BT1207S-P蓝牙模块规格书1.2

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NCP1207在电源适配器中的应用

采用反激式开关模式时，最大的占空比为：
maxVflb V kV flbbuklm k i n11 21 2 74 71 0.47
变压器初级绕组的峰值电流为:
Ipp k2Im in aavx g260.4 4 17 0 3 02.7A 2
最低输入电压时,功率转换器的开关频率为最低设定70KHZ .最大导通时间为:
10 ～ 7
2UEW-φ0.40×2
线圈结构图:
圈数 38 8 12 8 18
绕制方法双线并绕均匀散绕三线并绕三线并绕双线并绕
初级线圈电流控制:
初级电感量为:
LpV bIp um p lkkitnON 2 1 .7 .42 61 .710 634 u7 H (实际值为:400uH) 变压器铁芯电感系数AL:
AL
Lp (np)2
0.34.1703 (5)52
11n5H
24VDC输出绕组的圈数为:
n sV sm (1 a V b x m u )m a n lp x ki n(2 4 1 0 ).4 (1 1 7 0 .4 4 )7 5 1 5 1t2 urns
安森美的NCP1207是一款专著于反激、电流模、准谐振模式PWM控制器。由NCP1207构成的离线式功率变换器用于消费电子产品是一不错的选择。如用在笔记本电脑电源适配器、离线式电池充电器、DVD电源供应器、机顶盒电源等。同时,由于NCP1207工作在准谐振模式,用于消费类小功率电子产品的电源中，电源的电磁骚扰明显减小，电源在轻载时效率可高于是70%，同时它还可以用于反激式同步整流，更进一步提高电源的较率。
12VDC输出绕组的圈数为:
n s 1 .3 .V s m (1 a V b m xu ) m n alp x ki n (1 2 1 0 ).4 (1 1 0 7 .4 4 )7 5 1 .1 5 .3 8 turns

深圳市昇润科技HY-40R201低功耗蓝牙5.0模块规格书说明书

此外，昇润科技保留随时行通知，并不承诺更新此处所包含的信息。

昇润的关键组件。

以及不承担各种专利或知识产权的.密级：公开资料留随时更改硬件，软件。

昇润的产品不被授权产权的授权使用;蓝牙商1.简述 (1)1-1应用： (1)1-2主要特征： (1)2. 产品型号 (2)2-1.(4 种天线形式可供选择)/( 可选: 带屏蔽罩或不带屏蔽罩) (2)2-2: HY-40R201PC机种屏蔽罩上FCC ID &( IC ID 待定义）印刷内容： (2)3. 模块尺寸与图片 (2)3.1 HY-40R201P / WMD40R201SR6P0 PCB IFA天线 (2)3-2.HY-40R201I /WMD40R201SR6I0 IPEX RF外接天线连接端子 (3)3-3. HY-40R201W / MD40R201SR6W0 金属线天线 (1/4波长偶极子天线) (3)3.4. HY-40R201C/ WMD40R201SR6C0 (陶瓷天线) (3)(4). 应用注意事项: (4)5.引脚分配和端口功能说明 (5)6. 电气特性 (6)6-1. 射频特性及电流功耗: (6)6-2. 绝对最大额定值 (7)6-3. ESD 额定值 (7)6-4.建议工作条件 (7)6-5.GPIO DC特性 (7)6-6. 时序要求 (8)6-7. 动作状态切换时序特性 (8)7. 模块方块图 (8)8.IC功能方块图 (9)9. 工作模式架构图 (9)10. 回流焊曲线建议 (无铅锡膏: Sn 96.5%, Ag 3%, Cu 0.5%) (10)11. HY-40R201PC / WMD40R201SR6PC 模块 FCC及 IC声明 (11)12.联系我们 (13)HY-40R201提供蓝牙低功耗特性：无线电，蓝牙协议栈，配置文件和客户应用程序的所需空间。

BT-120中文资料

©2008 Amp’ed RF Inc
1722 Ringwood Ave, Suite 250, San Jose, CA 95131, USA
BT-120/121 Datasheet Page 5 of 6
元器件交易网
Amp’ed RF, Inc.
元器件交易网
Amp’ed RF, Inc.
(phone) 408 213-9530 (fax) 408 213-9533
Product Specification
Features
Bluetooth Radio
Fully embedded Bluetooth v2.0 Serial Profile Class 2 radio Complete RF ready module Wireless data communications Integrated chip antenna 128-bit encryption security Range up to 30m LOS FCC & Bluetooth qualified
1722 Ringwood Ave, Suite 250, San Jose, CA 95131, USA
BT-120/121 Datasheet Page 4 of 6
元器件交易网
Amp’ed RF, Inc.
(phone) 408 213-9530 (fax) 408 213-9533
BT-120/121 Datasheet Page 2 of 6
元器件交易网
Amp’ed RF, Inc.
(phone) 408 213-9530 (fax) 408 213-9533
Serial Interface AT Commands

