IBOM-台湾UNIOHM贴片排阻晶片排列凸式电极(4C03)
贴片排阻封装
S Circuit
R Circuit
S473
H Q L P
尺寸型號
RCN06-10R RCN06-10S
L 6.4 ± 0.2
W 3.1 ± 0.2
H 0.55 ± 0.1
L1 0.5 ± 0.3
L2 0.5 ± 0.2
P 1.27 ± 0.1
Q 0.8 ± 0.2
02 of 06
/
TOKEN
FCR/RCA/RCN 貼片厚膜電阻 網絡電阻 排阻
貼片厚膜電阻 網絡電阻 排阻
FCR, RCA, RCN 系列 表面貼裝電阻器
產品簡介
高精度表面貼裝網絡電阻，排列貼片，和倒裝 貼片是非常成熟，典型的芯片電阻器的代表。 德鍵電子採用最新封裝技術，優化無引線表面 貼裝的封裝，以滿足新的汽車行業對溫度和濕 度的要求，同時提供高重複性，穩定性的工業、 電信、和消費性電子產品。 適用於加工自動化 SMD 或 SMT 裝配系統，這些貼片元器件均符合 RoHS 標準， 與無鉛（Pb-Free）要求，兼容錫/鉛（Sn / Pb）回流焊和汽相焊接工藝。 倒裝貼片電阻 (Flip Chips) FCR 系列： - 倒裝貼片電阻尺寸結構（FCR 系列），有 EIA 0603， EIA 0805，和 EIA 1206 系列標準提供。 - 額定功率有 1/10W，1/8W，和 1/4W 可供選擇，最大電壓 100V， 300V，和 300V。 - 精度公差有 F(± 1%), J(± 5%) 對應寬廣的阻值範圍 1Ω to 10MΩ. 貼片排列電阻（排阻） RCA 系列： - RCA 排阻 1.6mm X 3.2mm 的封裝尺寸，非常方便於高密度電路的設計使用。 - 排阻是由多個電阻元組件排列封裝器件，如用一個排列電阻來取代 4 個精 密電阻的設計，應用成本相對的節約很多。 - 貼片排阻精準公差比有 F(± 1%)，G(± 2%)，和 J(± 5%) 對應的阻值範圍 從 10Ω 到 1MΩ. 網絡電阻（網阻） RCN 系列： - 網絡電阻提供寬廣阻值範圍從 10Ω 到 1MΩ， 工作溫度 -55°C~+125°C. - 網阻的每一個電阻元組件功率為 1/16W 於 +70°C，可由客戶定制配置。 如需德鍵最新詳細規格，機械特性或電氣特性，請與我們的銷售代表聯繫， 以取得更新的信息。
1N4001(Taiwan Semiconductor)中文数据手册「EasyDatasheet」
极性：颜色频带为负极
高温焊接防护证：260℃/ 10秒 /.375",设计（9.5mm）引线长度在5 lbs,（2.3千克）张力
重量：0.35克
尺寸以英寸（毫米） 标记图
1N400X G Y WW
=具体设备守则 =绿色复合 =年 =工作周
最大反向电流@额定VRT
满载最大反向电流,完整 周期平均.375"设计（9.5mm）铅Lenfth @T =75℃
典型结电容（注2）
=25 ℃ T =125℃
典型热阻
工作温度范围 存储温度范围
注1：与PW = 300微秒脉冲测试,1％占空比 注2：测量4.0V DC应用反向电压在1 MHz和
符
1N 1N 1N 1N 1N 1N 1N 4001 4002 4003 4004 4005 4006 4007
最大额定值和电气特性
等级25
℃ 环境温度,除非另有规定.
单相,半波,60赫兹,电阻或电感性负载.
