移动电源2A手机充电芯片

Integrated Charger/Boost Convertor with Power Path ControlFeaturesAdaptor Input Detection and Power Path Control Built-in 90m Ω Power Switch for Power Path ControlAdapter Input Over-Voltage ProtectionHigh Accuracy Switching Charger for 1 Cell Li-lon battery with Internal Compensation±0.5% Accuracy Battery Charger Output Voltage Charger Status Flag OutputAdapter Input Current Limit Controller with Built-in Current Sense ResistorTrickle Charging and Defective Battery Detec-tionHigh Efficiency Synchronous Boost Convertor Adjustable Output of Boost ConvertorEnable and Current Limit Control Pin for Boost Convertor.Output Short Circuit Protection for Boost Con-vertorAvailable for 4.2V/4.3V/4.35V Charge Voltage SettingAvailable for 2A/1.5A Charge CurrentSOP-8 (FD) PackageApplicationsMobile Battery BankGeneral DescriptionG5214 is an integrated charger/boost convertor with power path control for 1 cell Li-lon battery bank. The power path controller detects adapter input and control internal power switch of power path with over-voltage and over-current protection.The system operates in charger mode when adapter plug in. Charge current, battery voltage and adapter input current limit are regulated by constant off time buck controller with internal power MOSFET. The sys-tem enters trickle charge if battery voltage is too low. The charging stops if defective battery is detected. Charge Voltage has 2 options, 4.35V and 4.2V. Charge Current has 2 options, 2A and 1.5A. FLAG output indicates the charger status.The system operates in boost mode if adapter is absent and battery voltage is high enough. The output voltage is adjustable by external resistors with over current and short circuit protection. A 3-levels logic control the on/off and over-current of boost convertor.Ordering InformationORDER NUMBERMARKINGCHARGE CurrentCHARGE Voltage TEMP. RANGE PACKAGE (Green)G5214AF11U G5214A 2A 4.35V -40°C to +85°C SOP-8 (FD) G5214CF11U G5214C 2A 4.2V -40°C to +85°C SOP-8 (FD) G5214DF11U G5214D 1.5A 4.35V -40°C to +85°C SOP-8(FD) G5214FF11U G5214F 1.5A4.2V -40°C to +85°C SOP-8 (FD)Note: F1:SOP-8 (FD) 1: Bonding CodeU: Tape & ReelPin ConfigurationVADPVSYS EN/OCLX CSIP SOP-8 (FD)VBAT FLAGBTFB Note: Connect the thermal PAD to GND for proper function and excellent power dissipationAbsolute Maximum RatingsSupply Voltage (ADP to GND) . . . . . . . . .-0.3V to 6.5V Supply Voltage (ADP to GND, <30µS pulse ). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .-0.3V to 9V Supply Voltage (VSYS, VBAT to GND) . . . -0.3V to 6V CSIP to GND . . . . . . . . . . . . . . . . . . . . -0.3V to 6V LX to GND . . . . . . . . . . . . . . . . . . -0.5V to VSYS+0.5V Other Pins to GND. . . . . . . . . . . . . . . . . . . .-0.3V to 6V Thermal Resistance Junction to Ambient, (θJA )SOP-8 (FD) . . . . . . . . . . . . . . . . . . . . . . .132°C/W (1) SOP-8 (FD) (1in 2). . . . . . . . . . . . . . . . . . . . 108°C/W (2) Continuous Power Dissipation (T A = +25°C)SOP-8 (FD) . . . . . . . . . . . . . . . . . . . . . . .0.9W (1) SOP-8 (FD) (1in 2). . . . . . . . . . . . . . . . . . . . . . .1.2W (2) Thermal Resistance Junction to Case, (θJC )SOP-8 (FD) . . . . . . . . . . . . . . . . . . . . . . . . . . . 12°C/WStorage Temperature . . . . . . . . . . . . -65°C to +150°C Junction Temperature . . . . . . . . . . . . -10°C to +150°C Reflow Temperature (soldering, 10sec) . . . . . . .260°C ESD Protection (Human Body Mode) . . . . . . . . . . .2kVRecommended Operation ConditionsSupply Voltage (ADP to GND) . . . . . . . 