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金士顿e MMC 5.1嵌入式多媒体卡（e
Embedded Multi-Media Card(e•MMC™ 5.1)EMMC16G-IB29-PE90EMMC32G-IB29-PE90EMMC64G-IB29-PE90v1.0Product Features•Packaged managed NAND flash memory with e•MMC™ 5.1 interface•Backward compatible with all prior e•MMC™ specification revisions•153-ball JEDEC FBGA RoHS Compliant package•Operating voltage range:o VCCQ = 1.8 V/3.3 Vo VCC = 3.3 V•Operating Temperature (T case) - 40C to +85C•Storage Temperature -55C to +85C•Compliant with e•MMC™ 5.1 JEDEC Standard Number JESD84-B51•Factory configured with pseudo Single Level Cell (pSLC) mode for enhanced reliability and performance•Factory configured with reliable writee•MMC™ Specific Feature Support•High-speed e•MMC™ protocol•Variable clock frequencies of 0-200MHz•Ten-wire bus interface (clock, 1 bit command, 8 bit data bus) with an optional hardware reset •Supports three different data bus widths: 1 bit(default), 4 bits, 8 bits•Bus Modes:o Single data transfer rate: up to 52MB/s (using 8 parallel data lines at 52MHz)o Dual data rate mode (DDR-104) : up to 104MB/s @ 52MHzo High speed, single data rate mode (HS-200) : up to 200MB/s @ 200MHzo High speed, dual data rate mode (HS-400) : up to 400MB/s @ 200MHz•Supports alternate boot operation mode to provide a simple boot sequence methodo Supports SLEEP/AWAKE (CMD5)o Host initiated explicit sleep mode for power saving•Enhanced write protection with permanent and partial protection options•Multiple user data partition with enhanced attribute for increased reliability•Error free memory accesso Cyclic Redundancy Code (CRC) for reliable command and data communicationo Internal error correction code (ECC) for improved data storage integrityo Internal enhanced data management algorithmo Data protection for sudden power failure during program operations•Securityo Secure bad block erase commandso Enhanced write protection with permanent and partial protection options•Power off notification for sleep•Field firmware update (FFU)•Production state awareness•Device health report•Command queuing•Enhanced strobe•Cache flushing report•Cache barrier•Background operation control & High Priority Interrupt (HPI)•RPMB throughput improvement•Secure write protection•Pre EOL information•Optimal sizeProduct DescriptionKingston’s e•MMC™ products conform to the JEDEC e•MMC™ 5.1standard. These devices are an ideal universal storage solution for many commercial and industrial applications. In a single integrated packaged device, e•MMC™ combines triple-level cell (TLC) NAND flash memory with an onboard e•MMC™ controller, providing an industry standard interface to the host system. The integrated e•MMC™ controller directly manages NAND flash media which relieves the host processor of these tasks, including flash media error control, wear-leveling, NAND flash management and performance optimization. Future revision to the JEDEC e•MMC™ standard will always maintain backward compatibility. The industry standard interface to the host processor ensures compatibility across future NAND flash generations as well, easing product sustainment throughout the product life cycle. ConfigurationsKingston’s e•MMC™ products support a variety of configurations that allow the e•MMC™ device to be tailored to your specific application needs. The most popular configurations described below are each offered under standard part numbers.Standard TLC – By default the e•MMC™ device is configured with the NAND flash in a standard TLC mode. This configuration provides reasonable performance and reliability for many applications. Pseudo Single Level Cell (pSLC) – The TLC NAND flash in the Kingston e•MMC™ device can be configured to further improve device endurance, data retention, reliability and performance over the standard TLC configuration. This is done by converting the NAND TLC cells to a pseudo single level cell (SLC) configuration. In this configuration, along with the performance and reliability gains, the device capacity is reduced by 2/3 of the capacity. This one-time configuration is achieved by setting the e•MMC™ enhanced attribute for the hardware partition.Kingston e•MMC™ can be ordered preconfigured with the option of reliable write or pSLC at no additional cost. Standard TLC devices can also be one-time configured in-field by following the procedures outlined in the JEDEC e•MMC™ specification. The JEDEC e•MMC™ specification allows for many additional configurations such as up to 4 additional general purpose (GPn) hardware partitions each with the option to support pSLC and reliable write. Additionally, Kingston provides a content loading service that can streamline your product assembly while reducing production costs. For more information, contact your Kingston representative.Kingston e•MMC™ devices are fully compliant with the JEDEC Standard Specification No. JESD84-B51. This datasheet provides technical specifications for Kingston’s family of e•MMC™ devices. Refer to the JEDEC e•MMC™ standard for specific information related to e•MMC™ device function and operation. See: /sites/default/files/docs/JESD84-B51.pdfe•MMC™ Mode and ControllerTLC mode using PS8229 - Leading edge 3D NAND flash technology in TLC mode rated to 3,000 endurance cycles.- Strong data protection with LDPC Error control- Improved data integrity with end-to-end data protection.pSLC mode using PS8229 - Leading edge 3D NAND flash technology in pSLC mode.- Strong data protection with LDPC Error control- Improved data integrity with end-to-end data protection.Part NumberingFigure 1 – Part Number FormatEMMC 16G - xxxx - PE90A B C DPart Number FieldsA: Product Family : EMMCB: Device Capacity : Available capacities of 16GB – 64GBC: Hardware Revision and ConfigurationD: Device Firmware Revision and ConfigurationTable 1 - Device SummaryDevice PerformanceTable 2 below provides sequential read and write speeds for all capacities. Performance numbers can vary under different operating conditions. Values are given at HS400 bus mode. Contact your Kingston Representative for performance numbers using other bus modes.Power ConsumptionDevice current consumption for various device configurations is defined in the power class fields of the EXT_CSD register. Power consumption values are summarized in Table 3 below.Device and Partition CapacityThe device NAND flash capacity is divided across two boot partitions (2048 KB each), a Replay Protected Memory Block (RPMB) partition (512 KB), and the main user storage area. Four additional general purpose storage partitions can be created from the user partition. These partitions can be factory preconfigured or configured in-field by following the procedure outlined in section 6.2 of the JEDEC e•MMC™ specification JESD84-B51. A small portion of the NAND storage capacity is used for the storage of the onboard controller firmware and mapping tables. Additionally, several NAND blocks are held in reserve to boost performance and extend the life of the e•MMC™ device. Table 4 identifies the specific capacity of each partition. This information is reported in the device EXT_CSD register. The contents of this register are also listed in the Appendix.e•MMC™ Bus ModesKingston e•MMC™ devices support all bus modes defined in the JEDEC e•MMC™ 5.1 specification. These modes are summarized in Table 6 below.Signal DescriptionTable 7 - e•MMC™ Signals Name Type DescriptionCLK I Clock: Each cycle of this signal directs a one bit transfer on the command and either a one bit (1x) or a two bits transfer (2x) on all the data lines. The frequency may vary between zero and the maximum clock frequency.DAT[7:0] I/O/PP Data: These are bidirectional data channels. The DAT signals operate in push-pull mode. These bidirectional signals are driven by either the e•MMC™ device or the host controller. By default, after power up or reset, only DAT0 is used for data transfer. A wider data bus can be configured for data transfer, using either DAT0-DAT3 or DAT0-DAT7, by the e•MMC™ host controller. The e•MMC™ device includes internal pull-ups for data lines DAT1-DAT7. Immediately after entering the 4-bit mode, the device disconnects the internal pull ups of lines DAT1, DAT2, and DAT3. Correspondingly, immediately after entering to the 8-bit mode, the device disconnects the internal pull-ups of lines DAT1–DAT7.CMD I/O/PP/OD Command: This signal is a bidirectional command channel used for device initialization and transfer of commands. The CMD signal has two operation modes: open-drain for initialization mode, and push-pull for fast command transfer. Commands are sent from the e•MMC™ host controller to the e•MMC™ device and responses are sent from the device to the host.DS O This signal is generated by the device and used for output in HS400 mode. The frequency of this signal follows the frequency of CLK. For data output each cycle of this signal directs two bits transfer(2x) on the data - one bit for positive edge and the other bit for negative edge. For CRC status response output and CMD response output (enabled only HS400 enhanced strobe mode), the CRC status and CMD Response are latched on the positive edge only, and don't care on the negative edge.RST_n I Hardware Reset: By default, hardware reset is disabled and must be enabled in the EXT_CSD register if used. Otherwise, it can be left un-connected.RFU - Reserved for future use: These pins are not internally connected. Leave floatingNC - Not Connected: These pins are not internally connected. Signals can be routed through these balls to ease printed circuit board design. See Kingston’s Design Guidelines for further details.VSF - Vendor Specific Function: These pins are not internally connectedVddi - Internal Voltage Node: Note that this is not a power supply input. This pin provides access to the output of an internal voltage regulator to allow for the connection of an external Creg capacitor. See Kingston’s Design Guidelines for further details.Vcc S Supply voltage for core Vccq S Supply voltage for I/ODesign GuidelinesDesign guidelines are outlined in a separate document. Contact your Kingston Representative for more information.Package DimensionsFigure 2 – Package DimensionsFigure 3 – Ball Pattern DimensionsBall Assignment (153 ball)Table 8 – Ball Assignment, Top View (HS400)1 2 3 4 5 6 7 8 9 10 11 12 13 14A NC NC DAT0 DAT1 DAT2 Vss RFU NC NC NC NC NC NC NC AB NC DAT3 DAT4 DAT5 DAT6 DAT7 NC NC NC NC NC NC NC NC BC NC Vddi NC Vssq NC Vccq NC NC NC NC NC NC NC NC CD NC NC NC NC NC NC NC DE NC NC NC RFU Vcc Vss VSF VSF VSF NC NC NC EF NC NC NC Vcc VSF NC NC NC FG NC NC RFU Vss VSF NC NC NC GH NC NC NC DS Vss NC NC NC H J NC NC NC Vss Vcc NC NC NC J K NC NC NC RST_n RFU RFU Vss Vcc VSF NC NC NC K L NC NC NC NC NC NC L M NC NC NC Vccq CMD CLK NC NC NC NC NC NC NC NC M N NC Vssq NC Vccq Vssq NC NC NC NC NC NC NC NC NC N P NC NC Vccq Vssq Vccq Vssq RFU NC NC RFU NC NC NC NC P1 2 3 4 5 6 7 8 9 10 11 12 13 14 Note: VSF, RFU and NC balls are not electrically connected. RFU balls may be defined with functionality by the Joint Electron Device Engineering Council (JEDEC) in future revisions of the e•MMC™ standard. Please refer to Kingston’s design guidelines for more info.Device MarkingFigure 4 - EMMC Package Marking240xxxx-xxx.xxxxYYWW PPPPPPPPxxxxxxx-xxxx2xxxxxxTAIWANKingston Logo240xxxx-xxx.xxxx：Internal control numberYYWW：Date code (YY– Last 2 digits ofyear, WW- Work week)PPPPPPPP： Internal control numberxxxxxxx-xxxx Sales P/N2xxxxxx : Internal control numberCountry：TAIWANCard Identification Register (CID)The Card Identification (CID) register is a 128-bit register that contains device identification information used during the e•MMC™ protocol device identification phase. Refer to JEDEC Standard Specification No.JESD84-B51 for details.Field Byte ValueMID [127:120] 0x70reserved [119:114] 0x00CBX [113:112] 0x01OID [111:104] 0x00PNM [103:56 ] IB2916(16G) IB2932(32G) IB2964(64G)PRV [ 55:48 ] 0x90PSN [ 47:16 ] RandomMDT [ 15:8 ] month, yearCRC [ 7:1 ] Follows JEDEC Standard reserved [ 0:0 ] 0x01Card Specific Data Register [CSD]The Card-Specific Data (CSD) register provides information on how to access the contents stored in e•MMC™. The CSD registers are used to define the error correction type, maximum data access time, data transfer speed, data format…etc. For details, refer to section 7.3 of the JEDEC Standard Specification No.JESD84-B51.Field Byte ValueCSD_Structure [127:126] 0x03 (V2.0)SPEC_VER [125:122] 0x04 (V4.0~4.2)reserved [121:120] 0x00TAAC [119:112] 0x4F (40ms)NSAC [111:104] 0x01TRAN_SPEED [103:96 ] 0x32 (26Mbit/s)CCC [ 95:84 ] 0x0F5READ_BL_LEN [ 83:80 ] 0x09 (512 Bytes)READ_BL_PARTIAL [ 79:79 ] 0x00WRITE_BLK_MISALIGN [ 78:78 ] 0x00READ_BLK_MISALIGN [ 77:77 ] 0x00DSR_IMP [ 76:76 ] 0x00reserved [ 75:74 ] 0x00C_SIZE [ 73:62 ] 0xFFFVDD_R_CURR_MIN [ 61:59 ] 0x07 (100mA)VDD_R_CURR_MAX [ 58:56 ] 0x07 (200mA)VDD_W_CURR_MIN [ 55:53 ] 0x07 (100mA)VDD_W_CURR_MAX [ 52:50 ] 0x07 (200mA)C_SIZE_MULT [ 49:47 ] 0x07 (512 Bytes)ERASE_GRP_SIZE [ 46:42 ] 0x1FERASE_GRP_MULT [ 41:37 ] 0x1FWP_GRP_SIZE [ 36:32 ] 0x0FWP_GRP_ENABLE [ 31:31 ] 0x01DEFAULT_ECC [ 30:29 ] 0x00R2W_FACTOR [ 28:26 ] 0x02WRITE_BL_LEN [ 25:22 ] 0x09 (512 Bytes)WRITE_BL_PARTIAL [ 21:21 ] 0x00reserved [ 20:17 ] 0x00CONTENT_PROT_APP [ 16:16 ] 0x00FILE_FORMAT_GRP [ 15:15 ] 0x00COPY [ 14:14 ] 0x00PERM_WRITE_PROTECT [ 13:13 ] 0x00TMP_WRITE_PROTECT [ 12:12 ] 0x00FILE_FORMAT [ 11:10 ] 0x00Field Byte ValueECC [ 9:8 ] 0x00CRC [ 7:1 ] Follow JEDEC Standard reserved [ 0:0 ] 0x01Extended Card Specific Data Register [EXT_CSD]The Extended CSD register defines the Device properties and selected modes. It is 512 bytes long. The most significant 320 bytes are the Properties segment, which defines the Device capabilities and cannot be modified by the host. The lower 192 bytes are the Modes segment, which defines the configuration the Device is working in. These modes can be changed by the host by means of the SWITCH command. For details, refer to section 7.4 of the JEDEC Standard Specification No.JESD84-B51.Field Byte ValueReserved [511:506] 0EXT_SECURITY_ERR [505:505] 0x00S_CMD_SET [504:504] 0x01HPI_FEATURES [503:503] 0x01BKOPS_SUPPORT [502:502] 0x01MAX_PACKED_READS [501:501] 0x3CMAX_PACKED_WRITES [500:500] 0x20DATA_TAG_SUPPORT [499:499] 0x01TAG_UNIT_SIZE [498:498] 0x03TAG_RES_SIZE [497:497] 0x00CONTEXT_CAPABILITIES [496:496] 0x05LARGE_UNIT_SIZE_M1 [495:495] 0x17(16G) 0x2F(32G) 0x5F(64G)EXT_SUPPORT [494:494] 0x03 SUPPORTED_MODES [493:493] 0x01FFU_FEATURES [492:492] 0x00 OPERATION_CODE_TIMEOUT [491:491] 0x00FFU_ARG [490:487] 65535 BARRIER_SUPPORT [486:486] 0x01Reserved [485:309] 0CMDQ_SUPPORT [308:308] 0x01CMDQ_DEPTH [307:307] 0x0FReserved [306:306] 0x00 NUMBER_OF_FW_SECTORS_CORRECTLY_PROGRAMMED [305:302] 0 VENDOR_PROPRIETARY_HEALTH_REPORT [301:270] 0 DEVICE_LIFE_TIME_EST_TYP_B [269:269] 0x01DEVICE_LIFE_TIME_EST_TYP_A [268:268] 0x01PRE_EOL_INFO [267:267] 0x01 OPTIMAL_READ_SIZE [266:266] 0x01OPTIMAL_WRITE_SIZE [265:265] 0x08Field Byte Value OPTIMAL_TRIM_UNIT_SIZE [264:264] 0x01 DEVICE_VERSION [263:262] 0FIRMWARE_VERSION [261:254] 0x90 PWR_CL_DDR_200_360 [253:253] 0x00 CACHE_SIZE [252:249] 1024 GENERIC_CMD6_TIME [248:248] 0x32 POWER_OFF_LONG_TIME [247:247] 0xFF BKOPS_STATUS [246:246] 0x00 CORRECTLY_PRG_SECTORS_NUM [245:242] 0 INI_TIMEOUT_AP [241:241] 0x64 CACHE_FLUSH_POLICY [240:240] 0x01 PWR_CL_DDR_52_360 [239:239] 0x00 PWR_CL_DDR_52_195 [238:238] 0x00PWR_CL_200_195 [237:237] 0x00PWR_CL_200_130 [236:236] 0x00 MIN_PERF_DDR_W_8_52 [235:235] 0x00 MIN_PERF_DDR_R_8_52 [234:234] 0x00 Reserved [233:233] 0x00TRIM_MULT [232:232] 0x11(16G) 0x11(32G) 0x22(64G)SEC_FEATURE_SUPPORT [231:231] 0x55 SEC_ERASE_MULT [230:230] 0xF7 SEC_TRIM_MULT [229:229] 0xF7 BOOT_INFO [228:228] 0x07Reserved [227:227] 0x00 BOOT_SIZE_MULT [226:226] 0x20ACC_SIZE [225:225] 0x07(16G) 0x08(32G) 0x09(64G)HC_ERASE_GRP_SIZE [224:224] 0x01ERASE_TIMEOUT_MULT [223:223] 0x11(16G) 0x11(32G) 0x22(64G)REL_WR_SEC_C [222:222] 0x01HC_WP_GRP_SIZE [221:221] 0x10 S_C_VCC [220:220] 0x08S_C_VCCQ [219:219] 0x08 PRODUCTION_STATE_AWARENESS_TIMEOUT [218:218] 0x14 S_A_TIMEOUT [217:217] 0x15 SLEEP_NOTIFICATION_TIME [216:216] 0x0FField Byte ValueSEC_COUNT [215:212] 10207232 (16G) 20414464 (32G) 40828928 (64G)SECURE_WP_INFO [211:211] 0x01 MIN_PERF_W_8_52 [210:210] 0x08 MIN_PERF_R_8_52 [209:209] 0x08 MIN_PERF_W_8_26_4_52 [208:208] 0x08 MIN_PERF_R_8_26_4_52 [207:207] 0x08 MIN_PERF_W_4_26 [206:206] 0x08 MIN_PERF_R_4_26 [205:205] 0x08 Reserved [204:204] 0x00 PWR_CL_26_360 [203:203] 0x00 PWR_CL_52_360 [202:202] 0x00 PWR_CL_26_195 [201:201] 0x00 PWR_CL_52_195 [200:200] 0x00 PARTITION_SWITCH_TIME [199:199] 0xFF OUT_OF_INTERRUPT_TIME [198:198] 0xFF DRIVER_STRENGTH [197:197] 0x1F