BLF7G20LS-140P,118;BLF7G20LS-140P,112;中文规格书,Datasheet资料

BLF7G20LS-140PPower LDMOS transistorRev. 2 — 17 August 2010Product data sheet 1. Product profile1.1General description140W LDMOS power transistor for base station applications at frequencies from1800MHz to 2000MHz.Table 1.Typical performanceTypical RF performance at T case = 25 °C in a common source class-AB production test circuit.Mode of operation f I Dq V DS P L(AV)G pηD ACPR400k ACPR600k EVM rms (MHz)(mA)(V)(W)(dB)(%)(dBc)(dBc)(%)CW1805to1880850281251754---GSM EDGE1805to1880850286017.541−61−75 2.71.2Features and benefitsExcellent ruggednessHigh efficiencyLow R th providing excellent thermal stabilityDesigned for broadband operation (1800 MHz to 2000 MHz)Lower output capacitance for improved performance in Doherty applicationsDesigned for low memory effects providing excellent pre-distortabilityInternally matched for ease of useIntegrated ESD protectionCompliant to Directive 2002/95/EC, regarding Restriction of Hazardous Substances(RoHS)1.3ApplicationsRF power amplifiers for base stations and multi carrier applications in the 1800 MHz to 2000 MHz frequency range2. Pinning information[1]Connected to flange.3. Ordering information4. Limiting values5. Thermal characteristicsTable 2.PinningPin Description Simplified outlineGraphic symbol1drain12drain23gate14gate25source[1]4532143sym117Table 3.Ordering informationType numberPackageName DescriptionVersion BLF7G20LS-140P -earless flanged LDMOST ceramic package; 4leadsSOT1121BTable 4.Limiting valuesIn accordance with the Absolute Maximum Rating System (IEC 60134).Symbol ParameterConditionsMin Max Unit V DS drain-source voltage -65V V GS gate-source voltage −0.5+13V T stg storage temperature −65+150°C T jjunction temperature-200°CTable 5.Thermal characteristics Symbol ParameterConditionsTypUnit R th(j-c)thermal resistance from junction to caseT case =80°C; P L =100W0.41K/W6. Characteristics7. Test information7.1Ruggedness in class-AB operationThe BLF7G20LS-140P is capable of withstanding a load mismatch corresponding to VSWR =10 : 1 through all phases under the following conditions: V DS =28V; I Dq =850mA;P L =140W (CW); f =1805MHz.Table 6.CharacteristicsT j = 25 °C; per section unless otherwise specified.Symbol ParameterConditionsMin Typ Max Unit V (BR)DSS drain-source breakdown voltage V GS =0V; I D =0.9mA 65--V V GS(th)gate-source threshold voltage V DS =10 V; I D =90mA 1.5 1.9 2.3V I DSS drain leakage current V GS =0V; V DS =28V --2μA I DSX drain cut-off current V GS =V GS(th)+3.75 V; V DS =10V14--A I GSS gate leakage current V GS =11V; V DS =0V --200nA g fs forward transconductance V DS =10V; I D =2.5A - 6.45-S R DS(on)drain-source on-state resistanceV GS =V GS(th) + 3.75V; I D =3.15A-0.15-ΩTable 7.Application informationf = 1805 MHz and 1880 MHz; RF performance at V DS = 28 V; I Dq =850mA; T case = 25 °C; 2sections combined unless otherwise specified; in a class-AB production test circuit.Symbol Parameter ConditionsMin Typ Max Unit Mode of operation: GSM EDGE; P L(AV) = 60 WG p power gain 16.317.5-dB RL in input return loss -−15−8dB ηDdrain efficiency3741-%ACPR 400k adjacent channel power ratio (400 kHz)-−61−56.5dBc ACPR 600k adjacent channel power ratio (600 kHz)-−75−69.5dBc EVM rms RMS EDGE signal distortion error - 2.7 4.0%EVM M peak EDGE signal distortion error -8.512.5%Mode of operation: CW; P L(AV) = 125 WG p power gain 1617-dB ηDdrain efficiency4854-%7.2One-tone CW7.3Two-tone CW7.4GSM EDGE7.5Single carrier IS-95Single carrier IS-95 with pilot, paging, sync and 6traffic channels (Walsh codes 8-13).PAR=9.7dB at 0.01% probability on the CCDF. Channel bandwidth is 1.2288MHz.7.6Single carrier W-CDMA3GPP; test model1; 64DPCH; PAR=7.2dB at 0.01% probability on CCDF.Channel bandwidth is 3.84MHz.7.7Test circuitTable 8.List of componentsFor test circuit see Figure12.Component Description Value Remarks C1, C2, C3multilayer ceramic chip capacitor24pF[1]C4, C5multilayer ceramic chip capacitor 4.7 μF[2]C6, C7, C8multilayer ceramic chip capacitor11pF[3]C9, C10multilayer ceramic chip capacitor10 μF[2]C11electrolytic capacitor470 μF; 63 VR1, R2SMD resistor12ΩPhilips 1206[1]American Technical Ceramics type 100A or capacitor of same quality.[2]TDK or capacitor of same quality.[3]American Technical Ceramics type 100B or capacitor of same quality.7.8Impedance informationTable 9.Typical impedanceTypical values valid for both section in parallel unless otherwise specified.f Z S Z LMHzΩΩ1800 1.1 − j3.8 1.8 − j2.8 1840 1.3 − j3.7 1.7 − j2.6 1880 1.2 − j3.8 1.6 − j2.58. Package outlineFig 14.Package outline SOT1121B9. Abbreviations10. Revision historyTable 10.AbbreviationsAcronym Description CW Continuous WaveEDGE Enhanced Data rates for GSM Evolution ESD ElectroStatic DischargeGSM Global System for Mobile communications IS-95Interim Standard 95LDMOS Laterally Diffused Metal Oxide SemiconductorLDMOST Laterally Diffused Metal Oxide Semiconductor Transistor RF Radio Frequency SMD Surface Mounted Device VSWR Voltage Standing Wave RatioW-CDMAWideband Code Division Multiple AccessTable 11.Revision historyDocument ID Release date Data sheet status Change notice Supersedes BLF7G20LS-140P v.220100817Product data sheet-BLF7G20L-140P_7G20LS-140P v.1Modifications:•This document now only describes the BLF7G20LS-140P .•Table 1 on page 1: changed some values.•Table 4 on page 2: removed drain current specification.•Table 6 on page 3: added typical value for g fs .•Table 7 on page 3: changed some values.•Section 7.2 on page 4: updated the figures.•Section 7.3 on page 4: updated the figures.•Section 7.4 on page 5: updated the figures.•Section 7.5 on page 6: updated the figures.BLF7G20L-140P_7G20LS-140P v.120100421Objective data sheet--分销商库存信息:NXPBLF7G20LS-140P,118BLF7G20LS-140P,112。

200 42混合器机器人替代部件和配件手册说明书

SUPPORT W/BUSHING BUSHING
0040310
200 SPURT GUARD
SS 200 FRAME (P.O.R.)
0090638
KNOB
0040138 LID LOCK HOOK W/NUT
0058116 BRACKET FRONT (PLATED)
0058116S SS BRACKET FRONT
0058117
SS SHAFT FRONT
TOOL PAN ACCESS COVER SWITCH HOLDER GEAR BOX MOUNT
BELT COVER BEARING BRACKET WITH BUSHING
BUSHING BEARING BRACKET
QTY.
1 1 1 1 1 2 1 1 1
PAGE 6
200/42 MIXER GRINDER
42 KNIFE (INVESTMENT) 42 KNIFE (PREMIUM) 42-1/8” HOLE PLATE 42-3/16” HOLE PALTE 42-1/4” HOLE PLATE
QTY.
1 1 1 A/R 1 1 1 1 1 1 1 1
ITEM#
9D 10 10 11 12 13 14 15 16 17 18
QTY. 1 1 1 2 2 2 2 2 2 2 2
PAGE 4
1 5 6 3
200/42 MIXER GRINDER
REPLACEMENT PADDLE ASSEMBLY & BUSHING
FOR 200 MIXER GRINDERS S/N 101 TO 360
(THAT WERE MANUFACTURED BY “LASAR MFG.”)

BTS840S2中文资料

Infineon technologies
2
2003-Oct-01
元器件交易网
BTS 840 S2
Maximum Ratings at Tj = 25°C unless otherwise specified
Parameter
Symbol
Supply voltage (overvoltage protection see page 5)
see diagrams on page 10
Electrostatic discharge capability (ESD)
IN:
(Human Body Model)
ST, IS:
out to all other pins shorted:
acc. MIL-STD883D, method 3015.7 and ESD assn. std. S5.1-1993
-10 ... +16 V ±2.0 mA ±5.0 ±14
1) Supply voltages higher than Vbb(AZ) require an external current limit for the GND and status pins a 150Ω
resistor for the GND connection is recommended.
Symbol Vbb
3 7 16,17, 18,19 12,13, 14,15
IN1 IN2 OUT1
OUT2
4
ST1
8
ST2
2
GND1
6
GND2
5
IS1Vbb
Function Positive power supply voltage. For high

(完整word版)科蒂斯控制器1207A说明书(中)

1207A型直流电机控制器使用手册1概述CURTIS PMC 1207A可编程电机速度控制器为各种小型电动车辆提供了高效和易于安装的的控制系统,典型的应用对象为行走式叉车/堆垛车，小型载客车和清洁车等,以微控制器为核心的逻辑部分,配以可靠的MOSFET功率单元，为封装简洁紧凑的1207A控制器提供了大功率输出和先进的性能,可选用手持式编程器使用户能进行快捷、方便地完成参数设定，指导调试及获取故障诊断信息。

同所有CURTIS PMC 电机速度控制器一样，1207A型控制器为车辆的电机驱动速度提供了优异的运动控制，1207A控制器的主要性能包括:◆无级变速和反相制动控制◆大功率MOSFET设计提供高效（减少电机和电池损耗）和无噪声操作◆纯铜功率母线，配以经极化处理接线器传输能量◆采用铝制安装板和注模外壳,具有坚固而保护良好的结构◆过电压和欠电压保护可有效。

◆温度保护和补偿电路提供了低温消减，恒定电流限幅及高温线性回落功能一因而在任何温度条件下都不会发生突然性功率输出中断。

◆智能型手持编程器（选用件）提供了一套完整的参数设定和功能设定◆控制器及其它系统部件的诊断与测试信息，既能够通过车辆上的控制器获得，也可通过编程器获得◆硬件电路和软件对调速器电路，MOSFET驱动电路，MOSFET晶体管,接触器驱动器和接触器进行故障检测—-—确保控制器满足欧洲经济共同体（EEC）所规定的故障检测要求。

◆输入顺序选择包括空档起动和SRO◆微处理器控制的接触器动作顺序提供了真正的无电弧接触器开闭◆平滑的, 可控的反相制动—可变方式（与调速器位置相关)或固定的反相电流限幅方式◆空挡制动功能。

◆双模式运行可使车辆在不同环境下有不同的运行特性。

◆单信号输入方式的紧急反向功能（凸键开关)◆防后滑功能提供了满功率斜坡起动◆简洁的接触器和开关接线，带有短路和开路监测的线圈驱动器确保了安全操作。

◆灵活的调速器电路能够适应各种类型的调速器：5000-0欧姆，0-5000欧姆，0-5伏，3线电位器和各种电子调速器熟悉CURTIS PMC控制器会帮助您正确地安装和使用它。

