封装设备

10-0830224
Invention
0196366
Invention Semiconductor Die Ejecting Machine
10-0865766
Invention
0196367
Invenቤተ መጻሕፍቲ ባይዱion
Flipper for Semiconductor Die bonding Machine Solder Ball Mounting system for Ball Gris Array Solder Ball Mounting Method and Equipment for IC Package Ball supply open/close Valve for Ball dispensing
Description Solder Ball Mounting system for Ball Gris Array Solder Ball Mounting Method and Equipment For IC Package Solder Ball Mounting Method and relative Equipment For IC Package Ball Supply system for Ball Dispensing Ball Mounting and Marking system for IC Package Auto focus & Test Method and Equipment for Camera Module Housing Attach Method and Equipment for Camera Module Dipping Method and Equipment for Housing Attach Of Camera Module Lens Barrel Assembly method and equipment for Camera Module Easy condition application for registration between PCB substrate & Flux/Ball tool
Application No 19960030638 19960034223 19960034224 19990014055 20000078533 20040063197 20040067180 20040067181 20050028934 20060020022
Registration No 0196365
Contents
Company Overall Introduction
Company History
Company Organization and Sales & Service Network Company Vision
Sales Record
Technology and Patent Status Ball Mounting Technology for PCB Lamination Product Ball Mounting Technology for Singulated PCB Product Packaging Automation Technology Camera Module Application Technology Final Test Application Technology
Company Organization
CEO
Administration
R&D
QA
Sales & C/S
MFG
Oversea Office
Mechanical Design
Develop Machine Control S/W
Sales & Marketing
Customer Service
Assembly
FY 2001 – 2010 (Jumping Period)
Mar’ 2001 Jun’ 2002 Mar’ 2003 Dec’ 2003 Aug’ 2004 Dec’ 2004 Dec’ 2004 Aug’ 2005 Sep’ 2005 Dec’ 2006 Jul’ 2007 Dec’ 2007 Dec’ 2007 Oct’ 2007 Nov’ 2008 Dec’ 2010 : Certified CE Mark for Ball Placement System by SGS : Developed Auto Dispensing system for H/S attach and Under fill : Developed Auto Dispensing and Holder Attach system for Camera Module : Developed Auto Ball Placement system for Flip Chip and BGA Socket to be handled on Boat : Certified IS0 9000 by SGS and Registered Research and Develop center by KOITA : Developed Auto Image Test & Focus Handler for Camera Module : Attained Exporting Prize of 3 Million US$ from KITA : Selected as Export blue chip medium and small enterprises choice from SMBA : Certified INNO BIZ Company by SMBA Korea : Certified CE Mark for Camera Module Test Handler by SGS : Selected as blue chip medium and small size enterprises from INCHEON City : Attained Exporting Prize of 5 Million US$ from KITA : Developed New Model Ball Bumping system for 0.150 mm Ball Size (BPS-7200=> BPS 7200AA) : Certified Management Innovation Company by SMBA Korea : Developed Auto Focus Test & Active Alignment System for 8 Mega A/F Camera Module : Certified ISO 14000 by SGS and Attained 10 Million Exporting Prize from KITA
Company Profile
Sept’2011
Our Mission To Customer
All the people in SSP Inc. always think out
a solution to develop the best technology and make our solid promise to customers. We SSP will make new enterprise culture by pursuing the growth with customers and doing our responsibility to customers’ demand and the social roles.
Remark
Description
Application No 20070074082 20070074079 20070074080
Registration No
Remark
Invention
Dipping Equipment for Semiconductor Die Bonding Machine
(Head Quarter)
Location -. Head Quarter (R&D) : 82B-9L , Nam-dong Industrial Complex 679-8, Gojan-dong Namdong-gu, Incheon, Korea -. China Shanghai Office -. -. -. -. -. : H.Y-Lee (e-mail : hylee@sspinc.co.kr ) (Tel:86-13764676642) China Shenzhen Office : Jammy (e-mail : jammy@sspinc.co.kr) (Tel : 86-13-824318859) Singapore/Malaysia Office : SOE (e-mail : soe@sspinc.co.kr) (Tel : 65-90040485) Philippines Office : Joven (e-mail : joven@sspinc.co.kr) (Tel : 63-91-86512346) Taiwan Agent (Sellinng-Ware Co.,LTD : Richard Cheng (e-mail: richard@sellinware.com.tw) (Tel : 8863-5970052) Malaysia Penang Agent(Optima) : YC SOO (e-mail: ycsoo@optimaasia.com) (Tel : 604-626-6379)
Purchasing
Singapore & Malaysia Penang
China Shanghai Shenzhen
Philippines
Taiwan
Note: Part fabrication by 10 qualified OEM supplies
Company Vision
SSP INC VISION
Company Overall Introduction
Established :
June 20, 1996
C.E.O E-mail Fax
: K.H. LEE : sale@sspinc.co.kr : 82-32-822-0886
Home Page : www.sspinc.co.kr Tel : 82-32-822-0881~4
Best Value Best People Best Technique Best System
Management Innovation
Management by Objective
Professional Specialist
Quality Innovation by system
Global Technique Leading Company
Customer Delighting
Sales Record
Unit : Million US$
20. 5
9.2 7. 3 7. 5 8. 1
9.5
10. 5
Year 2004
Year 2005
Year 2006
Year 2007
Year 2008
Year 2009
Year 2010
Technology & Patents
Company History
FY 1996 – 2000(Quickening Period)
Jun’ 1996 Mar’ 1997 Mar’ 1998 Aug’ 1999 Jan’ 2000 By 2000 : : : : : : Founded “ Seoul Semiconductor Precision” Developed Auto Solder Ball Placement System for BGA Developed Auto Solder Ball Placement System for high-density BGA Attained Venture Company by SMBA Korea Renamed company to SSP Inc. Registered 5 development patents for Solder Ball Technology