1591XXMFLBK,1591XXMFLGY, 规格书,Datasheet 资料

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摩雷克易连接FFC FPC连接器说明书

Electrical Current - Maximum per Contact Voltage - Maximum
Solder Process Data Duration at Max. Process Temperature (seconds) Lead-freeProcess Capability
Documents: 3D Model (PDF) Drawing (PDF) 3D Model Product Specification PS-503480-001-001 (PDF) Packaging Specification SPK-503480-001-001 (PDF)
Datasheet (PDF) Product Guide (PDF) RoHS Certificate of Compliance (PDF) Reference Guide (PDF)
Part Number:
Status:
Overview: Description:
This document was generated on 01/04/2023
PLEASE CHECK FOR LATEST PART INFORMATION
5034801000 Active
Easy-On FFC FPC Connectors Easy-On FFC/FPC Connector, 0.50mm Pitch, FBH1 Series, Right-Angle, Dual Contact, 1.00mm Height, 10 Circuits, Gold over Nickel Plating
E29179
FFC/FPC Connectors 503480 Black Actuator Easy-On FFC FPC Connectors Easy-On FBH1 FFC / FPC Connectors 884982040854

slf系列贴片电感datasheet

SLF 系列 SLF6025
特点 ●是最适用于电源系统的低直流电阻，大电流，节能型产品。 ●因采用磁力屏蔽结构，所以可实现高密度安装。 ●底面为平直的低背型 , 可稳定地安装在电路板上。 ●采用卷带仕样，支持自动插入机。用途手机，计算机，硬盘驱动器，其他各种电子设备仕样
工作温度范围保存温度范围 –20 to +85°C ［包括自身温度上升］ –40 to +85°C ［产品单体］
电气特性
电感 (H) 4.7 6.8 10 15 22 33 47 68 100 150 220 电感容差 ±20% ±20% ±20% ±20% ±20% ±20% ±20% ±20% ±20% ±20% ±20% L 测定频率 (kHz) 100 100 100 100 100 100 100 100 100 100 100 直流电阻 ( )±20% 0.0284 0.0354 0.0532 0.0745 0.104 0.148 0.21 0.29 0.43 0.65 0.98 额定电流 (A) 基于电感变化率时 1.6max. 1.5max. 1.3max. 1max. 0.77max. 0.69max. 0.59max. 0.5max. 0.42max. 0.34max. 0.26max. 基于温度上升时 2.5typ. 2.2typ. 1.8typ. 1.4typ. 1.3typ. 1.1typ. 0.92typ. 0.78typ. 0.64typ. 0.5typ. 0.38typ. 品名 SLF6028T-4R7M1R6-PF SLF6028T-6R8M1R5-PF SLF6028T-100M1R3-PF SLF6028T-150M1R0-PF SLF6028T-220MR77-PF SLF6028T-330MR69-PF SLF6028T-470MR59-PF SLF6028T-680MR50-PF SLF6028T-101MR42-PF SLF6028T-151MR34-PF SLF6028T-221MR26-PF

744325240;中文规格书,Datasheet资料

Bezeichnung :description :Marking = part numberEigenschaften / properties Lerrlaufinduktivität/initial inductance Nenn-Induktivität /33%Umgebungstemperatur / temperature:+20°CWE-Superflux ME08-01-01ME 07-01-01NameDatum / dateÄnderung / modificationVersion 1Version 2 D Prüfgeräte / test equipment :HP 34401 A & Fluke 54II für/for I DC; Luftfeuchtigkeit / humidity:WAYNE KERR 3260B für/for L 0; I SAT Elektrische Eigenschaften / electrical properties :SPEICHERDROSSEL WE-HCI POWER-CHOKE WE-HCI.................................................................................................Kontrolliert / approvedWürth Elektronik eiSos GmbH & Co. KGD-74638 Waldenburg · Max-Eyth-Strasse 1 - 3 · Germany · Telefon (+49) (0) 7942 - 945 - 0 · Telefax (+49) (0) 7942 - 945 - 400Geprüft / checked AIEIW-200Basismaterial / base material:Umgebungstemp. / ambient temperature: -40°C - +100°C F Werkstoffe & Zulassungen / material & approvals :G Eigenschaften / general specifications :Metra HIT 27I für/for R DCE Testbedingungen / test conditions :Würth Elektronik..................................................................................Arbeitstemperatur / operating temperature: -40°C - +150°C Freigabe erteilt / general release:Kunde / customerDraht / wire: blackcoating:not exceed 150°C under worst case operating conditions.http://www.we-online.deDatum / date..................................................................................Unterschrift / signatureIt is recommended that the temperature of the part doesBezeichnung :description :H Induktivitätskurve / Inductance curve :ME08-01-01ME 07-01-01NameDatum / dateSPEICHERDROSSEL WE-HCI POWER-CHOKE WE-HCIDATUM / DATE : 2008-01-01Freigabe erteilt / general release:Kunde / customer....................................................................................................................................................................Datum / dateUnterschrift / signature Würth ElektronikVersion 2..............................................................................................................................................Version 1D-74638 Waldenburg · Max-Eyth-Strasse 1 - 3 · Germany · Telefon (+49) (0) 7942 - 945 - 0 · Telefax (+49) (0) 7942 - 945 - 400http://www.we-online.deGeprüft / checked Kontrolliert / approvedÄnderung / modificationWürth Elektronik eiSos GmbH & Co. KGBezeichnung :description :I Temperaturanstieg / Temperature rise curve :ME08-01-01ME 07-01-01NameDatum / dateVersion 1Freigabe erteilt / general release:Kunde / customerGeprüft / checked Kontrolliert / approvedÄnderung / modification...............................................................................................................................................................Datum / dateUnterschrift / signatureWürth ElektronikVersion 2..........................................................................................................................................http://www.we-online.deD-74638 Waldenburg · Max-Eyth-Strasse 1 - 3 · Germany · Telefon (+49) (0) 7942 - 945 - 0 · Telefax (+49) (0) 7942 - 945 - 400Würth Elektronik eiSos GmbH & Co. KGBezeichnung :description :ME08-01-01ME 07-01-01NameDatum / dateSPEICHERDROSSEL WE-HCI POWER-CHOKE WE-HCIFreigabe erteilt / general release:Kunde / customer...................................................................................................................................................................................................................................Version 1Datum / dateUnterschrift / signature Würth ElektronikD-74638 Waldenburg · Max-Eyth-Strasse 1 - 3 · Germany · Telefon (+49) (0) 7942 - 945 - 0 · Telefax (+49) (0) 7942 - 945 - 400Geprüft / checked Kontrolliert / approvedÄnderung / modificationWürth Elektronik eiSos GmbH & Co. KGVersion 2.................................................................................The Force for tearing off cover tape is 20 to 70 grams in arrow direction150°feeding directionThis electronic component has been designed and developed for usage in general electronic equipment. Before incorporating this component into any equipment where higher safety and reliability is especially required or if there is the possibility of direct damage or injury to human body, for example in the range of aerospace, aviation, nuclear control, submarine, transportation, (automotive control, train control, ship control), transportation signal, disaster prevention, medical, public information network etc, Würth Elektronik eiSos GmbH must be informed before the design-in stage. In addition, sufficient reliability evaluation checks for safety must be performed on every electronic component which is used in electrical circuits that require high safety and reliability functions or performance.分销商库存信息: WURTH-ELECTRONICS 744325240。

