PCB内存条检验标准中英文对照

PCB内存条检验标准

1.Purpose目的

Setting up a spec of PCB for memory module product.

制定内存产品规格.

2.Scope范围

This spec is applied to the PCB for normal memory module product.

这规格应用于内存条产品.

3.Reference Document参考文献

1>PCB working direction(HEI standard)

HEI标准PCB工作指引

2>JEDEC spec:JEDEC spec.M0-064

JEDEC标准:JEDEC spec.M0-064

3>IPC spec:IPC-A-600

IPC spec:IPC-A-600

4.Equipment & Materials:Not required仪器和材料:不要求

5.Calibration:Not required仪校:不要求

6.Records & Forms:Not required记录和格式:不要求

7.Safety安全性

1>Materials have to be stored in a appointed place.

产品必须储存在许可的地方.

2>It should be handled carefully for safety.

搬运必须考虑其产品的安全性.

8.Definition定义

1>PCB:a composite of organic and inorganic material,with external and internal conducting

or low-resistivity paths that allow mechanical support and electrical connection of components.(Printed Circuit Board)

印刷线路板

2>Tab:It connects electrical signal between memory module and system

金手指:连接记忆模块和系统间电子信号

3>Via hole:An hole that provides an electrical pathway from one metal layer to the metal

layer above or below

过孔:导通孔。用于印制板不同层中导线之间电气互连的一种镀覆孔。

4>Land:a circle copper which surrounds the via hole

孔环:过孔孔环-连接盘。

5>Solder Resist:Solder mask is applied to protect and insulate the circuitry both during

subsequent soldering and in the environment

防焊阻剂:绿油

6>Discoloration:the change in color of any plated metallization.

变色:金属化镀层色差

7>Copper Island(Copper residue):Copper that exists out of circuit

残铜:线间弧岛残铜

8>Undercut:the lateral etching into a substrate under a resistant coating,as at the edge

of a resist image(→overcut)

侧蚀(过蚀)

9>X-out:An inferior piece of PCB

报废PCS