显卡厂商自行生产的显卡参数可能会有较大的不同，主要体现在频率及功耗上；
4.以绿色字体标注的型号代表移动版显卡，用于笔记本或其他移动图形设备中；
5.以红色字体标注的型号代表曾经出现在NVIDIA产品计划中，但最终由于各种原因取消生产计划或未能上市的产品；
6.由于涉及的显卡型号众多，参数纷繁复杂，加之很多产品年代过于久远，资料匮乏，因此并不能保证参数的绝对准确以及未遗漏部分型号；。

08年初集成芯片组消费点评

08年初集成芯片组消费点评MGA950 MGA3100 GF7150/7050/7025 X1250 HD3200 GF8200各种集成显卡详细参数2008年03月15日星期六 04:36【市场导购】春节已经过去不少时候，踏入二月末三月初，又是DIY 市场季节繁荣的时期，这段时间的消费客户多以学生玩家为主，相应的主流市场消费层次也被定为在中低端平台产品，而今年由于A780G、MCP78等一系列新一代DX10集成芯片组的加入，集成平台市场成为真正的关注焦点。

既然今年性能强大的DX10集成GPU平台吹捧的如此红火，是否表示我们玩家也应该在赶上时代步伐挑选全新的DX10集显平台？是否意味着我们就该彻底遗忘老一代的DX9.0系列平台产品？简单的答案没有说服力，或许我们该遍历一下目前市面市售集成平台芯片组列表以上是目前市面上主流的集成平台核心产品列表，我们简单将它们分为Intel、AMD平台两大类，每类下分DX9.0、DX10两类，我们可以看到，在Intel 平台方面是没有可以提供DX10支持的平台的。

要在这众多的芯片之间做出抉择，自然需要一定的标准，先看看我们的标准是什么：平台基础应用：基本办公学习应用、游戏、高清视频支持第一：基础应用，看看课件、处理文件图片、上网冲浪、各类工具型软件应用等，这是最常规的办公学习以及家庭应用，这一条基本上所有平台都能够满足第二：游戏，从最基本的蜘蛛纸牌、休闲类小游戏、到各类3D网游、单机游戏应用；这一部分对平台显示性能要求最苛刻，根据设计规模的不同、其对GPU 等级的要求也完全不同，而目前许多类如极品飞车、孤岛危机一类需要大量贴图，高精度渲染的顶级游戏，不是一般集成GPU平台可以应付的。

第三：相比游戏，GPU在高清视频这一方面的应用还不算太长，但发展速度以及普及深度却毫不逊色。

随着视频规格的不断优化，视频对平台解码技术的要求也越来越高。

与游戏一样，类如1080i/1080P一类高规格视频，同样不是一般集成GPU平台可以应付的。