SN74CB3T1G125DBVR中文资料

合集下载

SN74CB3T3306中文资料

SN74CB3T3306中文资料

PACKAGING INFORMATIONOrderable Device Status (1)Package Type Package Drawing Pins Package Qty Eco Plan (2)Lead/Ball FinishMSL Peak Temp (3)SN74CB3T3306DCTR ACTIVE SM8DCT 83000TBD CU SNPB Level-1-235C-UNLIM SN74CB3T3306DCURACTIVEUS8DCU83000Pb-Free (RoHS)CU NIPDAULevel-1-260C-UNLIM(1)The marketing status values are defined as follows:ACTIVE:Product device recommended for new designs.LIFEBUY:TI has announced that the device will be discontinued,and a lifetime-buy period is in effect.NRND:Not recommended for new designs.Device is in production to support existing customers,but TI does not recommend using this part in a new design.PREVIEW:Device has been announced but is not in production.Samples may or may not be available.OBSOLETE:TI has discontinued the production of the device.(2)Eco Plan -The planned eco-friendly classification:Pb-Free (RoHS)or Green (RoHS &no Sb/Br)-please check /productcontent for the latest availability information and additional product content details.TBD:The Pb-Free/Green conversion plan has not been defined.Pb-Free (RoHS):TI's terms "Lead-Free"or "Pb-Free"mean semiconductor products that are compatible with the current RoHS requirements for all 6substances,including the requirement that lead not exceed 0.1%by weight in homogeneous materials.Where designed to be soldered at high temperatures,TI Pb-Free products are suitable for use in specified lead-free processes.Green (RoHS &no Sb/Br):TI defines "Green"to mean Pb-Free (RoHS compatible),and free of Bromine (Br)and Antimony (Sb)based flame retardants (Br or Sb do not exceed 0.1%by weight in homogeneous material)(3)MSL,Peak Temp.--The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications,and peak solder temperature.Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided.TI bases its knowledge and belief on information provided by third parties,and makes no representation or warranty as to the accuracy of such information.Efforts are underway to better integrate information from third parties.TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing orchemical analysis on incoming materials and chemicals.TI and TI suppliers consider certain information to be proprietary,and thus CAS numbers and other limited information may not be available for release.In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s)at issue in this document sold by TI to Customer on an annual basis.PACKAGE OPTION ADDENDUM30-Mar-2005Addendum-Page 1元器件交易网IMPORTANT NOTICETexas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements, and other changes to its products and services at any time and to discontinue any product or service without notice. Customers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. All products are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment.TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s standard warranty. T esting and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where mandated by government requirements, testing of all parameters of each product is not necessarily performed.TI assumes no liability for applications assistance or customer product design. Customers are responsible for their products and applications using TI components. T o minimize the risks associated with customer products and applications, customers should provide adequate design and operating safeguards.TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right, copyright, mask work right, or other TI intellectual property right relating to any combination, machine, or process in which TI products or services are used. Information published by TI regarding third-party products or services does not constitute a license from TI to use such products or services or a warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the third party, or a license from TI under the patents or other intellectual property of TI.Reproduction of information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties, conditions, limitations, and notices. Reproduction of this information with alteration is an unfair and deceptive business practice. TI is not responsible or liable for such altered documentation.Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service voids all express and any implied warranties for the associated TI product or service and is an unfair and deceptive business practice. TI is not responsible or liable for any such statements. Following are URLs where you can obtain information on other Texas Instruments products and application solutions:Products ApplicationsAmplifiers Audio /audioData Converters Automotive /automotiveDSP Broadband /broadbandInterface Digital Control /digitalcontrolLogic Military /militaryPower Mgmt Optical Networking /opticalnetwork Microcontrollers Security /securityTelephony /telephonyVideo & Imaging /videoWireless /wirelessMailing Address:Texas InstrumentsPost Office Box 655303 Dallas, Texas 75265Copyright 2005, Texas Instruments Incorporated。

SN74AC533DBR,SN74AC533DWRE4,SN74AC533DWRG4,SN74AC533DBRE4,SN74AC533NSR, 规格书,Datasheet 资料

SN74AC533DBR,SN74AC533DWRE4,SN74AC533DWRG4,SN74AC533DBRE4,SN74AC533NSR, 规格书,Datasheet 资料

Addendum-Page 1PACKAGING INFORMATIONOrderable Device Status(1)Package Type PackageDrawingPins Package QtyEco Plan(2)Lead/Ball Finish MSL Peak Temp (3)Samples (Requires Login)SN74AC533DBLE OBSOLETE SSOP DB 20TBD Call TI Call TI SN74AC533DBR ACTIVE SSOP DB 20TBD Call TI Call TI SN74AC533DBRE4ACTIVE SSOP DB 20TBD Call TI Call TI SN74AC533DBRG4ACTIVE SSOP DB 20TBDCall TICall TISN74AC533DW ACTIVE SOIC DW 2025Green (RoHS & no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74AC533DWG4ACTIVE SOIC DW 2025Green (RoHS & no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74AC533DWR ACTIVE SOIC DW 202000Green (RoHS & no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74AC533DWRE4ACTIVE SOIC DW 202000Green (RoHS & no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74AC533DWRG4ACTIVE SOIC DW 202000Green (RoHS & no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74AC533N ACTIVE PDIP N 2020Pb-Free (RoHS)CU NIPDAU N / A for Pkg Type SN74AC533NE4ACTIVE PDIP N 2020Pb-Free (RoHS)CU NIPDAU N / A for Pkg Type SN74AC533NSR ACTIVE SO NS 20TBD Call TI Call TI SN74AC533NSRE4ACTIVE SO NS 20TBD Call TI Call TI SN74AC533NSRG4ACTIVE SO NS 20TBDCall TICall TISN74AC533PW ACTIVE TSSOP PW 2070Green (RoHS & no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74AC533PWE4ACTIVE TSSOP PW 2070Green (RoHS & no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74AC533PWG4ACTIVE TSSOP PW 2070Green (RoHS & no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74AC533PWLEOBSOLETETSSOPPW20TBDCall TICall TI(1)The marketing status values are defined as follows:ACTIVE: Product device recommended for new designs.LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.PREVIEW: Device has been announced but is not in production. Samples may or may not be available.OBSOLETE: TI has discontinued the production of the device.芯天下--/(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check /productcontent for the latest availability information and additional product content details.TBD: The Pb-Free/Green conversion plan has not been defined.Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.Addendum-Page 2芯天下--/TAPE AND REEL INFORMATION*All dimensions are nominalDevicePackage Type Package Drawing Pins SPQReel Diameter (mm)Reel Width W1(mm)A0(mm)B0(mm)K0(mm)P1(mm)W (mm)Pin1Quadrant SN74AC533DWR SOICDW202000330.024.410.813.02.712.024.0Q1*All dimensions are nominalDevice Package Type Package Drawing Pins SPQ Length(mm)Width(mm)Height(mm)SN74AC533DWR SOIC DW202000367.0367.045.0IMPORTANT NOTICETexas Instruments Incorporated and its subsidiaries(TI)reserve the right to make corrections,enhancements,improvements and other changes to its semiconductor products and services per JESD46C and to discontinue any product or service per JESD48B.Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and complete.All semiconductor products(also referred to herein as“components”)are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment.TI warrants performance of its components to the specifications applicable at the time of sale,in accordance with the warranty in TI’s terms and conditions of sale of semiconductor products.Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty.Except where mandated by applicable law,testing of all parameters of each component is not necessarily performed.TI assumes no liability for applications assistance or the design of Buyers’products.Buyers are responsible for their products and applications using TI components.To minimize the risks associated with Buyers’products and applications,Buyers should provide adequate design and operating safeguards.TI does not warrant or represent that any license,either express or implied,is granted under any patent right,copyright,mask work right,or other intellectual property right relating to any combination,machine,or process in which TI components or services are rmation published by TI regarding third-party products or services does not constitute a license to use such products or services or a warranty or endorsement e of such information may require a license from a third party under the patents or other intellectual property of the third party,or a license from TI under the patents or other intellectual property of TI.Reproduction of significant portions of TI information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties,conditions,limitations,and notices.TI is not responsible or liable for such altered rmation of third parties may be subject to additional restrictions.Resale of TI components or services with statements different from or beyond the parameters stated by TI for that component or service voids all express and any implied warranties for the associated TI component or service and is an unfair and deceptive business practice. TI is not responsible or liable for any such statements.Buyer acknowledges and agrees that it is solely responsible for compliance with all legal,regulatory and safety-related requirements concerning its products,and any use of TI components in its applications,notwithstanding any applications-related information or support that may be provided by TI.Buyer represents and agrees that it has all the necessary expertise to create and implement safeguards which anticipate dangerous consequences of failures,monitor failures and their consequences,lessen the likelihood of failures that might cause harm and take appropriate remedial actions.Buyer will fully indemnify TI and its representatives against any damages arising out of the use of any TI components in safety-critical applications.In some cases,TI components may be promoted specifically to facilitate safety-related applications.With such components,TI’s goal is to help enable customers to design and create their own end-product solutions that meet applicable functional safety standards and requirements.Nonetheless,such components are subject to these terms.No TI components are authorized for use in FDA Class III(or similar life-critical medical equipment)unless authorized officers of the parties have executed a special agreement specifically governing such use.Only those TI components which TI has specifically designated as military grade or“enhanced plastic”are designed and intended for use in military/aerospace applications or environments.Buyer acknowledges and agrees that any military or aerospace use of TI components which have not been so designated is solely at the Buyer's risk,and that Buyer is solely responsible for compliance with all legal and regulatory requirements in connection with such use.TI has specifically designated certain components which meet ISO/TS16949requirements,mainly for automotive ponents which have not been so designated are neither designed nor intended for automotive use;and TI will not be responsible for any failure of such components to meet such requirements.Products ApplicationsAudio /audio Automotive and Transportation /automotiveAmplifiers Communications and Telecom /communicationsData Converters Computers and Peripherals /computersDLP®Products Consumer Electronics /consumer-appsDSP Energy and Lighting /energyClocks and Timers /clocks Industrial /industrialInterface Medical /medicalLogic Security /securityPower Mgmt Space,Avionics and Defense /space-avionics-defense Microcontrollers Video and Imaging /videoRFID OMAP Mobile Processors /omap TI E2E Community Wireless Connectivity /wirelessconnectivityMailing Address:Texas Instruments,Post Office Box655303,Dallas,Texas75265Copyright©2012,Texas Instruments Incorporated。

SN74LVC1G373DBVR,SN74LVC1G373DBVR,SN74LVC1G373DBVR,SN74LVC1G373DCKR, 规格书,Datasheet 资料

SN74LVC1G373DBVR,SN74LVC1G373DBVR,SN74LVC1G373DBVR,SN74LVC1G373DCKR, 规格书,Datasheet 资料

DESCRIPTION/ORDERING INFORMATION
This single D-type latch is designed for 1.65-V to 5.5-V VCC operation.
The SN74LVC1G373 is particularly suitable for implementing buffer registers, I/O ports, bidirectional bus drivers, and working registers. While the latch-enable (LE) input is high, the Q outputs follow the data (D) inputs. When LE is taken low, the Q outputs are latched at the logic levels set up at the D inputs.
(2) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI website at .
– 1000-V Charged-Device Model (C101)
DCK PACKAGE (TOP VIEW)
YZP PACKAGE (BOTTOM VIEW)
LE
1
6 OE
D 34 Q
GND 2 5 VCC
GND
2
5
VCC
LE 1 6 OE
D
3
4Q
See mechanical drawings for dimensions.

