3014PW21F-N10-A-8AA-I07XX bin 1

APPROVAL SHEETAOT MODEL NAME ATW3014-01AOT PART NUMBER 3014PW21F-N10-A-8AA-I07XXCUSTOMER NAME General CustomerDATE 2010/AugustVERSION 1MAKER CUSTOMERPrepared Checked ApprovedAOT HeadquartersNo. 13, Gongye 5th. Road, Hsinchu Industrial Park, Hukou Shiang,Hsinchu Hsien 303, Taiwan, R.O.C.TEL: +886-3-597-6988 / FAX: +886-3-598-7392Revision NoteDate Revision Page Version2010-08-25 Initiate Document 1~15 1Package OutlineType Number: 3014PW21F-N10-A-8AA-I07XX Unit: mm, Tolerance: ± 0.2 mmLED chipCathodeItem MaterialsPackage Heat-Resistant PolymerEncapsulating Material Silicone (with phosphor)Electrode Ag Plating Copper Alloy•Single blue chip.•High brightness SMD.•Compact package outline (LxWxH) of 3.0 mm x 1.4 mm x 0.8 mm. •Compatible with reflow soldering.•Complies with RoHS Directive.Optical/Electronic Characteristics (Ta=25°C)Item Symbol Condition Value Unit Forward Voltage V F I F = 20 mA 2.6 ~ 3.6 V Luminous Flux ΦI F = 20mA 4.25 ~ 6.5 lm Reverse Current I R V R=5V ≤5µA* V F measurement allowance is ±0.05V* Dominant wavelength measurement allowance is ±1nm* Luminous intensity is NIST reading. Luminous intensity tolerance: ±7%Absolute Maximum Ratings (Ta=25°C)Item Symbol Maximum Value Unit Forward Current I30 mAFPeak Pulse Forward Current; (1kHz,1/10 duty cycle) I100 mAFPReverse Voltage. V5 VRLED Junction Temperature. T125 °CjOperating Temperature. T-30 ~ +85 °CoprStorage Temperature. T-40 ~ +100 °CstgPower Dissipation P105 mWDSoldering Temperature TReflow Soldering 260℃,10secsldGroup Definition of Forward VoltageRank ConditionV F (V) 1T a =25oC I F =20mA2.6 ~3.6Group Definition of Brightness*A shipment shall consist of the LEDs of a combination of different ranks of luminance intensity,wavelength and forward voltage. The percentage of each rank in the shipment shall be determined by AOT *The ranking information of LEDs can be found on the reel label.Rank Condition Luminuous Flux(lm)W425 4.25 ~ 4.50 W450 4.50 ~ 4.75 W475 4.75 ~ 5.00 W500 5.00 ~ 5.25 W525 5.25 ~ 5.50 W550 5.50 ~ 5.75 W575 5.75 ~ 6.00 W600 6.00 ~ 6.25 W625T a =25oC I F =20mA6.25 ~ 6.50Chromaticity coordinate groups are measured with an accuracy of ±0.01.Optical/Electronic CharacteristicsForward Current vs. Relative Luminosity Forward Current vs. Forward VoltageSpectrum Radiation Patterno10o30o20oRecommended Reflow Soldering ConditionsSurface Mounting ConditionIn automatic mounting of the SMD LEDs on printed circuit boards, any bending, expanding and pulling forces or shock against the SMD LEDs should be kept min. to prevent them from electrical failures and mechanical damages of the devices.Soldering Reflow-Soldering of the SMD LEDs should conform to the soldering condition in the individual specifications. -SMD LEDs are designed for Reflow Soldering.-In the reflow soldering, too high temperature and too large temperature gradient such as rapid heating/cooling may cause electrical & optical failures and damages of the devices.-AOT cannot guarantee the LEDs after they have been assembled using the solder dipping method. 1) Lead Solder2) Lead-free Solder3) Manual Soldering Conditions- Lead SolderMax. 300 o C for Max. 3sec, and only one time.- Lead-free SolderMax. 350 o C for Max. 3sec, and only one time.- There is possibility that the brightness of LEDs is decreased, which is influenced by heat or ambient atmosphere during reflow. It is recommended to use the nitrogen reflow method.- After LEDs have been soldered, repair should not be done. As repair is unavoidable, a double-head soldering iron should be used. It should be confirmed beforehand whether the characteristics of the LEDs will be damaged by repairing or not.