nichicon FW series DATA SHEET

3300
332 10 × 20 1170 12.5 × 20 1420 12.5 × 25 1700 16 × 25 1950 16 × 35.5 2220 18 × 35.5 2360 20 × 40 2700 25 × 50 2900
4700
472 12.5 × 20 1350 12.5 × 25 1800 16 × 25 2100 16 × 31.5 2360 18 × 35.5 2490 20 × 40 2900 22 × 50 3400
Series name Type
Please refer to page 21, 22, 23 about the formed or taped product spec. Please refer to page 3 for the minimum order quantity.
Dimension table in next page.
Printed with black color letter on Gold sleeve.
D+ MAX. B P ± 0.5
Radial Lead Type
Sleeve (P.E.T.)
Bd
Pressure relief vent
(B 6.3up)
L+ MAX.
15MIN
4MIN
(mm)
BD
5
6.3
tan δ
Rated voltage (V) tan δ (MAX.)
6.3 0.28
10 0.24
16 0.20
25 0.16
35 0.14
50 0.12
For capacitance of more than 1000µF, add 0.02 for every increase of 1000µF.

FAN9611MX;中文规格书,Datasheet资料

/
FAN9611 / FAN9612 — Interleaved Dual BCM PFC Controllers
Ordering Information
Part Number
FAN9611MX FAN9612MX
Package
16-Lead, Small Outline Integrated Circuit (SOIC) 16-Lead, Small Outline Integrated Circuit (SOIC)
© 2008 Fairchild Semiconductor Corporation FAN9611 / FAN9612 • Rev. 1.1.5
2
/
FAN9611 / FAN9612 — Interleaved Dual BCM PFC Controllers
C OUT
RG1 RG2
Q2 R OV1
Figure 3. Typical Application Diagram
Block Diagram
Figure 4. Block Diagram
© 2008 Fairchild Semiconductor Corporation FAN9611 / FAN9612 • Rev. 1.1.5 3
Name
ZCD1 ZCD2 5VB MOT AGND SS COMP FB OVP VIN PGND DRV2 DRV1 VDD CS2 CS1t Detector for Phase 1 of the interleaved boost power stage. Zero Current Detector for Phase 2 of the interleaved boost power stage. 5V Bias. Bypass pin for the internal supply, which powers all control circuitry on the IC. Maximum On-Time adjust for the individual power stages. Analog Ground. Reference potential for all setup signals. Soft-Start Capacitor. Connected to the non-inverting input of the error amplifier. Compensation Network connection to the output of the gM error amplifier Feedback pin to sense the converter’s output voltage; inverting input of the error amplifier. Output Voltage monitor for the independent, second-level, latched OVP protection. Input Voltage monitor for brownout protection and input-voltage feedforward. Power Ground connection. Gate Drive Output for Phase 2 of the interleaved boost power stage. Gate Drive Output for Phase 1 of the interleaved boost power stage. External Bias Supply for the IC. Current Sense Input for Phase 2 of the interleaved boost power stage. Current Sense Input for Phase 1 of the interleaved boost power stage.

MMBFJ201;中文规格书,Datasheet资料

J201 - J202MMBFJ201 - MMBFJ203P D Total Device DissipationDerate above 25°C 6255.03502.8WmW/°CR q JC Thermal Resistance, Junction to Case125°C/W R q JA Thermal Resistance, Junction to Ambient357556°C/W* Device mounted on FR-4 PCB 1.6” ´1.6” ´0.06"Dimensions in MillimetersJ201 - J202 / MMBFJ201 - MMBFJ203 N-Channel General Purpose AmplifierJ201 - J202 / MMBFJ201 - MMBFJ203Rev. I31TRADEMARKSThe following are registered and unregistered trademarks and service marks Fairchild Semiconductor owns or is authorized to use andis not intended to be an exhaustive list of all such trademarks.DISCLAIMERFAIRCHILD SEMICONDUCTOR RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE TO ANY PRODUCTS HEREIN TO IMPROVE RELIABILITY, FUNCTION, OR DESIGN. FAIRCHILD DOES NOT ASSUME ANY LIABILITY ARISING OUT OF THE APPLICATION OR USE OF ANY PRODUCT OR CIRCUIT DESCRIBED HEREIN; NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS PATENT RIGHTS, NOR THE RIGHTS OF OTHERS. THESE SPECIFICATIONS DO NOT EXPAND THE TERMS OF FAIRCHILD’S WORLDWIDE TERMS AND CONDITIONS, SPECIFICALLY THE WARRANTY THEREIN, WHICH COVERS THESE PRODUCTS.LIFE SUPPORT POLICYFAIRCHILD’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF FAIRCHILD SEMICONDUCTOR CORPORATION.As used herein:1. Life support devices or systems are devices or systemswhich, (a) are intended for surgical implant into the body, or (b) support or sustain life, and (c) whose failure to perform when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in significant injury to the user.2.A critical component is any component of a life support device or system whose failure to perform can be reasonably expected to cause the failure of the life support device or system, or to affect its safety or effectiveness.PRODUCT STATUS DEFINITIONS Definition of Terms ACEx ®Build it Now™CorePLUS™CROSSVOLT ™CTL™Current Transfer Logic™EcoSPARK ®Fairchild ®Fairchild Semiconductor ®FACT Quiet Series™FACT ®FAST ®FastvCore™FPS™FRFET ®Global Power Resource SMGreen FPS™Green FPS™ e-Series™GTO™i-Lo ™IntelliMAX™ISOPLANAR™MegaBuck™MICROCOUPLER™MicroFET™MicroPak™MillerDrive™Motion-SPM™OPTOLOGIC ®OPTOPLANAR ®®PDP-SPM™Power220®Power247®POWEREDGE ®Power-SPM™PowerTrench ®Programmable Active Droop™QFET ®QS™QT Optoelectronics™Quiet Series™RapidConfigure™SMART START™SPM ®STEALTH™SuperFET™SuperSOT™-3SuperSOT™-6SuperSOT™-8SyncFET™The Power Franchise ®TinyBoost™TinyBuck™TinyLogic ®TINYOPTO™TinyPower™TinyPWM™TinyWire™µSerDes™UHC ®UniFET™VCX™Datasheet Identification Product Status DefinitionAdvance InformationFormative or In DesignThis datasheet contains the design specifications for product development. Specifications may change in any manner without notice.Preliminary First ProductionThis datasheet contains preliminary data; supplementary data will be pub-lished at a later date. Fairchild Semiconductor reserves the right to make changes at any time without notice to improve design.No Identification Needed Full ProductionThis datasheet contains final specifications. Fairchild Semiconductor reserves the right to make changes at any time without notice to improve design. Obsolete Not In ProductionThis datasheet contains specifications on a product that has been discontin-ued by Fairchild semiconductor. The datasheet is printed for reference infor-mation only.分销商库存信息: FAIRCHILD MMBFJ201。