Silabs BT122 Bluetooth Dual Mode模块项目配置指南说明书

UG496: BT122 Project Configuration User’s GuideThis document walks you through how to start a software projectfor your BT122 Bluetooth Dual Mode module, how to include the necessary resources in the project and also how to configure the hardware interface settings for the Bluetooth modules.KEY FEATURES•BT122 Project structure•Precise description of attributes and syntax used inside project files.Table of Contents1. Project Structure (3)1.1 Project File (3)1.2 Hardware Configuration (3)1.3 Bluetooth Low Energy Service Database (3)1.4 Bluetooth BR/EDR Profile SDP Entries (3)1.5 BGScript Application Code (3)1.6 Host Application Code (3)2. Project File Syntax (4)2.1 <project> (4)2.2 <hardware> (4)2.3 <gatt> (4)2.4 <script> (5)2.5 <image> (5)2.6 <entry> (6)2.7 <library> (6)2.8 Examples (7)2.8.1 Basic Project File for BT122 Bluetooth Dual Mode Module without a BGScript Application: (7)2.8.2 Basic Project File for BT122 Bluetooth Dual Mode Module Including a BGScript Application..73. Hardware Configuration File (8)3.1 <adc> (8)3.2 <sleep> (8)3.3 <controller sleep> (9)3.4 <wakeup pin> (10)3.5 <port> (11)3.6 <uart> (13)3.7 <i2c> (14)3.8 <host wakeup> (15)3.9 <bridging> (15)3.10 <lfxo> (15)4. SPP Configuration File (16)5. DID Configuration File (17)6. HID Configuration File (18)7. Revision History (21)The figure below illustrates the Bluetooth software project structure and the mandatory and optional resources. The structure is relative-ly simple and consists of the following components:1.Project file.2.Hardware configuration file.3.Bluetooth Low Energy service and characteristics database (GATT database).4.Bluetooth BR/EDR profile SDP entries.5.BGScript application source code (optional).6.Host application source code (optional and exclusive to BGScript code).1.1 Project FileThe project file defines the resources included in the project and their physical locations.1.2 Hardware ConfigurationThe hardware configuration file defines the host and peripheral interfaces (like UART, I2C and GPIO) used by the application and their settings.1.3 Bluetooth Low Energy Service DatabaseThe service database (GATT database) defines the contents and structure of the Bluetooth GATT services and characteristics imple-mented by the application. The GATT database is defined with the Profile Toolkit™ ― an XML-based description language1.4 Bluetooth BR/EDR Profile SDP EntriesThe SDP entries define the content of the Service Discovery Profile database for Bluetooth BR/EDR profiles like Serial Port Profile, Human Interface Device Profile, Apple iAP2 profile, or Device Information Profile.1.5 BGScript Application CodeBGScript is a basic-style application scripting language, which allows simple applications to be embedded into the BT122 Bluetooth Dual Mode module. When BGScript is used to implement the application logic, the source file needs to be included in the Bluetooth project file.1.6 Host Application CodeAn alternative way to implement the application is to use an additional host (typically an MCU) and use the Bluetooth module as a mo-dem. In this case, the application code runs outside the module and the source code files do not need to be included in the Bluetooth project, but the architecture selection needs to be defined in the project file.The project file (typically project.xml) describes all the components included in your Bluetooth Dual Mode project. Typically, these files are named as follows:•hardware.xml – Hardware configuration file for interfaces like UART and I2C•GATT.xml – GATT database file for Bluetooth Low Energy services and characteristics configuration•DID.xml, SPP.xml, HID.XML, etc. – SDP entry file(s) for possible Bluetooth profiles•script.bgs – Optional BGScript application source codeThe project file also defines other settings of the project like the hardware version or the firmware output files.The project file itself is a simple XML file with only a few elements in it, which are described below.2.1 <project>The XML attribute <project> starts the definition of the project file and includes the hardware device type the project is meant for. All the2.2 <hardware>The XML attribute <hardware> with its in parameterdefines the hardware configuration of the device.2.3 <gatt>The XML attribute <gatt> with its in parameter defines the GATT database file.Note: The GATT definition can also be placed inside Project XML file.The optional XML attribute <script> and its in parameters define the BGScript source code file. This XML attribute is placed within the2.5 <image>The XML attribute <entry> and its parameters are used to define the actual XML files for each of the Bluetooth BR/EDR SDP static records that you want to include in the firmware.These XML attributes are grouped within an XML attribute pair <sdp></sdp> which is used to define the Bluetooth BR/EDR Service2.7 <library>The optional XML attribute <library> and its in parameter are used to select which of the available variants of the software is to be built. The XML attribute is placed within the XML attribute pair <software></software>. This tag is not mandatory, if omitted the default library2.8.1 Basic Project File for BT122 Bluetooth Dual Mode Module without a BGScript Application:<?xml version="1.0" encoding="UTF-8" ?> <gatt in="gatt.xml" /><hardware in="hardware.xml" /><sdp><entry file="DID.xml" autoload="true"/><entry file="SPP.xml" id="2"/></sdp><image out="BT122_BGDemo.bin"/></project>2.8.2 Basic Project File for BT122 Bluetooth Dual Mode Module Including a BGScript Application<?xml version="1.0" encoding="UTF-8" ?><project device="bt122"><gatt in="gatt.xml" /><hardware in="hardware.xml"/><sdp><entry file="DID.xml" autoload="true"/><entry file="SPP.xml" id="2"/></sdp><scripting><script in="bgdemo.bgs"/></scripting><image out="BT122_BGDemo.bin"/></project>3. Hardware Configuration FileThe hardware configuration file is used to configure the hardware features such as TX power, UART, hardware timers, and GPIO set-ting of your Silicon Labs Bluetooth Dual Mode device.3.1 <adc>The XML attribute <adc> is used to configure the module’s ADC (Analog to Digital Converter) settings. ADC reference is always VDD.3.2 <sleep>The XML attribute <sleep> can be used to allow or prevent the use of deeper sleep modes. In order to enable deep sleep modes, please make sure that this option is enabled together with <controller_sleep> attribute. Otherwise, no sleep will be enabled.Note: If you enable the <sleep> feature and use UART to communicate with the module you must also enable the <wakeup_pin>.3.3 <controller sleep>The XML attribute <sleep> can be used to allow or prevent the use of sleep modes.3.4 <wakeup pin>The XML attribute <wakeup_pin> can be used to define an input GPIO that wakes the module from a sleep mode or alternatively pre-vents the Bluetooth module from entering a sleep mode. If sleep modes have been enabled and the UART interface is used for commu-nication with the module, this feature must be enabled.The wake-up pin functionality can only be assigned to a single GPIO, but you can still assign normal GPIO interrupts to other pins. The difference between the wake-up pin and normal GPIO interrupt is that the wake-up pin will not only generate the interrupt which wakes up the module from sleep but will also keep the module awake if it is asserted. Normal GPIO interrupts will wake the module form any state but after the interrupt event handler completes the module will return to sleep.How to use the wake-up pin:1.Assert the wake-up pin from an external host and keep it asserted.2.Process the dumo_evt_hardware_interrupt event generated by the module (see the API Reference Manual for more details)3.Send the desired BGAPI command(s) to the module.4.Wait until you receive the full BGAPI response(s) back from the module.5.De-assert the wake-up pin.6. The module enters sleep mode.Note: Steps 2 and 4 are critical and must be implemented correctly or otherwise, data loss might occur.Note: When this pin is pulled up, the Bluetooth Dual Mode module does not enter any of the sleep modes which increases power con-sumption.3.5 <port>The XML attribute <port> can be used to define the settings for I/O ports A, C, and F. The parameters are described in the table below.3.6 <uart>The XML attribute <uart> can be used to define the UART interface settings.3.7 <i2c>The XML attribute <i2c> can be used to define the module’s I2C (Inter-Integrated Circuit) interface configuration. Adding this attribute to3.8 <host wakeup>This XML element <host_wakeup> can be used to wake up the host processor when the module is about to send events or data over the UART to a host. Host wake up pin is guaranteed to stay up if there are more events to be sent to a host but not the end of the3.9 <bridging>The XML attribute <bridging> Bluetooth Low Energy can be used to allow or prevent the possibility of using bridging between serialNote: Enabling bridging with this attribute only allows or prevents the possibility of using this feature. To make sure it is going to work properly you still need to use proper endpoint routing in BGScript, and you need to run the API command at the BLE side to set the maximum MTU parameter value to 50 using gatt_set_max_mtu(50).3.10 <lfxo>Note: If custom value is not set, device uses tuning value from flash, written at manufacturing process.For Bluetooth BR/EDR profile the SDP entries also need to be configured so the profiles are properly advertised to remote devices. The SDP entries for all desired profiles must be defined in the project configuration file.In addition, the one XML file per profile must also be included in actual project, and these XML files are used to configure profile based settings.Below is an example showing the user configurable options for the Serial Port Profile (SPP) XML file.This mandatory SDP entry defines the Device Information Profile, the attributes of which describe certain characteristics of the mod-ule such as Vendor ID, Product ID, Version etc. For the Device Information Profile there is a corresponding XML file, named did.xml in the configuration file.The DID configuration file itself is a simple XML file consisting of nested structured elements, their attributes and attribute values.Below is an example showing the user configurable options for the Human Interface Devices (HID) XML file. Note that the “autoload”attribute cannot be used in the project.xml with HID SDP records.Note: Attribute “autoload” cannot be used in the project.xml with HID SDP records.7. Revision HistoryRevision 1.3October, 2023•Updated the I2C bit rate range.Revision 1.2July, 2022•Added new <uart> element attributes.Revision 1.1October, 2021•Added <lfxo> option in hardware.xml•Updated <library> options with HCI mode firmware example Revision 1.0•Initial release UG496: BT122 Project Configuration User’s GuideRevision HistoryIoT Portfolio /products Quality /quality Support & Community /communitySilicon Laboratories Inc.400 West Cesar Chavez Austin, TX 78701USA DisclaimerSilicon Labs intends to provide customers with the latest, accurate, and in-depth documentation of all peripherals and modules available for system and software imple-menters using or intending to use the Silicon Labs products. Characterization data, available modules and peripherals, memory sizes and memory addresses refer to each specific device, and “Typical” parameters provided can and do vary in different applications. Application examples described herein are for illustrative purposes only. Silicon Labs reserves the right to make changes without further notice to the product information, specifications, and descriptions herein, and does not give warranties as to the accuracy or completeness of the included information. Without prior notification, Silicon Labs may update product firmware during the manufacturing process for security or reliability reasons. Such changes will not alter the specifications or the performance of the product. Silicon Labs shall have no liability for the consequences of use of the infor -mation supplied in this document. This document does not imply or expressly grant any license to design or fabricate any integrated circuits. The products are not designed or authorized to be used within any FDA Class III devices, applications for which FDA premarket approval is required or Life Support Systems without the specific written consent of Silicon Labs. A “Life Support System” is any product or system intended to support or sustain life and/or health, which, if it fails, can be reasonably expected to result in significant personal injury or death. Silicon Labs products are not designed or authorized for military applications. Silicon Labs products shall under no circumstances be used in weapons of mass destruction including (but not limited to) nuclear, biological or chemical weapons, or missiles capable of delivering such weapons. Silicon Labs disclaims all express and implied warranties and shall not be responsible or liable for any injuries or damages related to use of a Silicon Labs product in such unauthorized applications. Note: This content may contain offensive terminology that is now obsolete. Silicon Labs is replacing these terms with inclusive language wherever possible. For more information, visit /about-us/inclusive-lexicon-projectTrademark InformationSilicon Laboratories Inc.®, Silicon Laboratories ®, Silicon Labs ®, SiLabs ® and the Silicon Labs logo ®, Bluegiga ®, Bluegiga Logo ®, EFM ®, EFM32®, EFR, Ember ®, Energy Micro, Energy Micro logo and combinations thereof, “the world’s most energy friendly microcontrollers”, Redpine Signals ®, WiSeConnect , n-Link, ThreadArch ®, EZLink ®, EZRadio ®, EZRadioPRO ®, Gecko ®, Gecko OS, Gecko OS Studio, Precision32®, Simplicity Studio ®, Telegesis, the Telegesis Logo ®, USBXpress ® , Zentri, the Zentri logo and Zentri DMS, Z-Wave ®, and others are trademarks or registered trademarks of Silicon Labs. ARM, CORTEX, Cortex-M3 and THUMB are trademarks or registered trademarks of ARM Holdings. Keil is a registered trademark of ARM Limited. Wi-Fi is a registered trademark of the Wi-Fi Alliance. All other products or brand names mentioned herein are trademarks of their respective holders.。