对于容性负载,减免电流20％
型号数量
最大重复峰值反向电压
最大RMS电压
最大直流阻断电压 最大正向平均整流电流
.375"设计（9.5mm）引线长度@T =75℃
峰值正向浪涌电流,8.3ms单一正弦半波 叠加额定负荷（JEDEC方法） 额定值融合（t8.3ms） 最大正向电压（注1） @1A
图. 2最大非重复正向
浪涌电流 50
40
CURRENT(A)
30
8.3msSingle Half Wave JEDEC Method
20
PEAK FORWARD SURGE
OX-221-9101-24M576 OCXO 商品说明书
OX-221-9101-24M576OCXONominal frequency (f0)24.576MHzFeaturesApplication•SC Cut Crystal •hermetically sealed •SMD•S3E compliant according GR1244•Wander generation (Standard /ZLAN Group)MTIE &TDEV compliant with:-G.812(zO1)-G.8273.4(zO4;zO5)-G.8263(zO6);Performance SpecificationsEnclosure17,87,6223,43,42,71234567top view25,4 0,27,62 0,117,8 0,122 0,2G275H 0,250,1Co- Planarity spec ( 0,1mm)2,52,58,9 0,1()all units in mmNotes:Unless otherwise stated all values are valid after warm-up time and refer to typical conditions for supply voltage, frequency control voltage,load,temperature(25◦C).Subject to technical modification.USA:Europe:100Watts Street LandstrasseMt Holly Springs,P A1706574924NeckarbischofsheimGermanyTel:1.717.486.3411T el:+49(0)7268.801.0Fax:1.717.486.5920Fax:+49(0)7268.801.281Information contained in this publication regarding device applications and the like is provided only foryour convenience and may be superseded by updates.It is your reasonability to ensure that yourapplication meets with your specifications.MICROCHIP MAKES NO REPRESENT A TION ORWARRANTIES OF ANY KIND WHETHER EXPRESS OR IMPLIED,WRITTEN OR ORAL,ST ATUTORYOR OTHERWISE,RELA TED TO THE INFORMA TION INCLUDING,BUT NOT LIMITED TO ITSCONDITION,QUALITY,PERFORMANCE,MERCHANT ABILITY OR FITNESS FOR PURPOSE.Microchip disclaims all liability arising from this information and its e of Microchip devices in lifesupport and/or safety applications is entirely at the buyer’s risk,and the buyer agrees to defend,indemnify and hold harmless Microchip from any and all damages,claims,suits,or expenses resultingfrom such use.No licenses are conveyed,implicitly,or otherwise,under any Microchip intellectualproperty rights unless otherwise statedTrademarksThe Microchip and Vectron names and logos are registered trademarks of Microchip TechnologyIncorporated in the U.S.A.and other countries.List of appendicesAppendix_OX-221-9101-24M576_Jitter II Appendix_OX-221-9100-20M000_9101-III 24M576_9102_25M000_MTIE_TDEVAppendix_OX-221-OX-40x_Power_on_time XIAppendix handling&processing note XIIThe following MTIE TDEV plots were generated from data collected on production devices over the course of a year and represent typical performance. Frequency is measured every second and converted to phase using Microchip’s golden standard TimeMonitor soft ware. Filtering is applied to the data per standards requirements, and limits where applicable, are shown in red. Additional information on standards and oscillatorrecommendations can be found in ZLAN-830 and ZLAN-3467 (formerly ZLAN-442 and ZLAN-68).Const. Temp ±1°K; slope 0,1°C/min, range 21..23°C Const. Temp ±5°F; slope 0,1°C/min,range 19.22..24.78°C Trapezoid_Pattern_slope 0,5°C/min,range +2,5...42,5°C Triangle-Pattern_slope 0,2°C/min,range -40...85°CConst. Temp ±1°K; slope 0,1°C/min, range 21..23°C Const. Temp ±5°F; slope 0,1°C/min,range 19.22..24.78°C Trapezoid_Pattern_slope 0,5°C/min,range +2,5...42,5°C Triangle-Pattern_slope 0,2°C/min,range -40...85°CConst. Temp ±1°K; slope 0,1°C/min, range 21..23°C Const. Temp ±5°F; slope 0,1°C/min,range 19.22..24.78°C Trapezoid_Pattern_slope 0,5°C/min,range +2,5...42,5°C Triangle-Pattern_slope 0,2°C/min,range -40...85°CConst. Temp ±1°K; slope 0,1°C/min, range 21..23°C Const. Temp ±5°F; slope 0,1°C/min,range 19.22..24.78°C Trapezoid_Pattern_slope 0,5°C/min,range +2,5...42,5°C Triangle-Pattern_slope 0,2°C/min,range -40...85°CConst. Temp ±1°K; slope 0,1°C/min, range 21..23°C Const. Temp ±5°F; slope 0,1°C/min,range 19.22..24.78°C Trapezoid_Pattern_slope 0,5°C/min,range +2,5...42,5°C Triangle-Pattern_slope 0,2°C/min,range -40...85°CConst. Temp ±1°K; slope 0,1°C/min, range 21..23°C Const. Temp ±5°F; slope 0,1°C/min,range 19.22..24.78°C Trapezoid_Pattern_slope 0,5°C/min,range +2,5...42,5°C Triangle-Pattern_slope 0,2°C/min,range -40...85°CConst. Temp ±1°K; slope 0,1°C/min, range 21..23°C Const. Temp ±5°F; slope 0,1°C/min,range 19.22..24.78°C Trapezoid_Pattern_slope 0,5°C/min,range +2,5...42,5°C Triangle-Pattern_slope 0,2°C/min,range -40...85°CConst. Temp ±1°K; slope 0,1°C/min, range 21..23°C Const. Temp ±5°F; slope 0,1°C/min,range 19.22..24.78°C Trapezoid_Pattern_slope 0,5°C/min,range +2,5...42,5°C Triangle-Pattern_slope 0,2°C/min,range -40...85°CApplicationUnless otherwise noted, the products listed in the catalogue are designed for use with ordinary electrical devices, such as stationary and portable communication, control, measurement equipment etc.. They are designed and manufactured to meet a high degree of reliability (lifetime more than 15 years) under normal …commercial“ application conditions. Products dedicated for automotive and H-Rel applications are specifically identified for these applications. If you intend to use these …commercial“ products for airborne, space or critical transport applications, nuclear power control, medical devices with a direct impact on human life, or other applications which require an exceptionally high degree of reliability or safety, please contact the manufacturer.Electrostatic SensitivityCrystal oscillators are electrostatic sensitive devices. Proper handling according to the established ESD handling rules as in IEC 61340-5-1 and EN 100015-1 is mandatory to avoid degradations of the oscillator performance due to damages of the internal circuitry by electrostatics. If not otherwise stated, our oscillators meet the requirements of the Human Body Model (HBM) according to JESD22-A114F.HandlingExcessive mechanical shocks during handling as well as manual and automatic assembly have to be avoided. If the oscillator was unintentionally dropped or otherwise subject to strong shocks, please verify that the electrical function is still within specification.Improper handling may also detoriate the coplanarity of bended leads of SMD components. SolderingOscillators can be processed using conventional soldering processes such as wave soldering, convection, infrared, and vapour phase reflow soldering under normal conditions. Solderability is guaranteed for one year storage under normal climatic conditions (+5°C to +35°C @ 40% to 75% relative humidity), however typically sufficient solderability –depending on the process – is maintained also for longer time periods. In cases of doubt, components older than one year should undergo a sample solderability test.The recommended reflow solder profile for SMT componets is according IPC/JEDEC J-STD-020 (latest revision)SMD oscillators must be on the top side of the PCB during the reflow process.After reflow soldering the frequency of the products may have shifted several ppm, which relaxes after several hours or days, depending on the products. For details please contact the manufacturer.CleaningCleaning is only allowed for hermetically sealed oscillators. Devices with non hermetical enclosures (e.g. with trimmer holes) shall not be cleaned by soaking or in vapour, because residues from the cleaning process may penetrate into the interior, and degrade the performance.Our products are laser marked. The marking of our oscillators is resistant to usual solvents, such as given in IEC 60068-2-45 Test XA. For applicable test conditions see IEC 60679-1.Ultrasonic cleaning is usually not harmful to oscillators