MMSZ4xxxT1G系列和SZMMSZ4xxxT1G系列零点电阻电源器件的商品说明书

MMSZ4686T1G MMSZ4686T1G.MMSZ4xxxT1G Series, SZMMSZ4xxxT1G Series Zener Voltage Regulators 500 mW, Low I ZT SOD−123 Surface MountThree complete series of Zener diodes are offered in the convenient, surface mount plastic SOD−123 package. These devices provide a convenient alternative to the leadless 34−package style.Features•500 mW Rating on FR−4 or FR−5 Board•Wide Zener Reverse V oltage Range − 1.8 V to 43 V•Low Reverse Current (I ZT) − 50 m A•Package Designed for Optimal Automated Board Assembly •Small Package Size for High Density Applications•ESD Rating of Class 3 (>16 kV) per Human Body Model•SZ Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC−Q101 Qualified and PPAP Capable•These Devices are Pb−Free and are RoHS Compliant*Mechanical Characteristics:CASE:V oid-free, transfer-molded, thermosetting plastic case FINISH:Corrosion resistant finish, easily solderableMAXIMUM CASE TEMPERATURE FOR SOLDERING PURPOSES: 260°C for 10 SecondsPOLARITY:Cathode indicated by polarity band FLAMMABILITY RATING:UL 94 V−0MAXIMUM RATINGSRating Symbol Max Units Total Power Dissipation on FR−5 Board,(Note 1) @ T L = 75°CDerated above 75°C P D5006.7mWmW/°CThermal Resistance, (Note 2) Junction−to−Ambient R q JA340°C/WThermal Resistance, (Note 2) Junction−to−Lead R q JL150°C/WJunction and Storage Temperature Range T J, T stg−55 to+150°CStresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality should not be assumed, damage may occur and reliability may be affected.1.FR−5 = 3.5 X 1.5 inches, using the minimum recommended footprint.2.Thermal Resistance measurement obtained via infrared Scan Method.*For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D.Cathode AnodeSee specific marking information in the device marking column of the Electrical Characteristics table on page 3 of this data sheet.DEVICE MARKING INFORMATIONSOD−123CASE 425STYLE 1Device Package Shipping†ORDERING INFORMATIONMARKING DIAGRAM†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our T ape and Reel Packaging Specifications Brochure, BRD8011/D.MMSZ4xxxT1G SOD−123(Pb−Free)3,000 /Tape & ReelMMSZ4xxxT3G SOD−123(Pb−Free)10,000 /Tape & Reel xx= Device Code (Refer to page 3)M= Date CodeG= Pb−Free Package(Note: Microdot may be in either location)1SZMMSZ4xxxT1G SOD−123(Pb−Free)3,000 /Tape & ReelSZMMSZ4xxxT3G SOD−123(Pb−Free)10,000 /Tape & ReelELECTRICAL CHARACTERISTICS (T A = 25°C unless otherwise noted, V F = 0.9 V Max. @ I F = 10 mA)Symbol ParameterV Z Reverse Zener Voltage @ I ZTI ZT Reverse CurrentI R Reverse Leakage Current @ V RVR Reverse VoltageI F Forward CurrentV F Forward Voltage @ I FProduct parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product performance may not be indicated by the Electrical Characteristics if operated under different conditions.ELECTRICAL CHARACTERISTICS (T A = 25°C unless otherwise noted, V F = 0.9 V Max. @ I F = 10 mA)Device*DeviceMarkingZener Voltage (Note 3)Leakage CurrentV Z (Volts)@ I ZT I R @ V RMin Nom Max m A m A VoltsMMSZ4678T1G CC 1.71 1.8 1.89507.51 MMSZ4679T1G CD 1.90 2.0 2.105051 MMSZ4680T1G CE 2.09 2.2 2.315041 MMSZ4681T1G CF 2.28 2.4 2.525021 MMSZ4682T1G CH 2.565 2.7 2.8355011 MMSZ4683T1G CJ 2.85 3.0 3.15500.81 MMSZ4684T1G CK 3.13 3.3 3.47507.5 1.5 MMSZ4685T1G CM 3.42 3.6 3.78507.52 MMSZ4686T1G CN 3.70 3.9 4.105052 MMSZ4687T1G CP 4.09 4.3 4.525042 SZMMSZ4687T1G CG6 4.09 4.3 4.525042 MMSZ4688T1G CT 4.47 4.7 4.9450103 MMSZ4689T1G CU 4.85 5.1 5.3650103 MMSZ4690T1G/T3G CV 5.32 5.6 5.8850104 MMSZ4691T1G CA 5.89 6.2 6.5150105 MMSZ4692T1G CX 6.46 6.87.145010 5.1 MMSZ4693T1G CY7.137.57.885010 5.7 MMSZ4694T1G CZ7.798.28.61501 6.2 MMSZ4695T1G DC8.278.79.14501 6.6 MMSZ4696T1G DD8.659.19.56501 6.9 MMSZ4697T1G DE9.501010.505017.6 MMSZ4698T1G DF10.451111.55500.058.4 MMSZ4699T1G DH11.401212.60500.059.1 MMSZ4700T1G DJ12.351313.65500.059.8 MMSZ4701T1G DK13.301414.70500.0510.6 MMSZ4702T1G DM14.251515.75500.0511.4 MMSZ4703T1G†DN15.201616.80500.0512.1 MMSZ4704T1G DP16.151717.85500.0512.9 MMSZ4705T1G DT17.101818.90500.0513.6 MMSZ4706T1G DU18.051919.95500.0514.4 MMSZ4707T1G DV19.002021.00500.0115.2 MMSZ4708T1G DA20.902223.10500.0116.7 MMSZ4709T1G DX22.802425.20500.0118.2 MMSZ4710T1G DY23.752526.25500.0119.0 MMSZ4711T1G†EA25.652728.35500.0120.4 MMSZ4712T1G EC26.602829.40500.0121.2 MMSZ4713T1G ED28.503031.50500.0122.8 MMSZ4714T1G EE31.353334.65500.0125.0 MMSZ4715T1G EF34.203637.80500.0127.3 MMSZ4716T1G EH37.053940.95500.0129.6 MMSZ4717T1G EJ40.854345.15500.0132.6 3.Nominal Zener voltage is measured with the device junction in thermal equilibrium at T L = 30°C ±1°C.