PCB内存条检验标准中英文对照
PCB中英文对照词汇
PCB 中英文对照词汇一、综合词汇序号中文英文1印刷电路Printed circuit2印制线路Printed wiring3印刷板Printed board4印制板电路Printed circuit board(pcb)5印制线路板Printed wiring board(pwb)6印制元件Printed component7印制接点Printed contact8印制板装配Printed board assembly9板board10单面印制板Single-sided printed board(ssb) 11双面印制板Double-sided printed board(dsb) 12多层印制板Multilayer printed board(mlb) 13多层印制电路板Multilayer printed circuit board 14多层印制线路板Multilayer printed wiring board 15刚性印制板Rigid printed board16刚性单面印制板Rigid single-sided printed board 17刚性双面印制板Rigid double-sided printed board 18刚性多层印制板Rigid multilayer printed board 19挠性多层印制板Flexible multilayer printed board20挠性印制板Flexible printed board21挠性单面印制板Flexible single-sided printed board22挠性双面印制板Flexible double-sided printed board23挠性印制电路Flexible printed circuit(fpc)24挠性印制线路Flexible printed wiring25刚性印制线路Flex-rigid printed board 、 rigid-flexprinted board26刚性双面印制板Flex-rigid double-sided printed board、rigid-flex double-sided printed27刚性多层印制板Flex-rigid multilayer printed board、rigid-flex double-sided printed28齐平印制板Flush printed board29金属芯印制板Metal core printed board30金属基印制板Metal base printed board31多重布线印制板Mulit-wiring printed board32陶瓷印制板Ceramic substrate printed board33导电胶印制板Electroconductive paste printed board34模塑电路板Molded circuit board35模压印制板Stamped printed wiring board36顺序层压多层印制板Sequentially-laminated multilayer37散线印制板Discrete wiring board38微线印制板Micro wire board39积层印制板Build-up printed board40积层多层印板Build-up multilayer printed board (bum) 41积层挠性印制板Build-up flexible printed board42表面层合电路板Surface laminar circuit(slc)43埋入凸块连印制板B2it printed board44多层膜基板Mutil-layered film substrate(mfs) 45层间全内导通多层印Alivh multiplayer printed board制板46载芯片板Chip on board (cob)47埋电阻板Buried resistance board48母板Mother board49子板Daughter board50背板backplane51裸板Bare board52键盘板夹心板Copper-invar-copper board53动态挠性板Dynamic flex board54静态挠性板Static flex board55可断拼板Break-away planel56电缆cable57挠性扁平电缆Flexible flat cable (ffc)58薄膜开关Membrance switch59混合开关Hybrid circuit60厚膜Thick film61厚膜电路Thick film circuit62薄膜Thin film63薄膜混合电路Thin film hybrid circuit 64互连interconnection65导线Conductor trace line 66齐平导线Flush conductor 67传输线Transmission line 68跨交crossover69板边插头Edge-board contact 70增强板stiffener71基底Substrate72基板面Real estate73导线面Conductor side74元件面Component side 75焊接面Solder side76印制Printing77网格Grid78图形Pattern79导电图形Conductive pattern 80非导电图形Non-conductive pattern 81字符legend82标志mark二、基材序号中文英文1基材Base material2层压板Laminate3覆金属箔基材Metal-clad bade material4覆铜箔层压板Copper-clad laminate(ccl)5单面覆铜箔层压板Single-sided copper-clad laminate 6双面覆铜箔层压板Double-sided copper laminate 7复合层压板Composite laminate8薄层压板Thin laminate9金属芯覆铜箔层压板Metal core copper-clad laminate 10金属基覆铜层压板Metal base copper-clad laminate 11挠性覆铜箔绝缘薄膜Flexible copper-clad dielectric film 12基体材料Basis material13预浸材料Prepreg14粘结片Bonding sheet15预浸粘结片Preimpregnated bonding sheet 16环氧玻璃基板Epoxy glass substrate17加成法用层压板Laminate for additive process 18预制内层覆箔板Mass laminate panel19内层芯板Core material20催化板材Catalyzed board21涂胶催化层压板Adhesive-coated catalyzed laminate 22涂胶无催化层压板Adhesive-coated uncatalyzed laminate 23粘结层Bonding layer24粘结膜Film adhesive25涂胶粘剂绝缘薄膜Adhesive coated dielectric film26无支撑胶粘剂膜Unsupported adhesive film27覆盖层Cover layer28增强板材Stiffener material29铜箔面Copper-clad surface30去铜箔面Foil removal surface31层压板面Unclad laminate surface32基膜面Base film surface33胶粘剂面Adhesive face34原始光洁面Plate finish35粗面Matt finish36纵向Length wise direction37横向Cross wise direction38剪切板Cut to size panel39酚醛纸质覆铜箔板Phenolic cellulose paper copper-cladlaminates(phenolic paper ccl)40环氧纸质覆铜箔板Epoxide cellulose paper copper-cladlaminates(epoxy paper ccl)41环氧玻璃布基覆铜箔Epoxide woven glass fabric copper-clad 板laminate42环氧玻璃布纸复合覆Epoxide cellulose paper core glass cloth 铜箔板surfaces copper-clad laminate43环氧玻璃布玻璃纤维Epoxide non woven glass reinforced 复合覆铜箔板copper-clad laminate44聚酯玻璃布覆铜箔板Polyester wovenglass fabric copper-clad laminate45聚酰亚胺玻璃布覆铜Polyimide woven glass fabric copper-clad箔板laminate46双马来酰亚胺三嗪环Bismaleimide triazine epoxide woven 氧玻璃布覆铜板glass fabric copper-clad laminate47环氧合成纤维布覆铜Epoxide synthetic fiber copper-clad箔板laminates48聚四乙烯玻璃纤维覆Teflon fiber glass copper-clad laminate铜箔板49超薄型层压板Ultra thin laminate50陶瓷基覆铜箔板Ceramincs base copper-clad laminate 51紫外线阻挡型覆铜箔Uv blocking copper-clad laminates板三、基材的材料序号中文英文1 a 阶树脂a-stage resin2 b 阶树脂b-stage resin3 c 阶树脂c-stage resin4环氧树脂Epoxy resin5酚醛树脂Phenolic resin6聚酯树脂Polyester resin7聚酰亚胺树脂Polyimide resin8双马来酰亚胺三嗪树Bismaleimide-triazine resin脂9丙烯酸树脂Acrylic resin10三聚氰胺甲醛树脂Melamine formaldehyde resin 11多功能环氧树脂Polyfunctional epoxy resin 12溴化环氧树脂Brominated epoxy resin 13环氧酚醛Epoxy novolac14氟树脂fluroresin15硅树脂Silicone resin16硅烷silane17聚合物polymer18无定形聚合物Amorphous polymer19结晶现象Crystalline polamer20双晶现象dimorphism21共聚物copolymer22合成树脂synthetic23热固性树脂Thermosetting resin24热塑性树脂Thermoplastic resin25感光性树脂Photosensitive resin26环氧当量Weight per epoxy equipvalent(wpe) 27环氧值Epoxy value28双氰胺dicyandiamide29粘结剂binder30固化剂Curing agent31胶粘剂adesive32阻燃剂Flame retardant33遮光剂opaquer34增塑剂plasticizers35不饱和聚酯Unsatuiated polyster36聚酯薄膜polyester37聚酰亚胺薄膜Polyimide film(pi)38聚四氟乙烯Polytetrafluoetylene(ptfe)39聚四氟乙烯丙烯薄膜Perfluorinated ethylene-propylenecopolymer film(fep)40增强材料Reinforcing material41玻璃纤维Glass fiber42 E 玻璃纤维e-glass fiber43 D 玻璃纤维d-glass fiber44S 玻璃纤维s-glass fiber45玻璃布Glass fabric46非织布Non-woven fabric 47玻璃纤维垫Glass mats48纱线yarn49单丝filament50胶股strand51纬纱Weft yarn52经纱Warp yarn53但尼尔denier54经向Warp-wise55纬向Weft-wise 、 filling-wise 56织物经纬密度Thread count57织物组织Weave structure58平纹组织Plain structure59坏布Grey fabric60稀松织物Woven scrim61弓纬Bow of weave62断经End missing63缺纬Mis-picks64纬斜bias65折痕crease66云织waviness67鱼眼Fish eye68毛圈长Feather length69厚薄段mark70裂缝spilt71捻度Twist of yarn72浸润剂含量Size content73浸润剂残留量Size residue74处理剂含量Finish leval75浸润剂size76偶联剂Couplint agent77处理织物Finished fabric78聚酰胺纤维Polyarmide fiber79聚酯纤维非织布Non-woven polyester fabric 80浸渍绝缘纵纸Impregenating insulation paper 81聚芳酰胺纤维纸Aromatic polyamide paper 82断裂长Breaking length83吸水高度Height of capillary rise84湿强度保留率Wet strength retention85白度whitenness86陶瓷ceramics87导电箔Conductive foil88铜箔Copper foil89电解铜箔Electrodeposited copper foil (ed copperfoil)90压延铜箔Rolled copper foil91退火铜箔Annealed copper foil92压延退火铜箔Rolled annealed copper foil (ra copperfoil)93薄铜箔Thin copper foil94涂胶铜箔Adhesive coated foil95涂胶脂铜箔Resin coated copper foil(rcc)96复合金属箔Composite metallic material97载体搏Carrier foil98殷瓦invar99箔（剖面）轮廓Foil profile100光面Shiny side101粗糙面Matte side102处理面Treated side103防锈处理Stain proofing104双面处理铜箔Double treated foil四、设计序号中文英文1原理图Shematic diagram2逻辑图Logic diagram3印制线路布设Printed wire layout4布设总图Master drawing5可制造性设计Design-for-manufacturability6计算机辅助设计Computer-aided design(cad)7计算机辅助制造Computer-aided manufacturability(cim) 8计算机集成制造Computer integrat manufacturing 9计算机辅助工程Computer-aided engineering(cae) 10计算机辅助测试Computer-aided test (cat)11电子设计自动化Electric design automaton(eda) 12工程设计自动化Engineering design automaton(eda2) 13组装设计自动化Assemnly aided architecturaldesign(aaad) 14计算机辅助制图Computer aided drawing15计算机控制显示Computer controlled display(ccd) 16布局placement17布线routing18布图设计layout19重布rerouting20模拟simulation21逻辑模拟Logic simulation22电路模拟Circit simulate23时序模拟Timing simulation24模块化modularization25布线完成率Layout effeciency26机器描述格式Machine descriptionm format(mdf) 27机器描述格式数据库Mdf database28设计数据库Design database29设计原点Design origin30优化（设计）Optimization(design)31供设计优化坐标轴Predominant axis32表格原点Table origin33镜像Mirroring34驱动文件Drive file35中间文件Intermediate file36制造文件Manufacturing documentation 37队列支撑数据库Queue