PmodBT2 Bluetooth模块说明书

1300 Henley Court Pullman, WA 99163509.334.6306 PmodBT2™ Reference ManualRevised April 15, 2016This manual applies to the PmodBT2 rev. AOverviewThe PmodBT2 is a powerful peripheral module employing the Roving Networks® RN-42 to create a fully integrated Bluetooth interface.1 Functional DescriptionThe PmodBT2 uses a standard 12-pin port and communicates via UART. There is a secondary SPI header on the board for updating the RN-42 firmware if needed.1.1 Jumper SettingsThe PmodBT2 has several modes available to the user via jumper settings. JP1 through JP4 provide various modes of operation as indicated in Table 1 below. Each jumper is active when shorted. JP1 restores the device to factor default settings after three transitions of the jumper setting (short-to-open or open-to-short). After the third transition, the device returns to factor default except for the Bluetooth name. The other three jumpers, JP2-JP4, only sample in the first 500 ms of operation to allow the pins that they tie to on the RN-42 module to serve a separate purpose later in the modules operation. JP2 enables pairing with a special device class defined by the user in software. This may be used so that the PmodBT2 operates as a substitute for an RS232 cable. JP3 enables auto connect to a stored address defined by the user. Finally, JP4 chooses whether to operate at the stored baudThe PmodBT2.∙ Bluetooth 2.1/2.0/1.2/1.0 compatible∙ Add wireless capability with this low power, Class 2Bluetooth radio∙ Supports HID profile for making accessories such aspointing devices, etc.∙ Secure communications, 128-bit encryption∙ Supports Bluetooth data link to iPhone/iPad/iPod Touch ∙ Six different modes∙ Small PCB size for flexible designs 1.5“ × 0.8” (3.8 cm × 2.0cm)∙ 12-pin Pmod port with UART interfaceFeatures include:rate (115.2kbps default) or a baud rate of 9600 regardless of the software selected rate when shorted. For more detailed information on jumper settings and functionality, refer to the RN-42 user manual.Jumper DescriptionJP1 (PIO4) Factory DefaultJP2 (PIO3) Auto Discovery/PairingJP3 (PIO6) Auto ConnectJP4 (PIO7) Baud Rate Setting (9600)Table 1. Set jumper description.Figure 1. PmodBT2 block diagram.1.2 UART InterfaceBy default, the UART interface uses a baud rate of 115.2 kbps, 8 data bits, no parity, and a single stop bit. The startup baud rate may be customized to predefined rates or set to a specific user customized baud rate. Predefined baud rates range from 1200 to 921k.The reset pin (RST) on J1 is active low. If the RST pin is toggled, the device will undergo a hard reset. This hard reset performs similarly to a power cycling of the device. The second interface besides the standard UART signals is the STATUS pin also on J1The STATUS pin directly reflects the connection status of the device. STATUS is driven high by the device when connected and is driven low otherwise.For more information on the devices UART interface and RST and STATUS pins refer to the RN-42 user manual on the Roving Networks website.1.3 Command ModeIn order to enter the command mode, the PmodBT2 must receive "$$$" to which it will respond "CMD". When in command mode, the module will respond to a large number of commands allowing the user to customizing the module for specific applications. In order to exit command mode, send "---<cr>" (three minus signs in a row and where <cr> stands for the carriage return character) to which the device will respond "END". Remote configuration, or configuration over a Bluetooth connection, is possible through the command mode but has several restrictions. The configure time, which defaults to 60 sec, defines the time window in which the PmodBT2 may be configured remotely. Outside of this time, the PmodBT2 will not respond to any remote commands. It is important to note that any of the "set" commands available for the PmodBT2 must be followed by a power cycle to take effect in any design.Connector J1 – UART CommunicationsPin Signal Description1 RTS Ready to Send2 RX Receive3 TX Transmit4 CTS Clear to Send5 GND Power Supply Ground6 VCC Power Supply (3.3V)7 STATUS Connection Status8 ~RST Reset9 NC Not Connected10 NC Not Connected11 GND Power Supply Ground12 VCC Power Supply (3.3V)Connector J2 – SPI Connector (Firmware Update Only)1 MISO Master in/ Slave out2 MOSI Master out/ Slave in3 SCK Serial Clock4 ~CS Chip Select5 VCC Power Supply (3.3V)6 GND Power Supply GroundTable 2. Connector descriptions.The various modes of operation are accessed by using the "SM,<5,4,3,2,1,0>" command while in command mode. The PmodBT2 can be put into one of six available modes of operation. The modes in order, 0 to 5, are: slave, master, trigger master, auto-connect, auto-connect DTR, and auto-connect ANY. For more detailed information on the different modes of operation, refer to the RN-42 user manual. For the full list of device commands, how to use remote configuration, and more detailed information on the different modes of operation, see the RN-42 data.。

