Jz4755硬件设计指南Jz4755_Board_Design Guide_EN
5G基站建设图纸设计及审核要求
5G基站建设图纸设计及审核要求一、设备安装拓扑图5G设备主要有以下两种安装方式:直流防雷分配箱供电、DCPD供电,具体连接拓扑图如下:安装拓扑1:使用直流防雷分配箱为AAU分配供电,并为后端配电柜防雷图错误!文档中没有指定样式的文字。
-1 5G BBU+AAU安装拓扑(直流防雷分配箱)安装拓扑2:使用DCPD为AAU分配供电,并为后端配电柜防雷。
图错误!文档中没有指定样式的文字。
-2 5GBBU+AAU安装拓扑(DCPD)二、主设备参数2.1 EMB6116参数2.2 TDAU5164N78参数2.3主设备线缆参数三、配套需求设计3.1室内配套设计1、机房平面图需如实反映本次工程机房大小及室内所有设备的尺寸及安装位置,新增设备加粗表示,尺寸标注需齐全、准确。
2、壁挂设备需注明距地高度,并保证所需安装、维护、散热空间,具体要求如下:(1)BBU侧面挂墙面板朝下方式:正前方≥600mm操作空间,顶部≥150mm安全距离,距离地面≥600mm,推荐1200cm-1500mm,距离遮挡物≥500mm操作空间,侧面出风口≥500mm散热空间,进风口≥300mm散热空间。
(2)BBU侧面挂墙面板出风口朝上方式:正前方≥600mm操作空间,顶部≥500mm 散热空间,距离地面≥600mm,推荐1200cm-1500mm,距离遮挡物≥350mm,左侧≥600mm操作空间,右侧≥150mm安全距离。
(3)直流防雷箱挂墙安装,安装空间不小于300mm×245mm×105mm,防雷箱周围足够的走线空间3、设备表需完整反映本机房内所有设备名称、型号、尺寸、数量以及安装属性(原有、新增),此表内容需与预算保持一致。
4、图纸说明需清楚描述本次工程相关信息,主要有以下几点要求:项目归属:描述本次工程归属项目情况站点配置:描述本站设备类型、小区参数配置(EMB6116,TDAU5164N78)机房归属:描述本站机房归属(移动自有、铁塔租用)设备供电:描述本次新增设备需占用的空开大小、数量、位置,核算新增设备功耗并明确是否需新增/更换电源模块、空开,注意:(1)如果使用直流防雷箱进行电源分配,S111配置时,給3个AAU同时供电,双路供电,每路所需最大电流63.75A,直流防雷箱需2路80A空开,BBU需1路63A 空开。
硬件设计技术手册
硬件设计技术手册第一章:引言硬件设计技术手册是一份详细介绍硬件设计技术的文档,旨在为硬件设计工程师提供指导和帮助。
本手册将涵盖硬件设计的各个方面,包括电路设计、PCB设计、硬件测试等内容。
它将涵盖从概念证明到制造的整个硬件生命周期。
第二章:电路设计2.1概述电路设计是硬件设计的核心部分之一。
它包括了模拟电路设计、数字电路设计和混合信号电路设计。
在电路设计过程中,需要了解电路理论、器件特性、损耗、噪音、干扰、时序等相关知识。
2.2模拟电路设计模拟电路设计涵盖了大量的电路设计技术。
包括了放大器设计、滤波器设计、参考源设计等。
此外,还需要熟悉各种电路拓扑结构,并能够根据设备需求进行相应的选择。
2.3数字电路设计数字电路设计应该覆盖数字电路家族的所有基本逻辑门,芯片电路整合、数码电路整合等,需要掌握各类逻辑设计语言和软件,如Verilog、VHDL及各种模拟器等。
2.4混合信号电路设计混合信号电路设计在数字电路和模拟电路的基础上实现模拟和数字混合信号的融合,其中包含硬件的AD、DA转换、软件的仿真等方面的内容。
第三章:PCB设计3.1概述电路板(PCB)是一个重要的硬件配件,PCB的设计影响到硬件的性能、稳定性和可靠性。
在PCB设计中,一定要考虑到PCB板形、布局、层数、连线方式以及PCB排布等各个方面的内容。
3.2PCB设计工具常见的PCB设计工具有Altium Designer、CircuitMaker、Eagle等。
其中Altium Designer是最流行的PCB设计工具之一,其拥有强大的功能和易用的界面,可以帮助用户更快地完成PCB设计。
3.3PCB设计规范在PCB设计中,必须遵守一些规范,以确保PCB具有良好的尺寸、性能和可靠性。
其中包括电路板层数、PCB板形、PCB排布规律、布线方向等。
第四章:硬件测试4.1概述硬件测试是硬件设计的最后一个阶段,目的是确保硬件符合预期的性能和规格。
测试过程中的各种测试手段将涵盖到电路板的功能测试、稳定性测试、可靠性测试以及兼容性测试等内容。
bq20z75 95 PCB 布线指南说明书
Application ReportSLUA431–December2007 bq20z75/95Printed-Circuit Board Layout Guide Doug Williams Battery ManagementABSTRACTNew single-package IC fuel gauges can significantly simplify PCB layout.Attention tolayout,however,is critical to the success of any battery management circuit board.Themixture of high-current paths with an ultralow-current microcontroller creates thepotential for design issues that can be troublesome.This document presents guidelinesthat can ensure a stable and well performing project.IntroductionNew single-package integrated circuits(IC)are available that combine the separate fuel gauge and AFE chips into one small package.This configuration can significantly simplify printed-circuit board(PCB)layout,but attention to layout is critical to the success of any battery management circuit board.Themixture of high-current paths with an ultralow-current microcontroller creates the potential for designissues.Careful placement and routing with regard to the principles described in the following discussion can ensure success.IC OrientationThe orientation of the fuel gauge IC is often driven by the shape of the board.Some pack designs have severe dimensional constraints,such as only allowing for a10-mm width.This leaves no choice but tomount the bq20z75/95IC in such a manner that no space is available for decoupling/filter capacitors to be placed next to the IC pins.In that case,adequate decoupling can be provided by mounting the capacitors on the other side of the board,as shown in Figure1.Figure1.Typical Narrow Board Design Where Most Decoupling/Filter Capacitors Are Located on OtherSide.bq20z75/95Power Supply Decoupling CapacitorFortunately,only one capacitor needs to be extremely close to the IC.The power supply decoupling from REG to VSS is very important for optimal operation of the bq20z75/95advanced gas gauge.For thebq20z95,this is the1-µF ceramic capacitor from pin32to pins31and34.Ensure that a heavy copper trace is between pins31and34.For the bq20z75,the capacitor is from REG pin26to VSS pins25and28.This is C15in the reference schematic in Figure10.SLUA431–December2007bq20z75/95Printed-Circuit Board Layout Guide1 Ground SystemTo keep the loop area small,place both terminals of this capacitor within3mm of the IC,and centered around pin32(bq20z95)or pin26(bq20z75).Use the shortest possible traces.A large loop area renders the capacitor useless and forms a little loop antenna for noise pickup.Ground SystemThe bq20z75/95requires a low-current ground system separate from the high-current PACK(–)path.Refer to the ground symbols in the bq20z75/95reference designs,and provide the separate low-current ground system accordingly.It is important that the low-current ground system only connects to PACK(–)at the sense resistor Kelvin pick-off point as shown in Figure2.The use of an optional inner layer ground plane is recommended,but not required,for the ground system.Figure2.Diagram Showing bq20z75/95Using Low-Current Ground System for Its Vss Pins andAssociated Components2SLUA431–December2007 bq20z75/95Printed-Circuit Board Layout GuideKevin Connections Kevin ConnectionsKelvin voltage sensing is extremely important in order to accurately measure current and top and bottom cell voltages.Figure3and Figure4demonstrate correct and incorrect techniques,respectively.Figure3.Incorrect Kelvin Voltage Sensing TechniqueIn Figure3,sensing through high-current copper traces produces measurement errors.SLUA431–December2007bq20z75/95Printed-Circuit Board Layout Guide3 RBI and LED CapacitorsFigure4.Correct Kelvin Voltage Sensing TechniqueAs Figure4shows,in some cases,the top and bottom cell voltage sensing may be extended out to the cells.RBI and LED CapacitorsThe3.3-V LEDOUT(pin8)output requires a4.7-µF ceramic capacitor when LEDs are used,but stillrequires2.2µF capacitance for loop stability when LEDs are not used,as with the bq20z75.Thiscapacitor also should be placed as close to the IC as is practical,but several millimeters of copper trace is not a problem.Placement of the RBI capacitor is not as critical.It can be placed further away from the IC.MRST ConnectionRESET and MRST are connected to allow the internal AFE to control the gas gauge reset state.Theconnection between these pins must be as short as possible in order to avoid any incoming noise.The recommended direct interconnection presents no problem.If unwanted resets are found,one or more of the following solutions may be effective:•Add a0.1-µF capacitor between MRST and ground.•Provide a1-kΩpullup resistor to2.5V at RESET.•Surround the entire circuit with a ground pattern.Normally,these steps are not required.If a test pin is added at MRST,provide it with a10-kΩseriesresistor.Communication Line Protection ComponentsThe5.6-V zener diodes,used to protect the communication pins of the bq20z75/95from ESD,should be located as close to the pack connector as possible.Return the grounded end of these zener diodes to the Pack(–)node,rather than to the low-current digital ground system.In this manner,ESD is diverted away from the sensitive electronics as much as possible.4SLUA431–December2007 bq20z75/95Printed-Circuit Board Layout GuideProtector FET Bypass and Pack Terminal Bypass Capacitors Protector FET Bypass and Pack Terminal Bypass CapacitorsThe general principle is to use wide copper traces to lower the inductance of the bypass capacitor circuits.In Figure5,an example layout demonstrates this technique.ing Wide Copper Traces Lowers the Inductance of Bypass Capacitors C1,C2,C3Board Offset ConsiderationsAlthough the most important component for board offset reduction is the decoupling capacitor for REG(2.5V REG),additional benefit is possible by using this recommended pattern for the Coulomb Counterdifferential low-pass filter network.Maintain the symmetrical placement pattern shown for optimum current offset e symmetrical shielded differential traces,if possible,from the sense resistor to the 100-Ωresistors as shown in Figure6.If the current sense leads are long,ensure that the100-Ωresistors are within10–15mm from the IC.Figure6.Differential Filter Components With Symmetrical