support database38元件安置component positioning 39图形显示Graphics display40比例因子Scaling factor41扫描填充Scan filling42矩形填充Rectangle filling43填充域Region filling44实体设计Physical design45逻辑设计Logic design46逻辑电路Logic design47层次设计Hierarchical design48自顶向下设计Top-down design49自顶向上设计Bottom-up design50线网net51数字化digitzing52设计规则检查Design rule checking53走（布）线路Router(cad)54网络表Net list55计算机辅助电路分析Computer-aided circuit analysis 56子线网Subnet57目标函数Objective function58设计后处理Post design processing(pdp) 59交互式制图设计Interactive drawing design 60费用矩阵Cost metrix61工程图Engineering drawing62方块框图Block diagram63迷宫Moze64元件密度Component density65巡回售货员问题Traveling salesman problem 66自由度Degrees freedom67入度Out going degree68出度Incoming degree69曼哈顿距离Manhatton distance70欧几里德距离Euclidean distance71网络Network72阵列Array73段Segment74逻辑Logic75逻辑设计自动化Logic design automation 76分线Separated time77分层Separated layer78定顺序Definite sequence79对准度registration80孔环Annular ring81公差Tolerance82同心Concentricity83样片coupon84变色discolorations85污点Stains86试样Specimen 87钻孔Drilling88剪裁Shearing 89切外型Routing90刮线Scoring91倒角Chamfering 92切空Blanking 93适应性suitability 94板弯Bow95板扭Twist96应力Stress97防焊膜Solder mask 98阻焊膜Solder resist 99文字标记Legend 100版本代字Revision letter 101料号Part No 102跳漏Skipping 103浮空Soda strawing 104流动Flow 105整平Leveling 106FPR First pass yield ‘。
PCB及PCBA缺陷中英文对照表
1板面凹痕dent 41漏印字符skip2内层白斑I/L white spot 42金粗Au too big3线路缺口circuit nick 43金簿Au too thin4蚀刻不净undering etching 44金手指缺口G/F voids/nick on G/F5绿油剥离S/M peel off 45金手指发黑G/F too black6显影不净under developing 46字符印反inverse C/M7基材白点 laminate measling 47金手指针孔G/F pinholes8铜面氧化copper oxide 48标志不清symbol unclear9绿油上焊盘s/m on pad 49标志错symbol wrong10白字上焊盘c/m on pad 50绿油鬼影ghost in S/M11阻焊不良poor S/M 51手指印finger print12线路擦花 track scratch 52补线不良poor line repairing13锡上线sn on circuit 53锡高exessive solder14聚锡sn mass 54孔小hole undersize15锡灰sn gray 55字符错wrong C/M16焊盘露铜cu exposed on pad 56字符印偏C/M misalignment17锡上金手指sn on G/F 57字符入孔C/M in hole18金手指凹痕G/F dent 58字符重影C/M doubloe image19金手指擦花G/F scratch 59漏镀金手指missing plating G/F20金手指粗糙G/F roughness 60金手指发白G/F gray21v-cut不良poor V-cut 61焊盘脱落pad break off/pad peel off 22倒边不良poor milling 62焊盘露铜pad expose cu23针床压伤ET dent 63断绿油桥missing S/M bridge24拖锡不良poor touch up 64塞孔block hole25补金不良poor repairing Au 65水迹water print26补油不良poor repairing s/m 66锡珠solder ball27针孔pinhole 67砂孔pitting28胶渍paster stain 68油薄29k孔内毛刺burrs in hole 69聚油excess solder mask30锡珠入孔solder in hole 70锡粗Sn too thick31露铜expose Cu 71线路上锡Sn overlap scratch32露镍expose Ni 72绿油下杂物 contamination under S/M 33绿油起泡solder mask blister 73焊盘损坏land damage34绿油起皱solder mask winbles 74焊盘翘起lifted land35金手指氧化G/F oxiding 75偏位misregistration36金颜色不良Au discoloration 76漏钻孔missing hole37金面凸起Au surface blister 77焊盘缺口nick on pad38绿油入孔solder mask in hole 78线路缺口nick on track39爆板board angle damafe40翘板warp1开路open circuit 46焊盘翘起lifted land2短路short circuit 47漏钻孔missing hole线路狗牙circuit wist 48露布纹weave exposure3线路缺口circuit nick 49钻偏孔hole misregistratiion4线路凹痕circuit dent 50孔损害hole damage5渗镀plating Bloody 51基材分层delamination6焊盘缺口pad nick 52蚀刻过度over etching7内层白斑I/L white spot 53多孔hole too much8黑化不良poor B.O 54残铜remain Cu55孔内露基材 laminate exposure in hole 10粉红圈pinking ring 56焊盘脱落pad break off11层压起泡press blister 57焊盘凹痕pad dent12错位misregistation 58焊盘凸起pad bulge13偏位shift 59焊盘损坏pad damaged14孔内无铜no Cu on Pth 60焊盘缺口pad nick15孔内毛刺hole burrs 61焊盘露铜pad expose Cu16NPTH有铜Cu on NPTH 30修理不良poor repairing17铜面露基材exposed laminate 31铜薄copper too thin18铜面凹痕dent on Cu surface 32内层擦花I/L scratch19胶渍gum residue 33内层偏位I/L misregistation20夹膜D/F nip 34内层杂物I/L inclusions21蚀刻不尽under etching 35掉膜film off22线幼line too thin 36干膜碎D/F meaking23孔大hole oversize 37退锡不尽poor Sn stripping24孔小hole undersize 38间隙小space too marrow25偏孔hole misregistration 39板薄board too thin26铜面瘤粒Cu nodule 40板厚board too thickness27显影不尽under developing 41针孔pinhole28铜面刮伤scratch on Cu surface 42崩孔breakout29塞孔hole plugged 43侧蚀undrcut45亚色dull colour 44镀层粗糙plating layer roughness。
PCB行业最常用术语之中英文对照
PCB行业最常用术语之中英文对照(按字母检索)A/W (artwork) 底片Ablation 烧溶(laser),切除abrade 粗化abrasion resistance 耐磨性absorption 吸收ACC ( accept ) 允收accelerated corrosion test 加速腐蚀accelerated test 加速试验acceleration 速化反应accelerator 加速剂acceptable 允收activator 活化液active work in process 实际在制品adhesion 附着力adhesive method 黏着法air inclusion 气泡air knife 风刀amorphous change 不定形的改变amount 总量amylnitrite 硝基戊烷analyzer 分析仪anneal 回火annular ring 环状垫圈;孔环anode slime (sludge) 阳极泥anodizing 阳极处理AOI ( automatic optical inspection ) 自动:光学检测applicable documents 引用之文件AQL sampling 允收水准抽样aqueous photoresist 液态光阻aspect ratio 纵横比(厚宽比)As received 到货时back lighting 背光back-up 垫板banked work in process 预留在制品base material 基材baseline performance 基准绩效batch 批beta backscattering 贝他射线照射法beveling 切斜边;斜边biaxial deformation 二方向之变形black-oxide 黑化blank controller 空白对照组blank panel 空板blanking 挖空blip 弹开blister 气泡;起泡blistering 气泡blow hole 吹孔board-thickness error 板厚错误bonding plies 黏结层bow ; bowing 板弯break out 从平环内破出bridging 搭桥;桥接BTO (Build To Order) 接单生产burning 烧焦burr 毛边(毛头)camcorder 一体型摄录放机carbide 碳化物carlson pin 定位梢carrier 载运剂catalyzing 催化catholic sputtering 阴极溅射法caul plate 隔板;钢板calibration system requirements 校验系统之各种要求center beam method 中心光束法central projection 集中式投射线certification 认证chamfer 倒角(金手指)chamfering 切斜边;倒角characteristic impedance 特性阻抗charge transfer overpotential 电量传递过电压chase 网框checkboard 棋盘chelator 蟹和剂chemical bond 化学键chemical vapor deposition 化学蒸着镀circumferential void 圆周性之孔破clad metal 包夹金属clean room 无尘室clearance 间隙coat 镀外表coating error 防焊覆盖错误coefficient of thermal expansion (CTE) 热澎胀系数cold solder joint 冷焊点cold-weld 金属粉末冷焊color 颜色color error 颜色错误compensation 补偿competitive performance 竞争力绩效complex salt 错化物complexor 错化物component hole 零件孔component side 零件面concentric 同心conformance 密贴性consumer products 消费性产品contact resistance 接触电阻continuous performance 连续发挥效能contract service 协力厂controlled split 均裂式conventional flow 乱流方式conventional tensile test 传统张力测试法conversion coating 转化层convex 突出coordinate list 数据清单copper claded laminates (CCL) 铜箔基板copper exposure 线路露铜copper mirror 镜铜copper pad 铜箔圆配copper residue (copper splash) 铜渣corrosion rate numbering 腐蚀速率计数系统corrosion resistance 抗蚀性coulombs law 库伦定律countersink 喇叭孔coupon 试样coupon location 试样点covering power 遮盖力CPU 中央处理器crack 破裂;裂痕crazing 裂痕;白斑cross linking 交联聚合cross talk 呼应作用crosslinking 交联crystal collection 结晶收集curing 聚合体current efficiency 电流效率cut-outs 挖空cutting 裁板cyanide 氰化物cycles of learning 学习循环cycle-time reduction 交期缩短date code 周期deburring 去毛头dedicated 专用型degradation 退变delamination 分层dent / pin hole 凹陷/ 针孔department of defense 国防部designation 字码简示法de-smear 除胶渣developing 显影dewetting 缩锡dewetting time 缩锡时间dimension error 外形尺寸错误dielectric constant 介质常数difficulty 困难度difunctional 双功能dimension 尺寸dimension stability 尺寸安定性dimensional stability 尺度安定性dimension and tolerance 尺寸与公差dirty hole 孔内异物discolor hole 孔黑;孔灰;氧化discoloration 变色disposable eyelet method 消耗性铆钉法distortion factor 尺寸变形函数double side 双面板downtime 停机时间drill 钻孔drill bit 钻头drill facet 钻尖切萷面drill pointer 钻尖重(研)磨机drilled blank board 已钻孔之裸板drilling 钻孔dry film 干膜ductility 延展性economy of scale 经济规模edge spacing 板边空地edge-board contact ( gold finger ) 金手指efficiency 能量效率electric test 电测electrical testing 电测;测试electrochemical machine ECM 电化学加工法electrochemical reactor 电化学反应器electroforming 电铸electroless plate 化学铜electroless-deposition 无电镀electropolishing 电解拋光electrorefining 电解精炼electrowinning 电解萃取elliptical set 椭圆形embrittlement 脆性entitlement performance 可达成绩效entrapment 电镀夹杂物epoxy 环氧树酯equipotential 电位线error data