BF1207中文资料

Rev. 01 — 28 July 2005
2 of 22
Philips Semiconductors
BF1207
Dual N-channel dual gate MOSFET
3. Ordering information
Table 3: Ordering information Package Name BF1207 Description plastic surface mounted package; 6 leads Version SOT363 Type number
Table 5: Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol VDS ID IG1 IG2 Ptot Tstg Tj
[1]
Parameter drain-source voltage drain current gate1 current gate2 current total power dissipation storage temperature junction temperature
[1]
[1]
Min 25 26 -
Typ 30 31 2.2 1.9 20 1.3 1.4
Max Unit 6 30 180 40 41 2.7 2.4 V mA mW mS mS pF pF fF dB dB
100 100 -
105 103 -
150
dBµV dBµV °C
junction temperature
© Koninklijke Philips Electronics N.V. 2005. All rights reserved.

Peavey P1BT P2BT 耐用蓝牙扬声器说明书

Features and specifications are subject to change without notice.Peavey Electronics Corporation • 711 A Street • Meridian, MS 39301(601) 483-5365 • FAX (601) 486-1278 • © 2015EX000030FCC/ICES Compliancy StatementThis device complies with Part 15 of the FCC rules and Industry Canada license-exempt RSS Standard(s). Operation is subject to the following two conditions: (1) this device may not cause harmful interference, and (2) this device must accept any interference received, that may cause undesired operation.Le présent appareil est conforme aux CNR d’lndustrie Canada applicables aux appareils radio exempts de licence. L’exploitation est autorisée aux deux conditions suivantes: (1) I’appareil ne doit pas produire de brouillage, et (2) I’utilisateur de I’appareil doit accepter tout brouillage radioélectrique subi, même si le brouillage est susceptible d’en compromettre le fonctionnement.Warning: Changes or modifications to the equipment not approved by Peavey Electronics Corp. can void the user’s authority to use the equipment.Note – This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to Part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates, uses, and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try and correct the interference by one or more of the following measures.• Reorient or relocate the receiving antenna.• Increase the separation between the equipment and receiver.• Connect the equipment into an outlet on a circuit different from that to which the receiver is con-nected.• Consult the dealer or an experienced radio/TV technician for help.CautionThe equipment complies with FCC radiation exposure limits set forth for an uncontrolled envi-ronment.FCC Radiation Exposure StatementThis equipment complied with FCC radiation exposure limits set forth for an uncontrolled environment. This equipment should be installed and operated with minimum distance 20cm between the radiator & your body.IC Radiation Exposure StatementThis equipment complies with IC radiation exposure limits set forth for an uncontrolled environment. The an-tenna should be installed and operated with minimum distance of 20 cm between the radiator and your body. This transmitter must not be co-located or operating in conjunction with any other antenna or transmitter.Cet appareil est conforme aux limites d'exposition aux rayonnements de la IC pour un environnement non contrôlé. L'antenne doit être installé de façon à garder une distance minimale de 20 centimètres entre la source de rayonnements et votre corps. L'émetteur ne doit pas être colocalisé ni fonctionner conjointement avec à autre antenne ou autre émetteur.• Bluetooth stereo linking• Bluetooth audio input for streaming music from any Bluetooth device • 3 Channel mixer• 2 XLR mic inputs and 1/4" Line Inputs • RCA/3.5 mm Stereo input channel• P1BT and P2BT have 180 W atts and 200 W atts maximum power respectively.Description:The P Series BT is a compact, powerful, lightweight and low profile portable speaker system. Utilizing 180/200/260 watts of potential maximum power, the units contain custom designed high frequency and woofer drivers. The P Series is extremely easy to carry: an entire PA system that can be moved by one person in one trip.The onboard mixer features 2 XLR and 1/4" inputs, two additional media channels feature stereo RCA/3.5mm inputs and streaming audio Bluetooth in. Units also have ability to link with other P Series units for stereo operation. Perfect for church, convention, DJ or club applications, the P Series offers the best-in-class feature-to-value and performance in the industry.P1BT/P2BTColumn Powered Speaker SystemsCongratulations on purchasing the Peavey P1BT/P2BT Powered Speaker System. These compact, portable and powerful systems are a perfect solution for the weekend warrior, singer songwriter or DJ. With a simple and intuitive layout, the P Series BT is a great plug and play option.Installation Note:This unit must have the following clearances from any combustible surface: top: 8", sides: 12", back: 12"• P1BT 2x6.5" W oofers with 1" (25mm) high-fre-quency compression driver•P2BT 3x6.5" W oofers with 1" (25mm) high-fre-quency compression driver(2) Line Input (Ch 1&2)or similar device.(5) Level Control(6) Low EQ (Bass)(7) High EQ (Treble)(8) Master Volume(9)Power LED(10) Sync XLR In/Out(11) Subwoofer Out(12) Bluetooth PairingUse this button to link your Bluetooth source (phone, tablet, etc...) to the speaker. See Bluetooth operation below.(13) Bluetooth Stereo LinkUse this button to link your speaker to second P1/2BT speaker. See Bluetooth operation below.Bluetooth Operation:Pairing: To pair your bluetooth source to the speaker, use the following steps:1. Press mode button on the back of the speaker to make the speaker discoverable. The pairing LED should start blinking.2. Go to your devices bluetooth screen and select the available Peavey speaker. Once paired,the pairing LED should light continuously.Stereo Linking: To link two compatible P1/2BT speakers, use the following steps:1. First, use the previous steps to pair your Bluetooth device to the first speaker.2. Press Pairing on the second speaker to turn the Bluetooth on.3. Press Stereo Link button on both speakers. Once the connection has been made, the StereoLink LED 's on both speakers should be on continuously.4. To disconnect, press the Stereo Link button again on either speaker.(14) Power Switch(15) AC Power InletThis is the receptacle for an IEC line cord, which provides AC power to the unit. Connect the line cord to this connector to provide power to the unit. Damage to the equipment may result if improper line voltage is used. (See line voltage marking on unit).(16) FUSETo replace the fuse, be sure to remove the IEC power cord from the IEC socket. The fuse holder tray is located beneath the IEC socket cavity. Pry the fuse holder tray out with a small flat blade screwdriver placed under the center of the top edge of the fuse tray, and gently lever the fuse tray out. The fuse is held in a clip in the fuse tray, and should be removed and replaced with a fresh 5 X 20mm 250V type fuse of the appropriate current rating. A spare fuse should be located in a hollow compartment in the fuse tray, below and behind the clip, this would be the one that is NOT clipped into the fuse tray clips.Then, once the fresh fuse has been put in place, re-insert the fuse tray into the IEC connector assembly, and make sure it is fully seated and flush with the outside of the IEC connector assembly.It is recommended that to assure future convenience of having a spare, that a spare fuse be obtained and placed in the hollow compartment at the earliest convenient time.Connections 2 - XLR input jacks (Ch 1&2)2 - 1/4" (6.35mm) TRS input jacks (Ch 1&2)1 - 1/8" (3.5mm) TRS/stereo input (Ch 3)1 - RCA input (Ch 3)(In/Out)L RSYNC-X21 - 1/4" (6.35mm) TRS (Subwoofer Output)19kHz60-Frequency Response P1BT19kHzP2BT-50Peak Power P1BT 180 Watts (150W LF/30W HF)HF)(130WL F/70WWattsP2BT200L(1W/1M)98dBSPMax Output SPL P1BTL(1W/1M)P2BT102dBSPBluetooth v5 A2DP streaming, stereo linking with a second P1/2BT speaker Woofer P1BT 2 x 6.5" (165mm) Woofer(165mm)Woofer6.5"x3P2BTTweeter P1BT 1" (25mm) high-frequency compression drivercompressiondriverhigh-frequencyP2BT(25mm)1"(7kgs)15.4lbsWeight P1BT(15kgs)33lbsP2BTDimensions (length x width x height) P1BT 23" x 9.25" x 10.5" (584mm x 235mm x 267mm)P2BT 30" x 9.25" x 10.5" (762mm x 235mm x 267mm)230V AC/50HzPower Supply 120V AC/60HzorLogo referenced in Directive 2002/96/EC Annex IV (OJ(L)37/38,13.02.03 and defined in EN 50419: 2005The bar is the symbol for marking of new waste and is applied only to equipment manufactured afterWarranty registration and information for U.S. customers available online at/warranty or use the QR tag belowFeatures and speci cations subject to change without notice.Peavey Electronics Corporation 5022 Hartley Peavey Drive Meridian, MS 39305 (601) 483-5365 FAX (601) 486-1278。