DEVICE_TYPE [196:196] 0x57 Reserved [195:195] 0x00 CSD_STRUCTURE [194:194] 0x02 Reserved [193:193] 0x00 EXT_CSD_REV [192:192] 0x08 CMD_SET [191:191] 0x00Reserved [190:190] 0x00 CMD_SET_REV [189:189] 0x00 Reserved [188:188] 0x00 POWER_CLASS [187:187] 0x00 Reserved [186:186] 0x00HS_TIMING [185:185] 0x01 STROBE_SUPPORT [184:184] 0x01 BUS_WIDTH [183:183] 0x02Reserved [182:182] 0x00 ERASED_MEM_CONT [181:181] 0x00 Reserved [180:180] 0x00 PARTITION_CONFIG [179:179] 0x00 BOOT_CONFIG_PROT [178:178] 0x00 BOOT_BUS_CONDITIONS [177:177] 0x00 Reserved [176:176] 0x00 ERASE_GROUP_DEF [175:175] 0x00 BOOT_WP_STATUS [174:174] 0x00C - 4Field Byte Value BOOT_WP [173:173] 0x00 Reserved [172:172] 0x00 USER_WP [171:171] 0x00 Reserved [170:170] 0x00 FW_CONFIG [169:169] 0x00 RPMB_SIZE_MULT [168:168] 0x20 WR_REL_SET [167:167] 0x00 WR_REL_PARAM [166:166] 0x15 SANITIZE_START [165:165] 0x00 BKOPS_START [164:164] 0x00 BKOPS_EN [163:163] 0x00 RST_n_FUNCTION[162:162] 0x00 HPI_MGMT[161:161] 0x00 PARTITIONING_SUPPORT [160:160] 0x07 MAX_ENH_SIZE_MULT [159:157] 623(16G) 1246(32G) 2492(64G) PARTITIONS_ATTRIBUTE[156:156] 0x01 PARTITION_SETTING_COMPLETED[155:155] 0x01 GP_SIZE_MULT_4 [154:152] 0 GP_SIZE_MULT_3 [151:149] 0 GP_SIZE_MULT_2 [148:146] 0 GP_SIZE_MULT_1[145:143] 0 ENH_SIZE_MULT[142:140] 623(16G) 1246(32G) 2492(64G)ENH_START_ADDR[139:136] 0 Reserved[135:135] 0x00 SEC_BAD_BLK_MGMNT[134:134] 0x00 PRODUCTION_STATE_AWARENESS[133:133] 0x00 TCASE_SUPPORT [132:132] 0x00 PERIODIC_WAKEUP[131:131] 0x00 PROGRAM _CID_CSD_DDR_SUPPORT[130:130] 0x01 Reserved[129:128] 0 VENDOR_SPECIFIC_FIELD[127:67 ] 538968064ERROR_CODE [ 66:65 ] 0 ERROR_TYPE[ 64:64 ] 0x00 NATIVE_SECTOR_SIZE [ 63:63 ] 0x00 USE_NATIVE_SECTOR [ 62:62 ] 0x00 DATA_SECTOR_SIZE [ 61:61 ] 0x00 INI_TIMEOUT_EMU[ 60:60 ] 0x00C - 5FieldByte Value CLASS_6_CTRL [ 59:59 ] 0x00 DYNCAP_NEEDED[ 58:58 ] 0x00 EXCEPTION_EVENTS_CTRL [ 57:56 ] 0 EXCEPTION_EVENTS_STATUS [ 55:54 ] 0 EXT_PARTITIONS_ATTRIBUTE[ 53:52 ] 0 CONTEXT_CONF[ 51:37 ] 0 PACKED_COMMAND_STATUS [ 36:36 ] 0x00 PACKED_FAILURE_INDEX [ 35:35 ] 0x00 POWER_OFF_NOTIFICATION[ 34:34 ] 0x00 CACHE_CTRL [ 33:33 ] 0x00 FLUSH_CACHE [ 32:32 ] 0x00 BARRIER_CTRL [ 31:31 ] 0x00 MODE_CONFIG[ 30:30 ] 0x00 MODE_OPERATION_CODES[ 29:29 ] 0x00 Reserved [ 28:27 ] 0 FFU_STATUS[ 26:26 ] 0x00 PRE_LOADING_DATA_SIZE [ 25:22 ] 0MAX_PRE_LOADING_DATA_SIZE[ 21:18 ] 3304106(16G) 6608213(32G) 13216426(64G)PRODUCT_STATE_AWARENESS_ENABLEMENT[ 17:17 ] 0x01 SECURE_REMOVAL_TYPE[ 16:16 ] 0x01 CMDQ_MODE_EN[ 15:15 ] 0x00 Reserved[ 14:0 ]。
E500 双通道温度监测器用户手册说明书
Trillium US Inc.E500® Dual Channel Temperature MonitorUser’s ManualRev A / November 201597-00032-000For information about Trillium US Inc., visit the Trillium US Inc. Web site at:How to Contact Trillium US Inc. Support:**********************For contact information and a complete listing of Direct Sales, Distributor, and Sales Representative contacts, visit the Trillium US Inc. Web site at:Trillium US Inc. has made its best effort to ensure that the information contained in this document is accurate and reliable. However, the information is subject to change without notice and is provided “AS IS” without warranty of any kind (express or implied). Before placing orders, customers are advised to obtain the latest version of relevant information to verify that information being relied upon is current and complete. All products are sold subject to the terms and conditions of sale supplied at the time of order acknowledgment, including those pertaining to warranty, patent infringement, and limitation of liability. No responsibility is assumed by Trillium US Inc. for the use of this information, including use of this information as the basis for manufacture or sale of any items, nor for infringements of patents or other rights of third parties. This document is the property of Trillium US Inc. and by furnishing this information, Trillium US Inc. grants no license, expressed or implied, under any patents, copyrights, trademarks, trade secrets, or other intellectual property rights of Trillium US Inc. Trillium US Inc., copyright owner of the information contained herein, gives consent for copies to be made of the information only for use within the customer’s organization as related to the use of Trillium US Inc. products. The same consent is given for similar information contained on any Trillium US Inc. Web site or disk used to distribute information to a customer. Trillium US Inc. does give consent to the copying or reproduction by any means of the information contained herein for general distribution, advertising or promotional purposes, or for creating any work for resale. The names of products of Trillium US Inc. or other vendors and suppliers appearing in this document may be trademarks or service marks of their respective owners that may be registered in some jurisdictions. A list of Trillium US Inc. trademarks and service marks can be found at:/Trillium US Inc.1340 Airport Commerce Dr.Bldg. 1 Suite 175Austin, Texas 78741 USATEL. +1 512 441 6893FAX +1 512 443 6665Email: *************************Copyright (©) 2015 by Trillium US Inc., All rights reserved.Copyright (©) 2015 by Trillium US Inc., All rights reserved.Table of Contents1 Revision History (iv)2 Preface (5)2.1 About Trillium US Inc. (5)2.2 Other Services from Trillium US Inc. (5)2.3 About this Manual (5)2.4 Compatibility (6)3 Introduction (6)3.1 E500 Dual Channel Cryogenic Temperature Monitor Features (6)3.2 Description (6)3.2.1 Specifications (6)4 Set Point Relay Pin-out (8)5 Analog Outputs (8)6 E500 User Interface (9)6.1 Diode Curve Selection (9)6.2 Set Point Configuration (9)6.3 Serial Port Interface (12)6.3.1 Serial Port Commands (12)6.4 E500 Curve Programmer (13)7 Ordering Information (14)List of FiguresFigure 1 – E500 Rear Panel (7)Figure 2 – Single Row Mating Connector (1803646) (8)Figure 3 – Channel Set Point Access (10)Figure 4 – Channel Set Point Example (11)Figure 5 – E500 Curve Programmer User Interface (13)List of TablesTable 3-1: E500 Specifications (6)Table 3-2: Rear Panel Features (7)Table 4-1: Set Point Relay Pin-out (8)Table 5-1: E500 Analog Output Pin-Out (8)Table 6-1: Serial Port Pin-Out (12)Table 6-2: Serial Port Settings (12)Table 6-3: Serial Port Commands (12)Table 7-1: E500 Dual Channel Cryogenic Temperature Monitor Ordering Information (14)Table 7-2: E500 Optional Cables (14)1Revision HistoryDate Revision ECR # Description of ChangeJuly 2008 1.0.1 Initial releaseJanuary 2013 1.0.2 Change to update corporate formatFebruary 2013 1.0.3 Corrected Dimensions, Corrected Sensor connection, added weightNovember 2015 A 2821 Rebranding and format changes, removed references to “backlit” LCD DisplayDocument Part Number: 97-00041-0002Preface2.1About Trillium US Inc.Trillium US Inc., a wholly-owned subsidiary of Trillium US Inc., specializes in the manufacture and repair of cryogenic vacuum pumps, cryocoolers (refrigerators) and helium compressors for semiconductor, optical coating, linear accelerators, medical equipment, and R&D applications.You can find just what you need from our range of products and support services:•New Equipment - cryopumps, compressors, cryocoolers, and cryopump controllers.•Comprehensive range of accessories for the installation of whole systems and a complete range of spare parts to repair cryopumps and compressors.2.2Other Services from Trillium US Inc.Trillium US Inc. offers comprehensive refurbishment services for its own equipment as well as for that of most of our competitors. Our products and services are available through our global network of agents and dealers.•Repair and refurbishment services - We offer our own quality products, as well as most other manufactures models, often with off-the-shelf availability.•Exchanges - We offer our own quality products, as well as most makes of cryopumps and helium compressors, which are refurbished and fully warranted.•Technical Support - Our support engineers will help determine if your cryopump system is operating correctly so that you can get your system back to optimum efficiency as soon as possible.o To contact Trillium US Inc. Technical Support:o E-mail: **********************o Telephone: 1-512-441-9258 or Toll Free: 1-800-404-1055•Installation - On-site installation services are available to guarantee performance and save you time.•Training - We offer on-site training to help you and your staff to know more about your cryopump and compressor systems. Our training will give you confidence and the ability to maintain a highest possible uptime for your system.2.3About this ManualThe purpose of this manual is to provide our customers using the E500 Dual Channel Cryogenic Temperature monitor with the information needed to safely and efficiently operate the monitor when operating as part of a cryogenic refrigeration system. Such a system is often comprised of the following equipment:•Cryopump compressors•Coldhead(s) or cryopump(s)•Connecting helium lines•Temperature monitor(s)This manual describes the design, operation and maintenance of the E500 Dual Channel Cryogenic Temperature monitor.2.4CompatibilityThe E500 Dual Channel Cryogenic Temperature Monitor is compatible with most cryopumps and coldheads.3Introduction3.1E500 Dual Channel Cryogenic Temperature Monitor FeaturesThe E500 Dual Channel Cryogenic Temperature Monitor features:•Continuous visual update of two temperature sensors (channels) using an LCD display•Drives two temperature diodes, intended for cryogenic temperature measurement•Diode temperature curve selection from four pre-defined curves•Supports one user-defined, programmable diode curve•Six programmable setpoint relays (three per sensor/channel)•Two 0 – 10 V analog outputs for temperature monitoring (one per sensor/channel)•Provides an RS-232 serial port for a PLC or PC digital interface3.2DescriptionThe E500 Cryogenic Temperature Monitor drives two diode temperature sensors, and provides a visual display of the temperature on an LCD module. Typical applications include monitoring temperature of a two stage coldhead of a cryopump or cryocooler, using one diode (channel) for each stage. It can also be used to monitor two cryopumps or cryocoolers simultaneously, by using one diode (channel) for each coldhead. The high resolution measurement sensors provide noise rejection to deliver precise, accurate temperature readings. The diode curves are user selectable from four (4) pre-defined curves providing support for common diodes. In addition, a user-programmable curve is available for non-supported diodes. Temperature conversion is provided by a 10μA constant current source using a spline interpolation (piecewise polynomial).3.2.1SpecificationsThe E500 specifications are listed in Table 3-1. The E500 rear panel is shown in Figure 1 and described in Table 3-2.Table 3-1: E500 SpecificationsItem SpecificationFeaturesDisplay 2 Temperatures Four Selectable Diode CurvesPower 110/220 VAC Input @ 50/60 Hz(Universal Input)ConnectorsIEC Power Input DB9F (Diode Driver)Dry Contact RatingCarry AC Current 10 A @ 250 VACCarry DC Current 5 A @30 VDC Max Switching Voltage400 VAC300 VDCMax Switching CurrentNO: 10 ANC: 8 AMax Switching PowerNO: 2,500 VANC: 2,000 VA150 WAnalog Output 0 – 10 V, 60mA max Dimensions 6.5” (W) x 7.5” (L) x 3.05” (H) Weight 3.2 lbs.Figure 1 – E500 Rear PanelTable 3-2: Rear Panel FeaturesFeature Description1: IEC Power Entry Universal Power input accepts 110 or 220 VAC at 50 or 60 Hz2: Set Point Relays Dry contacts are provided to trigger external equipment, or to provide status to control electronics, such as a PLC. Three relays are provided for each temperature channel. The top row connector is controlled by Channel #1 sensor, and the bottom is controlled by Channel #2. See Table 4-1 for a detailed pin-out.3: D-Sub 9 Female-Temp Sensors Connect temperature sensor according to the following pin out: •Pin 1: Shield (GND)•Pin 2: No Connect (NC)•Pin 3: NC•Pin 4: Diode Sensor #2 Positive•Pin 5: Diode Sensor #2 Negative•Pin 6 – 7: NC•Pin 8: Diode Sensor #1 Positive•Pin 9: Diode Sensor #1 Negative4: D-Sub 9 Male-RS-232 Serial Port Provides serial interface to a remote serial device. The serial port is intended to be used with a standard “straight through” serial cable (not NULL Modem).•Pin 1: No Connect (NC)•Pin 2: RS-232 Transmit Out•Pin 3: RS-232 Receive In•Pin 4: NC•Pin 5: GND•Pin 6 – 9: NC5: Analog OutputsAnalog outputs are provided for recorder logging, or as status toa PLC. The outputs provide 0 – 10 V for each channel.•Pin 1: Channel #1 Voltage Output•Pin 2: GND•Pin 3: Channel #2 Voltage Output•Pin 4: GND123454Set Point Relay Pin-outTable 4-1 describes the relay configuration. For each channel, 3 separate dry contacts are provided. Each dry contact has three connections: Normally Open, Normally Closed, and Common.Table 4-1: Set Point Relay Pin-outPin-Out(left to right)Top Row Bottom Row Relay PositionPin 1Channel 1 LowRelay Channel 2 LowRelayNormally OpenPin 2 Common Pin 3 Normally ClosedPin 4Channel 1 HighRelay Channel 2 HighRelayNormally OpenPin 5Common Pin 6Normally ClosedPin 7Channel 1 SpareRelay Channel 2 SpareRelayNormally OpenPin 8CommonPin 9Normally ClosedThe dual row connector provided on the E500 requires two male connectors for mating. The recommended mating connector is Phoenix Contact Part Number 1803646, see Figure 2. Note that if only one channel is utilized, only one Phoenix Contact connector is needed.Figure 2 – Single Row Mating Connector (1803646)5Analog OutputsThe E500 provides an analog output for each channel. A terminal block style plug is required to connect to the analog outputs. The recommended mating connector is Phoenix Contact Part Number 1803594. The outputs can provide a maximum output current of 60 mA each. To convert the output voltage to temperature, use the following formula:Temperature (Kelvin) = 35 * Analog Output Voltage (in Volts)This formula provides a maximum range of 0 – 350.0 °K. The pin-out (also shown on the back panel of the unit) is listed in Table 5-1:Table 5-1: E500 Analog Output Pin-OutPin Signal1 Channel #1 Analog Output2 Ground3 Channel #2 Analog Output4 Ground6E500 User InterfaceThe E500 provides a continuous display of the temperature measurements. The display interface also provides diode curve selection, and set point configuration.6.1Diode Curve SelectionThe user can select the diode curve which corresponds to the temperature diode sensor connected to the E500. To select a diode curve:1.Press the MENU button.2.Scroll through the standard diode options by pressing the UP and DOWN buttons.3.When the appropriate diode curve has been selected, press MENU.E500 supports the following standard temperature sensor diodes:•Trillium US Inc. Temperature Diode•CTI Temperature Diode•DT-470 Silicon Diode•DT-670 Silicon Diode6.2Set Point ConfigurationThe user can individually configure each setpoint relay to a unique temperature. Each channel has 3 setpoints associated with its temperature measurement – LOW, HIGH, and SPARE. A flow chart is shown to aid in navigating the menus. In addition, an example is shown at the end of the section. If no buttons are pressed for roughly 10 seconds, the display times out and returns to the main menu. NOTE: the changes are stored and take effect if the menu times out. To configure a setpoint:1.Press the MENU button twice. The first relay is “Channel #1 LO”. When the temperature is below this value, therelay is in the “Active” position. The temperature value is modified by pressing UP or DOWN for each digit. Once the digit has been set, press ENTER to move to the next digit.2.Press the MENU button to configure “Channel #1 HI”. When the temperature is above this value, the relay is inthe “Active” position.3.Press the MENU button to configure “Channel #1 SPARE”. When the temperature is above this value, the relay isin the “Active” position.4.Continue to press the MENU button to cycle through the Channel #2 set points.Figure 3 shows how to access the set points via menu selection. Figure 4 provides an example that will configure Channel #2 Low Set point Relay to 12 K. Begin by pressing MENU to navigate to the “Select Diode” display shown in Figure 4.Figure 4 – Channel Set Point Example6.3Serial Port InterfaceThe E500 provides a DB9 Male connector for serial port communications. A “straight through” serial cable is necessary for interfacing to the serial port. Only pins 2, 3, and 5 are required, see Table 6-1.Table 6-1: Serial Port Pin-OutDB9 Female (to E500) DB9 (to Controller)1 ------------- 12 ------------- 23 ------------- 34 ------------- 45 ------------- 56 ------------- 67 ------------- 78 ------------- 89 ------------- 9All commands start with ‘$’, and end with \r\n. The serial port should be configured as shown in Table 6-2.Table 6-2: Serial Port SettingsBaud Rate 19,200Data Bits 8Parity NONEStop Bits 1Flow Control NONE6.3.1Serial Port CommandsTable 6-3 lists the provided serial port commands.Table 6-3: Serial Port CommandsCommand Returns ExampleGetRev Revision x.x Get Revision SEND: $GetRev\r\n RECEIVE: $Revision 1.0\r\nGetTemp (channel) Channel: 1 or 2xxx.x or“OOR” if outof rangeGet Channel2 TempSEND: $GetTemp 2\r\nRECEIVE: $21.6\r\nGetSetp (channel,relay)Channel: 0 or 1 (0-> Channel 1, 1-> Channel 2) Relay: 0, 1, or 2. 