at ultrasonic frequencies of 20kHz at the sound intensities conventional in industry. Sensitive devices may suffer mechanical damage if subjected to 40kHz ultrasound at high sound pressure. In cases of doubt, please conduct tests under practical conditions with the oscillators mounted on the PC board.Hermetical SealIf the device is specified as hermetically sealed, it meets the requirements of IEC 60679-1, i.e. for enclosures with a volume smaller than 4000mm³ the leak rate is below 5*10-8 bar cm3/s, for larger enclosures it is below 1*10-6 bar c bar cm3/s, tested according to IEC 60068-2-17 Test Qk.Glass feed-throughs may be damaged as a result of mechanical overload, such as bending the connection leads or cutting them with an unappropriated tool. In order to avoid microcracking, the wire must be held fixed in position by a pressure pad between glass feed-through and the bending point during the bending process. Check: there should be no damaged edges on the glass feed-through after the bending.Tape & ReelThe packing in tape and reel is according to IEC 60286-3.Details see tape & reel data sheets.QualificationVectron products are undergoing regular qualification/reliability tests as per product family definition. Results are available upon request. Customer specific qualification tests are subject to agreement.If not otherwise stated, the product qualifications are performed according to IEC 60679-5 or other valid industry standards.ScreeningOur oscillators are 100% tested, and all key manufacturing processes are controlled by Statistical Process Control (SPC). Additional screening is therefore usually not required.On request, we can perform screening tests according to MIL-PRF-55310, class B for discrete or hybrid constructions of commercial (COTS) products. For special requirements see the High Reliability Clock section.Demounting/Desoldering of Ocsillator device for analysis:The removal or desoldering of oscillators from customer application after SMT process may cause damage to the device if not handeld appropriately. It may lead to parametric change such as frequency shift (like OCXO: up to +/- 200 ppb) . It is utmost important to minimize the direct heat exposure to the device in order to avoid such effects. Use of hot air gun for desoldering should be avoided.A mechanical stress could also destroy the part, if exposed to excessive mechanical shock after removal process. Appropriate shock protection & ESD designated packaging must be used to avoid any external mechanical shock for FA return process.In general, the products* withstand the tests listed in the following Table 1, which are based on valid industry standards.*Additional note: Test conditions could vary for different product families and individual product specifications depending on the customer as well as product requirements.Recommended Environmental Test ConditionsTable 1。
松下继电器选型一览
P.47
0.05A
0.15A 70Ω 120Ω
0.28ms 0.5ms 0.04ms 0.2ms
0.12A
0.3A 30Ω 50Ω
1.3mA 3mA 0.4mA 1.2mA 0.6ms 0.8ms 0.05ms 0.2ms 5,000V AC
UL､C-UL､BSI
Panasonic Electric Works Automation Controls Business Unit panasonic-denko.co.jp/ac/c
AQY212S 60V 60V
AQY210S 350VV
AQV212S 60V 60V
AQV215S 100V 100V
AQV217S 200V 200V
AQV210S 350V 350V
AQV214S 400V 400V
AQV216S 600V 600V
1A 连续 负载电流
PhotoMOS选型参数表
GU…通用、变更较大 GU GE RF HE HF HS PD Power
商品名称
外形尺寸
（ ） 高度包括支架尺寸。 单位mm
1a(4脚型) AC/DC兼用
4.3
4.4
2.1
GU SOP
1a(6脚型) AC/DC兼用
6.3
4.4 2.1
订购产品号 负载电压
AC(峰值) DC
AQV212 60V 60V
0.55A
1.2A 0.83Ω 2.5Ω 80pF
0.65ms 2ms
0.08ms 0.2ms
端子排列 或 印刷电路板加工图 （BOTTOM VIEW）
国外标准 重量(约) 备注 目录记载页
GU 1a(6脚型) AC/DC兼用
台湾PSA华新科SA系列防硫化凸型电阻规格书