- Reflow soldering should not be done more than two times.Taping and OrientationQuantity: 2,500 pcs/reelUnit:mmItem Standard Tolerance Item StandardTolerance W 8.00 +0.3 -0.1 P 2 2.00 ±0.05 E 1.75 ±0.10 t 0.25 ±0.02 F 3.50 ±0.05 A 0 1.53 ±0.10 D 0 1.50 ±0.10 B 0 3.20 ±0.10 D 1 1.00 ±0.25 K 0 1.00 ±0.10 P 04.00±0.10α α -+Reel Label DefinitionLBin(Vf/Iv/CIE) ：Vendor PN ：CD4WW3001-AA00 SN ：a : customer part numberb : forward voltage rangec : brightness ranged : CIE range e : min Vf f : max Vfg : min Ivh : max Ivnn : quantity of LEDAYMDxxxx –xxxx : A: AOT, Y: year, M: month, D: day, xxxx-xxx : serial No. SYMDxxxx: S: AOT factory , Y: year, M: month, D: day, xxxx : serial NoPN ： aLot No ：AYMDxxxx -xxx:Qty ：nn EABin(Vf/Iv/CIE) ：b-c-dVendor PN ：3014PW21F-N10-A-8AASN ：SYMDxxxxNo. Test ItemStandard TestTest Note Number ofMethod Conditions Damaged1 Steady State Operating Life Internal Ref. I F =20 mATa=25 oC 1000 hr 0/20 2 Thermal ShockJESD22-A106-A -40 oC ~ 85 oC Hold 30 min 84 cycles 0/20 3 High TemperatureStorage JESD22-A103-A Ta=125 oC 500 hr 0/20 4 Low TemperatureStorage Internal Ref. Ta=-40 o C 500 hr 0/20 5 High Temperature High Humidity JESD22-A101-B Ta=85 o C RH=85% 500 hr 0/20 6On-Off TestInternal Ref.2 sec ON - 2sec OFF100,000 cycles0/20Criteria for Judging Damage* U.S.L: Upper Standard Level * L.S.L: Lower Standard LevelCautions1. Storage ConditionsBefore opening the package:The LEDs should be kept at 30 or less and 90%RH or less. The LEDs should be used ℃within a year. When storing the LEDs, moisture proof packaging with absorbent material is recommended. After opening the package:The LEDs should be kept at 30 or less and 70%RH or less. The LEDs should ℃ be soldered within 168 hours (7days) after opening the package. If unused LEDs remain, they should be stored in moisture proof packages, such as sealed containers with packages of moisture absorbent material.Criteria for Judgement ItemSymbol Test ConditionsMin. Max. Forward Voltage V F I F =20mA - *U.S.L×1.1 Reverse Current I R V R =5V - *U.S.L×2.0 Luminous IntensityI VI F =20mA*L.S.L×0.7 -It is also recommended to return the LEDs to the original moisture proof bag and to reseal the moisture proof bag again.If the moisture absorbent material (silica gel) has faded away or the LEDs have exceeded the storage time, baking treatment should be performed using the following conditions.℃Baking treatment : more than 24 hours at 65 ± 5 .AOT LED electrodes are gold plated. The gold surface may be affected by environments which contain corrosive substances. Please avoid conditions which may cause the LED to corrode, tarnish or discolor. This corrosion or discoloration may cause difficulty during soldering operations; it is recommended that the User use the LEDs as soon as possible.2. Please avoid rapid transitions in ambient temperature especially in high humidity environmentwhere condensation can occur.3. Heat generation must be taken into design consideration when using the LED.4. It is recommended to have protection circuit. Over current might damage the devices or causewavelenth shift.5. Manual tip solder might cause damage to chips. It is recommended that the power of the ironshould be lower than 15W, with temperature control. The iron should be applied less than 5 seconds at 230~260 deg C (The device would be damaged in the reworking process if overheat overtime.)6. All equipment and machinery must be properly grounded. It is recommended to use a wristband oranti-electrostatic glove when handling the LED.7. Use IPA as a solvent for cleaning the LED. The other solvent may dissolve the LED package andthe silicon. Ultrasonic cleaning is not recommended.8. Damaged LED will show unusual characteristics such as remarkably high leaking current, turn-onvoltage becomes lower and the LED gets unlighted at low current.9. The encapsulated material of the LEDs is silicone. Therefore the LEDs have a soft surface on thetop of package. The pressure to the top surface will be influence to the reliability of the LEDs Precautions should be taken to avoid the strong pressure on the encapsulated part. So when using the chip mounter, the picking up nozzle that does not affect the silicone resin should be used.NOTE.All the information published is considered to be reliable. However, AOT does not assume any liability arising out of the application or use of any product described herein.AOT reserves the right to make changes at any time without notice to any products in order to improve reliability, function or design.AOT products are not authorized for use as critical components in life support devices or systems without the express written approval from the managing director of AOT.。