LayoutSLUA431–December2007bq20z75/95Printed-Circuit Board Layout Guide5 ESD Spark GapESD Spark GapProtect SMBus Clock,Data,and other communication lines from ESD with a spark gap at the connector.The pattern shown in Figure7is recommended,with0,2-mm spacing between the points.Figure7.Recommended Spark Gap Pattern Helps Protect Communication Lines From ESDRadio Frequency InterferenceNormally,strong RF signals have no effect on gas gauge performance.However,any silicon structure can rectify RF signals,producing unwanted voltages and currents at critical nodes.In fact,any copper trace or battery connection has a frequency where it becomes an effective half-wave or quarter-wave receiving antenna.For example,the1900-MHz cell phone band has a quarter wavelength of only3,9cm.A3-watt cell phone,held next to a battery management circuit board,can induce significant errors under the right conditions.Full sweep RF testing for every new design is strongly yout modificationand/or the use of small bypass capacitors can usually mitigate the problem.The most vulnerable node on the bq20z75/95reference design is the SAFE output,which feeds into a signal diode,followed by a FET gate and shunt capacitor.This type of network demodulates an RF signal and can produce enough DC on the gate of the fuse ignition FET to actually ignite the chemical fuse.The solution is to keep the trace from the SAFE output to the diode as short as possible to reduce itseffectiveness as an antenna.Alternately,both sides of the trace can be guarded with grounded copper. Unwanted Magnetic CouplingA battery fuel gauge circuit board is a challenging environment due to the fundamental incompatibility ofhigh-current traces and ultralow-current semiconductor devices.The best way to protect against unwanted trace-to-trace coupling is with a component placement such as that shown in Figure8,where thehigh-current section is on the opposite side of the board from the electronic devices.This is not possible in many situations due to mechanical constraints;nevertheless,every attempt should be made to routehigh-current traces away from signal traces,which enter the bq20z75/95directly.IC voltage references and registers can be disturbed and,in rare cases,damaged due to magnetic and capacitive coupling from the high-current path.Note that during surge current and ESD events,thehigh-current traces appear inductive and can couple unwanted noise into sensitive nodes of the gasgauge electronics,as illustrated in Figure9.6bq20z75/95Printed-Circuit Board Layout Guide SLUA431–December2007Thermal ConsiderationsFigure8.Separating High-and Low-Current Sections Provides an Advantage in Noise ImmunityFigure9.Avoiding Close Spacing Between High-Current and Low-Level Signal LinesThermal ConsiderationsAvoid thermal problems by placing the sense resistor,protection FETS,and high-current traces well away from the ICs.SLUA431–December2007bq20z75/95Printed-Circuit Board Layout Guide7 Reference SchematicReference SchematicFigure10is a reference schematic for a4-series-cell bq20z95battery management fuel gaugeThe bq20z75schematic is similar,but has no LEDs.Figure10.bq20z954-Series-Cell Reference Schematic8bq20z75/95Printed-Circuit Board Layout Guide SLUA431–December2007IMPORTANT NOTICETexas Instruments Incorporated and its subsidiaries(TI)reserve the right to make corrections,modifications,enhancements, improvements,and other changes to its products and services at any time and to discontinue any product or service without notice. Customers should obtain the latest relevant information before placing orders and should verify that such information is current and complete.All products are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment.TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s standard warranty.Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty.Except where mandated by government requirements,testing of all parameters of each product is not necessarily performed.TI assumes no liability for applications assistance or customer product design.Customers are responsible for their products and applications using TI components.To minimize the risks associated with customer products and applications,customers should provide adequate design and operating safeguards.TI does not warrant or represent that any license,either express or implied,is granted under any TI patent right,copyright,mask work right,or other TI intellectual property right relating to any combination,machine,or process in which TI products or services are rmation published by TI regarding third-party products or services does not constitute a license from TI to use such products or services or a warranty or endorsement e of such information may require a license from a third party under the patents or other intellectual property of the third party,or a license from TI under the patents or other intellectual property of TI. Reproduction of TI information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties,conditions,limitations,and notices.Reproduction of this information with alteration is an unfair and deceptive business practice.TI is not responsible or liable for such altered rmation of third parties may be subject to additional restrictions.Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service voids all express and any implied warranties for the associated TI product or service and is an unfair and deceptive business practice.TI is not responsible or liable for any such statements.TI products are not authorized for use in safety-critical applications(such as life support)where a failure of the TI product would reasonably be expected to cause severe personal injury or death,unless officers of the parties have executed an agreement specifically governing such use.Buyers represent that they have all necessary expertise in the safety and regulatory ramifications of their applications,and acknowledge and agree that they are solely responsible for all legal,regulatory and safety-related requirements concerning their products and any use of TI products in such safety-critical applications,notwithstanding any applications-related information or support that may be provided by TI.Further,Buyers must fully indemnify TI and its representatives against any damages arising out of the use of TI products in such safety-critical applications.TI products are neither designed nor intended for use in military/aerospace applications or environments unless the TI products are specifically designated by TI as military-grade or"enhanced plastic."Only products designated by TI as military-grade meet military specifications.Buyers acknowledge and agree that any such use of TI products which TI has not designated as military-grade is solely at the Buyer's risk,and that they are solely responsible for compliance with all legal and regulatory requirements in connection with such use.TI products are neither designed nor intended for use in automotive applications or environments unless the specific TI products are designated by TI as compliant with ISO/TS16949requirements.Buyers acknowledge and agree that,if they use anynon-designated products in automotive applications,TI will not be responsible for any failure to meet such requirements. Following are URLs where you can obtain information on other Texas Instruments products and application solutions:Products ApplicationsAmplifiers AudioData Converters AutomotiveDSP BroadbandInterface Digital ControlLogic MilitaryPower Mgmt Optical NetworkingMicrocontrollers SecurityRFID TelephonyLow Power Video&ImagingWirelessWirelessMailing Address:Texas Instruments,Post Office Box655303,Dallas,Texas75265Copyright©2007,Texas Instruments Incorporated。
国家仪器(National Instruments)产品快速参考指南说明书
ASCII Table
Dec Hex Char 32 0x20 (sp) 33 0x21 ! 34 0x22 “ 35 0x23 # 36 0x24 $ 37 0x25 % 38 0x26 & 39 0x27 ‘ 40 0x28 ( 41 0x29 ) 42 0x2A * 43 0x2B + 44 0x2C , 45 0x2D 46 0x2E . 47 0x2F / 48 0x30 0 49 0x31 1 50 0x32 2 51 0x33 3 52 0x34 4 53 0x35 5 54 0x36 6 55 0x37 7 56 0x38 8 57 0x39 9 58 0x3A : 59 0x3B ; 60 0x3C < 61 0x3D = 62 0x3E > 63 0x3F ?
