wire bonding 详细学习资料

TRAJECTORY
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TRAJECTORY
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TRAJECTORY
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TRAJECTORY
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TRAJECTORY
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TRAJECTORY
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2nd Search Height
Search Speed 2 Search Tol 2
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Capillary rises to loop height position
RH
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Formation of a loop
RD (Reverse Distance)
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Formation of a loop
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WIRE CLAMP „CLOSE‟
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Search Speed 2 Search Tol 2
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Search Speed 2 Search Tol 2
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Formation of a second bond
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heat
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Formation of a second bond Contact
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Formation of a second bond Base
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Tail length
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Disconnection of the tail
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Disconnection of the tail
SEARCH TOL 1
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Free air ball is captured in the chamfer
SEARCH SPEED1
SEARCH TOL 1
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Free air ball is captured in the chamfer
SEARCH SPEED1
SEARCH TOL 1
WIRE BOND PROCESS INTRODUCTION
CONTENTS
ASSEMBLY FLOW OF PLASTIC IC Wire Bond 原理 M/C Introduction Wire Bond Process Material SPEC Calculator
X Y Table
•Linear 3 phase AC Servo motor •High power AC Current Amplifier •DSP based control platform •High X-Y positioning accuracy of +/- 1 mm •Resolution of 0.2 mm
THERMAL BONING
Thermal Compressure
Ultrasonic Energy (Power)
Bond Head ASSY
• Low impact force •Real time Bonding Force monitoring • High resolution z-axis position with 2.5 micron per step resolution • Fast contact detection • Suppressed Force vibration • Fast Force response • Fast response voice coil wire clamp
SEARCH SPEED1
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SEARCH TOL 1
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Free air ball is captured in the chamfer
SEARCH SPEED1
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SEARCH TOL 1
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Free air ball is captured in the chamfer
SEARCH SPEED1
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Formation of a new free air ball
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Material
Leadfram Capillary Gold Wire
Leadfram (I)
Leadfram ( II )
CAPILLARY (I)
Capillary Manufacturer
Singulation Solder Plating TRIM/ Dejunk TRIM
SURFACE MOUNTPKG THROUGH
Dejunk TRIM Solder
Packing
HOLE PKG
Plating
FORMING
Wire Bond 原理
Ball Bond Wedge Bond ( 2nd Bond )
Eagle
MACHINE SPECIFICATIONS (II) •Vision System •Pattern Recognition Time 70 ms / point •Pattern Recognition Accuracy + 0.37 um •Lead Locator Detection 12 ms / lead (3 leads/frame) •Lead Locator Accuracy + 2.4 um •Post Bond Inspection First Bond, Second Bond Wire Tracing •Max. Die Level Different 400 – 500 um
W/H ASSY
• changeover •· Fully programmable indexer & tracks •· Motorized window clamp with soft close feature •· Output indexer with leadframe jam protection feature
( 1st Bond )
Gold wire
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B.PRINCIPLE
PRESSURE
VIBRATION
AL2O3
CONTAMINATION
GOLD BALL GLASS Al SiO2
MOISTURE
Si
銲接條件
HARD WELDING Pressure (Force) Amplify & Frequecy Welding Time (Bond Time) Welding Tempature (Heater)
Calculated Wire Length
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Calculated Wire Length
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SEARCH DELAY
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TRAJECTORY
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TRAJECTORY
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TRAJECTORY
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TRAJECTORY
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• Tool less conversion window clamps and top plate enables fast device
Eagle
MACHINE SPECIFICATIONS (I) •Bonding System •Bonding Method Thermosonic (TS) •BQM Mode Constant Current, Voltage, Power and Normal (Programmable) •Loop Type Normal, Low, Square & J •XY Resolution 0.2 um •Z Resolution (capillary travelling motion)2.5 um •Fine Pitch Capability 35 mm pitch @ 0.6 mil wire •No. of Bonding Wires up to 1000 •Program Storage 1000 programs on Hard Disk •Multimode Transducer System Programmable profile, control and vibration modes
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Formation of a first bond
SEARCH SPEED1
SEARCH TOL 1
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Formation of a first bond
IMPACT FORCE
SEARCH SPEED1
SEARCH TOL 1
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Formation of a first bond Contact
NOT INCLUDE DEDICATE LINE
Free air ball is captured in the chamfer
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lead
Free air ball is captured in the chamfer
SEARCH HEIGHT
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Free air ball is captured in the chamfer
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Capillary rises to loop height position
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Capillary rises to loop height position
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Capillary rises to loop height position
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Capillary rises to loop height position
PRESSURE
Ultra
Sonic
Vibration
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heat
lead
Formation of a first bond Base
PRESSURE
Ultra
Sonic
Vibration
pad
heat
lead
Capillary rises to loop height position
pad
•Facilities •Voltage 110 VAC (optional 100/120/200/210/ •220/230/240 VAC
Eagle
MACHINE SPECIFICATIONS (III)
•Material Handling System •Indexing Speed 200 – 250 ms @ 0.5 “ pitch •Indexer Resolution 1um •Leadframe Position Accuracy + 2 mil •Applicable Leadframe W = 17 – 75 mm @ bonding area in Y = 65mm = 17 – 90 mm @ bonding area in Y = 54mm L = 280 mm [Maximum] T = 0.075 – 0.8 mm •Applicable Magazine W = 100 mm (Maximum) L = 140 – 300 mm H = 180 mm (Maximum) •Magazine Pitch 2.4 – 10 mm (0.09” – 0.39 “) •Device Changeover < 4 minutes •Package Changeover < 5 minutes •Number of Buffer Magazine 3 (max. 435 mm)
DEFECT
封裝簡介
晶片Die
金線 Gold Wire 導線架
Lead fram
封裝流程
Wafer GrFra Baidu biblioteknding
Wafer Saw
Die Bonding
toaster
Wire Bonding
Die Surface Coating
Molding
Laser Mark
BGA
Solder Ball Placement
Bonding Process
The Wire Bond Temp
PREHEAT CU L/F200+/-10 BONDSITE 200+/-10
AL L/F210+/-10
BGA 150+/-10
230+/-10
160+/-10 160+/-10 160+/-10
TFBGA150+/-10 LBGA 150+/-10
(SPT, GAISER, PECO, TOTO…)
Capillary Data
( Tip , Hole , CD , FA&OR , IC )
CAPILLARY (II)