LQFP,TQFP,QFP,CQFP封装尺寸表
LQFP,TQFP,QFP,CQFP封装尺寸表
D u m m y C o m p o n e n t sLQFPLow Profile Quad Flat PackLow Profile Quad Flat Pack (LQFP) packages provide the same benefit of the metric QFP packages, but are thinner (body thickness of 1.4mm) and have a standard lead-frame footprint (2.0mm lead footprint).LQFPs help to solve issues such as increasing board density, die shrink programs, thin end-product profile and portability. Lead counts range from 32 to 256. Body sizes range from 5 x 5mm to 28 x 28mm. Copper lead-frames are used for the LQFP package. Lead pitches available for LQFP package are 0.65mm, 0.5mm, 0.4mm.Notes* = Available as an ExposedPad™ L/TQFP Package by Amkor. TheExposedPad™ L/TQFP can increase heat dissipation by as much as 110% over a standard L/TQFP. The E xposedPad™ L/TQFP is a cost effective, high frequency leadframe solution to thermal management when the die attach pad is soldered to the PCB. All LQFPs are standard in trays.LQFPs have a body thickness of 1.4mm. Tray quantity may vary. Tape type is plastic.Moisture sensitivity is JEDEC level 3.Lead-free parts are available with SnCu, SnBi or 100% Sn finish.For recommended kits see pages58, 68, 71, 81, 73 and 70.Part Number System▪ Add “TR” to end of part number for Tape and Reel.▪ Add specific finish to end of part number for Lead-Free, i.e Sn or SnCu or SnBi.LQFP48–7mm–.5mm–2.0Low Profile Quad Flat PackNumber of Pins Lead PitchBody SizeLead FootprintLQFP Low Profile Quad Flat Pack 1.4mm ThickPart NumberNumber of Pins Body Size Lead Pitch Quantity Per Tray Tape Width Tape Pitch Quantity Per Reel AvailableLead-Free Finishes .4mm PitchLQFP64-7mm-.4mm-2.0647mm sq .4mm 25016mm 12mm 1,000Sn, SnCu or SnBi LQFP80-10mm-.4mm-2.08010mm sq .4mm 16024mm 24mm 1,000Sn, SnCu or SnBi LQFP120-14mm-.4mm-2.012014mm sq .4mm 9032mm 24mm 750Sn, SnCu or SnBi LQFP128-14mm-.4mm-2.012814mm sq .4mm 9032mm 24mm 750Sn, SnCu or SnBi LQFP176-20mm-.4mm-2.017620mm sq .4mm 6044mm 24mm 500Sn, SnCu or SnBi LQFP216-24mm-.4mm-2.021624mm sq .4mm 4044mm 32mm 500Sn, SnCu or SnBi LQFP256-28mm-.4mm-2.025628mm sq .4mm 2444mm 40mm 500Sn, SnCu or SnBi .5mm PitchLQFP48-7mm-.5mm-2.0487mm sq .5mm 25016mm 12mm 1,000Sn, SnCu or SnBi LQFP64-10mm-.5mm-2.06410mm sq .5mm 16024mm 24mm 1,000Sn, SnCu or SnBi LQFP80-12mm-.5mm-2.08012mm sq .5mm 9024mm 20/24mm 1,000Sn, SnCu or SnBi LQFP100-14mm-.5mm-2.010014mm sq .5mm 9032mm 24mm 750Sn, SnCu or SnBi LQFP128-14x20mm-.5mm-2.012814 x 20mm .5mm 7244mm 32mm 500Sn, SnCu or SnBi LQFP128-20mm-.5mm-2.012820mm sq .5mm 6044mm 24mm 500Sn, SnCu or SnBi LQFP144-20mm-.5mm-2.0*14420mm sq .5mm 6044mm 24mm 750Sn, SnCu or SnBi LQFP160-24mm-.5mm-2.016024mm sq .5mm 4044mm 32mm 500Sn, SnCu or SnBi LQFP176-24mm-.5mm-2.0*17624mm sq .5mm 4044mm 32mm 500Sn, SnCu or SnBi LQFP208-28mm-.5mm-2.0*20828mm sq .5mm 3644mm 40mm 500Sn, SnCu or SnBi .65mm PitchLQFP52-10mm-.65mm-2.05210mm sq .65mm 16024mm 24mm 1,000Sn, SnCu or SnBi LQFP80-14mm-.65mm-2.08014mm sq .65mm 9032mm 24mm 750Sn, SnCu or SnBi LQFP100-14x20mm-.65mm-2.010014x20mm .65mm 7244mm 32mm 500Sn, SnCu or SnBi .8mm PitchLQFP32-7mm-.8mm-2.0327mm sq .8mm 25016mm 12mm 1,000Sn, SnCu or SnBi LQFP44-10mm-.8mm-2.04410mm sq .8mm 16024mm 24mm 1,000Sn, SnCu or SnBi LQFP64-14mm-.8mm-2.06414mm sq.8mm9032mm24mm750Sn, SnCu or SnBiDaisy-Chain And Lead-Free Parts Available!For drawings, please visit our web site at .Dummy ComponentsTQFPThin Quad Flat PackThin Quad Flat Pack (TQFP) packages provide the same benefit of the metric QFP package, but are thinner (body thickness of 1.0mm) and have a standard lead-frame footprint (2.0mm lead footprint). TQFPs are help-ing to solve issues such as increasing board density, die shrink programs, thin end-product profile and portability. Lead counts range from 32 to 176. Body sizes range from 5 x 5mm to 20 x 20mm. Copper lead-frames are used for the TQFP package. Lead pitches available for TQFP package are 0.4mm, 0.5mm, 0.65mm 0.8mm and 1.0mm.Exposed Pad L/TQFP PackageTQFP PackageMold Die Up (Standard)Die AttachDie Down (Inverted)Notes* = Available as an Exposed Pad L/TQFP Package by Amkor. TheExposedPad™ L/TQFP can increase heat dissipation by as much as 110% over a standard L/TQFP. The E xposedPad™ L/TQFP is a cost effective, high frequency leadframe solution to thermal management when the die attach pad is soldered to the PCB.TQFP is available in die up configurations in 1.0mm thickness only. 5 x 5mm to 20 x 20mm body size (JEDEC Standard). 