1 0011 0110
Idle
RS-232 +5 V
S 0 1 2 3 4 5 6 7 P S Idle
RS-485/422 Signals
If '–' < '+' then MARK, '1'
If '–' > '+' then SPACE, '0' RS-422 Voltage: ±7 V RS-485 Voltage:
Pin 14
Pin 25
Pin
232
2
TXD
3
RXD
4
RTS
5
CTS
6
DSR3
7
GND
8
DCD3
20
DTR3
22
RI3
422/485 RTS+ (HSO+) CTS+ (HSI+) RTS– (HSO–)
心率检测在智能手表上的应用_李志强
信号,然后接收组织的反射光信号。测量组织容积在 心脏搏动时的微小变化造成的反射光强度变化,来获
得脉搏波信号,通过检测峰值获得心率。 理论上还有一种做法是使用双波长光信号,通过
光电容积法测量获得血氧饱和度值,光信号需要进行
调制,双波长光线轮流照射组织,获得了每一时刻组 织对两种不同波长光线的反射光强度。然后进行解调 并根据朗伯比尔定律计算出血氧饱和度值。但是由于 该检测方法在手表上运用准确度不够,目前比较少产 品有做血氧检测。
心电图。 3. 反射式和电极式心率检测的优缺点对比如下
表 1:
表 1 反射式和电极式对比表
实现 心率 血氧 心电图 运动情况
操作便
功耗 抗干扰
方式 检测 监测 检测 下监测
利性
反射式 可以 可以 不行
可以
易受外来 单手操作, 发射光
光线,不同 主动读取 线,能
肤色,体毛 数据,便于 耗高
等影响 远程监控
参考文献:
[1]1. 神念科技官网 / [2]2. 北京君正官网 /cn/cn/proinfo.php? id=14&pid=782&fid=782
[3]3. 德 州 仪 器 官 网014 年第 6 期
F福 建 电 脑 UJIAN COMPUTER
心率检测在智能手表上的应用
李志强
(万利达集团有限公司 福建 厦门 361006)
【摘 要】:心率是反映人体循环系统机能的重要参数,经常性的对心率进行测量,了解身体机能状 况,对心脏工作异常有重要的预警作用。以智能手表为主的智能穿戴产品开始广泛增加心率检测功能。 本文首先介绍了心率检测的基本原理,接着讨论了在智能手表上反射式和电极式 2 种心率检测设计方 案各自特点并进行优劣对比,最后对设计方案的电路原理进行详细地分析和实验测试。
475 说明书
现 在 有 了 便 利 升 级 功 能,当 新 的 HART 和Ff现 场 总 线 设 备 描 述 文 件 (DDs)发布时, 只需要从互联网直接 下载就可以升级475现场通 讯器了。 随时保持更新,一切尽在您的掌握之 中。
使用 -10°C (14°F ) 到+50°C (122°F ) 0% to 95% RH (无凝结) 从0°C (32°F) 到+50°C (122°F )
充电 10°C (32°F ) 到+40°C (104°F )
带电池储存 -20°C (-4°F ) 到+55°C (131°F )
无电池储存 -20°C (-4°F ) 到+55°C (131°F )
外壳保护级别 IP51(前部)
防撞击 测试通过1米自由落体到水泥表面
便利升级要求
使用 有Internet连接的PC CD Rom驱动器 IrDA口(或红外适配器) 蓝牙接口(或适配器) SD 读卡器(对某些升级需要) WindowsXP(SP2 或SP3)或 Windows Vista 商务版(SP1) 操作系统
键盘 共25键,包括4个动作键,12个数字字母键, tab键,功能键,背光键,电源键,和4个光标 控制(箭头)键
电池 可充电锂离子电池模块
电池运行时间 连续运行-20小时 常规使用-40小时 待机状态-80小时
电池充电器选项 输入电压100-240VAC,50-60Hz 包括电源线,插头有美国,欧洲,和英国选择
对 于HART回 路, 475现 场 通 讯 器 能 确认回路中的DC信号是否正确。
通信电子线路课程设计--调频发射系统整机电路设计
通信电子线路课程设计--调频发射系统整机电路设计随着人类的文明不断进步,科学技术不断的发展,人们之间的交流越来越多,相互交换的信息也日益剧增,要传送的信息类型也是越来越多样化。
科技的进步也使得通信的技术得到了发展,特别是无线电波的使用,使我们的通信更加实时、高效。
科技的快速发展,将使人们的通信更方便快捷。
随着科技的发展和人民生活水平的提高,无线电发射机在生活中得到广泛应用,最普遍的有电台、对讲机等。
人们通过无线电发射机可以把需要传播出的信息发射出去,接收者可以通过特制的接收机接受信息,最普通的模式是:广播电台通过无线电发射机发射出广播,收听者通过收音机即可接收到电台广播。
调频发射机目前处于快速发展之中,在很多领域都有了很广泛的应用。
它可以用于演讲、教学、玩具、防盗监控等诸多领域。
关键字:高频电子线路,Multisim仿真,调频发射。
一、前言 (1)二、设计指标 (2)2.1题目 (2)2.2设计任务及主要技术指标和要求 (2)2.3内容和要求 (2)2.4主要技术指标 (2)三、系统总述 (3)3.1 调频基本概念 (3)3.2 工作原理 (3)3.3整体原理框图 (5)四、单元电路设计与仿真 (6)4.1压控振荡器调频电路 (6)4.2变容二极管直接调频电路 (8)4.3上混频电路 (10)4.4三极管倍频电路 (11)4.5丙类谐振功率放大电路 (12)五、整机电路设计 (13)六、高频实验平台整机联调 (14)七、设计总结 (16)八、参考文献 (17)一、前言频率的调制和解调是通信电子线路中非常重要且比较关键的一部分,调频电路在通信电子线路中运用非常广泛且作用很大,如何学好此部分对我们来说非常重要。
本课程设计的内容是学习基于Multisim的调频电路设计与仿真。
用Multisim仿真软件进行调频电路调频和解调,得到仿真结果。
从仿真结果中更好地理解频率的调制和解调。
由于一般的低频信号无法进行远距离传输,所以得经过调频搬到高频信号上传输,这个过程就是我们常说的调频。
产品硬件详细设计规范
收文:XXX * 非经本公司同意,严禁影印*XXXXXXXX有限公司收文:05-02C* 非经本公司同意,严禁影印*收文:05-03C * 非经本公司同意,严禁影印*文:*非经公司同意, 严禁影印*文:*非经公司同意, 严禁影印**非经公司同意, 严禁影印*文:*非经公司同意, 严禁影印*文:*非经公司同意, 严禁影印*文:*非经公司同意, 严禁影印*文:*非经公司同意, 严禁影印*文:*非经公司同意, 严禁影印*□硬件模块调试报告□产品硬件测试报告收文:05-05C * 非经公司同意, 严禁影印**非经公司同意, 严禁影印**非经公司同意, 严禁影印**非经公司同意, 严禁影印**非经公司同意, 严禁影印**非经公司同意, 严禁影印*收文:05-05C *非经公司同意, 严禁影印*收文:05-05C *非经公司同意, 严禁影印*收文:05-05C *非经公司同意, 严禁影印*收文:05-05C *非经公司同意, 严禁影印*收文:05-05C * 非经公司同意, 严禁影印*05-05C *非经公司同意, 严禁影印*收文:05-05C *非经公司同意, 严禁影印*收文:05-05C *非经公司同意, 严禁影印*收文:05-05C *非经公司同意, 严禁影印*收文:05-05C *非经公司同意, 严禁影印*收文:05-05C *非经公司同意, 严禁影印*收文:05-05C *非经公司同意, 严禁影印*收文:05-05C *非经公司同意, 严禁影印*收文:05-05C *非经公司同意, 严禁影印*收文:05-05C *非经公司同意, 严禁影印*收文:05-05C *非经公司同意, 严禁影印*收文:05-05C *非经公司同意,严禁影印*收文:05-05C *非经公司同意, 严禁影印*收文:05-05C *非经公司同意, 严禁影印*收文:05-05C *非经公司同意, 严禁影印*收文:05-05C*非经公司同意, 严禁影印*XXXXXXXX有限公司收文:05-05C *非经公司同意, 严禁影印*收文:05-05C *非经公司同意, 严禁影印*]收文:05-05C *非经公司同意, 严禁影印*收文:05-05C *非经公司同意, 严禁影印*收文:05-05C *非经公司同意, 严禁影印*收文:05-05C *非经公司同意, 严禁影印*收文:05-05C *非经公司同意, 严禁影印*收文:05-05C *非经公司同意, 严禁影印*收文:05-05C *非经公司同意, 严禁影印*XXXXXXXX有限公司收文: 05-05C。
DO-254机载电子设备硬件设计保证指南
机载电子设备硬件设计保证指南RTCA/DO-2542000年4月19日编制:SC-180本标准是由RTCA第180专门委员会(SC-180)编制的。
2000年4月19日经RTCA程序管理委员会批准。
RTCA SC-180和欧洲民用航空设备组织(EUROCAE)WG-46工作组通过一致的过程联合完成了本指南的开发。
RTCA股份公司是一个非盈利性机构,旨在推进航空科学技术和航空电子系统发展以便利大众。
该组织的职能类似于联邦顾问委员会,致力于为现代航空业务提供协调一致的建议。
RTCA的目标包括但不局限于:●以适当的方式整合航空系统用户和供应商的技术要求,使其有助于政府和工业部门能满足双方的目标和责任。
●对不断追求日益增长的安全性、系统容量和效率的航空业务所面对的系统技术问题进行分析并提供解决方案。
●在相关技术的应用方面开发协调一致的标准来满足用户和供应商的要求,包括用于支持航空的电子系统和设备的最低工作性能标准的开发。
●协助开发相关的技术材料,使国际民航组织和国际电信联盟和其它感兴趣的国际组织可以在其基础上使用。
组织的建议通常用作政府和私人机构决定的基础,以及许多联邦航空管理技术标准指令的基础。
因为RTCA不是美国政府的一个官方机构,其建议不能被视为官方政府政策声明,除非在与该建议有关的任何事务方面有法令管辖权的美国政府组织或机构这样宣布。
航空工业对负载电子硬件的开发和应用已经产生了对新的安全和鉴定方面的问题。
作为响应,RTCA SC-180和EUROCAE WG-46成立了。
在本标准编写的较早阶段,WG-46和SC-180同意成为一个联合委员会。
该联合委员会被特许开发清楚一致的电子机载硬件设计保证指南,使其安全地实现其预期的功能。
电子机载硬件包括航线替代单元、电路板组件、特定用途的集成电路和可编程逻辑设备等等。
本指南适用于当前的、更新的和扩展的技术。
本标准中的指南拟为飞机制造商和用于飞机系统的电子硬件项目的供应商所使用。
PRS-753A 型线路保护装置技术使用说明书
Ver 1.00
编写: 潘军军 俞伟国 审核: 侯 林 陈远生 批准: 徐成斌
长园深瑞继保自动化有限公司 二〇一三年八月
本说明书适用于国网地区按照六统一设计规范的传统站PRS-753A/C-G型线路保护装置。 本装置用户权限密码:800。 装置型号说明:
装置型号 PRS-753 X-G-XXXXX V1.00 XXXXXX XXXX
3. 功能及原理................................................................................................. 6
3.1. 3.2. 3.3. 3.4. 3.Байду номын сангаас. 3.6. 3.7. 3.8. 3.9. 3.10. 3.11. 3.12. 3.13. 3.14. 3.15. 3.16.
