倒装焊工艺(bumping)
- 1、下载文档前请自行甄别文档内容的完整性，平台不提供额外的编辑、内容补充、找答案等附加服务。
- 2、"仅部分预览"的文档,不可在线预览部分如存在完整性等问题,可反馈申请退款(可完整预览的文档不适用该条件!)。
- 3、如文档侵犯您的权益，请联系客服反馈,我们会尽快为您处理(人工客服工作时间：9:00-18:30)。
BUMPING INTRODUCTION
BUMPING INTRODUCTION
Bumping process introduction Domestic Bumping industry
Reflow machine
Wafer bumping: planting ball on wafer pad
Application: advanced package (BGA &WLP&CSP…..)
Wafer bumps
-gold bums
-solder bumps
-plating bumps
-stencil printing bumps
-solder ball attach
Methods of wafer bumping for flip chip
Gold bumping (plated)
Solder bumping (plated)
Gold ball (stud) bumps (gold wire micro weld) Solder ball bumps placement
Stencil Printed solder bumping
Solder bumping process is accomplished in a foundry-like processing setting. The bumps are generally made of lead, tin, or a combination of both.
Solder Bumping process flow
•gold ball bumping is truly an extension of the
wire bonding process.
Wire bonding.Gold (stud) bumps Bumping process introduction
Bumping process introduction Stencil printed solder bumping
Solder ball bumps placement and reflow
Costs of gold ball bumping vs. plating
Domestic Bumping industry 苏州颀中Chipmore
上海宏茂Chipmos
上海安靠Amkor
星科金朋SCC
江阴长电JCAP
苏州晶方WLCSP
中芯国际SMIC
上海宏茂Chipmos & 苏州欣中Chipmore -TCP&COG&COF for LCD Driver IC -Gold bumps
上海安靠Amkor
-put into production
-gold &solder bumping
星科金朋SCC
-Bumping service from TSMC
-Gold +Ni bumping & solder bumping
•JCAP Bumping Services
苏州Shellcase
-Shellcase WLCSP process & Wafer bumping process & TSV WLCSP process
氮气回流焊炉(for WAFER BUMP FORMING) -YAMATO WORKS (120000 USD)
深圳敏科））
系列回流焊炉炉(深圳敏科HELLER 1800EXL系列回流焊
岗）大型全热风无铅回流焊炉-SNR
州圣岗
SNR--845P（苏州圣
大型全热风无铅回流焊炉
SEMIgear GENVEA STP200/300