TI 系列集中料号表

TI 系列集中料号表

最小包装 3000 3000 3000 3000 3000 3000 3000 3000 3000 3000 3000 3000 3000 3000 3000 3000 3000 3000 3000 2500 2500 3000 2500 3000 3000 3000 3000 2000 3000 3000 3000 3000
封装 SOT23 SOT-23-5 SC70-5 SOT23-5 SOT-23-5 SC-70-5 SOT-23-5 SOT353 SC705 SOT-23-5 SC-70-5 SOT23-5 SC705 SOT-23-5 SC70-5 SC-70-5 SC70-5 SOT-23-6 SC706 0MSOP 8-MSOP SOT-23-5 8-SOIC 10-SON SOT-23-6 20-WQFN 6SON 14-HTSSOP 16-WQFN 8-DSBGA 10SON 6SON
9DSBGA 9DSBGA 16DSBGA 16DSBGA 12DSBGA 16DSBGA 9DSBGA 9DSBGA 12DSBGA 8MSOP 16BGA 14TSSOP 16DSBGA 8BGA 8MSOP SC-70-5 SC70-6 8-SOIC 40-VFQFN 8-SOIC 6-SON 28 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32
料号(Q272261417) LMV321IDBVR LMV331IDBVR LMV331IDCKR SN74AHC1G04DBVR SN74AHC1G08DBVR SN74AHC1G08DCKR SN74LVC1G04DBVR SN74LVC1G04DCKR SN74LVC1G07DCKR SN74LVC1G08DBVR SN74LVC1G08DCKR SN74LVC1G125DBVR SN74LVC1G125DCKR SN74LVC1G14DBVR SN74LVC1G14DCKR SN74LVC1G32DCKR SN74LVC1G66DCKR SN74LVC2G04DBVR SN74LVC2G07DCKR TPS51100DGQR TPS2001CDGKR TPS2051BDBVR TPS2052BDR TPS61020DRCR TPS3106K33DBVR TPS51216RUKR TPS61160DRVR TPS54226PWPR TPS2543RTER TPS61060YZFR TPS61087DRCR TPS61165DRVR

SN74AUP1G07DBVR_中文资料

SN74AUP1G07DBVR_中文资料

SN74A-低功耗单通道缓冲器/驱动器,漏极开路输出
特性:
1. 低静态功耗(最大CC I =0.9μF )。

2. 低动态功耗(典型
3.3V pd C =1pF )。

3. 低输入电容(典型i C =1.5 pF )。

4. 低噪声——正负脉冲<CC V 的10%。

5. off I 支持局部掉电模式操作。

6. 输入滞后允许慢输入转换和更好的开关噪声抗扰性的输入电压
(mV V hys 250=在典型的3.3V 下)。

7. 宽工作电压范围8V~3.6V 。

3.3V 下工作最佳。

8. 3.3pd t ns =在3.3V 时最大。

9. 适合点对点的应用。

描述:
该AUP 系列是TI 公司低功耗要求的主要解决方案,主要在电池供电的便携式应用方面。

该系列可确保跨越0.8 V 至3.6 V 的整个工作电压保持非常低的静态和动态功耗,有助于电池寿命延长。

该产品还可以保持优异的信号完整性。

该器件使用的off I 局部断电应用充分说明,Ioff 电路禁止输出,当断电时通过该装置防止破坏性电流回流。

额定参数:
波形1是内部条件的输出,使得输出为低电平时,除非禁止输出的时候。

波形2是与内部条件的输出,使得输出为高,除非禁止输出的时候。

sn74cbtLV1G125DCKR

sn74cbtLV1G125DCKR

PACKAGING INFORMATION Orderable DeviceStatus (1)Package Type Package Drawing Pins Package Qty Eco Plan (2)Lead/Ball Finish MSL Peak Temp (3)74CBTLV1G125CRE4ACTIVE SC70DCK 53000Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM 74CBTLV1G125CRG4ACTIVE SC70DCK 53000Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM 74CBTLV1G125DBVRE4ACTIVE SOT-23DBV 53000Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74CBTLV1G125DBVRACTIVE SOT-23DBV 53000Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74CBTLV1G125DCKRACTIVE SC70DCK 53000Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM (1)The marketing status values are defined as follows:ACTIVE:Product device recommended for new designs.LIFEBUY:TI has announced that the device will be discontinued,and a lifetime-buy period is in effect.NRND:Not recommended for new designs.Device is in production to support existing customers,but TI does not recommend using this part in a new design.PREVIEW:Device has been announced but is not in production.Samples may or may not be available.OBSOLETE:TI has discontinued the production of the device.(2)Eco Plan -The planned eco-friendly classification:Pb-Free (RoHS)or Green (RoHS &no Sb/Br)-please check /productcontent for the latest availability information and additional product content details.TBD:The Pb-Free/Green conversion plan has not been defined.Pb-Free (RoHS):TI's terms "Lead-Free"or "Pb-Free"mean semiconductor products that are compatible with the current RoHS requirements for all 6substances,including the requirement that lead not exceed 0.1%by weight in homogeneous materials.Where designed to be soldered at high temperatures,TI Pb-Free products are suitable for use in specified lead-free processes.Green (RoHS &no Sb/Br):TI defines "Green"to mean Pb-Free (RoHS compatible),and free of Bromine (Br)and Antimony (Sb)based flame retardants (Br or Sb do not exceed 0.1%by weight in homogeneous material)(3)MSL,Peak Temp.--The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications,and peak solder temperature.Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided.TI bases its knowledge and belief on information provided by third parties,and makes no representation or warranty as to the accuracy of such information.Efforts are underway to better integrate information from third parties.TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.TI and TI suppliers consider certain information to be proprietary,and thus CAS numbers and other limited information may not be available for release.In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s)at issue in this document sold by TI to Customer on an annual basis.PACKAGE OPTION ADDENDUM 4-Oct-2005Addendum-Page 1IMPORTANT NOTICETexas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements, and other changes to its products and services at any time and to discontinue any product or service without notice. Customers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. All products are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment.TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s standard warranty. T esting and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where mandated by government requirements, testing of all parameters of each product is not necessarily performed.TI assumes no liability for applications assistance or customer product design. Customers are responsible for their products and applications using TI components. T o minimize the risks associated with customer products and applications, customers should provide adequate design and operating safeguards.TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right, copyright, mask work right, or other TI intellectual property right relating to any combination, machine, or process in which TI products or services are used. Information published by TI regarding third-party products or services does not constitute a license from TI to use such products or services or a warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the third party, or a license from TI under the patents or other intellectual property of TI.Reproduction of information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties, conditions, limitations, and notices. Reproduction of this information with alteration is an unfair and deceptive business practice. TI is not responsible or liable for such altered documentation.Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service voids all express and any implied warranties for the associated TI product or service and is an unfair and deceptive business practice. TI is not responsible or liable for any such statements. Following are URLs where you can obtain information on other Texas Instruments products and application solutions:Products ApplicationsAmplifiers Audio /audioData Converters Automotive /automotiveDSP Broadband /broadbandInterface Digital Control /digitalcontrolLogic Military /militaryPower Mgmt Optical Networking /opticalnetwork Microcontrollers Security /securityTelephony /telephonyVideo & Imaging /videoWireless /wirelessMailing Address:Texas InstrumentsPost Office Box 655303 Dallas, Texas 75265Copyright 2005, Texas Instruments Incorporated。

SN74CB3T3257中文资料

SN74CB3T3257中文资料

FUNCTION TABLE (EACH MULTIPLEXER/DEMULTIPLEXER)
INPUTS
OE
S
L
L
L
H
H
X
INPUT/OUTPUT A
B1 B2 Z
FUNCTION
A port = B1 port A port = B2 port
Disconnect
VCC
5.5 V VCC ≈VCC – 1 V
3
元器件交SN易74网 4-BIT 1-OF-2 FET MULTIPLEXER/DEMULTIPLEXER 2.5-V/3.3-V LOW-VOLTAGE BUS SWITCH WITH 5-V-TOLERANT LEVEL SHIFTER
• Bidirectional Data Flow With Near-Zero Propagation Delay
• Low ON-State Resistance (ron) Characteristics (ron = 5 Ω Typ)
• Low Input/Output Capacitance Minimizes Loading (Cio(OFF) = 5 pF Typ)
SCDS149 – OCTOBER 2003 – REVISED MARCH 2005
FEATURES
• Output Voltage Translation Tracks VCC • Supports Mixed-Mode Signal Operation on All
Data I/O Ports
15 OE
SIMPLIFIED SCHEMATIC, EACH FET SWITCH (SW)
A

SN74CB3T3257PWR,SN74CB3T3257DGVR,SN74CB3T3257PW,SN74CB3T3257PWRE4,规格书,Datasheet 资料

SN74CB3T3257PWR,SN74CB3T3257DGVR,SN74CB3T3257PW,SN74CB3T3257PWRE4,规格书,Datasheet 资料
• Control Inputs Can Be Driven by TTL or 5-V/3.3-V CMOS Outputs
• Ioff Supports Partial-Power-Down Mode Operation
• Latch-Up Performance Exceeds 250 mA Per JESD 17
TA –40°C to 85°C
TSSOP – PW TVSOP – DGV
ORDERING INFORMATION
PACKAGE (1)
ORDERABLE PART NUMBER
Tube
SN74CB3T3257PW
Tape and reel
SN74CB3T3257PWR
Tape and reel
SN74CB3T3257DGVR
PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters.
– 5-V/3.3-V Input Down to 2.5-V Output Level Shift With 2.5-V VCC
• 5-V-Tolerant I/Os With Device Powered Up or Powered Down
• Bidirectional Data Flow With Near-Zero Propagation Delay

SN74LVC1G125_08中文资料

SN74LVC1G125_08中文资料

Copyright © 1999–2007, Texas Instruments Incorporated
元器件交SN易74网 SINGLE BUS BUFFER GATE WITH 3-STATE OUTPUT
SCES223O – APRIL 1999 – REVISED FEBRUARY 2007
This bus buffer gate is designed for 1.65-V to 5.5-V VCC operation.
The SN74LVC1G125 is a single line driver with a 3-state output. The output is disabled when the output-enable (OE) input is high.
IIK
Input clamp current
VI < 0
IOK
Output clamp current
VO < 0
IO
Continuous output current
Continuous current through VCC or GND
DBV package
DCK package
θJA
Package thermal impedance(4)
To ensure the high-impedance state during power up or power down, OE should be tied to VCC through a pullup resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver.