32 to 176 lead counts. Copper leadframes.1.0mm body thickness for TQFP. Moisture sensitivity is JEDEC level 3.Lead-free parts are available with SnCu, SnBi or 100% Sn finish.Part Number System▪ Add “ePad” to beginning of part number when orderingExposedPad™ package.▪ Add “TR” to end of part number for Tape and Reel.▪ Add “LF” to end of part number for Lead-Free.Mold Die Up (Standard)TQFP Thin Quad Flat Pack 1.0mm ThickPart NumberNumber of Pins Body SizeLead Pitch Footprint Quantity Per Tray Tape Width Tape Pitch Quantity Per Reel A-TQFP32-5mm-.5mm-2.0*325mm sq .5mm 2.0mm 36016mm 12mm 1,000A-TQFP32-7mm-.8mm-2.0*327mm sq .8mm 2.0mm 25016mm 12mm 1,000A-TQFP40-5mm-.4mm-2.0*405mm sq .4mm 2.0mm 36016mm 12mm 1,000A-TQFP44-10mm-.8mm-2.0*4410mm sq .8mm 2.0mm 16024mm 16mm 1,000A-TQFP48-7mm-.5mm-2.0 *487mm sq .5mm 2.0mm 25016mm 12mm 1,000A-TQFP52-10mm-.65mm-2.0 *5210mm sq .65mm 2.0mm 16024mm 16mm 1,000A-TQFP64-7mm-.4mm-2.0*647mm sq .4mm 2.0mm 25016mm 12mm 1,000A-TQFP64-10mm-.5mm-2.0*6410mm sq .5mm 2.0mm 16024mm 16mm 1,000A-TQFP64-14mm-.8mm-2.0 *6414mm sq .8mm 2.0mm 9032mm 24mm 750A-TQFP80-12mm-.5mm-2.0 *8012mm sq .5mm 2.0mm 11924mm 24mm 1,000A-TQFP80-14mm-.65mm-2.0*8014mm sq .65mm 2.0mm 9032mm 24mm 750A-TQFP100-14mm-.5mm-2.0*10014mm sq .5mm 2.0mm 9032mm 24mm 750A-TQFP120-14mm-.4mm-2.0 *12014mm sq .4mm 2.0mm 9032mm 24mm 750A-TQFP128-14mm-.4mm-2.0*12814mm sq .4mm 2.0mm 9032mm 24mm 750A-TQFP128-20mm-.5mm-2.0 *12820mm sq .5mm 2.0mm 6044mm 24mm 500A-TQFP144-20mm-.5mm-2.0 *14420mm sq .5mm 2.0mm 6044mm 24mm 500A-TQFP176-20mm-.4mm-2.0 *17620mm sq.4mm2.0mm6044mm24mm500A-TQFP32-5mm-.5mm-2.0Thin Quad Flat PackBody SizeLead FootprintNumber of PinsLead PitchAmkorD u m m y C o m p o n e n t sNotesAll QFPs are standard in JEDEC trays. Tray quantities may vary. Carrier tape is plastic.SnCu, SnBi or 100% Sn finish.QFPQuad Flat PackQuad Flat Pack (QFP) components have four sides with leads extend-ing from the component body on all four sides. QFP componentscome packaged in trays or on tape and reel to protect the component leads that can be easily damaged. An important measurement for QFPs is coplanarity. When the first lead from the component is placedPart Number System▪ Add “TR” to end of part number for Tape and Reel.▪ Add specific finish to end of part number for Lead-Free, i.e Sn, SnCu or SnBi.QFP44–10mm–.8mm–3.9mmQuadFlat PackNumber of Pins Lead Pitch Body SizeLead FootprintDaisy-Chain And Lead-Free Parts Available!QFP Plastic Quad Flat PackPart NumberNumber of Pins Body Size Body Thickness Lead Pitch Footprint Quantity Per Tray Tape Width Tape Pitch Quantity 13" Reel AvailableLead-Free Finishes .40mm PitchQFP256-28mm-.4mm-2.625628mm sq 3.37mm .40mm 2.6mm 244440200Sn, SnCu or SnBi .50mm PitchQFP64-10mm-.50mm-3.26410mm sq 2.0mm .50mm 3.2mm 962424500Sn, SnCu or SnBi QFP64-10mm-.50mm-3.96410mm sq 2.0mm.50mm 3.9mm 962424500Sn, SnCu or SnBi QFP100-14mm-.5mm-3.210014mm sq 2.0/2.67mm .50mm 3.2mm 843224350Sn, SnCu or SnBi QFP100-14mm-.5mm-3.910014mm sq 2.67mm .50mm 3.9mm 843224350Sn, SnCu or SnBi QFP128-14x20mm-.5mm-3.212814 x 20mm 2.71mm .50mm 3.2mm 664432200Sn, SnCu or SnBi QFP128-14x20mm-.5mm-3.912814 x 20mm 2.71mm .50mm 3.9mm 664432200Sn, SnCu or SnBi QFP208-28mm-.5mm-2.620828mm sq 3.37mm .50mm 2.6mm 244440200Sn, SnCu or SnBi QFP208-28mm-.5mm-3.220828mm sq 3.37mm .50mm 3.2mm 244440200Sn, SnCu or SnBi QFP240-32mm-.5mm-2.624032mm sq 3.4mm .50mm 2.6mm 245644250Sn, SnCu or SnBi QFP304-40mm-.5mm-2.630440mm sq 3.8mm .50mm 2.6mm 12n/a n/a —Sn, SnCu or SnBi .65mm PitchQFP52-10mm-.65mm-3.25210mm sq 2.0mm .65mm 3.2mm 962424500Sn, SnCu or SnBi QFP52-10mm-.65mm-3.95210mm sq 2.0mm.65mm 3.9mm 962424500Sn, SnCu or SnBi QFP80-14mm-.65mm-3.28014mm sq 2.0/2.67mm .65mm 3.2mm 843224350Sn, SnCu or SnBi QFP80-14mm-.65mm-3.98014mm sq 2.67mm .65mm 3.9mm 843224350Sn, SnCu or SnBi QFP100-14x20mm-.65mm-3.210014 x 20mm 2.71mm .65mm 3.2mm 664432200Sn, SnCu or SnBi QFP100-14x20mm-.65mm-3.910014 x 20mm 2.71mm .65mm 3.9mm 664432200Sn, SnCu or SnBi QFP144-28mm-.65mm-2.614428mm sq 3.37mm .65mm 2.6mm 244440200Sn, SnCu or SnBi QFP144-28mm-.65mm-3.214428mm sq 3.37mm .65mm 3.2mm 244440200Sn, SnCu or SnBi QFP160-28mm-.65mm-2.616028mm sq 3.37mm .65mm 2.6mm 244440200Sn, SnCu or SnBi QFP160-28mm-.65mm-3.216028mm sq 3.37mm .65mm 3.2mm 244440200Sn, SnCu or SnBi QFP160-28mm-.65mm-3.916028mm sq 3.37mm .65mm 3.9mm 244440200Sn, SnCu or SnBi .80mm PitchQFP44-10mm-.8mm-3.24410mm sq 2.0mm .80mm 3.2mm 962424500Sn, SnCu or SnBi QFP44-10mm-.8mm-3.94410mm sq 2.0mm.80mm 3.9mm 962424500Sn, SnCu or SnBi QFP64-14mm-.8mm-3.26414mm sq 2.0/2.67mm .80mm 3.2mm 843224350Sn, SnCu or SnBi QFP64-14mm-.8mm-3.96414mm sq 2.67mm .80mm 3.9mm 843224350Sn, SnCu