NCP1207中文规格

发NCP1207电流模式PWMController for Free Running 准谐振 NCP1207集成了电流型PWM 控制和退磁检测电路，在大范围的负载和输入电压变化情况下，确保谷电压开关（准谐振方式）和borderline/critical 传导模式。

器件内部的“跳过周期”功能会在轻载时提高效率和降低空载功耗，突发模式时电路中峰值电流已经很小，所以不会产生音频范围内的噪声。

器件内的8uS 计时器，限制了开关频率不高于100KHz （低于CISPR −22 EMI 中的150KHz 限制）。

器件的“动态自给（DSS ）”功能简化电路设计，可以取消变压器的辅助绕组供电，这个特点特别适用于电源输出电压大范围变化的场合，如电池充电器。

由于采用了HV 设计，器件直接连接到高压直流母线。

退磁检测电路通过一个辅助绕组检测变压器磁芯是否复位，同时这个引脚还具备快速过压保护（OVP ）功能，一旦退磁检测引脚检测到的电压达到OVP 门限，器件进入闭锁状态。

连续监测反馈信号和过流故障保护（OCP ）功能，使最终设计出来的产品更可靠。

器件特性 z borderline/critical 准谐振模式 z 电流型自动跳过周期模式 z 可取消辅助绕组供电 z （折返型）自动电流限（OCP ） z 过压锁死（OVP ） z 外部锁存触发。

例如外加过热保护电路 z 500mA 源/沉输出驱动能力 z 内部1mS 软启动 z 内部最小8uS 导通时间 z 可调节进入突发模式功率水平 z 集成过热保护 z 光耦合器直接连接 z SPICE 仿真模型用于瞬态分析 z 可选无铅封装典型应用 z笔记本电脑等AC/DC 适配器z 离线电池充电器 z 消费类电子设备（DVD 、机顶盒、电视机等）图一典型应用引脚说明引脚号引脚名称功能描述退磁检测与OVP 检测反激电源中一个辅助绕组上的电压确定变压器是否1 Demag复位，过压保护门限7.2V。

启英泰伦语音AI平台高性能语音识别模块数据手册 CI-D0XGS07J-BT说明书

文档会不定期更新，获取最新文档请至启英泰伦语音AI平台（)下载。

高性能语音识别模块数据手册CI-D0XGS07J-BT版本号：V1.1模块介绍概述本模块是针对低成本离线语音应用方案开发的一款通用、便携、低功耗高性能的语音识别模块，型号包括为：CI-D02GS07J-BT 和CI-D03GS07J-BT，两个型号管脚完全兼容，区别为主芯片型号不同，CI-D02GS07J-BT主芯片为CI1302，CI-D03GS07J-BT主芯片为CI1303。

CI-D03GS07J-BT中的主芯片CI1303比CI-D02GS07J-BT中的主芯片CI1302多2MB的Flash，可以实现更多命令词和算法功能。

图1 模块框图表1 模块选型表模块选型本地命令词300条以内本地命令词500条带插口单麦离线语音蓝牙模块CI-D02GS07J-BTCI-D03GS07J-BT该模块具有以下特点：模块体积小巧，长宽为37mm×40mm ，工作电压为 5.0V-5.5V ，一颗蓝牙5.0芯片和一颗音频功放芯片，带一路麦克风、一路喇叭和一路5V 电源及UART 的接口，此UART 接口也为5V 电平。

模块插入麦克风和喇叭直接供电即可使用，也可以直接通过接插件将UART 连接到产品主控板，由产品主控板的5V 电源进行供电，UART 通信或GPIO 控制，无需焊接。

模块包含2*3.5mm 螺丝孔，方便固定及安装。

模块主芯片支持离线神经网络计算，支持单麦克风降噪增强，单麦克风回声消除，360度全方位拾音，可抑制环境噪音，保证嘈杂环境中语音识别的准确性。

使用本模块进行离线语音识别不依赖网络，时延小，性能高，可实现97%以上的高识别率，10米超远距离识别，响应时间最快达到0.2S 。

模块可以应用于有能耗等级要求的产品和电池供电类产品中，运行功耗≤0.5W 。

模块带有一颗低功耗蓝牙芯片，兼容蓝牙5.0协议。

用户可通过手机等多媒体终端连接蓝牙播歌、接听电话和微信小程序控制等。

NCP1207B资料

©Ă Semiconductor Components Industries, LLC, 2007
1
August, 2007 - Rev. 1
Publication Order Number: NCP1207B/D
元器件交易网
Universal Network
NCP1207B
FB 2 CS 3
6 VCC
Features
•ăFree-Running Borderline/Critical Mode Quasi-Resonant Operation
GND 4
5 Drv
•ăCurrent-Mode with Adjustable Skip-Cycle Capability
•ăNo Auxiliary Winding VCC Operation
ORDERING INFORMATION
•ăAuto-Recovery Overcurrent Protection •ăLatching Overvoltage Protection •ăExternal Latch Triggering, e.g. Via Overtemperature Signal
VCC
PON
++
12 V, 10 V, 5.3 V (fault)
VUVLO
1.5 ms Delay
+ +
OVP
Demag
+ 5.0 V
/1.44
-+
4.5 ms Blanking
SQ S* R* R Q
+
+ 50 mV
Resd
Rint 10 V
Driver: src = 20 VCC sink = 10