85附图1装置插件布置图86附图2装置端子排接线图87目录长园深瑞继保自动化有限公司附图3光通信板信号灯说明88概述长园深瑞继保自动化有限公司概述prs753acg型线路保护装置是基于传统变电站开发的线路保护装置适用于qgdw1612013线路保护及辅助装置标准化设计规范规定要求的线路保护技术规范
PRS-753A/C-G 型线路保护装置
4. 配置及定值............................................................................................... 35
4.1. PRS-753A-G 定值 ................................................................................................35 4.2. PRS-753C-G 定值 ................................................................................................38 4.3. 定值整定说明 ......................................................................................................42
中山项目(N5200)硬件概要设计说明书
中山项目硬件概要设计说明书文档作者:陈华兴日期:2010-05-26 项目/PDT经理:日期:审核:日期:批准:日期:同洲电子股份有限公司版权所有内部资料注意保密文档历史发放及记录目录文档历史发放及记录 (2)目录 (3)1、引言 (3)1.1 文档目的 (3)1.2 适用范围 (3)1.3 产品信息 (4)1.4 硬件名称 (4)1.5 术语和缩略语 (4)1.6 参考资料 (4)2、总体设计 (4)2.1 需求规定 (4)2.2 功能要求 (4)2.3 性能指标 (5)2.4 开发环境 (5)2.5 设计思想 (5)3、硬件模块划分 (5)3.1 系统结构框图 (5)3.2 系统逻辑框图 (5)3.2.1 系统核心模块 (5)3.2.2音、视频处理模块 (5)3.2.3 GPIO分配及片选规划 (5)3.3 单板及功能 (6)4、接口设计 (6)面板与主板接口 (6)IC卡板与与主板接口 (6)电源板与主板接口 (6)5、可靠性、安全性、电磁兼容性设计 (6)6、电源设计 (7)6.1 输出接口引脚定义 (7)6.2输出特性 (7)6.3 输入电压 (7)7、工艺结构设计 (8)8、可测试性设计 (8)9、硬件调试方法与步骤 (8)10、元器件选用与结构布局合理性分析设计 (8)10.1 元器件选用的合理性分析设计 (8)10.2 结构布局的合理性分析设计 (8)1、引言1.1文档目的本文档主要说明了中山项目(N5200)标清数字电视接收机硬件的总体设计,各硬件模块划分,接口设计,可靠性、安全性、电磁兼容性设计,工艺结构设计,测试设计,系统调试与测试方法等。
1.2适用范围本文档主要适用的阅读人员有:PDT经理,项目经理,软硬件开发人员,QA测试人员,产品部人员,市场竞标人员等.本文档适用于研发,测试,产品,市场等领域.1.3产品信息产品名称:标清数字有线电视接收机产品型号:N52001.4硬件名称N5200包括以下硬件:(1)主板:XXX.XXX.XX(2)面板:XX.XX.XX(3)IC卡小板:IC.663.08(4)电源板:PW.317.XX1.5术语和缩略语缩略语/术语全称说明1.6参考资料1、ST5197 DATASHEET2、20100517招标文件(数字电视机顶盒).doc2、总体设计2.1需求规定2.1.0 完全符合MPEG-2/DVB标准;2.1.1 MPEG-2标清解码(MB@ML)2.1.2复合视频端子/S-VIDEO输出:PAL/NTSC;2.1.3 支持YPbPr输出;2.1.4 支持S/P DIF输出;2.1.5 支持以太网输出(RJ-45,1个);2.1.6 支持USB输出(前面板,1个);2.1.7 支持RF OUT输出;2.2功能要求1.支持DVB-C 信号输入;2.支持CVBS、YPbPr、S/P DIF输出;3.支持以太网输出;4.左右声道的AV音频接口;5.支持USB接口;6.面板六个按键控制系统菜单(节目+、节目-、音量+、音量-、主菜单、确定);7.系统状态和信号锁定指示灯;8.电源输入接口;2.3性能指标[列出本硬件系统所有的总体性能指标要求和有关的标准性文件。
技术手册B51
技术手册目录第一章公共广播 (2)第二章LED显示屏 (20)第三章弱电工程 (24)第四章音响 (48)第一章公共广播第一部分公共广播的基本知识公共广播顾名思义就是各种公共场所的广播。
比如宾馆、商场、车站、港口、机场、学校等等这些地方都是公共场所,这些地方都需要公共广播,可以说有人的地方就需要公共广播。
为什么公共广播如此重要呢?第一,这些地方都需要经常播放一些信息让群众了解,比如商场要介绍产品的信息,车站机场要播放各车次航班的信息等等,如果没有广播设施,这些功能就没法顺利实现或者达不到理想的效果。
第二,随着人民生活水平的提高,对环境的要求也在提高。
大家希望工作或生活的环境更加舒适轻松,广播设施可以播放轻松优美的音乐,满足大家的需要。
这一方面的功能越来越引起人们的重视。
第三,现在公共广播系统还兼作紧急广播,与消防报警系统联动,在各种紧急情况下及时播放各种紧急通知,有效的避免和降低了灾害的损失,有些地方是国家机关明令必须安装的设施。
公共广播有如此重要的作用,我们就很有必要了解公共广播的发展情况,掌握公共广播工程方面的技术。
最基本的公共广播系统需要音源、广播功放、广播喇叭。
无论多么简单的广播系统都必须有这三个组成部分。
这个系统虽然简单,但是基本的广播功能在一定的范围内都能实现,比如播放通知,背景音乐等等。
随着经济的发展,公众对广播的功能要求越来越高,并且随着技术的发展,为实现新的功能提供了技术上的保证。
公共广播的发展有了新的趋势,最基本的就是网络化、数字化的趋势。
现在很多的公共广播生产厂商在研发方面积极投入,推出了一系列的全新的公共广播系统。
比如点对点的寻址功能,利用有线电视网络,采用射频技术,达到共网传输,而且能同时传输8路音源等等,新的技术层出不穷。
象我们现在做的CHUNGSON公共广播系统就有CS3000数字交换式广播系统,CS1800/CS1600微机寻址广播系统,数控寻址广播系统等等一系列的数字公共广播系统。
PRS-753整机现场调试大纲.2.00.080301
戴振儒
版本号.定版日期
2.00.080301
根据项目组输出的 PRS-753 系列线路保护装置试验指导书,作相应升级
版本号.定版日期
版本号.定版日期
深圳南瑞科技有限公司
第1页
SZNARI/ZD-14-07-03-09
目录
1. 环境与电源 ..........................................................................1
3.2.1. 交流板 ............................................................................................................................... 2 3.2.2. 交流量 ............................................................................................................................... 2
PRS-753 整机现场调试大纲Ver 2Fra bibliotek00.080301
编写: 审核: 批准:
深圳南瑞科技有限公司 二〇〇八年三月
升级序号 1 2 3
编辑人 修订人 修订说明 修订人 修订说明 修订人 修订说明
SZNARI/ZD-14-07-03-09
文档升级说明
戴振儒
版本号.定版日期
2.00.060901
7. 打印功能调试.......................................................................7
机械设计手册 (第五版)目录 第四卷
机械设计手册(第五版)目录第4卷第15篇多点啮合柔性传动第1章概述第2章悬挂安装结构第3章悬挂装置的设计计算第4章柔性支撑的结构形式和设计计算第5章专业技术特点第6章整体结构的技术性能、尺寸系列和选型方法第7章多点啮合柔性传动动力学计算第16篇减速器、变速器第1章减速器设计一般资料P1181、常用减速器的分类、型式及其应用范围P1182、圆柱齿轮减速器标准中心距(摘自GB/T10090-1988)P1203、减速器传动比的分配与计算P1214、减速器的结构尺寸P1255、减速器轴承的选择P1336、减速器主要零件的配合P1347、齿轮与蜗杆传动的效率和散热计算P1348、齿轮与蜗杆传动的润滑P1389、减速器技术要求P14210、减速器典型结构示例P143第2章标准减速器及产品P1541、ZDY、ZLY、ZSY型硬齿面硬齿面圆柱齿轮减速器P1542、3、4、5、6、7、8、9、10、11、12、13、14、模块化系列斜齿轮减速电机P43014.1 SEW R系列14.214.3 SEW R系列第3章机械无极变速器及产品P475第17篇常用电机、电器及电动(液)推杆与升降机P516第1章常用电机P5181、电动机的特性、工作状态及其发热与温升P5182、电动机的选择P5233、异步电机常见故障5434、常用电动机规格544第2章常用电器 6901、电磁铁6902、行程开关6933、接近开关7124、光电开关7255、光电编码器7316、管状电加热元件735第3章电动、电液推杆与升降机 7441、电动推杆7442、电液推杆7573、升降机776第18篇机械振动的控制及利用 789主要符号 791第1章概述 7931、机械振动的分类及机械工程中的振动问题7932、油管振动的部分标准7953、机械振动等级的评定799第2章机械振动的基础资料 8031、机械振动表示方法8032、弹性构件的刚度8053、阻尼系数8084、振动系统的固有角频率8105、同向简谐振动合成8216、各种机械产生振动的扰动频率822第3章线性振动 823第4章非线性振动与随机振动 837第5章振动的控制 856第6章机械振动的利用 904第7章机械振动的测量技术 949第8章轴和轴系的临界转速 964第19篇机架设计 984第1章机架结构概论 9861、机架结构类型9862、机架杆系的几何不变性9983、机架设计计算的准则和要求9914、机架结构的选择9925、几种典型机架结构形式998第2章机架设计的一般概论 1018第3章梁的设计与计算 10391、梁的设计10392、梁的计算1051第4章柱和立架的设计与计算 10631、柱和立架的形状10632、柱的连接及柱和梁的连接10693、稳定性计算10744、柱的计算用表1084第5章桁架的设计与计算 10911、静定梁式平面桁架的分类10912、桁架的结构10923、静定平面桁架的内力分析10984、桁架的位移计算11025、超静定桁架的计算11096、空间桁架1110第6章框架的设计与计算 11161、刚架的结点设计11172、刚架内力分析方法11183、框架的位移11264、等截面刚架内力计算公式1132第7章其它形式的机架 11421、整体式机架11422、箱型机架1148第20篇塑料制品与塑料注射成型模具设计第1章塑料制品的设计第2章塑料注射成型工艺第3章塑料注射成型模具设计第4章热固形塑料注射成型模具第5章塑料注射成型模具实例第6章塑料注射成型模具标准模架第7章塑料注射成型模具设计程序与CAD。
MAX4754-MAX4756 低电阻开关-用户手册说明书
General DescriptionThe MAX4754/MAX4754A/MAX4755/MAX4756/MAX4756A low on-resistance, analog switches operate from a single +1.8V to +5.5V supply. The MAX4754/MAX4754A and MAX4755 are dual, double-pole, double-throw (DPDT)switches. The MAX4756/MAX4756A are quad, single-pole double-throw (SPDT) switches. They are configured to route either audio or data signals.The MAX4754/MAX4754A have four 0.5ΩSPDT switches for audio-signal routing and two logic control inputs. The MAX4755 has four 0.5ΩSPDT switches (with two switches that have an additional 11Ωseries resistor at the NC terminals). This allows users to drive an 8Ωspeaker as a 32Ωload (ear speaker). The MAX4756/MAX4756A have four 0.5ΩSPDT switches controlled by one logic control input and an enable input (EN ) to dis-able the switches.The MAX4754/MAX4754A/MAX4755/MAX4756/MAX4756A are available in a space-saving 16-pin TQFN and a tiny 16-bump, 2mm x 2mm chip-scale package (UCSP™).ApplicationsSpeaker-Headset Switching Audio-Signal Routing Cellular PhonesPDAs/Handheld Devices Notebook ComputersFeatures♦Data and Audio-Signal Routing♦Low R ON (0.5Ω typ) Audio Switches♦0.1Ω(typ) Channel-to-Channel Matching ♦0.2Ω(typ) On-Resistance Flatness ♦0.035% (typ) THD♦Improved Power-Supply Current for Non-Rail-to-Rail Control Logic Inputs (MAX4754A/MAX4756A)♦+1.8V to +5.5V Supply Range ♦Rail-to-Rail Signal Handling ♦16-Bump UCSP (2mm x 2mm)MAX4754/MAX4754A/MAX4755/MAX4756/MAX4756A________________________________________________________________Maxim Integrated Products 1Ordering InformationFor pricing, delivery, and ordering information,please contact Maxim/Dallas Direct!at 1-888-629-4642, or visit Maxim’s website at .Functional DiagramsUCSP is a trademark of Maxim Integrated Products, Inc.Pin Configurations appear at end of data sheet.Note:These devices operate over the -40°C to +85°C operating temperature range.*Future product—contact factory for availability.**EP = Exposed paddle.+Denotes lead-free package.M A X 4754/M A X 4754A /M A X 4755/M A X 4756/M A X 4756A0.5Ω, Quad SPDT Switches in UCSP/QFNABSOLUTE MAXIMUM RATINGSELECTRICAL CHARACTERISTICS(V+ = +2.7V to +5.25V, T = -40°C to +85°C, unless otherwise noted. Typical values are at +3V and T = +25°C.) (Notes 2, 3)Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.(All voltages referenced to GND.)V+, IN_, EN ...............................................................-0.3V to +6V COM_, NO_, NC_ (Note 1)...........................-0.3V to (V+ + 0.3V)Continuous CurrentNC1, NC2, COM1, COM2 (MAX4755)........................±100mA NO_, NC_, COM_ (remaining terminal connections)....±300mA Peak Current NC1, NC2, COM1, COM2 (MAX4755)(Pulsed at 1ms, 10% duty cycle)................................±200mA (Pulsed at 1ms, 50% duty cycle)................................±150mA Peak Current NO_, NC_,COM__ (remaining terminal connections)(Pulsed at 1ms, 10% duty cycle)............................±500mA (Pulsed at 1ms, 50% duty cycle)............................