file 异常情形etch rate 蚀铜速率etchants 蚀刻液etchback 回蚀evaluation program 评估用程序exposure 曝光external pin method 外部插梢法eyelet hole 铆钉孔Eyeletting 铆眼fabric 网布failure 故障fast response 快速响应fault 瑕庛;缺陷fiber exposure 纤维显露fiber protrusion 纤维突出fiducial mark 光学点,基准记号filler 填充料film 底片filtration 过滤finished board 成品fixing 固着fixture 电测夹具(治具)flaking off 粹离flammability rating 燃性等级flare 喇叭形孔flat cable 并排电缆feedback loop 回馈循环first-in-first-out (FIFO) 先进先出flexible manufacturing system (FMS) 弹性制造系统flux 助焊剂foil distortion 铜层变形fold 空泡foreign include 异物foreign material 基材内异物free radical chain polymerization 自由基连锁聚合fully additive 加成法fully annealed type 彻底回火轫化之类形function 函数fundamental and basic 基本fungus resistance 抗霉性funnel flange 喇叭形折翼galvanized 加法尼化制程gap 钻尖分开gauge length 有效长度gel time 胶化时间general resist ink 一般阻剂油墨general 通论general industrial 一般性(电子)工业级geometrical levelling 几何平整glass transition temperature (Tg) 玻璃态转换温度Gold 金gold finger 金手指gold plating 镀金golden board 标准板gouges 刷磨凹沟gouging 挖破grain boundary 金属晶体之四边green 绿色grip 夹头ground plane 接地层ground plane clearance 接地空环hackers 骇客HAL ( hot air leveling ) 喷锡haloing 白边;白圈hardener 硬化剂hardness 硬度hepa filter 空气滤清器high performance industrial 高性能(电子)工业级high reliability 高可靠度high resolution 高分辨率high temperature elongation (HTE) 高温延展性铜箔high temperature epoxy (HTE) 高温树酯hit 击hole counter 数孔机hole diameter 孔径hole diameter error 孔径错误hole location 孔位hole number 孔数hole wall quality 孔壁品质hook 外弧hot dip 热浸法hull cell 哈氏槽hybrid 混成集成电路hydrogen bonding 氢键hydrolysis 水解hydrometallurgy 湿法冶金法image analysis system 影像分析系统image transfer 影像转移immersion gold 浸金(化镍金) immersion plating 浸镀法impedance 阻抗infrared reflow 红外线重熔inhibitor 热聚合抑制剂injection mold 射模ink 油墨innerlayer & outlayer 内外层insulation resistance 绝缘电阻intended position 应该在的位置intensifier 增强器intensity 强度inter molecular exchange 交互改变interconnection 互相连通ionic contaminants 离子性污染物ionic contamination testing 离子污染试验IPA 异丙醇5I : inspiration (启蒙)identification 确认计划目标implementation 改善方案information 数据internalization 制度化invisible inventory 无形的库存knife edges 刀缘Knoop 努普(硬度单位)kraft paper 牛皮纸laminar flow 层流laminate 基层板laminating 压合lamination 压合laminator 压膜机land 焊垫lay back 刃角磨损lay up 组合叠板layout 布线;布局lead screw 牵引螺丝leakage 漏电learning curve 学习曲线legend 文字标记leveling 平整levelling additive 平整剂levelling power 平整力life support 维系生命limiting current 极限电流line space 线距line width 线宽linear variable differential transformer(LVDL) 线性可变差动:转换器liquid 液状(态)liquid crystal resins 液晶树脂liquid photoimageable solder resist ink 液态感光防焊油墨liquid photoresist ink 液态光阻剂油墨lot size 批量lower carrier 底部承载板mechanical plating 机祴镀法machine scrub 刷磨清洁法macrothrowing power 巨分布力margin 钻头刃带market share 市场占有率marking error 文字错误masked leveling 儰装平整mass lamination 大型压板mass transfer 质量传送效应mass transfer overpotential 质量传递过电压mass transportation 质传master drawing 主图;蓝图material use factor 材料使用率mealing 泡点;白点memory 记忆装置meniscograph solderability measurement 新月型焊锡效果microetch 微蚀microetching 微蚀microfocus 微焦距microfocus system 微焦距系统microprofile 微表面microsectioning 微切片法microthrowing power 微分布力migration 迁移mini-tensile tester 迷你拉力测试仪mis hole location 孔位错误misregistration 焊锡面与零件面对位偏差misregsitration 对不准moisture and insulation resistance test 湿气与绝缘电阻试验molded circuit board (MCB) 模制电路板monoethanal amine 单乙醇氨monohydrate state 水化物monomer 单分子膜;单体mouse bite 锯齿;蚀刻缺口msec 毫秒muffle furnace 高温焚火炉multichip 超大IC型(多芯片模块)mylar 保护膜nail head 钉头NC drill 数字钻孔机negative etchback 反回蚀negative film 负片negative rake angle 负抠耙角network 回路;网络neutralization 中和nick 缺口nickel 镍nodule 铜瘤;瘤粒no flow resin 不流树脂noise 噪声nominal 标示nominal dimension 标定长度nominal gel time 标示胶性时间nominal resin content 标示胶含量nominal resin flow 标示胶流量nominal scaled flow thickness 标示比例流量厚度OA equip 办公室自动:化设备obsolescence factor 报废因素OEM 原设备制造商offset-list 补偿数据清单ohmmeter 欧姆计open 断路open circuits 断路open short testing 断短路测试opening 开口original art work (A/W) 原稿底片Others 其它outgrowth 增出over design 牛刀杀鸡overlap 钻尖重叠overlay entry 盖板overpotential 过电压oxidation 氧化oxide treatment 黑化处理oxided cytochrome 氧化性之细包色素oxygen evolution 氧气发生反应packed bed 充填床式pad 锡垫;圆配pad copper exposure pad露铜panel 小型板面;母板panel plating 一次铜电镀parasitic 寄生的part no. 料号pattern plating 二次铜电镀PCB ( print circuit board ) 印刷电路板pcs 片peel strength 抗撕强度peeling off 剥离(剥落) performance specification 性能规范permittivity 透电率perspectives on experience 经验透视PET 聚酯photodiode detector 发光二极管侦测器photo initiator 感光启始剂photoresist 光阻phototool 光具(指工作底片)piece 子板面pinceton applied research 腐蚀测定仪pink ring 粉红圈pit 凹点pitch 脚距planar 平面plating 电镀plating exposure 下镀层露出plug gauge 插规plug hole 孔塞PNL (panel) 排板polar-polar interaction 极性之间的吸力polyester 聚酯类polyglycols 聚乙二醇polyimide 聚亚醯氨poor bevelling 磨边加工引起突起,剥离poor drill 孔形不良poor HAL 喷锡不良poor marking 字体不良poor pad 锡垫不良poor printed 印刷偏差poor solderability 焊锡性不良poor touch-up 补线不良position control system 位置控制系统positive rake angle 正抠耙角power curve model 幕次曲线模式practice 工艺惯例preferred 良好premature tearing 提前撕裂prepolymer 预聚合物prepreg 胶片pre-process ( front-end) 制前press 压床press cycle 压合周期primary current distribution 一次电流分布primary 主要product lifetimes 生命周期product process 制程promoter 促进剂protocal 初步资料prussic acid 普鲁士酸PTF-based process 厚膜糊法PTH (plating though hole) 导通孔pull away 拉开pumice 浮石粉pumice scrub 喷砂清洁法pyrometallurgy 火烧法冶炼QC ( quality control) 品管QFP (quad flat pack ) 扁方型封装体qualification inspection 资格审查检验qualification testing 资格检定quality classification 品质等级quantitative 计量式测试rack 挂架radiometer 能量剂rake angle 抠耙角RAM [Random Access Memory 随机存取内存real time 关键时刻recessed trace process 凹槽线路法recovery tank 回收槽reduction 还原re-eninforcement 强化refraction 折光率reinforcement style 补强材料的型式register mark 对位用标记registration hole 对位孔registration pattern 长方形铜地REJ ( reject ) 退货;拒收rejectable 拒收release agent 脱模剂relief angle 浮离角remark 备注repair 修理resin content 树脂含量(胶含量)resin flow 胶流量resin flow percentage 树脂流量之百分率resin recession 树脂下陷resin smear 胶渣resist strippers 剥干膜剂resistor network 排列电阻resolution 解像度return on assets 资产报酬率reversibility 可逆性rework 重工rosin 天然松香rotating cylinder 旋转圆柱形roughtness 孔壁粗糙;粗慥routing 切外形,成型routing bit 铣刀runout 偏转S/L on hole 孔内沾文字S/M ( solder mask ), S/L 防焊文字S/M (solder mask) 防焊S/M error 防焊种类错误S/M on hole 孔内绿漆salt spray test 盐水喷雾试验sampling size 抽样数scope 范围scored 刻痕scoring 枢槽;刮线scrap 废框scratches 刮伤screen printing 网版印刷scum 透明残膜sealing 封孔处理secondary 次要semi-additive 半加成法sensitize 敏化sensitizer 敏化液separator 钢隔板sequential lamination 渐成式压法serrated edges 毛边shatter 破碎short 短路shunt 分路silane treatment 硅烷处理silicone coupling agent 硅烷偶合剂silk screen 文字印刷simulator 仿真器single axis 单轴sizing 底片之伸缩补偿skip 漏印skip printing 跳印;漏印sliver 丝条slot 开槽slotting 开槽SMD ( surface mount device ) 表面黏着组件smear 胶渣SMT ( surface mount technology )表面黏着技术sodium carbonate monohydrate 结晶水碳酸钠soft tooling 软性工具solder 焊锡; 锡铅solder bridge 锡桥solder bump 锡突solder float 漂锡solder mask adhesion 绿漆附着力solder on G/F 金手指沾锡solder on trace 线路沾锡solder plug 锡塞solder side 焊锡面solderability 焊锡性solid carbide 实质碳化物spacing 间距spacing nonenough 间距不足SPC ( Statistical Process Control ) 统计生管specification 规范special considerations 特别考虑spin coating 旋转涂布spindle 钻轴spiral contractometer 螺旋收缩仪spot face 铣靶spray coating 喷涂Squeegee 刮刀stacking structure 叠板结构stamping 冲压standard hydraulic lamination标准液压法standardizing 标准化starvation 缺胶step tablet 格片数stock option 认股选择权strain 应度strength 强度stressmeter 应力计subtractive 减除法surface convex 表面突起surface examination 表面检查surface insulation resistance (SIR) 表面绝缘电阻surface mount 表面黏着方式surface roughness 表面粗慥度surges 突波switch circuit 开关线路tab 金手指tack free 不黏taped hole gauge 锥形孔规target hole 靶孔task force 