(情绪管理)T++EQ

I . Document items

list file

2.Can’t open file

3.Missing file

4.What the files are used for?

5.Rev.

6.Which spec will be used?

7.One film, but different requirement in another place II. Cost & special Material

minate material

minate core for single side board

3.Solder mask ink material

4.Other special material

III. Board Thk & Tol

1.No specified Board Thk

2.Unclear meaning on board Thk

y-up order

y-up structure

IV. Drill layer & hole

1.Hole type

2.Mismatched hole chart information

3.Special hole with strange conductor pad

4.Hole Diameter Tol

5.Press fit hole

6.Overlapped hole

7.Too close between hole to board edge

8.Hole quantity

9.Hole location Tol

10.Position of stamp hole

V. Drawing, dimension & Tolerance

1.Outline tolerance

2.Mismatched dimensions

3.Missing dimensions

4.Inner corner size

5.Asymmetry Tol

6.Data of hole to edge

7.Quality & side for Fiducial mark?

8.Direction to arrange unit in array DWG

VI. Impedance items

1.Which kind of line?

2.Impedance value

3.Coupon line width

4.Distance between holes in coupon

5.Test point issue

VII. Cu Thk

1.PTH hole

2.Buried hole & blind hole

3.Surface copper Thk

VIII. Conductor design

1.Delete non-functional isolated pads in inner layer

2.Annular ring

3.Clearance issue

4.Isolated line to separate different area in inner layers

5.Tenting hole issue

6.Line width/spacing Tol

7.Strange design

8.Exposed copper along board edge

9.Plating Gold finger guide line

10.Isolated fiducial mark

11.Dummy pattern at breakaway area

12.Dummy pattern at blank area in board

13.Fill in the narrow spacing

14.Similar issue on “Made in USA”

15.LOGO position & type

IVIII. Solder mask & Legend film & other (Carbon ink & peel able mask)

1.Solder mask Thk

2.Plugged hole items

3.Solder mask bridge

4.Exposed line/pad

5.Solder mask bridge between Gold Finger

6.Distance between the S/M opening edge of via hole/pad and S/M opening of the top of Gold Finger

7.Extra S/M opening

8.Missing S/M opening for SMT pad/round pad

ponent mark bridge

10.C/M width

11.Reverse legend

12.LOGO increase cost

IX. Surface final

1.No call surface treatment

2.Rohs requirement

3.Tighter Thk

4.Feasibility of process

XI. Fabrication for profile

1.Rout or Punch

2.V-cut

3.G/F bevel

4.Chamfer

XII. Bow & Twist

XIII. X-out

I . Document items

1. Netlist file

Question 1: After comparing the customer netlist file with CAD film inputted by our CAD/CAM. Some short/open was found. see figxx.

Suggestion: a)Ingore the netlist file and just follow the CAD data to do.

b)Please resend the right Gerber file to us.

2. Can’t open file

Question 2:We can’t open the file in the package (s ee figxx).

Suggestion: a)Ingore it.

b)Please resend it to us with other format.

3. Missing file

Question 3: Missing files called in the Gerber file (see figxx).

Suggestion: a)Ingore them.

b)Please send them to us ASAP.

4.What the files are used for?

Question 4:we don’t know what the files called in package used for? (see figxx).

Suggestion: a)Ingore them.

b) Please advise.

5. Rev.

Question 5:The Rev of customer P/N is different between Rev A in Gerber file and Rev B in mail information? (see figxx).

Suggestion: a)Follow Rev A in Gerber file to do.

b)Please advise.

6. Which spec will be used?

Question 6: Customer don't call fabrication spec for the project.

Suggestion: a)We’ll use IPC-A-600G Class 2 & IPC-6012 Class 2 to do..

b) Please advise.

7. One film, but different requirement in another place

Question 7: Customer requires print solder mask on both sides, but there is Top side solder mask film in the Gerber. .

Suggestion: a)Please confirm the one S/M film will be applied to both sides.