±400mAContinuous Power Dissipation (T A = +70°C)16-Bump UCSP (derate 8.2mW/°C above +70°C)......660mW 16-Pin TQFN (derate 16.9mW/°Cabove +70°C)............................................................1349mW ESD per Method 3015.7...................................................±2kV Operating Temperature Range ...........................-40°C to +85°C Junction Temperature......................................................+150°C Storage Temperature Range.............................-65°C to +150°C Bump Temperature (soldering)Infrared (15s)...............................................................+220°C Vapor Phase (60s).......................................................+215°C Lead Temperature (soldering, 10s).................................+300°CNote 1:Signals on NO_, NC_, COM_ exceeding V+ or GND are clamped by internal diodes. Limit forward-diode current to maximumcurrent rating.ELECTRICAL CHARACTERISTICS (continued)MAX4754/MAX4754A/MAX4755/MAX4756/MAX4756A0.5Ω, Quad SPDT Switches in UCSP/QFNM A X 4754/M A X 4754A /M A X 4755/M A X 4756/M A X 4756A0.5Ω, Quad SPDT Switches in UCSP/QFN 4_______________________________________________________________________________________Note 3:UCSP parts are 100% tested at +25°C and limits across the full temperature range are guaranteed by correlation anddesign. TQFN parts are 100% tested at +85°C and limits across the full temperature range are guaranteed by correlation and design.Note 4:R ON and ΔR ON matching specifications are guaranteed by design and correlation.Note 5:ΔR ON = R ON(MAX)- R ON(MIN).Note 6:Flatness is defined as the difference between the maximum and minimum value of on-resistance as measured over thespecified analog signal ranges.Note 7:Guaranteed by design, not production tested.Note 8:Off-Isolation = 20log 10[V COM / (V NO or V NC )], V COM = output, V NO or V NC = input to off switch.Note 9:Between any two switches.ELECTRICAL CHARACTERISTICS (continued)(V+ = +2.7V to +5.25V, T A = -40°C to +85°C, unless otherwise noted. Typical values are at +3V and T A = +25°C.) (Notes 2, 3)MAX4754/MAX4754A/MAX4755/MAX4756/MAX4756A0.5Ω, Quad SPDT Switches in UCSP/QFN_______________________________________________________________________________________5Typical Operating Characteristics(V+ = 3V, T A = +25°C, unless otherwise noted.)01.00.52.52.01.54.03.53.04.521345ON-RESISTANCE vs. V COM (MAX4754A/MAX4756A)V COM (V)R O N (Ω)00.30.20.10.40.50.60.70.80.91.0123ON-RESISTANCE vs. V COM AND TEMPERATUREV COM (V)R O N (_)00.30.20.10.40.50.60.70.80.91.021345ON-RESISTANCE vs. V COM AND TEMPERATUREV COM (V)R O N (_)ON-RESISTANCE vs. V COMV COM (V)R O N (Ω)4.54.03.0 3.51.0 1.5 2.0 2.50.510.511.011.512.012.513.010.05.0ON-RESISTANCEvs. V COM AND TEMPERATUREV COM (V)R O N (Ω)3.02.52.01.51.00.510.511.011.512.012.513.010.0ON-RESISTANCEvs. V COM AND TEMPERATUREV COM (V)R O N (Ω)5.04.53.52.5 4.03.02.01.51.00.510.511.011.512.012.513.010.0NO/NC OFF-LEAKAGE CURRENTvs. TEMPERATURE(MAX4754/MAX4755/MAX4756)TEMPERATURE (°C)N O /N C O F F -L E A K A G E (n A )603510-150.11100.01-4085COM ON-LEAKAGE CURRENTvs. TEMPERATURETEMPERATURE (°C)C O M O N -L E A K A G E C U R R E N T (n A )603510-150.11100.01-4085CHARGE INJECTION vs. V COM (MAX4754/MAX4755/MAX4756)V COM (V)C H A R G E I N J E C T I O N (p C )432110203040506070809010011012005M A X 4754/M A X 4754A /M A X 4755/M A X 4756/M A X 4756A0.5Ω, Quad SPDT Switches in UCSP/QFN 6_______________________________________________________________________________________Typical Operating Characteristics (continued)(V+ = 3V, T A = +25°C, unless otherwise noted.)CHARGE INJECTION vs. V COMV COM (V)C H A R G E I N J E C T I O N (p C )432150100150200250005SUPPLY CURRENT vs. SUPPLY VOLTAGEM A X 4754A -56A t o c 11SUPPLY VOLTAGE (V)S U P P L Y C U R R E N T (n A )54320.20.40.60.81.01.21.41.61.82.0016SUPPLY CURRENT vs. TEMPERATURE (MAX4754/MAX4755/MAX4756)TEMPERATURE (°C)S U P P L Y C U R R E N T (n A )603510-150.010.11101000.001-4085SUPPLY CURRENT vs. TEMPERATURE(MAX4754A/MAX4756A)TEMPERATURE (°C)S U P P L Y C U R R E N T (n A )6035-10-150.010.11101000.001-4085LOGIC THRESHOLD vs. SUPPLY VOLTAGE(MAX4754/MAX4755/MAX4756)SUPPLY VOLTAGE (V)L O G I C T H R E S H O L D (V )5.04.54.03.53.02.52.00.40.81.21.62.02.401.55.5LOGIC THRESHOLD vs. SUPPLY VOLTAGE(MAX4754A/MAX4756A)SUPPLY VOLTAGE (V)L O G I C T H R E S H O L D (V )4.53.52.50.20.40.60.81.01.21.40.01.55.5TURN-ON/OFF TIMES vs. SUPPLY VOLTAGE(MAX4754/MAX4755/MAX4756)SUPPLY VOLTAGE (V)t O N /t O F F (n s )5.04.54.03.53.02.52.01020304050607001.55.5TURN-ON/OFF TIMES vs. SUPPLY VOLTAGE(MAX4754A)SUPPLY VOLTAGE (V)t O N /t O F F (n s )1.52.53.54.55.5100200300400500600700800TURN-ON/OFF TIMES vs. TEMPERATURE(MAX4754/MAX4755/MAX4756)TEMPERATURE (°C)t O N /t O F F (n s )603510-1510203040500-4085MAX4754/MAX4754A/MAX4755/MAX4756/MAX4756A0.5Ω, Quad SPDT Switches in UCSP/QFN_______________________________________________________________________________________7Typical Operating Characteristics (continued)(V+ = 3V, T A = +25°C, unless otherwise noted.)TURN-ON/OFF TIMES vs. TEMPERATURE(MAX4754A)SUPPLY VOLTAGE (V)t O N /t O F F (n s )-40-1510356085050100150200250300350400450SUPPLY CURRENT vs. LOGIC CONTROL INPUTIN_ (V)CR O W B A R C U R R E N T (n A )01234565001000150020002500300035004000FREQUENCY REPSONSEFREQUENCY (MHz)O N -L O S S (d B )1010.0010.010.1-120-100-80-60-40-20020-1400.0001100TOTAL HARMONIC DISTORTION PLUS NOISE vs. FREQUENCYFREQUENCY (kHz)T H D + N (%)1010.10.010.11.00.0010.01100M A X 4754/M A X 4754A /M A X 4755/M A X 4756/M A X 4756A0.5Ω, Quad SPDT Switches in UCSP/QFN 8_______________________________________________________________________________________MAX4754/MAX4754A/MAX4755/MAX4756/MAX4756A0.5Ω, Quad SPDT Switches in UCSP/QFN_______________________________________________________________________________________9Detailed DescriptionThe MAX4754/MAX4754A/MAX4755/MAX4756/MAX4756A low on-resistance analog switches operate from a single +1.8V to +5.5V supply. The devices are fully specified for nominal 3V applications.The MAX4754/MAX4754A DPDT switch have two logic control inputs with each input controlling two SPDT switches. Each switch has a 0.5Ωon-resistance in the NO and NC terminals making it ideal for switching audio signals.The MAX4755 DPDT switch also has four 0.5ΩSPDT switches with the switch pairs 1 and 2 adding an 11.5Ωseries resistor to the NC terminal. This feature allows the user to drive an 8Ωspeaker as a 32Ωload, allowing it to be used as an ear speaker. Two logic control inputs are used to control the four switches.The MAX4756/MAX4756A has four 0.5ΩSPDT switches controlled by one logic control input (INA) and EN input to disable the switches.Applications InformationDigital Control InputsThe MAX4754/MAX4754A/MAX4755/MAX4756/MAX4756A logic inputs accept up to +5.5V regardless of the sup-ply voltage. For example, with a +3.3V supply IN_ can be driven low to GND and high to +5.5V, which allows mixed logic levels in a system. Driving the control logicinputs rail-to-rail also minimizes power consumption.For a +3V supply voltage, the logic thresholds are 0.5V (low) and 1.4V (high).For the MAX4756/MAX4756A, drive EN low to enable the COM_. When EN is high, COM _ is high impedance.Analog Signal LevelsAnalog signal inputs over the full voltage range (0V to V+) are passed through the switch with minimal change in on-resistance (see the Typical Operating Charac-teristics ). The switches are bidirectional so NO_, NC_,and COM_ can be either inputs or outputs.Power-Supply BypassingPower-supply bypassing improves noise margin and pre-vents switching noise from propagating from the V+ sup-ply to other components. A 0.1µF capacitor connected from V+ to GND is adequate for most applications.UCSP Applications InformationFor the latest application details on UCSP construction,dimensions, tape carrier information, printed circuit board techniques, bump-pad layout, and recommend-ed reflow temperature profile, as well as the latest infor-mation on reliability testing results, go to the Maxim website at /ucsp for the Application Note: UCSP—A Wafer-Level Chip-Scale Package .Typical Operating CircuitM A X 4754/M A X 4754A /M A X 4755/M A X 4756/M A X 4756A0.5Ω, Quad SPDT Switches in UCSP/QFN 