SA04X, SA06X±1%, ±5%, Convex TypeThick film General Purpose Chip-R Array Size 0402x4, 0603x4 (8P4R)Automotive & Anti-Sulfuration*Contents in this sheet are subject to change without prior notice.FEATURE1. High reliability and stability2. Sulfuration resistant3. Automotive grade with AEC Q-200 compliant4. Higher component and equipment reliability5. EU RoHS compliant and Lead free products6. Anti-Sulfuration ASTM B-809-95 105’C, 1000hrs compliantAPPLICATION•Consumer electrical equipment•EDP, Computer application•Telecom•Automotive applicationDESCRIPTIONThe resistors array is constructed in a high grade ceramic body (aluminum oxide). Internal metal electrodes are added at each end and connected by a resistive paste that is applied to the top surface of the substrate. The composition of the paste is adjusted to give the approximate resistance required and the value is trimmed to within tolerance by laser cutting of this resistive layer.The resistive layer is covered with a protective coat. Finally, the two external end terminations are added. For ease of soldering the outer layer of these end terminations is a Tin (Pb free) solder alloy.Fig 1. Consctruction of a Chip-R array(convex Type)QUICK REFERENCE DATAItem General SpecificationSeries No. SA04X SA06XSize 0402x4 (1005x4) 0603x4 (1608x4) Termination construction Convex Convex Resistance Tolerance ±5%, ±1% ±5%, ±1% Resistance Range 10Ω ~ 1MΩ, Jumper 1Ω ~ 1MΩ, Jumper,TCR (ppm/°C)10Ω - 1MΩ: ≤± 300 <10Ω: -200 ~ +400 10Ω - 1MΩ: ≤± 200Max. dissipation at T amb=70°C 1/16 W 1/10 WMax. Operation Voltage 50V 50VMax. overload voltage 100V 100VOperation temperature -55 ~ +155’CNote :1. Climatic category refer to IEC 600682. This is the maximum voltage that may be continuously supplied to the resistor element, see “IEC publication60115-8”3. Max. Operation Voltage : So called RCWV (Rated Continuous Working Voltage) is determined byValueResistancePowerRatedRCWV×=or Max. RCWV listed above, whichever is lower. DIMENSIONS (unit : mm)SA04X SA06XL 2.00 ± 0.10 3.20 ± 0.10W 1.00 ± 0.10 1.60 ± 0.10T 0.45 ± 0.10 0.50 ± 0.10P 0.50 ± 0.05 0.80 ± 0.10A 0.40 ± 0.10 0.60 ± 0.10B 0.20 ± 0.10 0.30 ± 0.10C 0.30 ± 0.05 0.40 ± 0.10G 0.25 ± 0.10 0.30 ± 0.20MARKING3-digits marking for E24 series ±1% , ±5% products.No marking for chip resistors array E96 series resistance.Each resistor is marked with a three digits code on the protective coating to designate the nominal resistance value.ExampleResistance 10Ω100Ω6800Ω47000ΩMarking code 100 101 682 473FUNCTIONAL DESCRIPTIONProduct characterizationStandard values of nominal resistance are taken from the E24 series for resistors with a tolerance of ±5%, The values of the E24 series are in accordance with “IEC publication 60063”Standard values of nominal resistance are taken from the E24/E96 series for resistors with a tolerance of ±1%, The values of the E24/E96 series are in accordance with “IEC publication 60063”DeratingThe power that the resistor can dissipate depends on the operating temperature; see Fig.2.Figure 2. Maximum dissipation in percentage of rated powerAs a function of the ambient temperatureCONSTRUCTIONR1=R2=R3=R4MOUNTINGDue to their rectangular shapes and small tolerances, Surface Mountable Resistors are suitable for handling by automatic placement systems.Chip placement can be on ceramic substrates and printed-circuit boards (PCBs). Electrical connection to the circuit is by individual soldering condition. The end terminations guarantee a reliable contact.SOLDERING CONDITIONThe robust construction of chip resistors allows them to be completely immersed in a solder bath of 260°C for 10 seconds. Therefore, it is possible to mount Surface Mount Resistors on one side of a PCB and other discrete components on the reverse (mixed PCBs).Surface Mount Resistors are tested for solderability at 235°C during 2 seconds. The test condition for no leaching is 260°C