SN74CBT3253中文资料

SN74CBT3253中文资料

元器件交易网IMPORTANT NOTICETexas Instruments and its subsidiaries (TI) reserve the right to make changes to their products or to discontinueany product or service without notice, and advise customers to obtain the latest version of relevant informationto verify, before placing orders, that information being relied on is current and complete. All products are soldsubject to the terms and conditions of sale supplied at the time of order acknowledgement, including thosepertaining to warranty, patent infringement, and limitation of liability.TI warrants performance of its semiconductor products to the specifications applicable at the time of sale inaccordance with TI’s standard warranty. Testing and other quality control techniques are utilized to the extentTI deems necessary to support this warranty. Specific testing of all parameters of each device is not necessarilyperformed, except those mandated by government requirements.CERTAIN APPLICATIONS USING SEMICONDUCTOR PRODUCTS MAY INVOLVE POTENTIAL RISKS OFDEATH, PERSONAL INJURY, OR SEVERE PROPERTY OR ENVIRONMENTAL DAMAGE (“CRITICALAPPLICATIONS”). TI SEMICONDUCTOR PRODUCTS ARE NOT DESIGNED, AUTHORIZED, ORWARRANTED TO BE SUITABLE FOR USE IN LIFE-SUPPORT DEVICES OR SYSTEMS OR OTHERCRITICAL APPLICATIONS. INCLUSION OF TI PRODUCTS IN SUCH APPLICATIONS IS UNDERSTOOD TOBE FULLY AT THE CUSTOMER’S RISK.In order to minimize risks associated with the customer’s applications, adequate design and operatingsafeguards must be provided by the customer to minimize inherent or procedural hazards.TI assumes no liability for applications assistance or customer product design. TI does not warrant or representthat any license, either express or implied, is granted under any patent right, copyright, mask work right, or otherintellectual property right of TI covering or relating to any combination, machine, or process in which suchsemiconductor products or services might be or are used. TI’s publication of information regarding any thirdparty’s products or services does not constitute TI’s approval, warranty or endorsement thereof.Copyright © 1998, Texas Instruments Incorporated。

74LVC1G125GW中文资料

74LVC1G125GW中文资料

4
Philips Semiconductors
Product specification
Bus buffer/line driver; 3-state
74LVC1G125
handbook, halfpage
A
Y
OE
MNA120
Fig.5 Logic diagram.
2004 Sep 15
5
Philips Semiconductors
INTEGRATED CIRCUITS
DATA SHEET
74LVC1G125 Bus buffer/line driver; 3-state
Product specification Supersedes data of 2002 Nov 18 2004 Sep 15
Philips Semiconductors
74LVC1G125
MAX. 5.5 5.5 VCC 5.5 5.5 +125 20 10 V V V V V
UNIT
°C ns/V ns/V
LIMITING VALUES In accordance with the Absolute Maximum Rating System (IEC 60134); voltages are referenced to GND (ground = 0 V). SYMBOL VCC IIK VI IOK VO PARAMETER supply voltage input diode current input voltage output diode current output voltage VI < 0 V note 1 VO > VCC or VO < 0 V enable mode; notes 1 and 2 disable mode; notes 1 and 2 IO ICC, IGND Tstg Ptot Notes 1. The input and output voltage ratings may be exceeded if the input and output current ratings are observed. 2. When VCC = 0 V (Power-down mode), the output voltage can be 5.5 V in normal operation. output source or sink current VCC or GND current storage temperature power dissipation Tamb = −40 °C to +125 °C VO = 0 V to VCC CONDITIONS − −0.5 − −0.5 −0.5 − − −65 − MIN. −0.5 MAX. +6.5 −50 +6.5 ±50 +6.5 +6.5 ±50 ±100 +150 250 V mA V mA V V mA mA °C mW UNIT

SN74LVC3G04DCTR中文资料

SN74LVC3G04DCTR中文资料

Copyright 2003, Texas Instruments Incorporated
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
1
元器件交易网
SN74LVC3G04 TRIPLE INVERTER GATE
description/ordering information (continued)
† Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at /sc/package. ‡ DCT: The actual top-side marking has three additional characters that designate the year, month, and assembly/test site. DCU: The actual top-side marking has one additional character that designates the assembly/test site. YEA/YZA, YEP/YZP: The actual top-side marking has three preceding characters to denote year, month, and sequence code, and one following character to designate the assembly/test site. Pin 1 identifier indicates solder-bump composition (1 = SnPb, • = Pb-free).

SN74LVC1G125DBVR中文资料

SN74LVC1G125DBVR中文资料
• Latch-Up Performance Exceeds 100 mA Per JESD 78, Class II
• ESD Protection Exceeds JESD 22 – 2000-V Human-Body Model (A114-A)
– 200-V Machine Model (A115-A)
Reel of 3000 SN74LVC1G125YZPR
_ _ _ CM
SON – DRY
Reel of 5000 SN74LVC1G125DRYR
CM_
–40°C to 85°C SOT (SOT-23) – DBV
Reel of 3000 Reel of 250
SN74LVC1G125DBVR SN74LVC1G125DBVT
(2) DBV/DCK/DRL/DRY: The actual top-side marking has one additional character that designates the assembly/test site. YZP: The actual top-side marking has three preceding characters to denote year, month, and sequence code, and one following character to designate the assembly/test site. Pin 1 identifier indicates solder-bump composition (1 = SnPb, • = Pb-free).
Copyright © 1999–2007, Texas Instruments Incorporated

SN74CBT3345中文资料

SN74CBT3345中文资料

元器件交易网IMPORTANT NOTICETexas Instruments and its subsidiaries (TI) reserve the right to make changes to their products or to discontinueany product or service without notice, and advise customers to obtain the latest version of relevant informationto verify, before placing orders, that information being relied on is current and complete. All products are soldsubject to the terms and conditions of sale supplied at the time of order acknowledgement, including thosepertaining to warranty, patent infringement, and limitation of liability.TI warrants performance of its semiconductor products to the specifications applicable at the time of sale inaccordance with TI’s standard warranty. Testing and other quality control techniques are utilized to the extentTI deems necessary to support this warranty. Specific testing of all parameters of each device is not necessarilyperformed, except those mandated by government requirements.CERTAIN APPLICATIONS USING SEMICONDUCTOR PRODUCTS MAY INVOLVE POTENTIAL RISKS OFDEATH, PERSONAL INJURY, OR SEVERE PROPERTY OR ENVIRONMENTAL DAMAGE (“CRITICALAPPLICATIONS”). TI SEMICONDUCTOR PRODUCTS ARE NOT DESIGNED, AUTHORIZED, ORWARRANTED TO BE SUITABLE FOR USE IN LIFE-SUPPORT DEVICES OR SYSTEMS OR OTHERCRITICAL APPLICATIONS. INCLUSION OF TI PRODUCTS IN SUCH APPLICATIONS IS UNDERSTOOD TOBE FULLY AT THE CUSTOMER’S RISK.In order to minimize risks associated with the customer’s applications, adequate design and operatingsafeguards must be provided by the customer to minimize inherent or procedural hazards.TI assumes no liability for applications assistance or customer product design. TI does not warrant or representthat any license, either express or implied, is granted under any patent right, copyright, mask work right, or otherintellectual property right of TI covering or relating to any combination, machine, or process in which suchsemiconductor products or services might be or are used. TI’s publication of information regarding any thirdparty’s products or services does not constitute TI’s approval, warranty or endorsement thereof.Copyright © 1998, Texas Instruments Incorporated。