0->LO, 1->HI, 2->SPARE xxx (integer)Get Channel2 SPARE setpointSEND: $GetSetp 1,2\r\nRECEIVE: $280\r\nSetSetp (channel,relay,temp) Channel: 0 or 1 (0-> Channel 1, 1-> Channel 2) Relay: 0, 1, or 2. 0->LO, 1->HI, 2->SPARETemp: xxx (integer, no decimal point)$xxx\r\n(returns thenew valuestored)Set Channel1 LOW setpoint to 12KSEND: $SetSetp 0,0,12\r\nRECEIVE: $12\r\nGetVolt(channel) Channel: 1 or 2 x.xxxxGet Channel2 VoltageSEND: $GetVolt 2\r\nRECEIVE: $1.2345\r\n6.4E500 Curve ProgrammerTo enter data for a user defined diode curve, the E500 Curve Programmer can be used. This utility allows the user to enter the polynomial coefficients that control the voltage to temperature conversion.In order to determine appropriate values, several “Voltage vs. Temperature” data points should be viewed in graph form. The graph can be broken up piece-wise into a maximum of 3 equations. For each of the equations, a trend line should be developed using a program such as Microsoft Excel or Matlab. Up to a 6th order polynomial can be used for each equation to provide maximum flexibility.Once the values have been chosen, the fields shown in Figure 5 should be populated.Figure 5 – E500 Curve Programmer User Interface7Ordering InformationTable 7-1 contains the ordering information for the E500 Dual Channel Cryogenic Temperature Monitor. Customers can also order the optional diode cables listed in Table 7-2.Table 7-1: E500 Dual Channel Cryogenic Temperature Monitor Ordering InformationCryopump Part NumberE500 Dual Channel Cryogenic Temperature Monitor 93-00040-00019” Rack Mount Kit (Fits up to 2 E500s)99-00072-00019” Rack Mount Kit (Fits single E500)99-00072-001 E500 Curve Programmer (to program custom diode curve) 10-00001-000Table 7-2: E500 Optional CablesConfiguration CablesPart Number10 Ft. 15 Ft. 20 Ft. 50 Ft.Single Cryopump or coldheadStandardSingle DiodeCable10133-10 10133-15 10133-20 10133-50Dual Diode Cryopump or coldhead Dual DiodeCable81-00016-010 81-00016-015 81-00016-020 81-00016-050Two Cryopumps or coldheadsDualCryopumpDiode Cable81-00038-010 81-00038-015 81-00038-020 81-00038-050。
TI型号大全35-迈锐国际
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新代参数设定参考手册--V9.4(1)(精)
新代科技參數設定說明手冊by : 新代科技date : 2006/09/05ver : 9.4版本更新記錄目錄1. 系統基本參數設定 ................................................................................ 5 1.1硬體環境設定 ................................................................................... 5 1.1.1軸卡基本參數設定 . .......................................................................... 5 1.1.1.1 Pr01 軸板基址 ................................................................................... 5 1.1.1.2 Pr09 軸板型態 ................................................................................... 6 1.1.1.3 Pr10 伺服警報接點型態 ........................................................................... 6 1.1.1.4 Pr11 軸卡時脈來源 ............................................................................... 7 1.1.1.5 Pr12 SERVO6軸卡最高時脈 . ........................................................................ 7 1.1.1.6 Pr13 軸卡數目 ................................................................................... 7 1.1.2 I/O卡基本參數設定 . ........................................................................ 8 1.1.2.1 Pr03 I/O板基址 .................................................................................. 8 1.1.2.2 Pr05 I/O板組態 . ................................................................................ 8 1.1.2.3 Pr15 I/O卡數位濾波程度 . ........................................................................ 11 1.1.3 控制精度設定 ............................................................................. 12 1.1.3.1 Pr17控制精度 .................................................................................. 12 1.1.4 螢幕功能鍵型態設定 ....................................................................... 12 1.1.4.1 Pr3205功能鍵型態 . .............................................................................. 12 1.1.5 螢幕型別 ................................................................................. 13 1.1.5.1 Pr3211 螢幕型別 ................................................................................ 13 1.1.6預設外部存取資料磁碟機代號 . ............................................................... 13 1.1.6.1 Pr3213 磁碟機代號 .............................................................................. 13 1.1.7 選擇控制面板鍵盤型態 ..................................................................... 13 1.1.7.1 Pr3217 選擇控制面板鍵盤型別 .................................................................... 13 1.1.8系統掃瞄時間設定 . ......................................................................... 14 1.1.8.1 Pr3202 I/O掃描時間 . ............................................................................ 14 1.1.8.2 Pr3203 運動補間時間 ............................................................................ 14 1.1.8.3 Pr3204 PLC掃描時間 . ............................................................................ 14 1.2軟體介面環境參數設定 .......................................................................... 15 1.2.1應用功能參數設定 . ......................................................................... 15 1.2.1.1 Pr411 G00運動方式 . ............................................................................. 15 1.2.1.2 Pr413 G92(G92.1座標保留模式設定 ............................................................... 15 1.2.1.3 Pr414 工件座標系統保留模式 ..................................................................... 15 1.2.1.4 Pr415 重置或關機時保留目前刀長資料 ............................................................. 16 1.2.1.5 Pr3207 C/S界面版本編號 . ........................................................................ 16 1.2.1.6 Pr3215選刀時呼叫副程式 . ........................................................................ 16 1.2.1.7 Pr3241 工件程式小數點型態 . (16)1.2.1.8 Pr3243 鍵盤重置鍵由 PLC 處理 ....................................................................17 1.2.1.9 Pr3245刀長磨耗補償輸入增量最大值 ............................................................... 17 1.2.1.10 Pr3801 G95時進給量與主軸位置緊密偶合 .......................................................... 17 1.2.1.11 Pr3807圓弧終點不在圓弧上檢查視窗 .............................................................. 18 1.2.1.12 Pr3809 UVW為 XYZ 軸增量指令 . .................................................................. 18 1.2.1.13 Pr3815 刀具半徑補償預看模式 ................................................................... 18 1.2.1.14 Pr3816 刀長補償模式 .......................................................................... 18 1.2.1.15 Pr3819過切檢查型態 . ........................................................................... 19 1.2.1.16 Pr3851斷刀處理程式號碼 . ....................................................................... 19 1.2.2 系統人機介面設定 ......................................................................... 20 1.2.2.1 Pr3201 設定啟動車床規則 ........................................................................ 20 1.2.2.2 Pr3209 語言設定 ................................................................................ 20 1.2.2.3 Pr3219 系統安裝組態 ............................................................................ 21 1.2.2.4 Pr3221 除錯模式 ................................................................................ 21 1.2.2.5 Pr3223啟動系統管理功能 . ........................................................................ 22 1.2.2.6 Pr3225 螢幕保護功能延遲時間 .................................................................... 22 1.2.2.7 Pr3227 螢幕解析度 .............................................................................. 22 1.2.2.8 Pr3229 關閉工件座標系統功能 .. (22)1.2.2.9 Pr3247 速率顯示方法 (23)2. 伺服軸向參數設定 ............................................................................... 24 2.1各軸對應機械軸設定 ............................................................................ 24 2.1.1 Pr21~Pr40 伺服對應的機械軸 ............................................................... 24 2.2軸向馬達運動方向的設定 . ....................................................................... 24 2.2.1 Pr41~Pr60 馬達運動方向設定 ............................................................... 24 2.3軸向命令與回授解析度設定 . ..................................................................... 25 2.3.1 Pr61~Pr80 位置感測器解析度 ............................................................... 25 Pr81~Pr100 軸卡回授倍頻 ........................................................................ 25 Pr121~Pr160 螺桿側齒輪齒數 , 馬達側齒輪齒數 ...................................................... 25 Pr161~Pr180 螺桿寬度(Pitch .................................................................... 25 Pr181~Pr200 伺服系統的位置迴路增益 ............................................................. 25 Pr201~Pr220 位置感測器型態 ..................................................................... 25 Pr341~Pr360 位置命令倍率分子 ................................................................... 25 Pr361~Pr380 位置命令倍率分母 ................................................................... 25 2.4各軸向應用型態設定 . ........................................................................... 27 2.4.1 Pr221~Pr226軸型態 . ....................................................................... 27 2.4.2 Pr281~Pr300選擇半徑軸或直徑軸 . ........................................................... 28 2.5各軸向顯示名稱設定 . ........................................................................... 28 2.5.1 Pr321~Pr340設定軸的名稱 . (28)2.6軸向控制模式設定 . ............................................................................. 29 2.6.1 Pr381~Pr400位置伺服控制模式 . ............................................................. 29 2.7定位檢查功能設定 . ............................................................................. 29 2.7.1 Pr421~Pr440切削時位置檢查的視窗範圍 ...................................................... 29 2.7.2 Pr481~Pr500 快速移動 (Rapid Travel, G00時位置檢查的視窗範圍 .............................. 30 2.7.3Pr561~Pr580 遺失位置檢查視窗 ............................................................. 30 2.7.4Pr901~Pr920 零速檢查視窗 ................................................................. 30 2.8各軸向左右軟體行程極限保護 . ................................................................... 30 2.8.1Pr2401~Pr2440 軟體第一行程保護的範圍 (30)2.8.2 Pr2441~Pr2480 軟體第二行程保護的範圍 .....................................................313. 主軸參數設定 ................................................................................... 32 3.1主軸對應命令輸出埠設定 (32)3.1.1 Pr1621~Pr1630 主軸對應的機械軸或邏輯軸 ...................................................324. 軸向運動特性設定參數 ........................................................................... 33 4.1切削時前加減速運動規劃 . ....................................................................... 33 4.1.1 Pr401 切削加減速時間 .................................................................... 33 Pr402 重力加速度加減速時間 ..................................................................... 33 Pr405 切削的最高進給速度 ....................................................................... 33 Pr541~Pr560 各軸切削的加減速時間 ............................................................... 33 Pr621~Pr640 各軸切削的最高進給速度 ............................................................. 33 Pr641~Pr660 各軸重力加速度加減速時間 ........................................................... 33 4.2切削時後加減速運動規劃 . ....................................................................... 35 4.2.1 Pr404後加減速切削鐘型加減速時間 . ......................................................... 35 4.3切削時直線轉角自動減速功能 . ................................................................... 37 4.3.1 Pr406轉角參考速度 . ....................................................................... 37 4.4切削時圓弧切削運動最高進給速度設定 ............................................................ 38 4.4.1 Pr408 半徑 5mm 圓弧切削參考速度 ........................................................... 38 4.5快速移動及 JOG 時的加減速規劃 .................................................................. 39 4.5.1 Pr441~Pr460 各軸快速移動 (G00的加減速時間 ............................................... 39 Pr461~Pr480 各軸快速移動 (G00的最高進給速度 .................................................... 39 Pr501~Pr520 各軸快速移動 (G00的F0速度 ......................................................... 39 Pr521~Pr540 各軸 JOG 速度 ....................................................................... 39 1P R 941~960啟動尋原點柵格功能 ................................................................. 40 2P R 1361~PR 1400圓弧尖角補償 . ................................................................... 43 3P R 3217選擇控制面板鍵盤型別 .................................................................. 44 4P R 3821~PR 3822軸偶合軸號 ..................................................................... 45 5P R 3823~PR 3824軸偶合軸號 (46)6P R 3825軸偶合型態 ............................................................................ 47 7P R 3851斷刀處理程式號碼 . (48)1. 系統基本參數設定1.1硬體環境設定1.1.1軸卡基本參數設定1.1.1.1 Pr01 軸板基址軸卡二片以下Pr01→800 軸卡超過二片Pr01→7682.Servo_6的第一片軸卡基址為 768(目前一部控制器僅支援一張 Servo_6,不可與 Servo_4混插3.Embedded 第一片軸卡基址固定為 5121.1.1.2 Pr09 軸板型態0:EMP21:SVO4+不檢查伺服警報2:SVO4+伺服警報接點為常開接點 Normal Open( A 接點 3:SVO4+伺服警報接點為常閉接點 Normal Close( B 接點 4:EMP45:SERVO69:虛擬軸卡1.1.1.3 Pr10 伺服警報接點型態0: SERVO 6軸卡警報為常開接點 Normal Open( A 接點 1: SERVO 6軸卡警報為常閉接點 Normal Close( B 接點1.1.1.4 Pr11 軸卡時脈來源此參數為設定軸卡時脈來源:設定 0為使用軸卡自已時脈設定 1為共用控制器底板 IPC Bus時脈設定 2為共用主機板 VIA 時脈設定原則:一體機控制器→請設定『 0』非一體機控制器→請設定『 2』舊型 486主機板控制器→請設定『 1』1.1.1.5 Pr12 SERVO6軸卡最高時脈此參數為設定 Servo6軸版最高時脈。
ti芯片解析 m 标号
ti芯片解析 m 标号TI芯片是德州仪器（Texas Instruments）公司生产的一种集成电路芯片。
该公司成立于1930年，是全球领先的半导体解决方案提供商之一。
TI芯片在电子行业中具有广泛的应用，包括通信、计算机、消费电子、医疗电子、工业自动化等领域。
TI芯片的特点之一是高性能。
它采用先进的制程技术，可以实现高速运算和大容量存储。
同时，TI芯片具有较低的功耗，能够在保证性能的同时降低电能消耗，提高设备的续航时间。
TI芯片还具有丰富的功能特点。
它可以集成多个功能模块，如处理器、存储器、通信接口等，满足不同应用的需求。
TI芯片还支持各种通信协议和接口标准，如USB、Ethernet、SPI、I2C等，能够与其他设备进行快速、稳定的数据交换。
TI芯片在通信领域有着广泛的应用。
它可以用于手机、平板电脑等移动设备中，实现高速数据传输和无线通信。
TI芯片还可以用于网络设备中，如路由器、交换机等，提供稳定可靠的网络连接。
此外，TI芯片还可以用于无线通信设备中，如蓝牙、WiFi模块等，实现设备之间的无线连接。
在计算机领域，TI芯片也有着重要的应用。
它可以用于个人电脑、服务器等设备中，提供强大的计算能力和高速的数据处理能力。
TI 芯片还可以用于嵌入式系统中，如工控设备、汽车电子等，实现各种复杂的功能和算法。
在消费电子领域，TI芯片可以用于各种电子产品中。
比如智能手机、平板电脑、电视机等，都可以采用TI芯片来实现各种功能。
TI芯片还可以用于音频设备、摄像设备等，提供高质量的音视频处理能力。
TI芯片在医疗电子领域也有广泛的应用。
它可以用于医疗设备中，如心电图仪、血糖仪等，实现数据采集和处理。
TI芯片还可以用于医疗监护设备中，如呼吸机、血压计等，提供可靠的监护功能。
除了上述应用领域，TI芯片还可以用于工业自动化领域。
它可以用于PLC（可编程逻辑控制器）等设备中，实现工业控制和自动化。
TI芯片还可以用于仪器仪表中，如示波器、信号发生器等，提供精确的测量和测试功能。
LiveU LU500 User Guide V3.0
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LiveU LU500 User Guide
Table of Contents