10______________________________________________________________________________________Timing Circuits/Timing DiagramsFigure 1. Switching TimeFigure 2. Break-Before-Make IntervalFigure 3. Charge InjectionTiming Circuits/Timing Diagrams (continued)MAX4754/MAX4754A/MAX4755/MAX4756/MAX4756A0.5Ω, Quad SPDT Switches in UCSP/QFNFigure4. On-Loss, Off-Isolation, and CrosstalkFigure5. Channel On-/Off-Capacitance______________________________________________________________________________________11M A X 4754/M A X 4754A /M A X 4755/M A X 4756/M A X 4756A0.5Ω, Quad SPDT Switches in UCSP/QFN 12______________________________________________________________________________________Pin Configurations/Truth TablesChip InformationPROCESS: CMOSPackage Information MAX4754/MAX4754A/MAX4755/MAX4756/MAX4756A0.5Ω, Quad SPDT Switches in UCSP/QFN (The package drawing(s) in this data sheet may not reflect the most current specifications. For the latest package outline information,go to /packages.)M A X 4754/M A X 4754A /M A X 4755/M A X 4756/M A X 4756A0.5Ω, Quad SPDT Switches in UCSP/QFN 14______________________________________________________________________________________MAX4754/MAX4754A/MAX4755/MAX4756/MAX4756A0.5Ω, Quad SPDT Switches in UCSP/QFNMaxim cannot assume responsibility for use of any circuitry other than circuitry entirely embodied in a Maxim product. No circuit patent licenses are implied. Maxim reserves the right to change the circuitry and specifications without notice at any time.Maxim Integrated Products, 120 San Gabriel Drive, Sunnyvale, CA 94086 408-737-7600 ____________________15©2006 Maxim Integrated Productsis a registered trademark of Maxim Integrated Products, Inc.Package Information (continued)(The package drawing(s) in this data sheet may not reflect the most current specifications. For the latest package outline information,go to /packages .)Revision HistoryPages changed at Rev 1: 1–5, 7, 8, 13, 14, 15。
475_PDS HART 手操器说明书
475Field CommunicatorProduct Data SheetJuly 2009I Full-color graphical user interfaceI Powerful field diagnostics I Bluetooth ®communication I Long-lasting Lithium-Ion power moduleIUniversal support for HART ®and F OUNDATION TM fieldbusdevices475Field CommunicatorWhat you get is the most powerful handheld available –universal,user upgradeable,intrinsically safe,rugged and reliable.Only the 475Field Communicator can deliver all this in a single handheld communicator.IntroductionThe 475Field Communicator builds on the industry-leading technology of the 375Field Communicator while adding innovative newcapabilities including color display,Bluetooth communication,and advanced field diagnostics.The 475Field Communicator is designed to support all HART and F OUNDATION fieldbus devices from all vendors.Product Data Sheet July2009Product DescriptionThe475Field Communicator is designed to simplify your work in the field.The intuitive full color user interface allows you to leverage the same practices for both HART and F OUNDATION fieldbus devices.It includes a larger touch screen than PDAsor Pocket PCs,supports HART versions5,6,and7(including WirelessHART™)devices,and allows you to upgrade your475 Field Communicator onsite using the Internet.See and Feel the Difference The touch screen display uses transflective technology,making it easy to read in both bright sunlight and normal lighting.To make sureall conditions are covered,amulti-level backlight is included,allowing bright,crisp display evenin plant areas with dim light.The touch screen display and largephysical navigation buttons providefor efficient use both on the benchand in the field.The full color graphics capability isprovided as standard with every475Field Communicator.It usespowerful EDDL technology to allowyou to read data from field devicesin a graphical manner.Charts,graphs,gauges,and productimages are just a few of the waysin which important device data canbe displayed using the475FieldCommunicator’s color LCD display.The weight of the475FieldCommunicator is evenlydistributed for comfortableone-handed operation in the field.It runs on Windows CE,a robust,real-time operating system.The475Field Communicatorhas plenty of memory to allow forfuture expansion.It has32MB ofapplication memory and1GB ofmemory on its System Card.User UpgradeableEasy Upgrade Keeps YourCommunicator CurrentThe475Field Communicator isuser upgradeable via the Internet.Avoid the time delays of sendingyour communicator to a servicecenter for upgrades.With theEasy Upgrade option,you candownload new device drivers,functionality,or licenses directlyto your475Field Communicator.Keeping your475FieldCommunicator updated is easy.New HART and F OUNDATIONfieldbus devices,as well asfunctional updates to existingdevices,are introduced continuallyby device vendors.Keepingup-to-date with the requiredDevice Descriptions(DDs)for allthe devices in your plant can bea real challenge.With Easy Upgrade,when newHART and F OUNDATION fieldbusDDs become available,you cansimply download them from theInternet and upgrade your475Field Communicator.Update atyour site,within your control,when it’s convenient for you.Designed not only for use on the bench,the475Field Communicator also enables you to do those tasks that just have to be done in the field.Page2Through Easy Upgrade ,you always have access to the latest HART and fieldbus drivers.With the 475Field Communicator,you are guaranteed universal HART and F OUNDATION fieldbus support in a single,intrinsically safe handheld communicator.Page 3Online LicensingThe Online Licensing capability provided with Easy Upgradeallows you to enable new options for your 475Field Communicator over the Internet.With Online Licensing,powerful options like F OUNDATION fieldbus can be added by simply purchasing the license and downloading it directly to your communicator.Universal –HART and F OUNDATION fieldbusWith over 1,100different HART and F OUNDATION fieldbus devices available from more than 100manufacturers,the 475Field Communicator works with all your devices to positively impact your bottom line.475FieldCommunicatorThe Easy Upgrade Utility allows you to transfer system software,DDs,and HART device configurations between the 475Field Communicator and a PC.Connect using IrDA,Bluetooth,or an SD Card Reader.((()))Easily store and print device configurations for analysis and documentation requirements.Rugged and ReliableIt’s called “Field Communicator”for a reason.Some tasks just have to be performed at thedevice in the field.The 475Field Communicator is designed for tough use in your plant or mill.Its large keys and physical navigation buttons allow forone-handed operation,even with your work gloves on.The rugged display is designed to take the knocks and shocks from normal use in the plant.The 475Field Communicator’s Protective Rubber Boot provides added protection in the field and in your toolbox.Both the rubber boot and 475housing are designed in accordance with Intrinsic Safety standards to limitIntrinsically SafeThe 475Field Communicator meets the Intrinsic Safety requirements of the listed regulatory agencies andstandards.All of the available Hazardous Locations approvals are provided in a single model option (see Ordering Information).