*Include SZ-prefix devices where applicable.†MMSZ4703 and MMSZ4711 Not Available in 10,000/Tape & ReelTYPICAL CHARACTERISTICSV Z , T E M P E R A T U R E C O E F F I C I E N T (m V /C )°θV Z , NOMINAL ZENER VOLTAGE (V)Figure 1. Temperature Coefficients (Temperature Range −55°C to +150°C)V Z , T E M P E R A T U R E C O E F F I C I E N T (m V /C )°θ100101V Z , NOMINAL ZENER VOLTAGE (V)Figure 2. Temperature Coefficients (Temperature Range −55°C to +150°C)1.21.00.80.60.40.20T, TEMPERATURE (5C)Figure 3. Steady State Power Derating P p k, P E A K S U R G E P O W E R (W A T T S )PW, PULSE WIDTH (ms)Figure 4. Maximum Nonrepetitive Surge PowerP D , P O W E R D I S S I P A T I O N (W A T T S )V Z , NOMINAL ZENER VOLTAGEFigure 5. Effect of Zener Voltage onZener ImpedanceZ Z T , D Y N A M I C I M P E D A N C E ()ΩTYPICAL CHARACTERISTICSC , C A P A C I T A N C E (p F )V Z , NOMINAL ZENER VOLTAGE (V)Figure 6. Typical Capacitance 1000100101V Z , ZENER VOLTAGE (V)1001010.10.01I Z , Z EN E R C U R R E N T (m A )V Z , ZENER VOLTAGE (V)1001010.10.01I R , L E A K A G E C U R R E N T (A )μV Z , NOMINAL ZENER VOLTAGE (V)Figure 7. Typical Leakage Current10001001010.10.010.0010.00010.00001I Z , Z E N E R C U R R E N T (m A )Figure 8. Zener Voltage versus Zener Current(V Z Up to 12 V)Figure 9. Zener Voltage versus Zener Current(12 V to 91 V)SOD−123CASE 425−04ISSUE GDATE 07 OCT 2009SCALE 5:1NOTES:1.DIMENSIONING AND TOLERANCING PER ANSIY14.5M, 1982.2.CONTROLLING DIMENSION: INCH.DIM MIN NOM MAXMILLIMETERSINCHESA0.94 1.17 1.350.037A10.000.050.100.000b0.510.610.710.020c1.600.150.055D 1.40 1.80E 2.54 2.69 2.840.100---3.680.140L0.253.860.0100.0460.0020.0240.0630.1060.1450.0530.0040.0280.0710.1120.152MIN NOM MAX3.56H E---------0.006------------GENERICMARKING DIAGRAM**For additional information on our Pb−Free strategy and solderingdetails, please download the ON Semiconductor Soldering andMounting Techniques Reference Manual, SOLDERRM/D.SOLDERING FOOTPRINT**This information is generic. Please refer to device datasheet for actual part marking. Pb−Free indicator, “G” ormicrodot “ G”, may or may not be present.XXX= Specific Device CodeM= Date CodeG= Pb−Free Package1STYLE 1:PIN 1. CATHODE2. ANODE0.910.036ǒmminchesǓSCALE 10:1------q001010°°°°(Note: Microdot may be in either location) MECHANICAL CASE OUTLINEPACKAGE DIMENSIONSON Semiconductor and are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries.ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. ON Semiconductor does not convey any license under its patent rights nor theON Semiconductor and are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries.ON Semiconductor owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of ON Semiconductor’s product/patent coverage may be accessed at ON Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.PUBLICATION ORDERING INFORMATIONTECHNICAL SUPPORTNorth American Technical Support:Voice Mail: 1 800−282−9855 Toll Free USA/Canada Phone: 011 421 33 790 2910LITERATURE FULFILLMENT :Email Requests to:*******************ON Semiconductor Website: Europe, Middle East and Africa Technical Support:Phone: 00421 33 790 2910For additional information, please contact your local Sales RepresentativeMMSZ4686T1G MMSZ4686T1G.。

(1414规格书)HFBR-x4xxZ

Furthermore, Avago Technologies application support group is always ready to assist with any design consideration.
Application Literature
Title HFBR-0400Z Series Reliability Data Application Bulletin 78 Application Note 1038 Application Note 1065 Application Note 1073 Application Note 1086 Application Note 1121 Application Note 1122 Application Note 1123 Application Note 1137 Application Note 1383
HFBR-1412TZ HFBR-1415Z HFBR-2412TZ HFBR-2422Z
HFBR-1412Z HFBR-1424Z HFBR-2412Z HFBR-24E2Z
HFBR-1414MZ HFBR-14E4Z HFBR-2416MZ HFBR-24E6Z
Link Selection Guide
This section gives the designer information necessary to use the HFBR-0400Z series components to make a functional fiber optic transceiver.
Avago Technologies offers a wide selection of evaluation kits for hands-on experience with fiber optic products as well as a wide range of application notes complete with circuit diagrams and board layouts.