模拟开关型号大全

模拟开关型号大全

模拟开关型号大全z开关及驱动器件制造商 产品类别 产品型号 产品描述TI公司 模拟开关CD4066BM 四双边开关CD74HC123M 高速CMOS双路可再触发单稳多谐振荡器CD74HC4051E 高速CMOS模拟多路开关CD74HC4051M 高速CMOS模拟多路开关CD74HC4052M 高速CMOS模拟多路开关CD74HC4053M 高速CMOS模拟多路开关CD74HC4053PW 高速CMOS模拟多路开关CD74HC4066PW 模拟开关CD74HCT4052M96 高速CMOS模拟多路开关SN74ALS35AN 六同相器(集电极开路输出)SN74AUC1G66DBVR 单模拟开关SN74HC4066D 四路双向模拟开关SN74HC4066DBR 四路双向模拟开关SN74HC4066DR 四路双向模拟开关SN74LV4066AD 四路双向模拟开关SN74LV4066ADR 四路双向模拟开关SN74LVC1G66DBVR 单模拟开关SN74LVC1G66DCKR 单模拟开关SN74LVC1G66DCKT 单模拟开关SN74LVC2G66DCTR 双模拟开关SN74LVC2G66DCUR 双模拟开关SN74LVC2G66DCUT 双模拟开关ON公司 模拟开关MC14051BDR2 模拟开关多路器MC74VHC1G66DTT1 单模拟开关MC74VHC1GT66DTT1 单模拟开关NL7WB66US 双单刀单掷模拟开关NLAS1053US 单单刀双掷模拟开关NLAS2066US 双单刀单掷模拟开关及过压容许NLAS323US 双单刀单掷模拟开关及单电源供电 NLAS324US 双单刀单掷模拟开关 NLAS325US 双单刀单掷模拟开关 NLAS44599DT 双双刀双掷模拟开关NLAS44599DTR2 低电压,单电源,双路DPDT 模拟开关 NLAS4501DTT1 单模拟开关 NLAS4599DFT2 单单刀双掷模拟开关 NLAS4599DTT1 单模拟开关 NLAS4684FCT1 双单刀双掷模拟开关 NLAS4685FCT1 双单刀双掷模拟开关 NLASB3157DFT2 单单刀双掷模拟开关NLAST44599DT 低电压,单电源,双路DPDT 模拟开关 NLAST44599DTR2 双模拟开关 NLAST4501DTT1 单模拟开关 NLAST4599DTT1单模拟开关ADG211AKN替换DG211,宽工作温度范围 ADG333ABN 与MAX333A 兼容模拟开关 ADG431BN逻辑1=ON,与MAX326兼容 ADI 公司模拟交叉点开关DG441DY4路, TTL 输入SPST 模拟开关(NClosed) DG442DJ 4路, TTL 输入SPST 模拟开关(NOpen) DG442DY 模拟开关, SPST, Quad, NOpen, TTL 输入ISL43110IB 低压,单电源SPST 高性能模拟开关(NOpen)ISL43111IB 低压,单电源SPST 高性能模拟开关(NClosed)ISL43112IB 低压,双电源SPST 高性能模拟开关NOpenISL43113IB 低压,双电源SPST 高性能模拟开关(NClose)ISL43140IB 低压,单电源和双电源4路SPST 高性能模拟开关(NClose)ISL43143IR 低压,单电源和双电源4路SPST 高性能模拟开关(NClose)INTERSIL 公司模拟开关 ISL43144IR低压,单电源和双电源4路SPST 高性能模拟开关(NOpen)ISL43410IR 低压,单电源DPDT高性能模拟开关z视频矩阵开关制造商 产品类别 产品型号 产品描述ADI公司 矩阵开关 AD8182AN 带宽800MHz视频多路转换器z总线开关制造商 产品类别 产品型号 产品描述SN74CB3T3125PW 四总线开关TI公司 总线开关SN74CB3T3245PW 8位FET2.5-V/3.3-V 低电压总线开关SN74CBT16210CDL 20位FET开关总线-2V脉冲保护器SN74CBT16210CDLR 20位FET开关总线-2V脉冲保护器SN74CBT16210DGGR 20位FET开关总线-2V脉冲保护器SN74CBT3125D 四总线开关SN74CBT3244DBR 八总线开关SN74CBT3244DW 八总线开关SN74CBT3245ADW 八总线开关SN74CBTD16211DGVR 24位总线开关SN74CBTD16211DL 24位总线开关SN74CBTD3306D 双总线开关(带电平转换)SN74CBTD3306PW 双总线开关(带电平转换)SN74CBTD3306PWR 双总线开关(带电平转换)SN74CBTD3384DBR 10位总线开关(带电平转换)SN74CBTD3861DBR 10位总线开关(带电平转换)SN74CBTD3861PW 10位总线开关(带电平转换)SN74CBTD3861PWR 10位总线开关(带电平转换)SN74CBTLV3125D 四总线开关SN74CBTLV3245ADW 八总线开关SN74CBTS3306D 双总线开关z 固态开关 制造商 产品类别 产品型号 产品描述 ACS102-5T1 ACS102-5TA ACS108-5SA ACS108-5SN ACS110-7SB2 ACS110-7SN ACS120-7SB ACS120-7ST ACS302-5T3 ACS402-5SB4 ACST4-7SB ACST4-7SFP ACST6-7SG ACST6-7ST ST 公司固态开关ACST8-8CFPz 带保护的电子开关 制造商 产品类别 产品型号 产品描述TPS2010AD 0.4A,2.7~5.5V 单高端MOSFET 开关集成电路,低电平使能TPS2010D 0.4A,2.7~5.5V 单高端MOSFET 开关集成电路,低电平使能TI 公司电流限制开关TPS2062D1A,2.7~5.5V 单高端MOSFET 开关集成电路,低电平使能z 干簧管 制造商 产品类别 产品型号 ORD228 通用微型 干簧管 ORD9216通用微型z 模拟多路器 制造商 产品类别 产品型号 产品描述 DG408DJ DG408DY DG409DJ ISL43640IR ISL43681IR INTERSIL 公司模拟多路器ISL43741IRADI 公司 多路复用器z 带状态报告的开关 制造商 产品类别 产品型号 产品描述 MC33143DW 双高端开关 MC33286DW 双高端开关MC33288ADH 大电流白炽灯固态继电器 MC33288BDH 大电流白炽灯固态继电器 MC33288CDH 大电流白炽灯固态继电器 MC33288DH 大电流白炽灯固态继电器 MC33289DW 电感负载的双高端开关 MC33486ADH H 桥负载的双高端开关MC33982PNA 带诊断和保护的自保护2mOhm 开关 高端开关MC33984PNA双高端开关MC33291DW 带SPI 接口的1.2欧RDS(on)8输出开关MC33291LDW 带SPI 接口的1.6欧RDS(on)8输出开关MC33298DW 带SPI I/O 控制的0.8欧RDS(on)8输出开关MC33298P 带SPI I/O 控制的0.8欧RDS(on)8输出开关MC33385DH 0.25欧RDS(on)4小灌电流驱动器 MC33397DW 带SPI 和并口输入控制的0.9欧RDS(on)2或6输出开关MC33880DW 1欧RDS(on)可设置8SPI 控制开关 MC33880DWB 1欧RDS(on)可设置8SPI 控制开关 FREESCALE 公司低端开关MC33882DH带SPI 和并口输入控制的0.8欧RDS(on)6输出开关z 带监测的开关 制造商 产品类别 产品型号 产品描述 H 桥和可配置开关 H 桥步进马达MC33287DW 接触监测及双低端保护驱动器 MC33884DW开关监测接口 MC33972DWB 开关监测接口FREESCALE 公司带监测的开关MC33993DWB 22输入多开关监测接口。

SN74CBTLV3257中文资料

SN74CBTLV3257中文资料

元器件交易网IMPORTANT NOTICETexas Instruments and its subsidiaries (TI) reserve the right to make changes to their products or to discontinueany product or service without notice, and advise customers to obtain the latest version of relevant informationto verify, before placing orders, that information being relied on is current and complete. All products are soldsubject to the terms and conditions of sale supplied at the time of order acknowledgement, including thosepertaining to warranty, patent infringement, and limitation of liability.TI warrants performance of its semiconductor products to the specifications applicable at the time of sale inaccordance with TI’s standard warranty. Testing and other quality control techniques are utilized to the extentTI deems necessary to support this warranty. Specific testing of all parameters of each device is not necessarilyperformed, except those mandated by government requirements.CERTAIN APPLICATIONS USING SEMICONDUCTOR PRODUCTS MAY INVOLVE POTENTIAL RISKS OFDEATH, PERSONAL INJURY, OR SEVERE PROPERTY OR ENVIRONMENTAL DAMAGE (“CRITICALAPPLICATIONS”). TI SEMICONDUCTOR PRODUCTS ARE NOT DESIGNED, AUTHORIZED, ORWARRANTED TO BE SUITABLE FOR USE IN LIFE-SUPPORT DEVICES OR SYSTEMS OR OTHERCRITICAL APPLICATIONS. INCLUSION OF TI PRODUCTS IN SUCH APPLICATIONS IS UNDERSTOOD TOBE FULLY AT THE CUSTOMER’S RISK.In order to minimize risks associated with the customer’s applications, adequate design and operatingsafeguards must be provided by the customer to minimize inherent or procedural hazards.TI assumes no liability for applications assistance or customer product design. TI does not warrant or representthat any license, either express or implied, is granted under any patent right, copyright, mask work right, or otherintellectual property right of TI covering or relating to any combination, machine, or process in which suchsemiconductor products or services might be or are used. TI’s publication of information regarding any thirdparty’s products or services does not constitute TI’s approval, warranty or endorsement thereof.Copyright © 1999, Texas Instruments Incorporated。

SN74CBTS6800资料

SN74CBTS6800资料

元器件交易网IMPORTANT NOTICETexas Instruments and its subsidiaries (TI) reserve the right to make changes to their products or to discontinueany product or service without notice, and advise customers to obtain the latest version of relevant informationto verify, before placing orders, that information being relied on is current and complete. All products are soldsubject to the terms and conditions of sale supplied at the time of order acknowledgement, including thosepertaining to warranty, patent infringement, and limitation of liability.TI warrants performance of its semiconductor products to the specifications applicable at the time of sale inaccordance with TI’s standard warranty. Testing and other quality control techniques are utilized to the extentTI deems necessary to support this warranty. Specific testing of all parameters of each device is not necessarilyperformed, except those mandated by government requirements.CERTAIN APPLICATIONS USING SEMICONDUCTOR PRODUCTS MAY INVOLVE POTENTIAL RISKS OFDEATH, PERSONAL INJURY, OR SEVERE PROPERTY OR ENVIRONMENTAL DAMAGE (“CRITICALAPPLICATIONS”). TI SEMICONDUCTOR PRODUCTS ARE NOT DESIGNED, AUTHORIZED, ORWARRANTED TO BE SUITABLE FOR USE IN LIFE-SUPPORT DEVICES OR SYSTEMS OR OTHERCRITICAL APPLICATIONS. INCLUSION OF TI PRODUCTS IN SUCH APPLICATIONS IS UNDERSTOOD TOBE FULLY AT THE CUSTOMER’S RISK.In order to minimize risks associated with the customer’s applications, adequate design and operatingsafeguards must be provided by the customer to minimize inherent or procedural hazards.TI assumes no liability for applications assistance or customer product design. TI does not warrant or representthat any license, either express or implied, is granted under any patent right, copyright, mask work right, or otherintellectual property right of TI covering or relating to any combination, machine, or process in which suchsemiconductor products or services might be or are used. TI’s publication of information regarding any thirdparty’s products or services does not constitute TI’s approval, warranty or endorsement thereof.Copyright © 1999, Texas Instruments Incorporated。