任务编组tensile strength 抗拉强度tensile stress 张性应力tent 浮盖terms and definitions 术语与定义termination load 抗匹配负载test circuit 测试线路test method 试验方法test point 测试点thermal shock 热震荡试验thermal stress 热应力试验thermistor 热电感应式thermo cycling 热循环试验theoretical cycle time 理论性周期时间thickness 厚度time to market 上市时机thickness distribution 厚度分布thief 补助阴极thin core 薄基板;内层板throwing power 分布力tolerance 公差;容差tooling hole 工具孔torque load 扭力拒之负载total quality program 全面的品质计划toughness 坚度trace error 线路错误trace nick & pin hole 线路缺口及针孔trace peeling 线路剥离trace pin-hole 线路针孔trace surface roughness 线路表面粗糙tarnish and oxide resist 抗污抗氧化剂transmittance 透光度trim line 裁切线true levelling 真平整true position 真正位置的孔;真位twist 板翘type 种类umbra 本影undercut 侧蚀uneven coating 喷锡厚镀不平整universal 万用型universal tensile tester 万用拉力试验机universal tester 泛用型测试机upper carrier 顶部承载钢uptime 稼动:时间vacuum deposition 真空蒸镀法vacuum hydraulic lamination真空液压法vaporizer 气化室V-cut V形槽vertical microsection 垂直微切片via hole 导通孔visible inventory 有形的库存vision inspection 目视检查V oid 孔破void in hole 孔壁上的破洞void in PTH hole 孔破walkman 随身听warehouse 仓库warp 板弯warp , warpage 板弯water absorption 吸水性wear resistance 耐磨度weave exposure 纤纹显露weave texture 织纹隐现wedge angle 契尖角week 周wet chemistry 湿式化学制程wet film 湿膜wet lamination 湿膜压膜法wet process 湿制程wetting 沾锡wetting balance 沾锡平衡法wicking 渗铜;渗入;灯蕊效应width 宽度width reduce 线细width-to-thickness ratio 宽度与厚度的比值window 操作范围work-in-process 在制品work order 工单working film 工作片working master 工作母片year 年yellow 金黄色yield 良率。
最新PCB及PCBA缺陷中英文对照表
最新PCB及PCBA缺陷中英文对照表PCB及PCBA缺陷中英文对照表PCB及PCBA缺陷中英文对照表1板面凹痕dent 41漏印字符skip2内层白斑I/L white spot 42金粗Au too big3线路缺口circuit nick 43金簿Au too thin4蚀刻不净undering etching 44金手指缺口G/F voids/nick on G/F 5绿油剥离S/M peel off 45金手指发黑G/F too black 6显影不净under developing 46字符印反inverse C/M7基材白点laminate measling 47金手指针孔G/F pinholes8铜面氧化copper oxide 48标志不清symbol unclear9绿油上焊盘s/m on pad 49标志错symbol wrong10白字上焊盘c/m on pad 50绿油鬼影ghost in S/M11阻焊不良poor S/M 51手指印finger print12线路擦花track scratch 52补线不良poor line repairing13锡上线sn on circuit 53锡高exessive solder14聚锡sn mass 54孔小hole undersize15锡灰sn gray 55字符错wrong C/M16焊盘露铜cu exposed on pad 56字符印偏C/M misalignment 17锡上金手指sn on G/F 57字符入孔C/M in hole18金手指凹痕G/F dent 58字符重影C/M doubloe image19金手指擦花G/F scratch 59漏镀金手指missing plating G/F 20金手指粗糙G/F roughness 60金手指发白G/F gray21v-cut不良poor V-cut 61焊盘脱落pad break off/pad peel off 22倒边不良poor milling 62焊盘露铜pad expose cu 23针床压伤ET dent 63断绿油桥missing S/M bridge24拖锡不良poor touch up 64塞孔block hole25补金不良poor repairing Au 65水迹water print26补油不良poor repairing s/m 66锡珠solder ball27针孔pinhole 67砂孔pitting28胶渍paster stain 68油薄S/M too thin29k孔内毛刺burrs in hole 69聚油excess solder mask 30锡珠入孔solder in hole 70锡粗Sn too thick31露铜expose Cu 71线路上锡Sn overlap scratch 32露镍expose Ni 72绿油下杂物contamination under S/M 33绿油起泡solder mask blister 73焊盘损坏land damage34绿油起皱solder mask winbles 74焊盘翘起lifted land35金手指氧化G/F oxiding 75偏位misregistration36金颜色不良Au discoloration 76漏钻孔missing hole37金面凸起Au surface blister 77焊盘缺口nick on pad 38绿油入孔solder mask in hole 78线路缺口nick on track 39爆板board angle damafe40翘板warp1开路open circuit 46焊盘翘起lifted land2短路short circuit 47漏钻孔missing hole线路狗牙circuit wist 48露布纹weave exposure3线路缺口circuit nick 49钻偏孔hole misregistratiion 4线路凹痕circuit dent 50孔损害hole damage5渗镀plating Bloody 51基材分层delamination6焊盘缺口pad nick 52蚀刻过度over etching7内层白斑I/L white spot 53多孔hole too much8黑化不良poor B.O 54残铜remain Cu9爆板measling 55孔内露基材laminate exposure in hole10粉红圈pinking ring 56焊盘脱落pad break off 11层压起泡press blister 57焊盘凹痕pad dent12错位misregistation 58焊盘凸起pad bulge13偏位shift 59焊盘损坏pad damaged14孔内无铜no Cu on Pth 60焊盘缺口pad nick15孔内毛刺hole burrs 61焊盘露铜pad expose Cu 16NPTH有铜Cu on NPTH 30修理不良poor repairing17铜面露基材exposed laminate 31铜薄copper too thin18铜面凹痕dent on Cu surface 32内层擦花I/L scratch19胶渍gum residue 33内层偏位I/L misregistation20夹膜D/F nip 34内层杂物I/L inclusions21蚀刻不尽under etching 35掉膜film off22线幼line too thin 36干膜碎D/F meaking23孔大hole oversize 37退锡不尽poor Sn stripping 24孔小hole undersize 38间隙小space too marrow 25偏孔hole misregistration 39板薄board too thin26铜面瘤粒Cu nodule 40板厚board too thickness27显影不尽under developing 41针孔pinhole28铜面刮伤scratch on Cu surface 42崩孔breakout29塞孔hole plugged 43侧蚀undrcut45亚色dull colour 44镀层粗糙plating layer roughness PCB 及PCBA常用度量衡单位换算所属目录：FASTPCBA靖邦公司资料发布时间：2009-01-01 1英尺=12英寸1英寸inch=1000密尔mil1mil=25.4um1mil=1000uin mil密耳有时也成英丝1um=40uin（有些公司称微英寸为麦，其实是微英寸）1OZ=28.35克/平方英尺=35微米H=18微米4mil/4mil=0.1mm/0.1mm线宽线距1ASD=1安培/平方分米=10.76安培/平方英尺1AM=1安培分钟=60库仑主要用于贵金属电镀如镀金1平方分米=10.76平方英尺1盎司=28.35克,此为英制单位1加仑(英制)=4.5升1加仑美制=3.785升1KHA=1000安小时1安培小时=3600库仑比重波美度=145-145/比重SG.SG.比重（克/立方厘米）=145/（145-波美PCB及PCBA行业专用名词PCB及PCBA行业专用名词BOM(Bill of material) 物料需求單Laminate 基板Copper foil 銅箔Solder mask(s/m) 防焊Bare Board 空板Microetching 微蝕Exposure 曝光Dry Film 干膜Matte side 毛面Rcc(Resin coated copper) 背膠銅箔Final shaping 成型Electrical test(ET) 電測Visual Inspection 外觀檢查Gold Finger(G/F) 金手指Legend 文字Post Cure 后烤Desmear 除膠渣Developing 顯影Pattern Plating 線路電鍍Panel Plating 全板電鍍Puddle Effect 水坑效應Oxide Coating 黑氧化Routing Bit 銑刀Tolerance 公差Post Treatment 后處理Adhesion 附著力Stripping 去膜Baking 烘烤AQL(acceptable quality level) 品質允收水準Optical Target 光學靶點Lay up 疊合Chromation 鉻化處理Undercut 側蝕Microvia 微孔Annular Ring 孔環Burr 毛頭Entek 有機保焊處理Conformal Mask 銅窗Drum Side 光面Diazo Film 偶氮棕片Cut Lamination 下料Sheets Cutting 裁板Inner Layer Drilling 內層鑽孔Outter Layer Drilling 一次孔2nd Drilling 二次孔PCB及PCBA专用名词Laser Drilling 雷射鉆孔Blind&Burried Hole Drilling 盲(埋)孔鉆孔screen printing 網版印刷silk screen 絲網印刷scum 透明殘膜skip printing 跳印漏印squeege 刮刀type 种類abietic acid 松脂酸air knife 風刀bridging 搭橋橋接flux 助焊劑product process 制程pre-process 制前solder bridge 錫橋soler bump 錫突solder plug 錫塞immersion gold 浸金(化金)thin core 薄基板twist 板翘, 板扭warp ,warpage 板彎weave eposure 織紋顯露wicking 燈蕊效應yield 良品abrasion resistance 耐磨性absorption 吸收accelerated test 加速實驗acceleration 速化反應accelerator 加速剂batch 批cold solder joint 冷焊點component side 零件面double side 雙面double side board 雙面板fiducial mark 基準記號finished board 成品板lot size 批量rack 掛架register mark 對準用標記solder side 錫鉛面thickness 厚度warehouse 仓库wet process 濕制程Beveling 斜邊chamfer 道角dimension 尺寸Fixture 治具interconnection 互相連通line space 線距line width 線寬misregistration 對不准mouse bite 蝕刻缺口nick 缺口master drawing 主圖print and etch board 印刷後及蝕刻後板crease 皺褶dent 凹陷glass fiber 玻璃纖維布pin hole 針孔pit 凹點target hole 靶孔PCBA及PCB专用名词(二)PCBA及PCB专用名词(二)Black Oxide Removal 黑化還原Plug Hole 塞孔Ink Print&precure 印刷及預烤Scrub 表面處理Spray Coating 靜電噴涂Printing of Legend 文字印刷Pumice ( Wet Blasting) 噴砂Immersion Ni/Au(ElectolessNi/Au) 浸鎳金Hot Air Solder Leveling 噴錫N/C routing 撈型Beveling of G/F 金手指斜边Cleanning&Baking 清洗及烘烤Fixture Testing 治具測試original A/W 客戶原稿working A/W 工作片working master 工作母片carlson pin 定位梢component hole(>30mil) 零件孔drill facet 鑽尖切削面drill pointer 鑽尖重磨機drilled blank board 已鑽孔的裸板hole diameter 孔徑hole location 孔位hole number 孔數lay back 刃角磨損margin 鑽頭刃帶open circuits 斷路runout 偏轉slot 開槽spindle 鑽軸tooling hole 工具孔stacking structure 疊板結構blow hole, void in PTH hole 吹孔孔破deburring 去毛頭electroless-deposition 無電鍍化etchback 回蝕air inclusion 氣泡chase 網框fabric 網布liquid 液態\狀mealing 泡點trim line 裁切線v-cut v型切槽golden board 標準板back lighting 背光crack 裂痕crazing 白斑dimension stability 尺寸安全性failure 故障fault 缺陷瑕疵gap 鑽尖分開gel time 膠化時間haloing 白邊白圈hardener 硬化劑hole counter 數孔機hook 外弧insulation resistance 絕緣阻抗ionizable(ionic) contaminants 離子性污染land 焊墊microsectioning 微切片法negative etchback 反回蝕overlap 鑽尖重曡peel strength 抗撕強度pink ring 粉紅圈REJ(reject) 拒收退貨release agent(sheets) 脫膜劑resin content 膠含量resin flow 膠流量resin recession 樹脂下限resin smear 膠渣rework 重工specification(spec.) 規範innerlayer&outlayer 內外層gold plating 鍍金QC(quality control) 品管back up 墊板blister 起泡局部分层caul plate 隔板, 钢板open circuits 断路sampling size 抽樣數edge spacing 板邊空地ground plane 接地層laminator 壓膜機M/T 磁帶disk 磁片。