–CENELEC/ATEX –Factory Mutual (FM)–Canadian Standards Association (CSA)–FISCO –IECExPage 4Product Data SheetJuly 2009the build up of static electrical energy.The 475Field Communicator is designed,manufactured,and tested to very demandingspecifications.It is ready to go wherever you need to go to get the jobdone.ATEXThe 475Field Communicator,with its handy carrying case,provides a single tool for configuring and diagnosing HART and F OUNDATION fieldbus devices.Even the power module is approved for installation in hazardousareas.The protective rubber boot provides added protection in the field.Page 5475FieldCommunicatorPowerful DiagnosticsInterface with AMS Device ManagerThe 475Field Communicator is fully compatible with AMS Device Manager,the industry standard for asset management software.In fact,Control Magazine readers have selected AMS Device Manager as the #1Calibration Software package for over 10years in a row.AMS Device Manager uses the intelligence from field devices to create a predictive maintenance environment.AMS Device Manager allows you to configure,calibrate,configurations in yourcommunicator or transfer them to AMS Device Manager.Together,the 475FieldCommunicator and AMS Device Manager enable you to efficiently manage all of your devices.Device Configuration ManagementUsing the Easy Upgrade Utility,you can back up hundreds of device configurations and can transfer them between your communicator and a PC.This library of device configurations is easy to view and print for analysis.document,and troubleshoot HART ,F OUNDATION fieldbus,and WirelessHART devices.Transfer device configuration data to AMS Device Manager via the IrDA port or Bluetooth interface on your 475Field Communicator and PC.Take your 475Field Communicator out to the field to configure or update one or more devices.Save up to 1,000devicePage 6Product Data SheetJuly 2009Detect power supply problems by monitoring low frequency noise on a segment.Locate incorrect terminations and faulty devices by diagnosing the communications signal level.For HART loops,the 475Field Communicator allows you to verify whether the DC voltage in the loop is correct.Diagnose Network Problems The 475Field Communicator can be used to configure all the F OUNDATION fieldbus devices in your e it to perform diagnostics for effective start-up and troubleshooting of fieldbus segments.Create a quality segment by diagnosing the network DC voltage and average noise.SpecificationsMicroprocessorI 80MHz Hitachi ®SH3Memory Internal Flash I 32MBSystem CardI 1GB secure digital card RAMI 32MB WeightI Approximately 1.65lb.(0.75kg)with battery DisplayI 1/4VGA (240by 320pixels)color,3.5in.(8.9cm)transflective display with touch screen I Anti-glare coatedKeypadI 25keys including 4action keys,12alphanumeric keys,tab key,function key,backlight key,power key,and 4cursor-control (arrow)keys;membrane design with tactile feedbackUsageI -10°C (14°F )to +50°C (122°F )I 0%to 95%RH (non-condensing)for 0°C (32°F )to +50°C (122°F )ChargeI 10°C (32°F )to +40°C (104°F )Storage With BatteriesI -20°C (-4°F )to +55°C (131°F )Storage Without BatteriesI -20°C (-4°F )to +60°C (140°F )Enclosure Rating I IP51(from front)ShockITested to survive a 1-meter drop test onto concrete UsageIPC with Internet access I CD Rom driveI IrDA port (or adapter)or Bluetooth (or adapter)I SD Card Reader (required for some upgrades)I Windows XP (SP2or SP3)or Windows Vista Business (SP1)BatteryI Rechargeable Lithium-Ion power module Battery Operating TimeI 20hours –continuous use I 40hours –typical use I 80hours –standby modeBattery Charger OptionsI Input voltage 100-240VAC,50-60Hz I Cables included with U.S.,Europe,and U.K.plugs Battery ChargerIMini DIN 6-pin jackHART and FieldbusI Three 4mm banana plugs (one common to HART and F OUNDATION fieldbus)IrDA PortI IrDA (Infrared Data Access)port supporting up to 115KbpsI ±15degrees recommended maximum angle from center lineI Approximately 18in.(45.7cm)recommended maximum distance BluetoothI Up to 32.8ft.(10m)communication distanceI Uses standard Windows drivers I FCC,IC,and CE approvals475Field Communicator Spare Parts ListRuggedized 250Ohm Load Resistor 00275-0096-0001Rechargeable Lithium-Ion Power Module00475-0002-0022Power Supply &Charger (Li-ion/NiMH)US/UK/EU connection types included 00475-0003-0022Power Supply/Charger Standard Cord Set (US/UK/EU cords)00475-0003-0002Power Supply/Charger Australia (AU)cord 00475-0003-0003Leadset with connectors 00375-0004-0001Mounting Straps00475-0005-0002Carrying Case (with straps)00475-0005-0003Magnetic Hangar 00475-0005-0004Protective Rubber Boot 00475-0005-0005Stylus (pack of 2)00475-0006-0001IrDA to USB Adapter (1)00375-0015-0002System Card (SD)Reader (with USB Interface)(2)00375-0018-0022Bluetooth Adapter (1)00475-0018-0023Stand00475-0044-0001Getting Started Guide 00475-0045-3001F OUNDATION fieldbus License Via Web 00375-0142-0002Easy Upgrade (New)License via Web(3)00375-0142-0003(3)(5)AMS Device Manager Field Communicator Interface Kit (25tags)AW7005HC00025AMS Device Manager Field Communicator Interface Kit (100Tags and above)AW7005HC20000(1)Can be used to support communication between the 475and the Easy Upgrade Programming Utility or AMS Device Manager (with Handheld Communicator Interface Kit.IrDA or Bluetooth communication is required to register the 475and use the Online Licensing system.(2)The System Card (SD)Reader allows a user to upgrade a System Card much faster than when using IrDA or Bluetooth.Due to file size constraints,major upgrades require the use of a card reader.(3)The Easy Upgrade feature allows users to add new System Application software and Device Descriptions (DDs)to the 475for a period of 3years.To upgrade without this feature,the System Card must be sent to a Service Center and the upgrade will be completed for a fee.(4)The Field Communicator Online Licensing system is available to end users but it may also be performed by an agent on the user's behalf.It is at the agent's discretion if an additional fee should apply.Any order must be accompanied by the System Card S/N.Instant notification available licenses for download can be provided to email addresses provided at time of order.For more details,see the Online Licensing procedure at (5)The ReNew option is available on System Cards where the Easy Upgrade license has been expired for less than 90days.Date of expiration can be obtained by inter facing the 475with v1.6.0(or higher)of the Easy Upgrade Programming Utility.(6)Requires AMS Device Manager (v6.2or higher).Both AMS Device Manager and the Handheld Communicator Interface Kit are available for sale through select channels only.See for more details.Page 7475Field Communicator©2009,Emerson Process Management.The contents of this publication are presented for informational purposes only,and while every effort has been made to ensure their accuracy,they are not to be construed as warranties or guarantees,express or implied,regarding the products or services described herein or their use or applicability.All sales are governed by our terms and conditions,which are available on request.We reserve the right to modify or improve the designs or specifications of our products at any time without notice.All rights reserved.AMS is a mark of one of the Emerson Process Management group of companies.The Emerson logo is a trademark and service mark of Emerson Electric Co.All other marks are the property of their respective owners.Emerson Process Management Asset Optimization Division 12001Technology DriveEden Prairie,MN 55344USA T 1(952)828-3206F 1(952)828-3006Product Data SheetMay 2009475Field Communicator475Field Communicator Ordering Information475Field Communicator (1)P Rechargeable Lithium-Ion Power Module Code Power Supply/Charger1Power Supply and Charger NiMH/Li-Ion (US/UK/EU connection types included)(3)9Not included (4)Code Language E English D German J Japanese R RussianCode Product CertificationsKL ATEX,FM,CSA and IECEx Intrinsically Safe (includes FISCO as applicable)NA No Approval Code Easy UpgradeU Easy Upgrade (3year)Option (5)9Not IncludedCode Standard OptionsGMGraphics (included at No Charge)(6)Device Configuration Management (included at No Charge)(7)Code Bluetooth T Bluetooth Communication (8)9No Bluetooth Communication Code Options A Spare Rechargeable Lithium-Ion Power Module (9)S Protective Rubber Boot with Stand Typical HART Model Number:475H P 1E KL U GMT Typical HART/Fieldbus Model Number:475F P 1E KL U GMT(1)Base Model 475includes Field Communicator unit with Color LCD display,System Card,leadset with connectors,carrying case,Getting Started Guide,Resource CD,stylus,and straps.(2)Must specify Easy Upgrade Option (Code U)when ordering this model option.(3)To obtain an Australia power cord,order part number 00375-0003-0003.(4)This option should only be considered if the user already has a 375or 475Power Supply/Charger.If it is a 375Power Supply /Charger,it must be the Li-Ion/NiMH version.(5)The Easy Upgrade capability allows users to add new System Application software and Device Descriptions (DDs)to the 475for a period of 3years.To upgrade without this feature,the System Card would have to be sent to a Service Center.(6)The Graphics functionality enables a user to access enhanced grapical features when using the HART or F OUNDATION fieldbus application.(7)Device Configuration Management provides the capablity to store in excess of 1,000configurations and print them.(8)Bluetooth enables communication to a PC via the Bluetooth protocol.(9)A fully charged Lithium-Ion Power Module is capable of delivering power for 20hours of typical field use.If requirements exceed this specification,a Spare Power Module (code A)should be specified.。