About This Guide ........................................................................................................ 1 Intended Audience ................................................................................................. 3 Additional Documentation .................................................................................... 3 Chapter 1: Introducing the LU500 ............................................................................ 9 Overview........................................................................................................................... 9 What’s in the LU500 Carrying Case? .........................................................................11 LiveU Central ..................................................................................................................12 Chapter 2: Getting Started ...................................................................................... 13 Step 1, Connecting the Video Camera ...................................................................14 Step 2, Powering On the LU500 Unit...........................................................................15 Charging the LU500 ...............................................................................................15 Step 3, Selecting a Channel .......................................................................................17 Virtual Groups .........................................................................................................20 Step 4, Selecting a Profile ............................................................................................22 Select a Profile ........................................................................................................22 Select the Delay .....................................................................................................23 Step 5, Selecting an Advanced Streaming Mode ................................................. 23 Step 6, Configuring WiFi ...............................................................................................27 Step 7, Going Live .........................................................................................................29 Checking Interface Quality .................................................................................30 Step 8, Shutting Down ..................................................................................................33 Chapter 3: LU500 User Interface ............................................................................. 35 LU500 Touch Screen Interface ....................................................................................36 Video Feed .....................................................................................................................37 Currently Selected Channel ......................................................................................39 Currently Selected Profile ...........................................................................................40 Connected Interfaces and Bandwidth.........................................................................40 Battery Status ................................................................................................................41 Turning Off .....................................................................................................................41 System Menu .................................................................................................................42 Selecting the LU500 Profile..........................................................................................43 Live ............................................................................................................................41 Store & Forward ......................................................................................................42 Configuration ................................................................................................................45
金士顿数据中心500系列固态硬盘规格说明书
/flashguideFeatures/specs on reverse >>Data Center 500 SeriesK ingston’s Data Center 500 (DC500R / DC500M) Series of solid-state drives are high performance 6Gbps SATA SSDs using the latest 3D TLC NAND, designed for Read Centric and Mixed-Use server workloads. They implement K ingston’s strict QoS requirements to ensure predictable random I/O performance as well as predictable low latencies over a wide range of read and write workloads. They can increase productivities within AI, machine learning, big data analytics, cloud computing, software-defined storage, operational databases (ODB), database applications, and data warehousing. Capacities from 480GB, 960GB, 1.92TB, 3.84TB 1Enterprise Data Center SSDDelivering on business demands for 24/7 uptime and reliability, K ingston Enterprise SSDs offer performance storage that combines performance predictability as well as rigorously tested reliability. Kingston’s DC500 Series SSDs offer features that enable data centers to select the most cost effective SSD for their workload(s). Businesses require results as they deliver on products, solutions and service level agreements (SLA’s). Kingston’s DC500 Series SSDs are designed to deliver on these expectations.DC500R: Read-centric SSDDC500R is a highly optimized SSD designed for read-centric workloads enabling data centers to select SSDs tailored for workloads without overspending on more expensive write intensive SSDs. It delivers I/O speeds and response times (latency) that a data center can deploy with confidence to ensure high levels of performance in the working application and downstream at the user interface. These are typically defined by applications requiring real-time results. Serving large amounts of data, delivering responsive results from a variety of databases and web-based applications can leverage the receptive performance of the DC500R.DC500M: Mixed-use SSDDC500M is powerful SSD designed for mixed-use workload applications where the demand has a more balanced mix of read and write operations. It delivers greater write endurance over a wide range of workloads all while maintaining the strict performance consistency requirements designed into all of K ingston’s Data center SSDs. Data centers hosting databases and various web-based application=s can leverage the predictable I/O and latency performance while controlling infrastructure costs.End-to-end ProtectionThe DC500 Series SSDs incorporate end-to-end data path protection to help guarantee that all user data transferred into the SSD is protected against transient errors. DC500R / DC500M both include on-board (PLP) power loss protection (via power capacitors and firmware). This ensures data-in-flight is written to the NAND Flash memory in the event of unexpected power loss. Additionally, PLP ensures that the drives mapping table (FTL) is updated prior to power being removed from the drive. These power loss safeguards reduce the chance for data loss and ensure that the drive will successfully re-initialize on the next power-up of the system.Quality of Service (QoS)The DC500 Series delivers on QoS (2,3,4) with consistency, predictability of latency (response time) and IOPS (IOs Per Second) performance while servicing balanced read and write workloads. Performance predictability is essential for web hosting applications that must deliver on SLA’s promised to customers. The DC500 series efficiency produces the reliability for web server applications requiring read centric drives or mixed-use intensive workloads where uptime is mission critical.Application use casesDesigned for service providers running a wide range of customer applications including:- Virtualization- High-speed databases- High bandwidth media streaming - SQL server reporting services (SSRS)- SAP- BI, ERP , CRM, GL, OLAP , OLTP , ERM and EDW workloads - Cloud Service ProvidersBoth DC500R and DC500M feature enterprise-class reliability with end-to-end data path protection, SMART health monitoring and strong ECC. They are backed by legendary pre and post-sales support along with a five-year limited warranty.7Data Center DC500 Enterprise Solid-State Drives (SSDs)Performance, Reliability and Consistency> Predictable random I/O performance and latencies over a wide range of workloads > Read-centric design for performance in high read intensive workloads (DC500R)> Mixed-use design for balanced performance in high read / write intensive workloads (DC500M)> Configurable over-provisioning > On-board (PLP) power lossTHIS DOCUMENT SUBJECT TO CHANGE WITHOUT NOTICE.©2019 Kingston Technology Corporation, 17600 Newhope Street, Fountain Valley, CA 92708 USA. All rights reserved.All trademarks and registered trademarks are the property of their respective owners. MKD-401USSPECIFICATIONS>Form Factor 2.5 Inch>Interface SATA Rev. 3.0 (6Gb/s) – with backwards compatibility to SATA Rev. 2.0 (3Gb/s) >Capacities 1 480GB, 960GB, 1.92TB, 3.84TB >NAND 3D TLC>Self-Encrypting Drive (SED) AES 256-bit Encryption>Sequential Read/Write: (DC500R) 480GB – 555MBs/500MBs 960GB – 555MBs/525MBs 1.92TB – 555MBs/525MBs 3.84TB – 555MBs/520MBs >Steady-State 4k Read/Write: (DC500R)480GB – 98,000/12,000 IOPS 960GB – 98,000/20,000 IOPS1.92TB – 98,000/24,000 IOPS 3.84TB – 98,000/28,000 IOPS>Sequential Read/Write: (DC500M) 480GB – 555MBs/520MBs 960GB – 555MBs/520MBs 1.92TB – 555MBs/520MBs 3.84TB – 555MBs/520MBs >Steady-State 4k Read/Write: (DC500M)480GB – 98,000/58,000 IOPS 960GB – 98,000/70,000 IOPS1.92TB – 98,000/75,000 IOPS 3.84TB – 98,000/75,000 IOPS >Quality of Service (Latency)2, 3, 4- TYP Read/Write: <500 µs / <2 ms>Hot-Plug Capable>Static and Dynamic Wear Leveling>Enterprise SMART tools Reliability tracking, usage statistics, life remaining, wear leveling, temperature>Power Loss Protection Tantalum Capacitors>Endurance DC500R: 480GB — 438TBW 5 (0.5 DWPD) 6 960GB — 876TBW 5 (0.5 DWPD) 6 1.92TB — 1752TBW 5 (0.5 DWPD) 6 3.84TB — 3504TBW 5 (0.5 DWPD) 6DC500M:480GB – 1139TBW 5(1.3 DWPD) 6 960GB – 2278TBW 5 (1.3 DWPD) 61.92TB – 4555TBW 5 (1.3 DWPD) 6 3.84TB – 9110TBW 5 (1.3 DWPD)6>Power Consumption Idle: 1.56W Average: 1.6W Max Read: 1.8W Max Write: 7.5W >Storage temperature -40°C ~ 85°C >Operating temperature 0°C ~ 70°C >Dimensions 69.9mm x 100mm x 7mm >Weight 92.34g>Vibration operating 2.17G Peak (7–800Hz) >Vibration non-operating 20G Peak (10–2000Hz) >MTBF 2 million hours>Warranty/support 7 Limited 5-year warranty with free technical supportData Center DC500 Enterprise Solid-State Drives (SSDs)FEATURES/ BENEFITS>Optimized for read-intensive applications (DC500R) — Responsiveness from low latency and consistent I/O performance delivers businesses the QoS needed in demanding read-centric workloads.>Optimized for mixed-use applications (DC500M) — An exceptional balance of consistent I/O delivery and high read and write IOPS performance to manage a wide range of transactional workloads.>Reduce application latencies — Data center’s hosting databases and various web-based applications can leverage the predictable I/O and latency performance.>Data Integrity Protection — EECC protection with advanced read/disturb management safeguards against data corruption for end-to-end data protection.>On-board (PLP) Power Loss Protection — Reduce the possibility of data loss and/or corruption on ungraceful power-fails via power capacitors and firmware.The cryptographic functionalities, mentioned in the present section, are implemented in the firmware of the product. The cryptographic functions of the firmware can only be changed during the manufacturing process and cannot be changed by a regular user. The product is designed for installation by the user by following the step-by-step instruction from the installation user guide, supplied with the product, and, thereby, can be used without further substantial support of the supplier.1. Some of the listed capacity on a Flash storage device is used for formatting and other functions and thus is not available for data storage. As such, the actual available capacity for data storage is less than what is listed on the products. For more information, go to Kingston’s Flash Guide at /flashguide.2. Workload based on FIO, Random 4KB QD=1 workload, measured as the time taken for 99.9 percentile of commands to finish the round-trip from host to drive and to host.3. Measurement taken once the workload has reached steady state but including all background activities required for normal operation and data reliability.4. Based on 960GB capacity.5. Total Bytes Written (TBW) is derived from the JEDEC Enterprise Workload (JESD219A).6. Drives Writes Per Day (DWPD).7. Limited warranty based on 5 years or SSD “Life Remaining” which can be found using the Kingston SSD Manager (/SSDManager). A new, unused product will show a wear indicator value of one hundred (100), whereas a product that has reached its endurance limit of program erase cycles will show a wear indicator value of one (1). See /wa for details.PART NUMBERSDC500R (Read-Centric)SEDC500R/480G SEDC500R/960G SEDC500R/1920G SEDC500R/3840G DC500M (Mixed-Use)SEDC500M/480G SEDC500M/960G SEDC500M/1920G SEDC500M/3840G。
HM215WU1-500 Product Specification Rev.0
PROPRIETARY NOTE THIS SPECIFICATION IS THE PROPERTY OF BOE HF AND SHALL NOT BE REPRODUCED OR COPIED WITHOUT THE WRITTEN PERMISSION OF BOE HF AND MUST BE RETURNED TO BOE HF UPON ITS REQUESTSPEC. NUMBERS864-6018PRODUCT GROUP TFT MODULEISSUE DATE Rev. O 2011.6.9PAGE 1 OF 30TITLE : B3 HM215WU1-500 Product Specification Rev. 0HEFEI BOE OPTOELECTRONICS TECHNOLOGYR2010-6053-O(1/3)A4(210 X 297)PRODUCT GROUPPRODUCT SPEC-TFT MODULESPEC. NUMBER S864-6018 SPEC. TITLE B3 HM215WU1-500 Product Specification Rev. 0REV OISSUE DATE 2011.6.9 PAGE 2 OF 30REVISION HISTORYREV. 0 ECN No. DESCRIPTION OF CHANGESInitial ReleaseDATE 2011.05.25PREPARED 向贤明R2010-6053-O(2/3)A4(210 X 297)PRODUCT GROUPPRODUCT SPEC-TFT MODULE SPEC. NUMBER S864-6018SPEC. TITLE B3 HM215WU1-500 Product Specification Rev. 0REV OISSUE DATE 2011.6.9 PAGE 3 OF30ContentsNo. 1.0 2.0 3.0 4.0 5.0 6.0 7.0 8.0 9.0 10.0 11.0 12.0 13.0 14.0 15.0 General Description Absolute Maximum Ratings Electrical Specifications Optical Specifications Interface Connection Signal Timing Specifications Signal Timing Waveforms of Interface Signal Input Signals, Display Colors & Gray Scale of Colors Power Sequence Mechanical Characteristics Reliability Test Handling& Cautions Product Serial Number Packing Appendix Item Page 4 6 7 8 10 14 16 18 19 20 21 22 23 24 27R2010-6053-O(3/3)A4(210 X 297)PRODUCT GROUPPRODUCT SPEC-TFT MODULE SPEC. NUMBER S864-6018SPEC. TITLE B3 HM215WU1-500 Product Specification Rev. 0REV OISSUE DATE 2011.6.9 PAGE 4 OF301.0 GENERAL DESCRIPTION1.1 Introduction HM215WU1-500 is a color active matrix TFT LCD module using amorphous silicon TFT's (Thin Film Transistors) as an active switching devices. This module has a 21.5 inch diagonally measured active area with FHD resolutions (1920 horizontal by 1080 vertical pixel array). Each pixel is divided into RED, GREEN, BLUE dots which are arranged in vertical stripe and this module can display 16.7M colors. The TFT-LCD panel used for this module is adapted for a low reflection and higher color type.LVDS Input SignalConnector (CN 1 )LVDS Rx + T/CON + Mini LVDS TxSource DriverGate DriverVDDDC/DC Gamma VcomTFT LCD Panel 1920 × 1080CN2 LED Light Bar1.2 Features LVDS Interface with 2 pixel / clock High-speed response 6-bit (Hi-FRC) color depth, display 16. 7M colors Incorporated edge type back-light (Lower side - One Light Bar) High luminance and contrast ratio, low reflection and normal viewing angle DE (Data Enable) only RoHS CompliantR2010-6053-O(3/3)A4(210 X 297)PRODUCT GROUPPRODUCT SPEC-TFT MODULE SPEC. NUMBER S864-6018 1.3 Application Desktop Type of PC & Workstation Use Slim-Size Display for Stand-alone Monitor Display Terminals for Control System Monitors for Process ControllerSPEC. TITLE B3 HM215WU1-500 Product Specification Rev. 0REV OISSUE DATE 2011.6.9 PAGE 5 OF301.4 General Specification The followings are general specifications at the model HM215WU1-500. <Table 1. General Specifications> Parameter Active area Number of pixels Pixel pitch Pixel arrangement Display colors Display mode Dimensional outline Weight Surface Treatment Back-light Specification 476.64(H) × 268.11 (V) 1920(H) ×1080(V) 0.24825(H) ×0.24825(V) RGB Vertical stripe 16.7M Normally White 495.6(H) × 292.2(V) × 10.2(D) typ. 1450 (Typ.) Haze 25%, 3H Lower side 1-LED Light bar Type mm g colors Unit mm pixels mmRemarksR2010-6053-O(3/3)A4(210 X 297)PRODUCT GROUPPRODUCT SPEC-TFT MODULE SPEC. NUMBER S864-6018SPEC. TITLE B3 HM215WU1-500 Product Specification Rev. 0REV OISSUE DATE 2011.6.9 PAGE 6 OF302.0 ABSOLUTE MAXIMUM RATINGSThe followings are maximum values which, if exceed, may cause faulty operation or damage to the unit. The operational and non-operational maximum voltage and current values are listed in Table 2. < Table 2. Absolute Maximum Ratings>Symbol Parameter Power Supply Voltage Logic Supply Voltage Operating Temperature Storage Temperature VDD VIN TOP TST -0.5 VSS-0.3 0 -20 5.5 VDD+0.3 +50 +60 V V ℃ ℃ Ta = 25 ℃ 1) 1) Min. Max. Unit [VSS=GND=0V] RemarksNote : 1) Temperature and relative humidity range are shown in the figure below. Wet bulb temperature should be 39 OC max. and no condensation of water.100 90 80(39,90)Relative Humidity (%RH)60O p e ra tin g R a n g e40(50,50)(60,30)20S to ra g e R a n g e5 -2 0 0 20 40 60 80T e m p e ra tu re (˚ ) CR2010-6053-O(3/3)A4(210 X 297)PRODUCT GROUPPRODUCT SPEC-TFT MODULE SPEC. NUMBER S864-6018SPEC. TITLE B3 HM215WU1-500 Product Specification Rev. 0REV OISSUE DATE 2011.6.9 PAGE 7 OF303.0 ELECTRICAL SPECIFICATIONS3.1Electrical Specifications< Table 3. Electrical specifications >ParameterPower Supply Voltage Power Supply Current In-Rush Current Permissible Input Ripple Voltage High Level Differential Input Threshold Voltage Low Level Differential Input Threshold Voltage Differential input voltage Differential input common mode voltage LED Channel Voltage LED Channel Current LED Lifetime PD Power Consumption PBL Ptotal VDD IDD IRUSH VRF VIH VIL |VID | Vcm VL IL[Ta =25±2 ℃] Max.5.5 1200 3 100 +100 600 1.5 57.6 63 V mA Hrs W W W IL=60 mA, Note 5Min.4.5 -100 200 1.0 46.4 57 30,000 -Typ.5.0 700 1.2 51.2 60 3.5 12.29 15.79UnitVRemarksNote1mA A mV mV mV mV VIH=100mV, VIL=-100mV Note 2 VDD = 5.0VNotes : 1. The supply voltage is measured and specified at the interface connector of LCM. The current draw and power consumption specified is for VDD=5.0V, Frame rate=75HZ. Test Pattern of power supply current a) Typ : Color Bar pattern b) Max : Skip Sub Pixel Pattern2. Duration of rush current is about 2 ms and rising time of VDD is 520 μs ± 20 %3. The lamp frequency should be selected as different as possible from the horizontal synchronous frequency and its harmonics to avoid interference, which may cause line flow on the display 4. The voltage above this value should be applied to the lamps for more than 1 second to start-up. Otherwise the lamps may not be turned on. 5. Calculated value for reference (VL × IL) ×4(channel) excluding driver loss. (LED Light bar: 16S4P)R2010-6053-O(3/3)A4(210 X 297)PRODUCT GROUPPRODUCT SPEC-TFT MODULE SPEC. NUMBER S864-6018SPEC. TITLE B3 HM215WU1-500 Product Specification Rev. 0REV OISSUE DATE 2011.6.9 PAGE 8 OF304.0 OPTICAL SPECIFICATION4.1 OverviewThe test of Optical specifications shall be measured in a dark room (ambient luminance ≤ 1 lux and temperature = 25±2℃) with the equipment of Luminance meter system (Goniometer system and TOPCONE BM-5) and test unit shall be located at an approximate distance 50cm from the LCD surface at a viewing angle of θ and Φ equal to 0°. We refer to θØ=0 (=θ3 ) as the 3 o’clock direction (the “right”), θØ=90 (= θ12 ) as the 12 o’clock direction (“upward”), θØ=180 (= θ9 ) as the 9 o’clock direction (“left”) and θØ=270(= θ6 ) as the 6 o’clock direction (“bottom”). While scanning θ and/or Ø, the center of the measuring spot on the Display surface shall stay fixed. The measurement shall be executed after 30 minutes warm-up period. VDD shall be 5.0V +/-10% at 25°C. Optimum viewing angle direction is 6 ’clock.4.2 Optical Specifications[VDD = 5.0V, Frame rate = 60Hz, Clock = 78MHz, IBL = 240mA, Ta =25±2 ℃] ParameterHorizontal Viewing Angle range VerticalSymbolΘ3 Θ9 Θ12 Θ6 Θ3 Θ9 Θ12 Θ6 CR Yw ΔY White Wx Wy Red Rx Ry Green Gx Gy Blue Bx By Tr Tf CTConditionMin.35 35Typ.45 45 25 40 600 200 80 0.313 0.329 0.632 0.340 0.333 0.626 0.157 0.043 1.5 3.5Max.