or SnBi QFP80-14x20mm-.8mm-3.28014 x 20mm 2.71mm .80mm 3.2mm 664432200Sn, SnCu or SnBi QFP80-14x20mm-.8mm-3.98014 x 20mm 2.71mm .80mm 3.9mm 664432200Sn, SnCu or SnBi QFP120-28mm-.8mm-2.612028mm sq 3.37mm .80mm 2.6mm 244440200Sn, SnCu or SnBi QFP120-28mm-.8mm-3.212028mm sq 3.37mm .80mm 3.2mm 244440200Sn, SnCu or SnBi QFP128-28mm-.8mm-2.612828mm sq 3.37mm .80mm 2.6mm 244440200Sn, SnCu or SnBi QFP128-28mm-.8mm-3.212828mm sq 3.37mm .80mm 3.2mm 244440200Sn, SnCu or SnBi 1.00mm PitchQFP52-14mm-1.0mm-3.25214mm sq 2.0/2.67mm 1.00mm 3.2mm 843224350Sn, SnCu or SnBi QFP52-14mm-1.0mm-3.95214mm sq 2.67mm 1.00mm 3.9mm 843224350Sn, SnCu or SnBi QFP64-14x20mm-1.0mm-3.26414 x 20mm 2.71mm 1.00mm 3.2mm 664432200Sn, SnCu or SnBi QFP64-14x20mm-1.0mm-3.96414 x 20mm2.71mm1.00mm3.9mm664432200Sn, SnCu or SnBion the PCB coplanarity is established. Coplanarity ensures the last lead can be placed on the board. The standard for QFP coplanarity is ±4 mils. Lead-free versions of QFPs are now available. Please call for additional information.Dummy ComponentsCQFPCeramic Quad Flat PackCQFPs are hermetic packages consisting of true pieces of dry pressed ceramic surrounding a uniformed leadframe with tie bar attached. Lead counts for this package range from 14 to 304, with lead pitch rangingPart Number Systemeither metal or ceramic. Lids are attached after die attach. This allows for a hermetically sealed environment for the die.from 15.7mil to 50mils. Package leads are gold or Kovar finish and can be solder-coated by special request. Lids are optional for CQFPs, which are sealed over the package cavity at temperatures from 400° to 460° C.NotesCQFPs are available with or without combo lid. Pins are flat (sandwiched) with tie bar. Parts are packaged in non-JEDEC trays.Due to the custom nature of the package, body size and dimensions can change without notice.Parts available with a daisy-chain configuration upon request. Other ceramic packages available upon request. Glass or epoxy seal.Footprint compatible with plastic QFP packages. EIAJ and JEDEC standards.Lead-frames are embedded into the glass to create both internal die connection and external PCB connection.This surface mount package consists of a ceramic base that has metal-ized castellations/pads on the sides and bottom of the package. LCC packages have pads on all four sides of the package. Lids for LCCs can beCQFP Ceramic Quad Flat PackPart NumberNumber of Pins Body Size Pitch (Inch)(mm)52CQFP-19.0mm-1.27mm 52.750" sq 19.0mm sq 1.27mm 68CQFP-24.1mm-1.27mm 68.950" sq 24.1mm sq 1.27mm 84CQFP-16.5mm-.65mm 84.650" sq 16.5mm sq .65mm 100CQFP-19.0mm-.65mm 100.750" sq 19.0mm sq .65mm 132CQFP-24.1mm-.65mm 132.950" sq 24.1mm sq .65mm 144CQFP-26.6mm-.65mm 144 1.050" sq 26.6mm sq .65mm 172CQFP-29.2mm-.65mm 172 1.150" sq 29.2mm sq .65mm 196CQFP-32.0mm-.50mm1961.260" sq32.0mm sq.50mmNotesLCCs are available with or without combo lid.Gold castellations are standard, but can be solder-coated with 100% Sn or Sn/Cu alloy.Parts are packaged in non-JEDEC trays.upon request.LCC Leadless Ceramic CarrierPart NumberNumber of Castellations Body Size Pitch (Inch)(mm)16LCC-1.27mm-7.36x8.96mm 16.350" x .285"7.36 x 8.96mm 1.27mm 20LCC-1.27mm-8.90mm 20.350" sq 8.90mm sq 1.27mm 28LCC-1.27mm-11.5mm28.450" sq 11.50mm sq 1.27mm 32LCC-1.27mm-11.4x14.0mm 32.550" x .450"11.40 x 14.00mm 1.27mm 40LCC-1.00mm-10.1mm 40.400" sq 10.10mm sq 1.00mm 44LCC-1.27mm-16.5mm 44.650" sq 16.50mm sq 1.27mm 48LCC-1.00mm-14.2mm 48.560" sq 14.20mm sq 1.00mm 52LCC-1.27mm-19.0mm 52.750" sq 19.00mm sq 1.27mm 68LCC-1.27mm-24.11mm 68.950" sq 24.11mm sq 1.27mm 84LCC-1.27mm-29.2mm841.150" sq29.20mm sq1.27mmLCCLeadless Ceramic Carrier52CQFP–19.0mm–1.27mmI/O CountBody SizeLead PitchCeramic Quad Flat Pack20LCC–1.27mm–8.90mm Number of CastellationsPitch Body SizeLeadless Ceramic CarrierFor recommended kits see pages 71 and 55.。
常用元器件封装标准尺寸
常用元器件封装标准尺寸王永建整理尺寸中的计量单位 mil / 40 ＝ mmDIP 双列封装QFP 四方扁平封装引脚数宽度 mil 引脚数宽度8,14,16,18,20 300 44,48 10*10mm22 400 5214*14mm 24,28,32,40,42,48600 64,80,100,12814*20mm 28,32,40(陶瓷）600 144,160,20828*28mm SKDIP 小双列封装SOP 小外形封装引脚数宽度 mil 引脚数宽度 mil22,24,28,32 300 8,14 15016,14,16,18,20 30028 33032 45044 500SDIP 缩短双列封装SSOP 缩短小型封装引脚数宽度 mil 引脚数宽度 mil40,42,64 600 16,24,28 150 TSSOP 缩短细小型封装20,28 209 引脚数: 8, 20, 48引脚数: 8 MSOP, 48 BQSOP48,56 300NSOP 窄小形双列封装TSOP 细小封装引脚数宽度 mil 引脚数宽度16 150 28,328*13.4mm SOJ 细小封装32 8*14mm 引脚数32 8*20mm28,32QFP 四方扁平封装LQFP 矮四方扁平封装引脚数宽度引脚数宽度44,48 10*10mm 32,44,48 7*7mm52 14*14mm 44，64,80 10*10mm64,80,100,128 14*20mm 80 12*12mm，14*14mm144,160,208 28*28mm 100，128 14*14mm，14*20mm144 20*20mm 208 28*28mmTQFP 细四方扁平封装 其他引脚数宽度类型引脚数 80,100 14*14mmPLCC 塑封大空间封装 SOT-23, SOT-223, SOT-89SOT-25SOT-26 TO-92TO-220, TO-252, TO-26328, 32, 44, 52, 68, 84 3 5 6 3,4 3塑封 DIP/SKDIP/SDIP 尺寸 (单位: mil)SOP/NSOP 封装尺寸(单位: mil)TSSOP 封装尺寸(单位: mil)SOJ 封装尺寸(单位: mil)QFP/LQFP/TQFP 封装尺寸(单位: mil)PLCC 封装尺寸(单位: mil)SOT 23 封装尺寸(单位: mil)SOT 223SOT 89SOT 25SOT 26TO 92TO 220TO 252TO 263 (DD2 PAK)。