西门子 S7-1200 功能安全手册 - 设备手册说明书

人身安全的提示用一个警告三角表示，仅与财产损失有关的提示不带警告三角。

警告提示根据危险等级由高到低如下表示。

危险表示如果不采取相应的小心措施，将会导致死亡或者严重的人身伤害。

警告表示如果不采取相应的小心措施，可能导致死亡或者严重的人身伤害。

小心表示如果不采取相应的小心措施，可能导致轻微的人身伤害。

注意表示如果不采取相应的小心措施，可能导致财产损失。

当出现多个危险等级的情况下，每次总是使用最高等级的警告提示。

如果在某个警告提示中带有警告可能导致人身伤害的警告三角，则可能在该警告提示中另外还附带有可能导致财产损失的警告。

合格的专业人员本文件所属的产品/系统只允许由符合各项工作要求的合格人员进行操作。

其操作必须遵照各自附带的文件说明，特别是其中的安全及警告提示。

由于具备相关培训及经验，合格人员可以察觉本产品/系统的风险，并避免可能的危险。

按规定使用 Siemens 产品请注意下列说明：警告Siemens 产品只允许用于目录和相关技术文件中规定的使用情况。

如果要使用其他公司的产品和组件，必须得到 Siemens 推荐和允许。

正确的运输、储存、组装、装配、安装、调试、操作和维护是产品安全、正常运行的前提。

必须保证允许的环境条件。

必须注意相关文件中的提示。

商标所有带有标记符号 ® 的都是 Siemens AG 的注册商标。

本印刷品中的其他符号可能是一些其他商标。

若第三方出于自身目的使用这些商标，将侵害其所有者的权利。

责任免除我们已对印刷品中所述内容与硬件和软件的一致性作过检查。

然而不排除存在偏差的可能性，因此我们不保证印刷品中所述内容与硬件和软件完全一致。

7MBR10SA120中文资料

I2t
(Non-Repetitive)
Operating junction temperature
Storage temperature
Isolation between terminal and copper base *2
voltage between thermistor and others *3
Item
Symbol
Condition
Inverter
Zero gate voltage collector current Gate-Emitter leakage current Gate-Emitter threshold voltage Collector-Emitter saturation voltage
Item Collector-Emitter voltage Gate-Emitter voltage
Collector current
Symbol VCES VGES IC
ICP
Inverter
Collector power dissipation Collector-Emitter voltage Gate-Emitter voltage Collector current
2.3
V
2.35
3.2
0.35 µs
1.0 mA
0.2 µA
2.1
V
2.2
2.6
0.35
1.2 µs
0.25
0.6
0.45
1.0
0.08
0.3
1.0 mA
1.1
V
1.2
1.5
1.0 mA
5000
Ω
465

BT153B-1200T-A 自动洗车机器人电源模块说明书

BT153B-1200T-AAutomotive Grade SCRRev.01 - 25 July 2019Product data sheet1. General description2. Features and benefits• High junction operating temperature capability (T j(max) = 150 °C)• AEC-Q101 compliant• Planar passivated for voltage ruggedness and reliability • High voltage capacity• Very high current surge capability • Surface mountable package3. Applications• Automotive battery charger, On Board Charger & Off Board Charger • DC motor control • Power converter• Solid State Relay (SSR)• Uninterruptible Power Supply (UPS)4. Quick reference dataPlanar passivated Silicon Controlled Rectifier (SCR) in a TO-263 surface mountable plastic package intended for use in applications requiring very high inrush current capability and high bidirectional blocking voltage capability. This product is qualified toAEC-Q101 standard for use in automotive applications.RoHS5. Pinning information6. Ordering information7. Marking8. Limiting valuesTable 5. Limiting values-5005010015001224364860T mb (°C)I T(RMS)(A)clfh4-001119°C10-210-111045495357616569surge duration (s)I T(RMS)(A)clfh4-002Fig. 1. RMS on-state current as a function of mounting base temperature; maximum values f = 50 Hz; T mb = 119 °C Fig. 2. RMS on-state current as a function of surgeduration; maximum values9. Thermal characteristics10. Characteristics-500501001500123T j (°C)clfh4-009I LI L (25°C)-500501001500123T j (°C)clfh4-010I HI H (25°C)00.51 1.521632486480V T (V)I T(A)clfh4-010(1)(3)(2)-500501001500.40.81.21.6T j (°C)clfh4-012V GTV GT (25°C)Fig. 9. Normalized latching current as a function of junction temperatureV o = 1.039 V; R s = 0.0089 Ω(1) T j = 150 °C; typical values (2) T j = 150 °C; maximum values (3) T j = 25 °C; maximum valuesFig. 11. On-state current as a function of on-state voltageFig. 12. Normalized gate trigger voltage as a function of junction temperatureFig. 10. Normalized holding current as a function of junction temperature11. Package outline12. Legal informationData sheet status[1lease consult the most recently issued document before initiating or completing a design.[2]The term 'short data sheet' is explained in section "Definitions".[3]The product status of device(s) described in this document may havechanged since this document was published and may differ in case ofmultiple devices. The latest product status information is available onthe Internet at URL .DefinitionsDraft — The document is a draft version only. The content is still under internal review and subject to formal approval, which may result in modifications or additions. WeEn Semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information.Short data sheet — A short data sheet is an extract from a full data sheet with the same product type number(s) and title. A short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. For detailed and full information see the relevant full data sheet, which is available on request via the local WeEn Semiconductors sales office. In case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail.Product specification — The information and data provided in a Product data sheet shall define the specification of the product as agreed between WeEn Semiconductors and its customer, unless WeEn Semiconductors and customer have explicitly agreed otherwise in writing. In no event however, shall an agreement be valid in which the WeEn Semiconductors productis deemed to offer functions and qualities beyond those described in the Product data sheet.DisclaimersLimited warranty and liability — Information in this document is believedto be accurate and reliable. However, WeEn Semiconductors does notgive any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. WeEn Semiconductors takes no responsibility for the content in this document if provided by an information source outside of WeEn Semiconductors.In no event shall WeEn Semiconductors be liable for any indirect, incidental, punitive, special or consequential damages (including - without limitation -lost profits, lost savings, business interruption, costs related to the removal or replacement of any products or rework charges) whether or not such damages are based on tort (including negligence), warranty, breach of contract or any other legal theory.Notwithstanding any damages that customer might incur for any reason whatsoever, WeEn Semiconductors’ aggregate and cumulative liability towards customer for the products described herein shall be limited in accordance with the Terms and conditions of commercial sale of WeEn Semiconductors.Right to make changes — WeEn Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof.Suitability for use — WeEn Semiconductors products are not designed, authorized or warranted to be suitable for use in life support, life-criticalor safety-critical systems or equipment, nor in applications where failureor malfunction of an WeEn Semiconductors product can reasonablybe expected to result in personal injury, death or severe property or environmental damage. WeEn Semiconductors and its suppliers accept no liability for inclusion and/or use of WeEn Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer’s own risk.Quick reference data — The Quick reference data is an extract of the product data given in the Limiting values and Characteristics sections of this document, and as such is not complete, exhaustive or legally binding. Applications — Applications that are described herein for any of these products are for illustrative purposes only. WeEn Semiconductors makesno representation or warranty that such applications will be suitable for the specified use without further testing or modification.Customers are responsible for the design and operation of their applications and products using WeEn Semiconductors products, and WeEn Semiconductors accepts no liability for any assistance with applications or customer product design. It is customer’s sole responsibility to determine whether the WeEn Semiconductors product is suitable and fit for the customer’s applications and products planned, as well as for the planned application and use of customer’s third party customer(s). Customers should provide appropriate design and operating safeguards to minimize the risks associated with their applications and products.WeEn Semiconductors does not accept any liability related to any default, damage, costs or problem which is based on any weakness or defaultin the customer’s applications or products, or the application or use by customer’s third party customer(s). Customer is responsible for doing all necessary testing for the customer’s applications and products using WeEn Semiconductors products in order to avoid a default of the applicationsand the products or of the application or use by customer’s third party customer(s). WeEn does not accept any liability in this respect.Limiting values — Stress above one or more limiting values (as defined in the Absolute Maximum Ratings System of IEC 60134) will cause permanent damage to the device. Limiting values are stress ratings only and (proper) operation of the device at these or any other conditions above thosegiven in the Recommended operating conditions section (if present) or the Characteristics sections of this document is not warranted. Constant or repeated exposure to limiting values will permanently and irreversibly affect the quality and reliability of the device.No offer to sell or license — Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.Export control — This document as well as the item(s) described herein may be subject to export control regulations. Export might require a prior authorization from competent authorities.Non-automotive qualified products — Unless this data sheet expressly states that this specific WeEn Semiconductors product is automotive qualified, the product is not suitable for automotive use. It is neither qualified nor tested in accordance with automotive testing or application requirements. WeEn Semiconductors accepts no liability for inclusion and/or use of non-automotive qualified products in automotive equipment or applications.In the event that customer uses the product for design-in and use in automotive applications to automotive specifications and standards, customer (a) shall use the product without WeEn Semiconductors’ warranty of the product for such automotive applications, use and specifications, and (b) whenever customer uses the product for automotive applications beyond WeEn Semiconductors’ specifications such use shall be solely at customer’s own risk, and (c) customer fully indemnifies WeEn Semiconductors forany liability, damages or failed product claims resulting from customer design and use of the product for automotive applications beyond WeEn Semiconductors’ standard warranty and WeEn Semiconductors’ product specifications.]PTranslations — A non-English (translated) version of a document is for reference only. The English version shall prevail in case of any discrepancy between the translated and English versions.TrademarksNotice: All referenced brands, product names, service names and trademarks are the property of their respective owners.WeEn Semiconductors BT153B-1200T-AAutomotive Grade SCRBT153B-1200T-A Product data sheet All information provided in this document is subject to legal disclaimers.© WeEn Semiconductors Co.,Ltd.2019All rights reserved25 July 201911 / 1113. Contents1. General description (1)2. Features and benefits (1)3. Applications (1)4. Quick reference data (1)5. Pinning information (2)6. Ordering information (2)7. Marking (2)8. Limiting values (3)9. Thermal characteristics (5)10. Characteristics (6)11. Package outline (8)12. Legal information (9)13. Contents (11)© WeEn Semiconductors Co., Ltd. 2019. All rights reservedFor more information, please visit: Forsalesofficeaddresses,pleasesendanemailto:**************************** Date of release: 25 July 2019。