SN74LVC1T45DRLRG4中文资料

SN74LVC1T45DRLRG4中文资料

FEATURESV CCA V CCBBGNDADBV PACKAGE(TOP VIEW)DCK PACKAGE(TOP VIEW)V CCA V CCBBAV CCBDRL PACKAGE(TOP VIEW)See mechanical drawings for dimensions.DIRDIRYZP PACKAGE(BOTTOM VIEW)V CCAAV CCBBGND DIR DESCRIPTION/ORDERING INFORMATIONWITH CONFIGURABLE VOLTAGE TRANSLATION AND3-STATE OUTPUTSSCES515H–DECEMBER2003–REVISED JANUARY2007•Available in the Texas Instruments•Max Data RatesNanoFree™Package–420Mbps(3.3-V to5-V Translation)•Fully Configurable Dual-Rail Design Allows–210Mbps(Translate to3.3V) Each Port to Operate Over the Full1.65-V to–140Mbps(Translate to2.5V)5.5-V Power-Supply Range–75Mbps(Translate to1.8V)•V CC Isolation Feature–If Either V CC Input Is at•Latch-Up Performance Exceeds100mA Per GND,Both Ports Are in the High-ImpedanceJESD78,Class IIState•ESD Protection Exceeds JESD22•DIR Input Circuit Referenced to V CCA–2000-V Human-Body Model(A114-A)•Low Power Consumption,4-µA Max I CC–200-V Machine Model(A115-A)•±24-mA Output Drive at3.3V–1000-V Charged-Device Model(C101)•I off Supports Partial-Power-Down ModeOperationThis single-bit noninverting bus transceiver uses two separate configurable power-supply rails.The A port is designed to track V CCA.V CCA accepts any supply voltage from1.65V to5.5V.The B port is designed to track V CCB.V CCB accepts any supply voltage from1.65V to5.5V.This allows for universal low-voltage bidirectional translation between any of the1.8-V,2.5-V,3.3-V,and5-V voltage nodes.ORDERING INFORMATIONT A PACKAGE(1)ORDERABLE PART NUMBER TOP-SIDE MARKING(2)NanoFree™–WCSP(DSBGA)Reel of3000SN74LVC1T45YZPR___TA_0.23-mm Large Bump–YZP(Pb-free)Reel of3000SN74LVC1T45DBVRSOT(SOT-23)–DBV CT1_Reel of250SN74LVC1T45DBVT–40°C to85°CReel of3000SN74LVC1T45DCKRSOT(SC-70)–DCKReel of250SN74LVC1T45DCKT TA_SOT(SOT-533)–DRL Reel of4000SN74LVC1T45DRLR(1)Package drawings,standard packing quantities,thermal data,symbolization,and PCB design guidelines are available at/sc/package.(2)DBV/DCK/DRL:The actual top-side marking has one additional character that designates the assembly/test site.YZP:The actual top-side marking has three preceding characters to denote year,month,and sequence code,and one following character to designate the assembly/test site.Pin1identifier indicates solder-bump composition(1=SnPb,•=Pb-free).Please be aware that an important notice concerning availability,standard warranty,and use in critical applications of TexasInstruments semiconductor products and disclaimers thereto appears at the end of this data sheet.NanoFree is a trademark of Texas Instruments.PRODUCTION DATA information is current as of publication date.Copyright©2003–2007,Texas Instruments Incorporated Products conform to specifications per the terms of the TexasInstruments standard warranty.Production processing does notnecessarily include testing of all parameters.DESCRIPTION/ORDERING INFORMATION (CONTINUED)BDIRAV CCA V CCBWITH CONFIGURABLE VOLTAGE TRANSLATION AND 3-STATE OUTPUTSSCES515H–DECEMBER 2003–REVISED JANUARY 2007The SN74LVC1T45is designed for asynchronous communication between two data buses.The logic levels of the direction-control (DIR)input activate either the B-port outputs or the A-port outputs.The device transmits data from the A bus to the B bus when the B-port outputs are activated and from the B bus to the A bus when the A-port outputs are activated.The input circuitry on both A and B ports always is active and must have a logic HIGH or LOW level applied to prevent excess I CC and I CCZ .The SN74LVC1T45is designed so that the DIR input is powered by V CCA .This device is fully specified for partial-power-down applications using I off .The I off circuitry disables the outputs,preventing damaging current backflow through the device when it is powered down.The V CC isolation feature ensures that if either V CC input is at GND,then both ports are in the high-impedance state.NanoFree™package technology is a major breakthrough in IC packaging concepts,using the die as the package.FUNCTION TABLE (1)INPUT OPERATION DIR L B data to A bus HA data toB bus(1)Input circuits of the data I/Os always are active.LOGIC DIAGRAM (POSITIVE LOGIC)2Submit Documentation FeedbackAbsolute Maximum Ratings (1)WITH CONFIGURABLE VOLTAGE TRANSLATION AND 3-STATE OUTPUTSSCES515H–DECEMBER 2003–REVISED JANUARY 2007over operating free-air temperature range (unless otherwise noted)MINMAX UNIT V CCA Supply voltage range –0.5 6.5V V CCB V I Input voltage range (2)–0.5 6.5V V O Voltage range applied to any output in the high-impedance or power-off state (2)–0.5 6.5V A port –0.5V CCA +0.5V O Voltage range applied to any output in the high or low state (2)(3)V B port –0.5V CCB +0.5I IK Input clamp current V I <0–50mA I OK Output clamp current V O <0–50mA I OContinuous output current±50mA Continuous current through V CC or GND±100mADBV package165DCK package 259θJAPackage thermal impedance (4)°C/W DRL package 142YZP package123T stg Storage temperature range–65150°C (1)Stresses beyond those listed under "absolute maximum ratings"may cause permanent damage to the device.These are stress ratings only,and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating conditions"is not implied.Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.(2)The input and output negative-voltage ratings may be exceeded if the input and output clamp-current ratings are observed.(3)The value of V CC is provided in the recommended operating conditions table.(4)The package thermal impedance is calculated in accordance with JESD 51-7.3Submit Documentation FeedbackRecommended Operating Conditions (1)(2)(3)WITH CONFIGURABLE VOLTAGE TRANSLATION AND 3-STATE OUTPUTSSCES515H–DECEMBER 2003–REVISED JANUARY 2007V CCIV CCOMIN MAX UNIT V CCA 1.65 5.5Supply voltageVV CCB1.655.51.65V to 1.95VV CCI ×0.652.3V to 2.7V 1.7High-level V IHData inputs (4)Vinput voltage3V to 3.6V 24.5V to5.5V V CCI ×0.71.65V to 1.95VV CCI ×0.352.3V to 2.7V 0.7Low-level V ILData inputs (4)V input voltage3V to 3.6V 0.84.5V to5.5V V CCI ×0.31.65V to 1.95VV CCA ×0.652.3V to 2.7V 1.7High-level DIRV IHVinput voltage(referenced to V CCA )(5)3V to 3.6V 24.5V to5.5V V CCA ×0.71.65V to 1.95VV CCA ×0.352.3V to 2.7V 0.7Low-level DIRV ILV input voltage (referenced to V CCA )(5)3V to 3.6V 0.84.5V to5.5VV CCA ×0.3V I Input voltage 0 5.5V V OOutput voltageV CCOV 1.65V to 1.95V–42.3V to 2.7V –8I OHHigh-level output currentmA 3V to 3.6V –244.5V to 5.5V –321.65V to 1.95V42.3V to 2.7V 8I OLLow-level output currentmA 3V to 3.6V 244.5V to 5.5V321.65V to 1.95V202.3V to 2.7V 20Data inputsInput transition ∆t/∆v3V to 3.6V 10ns/V rise or fall rate4.5V to5.5V5Control inputs1.65V to 5.5V5T A Operating free-air temperature–4085°C (1)V CCI is the V CC associated with the input port.(2)V CCO is the V CC associated with the output port.(3)All unused data inputs of the device must be held at V CCI or GND to ensure proper device operation.Refer to the TI application report,Implications of Slow or Floating CMOS Inputs ,literature number SCBA004.(4)For V CCI values not specified in the data sheet,V IH min =V CCI ×0.7V,V IL max =V CCI ×0.3V.(5)For V CCI values not specified in the data sheet,V IH min =V CCA ×0.7V,V IL max =V CCA ×0.3V.4Submit Documentation FeedbackElectrical Characteristics (1)(2)WITH CONFIGURABLE VOLTAGE TRANSLATION AND 3-STATE OUTPUTSSCES515H–DECEMBER 2003–REVISED JANUARY 2007over recommended operating free-air temperature range (unless otherwise noted)T A =25°C –40°C to 85°C PARAMETERTEST CONDITIONS V CCA V CCB UNITMINTYPMAXMIN MAXV CCO I OH =–100µA1.65V to 4.5V1.65V to 4.5V–0.1I OH =–4mA 1.65V 1.65V 1.2V OHV I =V IHVI OH =–8mA 2.3V 2.3V 1.9I OH =–24mA 3V 3V 2.4I OH =–32mA 4.5V 4.5V 3.8I OL =100µA 1.65V to 4.5V1.65V to 4.5V0.1I OL =4mA1.65V 1.65V 0.45V OLI OL =8mA V I =V IL 2.3V 2.3V 0.3V I OL =24mA 3V 3V 0.55I OL =32mA4.5V 4.5V 0.55I I DIR V I =V CCA or GND 1.65V to5.5V1.65V to 5.5V ±1±2µA A port 0V 0to 5.5V ±1±2I off V I or V O =0to 5.5V µA B port 0to 5.5V 0V ±1±2A or B I OZV O =V CCO or GND1.65V to 5.5V 1.65V to 5.5V ±1±2µA port1.65V to 5.5V1.65V to 5.5V3I CCAV I =V CCI or GND,I O =05.5V 0V 2µA 0V 5.5V -21.65V to 5.5V1.65V to 5.5V3I CCBV I =V CCI or GND,I O =05.5V 0V -2µA 0V5.5V 2I CCA +I CCB V I =V CCI or GND,I O =0 1.65V to 5.5V1.65V to 5.5V4µA (see Table 1)A port at V CCA –0.6V,A port50DIR at V CCA ,B port =open ∆I CCA3V to 5.5V3V to 5.5VµA DIR at V CCA –0.6V,DIRB port =open,50A port at V CCA or GNDB port at V CCB –0.6V,∆I CCB B port DIR at GND,3V to 5.5V 3V to 5.5V 50µA A port =openC i DIR V I =V CCA or GND 3.3V 3.3V 2.5pF A or B C io V O =V CCA/B or GND3.3V3.3V6pFport(1)V CCO is the V CC associated with the output port.