-UnitDeg. Deg. Deg. Deg. Deg. Deg. Deg. Deg.RemarkCR > 10 20 35 50 CR > 5 50 30 45 450 160 75 0.283 Θ = 0° (Center) Normal Viewing Angle 0.299 0.602 0.310 0.303 0.596 0.127 0.013Note 1Horizontal Viewing Angle range Vertical Luminance Contrast ratio Luminance of White White luminance uniformityNote 2 cd/m2 % 0.343 0.359 0.662 0.370 0.363 0.656 0.187 0.073 2.5 5.5 2.0 ms Note 6 ms % Note 7 Note 5 Note 3 Note 4Reproduction of colorResponse Time Cross TalkRising Falling--R2010-6053-O(3/3)A4(210 X 297)PRODUCT GROUPPRODUCT SPEC-TFT MODULE SPEC. NUMBER S864-6018SPEC. TITLE B3 HM215WU1-500 Product Specification Rev. 0REV OISSUE DATE 2011.6.9 PAGE 9 OF30Note :1. Viewing angle is the angle at which the contrast ratio is greater than 10. The viewing are determined for the horizontal or 3, 9 o’clock direction and the vertical or 6, 12 o’clock direction with respect to the optical axis which is normal to the LCD surface. Contrast measurements shall be made at viewing angle of θ= 0° and at the center of the LCD surface. Luminance shall be measured with all pixels in the view field set first to white, then to the dark (black) state. (See FIGURE 1 shown in Appendix) Luminance Contrast Ratio (CR) is defined mathematically. CR 3. = Luminance when displaying a white raster Luminance when displaying a black raster2.4.5.6.7.Center Luminance of white is defined as the LCD surface. Luminance shall be measured with all pixels in the view field set first to white. This measurement shall be taken at the locations shown in FIGURE 2 for a total of the measurements per display. The White luminance uniformity on LCD surface is then expressed as : ΔY = ( Minimum Luminance of 9points / Maximum Luminance of 9points ) * 100 (See FIGURE 2 shown in Appendix). The color chromaticity coordinates specified in Table 4. shall be calculated from the spectral data measured with all pixels first in red, green, blue and white. Measurements shall be made at the center of the panel. The electro-optical response time measurements shall be made as FIGURE 3 shown in Appendix by switching the “data” input signal ON and OFF. The times needed for the luminance to change from 10% to 90% is Td, and 90% to 10% is Tr. Cross-Talk of one area of the LCD surface by another shall be measured by comparing the luminance (YA) of a 25mm diameter area, with all display pixels set to a gray level, to the luminance (YB) of that same area when any adjacent area is driven dark. (See FIGURE 4 shown in Appendix).R2010-6053-O(3/3)A4(210 X 297)PRODUCT GROUPPRODUCT SPEC-TFT MODULE SPEC. NUMBER S864-6018SPEC. TITLE B3 HM215WU1-500 Product Specification Rev. 0REV OISSUE DATE 2011.6.9 PAGE 10 OF305.0 INTERFACE CONNECTION.5.1 Electrical Interface Connection●CN1Module Side Connector : UJU IS100-L300-C23 or Equivalent User Side Connector : JAE FI-X30H or EquivalentSymbol RXO0RXO0+ RXO1RXO1+ RXO2RXO2+ GND RXOCRXOC+ RXO3RXO3+ RXE0RXE0+ GND RXE1RXE1+ GND RXE2RXE2+ RXECRXEC+ RXE3RXE3+ GND NC NC NC VDD1 VDD2 VDD3 Function Negative Transmission data of Pixel 0 (ODD) Positive Transmission data of Pixel 0 (ODD) Negative Transmission data of Pixel 1 (ODD) Positive Transmission data of Pixel 1 (ODD) Negative Transmission data of Pixel 2 (ODD) Positive Transmission data of Pixel 2 (ODD) Power Ground Negative Transmission Clock (ODD) Positive Transmission Clock (ODD) Negative Transmission data of Pixel 3 (ODD) PositiveTransmission data of Pixel 3 (ODD) Negative Transmission data of Pixel 0 (EVEN) Positive Transmission data of Pixel 0 (EVEN) Power Ground Negative Transmission data of Pixel 1 (EVEN) Positive Transmission data of Pixel 1 (EVEN) Power Ground Negative Transmission data of Pixel 2 (EVEN) Positive Transmission data of Pixel 2 (EVEN) Negative Transmission Clock (EVEN) Positive Transmission Clock (EVEN) Negative Transmission data of Pixel 3 (EVEN) Positive Transmission data of Pixel 3 (EVEN) Power Ground Not connection, this pin should be open Not connection, this pin should be open Not connection Power Supply:+5V RemarkPin No 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30Note11： Note 1： This pin should be connected with GNDR2010-6053-O(3/3)A4(210 X 297)PRODUCT GROUPPRODUCT SPEC-TFT MODULE SPEC. NUMBER S864-6018SPEC. TITLE B3 HM215WU1-500 Product Specification Rev. 0REV OISSUE DATE 2011.6.9 PAGE 11 OF305.2 LVDS Interface (Tx; THC63LVDF83A or Equivalent) 5.2.1 ODD LVDS InterfaceTransmitter Pin No. 51 52 54 55 56 3 4 6 7 11 12 14 15 19 20 22 23 24 27 28 30 31 50 2 8 10 16 18 25 40 39 CLK OUTCLK OUT+ RXO CLKRXO CLK+ 8 9 42 41 OUT2OUT2+ RXO2RXO2+ 5 6 46 45 OUT1OUT1+ RXO1RXO1+ 3 4 48 47 OUT0OUT0+ RXO0RXO0+ 1 2 Pin No. Interface System (Tx) TFT-LCD (Rx) HM215WU1-500 (CN11) Pin No. RemarkInput Signal OR0 OR1 OR2 OR3 OR4 OR5 OG0 OG1 OG2 OG3 OG4 OG5 O D D L V D S OB0 OB1 OB2 OB3 OB4 OB5 Hsync Vsync DE MCLK OR6 OR7 OG6 OG7 OB6 OB7 RSVD38 37OUT3OUT3+RXO3RXO3+10 11R2010-6053-O(3/3)A4(210 X 297)PRODUCT GROUPPRODUCT SPEC-TFT MODULE SPEC. NUMBER S864-6018SPEC. TITLE B3 HM215WU1-500 Product Specification Rev. 0REV OISSUE DATE 2011.6.9 PAGE 12 OF305.2.2 EVEN LVDS InterfaceTransmitter Pin No. 51 52 54 55 56 3 4 6 7 11 12 14 15 19 20 22 23 24 27 28 30 31 50 2 8 10 16 18 25 40 39 CLK OUTCLK OUT+ RXE CLKRXE CLK+ 20 21 42 41 OUT2OUT2+ RXE2RXE2+ 18 19 46 45 OUT1OUT1+ RXE1RXE1+ 15 16 48 47 OUT0OUT0+ RXE0RXE0+ 12 13 Pin No. Interface System (Tx) TFT-LCD (Rx) HM215WU1-500 (CN11) Pin No. RemarkInput Signal ER0 ER1 ER2 ER3 ER4 ER5 EG0 EG1 EG2 EG3 EG4 E V E N L V D S EG5 EB0 EB1 EB2 EB3 EB4 EB5 Hsync Vsync DE MCLK ER6 ER7 EG6 EG7 EB6 EB7 RSVD38 37OUT3OUT3+RXE3RXE3+22 23R2010-6053-O(3/3)A4(210 X 297)PRODUCT GROUPPRODUCT SPEC-TFT MODULE SPEC. NUMBER S864-6018SPEC. TITLE B3 HM215WU1-500 Product Specification Rev. 0REV OISSUE DATE 2011.6.9 PAGE 13 OF305.3 Data Input Format(1,1) (2,1) (1919,1) (1920,1)R G B R G BR G B R G B1 Pixel = 3 DotsR G BR G B R G B (1,1080) (2,1080)R G B R G B (1919,1080) (1920,1080)Display Position of Input Data (V-H)5.4 Back-light Interface Connection●CN 2 LED LightBar Connector :CI1406M1HRL-NH or equivalentPin1 2 3 4 5 6Function Channel 1 Current Feedback Channel 2 Current Feedback LED Power Supply LED Power Supply Channel3 Current Feedback Channel4 Current FeedbackR2010-6053-O(3/3)A4(210 X 297)PRODUCT GROUPPRODUCT SPEC-TFT MODULE SPEC. NUMBER S864-6018SPEC. TITLE B3 HM215WU1-500 Product Specification Rev. 0REV OISSUE DATE 2011.6.9 PAGE 14 OF306.0 SIGNAL TIMING SPECIFICATION6.1 The HM215WU1-500 is operated by the DE only.Item Frequency Clock High Time Low TimeSymbols 1/Tc Tch TclMin 61.93 1091Typ 74.32 4/7 Tc 3/7 Tc 1125 60 16.67 1080 1100 960Max 92.90 1149 70 13.33 1200 -Unit MHzlines Hz ms lines clocks clocksFrame PeriodTv50 20Vertical Display Period One line Scanning Period Horizontal Display PeriodTvd Th Thd1060 -R2010-6053-O(3/3)A4(210 X 297)PRODUCT GROUPPRODUCT SPEC-TFT MODULE SPEC. NUMBER S864-6018SPEC. TITLE B3 HM215WU1-500 Product Specification Rev. 0REV OISSUE DATE 2011.6.9 PAGE 15 OF306.2 LVDS Rx Interface Timing ParameterThe specification of the LVDS Rx interface timing parameter is shown in Table 4. <Table 4. LVDS Rx Interface Timing Specification>Item CLKIN Period Input Data 0 Input Data 1 Input Data 2 Input Data 3 Input Data 4 Input Data 5 Input Data 6 Symbol tRCIP tRIP1 tRIP0 tRIP6 tRIP5 tRIP4 tRIP3 tRIP2 Min 10.76 -0.4 tRCIP/7-0.4 2 ×tRCIP/7-0.4 3 ×tRCIP/7-0.4 4 ×tRCIP/7-0.4 5 ×tRCIP/7-0.4 6 ×tRCIP/7-0.4 Typ 13.46 0.0 tRCIP/7 2 ×tRCIP/7 3 ×tRCIP/7 4 ×tRCIP/7 5 ×tRCIP/7 6 ×tRCIP/7 Max 16.15 +0.4 tRCIP/7+0.4 2 ×tRCIP/7+0.4 3 ×tRCIP/7+0.4 4 ×tRCIP/7+0.4 5 ×tRCIP/7+0.4 6 ×tRCIP/7+0.4 Unit nsec nsec nsec nsec nsec nsec nsec nsec RemarktRIP2 tRIP3 tRIP4 tRIP5 tRIP6 tRIP0 tRIP1 RXz +/* Z = 0, 1, 2,3 RxCLK+Rx3 Rx2 Rx1 Rx0 Rx6 Rx5 Rx4 Rx3 Rx2 Rx1 Rx0Vdiff=0[v]tRCIPVdiff=0[v]* Vdiff = (RXz+)-(RXz-),…. ,(RXCLK+)-(RXCLK-)R2010-6053-O(3/3)A4(210 X 297)PRODUCT GROUPPRODUCT SPEC-TFT MODULE SPEC. NUMBER S864-6018SPEC. TITLE B3 HM215WU1-500 Product Specification Rev. 0REV OISSUE DATE 2011.6.9 PAGE 16 OF307.0 SIGNAL TIMING WAVEFORMS OF INTERFACE SIGNAL7.1 Sync Timing WaveformsV-SyncOver 3 H-syncH-Sync Fix H-Sync width AreaDE1) Need over 3 H-sync during V-Sync Low 2) Fix H-Sync width from V-Sync falling edge to first rising edge7.2 Vertical Timing WaveformsTv TvdMCLK Th DER7 ~ R0 G7 ~ G0 B7 ~ B0Invalid Datax,1x,2x,yx,1050InvalidDatax+1,1R2010-6053-O(3/3)A4(210 X 297)PRODUCT GROUPPRODUCT SPEC-TFT MODULE SPEC. NUMBER S864-6018SPEC. TITLE B3 HM215WU1-500 Product Specification Rev. 0REV OISSUE DATE 2011.6.9 PAGE 17 OF307.3 Horizontal Timing WaveformsTh Thd MCLK Tc DERA7 ~RA0 GA7 ~GA0 BA7 ~BA0D1D2DnD1048 D1049 D1050InvalidDataD1D2D3TchTcl 2.0V 1.5VMCLK Tds Data0.8VTdh Data 2.0V 0.8VValid TesDE2.0VR2010-6053-O(3/3)A4(210 X 297)PRODUCT GROUPPRODUCT SPEC-TFT MODULE SPEC. NUMBER S864-6018SPEC. TITLE B3 HM215WU1-500 Product Specification Rev. 0REV OISSUE DATE 2011.6.9 PAGE 18 OF308.0 INPUT SIGNALS, BASIC DISPLAY COLORS & GRAY SCALE OF COLORSColor & Gray Scale Black Blue Green Cyan Red Magenta Yellow White Black △ Darker △ ▽ Brighter ▽ Red Black △ Darker △ ▽ Brighter ▽ Green Black △ Darker △ ▽ Brighter ▽ Blue Black △ Darker △ ▽ Brighter ▽ White R7 0 0 0 0 1 1 1 1 0 0 0 R6 0 0 0 0 1 1 1 1 0 0 0 RED DATA R5 R4 R3 R2 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 0 0 0 0 0 0 0 0 0 0 0 0 ↑ ↓ 1 1 1 1 1 1 1 1 1 1 1 1 0 0 0 0 0 0 0 0 0 0 0 0 ↑ ↓ 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 ↑ ↓ 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 ↑ ↓ 1 1 1 1 1 1 1 1 1 1 1 1 R1 0 0 0 0 1 1 1 1 0 0 1 R0 0 0 0 0 1 1 1 1 0 1 0 GREEN DATA G7 G6 G5 G4 G3 G2 G1 G0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 1 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 ↑ ↓ 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 1 0 0 0 0 0 0 1 0 ↑ ↓ 1 1 1 1 1 1 0 1 1 1 1 1 1 1 1 0 1 1 1 1 1 1 1 1 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 ↑ ↓ 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 1 0 0 0 0 0 0 1 0 ↑ ↓ 1 1 1 1 1 1 0 1 1 1 1 1 1 1 1 0 1 1 1 1 1 1 1 1 B7 0 1 0 1 0 1 0 1 0 0 0 B6 0 1 0 1 0 1 0 1 0 0 0 BLUE DATA B5 B4 B3 B2 0 0 0 0 1 1 1 1 0 0 0 0 1 1 1 1 0 0 0 0 1 1 1 1 0 0 0 0 1 1 1 1 0 0 0 0 0 0 0 0 0 0 0 0 ↑ ↓ 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 ↑ ↓ 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 ↑ ↓ 1 1 1 1 1 1 1 1 1 1 1 1 0 0 0 0 0 0 0 0 0 0 0 0 ↑ ↓ 1 1 1 1 1 1 1 1 1 1 1 1 B1 0 1 0 1 0 1 0 1 0 0 0 B0 0 1 0 1 0 1 0 1 0 0 0Basic ColorsGray Scale of REDGray Scale of GREEN1 1 1 0 0 01 1 1 0 0 00 1 1 0 0 01 0 1 0 0 00 0 0 0 0 00 0 0 0 0 00 0 0 0 0 00 0 0 0 0 0Gray Scale of BLUE0 0 0 0 0 00 0 0 0 0 00 0 0 0 0 00 0 0 0 0 00 0 0 0 0 00 0 0 0 0 00 0 0 0 0 10 0 0 0 1 0Gray Scale of WHITE0 0 0 0 0 00 0 0 0 0 00 0 0 0 0 10 0 0 0 1 01 1 1 0 0 01 1 1 0 0 00 1 1 0 0 11 0 1 0 1 01 1 1 1 1 10 1 11 0 11 1 1 1 1 10 1 1 0 1 1R2010-6053-O(3/3)A4(210 X 297)PRODUCT GROUPPRODUCT SPEC-TFT MODULE SPEC. NUMBER S864-6018SPEC. TITLE B3 HM215WU1-500 Product Specification Rev. 0REV OISSUE DATE 2011.6.9 PAGE 19 OF309.0 POWER SEQUENCETo prevent a latch-up or DC operation of the LCD module, the power on/off sequence shall be as shown in below0.9VDD0.9VDD 0.1VDDPower Supply0V0.1VDDT1 T2 Valid0VT3T4Interface SignalT5T6Back- light0V● ● ● ● ● ●0.5 ms ≤ T1 ≤ 10 ms 0 ≤ T2 ≤ 50 ms 0 ≤ T3 ≤ 50 ms 1 sec ≤ T4 200 ms ≤ T5 200 ms ≤ T6Notes:1. When the power supply VDD is 0V, keep the level of input signals on the low or keep high impedance. 2. Do not keep the interface signal high impedance when power is on. 3. Back Light must be turn on after power for logic and interface signal are valid.R2010-6053-O(3/3)A4(210 X 297)PRODUCT GROUPPRODUCT SPEC-TFT MODULE SPEC. NUMBER S864-6018SPEC. TITLE B3 HM215WU1-500 Product Specification Rev. 0REV OISSUE DATE 2011.6.9 PAGE 20 OF3010.0 MECHANICAL CHARACTERISTICS10.1 Dimensional Requirements FIGURE 6 (located in Appendix) shows mechanical outlines for the model HM215WU1-500. Other parameters are shown in Table 5. <Table 5. Dimensional Parameters>Parameter Dimensional outline Weight Active area Pixel pitch Number of pixels Back-light Specification Unit mm gram mm mm pixels495.6 ×292.2×10.2 1450 (typ.) 476.64(H) × 268.11(V) 0.24825(H) x 0.24825(V) 1920(H)×1080(V) (1 pixel = R + G + B dots) Lower side 1-LED Light bar Type10.2 Mounting See FIGURE 5. (shown in Appendix) 10.3 Anti-Glare and Polarizer Hardness. The surface of the LCD has an anti-glare coating to minimize reflection and a coating to reduce scratching. 10.4 Light Leakage There shall not be visible light from the back-lighting system around the edges of the screen as seen from a distance 50cm from the screen with an overhead light level of 350lux.R2010-6053-O(3/3)A4(210 X 297)PRODUCT GROUPPRODUCT SPEC-TFT MODULE SPEC. NUMBER S864-6018SPEC. TITLE B3 HM215WU1-500 Product Specification Rev. 0REV OISSUE DATE 2011.6.9 PAGE 21 OF3011.0 RELIABLITY TESTThe Reliability test items and its conditions are shown in below. <Table 6. Reliability Test Parameters > No 1 2 3 4 5 6 7 Test ItemsHigh temperature storage test Low temperature storage test High temperature & high humidity operation test High temperature operation test Low temperature operation test Thermal shock Vibration test (non-operating) Ta = 60 ℃, 240 hrs Ta = -20 ℃, 240 hrs Ta = 50 ℃, 80%RH, 240hrs Ta = 50 ℃, 240hrs Ta = 0 ℃, 240hrs Ta = -20 ℃ ↔ 60 ℃ (0.5 hr), 100 cycleFrequency Gravity / AMP Period Gravity 10 ~ 300 Hz, Sweep rate 30 min 1.5 G X, Y, Z 30 min Conditions50G 11msec, sine wave± X, ± Y, ± Z Once for each8Shock test (non-operating)Pulse widthDirection9 10Electro-static discharge test (non-operating)Air : 150 pF, 330Ω, 15 KV Contact : 150 pF, 330Ω, 8 KVAltitude testOperating: 0 to 16400ft , 0 to 40° Non Operating: 0 to 40000ft, -20 to 40°R2010-6053-O(3/3)A4(210 X 297)PRODUCT GROUPPRODUCT SPEC-TFT MODULE SPEC. NUMBER S864-6018SPEC. TITLE B3 HM215WU1-500 Product Specification Rev. 0REV OISSUE DATE 2011.6.9 PAGE 22 OF3012.0 HANDLING & CAUTIONS(1) Cautions when taking out the module Pick the pouch only, when taking out module from a shipping package. (2) Cautions for handling the module As the electrostatic discharges may break the LCD module, handle the LCD module with care. Peel a protection sheet off from the LCD panel surface as slowly as possible. As the LCD panel and back - light element are made from fragile glass material, impulse and pressure to the LCD module should be avoided. As the surface of the polarizer is very soft and easily scratched, use a soft dry cloth without chemicals for cleaning. Do not pull the interface connector in or out while the LCD module is operating. Put the module display side down on a flat horizontal plane. Handle connectors and cables with care. (3) Cautions for the operation When the module is operating, do not lose CLK, ENAB signals. If any one of these signals is lost, the LCD panel would be damaged. Obey the supply voltage sequence. If wrong sequence is applied, the module would be damaged. (4) Cautions for the atmosphere Dew drop atmosphere should be avoided. Do not store and/or operate the LCD module in a high temperature and/or humidity atmosphere. Storage in an electro-conductive polymer packing pouch and under relatively low temperature atmosphere is recommended. (5) Cautions for the module characteristics Do not apply fixed pattern data signal to the LCD module at product aging. Applying fixed pattern for a long time may cause image sticking. (6) Other cautions Do not disassemble and/or re-assemble LCD module. Do not re-adjust variable resistor or switch etc. When returning the module for repair or etc., Please pack the module not to be broken. We recommend to use the original shipping packages.R2010-6053-O(3/3)A4(210 X 297)PRODUCT GROUPPRODUCT SPEC-TFT MODULE SPEC. NUMBER S864-6018SPEC. TITLE B3 HM215WU1-500 Product Specification Rev. 0REV OISSUE DATE 2011.6.9 PAGE 23 OF3013.0 PRODUCT SERIAL NUMBERHM215WU1-500B31 X X X23 X X4 X5 X X X X X6 X X X X X7 X1. 