芯片封装类型图解
芯片封装类型图解本文介绍了常见的集成电路封装形式，包括BGA、CPGA、FBGA、JLCC、LDCC、LQFP100L、PCDIP、PLCC、PPGA、PQFP、TQFP100L、TSBGA217L、TSOP、CSP、SIP、ZIP、S-DIP、SK-DIP、PGA、SOP、MSP和QFP等。
SIP是单列直插式封装，引脚在芯片单侧排列，与DIP基本相同。
ZIP是Z型引脚直插式封装，引脚比SIP粗短些，节距等特征也与DIP基本相同。
S-DIP是收缩双列直插式封装，引脚在芯片两侧排列，引脚节距为1.778mm，芯片集成度高于DIP。
SK-DIP是窄型双列直插式封装，除了芯片的宽度是DIP的1/2以外，其它特征与DIP相同。
PGA是针栅阵列插入式封装，封装底面垂直阵列布置引脚插脚，插脚节距为2.54mm或1.27mm，插脚数可多达数百脚，用于高速的且大规模和超大规模集成电路。
SOP是小外型封装，表面贴装型封装的一种，引脚端子从封装的两个侧面引出，字母L状，引脚节距为1.27mm。
MSP是微方型封装，表面贴装型封装的一种，又叫QFI等，引脚端子从封装的四个侧面引出，呈I字形向下方延伸，没有向外突出的部分，实装占用面积小，引脚节距为1.27mm。
QFP是四方扁平封装，表面贴装型封装的一种，引脚端子从封装的两个侧面引出，呈L字形，引脚节距为1.0mm、0.8mm、0.65mm、0.5mm、0.4mm、0.3mm，引脚可达300脚以上。
SVP是一种表面安装型垂直封装，其引脚端子从封装的一个侧面引出，中间部位弯成直角并与PCB键合，适用于垂直安装，实装占有面积很小。
其引脚节距为0.65mm和0.5mm。
LCCC是一种无引线陶瓷封装载体，其四个侧面都设有电极焊盘而无引脚，适用于高速、高频集成电路封装。
PLCC是一种无引线塑料封装载体，适用于高速、高频集成电路封装，是一种塑料封装的LCC。
SOJ是一种小外形J引脚封装，其引脚端子从封装的两个侧面引出，呈J字形，引脚节距为1.27mm。
常用元器件封装尺寸大小
封装形式图片国际统一简称LDCCLGALQFPPDIPTO5TO52TO71TO71TO78PGAPlastic PIN GridArray 封装形式图片国际统一简称TSOPThinSmall OUtlinePackageQFPQuadFlat PackagePQFP 100LQFPQuadFlat PackageSOT143SOT220Thin ShrinkQutline PackageuBGAPLCCLQFPLQFP 100LTO8TO92TO93T099EBGA 680LQFP Quad Flat PackageTQFP 100LMicro Ball GridArrayuBGA Micro Ball GridArrayPCDIPZIPZig-Zag Inline PackaSOT223SOT223SOT23SOT23/SOT323 SOT25/SOT353SBGALBGA 160LPBGA 217L Plastic Ball GridArraySBGA 192LTSBGA 680LCLCCSC-705LSDIPSIPSingle Inline Package SOT26/SOT363FBGAFDIPSOJSOP EIAJ TYPE II 14LSSOP 16LSSOPSOJ 32LFlat PackHSOP28SOSmall OutlinePackageCNRCPGA Ceramic Pin OutlinePackageDIPDual Inline PackageDIP-tab DUAL Inline Package with MetalHeatsinkBQFP 132C-BendLeadITO220ITO3PTO220TO247TO264TO3JLCCLCCTO263/TO268SO DIMM Small Outline Dual In-line MemoryCERQUADCeramic QuadFlatCeramicCase LAMINATE CSPT12LChip Scale PackageGullwingleadsSOT343SOT523SOT89SOT89ModuleSOCKET 370 For intel 370 Pin PGA PentiumIII & Celeron CPUSIMM30Single Inline Memory ModuleSIMM72Single Inline Memory ModuleSIMM72Single inline Memory Modulepin PGA pentium 4 CPUSOCKET462/SOCKET A For PGA AMD Athlo & Duron CPUSocket 603FosterLLP 8LaPCI 32bit 5VPeripheralComponent Interconnect PCI 64bit 3.3VPeripheralComponent InterconnectPCMCIATCSP 20L Chip ScalePackageTO252SOCKET7 For intel PentiumPSDIP SLOT1 For intel pentiumII petiumIII & Celeron CPU SLOT A For AMDAthloncpuSNAPTKSNAPTKSNAPZPSOHBGABall Grid ArrayTO18& MMXpentiumCPU一、直插式电阻封装及尺寸直插式电阻封装为AXIAL-xx形式（比如AXIAL-0.3、AXIAL-0.4），后面的xx 代表焊盘中心间距为xx英寸，这一点在网上很多文章都没说清楚，单位为英寸。
TQFP与PLCC封装
TQFP封装薄四方扁平封装低成本，低高度引线框封装方案薄四方扁平封装对中等性能、低引线数量要求的应用场合而言是最有效利用成本的封装方案，且可以得到一个轻质量的不引人注意的封装。
TQFP系列支持宽泛范围的印模尺寸和引脚数量，尺寸范围从7mm到28mm，引线数量从32到256 产品体尺寸(mm) 引线间距(mm)TQFP 100 14 0.50TQFP 120 14 0.40TQFP 128 14*20 0.50TQFP 144 20 0.50TQFP 176 24 0.50TQFP 208 28 0.50TQFP 256 28 0.40TQFP 32 7 0.80TQFP 44 10 0.80TQFP 48 7 0.50TQFP 52 10 0.65TQFP 64 14 0.80TQFP 64 10 0.50TQFP 80 12 0.50TQFP 80 14 0.65TQFP44封装PLCCPLCC为特殊引脚芯片封装，它是贴片封装的一种，这种封装的引脚在芯片底部向内弯曲，因此在芯片的俯视图中是看不见芯片引脚的。
这种芯片的焊接采用回流焊工艺，需要专用的焊接设备，在调试时要取下芯片也很麻烦，现在已经很少用了。
PLCC(Plastic Leaded Chip Carrier),带引线的塑料芯片载体.表面贴装型封装之一,外形呈正方形,32脚封装,引脚从封装的四个侧面引出,呈丁字形,是塑料制品,外形尺寸比DIP封装小得多.PLCC封装适合用SMT表面安装技术在PCB上安装布线,具有外形尺寸小、可靠性高的优点.美国德克萨斯仪器公司首先在64k 位DRAM 和256kDRAM 中采用,现在已经普及用于逻辑LSI、DLD(或程逻辑器件)等电路.引脚中心距1.27mm,引脚数从18 到84 .J 形引脚不易变形,比QFP 容易操作,但焊接后的外观检查较为困难. PLCC 与LCC(也称QFN)相似.以前,两者的区别仅在于前者用塑料,后者用陶瓷.但现在已经出现用陶瓷制作的J 形引脚封装和用塑料制作的无引脚封装(标记为塑料LCC、PC LP、P -LCC 等),已经无法分辨.为此,日本电子机械工业会于1988 年决定,把从四侧引出J 形引脚的封装称为QFJ,把在四侧带有电极凸点的封装称为QFN.。
集成电路封装外形及说明
集成电路封装外形及说明
说明：
常见的封装材料有：塑料、陶瓷、玻璃、金属等，现在基本采用塑料封装。
按封装形式分：普通双列直插式，普通单列直插式，小型双列扁平，小型四列扁平，圆形金属，体积较大的厚膜电路等。
按封装体积大小排列分：最大为厚膜电路，其次分别为双列直插式，单列直插式，金属封装、双列扁平、四列扁平为最小。
两引脚之间的间距分：普通标准型塑料封装，双列、单列直插式一般多为2.54±0.25 mm，其次有2mm（多见于单列直插式）、1.778±0.25mm（多见于缩型双列直插式）、1.5±0.25mm，或1.27±0.25mm(多见于单列附散热片或单列V 型)、1.27±0.25mm(多见于双列扁平封装)、1±0.15mm(多见于双列或四列扁平封装)、0.8±0.05～0.15mm(多见于四列扁平封装)、0.65
±0.03mm(多见于四列扁平封装)。
双列直插式两列引脚之间的宽度分：一般有7.4～7.62mm、10.16mm、12.7mm、15.24mm等数种。
双列扁平封装两列之间的宽度分（包括引线长度：一般有6～6.5±mm、7.6mm、10.5～10.65mm 等。
四列扁平封装40 引脚以上的长×宽一般有：10×10mm(不计引线长度)、13.6
×13.6±0.4mm(包括引线长度)、20.6×20.6±0.4mm(包括引线长度)、8.45×8.45±0.5mm(不计引线长度)、14×14±0.15mm（不计引线长度）等。
半导体封装尺寸
半导体封装尺寸半导体封装尺寸是指封装在半导体芯片周围的外壳的物理尺寸。
这些尺寸会因不同的封装类型和应用而有所不同。
以下是一些常见的半导体封装类型及其尺寸：1.Dual In-line Package (DIP):•DIP封装是一种常见的封装形式，具有两排引脚。