PCB中英文对照一览表
ANTENNA 天线BATTERY 直流电源BELL 铃,钟BVC 同轴电缆接插件BRIDEG 1 整流桥(二极管)BRIDEG 2 整流桥(集成块) BUFFER 缓冲器BUZZER 蜂鸣器CAP 电容CAPACITOR 电容CAPACITOR POL 有极性电容CAPVAR 可调电容CIRCUIT BREAKER 熔断丝COAX 同轴电缆CON 插口CRYSTAL 晶体整荡器DB 并行插口DIODE 二极管DIODE SCHOTTKY 稳压二极管DIODE VARACTOR 变容二极管DPY_3-SEG 3段LEDDPY_7-SEG 7段LEDDPY_7-SEG_DP 7段LED(带小数点) ELECTRO 电解电容FUSE 熔断器INDUCTOR 电感INDUCTOR IRON 带铁芯电感INDUCTOR3 可调电感JFET N N沟道场效应管JFET P P沟道场效应管LAMP 灯泡LAMP NEDN 起辉器LED 发光二极管METER 仪表MICROPHONE 麦克风MOSFET MOS管MOTOR AC 交流电机MOTOR SERVO 伺服电机NAND 与非门NOR 或非门NPN NPN三极管NPN-PHOTO 感光三极管OPAMP 运放OR 或门PHOTO 感光二极管PNP 三极管NPN DAR NPN三极管PNP DAR PNP三极管POT 滑线变阻器PELAY-DPDT 双刀双掷继电器RES1.2 电阻RES3.4 可变电阻RESISTOR BRIDGE ? 桥式电阻RESPACK ? 电阻SCR 晶闸管PLUG ? 插头PLUG AC FEMALE 三相交流插头SOCKET ? 插座SOURCE CURRENT 电流源SOURCE VOLTAGE 电压源SPEAKER 扬声器SW ? 开关SW-DPDY ? 双刀双掷开关SW-SPST ? 单刀单掷开关SW-PB 按钮THERMISTOR 电热调节器TRANS1 变压器TRANS2 可调变压器TRIAC ? 三端双向可控硅TRIODE ? 三极真空管VARISTOR 变阻器ZENER ? 齐纳二极管DPY_7-SEG_DP 数码管SW-PB 开关。
PCB行业最常用术语之中英文对照（按字母检索）AW（artwork）底片
PCB行业最常用术语之中英文对照(按字母检索)A/W (artwork) 底片Ablation 烧溶(laser),切除abrade 粗化abrasion resistance 耐磨性absorption 吸收ACC ( accept ) 允收accelerated corrosion test 加速腐蚀accelerated test 加速试验acceleration 速化反应accelerator 加速剂acceptable 允收activator 活化液active work in process 实际在制品adhesion 附着力adhesive method 黏着法air inclusion 气泡air knife 风刀amorphous change 不定形的改变amount 总量amylnitrite 硝基戊烷analyzer 分析仪anneal 回火annular ring 环状垫圈;孔环anode slime (sludge) 阳极泥anodizing 阳极处理AOI ( automatic optical inspection ) 自动:光学检测applicable documents 引用之文件AQL sampling 允收水准抽样aqueous photoresist 液态光阻aspect ratio 纵横比(厚宽比)As received 到货时back lighting 背光back-up 垫板banked work in process 预留在制品base material 基材baseline performance 基准绩效batch 批beta backscattering 贝他射线照射法beveling 切斜边;斜边biaxial deformation 二方向之变形black-oxide 黑化blank controller 空白对照组blank panel 空板blanking 挖空blip 弹开blister 气泡;起泡blistering 气泡blow hole 吹孔board-thickness error 板厚错误bonding plies 黏结层bow ; bowing 板弯break out 从平环内破出bridging 搭桥;桥接BTO (Build To Order) 接单生产burning 烧焦burr 毛边(毛头)camcorder 一体型摄录放机carbide 碳化物carlson pin 定位梢carrier 载运剂catalyzing 催化catholic sputtering 阴极溅射法caul plate 隔板;钢板calibration system requirements 校验系统之各种要求center beam method 中心光束法central projection 集中式投射线certification 认证chamfer 倒角(金手指)chamfering 切斜边;倒角characteristic impedance 特性阻抗charge transfer overpotential 电量传递过电压chase 网框checkboard 棋盘chelator 蟹和剂chemical bond 化学键chemical vapor deposition 化学蒸着镀circumferential void 圆周性之孔破clad metal 包夹金属clean room 无尘室clearance 间隙coat 镀外表coating error 防焊覆盖错误coefficient of thermal expansion (CTE) 热澎胀系数cold solder joint 冷焊点cold-weld 金属粉末冷焊color 颜色color error 颜色错误compensation 补偿competitive performance 竞争力绩效complex salt 错化物complexor 错化物component hole 零件孔component side 零件面concentric 同心conformance 密贴性consumer products 消费性产品contact resistance 接触电阻continuous performance 连续发挥效能contract service 协力厂controlled split 均裂式conventional flow 乱流方式conventional tensile test 传统张力测试法conversion coating 转化层convex 突出coordinate list 数据清单copper claded laminates (CCL) 铜箔基板copper exposure 线路露铜copper mirror 镜铜copper pad 铜箔圆配copper residue (copper splash) 铜渣corrosion rate numbering 腐蚀速率计数系统corrosion resistance 抗蚀性coulombs law 库伦定律countersink 喇叭孔coupon 试样coupon location 试样点covering power 遮盖力CPU 中央处理器crack 破裂;裂痕crazing 裂痕;白斑cross linking 交联聚合cross talk 呼应作用crosslinking 交联crystal collection 结晶收集curing 聚合体current efficiency 电流效率cut-outs 挖空cutting 裁板cyanide 氰化物cycles of learning 学习循环cycle-time reduction 交期缩短date code 周期deburring 去毛头dedicated 专用型degradation 退变delamination 分层dent / pin hole 凹陷/ 针孔department of defense 国防部designation 字码简示法de-smear 除胶渣developing 显影dewetting 缩锡dewetting time 缩锡时间dimension error 外形尺寸错误dielectric constant 介质常数difficulty 困难度difunctional 双功能dimension 尺寸dimension stability 尺寸安定性dimensional stability 尺度安定性dimension and tolerance 尺寸与公差dirty hole 孔内异物discolor hole 孔黑;孔灰;氧化discoloration 变色disposable eyelet method 消耗性铆钉法distortion factor 尺寸变形函数double side 双面板downtime 停机时间drill 钻孔drill bit 钻头drill facet 钻尖切萷面drill pointer 钻尖重(研)磨机drilled blank board 已钻孔之裸板drilling 钻孔dry film 干膜ductility 延展性economy of scale 经济规模edge spacing 板边空地edge-board contact ( gold finger ) 金手指efficiency 能量效率electric test 电测electrical testing 电测;测试electrochemical machine ECM 电化学加工法electrochemical reactor 电化学反应器electroforming 电铸electroless plate 化学铜electroless-deposition 无电镀electropolishing 电解拋光electrorefining 电解精炼electrowinning 电解萃取elliptical set 椭圆形embrittlement 脆性entitlement performance 可达成绩效entrapment 电镀夹杂物epoxy 环氧树酯equipotential 电位线error data file 异常情形etch rate 蚀铜速率etchants 蚀刻液etchback 回蚀evaluation program 评估用程序exposure 曝光external pin method 外部插梢法eyelet hole 铆钉孔Eyeletting 铆眼fabric 网布failure 故障fast response 快速响应fault 瑕庛;缺陷fiber exposure 纤维显露fiber protrusion 纤维突出fiducial mark 光学点,基准记号filler 填充料film 底片filtration 过滤finished board 成品fixing 固着fixture 电测夹具(治具)flaking off 粹离flammability rating 燃性等级flare 喇叭形孔flat cable 并排电缆feedback loop 回馈循环first-in-first-out (FIFO) 先进先出flexible manufacturing system (FMS) 弹性制造系统flux 助焊剂foil distortion 铜层变形fold 空泡foreign include 异物foreign material 基材内异物free radical chain polymerization 自由基连锁聚合fully additive 加成法fully annealed type 彻底回火轫化之类形function 函数fundamental and basic 基本fungus resistance 抗霉性funnel flange 喇叭形折翼galvanized 加法尼化制程gap 钻尖分开gauge length 有效长度gel time 胶化时间general resist ink 一般阻剂油墨general 通论general industrial 一般性(电子)工业级geometrical levelling 几何平整glass transition temperature (Tg) 玻璃态转换温度Gold 金gold finger 金手指gold plating 镀金golden board 标准板gouges 刷磨凹沟gouging 挖破grain boundary 金属晶体之四边green 绿色grip 夹头ground plane 接地层ground plane clearance 接地空环hackers 骇客HAL ( hot air leveling ) 喷锡haloing 白边;白圈hardener 硬化剂hardness 硬度hepa filter 空气滤清器high performance industrial 高性能(电子)工业级high reliability 高可靠度high resolution 高分辨率high temperature elongation (HTE) 高温延展性铜箔high temperature epoxy (HTE) 高温树酯hit 击hole counter 数孔机hole diameter 孔径hole diameter error 孔径错误hole location 孔位hole number 孔数hole wall quality 孔壁品质hook 外弧hot dip 热浸法hull cell 哈氏槽hybrid 混成集成电路hydrogen bonding 氢键hydrolysis 水解hydrometallurgy 湿法冶金法image analysis system 影像分析系统image transfer 影像转移immersion gold 浸金(化镍金) immersion plating 浸镀法impedance 阻抗infrared reflow 红外线重熔inhibitor 热聚合抑制剂injection mold 射模ink 油墨innerlayer & outlayer 内外层insulation resistance 绝缘电阻intended position 应该在的位置intensifier 增强器intensity 强度inter molecular exchange 交互改变interconnection 互相连通ionic contaminants 离子性污染物ionic contamination testing 离子污染试验IPA异丙醇5I : inspiration (启蒙)identification 确认计划目标implementation 改善方案information 数据internalization 制度化invisible inventory 无形的库存knife edges 刀缘Knoop 努普(硬度单位)kraft paper 牛皮纸laminar flow 层流laminate 基层板laminating 压合lamination 压合laminator 压膜机land 焊垫lay back 刃角磨损lay up 组合叠板layout 布线;布局lead screw 牵引螺丝leakage 漏电learning curve 学习曲线legend 文字标记leveling 平整levelling additive 平整剂levelling power 平整力life support 维系生命limiting current 极限电流line space 线距line width 线宽linear variable differential transformer(LVDL) 线性可变差动:转换器liquid 液状(态)liquid crystal resins 液晶树脂liquid photoimageable solder resist ink 液态感光防焊油墨liquid photoresist ink 液态光阻剂油墨lot size 批量lower carrier 底部承载板mechanical plating 机祴镀法machine scrub 刷磨清洁法macrothrowing power 巨分布力margin 钻头刃带market share 市场占有率marking error 文字错误masked leveling 儰装平整mass lamination 大型压板mass transfer 质量传送效应mass transfer overpotential 质量传递过电压mass transportation 