2. 3. 4.Control Number( 2 digital or letter ) Rank / Grade (1 letter) Line Classification (B3 line:3 ) Year (2001 : 01, 2002 : 02, …)5. Month (1,2,3, … , 9, X, Y, Z) 6. Internal Use (FG-code,4 digital) 7. Serial Number(000000—FFFFFF)R2010-6053-O(3/3)A4(210 X 297)PRODUCT GROUPPRODUCT SPEC-TFT MODULE SPEC. NUMBER S864-6018SPEC. TITLE B3 HM215WU1-500 Product Specification Rev. 0REV OISSUE DATE 2011.6.9 PAGE 24 OF3014.0 Packing14.1 Packing OrderPut EPE Cushion into the box As shown in the figure, place the modules bundled by packing bag In the boxAfter sealing the box, attach Packing Label on the attach position sign area of the box.Place EPE cover on top of the boxR2010-6053-O(3/3)A4(210 X 297)PRODUCT GROUPPRODUCT SPEC-TFT MODULE SPEC. NUMBER S864-6018SPEC. TITLE B3 HM215WU1-500 Product Specification Rev. 0REV OISSUE DATE 2011.6.9 PAGE 25 OF3014.2 Pallet Packing OrderLoad Pallet in correct positionPile up the unit Box filled with Modules on the Pallet carefully not to make a space.Box coverPolyester bendOut boxAdjust Outer box to piling Boxes and cover the Outer box using box cover. Bend Pallet Assy which is putting the Box Cover tight in two direction (horizontal and vertical) and two times using Polyester bend.Wrap the Pallet Assy loaded 1story, 2stories from downside through side and to edge of upside. (12Boxes/Pallet)R2010-6053-O(3/3)A4(210 X 297)PRODUCT GROUPPRODUCT SPEC-TFT MODULE SPEC. NUMBER S864-6018SPEC. TITLE B3 HM215WU1-500 Product Specification Rev. 0REV OISSUE DATE 2011.6.9 PAGE 26 OF3014.3 Packing Specification and NoteBox Dimension : 348(W) × 558mm(L) × 400mm(H) Package Quantity in one Box : 10pcs Specification ItemPanel Cushion Box Packing Box PalletQ'ty1 1 1 10pcs/Box 1Dimension495.6(H) × 292.2(V) × 10.2(D) typ. 558(L)mm x 348(W)mm x 400(H)mm 558(L)mm x 348W)mm x 400(H)mm 1200(L)mm x 1140(W)mm x 120(H)mmWeight (kg)1.48 0.70 0.70 16.20 15.90 214Remarkwithout Panel & cushion with panel & cushion -Pallet after Packing 12boxes/pallet 1140(L)mm x 1076W)mm x 820(H)mm14.4 Box labelLabel Size : 108 mm (L) × 56 mm (W) Contents Model : HM215WU1-500 Q`ty : Module Q`ty in one box Serial No. : Box Serial No. See next page for detail description. Date : Packing Date FG Code : FG Code of ProductHM215WU1-500 0000000000000 594010 201X.X.XX00 0 00 0 0 000000 Type Grade Year Month ITEM-CODE Serial_noFG CODERoHS MarkR2010-6053-O(3/3)A4(210 X 297)。
Hilti HIT-RE500注射胶与500级钢筋技术资料说明书
Hilti HIT-RE500 Injectable Mortar with Grade 500 Rebar2 -34 – 6 7 - 13 14 -15 16 – 17 18 - 22 23 – 36 37 - 45 46 - 68 69 - 70 71 73 - 80 81 - 87Sample Submission and Approval Form Chemical Anchor System Summary & SAFEset Product CatalogueTechnical data & Setting Details Detailed Consumption Table Method Statement for Installation Loading Test Report (BS5080: Part 1)*Fire Performance Assessment Report (WF 327804/B Issue 2)* Fire Performance Test Report (IBMB 3357/0550-5)* Government Letter Country of OriginMaterial Safety Data Sheet Job ReferenceSAMPLE SUBMISSION AND APPROVAL FORMContract Title: ________________________________ Ref. No.: ________________________________________________________ Date: ________________________Ref. No. of________________________PreviousSubmission:Contract No: ________________________________ (1)________________________ File Reference: ________________________________ (2)________________________ DETAILS OF SUBMISSIONTo: Contract Manager’s Representative Attention: ________________________ From: ________________________________The enclosed sample and catalogue* / certificate of origin* / technical data* / test report* / job reference* as described below have been checked for compliance with the Specifications and Drawings, and are submitted for approval.1.General Informationa.Material Description HIT – RE500 Injection Adhesive____________________________________________________________________________________________________________________b.Location: Re-bar fastening____________________________________________________________________________________________________________________c.Specification Ref. Page:__________________________ Item: _________________________________________________ _________________________________________________ _______________________d.Drawing Ref. No.______________________________________________________________________________________________________________________________________________________________________________e.B.Q. Ref.No.:______________________________________________________________________________________________________________________________________________________________________________f.Anticipated date of approval:__________________________________________________________2.Technical InformationThe submitted sample has been checked against the specification and drawings as listed below:-Specification Requirements Submitted Sample(State details against each item)a.BrandNot specified Hiltib.Country of OriginNot specified Germanyc.Manufacturer’s Name & AddressNot specified Hilti Corporation, FL-9494 Principality of Liechtenstein.d.Factory’s Name & Address(es)Not specified Hilti Gmbh Ind. Ges. F. BefestigungstechnikHiltistrasse 6, D-86916 Kaufering, Germany.e.Supplier (with Applicator, if any)Not specified Hilti (Hong Kong) Ltdf. AppearanceNot specified According to the sample submittedg. Color +Not specified Redh. SpecificationNot specified Attachedi. Manufacturer’s CatalogueNot specified Attachedj. Test Report (Original/Certificated True Copy)Not specified Attachedk. Previous Job ReferenceNot specified Attachedl. Supplementary InformationNot specified NILFor and on behalf of the Contractor____________________________(Quality Control Manager)CONTRACT MANAGER’S COMMENTSTo:From: Contract Manager’s Representative: ________________________________On the basis of the sample and information given, the above sample submitted is:(1) * Approved.(2) * Not approved because __________________________________________________________________________________________________________________________________________________________________________________________________ Remarks: _______________________________________________________________________ ______________________________________________________________________________________________________________________________________________ Approval does not alter the requirements of the ContractContract Manager’s Representative: _________________________________________________________Date:cc. ____________________________________________________________________________________________________________________________________________________________(* Delete if appropriate)(+ For glass or vitreous mosaic tiles, the contractor is required to confirm the colour range(s) of the submitted sample, i.e. a) light and or medium; or b) dark)技術化學安卡錨栓總覽Injectable mortar Hilti HIT-RE 500Applications■Structural connections with post-installed rebar (e.g. extension/connection to walls, slabs, stairs, columns, foundations, etc.)■Substitution of misplaced/missing rebars or couplers■Anchoring structural steel connections (e.g. steel columns, beams, etc.)■Anchoring crash barriers, noise barriers, etc.■Structural renovation of buildings, bridges and other civil struc-tures, retrofitting and re-strengthening of concrete members possible■Suitable for underwater applications in hammer-drilled holes Advantages■High performance and technical superiority as per international approvals■Especially suitable for large-diameter elements and/or deep embedment depths■No expansion forces in concrete allow secure fastenings even close to edges and/or with close spacing■Virtually odourless hence convenient to work with ■Suitable for anchoring in diamond cored holes■Unique foil packaging and compatible Hilti HIT injection system makes handling extremely easyBase materials◾Concrete (uncracked)Always observe/follow the instructions accompanying the product or refer to/techlib.to the documents for details.Dispenser HDE 500-A22Applications■Injection of Hilti HIT adhesive mortar for fastening anchor rods and rebars in concrete and masonry■No need for external power source supply■Serial fastenings and/or injection in deep holesAdvantages■Dose adjustment knob for accurate and controlled dispensing ■Fast, easy foil pack loading■High battery capacity (up to 100x500ml foil packs)Dispenser HDMApplications■Injection of Hilti HIT adhesive mortar for fastening anchor rods and rebars in concrete and masonry Advantages■Fast, easy foil pack loading4Hammer drill bit TE-YDApplications■Drilling holes for anchoring structural steel connections (e.g. steel columns, beams)Advantages■Drilling and hole cleaning in one stepHammer drill bit TE-CDApplications■Drilling holes for structural connections with post-installed rebarsAdvantages■Drilling and hole cleaning in one stepAccessories for blowing out drilled holes Hilti HITApplications■For fast and efficient removal of dust and debris from drilled holes of varying diameters and depths to allow correct installa-tion of anchors and rebarHilti HIT Profi accessories Air nozzleApplications■Clearing dust and debris from drilled holes under various condi-tions including where adhesive anchors are set at great depth Advantages■Fast, effective cleaning of drilled holesAccessories for using brushes to clean holes Hilti HITApplications■For the proper brushing of drilled holes of varying diameters andembedment depths8Profi accessories for mortar injection Hilti HITApplications■For injection of Hilti HIT adhesive mortars in a variety of situa-tions including deep holes, overhead holes and in underwater applicationsAdvantages■Injection pistons and flexible extension hoses help ensure con-sistent injection of the adhesive into the hole without formationof air voidsOverhead cupHIT Profi accessories (Glasses & empty cases)Mixers and extensions Hilti HITUniversal vacuum cleaner VC 40-UMApplications■Removing dust from drilling, slitting, grinding, cutting and dry coring■Removing slurry from wet coring and cleaningAdvantages■Hilti AirBoost filter technology for consistently high suction performance■Very good handling thanks to compact design■Full exploitation of tank capacity due to placement of filter and hose connection in the upper part of the machine■Robust housing to withstand the harshest jobsite conditions ■New tank concept for easy and virtually dust-free dust removal ■Maximum total load of dust: up to 40 kgo n g K o n g 8228 8118 M a c a u 008008228 8118 (M o n - F r i 8:30 a m - 6:00 p m / S a t 8:30 a m - 1:00 p m ) | F a s t O r d e r i n g , P r o m p t & F r e e D e l i v e r y C u s t o m e r H o t l i n e : H o n g K o n g 8228 8118 M a c a u 008008228 8118 (M o n - F r i 8:30 a m - 6:00 p m / S a t 8:30 a m - 1:00 p m ) | F a s t O r d e r i n g , P r o m p t & F r e e D e l i v e r y 2H I T -R E 500I n j e c t i o n A d h e s i v eB e s tC h e m i c a l A n c h o rf o r r e b a r f a s t e n i ng u n d e r d i f f e r e n t c o n d i t i o n sH i g h P e r f o r m a n c e & S a f e t y V s o t h e r i n j e c t i o n a d h e s i v e40% h i g h e r t e n s i l e l o a d i n n o r m a l h o l e .30% h i g h e r t e n s i l e l o a d i n w e t a n d w a t e r -f i l l e d h o l e .S u i t a b l e f o r b o t h d r i l l e d o r d i a m o n d c o r e d h o l e .✓✓✓S a v e M a t e r i a l & L a b o u r C o s t V s h a r d c a r t r i d g e i n j e c t i o n a d h e s i v e70% l e s s w a s t a g e c o m p a r e d t o h a r d c a r t r i d g e .R e d u c e d i s p o s a l c o s t .S h o r t d i s p e n s i n g t i m e .✓✓✓y A p p r o v e d b a r f a s t e n i n gy i n j e c t i o n a d h e s i v e l i s t e d i n “F i r e p r o t e c t i o n s f o r s t r u c t u r a l u s e o f C e n t r a l D a t a B a n k ”.i r e r e s i s t a n c e W a r r i n g t o n t e s t r e p o r t .d s i m p le l o a d i n g s e l e c t i o n t a b l e .n i e n t & F l e x i b l e V s o t h e r o n a d h e s i v eg e c a n b e u s e d f r o m 5˚C t o 40˚C .o r k i n g t i m e (20m i n s ) a t 30˚C .d i s pe n s i n gf o r c e r e q u i r e d , c o m p a r e d t o h a r d e .W E A K E R b o n d s t r e n g t h70% M O R E w a s t a g e c o m p a r e d t o f o i l p a c kL I M I T E D t e m p e r a t u r e r a n g e (20˚C t o 32˚C ) f o r c a r t r i d g e d i s p e n s i n gI N S U F F I C I E N T w o r k i n g t i m e (8.5m i n s ) a t 30˚CH I G H E R d i s p e n s i n g f o r c eL A C K o f r e f e r e n c e / a p p r o v alO t h e r I n j e c t i o n A d h e s i v eHIT RE 500 foil pack, mixerCartridge Holder, HIT-CB 500Basic Setting Detail, Loading Data & Testing LoadRemarks:1.It is based on non-cracked concrete with strength 30N/mm 2;2.Yield strength of rebar f yk is 500N/mm 2;3.There is no factor of safety introduced in the ultimate mean pull out load. Please applyappropriate factor of safety in your design ;4.Onsite pullout test can be carried out to verify the workmanship of the installation but shouldnot be verification of the ultimate loading. The testing load shall be subjected to the designer’s decision but should not exceed the 0.87 x yield load to avoid permanent damage to the rebar.5.All the spacing and edge distance requirement for reinforced concrete design should be reference toBS8110;6.If there is a fire resistance concern, the loading should be referred to the fire tableTechnical InformationSetting DetailsConsumption Table for Quick ReferenceRemark:1)Please refer to ‘Detail ed consumption table’ for more information2)The filled volume was calculated by the following equation and is for reference only.Filled volume = [(D/2)2- (R/2)2] x 3.14 x Iwhere D = hole diameter, I = hole depth, R = rebar diameter2)The filled volume showed in the table did not include any wastage during the installation.3) 1 trigger pull of dispenser HDM is approx. 6 ml of RE 500.To dispense 1 cartridge of 500ml RE 500 needs approx. 80 triggers.Mechanical PropertiesTechnical Information*Please note that above consumption table is based on good workmanship andfor reference only*Please note that above consumption table is based on good workmanship andfor reference onlyMethod statement of RE500 installationMethod statement of RE500 installationMethod statement of RE500 installation。
镍钛产品疲劳测试早期断裂原因分析
镍钛产品疲劳测试早期断裂原因分析祁凤君;穆盈;廖经友;李晓玲【摘要】镍钛合金医疗器械产品,在疲劳测试过程中发生早期断裂,但该批原材料经检验是合格的.通过金相显微镜、扫描电镜及能谱等对产品断裂原因进行分析.结果表明,产品早期断裂是由于在承受最大应力的区域,局部存在夹杂物缺陷,致使产品在周期性疲劳应力作用下,产生早期疲劳断裂失效.【期刊名称】《热处理技术与装备》【年(卷),期】2018(039)003【总页数】5页(P53-57)【关键词】镍钛合金;疲劳;硅胶管;夹杂物【作者】祁凤君;穆盈;廖经友;李晓玲【作者单位】深圳市领先动物实验服务中心,广东深圳518057;深圳市领先动物实验服务中心,广东深圳518057;深圳市领先动物实验服务中心,广东深圳518057;深圳市领先动物实验服务中心,广东深圳518057【正文语种】中文【中图分类】TG113.25+5NiTi合金具有良好的形状记忆效应和超弹性特性，以及较长的疲劳寿命、优异的抗腐蚀性、抗打结性、较好的生物相容性等，在医学领域广泛应用于医疗器械产品。
镍钛合金医疗器械产品，在进行疲劳测试过程中(一批六支)，当运行至1.75千万次时，其中一支产品出现断裂，技术要求(8千万次，无断裂)。
该产品生产工艺：镍钛管激光切割→热定型→去除氧化层→表面处理→质量检查→疲劳试验→验收。
为此，笔者对失效产品进行断裂原因分析。
1 理化检验1.1 化学成分、力学性能、洁净度分析对镍钛合金产品原材料进行化学成分、力学性能、洁净度分析，结果见表1～3。
结果表明，化学成分、力学性能及洁净度均符合技术要求[1]。
表1 化学成分测试结果(质量分数，%)Table 1 Testing results of chemical compositi on(ω，%)元素NiCCoCuCrHFeNbN+OTi实测值56.03<0.0020<0.0050<0.0050<0.0050<0.0008<0.0050<0.0050<0.0220余量技术要求54.5～57.0≤0.050≤0.050≤0.010≤0.010≤0.005≤0.050≤0.025≤0.050余量表2 力学性能测试结果Table 2 Testing results of mechanical properties项目应变3%的强度/MPa抗拉强度/MPa延伸率/%实测值527113818.2技术要求≥380≥1070≥10表3 洁净度测试结果Table 3 Testing results of cleanliness项目疏松和非金属夹杂物(×500观察)实测值最严重视场含量0.6%单颗≤12 μm技术要求含量<2.8%单颗≤39 μm1.2 宏观分析在距离分叉大约200～600 μm处疲劳断裂，断裂平齐，未见明显塑性变形，为脆性断裂，见图1。
TQT500B用户使用说明书
深圳市诚质半导体设备有限公司
ShenZhen Trust Quality Semiconductor Equipment Co.,Ltd.