典型的DIP尺寸包括：•14引脚DIP：常见尺寸约为19.3 mm x 7.62 mm。
•16引脚DIP：常见尺寸约为19.3 mm x 7.62 mm。
•28引脚DIP：常见尺寸约为37.08 mm x 7.62 mm。
2.Quad Flat Package (QFP):•QFP封装是一种表面贴装封装，引脚在四个侧面。
典型的QFP尺寸包括：•32引脚QFP：常见尺寸约为7 mm x 7 mm。
•64引脚QFP：常见尺寸约为10 mm x 10 mm。
•100引脚QFP：常见尺寸约为14 mm x 14 mm。
3.Ball Grid Array (BGA):•BGA封装使用球形焊点连接芯片和印刷电路板（PCB）。
尺寸可以因球的数量和排列方式而异。
典型的BGA尺寸包括：•256球BGA：常见尺寸约为17 mm x 17 mm。
•672球BGA：常见尺寸约为27 mm x 27 mm。
4.Chip-on-Board (COB):•COB是将芯片直接粘贴到PCB上而不使用传统封装的一种技术。
尺寸可以根据芯片大小和应用而有所不同。
这只是一小部分常见半导体封装类型的例子，实际上有许多其他类型和尺寸的封装，每种封装都适用于不同的应用和性能要求。
具体的半导体封装尺寸信息通常可以在相关的半导体厂商的技术文档中找到。
LQFP,TQFP,QFP封装尺寸图解及区别
LQFP,TQFP,QFP封装尺寸图解及区别这个型号只有两种封装一种是TQFP32 一种是BGA48QFP(quad flat package)四侧引脚扁平封装。
表面贴装型封装之一，引脚从四个侧面引出呈海鸥翼(L)型。
基材有陶瓷、金属和塑料三种。
从数量上看，塑料封装占绝大部分。
当没有特别表示出材料时，多数情况为塑料QFP。
塑料QFP 是最普及的多引脚LSI 封装。
不仅用于微处理器，门陈列等数字逻辑LSI 电路，而且也用于VTR 信号处理、音响信号处理等模拟LSI 电路。
引脚中心距有1.0mm、0.8mm、0.65mm、0.5mm、0.4mm、0.3mm 等多种规格。
0.65mm 中心距规格中最多引脚数为304。
日本电子机械工业会对QFP 的外形规格进行了重新评价。
在引脚中心距上不加区别，而是根据封装本体厚度分为QFP(2.0mm～3.6mm 厚)、LQFP(1.4mm 厚)和TQFP(1.0mm 厚)三种。
LQFP指封装本体厚度为1.4mm的QFP。
TQFP指封装本体厚度为1.0mm的QFPBQFP(quad flat package with bumper)带缓冲垫的四侧引脚扁平封装。
QFP封装之一，在封装本体的四个角设置突起(缓冲垫)以防止在运送过程中引脚发生弯曲变形。
美国半导体厂家主要在微处理器和ASIC等电路中采用.此封装。
引脚中心距0.635mm，引脚数从84到196左右FQFP(finepitchquadflatpackage)小引脚中心距QFP。
通常指引脚中心距小于0.65mm的QFP(见QFP)。
部分导导体厂家采用此名称——仅供参考。
嘉立创的元件封装尺寸
嘉立创的元件封装尺寸
嘉立创是一家PCB（Printed Circuit Board，印刷电路板）制造商，他们提供各种尺寸和类型的电子元件封装。
具体的元件封装尺寸会根据不同的元件类型和要求而变化。
以下是一些常见的电子元件封装尺寸：
1. 0603封装：尺寸为0.06英寸乘以0.03英寸。
2. 0805封装：尺寸为0.08英寸乘以0.05英寸。
3. 1206封装：尺寸为0.12英寸乘以0.06英寸。
4. SOT-23封装：尺寸为0.118英寸乘以0.067英寸。
5. QFP封装：尺寸根据引脚数目和排列方式的不同而变化。
其中，QFP64封装的尺寸大约为0.45英寸乘以0.45英寸。
6. BGA封装：尺寸也根据球网阵列（Ball Grid Array）的大小和排列方式的不同而变化。
需要注意的是，以上只是一些常见的元件封装尺寸，具体的尺寸还取决于实际的元件和设计要求。
如果您需要更具体的尺寸信息，建议直接向嘉立创或相关元件供应商咨询。
常用元器件封装尺寸大小
功率 W 1/20W 1/16W 1/10W 1/8W 1/4W 1/3W 1/2W 3/4W
1W
word 格式-可编辑-感谢下载支持
按照 1 mil=0.001 英寸，1 英寸=2.54cm 换算关系设计，（1 英寸=1000mil）
////////////////// protel 元件封装介绍
封装形式图片
word 格式-可编辑-感谢下载支持
国际统一简称
封装形式图片
LDCC
LGA
LQFP
PDIP
TO5
国际统一简称
TSOP Thin Small OUtline Package
QFP
Quad Flat Package
PQFP 100L
QFP
Quad Flat Package
SOT143
TO52 TO71 TO71 TO78 PGA Plastic PIN Grid Array PLCC
BQFP 132
C-Bend
Lead
CERQUAD
Ceramic Quad Flat
Ceramic
Case
LAMINATE CSP T12L
Chip Scale Package
Gull
wingleads
SOT343
SOT523
SOT89
SOT89
LCC
TO263/TO268
SO DIMM Small Outline Dual In-line
Memory Module
SOCKET 370 For intel 370 Pin PGA PentiumIII & Celeron CPU
SIMM30 Single Inline Memory Module
常用元器件封装尺寸大小
TO252
TO18
SOCKET7 For intel Pentium & MMXpentium CPU
一、直插式电阻封装及尺寸
直插式电阻封装为 AXIAL-xx 形式（比如 AXIAL-0.3、AXIAL-0.4），后面的 x x 代表焊盘中心间距为 xx 英寸，这一点在网上很多文章都没说清楚，单位为英 寸。这个尺寸肯定比电阻本身要稍微大一点点，常见的固定（色环）电阻如下 图：
SBGA 192L
TSBGA 680L
CLCC
SC-705L
SDIP SIP
Single Inline Package
SO
Small Outline Package
3 / 11
SOP EIAJ
TYPE II 14L
SSOP 16L SSOP
SOJ 32L Flat Pack HSOP28 ITO220
10 / 11
电阻：RES1，RES2，RES3，RES4；封装属性为 axial 系列 无极性电容：cap;封装属性为 RAD-0.1 到 rad-0.4 电解电容：electroi;封装属性为 rb.2/.4 到 rb.5/1.0 电位器：pot1,pot2；封装属性为 vr-1 到 vr-5 二极管：封装属性为 diode-0.4(小功率）diode-0.7(大功率） 三极管：常见的封装属性为 to-18（普通三极管）to-22(大功率三极管）to-3 (大功率达林顿管） 电源稳压块有 78 和 79 系列；78 系列如 7805，7812，7820 等 79 系列有 7905，7912，7920 等 常见的封装属性有 to126h 和 to126v 整流桥：BRIDGE1,BRIDGE2: 封装属性为 D 系列（D-44，D-37，D-46） 电阻： AXIAL0.3-AXIAL0.7 其中 0.4-0.7 指电阻的长度，一般用 AXIAL0.4 瓷片电容：RAD0.1-RAD0.3。 其中 0.1-0.3 指电容大小，一般用 RAD0.1 电解电容：RB.1/.2-RB.4/.8 其中.1/.2-.4/.8 指电容大小。一般<100uF 用 RB.1/.2,100uF-470uF 用 RB.2/.4,>470uF 用 RB.3/.6 二极管： DIODE0.4-DIODE0.7 其中 0.4-0.7 指二极管长短，一般用 DIODE0. 4 发光二极管：RB.1/.2 集成块： DIP8-DIP40, 其中８－４０指有多少脚，８脚的就是 DIP8 贴片电阻
常用元器件封装尺寸大小
////////////////// protel 元件封装介绍 电阻 AXIAL0.3 0.4 三极管 TO-92A B 电容 RAD0.1 0.2 发光二极管 DZODE0.1 单排针 SIP+脚数 双排针 DIP+脚数 电解电容 RB.1 .2 。。。。。。。} 电阻 AXIAL 无极性电容 RAD 电解电容 RB电位器 VR 二极管 DIODE 三极管 TO 电源稳压块 78 和 79 系列 TO－126H 和 TO-126V 场效应管 和三极管一样 整流桥 D－44 D－37 D－46 单排多针插座 CON SIP 双列直插元件 DIP 晶振 XTAL1
SOCKET 370 For intel 370 Pin PGA PentiumIII & Celeron
CPU SIMM30 Single Inline Memory Module
SIMM72 Single Inline Memory
Module
SIMM72 Single inline Memory
封装尺寸与功率有关通常如下： 英制 0201 0402 0603 0805 1206 1210 1812 2010 2512
功率 W 1/20W 1/16W 1/10W 1/8W 1/4W 1/3W 1/2W 3/寸，1 英寸=2.54cm 换算关系设计，（现方式做保护处理对用户上传分享的文档内容本身不做任何修改或编辑并不能对任何下载内容负责
封装形式图片
国际统一简称
LDCC LGA LQFP PDIP TO5
封装形式图片
国际统一简称
TSOP Thin Small OUtline
Package QFP
Quad Flat Package
封装参考
封装参考————————————————————————————————作者：————————————————————————————————日期：主控板和底板部分，主控芯片SＴM３2F103VEＴ6从机芯片STM32F１03C8T6，两者均选用LQＦＰ封装形式，在实验室用LQＦＰ1００-N型，引脚数目自己定义。
ＬQＦP１00-L LQFＰ１00-M LQ ＦＰ100-N可以看出没什么区别。
QFＰLＱFP TQFＰ封装形式：都是方形扁平封装,只是厚度不同。
LＱFP和TＱFＰ,如果引脚数相同，并且本体大小相同或引脚间距相同时,他们的ＰCB封装可以通用。
