PCB字典(电路板词汇整理)教育训练教材

*Process Module 說明:A.下料( Cut Lamination)a-1 裁板( Sheets Cutting)

a-2 原物料發料(Panel)(Shear material to Size)B.鑽孔(Drilling)

b-1 內鑽(Inner Layer Drilling )b-2 一次孔(Outer Layer Drilling )b-3 二次孔(2nd Drilling)

b-4 雷射鑽孔(Laser Drilling )(Laser Ablation )b-5 盲(埋)孔鑽孔(Blind & Buried Hole Drilling)C.乾膜製程( Photo Process(D/F))c-1 前處理(Pretreatment)c-2 壓膜(Dry Film Lamination)c-3 曝光(Exposure)c-4 顯影(Developing)c-5 蝕銅(Etching)c-6 去膜(Stripping)c-7 初檢( Touch-up)

c-8 化學前處理,化學研磨( Chemical Milling )

c-9 選擇性浸金壓膜(Selective Gold Dry Film Lamination)c-10 顯影(Developing )c-11 去膜(Stripping )D.壓合Lamination

d-1 黑化(Black Oxide Treatment)d-2 微蝕

(Microetching)

D eveloping ,

E tching & S tripping ( DES )

d-3 鉚釘組合(eyelet )

d-4 疊板(Lay up)

d-5 壓合(Lamination)

d-6 後處理(Post Treatment)

d-7 黑氧化( Black Oxide Removal )

d-8 銑靶(spot face)

d-9 去溢膠(resin flush removal)

E.減銅(Copper Reduction)

e-1 薄化銅(Copper Reduction)

F.電鍍(Horizontal Electrolytic Plating)

f-1 水平電鍍(Horizontal Electro-Plating) (Panel Plating) f-2 錫鉛電鍍( Tin-Lead Plating ) (Pattern Plating)

f-3 低於1 mil ( Less than 1 mil Thickness )

f-4 高於1 mil ( More than 1 mil Thickness)

f-5 砂帶研磨(Belt Sanding)

f-6 剝錫鉛( Tin-Lead Stripping)

f-7 微切片( Microsection)

G.塞孔(Plug Hole)

g-1 印刷( Ink Print )

g-2 預烤(Precure)

g-3 表面刷磨(Scrub)

g-4 後烘烤(Postcure)

H.防焊(綠漆): (Solder Mask)

h-1 C面印刷(Printing Top Side)

h-2 S面印刷(Printing Bottom Side)

h-3 靜電噴塗(Spray Coating)

h-4 前處理(Pretreatment)

h-5 預烤(Precure)

h-6 曝光(Exposure)

h-7 顯影(Develop)

h-8 後烘烤(Postcure)

h-9 UV烘烤(UV Cure)

h-10 文字印刷( Printing of Legend )

h-11 噴砂( Pumice)(Wet Blasting)

h-12 印可剝離防焊(Peelable Solder Mask)

I . 鍍金Gold plating

i-1 金手指鍍鎳金( Gold Finger )

i-2 電鍍軟金(Soft Ni/Au Plating)

i-3 浸鎳金( Immersion Ni/Au) (Electroless Ni/Au)

J.噴錫(Hot Air Solder Leveling)

j-1 水平噴錫(Horizontal Hot Air Solder Leveling)

j-2 垂直噴錫( Vertical Hot Air Solder Leveling)

j-3 超級焊錫(Super Solder )

j-4. 印焊錫突點(Solder Bump)

K.成型(Profile)(Form)

k-1 撈型(N/C Routing ) (Milling)

k-2 模具沖(Punch)

k-3 板面清洗烘烤(Cleaning & Backing)

k-4 V型槽( V-Cut)(V-Scoring)

k-5 金手指斜邊( Beveling of G/F)

L.短斷路測試(Electrical Testing) (Continuity & Insulation Testing) l-1 AOI 光學檢查( AOI Inspection)

l-2 VRS 目檢(Verified & Repaired)

l-3 汎用型治具測試(Universal Tester)

l-4 專用治具測試(Dedicated Tester)

l-5 飛針測試(Flying Probe)

M.終檢( Final Visual Inspection)

m-1 壓板翹( Warpage Remove)

m-2 X-OUT 印刷(X-Out Marking)

m-3 包裝及出貨(Packing & shipping)