质传master drawing 主图;蓝图material use factor 材料使用率mealing 泡点;白点memory 记忆装置meniscograph solderability measurement 新月型焊锡效果microetch 微蚀microetching 微蚀microfocus 微焦距microfocus system 微焦距系统microprofile 微表面microsectioning 微切片法microthrowing power 微分布力migration 迁移mini-tensile tester 迷你拉力测试仪mis hole location 孔位错误misregistration 焊锡面与零件面对位偏差misregsitration 对不准moisture and insulation resistance test 湿气与绝缘电阻试验molded circuit board (MCB) 模制电路板monoethanal amine 单乙醇氨monohydrate state 水化物monomer 单分子膜;单体mouse bite 锯齿;蚀刻缺口msec 毫秒muffle furnace 高温焚火炉multichip 超大IC型(多芯片模块)mylar 保护膜nail head 钉头NC drill 数字钻孔机negative etchback 反回蚀negative film 负片negative rake angle 负抠耙角network 回路;网络neutralization 中和nick 缺口nickel 镍nodule 铜瘤;瘤粒no flow resin 不流树脂noise 噪声nominal 标示nominal dimension 标定长度nominal gel time 标示胶性时间nominal resin content 标示胶含量nominal resin flow 标示胶流量nominal scaled flow thickness 标示比例流量厚度OA equip 办公室自动:化设备obsolescence factor 报废因素OEM 原设备制造商offset-list 补偿数据清单ohmmeter 欧姆计open 断路open circuits 断路open short testing 断短路测试opening 开口original art work (A/W) 原稿底片Others 其它outgrowth 增出over design 牛刀杀鸡overlap 钻尖重叠overlay entry 盖板overpotential 过电压oxidation 氧化oxide treatment 黑化处理oxided cytochrome 氧化性之细包色素oxygen evolution 氧气发生反应packed bed 充填床式pad 锡垫;圆配pad copper exposure pad露铜panel 小型板面;母板panel plating 一次铜电镀parasitic 寄生的part no. 料号pattern plating 二次铜电镀PCB ( print circuit board ) 印刷电路板pcs 片peel strength 抗撕强度peeling off 剥离(剥落) performance specification 性能规范permittivity 透电率perspectives on experience 经验透视PET 聚酯photodiode detector 发光二极管侦测器photo initiator 感光启始剂photoresist 光阻phototool 光具(指工作底片)piece 子板面pinceton applied research 腐蚀测定仪pink ring 粉红圈pit 凹点pitch 脚距planar 平面plating 电镀plating exposure 下镀层露出plug gauge 插规plug hole 孔塞PNL (panel) 排板polar-polar interaction 极性之间的吸力polyester 聚酯类polyglycols 聚乙二醇polyimide 聚亚醯氨poor bevelling 磨边加工引起突起,剥离poor drill 孔形不良poor HAL 喷锡不良poor marking 字体不良poor pad 锡垫不良poor printed 印刷偏差poor solderability 焊锡性不良poor touch-up 补线不良position control system 位置控制系统positive rake angle 正抠耙角power curve model 幕次曲线模式practice 工艺惯例preferred 良好premature tearing 提前撕裂prepolymer 预聚合物prepreg 胶片pre-process ( front-end) 制前press 压床press cycle 压合周期primary current distribution 一次电流分布primary 主要product lifetimes 生命周期product process 制程promoter 促进剂protocal 初步资料prussic acid 普鲁士酸PTF-based process 厚膜糊法PTH (plating though hole) 导通孔pull away 拉开pumice 浮石粉pumice scrub 喷砂清洁法pyrometallurgy 火烧法冶炼QC ( quality control) 品管QFP (quad flat pack ) 扁方型封装体qualification inspection 资格审查检验qualification testing 资格检定quality classification 品质等级quantitative 计量式测试rack 挂架radiometer 能量剂rake angle 抠耙角RAM [Random Access Memory 随机存取内存real time 关键时刻recessed trace process 凹槽线路法recovery tank 回收槽reduction 还原re-eninforcement 强化refraction 折光率reinforcement style 补强材料的型式register mark 对位用标记registration hole 对位孔registration pattern 长方形铜地REJ ( reject ) 退货;拒收rejectable 拒收release agent 脱模剂relief angle 浮离角remark 备注repair 修理resin content 树脂含量(胶含量)resin flow 胶流量resin flow percentage 树脂流量之百分率resin recession 树脂下陷resin smear 胶渣resist strippers 剥干膜剂resistor network 排列电阻resolution 解像度return on assets 资产报酬率reversibility 可逆性rework 重工rosin 天然松香rotating cylinder 旋转圆柱形roughtness 孔壁粗糙;粗慥routing 切外形,成型routing bit 铣刀runout 偏转S/L on hole 孔内沾文字S/M ( solder mask ), S/L 防焊文字S/M (solder mask) 防焊S/M error 防焊种类错误S/M on hole 孔内绿漆salt spray test 盐水喷雾试验sampling size 抽样数scope 范围scored 刻痕scoring 枢槽;刮线scrap 废框scratches 刮伤screen printing 网版印刷scum 透明残膜sealing 封孔处理secondary 次要semi-additive 半加成法sensitize 敏化sensitizer 敏化液separator 钢隔板sequential lamination 渐成式压法serrated edges 毛边shatter 破碎short 短路shunt 分路silane treatment 硅烷处理silicone coupling agent 硅烷偶合剂silk screen 文字印刷simulator 仿真器single axis 单轴sizing 底片之伸缩补偿skip 漏印skip printing 跳印;漏印sliver 丝条slot 开槽slotting 开槽SMD ( surface mount device ) 表面黏着组件smear 胶渣SMT ( surface mount technology )表面黏着技术sodium carbonate monohydrate 结晶水碳酸钠soft tooling 软性工具solder 焊锡; 锡铅solder bridge 锡桥solder bump 锡突solder float 漂锡solder mask adhesion 绿漆附着力solder on G/F 金手指沾锡solder on trace 线路沾锡solder plug 锡塞solder side 焊锡面solderability 焊锡性solid carbide 实质碳化物spacing 间距spacing nonenough 间距不足SPC ( Statistical Process Control ) 统计生管specification 规范special considerations 特别考虑spin coating 旋转涂布spindle 钻轴spiral contractometer 螺旋收缩仪spot face 铣靶spray coating 喷涂Squeegee 刮刀stacking structure 叠板结构stamping 冲压standard hydraulic lamination标准液压法standardizing 标准化starvation 缺胶step tablet 格片数stock option 认股选择权strain 应度strength 强度stressmeter 应力计subtractive 减除法surface convex 表面突起surface examination 表面检查surface insulation resistance (SIR) 表面绝缘电阻surface mount 表面黏着方式surface roughness 表面粗慥度surges 突波switch circuit 开关线路tab 金手指tack free 不黏taped hole gauge 锥形孔规target hole 靶孔task force 任务编组tensile strength 抗拉强度tensile stress 张性应力tent 浮盖terms and definitions 术语与定义termination load 抗匹配负载test circuit 测试线路test method 试验方法test point 测试点thermal shock 热震荡试验thermal stress 热应力试验thermistor 热电感应式thermo cycling 热循环试验theoretical cycle time 理论性周期时间thickness 厚度time to market 上市时机thickness distribution 厚度分布thief 补助阴极thin core 薄基板;内层板throwing power 分布力tolerance 公差;容差tooling hole 工具孔torque load 扭力拒之负载total quality program 全面的品质计划toughness 坚度trace error 线路错误trace nick & pin hole 线路缺口及针孔trace peeling 线路剥离trace pin-hole 线路针孔trace surface roughness 线路表面粗糙tarnish and oxide resist 抗污抗氧化剂transmittance 透光度trim line 裁切线true levelling 真平整true position 真正位置的孔;真位twist 板翘type 种类umbra 本影undercut 侧蚀uneven coating 喷锡厚镀不平整universal 万用型universal tensile tester 万用拉力试验机universal tester 泛用型测试机upper carrier 顶部承载钢uptime 稼动:时间vacuum deposition 真空蒸镀法vacuum hydraulic lamination真空液压法vaporizer 气化室V-cut V形槽vertical microsection 垂直微切片via hole 导通孔visible inventory 有形的库存vision inspection 目视检查V oid 孔破void in hole 孔壁上的破洞void in PTH hole 孔破walkman 随身听warehouse 仓库warp 板弯warp , warpage 板弯water absorption 吸水性wear resistance 耐磨度weave exposure 纤纹显露weave texture 织纹隐现wedge angle 契尖角week 周wet chemistry 湿式化学制程wet film 湿膜wet lamination 湿膜压膜法wet process 湿制程wetting 沾锡wetting balance 沾锡平衡法wicking 渗铜;渗入;灯蕊效应width 宽度width reduce 线细width-to-thickness ratio 宽度与厚度的比值window 操作范围work-in-process 在制品work order 工单working film 工作片working master 工作母片year 年yellow 金黄色yield 良率。
规则检查中英对照
DXP规则检查中英文对照Rule Violat ions Count违反数Short-Circuit Constraint (Allowed=No) (All),(All)短路约束=不允许)(全部),(全部)Un-Routed Net Constraint ( (All) ) 26Un-Routed净约束(所有)26岁Clearance Constraint (Gap=9mil) (A ll),(All)间隙约束(间隙= 9 mil)(全部),(全部)Power Plane Connect Rule(Relief Connect )(Expansion=20mil) (ConductorWidth=10mil) (Air Gap=10mil) (Entries=4) (All)功率平面连接规则(救济连接)(扩展= 20 mil)(导体宽= 10 mil)(气隙= 10 mil)(条目= 4)(全部)0Width Constraint (Min=8mil) (Max=20mil) (Preferred=15mil) (All)宽度约束(Min = 8 mil)( Max= 20 mil)(优先15例mil)(全部)Height Constraint (Min=0mil) (Max=1000mil) (Prefered=500mil) (All)高度约束(Min = 0 mil)( Max = 1000 mil)(优先= 500 mil)(全部)Hole Size Constraint (Min=1mil) (Max=150mil) (A ll)孔尺寸约束(Min = 1 mil)( Max = 150 mil)(全部)Hole To Hole Clearance (Gap=6mil) (A ll),(All)洞孔间隙(间隙= 6 mil)(全部),(全部)Minimum Solder Mask Sliver (Gap=1mil) (All),(All)最低焊接面罩银(间隙= 1 mil)(全部),(全部)Silkscreen Over Component Pads (Clearance=1mil) (All),(All)丝网印刷在组件垫(许可= 1 mil)(全部),(全部)Silk to Silk (Clearance=1mil) (All),(A ll)丝印丝印(间隙= 1 mil)(全部),(全部)Net Antennae (Tolerance=0mil) (All)网络天线(耐受= 0 mil)(全部)Clearance Constraint (Gap=6mil) (InComponent(U1)),(All)间隙约束(间隙= 6 mil)(InComponent(U1)),(所有)。
PCB工程英文确认常用词及常用语句