Rolls BT287 蓝牙音频适配器说明书

BT287 Bluetooth Audio Adapter with switch Connection guideRolls Corporation Salt Lake City, UT1/20What's in the box?1 - Made in USA BT2871 - 15V power supply PN PS27s1 - This owners manualSPECIFICATIONS:Output Impedance: 1K Ohm RCAPower Requirements: 15 VDC, 500 mA;Rolls part number PS27s Size: 3.75” x 3.25” x 1.5”Weight:1 lb.DESCRIPTION:To pair a device to the BT287 simply find the BT287 (ROLLSBT) on your device and connect. After the device is connected to the BT287 a steady blue led will light indicating that the BT287 is paired to a device, but no audio is present. A slow blinking blue light indicates that audio is being sent when paired.When powered off the BT287 will remem -ber the device it was previously paired with. On power up will search for that device and reconnect to it.The DB287 has a Bluetooth operating range of 15 to 40 feet depending on how and where it is installed.The Rolls BT287 is a Bluetooth interface that will supply stereo or mono audio to a sound system. It also features a 400 watt contact closure relay for activation of the connected system. For example, if you have a sound system such as an old juke box and want to add Bluetooth capability to it. The BT287 will supply audio to the juke box as well as pro-vide a contact closure relay to turn the juke box on, controlling cabinet lights, amplifier and audio level remotely. When audio is sent to the BT287 the juke box will turn on automatically and start playing audio, when Bluetooth audio is not present the juke box will be powered off by the BT287. This way a homeowner or shop owner could have a piece of equipment (juke box) remotely controlled via laptop, phone, tablet or other digital Bluetooth device with the BT287.OPERATION:The BT287 should be installed by a knowledgeable sound installation professional that is familiar with electron-ic installations. Since hazardous voltages may be present on the control contacts, only people familiar with the hazards of such devices should attempt installation.。

US1207CS资料

ABSOLUTE MAXIMUM RATINGSInput Voltage (Vin) (12V)Enable Input Voltage (12V)Storage Temperature Range ................................ -65°C TO 150°COperating Junction Temperature Range ...................... 0°C TO 135°CUnless otherwise specified ,these specifications apply over ,Cin=Cout=10uF,Vin=Vo+1V, Vout=Vfb (for adjustable version only), and Ta=25 °C. Typical values refer to Ta=25 °C.Low duty cycle pulse testing are used which keeps junction and case temperatures equal to the ambient temperature.PARAMETER SYM TEST CONDITION MIN TYP MAX UNITS Reference Voltage Vo Io=10mA -1 1 % See T able 1 for typical values(Note 4) -2 2Line Regulation dVi Vo+1V<Vin<120.06 %/V Load Regulation (note 1)dVL10mA<Io<1A 0.7 %1mA<Io<150mA 0.5 % Output voltage T emp Coef.dVoT 20 100 ppm/°C Dropout Voltage (note 2)dVio Io=100mA (Note 4)100 200 mVIo=500mA (Note 4)300 400 mVIo=1000mA (Note 4)500 650 mV Ground Current (Note 3)Iq Vin=Vo +1Io=100mA (Note 4) 3 mAIo=500mA (Note 4) 15 mAIo=1000mA (Note 4) 50 mA Current Limit Icl Vo=0V 1.1 A Minimum Input Voltage Vinmin 2.1 2.3 VUS1208,1209Adjust Pin Current Iadj Vin=2.5V,Vo=Vadj (Note 4) 0.1 uA Minimum Load Current Iomin 1mAPin DescRIPTIONSPIN DESCRIPTIONA resistor divider from this pin to the Vout pin and ground sets the output voltage.An open collector output that switches low when the output voltage drops about 4% below its expected regulated voltage.The output of the regulator .A minimum of 2.2uF capacitor must be connected from this pin to ground.Ground pin. This pin must be connected to the lowest poten-tial in the system & all other pins must be at higher potential with respect to this pin.Enable pin. A low signal or left open on this pin shuts down the output.This pin must be tied HI or to Vin for normal operation.The input pin of the regulator. Typically a large storagecapacitor is connected from this pin to ground to insure that the input voltage does not sag below the minimumdrop out voltage during the load transient response. This pin must al-ways be 0.6V higher than Vout in order for thedevice to regu-late properly.APPLICATION INFORMATIONStabilityThe US120X series of regulators require the use of an output capacitor as part of the frequency compensation in order to make the regulator stable. A minimum of 2.2uF capacitance and the ESR in the range of 0.5 to 2ohm insures the stability of the system.Table 1- Output voltage v.s. part numberNote 1 : Low duty cycle pulse testing with Kelvin con-nections are required in order to maintain accurate data.Note 2 : Drop-out voltage is defined as the minimum differential voltage between Vin and Vout required to main-tain regulation at Vout. It is measured when the output voltage drops 1% below its nominal 1207,1208SYM TEST CONDITION MINTYP MAX UNITS Ground Current-S.D Activated Iqsd Enable=0V0.01 1uA Enable pin input LO voltage Venl Regulator OFF (Note 4) 0.8 V Enable pin input HI voltage VenhRegulator ON (Note 4) 2V Enable pin input LO current Venl=0V to 0.8V (Note 4) 0.1 2 uA Enable pin input HI current Venh=2V to Vin (Note 4)100600uAUS1207,1209Flag Output Threshold Voltage Vthfg3.8 %VoFlag Output Hysterises Voltage Vhys Output Ramping Up 0.8 %Vo Flag Output Saturation VoltageVfsatIo=5mA 400 mV Io=500uA 230 mVNote 3 : Ground current is the the regulator quiescent current plus the pass transistor current. The total cur-rent from the supply is the sum of the load current plus the ground pin current.Note 4 : The specification applies for the junction tem-perature of 0 to +125°C.PIN SYMBOL AdjUS1208,1209 Flag US1208 VoutAll devices GNDAll devices EnableUS1207,1209 VinAll devicesTYPICAL APPLICATIONFigure 1- Typical application of US1206VoutVoutError Flag TYPICAL APPLICATIONFigure 1- Typical application of US1207to TO263(M) package.TYPICAL APPLICATIONFigure 2- Typical application of US1208 in 3.3V to 2.5V regulatorschematic apply only to TO263(M) package.VoutError FlagTYPICAL APPLICATIONFigure 2- Typical application of US1209 in 3.3V to 2.5V regulatorschematic apply only to TO263(M) package.Vout。