而QFＰ,foo ｔprｉnt一项与LＱFP和ＴＱＦP都不能对应,所以QFP和ＬQFＰ，TＱＦP应该是不能通用的。
同是LQFP封装形式IＣ，由于芯片本身的规格的不同,引脚间距也不同，画封装要认真查阅资料。
实验室所用的都是一般规格的芯片，大多数可以通用。
MC1４03，W25X1６，MAX3232，SP485,MＡX３４91，TJA１０50等一般用ＳO封装，根据引脚数目的不同选择引脚数目，例如SＯ8，SO14,ＳO16等。
ＳOP SＯSOIC TSSOP SSOP由上图可以看出SOＰ、SO、SOIC 三者管脚大小和间距是一样的，只是整体外形大小同，TSＳOＰ和SSOP管脚大小和间距相同,管脚间距明显比SOP系列的要小。
至于那些其他形式的封装实验室没使用，或者用的很少就不介绍了。
要想了解自己查资料。
HT7533稳压芯片，实验室选用的是SOT-89封装,ＨT75３３常用封装如下:ＳOＴ-８9SOT-2５ＴO-92二极管的一般封装:ＤO－35，ＤO-４1玻封二极管；LL-34，ＬL-41玻封二极管；ＤO-４１塑封二极管;SOD１23,SOD3２3,ＳOD523塑封二极管；TO22０封装。
SＯT23贴片二极管。
ＤO-35DＯ－4１LL-34LL－4１DＯ-４1 SOD123，SOD３23，SOＤ523TO220SOT23其对应的封装形式:TO22０ＤO－41DO－35SOＴ23LL-3４LL-4１对应为12０6贴片封装；SOＤ123对应为１206，SOD323对应为0８05,S ＯD523对应为0６０3，一般的LEＤ发光二极管用08０5封装。
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D u m m y C o m p o n e n t sLQFPLow Profile Quad Flat PackLow Profile Quad Flat Pack (LQFP) packages provide the same benefit of the metric QFP packages, but are thinner (body thickness of 1.4mm) and have a standard lead-frame footprint (2.0mm lead footprint).LQFPs help to solve issues such as increasing board density, die shrink programs, thin end-product profile and portability. Lead counts range from 32 to 256. Body sizes range from 5 x 5mm to 28 x 28mm. Copper lead-frames are used for the LQFP package. Lead pitches available for LQFP package are 0.65mm, 0.5mm, 0.4mm.Notes* = Available as an ExposedPad™ L/TQFP Package by Amkor. TheExposedPad™ L/TQFP can increase heat dissipation by as much as 110% over a standard L/TQFP. The E xposedPad™ L/TQFP is a cost effective, high frequency leadframe solution to thermal management when the die attach pad is soldered to the PCB. All LQFPs are standard in trays.LQFPs have a body thickness of 1.4mm. Tray quantity may vary. Tape type is plastic.Moisture sensitivity is JEDEC level 3.Lead-free parts are available with SnCu, SnBi or 100% Sn finish.For recommended kits see pages58, 68, 71, 81, 73 and 70.Part Number System▪ Add “TR” to end of part number for Tape and Reel.▪ Add specific finish to end of part number for Lead-Free, i.e Sn or SnCu or SnBi.LQFP48–7mm–.5mm–2.0Low Profile Quad Flat PackNumber of Pins Lead PitchBody SizeLead FootprintLQFP Low Profile Quad Flat Pack 1.4mm ThickPart NumberNumber of Pins Body Size Lead Pitch Quantity Per Tray Tape Width Tape Pitch Quantity Per Reel AvailableLead-Free Finishes .4mm PitchLQFP64-7mm-.4mm-2.0647mm sq .4mm 25016mm 12mm 1,000Sn, SnCu or SnBi LQFP80-10mm-.4mm-2.08010mm sq .4mm 16024mm 24mm 1,000Sn, SnCu or SnBi LQFP120-14mm-.4mm-2.012014mm sq .4mm 9032mm 24mm 750Sn, SnCu or SnBi LQFP128-14mm-.4mm-2.012814mm sq .4mm 9032mm 24mm 750Sn, SnCu or SnBi LQFP176-20mm-.4mm-2.017620mm sq .4mm 6044mm 24mm 500Sn, SnCu or SnBi LQFP216-24mm-.4mm-2.021624mm sq .4mm 4044mm 32mm 500Sn, SnCu or SnBi LQFP256-28mm-.4mm-2.025628mm sq .4mm 2444mm 40mm 500Sn, SnCu or SnBi .5mm PitchLQFP48-7mm-.5mm-2.0487mm sq .5mm 25016mm 12mm 1,000Sn, SnCu or SnBi LQFP64-10mm-.5mm-2.06410mm sq .5mm 16024mm 24mm 1,000Sn, SnCu or SnBi LQFP80-12mm-.5mm-2.08012mm sq .5mm 9024mm 20/24mm 1,000Sn, SnCu or SnBi LQFP100-14mm-.5mm-2.010014mm sq .5mm 9032mm 24mm 750Sn, SnCu or SnBi LQFP128-14x20mm-.5mm-2.012814 x 20mm .5mm 7244mm 32mm 500Sn, SnCu or SnBi LQFP128-20mm-.5mm-2.012820mm sq .5mm 6044mm 24mm 500Sn, SnCu or SnBi LQFP144-20mm-.5mm-2.0*14420mm sq .5mm 6044mm 24mm 750Sn, SnCu or SnBi LQFP160-24mm-.5mm-2.016024mm sq .5mm 4044mm 32mm 500Sn, SnCu or SnBi LQFP176-24mm-.5mm-2.0*17624mm sq .5mm 4044mm 32mm 500Sn, SnCu or SnBi LQFP208-28mm-.5mm-2.0*20828mm sq .5mm 3644mm 40mm 500Sn, SnCu or SnBi .65mm PitchLQFP52-10mm-.65mm-2.05210mm sq .65mm 16024mm 24mm 1,000Sn, SnCu or SnBi LQFP80-14mm-.65mm-2.08014mm sq .65mm 9032mm 24mm 750Sn, SnCu or SnBi LQFP100-14x20mm-.65mm-2.010014x20mm .65mm 7244mm 32mm 500Sn, SnCu or SnBi .8mm PitchLQFP32-7mm-.8mm-2.0327mm sq .8mm 25016mm 12mm 1,000Sn, SnCu or SnBi LQFP44-10mm-.8mm-2.04410mm sq .8mm 16024mm 24mm 1,000Sn, SnCu or SnBi LQFP64-14mm-.8mm-2.06414mm sq.8mm9032mm24mm750Sn, SnCu or SnBiDaisy-Chain And Lead-Free Parts Available!For drawings, please visit our web site at .Dummy ComponentsTQFPThin Quad Flat PackThin Quad Flat Pack (TQFP) packages provide the same benefit of the metric QFP package, but are thinner (body thickness of 1.0mm) and have a standard lead-frame footprint (2.0mm lead footprint). TQFPs are help-ing to solve issues such as increasing board density, die shrink programs, thin end-product profile and portability. Lead counts range from 32 to 176. Body sizes range from 5 x 5mm to 20 x 20mm. Copper lead-frames are used for the TQFP package. Lead pitches available for TQFP package are 0.4mm, 0.5mm, 0.65mm 0.8mm and 1.0mm.Exposed Pad L/TQFP PackageTQFP PackageMold Die Up (Standard)Die AttachDie Down (Inverted)Notes* = Available as an Exposed Pad L/TQFP Package by Amkor. TheExposedPad™ L/TQFP can increase heat dissipation by as much as 110% over a standard L/TQFP. The E xposedPad™ L/TQFP is a cost effective, high frequency leadframe solution to thermal management when the die attach pad is soldered to the PCB.TQFP is available in die up configurations in 1.0mm thickness only. 5 x 5mm to 20 x 20mm body size (JEDEC Standard). 