规格：spec工程问题：engineering query（EQ）生产文件：production gerber电测成本：ET（electrical test）cost通断测试：Open and short testingIPC标准：IPC standardIPC二级：IPC class 2修改：revision公差：tolerance忽略：ignore(omit)工具孔：tooling hole安装孔：mounting hole元件孔：component hole槽孔：slot邮票孔：snap off hole导通孔：via盲孔：blind via埋孔：buried via金属化孔：PTH(plating through hole)非金属化孔：NPTH( no plating through hole)孔位：hole location附边：waste tab铜条：copper strip拼板强度：panel strong板厚：board thickness削铜：shave the copper露铜：copper exposure光标点：fiducial mark内弧：inside radius焊环：annular ring单板尺寸：single size拼板尺寸：panel size铣：routing铣刀：routerV-cut：scoring哑光：matt光亮的：glossy锡珠：solder ball(solder plugs)阻焊：solder mask(solder resist)阻焊开窗：solder mask opening单面开窗：single side mask opening补油：touch up solder mask补线：track welds毛刺：burrs去毛刺：deburr 镀层厚度：plating thickness清洁度：cleanliness离子污染：ionic contamination阻燃性：flammability retardant黑化：black oxidation棕化：brown oxidation红化：red oxidation可焊性：solderability焊料：solder角标：corner mark特性阻抗：characteristic impedance正像：positive负片：negative镜像：mirror线宽：conductor width线距：conductor spacing做样：build sample成品：finished下移：shift down垂直地：vertically水平的：horizontally波峰焊：wave solder钻孔数据：drilling dateUl 标记：Ul Marking蚀刻标记：etched marking周期：date code翘曲：bow and twist外层：outer layer内层：internal layer顶层：top layer底层：bottom layer元件面：component side焊接面：solder side阻焊层：solder mask layer丝印层：legend layer (silkscreen layer orover layer)兰胶层：peelable SM layer贴片层：paste mask layer碳油层：carbon layer外形层：outline layer(profile layer)白油：white ink绿油：green ink喷锡：hot air leveling (HAL)水金：flash gold插头镀金：plated gold edge-board contacts金手指：Gold-finger防氧化：Entek(OSP)沉金：Immersion gold (chem. Gold)沉锡：Immersion Tin(chem.Tin)沉银：Immersion Silver (chem. silver)单面板：single sided board双面板：double sided board多层板：multilayer board刚性板：rigid board挠性板：flexible board刚挠板：flex-rigid board铣：CNC (mill , routing)冲：punching倒角：beveling倒斜角：chamfer倒圆角：fillet尺寸：dimension介电常数：Dielectric constant菲林：film成像：Imaging板镀：Panel Plating图镀：Pattern Plating后清洗：Final Cleaning叠层：layup (stack-up)污染焊盘：contaminate pad分孔图：drill chart标靶盘：target pad外形公差：routing tolerance芯板：core常用语句－、厚度要求孔内铜厚0.001"太紧对我们的生产，建议按IPC二级0.0008"。
PCB中英文对照表
周期 义务 显影 显影速度 显影温度 显影液 叶片滚轮 生产优先级 异常物料处置审核委员会 有效的 相近的 电气的 侵占 整个的 树脂 蚀刻 超出 排除 展示 暴露于 外部的 磨边 曝光 能量 能量测量 铆钉 玻璃丝 制造 特征 基准 文件 结束 下面的 空闲的 刷痕 板面异物 未来期望 底片清洁液 过滤器 接地层、接电压层 金手指 玻璃
date code duty development develop speed develop femperature developing solution disk roller D/R DRB efficient equivalent electrical encroach entire epoxy resin etch exceed except exhibit expose external edge trimming exposure energy energy test eyelet filament fadrication feature fiducial file finish following free foot print foreign material on the surface future expectation film cleaner filter GND/VCC G/F(gold finger) glass gold finger glove gold rlating boards highest hOle horizontal
规范 正方形 叠板结构 规定 袸底 取代 供应商 系统 试作样品订单 评估样品订单 一般样品订单 警急呼救板 统计管制 用以监控制程状态的工具 刷磨 刷压 设定具有挑战性的目标和核准计划 温度 覆盖 测试点 文字高度 厚度 留铜边 误差 修补 线路 路径 线路焊接点 流程单 胶带 转印字 训练 修补 修正区 警讯界限 除非 显影不洁 导通孔 制造商 违背 直观的 抽检板 工作底片 板翘 波浪 周期 重量 白色
234印刷电路板标准中英文对照版
21.34 Printed Circuit Board Standards21.34 印刷电路板标准Group I: Cards shall be of glass epoxy construction, comply with requirements of NEMA L1-1 grade FR-4, and have minimum nominal thickness of 0.063 inches.第一组:卡片应该使用玻璃环氧基树脂构造，遵守国际电气制造业协会L1-1等级FR-4的要求，, 最低标称厚度为0.063英寸。
Cards shall have conductors whose material shall be copper. Thickness and width of conductors shall be determined on basis of current carrying capacity and in accordance with IPC 2221A and IPC 2222. Minimum conductor thickness shall be 0.002 inch.卡片应该有材料是铜的半导体。
导体的厚度和宽度取决于电流负载能力的基础上，按照IPC2221A和IPC2222实行。
最小的半导体的厚度应该是0.002英寸。
Printed circuit cards and components shall be covered with conformal coating on both sides between 0.003 inch and 0.007 inch in thickness. provisions to preclude coating from entering sockets shall be taken during the coating process.印刷电路卡片和组件应该被两边的保形涂层所覆盖，厚度在0.003英寸和0.007英寸之间。
PCB行业常用语言中英文对照表
Fiber Exposure
纤维暴露
是指基材表面当受到外来的机械摩擦，化学反应等攻击后，可能失去其外表所覆盖的树脂层，露出底材的玻璃布，称为纤维暴露，位于孔壁处则称为纤维突出。
Fiducial Mark
基准记号
在板面上为了下游的组装，方便其视觉辅助系统作业起见，常在大型的IC于板面焊垫外缘的右上及左下各加一个圆状或其它形状的“基准记号“，以协助放置机的定位。
耐燃性
是指线路板在其绝缘的树脂中，为了达到某种燃性等级（在UL中分HB，VO，V1及V2），必须在其树脂的配方中加入某些化学药品（如在FR－4中加入20％以上的溴），是板材之性能可达到一定的耐燃性。通常FR－4在其基材表面之径向方面，会加印制造者红色的UL水印，而未加耐燃剂的G－10，则径向只能加印绿色的水印标记。
Crease
皱褶
在多层板中常在铜皮处理不当时所发生的皱褶。
D
Date Code
周期代码
用来表明产品生产的时间。
Delamination
基材中层间的分离，基材与铜箔之间的分离，或线路板中所有的平面之间的分离。
Delivered Panel(DP)
为了方便下工序装配和测试的方便，在一块板上按一定的方式排列一个或多个线路板。
美国印刷线路板协会。
J
JEDEC Joint Electronic Device Engineer Council
联合电子元件工程委员会。
J-Lead
J型接脚。
Jumoer Wire
见“Hay Wire”。
Just-In-Time(JIT)
适时供应
是一种生产管理的技术，当生产线上的产品开始生产进行制造或组装时，生产单位既需供应所需的一切物料，甚至安排供应商将物料或零组件直接送到生产线上，此法可减少库存压力，及进料检验的人力及时间，可加速物流，加速产品出货的速度，赶上市场的需求，掌握最佳的商机。
PCB相关专业术语英汉对照
布局 布局效率 布设总图 布线 布线密度 步进重复 材料检验 参考尺寸 参考基准 残余铜 测试板 测试图形 側蚀 层间距 层间连接 层压（复合） 层压板 层压板裂缝 层压板面 层压板缺陷 层压板完整性 层压膜板 插（贴）装 差分驱动 差分蚀刻法 差示扫描量热法 潮湿和绝缘电阻 成品板 成像 尺寸稳定性 尺寸要求 冲切 抽查 出厂交收条件 储存 储存期 处理剂含量 处理面 处理物转移 处理织物 触变性 穿线弯连 传输线
桥接 切削量 清晰度 去毛刺 去铜箔面 去钻污 缺胶区 缺口 缺纬 绕接 热冲击 热导率 热风整平 热风整平 热隔离 热机分板 热膨胀系数 热熔 热熔液 热态强度保留率 热应力方法 热应力试验 人力资源部 乳胶面 润湿剂 三级封装(各种电子整机产品) 三聚氰胺甲醛树脂 散热层 扫描式电子显微镜 闪镀 烧焦镀层 烧灼 设计规则检查 射频干扰 伸长率 渗出 生产底版 生物制品 施工质量 湿法贴膜 湿强度保留率 湿热后绝缘电阻 蚀刻
placement layout efficiency master drawing routing circuit density step-and-repeat materials inspection datum dimension datum reference estraneous copper test board test pattern undercut layer-to-layer spacing internalyer connection laminating laminate crack of laminate unclad laminate surface laminate imperfections laminate integrity laminate moulding plate mounting differentia drive differential etching differential scanning caborimetry moisture and insulation resistance production board imaging dimensional stability dimensional requirements punching spot-check inspectin of product for delivery storage storage life finish level treated side treatment transfer finished fabric thixotopic clinched-wire through connection transmission line
PCB用语中韩对照
短路 烧板 蚀刻不净 蚀刻过度 铜渣 褪锡不净 药水(儿) 阻抗 值不符 阻抗 值 基材 绿油工序 绿油氧化 气泡 绿油杂物 绿油起泡 电表 表面 处理 沾锡 塞孔不良 油墨 油墨入孔 导通孔 跳印/漏印 基材白点 热应力 扩散 测试
[duǎnlù ] [shāobǎn] [shí kè bùjì ng] [shí kè guò dù] [tóngzhā] [tuìxī bùjìng] [yàoshu ǐ(r) ] [zǔkàngzh í bùfú ] [zǔkàngzh í ] [jī cái] [l ǜyóu gōngxù] [lǜyó u yǎnghuà] [qì pào] [l ǜyó u záwù] [lǜyó u qǐpào)] [diànbiǎo ] [biǎomiànchǔlǐ] [zhānxī] [sāikǒngbùliáng] [yó umò ] [yó umò rùkǒng] [dǎotōngkǒng] [tiàoyì n]/[lò uyì n] [jī cái bái di ǎn ] [rèyì nglì ] [kuò sàn ] [cèshì ]
控制 钻孔 孔径 钉头 内层 铜厚 漏钻 因素 玻璃纤维 延伸 变形 形状 圆 区域 成型 孔偏 核对 -相交 宽度 零件孔 叠板 塞孔 物品 刮伤 摩擦 效应 杂物
[kò ngzhì ] [zuān//kǒng ] [kǒngjì ng ] [dīngtóu] [nèicéng] [tó nghò u] [lòuzuān] [yīnsù] [bō‧lixiānwéi] [yánshēn ] [biàn//xí ng] [xí ngzhuàng] [yuán] [qūyù] [chéngxí ng ] [kǒngpiān] [héduì ] [xiāngjiāo] [kuāndù ] [lí ngjiànkǒng] [diébǎn] [sāikǒng] [wùpǐn ] [guāshāng] [mócā ] [xiàoyì ng] [záwù ]
完整word版,PCB常用英语对照