(2)V CCI is the V CC associated with the input port.5Submit Documentation FeedbackSwitching CharacteristicsSwitching CharacteristicsWITH CONFIGURABLE VOLTAGE TRANSLATION AND 3-STATE OUTPUTSSCES515H–DECEMBER 2003–REVISED JANUARY 2007over recommended operating free-air temperature range,V CCA =1.8V ±0.15V (see Figure 1)V CCB =1.8V V CCB =2.5V V CCB =3.3V V CCB =5V FROM TO ±0.15V ±0.2V ±0.3V ±0.5V PARAMETERUNIT(INPUT)(OUTPUT)MIN MAX MIN MAX MIN MAX MIN MAX t PLH 317.7 2.210.3 1.78.3 1.47.2A B ns t PHL 2.814.3 2.28.5 1.87.1 1.77t PLH 317.7 2.316 2.115.5 1.915.1B A ns t PHL 2.814.3 2.112.9212.6 1.812.2t PHZ 5.219.4 4.818.5 4.718.4 5.117.1DIR A ns t PLZ 2.310.5 2.110.5 2.410.7 3.110.9t PHZ 7.421.9 4.911.5 4.610.3 2.88.2DIR B ns t PLZ 4.216 3.79.2 3.38.4 2.46.4t PZH (1)33.725.223.921.5DIR A ns t PZL (1)36.224.422.920.4t PZH (1)28.220.81918.1DIRBns t PZL (1)33.72725.524.1(1)The enable time is a calculated value,derived using the formula shown in the enable times section.over recommended operating free-air temperature range,V CCA =2.5V ±0.2V (see Figure 1)V CCB =1.8V V CCB =2.5V V CCB =3.3V V CCB =5V FROM TO ±0.15V ±0.2V ±0.3V ±0.5V PARAMETERUNIT(INPUT)(OUTPUT)MIN MAX MIN MAX MIN MAX MIN MAX t PLH 2.316 1.58.5 1.3 6.4 1.1 5.1A B ns t PHL 2.112.9 1.47.5 1.3 5.40.9 4.6t PLH 2.210.3 1.58.5 1.4817.5B A ns t PHL 2.28.5 1.47.5 1.370.9 6.2t PHZ 38.1 3.18.1 2.88.1 3.28.1DIR A ns t PLZ 1.3 5.9 1.3 5.9 1.3 5.91 5.8t PHZ 6.523.7 4.111.4 3.910.2 2.47.1DIR B ns t PLZ 3.918.9 3.29.6 2.88.4 1.85.3t PZH (1)29.218.116.412.8DIR A ns t PZL (1)32.218.917.213.3t PZH (1)21.914.412.310.9DIRBns t PZL (1)2115.613.512.7(1)The enable time is a calculated value,derived using the formula shown in the enable times section.6Submit Documentation FeedbackSwitching CharacteristicsSwitching CharacteristicsOperating CharacteristicsWITH CONFIGURABLE VOLTAGE TRANSLATION AND 3-STATE OUTPUTSSCES515H–DECEMBER 2003–REVISED JANUARY 2007over recommended operating free-air temperature range,V CCA =3.3V ±0.3V (see Figure 1)V CCB =1.8V V CCB =2.5V V CCB =3.3V V CCB =5V FROM TO ±0.15V ±0.2V ±0.3V ±0.5V PARAMETERUNIT(INPUT)(OUTPUT)MIN MAX MIN MAXMIN MAX MIN MAX t PLH 2.115.5 1.480.7 5.80.7 4.4A B ns t PHL 212.6 1.370.850.74t PLH 1.78.3 1.3 6.40.7 5.80.6 5.4B A ns t PHL 1.87.1 1.3 5.40.850.7 4.5t PHZ 2.97.337.3 2.87.3 3.47.3DIR A ns t PLZ 1.8 5.6 1.6 5.6 2.2 5.7 2.2 5.7t PHZ 5.420.5 3.910.1 2.98.8 2.4 6.8DIR B ns t PLZ 3.314.5 2.97.8 2.47.1 1.74.9t PZH (1)22.814.212.910.3DIR A ns t PZL (1)27.615.513.811.3t PZH (1)21.113.611.510.1DIRBns t PZL (1)19.914.312.311.3(1)The enable time is a calculated value,derived using the formula shown in the enable times section.over recommended operating free-air temperature range,V CCA =5V ±0.5V (see Figure 1)V CCB =1.8V V CCB =2.5V V CCB =3.3V V CCB =5V FROM TO ±0.15V ±0.2V ±0.3V ±0.5V PARAMETERUNIT(INPUT)(OUTPUT)MIN MAX MIN MAX MIN MAX MIN MAX t PLH 1.915.117.50.6 5.40.5 3.9A B ns t PHL 1.812.20.9 6.20.7 4.50.5 3.5t PLH 1.47.21 5.10.7 4.40.5 3.9B A ns t PHL 1.770.9 4.60.740.5 3.5t PHZ 2.1 5.4 2.2 5.4 2.2 5.5 2.2 5.4DIR A ns t PLZ 0.9 3.81 3.81 3.70.9 3.7t PHZ 4.820.2 2.59.818.5 2.5 6.5DIR B ns t PLZ 4.214.8 2.57.4 2.57 1.64.5t PZH (1)2212.511.48.4DIR A ns t PZL (1)27.214.412.510t PZH (1)18.911.39.17.6DIRBns t PZL (1)17.611.6108.6(1)The enable time is a calculated value,derived using the formula shown in the enable times section.T A =25°CV CCA =V CCA =V CCA =V CCA =TEST V CCB =1.8VV CCB =2.5VV CCB =3.3VV CCB =5VPARAMETERUNITCONDITIONS TYP TYP TYP TYP A-port input,B-port output C L =0pF,3444C pdA(1)f =10MHz,pF B-port input,A-port output 18192021t r =t f =1ns A-port input,B-port output C L =0pF,18192021C pdB (1)f =10MHz,pF B-port input,A-port output3444t r =t f =1ns(1)Power dissipation capacitance per transceiver7Submit Documentation FeedbackPower-Up ConsiderationsWITH CONFIGURABLE VOLTAGE TRANSLATION AND 3-STATE OUTPUTSSCES515H–DECEMBER 2003–REVISED JANUARY 2007A proper power-up sequence always should be followed to avoid excessive supply current,bus contention,oscillations,or other anomalies.To guard against such power-up problems,take the following precautions:1.Connect ground before any supply voltage is applied.2.Power up V CCA .3.V CCB can be ramped up along with or after V CCA .Table 1.Typical Total Static Power Consumption (I CCA +I CCB )V CCAV CCB UNIT0V 1.8V 2.5V 3.3V 5V 0V 0<1<1<1<11.8V <1<2<2<222.5V <1<2<2<2<2µA 3.3V <1<2<2<2<25V<12<2<2<28Submit Documentation FeedbackTYPICAL CHARACTERISTICSt P H L − n sC L − pF105101520253035t P L H− n s C L − pF5101520253035t P H L− n sC L − pF5101520253035t P L H − n sC L − pFWITH CONFIGURABLE VOLTAGE TRANSLATION AND 3-STATE OUTPUTSSCES515H–DECEMBER 2003–REVISED JANUARY 2007TYPICAL PROPAGATION DELAY (A to B)vs LOAD CAPACITANCET A =25°C,V CCA =1.8VTYPICAL PROPAGATION DELAY (B to A)vs LOAD CAPACITANCET A =25°C,V CCA =1.8V9Submit Documentation Feedback5101520253035t P H L − n sC L − pF5t P L H − n sC L − pFt P H L− n s C L − pF12345678910t P L H − n sC L − pFWITH CONFIGURABLE VOLTAGE TRANSLATION AND 3-STATE OUTPUTSSCES515H–DECEMBER 2003–REVISED JANUARY 2007TYPICAL CHARACTERISTICS (continued)TYPICAL PROPAGATION DELAY (A to B)vs LOAD CAPACITANCET A =25°C,V CCA =2.5VTYPICAL PROPAGATION DELAY (B to A)vs LOAD CAPACITANCET A =25°C,V CCA =2.5V10Submit Documentation Feedbackt P H L − n sC L − pFt P L H − n sC L − pFt P H L− n s C L − pFt P L H − n s C L − pFSN74LVC1T45SINGLE-BIT DUAL-SUPPLY BUS TRANSCEIVERWITH CONFIGURABLE VOLTAGE TRANSLATION AND 3-STATE OUTPUTSSCES515H–DECEMBER 2003–REVISED JANUARY 2007TYPICAL CHARACTERISTICS (continued)TYPICAL PROPAGATION DELAY (A to B)vs LOAD CAPACITANCET A =25°C,V CCA =3.3VTYPICAL PROPAGATION DELAY (B to A)vs LOAD CAPACITANCET A =25°C,V CCA =3.3Vt P H L− n s C L − pFt P L H − n s C L − pFt P H L − n sC L − pFt P L H − n sC L − pFSN74LVC1T45SINGLE-BIT DUAL-SUPPLY BUS TRANSCEIVERWITH CONFIGURABLE VOLTAGE TRANSLATION AND 3-STATE OUTPUTSSCES515H–DECEMBER 2003–REVISED JANUARY 2007TYPICAL CHARACTERISTICS (continued)TYPICAL PROPAGATION DELAY (A to B)vs LOAD CAPACITANCET A =25°C,V CCA =5VTYPICAL PROPAGATION DELAY (B to A)vs LOAD CAPACITANCET A =25°C,V CCA =5VPARAMETER MEASUREMENT INFORMATIONV OH V OLLOAD CIRCUIT × V CCOOpenOutput Control (low-level enabling)Output Waveform 1S1 at 2 × V CCO (see Note B)Output Waveform 2S1 at GND (see Note B)0 V0 VV CCI0 VV CCAV CCOVOLTAGE WAVEFORMS PROPAGATION DELAY TIMESVOLTAGE WAVEFORMS PULSE DURATIONVOLTAGE WAVEFORMS ENABLE AND DISABLE TIMESInputt pd t PLZ /t PZL t PHZ /t PZHOpen 2 × V CCO GNDTEST S1NOTES: A.C L includes probe and jig capacitance.B.Waveform 1 is for an output with internal conditions such that the output is low, except when disabled by the output control.Waveform 2 is for an output with internal conditions such that the output is high, except when disabled by the output control.C.All input pulses are supplied by generators having the following characteristics: PRR v 10 MHz, Z O = 50 Ω, dv/dt ≥ 1 V/ns.D.The outputs are measured one at a time, with one transition per measurement.E.t PLZ and t PHZ are the same as t dis .F.t PZL and t PZH are the same as t en .G.t PLH and t PHL are the same as t pd .H.V CCI is the V CC associated with the input port.I.V CCO is the V CC associated with the output port.J.All parameters and waveforms are not applicable to all devices.1.8 V ± 0.15 V2.5 V ± 0.2 V3.3 V ± 0.3 V 5 V ± 0.5 V2 k Ω2 k Ω2 k Ω2 k ΩV CCO R L 0.15 V 0.15 V 0.3 V 0.3 VV TP C L 15 pF 15 pF 15 pF 15 pFSN74LVC1T45SINGLE-BIT DUAL-SUPPLY BUS TRANSCEIVERWITH CONFIGURABLE VOLTAGE TRANSLATION AND 3-STATE OUTPUTSSCES515H–DECEMBER 2003–REVISED JANUARY 2007Figure 1.Load Circuit and Voltage WaveformsAPPLICATION INFORMATIONSYSTEM-1SYSTEM-2SN74LVC1T45SINGLE-BIT DUAL-SUPPLY BUS TRANSCEIVERWITH CONFIGURABLE VOLTAGE TRANSLATION AND 3-STATE OUTPUTSSCES515H–DECEMBER 2003–REVISED JANUARY 2007Figure 2shows an example of the SN74LVC1T45being used in a unidirectional logic level-shifting application.PIN NAME FUNCTION DESCRIPTION1V CCA V CC1SYSTEM-1supply voltage (1.65V to 5.5V)2GND GND Device GND3A OUT Output level depends on V CC1voltage.4B IN Input threshold value depends on V CC2voltage.5DIR DIR GND (low level)determines B-port to A-port direction.6V CCBV CC2SYSTEM-2supply voltage (1.65V to 5.5V)Figure 2.Unidirectional Logic Level-Shifting ApplicationAPPLICATION INFORMATIONSYSTEM-1SYSTEM-2Enable TimesSN74LVC1T45SINGLE-BIT DUAL-SUPPLY BUS TRANSCEIVERWITH CONFIGURABLE VOLTAGE TRANSLATION AND 3-STATE OUTPUTSSCES515H–DECEMBER 2003–REVISED JANUARY 2007Figure 3shows the SN74LVC1T45being used in a bidirectional logic level-shifting application.Since the SN74LVC1T45does not have an output-enable (OE)pin,the system designer should take precautions to avoid bus contention between SYSTEM-1and SYSTEM-2when changing directions.The following table shows data transmission from SYSTEM-1to SYSTEM-2and then from SYSTEM-2to SYSTEM-1.STATE DIR CTRLI/O-1I/O-2DESCRIPTION1H Out In SYSTEM-1data to SYSTEM-2SYSTEM-2is getting ready to send data to SYSTEM-1.I/O-1and I/O-2are disabled.The 2H Hi-Z Hi-Z bus-line state depends on pullup or pulldown.