本系统适用于 IC 工程测试分析及量产测试，具有数字电路数字量，DC 及 AC 参数测量功能；本系统 开发在 DOS 操作系统下，具有可靠性高，稳定性好，适应长时间运行特点。软件操作界面简洁明了，方便 实用。TTL 接口可与多种 Prober/Handler 连接，并且可通过软件调节接口信号触发方式，适应不同机器 接口；通过 RS232 与 Prober 连接可以生成 Wafer Map，便于测试跟踪分析。
9.Learn Memory 系统内部配置 1M 深度 Learn Memory 用来存放用户 Learn 出来的测试向量。在有的时候不知产品的输 出向量，或是要进行工程验证，这时可以先把输入测试向量 Load 到 Pattern Memory 中，然后运行 LEARN 功能，这时系统会把 IC 的输出向量读出并存放在 Learn Memory 中，进行分析或测试。
深圳市诚质半导体设备有限公司
ShenZhen Trust Quality Semiconductor Equipment Co.,Ltd.
4
RELAY1
Hale Waihona Puke R1Relay Driver
DUT Board
+5V
RELAY16
R16
图（四）
6.VI/VO 系统有两组 VI（VIH1、VIL1，VIH2、VIL2），两组 VO（VOH1、VOL1，VOH2、VOL2） CH1-8（IN1-8）对应 VIH1、VIL1，CH17-32（OUT17-32）对应 VOH1、VOL1，CH9-16（IN9-16）对应 VIH2、 VIL2，CH33-48（OUT33-48）对应 VOH2、VOL2。双颗测试时，只要对 VIH1、VIL1、VOH1、VOL1 设定，其 设定值同时会自动复制到 VIH2、VIL2、VOH2、VOL2 上。具体技术参数见《TQT500B IC 测试机系统规格》。
unc500说明书
unc500说明书Uc500采用美国阿特金斯公司的高性能计算平台MATLAB DUAK架构，采用高效并行处理技术进行数字信号处理和数据处理。
Unc500 (DeliveryUnc500)是一款高性能高速模拟芯片，采用ARMCortex-M0内核，最高可达1.7 GHz。
集成了高性能计算与图形处理技术，内置DSP模块并实现了GPU和AI计算能力增强与多项GPU、FPGA、ASIC等处理芯片集成设计，实现了高度定制化处理能力。
Unc500集群采用了先进成熟算法及设计逻辑实现方案，对高性能计算应用软件具有很强针对性。
为进一步提高数据处理能力、应用效率和资源调度能力，提高运行速度及可靠性。
1、Uc500可以完成：高速数模混合、矢量和离散信号分析、信号检测和处理，以及处理实时数据等目标应用在现代信号分析中，数据的分析处理非常重要，它能快速、准确地给出各种信号的强度、幅值、频率、偏移，甚至是信号本身的固有特性。
因此，实时分析对信号处理中的数据处理提出了极高的要求。
数据采集是一个过程，而建模和分析是数据中的基础工作。
建模就是把一个物理模型与建模的过程融合到一起；分析就是对原始数据进行建模、分析、预测和处理等工作。
而建模就包括三个过程：数据预处理、数据整理、模型构建、数据分析。
2、信号分析与通信算法模型支持多种协议，包括传统的基于时间和空间的通信协议，例如基于时间的信道聚合协议，基于空间的数据融合和通信协议，以及基于时间的数据预处理协议。
可实现多种协议的模拟，包括语音、视频、数据与网络。
同时，可实现多种算法模型进行训练和仿真。
具有多协议融合功能的无线通信系统（如WLAN、CDMA等）可以有效降低无线网络的成本和功耗，改善无线通信网络中接收和发送信号的质量。
与传统无线通信系统相比，该方案具有体积小、功耗低、抗干扰能力强等优点；该方案在基站与用户终端之间采用了无线传感器网络(WLAN)进行信号融合时会产生大量的时间信号（如图2所示);同时在WLAN中应用WLAN网络是基于距离决定的；此外该方案还具有抗电磁干扰能力强、能耗低优点；它还具有抗干扰能力强、与WiFi网络结合可提供更快更稳定支持、适合无线网络通信、可与PC机连接等优点。
SynCTI 5.1.0.0升级说明 (2009年11月)说明书
SynCTI Upgrade Instruction(November 2009) New features added in SynCTI 5.1.0.0 to support IP-based service providers and application developers.Synway, a leading player specializing in designing hardware and software building blocks for use in Computer Telephony Integration (CTI) and VoIP applications, releases its latest driver version SynCTI 5.1.0.0 after adding powerful new features.The version is specially updated for SHN new boards, such as SHN-8B-CT/PCI+, SHN-16B-CT/PCI+, SHN-32B-CT/PCI+, SHN-60B-CT/PCI+, SHN-120B-CT/PCI+. These boards leverage multimedia processing and signaling technologies to deliver cost effective, flexible, high performance IP-based services or applications.All SHT series boards are optimized to become more robust in extreme conditions, with better encoding ability, and stronger capability of monitoring other boards, while the USB voice boxes are improved to receive DTMF much more powerfully.Synway’s engineers have added some features to the DST series (for tapping digital station), to perfectly support PBX and phone from a wide variety of leading vendors, which guarantee developers to design and create versatile platforms.More information could be found in the following table, or you could contact Synway’s sales representatives for more information. To obtain the latest driver, please click:/Support/Driver.aspx.SynCTI Ver. 5.1.0.0Release Date: November, 2009New Boards Series Feature Board Model New FeatureNote SHN VoIP SHN-8B-CT/PCI+ SHN-16B-CT/PCI+ SHN-32B-CT/PCI+ SHN-60B-CT/PCI+ SHN-120B-CT/PCI+ 1) PCI 2.2 bus support 2) DMA read and write support 3) Integrated LAN 4) Processing of network protocols in hardware 5) Easy upgrade of firmware6) Multiple programming modes support 7) Various VoIP CODECs support 8) Barge-in functionality 9) Highly efficient, real-time call control and voice processing 10) Unified SynCTI driver development platform NoneNew Features & Fixed Bugs for Other Boards Series Feature Supported Board Model New Feature & Fixed BugThe 16B boards optimize the A-Law, µ-Law encoding algorithms to prevent DSP exception.Solve the problem that one end of a station channel on 16B analog boards was probably blocked. All SHT series boardsImprove the 8B boards’ capability of monitoring other boards.Eliminate the Blue Screen of Death caused by unprotected empty pointers within the USB driver .SHT Analog Voice Boards USB voice boxesImprove the capability to receive DTMF .Digital Trunk Boards A-type and D-type Support LoopBack testing.Fix the bug that the local end of an SS7 channel was unable to be idle while the remote end was sending CGB messages.The driver newly supports the manual handling of MSU at SS7 MTP2.MSUDECODE.EXE supports the decoding of those messages made of 14-bit point codes.Solve the problem that SsmSendSs7MsuEx might send uncompleted messages in ISUP .Make an improvement that when an SS7 channel receives a GRA message, the corresponding channel will turn into the idle state, not affecting any other channels.Solve the problem that the driver could not recognize the GRA with the range of 31.SS7 Digital trunk boards which support SS7 signaling Fix the bug that the signaling link number was incorrect when customizing IAM, ACM messages in SS7/ISUP with multiple link groups.Fix the bug that the CallerID and CalleeID buffers were not emptied when the ISDNchannel went into the idle state.E1-ISDN Digital trunk boards which support ISDN signaling Fix the bug that the ISDN channel could not be left idle due to repeated calls of the function SsmHangup.T1-ISDN Digital trunk boards which support ISDN signaling Change the value of the fifth 8-bit block in the ISDN Bearer Capability InformationElement from A1 to A2.The driver newly supports the LineSide (OPS-FX) protocol.SHD SS1 Digital trunk boards which support SS1 signalingFix the bug that the channel would go into the pending state while it was disconnectedfrom a call in LineSide.Channel Bank Digital trunk boards which support channel bankFix the bug that sometimes rings could not be stopped after the large-capacity channel bank sent rings to 20 channels at the same time. FSK Digital trunk boardsImprove the capability to receive FSK. ATP-24A/PCI+ Fix the bug that some data might be lost during the GSM recording in hardware.ATP-24A and DST-24B/PCI series boards support the new configuration item DspCoder to replace the old ldr531.ATP Analog Tap Passive Boards ATP-24A series boardsATP-24A series boards newly support the AGC feature in hardware.Support the monitoring in CorNet, can acquire correct call status as well as calling and called party numbers.Add the feature to detect which party hangs up the call. Enable the function SpyGetCallInCh to output failure information.DTP Digital Trunk Passive Boards All DTP series boardsFix the bug that 30B digital trunk passive boards recorded silence or noises in G.729A in T1.Improve the parse of displayed messages on the Alcatel 4049 operator .For the use of ZXJ10 PBX, add a small tail to the end of FSK data.Optimize the support of the Panasonic PBX and the phone T7633.Shield the repeated events on the digital phone line.DST Digital Station Tap Boards All DST series boards Fix the bug that E_RCV_DTR_DKEY had no output while the board was working with Ericsson MXONE, Dialog4222.Better support the state machine of the 302C operator of the Avaya 8400 PBX.Better support the state machine of Nortel Meridian1 61/3905.Fix the bug in message display of the Alcatel digital phone.Fix the bug that some events were lost while using the Alcatel digital phone.Add a D-channel state machine of the Harris PBX.SHR-16DA-CT/PCI Support working with the 4059 PC operator of the OmniPCX 4400(OXO/OXE) PBX.Better support Nortel 61C and the phone 3905.Fix the bug that DST-24B/PCI was not supported by the function SsmStopListenTo.DST-24B/PCI DST-24B/PCI and ATP-24A series boards support the new configuration item DspCoder to replace the old ldr531.FAXFaxing All fax boards Fix the bug that the fax board could sometimes not receive the training acknowledgement. 1. Add new functions SsmSetVoiceEnergyMinValue and SsmGetVoiceEnergyMinValue to set and obtain the threshold value of Barge-in detector for noise judgment.2. Add a new function SsmGetMaxSs7link to get the total number of configured SS7 links in the system.3. Add a new function SsmGetSs7Mtp2Msu to query if the buffer area for MTP2 MSU reception in the driver has received any MSU message; if has, take out the first received message.4. Add a new function SsmSendSs7Mtp2Msu to send MSU messages at MTP2 layer on a specified SS7 link.Newly Added Function 5.Add a new function fPcm_Pcm8ConvertGSM to convert the 8 bit PCM formatted file to the GSM formatted file.6.Add a new function SsmDstSetFlag to set control properties of channels on the DST series board. 7.Add new functions SpyGetCallerType and SpyGetCalleeType to respectively obtain the calling and called party number types of the current call. 8.Add the value 4 to nType in functions SsmSetIsupFlag and SsmGetIsupFlag to set and get the TMR (Transmission Medium Requirement) parameter in the IAM message. 