PD100MF0MP;PD100MF0MP1;中文规格书,Datasheet资料

2. Content information about the six substances
specified in “Management Methods for Control of
Pollution Caused by Electronic Information Prod-
ucts Regulation” (popular name: China RoHS)
ommends checking the process to make sure these parameters are not exceeded; exceeding these parameters can cause substrate bending or other mechanical stresses leading to debonding of the internal gold wires, or other similar failure modes. 3. If using an infrared lamp to preheat the parts, such heat sources may cause localized high temperatures in the part's resin. Be sure to keep the temperature profile within the guidelines shown in Fig. 4. 4. If hand soldering, use temperatures ≤ 260° for ≤ 3 seconds. Do not dip-solder or VPS-solder this part. 5. Do not subject the package to excessive mechanical force during soldering as it may cause deformation or defects in plated connections. Internal connections may be severed due to mechanical force placed on the package due to the PCB flexing during the soldering process.

BLM15BB100SN1磁珠规格书

Series BLM03/15/18/21 BLM03/15 BLM15/18 BLM03/15/18/21 BLM03/15 BLM03/15/18/21 BLM15 BLM15 BLM03/15/18/21/31/41 BLE32 BLM03/15
BLM18
BLM03/15/18 BLM03 BLM15/18 BLM03/15/18 BLM03/15/18 BLM18 BLM15 BLM15/18
1400±40%
1000±25%
2000±40%
1800±25%
2700±40%
120±25%
145 (Typ.)
220±25%
270 (Typ.)
120±25%
-
150±25%
-
220±25%
-
330±25%
-
470±25%
-
600±25%
-
1000±25%
-
5±25%
-
10±25%
-
22±25%
J
Paper Taping (ø330mm Reel)
D
Paper Taping (ø180mm Reel)
*1 BLM21BD222Sp1/BLM21BD272Sp1 only. *2 Except for BLM21BD222Sp1/BLM21BD272Sp1
Series BLE, BLM21 *1/31/41 All Series BLM03/15/18 /21 *2
3.2g1.6mm
32
3.2g2.5mm
41
4.5g1.6mm
EIA 0201 0402 0603 0805 1206 1210 1806

744710215;中文规格书,Datasheet资料

5.1 5.0 4.02012-06-272012-05-022009-06-30SStSStRStSStCZWürth Elektronik eiSos GmbH & Co. KGEMC & Inductive SolutionsMax-Eyth-Str. 174638 WaldenburgGermanyTel. +49 (0) 79 42 945 - 0A Dimensions: [mm]F Typical Impedance Characteristics:H4: Classification Wave Soldering Profile:H5: Classification Wave ProfileProfile FeaturePreheat- Temperature Min (T smin )- Temperature Typical (T stypical ) - Temperature Max (T smax ) - Time (t s ) from (T smin to T smax )Δ preheat to max Temperature Peak temperature (T p )Time of actual peak temperature (t p )Ramp-down rate - Min - Typical - MaxTime 25°C to 25°C Pb-Free Assembly 100°C 120°C 130°C 70 seconds 150°C max.250°C - 260°C max. 10 secondsmax. 5 second each wave ~ 2 K/s ~ 3.5 K/s ~ 5 K/s 4 minutesSn-Pb Assembly 100°C 120°C 130°C 70 seconds 150°C max.235°C - 260°C max. 10 secondsmax. 5 second each wave ~ 2 K/s ~ 3.5 K/s ~ 5 K/s 4 minutesrefer to EN 61760-1:2006H Soldering Specifications:I Cautions and Warnings:The following conditions apply to all goods within the product series of WE-SDof Würth Elektronik eiSos GmbH & Co. KG:General:All recommendations according to the general technical specifications of the data-sheet have to be complied with.The disposal and operation of the product within ambient conditions which probably alloy or harm the wire isolation has to be avoided.If the product is potted in customer applications, the potting material might shrink during and after hardening. Accordingly to this the product is exposed to the pressure of the potting material with the effect that the core, wire and termination is possibly damaged by this pressure and so the electrical as well as the mechanical characteristics are endanger to be affected. After the potting material is cured, the core, wire and termination of the product have to be checked if any reduced electrical or mechanical functions or destructions have occurred.The responsibility for the applicability of customer specific products and use in a particular customer design is always within the authority of the customer. All technical specifications for standard products do also apply for customer specific products.Washing varnish agent that is used during the production to clean the application might damage or change the characteristics of the wire in-sulation, the marking or the plating. The washing varnish agent could have a negative effect on the long turn function of the product.Direct mechanical impact to the product shall be prevented as the ferrite material of the core could flake or in the worst case it could break. Product specific:Follow all instructions mentioned in the datasheet, especially:•The solder profile has to be complied with according to the technical wave soldering specification, otherwise no warranty will be sustai-ned.•All products are supposed to be used before the end of the period of 12 months based on the product date-code, if not a 100% solderabi-lity can´t be warranted.•Violation of the technical product specifications such as exceeding the nominal rated current will result in the loss of warranty.1. General Customer ResponsibilitySome goods within the product range of Würth Elektronik eiSos GmbH & Co. KG contain statements regarding general suitability for certain application areas. These statements about suitability are based on our knowledge and experience of typical requirements concerning the are-as, serve as general guidance and cannot be estimated as binding statements about the suitability for a customer application. The responsibi-lity for the applicability and use in a particular customer design is always solely within the authority of the customer. Due to this fact it is up to the customer to evaluate, where appropriate to investigate and decide whether the device with the specific product characteristics described in the product specification is valid and suitable for the respective customer application or not.2. Customer Responsibility related to Specific, in particular Safety-Relevant ApplicationsIt has to be clearly pointed out that the possibility of a malfunction of electronic components or failure before the end of the usual lifetime can-not be completely eliminated in the current state of the art, even if the products are operated within the range of the specifications.In certain customer applications requiring a very high level of safety and especially in customer applications in which the malfunction or failure of an electronic component could endanger human life or health it must be ensured by most advanced technological aid of suitable design of the customer application that no injury or damage is caused to third parties in the event of malfunction or failure of an electronic component.3. Best Care and AttentionAny product-specific notes, warnings and cautions must be strictly observed.4. Customer Support for Product SpecificationsSome products within the product range may contain substances which are subject to restrictions in certain jurisdictions in order to serve spe-cific technical requirements. Necessary information is available on request. In this case the field sales engineer or the internal sales person in charge should be contacted who will be happy to support in this matter.5. Product R&DDue to constant product improvement product specifications may change from time to time. As a standard reporting procedure of the Product Change Notification (PCN) according to the JEDEC-Standard inform about minor and major changes. In case of further queries regarding the PCN, the field sales engineer or the internal sales person in charge should be contacted. The basic responsibility of the customer as per Secti-on 1 and 2 remains unaffected.6. Product Life CycleDue to technical progress and economical evaluation we also reserve the right to discontinue production and delivery of products. As a stan-dard reporting procedure of the Product Termination Notification (PTN) according to the JEDEC-Standard we will inform at an early stage about inevitable product discontinuance. According to this we cannot guarantee that all products within our product range will always be available. Therefore it needs to be verified with the field sales engineer or the internal sales person in charge about the current product availability ex-pectancy before or when the product for application design-in disposal is considered.The approach named above does not apply in the case of individual agreements deviating from the foregoing for customer-specific products.7. Property RightsAll the rights for contractual products produced by Würth Elektronik eiSos GmbH & Co. KG on the basis of ideas, development contracts as well as models or templates that are subject to copyright, patent or commercial protection supplied to the customer will remain with Würth Elektronik eiSos GmbH & Co. KG.8. General Terms and ConditionsUnless otherwise agreed in individual contracts, all orders are subject to the current version of the “General Terms and Conditions of Würth Elektronik eiSos Group”, last version available at .J Important Notes:The following conditions apply to all goods within the product range of Würth Elektronik eiSos GmbH & Co. KG:分销商库存信息: WURTH-ELECTRONICS 744710215。