RD4755_Cetus-HW 1.3_CN
君正® RD4755_CETUS开发板硬件手册版本: 1.3日期: 2009年10月君正RD4755_CETUS开发板硬件手册Copyright © Ingenic Semiconductor Co. Ltd 2009. All rights reserved.Release historyDate Revision Change2009年8月 1.2 最新发布。
2009年10月 1.3 修改音频部分电路DisclaimerThis documentation is provided for use with Ingenic products. No license to Ingenic property rights is granted. Ingenic assumes no liability, provides no warranty either expressed or implied relating to the usage, or intellectual property right infringement except as provided for by Ingenic Terms and Conditions of Sale.Ingenic products are not designed for and should not be used in any medical or life sustaining or supporting equipment.All information in this document should be treated as preliminary. Ingenic may make changes to this document without notice. Anyone relying on this documentation should contact Ingenic for the current documentation and errata.北京君正集成电路股份有限公司地址:北京市海淀区东北旺西路8号中关村软件园一号楼信息中心A座108室邮编:100193电话:86-10-82826661传真:86-10-82825845网址:Http: //容内容1概述 (1)1.1RD4755_CETUS开发板主要技术指标及特点 (1)1.2RD4755_CETUS开发板的系统结构图 (2)2硬件描述 (3)2.1RD4755_CETUS开发板布局图 (3)2.2系统电源 (4)2.3系统复位 (4)2.4系统BOOT方式 (4)2.5动态内存(SDRAM) (5)2.6NAND子卡 (5)2.7LCD接口 (5)2.8USB接口 (6)2.9音频子系统 (6)2.9.1Headphone (6)2.9.2MIC (6)2.9.3Speaker (6)2.10视频输出 (6)2.11按键接口 (6)2.12MMC/SD、TF卡(与Nand Flash等其他信号复用) (7)2.13系统状态指示 (7)2.14调频模块 (7)2.15TS/ Camera接口(信号复用) (7)3快速使用RD4755_CETUS开发板 (9)4附录:RD4755_CETUS GPIO定义表 (11)概述1 概述RD4755_CETUS是采用君正JZ4755 高性能32位嵌入式处理器,为用户提供的展示JZ4755多媒体应用处理能力的开发平台。
电子设计产品硬件概要设计(模板)V1.1
4 关键器件选型 ...................................................................................................................................... 10
4.1
单板 1 关键器件选型........................................................................................................... 10
2.2.3 单板 n 功能简介............................................................................................................. 7
2.3
硬件运行环境说明................................................................................................................. 7
3.4.1 单板 n 总体框图及功能说明....................................................................................... 10
3.4.2 单板 n 重用技术分析................................................................................................... 10
SINUMERIK MC Safety Integrated 开机调试手册说明书
前言
1
基本安全说明
2
基本原理
3
F-PLC 的安全程序
4
驱动集成的安全功能
5
6 驱动集成的安全功能的控制方
式
调试和配置
7
验收测试
8
诊断
9
更换软/硬件
10
数据描述
11
系统特性
12
附录
A
法律资讯 警告提示系统
为了您的人身安全以及避免财产损失,必须注意本手册中的提示。人身安全的提示用一个警告三角表示,仅与财产损 失有关的提示不带警告三角。警告提示根据危险等级由高到低如下表示。
3 基本原理 ........................................................................................................................................ 35
3.1
F-PLC 的安全功能......................................................................................................... 35
1.6
SINUMERIK 操作软件 ................................................................................................... 21
1.7
按照 SINUMERIK 来配置报文 ........................................................................................ 22
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All information in this document should be treated as preliminary. Ingenic may make changes to this document without notice. Anyone relying on this documentation should contact Ingenic for the current documentation and errata.
Ingenic® Jz4755
Board Design Guide
Revision: 1.0 Date: Sep. 2009
Ingenic Jz4755
Board Design Guide
Copyright © Ingenic Semiconductor Co. Ltd 2009. All rights reserved.
3 External Memory Interface Design Guidelines .................................. 7
3.1 Overview ................................................................................................................................. 7 3.2 Memory sub-system................................................................................................................ 7
2 Platform Stack-Up and Placement ..................................................... 3
2.1 General Design Considerations.............................................................................................. 3 2.2 Nominal 4-Layer Board Stack-Up ........................................................................................... 3 2.3 PCB Technology Considerations ............................................................................................ 4
5 Video Design Guidelines ................................................................. 15
5.1 Video Power.......................................................................................................................... 15 5.2 VIDEO Out ............................................................................................................................ 15
3.2.1 Boot Memory ................................................................................................................... 7 3.2.2 NAND Flash Connection ................................................................................................. 8 3.3 SDRAM ................................................................................................................................... 8
9.1 Touch Screen ........................................................................................................................ 23 9.2 Battery Voltage Measurement..................................................................................y
Date Sep. 2009
Revision
1.0
First release
Change
Disclaimer
This documentation is provided for use with Ingenic products. No license to Ingenic property rights is granted. Ingenic assumes no liability, provides no warranty either expressed or implied relating to the usage, or intellectual property right infringement except as provided for by Ingenic Terms and Conditions of Sale.
8 Camera ............................................................................................ 21
9 SAR A/D Controller .......................................................................... 23
Ingenic Semiconductor Co., Ltd.
Room 108, Information Center Block A Zhongguancun Software Park, 8 Dongbeiwang west Road, Haidian District, Beijing China, 100193 Tel: 86-10-82826661 Fax: 86-10-82825845 Http: //
6 USB Design Guidelines ................................................................... 17
7 LCD ................................................................................................. 19
Content
Content
1 Overview............................................................................................ 1
1.1 Introduction ............................................................................................................................. 1 1.2 Reference Platform ................................................................................................................. 2
4 Audio Design Guidelines ..................................................................11
4.1 Audio Power...........................................................................................................................11 4.2 Headphone Out......................................................................................................................11 4.3 Mic In..................................................................................................................................... 12 4.4 Line In ................................................................................................................................... 12 4.5 Layout Guideline ................................................................................................................... 12