9. Add a new function SsmSetRingPeriod to set the on and off durations for the ringing current generator on station channels.10. Add a new function SsmSetTxRedirectingNum to set the redirecting number in the call setup message in ISUP .11. Add a new function SsmSipGetBoardRegStatus to get the status returned when the SHN board sends the Registration request for the last time.12. Add a new function SsmSipGetChRegStatus to get the status returned when the channel sends the Registration request for the last time.13. Add a new function SpyGetConId to obtain the connection number of the current call.14. Add a new function SsmGetUserInfo to obtain the content of the User-User message unit.1. Add a new configuration item DefaultVoiceFormat under the section [BoardId=x] to set the voice data encoding format of the B-channel on digital lines.2. Add a new configuration item Mp3IsOnlyRead under the section [SystemConfig] to set the property of the recorded MP3 files (read only or not).3. Add a new configuration item loopback under the section [BoardId=x] to set the loopback feature of trunks, used for diagnoses or debugging.4. Add a new configuration item ISDNProtocolType under the section [SpyPcm] to set the support of the CorNet protocol for ISDN monitoring.5. Add a new configuration item DefaultIAM_RedirectingNumber under the section [ISUP] to set the first two bytes of the redirecting number in the IAM message, including the nature of address indicator , numbering plan indicator and address presentation restricted indicator .Newly Added Configuration Item 6.Add a new configuration item PlayFilterFlag under the section [BoardId=x]. If voices are played in great volume, the DTMF detector probably fails to acquire the correct DTMF digits sent from the remote end. In such situation, the filter should be enabled to avoid the effect of the great volume on DTMF reception. This configuration item just determines whether to enable the filter or not.7.Add a new configuration item AppHandleMtp2Msu under the section [SS7] to set the way to handle SS7 MTP2 MSU.1.Fix the bug that the configuration of FilterFskCallerid made by the configuration program is incorrect. ConfigurationProgram2.Support the national standard of tone configuration.Board Startup 1.Fix the bug that the system shows illegal upon invoking SsmStartCti for more than one time within a single progress.1.Fix the bug that the time for the last time callback of SsmRecFileA is incorrect.2.Fix the bug that that the wav header in G.729A is not standard.3.Fix the bug that there appear noises while playing back the first package of data in the double-buffer mode.4.Support of memory recording and playback as well as double-buffer recording and playback, in PCM8.Play & Record5.Improve the quality of the alaw file converted by the function fPcm_MemAdpcmToALAW.6.Fix the bug that SsmPlayMemBlock cannot obtain the stop flag as it sets only one buffer.7.Add a new function fPcm_GSMToMp3 to convert the GSM formatted file to the MP3 formatted file.8.Add a new function fPcm_Pcm8ConvertGSM to convert the 8 bit PCM formatted file to the GSM formatted file. Monitoring 1.Improve the capability of a single channel to monitor multiple channels.FSK 1.Enhance the capability of all voice boards in FSK reception, eliminating misdetections.1.Fix the bug that the system goes halted while installing the package in Windows 7 RTM.InstallationPackage2.Add the software tool CasTool.exe and relative documents for digital station tap boards.About SynwaySynway specializes in designing hardware/software building blocks for use in Computer Telephony Integration (CTI) applications, such as IVR, Call Center, Recording, Unified Messaging and Value-Added Service (VAS) in both PSTN and IP environments. Our products feature rich media processing resources including Fax, conferencing, Codecs, echo cancellation and call control with an array of signaling capability for SIP, SS7 packets, ISDN and CAS in worldwide IP/T1/E1/Analog networks.In the past two decades, Synway has attracted CTI solution providers through superior service, field-proven products and matchless pricing for the highly reliable Telco and enterprise communications platform. With internally coordinated Maximal Support Value (MSV) System, our service engineers provide pre-sales consulting, development support, and after-sales service, so you can monitor the service process effortlessly. Synway's competitive pricing will ensure your matchless competitiveness in any project bidding or distribution-channel expansion globally. Our products have been applied by hundreds of customers worldwide.Synway marketingTel: +86-571-88860561Email:*****************Sales DepartmentTel: +86-571-88860561/88864579Fax: +86-571-88850923Email: ****************Technical SupportTel: +86-571-88864579Mobile: +86-137********Email: *********************** or ***************MSN: ***********************。
致态TiPlus50001T的聪明测试
致态TiPlus50001T的聪明测试1）现有开头后有天过去两年让很多人了解到我国在全球半导体行业的劣势，作为一个爱国中青年，长江存储旗下致态推出第一代PC005消费级固态硬盘，大聪明第一时间购入512G和1T版本，支持国货。
不过我太懒了，只为了支持并没有测评。
那么长存的研发进步之下的二代产品之一：致态TiPlus5000（以下简称致态5000），最近大聪明觉得有必要好好写一写，让更多的靓仔知道国产半导体破冰头排的实力。
致态是目前市面上唯一的纯国产固态硬盘，他的实力到底怎么样，我们一起看看。
由于市面上的固态硬盘满血版本基本是1T起步，所以这次大聪明自费，从小黄鱼购入1T版致态5000。
2）理论参数TBW从官方给出的数据看，1TB版本致态5000有着3500MB/s最大读取，以及3100MB/s的最大写入，质保寿命为600TBW写入或者5年，基本对标目前市场主流PCIE3.0固态硬盘颗粒和主控去掉贴纸，可以看到致态5000是单面设计，4颗NAND，每颗256Gb，主控来自较为常见的联芸（Maxio）1202。
从联芸官网给出的信息看，MAP1202是专为DRAM-less设计，也就是说这块致态5000无独立缓存，这样的设计好处是可以很好地控制成本上机后先给致态开个房产证，可以看到致态5000的十进制可用空间为1024GB，扣掉OP空间后剩余953GB可用空间，足额足量接着我用flash-ID抓取致态5000的信息，可以看到致态5000采用了长江存储128层闪存颗粒，也配上了HMB技术，通过连接主机内存来给硬盘加速，符合致态5000目前主流中端硬盘的定位。
3）性能测试测试平台了解完致态5000的硬件信息后，终于来到我们的实际性能测试环节。
先说一下我们的测试平台•主板CPU：12490F+微星Z690刀锋钛 D4•内存：宏碁掠夺者3200 8G×2•固态：1、SN730 512G；2、三星PM9A1 2T；3、致态TiPlus5000 1T•显卡：铭瑄RX580亮机•其他忽略为了保证测试的相对准确，用于测试的PM9A1和致态5000均走Z690主板南桥芯片。
uns n05500标准
uns n05500标准
UNS N05500是一种镍-铜合金，也称为K-500合金，具有优异的强度和耐腐蚀性能，被广泛应用于海洋工程、化工、航空航天等领域。
以下为该材料的部分标准：
1. UNS N05500棒的化学成分：UNS N05500合金主要由镍和铜组成，其中镍的含量约为63%，铜的含量约为33%。
该合金中还含有一定量的铝和钛，以及少量的铬、铁、锰等元素。
2. UNS N05500概述：可沉淀硬化的镍铜合金，具有Monel 400合金的耐蚀性又有比它更好的强度和硬度。
拥有低的磁导率，在-101°C下具有非磁性。
用于泵轴，油井工具和仪器，刮墨刀片，弹簧，阀芯，紧固件以及船用螺旋桨轴。
如需了解更多关于uns n05500标准的信息，建议咨询材料学专家或查阅相关文献资料。
500钢筋屈服强度标准值
500钢筋屈服强度标准值500钢筋屈服强度标准值本篇文档主要介绍500钢筋屈服强度标准值，包括钢筋原材料的力学性能、钢筋的屈服强度设计值、钢筋的屈服强度实测值、钢筋的抗拉强度设计值、钢筋的疲劳强度极限以及钢筋在复杂应力状态下的屈服强度。
一、钢筋原材料的力学性能钢筋原材料的力学性能是决定钢筋屈服强度的关键因素。
通常，钢筋原材料的力学性能包括弹性模量、屈服强度、抗拉强度等。
在生产过程中，通过对原材料的力学性能进行检测和评估，可以有效地控制产品质量和稳定性。
二、钢筋的屈服强度设计值钢筋的屈服强度设计值是指在设计过程中，根据结构要求和相关规范，对钢筋的屈服强度进行规定。
这种设计值通常是在考虑了多种因素后得出的，如结构的重要性、荷载特征、材料的可靠性等。
在建筑设计和施工过程中，必须严格遵守相关规范和标准，确保钢筋的屈服强度符合设计要求。
三、钢筋的屈服强度实测值钢筋的屈服强度实测值是通过试验方法得到的实际数据。
在生产过程中，通过对钢筋进行拉伸试验，可以准确地测得其屈服强度。
实测值与设计值的符合程度可以反映产品的质量和使用效果。
因此，在生产和使用过程中，需要进行严格的检测和监控。
四、钢筋的抗拉强度设计值钢筋的抗拉强度设计值是指在设计过程中，对钢筋的抗拉强度进行规定。
与屈服强度类似，这种设计值也是在考虑了多种因素后得出的。
在建筑设计和施工过程中，必须同时考虑钢筋的抗拉强度和屈服强度，以确保结构的安全性和稳定性。
五、钢筋的疲劳强度极限钢筋的疲劳强度极限是指钢筋在交变荷载反复作用下，能够抵抗破坏的最大应力值。
在结构设计过程中，需要考虑结构的疲劳强度，以防止在使用过程中出现疲劳破坏。
因此，在选择和使用钢筋时，需要了解其疲劳强度极限，并采取相应的措施来保证结构的安全性。
六、钢筋在复杂应力状态下的屈服强度在复杂应力状态下，钢筋的屈服强度会受到多种因素的影响，如温度、应力状态、材料缺陷等。
因此，在设计和施工过程中，需要对这些因素进行全面考虑，并采取相应的措施来保证钢筋在复杂应力状态下的安全性。
NVIDIA迎战ATI--GeForce3 Ti500性能测试
NVIDIA迎战ATI--GeForce3 Ti500性能测试
佚名
【期刊名称】《电子与电脑》
【年(卷),期】2001(000)011
【摘要】@@ 和其他任何计算机相比,图形硬件的变革都要更加频繁和激
进.Nvidia公司在设定这个惊人步伐的过程中扮演着重要的角色,随着ATI Radeon 8500和7500新型芯片的出现,这家公司在推进顶尖产品性能和将GeForce3的价格降低到主流水平方面面临了巨大的压力.Nvidia最新的Titanium(简称Ti)系列成功地完成了这两个任务.目前GeForce3新系列有两种芯片,其一采用了尽可能快的时钟频率以便获得最大的性能,而另一个则以接近前者一半的成本差不多实现了GeForce3的全部功能.我们很快就会推出最新主流显卡的相关报道,包括GeForce3 Ti 200和Radeon7500,但是现在首先让我们来关注一下你可以买到的最快的显卡GeForce3 Ti 500.
【总页数】2页(P46-47)
【正文语种】中文
【相关文献】
1.决战！2006第一炮——ATI全面迎战NVIDIA GS风暴 [J], Pophard;QQ糖
2.面对NVIDIA，谁为迎战？ [J], 袭澜; 风笛悠扬
3.面对NVIDIA,谁来迎战? [J], 袭澜; 风笛悠扬
4.NVIDIA GeForceG TX275紧急迎战 [J],
5.Radeon8500 VS GeForce 3 Ti500 3D性能测试 [J], CM Lab
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年扩建500吨96.5%除草剂异恶唑立项
投资融资项目
可行性研究报告
(典型案例〃仅供参考)
广州中撰企业投资咨询有限公司
地址：中国〃广州
目录
第一章年扩建500吨96.5%除草剂异恶唑项目概论 (1)
一、年扩建500吨96.5%除草剂异恶唑项目名称及承办单位 (1)
二、年扩建500吨96.5%除草剂异恶唑项目可行性研究报告委托编制单位 (1)
三、可行性研究的目的 (1)
四、可行性研究报告编制依据原则和范围 (2)
（一）项目可行性报告编制依据 (2)
（二）可行性研究报告编制原则 (2)
（三）可行性研究报告编制范围 (4)
五、研究的主要过程 (5)
六、年扩建500吨96.5%除草剂异恶唑产品方案及建设规模 (6)
七、年扩建500吨96.5%除草剂异恶唑项目总投资估算 (6)
八、工艺技术装备方案的选择 (6)
九、项目实施进度建议 (6)
十、研究结论 (7)
十一、年扩建500吨96.5%除草剂异恶唑项目主要经济技术指标 (9)
项目主要经济技术指标一览表 (9)
第二章年扩建500吨96.5%除草剂异恶唑产品说明 (15)
第三章年扩建500吨96.5%除草剂异恶唑项目市场分析预测 (15)
第四章项目选址科学性分析 (15)
一、厂址的选择原则 (16)
二、厂址选择方案 (16)
四、选址用地权属性质类别及占地面积 (17)
五、项目用地利用指标 (17)
项目占地及建筑工程投资一览表 (18)
六、项目选址综合评价 (19)
第五章项目建设内容与建设规模 (19)
一、建设内容 (20)
（一）土建工程 (20)
（二）设备购臵 (20)
二、建设规模 (21)
第六章原辅材料供应及基本生产条件 (21)
一、原辅材料供应条件 (21)
（一）主要原辅材料供应 (21)
（二）原辅材料来源 (21)
原辅材料及能源供应情况一览表 (22)
二、基本生产条件 (23)
第七章工程技术方案 (24)
一、工艺技术方案的选用原则 (24)
二、工艺技术方案 (25)
（一）工艺技术来源及特点 (25)
（二）技术保障措施 (25)
（三）产品生产工艺流程 (25)
年扩建500吨96.5%除草剂异恶唑生产工艺流程示意简图 (26)
三、设备的选择 (26)
（一）设备配臵原则 (26)
（二）设备配臵方案 (27)
主要设备投资明细表 (28)
第八章环境保护 (28)
一、环境保护设计依据 (29)
二、污染物的来源 (30)
（一）年扩建500吨96.5%除草剂异恶唑项目建设期污染源 (30)
（二）年扩建500吨96.5%除草剂异恶唑项目运营期污染源 (31)
三、污染物的治理 (31)
（一）项目施工期环境影响简要分析及治理措施 (31)
1、施工期大气环境影响分析和防治对策 (32)
2、施工期水环境影响分析和防治对策 (35)
3、施工期固体废弃物环境影响分析和防治对策 (37)
4、施工期噪声环境影响分析和防治对策 (38)
5、施工建议及要求 (39)
施工期间主要污染物产生及预计排放情况一览表 (41)
（二）项目营运期环境影响分析及治理措施 (42)
1、废水的治理 (42)
办公及生活废水处理流程图 (42)
生活及办公废水治理效果比较一览表 (43)
生活及办公废水治理效果一览表 (43)
2、固体废弃物的治理措施及排放分析 (43)
3、噪声治理措施及排放分析 (45)
主要噪声源治理情况一览表 (46)
四、环境保护投资分析 (46)
（一）环境保护设施投资 (46)
（二）环境效益分析 (47)
五、厂区绿化工程 (47)
六、清洁生产 (48)
七、环境保护结论 (48)
施工期主要污染物产生、排放及预期效果一览表 (50)
第九章项目节能分析 (51)
一、项目建设的节能原则 (51)
二、设计依据及用能标准 (51)
（一）节能政策依据 (51)
（二）国家及省、市节能目标 (52)
（三）行业标准、规范、技术规定和技术指导 (53)
三、项目节能背景分析 (53)
四、项目能源消耗种类和数量分析 (55)
（一）主要耗能装臵及能耗种类和数量 (55)
1、主要耗能装臵 (55)
2、主要能耗种类及数量 (55)
项目综合用能测算一览表 (56)
（二）单位产品能耗指标测算 (56)
单位能耗估算一览表 (57)
五、项目用能品种选择的可靠性分析 (58)
六、工艺设备节能措施 (58)
七、电力节能措施 (59)
八、节水措施 (60)
九、项目运营期节能原则 (60)
十、运营期主要节能措施 (61)
十一、能源管理 (62)
（一）管理组织和制度 (62)
（二）能源计量管理 (62)
十二、节能建议及效果分析 (63)
（一）节能建议 (63)
（二）节能效果分析 (64)
第十章组织机构工作制度和劳动定员 (64)
一、组织机构 (64)
二、工作制度 (64)
三、劳动定员 (65)
四、人员培训 (66)
（一）人员技术水平与要求 (66)
（二）培训规划建议 (66)
第十一章年扩建500吨96.5%除草剂异恶唑项目投资估算与资金筹措 (67)
一、投资估算依据和说明 (67)
（一）编制依据 (67)
（二）投资费用分析 (69)
（三）工程建设投资（固定资产）投资 (69)
1、设备投资估算 (69)
2、土建投资估算 (69)
3、其它费用 (70)
4、工程建设投资（固定资产）投资 (70)
固定资产投资估算表 (70)
5、铺底流动资金估算 (71)
铺底流动资金估算一览表 (71)
6、年扩建500吨96.5%除草剂异恶唑项目总投资估算 (71)
总投资构成分析一览表 (72)
二、资金筹措 (72)
投资计划与资金筹措表 (73)
三、年扩建500吨96.5%除草剂异恶唑项目资金使用计划 (73)
资金使用计划与运用表 (74)
第十二章经济评价 (74)
一、经济评价的依据和范围 (74)
二、基础数据与参数选取 (75)
三、财务效益与费用估算 (76)
（一）销售收入估算 (76)
产品销售收入及税金估算一览表 (76)
（二）综合总成本估算 (77)
综合总成本费用估算表 (77)
（三）利润总额估算 (78)
（四）所得税及税后利润 (78)
（五）项目投资收益率测算 (78)
项目综合损益表 (79)
四、财务分析 (80)
财务现金流量表（全部投资） (82)
财务现金流量表（固定投资） (83)
五、不确定性分析 (84)
盈亏平衡分析表 (85)
六、敏感性分析 (86)
单因素敏感性分析表 (87)
第十三章年扩建500吨96.5%除草剂异恶唑项目综合评价 (87)
第一章项目概论
一、项目名称及承办单位
1、项目名称：年扩建500吨96.5%除草剂异恶唑投资建设项目
2、项目建设性质：新建
3、项目承办单位：广州中撰企业投资咨询有限公司
4、企业类型：有限责任公司
5、注册资金：100万元人民币
二、项目可行性研究报告委托编制单位
1、编制单位：广州中撰企业投资咨询有限公司
三、可行性研究的目的
本可行性研究报告对该年扩建500吨96.5%除草剂异恶唑项目所涉及的主要问题，例如：资源条件、原辅材料、燃料和动力的供应、交通运输条件、建厂规模、投资规模、生产工艺和设备选型、产品类别、项目节能技术和措施、环境影响评价和劳动卫生保障等，从技术、经济和环境保护等多个方面进行较为详细的调查研究。
通过分析比较方案，并对项目建成后可能取得的技术经济效果进行预测，从而为投资决策提供可靠的依据，作为该年扩建500吨96.5%除草剂异恶唑项目进行下一步环境评价及工程设计的基础文件。
本可行性研究报告具体论述该年扩建500吨96.5%除草剂异
恶唑项目的设立在经济上的必要性、合理性、现实性；技术和设备的先进性、适用性、可靠性；财务上的盈利性、合法性；环境影响和劳动卫生保障上的可行性；建设上的可行性以及合理利用能源、提高能源利用效率。
为项目法人和备案机关决策、审批提供可靠的依据。
本可行性研究报告提供的数据准确可靠，符合国家有关规定，各项计算科学合理。
对项目的建设、生产和经营进行风险分析留有一定的余地。
对于不能落实的问题如实反映，并能够提出确实可行的有效解决措施。
四、可行性研究报告编制依据原则和范围
（一）项目可行性报告编制依据
1、中华人民共和国国民经济和社会发展第十二个五年规划。
2、XX省XX市国民经济和社会发展第十二个五年规划纲要。
3、《产业结构调整指导目录(2011年本)(2013修正)》。
4、国家发改委、建设部发布的《建设项目经济评价方法与参数》(第三版)。
5、项目承办单位提供的有关技术基础资料。
6、国家现行有关政策、法规和标准等。
（二）可行性研究报告编制原则
在该年扩建500吨96.5%除草剂异恶唑项目可行性研究中，从节约资源和保护环境的角度出发，遵循“创新、先进、可靠、实。