32 to 176 lead counts. Copper leadframes.1.0mm body thickness for TQFP. Moisture sensitivity is JEDEC level 3.Lead-free parts are available with SnCu, SnBi or 100% Sn finish.Part Number System▪ Add “ePad” to beginning of part number when orderingExposedPad™ package.▪ Add “TR” to end of part number for Tape and Reel.▪ Add “LF” to end of part number for Lead-Free.Mold Die Up (Standard)TQFP Thin Quad Flat Pack 1.0mm ThickPart NumberNumber of Pins Body SizeLead Pitch Footprint Quantity Per Tray Tape Width Tape Pitch Quantity Per Reel A-TQFP32-5mm-.5mm-2.0*325mm sq .5mm 2.0mm 36016mm 12mm 1,000A-TQFP32-7mm-.8mm-2.0*327mm sq .8mm 2.0mm 25016mm 12mm 1,000A-TQFP40-5mm-.4mm-2.0*405mm sq .4mm 2.0mm 36016mm 12mm 1,000A-TQFP44-10mm-.8mm-2.0*4410mm sq .8mm 2.0mm 16024mm 16mm 1,000A-TQFP48-7mm-.5mm-2.0 *487mm sq .5mm 2.0mm 25016mm 12mm 1,000A-TQFP52-10mm-.65mm-2.0 *5210mm sq .65mm 2.0mm 16024mm 16mm 1,000A-TQFP64-7mm-.4mm-2.0*647mm sq .4mm 2.0mm 25016mm 12mm 1,000A-TQFP64-10mm-.5mm-2.0*6410mm sq .5mm 2.0mm 16024mm 16mm 1,000A-TQFP64-14mm-.8mm-2.0 *6414mm sq .8mm 2.0mm 9032mm 24mm 750A-TQFP80-12mm-.5mm-2.0 *8012mm sq .5mm 2.0mm 11924mm 24mm 1,000A-TQFP80-14mm-.65mm-2.0*8014mm sq .65mm 2.0mm 9032mm 24mm 750A-TQFP100-14mm-.5mm-2.0*10014mm sq .5mm 2.0mm 9032mm 24mm 750A-TQFP120-14mm-.4mm-2.0 *12014mm sq .4mm 2.0mm 9032mm 24mm 750A-TQFP128-14mm-.4mm-2.0*12814mm sq .4mm 2.0mm 9032mm 24mm 750A-TQFP128-20mm-.5mm-2.0 *12820mm sq .5mm 2.0mm 6044mm 24mm 500A-TQFP144-20mm-.5mm-2.0 *14420mm sq .5mm 2.0mm 6044mm 24mm 500A-TQFP176-20mm-.4mm-2.0 *17620mm sq.4mm2.0mm6044mm24mm500A-TQFP32-5mm-.5mm-2.0Thin Quad Flat PackBody SizeLead FootprintNumber of PinsLead PitchAmkorD u m m y C o m p o n e n t sNotesAll QFPs are standard in JEDEC trays. Tray quantities may vary. Carrier tape is plastic.SnCu, SnBi or 100% Sn finish.QFPQuad Flat PackQuad Flat Pack (QFP) components have four sides with leads extend-ing from the component body on all four sides. QFP componentscome packaged in trays or on tape and reel to protect the component leads that can be easily damaged. An important measurement for QFPs is coplanarity. When the first lead from the component is placedPart Number System▪ Add “TR” to end of part number for Tape and Reel.▪ Add specific finish to end of part number for Lead-Free, i.e Sn, SnCu or SnBi.QFP44–10mm–.8mm–3.9mmQuadFlat PackNumber of Pins Lead Pitch Body SizeLead FootprintDaisy-Chain And Lead-Free Parts Available!QFP Plastic Quad Flat PackPart NumberNumber of Pins Body Size Body Thickness Lead Pitch Footprint Quantity Per Tray Tape Width Tape Pitch Quantity 13" Reel AvailableLead-Free Finishes .40mm PitchQFP256-28mm-.4mm-2.625628mm sq 3.37mm .40mm 2.6mm 244440200Sn, SnCu or SnBi .50mm PitchQFP64-10mm-.50mm-3.26410mm sq 2.0mm .50mm 3.2mm 962424500Sn, SnCu or SnBi QFP64-10mm-.50mm-3.96410mm sq 2.0mm.50mm 3.9mm 962424500Sn, SnCu or SnBi QFP100-14mm-.5mm-3.210014mm sq 2.0/2.67mm .50mm 3.2mm 843224350Sn, SnCu or SnBi QFP100-14mm-.5mm-3.910014mm sq 2.67mm .50mm 3.9mm 843224350Sn, SnCu or SnBi QFP128-14x20mm-.5mm-3.212814 x 20mm 2.71mm .50mm 3.2mm 664432200Sn, SnCu or SnBi QFP128-14x20mm-.5mm-3.912814 x 20mm 2.71mm .50mm 3.9mm 664432200Sn, SnCu or SnBi QFP208-28mm-.5mm-2.620828mm sq 3.37mm .50mm 2.6mm 244440200Sn, SnCu or SnBi QFP208-28mm-.5mm-3.220828mm sq 3.37mm .50mm 3.2mm 244440200Sn, SnCu or SnBi QFP240-32mm-.5mm-2.624032mm sq 3.4mm .50mm 2.6mm 245644250Sn, SnCu or SnBi QFP304-40mm-.5mm-2.630440mm sq 3.8mm .50mm 2.6mm 12n/a n/a —Sn, SnCu or SnBi .65mm PitchQFP52-10mm-.65mm-3.25210mm sq 2.0mm .65mm 3.2mm 962424500Sn, SnCu or SnBi QFP52-10mm-.65mm-3.95210mm sq 2.0mm.65mm 3.9mm 962424500Sn, SnCu or SnBi QFP80-14mm-.65mm-3.28014mm sq 2.0/2.67mm .65mm 3.2mm 843224350Sn, SnCu or SnBi QFP80-14mm-.65mm-3.98014mm sq 2.67mm .65mm 3.9mm 843224350Sn, SnCu or SnBi QFP100-14x20mm-.65mm-3.210014 x 20mm 2.71mm .65mm 3.2mm 664432200Sn, SnCu or SnBi QFP100-14x20mm-.65mm-3.910014 x 20mm 2.71mm .65mm 3.9mm 664432200Sn, SnCu or