1591MSFLBK,1591ASFLBK,1591BSFLBK,1591CSFLBK,1591HSFLBK,1591GSFLBK,1591SSFLBK, 规格书,Datasheet 资料

EUROPEBasingstoke, UK +44 1256 812812AUSTRALASIAQueenstown, SA, Australia +61 8 8240 2244CANADAGuelph, Ontario (519) 822-2960St. Laurent, Quebec (514) 343-9010USACheektowaga, NY (716) 651-0086w w w .h a mm o n d mf g .c o m20©Flanged Lid Version - Polystyrene (1591 Series)ACCESSORIESOTHER KEY FEATURES• Electronic instrument enclosures, designed for mounting printed circuit boards.• Designed for applications where the enclosure needs to be easily wall or shelf mounted.• Perfect where extra enclosure security is required by restricting access to lid screws.• Integral card guides accept 1.5 mm (0.062”) P .C. cards.• Two piece lap joint construction provides protection against access of dust and splashing water.• Designed to meet IP54• Molded in economical black polystyrene.• Lid is secured with black self-tapping #4 x 0.5” Philips screws.Unit assembled with self-tappingscrews...Economical black polystyrene material...Lap joint construction...P .C. Board Card Adaptors Allows horizontal mounting of P.C.board(s). See “Accessories Section” for full details!1591Z6 - Package of 61591Z50 - Package of 501591Z100 - Package of 100Replacement Screws Self-tapping type, black oxide,#4 x 0.5”1591TS100BK- Package of 100P .C. board standoffs molded into lid...P .C. Board ScrewsSelf-tapping type, used for bosses in the 1591 lid for P .C. board installation. #4 x 1/4” (6.4 mm)1593ATS50 - Package of 501593ATS100 - Package of 100芯天下--/21w w w .h a m m o n d mf g .c o m©CANADAGuelph, Ontario (519) 822-2960St. Laurent, Quebec (514) 343-9010USACheektowaga, NY (716) 651-0086EUROPEBasingstoke, UK +44 1256 812812AUSTRALASIAQueenstown, SA, Australia +61 8 8240 2244Flanged Lid Version - Polystyrene (1591 Series)For detailed drawings, CAD files and color photos visitour website at:NOTES:- Assembled height = dimension “C” + 0.16” (4.0 mm)- Average wall thickness: 0.08” (2.0 mm)芯天下--/。