4.8V to 5.5V Supply Voltage (VBAT to GND) . . . . . . .3V to 4.2V Operation Temperature (T A ) . . . . . . . -40°C to +85°CStress beyond those listed under “Absolute Maximum Ratings ” may cause permanent damage to the device.Note: (1): Please refer to Minimum Footprint PCB Layout Section. (2): Please refer to 1in 2 of 1oz PCB Layout Section.Electrical CharacteristicsADP =5V, V BAT =3.7V, T A =25°C, unless otherwise noted.The device is not guaranteed to function outside its operating conditions. Parameters with MIN and/or MAX limits are 100% tested at +25°C, unless otherwise specified.PARAMETER CONDITION MIN TYP MAX UNITSBattery Quiescent Current I VSYS =0 --- 500 700 µAVBAT=2.5V, Boost Convertor Stops --- 20 30 Battery Leakage CurrentVBAT=3.7V, Pull EN/OC low to shutdown--- 35 45 µAVBAT Rising2.62.752.9VBAT UVLO/ Trickle Charge ThresholdVBAT Falling 2.5 2.65 2.8VSwitch from VADP to VSYS --- 90 100m Ω Switch from VSYS to LX, V SYS =5V ---44 52 m Ω On-Resistance of Switches Switch from LX to GND, V SYS =5V --- 39 45 m Ω VSYS Short Circuit Blanking Time263443msVSYS Short Circuit Auto-Restart Time 177 238 300 msEN/OC input high threshold 4.5 --- ---EN/OC input low threshold --- --- 0.3 EN/OC Threshold EN/OC floating logic threshold 1.1 --- 3 V FLAG On Resistance ADP=5V---18 40 Ω FLAG Pin LeakageFLAG=6V--- 0.1 0.5 µA Thermal Shutdown Threshold Temperature Rising --- 150 --- °C Thermal Shutdown Hysteresis---25---°CAdapter Power Path Control ADP rising 4.65 4.74 4.83 V Adapter Power Good Threshold ADP falling 4.47 4.56 4.64 V ADP rising5.856.02 6.2 V Adapter OVP Threshold ADP falling 5.65 5.78 5.93 V G5214A/B/C, VSYS =0V 2.3 2.6 3.1Current Limit of Power SwitchG5214D/E/F, VSYS =0V1.82.1 2.6AElectrical Characteristics (continued)PARAMETER CONDITIONMINTYPMAX UNITSBOOST CONVERTORBTFB Output Voltage VBAT=3.0V~4.2V, I VSYS=0~2A 0.59 0.61 0.63VVSYS Short Current Limit VBAT>VSYS, R SNS=10mΩ, EN/OC floating 2.1 2.5 2.7 AReduction VSYS Short Current Limit VBAT>VSYS, R SNS=10mΩ, EN/OC input high 1.4 1.69 1.83 AVBAT=3.7V, EN/OC floating, R SNS=10mΩ 5.35 6.05 6.44VBAT=4.2V, EN/OC floating, R SNS=10mΩ 3.91 4.60 5.42Normal Inductor Peak Current LimitVBAT=3.0V, EN/OC floating, R SNS=10mΩ 5.42 6.40 7.49AVBAT=3.7V, EN/OC input high, R SNS=10mΩ 4.30 4.80 5.10VBAT=4.2V, EN/OC input high, R SNS=10mΩ 3.35 3.75 4.25Reduction Inductor Peak Current LimitVBAT=3.0V, EN/OC input high, R SNS=10mΩ 4.36 5.10 6.00AVBAT= 3.7V 1.2471.4341.649VBAT= 4.2V 1.421.6321.877Off-TimeVBAT=3V 1.0211.1641.339µsMinimum Off-Time --- 250 --- nsBoost Convertor OVP Threshold VSYS rising, reference to the normal boostoutput5 8 11 %Current Threshold of Asynchronous Converting R SNS=10mΩ100 150 300mASoft Start Time VBAT=3.7V, VSYS Rising to 4.8V --- 1 --- msBattery ChargerG5214C/F 4.1794.24.221Battery Charge Voltage AccuracyG5214A/D 4.328 4.35 4.372VG5214A/C, RSNS=10mΩ 1.83 2 2.17Charge Current AccuracyG5214D/F, RSNS=10mΩ 1.37 1.5 1.63AG5214A/C, RSNS=10mΩ110 250 350Trickle Charge Current AccuracyG5214D/F, RSNS=10mΩ80 200 300mAG5214A/C 1.822.3 Adapter Current Limit AccuracyG5214D/F 1.31.51.8AVSYS=5V, VBAT=3.7V 0.543 0.621 0.714VSYS=5V, VBAT=4.2V 0.329 0.379 0.436Off-TimeVSYS=5V, VBAT=2V 1.243 1.429 1.643µsMinimum Off-Time --- 250 --- nsDead Battery Detection Timeout Period 15415 17728 20387SVBAT rising, reference to the charge voltage 3.88 4 4.12Battery OVP ThresholdVBAT falling, reference to the charge voltage 2.43 2.5 2.58%Current Threshold of Asynchronous Converting R SNS=10mΩ-100 146 270mAMinimum Footprint PCB Layout SectionSOP-8 (FD)1in of 1oz PCB Layout SectionSOP-8 (FD)PIN NAMEPIN FUNCTION1 EN/OC Leave the pin floating set normal operating of boost convertor. Connect this pin to VBAT setthe current limit of boost convertor to 3/4 of normal value. Connect this pin to GND to shutdown the boost convertor.2 LX Connect the pin to output inductor.3 VSYS System output. Connect 33µFX2 capacitors to GND. 4VADPAC adapter input. Connect a capacitor to GND.5 FLAGCharger status indicator, open-drain output. The output is pulled low if the system is in charg-ing mode and battery is not fully charged. 