(1)DIR bit is flipped.I/O-1and I/O-2still are disabled.The bus-line state depends on pullup or 3L Hi-Z Hi-Z pulldown.(1)4LOutInSYSTEM-2data to SYSTEM-1(1)SYSTEM-1and SYSTEM-2must use the same conditions,i.e.,both pullup or both pulldown.Figure 3.Bidirectional Logic Level-Shifting ApplicationCalculate the enable times for the SN74LVC1T45using the following formulas:•t PZH (DIR to A)=t PLZ (DIR to B)+t PLH (B to A)•t PZL (DIR to A)=t PHZ (DIR to B)+t PHL (B to A)•t PZH (DIR to B)=t PLZ (DIR to A)+t PLH (A to B)•t PZL (DIR to B)=t PHZ (DIR to A)+t PHL (A to B)In a bidirectional application,these enable times provide the maximum delay from the time the DIR bit is switched until an output is expected.For example,if the SN74LVC1T45initially is transmitting from A to B,then the DIR bit is switched;the B port of the device must be disabled before presenting it with an input.After the B port has been disabled,an input signal applied to it appears on the corresponding A port after the specified propagation delay.PACKAGING INFORMATIONOrderable Device Status (1)Package Type Package Drawing Pins Package Qty Eco Plan (2)Lead/Ball Finish MSL Peak Temp (3)SN74LVC1T45DBVR ACTIVE SOT-23DBV 63000Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74LVC1T45DBVRE4ACTIVE SOT-23DBV 63000Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74LVC1T45DBVT ACTIVE SOT-23DBV 6250Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74LVC1T45DBVTE4ACTIVE SOT-23DBV 6250Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74LVC1T45DCKR ACTIVE SC70DCK 63000Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74LVC1T45DCKRE4ACTIVE SC70DCK 63000Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74LVC1T45DCKRG4ACTIVE SC70DCK 63000Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74LVC1T45DCKT ACTIVE SC70DCK 6250Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74LVC1T45DCKTE4ACTIVE SC70DCK 6250Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74LVC1T45DCKTG4ACTIVE SC70DCK 6250Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74LVC1T45DRLR ACTIVE SOT-533DRL 64000Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74LVC1T45DRLRG4ACTIVE SOT-533DRL 64000Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74LVC1T45YZPRACTIVEWCSPYZP63000Green (RoHS &no Sb/Br)SNAGCULevel-1-260C-UNLIM(1)The marketing status values are defined as follows:ACTIVE:Product device recommended for new designs.LIFEBUY:TI has announced that the device will be discontinued,and a lifetime-buy period is in effect.NRND:Not recommended for new designs.Device isin production to support existing customers,but TI does not recommend using this part in a new design.PREVIEW:Device has been announced but is not in production.Samples may or may not be available.OBSOLETE:TI has discontinued the production of the device.(2)Eco Plan -The planned eco-friendly classification:Pb-Free (RoHS),Pb-Free (RoHS Exempt),or Green (RoHS &no Sb/Br)-please check /productcontent for the latest availability information and additional product content details.TBD:The Pb-Free/Green conversion plan has not been defined.Pb-Free (RoHS):TI's terms "Lead-Free"or "Pb-Free"mean semiconductor products that are compatible with the current RoHS requirements for all 6substances,including the requirement that lead not exceed 0.1%by weight in homogeneous materials.Where designed to be soldered at high temperatures,TI Pb-Free products are suitable for use in specified lead-free processes.Pb-Free (RoHS Exempt):This component has a RoHS exemption for either 1)lead-based flip-chip solder bumps used between the die and package,or 2)lead-based die adhesive used between the die and leadframe.The component is otherwise considered Pb-Free (RoHS compatible)as defined above.Green (RoHS &no Sb/Br):TI defines "Green"to mean Pb-Free (RoHS compatible),and free of Bromine (Br)and Antimony (Sb)based flame retardants (Br or Sb do not exceed 0.1%by weight in homogeneous material)(3)MSL,Peak Temp.--The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications,and peak solder temperature.Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided.TI bases its knowledge and belief on information provided by third parties,and makes no representation or warranty as to the accuracy of such information.Efforts are underway to better integrate information from third parties.TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on6-Feb-2007incoming materials and chemicals.TI and TI suppliers consider certain information to be proprietary,and thus CAS numbers and other limited information may not be available for release.In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s)at issue in this document sold by TI to Customer on an annualbasis.6-Feb-2007IMPORTANT NOTICETexas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements, and other changes to its products and services at any time and todiscontinue any product or service without notice. Customers should obtain the latest relevant informationbefore placing orders and should verify that such information is current and complete. All products are soldsubject to TI’s terms and conditions of sale supplied at the time of order acknowledgment.TI warrants performance of its hardware products to the specifications applicable at the time of sale inaccordance with TI’s standard warranty. Testing and other quality control techniques are used to the extentTI deems necessary to support this warranty. Except where mandated by government requirements, testingof all parameters of each product is not necessarily performed.TI assumes no liability for applications assistance or customer product design. Customers are responsiblefor their products and applications using TI components. To minimize the risks associated with customerproducts and applications, customers should provide adequate design and operating safeguards.TI does not warrant or represent that any license, either express or implied, is granted under any TI patentright, copyright, mask work right, or other TI intellectual property right relating to any combination, machine,or process in which TI products or services are used. Information published by TI regarding third-partyproducts or services does not constitute a license from TI to use such products or services or a warranty orendorsement thereof. Use of such information may require a license from a third party under the patents orother intellectual property of the third party, or a license from TI under the patents or other intellectualproperty of TI.Reproduction of information in TI data books or data sheets is permissible only if reproduction is withoutalteration and is accompanied by all associated warranties, conditions, limitations, and notices.Reproduction of this information with alteration is an unfair and deceptive business practice. TI is notresponsible or liable for such altered documentation.Resale of TI products or services with statements different from or beyond the parameters stated by TI forthat product or service voids all express and any implied warranties for the associated TI product or serviceand is an unfair and deceptive business practice. TI is not responsible or liable for any such statements.Following are URLs where you can obtain information on other Texas Instruments products and applicationsolutions:Products ApplicationsAmplifiers Audio /audioData Converters Automotive /automotive/broadbandBroadbandDSP DigitalControl /digitalcontrol Interface Military /military Logic Power Mgmt Optical Networking /opticalnetworkSecurity /security Microcontrollers Low Power Wireless /lpw Telephony /telephonyVideo & Imaging /video/wirelessWirelessMailing Address: Texas InstrumentsPost Office Box 655303 Dallas, Texas 75265Copyright © 2007, Texas Instruments Incorporated。