SY58016LMI;中文规格书,Datasheet资料

SY58016L3.3V, 10Gbps Differential CML Line Driver/Receiver with Internal TerminationMLF and Micro LeadFrame are trademarks of Micrel, Inc.Micrel Inc. • 2180 Fortune Drive • San Jose, CA 95131 • USA • tel +1 (408) 944-0800 • fax + 1 (408) 474-1000 • General DescriptionThe SY58016L is a high-speed, current mode logic (CML) differential receiver. It is ideal for interfacing with high frequency sources. It can be used as a Line Receiver, Line Driver, and Limiting Amplifier. The device can be operated from DC to 10Gbps. The input incorporates internal termination resistors, and directly interfaces to a CML logic signal. The output is CML compatible, and includes 50Ω load resistors.Data sheets and support documentation can be found on Micrel’s web site at: .Features• Accepts up to 10.7Gbps data • < 45ps edge rate • Gain ≥ 4V/V• CML/PECL differential inputs • CML outputs • Internal 50Ω input termination • Internal 50Ω output load resistors• Available in die or 16-pin (3mm x 3mm) MLF packageApplications• Backplane buffering• OC-3/OC-192 SONET clock or data distribution/driver • All GigE clock or data distribution/driver • Fibre Channel distribution/driver________________________________________________________________________________________________Package/Ordering InformationPart NumberPackage TypeOperating RangePackage MarkingSY58016LXC DIE 25°C — SY58016LMG MLF-16 Industrial 016L SY58016LMGTR* MLF-16 Industrial016L*Tape and ReelPin DescriptionPin NumberPin NamePin Function1.4D, /D CML, PECL differential inputs with internal 50Ω pull-up resistors.2,3,10,11 VTR Transmission Line Return: Normally connected to the most positive supply. 6, 7, 14, 15 Exposed pad VEE Most negative supply. Exposed pad to be at the same electrical potential as VEE pins.12, 9 Q, /Q CML differential outputs with internal 50Ω pull-up resistors. 5, 8, 13, 16VCCPositive power supply: +3.3V nominal.________________________________________________________________________________________________Functional Block DiagramTypical PerformanceAbsolute Maximum Ratings (1)Supply Voltage (V CC —V EE )..........................................+4.0V Output Voltage (V OUT ).................................Max. V CC +0.5V ............................................................Min. V CC to -1.0V Maximum Input Current (I IN )......................................±25mA Maximum Output Current (I OUT )................................±25mA Lead Temperature (Soldering, 10 sec.).....................220°COperating Ratings (2)Supply Voltage (V IN ) Input Voltage (V CC =0V).........................-1.0V to +0.5V Input Voltage (V EE =0V).............V CC -1.0V to V CC +0.5V Ambient Temperature (T A )...........................-40°C to +85°C Storage Temperature (T S ).........................-65°C to +150°C Package Thermal ResistanceInput Voltage (V CC =0V)................................-1.0V to +0.5V MLF (θJA ) Still Air...........................................................60°C/W 500lfpm..........................................................54°C/W MLF (ψJB) (4)32°Notes:1.Permanent device damage may occur if Absolute Maximum Ratings are exceeded. This is a stress rating only, and functional operation is notimplied at conditions other than those detailed in the operational sections of this data sheet. Exposure to Absolute Maximum Rating conditions for extended periods may affect device reliability.2. The data sheet limits are not guaranteed if the device is operated beyond the operation ratings.3. The device is guaranteed to meet the CD specifications, show in the table above, after thermal equilibrium has been established. The device is tested in a socket such that transverse airflow of ≥500lfpm is maintained.4.Junction-to-board resistance assumes exposed pad is soldered (or equivalent) to the devices most negative potential on the PCB.DC Electrical Characteristics (4)V EE = GND; V CC =3.3V ±10%.Symbol ParameterCondition Min Typ MaxUnitsI EE Power Supply Current — 50 75 mA R IN Input Resistance 40 50 60 Ω R OUT Output Source Impedance40 50 60Ω V IH Input HIGH Voltage V CC – 0.9 — V CC VV IL Input LOW Voltage V CC – 1.0 — V CC – 0.1 V V OH Output HIGH VoltageV CC – 0.040V CC – 0.010V CC VV OL Output LOW Voltage (1) — V CC – 0.400V CC – 0.325VV OUT(swing)Output Voltage Swing(1)325 400 — mVp-pNote:1. 50Ω output load and input swing is more than 100mVp-p. See Figure 1 for Output Swing definition.Input/Output SwingFigure 1. Input/Output SwingAC Electrical CharacteristicsSymbol Parameter Condition Min Typ Max UnitsfMAX Maximum Data Rate 10.7 — — Gbps t PLH t PHL Propagation Delay—100150psRandom Jitter (1) — — 1.5 ps (rms)t JITTER Deterministic Jitter (2) — — 15 ps (pk-pk) V IN Minimum Input Swing (3) 100 — — mVp-pt r, t fOutput Rise/Fall times (20% to 80%)(4)— 30 45 psNotes:1. Measured with a K28.7 comma detect character pattern, measured at 10Gbps. See Figure 2: Eye Diagram.2. Measured with a K28/5 pattern 223-1PRBS pattern at 10Gbps.3.Minimum input swing for which AC parameters are guaranteed. See Figure 1. Reduced input swing will impact maximum data rate and the resulting eye pattern.4. 50Ω load and input swing is more than 100mVp-p.Eye DiagramFigure 2. Eye Diagram16 LEAD Micro LeadFrame™ (MLF-16)分销商库存信息: MICRELSY58016LMI。

1591XXSFLBK,1591XXSFLGY, 规格书,Datasheet 资料

84.62 mm [3.332 in] 63.00 mm [2.480 in] 56.90 mm [2.240 in]
n3.51 mm [0.138 in]
1591XXSFL
77.90 mm [3.067 in] 61.90 mm [2.437 in]
1591XXSFL Box Enclosure Black Enclosure - RAL 7011 1591XXSFLBK Gray Enclosure - RAL 7002 1591XXSFLGY ACCESSORIES Lid Screws M3 x 0.5 - H6 Black 1591MS100BK (Pkg 100) Lid Screws M3 x 0.5 - H6 Standard 1591MS100 (Pkg 100) P.C. Boa rd Scre w s (All Box e s) P.C. Board Screws 1593ATS50 (Pkg 50) [#4 x 1/4" self-tapping (6.4mm)] 1593ATS100 (Pkg 100)
3
MAX P.C. BOARD SIZE (NOT INCLUDED)
BOTTOM VIEW OF LID
4
1591XXSFL
1
芯天下--/
2
A
n2.50 mm x 5.00 mm
73.30 mm [2.886 in]
R3.51 mm [0.138 in] 97.80 mm [3.850 in]
73.30 mm [2.886 in]
A
SIDE VIEW OF LID
Mounting Holes for #6 - #8 screws (M3.5 - M4.5)