6 BTFB Connect 2 resistors in series from VSYS to BTFB to GND to set the boost output votage 7 VBAT Battery input. Connect 20µF capacitors to GND. 8CSIPCurrent detection input.9 GND GroundBlock DiagramFunction DescriptionG5214 detects the plug-in of adapter, turns on power switch and decides boost/charging mode of the sys-tem automatically. If adapter is absent and battery voltage is high enough, the power switch is turned off and G5214 is in boost mode, the boost converter out-puts to system output source from battery. The power switch is turned on after adapter is plugged-in and detected. G5214 turns into charger mode after the power switch is fully turned on. In charger mode, sys-tem output is directly supply from adapter via the power switch, and the charger convertor supply charging current to the battery from system output. There are several protections of power path, boost convertor and charger convertor.Power Path ControlAdapter is detected if VADP is larger than power good threshold (4.74V with hysteresis) and smaller than OVP threshold (5.78V with hysteresis). After the de-tection of adapter, the power switch between VSYS and VADP turns on. The gate of NMOS switch rises slowly to minimize surge current of adapter. There is over-current protection for the power switch. If over-load occurs on VSYS, the switch gate is lowered down to keep the current flow through the switch in current limit to protect adapter and the switch.When adapter input OVP is detected, the power switch is shutdown immediately to keep VSYS below normal voltage range to protect the devices connected to VSYS from damaged by high voltage.After the gate of power switch rises high enough and no abnormal event is detected. The system gets into charger mode. If system isn’t in charger mode and the battery voltage is higher than VBAT UVLO threshold, the system operates in boost mode, otherwise the system is shutdown.Boost ConvertorIn boost mode, VSYS is boosted to the voltage setting by external resistors connected from VSYS to BTFB to GND. The BTFB pin is regulated to 0.61V. The con-troller of boost is constant off-time and the off-time is calculated by VSYS and VBAT to keep the switching frequency near 500kHz. Internal soft-start controls the rising time of VSYS output to about 1ms. There is OVP function of boost output.Boost convertor has current limit functions. If VSYS is lower than VBAT, the inductor current is limited to 2.5A. If VSYS is larger than VBAT, G5214 performs cycle by cycle peak inductor current limit. The current limit value is inversely proportion to VBAT, that makes output current limit changes slightly versus battery voltage.EN/OC pin controls the operation of boost convertor. The current limit is set to 3/4 of normal value when EN/OC is connected to VBAT. The boost convertor is shut down if EN/OC pin is pulled to GND. Leave the pin floating for normal operation.Charger ConvertorIn charger mode, adapter is connected to VSYS as the power of charger for 1 cell Li-lon battery. The system controls the battery voltage to 4.35V, 4.3V or 4.2V for G5214A/G5214D and G5214CG5214F, respectively. The charging current is lower down if adapter current is larger than a preset level. The current limit of total adapter current is 2A or 1.5A and current is sensed by internal resistor. The controller is constant off-time and the off-time is calculated by