Concord Electronics CO.,LtdzengxianPCB常用英语对照⏹第一章.认识我们的PCB⏹第二章.了解客户要求(PO&MO)⏹第三章.工程常用英语⏹第四章.品质常用英语⏹第五章.实用相关PCB英语⏹第一章.认识我们的PCB⏹ 1.元件面Component Side (CS)⏹ 2.焊接面Solder Side (SS)⏹ 3.单面板Single side board (SS)⏹ 4.双面板Double side board (DS)⏹ 5.多层板Multi-layer board⏹ 6.孔Hole⏹7.有铜孔Plated Though Hole (PTH)⏹8.无铜孔None Plated Though hole (NPTH)⏹9.过电孔Via Holes⏹10.定位孔Tooling Holes⏹11.锡/无铅喷锡Tin (Sn)/Lead free Hot air lever⏹12.铜/抗氧化/松香Copper (Cu) /OSP/Entek/Flux⏹13.金/电金/沉金Gold (Au)/Gold plating (Flash Gold)/Immersion Gold⏹14.镍/电镍Nickel (Ni)/Nickel Plating⏹15.铅/有铅锡Lead (Pb)/Hot air level (HAL)⏹16.(绿)阻焊(Green) Solder mask⏹17.(白)字符(White) Silkscreen (legend)⏹18. 碳油Carbon⏹19. (蓝)胶(Blue) peelable mask⏹20.绿油桥solder mask bridge⏹21.绿油塞孔Plug-holes⏹22.绿油开窗Opening⏹23.线路/线宽Track/line width⏹24.线距Line spacing⏹25.焊盘/焊环/贴片PAD/Ring/SMT/IC/BGA⏹26. 大铜皮Copper area (GND)⏹27.槽孔Slot hole⏹28.外形Outline⏹29.锣板CNC Routing⏹30.啤板Punching⏹31. V-坑V-Cut⏹32.钻孔/二钻drill /Second drill⏹33.工作边/对光点Frame /Fiducial mark第二章.了解客户要求(PO&MO)⏹ 1.采购订单Purchase Order⏹ 2.生产订单Manufacturing Order⏹ 3.客户名称Customer ‘s Name⏹ 4.下单日期Order Date⏹ 5.交货日期Delivery Date⏹ 6.交货数量Order Qty⏹7.客户编号Part Number( P/N.)⏹8.本厂型号Factory Number (No.)⏹9.单价Unit price⏹10.菲林费Film Cost⏹11.测试架费E-test Cost⏹12.总金额Total Amount⏹13.要求说明Specifications; note; warning⏹14.单元尺寸Unit size⏹15.拼版尺寸Panel size⏹16.材料(板材) Material⏹17.表面工艺Surface ;Finish⏹18.阻焊(绿油)Solder mask ;Wetting film LPI;⏹19.丝印(白字) Silkscreen ; legend⏹20.外形Outline ;Profile⏹21.叉板出货“X”-out panel⏹22.包装Packing ;Vacuum-pack ;Manual-pack⏹23.箱唛Carton Lable⏹24.文件资料Offers file (data)⏹25.备注Remarks⏹26.供应商Supplier ; Vendor⏹27.内容Description第三章.工程常用英语⏹ 1.计算机辅助设计Computer-Aided Design .(CAD)⏹ 2.计算机辅助制造Computer-Aided Manufacturing .(CAM)⏹ 3.制作指示Manufactural Instruction⏹ 4.菲林Film⏹ 5.样板Sample⏹ 6.生产板Product Board⏹7.顶层线路Top layer (c.s.)⏹8.底层线路Bottom layer (s.s.)⏹9.内层线路Inner layer⏹10.接地/电源层GND/Power layer⏹11.PP片Preprg⏹12.顶/底层阻焊层Top/Bottom solder mask layer⏹13.字符层Silkscreen layer⏹14.碳油层Carbon layer⏹15.蓝胶层Blue Peelable mask layer⏹16.钢网层Paste layer⏹17.外形层Profile layer(outline)⏹18.分孔图drill chart⏹19.机械图Machine drawing⏹20.流程图Process drawing⏹21.板厚Board Thickness (THK)⏹22.铜厚Copper Thickness (THK)⏹23.最大的Maximal⏹24.最小的Minimum⏹25.公差Tolerance⏹26.尺寸Size⏹27.长Long⏹28.宽Width⏹29.重Weight⏹30.直径Diameter⏹31.半径Radius⏹32.光圈表Aperture list/ D-code⏹33.钻孔表NC Tool Tables⏹34.正方形/长方形Square/Rectangle⏹35.圆形Round⏹36.八角形Octangle第四章.品质常用英语⏹ 1.合格品Good (ok) board⏹ 2.修理品Repairing board⏹ 3.报废品Scrap board⏹ 4.接受Accept (Acc.)⏹ 5.拒收Reject (Rej.)⏹ 6.出货报告Quality Assurance Outgoing Report⏹7.切片报告Micro-Section Report⏹8.可焊性测试报告Solderability Test Report⏹9.纠正改善措施报告Complaint Action Report⏹10.最小线宽Min. line width⏹11.最小线距Min. Spacing⏹12.最小焊环Min. Annular Ring⏹13.顶层与底层对位偏差Front& Back Registration⏹14.镀铜厚PTH thickness⏹15.镍厚Nickel thickness⏹16.金厚Gold thickness⏹17.阻焊厚Solder coating thickness⏹18.金手指厚Overall Finger Thickness⏹19.3M 胶带测试Tape test⏹20.阻焊类型及颜色S/M Material & Color⏹21.字符类型及颜色C/M Material & Color⏹22.溶剂测试Solvent Test⏹23.印碳油Carbon print⏹24.电测试Electronical Test⏹25.要求孔径Hole Size Required⏹26.实际测量Actual Size⏹27.标记Marking (UL CEC logo)⏹28.板弯/板曲Warp & Twist⏹29.主要缺陷Main Defect⏹30.开/短路Open / Short⏹31.多孔/少孔Superfluous/ Missing Holes⏹32.偏孔Secund holes⏹33.爆孔Blow holes⏹34.线路缺损circuit damage⏹35.露铜Expose copper⏹36.甩铜(金) Peel off copper (gold)⏹37.线幼Circuit Thin⏹38.针孔Pinhole⏹39.凸线Circuit bulgy⏹40.掉绿油Solder mask Peel off⏹41.绿油入孔Solder mask fill into holes⏹42.绿油塞孔Solder mask plug holes⏹43.字符上PAD Silkscreen fall on Pads⏹44.字符不清Silkscreen unclear⏹45.漏印标记Missing the marking⏹46.板料分层Delamination⏹47.铜皮起泡Conductor Crack⏹48.上锡不良Non-wetting⏹49.擦花Scrape⏹50.氧化Oxidation⏹51.超出公差Out of Tolerance第五章.实用相关PCB英语⏹ 1.数词,数量Quantity / Qty⏹ 2.一,十,十一One ,Ten, Eleven⏹ 3.二,十二,二十Two , Twelve, Twenty⏹ 4.三,十三,三十Three, Thirteen, Thirty⏹ 5.四,十四,四十Four, Fourteen, Forty⏹ 6.五,十五,五十Five, Fifteen, Fifty⏹7.六,十六,六十Six, Sixteen, Sixty⏹8.七,十七,七十Seven, Seventeen, Seventy⏹93.八,十八,八十Eight, Eighteen, Eighty⏹10.九,十九,九十Nine, Nineteen, Ninety⏹11.零,百,千,百万Zero, Hundred, Thousand, Million⏹12.第一,第二,第三First, Second, Third⏹13.单位Unit⏹14. 米,厘米Meter, Centimeter⏹15.毫米,微米Millimeter, Micron⏹16.英尺,英寸Feet, Inch⏹, 微英寸Mil, Micro-inch⏹18.平方米/尺Square (sq.) meter / Feet⏹19.千克,克Kilo-Gram, Gram⏹20. 安士(盎司) Ounce⏹21.颜色Color⏹22.黑色,哑黑色Black , Matte Black⏹23.白色White⏹24.绿色Green⏹25.蓝色Blue⏹26.红色Red⏹27.黄色Yellow⏹28.日期,星期Date, Week⏹29.星期一到日Monday, Tuesday, Wednesday, Thursday, Friday, Saturday, Sunday ⏹30.春夏秋冬Spring, Summer, Autumn, Winter⏹31.一月,二月January, February⏹32.三月,四月March, April⏹33.五月,六月May, June⏹34.七月,八月July, August⏹35.九月,十月September, October⏹36.十一月,十二月November, December⏹37.页Page⏹38.人民币RMB⏹39.港币HKD⏹40.美圆USD⏹41.欧圆EUR。
PCB内存条检验标准中英文对照
PCB内存条检验标准中英文对照PCB内存条检验标准1.Purpose目的Setting up a spec of PCB for memory module product.制定内存产品规格.2.Scope范围This spec is applied to the PCB for normal memory module product.这规格应用于内存条产品.3.Reference Document参考文献1>PCB working direction(HEI standard)HEI标准PCB工作指引2>JEDEC spec:JEDEC spec.M0-064JEDEC标准:JEDEC spec.M0-0643>IPC spec:IPC-A-600IPC spec:IPC-A-6004.Equipment & Materials:Not required仪器和材料:不要求5.Calibration:Not required仪校:不要求6.Records & Forms:Not required记录和格式:不要求7.Safety安全性1>Materials have to be stored in a appointed place.产品必须储存在许可的地方.2>It should be handled carefully for safety.搬运必须考虑其产品的安全性.8.Definition定义1>PCB:a composite of organic and inorganic material,with external and internal conductingor low-resistivity paths that allow mechanical support and electrical connection of components.(Printed Circuit Board)印刷线路板2>Tab:It connects electrical signal between memory module and system金手指:连接记忆模块和系统间电子信号3>Via hole:An hole that provides an electrical pathway from one metal layer to the metallayer above or below过孔:导通孔。
PCB,电子制板,电子术语中英文对照手册
1、Acoustic Microscope(AM) 感音成像显微镜利用频率在10～100MHz的超音波，以水为能量传送的媒体，对精细电子密封品进行非破坏性品检的一种技术。
如对已封装传统IC在密封品质方面，或密集组装的PCBA，均可利用此法进行成像检查。
此技术已有雷射扫瞄式(SLAM) 与C模式扫瞄(C-SAM)等两种实用机种上市。
2、Aerosol 喷雾剂，气溶胶，气悬体指在空气中可分散成微小胶体粒子的混合气体，是对某种液体采压力容器的包装，采泄压喷出方式的分布法。
如日常生活中所用的喷雾发胶、罐装喷漆等。
3、Aliphatic Solvent 脂肪族溶剂有机化合物大体上可分为以直连碳炼所组成的脂肪族，与含苯环状的芳香族(Aromatic)。
某些直炼状分子的有机溶剂，如乙醇、丙酮、丁酮(MEK)、三氯乙烷等皆称为"脂肪族溶剂"。
4、Ambient Tamp. 环境温度指处理站或制程联机周围附近的温度。
5、Amorphous 无定形，非晶形指原子排列不具有固定组态的物质，如塑料水泥等。
6、Anisotropic 异向的，单向的在PCB制程常指良好蚀刻进行时，只出现垂直方向的正蚀，尚未发生不良的侧蚀 (Undercut) 者，称为单向蚀刻 Anisotropic Etching 。
另外于封装或组装时，在无法进行正统焊接的情况下(如LCD玻璃质显示屏后的ITO线路，与PCB之互连及固着等)，即可使用垂直单向的"导电胶"进行不同材质层之间的接合或装配，以完成系统之互连。
又如树脂本身其三维原为等向之膨胀，但加入纤维补强后X, Y受到限制，却突显出Z方向仍有很大的变形，亦称之单向变化。
7、Anneal 韧化将金属加热至近于熔点的某一温度，再慢慢冷却至室温，以消除其硬度及脆性而使韧性增强的工程。
其脆性可能是自然发生的，也可能是由于压力或弯曲所生成的。
此字有时也可改用成形容词 Annealed 及动名词 Annealing。
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PCB内存条检验标准
1.Purpose目的
Setting up a spec of PCB for memory module product.
制定内存产品规格.
2.Scope范围
This spec is applied to the PCB for normal memory module product.
这规格应用于内存条产品.
3.Reference Document参考文献
1>PCB working direction(HEI standard)
HEI标准PCB工作指引
2>JEDEC spec:JEDEC spec.M0-064
JEDEC标准:JEDEC spec.M0-064
3>IPC spec:IPC-A-600
IPC spec:IPC-A-600
4.Equipment & Materials:Not required仪器和材料:不要求
5.Calibration:Not required仪校:不要求
6.Records & Forms:Not required记录和格式:不要求
7.Safety安全性
1>Materials have to be stored in a appointed place.
产品必须储存在许可的地方.
2>It should be handled carefully for safety.
搬运必须考虑其产品的安全性.
8.Definition定义
1>PCB:a composite of organic and inorganic material,with external and internal conducting
or low-resistivity paths that allow mechanical support and electrical connection of components.(Printed Circuit Board)
印刷线路板
2>Tab:It connects electrical signal between memory module and system
金手指:连接记忆模块和系统间电子信号
3>Via hole:An hole that provides an electrical pathway from one metal layer to the metal
layer above or below
过孔:导通孔。
用于印制板不同层中导线之间电气互连的一种镀覆孔。
4>Land:a circle copper which surrounds the via hole
孔环:过孔孔环-连接盘。
5>Solder Resist:Solder mask is applied to protect and insulate the circuitry both during
subsequent soldering and in the environment
防焊阻剂:绿油
6>Discoloration:the change in color of any plated metallization.
变色:金属化镀层色差
7>Copper Island(Copper residue):Copper that exists out of circuit
残铜:线间弧岛残铜
8>Undercut:the lateral etching into a substrate under a resistant coating,as at the edge
of a resist image(→overcut)
侧蚀(过蚀)
9>X-out:An inferior piece of PCB
报废PCS。