SN74AHC1G08DBVTG4资料

SN74AHC1G08DBVTG4资料

PACKAGING INFORMATIONOrderable Device Status(1)PackageType PackageDrawingPins PackageQtyEco Plan(2)Lead/Ball Finish MSL Peak Temp(3)SN74AHC1G08DBVR ACTIVE SOT-23DBV53000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74AHC1G08DBVRE4ACTIVE SOT-23DBV53000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74AHC1G08DBVRG4ACTIVE SOT-23DBV53000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74AHC1G08DBVT ACTIVE SOT-23DBV5250Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74AHC1G08DBVTE4ACTIVE SOT-23DBV5250Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74AHC1G08DBVTG4ACTIVE SOT-23DBV5250Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74AHC1G08DCKR ACTIVE SC70DCK53000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74AHC1G08DCKRE4ACTIVE SC70DCK53000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74AHC1G08DCKRG4ACTIVE SC70DCK53000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74AHC1G08DCKT ACTIVE SC70DCK5250Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74AHC1G08DCKTE4ACTIVE SC70DCK5250Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74AHC1G08DCKTG4ACTIVE SC70DCK5250Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74AHC1G08DRLR ACTIVE SOT DRL54000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74AHC1G08DRLRG4ACTIVE SOT DRL54000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIM(1)The marketing status values are defined as follows:ACTIVE:Product device recommended for new designs.LIFEBUY:TI has announced that the device will be discontinued,and a lifetime-buy period is in effect.NRND:Not recommended for new designs.Device is in production to support existing customers,but TI does not recommend using this part in a new design.PREVIEW:Device has been announced but is not in production.Samples may or may not be available.OBSOLETE:TI has discontinued the production of the device.(2)Eco Plan-The planned eco-friendly classification:Pb-Free(RoHS),Pb-Free(RoHS Exempt),or Green(RoHS&no Sb/Br)-please check /productcontent for the latest availability information and additional product content details.TBD:The Pb-Free/Green conversion plan has not been defined.Pb-Free(RoHS):TI's terms"Lead-Free"or"Pb-Free"mean semiconductor products that are compatible with the current RoHS requirements for all6substances,including the requirement that lead not exceed0.1%by weight in homogeneous materials.Where designed to be soldered at high temperatures,TI Pb-Free products are suitable for use in specified lead-free processes.Pb-Free(RoHS Exempt):This component has a RoHS exemption for either1)lead-based flip-chip solder bumps used between the die and package,or2)lead-based die adhesive used between the die and leadframe.The component is otherwise considered Pb-Free(RoHS compatible)as defined above.Green(RoHS&no Sb/Br):TI defines"Green"to mean Pb-Free(RoHS compatible),and free of Bromine(Br)and Antimony(Sb)based flame retardants(Br or Sb do not exceed0.1%by weight in homogeneous material)(3)MSL,Peak Temp.--The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications,and peak solder temperature.Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is 22-Oct-2007provided.TI bases its knowledge and belief on information provided by third parties,and makes no representation or warranty as to the accuracy of such information.Efforts are underway to better integrate information from third parties.TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.TI and TI suppliers consider certain information to be proprietary,and thus CAS numbers and other limited information may not be available for release.In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s)at issue in this document sold by TI to Customer on an annualbasis.22-Oct-2007TAPE AND REEL BOXINFORMATIONDevicePackage Pins SiteReel Diameter (mm)Reel Width (mm)A0(mm)B0(mm)K0(mm)P1(mm)W (mm)Pin1Quadrant SN74AHC1G08DBVR DBV 5SITE 341809 3.23 3.17 1.3748Q3SN74AHC1G08DBVR DBV 5SITE 4500 3.23 3.17 1.3748Q3SN74AHC1G08DBVT DBV 5SITE 341809 3.23 3.17 1.3748Q3SN74AHC1G08DBVT DBV 5SITE 453301610.615.8 4.91624Q3SN74AHC1G08DCKR DCK 5SITE 341809 2.24 2.34 1.2248Q3SN74AHC1G08DCKR DCK 5SITE 4500 2.4 2.5 1.248Q3SN74AHC1G08DCKT DCK 5SITE 341809 2.24 2.34 1.2248Q3SN74AHC1G08DCKT DCK 5SITE 4500 2.4 2.5 1.248Q3SN74AHC1G08DRLRDRL5SITE 3518091.781.780.6948Q316-Nov-2007DevicePackage Pins Site Length (mm)Width (mm)Height (mm)SN74AHC1G08DBVR DBV 5SITE 34205.0200.033.0SN74AHC1G08DBVR DBV 5SITE 450.0185.0220.0SN74AHC1G08DBVT DBV 5SITE 34201.0192.026.0SN74AHC1G08DBVT DBV 5SITE 450.00.00.0SN74AHC1G08DCKR DCK 5SITE 34205.0200.033.0SN74AHC1G08DCKR DCK 5SITE 450.0185.0220.0SN74AHC1G08DCKT DCK 5SITE 34201.0192.026.0SN74AHC1G08DCKT DCK 5SITE 450.0185.0220.0SN74AHC1G08DRLRDRL5SITE 35202.0201.028.016-Nov-2007IMPORTANT NOTICETexas Instruments Incorporated and its subsidiaries(TI)reserve the right to make corrections,modifications,enhancements, improvements,and other changes to its products and services at any time and to discontinue any product or service without notice. Customers should obtain the latest relevant information before placing orders and should verify that such information is current and complete.All products are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment.TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s standard warranty.Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty.Except where mandated by government requirements,testing of all parameters of each product is not necessarily performed.TI assumes no liability for applications assistance or customer product design.Customers are responsible for their products and applications using TI components.To minimize the risks associated with customer products and applications,customers should provide adequate design and operating safeguards.TI does not warrant or represent that any license,either express or implied,is granted under any TI patent right,copyright,mask work right,or other TI intellectual property right relating to any combination,machine,or process in which TI products or services are rmation published by TI regarding third-party products or services does not constitute a license from TI to use such products or services or a warranty or endorsement e of such information may require a license from a third party under the patents or other intellectual property of the third party,or a license from TI under the patents or other intellectual property of TI. Reproduction of TI information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties,conditions,limitations,and notices.Reproduction of this information with alteration is an unfair and deceptive business practice.TI is not responsible or liable for such altered rmation of third parties may be subject to additional restrictions.Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service voids all express and any implied warranties for the associated TI product or service and is an unfair and deceptive business practice.TI is not responsible or liable for any such statements.TI products are not authorized for use in safety-critical applications(such as life support)where a failure of the TI product would reasonably be expected to cause severe personal injury or death,unless officers of the parties have executed an agreement specifically governing such use.Buyers represent that they have all necessary expertise in the safety and regulatory ramifications of their applications,and acknowledge and agree that they are solely responsible for all legal,regulatory and safety-related requirements concerning their products and any use of TI products in such safety-critical applications,notwithstanding any applications-related information or support that may be provided by TI.Further,Buyers must fully indemnify TI and its representatives against any damages arising out of the use of TI products in such safety-critical applications.TI products are neither designed nor intended for use in military/aerospace applications or environments unless the TI products are specifically designated by TI as military-grade or"enhanced plastic."Only products designated by TI as military-grade meet military specifications.Buyers acknowledge and agree that any such use of TI products which TI has not designated as military-grade is solely at the Buyer's risk,and that they are solely responsible for compliance with all legal and regulatory requirements in connection with such use.TI products are neither designed nor intended for use in automotive applications or environments unless the specific TI products are designated by TI as compliant with ISO/TS16949requirements.Buyers acknowledge and agree that,if they use anynon-designated products in automotive applications,TI will not be responsible for any failure to meet such requirements. Following are URLs where you can obtain information on other Texas Instruments products and application solutions:Products ApplicationsAmplifiers Audio /audioData Converters Automotive /automotiveDSP Broadband /broadbandInterface Digital Control /digitalcontrolLogic Military /militaryPower Mgmt Optical Networking /opticalnetworkMicrocontrollers Security /securityRFID Telephony /telephonyLow Power /lpw Video&Imaging /videoWirelessWireless /wirelessMailing Address:Texas Instruments,Post Office Box655303,Dallas,Texas75265Copyright©2007,Texas Instruments Incorporated。

SN74LVC1G17DBVTG4中文资料

SN74LVC1G17DBVTG4中文资料

元器件交易网

SN74LVC1G17 SINGLE SCHMITT-TRIGGER BUFFER
SCES351R – JULY 2001 – REVISED AUGUST 2007
Absolute Maximum Ratings(1)
over operating free-air temperature range (unless otherwise noted)
SN74LVC1G17DRLR
Reel of 4000
C7_
SN74LVC1G17DRLRG4
(1) Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at /sc/package.
• Latch-Up Performance Exceeds 100 mA Per JESD 78, Class II
• ESD Protection Exceeds JESD 22 – 2000-V Human-Body Model (A114-A)
– 200-V Machine Model (A115-A)
NanoFree is a trademark of Texas Instruments.
PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters.
相关主题
  1. 1、下载文档前请自行甄别文档内容的完整性,平台不提供额外的编辑、内容补充、找答案等附加服务。
  2. 2、"仅部分预览"的文档,不可在线预览部分如存在完整性等问题,可反馈申请退款(可完整预览的文档不适用该条件!)。
  3. 3、如文档侵犯您的权益,请联系客服反馈,我们会尽快为您处理(人工客服工作时间:9:00-18:30)。

PACKAGING INFORMATIONOrderable Device Status (1)Package Type Package Drawing Pins Package Qty Eco Plan (2)Lead/Ball Finish MSL Peak Temp (3)SN74CB3T1G125DBVR ACTIVE SOT-23DBV 53000Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74CB3T1G125DCKRACTIVESC70DCK53000Pb-Free (RoHS)CU NIPDAULevel-1-260C-UNLIM(1)The marketing status values are defined as follows:ACTIVE:Product device recommended for new designs.LIFEBUY:TI has announced that the device will be discontinued,and a lifetime-buy period is in effect.NRND:Not recommended for new designs.Device is in production to support existing customers,but TI does not recommend using this part in a new design.PREVIEW:Device has been announced but is not in production.Samples may or may not be available.OBSOLETE:TI has discontinued the production of the device.(2)Eco Plan -May not be currently available -please check /productcontent for the latest availability information and additional product content details.None:Not yet available Lead (Pb-Free).Pb-Free (RoHS):TI's terms "Lead-Free"or "Pb-Free"mean semiconductor products that are compatible with the current RoHS requirements for all 6substances,including the requirement that lead not exceed 0.1%by weight in homogeneous materials.Where designed to be soldered at high temperatures,TI Pb-Free products are suitable for use in specified lead-free processes.Green (RoHS &no Sb/Br):TI defines "Green"to mean "Pb-Free"and in addition,uses package materials that do not contain halogens,including bromine (Br)or antimony (Sb)above 0.1%of total product weight.(3)MSL,Peak Temp.--The Moisture Sensitivity Level rating according to the JEDECindustry standard classifications,and peak solder temperature.Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided.TI bases its knowledge and belief on information provided by third parties,and makes no representation or warranty as to the accuracy of such information.Efforts are underway to better integrate information from third parties.TI has taken and continues to take reasonable steps to provide representative and accurate information but may not haveconducted destructive testing or chemical analysis on incoming materials and chemicals.TI and TI suppliers consider certain information to be proprietary,and thus CAS numbers and other limited information may not be available for release.In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s)at issue in this document sold by TI to Customer on an annual basis.PACKAGE OPTION ADDENDUM25-Feb-2005Addendum-Page 1IMPORTANT NOTICETexas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements, and other changes to its products and services at any time and to discontinue any product or service without notice. Customers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. All products are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment.TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s standard warranty. T esting and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where mandated by government requirements, testing of all parameters of each product is not necessarily performed.TI assumes no liability for applications assistance or customer product design. Customers are responsible for their products and applications using TI components. T o minimize the risks associated with customer products and applications, customers should provide adequate design and operating safeguards.TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right, copyright, mask work right, or other TI intellectual property right relating to any combination, machine, or process in which TI products or services are used. Information published by TI regarding third-party products or services does not constitute a license from TI to use such products or services or a warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the third party, or a license from TI under the patents or other intellectual property of TI.Reproduction of information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties, conditions, limitations, and notices. Reproduction of this information with alteration is an unfair and deceptive business practice. TI is not responsible or liable for such altered documentation.Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service voids all express and any implied warranties for the associated TI product or service and is an unfair and deceptive business practice. TI is not responsible or liable for any such statements. Following are URLs where you can obtain information on other Texas Instruments products and application solutions:Products ApplicationsAmplifiers Audio /audioData Converters Automotive /automotiveDSP Broadband /broadbandInterface Digital Control /digitalcontrolLogic Military /militaryPower Mgmt Optical Networking /opticalnetwork Microcontrollers Security /securityTelephony /telephonyVideo & Imaging /videoWireless /wirelessMailing Address:Texas InstrumentsPost Office Box 655303 Dallas, Texas 75265Copyright 2005, Texas Instruments Incorporated。

相关文档
最新文档