for 30 seconds. Typical examples of soldering processes that provide reliable joints without any damage are given in Fig 3.Fig 3. Infrared soldering profile for Chip Resistors arrayCATALOGUE NUMBERSThe resistors have a catalogue number starting with .SA04X472_JTLAutomotive codeSA04 : 0402 x 4 SA06 : 0603 x 4Type codeX : ConvexResistance code5%, E24 : 2 significantdigitsfollowed by no. ofzeros and a blank 220Ω=221_(“_” means a blank) 1%, E24+E96: 3 significantdigits followed by no. of zeros102Ω =1020 37.4K Ω=3742Tolerance F : ±1% J : ±5% P : JumperPackaging code T : 7” Reeled taping Q : 10” Reeled taping G : 13” Reeled taping B : BulkSpecial code L = Lead free* Anti-sulfur test conditions: ASTM B-809-95 105’C, 1000 hrs, criteria: within ±1% ! * 100% CCD visual inspection to guarantee visual quality !SA06X, Reeled tape packaging : 8mm width paper taping 5000pcs per reel. SA04X, Reeled tape packaging : 8mm width paper taping 10,000pcs per reel.TEST AND REQUIREMENTSEssentially all tests are carried out according to the schedule of IEC publication 115-8, category LCT/UCT/56(rated temperature range : L ower C ategory T emperature, U pper C ategory T emperature; damp heat, long term, 56 days). The testing also meets the requirements specified by EIA, EIAJ and JIS.The tests are carried out in accordance with IEC publication 68, "Recommended basic climatic and mechanical robustness testing procedure for electronic components" and under standard atmospheric conditions according to IEC 60068-1, subclause 5.3. Unless otherwise specified, the following value supplied :Temperature: 15°C to 35°C.Relative humidity: 45% to 75%.Air pressure: 86kPa to 106 kPa (860 mbar to 1060 mbar).All soldering tests are performed with midly activated flux.REQUIREMENTTEST PROCEDURE / TEST METHODResistor 0ΩBoard Flex AEC-Q200-005Resistors mounted on a 90mm glass epoxy resin PCB(FR4),bending once 2mm for 10sec∆R/R max. ±(1.0%+0.05Ω).No visible damage<50mΩTerminal strength AEC-Q200-006Pressurizing force: 1Kg, Test time: 60±1sec. No remarkable damage or removal ofthe terminationsVibrationMIL-STD-202 method 204Test 5g’s for 20min., 12 cycles each of 3 orientations ∆R/R max. ±(1.0%+0.05Ω)No visible damage <50mΩThermal shock MIL-STD-202 method 107 Test –55 to 125℃/ dwell time 15min/ Max transfer time20sec300cycles∆R/R max. ±(0.5%+0.05Ω)No visible damage <50mΩESDAEC-Q200-002 Test contact 1.0KV ∆R/R max. ±(1.0%+0.05Ω)No visible damage<50mΩTEST CONDITION FOR JUMPER (0 Ω)Item SA04X SA06X Power Rating At 70°C 1/16W 1/10W Resistance MAX.50mΩMAX.50mΩ Rated Current 1A 1APeak Current 1.5A 3AOperating Temperature -55~155°C -55~155°CPACKAGINGPaper Tape specifications (unit :mm)Symbol A B W F E SA06X 3.60±0.20 2.00±0.20 SA04X2.20±0.201.20±0.208.00±0.303.50±0.201.75±0.10Symbol P1 P0 ΦDT SA06X 4.00±0.10 Max. 1.0 SA04X2.00±0.054.00±0.101.00.050.1+−ΦMax. 0.6Reel dimensionsSymbol A B C D 7” REELΦ178.0±2.0Φ60.0±1.013.0±0.29.0±0.5。
CMBP系列贴片铁氧体磁珠商品说明书
●EXTERNAL DIMENSIONS UNIT：mm（外形尺寸）
PART NO. CMBP0402 CMBP0603 CMBP0805 CMBP1206
A 1.0±0.15 1.6±0.15 2.0(+0.3,-0.1) 3.2±0.2
B 0.5±0.15 0.8±0.15 1.25±0.2 1.6±0.2
CMBP0603- 600 60±25%
CMBP0603- 750 75±25%
CMBP0603- 121 120±25%
CMBP0603- 221 220±25%
CMBP0603- 601 600±25%
MHz Freq, 100 100 100 100 100 100
CMBP0805 TYPE
Max.DC Resistance 直流电阻
Design As Customers Requested Specifications 可根据客户需求设计
电感专业制造商 CMBP系列贴片铁氧体磁珠
CMBP0402 TYPE
Part Number 型号
Inductance 阻抗
Z Test Frequency
阻抗的测试频率
Units 单位 Symbol 符号 CMBP0402- 100
抑制效果，两种铁氧体材料、阻抗范围宽。适用于不同的电子线路 Internal silver printed layers and magnetic shielded structures to minimize crosstalk,Can be used in a wide range of frequency(from dozens of MHz to hundreds of MHz)to suppress EMI,Two types material and wide range of impedance values for various applications