PMEG4010EP,115;中文规格书,Datasheet资料

1. Product profile
1.1General description
Planar Maximum Efficiency General Application (MEGA) Schottky barrier rectifier with an
integrated guard ring for stress protection, encapsulated in a SOD128 small and flat lead Surface-Mounted Device (SMD) plastic package.
1.2Features and benefits
Average forward current: I F(AV)≤1A Reverse voltage: V R ≤40V Low forward voltage
High power capability due to clip-bond technology AEC-Q101 qualified
Small and flat lead SMD plastic package
1.3Applications
Low voltage rectification
High efficiency DC-to-DC conversion Switch Mode Power Supply (SMPS) Reverse polarity protection
Low power consumption applications
1.4Quick reference data
[1]
Device mounted on a ceramic Printed-Circuit Board (PCB), Al 2O 3, standard footprint.
PMEG4010EP
1 A low V F MEGA Schottky barrier rectifier
Rev. 02 — 15 April 2010
Product data sheet
Table 1.Quick reference data T j =25°C unless otherwise specified.Symbol Parameter
Conditions Min Typ Max Unit
I F(AV)
average forward current
square wave; δ=0.5; f =20kHz T amb ≤120°C [1]
--1A T sp ≤145°C
--1A V R reverse voltage --40V V F forward voltage I F =1A -430490mV I R
reverse current
V R =40V
-
10
50
μA
2. Pinning information
[1]The marking bar indicates the cathode.
3. Ordering information
4. Marking
5. Limiting values
Table 2.Pinning
Pin Description
Simplified outline Graphic symbol
1cathode [1]
2
anode
sym001
1
2
Table 3.Ordering information
Type number Package Name
Description
Version PMEG4010EP
-
plastic surface-mounted package; 2leads
SOD128
Table 4.Marking codes
Type number Marking code PMEG4010EP
AC
Table 5.Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).Symbol Parameter Conditions Min Max Unit V R reverse voltage T j =25°C -
40
V
I F(AV)
average forward current
square wave; δ=0.5; f =20kHz T amb ≤120°C [1]
-1A T sp ≤145°C
-1A I FSM non-repetitive peak forward current square wave; t p =8ms [2]-50A P tot
total power dissipation
T amb ≤25°C
[3][4]-625mW [3][5]-1050mW [3][1]
-
2100
mW
[1]Device mounted on a ceramic PCB, Al 2O 3, standard footprint.[2]T j =25°C prior to surge.
[3]Reflow soldering is the only recommended soldering method.
[4]Device mounted on an FR4PCB, single-sided copper, tin-plated and standard footprint.
[5]
Device mounted on an FR4PCB, single-sided copper, tin-plated, mounting pad for cathode 1cm 2.
6. Thermal characteristics
[1]For Schottky barrier diodes thermal runaway has to be considered, as in some applications the reverse power losses P R are a significant part of the total power losses.[2]Reflow soldering is the only recommended soldering method.
[3]Device mounted on an FR4PCB, single-sided copper, tin-plated and standard footprint.
[4]Device mounted on an FR4PCB, single-sided copper, tin-plated, mounting pad for cathode 1cm 2.[5]Device mounted on a ceramic PCB, Al 2O 3, standard footprint.[6]
Soldering point of cathode tab.
T j junction temperature -150°C T amb ambient temperature −55+150°C T stg
storage temperature
−65
+150
°C
Table 5.Limiting values …continued
In accordance with the Absolute Maximum Rating System (IEC 60134).Symbol Parameter
Conditions Min Max Unit Table 6.Thermal characteristics Symbol Parameter
Conditions Min Typ Max Unit R th(j-a)
thermal resistance from
junction to ambient
in free air
[1][2][3]--200K/W [4]--120K/W [5]
--60K/W R th(j-sp)
thermal resistance from junction to solder point
[6]
-
-
12
K/W
7. Characteristics
Table 7.Characteristics
T j=25°C unless otherwise specified.
Symbol Parameter Conditions Min Typ Max Unit
V F forward voltage I F=0.1A-310360mV
I F=1A-430490mV
I R reverse current V R=10V-313μA
V R=40V-1050μA
C d diode capacitance f=1MHz
V R=1V-130-pF
V R=10V-50-pF
8. Test information
The current ratings for the typical waveforms as shown in Figure 9, 10, 11 and 12 are calculated according to the equations:with I M defined as peak current, at DC, and with I RMS defined as RMS current.
8.1Quality information
This product has been qualified in accordance with the Automotive Electronics Council (AEC) standard Q101 - Stress test qualification for discrete semiconductors , and is suitable for use in automotive applications.
9. Package outline
I F AV ()I M δ×=I RMS I F AV ()=I RMS I M δ×=
10. Packing information
Table 8.Packing methods
The indicated -xxx are the last three digits of the 12NC ordering code.[1]
Type number Package Description Packing quantity
3000
PMEG4010EP SOD1284mm pitch, 12mm tape and reel-115
[1]For further information and the availability of packing methods, see Section14.
11. Soldering
分销商库存信息: NXP
PMEG4010EP,115。