XPF规格书简体

６）对应点胶运转中可以准备与旋转自动更换头·单吸嘴一样可以进行自动更换的点胶自动更换头
-4-
XPF-030706ZS
1．概要
1.2.4
对应多种多样的元件
自动更换头有“旋转自动更换头”和“单吸嘴”可以根据贴装元件的种类进行自动更换。另外，由于还可以对应”点胶自动更换头”所以可以不降低生产线效率而最大限度的活用工作头的能力。
□10mm
□10mm
□10mm □10mm
2)-3 用2个φ5.0mm的吸嘴贴装20×20mm以内的元件对于超过□10mm的元件，为了避免元件与吸嘴干涉对于φ3.7mm以上的吸嘴只安装在上下的吸嘴位置（吸嘴号码1，7）。
□20mm
□20mm
-6-
XPF-030706ZS
1．概要
1.2.4.2 单吸嘴
-8-
XPF-030706ZS
1．概要
1.2.5
引脚浮起检测（选项）
可以用独创的光学系统和影像处理对QFP、VQFP、SOIC、接插件等引脚元件的引脚浮起进行检查。
元件尺寸
最大45mm×150mm
元件高度※1
最大20.0mm为止或者最大15.0mm
每边的引脚根数
3根以上～128根以下
引脚间距
0.30mm以上
１）超高速吸嘴更换系统
吸嘴的更换采用独创的”双真空吸嘴”系统可以高速完成，即使是使用多种吸嘴因更换而造成的损耗时间也只有一点点。
吸嘴头
吸嘴元件
２）双真空吸嘴和机械夹头（与XP-243E通用）
通过对应双真空吸嘴（标准吸嘴・长孔吸嘴・带有橡皮垫吸嘴）和机械夹头，可以贴装各种元件。
＜标准吸嘴＞
·完全的单供料器 ·运转中可以自由拔插供料器 ·通过供料器ID系统实现防止错置功能 ·料带拼接容易 ·纸、嵌入式、料带厚度、送出间距的变更自由 ·与NXT & AIM共用

富基电子客户规格书说明书

产产容量客户规格文件C A 客厂址：深Address: B Re 品型号Pro 品代码Pro 量 Capaci 户代码Cu 格书编号S 件版本RE 拟Pre HP_L 2019-CustomerApproval 客户承认圳市宝安区松Bld.10，2rd Ind 富基 echa oduct Mode oduct Code ty.： stomer Co Specificatio EV ：FUJ 拟制 eparedLiu / ZengPe -06-05松岗街道塘下dustrial Park T 基电子FUJI ELEC argea Spe el ： e ode: on No.: JI ELEC eng Comp 公司名Custo 客户Part No 部件Signa 签下涌第二工业TangXiaYong,S 子（深CTRONICS able ecifi INR 539130539 A5CTRONIC 品质检Quality Ch Hui hon 2019-06pany Name 名称：omer Model 型号o.:编号： ature 名业区第十栋SongGang,Ba 深圳）(SHENZH Li-Io icati R18650F19021 000mAh 9 CS (SHE 检验 heckoutng Liu 6-05:l : : aoAn,ShenZhe 有限公EN) CO., L on Ba onL(1INR19/NZHEN) Date日期en, China公司LTD.atter /66-4) ) CO.,LT 核准Approved Peter Su 2019-06-05ryTD. d5序号No.12345 版本Rev.A1A2A3A4A5DateCFirst issue修改成品尺(66.0mm M更改线序更新EVA增加醋酸胶修改LAYO修改插件导修改装配方修改插件导(23mm替修改醋酸胶修改正极连修改插件线201修Histo修订内容ontent of Ce尺寸Max 替代6尺寸胶布OUT图导线线序方式导线出线长度代25mm)胶布长度(15连接线号(反映线型(反映线太19-06-05修订履历ory of C内容Change6.5mm Max度5mm替代18映阻抗大)太硬)Page历表Chang修订P/x)1312138mm)1414ge订页码age修PrHPHPHPHPHP1/ 19修订者reparedP_LiuP_LiuP_LiuP_LiuP_Liu日期Date2019-04-232019-05-052019-05-162019-05-272019-06-05356751、目的2、依据标3、基本参4、测试方5、技术指6、保护板7、装配结8、环保要9、外观 10、运输11、安全12、质量13、保质14、其他Scope .........标准Test re 参数Key pa 方法和定义指标Technic 板规格与特性结构Assemb 要求 Enviro Cosmetic re 输、贮存 Tra 全规程和使用量评定程序质期限 Guar 他事项 Misc Date.....................eference sta arameters ..Test metho cal indicator 性PCM Spe bly configura onmental req equirements ansportation 用说明 Safegu Quality As ranteed Dea cellaneous ..201Tabl .....................andard ............................ods and def rs ..................c. and chara ation ............quirements. .....................n and storage uard and ins ssessment P adline ..............................19-06-05 目录e of C............................................................finitions .........................acteristic ..................................................................e ...................struction .....Procedures ........................................Page录Conten .......................................................................................................................................................................................................................................s .............................................................nt......................................................................................................................................................................................................................................................................................................2/ 19........................................................................................................................................................................................................................................................................................................ 3................ 3................ 3................ 4................ 5.............. 11.............. 14.............. 16.............. 16.............. 16.............. 17.............. 19.............. 19.. (19)1、目的本规格书品的质量This spe the basis proper u2、依据标本产品依The batt Batteries3、基本参序号No. 1 2 3 4 5 最6 7 8 9 10 11C 1213放14O 15Scope书适用于富基电量及正确使用方ecification shal s of the produ se of the prod 标准Test 依据标准：GB3ery is tested in s used in Porta 参数Key p 项目It 型号Mo 电池类型Ba 电池结Battery Con 标称容量 Rat 最小容量Minim 标称电压Ra 内阻 Internal 电池重量 Ba 出货状态As of shipme 充电截止Charge cut-通讯方Communication 充电电流 Cha 放电电流Disch 工作温Operating Tem 存储温Date电子（深圳）有方法.ll be applied to uct design, pr duct; reference 31241-2014《便n reference to able Electroni parameter tems odel No. attery Type结构 nfiguration ted Capacity mum Capacity ated Voltage l Resistance ttery Weight态电压 ent Voltage止电压 -off voltage方式n methods arge Currentharge current温度perature(°C ）温度201限公司生产的o Li-ion batter roduction and standard 便携式电子产品o the standard ic Devices. rs规格Sp INR18650Rechargea 1130y 1233≤93.5500Chargin 充电：Dischargin 放电：-19-06-05的锂离子电池, 它ry manufacture testing; The品用锂离子电池 of GB 31241-pecifications 0F1L(1INR19/6able Li-ion Ba 1S4P 000mAh 300mAh 3.63V 90m Ω Approx:189g 5 ~3.75V4.2V I2C 0.2C 5A 3.0A 0.2C 5A3.0Ang:0℃~45℃0℃~45℃ ng: -20℃~50-20℃~50℃Page它是产品设计、ed by FUJI EL purpose is to 池和电池组安全-2014 Safety R 66-4) tteryD (AC 标准标准Ma ℃(50±、生产和检验的LECTRONICS let customers 全要求》。