VSYS and VBAT to keep the switching frequency near 700kHz. The charger convertor is internal compensated.If battery voltage is below the UVLO threshold, the system is trickle charged with 15% of the normal charging current. The battery is determined as dead battery if battery voltage keeps under the UVLO threshold for over 17728S.G5214 has over-voltage protection for charger. The high and low side switched are turned off immediately if battery voltage goes over 4% of normal battery volt-age setting.The charge current is 2A or 1.5A. The adapter current is also limited to 2A or 1.5A. The current limits of power switch is 2.6A or 2.1A.Over-Current ProtectionsThe over-current protection of VSYS pin is auto-restart mode. If any of VSYS OCP event occurs (OCP of power switch or boost convertor) and lasting over 34ms, the system shutdown for 238ms and re-start again. The function keep the system temperature low even if VSYS is short. G5214 also have over-temperature protection. The whole system is shutdown if temperature rises over 150°C.Charger Status FlagWhen G5214 operates in charging mode, FLAG out-puts low if the battery is not fully charged. The FLAG pin outputs high impedance if system is not in charg-ing or the battery is fully charged.Application InformationInductor SelectionInductance between 3.3µH and 10µH is recommended. The RHZ is lower with large inductance. Select smaller inductance with larger VSYS capacitance to enlarge system bandwidth with the same output ripples at boost mode. It’s important to select inductor with maximum current to avoid saturation. Check both charger mode and boost mode for peak current.VSYS Capacitor SelectionThe recommended value of this capacitors is 33µFX2. This value maintain the boost controller loop at proper bandwidth with sufficient phase margin.VBAT Capacitor SelectionConnect 20µF capacitor to maintain charger loop sta-bility and serve as input capacitor at boost mode. Current Sense Resistor SelectionThe charging current and current limit at boost mode are inverse proportion to R SNS. Select 10mΩR SNS for proper current setting. To maintain stability of charger loop, 10mΩ or larger R SNS is recommanded.PCB Layout ConsiderationsSignal Ground and Power Ground ConnectionAt minimum, a reasonably large area of copper, which will shield other noise couplings through the IC, should be used as signal ground beneath the IC. The best tie-point between the signal ground and the power ground is at the negative side of the output capacitor on each side, where there is little noise; a noisy trace beneath the IC is not recommended.LX PinThis trace should be short, and positioned away from other weak signal traces. This node is noisy and has high voltage swing. No trace should be in parallel with it.CSIP, VBAT PinsThese pins is used as the battery voltage and inductor current feedback. The traces should be away from the noisy pins like LX. In general, the current sense resis-tor R SNS should be close to the IC.Copper Size for the LX NodeThe capacitance of LX should be kept very low to minimize ringing. It would be best to limit the size of the LX node copper.Exposed PADIt’s highly recommended to add larger copper to ex-posed PAD connected to signal ground. At high cur-rent operation, the power consumption is high. Large copper to exposed PAD decrease thermal resistance much.Package InformationSOP- 8 (FD) PackageTaping SpecificationPACKAGE Q ’TY/REELSOP-8 (FD)2,500 eaGMT Inc. does not assume any responsibility for use of any circuitry described, no circuit patent licenses are implied and GMT Inc. reserves the right at any time without notice to change said circuitry and specifications.。