SnBi QFP144-28mm-.65mm-2.614428mm sq 3.37mm .65mm 2.6mm 244440200Sn, SnCu or SnBi QFP144-28mm-.65mm-3.214428mm sq 3.37mm .65mm 3.2mm 244440200Sn, SnCu or SnBi QFP160-28mm-.65mm-2.616028mm sq 3.37mm .65mm 2.6mm 244440200Sn, SnCu or SnBi QFP160-28mm-.65mm-3.216028mm sq 3.37mm .65mm 3.2mm 244440200Sn, SnCu or SnBi QFP160-28mm-.65mm-3.916028mm sq 3.37mm .65mm 3.9mm 244440200Sn, SnCu or SnBi .80mm PitchQFP44-10mm-.8mm-3.24410mm sq 2.0mm .80mm 3.2mm 962424500Sn, SnCu or SnBi QFP44-10mm-.8mm-3.94410mm sq 2.0mm.80mm 3.9mm 962424500Sn, SnCu or SnBi QFP64-14mm-.8mm-3.26414mm sq 2.0/2.67mm .80mm 3.2mm 843224350Sn, SnCu or SnBi QFP64-14mm-.8mm-3.96414mm sq 2.67mm .80mm 3.9mm 843224350Sn, SnCu or SnBi QFP80-14x20mm-.8mm-3.28014 x 20mm 2.71mm .80mm 3.2mm 664432200Sn, SnCu or SnBi QFP80-14x20mm-.8mm-3.98014 x 20mm 2.71mm .80mm 3.9mm 664432200Sn, SnCu or SnBi QFP120-28mm-.8mm-2.612028mm sq 3.37mm .80mm 2.6mm 244440200Sn, SnCu or SnBi QFP120-28mm-.8mm-3.212028mm sq 3.37mm .80mm 3.2mm 244440200Sn, SnCu or SnBi QFP128-28mm-.8mm-2.612828mm sq 3.37mm .80mm 2.6mm 244440200Sn, SnCu or SnBi QFP128-28mm-.8mm-3.212828mm sq 3.37mm .80mm 3.2mm 244440200Sn, SnCu or SnBi 1.00mm PitchQFP52-14mm-1.0mm-3.25214mm sq 2.0/2.67mm 1.00mm 3.2mm 843224350Sn, SnCu or SnBi QFP52-14mm-1.0mm-3.95214mm sq 2.67mm 1.00mm 3.9mm 843224350Sn, SnCu or SnBi QFP64-14x20mm-1.0mm-3.26414 x 20mm 2.71mm 1.00mm 3.2mm 664432200Sn, SnCu or SnBi QFP64-14x20mm-1.0mm-3.96414 x 20mm2.71mm1.00mm3.9mm664432200Sn, SnCu or SnBion the PCB coplanarity is established. Coplanarity ensures the last lead can be placed on the board. The standard for QFP coplanarity is ±4 mils. Lead-free versions of QFPs are now available. Please call for additional information.Dummy ComponentsCQFPCeramic Quad Flat PackCQFPs are hermetic packages consisting of true pieces of dry pressed ceramic surrounding a uniformed leadframe with tie bar attached. Lead counts for this package range from 14 to 304, with lead pitch rangingPart Number Systemeither metal or ceramic. Lids are attached after die attach. This allows for a hermetically sealed environment for the die.from 15.7mil to 50mils. Package leads are gold or Kovar finish and can be solder-coated by special request. Lids are optional for CQFPs, which are sealed over the package cavity at temperatures from 400° to 460° C.NotesCQFPs are available with or without combo lid. Pins are flat (sandwiched) with tie bar. Parts are packaged in non-JEDEC trays.Due to the custom nature of the package, body size and dimensions can change without notice.Parts available with a daisy-chain configuration upon request. Other ceramic packages available upon request. Glass or epoxy seal.Footprint compatible with plastic QFP packages. EIAJ and JEDEC standards.Lead-frames are embedded into the glass to create both internal die connection and external PCB connection.This surface mount package consists of a ceramic base that has metal-ized castellations/pads on the sides and bottom of the package. LCC packages have pads on all four sides of the package. Lids for LCCs can beCQFP Ceramic Quad Flat PackPart NumberNumber of Pins Body Size Pitch (Inch)(mm)52CQFP-19.0mm-1.27mm 52.750" sq 19.0mm sq 1.27mm 68CQFP-24.1mm-1.27mm 68.950" sq 24.1mm sq 1.27mm 84CQFP-16.5mm-.65mm 84.650" sq 16.5mm sq .65mm 100CQFP-19.0mm-.65mm 100.750" sq 19.0mm sq .65mm 132CQFP-24.1mm-.65mm 132.950" sq 24.1mm sq .65mm 144CQFP-26.6mm-.65mm 144 1.050" sq 26.6mm sq .65mm 172CQFP-29.2mm-.65mm 172 1.150" sq 29.2mm sq .65mm 196CQFP-32.0mm-.50mm1961.260" sq32.0mm sq.50mmNotesLCCs are available with or without combo lid.Gold castellations are standard, but can be solder-coated with 100% Sn or Sn/Cu alloy.Parts are packaged in non-JEDEC trays.upon request.LCC Leadless Ceramic CarrierPart NumberNumber of Castellations Body Size Pitch (Inch)(mm)16LCC-1.27mm-7.36x8.96mm 16.350" x .285"7.36 x 8.96mm 1.27mm 20LCC-1.27mm-8.90mm 20.350" sq 8.90mm sq 1.27mm 28LCC-1.27mm-11.5mm28.450" sq 11.50mm sq 1.27mm 32LCC-1.27mm-11.4x14.0mm 32.550" x .450"11.40 x 14.00mm 1.27mm 40LCC-1.00mm-10.1mm 40.400" sq 10.10mm sq 1.00mm 44LCC-1.27mm-16.5mm 44.650" sq 16.50mm sq 1.27mm 48LCC-1.00mm-14.2mm 48.560" sq 14.20mm sq 1.00mm 52LCC-1.27mm-19.0mm 52.750" sq 19.00mm sq 1.27mm 68LCC-1.27mm-24.11mm 68.950" sq 24.11mm sq 1.27mm 84LCC-1.27mm-29.2mm841.150" sq29.20mm sq1.27mmLCCLeadless Ceramic Carrier52CQFP–19.0mm–1.27mmI/O CountBody SizeLead PitchCeramic Quad Flat Pack20LCC–1.27mm–8.90mm Number of CastellationsPitch Body SizeLeadless Ceramic CarrierFor recommended kits see pages 71 and 55.。