SSC-MBT61223中文资料

SSC-MBT722
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7. Outline Dimension
Package Outlines
6
5
4
Package Marking (Cathode)
Front View
1
2
3
Right View
Rear View
( Tolerance: ±0.2, Unit: mm )
4. Electro-Optical Characteristics
Parameter Forward Voltage (per die) Reverse Current (per die) Luminance Intensity *1 Luminance Flux Dominant Wavelength Peak Wavelength Spectral Bandwidth Viewing Angle *2 Optical Efficiency Symbol VF IR IV ΦV Condition IF =20 mA VR=5V IF =60 mA IF =60 mA IF =60 mA IF =60mA IF =60 mA IF =60 mA IF =60 mA Min 2.7 300 465 Typ 3.3 580 1.8 470 463 27 120 9 Max 4.0 10 860 477 -
2. Application ------------------------------------------------------------- 2 3. Absolute Maximum Ratings ------------------------------------------ 2 4. Electro-optical Characteristics ---------------------------------------- 3 5. Rank of MBT722 6. Soldering Profile 7. Outline Dimension 8. Packing ---------------------------------------------------------------------------------------4 6 6 ---------------------------------------------------- 5
SSC-QP-7-03-08(REV.00)
SEOUL SEMICONDUCTOR CO., LTD. 148-29 Kasan-Dong, Keumchun-Gu, Seoul, 153-023, Korea Phone : 82-2-2106-7305~6
SSC-MBT722
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260 240 220 200
180 150 ~
Pre-heating
Rising 5 °C/sec
Cooling -5 °C/sec
0 Time [Hr]
(2) Hand Soldering conditions
Do not exceed 4 seconds at maximum 315ºC under soldering iron.
Circuit Diagram Blue Anode
6
Recommended Solder Pad
Blue Anode
5
Blue Anode
4
B1
1
B2
2
B3
3
Blue Blue Blue Cathode Cathode Cathode
( Tolerance: ±0.2,
Unit: mm )
* MATERIALS PARTS Package Encapsulating Resin Electrodes MATERIALS Heat-Resistant Polymer Epoxy Resin Ag Plating Copper Alloy
(Ta=25ºC)
Unit V µA mcd lm nm nm nm deg lm/W
λd λP ∆λ
2 θ½
η
opt
*1 The luminous intensity IV was measured at the peak of the spatial pattern which may not be aligned with the mechanical axis of the LED package. Luminous Intensity Measurement allowance is ±10%. *2 2θ½ is the off-axis where the luminous intensity is 1/2 of the peak intensity. [Note] All measurements were made under the standardized environment of SSC.
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*Customer:
SPECIFICATION
ITEM MODEL TOP LED DEVICE SSC-MBT722
[Contents]
1. Features
------------------------------------------------------------- 2
SSC-QP-7-03-08(REV.00)
SEOUL SEMICONDUCTOR CO., LTD. 148-29 Kasan-Dong, Keumchun-Gu, Seoul, 153-023, Korea Phone : 82-2-2106-7305~6
SSC-MBT722
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8. Packing
Package Marking
( Tolerance: ±0.2,
Unit: mm )
(1) Quantity : 700pcs/Reel (2) Cumulative Tolerance : Cumulative Tolerance/10 pitches to be ±0.2mm (3) Adhesion Strength of Cover Tape : Adhesion strength to be 0.1-0.7N when the cover tape is turned off from the carrier tape at the angle of 10º to the carrier tape (4) Package : P/N, Manufacturing data Code No. and quantity to be indicated on a damp proof Package
SSC-MBT722
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1. Features
Pb-free Reflow Soldering application RoHS Compliant Material : InGaN Suitable for all SMT assembly methods ; Suitable for all soldering methods White colored SMT package and colorless clear window Encapsulating Resin : Epoxy Resin
5. Rank of MBT722
▣ Rank Name Table X1 Iv X2 λd X3 Vf
▣ Luminous Intensity [Iv] Rank Iv (mcd) Name MIN MAX N 300 400 O 400 510 P 510 650 Q 650 860 ▣ Dominant Wavelength [λd] Rank λd (nm) Name MIN MAX 465 469 A 469 473 B C 473 477 ▣ Forward Voltage Rank Name 1 2 3 Vf (V) MIN 2.7 3.1 3.6 MAX 3.1 3.6 4.0
SSC-QP-7-03-08(REV.00)
SEOUL SEMICONDUCTOR CO., LTD. 148-29 Kasan-Dong, Keumchun-Gu, Seoul, 153-023, Korea Phone : 82-2-2106-7305~6
SSC-MBT722
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CUSTOMER Checked by Approved by
SUPPLIER Drawn by Checked by Approved by
SSC-QP-7-03-08(REV.00)
SEOUL SEMICONDUCTOR CO., LTD. 148-29 Kasan-Dong, Keumchun-Gu, Seoul, 153-023, Korea Phone : 82-2-2106-7305~6
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9. Reel Packing Structure ------------------------------------------------- 7 10. Precaution for Use --------------------------------------------------- 8 11. Characteristic Diagram ---------------------------------------- 9
6.Soldering Profile (1) Reflow Soldering Conditions / Profile (Lead Free Solder)